Wiring circuit board manufacturing method

Abstract

To provide a wiring circuit board manufacturing method with which it is possible to manufacture a wiring circuit board that excels in handleability in a second step, and yet enables shake correction.SOLUTION: A method for manufacturing a product board 100 comprises a first step, a second step, and a third step in order. In the first step, an intermediate board 1 comprising a frame 2, a mounting unit 3, a first joint 4, and a second joint 5 is prepared. The mounting unit 3 is enclosed in the frame 2. The mounting unit 3 is spaced apart from the frame 2. The first joint 4 and the second joint 5 connect the frame 2 and the mounting unit 3. The frame 2, mounting unit 3 and first joint 4 of the intermediate board 1 include a base insulating layer 12 and a wiring layer 13, respectively. The wiring layer 13 is located on one face in the thickness direction of the base insulating layer 12. In the second step, the intermediate board 1 is inspected. In the third step, the second joint 5 is removed.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for producing a wired circuit board. [Background technology]

[0002] A wired circuit board for mounting an imaging element is known (see, for example, Patent Document 1 below). The wired circuit board described in Patent Document 1 includes a frame, a mounting portion surrounded by the frame, and a support member connecting them. The wired circuit board includes an insulating layer and a wiring layer disposed on one surface of the insulating layer.

[0003] The printed circuit board described in Patent Document 1 has an imaging element mounted on a mounting portion after undergoing an inspection process. The inspection process includes, for example, a continuity inspection of the wiring layer and an external shape inspection of the insulating layer.

[0004] When the imaging device moves (vibrates), the frame also moves (vibrates). This causes the mounting part to shake (vibrate) in conjunction with the movement (vibration) of the frame. However, the above-mentioned shaking (vibration) of the mounting part can be corrected by a support member having low resilience. The above-mentioned correction is called vibration correction (shake correction). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2020-30306 Summary of the Invention [Problem to be solved by the invention]

[0006] In the inspection process, when the frame moves, the mounting part does not move sufficiently in conjunction with the movement of the frame due to the support member having low resilience, and the posture of the mounting part becomes unstable, which causes a problem that the handleability of the wired circuit board in the inspection process is low.

[0007] The present invention provides a method for producing a wired circuit board, which can produce a wired circuit board that is excellent in handleability in the second step and can correct vibrations. [Means for solving the problem]

[0008] The present invention [1] includes a method for manufacturing a wired circuit board comprising a frame, a mounting portion surrounded by the frame and spaced apart from the frame, and a first joint and a second joint connecting the frame and the mounting portion, wherein each of the frame, the mounting portion and the first joint comprises an insulating layer and a wiring layer disposed on one side of the insulating layer in a thickness direction, the method comprising the steps of: a first step of preparing a wired circuit board; a second step of inspecting the wired circuit board; and a third step of removing the second joint.

[0009] According to this manufacturing method, since the wired circuit board has the second joint in the second step, even if the frame is moved, the mounting portion is supported on the frame by the first joint and the second joint. Therefore, the posture of the mounting portion can be stabilized in the second step. As a result, the wired circuit board is easy to handle in the second step.

[0010] In the third step, the second joint is removed. Therefore, the mounting part is supported on the frame by the first joint. Therefore, the vibration of the mounting part can be reliably corrected.

[0011] The present invention [2] includes the method for manufacturing the wired circuit board described in [1], wherein the mounting portion has a generally rectangular shape and has a side at an outer peripheral edge of the mounting portion, the frame has a generally rectangular frame shape and has an opposing side facing the side and a non-opposing side adjacent to the opposing side and not facing the side, the first joint connects the side and the non-opposing side, and the second joint connects the side and the opposing side.

[0012] The first joint connects the side and the non-opposing side, and the second joint connects the side and the opposing side. Therefore, the first joint can be made longer than the second joint. As a result, the low resilience of the long first joint can be improved. On the other hand, the rigidity of the short second joint can be improved.

[0013] The present invention [3] includes the method for manufacturing a wired circuit board according to [2], wherein the sides include a first side and a second side along the first side, and at least two of the first joints and the second joints are provided on the wired circuit board in the first step, and each of the two first joints is connected to each of the first side and the second side, and each of the two second joints is connected to each of the first side and the second side.

[0014] In this manufacturing method, in the wired circuit board in the first step, the two first joints are connected to the first side and the second side, respectively, and the two second joints are connected to the first side and the second side, respectively. Therefore, in the second step, the posture of the mounting portion in the direction in which the first side and the second side face each other can be made even more stable.

[0015] The present invention [4] includes the method for manufacturing a wired circuit board according to any one of [1] to [3], wherein in the first step, the wired circuit board further includes a third joint connecting the frame and the first joint, and in the third step, the third joint is further removed.

[0016] In this manufacturing method, since the wired circuit board including the third joint that supports the first joint is prepared in the first step, the rigidity of the first joint can be increased in the second step.

[0017] In addition, in this manufacturing method, since the third joint is removed in the third step, the mounting portion is supported by the first joint, so that the vibration of the mounting portion can be reliably corrected.

[0018] The present invention [5] includes the method for producing a wired circuit board according to any one of [1] to [4], wherein the second joint includes the insulating layer.

[0019] The present invention [6] relates to the method for producing a wired circuit board according to [5], wherein the insulating layer in the second joint includes a base insulating layer and / or a cover insulating layer.

[0020] The present invention [7] includes the method for producing a wired circuit board according to [6], wherein the second joint further includes the wiring layer.

[0021] The second joint includes a wiring layer in addition to the insulating layer, so that the wiring layer can reinforce the insulating layer in the second joint.

[0022] The present invention [8] includes the method for manufacturing a wired circuit board described in any one of [1] to [7], wherein each of the frame and the mounting portion further includes a metal support layer arranged on the other side of the insulating layer in the thickness direction.

[0023] Each of the frame and the mounting portion includes a metal support layer, thereby improving rigidity.

[0024] The present invention [9] includes the method for producing a wired circuit board according to [8], wherein the second joint includes the metal support layer.

[0025] Since the second joint includes a metal support layer, the rigidity can be improved, which results in excellent handling of the mounting portion in the second step.

[0026] The present invention

[10] includes the method for manufacturing a wired circuit board described in any one of [1] to [9], wherein the wiring layer in the first joint has a plurality of joint wires spaced apart from each other, and the insulating layer in the first joint has slits arranged between the plurality of joint wires.

[0027] Since the first joint has a slit, the low resilience of the first joint can be improved, and therefore, by removing the second joint from the wired circuit board, the mounting portion can be more reliably compensated for vibration.

[0028] The present invention

[11] includes the method for manufacturing a wired circuit board according to

[10] , wherein the slit extends along the plurality of joint wirings, and the first joint has a sub-joint that divides the slit in the direction in which the slit extends and connects the plurality of joint wirings.

[0029] In the wired circuit board, the sub-joint can suppress a decrease in rigidity of the first joint caused by the slit, thereby improving the handleability of the wired circuit board in the second step.

[0030] The present invention

[12] includes the method for manufacturing a wired circuit board according to any one of [1] to

[10] , wherein the second joint does not overlap the first joint in a thickness direction.

[0031] Since the second joint does not overlap the first joint, the configuration of the wired circuit board is simple in the first step, and therefore the second joint can be easily removed in the third step.

[0032] The present invention

[13] includes the method for producing a wired circuit board according to [1] or [2], wherein the second joint intersects with the first joint.

[0033] The present invention

[14] includes the method for manufacturing a wired circuit board described in any one of [1] to

[13] , further comprising a fourth step, after the first step and before the third step, of mounting an imaging element on the mounting portion.

[0034] With this method, the posture of the mounting part can be stabilized in the fourth step before the third step of removing the second joint, so that the imaging element can be reliably mounted on the mounting part.

[0035] The present invention

[15] includes the method for producing a wired circuit board according to

[14] , in which the fourth step is carried out after the second step.

[0036] With this method, the intermediate board is inspected in the second step, and if it is found to be defective, the intermediate board is discarded, but in the fourth step, the above-mentioned imaging element can be separately mounted on another good intermediate board.

[0037] The present invention

[16] includes a wired circuit board comprising: a frame; a mounting portion surrounded by the frame and spaced apart from the frame; and a first joint and a second joint connecting the frame and the mounting portion, wherein the mounting portion has a generally rectangular shape and has a side at an outer periphery of the mounting portion, the frame has a generally rectangular frame shape and has an opposing side facing the side and a non-opposing side adjacent to the opposing side and not facing the side, the first joint connecting the side and the non-opposing side, and the second joint connecting the side and the opposing side.

[0038] In this wired circuit board, the first joint connects the side and the non-opposing side, and the second joint connects the side and the opposing side. Therefore, the first joint can be made longer than the second joint. Therefore, the rigidity of the short second joint can be improved. As a result, the wired circuit board is easy to handle. Meanwhile, the low resilience of the long first joint can be improved. Therefore, by removing the second joint, the mounting part can be reliably compensated for vibration.

[0039] The present invention

[17] includes the wired circuit board according to

[16] , wherein the mounting portion and the first joint each include an insulating layer and a wiring layer arranged on one side of the insulating layer in the thickness direction, and the second joint includes the insulating layer.

[0040] The present invention

[18] includes the wired circuit board according to

[17] , wherein the second joint further includes the wiring layer.

[0041] The second joint includes a wiring layer in addition to the insulating layer, so that the wiring layer can reinforce the insulating layer in the second joint.

[0042] The present invention

[19] includes the wired circuit board described in any one of

[16] to

[19] , wherein each of the frame and the mounting portion further includes a metal support layer arranged on the other side of the insulating layer in the thickness direction.

[0043] Each of the frame and the mounting portion includes a metal support layer, thereby improving rigidity.

[0044] The present invention

[20] includes the wired circuit board according to

[16] or

[17] , wherein the insulating layer in the second joint includes a base insulating layer and / or a cover insulating layer.

[0045] The present invention

[21] includes the wired circuit board according to any one of

[16] to

[20] , wherein the wiring layer in the first joint has a plurality of joint wires spaced apart from each other, and the insulating layer in the first joint has slits arranged between the plurality of joint wires.

