Manufacturing method of on-vehicle wiring board, and on-vehicle wiring board

Abstract

To easily realize a current path corresponding to a vehicle type while attaining improvement of heat radiation property by utilizing a common substrate on which a conductor part can be mounted.SOLUTION: A manufacturing method of an on-vehicle wiring board uses a substrate part main body 10. The manufacturing method of the on-vehicle wiring board includes a selection step. In the selection step, at least any one of whether to join a conductor part 50 to a plurality of land parts 23, the number of junctions of the conductor part 50 to the plurality of land parts 23, and a destination to join the lands 23 via the conductor parts 50 in a plurality of second cable runs insulated from a cable run 25 is selected in accordance with a type of a vehicle on which the on-vehicle wiring board (e.g., an on-vehicle wiring board 92) is mounted. The manufacturing method of the on-vehicle wiring board configures a current path using the cable run 25 by applying a selection result in the selection step to the substrate part main body 10.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a method for manufacturing an in-vehicle wiring board, and an in-vehicle wiring board. [Background technology]

[0002] Patent Document 1 discloses a structure in which a part of a current path is configured by a connection member mounted on a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-28930 A Summary of the Invention [Problem to be solved by the invention]

[0004] The current path may differ depending on the vehicle model and grade. If a separate board is prepared for each current path, there is a concern that this will lead to an increase in the number of board types. In addition, it is desirable for the current path to have improved heat dissipation properties.

[0005] The present disclosure aims to provide a technology that utilizes a common substrate on which a conductor portion can be mounted, thereby improving heat dissipation and easily realizing a current path appropriate for the type of vehicle. [Means for solving the problem]

[0006] The method for manufacturing an in-vehicle wiring board according to the present disclosure includes: A method for manufacturing an in-vehicle wiring board using a substrate body, comprising: The substrate body includes: A conductor layer having a wiring pattern; an insulating layer having an insulating film covering a part of the wiring pattern; Equipped with A portion of the wiring pattern is configured as a land portion that is not covered with the insulating film, the wiring pattern has a power path on which a plurality of the land portions are formed, The land portion is capable of joining a conductor portion having heat dissipation properties, a selection step of selecting at least one of the following in accordance with the type of vehicle on which the automotive wiring board is mounted: whether or not the conductor portion is to be joined to the plurality of land portions; the number of the conductor portions to be joined to the plurality of land portions; and a destination of the plurality of second power paths insulated from the power path to which the land portion is to be joined via the conductor portion; A current path using the power path is configured by applying the selection result from the selection process to the substrate main body.

[0007] The in-vehicle wiring board according to the present disclosure includes: A substrate body, A conductor portion having heat dissipation properties, The substrate body includes: A conductor layer having a wiring pattern; an insulating layer having an insulating film covering a part of the wiring pattern; Equipped with A portion of the wiring pattern is configured as a land portion that is not covered with the insulating film, the wiring pattern has a power path on which a plurality of the land portions are formed, The conductor portion satisfies at least one of the following conditions: it is joined to a plurality of the land portions; and it is joined to the land portion and at least one of a plurality of second power paths insulated from the power path. Effect of the Invention

[0008] The technology disclosed herein utilizes a common substrate on which a conductor portion can be mounted, thereby improving heat dissipation and easily realizing a current path appropriate for the type of vehicle. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view of a portion of a substrate body according to a first embodiment. [Diagram 2]FIG. 2 is a plan view of a portion of the in-vehicle wiring board when the conductor portion is not connected. [Diagram 3] FIG. 3 is a plan view of a portion of an in-vehicle wiring board when a conductor portion is joined to one row of lands. [Figure 4] FIG. 4 is a plan view of a portion of an in-vehicle wiring board when conductor portions are joined to two rows of lands. [Diagram 5] FIG. 5 is a cross-sectional view taken along line AA in FIG. [Figure 6] FIG. 6 is a plan view of a portion of the substrate body of the second embodiment. [Figure 7] FIG. 7 is a plan view of a portion of the in-vehicle wiring board according to the second embodiment. [Figure 8] FIG. 8 is a plan view of a portion of the substrate body of the third embodiment. [Figure 9] FIG. 9 is a plan view of a portion of the in-vehicle wiring board according to the third embodiment. [Figure 10] FIG. 10 is an explanatory diagram showing an example in which the land portion and the conductor portion are arranged side by side in the second direction. [Figure 11] FIG. 11 is an explanatory diagram showing an example in which a plurality of conductor parts that are arranged with a shift in the second direction are arranged closely packed in the second direction. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In the following, embodiments of the present disclosure are listed and illustrated.

[0011] [1] A method for manufacturing an in-vehicle wiring board using a substrate body, comprising: The substrate body includes: A conductor layer having a wiring pattern; an insulating layer having an insulating film covering a part of the wiring pattern; Equipped with A portion of the wiring pattern is configured as a land portion that is not covered with the insulating film, the wiring pattern has a power path on which a plurality of the land portions are formed, The land portion is capable of joining a conductor portion having heat dissipation properties, a selection step of selecting at least one of the following in accordance with the type of vehicle on which the automotive wiring board is mounted: whether or not the conductor portion is to be joined to the plurality of land portions; the number of the conductor portions to be joined to the plurality of land portions; and a destination of the plurality of second power paths insulated from the power path to which the land portion is to be joined via the conductor portion; A current path using the power path is configured by applying the selection result in the selection process to the substrate body. A method for manufacturing an in-vehicle wiring board.

