Imaging apparatus

Abstract

To efficiently cool a recording medium while suppressing increase in a size.SOLUTION: A control circuit board 13 is disposed on a -Z side in an optical axis direction substantially parallel to an imaging element board 102 substantially perpendicular to the optical axis direction. A medium slot 202, capable of housing a recording medium 80, is mounted on the control circuit board 13. A first air-cooling duct 12 is disposed closer to a rear side in the optical axis direction than the imaging element board 102 and closer to a front side in the optical axis direction than the control circuit board 13 and the medium slot 202. The first air-cooling duct 12 is thermally connected to the control circuit board 13.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to an imaging device. [Background technology]

[0002] In imaging devices, as the resolution and frame rate of recorded images increase, the signal processing load and power consumption become larger, and the amount of heat generated by signal processing units such as the imaging unit and recording medium (recording media) increases.

[0003] The performance of electronic components in an imaging device decreases at high temperatures, so it is necessary to provide a cooling structure inside the device. A heat dissipation structure that forcibly cools the inside of an imaging device is disclosed in Patent Document 1. The imaging device in Patent Document 1 has a built-in forced air-cooling flow path, and after external air supplied from an air intake on the back of the device is passed through the forced air-cooling flow path for heat exchange, the air is exhausted from an exhaust port on the side of the device, thereby cooling the main heat source inside the device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2022-77037 Summary of the Invention [Problem to be solved by the invention]

[0005] However, Patent Document 1 does not take into consideration cooling of the recording medium. If a new structure for cooling the recording medium were added, the device would become larger. As the writing bit rate increases due to future improvements in image quality, the amount of heat generated by the recording medium is expected to increase further, making it necessary to efficiently cool the recording medium.

[0006] An object of the present invention is to efficiently cool a recording medium while suppressing an increase in size. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, the imaging device of the present invention comprises a first substrate substantially perpendicular to an optical axis direction, a second substrate arranged substantially parallel to the first substrate on one side of the optical axis direction, a storage section mounted on the second substrate and capable of storing a recording medium, a first air-cooled duct arranged on the one side of the optical axis direction of the first substrate and on the other side of the optical axis direction of the second substrate and the storage section, and a fan that generates an airflow in the first air-cooled duct, wherein the first air-cooled duct is thermally connected to at least one of the recording medium, the storage section or the second substrate. Effect of the Invention

[0008] According to the present invention, it is possible to efficiently cool a recording medium while suppressing an increase in size. [Brief description of the drawings]

[0009] [Figure 1] FIG. [Diagram 2] 2A and 2B are rear and front perspective views of internal components of the imaging device. [Diagram 3] 2A and 2B are exploded rear and front perspective views of internal components of the imaging device. [Figure 4] 3A and 3B are rear and front perspective views of an imaging unit. [Diagram 5] 3A and 3B are rear and front perspective views showing a heat dissipation structure of the imaging device. [Figure 6] 3A and 3B are exploded rear and front perspective views showing a heat dissipation structure of the imaging device. [Figure 7] 3A and 3B are bottom and rear views of the imaging apparatus. [Figure 8] FIG. 7(b) is a cross-sectional view taken along line AA in FIG. [Figure 9] FIG. 7(b) is a cross-sectional view taken along line BB in FIG. [Figure 10] FIG. 7(b) is a cross-sectional view taken along line CC in FIG. [Figure 11] FIG. 2 is an exploded rear perspective view of the internal components of the imaging device. [Figure 12] FIG. 2 is a front view showing the internal configuration of the imaging device. [Figure 13] FIG. 2 is a perspective view of the appearance of the imaging device. [Figure 14] FIG. 2 is a front perspective view showing the internal configuration of the imaging device. [Figure 15] FIG. 2 is a front view showing the internal configuration of the imaging device. [Figure 16] FIG. 13 is a cross-sectional view taken along line DD in FIG. [Figure 17] 3A and 3B are rear and front perspective views of a main part of a heat dissipation structure for a recording medium. [Figure 18] 2A and 2B are exploded rear and front perspective views, respectively, of a main part of a heat dissipation structure for a recording medium. [Figure 19] FIG. [Figure 20] 4A and 4B are rear and front perspective views showing the positional relationship between a control circuit board and an elastic heat transfer member. [Figure 21] FIG. 17(b) is a cross-sectional view taken along line EE in FIG. [Figure 22] FIG. 4 is a perspective view showing a flow path of a first air-cooling duct. [Diagram 23] FIG. [Figure 24] FIG. 4 is a perspective view of a second elastic heat transfer member. [Diagram 25] FIG. [Figure 26] FIG. 4 is an enlarged view of the periphery of a second elastic heat transfer member. [Figure 27] FIG. 2 is a perspective view of the bottom side of the imaging device. [Figure 28] FIG. 2 is a perspective view of a control circuit board and each air-cooling duct. [Figure 29] 4A and 4B are a rear perspective view and a front perspective view of the periphery of a control circuit board. [Diagram 30] 2 is an XY plan view of the control circuit board as seen from the rear side. FIG. [Diagram 31] FIG. 2 is an XY plan view of a media slot with a recording medium inserted, seen from the front and rear. [Diagram 32]FIG. 13 is a front exploded perspective view of the configuration relating to the control circuit board, the media slot, and the air flow path. [Diagram 33] FIG. 13 is an exploded front perspective view of a control circuit board on which two media slots are arranged. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0011] (First embodiment) 1(a), (b), and (c) are perspective views of an imaging device according to a first embodiment of the present invention. To simplify the following description, the XYZ coordinate system is defined as follows. The direction of the imaging optical axis (optical axis O direction) of the imaging device 1 is the Z axis, and the subject direction is positive (+Z). On a plane perpendicular to the Z axis, the width direction (left-right direction) of the imaging device 1 is the X axis, and the right side as viewed from the subject side (+Z side) is positive (+X). The top-bottom direction of the imaging device 1 is the Y axis, and the direction toward the sky is positive (+Y).

[0012] 1(a) is a front perspective view of the imaging device 1, and Figures 1(b) and 1(c) are rear perspective views of the imaging device 1. Figure 1(c) shows a state in which a battery 70 and a recording medium 80 are in the middle of being inserted or removed from the imaging device 1.

[0013] The imaging device 1 is composed of an imaging device body 2 and a lens 3. Inside the imaging device body 2, components including the main functions of an imaging device are arranged, such as a control circuit board 13 (see FIG. 2(b)), an imaging element 101 (FIG. 4(b)), a power supply unit, a recording unit for recording images, and various operation units. As shown in FIG. 1(a), the lens 3 is attached to the imaging device body 2 on the subject side (+Z side). The lens 3 can be replaced according to the shooting conditions.

[0014] As shown in FIG. 1(a), an exhaust port 4 is provided on the right side (+X side) of the imaging device body 2. Hot air inside the body is exhausted from the exhaust port 4 by a forced air-cooling mechanism using a cooling fan 15 (FIGS. 3(a) and (b)) described later. As shown in FIG. 1(b) and FIG. 1(c), a first air intake port 5 is provided on the bottom (-Y side) of the imaging device body 2. Cold air is drawn into the body from the first air intake port 5 by a forced air-cooling mechanism using a cooling fan 15.

[0015] A second air intake 6 is provided at a position toward the left of the imaging device body 2. Cool air is drawn into the body from the second air intake 6 by a forced air-cooling mechanism using a cooling fan 15. A grip section 9, which is a gripping section for a photographer to hold the imaging device body 2, is disposed on the left side of the imaging device body 2. The grip section 9 has a shape that protrudes forward (in the +Z direction) of the imaging device body 2. The second air intake 6 is provided on a side section that is stepped down from the grip section 9, so that it is unlikely to be covered even when the photographer holds the imaging device 1.

