Joint device, joint method, and method for manufacturing article

Abstract

To provide a technique advantageous for achieving, with high accuracy, positioning in joining a second object to a first object.SOLUTION: A joint device is provided which joins a second object to a first object, the joint device comprising: a holding unit that holds a sheet to which the second object is pasted; a projection mechanism that causes the second object to project toward the first object with the sheet held by the holding unit; a measurement unit that measures the position of the second object pasted to the sheet held by the holding unit with respect to the first object; and a processing unit that performs processing of positioning the first object and the second object based on the position measured by the measurement unit in a state where the projection mechanism causes the second object to project toward the first object.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a joining device, a joining method, and a method for manufacturing an article. [Background technology]

[0002] A technique has been proposed in the past in which a die on which a semiconductor element is manufactured is surface-treated and the die is directly bonded to an object to be bonded (see Patent Document 1). Patent Document 1 discloses a technique for bonding the surface of a semiconductor chip (second object) to the surface of a substrate (first object). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-92078 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, a technology has been proposed to bond different dies called chiplets at high density to realize high-performance semiconductor elements in a single package. With this technology, the spacing between the pads for high-density I / O bonding arranged on each die becomes shorter, and there is a demand for improved bonding position accuracy of the bonding equipment.

[0005] In the technology disclosed in Patent Document 1, the activated surface of a die attached to a sheet is held facing the activated surface of a substrate, and the back surface of the die is pressed to bond the die and the substrate in close contact. Therefore, in this technology, the back surface of the die is pressed after the die and the substrate are positioned (aligned) relative to each other, so that misalignment occurs during pressing, making it difficult to bond the die and the substrate while maintaining high positioning accuracy (bonding position accuracy).

[0006] The present invention has been made in consideration of such problems in the conventional technology, and has an exemplary object to provide a technology that is advantageous for achieving high-precision positioning when joining a first object to a second object. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, a joining device as one aspect of the present invention is a joining device that joins a second object to a first object, and is characterized in having: a holding unit that holds a sheet to which the second object is attached; a protruding mechanism that protrudes the second object toward the first object via the sheet held in the holding unit; a measuring unit that measures the position of the second object attached to the sheet held in the holding unit relative to the first object; and a processing unit that performs processing to position the first object and the second object based on the position measured by the measuring unit when the second object is protruded toward the first object by the protruding mechanism.

[0008] Further objects or other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. Effect of the Invention

[0009] According to the present invention, for example, it is possible to provide a technique that is advantageous for achieving high-precision positioning when joining a first object to a second object. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic diagram showing a configuration of a joining device according to one aspect of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view showing a configuration of a dicing frame. [Diagram 3] 11A and 11B are diagrams illustrating a specific operation image of a protruding mechanism and a suction mechanism in a joining operation. [Figure 4] 10 is a flowchart for explaining a joining operation. [Diagram 5]FIG. 2 is a diagram for explaining a pretreatment for joining a first object and a second object. [Figure 6] FIG. 4 is a schematic diagram showing another configuration of the joining device according to one aspect of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] A bonding apparatus according to one aspect of the present invention is mainly applied to a process (bonding process) of bonding a second object (second object) to a first object (first object to be bonded) or to a plurality of locations of the first object. In the following description, the first object is a substrate (wafer) on which a semiconductor device is manufactured, and the second object is an individualized die on which a semiconductor device is manufactured, but the first object is not limited thereto.

[0013] The first object includes, in addition to a substrate on which a semiconductor device is manufactured, for example, a silicon substrate, a silicon substrate on which wiring is formed, a glass substrate, a glass panel on which wiring is formed, and an organic panel (PCB) on which wiring is formed. The first object also includes, for example, a metal panel, and a substrate on which a semiconductor device is manufactured, to which a die on which some semiconductor devices are already manufactured is bonded.

[0014] The second object may include, besides a singulated die, for example, a stack of several already singulated dies, small pieces of material, optical elements, MEMS, structures.

[0015] Furthermore, the method of joining the first object and the second object is not limited. The method of joining the first object and the second object includes, for example, joining with an adhesive, joining with a temporary adhesive, joining by hybrid bonding, atomic diffusion bonding, vacuum bonding, bump bonding, etc. In this way, the method of joining the first object and the second object includes various temporary and permanent joining methods.

[0016] As examples of industrial applications of the joining device according to one aspect of the present invention, the following application examples are considered.

[0017] A first application example may be the manufacture of stacked memories. When a bonding apparatus according to one aspect of the present invention is applied to the manufacture of stacked memories, the first object is a substrate (wafer) on which memories, which are semiconductor devices, are manufactured, and the second object is the memory, which is an individualized die. Generally, about eight layers are stacked, so that in bonding the eighth layer, the first object is a substrate on which six layers of memories have already been bonded. The final layer may also be a driver that drives the memory.

