Liquid discharge substrate, liquid discharge head, and method for manufacturing liquid discharge substrate

Abstract

To firmly fix an elastic member.SOLUTION: A liquid discharge substrate comprises: a support substrate in which a first flow path is formed; a first substrate member in which a second flow path is formed; and a second substrate member in which a plurality of pressure chambers communicated with the second flow path and a plurality of discharge ports arranged in the pressure chambers to enable discharging of liquids stored in the pressure chamber are formed. A part of a wall surface of the second flow path is formed by a sheet-like elastic member stuck to a hollow part defined by the support substrate and the first substrate member. In a region of the elastic member corresponding to the second flow path, one end is joined between the support substrate and the first substrate member by a joining member, and the other end is joined to the support substrate in a state where the joining member is continuously stuck from a bottom surface of the elastic member to an inner peripheral surface of an opening formed in the elastic member.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a liquid ejection substrate, a liquid ejection head, and a method for manufacturing a liquid ejection substrate. [Background technology]

[0002] As an example of a liquid ejection head for ejecting liquid droplets, an inkjet head mounted on an inkjet recording device is known. The inkjet head is configured to eject ink droplets from an ejection port by applying pressure to ink in a pressure chamber by a drive unit.

[0003] Pressure fluctuations occur when ink droplets are ejected, and these pressure fluctuations may propagate to other pressure chambers through the liquid flow paths. In such cases, there is a risk of ejection defects due to so-called crosstalk. One method for reducing the effects of crosstalk is to use a damper to attenuate the pressure fluctuations.

[0004] Patent Document 1 discloses a liquid ejection substrate that includes a sheet-like elastic member having an area that functions as a damper. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2006-095725 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the configuration of Patent Document 1, the discharge port is also formed in the sheet-like elastic member, and the area that functions as a damper is relatively narrow. Here, it is possible to form a relatively large area that functions as a damper without forming a discharge port in the elastic member. However, in this case, it is required to firmly fix the elastic member having the damper function.

[0007] Therefore, an object of the technology disclosed herein is to provide a technology for firmly fixing an elastic member. [Means for solving the problem]

[0008] In order to achieve the above object, the liquid ejection substrate of the present disclosure is a liquid ejection substrate formed by laminating, via a bonding member, a support substrate on which a first flow path that is a liquid supply flow path is formed, a first substrate member on which a second flow path capable of accommodating liquid supplied from the first flow path is formed, and a second substrate member on which a plurality of pressure chambers communicating with the second flow path and a plurality of ejection ports arranged for each of the pressure chambers and capable of ejecting liquid accommodated in the pressure chambers are formed, the liquid ejection substrate being characterized in that a portion of a wall surface of the second flow path is formed by a sheet-like elastic member stretched in a hollow portion defined by the support substrate and the first substrate member, and in a region of the elastic member corresponding to the second flow path, one end is joined between the support substrate and the first substrate member by the bonding member, and the other end is joined to the support substrate in a state in which the bonding member is continuously attached from a bottom surface of the elastic member to an inner peripheral surface of an opening formed in the elastic member. Effect of the Invention

[0009] According to the technique of the present disclosure, the elastic member can be firmly fixed. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a schematic cross-sectional perspective view of a liquid ejection substrate according to an embodiment. [Diagram 2] FIG. 1 is a diagram showing the configuration of Patent Document 1. [Diagram 3] FIG. 4 is a diagram for explaining a bonding state of an elastic member. [Figure 4] FIG. 4 is a schematic enlarged view of the vicinity of a region that functions as a damper. [Diagram 5] FIG. 4 is a schematic diagram showing how a joining member fixes an elastic member in one embodiment. [Figure 6]5A to 5C are diagrams illustrating a manufacturing process of a liquid ejection substrate according to an embodiment. [Figure 7] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate. [Figure 8] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate. [Figure 9] FIG. 2 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment. [Figure 10] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate. [Figure 11] FIG. 2 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment. [Figure 12] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate. [Figure 13] FIG. 2 is a schematic cross-sectional perspective view of a liquid ejection substrate according to an embodiment. [Figure 14] FIG. 2 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment. [Figure 15] FIG. 2 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment. [Figure 16] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate. [Figure 17] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate. [Figure 18] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate. [Figure 19] FIG. 2 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment. [Figure 20] FIG. 2 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] [First embodiment] <Liquid discharge device> The liquid ejection device in this embodiment includes a liquid ejection head that performs recording on a recording medium while ejecting liquid. The liquid ejection head includes a housing having a liquid storage section capable of storing liquid, a liquid ejection substrate provided on the bottom surface of the housing, and an electrical connection section that sends power and control signals to the liquid ejection substrate. Below, a first liquid ejection substrate 100 that can be used as the liquid ejection substrate in this embodiment will be described.

[0012] <Description of the First Liquid Ejection Substrate 100> FIG. 1 is a schematic cross-sectional perspective view of a first liquid ejection substrate 100 in this embodiment. In each drawing in this specification, the X direction indicates the width direction of the first liquid ejection substrate 100. The Y direction indicates the depth direction of the first liquid ejection substrate 100. The Z direction indicates the height direction of the first liquid ejection substrate 100. The surface of the first liquid ejection substrate 100 facing the +Z direction is appropriately referred to as the "top surface". The surface of the first liquid ejection substrate 100 facing the -Z direction is appropriately referred to as the "bottom surface". The X direction, Y direction, and Z direction are each perpendicular to each other.

[0013] 1, the first liquid ejection substrate 100 in this embodiment includes a first support substrate 102 that supports an elastic member 101 from its bottom surface, and a second support substrate 103 that supports the elastic member 101 from its top surface. A layer of a first bonding member 104 is formed between the top surface of the first support substrate 102 and the bottom surface of the elastic member 101. A layer of a second bonding member 105 is formed between the top surface of the elastic member 101 and the bottom surface of the second support substrate 103. In this manner, the elastic member 101 is sandwiched and fixed between the first support substrate 102 and the second support substrate 103 via the first bonding member 104 and the second bonding member 105.

[0014] The second support substrate 103 includes a first substrate member 106 having a second bonding member 105 attached to its bottom surface. The first substrate member 106 has an accommodation space 107 formed therein, recessed from the top surface to the bottom surface. A vibration plate 108 is bonded to the top surface of the first substrate member 106 so as to cover the accommodation space 107. A piezoelectric element 109 is disposed on the bottom surface of the vibration plate 108. The piezoelectric element 109 is accommodated in the accommodation space 107.

