Chip transmission platform for wire bonding

Abstract

The utility model relates to the technical field of lead bonding, in particular to a chip transmission platform for lead bonding, which comprises a base and two groups of parallel guide rail assemblies. The guide rail assembly comprises a movable unit and a fixed unit, and the movable unit moves up and down through a third driving part; the fixing unit comprises a first base plate, a first synchronous belt, a first transmission wheel assembly and a first driving part, and the first synchronous belt is driven by the first driving part to operate; the movable unit comprises a second substrate, a second synchronous belt, a second transmission wheel assembly, a second driving piece and a photoelectric switch, the second synchronous belt is driven by the second driving piece, the photoelectric switch senses the position of the chip, and the second substrate is provided with a clamping air cylinder to achieve chip positioning; a guide piece is arranged between the first synchronous belt and the second synchronous belt to ensure smooth transmission of chips; through synergy of the synchronous belts and design of the guide rails, the mechanical structure is simplified, efficient conveying and positioning of chips are achieved, the number of parts is reduced, production efficiency is improved, the chips are prevented from being stuck or deviated, and the machining period is shortened.

Description

Technical Field

[0001] This utility model relates to the field of wire bonding technology, and more specifically to a chip transfer platform for wire bonding. Background Technology

[0002] Wire bonding is a common chip packaging technology, mainly used to interconnect chips with circuits on the package or substrate to transmit electrical signals. As an important step in precision manufacturing, wire bonding has high requirements for the precise positioning and stability of the chip. In order to meet the requirements of efficient and high-precision wire bonding operations, the design of the chip transmission platform is particularly critical.

[0003] However, in existing technologies, chip transfer platforms typically employ complex drive systems to achieve precise chip positioning and transfer. This complex structure results in a large overall size of the equipment, higher manufacturing and maintenance costs, and increased investment pressure on production lines.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the general background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] This invention provides a chip transfer platform for wire bonding, thereby effectively solving the problems in the background art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is: a chip transfer platform for wire bonding, comprising: a base and two sets of guide rail assemblies arranged in parallel on the base;

[0007] Each guide rail assembly includes a movable unit and fixed units disposed on both sides of the movable unit; a third driving member is provided between the movable unit and the base for driving the movable unit to move up and down; the two fixed units are disposed on the base;

[0008] Each of the fixed units includes a first base plate, a first synchronous belt, a first transmission wheel assembly, and a first driving member; the first transmission wheel assembly is disposed on the first base plate, the first synchronous belt is disposed on the first transmission wheel assembly, and the first driving member drives the first transmission wheel assembly to rotate, thereby driving the first synchronous belt to move;

[0009] Each of the movable units comprises a second base plate, a second synchronous belt, a second transmission wheel assembly, a second driving member and a photoelectric switch; the second transmission wheel assembly is arranged on the second base plate, the second synchronous belt is arranged on the second transmission wheel assembly, the second driving member drives the second transmission wheel assembly to rotate, thereby driving the second synchronous belt to move, and the photoelectric switch is arranged on the second base plate and is used for sensing the position of a chip; at least one side of the second base plate is provided with a clamping air cylinder, which is used for clamping and positioning the chip.

[0010] A guide is arranged between the first synchronous belt and the second synchronous belt.

[0011] Further, each of the fixed units further comprises a first guide rail arranged on the top of the first base plate and a first pad arranged on the bottom of the first guide rail, the first pad is provided with a first through slot in the length direction, which is used for providing a passing space for the movement of the first synchronous belt, and the first synchronous belt passes through the first through slot and moves along the first guide rail.

[0012] Each of the movable units further comprises a second guide rail arranged on the top of the second base plate and a second pad arranged on the bottom of the second guide rail, the second pad is provided with a second through slot in the length direction, which is used for providing a passing space for the movement of the second synchronous belt, and the second synchronous belt passes through the second through slot and moves along the second guide rail.

[0013] Further, the guide comprises a body arranged in a sheet shape and a fixed part arranged at one end of the body, the fixed part is arranged on the second pad, and the body is provided with a chamfer on the side close to the first synchronous belt.