[0018] As a second application example, heterogeneous integration of a processor is conceivable. In contrast to the mainstream of conventional processors, which are SoCs in which logic circuits and SRAMs are configured in one semiconductor element, each element is manufactured on a separate substrate by applying an optimal process, and then these elements are bonded to manufacture a processor. This makes it possible to reduce the cost of the processor and improve the yield. When the bonding apparatus according to one aspect of the present invention is applied to heterogeneous integration, the first object is a substrate (wafer) on which a logic device, which is a semiconductor device, is manufactured. The second object is a die such as an SRAM, an antenna, or a driver that is singulated after probing. Since different dies are usually bonded sequentially, the number of bonded objects increases sequentially as the first object. For example, when bonding is started from an SRAM, when bonding the next element of the SRAM, the first object is a logic substrate (wafer) to which the SRAM is bonded. When bonding multiple dies, it is preferable to bond the thinnest die first so that the bonding head does not interfere with the bonded die.

[0019] As a third application example, 2.5D bonding using a silicon interposer is considered. A silicon interposer is a silicon substrate (wafer) on which wiring is formed. In 2.5D bonding, a silicon interposer is used to bond individualized dies to perform electrical bonding between the dies. When a bonding device according to one aspect of the present invention is applied to die bonding to a silicon interposer, the first object is a silicon substrate (wafer) on which wiring is formed, and the second object is an individualized die. In general, since multiple types of dies are bonded to a silicon interposer, the first object also includes a silicon interposer to which several dies are bonded. In addition, when bonding multiple dies, it is preferable to bond the thinnest die first so that the bonding head does not interfere with the bonded dies.

[0020] A fourth application example is 2.1D bonding using an organic interposer or a glass interposer. An organic interposer is an organic panel (PCB substrate, CCL substrate) used as a package substrate on which wiring is formed. A glass interposer is a glass panel on which wiring is formed. 2.1D bonding is bonding a singulated die to an organic interposer or a glass interposer, and electrically bonding between the dies by wiring on the interposer. When a bonding device according to one aspect of the present invention is applied to die bonding to an organic interposer, the first object is an organic panel on which wiring is formed, and the second object is a singulated die. When a bonding device according to one aspect of the present invention is applied to die bonding to a glass interposer, the first object is a glass panel on which wiring is formed, and the second object is a singulated die. Generally, since multiple types of dies are bonded to an organic interposer or a glass interposer, the first object also includes an organic interposer or a glass interposer to which several dies are bonded. Furthermore, when bonding multiple dies together, the order of bonding is preferably such that the thinner die is bonded first, so that the bonding head does not interfere with the already bonded dies.

[0021] A fifth application example is temporary bonding in a fan-out package manufacturing process. A fan-out wafer level package is known in which a singulated die is reconstructed into a wafer shape using a molded resin and packaged. A fan-out panel level package is known in which a singulated die is reconstructed into a panel shape using a molded resin and packaged. These packages are applied to semiconductor manufacturing as advanced packages. In packaging, rewiring from the die to the bumps, or rewiring for bonding different types of dies is formed on a molded reconstructed substrate. In this case, if the arrangement accuracy of the die is low, when the rewiring pattern is transferred using a step-and-repeat exposure device, the rewiring pattern cannot be positioned (aligned) with high accuracy on the die. Therefore, it is required to arrange the die with high accuracy. When the bonding device as one aspect of the present invention is applied to a fan-out package manufacturing process, the first object is a metal panel, and the second object is a singulated die. The singulated die is temporarily bonded to a substrate such as a metal panel by a temporary bonding agent. The metal panel is then peeled off from the molded wafer or panel to produce a reconstituted wafer or panel. When this method is applied to bonding, it is preferable to adjust the bonding position of the bonding device so as to correct the array deformation caused by the molding process.

[0022] As a sixth application example, heterogeneous substrate bonding is considered. For example, in the field of infrared image sensors, InGaAs is known as a highly sensitive material. Therefore, it is possible to manufacture a highly sensitive and high-speed infrared image sensor by using InGaAs for the sensor part that receives light and silicon that realizes high-speed processing for the logic circuit that extracts data. However, only small-diameter substrates (wafers) of InGaAs crystals are mass-produced, such as 4 inches, which are smaller than the mainstream 300 mm silicon substrate. Therefore, a technology has been proposed in which an individualized InGaAs substrate is bonded onto a 300 mm silicon substrate on which a logic circuit is formed. The bonding apparatus as one aspect of the present invention can also be applied to heterogeneous substrate bonding in which substrates made of different materials and of different sizes are bonded. When the bonding apparatus as one aspect of the present invention is applied to heterogeneous substrate bonding, the first object is a large-diameter substrate such as a silicon substrate (wafer), and the second object is a small piece of material such as InGaAs. Such a small piece of material is a sliced ​​crystal, but it is preferable to cut it into a square shape.

[0023] First Embodiment Fig. 1 is a schematic diagram showing the configuration of a bonding device BD according to one aspect of the present invention. In this embodiment, as shown in Fig. 1, directions are indicated by an XYZ coordinate system. Typically, the XY plane is a plane parallel to the horizontal plane, and the Z axis is an axis parallel to the vertical direction. The X axis, the Y axis, and the Z axis are indicated as directions perpendicular to each other or directions intersecting each other. This is also true in other drawings.

[0024] In this embodiment, the bonding apparatus BD is embodied as an apparatus for bonding a second object 1a, such as a die, to a first object 2a, such as a substrate. As shown in FIG. 1, the bonding apparatus BD has a first module 1, a second module 2, and a control unit 3.

