Lead bonding and packaging equipment of sensor and lead bonding and packaging method of lead bonding and packaging equipment

Abstract

The invention provides a lead bonding and packaging device and a lead bonding and packaging method for a key process for packaging a deep cavity lead of an immersion type miniature liquid pressure sensor. The lead bonding packaging equipment comprises a rack, a movement mechanism mounting plate, an X-axis movement mechanism, a Y-axis movement mechanism, a first Z-axis movement mechanism and a second Z-axis movement mechanism, the movement mechanism mounting plate, the X-axis movement mechanism, the Y-axis movement mechanism, the first Z-axis movement mechanism and the second Z-axis movement mechanism are all mounted on the rack, a clamping mechanism is mounted on the X-axis movement mechanism or the Y-axis movement mechanism, and a visual microscopic mechanism is mounted on the first Z-axis movement mechanism. And a chopper positioning mechanism is mounted on the second Z-axis movement mechanism. According to the technical scheme provided by the invention, the alignment accuracy and stability in the wire leading process can be ensured, the yield and consistency of deep cavity bonding are improved, manual intervention and operation errors are reduced, automation of the wire bonding process is realized, the bonding precision and stability are improved, and the method has relatively high practicability and popularization value.

Description

[Technical Field]

[0001] This invention relates to the field of micro-sensor and chip packaging technology, and in particular to a wire bonding packaging device and a wire bonding packaging method for an immersion micro liquid pressure sensor. [Background Technology]

[0002] Miniature liquid pressure sensors, as high-precision measuring devices, are widely used in fields such as medical diagnostics, aerospace, and precision industry, where there are strict requirements for sensing accuracy and size. The packaging structure of these sensors involves the lead connections between the chip and external circuitry. Typically, a chip with a glass ring structure is used for packaging, and through-holes are provided on the glass ring for lead connections.

[0003] In immersion-type direct-measurement pressure sensors, changes in liquid pressure are accurately sensed through a flat diaphragm cup bottom pressure-bearing structure. However, this structural design presents challenges in deep-cavity wire bonding. This process involves drawing multiple bonding wires from a cylindrical cavity with a small diameter and a large depth, requiring high positive bonding strength and ensuring that the bonding wires do not interfere with each other. It demands high-level technical skill. Currently, this type of deep-cavity wire bonding operation is mostly performed manually by skilled workers using specialized equipment. This approach suffers from several significant drawbacks: large positioning errors, poor operational consistency, high dependence on worker skill, and low efficiency. It also struggles to meet the requirements of large-scale production and high reliability, as well as the needs for sensor miniaturization and performance improvements.

[0004] Deep cavity wire bonding is crucial not only for the research and manufacturing of miniature liquid pressure sensors but also frequently required in some MEMS microsensors and chip packaging. Therefore, developing efficient and stable automated deep cavity wire bonding technology is particularly important. Consequently, it is necessary to develop an automated deep cavity wire bonding device based on a vision recognition system and an automatic positioning mechanism to improve wire quality, processing efficiency, and adaptability to complex sensor packaging structures. [Summary of the Invention]

[0005] The purpose of this invention is to provide a wire bonding and packaging device and method for a sensor, which can ensure the alignment accuracy and stability of the wire bonding process, improve the yield and consistency of deep cavity bonding, reduce manual intervention and operational errors, realize the automation of the wire bonding process, improve the bonding accuracy and stability, and has high practicality and promotion value.

[0006] To achieve the above-mentioned objectives, the present invention provides a wire bonding and packaging device for a sensor, wherein the wire bonding and packaging device includes a frame, a motion mechanism mounting plate mounted on the frame, an X-axis motion mechanism, a Y-axis motion mechanism, a first Z-axis motion mechanism, and a second Z-axis motion mechanism. A clamping mechanism is mounted on the X-axis motion mechanism or the Y-axis motion mechanism, a visual microscopy mechanism is mounted on the first Z-axis motion mechanism, and a cutting tool positioning mechanism is mounted on the second Z-axis motion mechanism.

[0007] As a further improvement of one embodiment of the present invention, the clamping mechanism includes a worktable fixed seat disposed on an X-axis motion mechanism or a Y-axis motion mechanism, a worktable disposed on the worktable fixed seat, and a clamp disposed on the worktable.