[0046] Since the first joint has a slit, the low resilience of the first joint can be improved, and therefore, in the wired circuit board after the third process, the mounting portion can be more reliably compensated for vibration.

[0047] The present invention

[22] includes the method for manufacturing a wired circuit board according to

[21] , wherein the slit extends along the plurality of joint wirings, and the first joint has a sub-joint that divides the slit in the direction in which the slit extends and connects the plurality of joint wirings.

[0048] In the second step, the sub-joint in the wired circuit board can prevent a decrease in rigidity of the first joint caused by the slit, and therefore, excessive deformation of the first joint can be suppressed.

[0049] The present invention

[23] includes the wired circuit board according to any one of

[16] to

[22] , further comprising a third joint connecting the frame and the first joint.

[0050] Since this wired circuit board includes the third joint, the rigidity of the first joint can be increased. [Brief description of the drawings]

[0051] [Figure 1] 1 is a plan view of an intermediate substrate prepared in a first step of one embodiment of a method for producing a wired circuit board according to the present invention. [Diagram 2] 4 is a plan view of a product board produced by a third step of one embodiment of the method for producing a wired circuit board of the present invention. FIG. [Diagram 3] 2 is a partial enlarged view of the intermediate substrate shown in FIG. [Figure 4] 4A is a process diagram of one embodiment of a method for producing a wired circuit board of the present invention. Fig. 4A is a cross-sectional view taken along line AA in Fig. 3. Fig. 4B is a fourth process. Fig. 4C is a third process. [Diagram 5] 5A is a diagram showing a preparation process of the intermediate substrate shown in FIG. 4A. FIG. 5A is a process of forming a base insulating layer. FIG. 5B is a process of forming a wiring layer. FIG. 5C is a process of forming a cover insulating layer. [Figure 6] FIG. 11 is a cross-sectional view of a first modified example. [Figure 7] FIG. 11 is a cross-sectional view of a second modified example. [Figure 8] FIG. 13 is a cross-sectional view of a third modified example. [Figure 9] FIG. 13 is a plan view of a fourth modified example. [Figure 10] FIG. 13 is a plan view of a fifth modified example. [Figure 11] FIG. 13 is a plan view of a sixth modified example. [Figure 12] FIG. 13 is a plan view of a seventh modified example. [Figure 13] FIG. 13 is a plan view of an eighth modified example. [Figure 14] FIG. 13 is a plan view of a ninth modified example. [Figure 15] 15 is a cross-sectional view taken along the line AA in FIG. 14. [Figure 16] FIG. 23 is a cross-sectional view of an intermediate substrate according to a tenth modified example. [Figure 17] FIG. 23 is a cross-sectional view of an intermediate substrate of an eleventh modified example. [Figure 18] FIG. 23 is an enlarged plan view of an intermediate substrate of a twelfth modified example. [Figure 19] FIG. 23 is an enlarged plan view of an intermediate substrate of a thirteenth modified example. [Figure 20] 20A is a process diagram of a fourteenth modified example, FIG. 20B is a first process, FIG. 20B is a third process, and FIG. 20C is a fourth process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0052] 1. One embodiment of a method for manufacturing a printed circuit board An embodiment of the method for manufacturing a wired circuit board of the present invention will be described with reference to Fig. 1 to Fig. 5C. In Fig. 2, an imaging element 105 and an external substrate 106 (described later) are omitted in order to clearly show the shapes and arrangements of a frame 2 and a mounting portion 3 (described later).

[0053] This manufacturing method includes a first step (see FIG. 1 and FIG. 4A), a second step, a fourth step (see FIG. 4B), and a third step (see FIG. 2 and FIG. 4C) in this order. The first step, the second step, the fourth step, and the third step are performed in this order. The first step, the second step, the fourth step, and the third step will be described below in this order.

[0054] 1.1 First step As shown in Fig. 1, in the first step, an intermediate substrate 1 is prepared as an example of a wired circuit board. Intermediate substrate 1 differs from product substrate 100 (see Fig. 2) described below. That is, intermediate substrate 1 includes second joint 5 described below that product substrate 100 does not include. Intermediate substrate 1 is an intermediate part for manufacturing product substrate 100 (see Fig. 2).

[0055] The intermediate substrate 1 has a sheet shape. The intermediate substrate 1 has a thickness. The intermediate substrate 1 extends in a planar direction. The planar direction is perpendicular to the thickness direction. The intermediate substrate 1 includes a frame 2, a mounting portion 3, a first joint 4, and a second joint 5.

[0056] 1.1.1 Frame 2 In this embodiment, the frame 2 has a substantially rectangular frame shape. The frame 2 includes an inner peripheral edge 20. In this embodiment, the frame 2 has four sides 23A, 23B, 23C, and 23D at the inner peripheral edge 20. The four sides 23A, 23B, 23C, and 23D are arranged in order counterclockwise in a plan view. Sides 23A and 23C face each other. Side 23B connects one end of side 23A to one end of side 23C. Side 23D connects the other end of side 23A to the other end of side 23C. Sides 23B and 23D face each other.

[0057] As shown in FIG. 4A, the frame 2 includes a metal support layer 11, a base insulating layer 12, a wiring layer 13, and a cover insulating layer .

[0058] 1.1.1.1 Metal Support Layer 11 in Frame 2 The metal supporting layer 11 extends in the planar direction of the frame 2. The metal supporting layer 11 forms the other surface of the frame 2 in the thickness direction.

[0059] The material of the metal support layer 11 in the frame 2 is, for example, a rigid material. Examples of the rigid material include stainless steel, 42 alloy, aluminum, copper-beryllium, phosphor bronze, copper, silver, nickel, chromium, titanium, tantalum, platinum, gold, and copper alloy. As the rigid material, preferably, stainless steel and copper alloy are used from the viewpoint of ensuring the strength of the frame 2. The thickness of the metal support layer 11 in the frame 2 is, for example, 30 μm or more, preferably 100 μm or more, and for example, 10,000 μm or less, preferably 1,000 μm or less.

[0060] 1.1.1.2 Base insulating layer 12 in frame 2 In the frame 2, the base insulating layer 12 is disposed on one side of the metal supporting layer 11 in the thickness direction. In other words, in the frame 2, the metal supporting layer 11 is disposed on the other side of the base insulating layer 12 in the thickness direction. The base insulating layer 12 contacts one side of the metal supporting layer 11.

[0061] The material of the base insulating layer 12 in the frame 2 is, for example, a resin, preferably a polyimide resin. The thickness of the base insulating layer 12 in the frame 2 is, for example, 1 μm or more, preferably 5 μm or more, and for example, less than 20 μm, preferably 15 μm or less.

[0062] 1.1.1.3 Wiring layer 13 in frame 2 In the frame 2, the wiring layer 13 is disposed on one surface of the base insulating layer 12 in the thickness direction. The wiring layer 13 contacts one surface of the base insulating layer 12. As shown in FIG. 3, the wiring layer 13 includes a plurality of frame terminals 131 and a plurality of frame wires 132.

[0063] 1.1.1.4 Frame terminal 131 The frame terminals 131 are provided corresponding to the four sides 23A, 23B (see FIG. 1), 23C (see FIG. 1), and 23D (see FIG. 1). The frame terminals 131 corresponding to the side 23A are spaced apart from one another along the side 23A. Preferably, the frame terminals 131 are spaced apart from one another at equal intervals along the side 23A. The frame terminals 131 corresponding to the side 23A include frame ground terminals 131G and frame differential terminals 131D. Although not shown, the frame terminals 131 corresponding to the sides 23B (see FIG. 1), 23C (see FIG. 1), and 23D (see FIG. 1) have the same configuration as the frame terminals 131 corresponding to the side 23A.

[0064] 1.1.1.5 Frame wiring 132 The plurality of frame wirings 132 are electrically connected to the plurality of frame terminals 131, respectively. In this embodiment, the plurality of frame wirings 132 corresponding to the side 23A extend from each of the plurality of frame terminals 131 corresponding to the side 23A, bend, converge to each other, and then reach the inner periphery 20. Specifically, each of the plurality of frame wirings 132 includes a frame extension line 132A and a frame convergence line 132B.

[0065] The frame extension lines 132A corresponding to the side 23A extend from each of the plurality of frame terminals 131 corresponding to the side 23A toward the side 23A. The frame extension lines 132A corresponding to the side 23A are provided in plurality in correspondence with the plurality of frame terminals 131 corresponding to the side 23A.

[0066] The multiple frame extension lines 132A are spaced apart from one another in a direction along the side 23A. Each of the multiple frame extension lines 132A extends in a direction intersecting the side 23A.

[0067] The frame extension line 132A includes a plurality of frame ground extension lines 132AG and a plurality of frame differential extension lines 132AD. Each of the frame ground extension lines 132AG extends from each of the frame ground terminals 131G. Each of the frame differential extension lines 132AD extends from each of the frame differential terminals 131D.

[0068] In the frame 2, an area in which the multiple frame extension lines 132A are provided is defined as a third portion 25.

[0069] The frame extension lines 132A corresponding to the sides 23B (see FIG. 1), 23C (see FIG. 1), and 23D (see FIG. 1) have the same configuration as the frame extension line 132A corresponding to the side 23A described above.

[0070] A plurality of frame converging lines 132B corresponding to the side 23A are provided corresponding to the plurality of frame extending lines 132A corresponding to the side 23A. The plurality of frame converging lines 132B converge to each other and head toward the vicinity of a second connecting portion 46 (described later) of the first joint 4A in the frame 2. Each of the plurality of frame converging lines 132B starts from one end edge of the plurality of frame extending lines 132A and ends at a point where the frame converging lines 132B overlap with the side 23A in the thickness direction. The one end edge is an end edge of the frame extending line 132A on the opposite side to the frame terminal 131. The starting point of the frame converging line 132B is a first bending point in the frame wiring 132. The frame converging line 132B bends in a region facing the second connecting portion 46 of the first joint 4A. The above-mentioned bend in the frame converging line 132B becomes a second bend point in the frame wiring 132. The second bend point in the frame wiring 132 is spaced apart from the first bend point in the frame wiring 132 in the direction along the side 23A. The second bend point faces the first joint 4A in the direction perpendicular to the side 23A, but may not face the corresponding frame terminal 131. The wiring density of the multiple frame converging lines 132B is higher than the wiring density of the above-mentioned frame extending line 132A. The multiple frame converging lines 132B may have equally spaced portions that are spaced apart from each other by equal intervals. In this embodiment, each of the multiple frame converging lines 132B has a substantially L-shaped shape.

