Detection device, lithography device, and article manufacturing method

Abstract

To provide a technique of detecting a relative position of a first object and a second object at high detection accuracy.SOLUTION: A first object and a second object are respectively provided with a first mark and a second mark. A detection device includes: an illumination system configured to illuminate the first and second marks with illumination light; and a detection system including an imaging device and configured to form an image with diffraction light from the first and second marks illuminated by the illumination system on an imaging surface of the imaging device. The first and second marks are configured to be capable of forming, on the imaging surface, optical information showing a relative position in a first direction or a second direction orthogonal to the first direction. The illumination light is light that passes though an optical axis of the illumination system on a pupil surface of the illumination system or a vicinity thereof only. The pupil surface 26 of the detection system includes a shading body 260 including a first shading part 261 crossing the optical axis of the detection system in a direction parallel to a third direction and a second shading part 262 crossing the optical axis of the detection system in a direction parallel to a fourth direction. The third direction is a direction conjugate to the first direction. The fourth direction is a direction conjugate to the second direction.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a detection apparatus, a lithographic apparatus and a method for manufacturing an article. [Background technology]

[0002] In an imprinting apparatus, a pattern made of the cured product of the imprinting material is formed by bringing a mold into contact with an imprinting material arranged on a substrate and curing the imprinting material. In such an imprinting apparatus, it is important to accurately align the substrate and the mold. Patent Document 1 describes a technique for aligning the substrate and the mold using a mark made of a diffraction grating provided on the substrate and a mark made of a diffraction grating provided on the mold. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2008-522412 Summary of the Invention [Problem to be solved by the invention]

[0004] When a mark is illuminated, light reflected from the edge that is the boundary between the mark and the area outside the mark enters the imaging element as noise light, which can reduce the detection accuracy of the mark. In particular, when the area of ​​the mark is reduced, the effect of noise light on the image formed by the light for detecting position information from the mark increases, and the decrease in detection accuracy can become significant.

[0005] An object of the present invention is to provide an advantageous technique for detecting the relative positions of a first mark and a second mark provided on a first object and a second object, respectively, with high detection accuracy. [Means for solving the problem]

[0006] One aspect of the present invention relates to a detection device that detects relative positions of a first mark and a second mark provided on a first object and a second object, respectively, that are arranged one on top of the other, the detection device comprising: an illumination system that illuminates the first mark and the second mark with illumination light; and a detection system that includes an image sensor and images diffracted light from the first mark and the second mark illuminated by the illumination system on an image sensor surface, the first mark and the second mark are configured to be able to form optical information on the image sensor that indicates the relative positions in a first direction or a second direction perpendicular to the first direction, the illumination light is light that passes only through the optical axis of the illumination system and its vicinity in a pupil plane of the illumination system, the pupil plane of the detection system is provided with a light shield that includes a first light shielding portion that crosses the optical axis of the detection system in a direction parallel to a third direction and a second light shielding portion that crosses the optical axis of the detection system in a direction parallel to a fourth direction, the third direction is a direction conjugate to the first direction, and the fourth direction is a direction conjugate to the second direction. Effect of the Invention

[0007] According to the present invention, there is provided an advantageous technique for detecting the relative positions of a first mark and a second mark provided on a first object and a second object, respectively, with high detection accuracy. [Brief description of the drawings]

[0008] [Figure 1] 3A is a diagram illustrating a light intensity distribution on a pupil plane of an illumination system, and FIG. 3B is a diagram illustrating a light intensity distribution on a pupil plane of a detection system. [Diagram 2] FIG. 1 illustrates an imprint apparatus as an example of a lithography apparatus. [Diagram 3] FIG. 2 is a diagram illustrating the configuration of a detection device. [Figure 4] FIG. 2 illustrates a mold mark (a) and a substrate mark (b). [Diagram 5] FIG. 1 is a diagram illustrating a diffraction grating that generates moiré fringes. [Figure 6] FIG. 1 is a diagram illustrating a diffraction grating that generates moiré fringes. [Figure 7] FIG. 13 is a diagram illustrating an example of pattern edge light. [Figure 8] 1A is a diagram illustrating an illumination diaphragm arranged on a pupil plane of an illumination system, and FIG. 1B is a diagram illustrating an illumination diaphragm arranged on a pupil plane of a detection system. [Figure 9] 11A and 11B are diagrams for explaining the influence of the presence or absence of pattern edge light on phase difference measurement of moiré fringes. [Figure 10] 1 is a diagram illustrating a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0010] FIG. 2 shows the configuration of an imprinting apparatus 10 as an example of a lithography apparatus that transfers a pattern of an original to a substrate. The imprinting apparatus 10 is used in the manufacture of devices such as semiconductor devices, and forms a pattern made of a cured product of the imprinting material 18 on the substrate 17, which is an object to be processed, by using a mold (type) 16 to mold an uncured imprinting material 18 on the substrate 17. The pattern forming process of forming a pattern on the substrate 17 by the imprinting apparatus 10 may include a contacting step, a filling and alignment step, a curing step, and a separating step. In the contacting step, the imprinting material 18 on the shot region of the substrate 17 is brought into contact with the pattern region 16a of the mold 16. In the filling and alignment step, the imprinting material 18 is filled into a space defined by the substrate 17 and the pattern region 16a, and the shot region of the substrate 17 is aligned with the pattern region 16a of the mold 16. The shot region is a region where a pattern is formed by one pattern formation process, in other words, a region where the pattern region 16a of the mold 16 is transferred by one pattern formation process.

[0011] As the imprint material, a curable composition (sometimes called an uncured resin) that is cured by applying energy for curing is used. As the energy for curing, electromagnetic waves, heat, etc. can be used. The electromagnetic waves can be, for example, light having a wavelength selected from the range of 10 nm to 1 mm, such as infrared rays, visible light, and ultraviolet rays. The curable composition can be a composition that is cured by irradiation with light or by heating. Among these, the photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, and a polymer component. The imprint material can be arranged on the substrate in the form of droplets, or in the form of islands or a film formed by connecting a plurality of droplets. The imprint material may also be supplied in the form of a film on the substrate by a spin coater or a slit coater. The viscosity of the imprint material (viscosity at 25°C) may be, for example, 1 mPa·s or more and 100 mPa·s or less. Examples of materials that can be used for the substrate include glass, ceramics, metals, semiconductors (Si, GaN, SiC, etc.), and resins. If necessary, a member made of a material different from that of the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass. Below, an example in which a photocurable composition is used as the imprint material will be described, but this is not intended to limit the type of imprint material.