[0008] As a further improvement of one embodiment of the present invention, the clamping mechanism further includes a heating device disposed on the worktable, the heating device being used to control the temperature of the wire bonded component during bonding.

[0009] As a further improvement of one embodiment of the present invention, the X-axis motion mechanism is disposed on the motion mechanism mounting plate, and the Y-axis motion mechanism is disposed on the X-axis motion mechanism.

[0010] As a further improvement of one embodiment of the present invention, the visual microscopy mechanism includes a Z-axis motion mechanism mounting plate for mounting the first Z-axis motion mechanism, a camera mounting plate mounted on the first Z-axis motion mechanism, a camera, a telecentric lens, and a point light source, wherein the point light source is mounted on the telecentric lens, and the Z-axis motion mechanism mounting plate is disposed on the frame.

[0011] As a further improvement of one embodiment of the present invention, the chopping knife positioning mechanism includes a chopping knife assembly and a wire feeding assembly, wherein the chopping knife assembly is mounted on the second Z-axis motion mechanism.

[0012] As a further improvement of one embodiment of the present invention, the component to be bonded has a first bonding surface and a second bonding surface, and the cleaving blades of the cleaving blade assembly are bonded between the first bonding surface and the second bonding surface respectively to complete the wire bonding.

[0013] As a further improvement of one embodiment of the present invention, the wire feeding assembly includes a spool base plate, wire support plates and a connecting frame both disposed on the spool base plate, a limiting rod and a wire feeding swing rod disposed on the connecting frame.

[0014] To achieve another objective mentioned above, the present invention also provides a wire bonding and packaging method based on the wire bonding and packaging apparatus described in any of the above technical solutions, wherein the wire bonding and packaging method includes the following steps:

[0015] (1) Clamp the workpiece to be bonded and fix the workpiece to be bonded on the clamping mechanism;

[0016] (2) Identify and record the positions of at least two global reference points located outside the deep cavity structure of the component to be bonded by the visual microscopy mechanism, and identify and record the positions of multiple target bonding points located inside the deep cavity structure of the component to be bonded; calculate the preset spatial mapping relationship between the target bonding points and the global reference points based on the recorded positions of the global reference points and the positions of the target bonding points.

[0017] (3) Identify and locate the corresponding global reference point on the visual microscopy mechanism to determine the current actual pose of the component to be bonded in the coordinate system of the motion system; for the first positioning of the component to be bonded, adjust the relative position of the component to be bonded and the visual microscopy mechanism to achieve accurate positioning of the first bonding point on the component to be bonded and obtain the specific coordinates of the first positioning; then perform a second positioning of the component to be bonded to obtain the specific coordinates of the second bonding point on the component to be bonded.

[0018] (4) After obtaining the specific coordinates of the first and second bonding points on the component to be bonded, based on the current actual pose of the component to be bonded and the preset spatial mapping relationship stored in step (2), calculate the target bonding coordinates of multiple target bonding points inside the deep cavity in the current motion system coordinate system; adjust the relative position of the component to be bonded and the chopping blade in the chopping blade positioning mechanism to complete the bonding of the first bonding point and the second bonding point respectively, and complete the control of the arc through the X-axis motion mechanism and the Y-axis motion mechanism.

[0019] As a further improvement of one embodiment of the present invention, in step (3), the timing pose of the component to be bonded is first determined by the reference point in the visual microscopic mechanism, and the first and second bonding points of the component to be bonded are precisely positioned by the X-axis motion mechanism and the Y-axis motion mechanism respectively. After obtaining the specific coordinates, the wire bonding and arc control are completed by the X-axis motion mechanism, the Y-axis motion mechanism and the second Z-axis motion mechanism.