[0071] In the frame 2, the region where the frame converging line 132B is provided is defined as the fourth portion 26. The fourth portion 26 is disposed between the inner periphery 20 (side 23A) and the above-mentioned third portion 25. The side 23A, the fourth portion 26, and the third portion 25 are aligned in order. The wiring density of the frame converging line 132B in the fourth portion 26 is higher than the wiring density of the frame extending line 132A in the third portion 25.

[0072] The frame converging lines 132B corresponding to the sides 23B (see FIG. 1), 23C (see FIG. 1), and 23D (see FIG. 1) have the same configuration as the frame converging line 132B corresponding to the above-mentioned side 23A.

[0073] Examples of materials for the wiring layer 13 in the frame 2 include conductors. As the conductor, copper is preferably used.

[0074] The thickness of the wiring layer 13 in the frame 2 is in a range of, for example, 1 μm or more, or preferably 5 μm or more, and in a range of, for example, 50 μm or less, or preferably 35 μm or less.

[0075] 1.1.1.6 Cover insulating layer 14 in frame 2 4A, in the frame 2, the cover insulating layer 14 is disposed on one surface of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 covers the frame wiring 132 (frame extension line 132A and frame convergence line 132B) which is a part of the wiring layer 13. The cover insulating layer 14 exposes the frame terminals 131 (frame ground terminal 131G and frame differential terminal 131D) which are the remaining parts of the wiring layer 13.

[0076] The material of the cover insulating layer 14 may be, for example, a resin, and preferably a polyimide resin. The thickness of the cover insulating layer 14 in the frame 2 is, for example, 1 μm or more, preferably 5 μm or more, and for example, less than 20 μm, preferably 15 μm or less.

[0077] 1.1.1.7 Frame 2 dimensions The outer dimensions of the frame 2 are not limited. As shown in FIG. 1, the distance between the sides 23A and 23C and the distance between the sides 23B and 23D are, for example, 5 mm or more, preferably 8 mm or more, and, for example, 50 mm or less, preferably 30 mm or less. The length of each of the sides 23A, 23B, 23C, and 23D is, for example, 5 mm or more, preferably 8 mm or more, and, for example, 50 mm or less, preferably 30 mm or less. The width of the frame 2 is, for example, 0.1 mm or more, preferably 0.3 mm or more, and, for example, 50 mm or less, preferably 30 mm or less. The width of the frame 2 is the length between the inner peripheral edge 20 and the outer peripheral edge.

[0078] As shown in FIG. 3, the width of each of the multiple frame terminals 131 is, for example, 10 μm or more, or preferably 30 μm or more, and for example, 3000 μm or less, or preferably 1000 μm or less.

[0079] The pitch of the multiple frame terminals 131 is, for example, 30 μm or more, or preferably 50 μm or more, and for example, 2000 μm or less, or preferably 1000 μm or less. The pitch is the distance between the edges of adjacent frame terminals 131. Each of the two edges is one edge in the direction along side 23A. The definition of the pitch is the same below.

[0080] In contrast, in this embodiment, the pitch of the evenly spaced portions of the plurality of frame converging lines 132B is smaller than the pitch of the plurality of frame extending lines 132A. The pitch of the evenly spaced portions of the plurality of frame converging lines 132B is, for example, 1500 μm or less, preferably 1000 μm or less, more preferably 800 μm or less, and for example, 10 μm or more. The ratio of the pitch of the evenly spaced portions of the plurality of frame converging lines 132B to the pitch of the plurality of frame extending lines 132A is, for example, less than 1, preferably 0.8 or less, more preferably 0.5 or less, and for example, 0.01 or more.

[0081] The width of the frame wiring 132 is, for example, 1 μm or more, or preferably 5 μm or more, and for example, 3000 μm or less, or preferably 1000 μm or less.

[0082] 1.1.2 Mounting section 3 As shown in FIG. 1, the mounting portion 3 is surrounded by a frame 2. The mounting portion 3 is spaced apart from the frame 2. In this embodiment, the mounting portion 3 has a substantially rectangular shape. Preferably, the mounting portion 3 has a substantially rectangular outer shape, specifically, a substantially rectangular frame shape. The mounting portion 3 includes an outer peripheral edge 30 and an inner peripheral edge 39. In this embodiment, the mounting portion 3 includes four sides 33A, 33B, 33C, and 33D at the outer peripheral edge 30.

[0083] The four sides 33A, 33B, 33C, and 33D are disposed in a counterclockwise direction in a plan view. The sides 33A, 33B, 33C, and 33D of the mounting portion 3 face the sides 23A, 23B, 23C, and 23D of the frame 2, respectively.

[0084] In other words, the side 33B of the mounting portion 3 faces (opposes) the side 23B of the frame 2. That is, the side 23B is the opposing side to the side 33B. The side 33B extends in the same direction as the side 23B.

[0085] Side 33B of mounting portion 3 does not face (oppose) side 23A of frame 2. In other words, side 23A is a non-facing side to side 33B. Side 33B is adjacent to side 33A. Side 33B extends in a direction intersecting side 23A. Preferably, side 33B extends in a direction perpendicular to side 23A. In this embodiment, side 33B is an example of a first side.

[0086] Side 33C extends in the same direction as side 33A. Side 33B connects one end of side 33A to one end of side 33C.

[0087] Side 33D connects the other end of side 33A and the other end of side 33C. Side 33D is along the same direction as side 33B. In other words, side 33D is along side 33B. Side 33D is an example of a second side.

[0088] As shown in FIG. 4A, the mounting portion 3 includes a metal support layer 11, a base insulating layer 12, a wiring layer 13, and a cover insulating layer .

[0089] 1.1.2.1 Metal Support Layer 11 in Mounting Section 3

[0090] In the mounting portion 3, the metal support layer 11 extends in the planar direction. The metal support layer 11 forms the other surface of the mounting portion 3 in the thickness direction. The material and thickness of the metal support layer 11 in the mounting portion 3 are the same as those of the metal support layer 11 in the frame 2.

[0091] 1.1.2.2 Base insulating layer 12 in mounting portion 3 In the mounting portion 3, the base insulating layer 12 is disposed on one side of the metal support layer 11 in the thickness direction. In other words, in the mounting portion 3, the metal support layer 11 is disposed on the other side of the base insulating layer 12 in the thickness direction. The base insulating layer 12 contacts one side of the metal support layer 11.

[0092] The material and thickness of the insulating base layer 12 in the mounting portion 3 are the same as those of the insulating base layer 12 in the frame 2, respectively.

[0093] 1.1.2.3 Wiring layer 13 in mounting portion 3 In the mounting portion 3, the wiring layer 13 is disposed on one surface of the base insulating layer 12 in the thickness direction. The wiring layer 13 contacts one surface of the base insulating layer 12. As shown in FIG. 3, the wiring layer 13 in the mounting portion 3 includes a plurality of terminals 133 and a plurality of wires 134.

[0094] 1.1.2.4 Terminal 133

[0095] As shown in FIG. 3, the multiple terminals 133 are provided corresponding to each of the four sides 33A (see FIG. 1), 33B, 33C (see FIG. 1), and 33D (see FIG. 1). Specifically, the multiple terminals 133 corresponding to the side 33B are spaced apart from each other in the direction along the side 33B. Preferably, the multiple terminals 133 are spaced apart from each other at equal intervals in the direction along the side 33B. The multiple terminals 133 corresponding to the side 33B include multiple ground terminals 133G and multiple differential terminals 133D. Although not shown, the multiple terminals 133 corresponding to each of the sides 33A (see FIG. 1), 33C (see FIG. 1), and 33D (see FIG. 1) have the same configuration as the terminals 133 corresponding to the side 33B.

[0096] 1.1.2.5 Wiring 134 The multiple wirings 134 are electrically connected to the multiple terminals 133, respectively. The multiple wirings 134 are spaced apart from one another. In this embodiment, the multiple wirings 134 corresponding to the side 33B extend from each of the multiple terminals 133 corresponding to the side 33B, then converge to one another, and then reach the outer periphery 30. Specifically, each of the multiple wirings 134 includes an extending line 134A and a converging line 134B.

[0097] The extension lines 134A corresponding to the side 33B extend from each of the multiple terminals 133 corresponding to the side 33B toward the side 33B. A plurality of extension lines 134A corresponding to the side 33B are provided corresponding to the multiple terminals 133 corresponding to the side 33B.

[0098] The extension lines 134A are spaced apart from one another in a direction along the side 33B. Each of the extension lines 134A extends in a direction intersecting the side 33B. The extension lines 134A include a plurality of ground extension lines 134AG and a plurality of differential extension lines 134AD. Each of the ground extension lines 134AG extends from a corresponding one of the ground terminals 133G. Each of the differential extension lines 134AD extends from a corresponding one of the differential terminals 133D.

[0099] In the mounting portion 3, an area in which the multiple extension wires 134A are provided is defined as the first portion 31. In other words, the mounting portion 3 includes the first portion 31. In other words, in the first portion 31, the multiple wirings 134 extend from the multiple terminals 133.

[0100] The extension lines 134A corresponding to the sides 33A (see FIG. 1), 33C (see FIG. 1), and 33D (see FIG. 1) have the same configuration as the extension line 134A corresponding to the side 33B described above.

[0101] A plurality of converging lines 134B corresponding to the side 33B are provided corresponding to the extending lines 134A corresponding to the side 33B. The plurality of converging lines 134B converge to each other and head toward the vicinity of a connection portion 45 (described later) of the first joint 4A in the mounting portion 3. Each of the plurality of converging lines 134B starts from one end edge of the plurality of extending lines 134A and ends at a point where the plurality of converging lines 134B overlaps with the side 33B in the thickness direction. The one end edge is an end edge of the extending line 134A on the opposite side to the terminal 133. The starting point of the converging line 134B is a first bending point of the wiring 134. The converging line 134B is bent in a region facing the connection portion 45 of the first joint 4A. The above-mentioned bending of the converging line 134B is a second bending point of the wiring 134. The second bend point of the wiring 134 is spaced apart from the first bend point of the wiring 134 in the direction along the side 33B. The second bend point faces the first joint 4A in the direction perpendicular to the side 33B, but may not face the corresponding terminal 133. The wiring density of the multiple converging lines 134B is higher than the wiring density of the above-mentioned extension line 134A. The multiple converging lines 134B may have equally spaced portions that are spaced apart at equal intervals from each other. In this embodiment, each of the multiple converging lines 134B has a substantially L-shape.