[0012] In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which the direction parallel to the surface of the substrate 17 is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively, and the rotation around the X-axis, the Y axis, and the Z axis are θX, θY, and θZ, respectively. Control or drive regarding the X-axis, Y-axis, and Z-axis means control or drive regarding the direction parallel to the X-axis, the direction parallel to the Y axis, and the direction parallel to the Z axis, respectively. Furthermore, control or drive regarding the θX-axis, θY-axis, and θZ-axis means control or drive regarding the rotation around an axis parallel to the X-axis, the rotation around an axis parallel to the Y axis, and the rotation around an axis parallel to the Z axis, respectively. Furthermore, the position is information that can be specified based on the coordinates of the X-axis, Y-axis, and Z-axis, and the orientation is information that can be specified by the values ​​of the θX-axis, θY-axis, and θZ-axis. Positioning means controlling the position and / or orientation. The alignment (positioning) may include controlling the position and / or attitude of at least one of the substrate 17 and the mold so that an alignment error (overlay error) between the shot area of ​​the substrate 17 and the pattern area of ​​the mold 16 is reduced. The alignment may also include control for correcting or changing the shape of at least one of the shot area of ​​the substrate 17 and the pattern area of ​​the mold 16. The contact step and the separation step may be performed by driving the mold 16 by the mold driving mechanism 13, but may also be performed by driving the substrate 17 by the substrate driving mechanism 14. Alternatively, the contact step and the separation step may be performed by driving the mold 16 by the mold driving mechanism 13 and driving the substrate 17 by the substrate driving mechanism 14.

[0013] The imprinting apparatus 10 may include a curing unit 11, a detection unit 12, a mold driving mechanism 13, a substrate driving mechanism 14, and a control unit C. The imprinting apparatus 10 may further include an application unit 15. After a contact step in which the imprinting material 18 on the substrate 17 is brought into contact with the mold 16, the curing unit 11 irradiates the imprinting material 18 with light such as ultraviolet light as curing energy to cure the imprinting material 18. The curing unit 11 may include, for example, a light source and a plurality of optical elements for uniformly irradiating the light emitted from the light source in a predetermined shape onto the pattern region 16a of the mold 16, which is the irradiated surface. In particular, it is desirable that the irradiation region (irradiation range) of the light by the curing unit 11 is approximately the same as the surface area of ​​the pattern region 16a or slightly larger than the area of ​​the pattern region 16a. This is because the irradiation region is minimized to prevent the mold 16 or the substrate 17 from expanding due to heat caused by irradiation, causing misalignment or distortion in the pattern transferred to the imprinting material 18. In addition, this is also to prevent abnormal operation of the coating unit 15 caused by light reflected by the substrate 17 or the like reaching the coating unit 15 and curing the imprint material 18 remaining in the discharge portion of the coating unit 15. Here, as the light source, for example, a high-pressure mercury lamp, various excimer lamps, an excimer laser, or a light-emitting diode can be used. The light source can be appropriately selected depending on the characteristics of the imprint material 18, which is the light-receiving body.

[0014] FIG. 3 shows an example of the configuration of the detection device 12. The detection device 12 is configured to optically detect or measure the relative position between a mold mark (first mark) 19 arranged on a mold (first object) 16 and a substrate mark (second mark) 20 arranged on a substrate (second object) 17. The mold mark (first mark) 19 and the substrate mark (second mark) 20 are configured to be able to form optical information indicating the relative position in the X direction (first direction) or the Y direction (second direction) on an imaging surface of an imaging element 25 described later. The detection device 12 may include an illumination system 22 and a detection system 21. A part of the illumination system 22 and a part of the detection system 21 may be shared. The illumination system 22 includes a light source 23, generates illumination light using light from the light source 23, and illuminates the measurement object (first mark, second mark) with the illumination light. The illumination light may be unpolarized light. The detection system 21 detects the relative positions of a mold mark (first mark) 19 and a substrate mark (second mark) 20 as the measurement object by detecting light from the measurement object illuminated with the illumination light.

[0015] The optical axis of the detection device 12 at the positions of the substrate 17 and the mold 16 is perpendicular to the upper surface of the substrate 17 and the lower surface (pattern region 16a) of the mold 16, i.e., parallel to the Z axis. The detection device 12 can be configured to be driven in the X and Y directions by a driving mechanism (not shown) in accordance with the positions of the mold mark 19 and the substrate mark 20. The detection device 12 may be configured to be driven in the Z direction to focus the detection system 21 on the position of the mold mark 19 or the substrate mark 20. The detection device 12 may include an optical element or optical system for focusing. Based on the relative positions of the mold mark 19 and the substrate mark 20 detected or measured using the detection device 12, the positioning of the substrate 17 by the substrate driving mechanism 14 and the correction of the shape and magnification of the pattern region 16 by a correction mechanism (not shown) can be controlled. The correction mechanism is mounted on the mold driving mechanism 13 and can adjust the shape and magnification of the pattern region 16a of the mold 16 by deforming the mold 16. Mold marks 19 and substrate marks 20 will be described in more detail below.

[0016] The mold driving mechanism 13 may include a mold chuck (not shown) that holds the mold 16 by vacuum suction force, electrostatic suction, or the like, and a mold driving unit (not shown) that drives the mold chuck to drive the mold 16. The mold driving mechanism 13 may also include the above-mentioned correction mechanism. The mold driving unit may be configured to drive the mold chuck or the mold 16 about the Z axis, for example. The mold driving unit may further be configured to drive the mold chuck or the mold 16 about at least one of the θX axis, the θY axis, the θZ axis, the X axis, and the Y axis.