[0020] Compared with existing technologies, this invention has the following advantages: This wire bonding and packaging equipment optimizes the structure and function of traditional gold wire bonding machines by adding a visual microscopy mechanism and X-axis and Y-axis motion mechanisms to achieve automated and precise wire bonding operations in deep cavity structures. The visual microscopy system is used to capture the solder joint positions of the components to be bonded, such as chips, in real time. Combined with the high-precision X-axis and Y-axis motion mechanisms, it performs intelligent positioning, accurately locating different bonding points on different planes of the components to be bonded, ensuring the alignment accuracy and stability of the wire bonding process. This allows the cleaver to move to the bonding point positions for deep cavity wire bonding. Therefore, this wire bonding and packaging equipment is suitable for the packaging needs of miniature liquid sensors with cavity structures, significantly improving the yield and consistency of deep cavity bonding, reducing manual intervention and operational errors, and possessing high practicality and promotional value. Furthermore, this wire bonding and packaging equipment has a simple structure, is easy to operate, can be mass-produced, has high working efficiency, and can guarantee the consistency of bonding quality. [Attached Image Description]

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0022] Figure 1 A schematic diagram of a wire bonding and packaging device for a sensor provided for a specific embodiment of the present invention;

[0023] Figure 2 for Figure 1 Schematic diagram of the X-axis and Y-axis motion mechanism and clamping mechanism in the middle lead bonding packaging equipment;

[0024] Figure 3 for Figure 1 A schematic diagram of the wedge positioning mechanism in a wire bonding packaging device;

[0025] Figure 4 yes Figure 3 An enlarged schematic diagram of the chopping blade in the chopping blade positioning mechanism;

[0026] Figure 5 yes Figure 1 A schematic diagram of the vision microscopy mechanism in a wire bonding packaging device;

[0027] Figure 6 yes Figure 1 A schematic diagram of the components to be bonded by the wire bonding packaging equipment;

[0028] Figure 7 for Figure 1 A schematic diagram of the wire feeding assembly in a wire bonding packaging device.

Detailed Implementation Methods

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0030] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0031] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0034] Please see Figures 1 to 7As shown, the first embodiment of the present invention provides a wire bonding packaging device for a sensor. This specific embodiment relates to the key process of deep cavity wire bonding for pressure sensor packaging, and particularly to the key process of deep cavity wire bonding for immersion liquid pressure sensor packaging. Of course, the technical solution of this wire bonding packaging device can also be used for other sensors, as long as wire bonding is involved. The wire bonding packaging device includes a frame 7, a motion mechanism mounting plate 11 mounted on the frame 7, an X-axis motion mechanism 12, a Y-axis motion mechanism 13, a first Z-axis motion mechanism 53, and a second Z-axis motion mechanism. A clamping mechanism 2 is mounted on the X-axis motion mechanism 12 or the Y-axis motion mechanism 13, a visual microscopy mechanism is mounted on the first Z-axis motion mechanism 53, and a cutting tool positioning mechanism is mounted on the second Z-axis motion mechanism.

[0035] Specifically, the X-axis motion mechanism 12 is an X-axis sliding platform that is slidably mounted on the frame 7 along the X-axis. The Y-axis motion mechanism 13 is a Y-axis sliding platform that is slidably arranged along the Y-axis. The second Z-axis motion mechanism includes a Z-axis motion motor 34.

[0036] The clamping mechanism 2 includes a worktable fixed base 21 mounted on the X-axis motion mechanism 12 or the Y-axis motion mechanism 13, a worktable 22 mounted on the worktable fixed base 21, and a clamp 23 mounted on the worktable 22.

[0037] The X-axis motion mechanism 12 adjusts the position of the worktable 22 in the X direction, and the Y-axis motion mechanism 13 adjusts the position of the worktable 22 in the Y direction. Thus, the fixture 23 on the worktable 22 fixes the workpiece 6 to be bonded in a certain position so as to better complete the wire bonding process.

[0038] The clamping mechanism 2 also includes a heating device disposed on the worktable 22. The heating device is used to control the temperature of the workpiece 6 during wire bonding, thereby controlling the temperature of the workpiece 6 to a suitable range during the wire bonding process.

[0039] Specifically, the X-axis motion mechanism 12 is mounted on the motion mechanism mounting plate 11, and the Y-axis motion mechanism 13 is mounted on the X-axis motion mechanism 12.

[0040] The visual microscopy mechanism includes a Z-axis motion mechanism mounting plate 52 for mounting the first Z-axis motion mechanism 53, a camera 55 mounting plate 54 mounted on the first Z-axis motion mechanism 53, a camera 55, a telecentric lens 56, and a point light source 57, with the point light source 57 mounted on the telecentric lens 56, and the Z-axis motion mechanism mounting plate 52 disposed on the frame 7.

