Prober

Abstract

To provide a prober that can supply cooling air to each measuring section by a route that does not go through a loader section.SOLUTION: A prober 10 has a loader section 114 with a wafer W transport unit 22, and a prober body 112 with a plurality of measurement sections 30, a tester 43 located in each of the plurality of measurement sections 30 and a probing area 50 in the plurality of measurement sections. The loader section 114 and the prober body 112 are arranged with a gap S. The plurality of measuring sections 30 each have a bulkhead 70 between them and the loader section 114. The bulkhead 70 has an intake 71 for supplying cooling air to each of the testers 43, and a delivery opening 72 for receiving the conveyed material from the loader section 114 into the measuring section 30.SELECTED DRAWING: Figure 11

Description

[Technical field]

[0001] The present invention relates to a prober for testing electrical characteristics of a plurality of semiconductor devices (chips) formed on a wafer, and more particularly to a multi-probe having a plurality of measuring units. [Background technology]

[0002] The semiconductor manufacturing process includes many steps, and various inspections are performed in each manufacturing process to ensure quality and improve yield. For example, when multiple chips including semiconductor devices are formed on a wafer, the electrode pads of each chip are connected to a tester, and power and test signals are supplied from the tester. Then, the signals output from the semiconductor devices formed on each chip are measured by the tester. In this way, the semiconductor devices are electrically inspected to see if they operate normally (wafer-level inspection).

[0003] Wafer-level testing is performed using a prober that contacts the electrode pads of each chip on the wafer with a probe. The probe is electrically connected to the terminal of a tester, and power and test signals are supplied from the tester to each chip through the probe. The output signal from each chip is detected by the tester through the probe to measure whether it is operating normally.

[0004] In this wafer-level inspection, in order to improve throughput while suppressing increases in installation area and equipment costs, a prober (multi-prober) has been proposed that includes a prober main body with multiple measurement units and a loader unit. For example, Patent Document 1 discloses a multi-prober in which multiple measurement units are stacked in multiple stages in the prober main body, and wafer-level inspection is performed by a tester provided in each measurement unit. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2019-149447 A Summary of the Invention [Problem to be solved by the invention]

[0006] In a multi-prober, it is necessary to circulate outside air with a high dew point (cooling air) to each measurement section to cool the tester. When performing wafer-level inspection at room temperature to high temperature, cooling air is generally supplied to each measurement section from inside the loader section to maintain the temperature inside each measurement section within a specified inspection temperature range, and after cooling the tester, the cooling air is exhausted to the outside of each measurement section.

[0007] On the other hand, when performing wafer-level inspection at low temperatures, the inside of the prober body and the inside of the loader are filled with dry air (air for preventing condensation) having a low dew point in order to suppress condensation. Therefore, it is desirable to supply cooling air to each measurement section via a route that does not pass through the inside of the loader section filled with dry air, and to exhaust the cooling air from each measurement section after cooling the tester.

[0008] In order to supply cooling air to each measurement unit through a route that does not pass through the loader unit, it is possible to provide a dedicated route for cooling air on the loader unit side or on the prober main body side. However, in order to prevent the cooling air from leaking, it is necessary to configure the dedicated route for cooling air airtight with respect to the loader unit (provide a seal), which creates a problem of increasing the size of the prober accordingly.

[0009] The present invention has been made in view of the above circumstances, and has an object to provide a prober capable of supplying cooling air to each measuring section through a route that does not pass through the loader section. [Means for solving the problem]

[0010] The prober of the first embodiment comprises a loader section having a wafer transport mechanism, and a prober body having a plurality of measurement sections, a tester disposed in each of the plurality of measurement sections, and a probing area provided in the plurality of measurement sections, the loader section and the prober body being arranged with a gap therebetween, and each of the plurality of measurement sections has a partition between it and the loader section, and the partition has an intake port for supplying cooling air to the tester and a transfer port for transferring transported items from the loader section to the inside of the measurement section.

[0011] In the prober of the second aspect, the prober body has an exhaust port for exhausting the cooling air that has passed through the tester to the opposite side to the loader section.

[0012] In the prober of the third aspect, the partition includes an opening / closing mechanism for opening and closing the delivery opening.

[0013] In the prober of the fourth aspect, the tester is provided with a fan that draws in cooling air on the side of the intake port. Effect of the Invention

[0014] According to the present invention, it is possible to supply cooling air to each measuring section via a route that does not pass through the loader section. [Brief description of the drawings]

[0015] [Figure 1] 1 is an external perspective view of a prober according to an embodiment, as viewed from a loader unit side; [Diagram 2] FIG. [Diagram 3] FIG. 2 is a diagram (front view) showing the internal structure of a prober main body. [Figure 4] FIG. 2 is a diagram showing a configuration of a measurement unit. [Diagram 5] FIG. 2 is a diagram showing an outline of the path of cooling air in the entire prober. [Figure 6] FIG. 2 is an external perspective view of the prober body as viewed from the loader unit side. [Figure 7] FIG. 4 is a diagram of the partition wall as viewed from the loader unit side. [Figure 8] FIG. 4 is a view of the partition wall as seen from the inside of the measurement section. [Figure 9] 13 is a diagram showing a side surface of the prober body on the maintenance area side. FIG. [Figure 10] FIG. 2 is a perspective view of the appearance of a tester. [Figure 11] FIG. 4 is a diagram showing a path of cooling air within a measuring section. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings.