[0025] The first module 1 is a module for mounting the dicing frame DF. The first module 1 includes a holding unit 13 that holds the dicing frame DF carried into the bonding device DB. FIG. 2 is a cross-sectional view showing the configuration of the dicing frame DF. The dicing frame DF includes a frame 1c and a sheet 1b attached to the frame 1c. A plurality of second objects 1a are attached (adhered) to the sheet 1b via a non-bonding surface NS, which is a surface opposite to each bonding surface BS1 (a surface on the side bonded to the first object 2a). The holding unit 13 holds the dicing frame DF (sheet 1b) via the frame 1c in a state in which the bonding target location TP of the first object 2a and the bonding surface BS of the second object 1a face each other. The holding unit 13 also includes a driving unit 13a that drives the sheet 1b two-dimensionally relative to the protruding mechanism 11 in an XY plane (horizontal plane) perpendicular to the Z direction (vertical direction) in which the protruding mechanism 11 protrudes the second object 1a attached to the sheet 1b. This allows the protruding mechanism 11 to repeat the joining operation while changing the position of the sheet 1b (the second object 1a attached to the sheet 1b).

[0026] The first module 1 includes a protruding mechanism 11. The protruding mechanism 11 is a mechanism that, through the sheet 1b of the dicing frame DF held by the holding unit 13, specifically, pushes out the back surface opposite to the attached surface of the sheet 1b, thereby causing the second object 1a attached to the sheet 1b to protrude toward the first object 2a. The protruding mechanism 11 also functions as a peeling mechanism that peels off the second object 1a from the sheet 1b in a state in which the first object 2a and the second object 1a are joined. The protruding mechanism 11 may be provided with a driving unit 11a that drives the protruding mechanism 11 with respect to the sheet 1b of the dicing frame DF held by the holding unit 13 in the XY plane perpendicular to the Z direction in which the second object 1a attached to the sheet 1b is protruded. However, the driving unit 11a is not necessarily a required configuration, and may be provided when the driving unit 13a is not provided in the holding unit 13. In other words, it is only necessary that either the drive unit 11a or 13a is provided so as to be able to change the relative position between the protrusion mechanism 11 and the sheet 1b within the XY plane.

[0027] The first module 1 includes an adsorption mechanism 12. The adsorption mechanism 12 functions as a holding mechanism that adsorbs and holds non-target objects, excluding target objects to be protruded toward the first object 2a by the protrusion mechanism 11, through the sheet 1b among the multiple second objects 1a attached to the sheet 1b. Here, the target objects are second objects 1a to be protruded toward the first object 2a in one joining operation, and the number of the second objects is not limited (there may be one or more). The non-target objects are second objects 1a that are not to be protruded toward the first object 2a in one joining operation, specifically, second objects 1a attached around the target objects.

[0028] Basically, the suction mechanism 12 is configured to be drivable in conjunction with (synchronization with) the protruding mechanism 11 so as to maintain a positional relationship with the protruding mechanism 11. For example, the suction mechanism 12 may be attached (connected) to the protruding mechanism 11 and configured to be drivable via a drive unit 11a that drives the protruding mechanism 11, or a drive unit that drives the suction mechanism 12 may be provided independently to enable the suction mechanism 12 to be drivable.

[0029] In this embodiment, the suction mechanism 12 includes a plurality of suction holes for suctioning and holding the second object 1a via the sheet 1b. If the suction holes of the suction mechanism 12 are too large, the second object 1a may be sucked in together with the sheet 1b, which may cause cracks. Therefore, it is necessary to appropriately set the size, number, arrangement, etc. of the suction holes of the suction mechanism 12 according to the size and thickness of the second object 1a and the hardness and thickness of the sheet 1b.

[0030] The second module 2 is a module for mounting the first object 2a. The second module 2 includes a stage 21 that holds the first object 2a via a chuck 2b that adsorbs the first object 2a, and a stage drive unit that can drive the stage 21 about six axes, namely, the X-axis, the Y-axis, the Z-axis, and the tilt directions of each axis.

[0031] A target 23 is provided (fixed) on the stage 21, and is the measurement subject when the position measuring device 101 measures the position of the stage 21 (first object 2a held by the stage 21). The position measuring device 101 detects the target 23 provided on the stage 21 to measure the position of the stage 21, i.e., the position of the first object 2a held by the stage 21. The position measuring device 101 may be, for example, an interferometer, in which case the target 23 would be a bar mirror. The position measuring device 101 may also be, for example, an encoder head, in which case the target 23 would be an encoder scale.

[0032] The second module 2 includes a measuring unit 22 provided on the stage 21 so as to face the dicing frame DF. The measuring unit 22 measures the position of the second object 1a attached to the sheet 1b of the dicing frame DF held by the holding unit 13, specifically, the position of the second object 1a (target object) to be protruded toward the first object 2a by the protruding mechanism 11, relative to the first object 2a. In this embodiment, the measuring unit 22 measures the position of the second object 1a in a state in which the second object 1a is protruded toward the first object 2a by the protruding mechanism 11 and the first object 2a and the second object 1a are separated from each other. The measuring unit 22 includes, for example, a camera, and measures the position of the second object 1a relative to the first object 2a (the position in the XY plane and the inclination with respect to the XY plane) by detecting the feature points of the second object 1a, which is the target object, and the outer shape of the second object 1a.