[0015] The second support substrate 103 further includes a second substrate member 110 bonded to the upper surface of the vibration plate 108. An outlet 111 for discharging liquid as droplets is formed on the upper surface of the second substrate member 110. An example of the first support substrate 102, the first substrate member 106, and the second substrate member 110 is, for example, a silicon substrate. The first support substrate 102 has a recess 112 recessed from the upper surface to the bottom surface of the first support substrate 102. Furthermore, at a position different from the recess 112 of the first support substrate 102, a first flow path 113 is formed which penetrates the first support substrate 102, the elastic member 101, and a part of the bottom surface side of the first substrate member 106.

[0016] The elastic member 101 has a first opening 114 for connecting the first flow path 113 from the first support substrate 102 to the first substrate member 106. One example of a method for forming the first opening 114 in the elastic member 101 is dry etching. The elastic member 101 contains a resin. One example of the resin contained in the elastic member 101 is polyimide or polyamide.

[0017] Moreover, the bottom surface of the elastic member 101 is joined to the upper surface of the first support substrate 102 so as to cover the recess 112. With this configuration, when an external force is applied to the elastic member 101 due to a pressure fluctuation or the like, which will be described later, the elastic member 101 can elastically deform toward the recess 112. Of course, the elastic member 101 can also return to its original shape from the elastically deformed shape due to an elastic restoring force.

[0018] In the first substrate member 106, a plurality of second flow paths 115 communicating with the first opening 114 and a third flow path 116 communicating individually with each of the second flow paths 115 are formed. In the first substrate member 106, a plurality of storage spaces 107 with a vibration plate 108 as a top surface are arranged in the Y direction. Each of the storage spaces 107 accommodates a plurality of piezoelectric elements 109 arranged on the bottom surface of the vibration plate 108.

[0019] A diaphragm opening 117 is formed in the diaphragm 108, which connects the third flow path 116 from the first substrate member 106 to the second substrate member 110. A plurality of pressure chambers 118 are formed in the second substrate member 110, with the diaphragm 108 as the bottom surface. In the second substrate member 110, a plurality of discharge ports 111 which connect with the respective pressure chambers 118 are arranged in the Y direction.

[0020] According to this configuration, when liquid is ejected from the first liquid ejection substrate 100, the liquid is supplied from the first flow path 113 through the first opening 114 to the second flow path 115. The liquid supplied to the second flow path 115 passes through the third flow path 116 and the vibration plate opening 117, and is supplied to the pressure chamber 118.

[0021] The piezoelectric element 109 elastically deforms the vibration plate 108 in response to an electric signal received from the liquid ejection device main body (not shown), thereby changing the volume inside the pressure chamber 118. As a result, a pressure fluctuation occurs in the pressure chamber 118, and the liquid inside the pressure chamber 118 is pressurized, causing droplets (e.g., ink droplets) to be ejected in the +Z direction from the ejection port 111. Note that the liquid that is not ejected from the ejection port 111 is collected.

[0022] When pressure fluctuations occur, the elastic member 101, which is one wall surface of the second flow path 115, elastically deforms toward the recess 112, thereby damping the pressure fluctuations. In other words, the entire second flow path 115 functions as a damper. With this configuration, it is possible to mitigate pressure fluctuations for the ejection ports other than the ejection port where the ejection operation has been performed, and reduce the effects of crosstalk.

[0023] FIG. 2 is a diagram showing the configuration of Patent Document 1 for comparison with this embodiment. In Patent Document 1, the nozzle plate 201 in which the ejection port 204 is formed is made of an elastic member, and the second region 203 communicating with the ejection port 204 functions as a damper. However, the second region 203 functioning as a damper in the configuration of Patent Document 1 has a smaller volume than the second flow path 115 (see FIG. 1) functioning as a damper in the configuration of this embodiment. For this reason, in the configuration of Patent Document 1, it is difficult to sufficiently suppress the influence of crosstalk in a situation where high density of the ejection ports is required. In other words, according to the configuration of this embodiment, it is possible to further promote high density of the ejection ports than before while suppressing the influence of crosstalk.

[0024] However, when a relatively large damping area is formed using a sheet-like elastic member as in this embodiment, it is necessary to firmly fix the elastic member which deforms due to pressure fluctuations.

[0025] Fig. 3 is a diagram for explaining the bonding state of the elastic member 101. Fig. 3 corresponds to a diagram of the first liquid ejection substrate 100 viewed from the +Y direction in Fig. 1.

[0026] As shown in Fig. 3, the first liquid ejection substrate 100 is formed by laminating a first support substrate 102, a first substrate member 106, and a second substrate member 110 with a bonding member interposed therebetween. A first flow path 113, which is a liquid supply flow path, is formed in the first support substrate 102. A second flow path 115 capable of containing liquid supplied from the first flow path 113 is formed in the first substrate member 106 included in the second support substrate 103. A plurality of pressure chambers 118 communicating with the second flow path 115 are formed in the second substrate member 110 included in the second support substrate 103. A plurality of ejection ports 111, which are arranged for each of the pressure chambers 118 and capable of ejecting the liquid contained in the pressure chambers 118, are formed in the second substrate member 110 included in the second support substrate 103. A portion of the wall surface of the second flow path 115 is formed by a sheet-like elastic member 101 stretched in the hollow portion defined by the first support substrate 102 and the first substrate member 106 (i.e., the space formed by the recess 112 and the second flow path 115).

[0027] FIG. 4 is a schematic enlarged view of the vicinity of the region functioning as a damper shown in FIG. 3. Here, for convenience, the elastic member 101 is divided into a first region 202 bonded to the first support substrate 102 and the first substrate member 106, a second region 203 that is a part of the second flow path 115, and a third region 301 bonded to the first support substrate 102. Of these regions, in the third region 301, the upper surface side of the elastic member 101 is not supported by a member. Therefore, when the elastic member 101 elastically deforms, there is a risk that the elastic member 101 will peel off from the first support substrate 102. If the elastic member 101 peels off from the first support substrate 102, the function of the elastic member 101 as a damper will be reduced. In view of the above situation, in this embodiment, a characteristic bonding method is applied to the third region 301.

[0028] FIG. 5 is a schematic diagram showing how the elastic member 101 is fixed in this embodiment.

[0029] Fig. 5(a) is a schematic cross-sectional plan view of the first liquid ejection substrate 100 in this embodiment. As shown in Fig. 5(a), one or more annular second openings 501 are formed in the third region 301 in this embodiment. One example of a method for forming the second openings 501 in the elastic member 101 is dry etching. The position of the second openings 501 is not limited as long as it is within the third region 301. In the third region 301, the first bonding member 104 passes through the second openings 501 and spreads out onto the upper surface of the elastic member 101.