[0017] [Prober] First, an example of a prober (multi-prober) according to this embodiment will be described. Fig. 1 is an external perspective view of the prober 100 as viewed from the loader unit 114 side. Fig. 2 is a plan view of the prober 100 shown in Fig. 1. Note that the X, Y and Z axes in the figure are mutually orthogonal, with the X and Y axes being parallel to the horizontal direction and the Z axis being orthogonal to the horizontal direction.

[0018] 1 and 2, the prober 100 according to this embodiment includes a loader section 114 and a prober body 112. The loader section 114 supplies and collects a wafer W (see FIG. 4) to be inspected. The prober body 112 is disposed adjacent to the loader section 114 and has a plurality of measurement sections 30.

[0019] Further, although details will be described later, in the prober 100 according to this embodiment, a gap S is provided between the prober body 112 and the loader section 114 as an intake path for cooling air for cooling the tester 43 .

[0020] When a wafer W (test subject) is supplied from the loader unit 114 to each measurement unit 30, each measurement unit 30 performs an inspection (wafer level inspection) of the electrical characteristics of each chip on the wafer W. Then, the wafer W inspected by each measurement unit 30 is collected by the loader unit 114. The prober 100 also includes an operation panel 121, and a control device (not shown) that controls each unit.

[0021] The loader section 114 has a load port 118 and a transport unit 122 (one example of the transport mechanism of the present invention). A wafer cassette 120 and a probe card cassette 123 are placed on the load port 118. The transport unit 122 (see FIG. 2) transports the wafer W between each measurement section 30 of the prober main body 112 and the wafer cassette 120, and further transports the probe card 42 (see FIGS. 3 and 4) between each measurement section 30 and the probe card cassette 123. The probe card 42 is transported by the transport unit 122 while being placed on a card holder (not shown). Hereinafter, the wafer W and the probe card 42 are collectively referred to as the transported object.

[0022] The transport unit 122 includes a transport unit drive mechanism (not shown) and is configured to be movable in the X and Z directions and rotatable in the θ direction (around the Z direction). The transport unit 122 also includes a transport arm 124, which can be extended and retracted back and forth by the transport unit drive mechanism. An adsorption pad (not shown) is provided on the upper surface of the transport arm 124, and the transport arm 124 holds the transported object by vacuum adsorbing the back surface of the transported object with the adsorption pad. As a result, the transported object is taken out of the load port 118 by the transport arm 124 of the transport unit 122 and transported to each measuring unit 30 of the prober main body 112 while being held on the upper surface. When the inspection is completed, the transported object is taken out of each measuring unit 30 by the reverse route.

[0023] Fig. 3 is a view of the internal structure of the prober body 112 of Fig. 1 as seen from the front side (the side of the loader unit 114). As shown in Fig. 3, the prober body 112 has a hierarchical structure (multi-tier structure) in which a plurality of measuring units 30 are stacked in multiple tiers, and the measuring units 30 are two-dimensionally arranged along the X direction and the Z direction. In this embodiment, as an example, four measuring units 30 are stacked in the X direction in three tiers in the Z direction.

[0024] The prober body 112 includes a housing that defines each of the multiple measurement units 30. The housing has a lattice shape in which multiple frames are combined in a lattice shape.

[0025] Next, the configuration of the measurement unit will be described with reference to Fig. 4. Each measurement unit 30 basically has the same configuration. As shown in Fig. 4, each measurement unit 30 includes a head plate 44, a tester 43, a probe card 42, and a pogo frame 41 interposed between the tester 43 and the probe card 42.

[0026] The tester 43 is supported above the head plate 44 by a tester holder (not shown). The tester 43 is electrically connected to the probes 66 of the probe card 42, and supplies power and test signals to each chip for electrical testing, and detects output signals from each chip to measure whether it is operating normally.

[0027] The head plate 44 is supported by the housing of the prober main body 112, and has a pogo frame attachment part 53 consisting of a circular opening corresponding to the planar shape of the pogo frame 41. The pogo frame attachment part 53 has a positioning pin 63, and the pogo frame 41 is fixed to the pogo frame attachment part 53 in a state where it is positioned by the positioning pin 63. The method of fixing the pogo frame 41 is not particularly limited, but for example, a method of fixing the pogo frame 41 by vacuum adsorbing it to the support surface (adsorption surface) of the pogo frame attachment part 53 using a suction means (not shown) is preferable. Note that as a fixing means other than vacuum adsorption, a mechanical fixing means such as a screw may be used.