[0012] The manufacturing method for the wiring board for vehicle mounting can realize a current path according to a plurality of types depending on which is selected in the selection process. Moreover, since the conductor portion has heat dissipation properties, when the conductor portion is joined to the land portion, the heat dissipation properties are improved. Therefore, the manufacturing method for the wiring board for vehicle mounting can easily realize a current path according to the type of vehicle while improving the heat dissipation properties by utilizing a common substrate on which the conductor portion can be mounted.

[0013] [2] In the selection step, at least one of whether or not the conductor portion is to be joined to the plurality of land portions and the number of the conductor portions to be joined to the plurality of land portions is selected according to the type of vehicle in which the vehicle-mounted wiring board is to be mounted. A method for manufacturing an in-vehicle wiring board according to [1].

[0014] As the number of junctions of the conductor portion increases, the cross-sectional area of ​​the current path increases, so the resistance value of the current path decreases and the maximum current value (current allowable value) that can flow through the current path increases. In other words, the manufacturing method of the above-mentioned in-vehicle wiring board can easily realize a current path with a current allowable value according to the type of vehicle.

[0015] [3] The power path is provided with a plurality of land rows each including a plurality of the land portions arranged side by side; In the selection step, when selecting the number of connections of the conductor portions to the plurality of land portions, the number of land rows to which the conductor portions are to be connected is selected. A method for manufacturing an in-vehicle wiring board according to [2].

[0016] The in-vehicle wiring boards manufactured by the above method can be distinguished by the number of land rows to which the conductor portions are joined, and therefore it is easy to visually identify which type of in-vehicle wiring board the in-vehicle wiring board manufactured by the above method corresponds to.

[0017] [4] The plurality of land portions are arranged side by side in a direction in which a current flows, When the selection step selects that the conductor portion is to be joined to the land portion, a joining step is performed to join the conductor portion to a plurality of the land portions arranged in a direction in which a current flows. A method for manufacturing an in-vehicle wiring board according to [2] or [3].

[0018] In the in-vehicle wiring board manufactured by the above method, the conductor portion is arranged along the direction of current flow, so that the current flowing through the power path easily flows through the conductor portion.

[0019] [5] In the selection step, a destination to which the land portion is to be joined via the conductor portion is selected from among the plurality of second power paths. A method for manufacturing an in-vehicle wiring board according to [1].

[0020] In the method for manufacturing an in-vehicle wiring board, depending on which second power path is selected, at least one of a power supply source that supplies power to the power path and a power supply destination from the power path can be selected. In other words, the method for manufacturing an in-vehicle wiring board can select at least one of a power supply source that supplies power to the power path and a power supply destination from the power path according to the type of vehicle while improving heat dissipation.

[0021] [6] A second land portion is formed on each of the second power paths, the plurality of land portions include the land portions provided in correspondence with the second land portions individually, In the selection step, the land portion and the second land portion corresponding to the land portion are selected, When the land portion and the second land portion corresponding to the land portion are selected in the selection step, a joining step is performed to join the conductor portion to the selected land portion and the second land portion. A method for manufacturing an in-vehicle wiring board according to [5].

[0022] In the above-described method for manufacturing an in-vehicle wiring board, the conductor portion is joined to the corresponding land portion and the second land portion, which makes it easier to join the land portion and the second land portion in a more appropriate positional relationship.

[0023] [7] When the conductor portion is joined to the land portion, the conductor portion is surface-mounted on the main body of the substrate portion. A method for manufacturing an in-vehicle wiring board according to any one of [1] to [6].

[0024] The in-vehicle wiring board manufactured by the above method can more effectively utilize the rear surface of the board body than a configuration in which the conductor portion is mounted in a through hole.

[0025] [8] A substrate body, A conductor portion having heat dissipation properties, The substrate body includes: A conductor layer having a wiring pattern; an insulating layer having an insulating film covering a part of the wiring pattern; Equipped with A portion of the wiring pattern is configured as a land portion that is not covered with the insulating film, the wiring pattern has a power path on which a plurality of the land portions are formed, The conductor portion satisfies at least one of the following conditions: the conductor portion is joined to a plurality of the land portions; and the conductor portion is joined to at least one of a plurality of second power paths insulated from the power path and the land portion. Automotive wiring board.

[0026] In the above-mentioned vehicle-mounted wiring board, in a configuration in which the conductor portion is joined to a plurality of land portions, the cross-sectional area of ​​the current path is increased by the conductor portion. As a result, the resistance value of the current path is reduced and the allowable current value is increased. In addition, in the above-mentioned vehicle-mounted wiring board, in a configuration in which the conductor portion is joined to at least any of the second power paths and the land portion, a current path is formed that connects the power path to at least any of the second power paths. Therefore, the above-mentioned vehicle-mounted wiring board uses a common substrate on which the conductor portion can be mounted, and heat dissipation is improved, and a current path according to the type of vehicle is formed.

[0027] [9] The conductor portion is joined to a plurality of the land portions. The in-vehicle wiring board according to [8].

[0028] In the above-mentioned in-vehicle wiring board, the cross-sectional area of ​​the current path is increased by the conductor portion, resulting in a reduced resistance value of the current path and a larger allowable current value.

[0029]

[10] A second land portion is formed on each of the second power paths, Each of the second land portions is disposed at a position corresponding to each of the land portions, The conductor portion is joined to the corresponding land portion and the second land portion. The in-vehicle wiring board according to [8].