[0017] The substrate driving mechanism 14 may include a substrate chuck that holds the substrate 17 by vacuum suction force, electrostatic force, or the like, and a substrate driving unit (not shown) that drives the substrate chuck to drive the substrate 17. The substrate driving unit may be configured to drive the substrate chuck or the substrate 17 about the X-axis, Y-axis, and θZ-axis, for example. The substrate driving unit may further be configured to drive the substrate chuck or the substrate 17 about at least one of the θX-axis, θY-axis, and Z-axis.

[0018] Applicator (dispenser) 15 applies or places uncured imprint material 18 on substrate 17. Applicator 15 may be located outside the housing of imprint apparatus 10, in which case applicator 15 may be understood to be not a component of imprint apparatus 10.

[0019] The mold 16 has a pattern such as a circuit pattern to be transferred to the substrate 17 (the imprint material 18 thereon) in its pattern region 16a. The mold 16 can be made of a material that transmits light as the curing energy, such as quartz. The substrate 17 can be, for example, a semiconductor substrate such as a single crystal silicon substrate, or a substrate having at least one layer on a semiconductor substrate.

[0020] The control unit C may be configured to control the curing unit 11, the detection device 12, the mold driving mechanism 13, the substrate driving mechanism 14, and the application unit 15. The control unit C may be configured, for example, by a field programmable gate array (FPGA), a computer with a built-in program, or a combination of all or part of these. The FPGA may include a programmable logic device (PLD) or an application specific integrated circuit (ASIC). The control unit C may include a memory and a processor, and may operate based on an arithmetic expression, a parameter, and a computer program stored (saved) in the memory to define the operation and function of the imprint apparatus 10. At least a part of the function of the detection device 12, for example, the function of processing an image captured by the image sensor 25, may be provided by a module incorporated in the control unit C, and in that case, the module of the control unit C may be understood as a part of the detection device 12.

[0021] Here, we will explain the imprint process or pattern formation process executed by the imprint apparatus 10. First, the substrate 17 is transported by a substrate transport mechanism (not shown) to a substrate chuck of the substrate driving mechanism 14, and fixed to the substrate chuck. Next, the substrate 17 is driven by the substrate driving mechanism 14 so that the shot area of ​​the substrate 17 moves to a coating position by the coating unit 15. Thereafter, the imprint material 18 is applied, disposed or supplied to the shot area (imprint area) of the substrate by the coating unit 15 (coating step).

[0022] Next, the substrate 17 is driven by the substrate driving mechanism 14 so that the shot region in which the imprint material 18 is arranged is positioned directly below the pattern region 16a of the mold 16. Next, for example, the mold 16 is lowered by the mold driving mechanism 13 to bring the imprint material 18 on the substrate 17 into contact with the pattern region 16a of the mold 16 (contact step). As a result, the imprint material 18 is filled into the space between the substrate 17 and the pattern region 16a of the mold 16 (including the recess of the pattern region 16a) (filling step). In addition, for a plurality of mark pairs each consisting of a mold mark 19 and a substrate mark 20, the relative positions of the mold mark 19 and the substrate mark 20 are detected or measured by the detection device 12. Then, based on the result, the pattern region 16a is aligned with the shot region of the substrate 17 (alignment step). At this time, the shape of the pattern region 16a of the mold 16 may be corrected by a correction mechanism. In addition, the shape of the shot area of ​​the substrate 17 may be corrected by a heating mechanism (not shown).

[0023] At the stage where the filling and alignment steps are completed, the curing unit 11 irradiates the imprint material 18 with light through the mold 16, and the imprint material 18 is cured (curing step). At this time, the detection device 12 can be driven to retract so as not to block the optical path of the curing unit 11. Next, the mold 16 is raised by the mold driving mechanism 13, whereby the mold 16 is separated from the cured imprint material 18 on the substrate 17 (separation step).

[0024] The imprint apparatus 10 includes a detection device 12, and can be understood as an example of a lithography apparatus that aligns an original (or a pattern area) with a substrate (or a shot area) and transfers the pattern of the original to the substrate based on the output of the detection device 12. The imprint apparatus 10 aligns a mold 16 (first object or original) provided with a mold mark 19 (first mark) with a substrate 17 (second object) provided with a substrate mark 20 (second mark) based on the output of the detection device 12.

[0025] The detection device 12 will be described in detail below with reference to FIG. 3. As described above, the detection device 12 includes an illumination system 22 and a detection system 21, and a part of the illumination system 22 and a part of the detection system 21 can be shared. The illumination system 22 guides illumination light generated by light from a light source 23 via a prism 24 or the like to a common optical axis, and illuminates the mold mark 19 and the substrate mark 20. The light source 23 can include at least one of a halogen lamp, an LED, a semiconductor laser (LD), a high-pressure mercury lamp, a metal halide lamp, a supercontinuum light source, and an LDLS (Laser-Driven Light Source) light source. The wavelength of the illumination light generated by the light source 23 is selected so as not to cure the imprint material 18.

[0026] Prism 24 is shared by illumination system 22 and detection system 21, and may be disposed on or near pupil plane 1 of illumination system 22, or on or near pupil plane 2 of detection system 21. Mold mark 19 and substrate mark 20 may include marks formed of diffraction gratings. Detection system 21 may form an optical image of interference light (interference fringes or moire fringes) generated by interference between diffracted lights diffracted by mold mark 19 and substrate mark 20 illuminated by illumination system 22, on the imaging plane of imaging element 25. Imaging element 25 may be formed of, for example, a CCD sensor or a CMOS sensor.

[0027] The prism 24 has a surface (bonded surface) where two members are bonded together as a reflecting surface RS, and may have a reflecting film 24a on the bonded surface. The prism 24 may be replaced with a plate-shaped optical element having a reflecting film 24a on its surface. The position where the prism 24 is arranged does not have to be on the pupil planes 1 and 2 of the illumination system 22 and the detection system 21 or near either of them. An illumination diaphragm 27 (e.g., a pinhole plate) may be arranged on the pupil plane 1 of the illumination system 22. A detection diaphragm 26 may be arranged on the pupil plane 2 of the detection system 21. The illumination diaphragm 27 defines the light intensity distribution on the pupil plane 1 of the illumination system 22. The illumination diaphragm 27 may be an optional component, and illumination light parallel to the optical axis may be formed by defining the area of ​​the reflecting film 24a.