[0028] The pogo frame 41 is provided with a number of pogo pins (not shown) that electrically connect each terminal formed on the lower surface (surface facing the pogo frame 41) of the tester 43 to each terminal formed on the upper surface (surface facing the pogo frame 41) of the probe card 42. Ring-shaped seal members 60 and 62 are formed on the outer periphery of the upper surface (surface facing the tester 43) and the lower surface (surface facing the probe card 42), respectively, of the pogo frame 41. Then, the space surrounded by the tester 43, the pogo frame 41, and the seal member 60 and the space surrounded by the probe card 42, the pogo frame 41, and the seal member 62 are depressurized by a suction means (not shown), whereby the tester 43, the pogo frame 41, and the probe card 42 are integrated together (see FIG. 4).

[0029] The probe card 42 has a large number of probes 66 corresponding to the electrodes of each chip of the wafer W. Each probe 66 is formed to protrude downward from the lower surface (the surface facing the wafer chuck 150) of the probe card 42, and is electrically connected to each terminal provided on the upper surface (the surface facing the pogo frame 41) of the probe card 42. Therefore, when the tester 43, the pogo frame 41, and the probe card 42 are integrated, each probe 66 is electrically connected to each terminal of the tester 43 via the pogo frame 41. Note that the probe card 42 in this example has a large number of probes 66 corresponding to the electrodes of all the chips of the wafer W to be inspected, and each measuring unit 30 simultaneously inspects all the chips on the wafer W held by the wafer chuck 150.

[0030] The wafer chuck 150 fixes the wafer W by suction, for example, by vacuum suction. The wafer chuck 150 is detachably supported by an alignment device 13, which will be described later, and can be moved in the X, Y, Z, and θ directions by the alignment device 13. A ring-shaped seal member 64 is provided on the outer periphery of the upper surface (wafer placement surface) of the wafer chuck 150. The space surrounded by the probe card 42, the wafer chuck 150, and the seal member 64 is depressurized by a suction means (not shown), so that the wafer chuck 150 is attracted toward the probe card 42. As a result, each probe 66 of the probe card 42 comes into contact with the electrode pad of each chip of the wafer W, and the wafer W is ready to start inspection.

[0031] Inside the wafer chuck 150, a heating / cooling mechanism (not shown) is provided as a heating / cooling source so that electrical characteristics of the chips can be inspected at high temperatures (for example, up to 150° C.) or low temperatures (for example, down to −40° C.). As the heating / cooling mechanism, any suitable known heater / cooler can be used, and various types are possible, such as a double-layer structure with a heating layer of a surface heater and a cooling layer with a cooling fluid passage, or a single-layer heating / cooling device with a cooling pipe wrapped around a heater embedded in a thermal conductor. Also, instead of electrical heating, a device that circulates a thermal fluid or a Peltier element may be used.

[0032] The prober body 112 further includes an alignment device 13 that detachably supports the wafer chuck 150. The alignment device 13 is provided for each stage, and is configured to be movable between the multiple measurement units 30 arranged on each stage (stage) by an alignment device drive mechanism (not shown). In other words, the alignment device 13 is shared between the multiple measurement units 30 (four in this example) arranged on the same stage (stage), and moves between the multiple measurement units 30 arranged on the same stage.

[0033] Furthermore, when the alignment device 13 moves to each measurement section 30, it is fixed to a positioning and fixing device (not shown), and the above-mentioned alignment device driving mechanism moves the wafer chuck 150 in the X, Y, Z, and θ directions to perform relative alignment between the wafer W held on the wafer chuck 150 and the probe card 42. Although not shown, the alignment device 13 is equipped with a needle position detection camera and a wafer alignment camera in order to detect the relative positional relationship between the electrodes of the chips of the wafer W held on the wafer chuck 150 and the probes 66.

[0034] Although alignment device 13 adheres and fixes wafer chuck 150 by vacuum suction or the like, any fixing means other than vacuum suction may be used as long as it can fix wafer chuck 150, and for example, mechanical means may be used for fixing. Also, alignment device 13 is provided with a positioning member (not shown) so that the relative positional relationship with wafer chuck 150 is always constant.

[0035] Next, an overview of an inspection method using the prober 100 will be described. When an inspection is performed using the prober 100, the wafer W is taken out of the wafer cassette 120 by the transfer arm 124 in the loader unit 114, and the wafer W is transferred to each measurement unit 30 of the prober main body 112 while being held on the upper surface of the transfer arm 124.

[0036] Meanwhile, in the prober body 112, the alignment device 13 provided for each story (each stage) moves to a predetermined measurement unit 30, and the wafer chuck 150 is positioned on the upper surface of the alignment device 13 and fixed thereon by suction.

[0037] Next, the alignment device 13 moves the wafer chuck 150 to a predetermined delivery position. Then, when the wafer W is delivered from the transfer unit 122 of the loader section 114, the wafer W is held on the upper surface of the wafer chuck 150.