[0033] The control unit 3 is composed of, for example, a computer (information processing device) including a CPU, a memory, etc. The control unit 3 comprehensively controls each part of the bonding device BD in accordance with a program stored in the storage unit to operate the bonding device BD and perform a bonding operation of bonding the second object 1a to the first object 2a. The control unit 3 also functions as a processing unit that performs a process of positioning the second object 1a and the first object 2a based on the position of the second object 1a measured by the measurement unit 22 in a state in which the second object 1a is protruded toward the first object 2a by the protrusion mechanism 11 during the bonding operation.

[0034] 3(a) and 3(b) are diagrams showing a specific operational image of the protruding mechanism 11 and the suction mechanism 12 in a joining operation for joining the second object 1a to the first object 2a. The protruding mechanism 11 includes a protruding portion 112 (push-down stage) for protruding the second object 1a toward the first object 2a, and a peeling portion 111 for peeling the second object 1a joined to the first object 2a from the sheet 1b.

[0035] As shown in FIG. 3(a) and FIG. 3(b), in this embodiment, the peeling portion 111 is configured as an internal mechanism built into the protruding portion 112. The protruding portion 112 pushes the outer peripheral region of the second object 1a toward the first object 2a through the sheet 1b held by the holding portion 13. The peeling portion 111 also pushes the inner region of the second object 1a, which is located inside the outer peripheral region, toward the first object 2a through the sheet 1b. As the material of the protruding portion 112 and the peeling portion 111, for example, resin or rubber is preferable in consideration of damage to the second object 1a, and invar is preferable in consideration of heat transfer to the second object 1a. As the shape of the protruding portion 112 and the peeling portion 111, for example, a block shape is preferable in consideration of sufficiently pushing out the second object 1a and damaging the second object 1a.

[0036] In the joining operation, first, as shown in Fig. 3(a), of the multiple second objects 1a attached to the sheet 1b, the second object 1a to be joined to the first object 2a, i.e., the outer region of the target object, is pushed toward the first object 2a by the protrusion 112. At this time, of the multiple second objects 1a attached to the sheet 1b, the second objects 1a not to be joined to the first object 2a, i.e., the non-target objects, are attracted by the attraction mechanism 12. This makes it possible to bring only the target object, which is the second object 1a to be joined to the first object 2a, into contact with the first object 2a (protruding toward the first object 2a).

[0037] Next, the position of the second object 1a, which is the target object protruded toward the first object 2a by the protrusion 112, relative to the first object 2a is measured by the measurement unit 22. Furthermore, the second object 1a and the first object 2a are positioned (positioning process is performed) based on the position of the second object 1a measured by the measurement unit 22. Specifically, the stage 21 holding the first object 2a relative to the second object 1a is driven so that the positional deviation between the place to be joined TP of the first object 2a and the joining surface BS1 of the second object 1a is reduced and the place to be joined TP and the joining surface BS1 coincide with each other.

[0038] The second object 1a and the first object 2a are positioned based on the position of the second object 1a measured by the measuring unit 22, and when the first object 2a and the second object 1a are brought into contact with each other, a bonding force is generated between them, and the second object 1a is bonded to the first object 2a. At this time, in a state in which the first object 2a and the second object 1a are in contact with each other, the peeling unit 111 further pushes the inner region of the second object 1a toward the first object 2a, as shown in FIG. 3(b). Specifically, in a state in which the second object 1a and the first object 2a are bonded to each other, the peeling unit 111 peels the second object 1a from the sheet 1b by changing the shape of the inner region to be pushed toward the first object 2a. In addition, in a state in which the second object 1a and the first object 2a are bonded to each other, the peeling unit 111 may peel the second object 1a from the sheet 1b by selectively pushing a plurality of regions in the inner region to be pushed toward the first object 2a toward the first object 2a. For example, the second object 1a can be peeled off from the outer region by pushing out a plurality of regions in the inner region of the second object 1a in order from the outside. In this manner, the second object 1a joined to the first object 2a is peeled off from the sheet 1b of the dicing frame DF.

[0039] In addition, in FIG. 3(b), in order to make it easier to understand the operation of the peeling unit 111, a state in which the first object 2a and the second object 1a are not joined (contacted) is shown, but in reality, the peeling unit 111 is operated in a state in which the first object 2a and the second object 1a are joined. In addition, in FIG. 3(a) and FIG. 3(b), one protruding mechanism 11 protrudes one second object 1a (one-to-one correspondence), but this is not limited to this. For example, it is also possible to configure the protruding mechanism 11 so that one protruding mechanism 11 protrudes two or more second objects 1a at the same time.

[0040] The joining operation for joining the second object 1a to the first object 2a will be described with reference to Fig. 4. As described above, the joining operation is performed by the control unit 3 comprehensively controlling each unit of the joining device BD.

[0041] In S1001, a dicing frame DF having a plurality of second objects 1a attached to a sheet 1b is carried into a bonding device BD. The dicing frame DF is held by a holder 13 in a state in which a bonding target location TP of the first object 2a faces a bonding surface BS of the second object 1a.