[0041] Furthermore, the camera 55 is a CCD camera 55, and the camera 55 and the telecentric lens 56 are located above the clamping mechanism 2.

[0042] The visual microscopy mechanism also includes an adapter 51, and the Z-axis motion mechanism mounting plate 52 is mounted on the frame 7 via the adapter 51.

[0043] The chopping knife positioning mechanism includes a chopping knife assembly 3 and a line feeding assembly 4. The chopping knife assembly 3 is mounted on the second Z-axis motion mechanism.

[0044] Furthermore, the cleaving assembly 3 includes a ignition rod 32, an amplitude transformer 33, and a cleaving blade 31 located at the end of the amplitude transformer 33. A transducer 35 is also provided on the amplitude transformer 33, with the transducer 35 and the cleaving blade 31 positioned at opposite ends of the amplitude transformer 33. During wire bonding, the Z-axis position of the cleaving assembly 3 is adjusted by the movement of the Z-axis motion motor 34 to adjust the height of the cleaving blade 31. The ignition rod 32 melts the gold wire 4a passing through the cleaving blade 31 into a gold ball, thus better bonding it to the solder joint. The amplitude transformer 33 concentrates ultrasonic energy on the cleaving blade 31 for better bonding. The cleaving assembly 3 also includes a wire clamping piece or wire clamp spring 36, and a gemstone bead 4b is provided at the end of the gold wire 4a.

[0045] Specifically, in this embodiment, the blade of the chopping knife 31 is divided into three sections along its axial direction from the front end to the rear end. The chopping knife 31 includes a working part 31a disposed at the front end of the blade, a clearance part 31b connected to the working part 31a, and a mounting part 31c connected to the clearance part 31b. Specifically, the clearance part 31b is integrally formed with the working part 31a, and the mounting part 31c is integrally formed with the clearance part 31b.

[0046] The working part 31a has a minimum outer diameter, which is designed to perform precise bonding operations on the wires within the deep cavity of the component 6 to be bonded. The outer diameter of the clearance part 31b is larger than that of the working part 31a, but smaller than the inner diameter of the target deep cavity, so that the clearance part 31b can guide the working part 31a to the target pad position at the bottom of the cavity without interfering with the inner wall of the deep cavity. The outer diameter of the mounting part 31c is larger than that of the clearance part 31b, which is used to securely mount the wedge 31 on the wire bonding packaging equipment and provide the necessary rigid support for the overall structure.

[0047] The function of the wire feeding assembly 4 is to install the gold wire 4a and feed the wire. During the welding process, the wire feeding assembly 4 tensions and relaxes the gold wire 4a in a timely and accurate manner to facilitate the stable formation of the wire arc and the uniform size of the gold balls. Specifically, the wire feeding assembly 4 includes a wire spool base plate 41, wire support plates 43 and a connecting frame 44, and a limiting rod 45 and a wire feeding swing rod 41, all of which are disposed on the wire spool base plate 41.

[0048] Furthermore, the wire feeding assembly 4 also includes a wire guide tube 46, a wire guide ring 47, and a wire support plate 48, all disposed on the spool base plate 41. The gold wire 4a is guided from the outside of the wire guide ring 47 into the wire guide tube 46. The gold wire 4a, drawn out from the wire guide tube 46, flows downward along the wire support plate 48, with the wire support piece 43 and the wire support plate 48 facing each other. The gold wire 4a passes through the gap between the wire support piece 43 and the wire support plate 48. A fixing member 49 is provided on the spool base plate 41, and the wire support piece 43 is disposed on the fixing member 49. Alternatively, the wire support piece 43 can also be a pressure glass sheet.

[0049] The wire feeding assembly 4 also includes a wire feeding electromagnet interface plate 41a disposed on the spool base plate 41 and a wire feeding electromagnet 41b disposed on the connecting frame 44. The connecting frame 44 is also provided with a starting position adjusting screw 44a that abuts against the wire feeding lever 41, and the wire feeding lever 41 is rotatably mounted on the connecting frame 44. Figure 5 Point A indicates the position of the wire-feeding lever 41 when tensioned, and point B indicates the position of the wire-feeding lever 41 when relaxed. The swing amplitude L is the horizontal distance between the tensioned and relaxed states of the wire-feeding lever 41. By adjusting the swing amplitude L, the wire-feeding length is made equal to the length of a single line. The specific adjustment method for the swing amplitude L is as follows: First, adjust the starting position adjusting screw 44a so that the wire-feeding lever 41 just straightens the gold wire 4a at the second welding aiming point. Then, adjust the swing amplitude L by adjusting the limit rod 45. Specifically, adjusting the limit rod 45 upwards decreases the swing amplitude L and shortens the wire-feeding length; conversely, adjusting it downwards increases the swing amplitude. Through the above adjustments, the wire-feeding length meets the requirements.