[0030] FIG. 5(b) is a cross-sectional view taken along line Vb-Vb in FIG. 5(a).

[0031] 5(b), the elastic member 101 has openings, that is, a first opening 114 and a second opening 501. The first opening 114 communicates the first flow path 113 with the second flow path 115 when the first support substrate 102 and the second support substrate 103 are bonded together.

[0032] The elastic member 101 has a first region 202 that is supported by being sandwiched between the first supporting substrate 102 and the first substrate member 106. The elastic member 101 also has a second region 203 that covers the recess 112, is not supported by the first supporting substrate 102 and the first substrate member 106, and is capable of elastically deforming toward the recess 112 when subjected to an external force. The second region 203 functions as a damper region for attenuating pressure fluctuations that occur when liquid is ejected.

[0033] Furthermore, the elastic member 101 has a third region 301 whose bottom surface is supported by the first support substrate 102 and whose top surface is not supported. In the third region 301 in this embodiment, the first bonding member 104 applied to the top surface of the first support substrate 102 passes through a second opening 501, which is a through hole formed in the bonding surface with the first support substrate 102, and spreads over the top surface of the elastic member 101.

[0034] As a result, in the third region 301, the first bonding members 104 adhere to the bottom surface of the elastic member 101, the inner circumferential surface of the second opening 501, and the upper surface of the elastic member 101. In other words, while the first bonding members 104 spread over the upper surface of the elastic member 101 after flowing into the second opening 501, the first bonding members 104 fix the elastic member 101 like an anchor. In this example, the anchor effect of the first bonding members 104 is promoted by forming a plurality of second openings 501 in the third region 301.

[0035] That is, in the region of the elastic member 101 that functions as a damper, one end (first region 202) is joined between the first support substrate 102 and the first substrate member 106 by the first bonding member 104 and the second bonding member 105. Meanwhile, the other end (third region 301) is joined to the first support substrate 102 with the first bonding member 104 continuously adhering from the bottom surface of the elastic member 101 to the inner circumferential surface of the second opening 501 and protruding onto the upper surface.

[0036] According to such a configuration, the bonding area between the first support substrate 102 and the elastic member 101 can be made relatively large. This makes it possible to improve the bonding strength between the first support substrate 102 and the elastic member 101 in the third region 301 compared to the conventional case. Therefore, according to the liquid ejection substrate of the present disclosure, the elastic member 101 can be bonded to the first support substrate 102 more firmly than in a state in which the elastic member 101 is simply supported by the first support substrate 102 with the first bonding member 104 sandwiched therebetween as shown in FIG. 4. As a result, even if the elastic member 101 in the second region 203 deforms unevenly due to the ejection operation, it is possible to prevent the elastic member 101 from peeling off from the substrate member.

[0037] Furthermore, since excess first bonding members 104 can be accommodated in the second opening 501, it is also possible to adjust the amount of the first bonding members 104 that protrude outside the third region 301. This prevents the first bonding members 104 from adhering to the second region 203 and impairing the damper function of the second region 203.

[0038] <Jointing materials> The first bonding member 104 and the second bonding member 105 will be described below. When it is not necessary to particularly distinguish between the first bonding member 104 and the second bonding member 105, they will be simply referred to as "bonding members." When it is not necessary to particularly distinguish between the first support substrate 102, the first substrate member 106, and the second substrate member 110, they will be simply referred to as "flow path substrates."

[0039] As the joining member, organic or inorganic materials can be used. Depending on the material used for the flow path substrate, deterioration at high temperatures may be an issue, so organic materials that allow joining at relatively low temperatures are preferred because they increase the degree of freedom of the material for the flow path substrate. Although adhesive materials can be used as the organic joining member, materials that harden when joined are preferred because they are easier to increase the joining strength. Thermoplastic materials are preferred because they are easy to handle and harden when the temperature drops after softening and adhering due to heat. Materials that harden due to a chemical reaction after joining are preferred because they are easier to increase the joining strength. Thermosetting materials are preferred because they are easy to control the hardening reaction.

[0040] The material of the joining member may be epoxy, acrylic, urethane, silicone, benzocyclobutene, polyimide, polyamide, polyamideimide, cyanoacrylate, phenol, melamine, styrene, cyclized rubber, or a mixture of these, etc. Among these, resins mainly composed of epoxy, silicone, benzocyclobutene, or polyimide, which have excellent chemical resistance, are preferred.

[0041] The type of epoxy is not particularly limited, and may be, for example, a bisphenol type epoxy, a novolac type epoxy, an epoxy polyol type epoxy, an alicyclic epoxy, a glycidyl type epoxy, a urethane modified epoxy, a chelate modified epoxy, a rubber modified epoxy, or a mixture thereof.

[0042] Silicone is not particularly limited. For example, condensation type silicone or addition type silicone can be used. Among them, addition type silicone, which has less cure shrinkage, is preferable. For example, epoxy modified silicone, acrylic modified silicone, methyl silicone, phenyl silicone, methylphenyl silicone, alkyd modified silicone, polyester modified silicone, or a mixture thereof can be used.

[0043] The polyimide is not particularly limited. A polyimide having thermoplasticity may be used in the form of a film. A polyamic acid may be used as a precursor. It is preferable to use a precursor and then harden the precursor after bonding, since this makes it easier to increase the bonding strength.

[0044] A filler may be added to the joining member. For example, a fibrous filler is preferable because it has a relatively high effect of suppressing defects such as breakage of the joining member. Examples of the fibrous filler include carbon fiber, metal fiber, glass fiber, and cellulose fiber.

[0045] The flow path substrate may have a functional layer to enhance chemical resistance or to enhance the bonding strength with the bonding member. The functional layer may be disposed on a part of the flow path substrate. The functional layer may be disposed on the entire surface of the flow path substrate. A coupling agent may be disposed between the first support substrate 102 and the elastic member 101. By selecting a coupling agent suited to the substrate material or functional layer material and the bonding member, a covalent bond can be formed, which has the effect of enhancing the bonding strength. Of course, a coupling agent may be disposed between the elastic member 101 and the first substrate member 106.

[0046] <Method of Manufacturing Liquid Discharge Substrate> FIG. 6 is a diagram for explaining an example of a manufacturing process for the first liquid ejection substrate 100 in this embodiment.