[0014] Further, the first transmission wheel assembly and the second transmission wheel assembly each comprise a driving wheel, two steering wheels and two tensioning wheels; the driving wheel is connected with the first driving member or the second driving member; the two steering wheels are symmetrically and horizontally arranged on the first base plate or the second base plate and are used for changing the running direction of the synchronous belt; and the tensioning wheels are arranged between the driving wheel and the steering wheel and are used for adjusting the tension of the first synchronous belt or the second synchronous belt.

[0015] Further, a guide assembly is arranged between the first base plate and the second base plate.

[0016] The guide assembly comprises a first sliding rail arranged on the first base plate and a fixed block arranged on the first base plate, the fixed block is arranged in an L shape, the fixed block is provided with a first sliding block, the first sliding block is slidably arranged on the first sliding rail and is used for guiding the lifting movement of the movable unit.

[0017] Further, the two ends of the activity unit are also provided with a positioning assembly; the positioning assembly comprises a baffle, a connecting piece, a second sliding rail, a second sliding block and a fourth driving piece, the second sliding rail is arranged on the first base plate, the second sliding block is slidably arranged on the second sliding rail; one end of the connecting piece is connected with the baffle, and the other end is connected with the second sliding block; the fourth driving piece drives the second sliding block to move along the second sliding rail, so as to drive the baffle to limit the position of the chip.

[0018] Further, the baffle is in L-shaped structure, and a plurality of adjusting holes are arranged at one end.

[0019] Further, the first driving piece and the second driving piece are motors, and the third driving piece and the fourth driving piece are air cylinders or oil cylinders.

[0020] Further, the fixed unit is provided with the baffle at the starting position of the chip, so as to prevent the chip from entering the first synchronous belt.

[0021] Further, a connecting block is arranged between the third driving piece and the second base plate, the connecting block is in L-shaped structure, one end of the connecting block is screwed with the output end of the third driving piece, and the other end is screwed with the second base plate.

[0022] The beneficial effects of the utility model are:

[0023] Through the cooperative work of the first synchronous belt and the second synchronous belt and the design of the guide rail assembly, the efficient transmission and positioning of the chip are realized, and the number of mechanical parts is reduced, so that the overall structure of the equipment is more simple.

[0024] The guide piece is arranged between the first synchronous belt and the second synchronous belt, so that the smooth transition of the chip in the transmission process is ensured, the transmission efficiency is effectively improved, and the chip is prevented from being jammed or deviated; through the continuous transmission and accurate control of the platform through the synchronous belt, the efficient transmission and positioning of the chip are realized, the processing cycle of each chip is shortened by combining the rapid response of the up-down movement function and the clamping device, so that the overall production efficiency is significantly improved. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced, and obviously, the drawings in the following description are only some embodiments in the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating creative labor.

[0026] Figure 1 It is a structural schematic view of the chip transmission platform for wire bonding.

[0027] Figure 2 This is a schematic diagram of the guide rail assembly.

[0028] Figure 3 In order to be in Figure 2 A magnified view of a section at point A in the middle;

[0029] Figure 4 This is a structural diagram of a fixed unit;

[0030] Figure 5 This is a structural diagram of a fixed unit at another angle;

[0031] Figure 6 This is a schematic diagram of the structure of the first pad block;

[0032] Figure 7 This is a structural diagram of the activity unit;

[0033] Figure 8 This is a schematic diagram of the structure of the second pad block;

[0034] Figure 9 This is a schematic diagram of the positioning component.