[0050] After the wire feeding assembly 4 places the gold wire 4a in the predetermined position, the ignition rod 32 melts the gold wire 4a passing through the cleaver 31 into a gold ball, and the amplitude transformer 33 concentrates the ultrasonic energy on the cleaver 31, thereby better completing the bonding.

[0051] Specifically, in this embodiment, the component to be bonded 6 includes a sensor chip 61 and a PCB board 62. The component to be bonded 6 has a first bonding surface 61a and a second bonding surface 62a. The chopping blade 31 of the chopping blade assembly 3 is bonded between the first bonding surface 61a and the second bonding surface 62a respectively to complete the wire bonding. The first bonding surface 61a is located on the sensor chip 61, and the second bonding surface 62a is located on the PCB board 62.

[0052] Furthermore, the first bonding surface 61a has a first bonding point 61b, and the second bonding surface 62a has a second bonding point 62b.

[0053] During wire bonding, the camera 55 and telecentric lens 56 are moved up and down by the first Z-axis motion mechanism 53 to achieve focusing and capture images of the two bonding planes at different heights of the deep cavity wire. The X-axis motion mechanism 12 and Y-axis motion mechanism 13 are controlled by the signal from the microscopic vision mechanism to adjust the position of the worktable 22 in the X and Y directions, thereby achieving precise positioning of the cleaver 31 on the solder joint. At the same time, the X-axis motion mechanism 12, Y-axis motion mechanism 13 and Z-axis motion motor 34 work together to complete the arc control of the cleaver 31 on the gold wire 4a.

[0054] The present invention also provides a wire bonding and packaging method for a wire bonding and packaging device, wherein the wire bonding and packaging method includes the following steps:

[0055] (1) Clamp the part to be bonded 6 and fix the part to be bonded 6 on the clamping mechanism 2;

[0056] (2) Identify and record the positions of at least two global reference points located outside the deep cavity structure of the component to be bonded 6 using the visual microscopy mechanism, and identify and record the positions of multiple target bonding points located inside the deep cavity structure of the component to be bonded 6; calculate the preset spatial mapping relationship between the target bonding points and the global reference points based on the recorded positions of the global reference points and the positions of the target bonding points.

[0057] (3) Identify and locate the corresponding global reference point on the visual microscopy mechanism to determine the current actual pose of the component to be bonded 6 in the motion system coordinate system; for the first positioning of the component to be bonded 6, adjust the relative position of the component to be bonded 6 and the visual microscopy mechanism to achieve accurate positioning of the first bonding point 61b on the component to be bonded 6, and obtain the specific coordinates of the first positioning; then perform a second positioning of the component to be bonded 6 to obtain the specific coordinates of the second bonding point 62b on the component to be bonded 6.

[0058] (4) After obtaining the specific coordinates of the first and second bonding points on the component to be bonded 6, based on the current actual pose of the component to be bonded 6 and the preset spatial mapping relationship stored in step (2), calculate the target bonding coordinates of multiple target bonding points inside the deep cavity in the current motion system coordinate system; adjust the relative position of the component to be bonded 6 and the chopping blade 31 in the chopping blade positioning mechanism to complete the bonding of the first bonding point 61b and the second bonding point 62b respectively, and complete the control of the arc shape through the X-axis motion mechanism 12 and the Y-axis motion mechanism 13.

[0059] Furthermore, in step (3), the timing pose of the component to be bonded is first determined by the reference point in the visual microscopic mechanism, and the first and second bonding points of the component to be bonded 6 are precisely positioned by the X-axis motion mechanism 12 and the Y-axis motion mechanism 13 respectively. After obtaining the specific coordinates, the wire bonding and arc control are completed by the X-axis motion mechanism 12, the Y-axis motion mechanism 13 and the second Z-axis motion mechanism.