[0042] Once the dicing frame DF is held by the holding portion 13, it is advisable to expand the dicing frame DF (specifically, the sheet 1b to which the second object 1a is attached). If the dicing frame DF is not expanded, there is a possibility that the amount of protrusion will be insufficient when the protruding mechanism 11 protrudes the second object 1a toward the first object 2a. There is also a possibility that the second object 1a (non-target object) around the second object 1a protruding toward the first object 2a may be damaged. Basically, the dicing frame DF is often carried in an unexpanded state. However, when a dicing frame DF that has been expanded in advance is carried in, expansion in the bonding device BD is not necessary.

[0043] As an example of a pre-expanded dicing frame, there is a dicing frame called a grip ring or double ring. This dicing frame can achieve the same effect as an expansion by sandwiching the sheet between two rings, an inner ring and an outer ring, and tensioning it. Small pin ICs such as discrete semiconductors are often handled with a grip ring.

[0044] On the other hand, when a dicing frame that has not been expanded beforehand is carried in, it is preferable to precisely adjust the expansion amount. It is required that the expansion amount be changed severely according to the type of sheet and the type of chip (second object). For example, when the expansion amount is large for a thin chip, the chip peels off too much and the outer periphery of the chip warps. In such a case, for example, the outer shape of the chip cannot be recognized by the measuring unit 22 such as a camera, and it may be difficult to measure the position of the chip. Also, when the expansion amount is large for a small chip, the chip peels off too much and the chip peels off (detaches) from the sheet. On the other hand, when the expansion amount is small for a large or thick chip, the amount of the chip peeled off from the sheet is small, which may lead to a peeling error when the chip is peeled off from the sheet by the protruding mechanism 11, for example. Therefore, when a dicing frame that has not been expanded beforehand is carried in, it is preferable to adjust the expansion amount after understanding the characteristics of the sheet and the chip (second object).

[0045] If foreign matter adheres to the joining target location TP of the first object 2a or the joining surface BS of the second object 1a, the joining will be insufficient, so the inside (space) of the joining device BD is maintained at a high cleanliness level of about class 1. The dicing frame DF is also stored in a dedicated transport case that is highly airtight and maintained at a high cleanliness level in order to prevent the adhesion of foreign matter, and is then carried into the joining device BD. After the dicing frame DF is carried into the joining device BD, the dicing frame DF may be washed in the joining device BD to increase the cleanliness, as shown in FIG. 5(a). In addition to washing the dicing frame DF, the joining device BD also performs various pre-processing steps for joining the joining target location TP of the first object 2a and the joining surface BS of the second object 1a. For example, when the first object 2a and the second object 1a are joined using an adhesive, the adhesive is applied to the dicing frame DF as shown in FIG. 5(b). When the first object 2a and the second object 1a are bonded using hybrid bonding, a process is performed to activate the surface of the dicing frame DF by irradiating it with heat or light, as shown in Fig. 5(c). Since the bonding device BD needs to perform positioning (alignment) in a state free from disturbance, these pre-processing steps may be performed by a separate device outside the bonding device BD. Figs. 5(a), 5(b) and 5(c) are diagrams for explaining the pre-processing steps for bonding the first object 2a and the second object 1a.

[0046] It is preferable that the pretreatment for bonding the first object 2a and the second object 1a is performed before expanding the dicing frame DF. For example, if the dicing frame DF is washed after expanding the dicing frame DF, the second object 1a may peel off from the sheet 1b due to such washing. Also, in order to weaken the adhesive strength of the adhesive bonding the sheet 1b and the second object 1a, the dicing frame DF may be irradiated with UV light or the like in advance. In such a case, if the dicing frame DF is washed after the UV irradiation, the second object 1a may peel off from the sheet 1b due to such washing. Therefore, it is preferable to perform the treatment for weakening the adhesive strength of the adhesive, such as UV irradiation, after washing the dicing frame DF.

[0047] Returning to Fig. 4, in S1002, the protruding mechanism 11 protrudes the second object 1a to be joined to the first object 2a, i.e., the target object, from among the multiple second objects 1a attached to the sheet 1b of the dicing frame DF held by the holding unit 13. Note that before the protruding mechanism 11 protrudes the second object 1a, the sheet 1b (second object 1a) is positioned relative to the protruding mechanism 11 so that the target object is located below the protruding mechanism 11. To position the sheet 1b relative to the protruding mechanism 11, a driving unit 13a that drives the sheet 1b relative to the protruding mechanism 11, or a driving unit 11a that drives the protruding mechanism 11 relative to the sheet 1b, is used.

[0048] Here, in parallel with positioning the sheet 1b with respect to the protruding mechanism 11, it is preferable to make the protruding mechanism 11 and the target object of the second object 1a attached to the sheet 1b parallel (parallelism within an allowable range). Specifically, the target object, which is the second object 1a to be joined to the first object 2a, is observed, for example, by a measuring unit 22 including a camera, and the inclination of the protruding mechanism 11 or the holding unit 13 is adjusted based on the observation result, thereby making the parallelism between the protruding mechanism 11 and the target object within an allowable range. However, depending on the joining accuracy between the first object 2a and the second object 1a and the joining budget, the parallelism between the protruding mechanism 11 and the target object may be made to fall within an allowable range only by adjustments made at the assembly stage of the joining device BD.