[0035] Reference numerals: 1. Base; 2. Guide rail assembly; 21. Fixing unit; 211. First base plate; 212. First synchronous belt; 213. First transmission wheel assembly; 213a. Drive wheel; 213b. Steering wheel; 213c. Tensioner wheel; 214. First driving member; 215. First guide rail; 216. First pad; 216a. First through groove; 22. Movable unit; 221. Second base plate; 222. Second synchronous belt; 223. Second transmission wheel assembly; 224. Second driving member; 22 5. Photoelectric switch; 226. Third driving component; 226a. Connecting block; 227. Second guide rail; 228. Second pad; 228a. Second through groove; 229. Clamping cylinder; 3. Guide component; 31. Body; 311. Chamfer; 32. Fixing part; 4. Guide assembly; 41. First slide rail; 42. Fixing block; 43. First slider; 5. Positioning assembly; 51. Baffle; 511. Adjustment hole; 52. Connecting component; 53. Second slide rail; 54. Second slider; 55. Fourth driving component. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0037] In the description of the utility model, it needs to explain, belong to "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and so on the direction or position relation of indication is based on the direction or position relation shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and not indicating or implying that the device or element must have a specific orientation, a specific orientation and operation, therefore, it cannot be understood as a limitation of the utility model.

[0038] In the description of the utility model, it needs to explain, unless otherwise explicitly provided and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, also can be detachable connection, or integral type connection, can be mechanical connection, also can be electrical connection, can be direct connection, also can be indirect connection through intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to specific circumstances.

[0039] As shown in Figures 1 to 9 : a chip transmission platform for wire bonding, comprising: base 1 and two groups of guide rail assemblies 2 arranged in parallel on the base 1;

[0040] Each guide rail assembly 2 comprises a movable unit 22 and a fixed unit 21 arranged on both sides of the movable unit 22;A third driving member 226 is arranged between the movable unit 22 and the base 1 for driving the movable unit 22 to move up and down;Two fixed units 21 are arranged on the base 1;

[0041] Each fixed unit 21 comprises a first base plate 211, a first synchronous belt 212, a first transmission wheel assembly 213 and a first driving member 214;The first transmission wheel assembly 213 is arranged on the first base plate 211, the first synchronous belt 212 is arranged on the first transmission wheel assembly 213, and the first driving member 214 drives the first transmission wheel assembly 213 to rotate, thereby driving the first synchronous belt 212 to move;

[0042] Each movable unit 22 comprises a second base plate 221, a second synchronous belt 222, a second transmission wheel assembly 223, a second driving member 224 and a photoelectric switch 225;The second transmission wheel assembly 223 is arranged on the second base plate 221, the second synchronous belt 222 is arranged on the second transmission wheel assembly 223, the second driving member 224 drives the second transmission wheel assembly 223 to rotate, thereby driving the second synchronous belt 222 to move, the photoelectric switch 225 is arranged on the second base plate 221 for sensing the position of the chip, wherein at least one side of the second base plate 221 is provided with a clamping cylinder 229 for clamping and positioning the chip;

[0043] A guide member 3 is arranged between the first synchronous belt 212 and the second synchronous belt 222.

[0044] In use, the chip enters from the first synchronous belt 212 on one side, under the action of the guide 3, the chip is transferred to the second synchronous belt 222 by the movement of the first synchronous belt 212, when the photoelectric switch 225 senses that the chip reaches the appropriate position, the second synchronous belt 222 stops, the clamping cylinder 229 extends to clamp the chip, the third driving element 226 drives the movable unit 22 to rise to the set position for wire bonding, after the wire bonding is completed, the third driving element 226 drives the movable unit 22 to descend to the initial position, the clamping cylinder 229 retreats, and the second synchronous belt 222 moves, under the action of the other guide 3, the chip is transferred from the second synchronous belt 222 to the first synchronous belt 212 on the other side, entering the next process.

[0045] By setting the photoelectric switch 225 to sense the position of the chip, real-time detection and accurate control of the chip are realized, ensuring that the chip can reach the designated position before clamping and bonding operations, thereby avoiding bonding failure or reduced precision due to position deviation. The addition of the photoelectric switch 225 enables the platform to detect and position the chip in real time, combined with the precise control of the synchronous belt, significantly improving the automation level of the equipment and reducing the need for manual intervention. By clamping the chip with the clamping cylinder 229, the possibility of damage to the chip caused by external forces such as mechanical clamping or transmission vibration is avoided, improving the reliability of the chip processing process.