[0102] In the mounting portion 3, the region where the converging line 134B is provided is defined as the second portion 32. In other words, the mounting portion 3 has the second portion 32. The second portion 32 is disposed between the outer circumferential edge 30 (side 33B) and the above-mentioned first portion 31. The side 33B, the second portion 32, and the first portion 31 are aligned in order toward the inner circumferential edge 39. In the second portion 32, the multiple wirings 134 converge. The wiring density of the converging line 134B in the second portion 32 is higher than the wiring density of the extending line 134A in the first portion 31.

[0103] 1.1.2.6 Cover insulating layer 14 in mounting portion 3 4A, in the mounting portion 3, the cover insulating layer 14 is disposed on one surface of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 covers the wiring 134 (extension wire 134A and convergence wire 134B) which is a part of the wiring layer 13. The cover insulating layer 14 exposes the terminal 133 which is the remaining part of the wiring layer 13.

[0104] 1.1.2.7 Dimensions of mounting part 3 The outer dimensions of the mounting portion 3 are not limited. As shown in Fig. 1, the distance between the sides 33A and 33C and the distance between the sides 33B and 33D are each, for example, 3 mm or more, preferably 5 mm or more, and for example, 50 mm or less, preferably 30 mm or less. The length of each of the sides 33A, 33B, 33C, and 33D is, for example, 3 mm or more, preferably 5 mm or more, and for example, 50 mm or less, preferably 30 mm or less.

[0105] The width of the mounting portion 3 is, for example, 0.3 mm or more, preferably 0.5 mm or more, and for example, 30 mm or less, preferably 20 mm or less. The width of the mounting portion 3 is the length between the outer peripheral edge 30 and the inner peripheral edge 39.

[0106] As shown in FIG. 3, the width of each of the plurality of terminals 133 is the same as the width of each of the plurality of frame terminals 131 described above.

[0107] The pitch of the multiple terminals 133 is, for example, 30 μm or more, preferably 50 μm or more, and for example, 2000 μm or less, preferably 1000 μm or less. The interval between adjacent terminals 133 is, for example, 10 μm or more, preferably 30 μm or more, preferably 1500 μm or more, and for example, 800 μm or less.

[0108] The pitch of the multiple extension lines 134A is preferably the same as the pitch of the multiple terminals 133. The pitch of the equally spaced portions of the convergent lines 134B is smaller than the pitch of the multiple extension lines 134A. The pitch of the equally spaced portions of the convergent lines 134B is, for example, 1500 μm or less, preferably 1000 μm or less, more preferably 800 μm or less, and for example, 10 μm or more. The ratio of the pitch of the equally spaced portions of the convergent lines 134B to the pitch of the multiple extension lines 134A is, for example, less than 1, preferably 0.8 or less, more preferably 0.5 or less, and for example, 0.01 or more.

[0109] The width of the wiring 134 is the same as the width of the frame wiring 132 described above.

[0110] 1.1.3 First joint 4 As shown in FIG. 1, the first joint 4 is disposed between the frame 2 and the mounting portion 3. The first joint 4 connects the frame 2 and the mounting portion 3. A plurality of first joints 4 are provided corresponding to a plurality of sides 33 of the mounting portion 3. In this embodiment, the plurality of first joints 4A, 4B, 4C, and 4D correspond to the plurality of sides 33B, 33C, 33D, and 33A of the mounting portion 3, respectively. Specifically, the first joint 4A connects the side 23A of the frame 2 to the side 33B (first side, non-opposing side) of the mounting portion 3. The first joint 4B connects the side 23B of the frame 2 to the side 33C of the mounting portion 3. The first joint 4C connects the side 23C of the frame 2 to the side 33D (second side) of the mounting portion 3. The first joint 4D connects the side 23D of the frame 2 to the side 33A of the mounting portion 3.

[0111] The first joint 4A will be described in detail below. The first joints 4B, 4C, and 4D have the same configuration as the first joint 4A, and so detailed descriptions thereof will be omitted.

[0112] 1.1.3.1 Shape of the first joint 4A As shown in Fig. 3, in this embodiment, the first joint 4A has a curved shape in a plan view. Preferably, the first joint 4A does not have a straight shape and / or a bent shape, and has only a curved shape. Specifically, the first joint 4A has an S-shape or a hook shape. If the first joint 4A has a curved shape, stress can be alleviated evenly without being locally concentrated, and therefore the accuracy of vibration correction of the mounting unit 3 can be improved.

[0113] 1.1.3.2 Connection of the first joint 4 to the mounting part 3 The first joint 4A is connected to the second portion 32 of the mounting portion 3. In other words, the first joint 4A is not connected to the first portion 31 of the mounting portion 3 where the multiple extending wires 134A having the same pitch as the multiple terminals 133 (relatively large pitch) are arranged, but is connected to the second portion 32 where the multiple converging wires 134B having a smaller pitch than the multiple terminals 133 are arranged.

[0114] The first joint 4A includes a connection portion 45 that is connected to the above-described second portion 32. As shown in Fig. 1, for example, the connection portion 45 is connected to the central region 34 of the side 33B of the mounting portion 3.

[0115] Central region 34 is a region of side 33B including central portion 35. Central portion 35 is the midpoint of side 33B and the area therearound. Central region 34 has a length that is 1 / 2 the length of side 33B. Central region 34 preferably has a length that is 1 / 3 the length of side 33B, and more preferably has a length that is 1 / 4 the length of side 33B.

[0116] Preferably, the first joint 4A connects to the center portion 35 of the side 33B.

[0117] The ratio of the length of connection portion 45 in the direction along side 33B to the length of side 33B (length of connection portion 45 / length of side 33B) is, for example, 0.3 or less, preferably 0.25 or less, more preferably 0.2 or less, and is, for example, 0.01 or more.

[0118] If the ratio of the length of connecting portion 45 in the direction along side 33B to the length of side 33B is equal to or less than the above-mentioned upper limit, widening of connecting portion 45 in the extending direction of side 33B is suppressed, and therefore the rigidity of first joint 4A can be reliably reduced.

[0119] 1.1.3.3 Connection of the first joint 4 to the frame 2 3, the first joint 4A is connected to the fourth portion 26 of the frame 2. That is, the first joint 4A is not connected to the third portion 25 of the frame 2 where the plurality of frame extension wires 132A having the same pitch as the plurality of frame terminals 131 (relatively large pitch) are arranged, but is connected to the fourth portion 26 where the plurality of converging wires 134B having a smaller pitch than the plurality of frame terminals 131 are arranged.

[0120] The first joint 4A includes a second connection portion 46 that connects to the fourth portion 26. As shown in Fig. 1, for example, the second connection portion 46 connects to the frame central region 29 of the side 23A of the frame 2.

[0121] Frame central region 29 is a region of side 23A that includes frame central portion 28. Frame central portion 28 is the midpoint of side 23A and the area nearby. Frame central region 29 has a length that is 1 / 2 the length of side 23A. Preferably, frame central region 29 has a length that is 1 / 3 the length of side 23A. More preferably, frame central region 29 has a length that is 1 / 4 the length of side 23A.

[0122] Preferably, the first joint 4A connects to the frame central portion 28 of side 23A.

[0123] The ratio of the length of the second connection portion 46 in the direction along side 23A to the length of side 23A (length of second connection portion 46 / length of side 23A) is, for example, 0.3 or less, preferably 0.25 or less, more preferably 0.2 or less, and is, for example, 0.01 or more.

[0124] If the ratio of the length of the second connection part 46 in the direction along the side 23A to the length of the side 23A is equal to or less than the above-mentioned upper limit, the second connection part 46 is prevented from expanding in the extending direction of the side 23A, and therefore the rigidity of the first joint 4A can be reliably reduced.

[0125] As shown in FIG. 4A, in this embodiment, the first joint 4A includes a plurality of slits 421, 422, and 423, a plurality of wiring body portions 431 and 432, and ground wiring body portions 433 and 434.

[0126] 1.1.3.4 Slits 421, 422, 423 Each of the multiple slits 421, 422, 423 is disposed in a middle portion of the first joint 4 in a direction intersecting the direction in which the first joint 4 extends (intersecting direction, preferably, perpendicular direction). The multiple slits 421, 422, 423 are spaced apart from each other in the intersecting direction. Each of the multiple slits 421, 422, 423 is disposed over the entire first joint 4 in the direction in which the first joint 4 extends. The multiple slits 421, 422, 423 are arranged in order in the intersecting direction. The multiple slits 421, 422, 423 separate the wiring body 431, the wiring body 432, the ground wiring body 433, and the ground wiring body 434. Each of the multiple slits 421, 422, 423 penetrates the base insulating layer 12 and the cover insulating layer 14 described later in the thickness direction.

[0127] 1.1.3.5 Wiring body parts 431, 432

[0128] The wiring body 431 and the wiring body 432 are partitioned by slits 421, 422, and 423. The wiring body 431 and the wiring body 432 are spaced apart from each other in the intersecting direction. The multiple slits 421, 422, and 423 extend along the wiring body 431 and the wiring body 432. Each of the wiring body 431 and the wiring body 432 includes four joint wires 1341, 1342, 1343, and 1344, a base insulating layer 12, and a cover insulating layer 14. In other words, the first joint 4 includes four joint wires 1341, 1342, 1343, and 1344, a base insulating layer 12, and a cover insulating layer 14.

[0129] The joint wirings 1341, 1342, 1343, and 1344 are spaced apart from each other in the crossing direction. The joint wirings 1341, 1342, 1343, and 1344 are arranged in sequence in the crossing direction. The slits 421, 422, and 423 extend along the joint wirings 1341, 1342, 1343, and 1344. In this embodiment, the joint wirings 1341, 1342, 1343, and 1344 can function as differential wirings. For example, the joint wirings 1341 and 1342 operate as a differential pair. The joint wirings 1343 and 1344 operate as a differential pair.