[0016] The imaging device body 2 also has a battery cover 7 that covers the battery 70. The battery 70 can be inserted and removed in the vertical direction (Y-axis direction) of the imaging device body 2. A recording media cover 8 that covers a recording medium 80 is also provided on the left side of the imaging device body 2. The recording media 80 can be inserted and removed in the horizontal direction (Y-axis direction) of the imaging device body 2, and is stored in a media slot 202 (FIG. 3(a)) that will be described later. The battery 70 and the recording media 80 are each stored in a grip portion 9.

[0017] The internal components of the imaging device 1 will be described with reference to Figures 2 and 3. Figures 2(a) and 2(b) are respectively a rear perspective view and a front perspective view of the internal components of the imaging device 1. Figures 3(a) and 3(b) are respectively a rear exploded perspective view and a front exploded perspective view of the internal components of the imaging device 1. Figures 2 and 3 omit illustration of components other than the main components.

[0018] As shown in Figures 3(a) and (b), the inside of the imaging device main body 2 is mainly composed of an imaging unit 100 and a main unit 200. The imaging unit 100 includes an imaging unit holding member 10, an imaging element unit 11, and a first air-cooling duct 12. The imaging element unit 11 is composed of a drive unit (element drive unit 110 described later) that holds the imaging element 101 (Figure 4(b)), and a holding unit (fixed metal plate 121 described later, etc.) that holds the drive unit so that it can be driven. This realizes an anti-vibration function for the imaging element 101. The anti-vibration structure of the imaging unit 100 will be described in detail later.

[0019] The main unit 200 includes a control circuit board 13, a second air-cooling duct 14, a cooling fan 15, an exhaust port connector 16, and a duct connector 17. The control circuit board 13 controls the entire imaging device 1.

[0020] The first air-cooling duct 12 is made of a metal such as aluminum having high thermal conductivity, and is thermally connected to the image pickup element 101. The first air-cooling duct 12 is further thermally connected to a recording medium 80 stored in a media slot 202 mounted on the control circuit board 13. The second air-cooling duct 14 is made of a metal such as aluminum having high thermal conductivity, and is thermally connected to an IC 201 which is the main heat source in the control circuit board 13.

[0021] Heat generated by the imaging element 101, recording medium 80, and IC 201 is dissipated by the heat dissipation structure. The cooling fan 15 generates an airflow in the first air-cooling duct 12 (inside the air-cooling duct) as it rotates. This heat dissipation structure achieves forced air cooling by sucking in air from outside the imaging device body 2 as the cooling fan 15 rotates, exchanging heat with each air-cooling duct, and expelling the hot air to the outside. Details of this heat dissipation structure will be described later.

[0022] The vibration-proof structure of the imaging unit 100 will be described with reference to Figures 4(a) and (b). Figures 4(a) and (b) are respectively a rear perspective view and a front perspective view of the imaging unit 100. Note that the imaging unit holding member 10 is omitted from Figures 4(a) and (b).

[0023] The imaging unit 100 includes an element driving unit 110 and an imaging element holding unit 120. The element driving unit 110 includes an imaging element 101, an imaging element substrate 102 (FIG. 6(a)) on which the imaging element 101 is mounted, an imaging element holding member 103 that adhesively holds the imaging element 101, and the like. The imaging element holding unit 120 includes a fixed metal plate 121, a first air-cooling duct 12, and the like. The imaging element 101 converts light entering through the lens 3 into an electrical signal.

[0024] The element driving unit 110 is sandwiched between components of the image sensor holding unit 120 and is held rotatably by ball members (not shown) or the like. The first driving mechanism 130X and the second driving mechanism 130Y extend in the Y and X directions of the image sensing unit 100. The first driving mechanism 130X and the second driving mechanism 130Y each have a coil and a magnet (neither shown) arranged to overlap in the optical axis direction, and can generate a driving force by a voice coil motor method.

[0025] These drive mechanisms enable element drive unit 110 to be driven by a predetermined amount of movement in a predetermined direction relative to image sensor holding unit 120. For example, when camera shake occurs during use of image capture device 1, the amount of shake can be detected and element drive unit 110 can be driven to offset the amount of shake, thereby correcting blur in a captured image caused by camera shake.

[0026] The first air-cooling duct 12 has an image sensor cooling surface 12a (FIG. 6(a)) at a position facing the image sensor unit 11, and heat generated in the image sensor unit 11 is transferred via the image sensor cooling surface 12a. The heat transferred to the first air-cooling duct 12 is cooled by a heat dissipation structure described later.

[0027] The heat dissipation structure of the imaging device 1 will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is an internal perspective view showing the heat dissipation structure of the imaging device 1, with Fig. 5(a) being a rear perspective view and Fig. 5(b) being a front perspective view. Fig. 6 is an internal exploded perspective view showing the heat dissipation structure of the imaging device 1, with Fig. 6(a) being a rear exploded perspective view and Fig. 6(b) being a front exploded perspective view.

[0028] 5 and 6, the image sensor 101 is mounted on an image sensor substrate 102 (FIG. 6(a)) so as to be substantially perpendicular to the optical axis direction. As shown in FIGS. 6(a) and 6(b), a first air-cooling duct 12 is disposed behind the image sensor 101 so as to face the image sensor substrate 102.

[0029] Heat from the imaging element 101 is transferred from the imaging element cooling surface 12a to the first air-cooling duct 12. This heat transfer is performed via, for example, a heat dissipation rubber or a graphite sheet (not shown), and does not significantly affect the vibration-proof drive of the imaging element unit 11.

[0030] The control circuit board 13 is disposed perpendicular to the optical axis O (FIG. 3(b)). From the front, the imaging element unit 11, the first air-cooling duct 12, and the control circuit board 13 are disposed in this order. A video signal output from the imaging element board 102 is transmitted to the control circuit board 13 by a flexible printed circuit board (not shown), and processed in an image processing unit of the control circuit board 13. The IC 201 that handles this image processing and the like is thermally connected to the second air-cooling duct 14 that is disposed behind the control circuit board 13.

[0031] A media slot 202 is mounted near the end of the control circuit board 13 on the -X side (FIG. 6(a)). The media slot 202 is a storage section that can store recording media 80, which is an example of a recording medium. The media slot 202 is located within an area that fits within the grip portion 9 when projected from the rear. The media slot 202 is located on the rear side (-Z side) of the control circuit board 13.

[0032] When a moving image is recorded by the imaging device 1, the converted video data is written to the recording medium 80 inserted in the media slot 202. In recent years, as the resolution of this video data has increased, the amount of heat generated by the recording medium 80 has increased along with an increase in the writing bit rate to the recording medium 80, making it important to dissipate heat from the recording medium 80.

[0033] Both sides of the recording medium 80 inserted in the media slot 202 are covered by the control circuit board 13 and a part of the media slot 202. The first air-cooling duct 12 is disposed in front of the control circuit board 13 (in the +Z direction). The first air-cooling duct 12 has a recording media cooling surface 12b in an area that overlaps with the media slot 202 when viewed from behind (FIG. 6(a)). The recording media cooling surface 12b is thermally connected to the opposing control circuit board 13, so that heat from the recording medium 80 is transferred to the first air-cooling duct 12 and dissipated. In this embodiment, an elastic heat conductive member 203 is sandwiched between the control circuit board 13 and the first air-cooling duct 12, and heat is transferred via the heat conductive member 203.

[0034] In this embodiment, the heat of the recording medium 80 is transferred from the control circuit board 13 facing the recording medium 80 to the first air-cooling duct 12. That is, the first air-cooling duct 12 is thermally connected to the control circuit board 13. However, the present invention is not limited to this, and the heat of the recording medium 80 may be transferred directly from the recording medium 80 or from the media slot 202. The mounting surface of the media slot 202 may be the front side of the control circuit board 13. Therefore, it is sufficient that the first air-cooling duct 12 is thermally connected to at least one of the recording medium 80, the media slot 202, and the control circuit board 13.