[0028] 4 is a schematic diagram of a mold mark 19 and a substrate mark 20, which are alignment marks. The mold mark 19 may be composed of, for example, a mark 19a, a diffraction grating 19b, and a diffraction grating 19b'. The substrate mark 20 may be composed of, for example, a mark 20a, a diffraction grating 20b, and a diffraction grating 20b'. The marks 19a and 29a are rough inspection marks, and the diffraction gratings 19b, 19b', 20b, and 20b' are precision inspection marks.

[0029] The diffraction gratings 19b, 19b', 20b, and 20b' may have a periodic pattern. The relative positions of the mold 16 and the substrate 17 can be obtained from the detection results by the detection device 12, using the geometric center positions of the marks 19a and 20a as a reference. Since interference fringes (moiré fringes) are generated by the diffracted light from the diffraction grating 19b (19b') of the mold mark 19 and the diffraction grating 20b (20b') of the substrate mark 20, the amount of light of the moiré fringes changes depending on the diffraction efficiency of the mold mark 19 and the substrate mark 20. In particular, since the diffraction efficiency changes periodically depending on the change in wavelength, there may be wavelengths at which the moiré fringes can be detected efficiently and wavelengths at which the moiré fringes are difficult to detect. Light of a wavelength at which it is difficult to detect the moiré fringes may become noise.

[0030] FIG. 5 is a diagram showing an example of a diffraction grating that generates a moiré fringe. Hereinafter, with reference to FIG. 5(a) to FIG. 5(d), the principle of the generation of the moiré fringe by the diffracted light from the diffraction grating 19b and the diffraction grating 20b, and the detection of the relative position of the diffraction grating 19b and the diffraction grating 20b using the moiré fringe will be described. The periods of the patterns (gratings) in the measurement direction of the diffraction grating 19b provided on the mold 16 and the diffraction grating 20b provided on the substrate 17 are slightly different. When two diffraction gratings with different periods are overlapped, a pattern having a period reflecting the period difference between the diffraction gratings, so-called moiré fringes (moiré), appears due to the interference between the diffracted lights from the two diffraction gratings. In this case, the phase of the moiré fringe changes depending on the relative positions of the diffraction gratings, so that the relative positions of the diffraction gratings 19b and the diffraction grating 20b, i.e., the relative positions of the mold 16 and the substrate 17, can be obtained by detecting the moiré fringe.

[0031] Specifically, when the diffraction gratings 19b and 20b, which have slightly different periods, are overlapped, the diffracted light from the diffraction gratings 19b and 20b overlap, and as shown in FIG. 5(c), a moire fringe having a period reflecting the difference in period is generated. The position of light and dark in the moire fringe (phase of the fringe) changes depending on the relative positions of the diffraction gratings 19b and 20b. For example, when one of the diffraction gratings 19b and 20b is shifted in the X direction, the moire fringe shown in FIG. 5(c) changes to the moire fringe shown in FIG. 5(d). The moire fringe magnifies the actual positional deviation between the diffraction gratings 19b and 20b and occurs as a fringe with a large period, so that even if the resolution of the detection system 21 is low, the relative positions of the diffraction gratings 19b and 20b can be detected with high accuracy. Although the diffraction gratings 19b, 19b', 20b, and 20b' have been described as one-dimensional diffraction grating patterns, the diffraction gratings 20b and 20b' can be made into a checkerboard pattern, for example, as shown in Figure 6. By making the diffraction grating pattern into a checkerboard pattern, it is possible to diffract light not only in the Y direction shown in Figure 4, but also in the X direction.

[0032] Scattered light from pattern edges and foreign matter leads to measurement errors in moiré measurement. When illumination light is incident on the alignment mark from the Z direction perpendicular to the XY plane, noise light passes through the X and Y axes of the pupil plane 2 of the detection system 21. This is because the edges of the patterns of the mold mark 19 and the substrate mark 20 are parallel to either the X or Y axis. Therefore, it is preferable that the image sensor 25 detects light that has passed through an area eccentric from the center of the pupil of the detection system 21 as a signal required for moiré fringe detection, and blocks noise light that enters the X and Y axes of the pupil of the detection system 21. This makes it possible to reduce noise caused by scattered light from the pattern edges. In addition, if the two opposing sides of the checkerboard are not parallel to either the X or Y axis, respectively, the scattered light from the pattern edges may pass through other than the X and Y axes of the pupil plane 2 of the detection system 21. Therefore, it is preferable that the pattern edges are parallel to either the X or Y axis, respectively. This is not limited to the case where the diffraction grating pattern of the substrate mark 20 is a checkerboard and the diffraction grating pattern of the mold mark 19 is a line-and-space pattern. For example, the diffraction grating pattern of the substrate mark 20 may be a line-and-space pattern and the diffraction grating pattern of the mold mark 19 may be a checkerboard pattern.

[0033] Next, a method of determining the relative position by detecting moiré fringes will be described. The diffraction gratings 19b and 20b are configured with periodic patterns, and since the periods in the measurement direction are slightly different, when they are superimposed, moiré fringes are formed in which the light intensity changes in the Y direction. In addition, the shift direction of the moiré fringes when the relative position changes differs depending on the difference in the periods of the diffraction gratings 19b and 20b. For example, when the period of the diffraction grating 19b is slightly larger than the period of the diffraction grating 20b, if the substrate 17 shifts relatively in the +Y direction, the moiré fringes also shift in the +Y direction. On the other hand, when the period of the diffraction grating 19b is slightly smaller than the period of the diffraction grating 20b, if the substrate 17 shifts relatively in the +Y direction, the moiré fringes shift in the -Y direction.

[0034] Another moiré fringe is formed by the diffraction grating 19b' and the diffraction grating 20b'. The relationship between the periods of the diffraction gratings 19b and 20b is opposite to that between the diffraction gratings 19b' and 20b'. Therefore, when the relative positions change, the positions of the two measured moiré fringes change in opposite directions. If the periodic marks on the mold side and the substrate side that generate the moiré fringes are misaligned by one period, the misalignment of one period cannot be detected according to the principle of moiré fringe detection. Therefore, it can be confirmed that there is no relative misalignment of one period between the mold 16 and the substrate 17 by using the marks 19a and 20a, which have low detection accuracy.