[0049] After the target object, which is the second object 1a to be joined to the first object 2a, is positioned under the protruding mechanism 11, the target object is protruded by the protruding mechanism 11, and at this time, the suction mechanism 12 is also operated at the same time. Specifically, the suction mechanism 12 adsorbs and holds the second object 1a that is not to be joined to the first object 2a around the target object, that is, the non-target object. As a result, a clearance is formed between the target object, which is the second object 1a to be joined to the first object 2a, and the non-target object that is not to be joined to the first object 2a, and it becomes possible to easily protrude only the target object by the protruding mechanism 11. In this way, in this embodiment, the protruding mechanism 11 and the suction mechanism 12 are operated at the same time to protrude the target object, which is the second object 1a to be joined to the first object 2a.

[0050] As described above, the protruding mechanism 11 has a function of protruding the second object 1a (mainly the protruding portion 112) and a function of peeling the second object 1a from the sheet 1b (mainly the peeling portion 111). However, in this embodiment, in S1002, among the functions of the protruding mechanism 11, only the function of protruding the second object 1a is operated.

[0051] In S1003, in a state where the target object, which is the second object 1a to be joined to the first object 2a, is protruded, the measurement unit 22 measures the position of the target object (second object 1a) relative to (the joining target part TP of) the first object 2a. As described above, the measurement unit 22 is provided on the stage 21 that holds the first object 2a. Therefore, by driving the stage 21 so that the measurement unit 22 is positioned under the target object, which is the second object 1a to be joined to the first object 2a, it is possible to measure the position of the target object.

[0052] In this embodiment, in S1003, the position of the target object, which is the second object 1a to be joined to the first object 2a, is measured from the contrast difference between the target object (its outer periphery) obtained by detecting the outer shape of the target object and the periphery of the target object (the protruding portion 112 and the peeling portion 111). Therefore, it is preferable that the surfaces of the protruding portion 112 and the peeling portion 111 on the first object 2a side (the surfaces that push out the second object 1a via the sheet 1b), especially the area of ​​the surfaces outside the target object, are subjected to a surface treatment to increase the contrast difference.

[0053] Examples of surface treatments for increasing the contrast difference between the second object 1a (target object) and the periphery of the second object 1a include black chrome, matte black anodized aluminum, and Raydent (registered trademark). By using such surface treatments, the surfaces of the protruding portion 112 and the peeling portion 111 facing the first object 2a are blackened, making it easier for the measuring unit 22 to detect the outer shape of the second object 1a. However, if the surfaces of the protruding portion 112 and the peeling portion 111 facing the first object 2a are blackened but glossy, light is reflected by these surfaces, which hinders detection of the outer shape of the second object 1a. Therefore, it is particularly preferable to apply a surface treatment such as a matte finish to the surfaces of the protruding portion 112 and the peeling portion 111 facing the first object 2a to suppress light reflection.

[0054] In S1004, a target object, which is a second object 1a to be joined to the first object 2a, is joined to a joining target location TP of the first object 2a. Specifically, based on the position of the second object 1a measured in S1003, the first object 2a and the target object, which is a second object 1a to be joined to the first object 2a, are positioned. The positioning of the first object 2a and the target object is realized, for example, by driving the stage 21 holding the first object 2a so that the positional deviation between the joining target location of the first object 2a and the target object (the joining surface BS1 of the second object 1a) is reduced. At this time, in order to control the position of the stage 21 with high accuracy, it is preferable to drive the stage 21 while measuring the position of the stage 21 with the position measuring device 101. After the first object 2a and the target object are positioned, the target object is joined to the joining target location TP of the first object 2a. The first object 2a and the second object 1a are joined together by driving the stage 21 upward (in the +Z direction).

[0055] In S1005, the second object 1a bonded to the first object 2a, i.e., the target object, is peeled off from the sheet 1b by the protruding mechanism 11. Here, only the function of the protruding mechanism 11 to peel off the second object 1a from the sheet 1b is operated. For example, the peeling unit 111 forms a gap between the second object 1a and the sheet 1b, which serves as a starting point for peeling, and the stage 21 is driven downward (in the -Z direction), thereby realizing peeling of the second object 1a from the sheet 1b.

[0056] In S1006, it is determined whether or not a second object 1a (a second object 1a to be joined to a first object 2a) exists (remains) on the dicing frame DF, that is, whether or not the second object 1a joined to the first object 2a in S1005 is the final target object. If the second object 1a exists on the dicing frame DF, the process proceeds to S1002 in order to join the second object 1a to the first object 2a. On the other hand, if the second object 1a does not exist on the dicing frame DF, the joining operation is terminated. Note that even if the second object 1a does not exist on the dicing frame DF, it is also possible to continue the joining operation by carrying a new dicing frame DF into the joining device BD without stopping the joining operation.

[0057] In this manner, in this embodiment, before joining the first object 2a and the second object 1a, the position of the second object 1a relative to the first object 2a is measured with the second object 1a protruding toward the first object 2a, and the first object 2a and the second object 1a are positioned based on the measurement result. Therefore, positioning when joining the second object 1a to the first object 2a can be achieved with high accuracy. Also, the first object 2a and the second object 1a can be joined while maintaining high positioning accuracy (joining position accuracy).