[0038] Next, the alignment device 13 moves the wafer chuck 150 holding the wafer W to a predetermined alignment position, and detects the relative positional relationship between the electrodes of the chips of the wafer W held on the wafer chuck 150 and the probes 66 using a needle position detection camera and a wafer alignment camera (not shown). Based on the detected positional relationship, the alignment device 13 moves the wafer chuck 150 in the X, Y, Z, and θ directions to align the wafer W held on the wafer chuck 150 with the probe card 42 relative to each other.

[0039] After this alignment is performed, alignment device 13 moves wafer chuck 150 to a predetermined measurement position (a position facing probe card 42) and raises wafer chuck 150 to a predetermined height (specifically, a height at which seal member 64 formed on the upper surface of wafer chuck 150 contacts the lower surface of probe card 42 (the surface facing wafer chuck 150)).

[0040] At this time, it is preferable that suction by a suction means (not shown) is started before the seal member 64 comes into contact with the lower surface of the probe card 42 (i.e., before the space surrounded by the probe card 42, the wafer chuck 150, and the seal member 64 becomes a sealed space). As a result, even if the wafer chuck 150 is raised, the suction means is in a state of suction, so it is possible to prevent the influence of the reaction force due to the compression of the above-mentioned space. Note that suction by the suction means may be started at the same time that the seal member 64 comes into contact with the lower surface of the probe card 42.

[0041] Thereafter, alignment device 13 releases the fixation of wafer chuck 150. As a result, wafer chuck 150 is removed from alignment device 13. Then, the space surrounded by probe card 42, wafer chuck 150, and seal member 64 is depressurized by suction by the suction means, so that wafer chuck 150 is attracted toward probe card 42, probe card 42 and wafer chuck 150 come into close contact with each other, and each probe 66 of probe card 42 comes into contact with the electrode pad of each chip of wafer W with a uniform contact pressure.

[0042] As a result, as shown in FIG. 4, the measurement unit 30 is in a state in which the tester 43, the pogo frame 41, the probe card 42, and the wafer chuck 150 are integrated, and the measurement unit 30 is ready to start wafer-level inspection.

[0043] Thereafter, power and test signals are supplied from the tester 43 to each chip on the wafer W, and signals output from the chips are detected to perform an electrical operation test.

[0044] Similarly, for the other measuring units 30, a wafer W is supplied onto the wafer chuck 150, and after the alignment and contact operations are completed in each measuring unit 30, simultaneous inspection of each chip on the wafer W is performed in sequence. That is, in each measuring unit 30, power and a test signal are supplied from the tester 43 to each chip on the wafer W, and an electrical operation inspection is performed by detecting a signal output from the chip.

[0045] When the inspection is completed in each measuring section 30, the alignment device 13 moves to each measuring section 30 in sequence, and retrieves the wafer chuck 150 holding the inspected wafer W.

[0046] That is, when alignment device 13 moves to measurement unit 30 where inspection has been completed, alignment device 13 rises to a position where its upper surface abuts against wafer chuck 150. This releases the reduced pressure in the space surrounded by probe card 42, wafer chuck 150, and seal member 64. Then, alignment device 13 positions and fixes wafer chuck 150 on its upper surface.

[0047] Furthermore, the alignment device 13 moves the wafer chuck 150 to a predetermined transfer position, releases the inspected wafer W from the wafer chuck 150, and transfers the inspected wafer W to the transfer unit 122. The inspected wafer W transferred to the transfer unit 122 is held by the transfer arm 124 and returned to the wafer cassette 120 arranged in the loader section 114.

[0048] 3, one wafer chuck 150 is assigned to each measuring unit 30, but the wafer chuck 150 may be shared among a plurality of measuring units 30. In this case, the alignment device 13 moves the wafer chuck 150 between the plurality of measuring units 30 that share the wafer chuck 150.

[0049] The probe cards 42 are provided according to the type of wafer W, and are appropriately replaced as necessary under the control of a control device (not shown). When replacing the probe card 42, first, the fixation between the pogo frame 41 and the probe card 42 is released, and the probe card 42 is handed over to the transport unit 122. The probe card 42 handed over to the transport unit 122 is returned to the probe card cassette 123 arranged in the loader section 114 by the transport arm 124. Next, a new probe card 42 is transported to the measurement section 30 in the reverse procedure to that for returning the probe card 42 to the loader section 114.

[0050] [Outline of cooling air path] Next, a description will be given of the path of cooling air for the tester 43 in the prober 100. As described above, in the prober 100, the prober body 112 has a plurality of measurement units 30, and wafer-level inspection is performed in parallel in each measurement unit 30. In order to maintain the temperature in each measurement unit 30 within a predetermined inspection temperature range, it is necessary to circulate cooling air within each measurement unit 30 so as to remove heat generated in the tester 43 of each measurement unit 30.

[0051] In particular, when performing wafer-level inspection in a low-temperature state, the prober body 112 and the loader unit 114 are filled with dry air having a relatively low dew point in order to suppress condensation. Therefore, it is desirable to supply cooling air to each measurement unit 30 via a route that does not pass through the loader unit 114 filled with dry air, and to exhaust the cooling air from each measurement unit 30 after cooling the tester 43.