[0035] Furthermore, the second air-cooling duct 14 and the media slot 202 do not overlap when viewed from the rear, and are arranged side by side in the left-right direction (Fig. 5). The second air-cooling duct 14 is not directly involved in dissipating heat from the recording media 80, and can dissipate heat from the IC 201 near the media slot 202 of the control circuit board 13, thereby preventing the grip section 9 from becoming larger, particularly in thickness. The second air-cooling duct 14 has a second intake section 14a (Fig. 5(a)). The first air-cooling duct 12 has a first intake section 12c (Fig. 5(b)).

[0036] Next, the structure of forced air cooling by the cooling fan 15 will be described with reference to FIGS.

[0037] Figures 7(a) and (b) are respectively a bottom view and a rear view of the imaging device 1. Figure 8 is a cross-sectional view taken along line AA in Figure 7(a). Figure 9 is a cross-sectional view taken along line BB in Figure 7(b). Figure 10 is a cross-sectional view taken along line CC in Figure 7(b).

[0038] 6(a), 10, etc., the control circuit board 13 is disposed substantially parallel to the imaging element board 102 and on the rear side (-Z side; one side) of the imaging element board 102 in the optical axis direction. The first air-cooling duct 12 is disposed on the rear side (-Z side) of the imaging element board 102 (first board) in the optical axis direction and on the front side (+Z side; other side) of the control circuit board 13 (second board) and the media slot 202 in the optical axis direction. The first air-cooling duct 12 is located between the imaging element board 102 and the control circuit board 13 in the optical axis direction.

[0039] In addition, a battery 70 is stored in an area that overlaps with the grip portion 9 when viewed from the optical axis direction, and the first air-cooling duct 12 is located between the battery 70 and the control circuit board 13 in the optical axis direction (FIG. 10).

[0040] As shown in Figures 7(a) and 8, the first air intake 5 on the bottom surface of the imaging device body 2 is connected to the first air intake section 12c of the first air-cooling duct 12. By the rotation of the cooling fan 15, air from the outside of the imaging device body 2 is taken into the first air-cooling duct 12 through the first air intake 5 and the first air intake section 12c (arrow F1 in Figure 8). Heat of the recording medium 80 stored in the media slot 202 is transferred to the recording media cooling surface 12b of the first air-cooling duct 12 in front of the control circuit board 13 via the heat conductive member 203 (arrow F2 in Figures 8 and 10).

[0041] Meanwhile, the heat of the imaging element 101 is transferred to the imaging element cooling surface 12a of the first air-cooling duct 12 via a heat conductive member (not shown) or the like (arrow F3 in Figs. 8 and 10). The air in the first air-cooling duct 12, which has been heated by heat exchange with these heat sources (recording medium 80, imaging element 101), is taken into the second air-cooling duct 14 via the duct connecting portion 17, which is connected to the first exhaust portion 12d of the first air-cooling duct 12 (arrow F4 in Fig. 9).

[0042] The second air intake 6 of the imaging device body 2 is connected to the second air intake section 14a of the second air-cooling duct 14. Air from outside the imaging device body 2 is taken into the second air-cooling duct 14 through the second air intake 6 and the second air intake section 14a by the rotation of the cooling fan 15 (arrow F5 in FIG. 10). Heat from the IC 201 mounted on the control circuit board 13 is transferred to the second air-cooling duct 14 behind the control circuit board 13 via a heat conductive member (not shown) or the like (arrow F6 in FIG. 10).

[0043] The air in the second air-cooling duct 14, which has been heated by heat exchange with this heat source (IC 201), merges with the air that has been heated by the heat of the image sensor 101 and the recording medium 80 transmitted from the first air-cooling duct 12, and is sucked in by the cooling fan 15 (arrow F7 in Figs. 9 and 10). Then, this sucked in air passes through the exhaust port connector 16 and is exhausted to the outside from the exhaust port 4 of the image pickup device body 2 (arrow F8 in Fig. 10).

[0044] In this way, the forced air-cooling mechanism using the cooling fan 15 makes it possible to exhaust the heat of the recording medium 80 to the outside of the imaging device body 2 via the first air-cooling duct 12. Therefore, even during high bit rate recording, recording does not need to be stopped, and the reliability of the imaging device 1 can be improved. In addition, heat from the imaging element 101 and the control circuit board 13, which are other heat sources, can also be exhausted to the outside of the imaging device body 2 via the first air-cooling duct 12 and the second air-cooling duct 14, further improving the reliability of the imaging device 1.

[0045] According to this embodiment, the first air-cooling duct 12 is disposed behind the image pickup device board 102 in the optical axis direction and in front of the control circuit board 13 and the media slot 202 in the optical axis direction (FIG. 10). The first air-cooling duct 12 is thermally connected to the control circuit board 13. Then, the forced air-cooling mechanism using the cooling fan 15 exhausts heat from the control circuit board 13 through the first air-cooling duct 21, so that the recording media 80 housed in the media slot 202 is efficiently cooled. In addition, this forced air-cooling mechanism cools the control circuit board 13, and there is no need to provide a new cooling structure for cooling the recording media 80, so that the configuration is prevented from becoming complicated and large. Therefore, the recording media 80 can be efficiently cooled while suppressing the increase in size.

[0046] Furthermore, since the imaging element 101 is thermally connected to the first air-cooling duct 12, the imaging element 101 can be cooled efficiently.

[0047] Moreover, since the second air-cooling duct 14 is thermally connected to the IC 201, which is the main heat source in the control circuit board 13, the control circuit board 13 including the IC 201 can be efficiently cooled.

[0048] In addition, since the first air-cooled duct 12 and the second air-cooled duct 14 are connected by the duct connection part 17, the air flow path is connected, so that the air taken in the first air-cooled duct 12 can be efficiently discharged via the second air-cooled duct 14.

[0049] Second Embodiment A second embodiment of the present invention and its modified example will be described with reference to Figures 11 to 16. In the imaging device 1 of this embodiment, the configurations of the first air-cooling duct 1000 and the media slot 1020 are different from those of the first embodiment.

[0050] Fig. 11 is an exploded rear perspective view of the internal components of the imaging device 1. Fig. 12 is a front view showing the internal configuration of the imaging device 1. In Fig. 12, in order to explain the layout of the first air-cooling duct 1000, attention is mainly focused on the relationship between the first air-cooling duct 1000, the control circuit board 13, and the battery 70.

[0051] As shown in Fig. 12, when viewed from the optical axis direction, the first air-cooling duct 1000 is disposed in a position that overlaps a portion of the recording medium 80 but does not overlap the battery 70. In the area where the first air-cooling duct 1000 and the recording medium 80 overlap, there is a heat transfer member (a spring 1006 and a receiving part 1007, which will be described later in Fig. 16) that connects the recording medium 80 and the first air-cooling duct 1000. This heat transfer member allows the heat of the recording medium 80 to be transferred to the first air-cooling duct 1000. The heat transfer between the recording medium 80 and the first air-cooling duct 1000 will be described later.

[0052] As the first air-cooling duct 1000 and the battery 70 do not overlap when viewed from the optical axis direction, the recording medium 80 can be cooled without increasing the thickness of the grip portion 9. Therefore, it is possible to provide an imaging device that is small and does not impair gripping properties.

[0053] 13 to 15 are diagrams illustrating a modification of this embodiment. Since the heat dissipation structure in this embodiment is common to the modification, the heat dissipation structure in this embodiment will first be described with reference to FIG.

[0054] Fig. 16 is a cross-sectional view taken along the line DD in Fig. 12. An example of heat transfer from the recording medium 80 to the first air-cooling duct 1000 will be described.

[0055] The first air-cooling duct 1000 has two walls that are approximately parallel to the control circuit board 13. Of the two walls, the wall that is close to (adjacent to) the control circuit board 13 is a first wall 1002, and the wall that is farther from the control circuit board 13 is a second wall 1003. Air flows between these two walls.