[0058] <Second embodiment> Fig. 6 is a schematic diagram showing another configuration of a bonding apparatus BD according to one aspect of the present invention. In this embodiment, the bonding apparatus BD further includes a peeling mechanism 201 that peels off the second object 1a bonded to the first object 2a from the sheet 1b as shown in Fig. 6. The peeling mechanism 201 peels off the second object 1a from the sheet 1b by applying light (e.g., UV light) or heat to the attachment surface (adhesive surface) between the second object 1a and the sheet 1b.

[0059] The peeling mechanism 201 may be provided in place of the peeling unit 111 constituting a part of the protruding mechanism 11, or may be provided in addition to the peeling unit 111. Even when the peeling mechanism 201 is provided in place of the peeling unit 111, the protruding mechanism 11 is configured as a unit since it includes the protruding unit 112 for protruding the second object 1a toward the first object 2a.

[0060] The peeling mechanism 201 is disposed at a position where light or heat can be irradiated onto the bonding surface between the second object 1a and the sheet 1b. The peeling mechanism 201 may be disposed, for example, in the holder 13 that holds the dicing frame DF, or in the stage 21 that holds the first object 2a. The peeling mechanism 201 may be configured to be drivable to a position where light or heat can be irradiated onto the bonding surface between the second object 1a and the sheet 1b in a bonding operation for bonding the first object 2a to the second object 1a.

[0061] <Third embodiment> Next, a method for manufacturing an article (such as a semiconductor IC element, a liquid crystal display element, or a MEMS) using the above-mentioned bonding apparatus BD will be described. The article is manufactured by a process of preparing a first object, a process of preparing a second object, a process of manufacturing a bonded product by bonding the first object and the second object using the above-mentioned bonding apparatus BD (bonding method (bonding operation)), and a process of processing the bonded product in other well-known processes. The other well-known processes include probing, dicing, bonding, packaging, and the like. This article manufacturing method makes it possible to manufacture articles of higher quality than ever before.

[0062] The disclosure of the present specification includes the following joining apparatus, joining method, and method for manufacturing an article.

[0063] (Item 1) A joining device for joining a first object to a second object, comprising: a holding portion that holds the sheet to which the second object is attached; a protruding mechanism for protruding the second object toward the first object via the sheet held by the holding unit; a measuring unit configured to measure a position of the second object attached to the sheet held by the holding unit relative to the first object; a processing unit that performs processing for positioning the first object and the second object based on the position measured by the measurement unit in a state in which the second object is protruded toward the first object by the protrusion mechanism; and A joining device comprising:

[0064] (Item 2) 2. The joining apparatus according to item 1, wherein the state is a state in which the first object and the second object are separated from each other.

[0065] (Item 3) the second object is attached to the sheet via a surface of the second object opposite to a joining surface of the second object relative to a joining target portion of the first object; 3. The joining device according to item 1 or 2, wherein the holding section holds the sheet in a state in which the portion to be joined of the first object and the joining surface of the second object face each other.

[0066] (Item 4) 4. The joining apparatus according to item 3, wherein the processing section performs the processing so as to reduce a positional deviation between the joining target portion and the joining surface.

[0067] (Item 5) The protruding mechanism includes: a protruding portion for protruding the second object toward the first object; a peeling unit for peeling the second object joined to the first object from the sheet; 5. The joining device according to any one of items 1 to 4, comprising:

[0068] (Item 6) the protrusion pushes an outer circumferential region of the second object toward the first object via the sheet, 6. The bonding device according to item 5, wherein the peeling section pushes an inner region of the second object, which is located on the inner side than the outer circumferential region, toward the first object via the sheet.

[0069] (Item 7) The bonding device described in item 6, characterized in that, when the second object and the first object are bonded to each other, the peeling unit peels the second object from the sheet by changing the shape of the inner region that is pushed out toward the first object.

[0070] (Item 8) 7. The joining device according to item 6, wherein the peeling section peels off the second object from the sheet by selectively pushing a plurality of regions in the inner region toward the first object when the second object and the first object are joined together.

[0071] (Item 9) The joining device according to any one of items 1 to 8, further comprising a peeling mechanism that irradiates light onto an attachment surface between the second object and the sheet to peel off the second object joined to the first object from the sheet.

[0072] (Item 10) The joining device according to any one of items 1 to 8, further comprising a peeling mechanism that applies heat to an attachment surface between the second object and the sheet to peel the second object joined to the first object from the sheet.

[0073] (Item 11) A plurality of second objects are attached to the sheet, The joining device described in any one of items 1 to 10, further comprising a holding mechanism for holding non-target objects among the plurality of second objects attached to the sheet, excluding a target object that is to be protruded toward the first object by the protruding mechanism.

[0074] (Item 12) 12. The joining apparatus according to item 11, wherein the holding mechanism holds the non-target object so that a clearance is formed between the target object and the non-target object.