[0035] Next, the light intensity distribution on the pupil plane 1 of the illumination system 22 and the pupil plane 2 of the detection system 21 will be described with reference to FIGS. 1(a) and 1(b). As illustrated in FIG. 1(a), a light intensity distribution 3 having a light intensity concentrated on the intersection of the x-axis and the y-axis (i.e., the optical axis) can be generated at the exit of the pupil plane 1 of the illumination system 22. FIG. 1(b) illustrates a light intensity distribution formed on the pupil plane 1 of the detection system 21 by the diffracted lights 4a to 4d, 5a to 5d, and 6 from the marks 19b and 20b (19b' and 20b') illuminated by the light intensity distribution 3. An xyz coordinate system is defined as the coordinate system of the pupil plane 1 of the illumination system 22. The x-axis and y-axis on the pupil plane 1 of the illumination system 22 respectively coincide with the Z-axis and Y-axis in the XYZ coordinate system. The x direction parallel to the x axis is a direction conjugate to the X direction parallel to the X axis, and the y direction parallel to the y axis is a direction conjugate to the Y direction parallel to the Y axis. In the illumination system 22, the x direction and the X direction are conjugate to each other, meaning that the x direction and the X direction are the same direction when there is no reflecting surface (e.g., reflecting surface RS) between the mold 16 / substrate 17 and the pupil plane 1 of the illumination system 22 that bends the optical axis. In the illumination system 22, the x direction and the X direction are conjugate to each other, meaning that when there is a reflecting surface between the mold 16 / substrate 17 and the pupil plane 1 that bends the optical axis, the X direction mapped onto the pupil plane 1 by the reflecting surface coincides with the x direction. When the reflecting surface exists, the x direction and the X direction may or may not coincide with each other. The same applies to the conjugation of the y direction and the Y direction.

[0036] In the example shown in FIG. 3, there is no reflecting surface between the mold 16 / substrate 17 and the pupil plane 2 of the detection system 21 that bends the optical axis of the detection system 21. Therefore, when an xyz coordinate system is defined as the coordinate system of the pupil plane 2 of the detection system 21, the x axis coincides with the X axis, and the y axis coincides with the Y axis. The x direction (third direction) parallel to the x axis is a direction conjugate to the X direction (first direction) parallel to the X axis, and the y direction (fourth direction) parallel to the y axis is a direction conjugate to the Y direction (second direction) parallel to the Y axis. In the detection system 21, the x direction and the X direction are conjugate to each other when there is no reflecting surface between the mold 16 / substrate 17 and the pupil plane 2 of the detection system 21 that bends the optical axis of the detection system 21, meaning that the x direction and the X direction are the same direction. In detection system 21, the x direction and the X direction are conjugate with each other means that, when a reflecting surface that bends the optical axis exists between mold 16 / substrate 17 and pupil plane 2 of detection system 21, the X direction mapped onto pupil plane 2 by the reflecting surface coincides with the x direction. When the reflecting surface exists, the x direction and the X direction may or may not coincide with each other. The same applies to the conjugation of the y direction and the Y direction.

[0037] Here, a case will be described where the measurement direction (the direction in which the light intensity in the moiré fringes changes) coincides with the X direction (first direction). The relative position of the diffraction grating 19b (19b') of the mold mark 19 and the diffraction grating 20b (20b') of the substrate mark 20 is equivalent to the relative position of the mold mark 19 and the substrate mark 20. The detection system 21 forms an image on the imaging surface of the imaging element 25, which indicates the relative position of the diffraction grating 19b (19b') of the mold mark 19 and the diffraction grating 20b (20b') of the substrate mark 20 in the measurement direction.

[0038] Consider the case where a light intensity distribution 3 having light intensity concentrated at the intersection of the X-axis and the Y-axis (the optical axis of the illumination system 22) and its vicinity is formed at the exit of the pupil plane 1 of the illumination system 22, in other words, the case where the illumination light passes only through the optical axis of the illumination system 22 and its vicinity at the pupil plane 1 of the illumination system 22. In this case, it can be considered that only the light component parallel to the optical axis among the light emitted from the light source 23 is incident on the mold mark 19 (diffraction gratings 19b, 19b') as the illumination light. In the mold mark 19 (diffraction gratings 19b, 19b'), +1st order and -1st order diffracted light are generated in the X-axis direction. Of the diffracted light generated in the mold mark 19 (diffraction gratings 19b, 19b'), the +1st order diffracted light is defined as light diffracted in the positive direction of the X-axis with respect to the optical axis, and the -1st order diffracted light is defined as light diffracted in the negative direction of the X-axis with respect to the optical axis. When each diffracted light is incident on the substrate mark 20 (diffraction gratings 20b, 20b'), +1st order and -1st order diffracted light are generated, respectively. Because the substrate mark 20 has a checkerboard shape, the traveling direction of the light diffracted by the substrate mark 20 has both X-axis and Y-axis components. Here, of the diffracted light generated by the substrate mark 20, the +1st order diffracted light is defined as diffracted light having a positive Y-axis component relative to the optical axis in its traveling direction, and the -1st order diffracted light is defined as diffracted light having a negative Y-axis component relative to the optical axis in its traveling direction.

[0039] In FIG. 1, for example, in the pupil plane 2 of the detection system 21, the diffracted light 4a represents the light that is diffracted in the +1-order direction by the substrate mark 20 after the illumination light is incident on the mold mark 19 and diffracted in the -1-order direction. Such diffracted light 4a is represented as (-1, +1). According to this representation method, in addition to the diffracted light (-1, +1), the diffracted light 4b (+1, +1), the diffracted light 4c (-1, -1), and the diffracted light 4d (+1, -1) are incident on the pupil plane 2. The diffracted light 4a and the diffracted light 4b form an image on the imaging surface of the imaging element 25, and an interference fringe (moire fringe) whose light intensity changes in the X direction is generated. Similarly, the diffracted light 4c and the diffracted light 4d also generate an interference fringe whose light intensity changes in the X direction.