[0056] The control circuit board 13 has a board hole 1004 for dissipating heat, and the first wall 1002 has a duct hole 1005. Fins 1008 extend inward from the second wall 1003. A spring 1006 is provided between the second wall 1003 of the first air-cooling duct 1000 and the recording medium 80, penetrating the board hole 1004 and the duct hole 1005.

[0057] A receiving part 1007 is provided between the spring 1006 and the recording medium 80. The receiving part 1007 is a contact member that is pressed against and contacts the recording medium 80 by the biasing force of the spring 1006. Therefore, the deformation range T of the spring 1006 is longer than the distance D1 between the first wall 1002 and the second wall 1003.

[0058] The receiving part 1007 is made of a material with high thermal conductivity such as metal, and the spring 1006 is also made of metal, so it easily transmits heat. Therefore, heat transmitted to the receiving part 1007 through contact with the recording medium 80 is efficiently transmitted to the second wall 1003 via the spring 1006. The heat transmitted to the second wall 1003 is transmitted to the fins 1008, where it exchanges heat with the air that hits the fins 1008 and is discharged to the outside, thereby enabling heat dissipation.

[0059] A slope 1010 is formed around the entire periphery of the edge of the end face of the receiving part 1007 that comes into contact with the recording medium 80. When the recording medium 80 is inserted, the end of the recording medium 80 hits the slope 1010 of the receiving part 1007. This force compresses the spring 1006, allowing the recording medium 80 to be inserted smoothly.

[0060] In addition, the control circuit board 13 has a cylindrical wall 1009 that connects the first wall 1002 and the second wall 1003 so as to surround the outer periphery of the spring 1006. A part of the first air-cooling duct 1000 is blocked by the cylindrical wall 1009. This blocked area is designated as X1. The spring 1006 expands and contracts within the area X1. Air avoids the area X1 and flows between the first wall 1002 and the second wall 1003, and does not flow through the area X1. Therefore, the air flowing through the first air-cooling duct 1000 does not enter the spring 1006 or the recording medium 80.

[0061] In this way, by disposing the spring 1006 between the second wall 1003 and the recording medium 80, the deformation range T of the spring 1006 can be made large. Therefore, the stroke over which the spring 1006 expands and contracts can be made large, and the spring 1006 can come into contact with the recording medium 80 with a small load. In general, applying an external force to the recording medium 80 is not preferable because the force is applied to the contact point of the media slot 1020. However, by making the stroke of the spring 1006 large as in this embodiment, the load on the recording medium 80 is reduced, and an appropriate contact state can be maintained.

[0062] Furthermore, because no air flows through the spring 1006 or recording medium 80 disposed in the area X1 isolated by the cylindrical wall 1009, dust carried in from the outside air flowing through the first air-cooled duct 1000 does not accumulate thereon. This makes it possible to prevent the elasticity of the spring 1006 from being hindered and to prevent dust from entering the media slot 1020. Although the spring 1006 is used as a biasing member for biasing the recording medium 80, the form of the spring is not limited to this. Also, other elastic members may be used as long as they are elastic and have good thermal conductivity.

[0063] According to this embodiment, the first air-cooling duct 1000 is disposed behind the imaging element board 102 in the optical axis direction and in front of the control circuit board 13 and the media slot 1020 in the optical axis direction. The first air-cooling duct 1000 is thermally connected to the control circuit board 13. Therefore, the same effect as in the first embodiment can be achieved in terms of efficiently cooling the recording medium 80 while suppressing an increase in size.

[0064] Furthermore, when viewed from the optical axis direction, at least a portion of the media slot 1020 overlaps with the battery 70. The first air-cooling duct 1000 is disposed at a position that does not overlap with the battery 70 when viewed from the optical axis direction, but overlaps with the media slot 1020 (FIG. 12). This makes it possible to enhance the cooling effect of the media slot 1020 while suppressing the expansion in the optical axis direction in the area where the battery 70 is disposed.

[0065] In addition, a spring 1006, which is a deformable heat transfer member, penetrates the first wall 1002 and the control circuit board 13 of the first air-cooling duct 1000, and abuts against both the recording medium 80 and the second wall 1003 (FIG. 16). This allows the heat of the recording medium 80 to be efficiently transferred to the first air-cooling duct 1000.

[0066] Furthermore, since the deformation range T of the spring 1006 is longer than the distance D1 between the first wall 1002 and the second wall 1003, the contact load on the recording medium 80 can be reduced and an appropriate contact state can be maintained.

[0067] Furthermore, the spring 1006 is housed within an area X1 surrounded by the first wall 1002, the second wall 1003, and the third wall, that is, the cylindrical wall 1009. This prevents dust from entering the media slot 1020.

[0068] Furthermore, a receiving part 1007 is provided at the tip of the spring 1006, and the spring 1006 abuts against the recording medium 80 via the receiving part 1007, and a slope 1010 is provided at the end of the receiving part 1007. This allows the recording medium 80 to be inserted smoothly.

[0069] Next, a modification of this embodiment will be described with reference to FIGS.

[0070] Fig. 13 is an external perspective view of an imaging device 1 according to a modified example of this embodiment. Fig. 14 and Fig. 15 are a front perspective view and a front view, respectively, showing the internal configuration of the imaging device 1. In Fig. 14, some components are omitted in order to explain the duct structure. Portions not specifically mentioned are the same as those explained as the second embodiment.

[0071] 13 and 15, in this modification, the air intake 1001 is disposed on approximately the same plane as the surface of the mount to which the lens is attached, and between the mount and the grip in the X-axis direction. The air that enters through the air intake 1001 flows into the first air-cooling duct 1000.

[0072] Moreover, the air intake 1001 is positioned so as to overlap a portion of the recording medium 80 when viewed from the optical axis direction, but not to overlap the battery 70 (FIG. 15). This allows air to be taken in from a position close to the recording medium 80, which is a heat source. Therefore, the air immediately after being taken in from the outside can be made to flow near the recording medium 80, improving the cooling effect.

[0073] According to this modification, the first air-cooling duct 1000 takes in air from the intake port 1001 located at a position overlapping with the media slot 1020 when viewed from the optical axis direction, so that the cooling effect of the recording media 80 can be further improved.

[0074] In this embodiment and its modified examples, the first air-cooling duct 1000 may be thermally connected to at least one of the recording medium 80, the media slot 1020, and the control circuit board 13. For example, the media slot 1020 may be mounted on the front side of the control circuit board 13.

[0075] Furthermore, the configuration is not limited to direct heat dissipation from the recording medium 80 to the first air-cooling duct 1000, but may be such that heat transferred from the recording medium 80 to the media slot 1020 is transferred to the first air-cooling duct 1000. Even with this configuration, a cooling effect can be expected due to heat transfer from the portion where the first air-cooling duct 1000 and the media slot 1020 overlap.

[0076] (Third embodiment) A third embodiment of the present invention will be described with reference to Figures 17 to 26. Differences from the first embodiment will be mainly described. Parts that are not particularly mentioned are the same as those in the first embodiment.

[0077] 17(a) and (b) are perspective views of the main part of the heat dissipation structure of the recording medium 80, with FIG. 17(a) being a rear perspective view and FIG. 17(b) being a front perspective view.

[0078] The recording medium 80, which is a heat source, is inserted into a media slot 3002 mounted on a control circuit board 3026. The battery 70 is stored in a battery storage section 3004. The first air-cooling duct 3005 has an intake port 3006 that communicates with the first intake port 5 (FIG. 1(b)) and an exhaust port 3007 that communicates with the duct connecting section 17 (FIG. 2(a)). In addition, the cooling fan 15 (FIG. 2(a)) causes air to flow from the intake port 3006 to the exhaust port 3007 in the first air-cooling duct 3005. Heat generated by the recording medium 80 is discharged to the outside of the imaging device body 2 (FIG. 1) via the air flowing in the first air-cooling duct 3005. The cooling of the recording medium 80 will be described later.