[0047] FIG. 6(a) is a diagram showing the first step. The first support substrate 102 has a recess 112 and a first flow path 113 formed therein. At this point, the first flow path 113 is a through hole penetrating the first support substrate 102. As shown in FIG. 6(a), in the first step, the first bonding member 104 before hardening is applied to the surface of the first support substrate 102 on which the recess 112 is formed, in an area where the recess 112 and the first flow path 113 are not formed. A method for applying the first bonding member 104 before hardening is used as a method for applying a general resin member. For example, when applying the first bonding member 104 to the entire surface of the first support substrate 102, the first bonding member 104 is applied by spin coating, spraying, or the like. When applying the first bonding member 104 to a part of the first support substrate 102, the first bonding member 104 is applied by a dispenser, screen printing, or by transferring a bonding member made into a dry film, or the like.

[0048] Fig. 6(b) is a diagram showing the second step. As shown in Fig. 6(b), in the second step, the sheet-like elastic member 101 is placed on the first bonding member 104, and the first support substrate 102 and the elastic member 101 are bonded by the first bonding member 104. When the first support substrate 102 and the elastic member 101 are bonded, an appropriate temperature, pressure, or time is selected according to the structure or thickness of the first support substrate 102, or the material of the first bonding member 104, etc. Since the first bonding member 104 may be affected by oxygen in the air, etc., it is preferable that the first support substrate 102 and the elastic member 101 are bonded under reduced pressure.

[0049] FIG. 6(c) is a diagram showing the third step. As shown in FIG. 6(c), in the third step, the first opening 114 and the second opening 501 are formed in the elastic member 101. One example of a method for forming the first opening 114 and the second opening 501 is a method of forming them by dry etching using a mask material (not shown). When the elastic member 101 is a photosensitive resin, a method of patterning by exposure to light may be used. Since the second opening 501 is formed in the third region 301, a part of the first bonding member 104 before hardening flows into the inside of the second opening 501. Furthermore, inside the second opening 501, a part of the first bonding member 104 before hardening flows to the upper surface of the elastic member 101 due to capillary action. On the upper surface of the elastic member 101, a part of the first bonding member 104 before hardening that has passed through the second opening 501 flows out in a spreading manner.

[0050] FIG. 6(d) is a diagram showing the fourth step. As shown in FIG. 6(d), in the fourth step, the first bonding members 104 are hardened. In the fourth step, the first bonding members 104 are hardened using a chemical reaction, which has the effect of increasing the bonding strength. In order to harden the first bonding members 104, the temperature, time, atmosphere, or the like can be selected according to the material of the first bonding members 104. In addition, as an example of a method for adjusting the flow of the first bonding members 104, there is a method of irradiating the first support substrate 102 with electromagnetic waves or the like to rapidly heat the first bonding members 104. As another example, there is a method of hardening the first bonding members 104 by irradiating the first support substrate 102 with electromagnetic waves or the like that penetrate the first support substrate 102.

[0051] Fig. 6(e) is a diagram showing the fifth step. As shown in Fig. 6(e), in the fifth step, the first substrate member 106 having the second bonding member 105 applied to the inner periphery of the bottom surface is bonded to the elastic member 101. In the fifth step, appropriate temperature, pressure, and time are selected depending on the structure or thickness of the first substrate member 106, or the material of the second bonding member 105, etc. Since the second bonding member 105 may be affected by oxygen in the air, etc., it is preferable to bond under reduced pressure.

[0052] FIG. 6(f) is a diagram showing the sixth step. As shown in FIG. 6(f), in the sixth step, the second bonding member 105 is hardened. In the sixth step, the second bonding member 105 is hardened using a chemical reaction, thereby obtaining an effect of increasing the bonding strength. In order to harden the second bonding member 105, the temperature, time, atmosphere, or the like can be selected according to the material of the second bonding member 105. In addition, as an example of a method for adjusting the flow of the second bonding member 105, there is a method of irradiating the first substrate member 106 with electromagnetic waves or the like to rapidly heat the first substrate member 106. As another example, there is a method of hardening the second bonding member 105 by irradiating the first substrate member 106 with electromagnetic waves or the like through the first substrate member 106.

[0053] [Example] Hereinafter, an embodiment of the manufacturing method shown in Fig. 6(a) to Fig. 6(f) will be described. Hereinafter, the description will be given with reference to Fig. 6(a) to Fig. 6(f), but only one technically preferred example will be described. In particular, the technical scope of the present disclosure is not limited thereto.

[0054] As shown in FIG. 6(a), a 625 μm silicon substrate was prepared as the first support substrate 102. A positive resist was exposed to light on both sides of the silicon substrate, and developed. Then, a recess 112 with a depth of 300 μm and a width of 300 μm and a first flow path 113 with a width of 200 μm were formed by dry etching. Then, the first bonding member 104 before hardening with a thickness of 2 μm was made into a dry film and transferred to the first support substrate 102. In this embodiment, a thermosetting resin was applied as the first bonding member 104.

[0055] Next, as shown in Fig. 6(b), the first support substrate 102 and the elastic member 101 were bonded via the uncured first bonding member 104. For example, a polyimide film having a thickness of 3 µm was used as the elastic member 101. The elastic member 101 was formed by applying pressure by a lamination method. The lamination temperature was set to a temperature at which the uncured first bonding member 104 would not harden.

[0056] 6(c), a mask pattern (not shown) was formed on the elastic member 101. After that, the first opening 114 and the second opening 501 were formed by a generally known reactive dry etching method using a mixed gas of CF4 gas (tetrafluoromethane gas) and oxygen gas. By forming the second opening 501 in the third region 301, a part of the first bonding member 104 before hardening flowed into the inside of the second opening 501. Furthermore, a part of the first bonding member 104 before hardening that flowed and passed through the inside of the second opening 501 flowed out so as to spread on the upper surface of the elastic member 101.

[0057] 6(d), the uncured first bonding members 104 were cured by performing a heat treatment at 250° C. in an oven with a nitrogen atmosphere.

[0058] Next, as shown in Fig. 6(e), a first substrate member 106 coated with the uncured second bonding member 105 was bonded to the elastic member 101. For example, a silicon substrate was used as the first substrate member 106. In this manner, the first substrate member 106 and the second substrate member 110 as shown in Fig. 5(b) were produced. In addition, a thermosetting epoxy resin having a thickness of 40 µm was applied as the second bonding member 105 by a dispense method.

[0059] 6(f), the second bonding members 105 were hardened by performing a heat treatment at 160° C. in an oven with a nitrogen atmosphere.