[0040] The pitch of the mold mark 19 (19b, 19b') is Pmx, and the pitch of the board mark 20 (20b, 20b') in the X direction and the Y direction is Pwx, Pwy, respectively. The distance of the diffracted light 4a from the X axis at the pupil plane 2 of the detection system 21 can be expressed as f·tanθwy. f is the focal length of the lens group arranged between the pupil plane 2 of the detection system 21 and the mold mark 19 / board mark 20, and θwy is the diffraction angle in the Y direction at the board mark 20. The diffraction angle θwy is arcsin(λ / Pwy). This is because the diffraction angle θ can be expressed as sinθ=λ / p, where λ is the wavelength of light and p is the mark pitch. The wavelength λ may be a single wavelength, for example, as in the case of using a laser light source, or may have an intensity distribution in a wavelength band of, for example, 500 to 800 nm. On the other hand, the distance of the diffracted light 4a from the Y axis can be expressed as f tan(θmx-θwx). θmx is the diffraction angle in the X-axis direction at the mold mark 19, and θwx is the diffraction angle in the X-axis direction at the substrate mark 20. θmx-θwx is arcsin(λ / Pmx)-arcsin(λ / Pwx). This is because the light incident on the mold mark 19 / substrate mark 20 is diffracted in the X-axis direction at each of the mold mark 19 and the substrate mark 20. The same can be said about the mold mark 19 / substrate mark 20 when the measurement direction is the same as the Y axis (second direction) perpendicular to the X axis of the pupil planes 1 and 2, and the diffracted lights 5a, 5b, 5c, and 5d can be explained, respectively.

[0041] The pattern edge light 6 will be described with reference to FIG. 7. The pattern edge light 6 is diffracted light at the edges of the entire patterns of the diffraction gratings 19b (19b') and 20b (20b') of the mold mark 19 and the substrate mark 20. The pitch of each of the edges of the individual minute pattern elements constituting 19b (19b') and 20b (20b') is so small that they are not detected as diffracted light. The pattern edge light in the diffraction grating 19b of the mold mark 19 will be described. Light incident on the edge of the entire diffraction grating 19b is diffracted only in the axial direction perpendicular to the edge. This is because the edge of the entire diffraction grating 19b is parallel to either the X-axis or the Y-axis. For example, when light is incident on an edge parallel to the X-axis, the diffracted light is parallel to the Y-axis. On the other hand, when light is incident on an edge parallel to the Y-axis, the diffracted light is diffracted in the X-axis direction. The same is true for the diffracted light from the diffraction grating 19b' of the mold mark 19 and the diffraction gratings 20b, 20b' of the substrate mark 20. Therefore, the pattern edge light 6 passes through the X-axis and its vicinity, and the Y-axis and its vicinity on the pupil plane 2 of the detection system 21.

[0042] The illumination diaphragm 27 and the detection diaphragm 26 for removing the pattern edge light 6, which is unnecessary light, will be described with reference to FIG. 8. In order to make light parallel to the optical axis incident on the mold mark 19, it is advantageous to form a light intensity distribution having light intensity concentrated only at the intersection of the X-axis and the Y-axis (i.e., the optical axis) and its vicinity at the exit of the pupil plane 1 of the illumination system 22. Therefore, an illumination diaphragm 27 (pinhole plate) having an opening (pinhole) at the intersection of the X-axis and the Y-axis can be arranged on the pupil plane 1. This makes it possible to make only light parallel to the optical axis of the light source 23 incident on the mold mark 19 (diffraction gratings 19b, 19b').

[0043] The diffracted light 4a-4d and 5a-5d that form the moiré fringes on the imaging surface of the imaging element 25 are incident on a region that is not on the X-axis or Y-axis on the pupil plane 2 of the detection system 21. On the other hand, the pattern edge light 6 is incident on the X-axis and its vicinity, and on the Y-axis and its vicinity on the pupil plane 2 of the detection system 21. The pattern edge light 6 becomes noise light when measuring the relative position between the diffraction grating 19b (19b') and the diffraction grating 20b (20b') from the phase difference of the moiré fringes. Therefore, the pattern edge light 6 can be blocked by arranging the detection diaphragm 26 having the light shielding body 260 on the X-axis and its vicinity, and on the Y-axis and its vicinity on the pupil plane 2 of the detection system 21.

[0044] The light shielding body 260 disposed on the pupil plane 2 of the detection system 21 may include a first light shielding portion 261 that crosses the optical axis of the detection system 21 in a direction (third direction) parallel to the x-axis, and a second light shielding portion 262 that crosses the optical axis of the detection system 21 in a direction (fourth direction) parallel to the y-axis. The light shielding body 260 may further include a third light shielding portion 263 that is aligned with the optical axis. The third light shielding portion may have a circular shape. As described above, the direction (third direction) parallel to the x-axis is a direction conjugate to the direction (first direction) parallel to the X-axis, and the direction (fourth direction) parallel to the y-axis is a direction conjugate to the direction (second direction) parallel to the Y-axis. The illumination diaphragm 27 may be a pinhole plate having a pinhole having a diameter d.

[0045] The pupil plane 2 of the detection system 21 has a light-transmitting region 265 in an area where the light shielding body 260 is not arranged. Diffracted light from the mold mark 19 (19b, 19b') and the substrate mark 20 (20b, 20b') illuminated with the illumination light passes through the light-transmitting region 265 and forms optical information indicating the relative positions of the mold 16 and the substrate 17 on the imaging plane of the imaging element 25. Unwanted light that does not contain optical information indicating the relative positions among the light from the mold mark 19 (19b, 19b') and the substrate mark 20 (20b, 20b') illuminated with the illumination light can be blocked by both the first light shielding portion 262 and the second light shielding portion 262.