[0030] In the above-mentioned in-vehicle wiring board, a current path is formed by connecting the power path to at least one of the second power paths by connecting the corresponding land portion and the second land portion to each other.

[0031] First Embodiment The following description relates to a method for manufacturing an in-vehicle wiring board using the board body 10.

[0032] (Substrate body 10) As shown in FIG. 1 and FIG. 5, the substrate body 10 includes a conductor layer 20 and an insulating layer 30. The conductor layer 20 is made of, for example, a metal foil (for example, copper foil). The conductor layer 20 has a wiring pattern 21. The wiring pattern 21 has an elongated shape. An input-side electrical component 41 and an output-side electrical component 42 are provided on the wiring pattern 21. The wiring pattern 21 functions as an electrical path that supplies power input via the input-side electrical component 41 to the output-side electrical component 42. The input-side electrical component 41 is not particularly limited, and may be a connector, a switch, a fuse, or other electrical component. The output-side electrical component 42 is not particularly limited, and may be a connector, a switch, a fuse, or other electrical component.

[0033] As shown in FIG. 5, the insulating layer 30 has a base portion 31 and an insulating film 32. The base portion 31 has insulating properties and is made of, for example, resin. The base portion 31 has a plate shape. The thickness of the base portion 31 is greater than the thickness of the insulating film 32. The base portion 31 is disposed on one side of the thickness direction of the substrate main body 10 with respect to the conductor layer 20. Hereinafter, the "thickness direction of the substrate main body 10" is also simply referred to as the "thickness direction". The conductor layer 20 (more specifically, the wiring pattern 21) is provided on the surface of the base portion 31 on the other side in the thickness direction. The insulating film 32 covers a part of the surface of the conductor layer 20 (more specifically, the wiring pattern 21) on the other side in the thickness direction. The insulating film 32 is made of, for example, a solder resist. The insulating film 32 has insulating properties and is made of, for example, resin.

[0034] As shown in FIG. 5, a part of the wiring pattern 21 is configured as a land portion 23 that is not covered with the insulating film 32. The land portion 23 can be joined to a conductor portion 50 having heat dissipation properties. The conductor portion 50 is a member that is joined to the land portion 23 by solder 55. The conductor portion 50 is a heat dissipation member. The conductor portion 50 is configured not to be covered with resin. That is, the surface of the conductor portion 50 is configured to be exposed without being covered with resin. Therefore, the conductor portion 50 can improve heat dissipation compared to a jumper wire made of a coated electric wire. The conductor portion 50 is configured as, for example, a bus bar (more specifically, a chip bus bar). In this embodiment, the conductor portion 50 is rectangular parallelepiped-shaped, but may be in another form. For example, the conductor portion 50 may be cubic-shaped or may be in a form including a curved surface. The conductor portion 50 is formed in an elongated shape. The conductor portion 50 has an opposing surface 51 on one side in the thickness direction. The opposing surface 51 is a flat surface. The facing surface 51 is disposed along the substrate main body 10. The facing surface 51 is joined to the land portion 23 by solder 55.

[0035] As shown in FIG. 1, the land portion 23 is surrounded by an insulating film 32. The land portion 23 has a rectangular shape. The wiring pattern 21 has a power path 25 on which a plurality of land portions 23 are formed. The plurality of land portions 23 are arranged side by side in a first direction. The plurality of land portions 23 are arranged side by side in a straight line. The plurality of land portions 23 are arranged side by side in the direction in which current flows. The direction in which current flows is along the first direction.

[0036] As shown in FIG. 5, the power path 25 has a first connection portion 26 to which an input-side electrical component 41 is electrically connected, and a second connection portion 27 to which an output-side electrical component 42 is electrically connected. In the example shown in FIG. 5, the first connection portion 26 and the second connection portion 27 are configured as through holes. The first connection portion 26 and the second connection portion 27 do not have to be through holes, and may be, for example, lands. The multiple land portions 23 are disposed between the first connection portion 26 and the second connection portion 27. The "direction of current flow" is the direction from the first connection portion 26 to the second connection portion 27.

[0037] As shown in Figs. 1 and 5, the plurality of land portions 23 include a land pair constituted by a pair of land portions 23. The pair of land portions 23 are arranged at intervals from each other in the first direction. The pair of land portions 23 are arranged at intervals from each other in the first direction. The conductor portion 50 is joined to the pair of land portions 23. More specifically, one end side in the longitudinal direction of the longitudinal conductor portion 50 is joined to one land portion 23A, and the other end side in the longitudinal direction is joined to the other land portion 23B. According to this configuration, the amount of solder 55 used can be reduced compared to a configuration in which the entire opposing surface 51 of the conductor portion 50 is joined to the power path 25 by the solder 55.

[0038] The land portions 23 include a plurality of land pairs as shown in Fig. 1. The power path 25 includes a configuration in which the plurality of land pairs are arranged side by side in a first direction. The power path 25 includes a configuration in which the plurality of land pairs are arranged shifted in a second direction.

[0039] As shown in FIG. 1, the power path 25 is provided with a plurality of land rows, each of which is configured with a plurality of land portions 23 lined up. The plurality of land rows are arranged in a row in a second direction perpendicular to the first direction and the thickness direction. In the example shown in FIG. 1, two land rows are provided. The number of land portions 23 in each land row is the same. Each land row is made up of a plurality of land pairs. The land pairs in adjacent land rows are arranged offset from each other in the first direction.