[0052] Therefore, in this embodiment, a path is devised so that the cooling air can be supplied to and exhausted from each measurement unit 30 without passing through the inside of the loader unit 114. First, an overview of the path of the cooling air in the entire prober 100 according to this embodiment will be described with reference to FIG.

[0053] Fig. 5 is a diagram showing an outline of the path of cooling air when the inside of the prober 100 is viewed from above in the Z direction. In Fig. 5, the path of cooling air is indicated by a thick dotted arrow A. As shown in Fig. 5, the prober main body 112 and the loader part 114 are disposed adjacent to each other with a gap S therebetween. Preferably, the width of the gap S is 10 mm to 20 mm.

[0054] Each measurement unit 30 of the prober body 112 has a tester 43 therein. Of the four side surfaces of the prober body 112, the side surface facing the loader unit 114 (side surface 112A described below) is provided with an air intake 71 at a position corresponding to each tester 43. The size of the air intake 71 is appropriately determined taking into consideration the amount of heat generated by the tester 43, but it is preferable to make it as large as possible.

[0055] Furthermore, among the four side surfaces of the prober body 112, the side surface opposite the loader section 114 (a side surface 112B described below) is provided with exhaust ports 73 at positions corresponding to the testers 43.

[0056] Since the prober body 112 and the loader unit 114 are separated by a gap S, cooling air for cooling the tester 43 can be supplied to each measurement unit 30 through the gap S and the air intake 71, as shown by arrow A. This makes it possible to supply cooling air into the measurement unit 30 without passing through the inside of the loader unit 114.

[0057] Furthermore, as shown by arrow A, the cooling air supplied from the intake port 71 passes through the tester 43 and is exhausted from the exhaust port 73. Here, as shown in Fig. 5, the side surface of the prober body 112 on which the intake port 71 is provided is different from the side surface on which the exhaust port 73 is provided. This makes it possible to suppress a decrease in the cooling efficiency of each tester 43 caused by an increase in the temperature of the cooling air near the intake port due to the exhausted cooling air.

[0058] 5, a fan 47 may be provided on the path of the cooling air in the prober body 112. The cooling air can be forcibly circulated from the intake port 71 to the exhaust port 73 by the fan 47, thereby improving the cooling efficiency.

[0059] [Specific configuration related to the cooling air path] A specific configuration relating to a path from the intake port 71, which takes in cooling air from the outside of the prober 100, to the exhaust port 73, which exhausts the cooling air to the outside of the prober 100, will be described below in order.

[0060] First, the cooling air intake port 71 will be described. Fig. 6 is an external perspective view of the prober 100 shown in Fig. 1 with the loader unit 114 removed, showing only the prober main body 112 as viewed from the loader unit 114 side.

[0061] 6, the outer shape of the prober body 112 is a substantially rectangular parallelepiped, and the housing of the prober body 112 has four side surfaces that are arranged parallel to (substantially perpendicular to) the Z direction. Hereinafter, of the four side surfaces of the prober body 112, the side surface facing the loader unit 114 will be referred to as side surface 112A, the side surface provided on the opposite side to the loader unit 114 will be referred to as side surface 112B, and the two side surfaces provided between the side surfaces 112A and 112B will be referred to as side surface 112C and side surface 112D, respectively.

[0062] Incidentally, since a maintenance area is generally provided on the side opposite to the loader unit 114 as viewed from the prober body 112, the side surface 112B may also be referred to as the side surface on the maintenance area side.

[0063] The side surface 112A facing the loader unit 114 has partition walls 70 (partition walls 70 on the loader unit 114 side) partitioned for each measurement unit 30. In this example, since the prober body 112 has 12 measurement units 30, the side surface 112A has 12 partition walls 70 corresponding to the 12 measurement units 30.

[0064] The partition 70 isolates or roughly isolates the inside of each measurement unit 30 from the loader unit 114 and the external environment. The partition 70 is made of metal, for example, having a thickness of 10 mm to 30 mm. Note that this example is not intended to limit the material and thickness of the partition 70.

[0065] Each partition 70 is formed with an intake port 71 and a delivery port 72. The intake port 71 is an opening for supplying cooling air for cooling the tester 43 from the external environment into the measurement unit 30. Preferably, the intake port 71 is provided at a position in the X direction and the Y direction corresponding to the tester 43 in the measurement unit 30. This allows the cooling air to be effectively supplied into the measurement unit 30.

[0066] The delivery opening 72 is an opening for delivering the transported object between the loader unit 114 and the prober body 112. The shape of the delivery opening 72 is generally a rectangle that matches the outer shape of the approximately plate-like transported object. Preferably, the delivery opening 72 is provided at a position corresponding to the pogo frame 41 and the wafer chuck 150 in the measurement unit 30 in the X and Z directions. This allows the transported object to be delivered smoothly between the loader unit 114 and the prober body 112.