[0130] One base insulating layer 12 contacts the other surfaces of the joint wirings 1341, 1342, 1343, and 1344 in the thickness direction in each of the wiring body portions 431 and 432.

[0131] One cover insulating layer 14 collectively covers the joint wirings 1341, 1342, 1343, and 1344 in each of the wiring body portions 431 and 432. The cover insulating layer 14 contacts one surface and an outer surface of each of the joint wirings 1341, 1342, 1343, and 1344.

[0132] 1.1.3.6 Ground wiring body 433, 434 The ground wiring body 433 is disposed across the wiring body 431 from the slit 421. The ground wiring body 434 is disposed across the wiring body 432 from the slit 423. Each of the ground wiring bodies 433 and 434 includes a ground wiring 1345, a base insulating layer 12, and a cover insulating layer 14.

[0133] One base insulating layer 12 is in contact with the lower surface of the ground wire 1345 in the thickness direction in each of the ground wire bodies 433 and 434. The ground wire 1345 is thicker than the joint wires 1341, 1342, 1343, and 1344.

[0134] One cover insulating layer 14 covers the ground wire 1345 in each of the ground wire bodies 433, 434. The cover insulating layer 14 contacts one surface and an outer surface of the ground wire 1345 in the thickness direction.

[0135] 3, the ground wiring 1345 is electrically connected to a frame ground terminal 131G of the frame 2. Specifically, the ground wiring 1345 is electrically connected to the metal support layer 11 of the frame 2 via the converging line 134B corresponding to the ground extension line 134AG, the ground extension line 134AG, and the frame ground terminal 131G. In this way, the ground wiring 1345 is grounded to the frame ground terminal 131G.

[0136] 4A, the first joint 4A does not include, for example, a metal support layer 11. The metal support layer 11 is a layer disposed on the other side in the thickness direction of the insulating base layer 12. The material of the metal support layer 11 is, for example, the above-mentioned rigid material.

[0137] The first joint 4A includes a base insulating layer 12, a wiring layer 13, and a cover insulating layer 14. Preferably, the first joint 4A includes only the base insulating layer 12, the wiring layer 13, and the cover insulating layer 14.

[0138] 1.1.3.7 Base insulating layer 12 at first joint 4A

[0139] In the first joint 4A, the base insulating layer 12 forms the other surface of the first joint 4A in the thickness direction. The base insulating layer 12 is exposed toward the other side in the thickness direction.

[0140] The base insulating layer 12 has the above-mentioned multiple slits 421, 422, 423. The multiple slits 421, 422, 423 are arranged between the wiring body parts 431 and 432, between the wiring body part 431 and the ground wiring body part 433, and between the wiring body part 432 and the ground wiring body part 434.

[0141] 1.1.3.8 Wiring layer 13 at first joint 4A In the first joint 4A, the wiring layer 13 includes the joint wirings 1341, 1342, 1343, and 1344 described above, and the two ground wirings 1345 described above.

[0142] In the first joint 4A, the wiring layer 13 is disposed on one surface of the base insulating layer 12 in the thickness direction. The wiring layer 13 contacts one surface of the base insulating layer 12. The joint wirings 1341, 1342, 1343, 1344 are spaced apart from each other in the intersecting direction (preferably, the perpendicular direction) in the first joint 4A. As shown in FIG. 3, the joint wirings 1341, 1342, 1343, 1344 are electrically connected to the multiple wirings 134, respectively. In addition, the joint wirings 1341, 1342, 1343, 1344 are electrically connected to the multiple frame wirings 132, respectively. That is, the multiple joint wirings 1341, 1342, 1343, 1344 electrically connect the multiple frame wirings 132 in the frame 2 and the multiple wirings 134 in the mounting portion 3.

[0143] 1.1.3.9 Cover insulating layer 14 at first joint 4A As shown in Fig. 4A, in the first joint 4A, the cover insulating layer 14 forms one surface of the first joint 4A in the thickness direction. The cover insulating layer 14 is exposed toward one side in the thickness direction. The cover insulating layer 14 is disposed on one surface of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 covers a plurality of joint wirings 1341, 1342, 1343, and 1344 and a ground wiring 1345.

[0144] The cover insulating layer 14 has the above-mentioned multiple slits 421, 422, 423 together with the base insulating layer 12. Each of the multiple slits 421, 422, 423 penetrates the cover insulating layer 14 in the thickness direction. The inner surfaces partitioning each of the multiple slits 421, 422, 423 in the cover insulating layer 14 are flush with the inner surfaces partitioning each of the multiple slits 421, 422, 423 in the base insulating layer 12.

[0145] 1.1.3.10 Dimensions of the first joint 4A The ratio of the thickness of the ground wiring 1345 to the thickness of the joint wirings 1341, 1342, 1343, and 1344 is, for example, 0.5 or more, preferably 0.8 or more, more preferably 1 or more, and for example, 10 or less. The thicknesses of the joint wirings 1341, 1342, 1343, and 1344 are the same as the thickness of the frame wiring 132. The thickness of the ground wiring 1345 is, for example, 3 μm or more, preferably 6 μm or more, and for example, 100 μm or less, preferably 50 μm or less.

[0146] The width of the joint wirings 1341 , 1342 , 1343 , and 1344 and the width of the ground wiring 1345 are the same as the width of the frame wiring 132 .

[0147] The lengths of the first joints 4A, 4B, 4C, and 4D may be the same or different. When the lengths of the first joints 4A, 4B, 4C, and 4D are different from each other, the difference in length between the longest first joint 4 and the shortest first joint 4 is, for example, 3 mm or less, preferably 2 mm or less, and more preferably 1.5 mm or less. If the difference in length between the longest first joint 4 and the shortest first joint 4 is equal to or less than the above-mentioned upper limit, the accuracy of the shake correction of the mounting unit 3 can be improved.

[0148] The thickness of each of the multiple wiring bodies 431, 432 is, for example, 3 μm or more, preferably 5 μm or more, and for example, 100 μm or less, preferably 50 μm or less. The width of each of the multiple wiring bodies 431, 432 is, for example, 5 μm or more, preferably 10 μm or more, and for example, 500 μm or less, preferably 300 μm or less.

[0149] The thickness of each of the ground wire bodies 433 and 434 is, for example, 3 μm or more, preferably 5 μm or more, and for example, 100 μm or less, preferably 50 μm or less. The width of each of the ground wire bodies 433 and 434 is, for example, 5 μm or more, preferably 10 μm or more, and for example, 500 μm or less, preferably 300 μm or less.

[0150] The width of each of the slits 421, 422, 423 is, for example, 5 μm or more, or preferably 10 μm or more, and for example, 500 μm or less, or preferably 300 μm or less.

[0151] 1.1.4 Second Joint 5 1, the second joint 5 is disposed between the frame 2 and the mounting portion 3. The second joint connects the frame 2 and the mounting portion 3. A plurality of (two) second joints 5 are provided corresponding to the plurality of sides 33 of the mounting portion 3. In this embodiment, the two second joints 5B, 5D correspond to the two sides 33B, 33D, respectively.

[0152] Specifically, the second joint 5B connects the side 23B of the frame 2 and the side 33B (first side) of the mounting unit 3. The second joint 5B is connected to the side 33B, which is the first side of the mounting unit 3. The side 33B is the side opposite to the side 23B.

[0153] Further, the second joint 5D connects the side 23D of the frame 2 and the side 33D of the mounting unit 3. In other words, the second joint 5D connects to the side 33D, which is the second side of the mounting unit 3. The side 33D is the opposing side to the side 23D. In this embodiment, the second joint 5D is disposed on the opposite side of the mounting unit 3 from the second joint 5B.

[0154] In the direction along the periphery of the mounting unit 3, two first joints 4B, 4C (or first joints 4D, 4A) are disposed between two second joints 5B, 5D. In other words, in this embodiment, one second joint 5B is located between two first joints 4A, 4B in the direction along the periphery of the mounting unit 3. One second joint 5D is located between two first joints 4C, 4D in the direction along the periphery of the mounting unit 3. In this embodiment, the first joint 4A, the second joint 5B, the first joint 4B, the first joint 4C, the second joint 5D, and the first joint 4D are disposed in this order counterclockwise in the direction along the periphery of the mounting unit 3.

[0155] The second joint 5B will be described in detail below. The second joint 5D has a similar configuration to the second joint 5B, and so a detailed description thereof will be omitted.

[0156] 1.1.4.1 Shape of the second joint 5B As shown in FIG. 1, the second joint 5B has a linear shape in a plan view. The second joint 5 may be inclined with respect to each of the sides 23B and 33B, or may be perpendicular to the sides. When the second joint 5 is inclined with respect to each of the sides 23B and 33B, the acute angle α1 formed between the second joint 5 and the side 23B is, for example, 5 degrees or more, preferably 15 degrees or more, and, for example, less than 90 degrees. The acute angle α2 formed between the second joint 5 and the side 33B is, for example, 5 degrees or more, preferably 15 degrees or more, and, for example, less than 90 degrees.

[0157] Further, the second joint 5B crosses the line segment connecting the connection portion 45 of the first joint 4A and the second connection portion 46 of the first joint 4B.

[0158] The second joint 5B does not overlap in the thickness direction with the first joint 4A connected to the side 33B. The second joint 5B does not overlap in the thickness direction with the first joint 4B connected to the side 23B. In other words, the second joint 5B is spaced apart from each of the first joint 4A and the first joint 4B in a plan view.

[0159] 1.1.4.2 Connection of the second joint 5 to the mounting part 3 In this embodiment, the second joint 5B is connected to a central region 34 of the side 33B. Specifically, the second joint 5B is connected to a first position 36. The first position 36 is shifted from a central portion 35 toward the side 33C in the central region 34. The first position 36 is included in the central region 34.

[0160] 1.1.4.3 Connection of the second joint 5 to the frame 2 In this embodiment, the second joint 5B is connected to the frame central region 29 on the side 23B. Specifically, the second joint 5B is connected to a fourth position 282. The fourth position 282 is shifted from the frame central portion 28 toward the side 23A in the frame central region 29. The fourth position 282 is included in the frame central region 29.