[0060] In the specific operation process, the part to be bonded 6 is first fixed on the fixture 23, and the temperature of the surface of the part to be bonded 6 is controlled to the set temperature by the heating device.

[0061] The bonding component 6 is positioned for the first time. Specifically, the X-axis motion mechanism 12 and the Y-axis motion mechanism 13 move the worktable 22 to a position directly below the field of view of the CCD camera 55 and the telecentric lens 56. Then, the first Z-axis motion mechanism 53 moves the CCD camera 55 and the telecentric lens 56 vertically to a suitable working distance to position the first bonding surface 61a. The distance is adjusted to make the image in the field of view clear and accurately position the first bonding point 61b. After obtaining the coordinates of the first bonding point 61b in the field of view, the first Z-axis motion mechanism 53 moves the CCD camera 55 and the telecentric lens 56 upward to a suitable distance to position the second bonding surface 62a. This makes the image in the field of view clear and accurately positions the second bonding point 62b, and at the same time, the coordinates of the second bonding point 62b are obtained.

[0062] After obtaining the X and Y coordinates of the first bonding point 61b and the second bonding point 62b, the X-axis motion mechanism 12 and the Y-axis motion mechanism 13 control the worktable 22 to the set position. After the ignition rod 32 ignites and the gold wire 4a forms a ball, the Z-axis motion motor 34 controls the cutting blade 31 to descend to the first bonding point 61b to complete the first bonding. Then, the Z-axis motion motor 34 controls the cutting blade 31 to rise, and the X-axis motion mechanism 12 and the Y-axis motion mechanism 131 move the worktable 22 so that the cutting blade 31 is directly above the second bonding point 62b. The Z-axis motion motor 34 controls the cutting blade 31 to descend to the second bonding point 62b again to complete the second bonding. In this way, the wire is led between the two bonding points at different heights to form a wire arc.

[0063] Repeating the above process can create a second, third, or more arcs.

[0064] Furthermore, the wire bonding packaging method also includes a step of controlling bonding parameters, including bonding temperature, ultrasonic power, and bonding pressure. The control method aims to ensure a reliable connection between the lead and the pad to meet bonding quality requirements, while maintaining the overall stress applied to the wedge 31 below its mechanical strength limit, to avoid breakage or failure due to the relatively low strength of the working part 31a and the clearance part 31b.

[0065] Compared to the standard process using a traditional integrated bonding wedge, by appropriately adjusting the setting values ​​of bonding pressure and ultrasonic power, and correspondingly adjusting the bonding temperature or ultrasonic action time, the potential impact of reduced pressure or power on lead quality can be compensated, thereby ensuring the final bonding quality and further preventing the wedge 31 from breaking or failing.

[0066] The wire bonding and packaging equipment provided in this preferred embodiment optimizes the structure and function of a traditional gold wire 4a wire bonding machine by adding a visual microscopy mechanism, an X-axis motion mechanism 12, and a Y-axis motion mechanism 13 to achieve automated and precise wire bonding operations in deep cavity structures. The visual microscopy system is used to capture the solder joint positions of the workpiece 6 to be bonded, such as a chip, in real time. Combined with the high-precision X-axis motion mechanism 12 and Y-axis motion mechanism 13, intelligent positioning is performed to accurately locate different bonding points on different planes of the workpiece 6, ensuring the alignment accuracy and stability of the wire bonding process. This allows the cutting blade 31 to move to the bonding point positions for deep cavity wire bonding. Therefore, this wire bonding and packaging equipment is suitable for the packaging needs of miniature liquid sensors with cavity structures, significantly improving the yield and consistency of deep cavity bonding, reducing manual intervention and operational errors, and possessing high practicality and promotional value. Furthermore, this wire bonding and packaging equipment has a simple structure, is easy to operate, can be mass-produced, has high working efficiency, and can guarantee the consistency of bonding quality.

[0067] The above are merely specific embodiments of the present invention, and any improvements made based on the concept of the present invention shall be considered within the scope of protection of the present invention.