[0040] 3, the interval GA between one land portion 23A and the other land portion 23B of a pair of lands 23 is longer than the length of the land portion 23 in the first direction and longer than the length (width) of the land portion 23 in the second direction. The length of the land portion 23 in the first direction is shorter than the length (width) of the land portion 23 in the second direction. The interval GB between adjacent land pairs in the first direction is shorter than the interval GA described above, shorter than the length of the land portion 23 in the first direction, and shorter than the length (width) of the land portion 23 in the second direction. The interval GB between adjacent land pairs refers to the interval between the land portion 23 on the other land pair side of one of the adjacent land pairs and the land portion 23 on the one land pair side of the other land pair.

[0041] 3, the length of the conductor 50 in the longitudinal direction (first direction) is longer than the length of the land 23 in the first direction and longer than the length (width) of the land 23 in the second direction. The length of the conductor 50 in the lateral direction (second direction) is longer than the length of the land 23 in the first direction and shorter than the length (width) of the land 23 in the second direction.

[0042] When the conductor portion 50 is joined to a plurality of land portions 23, the conductor portion 50 also forms part of the current path formed by the power path 25. This increases the cross-sectional area of ​​the current path formed by the power path 25. When the cross-sectional area of ​​the current path increases, the resistance value of the current path decreases, and the maximum current value (allowable current value) that can flow through the current path increases.

[0043] In addition, a plurality of land pairs are provided in the power path 25. As the number of conductor parts 50 joined to the power path 25 increases, the cross-sectional area of ​​the current path increases, the resistance value of the current path decreases, and the allowable current value increases.

[0044] For example, in a configuration in which the conductor portion 50 is not joined to the land portion 23, the allowable current value is 30 A. In a configuration in which the conductor portion 50 is joined to the land row "1" (specifically, a configuration in which the conductor portion 50 is joined to each land pair included in the land row "1"), the allowable current value is 60 A. In a configuration in which the conductor portion 50 is joined to the land row "2" (specifically, a configuration in which the conductor portion 50 is joined to each land pair included in the land row "2"), the allowable current value is 100 A.

[0045] In this way, the allowable current value of the substrate main body 10 is set according to the number of joints of the conductor parts 50. In addition, since the conductor parts 50 have heat dissipation properties, joining the conductor parts 50 also improves the heat dissipation properties.

[0046] (Method of manufacturing an in-vehicle wiring board) The method for manufacturing an in-vehicle wiring board includes a preparation step and a selection step.

[0047] In the preparation step, the substrate main body 10 is prepared. Also, in the preparation step, the conductor portion 50 is prepared as necessary.

[0048] In the selection process, the number of connections of the conductor portion 50 to the plurality of land portions 23 is selected according to the type of vehicle in which the automotive wiring board is mounted. In this embodiment, "selecting the number of connections of the conductor portion 50 to the plurality of land portions 23" is synonymous with "selecting the number of land pairs to which the conductor portion 50 is connected."

[0049] "Vehicle type" refers to a type classified by vehicle model, grade, destination, options, etc. More specifically, "vehicle type" refers to a type in which the allowable current value in power path 25 differs depending on the vehicle model, grade, destination, options, etc. "Allowable current value in power path 25" refers to the maximum current value that can be passed through power path 25. In this embodiment, "vehicle type" includes type A, type B, and type C. Type A vehicles are vehicles that require an allowable current value of 30A. Type B vehicles are vehicles that require an allowable current value of 60A. Type C vehicles are vehicles that require an allowable current value of 100A.

[0050] The "number of connections of the conductor portion 50 to the multiple land portions 23" also includes "0". In this embodiment, the "number of connections of the conductor portion 50 to the multiple land portions 23" is either "0", "3", or "6". In the selection process, when selecting the number of connections of the conductor portion 50 to the multiple land portions 23, the number of land rows to which the conductor portion 50 is to be connected is selected. The "number of land rows to which the conductor portion 50 is to be connected" also includes "0". In this embodiment, the "number of land rows to which the conductor portion 50 is to be connected" is either "0", "1", or "2".

[0051] In the selection process, if the vehicle type is type A, "0" is selected as the "number of land rows to which conductor portion 50 is joined." In other words, if the vehicle type is type A, "0" is selected as the "number of connections of conductor portion 50 to multiple land portions 23." In this case, as shown in FIG. 2, no conductor portion 50 is joined to any of the land portions 23. In this way, an in-vehicle wiring board 91 including a current path with an allowable current value of 30 A is manufactured.

[0052] In addition, in the selection process, when the vehicle type is type B, "1" is selected as the "number of land rows to which the conductor portion 50 is joined". In other words, when the vehicle type is type B, "3" is selected as the "number of connections of the conductor portion 50 to the plurality of land portions 23". In this way, when joining of the conductor portion 50 to the land portion 23 is selected in the selection process, a joining process is performed to join the conductor portion 50 to the plurality of land portions 23. In the joining process, as shown in FIG. 3, the conductor portion 50 is joined to the land row "1". Specifically, in the joining process, the conductor portion 50 is joined to each land pair included in the land row "1". In this way, an in-vehicle wiring board 92 including a current path with an allowable current value of 60 A is manufactured.