[0161] 1.1.4.3 Layer structure of second joint 5B 4A, the second joint 5B includes the insulating base layer 12 and the insulating cover layer 14. In this embodiment, the second joint 5 includes only the insulating base layer 12 and the insulating cover layer 14.

[0162] 1.1.4.4 Base insulating layer 12 at second joint 5B In the second joint 5B, the base insulating layer 12 forms the other surface of the second joint 5B in the thickness direction. The base insulating layer 12 is exposed toward the other side in the thickness direction. The material and thickness of the base insulating layer 12 in the second joint 5B are the same as the material and thickness of the base insulating layer 12 in the frame 2, respectively.

[0163] 1.1.4.5 Cover insulating layer 14 at second joint 5B In the second joint 5B, the cover insulating layer 14 forms one side of the second joint 5B in the thickness direction. The cover insulating layer 14 is exposed to one side in the thickness direction. In the second joint 5B, the cover insulating layer 14 is disposed on one side of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 contacts one side of the base insulating layer 12. Both side surfaces of the cover insulating layer 14 are, for example, flush with both side surfaces of the base insulating layer 12. The material and thickness of the cover insulating layer 14 in the second joint 5B are the same as the material and thickness of the cover insulating layer 14 in the frame 2.

[0164] In the second joint 5B, the cover insulating layer 14, together with the base insulating layer 12, forms a joint insulator portion 124. The joint insulator portion 124 has a thickness of, for example, 5 μm or more, preferably 10 μm or more, and for example, 100 μm or less, preferably 50 μm or less.

[0165] 1.1.4.6 Dimensions of the second joint 5B 1, the length of the second joint 5B is, for example, 0.5 mm or more, preferably 1 mm or more, and for example, 20 mm or less, preferably 15 mm or less. The length of the second joint 5B is the length in the direction in which the second joint 5B extends.

[0166] The width of the second joint 5B is, for example, 100 μm or more, preferably 500 μm or more, and for example, 8000 μm or less, preferably 5000 μm or less. The width of the second joint 5B is the length in a direction perpendicular to the direction in which the second joint 5B extends. In this embodiment, the width of the second joint 5B is the same in the direction in which the second joint 5B extends.

[0167] The ratio of the width of the second joint 5B to the width of each of the multiple wiring body portions 431, 432 is, for example, 1 or more, preferably 3 or more, and is, for example, 100 or less, preferably 50 or less.

[0168] 1.1.5 How to prepare the middle board 1 A method for preparing the intermediate substrate 1 will now be described with reference to Figures 5A to 5C.

[0169] As shown in FIG. 5A, in this method, first, the insulating base layer 12 is formed on one surface of a metal support plate 110 in the thickness direction.

[0170] The metal support plate 110 is a metal plate for forming the metal support layer 11. The metal support plate 110 is made of the same material as the metal support layer 11 and has the same thickness as the metal support layer 11.

[0171] For example, a resin is applied to one surface of the metal support plate 110, and the base insulating layer 12 having a pattern corresponding to the frame 2, the mounting portion 3, the first joint 4, and the second joint 5 is formed by photolithography. In this process, the base insulating layer 12 of the frame 2, the base insulating layer 12 of the mounting portion 3, the base insulating layer 12 of the first joint 4, and the base insulating layer 12 of the second joint 5 are formed simultaneously.

[0172] As shown in FIG. 5B, the wiring layer 13 is then formed on one surface of the base insulating layer 12 in the thickness direction. For example, the wiring layer 13 is formed by a conductor pattern forming method. Examples of the conductor pattern forming method include an additive method and a subtractive method, and preferably, an additive method. To form the wiring layer 13 by the additive method, first, the wiring layer 13 of the frame 2, a part of the wiring layer 13 of the mounting portion 3, and the wiring layer 13 of the first joint 4 are simultaneously formed. The part of the wiring layer 13 of the mounting portion 3 is the joint wirings 1341, 1342, 1343, and 1344, and the other side part of the ground wiring 1345 in the thickness direction (see imaginary line). Then, the one side part of the ground wiring 1345 in the thickness direction (see imaginary line) is laminated on the other side part of the ground wiring 1345.

[0173] As shown in FIG. 5C, the insulating cover layer 14 is formed on one surface of the insulating base layer 12 in the thickness direction.

[0174] For example, resin is applied to one side of the metal support plate 110, the base insulating layer 12, and the wiring layer 13, and a cover insulating layer 14 having a pattern corresponding to the frame 2, the mounting portion 3, the first joint 4, and the second joint 5 is formed by photolithography. In this process, the cover insulating layer 14 of the frame 2, the cover insulating layer 14 of the mounting portion 3, the cover insulating layer 14 of the first joint 4, and the cover insulating layer 14 of the second joint 5 are formed simultaneously.

[0175] Thereafter, as shown in FIG. 4A, the metal support plate 110 is contour-processed to form the metal support layer 11. Examples of contour processing include etching, punching, and laser. From the viewpoint of productivity, etching is preferably used as the contour processing. By contour processing of the metal support plate 110, the metal support plate 110 between the frame 2 and the mounting portion 3 is removed. As a result, each of the first joint 4 and the second joint 5 does not include the metal support layer 11.

[0176] In this way, intermediate substrate 1 is prepared.

[0177] 1.2 Second process In the second step, intermediate substrate 1 is inspected. The second step includes a continuity inspection of wiring layer 13, and an external shape inspection of metal support layer 11, base insulating layer 12, and cover insulating layer .

[0178] When inspecting intermediate substrate 1 in the second step, frame 2 is held by an operator or a conveying device. Then, intermediate substrate 1 is conveyed to an inspection device. In the inspection device, frame 2 is placed on an inspection table (not shown). Frame 2 comes into contact with the inspection table. After inspection of intermediate substrate 1, intermediate substrate 1 is removed from the inspection device. Then, while frame 2 is held by an operator or a conveying device, intermediate substrate 1 is subjected to the next fourth step.

[0179] 1.3 4th step As shown in FIG. 4B, the fourth step is performed after the second step. In other words, the fourth step is performed after the first step and before the third step. In the fourth step, the frame 2 comes into contact with the device (mounting device). In the fourth step, the imaging element 105 is mounted on the mounting portion 3. The electrodes 1051 of the imaging element 105 and the multiple terminals 133 on the mounting portion 3 are electrically connected. Note that the imaging element 105 may be mounted on the mounting portion 3 via a mounting board (not shown).

[0180] At the same time, external substrate 106 is mounted on frame 2. Electrodes 1061 of external substrate 106 and a plurality of frame terminals 131 on frame 2 are electrically connected.

[0181] By the fourth step, the intermediate substrate 1 on which the imaging element 105 is mounted is obtained. Specifically, the intermediate substrate 1 in which the imaging element 105 is mounted on the mounting portion 3 and the external substrate 106 is mounted on the frame 2 is obtained.

[0182] 1.4 Third step As shown in Fig. 2 and Fig. 4C, in the third step, the second joint 5 is removed. Methods for removing the second joint 5 include, for example, cutting using a sheet cutter, etching, punching, and laser. From the viewpoint of productivity, preferable methods for removing the second joint 5 include cutting, punching, and laser. As a result, the mounting portion 3 is supported on the frame 2 only via the first joint 4.

[0183] In the third step, the second joint 5 is removed from the intermediate substrate 1 to produce the product substrate 100. That is, the product substrate 100 does not include the second joint 5, but includes the frame 2, the mounting portion 3, and the first joint 4. An imaging element 105 and an external substrate 106 are mounted on the product substrate 100.

[0184] 2. Effects of one embodiment According to this manufacturing method, as shown in Fig. 1 and Fig. 4B, in the second step, the intermediate substrate 1 still includes the second joint 5. Then, even if the frame 2 is moved, the mounting portion 3 is supported on the frame 2 by the first joint 4 and the second joint 5. Therefore, in the second step, the posture of the mounting portion 3 can be stabilized. As a result, the intermediate substrate 1 is excellent in handleability in the second step.

[0185] 2 and 4C, in the third step, the second joint 5 is removed. Therefore, the mounting portion 3 is supported on the frame 2 only by the first joint 4. Therefore, the vibration of the mounting portion 3 on the product substrate 100 can be reliably corrected.

[0186] As shown in Fig. 1, the first joint 4A connects the side 33B to the side 23A that is not opposed to the side 33B, and the second joint 5B connects the side 33B to the side 23B that is opposed to the side 33B. Therefore, the first joint 4A can be made longer than the second joint 5B. As a result, the low resilience of the long first joint 4A can be improved. On the other hand, the rigidity of the short second joint 5B can be improved.

[0187] In the intermediate substrate 1 in the first step, the two first joints 4A and 4C are connected to the first side 33B and the second side 33D, respectively. In the intermediate substrate 1 in the first step, the two second joints 5B and 5D are connected to the first side 33B and the second side 33D, respectively.

[0188] Therefore, in the second step, the posture of the mounting portion 3 in the direction in which the side 33B and the side 33D face each other can be made even more stable.

[0189] Each of the frame 2 and the mounting portion 3 includes a metal support layer 11, which can improve rigidity.

[0190] Since the second joint 5 includes the metal supporting layer 11, the rigidity can be improved, and therefore the handling of the mounting portion 3 in the second step is excellent.

[0191] In addition, since the second joint 5B does not overlap the first joints 4A and 4B, the configuration of the intermediate substrate 1 in the first step is simple, and therefore the second joint 5 can be easily removed in the third step.

[0192] As shown in Fig. 4A, the first joint 4A has slits 421, 422, and 423. This makes it possible to weaken the first joint 4A and improve the low resilience of the first joint 4A. As a result, as shown in Fig. 4C, in the product substrate 100 after the third step, the vibration of the mounting portion 3 can be corrected more reliably.

[0193] 4B, this method makes it possible to stabilize the posture of the mounting portion 3 in the fourth step prior to the third step of removing the second joint 5. Therefore, the imaging element 105 can be reliably mounted on the mounting portion 3.