[0060] The first liquid ejection substrate 100 manufactured as described above was attached to a liquid ejection head, and the liquid ejection head was used to perform an ejection operation for a predetermined period of time. During this time, stable ejection operation was possible for the predetermined period of time. Furthermore, no peeling was observed in the elastic member 101 of the first liquid ejection substrate 100 after the ejection operation was completed.

[0061] <Summary> As described above, according to the first liquid ejection substrate 100 of the present embodiment, a larger-capacity damper region than the conventional one can be provided below the ejection ports arranged at high density. In addition, the first bonding member 104 is continuously attached to the bottom surface of the elastic member 101 functioning as a damper, the inner peripheral surface of the second opening 501, and the upper surface of the elastic member 101. According to such a configuration, at least two surfaces (three surfaces in the present embodiment) among the multiple surfaces of the elastic member 101 are fixed by the first bonding member 104. That is, the elastic member 101 is fixed from three directions (+Z direction, -X direction, and -Z direction). Therefore, the bonding strength between the first support substrate 102 and the elastic member 101 in the third region 301 can be improved compared to the conventional one.

[0062] Therefore, according to the liquid ejection substrate of the present disclosure, it is possible to prevent the elastic member from peeling off from the substrate member. In other words, according to the technique of the present disclosure, it is possible to firmly fix the elastic member.

[0063] Furthermore, the excess first joint member 104 is accommodated inside the second opening 501. This makes it possible to fix the elastic member 101 while adjusting the amount by which the first joint member 104 protrudes outside the third region 301. As a result, it is possible to further increase the density of the ejection ports compared to conventional methods while suppressing the effects of crosstalk.

[0064] [Modification 1 of the first embodiment] FIG. 7 is a diagram showing a first liquid ejection substrate 100 in this modified example.

[0065] 7, in the third region 301, the first bonding members 104 flow onto the inner circumferential surface of the second opening 501. However, the first bonding members 104 are not attached to the upper surface of the elastic member 101.

[0066] Even with this configuration, excess first joint member 104 can be accommodated inside second opening 501.

[0067] [Modification 2 of the first embodiment] FIG. 8 is a diagram showing a first liquid ejection substrate 100 in this modified example.

[0068] 8, the elastic member 101 of this modification has one substantially L-shaped second opening 501 that is continuously formed along the inside of the third region 301. That is, the second opening 501 in this modification is an opening that extends along the bonding surface with the first support substrate 102 (see FIG. 1) in the third region 301.

[0069] According to such a configuration, the bonding area between the elastic member 101 and the first bonding member 104 (see FIG. 1) is larger than that in the example of FIG. 5(a). Therefore, according to the elastic member 101 in this modification, peeling from the first support substrate 102 (see FIG. 1) can be further suppressed.

[0070] [Second embodiment] Hereinafter, a second embodiment of the technology of the present disclosure will be described with reference to the drawings. In the following description, the same reference numerals and names are used for configurations similar to or corresponding to those of the first embodiment, and the description will be omitted as appropriate, and differences will be mainly described. This embodiment differs from the first embodiment in that the second opening is not formed. This embodiment aims to prevent the elastic member from peeling off the first support substrate with a simpler configuration.

[0071] FIG. 9 is a schematic cross-sectional front view of a second liquid ejection substrate 900 in this embodiment.

[0072] 9, in this embodiment, the first bonding member 104 is continuously attached to the bottom surface of the elastic member 101, the inner peripheral surface of the first opening 114, and the upper surface of the elastic member 101. In this embodiment, the second opening is not formed in the elastic member 101. With this configuration, the elastic member 101 is fixed from three directions even without the second opening.

[0073] Therefore, according to the second liquid ejection substrate 900, with a simpler configuration than the first embodiment, it is possible to prevent the elastic member 101 from peeling off from the first support substrate 102. In other words, according to the liquid ejection substrate of this embodiment, with a simpler configuration than the first embodiment, it is possible to firmly fix the elastic member.

[0074] [Modification of the second embodiment] FIG. 10 is a diagram showing a second liquid ejection substrate 900 in this modified example.

[0075] As shown in FIG. 10, in this example, the inner wall of the first flow path 113 and the inner diameter of the first opening 114 are the same size, and when the first support substrate 102 and the elastic member 101 are bonded, the first flow path 113 and the first opening 114 are connected to each other.

[0076] According to this configuration, the first joint member 104 fixes the bottom surface of the elastic member 101 and the inner circumferential surface of the first opening 114. However, the first joint member 104 does not fix the upper surface of the elastic member 101. Therefore, according to the second liquid ejection substrate 900 in this modified example, the elastic member 101 can be fixed with a smaller amount than the example in FIG.

[0077] [Third embodiment] Hereinafter, the third embodiment of the technology of the present disclosure will be described with reference to the drawings. In the following description, the same reference numerals and names are used for configurations similar to or corresponding to the first or second embodiment, and the description is omitted as appropriate, and the differences are mainly described. This embodiment differs from the first embodiment in that the second opening 501 is not formed.

[0078] FIG. 11 is a schematic cross-sectional front view of a third liquid ejection substrate 1100 in this embodiment.

[0079] As shown in FIG. 11 , the elastic member 101 does not have a second opening. The inner diameter of the first opening 114 is larger than the inner diameter of the first flow path 113. A part of the first opening 114 is located in the third region 301. The first joint member 104 fixes the bottom surface of the elastic member 101, the inner peripheral surface of the first opening 114, and the upper surface of the elastic member 101. In this example, when the first joint member 104 fixes the inner peripheral surface of the first opening 114, the first joint member 104 does not protrude outside the third region 301.

[0080] According to such a configuration, it is possible to fix the elastic member 101 from three directions without narrowing the inner diameter of the first flow path 113 as in the example of Fig. 9. In other words, according to the liquid ejection substrate of this embodiment, it is possible to fix the elastic member more firmly.

[0081] [Modification of the third embodiment] FIG. 12 is a diagram showing a third liquid ejection substrate 1100 in this modified example.

[0082] 12, the inner diameter of the first opening 114 is larger than the inner diameter of the first flow path 113. The first bonding members 104 fix the inner circumferential surface of the first opening 114, which is formed to be larger than the inner diameter of the first flow path 113. However, the first bonding members 104 do not fix the upper surface of the elastic member 101. That is, the amount of the first bonding members 104 in this example is smaller than that in the example of FIG. 11. Even with such a configuration, the elastic member 101 can be fixed.

[0083] Therefore, according to the third liquid ejection substrate 1100 of this modified example, the elastic member 101 can be fixed with a smaller amount than in the example of FIG.