[0053] In addition, in the selection process, when the vehicle type is type C, "2" is selected as the "number of land rows to which the conductor portion 50 is joined". In other words, when the vehicle type is type C, "6" is selected as the "number of connections of the conductor portion 50 to the plurality of land portions 23". In this way, when joining of the conductor portion 50 to the land portion 23 is selected in the selection process, a joining process is performed to join the conductor portion 50 to the plurality of land portions 23. In the joining process, as shown in FIG. 4, the conductor portion 50 is joined to the land row "2". Specifically, in the joining process, the conductor portion 50 is joined to each land pair included in the land row "2". In this way, an in-vehicle wiring board 93 including a current path with an allowable current value of 100 A is manufactured.

[0054] In the bonding process, the conductor portion 50 is bonded to the land portion 23 by the solder 55. The soldering is, for example, reflow soldering. The conductor portion 50 is surface-mounted on the board portion main body 10.

[0055] 2 to 5, an input-side electric component 41 is connected to the first connection portion 26 of the in-vehicle wiring boards 91, 92, and 93 by soldering or the like. An output-side electric component 42 is connected to the second connection portion 27 of the in-vehicle wiring boards 91, 92, and 93 by soldering or the like.

[0056] (Example of effects) The manufacturing method of the in-vehicle wiring board of the first embodiment can realize a current path of an allowable current value according to a plurality of types by selecting the number of conductor parts 50 to be joined to a plurality of land parts 23 in a selection process. Moreover, since the conductor parts 50 have heat dissipation properties, when the conductor parts 50 are joined to the land parts 23, the heat dissipation is improved. More specifically, since the conductor parts 50 are not covered with resin, the heat dissipation is improved compared to a configuration in which a jumper wire made of a coated electric wire is joined. Therefore, the manufacturing method of the in-vehicle wiring board can easily realize a current path according to the type of vehicle while improving the heat dissipation by utilizing a common substrate on which the conductor parts 50 can be mounted.

[0057] In the manufacturing method of the in-vehicle wiring board of the first embodiment, the conductor portion 50 is bonded to a selected number of land rows. The in-vehicle wiring board manufactured by the above method can be distinguished by the number of land rows to which the conductor portion 50 is bonded. Therefore, the in-vehicle wiring board manufactured by the above method can be easily visually identified as to which type the in-vehicle wiring board corresponds.

[0058] Furthermore, in the in-vehicle wiring board manufactured by the above method, the conductor portion 50 is arranged along the direction of current flow, so that the current flowing through the power path 25 easily flows through the conductor portion 50.

[0059] Furthermore, since the in-vehicle wiring board manufactured by the above method has the conductor portion 50 surface-mounted on the substrate main body 10, it is easier to make effective use of the back surface of the substrate main body 10 compared to a configuration in which the conductor portion is through-hole mounted.

[0060] 3 and 4, the conductor portion 50 is joined to a plurality of land portions 23, so that the cross-sectional area of ​​the current path formed by the power path 25 is increased. As a result, the resistance value of the current path is reduced and the allowable current value is increased. Therefore, the in-vehicle wiring board 92 uses a common board on which the conductor portion 50 can be mounted, improving heat dissipation and forming a current path according to the type of vehicle.

[0061] <Second embodiment> In the second embodiment, a configuration will be described in which a conductor portion is joined to a land portion of an electric power path and at least one of a plurality of second electric power paths arranged on the input side.

[0062] The following description relates to a method for manufacturing an in-vehicle wiring board according to the second embodiment using the board portion main body 210.

[0063] (Substrate body 210) As shown in Fig. 6, the substrate main body 210 includes a conductor layer 220 and an insulating layer 230. The conductor layer 220 is made of, for example, a metal foil (for example, copper foil). The conductor layer 220 has a wiring pattern 221. The insulating layer 230 has the base portion 31 (see Fig. 5) described in the first embodiment and an insulating layer 232. The insulating layer 232 is made of, for example, a solder resist. The insulating layer 232 has insulating properties and is made of, for example, a resin.

[0064] The wiring pattern 221 has a first power path 270 and a plurality of second power paths 280, 281. The first power path 270 is disposed at intervals from each of the second power paths 280, 281. The first power path 270 is insulated from each of the second power paths 280, 281 when the conductor portion 50 is not joined. The second power paths 280, 281 are disposed at intervals from each other. The second power paths 280, 281 are insulated from each other.

[0065] A portion of the wiring pattern 221 is configured as first land portions 271, 272 that are not covered by the insulating film 232. A plurality of first land portions 271, 272 are formed in the first power path 270. The first land portions 271, 272 are arranged at intervals from each other.

[0066] A partial region of the wiring pattern 221 is configured as a second land portion 280A that is not covered with the insulating film 232. In the second power path 280, the second land portion 280A is formed.

[0067] A partial region of the wiring pattern 221 is configured as a second land portion 281A that is not covered with the insulating film 232. The second land portion 281A is formed in the second power path 281. That is, the second land portion is formed in each second power path.

[0068] The multiple first land parts 271, 272 include first land parts provided to correspond to the respective second land parts individually. Specifically, the first land part 271 is disposed at a position corresponding to the second power path 280 (specifically, the second land part 280A). The first land part 271 can be joined to the second power path 280 (specifically, the second land part 280A) via the conductor part 50. The first land part 272 is disposed at a position corresponding to the second power path 281 (specifically, the second land part 281A). The first land part 272 can be joined to the second power path 281 (specifically, the second land part 281A) via the conductor part 50. In other words, the second power paths 280, 281 (specifically, the second land parts 280A, 281A) correspond to options of "destinations to which the first land parts 271, 272 are joined via the conductor part 50".