[0075] (Item 13) Further comprising a position measuring device for measuring a position of the first object, The joining device described in any one of items 1 to 12, characterized in that, in the processing, the processing unit controls a position of the first object relative to the second object based on the position of the first object measured by the position measuring device.

[0076] (Item 14) The joining device described in any one of items 1 to 13, characterized in that the holding unit includes a drive unit that drives the sheet relative to the protruding mechanism in a plane perpendicular to the direction in which the protruding mechanism protrudes the second object.

[0077] (Item 15) 14. The joining device according to any one of items 1 to 13, further comprising a drive unit that drives the protruding mechanism with respect to the sheet held by the holding unit in a plane perpendicular to the direction in which the protruding mechanism protrudes the second object.

[0078] (Item 16) A method for joining a first object to a second object, comprising the steps of: holding the sheet to which the second object is attached; causing the second object to protrude toward the first object through the held sheet; measuring a position of the second object attached to the held sheet relative to the first object in a state in which the second object is protruding toward the first object; positioning the first object and the second object based on the measured positions; A bonding method comprising the steps of:

[0079] (Item 17) Providing a first object; Providing a second object; A step of forming a bonded object by bonding the first object to the second object according to the bonding method described in item 16; treating the bonded article to produce an article; A method for producing an article, comprising the steps of:

[0080] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0081] BD: Bonding device 1a: First object 1b: Sheet 2a: Second object 3: Control unit 11: Protrusion mechanism 22: Measurement unit

Claims

1. A joining device for joining a first object and a second object, a holding portion that holds the sheet to which the second object is attached; a protruding mechanism that protrudes the second object toward the first object via the sheet held by the holding unit; a measurement unit that measures the position of the second object attached to the sheet held by the holding unit; a processing unit that performs processing to position the first object and the second object based on the position measured by the measurement unit in a state in which the second object is protruded toward the first object by the protrusion mechanism; and A joining device comprising:

2. The bonding apparatus according to claim 1 , wherein the state is a state in which the first object and the second object are spaced apart.

3. the second object is attached to the sheet via a surface of the second object opposite to a joining surface of the second object relative to a joining target portion of the first object, The joining device according to claim 1 , wherein the holding unit holds the sheet in a state in which the portion to be joined of the first object and the joining surface of the second object face each other.

4. The joining apparatus according to claim 3 , wherein the processing section performs the processing so as to reduce a positional deviation between the part to be joined and the joining surface.

5. The protruding mechanism includes: a protrusion for protruding the second object toward the first object; a peeling unit for peeling the second object joined to the first object from the sheet; The joining device according to claim 1 , further comprising:

6. the protrusion pushes the outer peripheral region of the second object toward the first object via the sheet; The bonding device according to claim 5 , wherein the peeling unit pushes an inner region of the second object, which is located inside the outer circumferential region, toward the first object via the sheet.

7. The joining device according to claim 6, characterized in that the peeling unit peels the second object from the sheet by changing the shape of the inner region that is pushed toward the first object when the second object and the first object are joined.

8. The joining device according to claim 6, characterized in that the peeling unit peels the second object from the sheet by selectively pushing multiple areas in the inner region toward the first object when the second object and the first object are joined.

9. The joining device according to claim 1, further comprising a peeling mechanism that irradiates light onto the bonding surface between the second object and the sheet to peel the second object joined to the first object from the sheet.

10. The joining device according to claim 1, further comprising a peeling mechanism that applies heat to the bonding surface between the second object and the sheet to peel the second object joined to the first object from the sheet.

11. a plurality of second objects are attached to the sheet; The joining device according to claim 1, further comprising a holding mechanism for holding non-target objects among the plurality of second objects attached to the sheet, excluding target objects that are to be protruded toward the first object by the protrusion mechanism.

12. The bonding apparatus according to claim 11 , wherein the holding mechanism holds the non-target object so that a clearance is formed between the target object and the non-target object.

13. a position measuring device for measuring the position of the first object; The joining apparatus according to claim 1 , wherein the processing unit controls the position of the first object relative to the second object based on the position of the first object measured by the position measuring device during the processing.

14. The joining device according to claim 1 , wherein the holding unit includes a drive unit that drives the sheet relative to the protruding mechanism in a plane perpendicular to a direction in which the protruding mechanism protrudes the second object.

15. The joining device according to claim 1, further comprising a drive unit that drives the protruding mechanism relative to the sheet held by the holding unit in a plane perpendicular to the direction in which the protruding mechanism protrudes the second object.

16. A joining device as described in claim 1, characterized in that the joining surface of the second object is processed for joining while the surface opposite to the joining surface of the second object is attached to the sheet.

17. A joining device as described in Claim 16, characterized in that the processing for joining includes any of cleaning the joining surfaces, applying adhesive to the joining surfaces, and activating the joining surfaces.

18. A joining method for joining a first object and a second object, comprising: holding the sheet to which the second object is attached; causing the second object to protrude toward the first object through the held sheet; measuring the position of the second object attached to the held sheet in a state in which the second object is protruding toward the first object; positioning the first object and the second object based on the measured positions; A bonding method comprising the steps of:

19. Providing a first object; Providing a second object; forming a bonded article by bonding the second object to the first object according to the bonding method of claim 18; treating the bonded material to produce an article; A method for manufacturing an article, comprising:

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