[0084] [Fourth embodiment] A fourth embodiment of the technology of the present disclosure will be described below with reference to Figs. 13 to 15. In the following description, the same reference numerals and names are used for configurations similar to or corresponding to the above embodiments, and descriptions are omitted as appropriate, and differences are mainly described. This embodiment differs from the above embodiments in that a filter portion 1301 is formed in the elastic member 101. The purpose of this embodiment is to provide the elastic member 101 with both a filter function and a damper function.

[0085] FIG. 13 is a schematic cross-sectional perspective view of a fourth liquid ejection substrate 1300 in this embodiment.

[0086] 14 is a schematic cross-sectional front view of a fourth liquid ejection substrate 1300 in this embodiment. Note that the function of the filter portion 1301 will be mainly described here, and the bonding between the first support substrate 102 and the elastic member 101 will be described later with reference to FIG.

[0087] As shown in FIG. 13 and FIG. 14, the elastic member 101 of this embodiment is formed with a filter portion 1301. The filter portion 1301 is formed at a position where the liquid flowing from the first flow path 113 communicates with the second flow path 115 in a state where the first support substrate 102 and the first substrate member 106 are joined with the elastic member 101 sandwiched therebetween. With this configuration, it is possible to prevent foreign matter larger than the opening of the filter portion 1301 from flowing from the first flow path 113 to the second flow path 115. That is, with the fourth liquid ejection substrate 1300 of this embodiment, it is possible to provide the elastic member 101 with a filter function and a damper function. The shape of the opening in the filter portion 1301 is not limited to a circle. The shape of the opening in the filter portion 1301 does not have to be a circle as long as it can prevent foreign matter from flowing from the first flow path 113 to the second flow path 115. For example, the shape of the opening in the filter portion 1301 may be a slit.

[0088] [Modification 1 of the fourth embodiment] FIG. 15 is a schematic cross-sectional front view of a fourth liquid ejection substrate 1300 in this modified example.

[0089] 15, the first joint member 104 in this modification fixes the bottom surface of the elastic member 101 and the inner circumferential surface of the opening in the filter portion 1301. With this configuration, the elastic member 101 is fixed from two directions (the +Z direction and the -X direction). Since a part of the opening in the filter portion 1301 is blocked by the first joint member 104, the amount of liquid flowing from the first flow path 113 to the second flow path 115 is reduced compared to the case where the entire opening in the filter portion 1301 is not blocked by the first joint member 104.

[0090] This reduces the impact when the liquid hits the second region 203 in the second flow path 115. Therefore, according to the fourth liquid ejection substrate 1300 in this embodiment, the elastic member 101 can have both a filter function and a damper function.

[0091] [Modification 2 of the fourth embodiment] FIG. 16 is a diagram showing a fourth liquid ejection substrate 1300 in this modified example.

[0092] 16, when the first bonding member 104 adheres to the opening of the filter portion 1301, a meniscus may be formed of the first bonding member 104. In this case, the meniscus of the first bonding member 104 is formed in a very small gap, and the first bonding member 104 is in a state of bridging the opening of the filter portion 1301.

[0093] With this configuration, it is possible to further reduce the amount of liquid flowing from the first flow path 113 to the second flow path 115. Therefore, with the fourth liquid ejection substrate 1300 in this modified example, peeling of the elastic member 101 from the first support substrate 102 is suppressed in the third region compared to the example in FIG.

[0094] [Modification 3 of the fourth embodiment] FIG. 17 is a diagram showing a fourth liquid ejection substrate 1300 in this modified example.

[0095] 17, the first bonding member 104 in this modification is continuously attached to the bottom surface of the elastic member 101, the inner circumferential surface of the opening in the filter portion 1301, and the top surface of the elastic member 101. With this configuration, the elastic member 101 is fixed from three directions in the third region 301. Therefore, with the fourth liquid ejection substrate 1300 in this modification, it is possible to prevent the elastic member 101 from peeling off from the first support substrate 102 more effectively than in the example of FIG.

[0096] [Modification 4 of the fourth embodiment] FIG. 18 is a diagram showing a fourth liquid ejection substrate 1300 in this modified example.

[0097] 18, the first bonding member 104 in this modification continuously fixes the bottom surface of the elastic member 101, the inner circumferential surface of the opening in the filter portion 1301, and the upper surface of the elastic member 101. Furthermore, a meniscus of the first bonding member 104 is formed so as to completely block at least one of the multiple openings formed in the filter portion 1301. In this example, the first bonding member 104 is also attached to a part of the inner circumferential surface of the first flow path 113.

[0098] According to such a configuration, the bonding area between the first support substrate 102 and the elastic member 101 is further increased in the vicinity of the third region 301. Therefore, according to the liquid ejection substrate of this modified example, peeling of the elastic member 101 can be suppressed more effectively than in the example of FIG.

[0099] [Fifth embodiment] Hereinafter, a fifth embodiment of the technology of the present disclosure will be described with reference to the drawings. In the following description, the same reference numerals and names are used for configurations similar to or corresponding to the above embodiments, and the description will be omitted as appropriate, and differences will be mainly described. In this embodiment, the purpose is to selectively use a joining member with excellent joining properties and a joining member with corrosion resistance by liquid.

[0100] Fig. 19 is a schematic front cross-sectional view of a fifth liquid ejection substrate 1900 in this embodiment. Fig. 19(a) is an enlarged view of a third region 301 of the fifth liquid ejection substrate 1900 in this embodiment.

[0101] 19, in the third region 301 in this embodiment, the second bonding member 105 is continuously attached from the upper surface of the elastic member 101 to the inner circumferential surface of the second opening 501. The first bonding member 104 is applied to the upper surface of the first support substrate 102. However, the first bonding member 104 is applied at a position where it is not attached to the inner circumferential surface of the second opening 501.

[0102] According to this configuration, the second joint member 105 communicates from the top surface of the elastic member 101 to the first joint member 104 located below (in the -Z direction) the bottom surface of the elastic member 101. Therefore, in the third region 301, the elastic member 101 is fixed so as to be sandwiched between the first joint member 104 and the second joint member 105.

[0103] Moreover, the first bonding member 104 has relatively excellent bonding properties, and therefore provides good bonding to the first support substrate 102. And the second bonding member 105 has resistance to corrosion caused by liquid, and therefore can suppress corrosion of the bonded portion between the elastic member 101 and the first support substrate 102 caused by liquid.

[0104] According to the fifth liquid ejection substrate 1900 of this embodiment, for example, a material having excellent bonding properties with the first support substrate 102 can be used as the first bonding member 104, and a material having excellent corrosion resistance to liquids can be selected as the second bonding member, making it possible to use two types of bonding members.