[0046] When the diameter of the concentrated light intensity portion (i.e., a pinhole) in the light intensity distribution 3 formed at the exit of the pupil plane 1 of the illumination system 22 is d, the width of the pattern edge light 6 on the pupil plane 2 of the detection system 21 is also d. Therefore, in order to block the pattern edge light 6, it is preferable that the width D of the first light shielding portion 261 and the second light shielding portion 262 of the detection diaphragm 26 is equal to or larger than d. The diffracted light 4a to 4d and 5a to 5d for forming an image of the moiré fringes on the imaging plane of the imaging element 25 must be incident on an area other than the light shielding body 260 on the pupil plane 2 of the detection system 21. For example, for the diffracted light 4a, it is preferable that both the distance |f·tanθwy| from the X-axis and the distance |f·tan(θmx-θwx)| from the Y-axis on the pupil plane 2 of the detection system 21 are larger than the sum of half the width D of the light shielding body 260 and the radius r of the diffracted light 4a. Here, the width D of the light shielding body 260 in the X direction is the width in the X direction of the second light shielding portion 262, and in the Y direction is the width in the Y direction of the first light shielding portion 261. Expressing this condition as a formula, it is preferable that the width D of the light shielding body 260 satisfies the following formula.

[0047] |f tanθwy|-r ≧ D / 2 ≧ d / 2, and |f·tan(θmx‐θwx)|-r≧D / 2≧d / 2 Here, r is greater than d because there is a finite number of pitches between mold mark 19 and substrate mark 20. Furthermore, for example, in the case of diffracted light 5a, it is preferable that the width of light blocking body D satisfies the following formula.

[0048] |f tanθwx|-r ≥ D / 2 ≥ d / 2, and |f·tan(θmy-θwy)|-r≧D / 2≧d / 2 The mark that generates the diffracted light 5a is a mark whose measurement direction is the Y direction.

[0049] The influence of the presence or absence of the pattern edge light 6 on the phase difference measurement of the moiré fringes will be described with reference to FIG. 9. When the pattern edge light 6 is present at both ends of the moiré fringes, as in an arbitrary cross section 31 in the measurement direction of the moiré fringes containing the pattern edge light 6, this becomes a noise component, and the measurement accuracy of the relative phase deteriorates. In addition, the closer the moiré fringes and the pattern edge light 6 are to each other, the greater the influence of the noise component becomes, making it difficult to miniaturize the alignment mark. On the other hand, as in an arbitrary cross section 32 in the measurement direction of the moiré fringes from which the pattern edge light 6 has been removed, the measurement accuracy of the relative phase improves in the case of only the moiré signal. In addition, the measurement accuracy of the relative phase is expected to improve by reducing the shot noise of the image sensor 25.

[0050] Next, an article manufacturing method using an imprint apparatus typified by the above-mentioned embodiment will be described. The article may be, for example, a semiconductor device, a display device, or a MEMS. The article manufacturing method may include a transfer step of transferring a pattern of an original to a substrate using a lithography apparatus or an imprint apparatus, and a processing step of processing the substrate so that an article can be obtained from the substrate that has undergone the transfer step. The transfer step may include, for example, a contact step of bringing the imprint material 18 on the shot region of the substrate 17 into contact with the mold 16. The transfer step may also include a measurement step of measuring the relative position between the shot region (or substrate mark) of the substrate 17 and the mold 16. The transfer step may also include an alignment step of aligning the shot region of the substrate 17 and the mold 16 based on the result of the measurement step. The transfer step may also include a curing step of curing the imprint material 18 on the substrate 17, and a separation step of separating the imprint material 18 from the mold 16. As a result, a pattern made of the cured product of the imprint material 18 is formed or transferred onto the substrate 17. The processing steps can include, for example, etching, resist peeling, dicing, bonding, packaging, and the like.

[0051] The pattern of the cured product formed by using the imprinting apparatus is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of the electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of the molds include molds for imprinting.

[0052] The pattern of the cured product is used as it is as at least a part of a component of the article, or is used temporarily as a resist mask, which is removed after etching or ion implantation in a substrate processing step.

[0053] Next, an article manufacturing method will be described, in which a pattern is formed on a substrate by an imprinting device, the substrate on which the pattern is formed is processed, and an article is manufactured from the processed substrate. As shown in Fig. 10(a), a substrate 1z such as a silicon wafer having a workpiece 2z such as an insulator formed on its surface is prepared, and then an imprinting material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state in which the imprinting material 3z in the form of multiple droplets is applied onto the substrate is shown.

[0054] As shown in Fig. 10(b), the imprinting mold 4z is placed so that the side on which the concave-convex pattern is formed faces the imprinting material 3z on the substrate. As shown in Fig. 10(c), the substrate 1z to which the imprinting material 3z has been applied is brought into contact with the mold 4z, and pressure is applied. The imprinting material 3z fills the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z in this state as energy for hardening, the imprinting material 3z hardens.

[0055] 10(d), after the imprint material 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. In this cured product pattern, the recesses of the mold correspond to the protrusions of the cured product, and the protrusions of the mold correspond to the recesses of the cured product, i.e., the recessed and protruding pattern of the mold 4z is transferred to the imprint material 3z.

[0056] As shown in Fig. 10(e), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured material or where only a thin layer remains is removed, forming a groove 5z. As shown in Fig. 10(f), when the pattern of the cured material is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured material is removed, but it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, a component of an article, without being removed after processing.