[0079] 18(a) and (b) are exploded perspective views of the main parts of the heat dissipation structure of the recording medium 80, with FIG. 18(a) being a rear perspective view and FIG. 18(b) being a front perspective view.

[0080] An elastic heat transfer member 3008 having high thermal conductivity and elasticity is disposed in a board opening 3009 of the control circuit board 3026. When the recording medium 80 is stored in the media slot 3002, the elastic heat transfer member 3008 contacts the recording medium 80, and a portion of the elastic heat transfer member 3008 is exposed from the board opening 3009 into the first air-cooling duct 3005. The detailed positional relationship between these will be described later.

[0081] In the first air-cooling duct 3005, a duct lid member 3018 has a lid opening 3010 formed on the optical axis projection of the recording medium 80. A duct base member 3019 has a duct opening 3011 formed on the optical axis projection of the battery 70. A storage member opening 3012 is formed in the battery storage section 3004. This storage member opening 3012 is sealed with a heat transfer plate 3013 with high thermal conductivity.

[0082] The detailed configuration of the elastic heat transfer member 3008 will be described with reference to Fig. 19 and Fig. 20. Fig. 19 is a perspective view of the elastic heat transfer member 3008. Fig. 20(a) and (b) are perspective views showing the positional relationship between the control circuit board 3026 and the elastic heat transfer member 3008, with Fig. 20(a) being a rear perspective view and Fig. 20(b) being a front perspective view.

[0083] The elastic heat transfer member 3008 has a mounting portion 3014 for mounting on the surface of the control circuit board 3026 on the -Z side. The elastic heat transfer member 3008 also has a heat transfer surface 3015 that contacts the recording medium 80 (FIG. 17(a)) and transfers heat. The elastic heat transfer member 3008 also has a fin portion 3016 for effectively transferring heat to the air flowing through the first air-cooling duct 3005. The fin portion 3016 protrudes from the board opening 3009 (FIG. 18(b)) into the first air-cooling duct 3005 (FIG. 17(b)). The elastic heat transfer member 3008 also has an inclined portion 3017 for facilitating the insertion of the recording medium 80. The contact relationship between the recording medium 80 and the elastic heat transfer member 3008 when the recording medium 80 is inserted will be described later.

[0084] 21 and 22, the air flow path in the first air-cooling duct 3005 and heat dissipation from the recording medium 80 will be described. Fig. 21 is a cross-sectional view taken along line EE in Fig. 17(a).

[0085] The wall of the first air-cooling duct 3005 on the recording medium 80 side (-Z side) is composed of a duct lid member 3018, a control circuit board 3026 exposed from a lid opening 3010 (FIG. 18(a)), and a part of an elastic heat transfer member 3008. Heat generated by the recording medium 80 is cooled by being transferred to the air flowing inside the first air-cooling duct 3005 via the elastic heat transfer member 3008. By providing the elastic heat transfer member 3008 with the fin portion 3016, the surface area of ​​the elastic heat transfer member 3008 is increased, and the cooling efficiency of the recording medium 80 can be improved.

[0086] Furthermore, the heat generated by the recording medium 80 is also transferred from the mounting portion 3014 of the elastic heat transfer member 3008 to the control circuit board 3026. Since the control circuit board 3026 is exposed inside the first air-cooling duct 3005, the heat of the control circuit board 3026 can also be transferred to the air flowing inside the first air-cooling duct 3005, thereby improving the cooling efficiency of the recording medium 80.

[0087] The wall of the first air-cooling duct 3005 on the battery 70 side (+Z side) is composed of a duct base member 3019 and a battery storage section 3004 exposed from a duct opening 3011 (FIG. 18(a)) of the duct base member 3019. A part of the battery storage section 3004 is composed of a heat transfer plate 3013. That is, at least a part of the part of the battery storage section 3004 exposed inside the first air-cooling duct 3005 is composed of the heat transfer plate 3013 which is a thermally conductive member.

[0088] A portion of the battery storage section 3004 also serves as a portion of the first air-cooling duct 3005, thereby making it possible to reduce the thickness of the first air-cooling duct 3005. This allows the grip section 9 (FIG. 1(a)) of the imaging device 1 to be reduced in thickness in the optical axis direction. Note that while a portion of the battery storage section 3004 also serves as a portion of the first air-cooling duct 3005, conversely, a portion of the first air-cooling duct 3005 may also serve as a portion of the battery storage section 3004.

[0089] Furthermore, the heat transfer plate 3013 also serves as a part of the first air-cooling duct 3005, thereby improving the cooling efficiency of the battery 70. In this embodiment, the battery 70 and the heat transfer plate 3013 are not in contact with each other, but a configuration in which the battery 70 and the heat transfer plate 3013 are in contact with each other may be adopted.

[0090] FIG. 22 is a perspective view showing the flow path of the first air-cooling duct 3005. The duct base member 3019 has a first flow straightening rib 3020 that protrudes substantially in the optical axis direction. The battery storage section 3004 has a second flow straightening rib 3021 that protrudes substantially in the optical axis direction (see also FIG. 18(a)). Due to the action of the first flow straightening rib 3020 and the second flow straightening rib 3021, the air flow path in the first air-cooling duct 3005 becomes a flow path that bypasses the first flow straightening rib 3020 and the second flow straightening rib 3021 as indicated by the dashed arrow G. This generates an air flow throughout the entire duct, and the cooling efficiency of the recording medium 80 can be improved.

[0091] The contact relationship between the recording medium 80 and the elastic heat transfer member 3008 during the insertion process of the recording medium 80 will be described with reference to Figure 23. Figures 23(a), (b), and (c) are enlarged views of the periphery of the elastic heat transfer member 3008 in a cross section taken along line EE in Figure 17(a).

[0092] 23(a) shows the initial insertion state before the recording medium 80 comes into contact with the elastic heat transfer member 3008. In this state, a part of the elastic heat transfer member 3008 and a part of the recording medium 80 overlap when viewed from the insertion direction of the recording medium 80 (X-axis direction).

[0093] 23(b) shows the state in which the recording medium 80 is being inserted into the media slot 3002. During the process of inserting the recording medium 80, the recording medium 80 first comes into contact with the inclined portion 3017 of the elastic heat transfer member 3008. This makes it possible to reduce the force that the recording medium 80 receives from the elastic heat transfer member 3008.

[0094] 23(c) shows the state after the recording medium 80 has been inserted into the media slot 3002. In this state, the heat transfer surface 3015 of the elastic heat transfer member 3008 and the recording medium 80 are in contact.

[0095] 23(c), a configuration is adopted in which fin portion 3016 of elastic heat transfer member 3008 protrudes into the flow path of first air-cooling duct 3005. However, when emphasis is placed on making first air-cooling duct 3005 thinner, a configuration in which fin portion 3016 is eliminated from elastic heat transfer member 3008 may be adopted. In that case, elastic heat transfer member 3008 is connected to first air-cooling duct 3005 through board opening 3009, but is disposed at a position that does not protrude beyond control circuit board 3026 in the +Z direction.

[0096] According to this embodiment, the first air-cooling duct 3005 is disposed behind the imaging element board 102 in the optical axis direction and in front of the control circuit board 3026 and the media slot 3002 in the optical axis direction. The first air-cooling duct 3005 is thermally connected to the control circuit board 3026. Therefore, the same effect as in the first embodiment can be achieved in terms of efficiently cooling the recording medium 80 while suppressing an increase in size.

[0097] Further, an elastic heat transfer member 3008 is disposed in a board opening 3009 of the control circuit board 3026. Then, a heat transfer surface 3015 (first heat transfer portion) and the recording medium 80 come into contact with each other, and a fin portion 3016 (second heat transfer portion) is exposed from the board opening 3009 into the first air-cooling duct 3005 ( FIG. 21 ). In particular, the fin portion 3016 protrudes into the first air-cooling duct 3005. This allows the recording medium 80 to be cooled efficiently.