[0067] Preferably, the delivery port 72 and the loader section 114 communicate with each other through a tunnel-shaped passage 92 (see FIG. 11). This makes it possible to prevent cooling air from the external environment from entering the inside of the prober body 112 even if the prober body 112 and the loader section 114 are separated from each other by the gap S.

[0068] The following provides a more detailed explanation of the configuration of the partition 70 of each measurement unit 30. Fig. 7 is a view of the partition 70 of one measurement unit 30 in Fig. 6, viewed from the loader unit 114 side, that is, from the outside of the measurement unit 30.

[0069] 7, the tester 43 and the fan 47 (see FIG. 6) provided in the measurement unit 30 can be seen from the intake port 71. Furthermore, a part of the pogo frame 41 and the wafer chuck 150 provided in the measurement unit 30 can be seen from the delivery port 72. Note that to make it easier to understand the shapes of the intake port 71 and the delivery port 72, the structures within the measurement unit 30 are shown by dashed lines in FIG.

[0070] Fig. 8 is a view of the partition 70 as seen from inside the measurement unit 30. As shown in Fig. 8, a shutter 80 for opening and closing the delivery port 72 is provided in the measurement unit 30. The shutter 80 is an example of the opening and closing mechanism of the present invention. Reference numeral 8A in Fig. 8 indicates a state in which the delivery port 72 is open, and reference numeral 8B in Fig. 8 indicates a state in which the delivery port 72 is closed.

[0071] The shutter 80 includes a shielding plate 81, a pair of guide rails 82, and an air cylinder 83. The size of the shielding plate 81 is preferably larger than the delivery opening 72 so as to reliably cover the delivery opening 72. The shape of the shielding plate 81 is not particularly limited. In this embodiment, the shielding plate 81 is trapezoidal, for example.

[0072] A pair of guide rails 82 are provided on both sides in the longitudinal direction of the rectangular delivery opening 72, and the shielding plate 81 is movable in the vertical direction (Z direction) along the pair of guide rails 82.

[0073] The air cylinder 83 is configured to be expandable and contractable in the vertical direction (Z direction). Of both ends of the air cylinder 83 in the expansion and contraction direction, one end is connected to the shielding plate 81, and the other end is connected to the bottom of the measurement unit 30. When the transported object is supplied into the measurement unit 30 through the delivery port 72, the length of the air cylinder 83 is contracted under the control of a control device (not shown), and the shielding plate 81 is moved to a position below the delivery port 72. This opens the delivery port 72.

[0074] Preferably, except when the transported object is supplied through the delivery opening 72, the length of the air cylinder 83 is extended by the control of a control device (not shown) to move the shielding plate 81 to a position that completely covers the delivery opening 72. This closes the delivery opening 72. Note that although the structure of the shutter 80 has been exemplified, the structure is not limited as long as it can open and close the delivery opening 72.

[0075] By closing the delivery opening 72 with the shutter 80 except when the transported object is being delivered, it is possible to prevent dry air with a relatively high dew point from flowing into the probing area 50 (see FIG. 4) of the measurement unit 30 from the loader unit 114 side. The probing area 50 is a space portion disposed below the head plate 44, in which the probe card 42 and the wafer chuck 150 are disposed. In other words, the probing area 50 includes a portion where the probes 66 of the probe card 42 come into contact with the electrode pads of each chip of the wafer W.

[0076] Next, the exhaust port 73 for cooling air will be described. Fig. 9 is a diagram showing a side surface 112B of the prober main body 112 on the maintenance area side (the side opposite to the loader unit 114).

[0077] 9, the side surface 112B on the maintenance area side has plate-shaped panels 74 partitioned into individual measurement units 30. In this example, since the prober body 112 has 12 measurement units 30, the side surface 112B has 12 panels 74 corresponding to the 12 measurement units 30. The panels 74 are made of metal, for example, with a thickness of 10 mm to 30 mm. Note that this example is not intended to limit the material and thickness of the panels 74.

[0078] An exhaust port 73 and a maintenance opening (not shown) are formed in each panel 74. Preferably, the exhaust port 73 is provided at a position corresponding to the tester 43 in the measurement unit 30 in the X and Z directions. This allows the cooling air to be effectively exhausted from the tester 43.

[0079] Preferably, in order to prevent the intrusion of foreign matter, a metal net 75 is fitted into the exhaust port 73. Also, for example, a pair of hinges 76 are provided at the lower end of the net 75, so that the net 75 can be easily removed from the exhaust port 73.

[0080] The maintenance opening (not shown) is provided, for example, below the exhaust port 73. Preferably, the maintenance opening is provided at a position that allows an operator to access the equipment arranged below the head plate 44 in the measurement unit 30. Furthermore, a cover plate 78 that closes the maintenance opening is provided above the maintenance opening. A pair of hinges 77 are provided at the upper end of the cover plate 78, making it possible to easily remove the cover plate 78 from the maintenance opening.