[0057] The disclosure herein includes the following detection apparatus, lithography apparatus and article manufacturing methods. (Item 1) A detection device that detects a relative position between a first mark and a second mark provided on a first object and a second object, respectively, which are arranged one on top of the other, comprising: an illumination system that illuminates the first mark and the second mark with illumination light; a detection system including an image sensor for forming an image of diffracted light from the first mark and the second mark illuminated by the illumination system on an image sensor of the image sensor, the first mark and the second mark are configured to be capable of forming optical information indicating the relative positions in a first direction or a second direction perpendicular to the first direction on the imaging surface; the illumination light is light that passes only through the optical axis of the illumination system and its vicinity on a pupil plane of the illumination system, a light shielding body including a first light shielding portion intersecting an optical axis of the detection system in a direction parallel to a third direction and a second light shielding portion intersecting the optical axis of the detection system in a direction parallel to a fourth direction is provided on a pupil plane of the detection system; The third direction is a direction conjugate to the first direction, and the fourth direction is a direction conjugate to the second direction. A detection device comprising: (Item 2) the illumination system has a pinhole plate disposed on the pupil plane of the illumination system, and the illumination light is light that has passed through a pinhole in the pinhole plate. 2. The detection device according to item 1, (Item 3) a width of the first light-shielding portion in the fourth direction and a width of the second light-shielding portion in the third direction are equal to or larger than a diameter of the pinhole; 3. The detection device according to item 2, (Item 4) the illumination system and the detection system share a prism; the pupil plane of the illumination system is disposed between a light source and the prism, and the illumination light illuminates the first mark and the second mark after being reflected by the prism. 4. The detection device according to item 2 or 3. (Item 5) the diffracted light from the first mark and the second mark passes through the prism and is incident on the imaging surface; the pupil plane of the detection system is disposed between the prism and the imaging plane. 5. The detection device according to item 4, (Item 6) the first light-shielding portion extends over an entire diameter of a pupil plane of the detection system in the third direction, the second light-shielding portion extends over an entire diameter in the fourth direction of a pupil plane of the detection system; 6. The detection device according to any one of items 1 to 5, (Item 7) the pupil plane of the detection system has a light transmitting area in an area where the light blocking body is not disposed, diffracted light from the first mark and the second mark illuminated with the illumination light passes through the light transmitting region to form the optical information indicating the relative position on the imaging plane. 7. The detection device according to any one of items 1 to 6, (Item 8) a first-order diffracted light from the first mark and the second mark illuminated with the illumination light passes through the light transmitting region, and forms the optical information indicating the relative position on the imaging plane; 8. The detection device according to item 7, (Item 9) the light blocking body further includes a third light blocking portion aligned with the optical axis of the detection system; 9. The detection device according to any one of items 1 to 8, (Item 10) The illumination light is unpolarized light. 10. The detection device according to any one of items 1 to 9, (Item 11) unnecessary light, which does not contain the optical information indicating the relative position, among the light from the first mark and the second mark illuminated with the illumination light is blocked by both the first light-shielding part and the second light-shielding part. 11. The detection device according to any one of items 1 to 10, (Item 12) A lithography apparatus for transferring a pattern of an original onto a substrate, comprising: A detection device according to any one of items 1 to 11, A lithography apparatus configured to perform alignment between the original as the first object on which the first mark is provided and the substrate as the second object on which the second mark is provided, based on an output of the detection device. (Item 13) Item 13. A lithographic apparatus according to item 12, configured as an imprint apparatus.

[0058] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0059] 1: pupil plane of illumination system, 2: pupil plane of detection system, 12: detection device, 21: detection system, 22: illumination system, 25: image sensor, 26: detection aperture, 27: illumination aperture

Claims

A detection device for detecting the relative positions of a first mark and a second mark respectively provided on a first object and a second object, comprising: an illumination system for illuminating the first mark and the second mark with illumination light; a detection system including an imaging device, for forming diffracted light from the first mark and the second mark illuminated by the illumination system on an imaging surface of the imaging device, wherein the first mark and the second mark are configured to be able to form optical information indicating the relative position in a first direction or a second direction orthogonal to the first direction on the imaging surface; the illumination light is light passing through the optical axis of the illumination system and its vicinity on the pupil plane of the illumination system; a light shielding body including a first light shielding portion extending in a direction parallel to a third direction so as to pass through the optical axis of the detection system and a second light shielding portion intersecting and extending in a direction parallel to a fourth direction so as to pass through the optical axis of the detection system is provided on the pupil plane of the detection system; the axis in the third direction is conjugate to the axis in the first direction, and the axis in the fourth direction is conjugate to the axis in the second direction; a detection device characterized by the above.

2. The illumination system has a pinhole plate disposed on the pupil plane of the illumination system, and the illumination light is light passing through the pinholes of the pinhole plate. The detection device according to claim 1, characterized by the above.

3. The length of the first light shielding portion in the fourth direction and the length of the second light shielding portion in the third direction are equal to or larger than the diameter of the pinhole. The detection device according to claim 2, characterized by the above.

4. The illumination system and the detection system share a prism; the pupil plane of the illumination system is disposed between a light source and the prism, and the illumination light illuminates the first mark and the second mark after being reflected by the prism. The detection device according to claim 2, characterized by the above.

5. Diffracted light from the first mark and the second mark enters the imaging surface after passing through the prism; the pupil plane of the detection system is disposed between the prism and the imaging surface. The detection device according to claim 4, characterized by the above.

6. The first light shielding portion extends over the entire diameter of the pupil plane of the detection system in the third direction; the second light shielding portion extends over the entire diameter of the pupil plane of the detection system in the fourth direction. The detection device according to claim 1, characterized by the above.

7. The pupil plane of the detection system has a light transmission region in an area where the light shielding body is not disposed, Diffracted light from the first mark and the second mark illuminated by the illumination light passes through the light transmission region to form the optical information indicating the relative position on the imaging surface. The detection device according to claim 1, wherein the detection device is characterized in that.

8. First-order diffracted light from the first mark and the second mark illuminated by the illumination light passes through the light transmission region to form the optical information indicating the relative position on the imaging surface. The detection device according to claim 7, wherein the detection device is characterized in that.

9. The light shielding body further includes a third light shielding portion centered on the optical axis of the detection system. The detection device according to claim 1, wherein the detection device is characterized in that.

10. The illumination light is non-polarized light. The detection device according to claim 1, wherein the detection device is characterized in that.

11. Unnecessary light that does not include the optical information indicating the relative position among the light from the first mark and the second mark illuminated by the illumination light is blocked by both the first light shielding portion and the second light shielding portion. The detection device according to claim 1, wherein the detection device is characterized in that.

12. A lithography apparatus for transferring a pattern of a master onto a substrate, Comprising the detection device according to any one of claims 1 to 11, An alignment between the master as the first object provided with the first mark and the substrate as the second object provided with the second mark is performed based on an output of the detection device. A lithography apparatus characterized by being configured.

13. The lithography apparatus according to claim 12, wherein the lithography apparatus is configured as an imprint apparatus.

14. A transfer step of transferring a pattern of a master onto a substrate using the lithography apparatus according to claim 13, A processing step of processing the substrate so that an article can be obtained from the substrate that has undergone the transfer step, An article manufacturing method characterized by including.

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