[0098] In addition, in the optical axis direction, the first air-cooling duct 3005 is disposed between the battery 70 and the control circuit board 3026, and the heat transfer plate 3013 constituting a part of the battery storage section 3004 also serves as a part of the first air-cooling duct 3005 (FIG. 21). At least a part of the battery storage section 3004 also serves as at least a part of the first air-cooling duct 3005, so that the grip section 9 of the imaging device 1 can be made thinner in the optical axis direction. In addition, the heat transfer plate 3013 also serves as a part of the first air-cooling duct 3005. That is, at least a part of the part of the battery storage section 3004 exposed in the first air-cooling duct 3005 is composed of the heat transfer plate 3013 which is a thermally conductive member. This also enhances the cooling efficiency of the battery 70.

[0099] Furthermore, at least a portion of the control circuit board 3026 also serves as at least a portion of the first air-cooling duct 3005 (FIG. 21), so that the image pickup device 1 can be prevented from becoming large.

[0100] Next, a modified example of this embodiment will be described with reference to Figures 24 to 26. In this modified example, a second elastic heat transfer member 3022 is employed instead of the elastic heat transfer member 3008 (Figure 19).

[0101] 24 is a perspective view of second elastic heat transfer member 3022. Second elastic heat transfer member 3022 is disposed in board opening 3009 of control circuit board 3026. The material of second elastic heat transfer member 3022 is the same as that of elastic heat transfer member 3008, and is a material such as metal having high elasticity and thermal conductivity. The shape of second elastic heat transfer member 3022 corresponds to the shape of elastic heat transfer member 3008 except that fin portion 3016 is eliminated and second heat transfer surface 3025 is provided instead.

[0102] 25 is a perspective view of the control circuit board 3026. A heat-transfer sheet member 3024 serving as a heat-transfer sealing member is disposed on the +Z side surface (the surface opposite to the recording medium 80) of the control circuit board 3026. The heat-transfer sheet member 3024 is made of a material with high heat conductivity such as metal, or a thin member such as a film.

[0103] FIG. 26 is an enlarged view of the periphery of the second elastic heat transfer member 3022 corresponding to FIG. 23(c). The heat transfer sheet member 3024 is arranged so as to cover the substrate opening 3009 (FIG. 18(b)). The heat transfer surface 3015 of the second elastic heat transfer member 3022 contacts the recording medium 80, and the second heat transfer surface 3025 of the second elastic heat transfer member 3022 contacts the heat transfer sheet member 3024. As a result, the heat of the recording medium 80 is transferred to the air flowing in the first air-cooling duct 3005 via the second elastic heat transfer member 3022 and the heat transfer sheet member 3024. In this configuration, sealing the substrate opening 3009 has the effect of improving the dust-proof and drip-proof performance of the recording medium 80. In addition, the absence of the fin portion 3016 has the effect of forming a thin duct.

[0104] Thus, according to this modification, the heat transfer sheet member 3024 is exposed inside the first air-cooling duct 3005. The heat transfer surface 3015 (first heat transfer portion) of the second elastic heat transfer member 3022 contacts the recording medium 80, and the second heat transfer surface 3025 (second heat transfer portion) of the second elastic heat transfer member 3022 contacts the heat transfer sheet member 3024. Therefore, the recording medium 80 can be cooled more efficiently.

[0105] (Fourth embodiment) 27 is a perspective view of the bottom side (-Y side) of an imaging device according to a fourth embodiment of the present invention. This imaging device 6000 is composed of an imaging device body 5000 and a lens 3. The configuration of the lens 3 is the same as that of the first embodiment.

[0106] This embodiment differs from the first embodiment mainly in the forced air-cooling structure of the media slot 202 (FIG. 3(a)). Parts that are not specifically mentioned are the same as those described in the first embodiment.

[0107] As shown in FIG. 27, a first intake port 5012 and a second intake port 5013 for taking in outside air into the inside of the imaging device body 5000 by a forced air-cooling mechanism are disposed on the bottom surface (−Y side surface) of the imaging device body 5000.

[0108] Fig. 28 is a perspective view of the control circuit board 5021 and each air-cooling duct. With reference to Fig. 28, a second air-cooling duct 5025 that mainly cools the IC 201 (Fig. 3(a)) on the control circuit board 5021 and a first air-cooling duct 5024 that cools the recording medium 80 and the image sensor unit 11 (Fig. 3(a)) will be described.

[0109] 28, the second air-cooling duct 5025 and the first air-cooling duct 5024 are connected by a duct connecting part 5028 across the control circuit board 5021. In addition, the first air-cooling duct 5024 and the second air-cooling duct 5025 are also connected by a third air-cooling duct 5023 in addition to the duct connecting part 5028.

[0110] The control circuit board 5021 is provided with a board opening 5022 which is a through hole for passing a third air-cooling duct 5023. The third air-cooling duct 5023 passes through the board opening 5022 and connects the first air-cooling duct 5024 and the second air-cooling duct 5025. Details of the board opening 5022 and the third air-cooling duct 5023 will be described later.

[0111] 29(a) and (b), a description will be given of the air flow for cooling the recording medium 80. Fig. 29(a) is a rear perspective view of the periphery of the control circuit board 5021, and Fig. 29(b) is a front perspective view of the periphery of the control circuit board 5021.

[0112] The flow of the first air 5031 passing through the third air-cooling duct 5023 is as follows. As shown in Fig. 29(a), the first air 5031 is taken in from the first air intake 5012 by the rotation of the cooling fan 15. The taken in air passes through the first air-cooling duct 5024, the third air-cooling duct 5023, the second air-cooling duct 5025, and the cooling fan 15 in this order, and is exhausted to the exhaust port connecting part 16.

[0113] The flow of the second air 5032 passing through the duct connecting part 5028 is as follows: As shown in Fig. 29(b), the second air 5032 is taken in from the second air intake port 5013 by the rotation of the cooling fan 15, passes through the first air-cooled duct 5024, the duct connecting part 5028, the second air-cooled duct 5025, and the cooling fan 15 in this order, and is exhausted to the exhaust port connecting part 16.

[0114] The first air 5031 mainly effectively cools the recording medium 80 and the IC 201 on the control circuit board 5021. The second air 5032 mainly effectively cools the image sensor unit 11 and the control circuit board 5021.

[0115] 30 is an XY plan view of the control circuit board 5021 as viewed from the rear side (-Z side). The arrangement of the board opening 5022 will be described. The media slot 202 and IC 201 are arranged on the control circuit board 5021. The third air-cooling duct 5023 is arranged near the media slot 202 to effectively cool the recording medium 80. Therefore, the board opening 5022 through which the third air-cooling duct 5023 passes is arranged in a position close to the media slot 202.

[0116] Here, IC201, which generates a large amount of heat, is disposed on control circuit board 5021. If IC201 is disposed near media slot 202, there is a concern that heat from IC201 will be transferred to media slot 202, causing recording medium 80 to become even hotter. Therefore, in this embodiment, by disposing board opening 5022 between media slot 202 and IC201 in the X-axis direction, board opening 5022 also serves to thermally insulate media slot 202 from IC201.

[0117] 30. Furthermore, the shape of the board opening 5022 does not have to be a rectangle as shown in Fig. 30 as long as the third air-cooling duct 5023 can pass through it. Furthermore, members other than the third air-cooling duct 5023, such as wiring, may pass through the board opening 5022 as long as they do not impede the arrangement of the third air-cooling duct 5023 or the heat dissipation of the media slot 202. In other words, it does not matter whether or not a member passes through the board opening 5022, and the type of member that passes through is also not important.

[0118] 31(a) and (b) are XY plan views, seen from the rear and front, respectively, of the media slot 202 into which the recording medium 80 has been inserted. The shape of the media slot 202 will now be described.