[0081] Since the mesh 75 and cover plate 78 can be removed from the exhaust port 73 and the maintenance opening as necessary, the operator can easily perform maintenance on the various devices located above and below the head plate 44 within the measurement section 30.

[0082] Next, the tester 43 provided in each measurement unit 30 will be described. Fig. 10 is an external perspective view of the tester 43. Reference numeral 10A in Fig. 10 is an external perspective view of the tester 43 as viewed from the loader unit 114 side, and reference numeral 10B in Fig. 10 is an external perspective view of the tester 43 as viewed from the maintenance area side opposite the loader unit 114. In Fig. 10, the thick dotted arrow B indicates the path of the cooling air.

[0083] 10, the tester 43 has a generally rectangular parallelepiped shape as a whole, and the housing of the tester 43 has four side surfaces 43A to 43D standing parallel to the Z direction (approximately vertical), a top surface 43E parallel to the XY plane, and a bottom surface 43F parallel to the XY plane. Hereinafter, of the four side surfaces of the tester 43, the side surface facing the loader unit 114 will be referred to as side surface 43A, the side surface provided on the opposite side to the loader unit 114 (the maintenance area side) will be referred to as side surface 43B, and the two side surfaces provided between side surface 43A and side surface 43B will be referred to as side surface 43C and side surface 43D, respectively.

[0084] 10, the side surface 43A of the tester 43 facing the loader unit 114 has one or more openings 90, and the cooling air sucked into the prober body 112 through the gap S and the intake port 71 is supplied from the openings 90 into the tester 43. Therefore, it is not necessary to provide a dedicated path for cooling air to supply the cooling air from the loader unit 114 side.

[0085] Preferably, the fan 47 described above is provided near the opening 90 (see FIGS. 5 and 11 for the fan 47). This allows the cooling air to be efficiently taken in from the intake port 71 and circulated within the tester 43, thereby improving the cooling efficiency of the tester 43.

[0086] Furthermore, as shown by the symbol 10B in Figure 10, the side 43B of the tester 43 facing the maintenance area has one or more openings 91, and the cooling air that has passed through the tester 43 is exhausted from the tester 43 to the outside of the prober body 112 through the openings 91 and the exhaust port 73.

[0087] Also, preferably, the side surfaces 43C, 43D, the top surface 43E, and the bottom surface 43F do not have openings. As a result, while preventing the cooling air from escaping outside the tester 43, the cooling air supplied from the opening 90 passes through the inside of the housing of the tester 43 formed in a substantially cylindrical (substantially square) shape as shown by the arrow B, and is exhausted from the opening 91. As a result, the tester 43 can be efficiently cooled. Also, since it is possible to prevent the cooling air from leaking from the tester 43 to the probing area 50 below the head plate 44, the temperature in the probing area 50 can be stably maintained within a predetermined inspection temperature range.

[0088] In particular, in wafer-level inspection at low temperatures, when the probing area 50 (and the inside of the loader section 114) is filled with dry air to prevent condensation, there is a significant advantage in being able to prevent leakage of cooling air from the tester 43 to the probing area 50.

[0089] In addition, since cooling air is passed through the substantially cylindrical housing of the tester 43, there is no need to provide a path dedicated to cooling air in the prober body 112. In other words, there is no need to provide a path dedicated to cooling air on either the loader section 114 side or the prober body 112 side, and therefore the cost and size of the prober 100 can be reduced accordingly.

[0090] [Effects of the invention] The effects of this embodiment will be described below with reference to Fig. 11, taking into account the path of cooling air in one measurement unit 30. Fig. 11 is a cross-sectional view taken along the cross-sectional line 11-11 of the prober 100 in Fig. 1, and shows only the cross-sectional view of the uppermost measurement unit 30 of the prober main body 112, which is configured in three layers. In Fig. 11, the thick dotted arrow C indicates the path of cooling air.

[0091] 11, cooling air is supplied from the external environment into the measurement unit 30 through the gap S between the prober body 112 and the loader unit 114 and the intake port 71, without passing through the inside of the loader unit 114. This advantage is particularly effective when the loader unit 114 is filled with dry air to suppress condensation during wafer-level inspection at low temperatures.

[0092] Furthermore, by drawing cooling air into the measurement unit 30 from the gap S between the prober body 112 and the loader unit 114, the cooling air in the gap S between the prober body 112 and the loader unit 114 becomes fluid. Since the cooling air does not stagnate between the prober body 112 and the loader unit 114, the occurrence of condensation can be suppressed. This advantage is particularly effective in wafer-level inspection at low temperatures.

[0093] As shown by arrow C, a fan 47 is provided on the path of cooling air inside the tester 43. By driving the fan 47, cooling air can be actively taken into the inside of the tester 43 from the gap S, and the taken-in air can be further guided to the exhaust port 73. This can improve the cooling efficiency. Preferably, the fan 47 is provided on the side of the loader unit 114. This promotes the supply of cooling air from the intake port 71.