[0194] 3. Variations In the following modifications, the same components and steps as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. In addition, each modification can achieve the same effects as those in the above-described embodiment, unless otherwise specified. Furthermore, the embodiment and its modifications can be appropriately combined.

[0195] 3.1 First modified example 6, the second joint 5 does not include a base insulating layer 12 and a cover insulating layer 14, but includes a metal support layer 11. In the first modification, the second joint 5 includes only the metal support layer 11. The metal support layer 11 in the second joint 5 has the same configuration as the metal support layer 11 in the frame 2.

[0196] In the first modified example, the second joint 5 includes the metal support layer 11, and therefore the second joint 5 has superior rigidity compared to the embodiment in which the second joint 5 is formed from the joint insulator portion .

[0197] 3.2 Second variant 7, the second joint 5 includes a base insulating layer 12, a wiring layer 13, and a cover insulating layer 14. That is, the second joint 5 of the second modified example further includes the wiring layer 13 in addition to the base insulating layer 12 and the cover insulating layer 14 in the second joint 5 of the embodiment shown in FIG.

[0198] In the second modified example, the wiring layer 13 in the second joint 5 has the same configuration as the wiring layer 13 in the embodiment. However, in the second modified example, the wiring layer 13 in the second joint 5 does not have, for example, a function of transporting electricity. In the second modified example, the wiring layer 13 is a core material for the base insulating layer 12 and the cover insulating layer 14 (joint insulator portion 124) and reinforces the joint insulator portion 124.

[0199] The width of the wiring layer 13 of the second joint 5 in the second modified example may be the same as or wider than the width of the joint wirings 1341, 1342, 1343, and 1344 of the first joint 4. When the width of the wiring layer 13 of the second joint 5 is wider than the width of the joint wirings 1341, 1342, 1343, and 1344, the ratio of the width of the wiring layer 13 of the second joint 5 to the width of the joint wirings 1341, 1342, 1343, and 1344 is, for example, 1.5 or more, preferably 2 or more, more preferably 3 or more, and is, for example, 50 or less.

[0200] 3.2.1 Effects of the second modified example The second joint 5 includes a wiring layer 13 in addition to the base insulating layer 12. Therefore, in the second joint 5, the wiring layer 13 can reinforce the joint insulator portion 124 including the base insulating layer 12.

[0201] 3.3 Third variant As shown in FIG. 8, the second joint 5 includes a metal supporting layer 11 and a base insulating layer 12.

[0202] 3.4 Fourth variant 9, intermediate substrate 1 includes four second joints 5A, 5B, 5C, and 5D. Second joint 5A connects side 23A of frame 2 to side 33A of mounting portion 3. Second joint 5C connects side 23C of frame 2 to side 33C of mounting portion 3.

[0203] In the fourth modified example, the first joints 4 and the second joints 5 are arranged alternately in a direction along the periphery of the mounting unit 3. Specifically, the second joint 5A, the first joint 4A, the second joint 5B, the first joint 4B, the second joint 5C, the first joint 4C, the second joint 5D, and the first joint 4D are arranged in this order counterclockwise in the direction along the periphery of the mounting unit 3.

[0204] In the fourth modified example, the number of second joints 5 is greater than that in the first embodiment, and therefore the intermediate substrate 1 is easier to handle in the second step.

[0205] In contrast, in the embodiment, the number of second joints 5 is smaller than that in the fourth modified example, and therefore the second joints 5 can be easily removed in the third step.

[0206] 3.5 Fifth Variation 10, the second joint 5 partially overlaps with the first joint 4 in the thickness direction. In the fifth modified example, the second joint 5 intersects with the first joint 4 in the thickness direction.

[0207] The second joint 5A has an intersection 4A0. At the intersection 4A0, the second joint 5A and the first joint 4A intersect. The second joint 5B has an intersection 4B0. At the intersection 4B0, the second joint 5B and the first joint 4B intersect. The second joint 5C has an intersection 4C0. At the intersection 4C0, the second joint 5C and the first joint 4C intersect. The second joint 5D has an intersection 4D0. At the intersection 4D0, the second joint 5D and the first joint 4D intersect.

[0208] In a fifth variant, the second joint 5A is, for example, perpendicular to the side 23A and / or the side 33A.

[0209] 3.6 Sixth Variation As shown in FIG. 11, the intermediate substrate 1 further includes a third joint 8 .

[0210] 3.6.1 First step of the sixth modification In the first step, there is prepared an intermediate substrate 1 further including a third joint 8. The intermediate substrate 1 of the sixth modified example has a configuration in which the intermediate substrate 1 of the fourth modified example shown in FIG.

[0211] The intermediate substrate 1 includes a plurality of third joints 8A, 8B, 8C, and 8D. The third joint 8A will be described in detail. Descriptions of the third joints 8B, 8C, and 8D will be omitted.

[0212] The third joint 8A connects the frame 2 and the first joint 4. The third joint 8A connects to a corner 24A in the frame 2. The corner 24A is formed at the inner periphery 20 of the frame 2 by adjacent sides 23A and 23B.

[0213] The third joint 8A is connected to a middle part of the first joint 4A in the extension direction of the first joint 4A. The third joint 8A extends from a corner 24A of the frame 2 to a middle part of the first joint 4A. However, the third joint 8 does not reach the mounting portion 3. The third joint 8A is inclined about a side 23A.

[0214] 3.6.2 Third step of the sixth modification In the third step of the sixth modified example, the third joint 8 is removed together with the second joint 5. Therefore, the product substrate 100 does not include the second joint 5 and the third joint 8 (see FIG. 11).

[0215] 3.6.3 Effects of the sixth modified example As shown in FIG. 11, in this manufacturing method, the first step involves preparing an intermediate substrate 1 having a third joint 8 that supports the first joint 4, so that the rigidity of the first joint 4 can be increased in the second step.

[0216] In this manufacturing method, since the third joint 8 is removed in the third step, the mounting portion 3 is supported by the first joint 4. Therefore, the vibration of the mounting portion 3 can be reliably corrected.

[0217] 3.7 Seventh Variation 12, in the seventh modified example, two second joints 5A, 5A1 are provided corresponding to one first joint 4A. The intermediate substrate 1 of the seventh modified example includes eight second joints 5A, 5A1, 5B, 5B1, 5C, 5C1, 5D, and 5D1.

[0218] The intermediate substrate 1 of the seventh modified example further includes second joints 5A1, 5B1, 5C1, and 5D1 in addition to the second joints 5A, 5B, 5C, and 5D in the intermediate substrate 1 of the fifth modified example shown in FIG.

[0219] The second joint 5A1 connects the side 23B of the frame 2 and the side 33B of the mounting portion 3. The second joint 5A1 intersects with the first joint 4A in the thickness direction.

[0220] The second joint 5A1 has an intersection 4A1 in addition to the intersection 4A0. At the intersection 4A1, the second joint 5A1 and the first joint 4A intersect. The intersection 4A1 and the intersection 4A0 are spaced apart in the extension direction of the first joint 4A. The second joint 5B1 has an intersection 4B1 in addition to the intersection 4B0. At the intersection 4B1, the second joint 5B1 and the first joint 4B intersect. The intersection 4B1 and the intersection 4B0 are spaced apart in the extension direction of the first joint 4B. The second joint 5C1 has an intersection 4C1 in addition to the intersection 4C0. At the intersection 4C1, the second joint 5C1 and the first joint 4C intersect. The intersection 4C1 and the intersection 4C0 are spaced apart in the extension direction of the first joint 4C. The second joint 5D1 has an intersection portion 4D1 in addition to the intersection portion 4D0. The second joint 5D1 and the first joint 4D intersect at the intersection portion 4D1. The intersection portion 4D1 and the intersection portion 4D0 are spaced apart from each other in the extension direction of the first joint 4D.

[0221] 3.8 Eighth Variation As shown in Fig. 13, the intermediate substrate 1 of the eighth modified example includes four second joints 5A, 5B1, 5C, and 5D1. Specifically, the intermediate substrate 1 of the eighth modified example does not include four second joints 5A1, 5B, 5C1, and 5D (see Fig. 12) among the eight second joints 5A, 5A1, 5B, 5B1, 5C, 5C1, 5D, and 5D1 in the intermediate substrate 1 shown in Fig. 12.

[0222] 3.9 Ninth Variation In the intermediate substrate 1, as shown in FIG. 14, each of the first joints 4A, 4B, 4C, and 4D includes sub-joints 4511, 4512, 4521, 4522, 4531, and 4532.

[0223] The sub-joints 4511, 4512 divide the slit 421 in the direction that the slit 421 extends. The sub-joints 4511, 4512 are spaced apart in the direction that the slit 421 extends.

[0224] The sub-joints 4521 and 4522 divide the slit 422 in the direction in which the slit 422 extends. The sub-joints 4521 and 4522 are spaced apart in the direction in which the slit 422 extends. As shown in Fig. 15, each of the sub-joints 4521 and 4522 connects the wiring body portion 431 to the wiring body portion 432. Furthermore, each of the sub-joints 4521 and 4522 connects the joint wiring 1344 of the wiring body portion 431 to the joint wiring 1341 of the wiring body portion 432.

[0225] 14, the sub-joints 4511, 4521, and 4531 are lined up in a direction intersecting (intersecting direction, preferably a perpendicular direction) the extension direction of the first joint 4. The sub-joints 4512, 4522, and 4532 are lined up in a direction intersecting (intersecting direction, preferably a perpendicular direction) the extension direction of the first joint 4.

[0226] The sub-joints 4531, 4532 divide the slit 423 in the direction that the slit 421 extends. The sub-joints 4531, 4532 are spaced apart in the direction that the slit 423 extends.

[0227] 15, the sub-joints 4511, 4512, 4521, 4522, 4531, and 4532 include the base insulating layer 12. In this modification, the sub-joints 4511, 4512, 4521, 4522, 4531, and 4532 include only the base insulating layer 12.

[0228] According to the fourth modification, the sub-joints 4521 and 4522 can prevent the rigidity of each of the first joints 4A, 4B, 4C, and 4D from being excessively reduced due to the slits 422. Therefore, deformation of each of the first joints 4A, 4B, 4C, and 4D can be suppressed. Therefore, in the second step, the posture of the mounting portion 3 can be stabilized. As a result, the intermediate substrate 1 can be easily handled in the second step.