[0119] 31(b), the media slot 202 is electrically connected to the control circuit board 5021. The exterior of the media slot 202 is shaped to have a wraparound portion 5210 that wraps around to between the recording medium 80 and the control circuit board 5021. Therefore, when viewed from the mounting surface side (+Z side) of the control circuit board 5021, the recording medium 80 and the wraparound portion 5210 at least partially overlap each other.

[0120] Next, the heat dissipation structure of the media slot 202 will be described with reference to Fig. 32. Fig. 32 is an exploded front perspective view of the configuration relating to the control circuit board 5021, the media slot 202, and the air flow path.

[0121] The control circuit board 5021 has a through hole 5230 in a range where the control circuit board 5021 and the wraparound portion 5210 overlap when projected as viewed from the optical axis direction. An elastic heat dissipation member 5220 is disposed in the through hole 5230. As a result, the wraparound portion 5210 of the media slot 202 and the first air-cooling duct 5024 are thermally connected via the heat dissipation member 5220.

[0122] The through-hole 5230 is formed in a size and position such that the recording medium 80 is not exposed from the through-hole 5230 when the recording medium 80 is inserted into the media slot 202. As a result, the heat dissipation member 5220 does not interfere with the insertion and removal of the recording medium 80, and does not apply a load to the recording medium 80.

[0123] Furthermore, the second air-cooling duct 5025 and the media slot 202 are thermally connected via the heat dissipation member 5050. Furthermore, the media slot 202 and the third air-cooling duct 5023 are thermally connected via the heat dissipation member 5050.

[0124] Here, by arranging the board opening 5022 and the third air-cooling duct 5023 in the vicinity of the media slot 202, the cool air taken in from the first air intake 5012 can be made to flow near the media slot 202. This makes it possible to more effectively dissipate heat from the media slot 202 via the heat dissipation member 5050. Since the media slot 202 is thermally connected to each air-cooling duct, the heat dissipation efficiency of the media slot 202 can be improved.

[0125] According to this embodiment, the first air-cooling duct 5024 is disposed behind the image sensor unit 11 in the optical axis direction and in front of the control circuit board 5021 and the media slot 202 in the optical axis direction. The first air-cooling duct 5024 is thermally connected to the control circuit board 5021. Therefore, the same effect as in the first embodiment can be achieved in terms of efficiently cooling the recording medium 80 while suppressing an increase in size.

[0126] Furthermore, a third air-cooling duct 5023 passes through a substrate opening 5022 of the second air-cooling duct 5025, and connects the first air-cooling duct 5024 and the second air-cooling duct 5025. At least one of the second air-cooling duct 5025 or the third air-cooling duct 5023 and the media slot 202 is thermally connected by a sheet-shaped heat dissipation member 5050. This allows the media slot 202 to be cooled efficiently.

[0127] Moreover, when viewed from the optical axis direction, the board opening 5022 is located between the IC 201, which is the main heat source in the control circuit board 5021, and the media slot 202 (FIG. 30). This thermally isolates the media slot 202 from the IC 201, thereby improving the heat dissipation efficiency of the media slot 202.

[0128] Furthermore, the media slot 202 and the first air-cooling duct 5024 are thermally connected via the heat dissipation member 5220 disposed in the through hole 5230 (FIG. 32). This makes it possible to improve the heat dissipation efficiency of the media slot 202.

[0129] Furthermore, since the recording medium 80 is not exposed to the side of the first air-cooling duct 5024 through the through-hole 5230, the load on the recording medium 80 can be suppressed.

[0130] A modified example of the fourth embodiment will be described with reference to Fig. 33. In this modified example, a plurality of media slots 202 are arranged side by side in the Y direction.

[0131] Figure 33 is an exploded front perspective view of a control circuit board 5021 on which two media slots 202 are arranged. In Figure 33, two media slots 202 are arranged side by side in the Y direction, but the number of media slots 202 may be three or more.

[0132] 33 is an area where wraparound portions 5210 of media slots 202 are adjacent to each other. Through holes 5230 and heat dissipation members 5220 are arranged so as to thermally connect portion 5300 surrounded by dashed line to first air-cooling duct 5024. Since portion 5300 surrounded by dashed line is an area where media slots 202, which are heat sources, are close to each other, it is a place where heat tends to build up.

[0133] Therefore, the portion enclosed by the dashed line 5300 is thermally connected to the first air-cooling duct 5024. As a result, even when multiple media slots 202 are installed in the Y direction, heat generated by the recording media 80 in the media slots 202 can be efficiently dissipated to the first air-cooling duct 5024.

[0134] In each embodiment, the term "approximately" does not mean to exclude completely. For example, "approximately parallel," "approximately perpendicular," "approximately the same plane," and "approximately the optical axis direction" are intended to include completely parallel, vertical, orthogonal, the same plane, and the optical axis direction, respectively.

[0135] Although the present invention has been described in detail based on the preferred embodiments, the present invention is not limited to these specific embodiments, and various forms within the scope of the gist of the present invention are also included in the present invention. Parts of the above-described embodiments may be combined as appropriate.

[0136] The disclosure of this embodiment includes the following configuration. (Configuration 1) A first substrate that is substantially perpendicular to the optical axis direction; a second substrate disposed substantially parallel to the first substrate and on one side of the optical axis direction; a storage section mounted on the second substrate and capable of storing a recording medium; a first air-cooling duct arranged on the one side of the first substrate in the optical axis direction and on the other side of the second substrate and the storage portion in the optical axis direction; a fan that generates an air flow in the first air-cooling duct; 2. An imaging device, comprising: a first cooling duct that is thermally connected to at least one of the recording medium, the storage unit, and the second substrate. (Configuration 2) 2. The imaging device according to claim 1, wherein the storage section is mounted on the one side of the second substrate in the optical axis direction. (Configuration 3) an imaging element is mounted on the first substrate; 3. The imaging device according to configuration 1 or 2, wherein the imaging element is thermally connected to the first air-cooling duct. (Configuration 4) a second air-cooling duct disposed on the other side of the second substrate in the optical axis direction; 4. The imaging device according to any one of configurations 1 to 3, wherein the second air-cooling duct is thermally connected to a main heat source in the second substrate. (Configuration 5) 5. The imaging device according to configuration 4, further comprising a connecting portion that connects the first air-cooling duct and the second air-cooling duct. (Configuration 6) the imaging device has a gripping portion that is gripped during use, a battery is stored in an area that overlaps with the grip portion when viewed from the optical axis direction; 6. The imaging device according to any one of configurations 1 to 5, wherein the first air-cooling duct is disposed between the battery and the second board in the optical axis direction. (Configuration 7) an imaging element is mounted on the first substrate; 7. The imaging device according to any one of configurations 1 to 6, further comprising a drive mechanism that moves a unit including the imaging element and the first substrate in a direction perpendicular to the optical axis direction. (Configuration 8) a battery overlapping at least a portion of the storage section when viewed from the optical axis direction; 2. The imaging device according to configuration 1, wherein the first air-cooling duct is disposed at a position that does not overlap the battery when viewed from the optical axis direction and overlaps with the storage section. (Configuration 9) 9. The imaging device according to configuration 8, wherein the first air-cooling duct takes in air from a position overlapping with the storage section when viewed from the optical axis direction. (Configuration 10) the first air-cooling duct includes a first wall adjacent to the second substrate in the optical axis direction and substantially parallel to the second substrate, and a second wall provided at a position farther from the second substrate in the optical axis direction than the first wall and substantially parallel to the second substrate, An imaging device as described in configuration 8 or 9, characterized in that a deformable heat transfer member penetrates the first wall and the second substrate and abuts both the recording medium and the second wall. (Configuration 11) 11. The imaging device according to configuration 10, wherein a deformable range of the heat transfer member is longer than a distance between the first wall and the second wall in the optical axis direction. (Configuration 12) the first wall and the second wall are connected by a third wall, 12. The imaging device according to configuration 11, wherein the heat transfer member is housed in an area surrounded by the third wall. (Configuration 13) a contact member is provided at a tip of the heat transfer member, the heat transfer member is in contact with the recording medium via the contact member, 13. The imaging device according to configuration 12, wherein an inclined surface is provided on an end of the abutting member. (Configuration 14) the second substrate has an opening; An elastic heat transfer member is disposed in the opening, a first heat transfer portion of the elastic heat transfer member contacts the recording medium; 2. The imaging device according to configuration 1, wherein the second heat transfer portion of the elastic heat transfer member is exposed from the opening to the inside of the first air-cooling duct. (Configuration 15) 15. The imaging device according to configuration 14, wherein the second heat transfer portion protrudes into the first air-cooling duct. (Configuration 16) A battery storage section for storing a battery is provided. In the optical axis direction, the first air-cooling duct is disposed between the battery and the second board, 15. The imaging device according to configuration 14, wherein at least a portion of the battery storage section doubles as at least a portion of the first air-cooling duct. (Configuration 17) 17. The imaging device according to configuration 16, wherein at least a part of the battery storage section exposed inside the first air-cooling duct is made of a thermally conductive material. (Configuration 18) 17. The imaging device according to configuration 16, wherein at least a portion of the second substrate also serves as at least a portion of the first air-cooling duct. (Configuration 19) the second substrate has an opening; An elastic heat transfer member is disposed in the opening, a heat-transfer sealing member that covers the opening is provided on a surface of the second substrate opposite to the recording medium; the heat transfer sealing member is exposed within the first air cooling duct; a first heat transfer portion of the elastic heat transfer member contacts the recording medium; 2. The imaging device according to configuration 1, wherein the second heat transfer portion of the elastic heat transfer member and the heat transfer sealing member are in contact with each other. (Configuration 20) a second air-cooling duct disposed on the other side of the second substrate in the optical axis direction; a third air-cooled duct connecting the first air-cooled duct and the second air-cooled duct, an opening for passing the third air-cooling duct is formed in the second board near the storage section; 2. The imaging device according to configuration 1, wherein at least one of the second air-cooling duct and the third air-cooling duct is thermally connected to the storage unit by a sheet-shaped heat dissipation member. (Configuration 21) 21. The imaging device of configuration 20, wherein the opening is located between a main heat source and the storage section on the second substrate. (Configuration 22) a heat dissipation member is disposed in a through hole formed in the second substrate in a range that overlaps with the storage portion when projected in the optical axis direction; 22. The imaging device according to configuration 20 or 21, wherein the storage section and the first air-cooling duct are thermally connected via the heat dissipation member. (Configuration 23) 23. The imaging device according to configuration 22, wherein the recording medium is not exposed to the side of the first air-cooling duct through the through hole. [Explanation of symbols]