[0094] 11, the prober body 112 and the loader section 114 are separated by a gap S, but most of the side surface 112A facing the loader section 114 is covered by the partition wall 70. Therefore, even if the prober body 112 and the loader section 114 are separated by the gap S, it is possible to prevent cooling air from the external environment from entering the probing area 50 of the prober body 112 through the gap S.

[0095] Furthermore, the transfer opening 72 provided in the partition 70 and the loader section 114 are connected to each other by a tunnel-shaped passage 92. Since the transfer of the transported objects (wafer W and probe card 42) between the prober body 112 and the loader section 114 is performed via the tunnel-shaped passage 92 and the transfer opening 72, it is possible to prevent the cooling air from entering the probing area 50.

[0096] Furthermore, there is provided a shutter 80 that opens and closes the delivery port 72. By closing the delivery port 72 with the shutter 80 except when the transported object is being delivered, it is possible to prevent dry air with a relatively high dew point from flowing into the probing area 50 of the measurement unit 30 from the loader unit 114 side.

[0097] 11, the cooling air supplied from the intake port 71 passes through the substantially cylindrical housing of the tester 43, cools the tester 43 in a substantially straight line to the exhaust port 73, and is then exhausted. Therefore, the tester 43 can be cooled efficiently.

[0098] Since the cooling air supplied from the opening 90 of the tester 43 passes through the substantially cylindrical housing of the tester 43 and is exhausted from the opening 91 of the tester 43, it is possible to prevent the cooling air from leaking from inside the tester 43 to the probing area 50. As a result, the temperature inside the probing area 50 can be stably maintained within a predetermined inspection temperature range.

[0099] In addition, since the cooling air passes through the substantially cylindrical housing of the tester 43, there is no need to provide a path dedicated to the cooling air in the prober body 112. In other words, there is no need to provide a path dedicated to the cooling air on either the loader section 114 side or the prober body 112 side, so that the cost of the prober 100 and the space of the prober body 112 can be reduced accordingly.

[0100] The intake port 71 is provided on a side surface 112A (partition wall 70 of each measurement unit 30) on the loader unit 114 side of the prober body 112, and the exhaust port 73 is provided on a side surface 112B (panel 74 of each measurement unit 30) on the opposite side of the loader unit 114 of the prober body 112. Therefore, it is possible to suppress an increase in the temperature of the cooling air near the intake port 71 due to the cooling air exhausted from the exhaust port 73. As a result, it is possible to suppress a decrease in cooling efficiency.

[0101] [others] In this embodiment, the shutter 80 that opens and closes the delivery port 72 is provided inside the measurement unit 30 , but the shutter 80 may be provided outside the measurement unit 30 .

[0102] Although the prober according to the present invention has been described in detail above, it is needless to say that the present invention can be improved or modified in several ways without departing from the gist of the present invention. [Explanation of symbols]

[0103] 13 alignment device, 30 measurement section, 41 pogo frame, 42 probe card, 43 tester, 43A, 43B, 43C, 43D side, 43E top, 43F bottom, 44 head plate, 47 fan, 50 probing area, 53 pogo frame mounting section, 60, 62, 64 seal member, 66 probe, 70 bulkhead, 71 intake port, 72 delivery port, 73 exhaust port, 74 panel, 75 net, 76, 77 hinge, 78 cover plate, 80 shutter, 81 shielding plate, 82 guide rail, 83 air cylinder, 90, 91 opening, 92 passage, 100 prober, 112 prober body, 112A, 112B, 112C, 112D side, 114 loader section, 116 Measurement unit, 118 load port, 120 wafer cassette, 121 operation panel, 122 transfer unit, 123 probe card cassette, 124 transfer arm, 150 wafer chuck, A, B, C arrows, S gap, W wafer

Claims

1. a loader unit having a wafer transport mechanism; a prober body having a plurality of measurement units, the prober body having a tester disposed in each of the plurality of measurement units and a probing area provided in the plurality of measurement units; A prober comprising: the loader section and the prober body are disposed with a gap therebetween, each of the plurality of measurement units has a partition wall between it and the loader unit; the partition wall is formed with an intake port for supplying cooling air to the tester and a delivery port for delivering a transported object from the loader section to the measuring section, a tunnel-shaped passage that connects the delivery port and the loader unit; The loader section delivers the transported object into the measuring section through the passage and the delivery port.

2. the prober body has an exhaust port for exhausting the cooling air that has passed through the tester to the opposite side of the loader section, the tester includes a substantially cylindrical housing, the intake port being disposed on one side surface of the housing, and the exhaust port being disposed on the other side surface opposite to the one side surface; 2. The prober according to claim 1, wherein the tester and the probing area are separated by a bottom surface of the housing, and the bottom surface does not have an opening.

3. 3. The prober according to claim 1, wherein the partition wall includes an opening / closing mechanism for opening and closing the delivery opening.

4. 3. The prober according to claim 1, wherein the tester is provided with a fan on the side of the air inlet for drawing in the cooling air.

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