[0069] Different powers are supplied to the second power paths 280, 281. The different powers may be powers supplied from different batteries, or may be powers obtained by varying the powers from a common battery through voltage conversion or the like.

[0070] As shown in FIG. 7, for example, a first voltage (+B1 voltage) is applied to the second power path 280. For example, a second voltage (+B2 voltage) is applied to the second power path 281. When the first land portion 271 is joined to the second power path 280 (specifically, the second land portion 280A) via the conductor portion 50, power is supplied from the second power path 280 to the first power path 270. That is, a first voltage (+B1 voltage) is applied to the first power path 270. When the first land portion 272 is joined to the second power path 281 (specifically, the second land portion 281A) via the conductor portion 50, power is supplied from the second power path 281 to the first power path 270. That is, a second voltage (+B2 voltage) is applied to the first power path 270. The first power path 270 supplies the power supplied from the second power path to the load 275 side. The type of load is not particularly limited.

[0071] (Method of manufacturing an in-vehicle wiring board) The method for manufacturing an in-vehicle wiring board includes a preparation step and a selection step.

[0072] In the preparation step, the substrate main body 210 and the conductor portion 50 are prepared.

[0073] In the selection process, a destination to which the first land portion 271, 272 is joined via the conductor portion 50 is selected from the plurality of second power paths 280, 281 in accordance with the type of vehicle on which the in-vehicle wiring board is mounted. As described above, each first land portion is disposed at a position corresponding to each second land portion. Therefore, in the selection process, one of the plurality of first land portions 271, 272 and a second land portion corresponding to the first land portion are selected.

[0074] When the first land portion and the second land portion corresponding to the first land portion are selected in the selection step, a joining step is performed in which the conductor portion 50 is joined to the selected first land portion and second land portion.

[0075] For example, when the first land portion 271 and the second land portion 280A are selected in the selection process, the conductor portion 50 is joined to the first land portion 271 and the second land portion 280A. In this case, an in-vehicle wiring board 291 is manufactured in which the second power path 280 is connected to the first power path 270 (see FIG. 7).

[0076] When the first land portion 272 and the second land portion 281A are selected by the selection process, the conductor portion 50 is joined to the first land portion 272 and the second land portion 281A. In this case, an in-vehicle wiring board (not shown) in which the second power path 281 is connected to the first power path 270 is manufactured.

[0077] (Example of effects) The manufacturing method for an in-vehicle wiring board of the second embodiment can select a power supply source that supplies power to the first power path 270 depending on which second power path is selected in the selection process. Moreover, since the conductor portion 50 has heat dissipation properties, heat dissipation is improved. Therefore, the manufacturing method for an in-vehicle wiring board of the second embodiment can easily realize a current path according to the type of vehicle while improving heat dissipation by utilizing a common substrate on which the conductor portion 50 can be mounted.

[0078] Further, the multiple first land portions 271, 272 include first land portions provided to correspond individually to the second power paths 280, 281 (specifically, second land portions 280A, 281A). Then, in the joining step, the conductor portion 50 is joined to the first land portion and the second land portion corresponding to the first land portion. Therefore, in the manufacturing method for an in-vehicle wiring board of the second embodiment, the conductor portion 50 is joined to the first land portion and the second land portion arranged at positions corresponding to each other. Therefore, it is easy to join the land portion and the second land portion in a more appropriate positional relationship.

[0079] In addition, in the in-vehicle wiring board 291 shown in FIG. 7, a current path is formed by connecting the first land portion and the second land portion that are arranged in a corresponding positional relationship to each other, connecting the first power path 270 to any one of the second power paths.

[0080] <Third embodiment> In the third embodiment, a configuration will be described in which a conductor portion is joined to a land portion of an electric power path and at least one of a plurality of second electric power paths arranged on the output side.

[0081] The following description relates to a method for manufacturing an in-vehicle wiring board according to the third embodiment using the board portion main body 310.

[0082] (Substrate body 310) As shown in Fig. 8, the substrate main body 310 includes a conductor layer 320 and an insulating layer 330. The conductor layer 320 is made of, for example, a metal foil (e.g., copper foil). The conductor layer 320 has a wiring pattern 321. The insulating layer 330 has the base portion 31 (see Fig. 5) described in the first embodiment and an insulating layer 332. The insulating layer 332 is made of, for example, a solder resist. The insulating layer 332 has insulating properties and is made of, for example, a resin.

[0083] The wiring pattern 321 has a first power path 370 and a plurality of second power paths 380, 381. The first power path 370 is disposed at intervals from each of the second power paths 380, 381. The first power path 370 is insulated from each of the second power paths 380, 381 when the conductor portion 50 is not joined. The second power paths 380, 381 are disposed at intervals from each other. The second power paths 380, 381 are insulated from each other.

[0084] A portion of the wiring pattern 321 is configured as first land portions 371, 372 that are not covered by the insulating film 332. A plurality of first land portions 371, 372 are formed in the first power path 370. The first land portions 371, 372 are arranged at intervals from each other.

[0085] A partial region of the wiring pattern 321 is configured as a second land portion 380A that is not covered with the insulating film 332. In the second power path 380, the second land portion 380A is formed.

[0086] A partial region of the wiring pattern 321 is configured as a second land portion 381A that is not covered with the insulating film 332. The second land portion 381A is formed in the second power path 381. That is, the second land portion is formed in each second power path.