[0046] Through the cooperative work of the first synchronous belt 212 and the second synchronous belt 222, and the design of the guide rail assembly 2, efficient transmission and positioning of the chip are realized, while reducing the number of mechanical components, making the overall structure of the equipment more simple. The guide 3 is arranged between the first synchronous belt 212 and the second synchronous belt 222 to ensure smooth transition of the chip during transmission, effectively improving transmission efficiency and avoiding chip jamming or transmission deviation. The platform realizes efficient transmission and positioning of the chip through continuous transmission and precise control of the synchronous belt, combined with the rapid response of the up-down movement function and the clamping device, shortening the processing cycle of each chip, thereby significantly improving the overall production efficiency.

[0047] The third driving element 226 is arranged between the movable unit 22 and the base 1, which can realize the up-down adjustment function, so that the equipment can adapt to different height requirements of the bonding equipment, improving the versatility and flexibility of the platform.

[0048] As a preferred embodiment of the above, each fixed unit 21 further comprises a first guide rail 215 arranged on the top of the first base plate 211 and a first pad 216 arranged at the bottom of the first guide rail 215, the first pad 216 is provided with a first through slot 216a along the length direction, which is used to provide a through space for the movement of the first synchronous belt 212, and the first synchronous belt 212 passes through the first through slot 216a and moves along the first guide rail 215;

[0049] Each movable unit 22 further comprises a second guide rail 227 arranged on the top of the second substrate 221 and a second pad 228 arranged on the bottom of the second guide rail 227, the second pad 228 is provided with a second through slot 228a along the length direction for providing a passing space for the movement of the second synchronous belt 222, the second synchronous belt 222 passes through the second through slot 228a and moves along the second guide rail 227. Specifically, by arranging guide rails and pads in the fixed unit 21 and the movable unit 22 respectively, the stability and positioning accuracy of the synchronous belt movement can be effectively improved. The guide rail provides precise movement guidance, and the pad further constrains the running track of the synchronous belt to avoid transmission errors caused by running deviation. The arrangement of the through slot provides a fixed passing space for the running of the synchronous belt, ensuring that the synchronous belt is always in the preset track during movement, further improving the stability and consistency of chip transmission. The smooth guidance of the guide rail and the effective support of the pad reduce the friction and vibration in the movement of the synchronous belt, thereby reducing the wear and running noise of the equipment.

[0050] In the present embodiment, the guide 3 comprises a body 31 arranged in a sheet shape and a fixed part 32 arranged at one end of the body 31, the fixed part 32 is arranged on the second pad 228, and the body 31 is provided with a chamfer 311 on the side close to the first synchronous belt 212. The transition effect of the chamfer 311 makes it easier for the chip to be guided to the second synchronous belt 222 during movement, avoiding jamming or scratching caused by direct contact of the chip edge with the guide 3, and providing reliable guiding effect during chip transmission, ensuring that the chip can smoothly transition to the target synchronous belt along the preset track, thereby improving the stability of the entire transmission process.

[0051] Among them, the first transmission wheel assembly 213 and the second transmission wheel assembly 223 each comprise a driving wheel 213a, two steering wheels 213b and two tensioning wheels 213c; the driving wheel 213a is connected with the first driving part 214 or the second driving part 224; the two steering wheels 213b are symmetrically and horizontally arranged on the first substrate 211 or the second substrate 221, and are used for changing the running direction of the synchronous belt; the tensioning wheel 213c is arranged between the driving wheel 213a and the steering wheel 213b, and is used for adjusting the tension of the first synchronous belt 212 or the second synchronous belt 222 to prevent running instability caused by loose or tight synchronous belt. The design of the two steering wheels 213b can flexibly change the running direction of the synchronous belt, optimize the chip transmission path, and make the equipment structure more compact, further improving the transmission efficiency.