[0105] [Modification 1 of the fifth embodiment] FIG. 19(b) is a diagram showing a fifth liquid ejection substrate 1900 in this modified example.

[0106] 19(b), in the third region 301 in this modification, the second bonding members 105 are continuously attached from the upper surface of the elastic member 101 through the second opening 501 to the upper surface of the first support substrate 102. In this modification, a layer of the first bonding members 104 is not formed in the portion through which the second bonding members 105 pass.

[0107] With this configuration as well, it is possible to selectively use a joining member having excellent joining properties and a joining member having resistance to corrosion caused by liquid.

[0108] [Modification 2 of the fifth embodiment] FIG. 19C is a diagram showing a fifth liquid ejection substrate 1900 in this modified example.

[0109] 19(c), in the third region 301 in this modification, the second bonding members 105 are continuously attached to the upper surface of the elastic member 101, the inner circumferential surface of the second opening 501, and the first support substrate 102. In this modification, a layer of the first bonding members 104 is not formed in the portion through which the second bonding members 105 pass.

[0110] According to such a configuration, the second bonding member 105 can fix the elastic member 101 like an anchor. Therefore, according to the fifth liquid ejection substrate 1900 in this modified example, peeling of the elastic member 101 can be suppressed more than in the examples of Figures 19(a) and 19(b).

[0111] [Sixth embodiment] Hereinafter, a sixth embodiment of the technology of the present disclosure will be described with reference to the drawings. In the following description, the same reference numerals and names are used for configurations similar to or corresponding to the above embodiments, and the description will be omitted as appropriate, and differences will be mainly described. In this embodiment, the purpose is to further suppress peeling of the elastic member 101.

[0112] Figure 20 is a schematic front cross-sectional view of a sixth liquid ejection substrate 2000 in this embodiment. Figure 20(a) is a schematic enlarged view of a third region 301 in this embodiment.

[0113] 20(a), the first support substrate 102 in this embodiment has a first groove 2001 to which a first bonding member 104 is attached. Note that a plurality of first grooves 2001 may be formed.

[0114] With this configuration, when the first bonding member 104 is applied, it is possible to prevent the first bonding member 104 from protruding into the second region 203. In other words, the protruding first bonding member 104 is prevented from impeding the damper function, and the elastic member 101 is also prevented from peeling off from the first support substrate 102. Therefore, with the sixth liquid ejection substrate 2000 of this embodiment, it is possible to prevent the elastic member 101 from peeling off more effectively than in the example of FIG.

[0115] [Modification of the sixth embodiment] Fig. 20(b) is a diagram showing a sixth liquid ejection substrate 2000 in this modified example. As shown in Fig. 20(b), a second opening 501 is formed in the elastic member 101 in this modified example. The first support substrate 102 in this modified example has a second groove 2002 to which a second bonding member 105 is attached. It is to be noted that a plurality of second grooves 2002 may be formed.

[0116] According to this configuration, in the third region 301 of this modification, when the second bonding member 105 is applied to the upper surface of the elastic member 101, the second bonding member 105 communicates from the upper surface of the elastic member 101 to the inside of the second groove 2002. Therefore, the second bonding member 105 can fix the elastic member 101 like an anchor. Therefore, according to the sixth liquid ejection substrate 2000 of this modification, it is possible to prevent the elastic member 101 from peeling off.

[0117] [Other embodiments] The first to sixth embodiments may be implemented in appropriate combinations.

[0118] In the above embodiment, the first support substrate 102, the first substrate member 106, and the second substrate member 110 are separate members, but they do not have to be separate members. For example, the first support substrate 102, the first substrate member 106, and the second substrate member 110 may be included in a single substrate.

[0119] In the above embodiment, dry etching has been given as an example of a method for forming the first opening 114 and the second opening 501 in the elastic member 101. As another example, when the elastic member 101 contains a photosensitive resin, the first opening 114 and the second opening 501 may be formed by patterning through exposure to light.

[0120] 6(e), the second supporting substrate 103 having the second bonding member 105 applied to its bottom surface is bonded to the elastic member 101. As another example of the fifth step, the bottom surface of the first substrate member 106 having no second bonding member 105 applied thereto is bonded to the top surface of the elastic member 101 having the second bonding member 105 applied thereto.

[0121] In the above embodiment, a piezoelectric method using a piezoelectric element is given as an example of a driving means for applying pressure to the ink in the pressure chamber. Other examples of the driving means for applying pressure to the ink in the pressure chamber include a method using electrostatic force, a method using a heating element, etc.

[0122] The technology of the present disclosure includes the following configurations or methods.

[0123] [Configuration 1] A support substrate in which a first flow path that is a liquid supply flow path is formed; a first substrate member having a second flow path formed therein capable of accommodating liquid supplied from the first flow path; a second substrate member in which a plurality of pressure chambers communicating with the second flow path and a plurality of ejection ports arranged for each of the pressure chambers and capable of ejecting liquid contained in the pressure chambers are formed; a liquid ejection substrate in which the liquid ejection substrate is laminated via a bonding member, a portion of a wall surface of the second flow path is formed by a sheet-like elastic member stretched in a hollow portion defined by the support substrate and the first substrate member, In a region of the elastic member corresponding to the second flow path, one end portion is joined between the support substrate and the first substrate member by the joining member, and the other end portion is joined to the support substrate in a state in which the joining member is continuously attached from a bottom surface of the elastic member to an inner peripheral surface of an opening portion formed in the elastic member. A liquid ejection substrate comprising:

[0124] [Configuration 2] 2. The liquid ejection substrate according to configuration 1, wherein an inner circumferential surface of the opening is exposed to the first flow path.

[0125] [Configuration 3] A liquid ejection substrate as described in configuration 1 or 2, wherein at the one end, the elastic member is joined to the support substrate via a first bonding member and to the first substrate member via a second bonding member different from the first bonding member.

[0126] [Configuration 4] 4. The liquid ejection substrate according to any one of configurations 1 to 3, wherein the opening is a through hole formed in a surface to be joined to the support substrate.

[0127] [Configuration 5] 5. The liquid ejection substrate according to configuration 4, wherein the opening is continuous with the first flow path and has an inner diameter equal to or larger than an inner diameter of the first flow path.

[0128] [Configuration 6] A liquid ejection substrate as described in configuration 5, wherein the inner diameter of the opening is larger than the inner diameter of the first flow path, and the bonding member is attached to the inner surface of the opening without protruding into the inside of the first flow path.