[0229] 3.10 10th Variation 16, the sub-joints 4511, 4512, 4521, 4522, 4531, and 4532 include the base insulating layer 12 and the cover insulating layer 14. In this modification, the sub-joints 4511, 4512, 4521, 4522, 4531, and 4532 include only the base insulating layer 12 and the cover insulating layer 14.

[0230] Although not shown, the sub-joints 4511 , 4512 , 4521 , 4522 , 4531 , and 4532 may include only the cover insulating layer 14 .

[0231] 3.11 11th Variation As shown in FIG. 17, the frame 2, the mounting portion 3, and the first joint 4 of the intermediate substrate 1 do not include the metal supporting layer 11.

[0232] 3.12 Modifications 12 and 13 As shown in Fig. 18 and Fig. 19, each of the twelfth and thirteenth modifications has a configuration that combines the seventh and ninth modifications. Two second joints 5A and 5A1 are provided corresponding to one first joint 4A. Each of the first joints 4A, 4B, 4C, and 4D includes sub-joints 4511, 4512, 4521, 4522, 4531, and 4532.

[0233] 18, in the twelfth modified example, sub-joints 4511, 4521, and 4531 are disposed at an intersection 4A1. Sub-joints 4512, 4522, and 4532 are disposed at an intersection 4A0.

[0234] As shown in FIG. 19, in the thirteenth modified example, sub-joints 4511, 4521, and 4531 are disposed between an intersection 4A1 and an intersection 4A0.

[0235] 3.13 Fourteenth Variation In a fourteenth modified example, as shown in Figs. 20B and 20C, the fourth step is carried out after the third step.

[0236] In the manufacturing method of the fourteenth modification, a first step (see FIG. 20A), a second step, a third step (see FIG. 20B), and a fourth step (see FIG. 20C) are carried out in this order.

[0237] As shown in Fig. 20B, in the third step, the second joint 5 in the intermediate substrate 1 (see Fig. 20A) is removed. This produces the product substrate 100. The imaging element 105 (see Fig. 20C) and the external substrate 106 (see Fig. 20C) are not yet mounted on this product substrate 100.

[0238] 20C, in a fourth step, the imaging element 105 and the external board 106 are mounted on the product board 100. Specifically, the imaging element 105 is mounted on the mounting portion 3, and the external board 106 is mounted on the frame 2.

[0239] Comparing the first embodiment and the fourteenth modified example, the first embodiment is preferable. In the first embodiment, as shown in FIG. 4B, when the imaging element 105 is mounted on the mounting portion 3 in the fourth step, the mounting portion 3 is supported on the frame 2 via the second joint 5 in addition to the first joint 4, so that the posture of the mounting portion 3 can be further stabilized. Therefore, the imaging element 105 can be reliably mounted on the mounting portion 3 in the fourth step.

[0240] 3.14 Other Variations In one embodiment, the second joint 5B includes the base insulating layer 12 and the cover insulating layer 14, but may include only the base insulating layer 12 or only the cover insulating layer 14, although not shown.

[0241] In one embodiment, the first joint 4A does not include a metal support layer 11, but in variants the first joint 4 may include a metal support layer 11.

[0242] In one embodiment, the mounting portion 3 has a rectangular frame shape, but may be rectangular without an inner peripheral edge 39 (see FIG. 1).

[0243] The mounting portion 3 may have a curved shape or may even be circular, in which case the outer periphery 30 of the mounting portion 3 has no sides.

[0244] The frame 2 may have a curved shape or even a circular ring shape, in which case the inner peripheral edge 20 of the frame 2 has no sides.

[0245] The second joint 5 may have a curved and / or bent shape. Curved shapes include a generally wave shape, an S-shape, and a hook shape.

[0246] The fourth step may also be carried out after the first step and before the second step.

[0247] In this modified example, the imaging element 105 is mounted on the mounting portion 3 in the fourth step, and then the intermediate substrate 1 can be inspected together with the imaging element 105 in the second step.

[0248] In the above-described modified example, if the intermediate substrate 1 on which the imaging element 105 is mounted is defective, the imaging element 105 and the intermediate substrate 1 are discarded.

[0249] In contrast, in one embodiment, the fourth step is performed before the second step. Specifically, in the second step, the intermediate substrate 1 is inspected, and if the intermediate substrate 1 is found to be defective, the intermediate substrate 1 is discarded. In the fourth step, the imaging element 105 can be mounted separately on another good intermediate substrate 1. In other words, the above-mentioned discarding of the imaging element 105 can be prevented. From the above, of the embodiment and the above-mentioned modified examples, the embodiment is preferable.

[0250] The number of second joints 5 may be one or three. [Explanation of symbols]

[0251] 1 Intermediate board (an example of a printed circuit board) 2 Frames 3 Mounting section 4, 4A, 4B, 4C, 4D 1st joint 5,5A,5A1,5B,5B1,5C,5C1,5D,5D1 Second joint 8,8A,8B,8C,8D 3rd joint 11 Metal support layer 12 Base insulation layer (insulation layer) 13 Wiring layer 14 Cover insulation layer (insulation layer) 15 3rd Joint Sides 23A, 23B, 23C, and 23D 30 Outer rim Sides 33A, 33B, 33C, 33D 100 Product board (an example of a printed circuit board) 105 Image sensor 134 Wiring 421,422,423 Slit 4511, 4512, 4521, 4522, 4531, 4532 Sub-joints 1341, 1342, 1343, 1344 Joint wiring

Claims

1. A wiring circuit board comprising a frame, a mounting portion surrounded by the frame and spaced apart from the frame, and a first joint and a second joint connecting the frame and the mounting portion, wherein each of the frame, the mounting portion and the first joint comprises an insulating layer and a wiring layer disposed on one side of the insulating layer in the thickness direction, a first step of preparing a wiring circuit board, A second step involves inspecting the aforementioned wiring circuit board, A third step of removing the second joint, A method for manufacturing a wiring circuit board that sequentially incorporates the following elements.

2. The mounting portion has a substantially rectangular shape, and the outer edge of the mounting portion has sides, The frame has a substantially rectangular frame shape and has an opposing side that faces the side, and a non-opposing side that is adjacent to the opposing side and does not face the side. The first joint connects the side and the non-opposite side, The method for manufacturing a wiring circuit board according to claim 1, wherein the second joint connects the side and the opposing side.

3. The aforementioned edge includes a first edge and a second edge along the first edge, Each of the first joint and the second joint is provided in at least two on the wiring circuit board in the first step, Each of the two first joints is connected to the first side and the second side, The method for manufacturing a wiring circuit board according to claim 2, wherein each of the two second joints is connected to the first side and the second side, respectively.

4. In the first step, a wiring circuit board is prepared which further includes a third joint connecting the frame and the first joint. The method for manufacturing a wiring circuit board according to claim 1 or claim 2, wherein the third step further removes the third joint.

5. The method for manufacturing a wiring circuit board according to claim 1 or claim 2, wherein the second joint includes the insulating layer.

6. The method for manufacturing a wiring circuit board according to claim 5, wherein the insulating layer in the second joint includes a base insulating layer and / or a cover insulating layer.

7. The method for manufacturing a wiring circuit board according to claim 6, wherein the second joint further comprises the wiring layer.

8. The method for manufacturing a wiring circuit board according to claim 1 or 2, wherein each of the frame and the mounting portion further includes a metal support layer disposed on the other side of the insulating layer in the thickness direction.

9. The method for manufacturing a wiring circuit board according to claim 8, wherein the second joint includes the metal support layer.

10. The wiring layer in the first joint has a plurality of joint wirings that are spaced apart from each other. The method for manufacturing a wiring circuit board according to claim 1 or claim 2, wherein the insulating layer in the first joint has slits arranged between the plurality of joint wirings.

11. The slit extends along the plurality of joint wirings, The method for manufacturing a wiring circuit board according to claim 10, wherein the first joint is a sub-joint that divides the slit in the direction in which the slit extends, and has a sub-joint that connects the plurality of joint wirings.

12. The method for manufacturing a wiring circuit board according to claim 1 or claim 2, wherein the second joint does not overlap with the first joint in the thickness direction.

13. The method for manufacturing a wiring circuit board according to claim 1 or claim 2, wherein the second joint intersects with the first joint.

14. A method for manufacturing a wiring circuit board according to claim 1 or 2, further comprising a fourth step of mounting an image sensor on the mounting portion after the first step and before the third step.

15. The method for manufacturing a wiring circuit board according to claim 14, wherein the fourth step is performed after the second step.

16. It comprises a frame, a mounting section surrounded by the frame and spaced apart from the frame, and a first joint and a second joint connecting the frame and the mounting section. The mounting portion has a substantially rectangular shape, and the outer edge of the mounting portion has sides, The frame has a substantially rectangular frame shape and has an opposing side that faces the side, and a non-opposing side that is adjacent to the opposing side and does not face the side. The first joint connects the side and the non-opposite side, The second joint is a wiring circuit board that connects the side and the opposing side.

17. Each of the mounting portion and the first joint comprises an insulating layer and a wiring layer disposed on one side of the insulating layer in the thickness direction. The wiring circuit board according to claim 16, wherein the second joint includes the insulating layer.

18. The wiring circuit board according to claim 17, wherein the second joint further comprises the wiring layer.

19. The wiring circuit board according to claim 17 or 18, wherein each of the frame and the mounting portion further comprises a metal support layer disposed on the other side of the insulating layer in the thickness direction.

20. The wiring circuit board according to claim 17 or claim 18, wherein the insulating layer in the second joint includes a base insulating layer and / or a cover insulating layer.

21. The wiring layer in the first joint has a plurality of joint wirings that are spaced apart from each other. The wiring circuit board according to claim 17 or claim 18, wherein the insulating layer in the first joint has slits arranged between the plurality of joint wirings.

22. The slit extends along the plurality of joint wirings, The wiring circuit board according to claim 21, wherein the first joint is a sub-joint that divides the slit in the direction in which the slit extends, and has a sub-joint that connects the plurality of joint wirings.

23. The wiring circuit board according to claim 16 or claim 17, further comprising a third joint connecting the frame and the first joint.

Images