[0052] In the present embodiment, a guide assembly 4 is arranged between the first substrate 211 and the second substrate 221;

[0053] The guide assembly 4 comprises a first sliding rail 41 arranged on the first base plate 211 and a fixed block 42 arranged on the first base plate 211. The fixed block 42 is arranged in an L shape, and the first sliding block 43 is arranged on the fixed block 42 and is slidably arranged on the first sliding rail 41 to guide the lifting movement of the movable unit 22. Specifically, the lifting movement of the movable unit 22 is accurately guided by arranging the first sliding rail 41 and the first sliding block 43, so as to avoid the deviation, shaking or instability that may occur during the movement. The sliding rail provides a fixed track, and the sliding movement of the sliding block on the sliding rail enables the movable unit 22 to maintain stability and straightness, thereby improving the accuracy of the lifting movement.

[0054] As a preferred embodiment of the above embodiment, the movable unit 22 is further provided with a positioning assembly 5 at both ends. The positioning assembly 5 comprises a baffle 51, a connecting piece 52, a second sliding rail 53, a second sliding block 54 and a fourth driving member 55. The second sliding rail 53 is arranged on the first base plate 211, and the second sliding block 54 is slidably arranged on the second sliding rail 53. One end of the connecting piece 52 is connected with the baffle 51, and the other end is connected with the second sliding block 54. The fourth driving member 55 drives the second sliding block 54 to move along the second sliding rail 53 to drive the baffle 51 to limit the position of the chip. Specifically, when the photoelectric switch 225 detects that the chip reaches the set position, the second synchronous belt 222 stops rotating, the clamping cylinder 229 extends to clamp the chip, and the baffles 51 on both sides are inserted into the corresponding positioning holes of the chip under the driving of the fourth driving member 55 to further position the chip. After the wire bonding is completed, the clamping cylinder 229 and the baffle 51 retreat to release the positioning of the chip, and the chip enters the first synchronous belt 212 from the second synchronous belt 222. After the baffle 51 is inserted into the chip positioning hole, the slight deviation of the chip caused by insufficient clamping or other interference factors can be effectively avoided, and the reliability and consistency of the wire bonding process are further improved.

[0055] In the embodiment, the baffle 51 is in an L shape structure, and a plurality of adjusting holes 511 are arranged at one end of the baffle 51. When the baffle 51 moves upward, one end is inserted into the chip for positioning. Specifically, the L-shaped baffle 51 is physically limited by being inserted into the positioning hole of the chip, which effectively avoids the positional deviation of the chip caused by external force (such as transmission vibration or insufficient clamping), thereby improving the reliability of the wire bonding. A plurality of adjusting holes 511 are arranged at the other end of the baffle 51, so that the installation position or height of the baffle 51 can be flexibly adjusted to adapt to different sizes of chips or changes in the position of the positioning hole.

[0056] The first driving member 214 and the second driving member 224 are motors, and the third driving member 226 and the fourth driving member 55 are cylinders or oil cylinders.

[0057] In the embodiment, the fixed unit 21 is provided with a baffle 51 at the chip starting position, which is used to prevent the chip from entering the first synchronous belt 212.

[0058] As a preferred embodiment of the above embodiment, a connecting block 226a is arranged between the third driving member 226 and the second base plate 221, the connecting block 226a is arranged in an L shape, one end of the connecting block 226a is screwed with the output end of the third driving member 226, and the other end of the connecting block 226a is screwed with the second base plate 221, the L-shaped connecting block 226a makes the connection between the third driving member 226 and the second base plate 221 more simple and easy to operate, and facilitates installation and disassembly, and the L-shaped structure can provide support in two directions, thereby enhancing the tensile and shear resistance of the connecting block 226a, and the L-shaped structure is particularly suitable for bearing the dynamic load output by the third driving member 226, thereby ensuring the reliability of long-term operation of the equipment.

[0059] Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principle of the utility model, and various changes and improvements can be made to the utility model without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed. The scope of protection of the utility model is defined by the appended claims and their equivalents.