[0129] [Configuration 7] 7. The liquid ejection substrate according to configuration 6, wherein the joining member is continuously attached to a bottom surface of the elastic member, an inner peripheral surface of the opening, and an upper surface of the elastic member.

[0130] [Configuration 8] 5. The liquid ejection substrate according to configuration 4, wherein the joining member flows into the through hole.

[0131] [Configuration 9] 9. The liquid ejection substrate according to configuration 8, wherein the through holes are arranged in a plurality along a surface to be joined to the support substrate.

[0132] [Configuration 10] 10. The liquid ejection substrate according to configuration 8 or 9, wherein the through hole is an opening extending along a bonding surface with the support substrate.

[0133] [Configuration 11] A liquid ejection substrate described in any one of configurations 1 to 10, wherein the elastic member extends from a region corresponding to the second flow path to a region corresponding to the first flow path, and the opening is an opening of a filter formed in the region corresponding to the first flow path.

[0134] [Configuration 12] 12. The liquid ejection substrate according to claim 11, wherein the joining member covers a portion of the opening of the filter.

[0135] [Configuration 13] 13. The liquid ejection substrate according to any one of configurations 1 to 12, wherein the bonding member flows into a groove formed in the support substrate in the vicinity of the other end portion.

[0136] [Configuration 14] 14. The liquid ejection substrate according to any one of configurations 11 to 13, wherein the bonding member flows into a groove formed in the support substrate.

[0137] [Configuration 15] The liquid ejection substrate according to any one of configurations 1 to 3, wherein the joining member includes a first joining member joined to the support substrate in the vicinity of the other end, and a second joining member joined to the first joining member and continuously attached from the bottom surface of the elastic member to the cross section.

[0138] [Configuration 16] 16. The liquid ejection substrate according to claim 15, wherein the support substrate has a second groove to which the second bonding member is attached.

[0139] [Configuration 17] 17. The liquid ejection substrate according to any one of configurations 1 to 16, wherein each of the plurality of pressure chambers has a driving unit that varies the pressure in the pressure chamber.

[0140] [Configuration 18] A liquid ejection substrate according to any one of configurations 1 to 17; a housing capable of containing a liquid to be supplied to the first flow path; and electrical connections for providing power and control signals to the liquid ejection substrate. A liquid ejection head comprising:

[0141] [Method 19] forming a through hole and a recess in a support substrate; applying a bonding material to a surface of the support substrate on which the recess is formed and to an area on which the recess and the through hole are not formed; placing a sheet-shaped elastic member on the joining member; forming an opening in the elastic member; causing the joining material to flow onto an inner circumferential surface of the opening; hardening the joining member; a step of bonding a second support substrate to an inner peripheral portion of a surface of the elastic member opposite to a surface to which the support substrate is bonded; A method for manufacturing a liquid ejection substrate, comprising:

Claims

1. a support substrate in which a first flow path that is a liquid supply flow path is formed; a first substrate member having a second flow path formed therein that can accommodate the liquid supplied from the first flow path; a second substrate member formed with a plurality of pressure chambers communicating with the second flow path and a plurality of ejection ports arranged for each of the pressure chambers and capable of ejecting liquid contained in the pressure chambers; are laminated via a bonding member, a portion of a wall surface of the second flow path is formed by a sheet-like elastic member stretched in a hollow portion defined by the support substrate and the first substrate member, In a region of the elastic member corresponding to the second flow path, one end is joined between the support substrate and the first substrate member by the joining member, and the other end is joined to the support substrate in a state in which the joining member is continuously attached from the joining surface between the elastic member and the support substrate to an inner circumferential surface of a through hole formed in the elastic member. A liquid ejection substrate characterized by:

2. The liquid ejection substrate according to claim 1 , wherein an inner circumferential surface of the through hole is exposed to the first flow path.

3. 3. A liquid ejection substrate as described in claim 1 or 2, wherein at one end, the elastic member is joined to the support substrate via a first joining member and to the first substrate member via a second joining member different from the first joining member.

4. The liquid ejection substrate according to claim 1 , wherein the through-hole is continuous with the first flow path and has an inner diameter equal to or larger than an inner diameter of the first flow path.

5. 5. The liquid ejection substrate according to claim 4, wherein the inner diameter of the through hole is larger than the inner diameter of the first flow path, and the joining member is attached to the inner surface of the through hole without protruding into the inside of the first flow path.

6. The liquid ejection substrate according to claim 5 , wherein the joining member is continuously attached to a bottom surface of the elastic member, an inner peripheral surface of the through hole, and an upper surface of the elastic member.

7. The liquid ejection substrate according to claim 1 , wherein a plurality of the through holes are arranged along the bonding surface between the elastic member and the support substrate.

8. The liquid ejection substrate according to claim 1 , wherein one of the through holes extends along the bonding surface between the elastic member and the support substrate.

9. 3. The liquid ejection substrate according to claim 1, wherein the elastic member extends from a region corresponding to the second flow path to a region corresponding to the first flow path, and the through hole forms part of a filter formed in the region corresponding to the first flow path.

10. The liquid ejection substrate according to claim 9 , wherein the joining member closes the through-hole that constitutes the filter.

11. 3. The liquid ejection substrate according to claim 1, wherein the bonding member flows into a groove formed in the support substrate in the vicinity of the other end.

12. The liquid ejection substrate according to claim 9 , wherein the bonding member flows into a groove formed in the support substrate.

13. 3. The liquid ejection substrate according to claim 1, wherein the joining member includes a first joining member joined to the support substrate near the other end, and a second joining member joined to the first joining member and attached continuously from the bottom surface of the elastic member to the cross section.

14. The liquid ejection substrate according to claim 13 , wherein the support substrate has a second groove to which the second bonding member is attached.

15. 3. The liquid ejection substrate according to claim 1, wherein each of the plurality of pressure chambers has a driving means for varying the pressure in the pressure chamber.

16. The liquid ejection substrate according to claim 1 or 2; a housing capable of containing a liquid to be supplied to the first flow path; and electrical connections for providing power and control signals to the liquid ejection substrate. A liquid ejection head comprising:

17. forming a through hole and a recess in a support substrate; applying a bonding material to a surface of the support substrate on which the recess is formed and to an area on which the recess and the through hole are not formed; placing a sheet-shaped elastic member on the joining member; forming a through hole in the elastic member; causing the joining material to flow along an inner circumferential surface of the through hole; hardening the joining member; a step of bonding a second support substrate to an inner peripheral portion of a surface of the elastic member opposite to a surface to which the support substrate is bonded; A method for manufacturing a liquid ejection substrate, comprising:

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