[0137] 12 First air cooling duct 13 Control circuit board 15 Cooling fan 80 Recording Media 101 Image sensor 102 Image sensor board 202 Media Slot

Claims

1. a first substrate disposed so as to be substantially perpendicular to the optical axis; a second substrate disposed substantially parallel to the first substrate and on one side in the optical axis direction; a storage section mounted on the second substrate and capable of storing a recording medium; a first air-cooling duct disposed on the one side of the first substrate in the optical axis direction and on the other side of the second substrate and the storage portion in the optical axis direction; a fan that generates an airflow in the first air-cooling duct, The imaging device, wherein the first air-cooling duct is thermally connected to at least one of the recording medium, the storage section, and the second substrate.

2. The imaging device according to claim 1 , wherein the storage section is mounted on the one side of the second substrate in the optical axis direction.

3. an imaging element is mounted on the first substrate; 2. The imaging device according to claim 1, wherein the imaging element is thermally connected to the first air-cooling duct.

4. a second air-cooling duct disposed on the other side of the second substrate in the optical axis direction; 2. The imaging device according to claim 1, wherein the second air-cooling duct is thermally connected to a main heat source in the second substrate.

5. 5. The imaging device according to claim 4, further comprising a connecting portion that connects the first air-cooling duct and the second air-cooling duct.

6. the imaging device has a grip portion that is gripped when in use, a battery is housed in an area that overlaps the grip portion when viewed from the optical axis direction; 2. The imaging device according to claim 1, wherein the first cooling duct is disposed between the battery and the second board in the optical axis direction.

7. an imaging element is mounted on the first substrate; 2. The imaging device according to claim 1, further comprising a drive mechanism for moving a unit including the imaging element and the first substrate in a direction substantially perpendicular to the optical axis.

8. a battery that overlaps at least a portion of the storage section when viewed from the optical axis direction; 2. The imaging device according to claim 1, wherein the first air-cooling duct is disposed at a position that does not overlap the battery when viewed in the optical axis direction, but overlaps the storage section.

9. 9. The imaging device according to claim 8, wherein the first air-cooling duct takes in air from a position overlapping the storage section when viewed in the optical axis direction.

10. the first air-cooling duct includes a first wall adjacent to the second substrate in the optical axis direction and substantially parallel to the second substrate, and a second wall provided at a position farther from the second substrate in the optical axis direction than the first wall and substantially parallel to the second substrate, 9. The imaging device according to claim 8, wherein a deformable heat transfer member penetrates the first wall and the second substrate and abuts against both the recording medium and the second wall.

11. 11. The imaging device according to claim 10, wherein the deformable range of the heat transfer member is longer than the distance between the first wall and the second wall in the optical axis direction.

12. the first wall and the second wall are connected by a third wall, 12. The imaging device according to claim 11, wherein the heat transfer member is accommodated in an area surrounded by the third wall.

13. a contact member is provided at a tip of the heat transfer member, the heat transfer member contacts the recording medium via the contact member; 13. The imaging device according to claim 12, wherein an inclined surface is provided on an end of the contact member.

14. the second substrate has an opening; An elastic heat transfer member is disposed in the opening, a first heat transfer portion of the elastic heat transfer member contacting the recording medium; 2. The imaging device according to claim 1, wherein the second heat transfer portion of the elastic heat transfer member is exposed to the inside of the first air-cooling duct through the opening.

15. 15. The imaging device according to claim 14, wherein the second heat transfer portion projects into the first air-cooling duct.

16. a battery storage section for storing a battery; the first air-cooling duct is disposed between the battery and the second board in the optical axis direction; 15. The imaging device according to claim 14, wherein at least a portion of the battery storage section also serves as at least a portion of the first air-cooling duct.

17. 17. The imaging device according to claim 16, wherein at least a part of the battery storage section that is exposed to the inside of the first air-cooling duct is made of a thermally conductive material.

18. 17. The imaging device according to claim 16, wherein at least a portion of the second substrate also serves as at least a portion of the first air-cooling duct.

19. the second substrate has an opening; An elastic heat transfer member is disposed in the opening, a heat-transfer sealing member that covers the opening is provided on a surface of the second substrate opposite to the recording medium; the heat transfer sealing member is exposed within the first air cooling duct; a first heat transfer portion of the elastic heat transfer member contacting the recording medium; 2. The imaging device according to claim 1, wherein the second heat transfer portion of the elastic heat transfer member and the heat transfer sealing member are in contact with each other.

20. a second air-cooling duct disposed on the other side of the second substrate in the optical axis direction; a third air-cooling duct connecting the first air-cooling duct and the second air-cooling duct, an opening for allowing the third air-cooling duct to pass through is formed in the second board near the storage section; 2. The imaging device according to claim 1, wherein at least one of the second air-cooling duct and the third air-cooling duct is thermally connected to the storage section by a sheet-like heat dissipation member.

21. 21. The imaging device according to claim 20, wherein the opening is located between the main heat source and the storage section on the second substrate.

22. a heat dissipation member is disposed in a through hole formed in the second substrate in a range that overlaps the storage portion when projected in the optical axis direction; 21. The imaging device according to claim 20, wherein the storage section and the first air-cooling duct are thermally connected via the heat dissipation member.

23. 23. The imaging device according to claim 22, wherein the recording medium is not exposed to the first air-cooling duct side through the through hole.

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