Claims

1. A wire bonding and packaging device for a sensor, characterized in that, The wire bonding and packaging equipment includes a frame, a motion mechanism mounting plate mounted on the frame, an X-axis motion mechanism, a Y-axis motion mechanism, a first Z-axis motion mechanism, and a second Z-axis motion mechanism. A clamping mechanism is mounted on the X-axis motion mechanism or the Y-axis motion mechanism. A visual microscopic mechanism is mounted on the first Z-axis motion mechanism, and a cleaving positioning mechanism is mounted on the second Z-axis motion mechanism.

2. The wire bonding and packaging apparatus according to claim 1, characterized in that, The clamping mechanism includes a worktable fixed base mounted on the X-axis motion mechanism or the Y-axis motion mechanism, a worktable mounted on the worktable fixed base, and a clamp mounted on the worktable.

3. The wire bonding and packaging apparatus according to claim 2, characterized in that, The clamping mechanism also includes a heating device disposed on the worktable, which is used to control the temperature of the wire bonded component during bonding.

4. The wire bonding and packaging apparatus according to claim 1, characterized in that, The X-axis motion mechanism is mounted on the motion mechanism mounting plate, and the Y-axis motion mechanism is mounted on the X-axis motion mechanism.

5. The wire bonding and packaging apparatus according to claim 1, characterized in that, The visual microscopy mechanism includes a Z-axis motion mechanism mounting plate for mounting the first Z-axis motion mechanism, a camera mounting plate mounted on the first Z-axis motion mechanism, a camera, a telecentric lens, and a point light source, wherein the point light source is mounted on the telecentric lens, and the Z-axis motion mechanism mounting plate is disposed on the frame.

6. The wire bonding and packaging apparatus according to claim 1, characterized in that, The chopping blade positioning mechanism includes a chopping blade assembly and a wire feeding assembly, wherein the chopping blade assembly is mounted on the second Z-axis motion mechanism.

7. The wire bonding and packaging apparatus according to claim 6, characterized in that, The component to be bonded has a first bonding surface and a second bonding surface. The cleaving blades of the cleaving blade assembly are bonded between the first bonding surface and the second bonding surface respectively to complete the wire bonding.

8. The wire bonding and packaging apparatus according to claim 6, characterized in that, The wire feeding assembly includes a spool base plate, wire support plates and connecting frames all disposed on the spool base plate, a limiting rod and a wire feeding swing rod disposed on the connecting frame.

9. A wire bonding and packaging method based on the wire bonding and packaging apparatus according to any one of claims 1 to 7, characterized in that, The wire bonding and packaging method includes the following steps: (1) Clamp the workpiece to be bonded and fix the workpiece to be bonded on the clamping mechanism; (2) Identify and record the positions of at least two global reference points located outside the deep cavity structure of the component to be bonded by the visual microscopy mechanism, and identify and record the positions of multiple target bonding points located inside the deep cavity structure of the component to be bonded; calculate the preset spatial mapping relationship between the target bonding points and the global reference points based on the recorded positions of the global reference points and the positions of the target bonding points. (3) Identify and locate the corresponding global reference point on the visual microscopy mechanism to determine the current actual pose of the component to be bonded in the coordinate system of the motion system; for the first positioning of the component to be bonded, adjust the relative position of the component to be bonded and the visual microscopy mechanism to achieve accurate positioning of the first bonding point on the component to be bonded and obtain the specific coordinates of the first positioning; then perform a second positioning of the component to be bonded to obtain the specific coordinates of the second bonding point on the component to be bonded. (4) After obtaining the specific coordinates of the first and second bonding points on the component to be bonded, based on the current actual pose of the component to be bonded and the preset spatial mapping relationship stored in step (2), calculate the target bonding coordinates of multiple target bonding points inside the deep cavity in the current motion system coordinate system; adjust the relative position of the component to be bonded and the chopping blade in the chopping blade positioning mechanism to complete the bonding of the first bonding point and the second bonding point respectively, and complete the control of the arc through the X-axis motion mechanism and the Y-axis motion mechanism.

10. The wire bonding packaging method according to claim 9, characterized in that, In step (3), the timing pose of the component to be bonded is first determined by the reference point in the visual microscopic mechanism, and the first and second bonding points of the component to be bonded are precisely positioned by the X-axis motion mechanism and the Y-axis motion mechanism respectively. After obtaining the specific coordinates, the wire bonding and arc control are completed by the X-axis motion mechanism, the Y-axis motion mechanism and the second Z-axis motion mechanism.

Images