Claims

1. A chip transfer platform for wire bonding, characterized in that, include: A base and two sets of guide rail assemblies arranged in parallel on the base; Each guide rail assembly includes a movable unit and fixed units disposed on both sides of the movable unit; a third driving member is provided between the movable unit and the base for driving the movable unit to move up and down; the two fixed units are disposed on the base; Each of the fixed units includes a first base plate, a first synchronous belt, a first transmission wheel assembly, and a first driving member; the first transmission wheel assembly is disposed on the first base plate, the first synchronous belt is disposed on the first transmission wheel assembly, and the first driving member drives the first transmission wheel assembly to rotate, thereby driving the first synchronous belt to move; Each of the active units includes a second substrate, a second synchronous belt, a second transmission wheel assembly, a second driving member, and a photoelectric switch; the second transmission wheel assembly is disposed on the second substrate, the second synchronous belt is disposed on the second transmission wheel assembly, the second driving member drives the second transmission wheel assembly to rotate, thereby driving the second synchronous belt to move, the photoelectric switch is disposed on the second substrate for sensing the chip position, wherein at least one side of the second substrate is provided with a clamping cylinder for clamping and positioning the chip; A guide is provided between the first synchronization belt and the second synchronization belt.

2. The chip transfer platform for wire bonding according to claim 1, characterized in that, Each of the fixing units further includes a first guide rail disposed on the top of the first substrate and a first pad disposed at the bottom of the first guide rail. The first pad is provided with a first through groove along the length direction to provide passage space for the movement of the first synchronous belt. The first synchronous belt passes through the first through groove and moves along the first guide rail. Each of the active units further includes a second guide rail disposed on the top of the second substrate and a second pad disposed at the bottom of the second guide rail. The second pad is provided with a second through groove along the length direction to provide passage space for the movement of the second synchronous belt. The second synchronous belt passes through the second through groove and moves along the second guide rail.

3. The chip transfer platform for wire bonding according to claim 2, characterized in that, The guide includes a sheet-shaped body and a fixing part located at one end of the body. The fixing part is located on the second pad, and the body has a chamfer on the side near the first synchronous belt.

4. The chip transfer platform for wire bonding according to claim 1, characterized in that, Both the first transmission wheel assembly and the second transmission wheel assembly include a drive wheel, two steering wheels, and two tensioning wheels; the drive wheel is connected to the first drive member or the second drive member; the two steering wheels are symmetrically and horizontally arranged on the first base plate or the second base plate, and are used to change the running direction of the synchronous belt; the tensioning wheels are arranged between the drive wheel and the steering wheels, and are used to adjust the tension of the first synchronous belt or the second synchronous belt.

5. The chip transfer platform for wire bonding according to claim 1, characterized in that, A guide assembly is provided between the first substrate and the second substrate; The guiding component includes a first slide rail disposed on the first substrate and a fixing block disposed on the first substrate. The fixing block is L-shaped and has a first slider disposed on it. The first slider is slidably disposed on the first slide rail and is used to guide the lifting and lowering movement of the movable unit.

6. The chip transfer platform for wire bonding according to claim 1, characterized in that, The active unit is further provided with positioning components at both ends; the positioning components include a baffle, a connector, a second slide rail, a second slider and a fourth driving component, the second slide rail is disposed on the first substrate and the second slider is slidably disposed on the second slide rail; one end of the connector is connected to the baffle and the other end is connected to the second slider; the fourth driving component drives the second slider to move along the second slide rail so as to drive the baffle to limit the position of the chip.

7. The chip transfer platform for wire bonding according to claim 6, characterized in that, The baffle has an L-shaped structure and multiple adjustment holes at one end.

8. The chip transfer platform for wire bonding according to claim 6, characterized in that, The first and second driving components are motors, and the third and fourth driving components are cylinders or hydraulic cylinders.

9. The chip transfer platform for wire bonding according to claim 6, characterized in that, The fixing unit is provided with the baffle at the starting position of the chip to prevent the chip from entering the first synchronization band.

10. The chip transfer platform for wire bonding according to claim 1, characterized in that, A connecting block is provided between the third driving component and the second substrate. The connecting block is L-shaped, with one end screwed to the output end of the third driving component and the other end screwed to the second substrate.

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