[0087] The multiple first land portions 371, 372 include first land portions provided to correspond to the respective second land portions individually. Specifically, the first land portion 371 is disposed at a position corresponding to the second power path 380 (specifically, the second land portion 380A). The first land portion 371 may be joined to the second power path 380 (specifically, the second land portion 380A) via the conductor portion 50. The first land portion 372 is disposed at a position corresponding to the second power path 381 (specifically, the second land portion 381A). The first land portion 372 may be joined to the second power path 381 (specifically, the second land portion 381A) via the conductor portion 50.

[0088] 9, different loads can be connected to the second power paths 380 and 381. For example, a first load 385 can be connected to the second power path 380, and a second load 386 can be connected to the second power path 381. The types of the first load 385 and the second load 386 are not particularly limited.

[0089] As shown in Fig. 9, a +B voltage is applied to the first power path 370. When the first land portion 371 is joined to the second power path 380 (specifically, the second land portion 380A) via the conductor portion 50, power is supplied from the first power path 370 to the second power path 380. That is, a +B voltage is applied to the second power path 380. When the first land portion 372 is joined to the second power path 381 (specifically, the second land portion 381A) via the conductor portion 50, power is supplied from the first power path 370 to the second power path 381. That is, a predetermined voltage (for example, a +B voltage) is applied to the second power path 381.

[0090] (Method of manufacturing an in-vehicle wiring board) The method for manufacturing an in-vehicle wiring board includes a preparation step and a selection step.

[0091] In the preparation step, the substrate main body 310 and the conductor portion 50 are prepared.

[0092] In the selection process, a destination to which the first land portions 371, 372 are joined via the conductor portion 50 is selected from the plurality of second power paths 380, 381 in accordance with the type of vehicle on which the automotive wiring board is mounted. In this embodiment, "only the second power path 380" and "both of the second power paths 380, 381" are provided as options for "destination to which the first land portions 371, 372 are joined."

[0093] When "only the second power path 380" is selected in the selection process, a joining process is performed in which the conductor portion 50 is joined to the second land portion 380A and the first land portion 371 of the second power path 380. In this case, an in-vehicle wiring board (see FIG. 9) in which the first power path 370 is connected to the second power path 380 is manufactured.

[0094] When "both of the second power paths 380, 381" is selected in the selection process, a joining process is performed in which the conductor portion 50 is joined to the second land portion 380A and the first land portion 371 of the second power path 380, and the conductor portion 50 is joined to the second land portion 381A and the first land portion 372 of the second power path 381. In this case, an in-vehicle wiring board (not shown) is manufactured in which the first power path 370 is connected to each of the multiple second power paths 380, 381.

[0095] (Example of effects) The manufacturing method for an in-vehicle wiring board of the third embodiment can select a power supply destination to which power is supplied from the first power path 370 depending on which second power path is selected in the selection process. Moreover, since the conductor portion 50 has heat dissipation properties, heat dissipation is improved. Therefore, the manufacturing method for an in-vehicle wiring board of the second embodiment can easily realize a current path according to the type of vehicle while improving heat dissipation by utilizing a common substrate on which the conductor portion 50 can be mounted.

[0096] Further, the multiple first land portions 371, 372 include first land portions provided to correspond individually to the second power paths 380, 381 (specifically, second land portions 380A, 381A). Then, in the joining step, the conductor portion 50 is joined to the first land portion and the second land portion corresponding to the first land portion. Therefore, in the manufacturing method for an in-vehicle wiring board of the third embodiment, the conductor portion 50 is joined to the first land portion and the second land portion arranged at positions corresponding to each other. Therefore, it is easy to join the land portion and the second land portion in a more appropriate positional relationship.

[0097] In addition, in the in-vehicle wiring board 391 shown in FIG. 9, a current path is formed that connects the first power path 370 to a desired second power path by connecting a first land portion and a second land portion that are arranged in a corresponding positional relationship to each other.

[0098] <Other embodiments> The present disclosure is not limited to the embodiments described above and in the drawings. For example, the features of the above or later described embodiments can be combined in any combination within a range that does not contradict. In addition, any feature of the above or later described embodiments can be omitted unless it is clearly stated as essential. Furthermore, the above-mentioned embodiment may be modified as follows.

[0099] In each of the above embodiments, the conductor portion is configured to be surface mounted on the substrate body, but it may be configured to be through-hole mounted.

[0100] In the first embodiment, the number of conductor portions to be joined to the plurality of lands is selected in the selection step, but the selection step may be configured to select whether or not to join the conductor portions to the plurality of lands.

[0101] In the first embodiment, the pair of lands is arranged along the direction of current flow, but the present invention is not limited to this configuration. For example, the straight line connecting the pair of lands may be inclined with respect to the direction of current flow. From the viewpoint of making it easier for the current to flow to the conductor joined to the pair of lands, the inclination angle with respect to the direction of current flow is preferably within 45°.

[0102] In the above first embodiment, there are two land rows, but there may be one row, or three or more rows.

[0103] In the first embodiment, the number of connections of the conductor portions is selected in units of land rows, but other configurations are also possible. For example, the number of connections of the conductor portions may be selected regardless of the land rows.

[0104] In the first embodiment, the conductor portion is joined to two land portions, but the conductor portion may be joined to three or more land portions.

[0105] In the first embodiment, the multiple lands and conductors arranged with a shift in the second direction are shifted from each other in the first direction, but other configurations are also possible. For example, as shown in Fig. 10, multiple lands 423 and conductors 50 may be arranged side by side in the second direction.

[0106] In the first embodiment, the positional relationship between the conductor portions and the land portions may be configured as shown in Fig. 11. That is, two conductor portions 50 may be arranged so as to overlap each other in the second direction and to be shifted in the first direction, and a land portion 523 joined to one conductor portion 50 and a land portion 523 joined to the other conductor portion 50 may be arranged so as to overlap each other in the first direction. This configuration makes it easy to narrow the gap between the conductor portions 50 in the second direction.

[0107] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is not limited to the embodiments disclosed herein, and is intended to include all modifications within the scope indicated by the claims or within the scope equivalent to the claims. [Explanation of symbols]

[0108] 10...Substrate body 20...Conductor layer 21...Wiring pattern 23…Land section 23A…Land section 23B…Land section 25…Power line 26…First connection part 27…Second connection part 30…Insulating layer 31…Base section 32...Insulating film 41...Input side electrical components 42...Output side electrical components 50…Conductor 51…opposing surface 55…Solder 91...Automotive wiring board 92…Automotive wiring board 93…Automotive wiring board 210...Substrate body 220...Conductor layer 221...Wiring pattern 230...insulating layer 232...Insulating film 270...1st power path (power path) 271…First Land Section (Land Section) 272…First Land Section (Land Section) 275…Load 280…Second power path 280A…Second land section 281…Second power path 281A…Second Land Section 291...Automotive wiring board 310...Substrate body 320...Conductor layer 321...Wiring pattern 330...insulating layer 332...Insulating film 370…1st power path (power path) 371…First Land Section (Land Section) 372…First Land Section (Land Section) 380…Second power path 380A…Second land section 381…Second power path 381A…Second Land Section 385…1st load 386…Second load 391...Automotive wiring board 423…Land Department 523…Land Department

Claims

1. A method for manufacturing an in-vehicle wiring board using a substrate body, comprising: The substrate body includes: A conductor layer having a wiring pattern; an insulating layer having an insulating film covering a part of the wiring pattern; Equipped with A portion of the wiring pattern is configured as a land portion that is not covered with the insulating film, the wiring pattern has a power path on which a plurality of the land portions are formed, The land portion is capable of joining a conductor portion having heat dissipation properties, a selection step of selecting at least one of the following in accordance with the type of vehicle on which the automotive wiring board is mounted: whether or not the conductor portion is to be joined to the plurality of land portions; the number of the conductor portions to be joined to the plurality of land portions; and a destination of the plurality of second power paths insulated from the power path to which the land portion is to be joined via the conductor portion; A current path using the power path is configured by applying the selection result in the selection process to the substrate body. A method for manufacturing an in-vehicle wiring board.

2. In the selection step, at least one of whether or not the conductor portion is to be joined to the plurality of land portions and the number of the conductor portions to be joined to the plurality of land portions is selected according to the type of vehicle on which the vehicle-mounted wiring board is mounted. The method for manufacturing the wiring board for vehicle installation according to claim 1 .

3. The power path is provided with a plurality of land rows each including a plurality of the land portions arranged side by side, In the selection step, when selecting the number of connections of the conductor portions to the plurality of land portions, the number of land rows to which the conductor portions are to be connected is selected. The method for manufacturing the in-vehicle wiring board according to claim 2 .

4. The plurality of land portions are arranged side by side in a direction in which a current flows, When the selection step selects that the conductor portion is to be joined to the land portion, a joining step is performed to join the conductor portion to a plurality of the land portions arranged in a direction in which a current flows. The method for manufacturing an in-vehicle wiring board according to claim 2 or 3.

5. In the selection step, a destination to which the land portion is to be joined via the conductor portion is selected from among the plurality of second power paths. The method for manufacturing the wiring board for vehicle installation according to claim 1 .

6. A second land portion is formed on each of the second power paths, the plurality of land portions include the land portions provided in correspondence with the second land portions, In the selection step, the land portion and the second land portion corresponding to the land portion are selected, When the land portion and the second land portion corresponding to the land portion are selected in the selection step, a joining step is performed to join the conductor portion to the selected land portion and the second land portion. The method for manufacturing an in-vehicle wiring board according to claim 5 .

7. When the conductor portion is joined to the land portion, the conductor portion is surface-mounted on the main body of the substrate portion. The method for manufacturing the wiring board for vehicle mounting according to any one of claims 1 to 3.

8. A substrate body, A conductor portion having a heat dissipation property, The substrate body includes: A conductor layer having a wiring pattern; an insulating layer having an insulating film covering a part of the wiring pattern; Equipped with A portion of the wiring pattern is configured as a land portion that is not covered with the insulating film, the wiring pattern has a power path on which a plurality of the land portions are formed, The conductor portion satisfies at least one of the following conditions: the conductor portion is joined to a plurality of the land portions; and the conductor portion is joined to at least one of a plurality of second power paths insulated from the power path and the land portion. Automotive wiring board.

9. The conductor portion is joined to a plurality of the land portions. The wiring board for vehicle installation according to claim 8 .

10. A second land portion is formed on each of the second power paths, Each of the second land portions is disposed at a position corresponding to each of the land portions, The conductor portion is joined to the corresponding land portion and the second land portion. The wiring board for vehicle installation according to claim 8 .

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