Semiconductor manufacturing device, push-up unit, and method for manufacturing semiconductor device

Abstract

To provide a technique capable of reducing damage to a die.SOLUTION: A semiconductor manufacturing device includes a wafer holder that holds a dicing tape to which a die is attached, and a push-up unit having a block portion that pushes up the dicing tape. The block portion includes an outer block that has a length in a first direction longer than a length in a second direction in a plan view and has a plurality of openings, and an inner block that is arranged inside the openings. A plurality of the inner blocks are arranged side by side along the first direction.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to semiconductor manufacturing equipment and is applicable to, for example, a die bonder having a push-up unit. [Background technology]

[0002] One of the manufacturing processes for semiconductor devices is a peeling process in which dies separated from a wafer are peeled off from a dicing tape. In the peeling process, for example, the dies are pushed up from the back surface of the dicing tape by a push-up unit, peeled off one by one from the dicing tape held by a wafer supply unit, and picked up by a suction nozzle such as a collet provided on a pickup head or a bond head.

[0003] For example, a push-up unit moves a plurality of blocks up and down to peel off the dicing tape from the periphery of the die (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-114399 A Summary of the Invention [Problem to be solved by the invention]

[0005] When the die is peeled off from the dicing tape by the push-up unit, the die may be damaged.

[0006] An object of the present disclosure is to provide a technique capable of reducing damage to a die. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0007] A brief summary of representative aspects of this disclosure is as follows. That is, the semiconductor manufacturing apparatus includes a wafer holder that holds a dicing tape to which a die is attached, and a push-up unit having a block portion that pushes up the dicing tape. The block portion includes an outer block that has a length in a first direction longer than a length in a second direction in a plan view and has a plurality of openings, and an inner block that is arranged inside the openings. A plurality of the inner blocks are arranged side by side along the first direction. Effect of the Invention

[0008] According to the present disclosure, damage to the die can be reduced. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic top view showing an example of the configuration of a die bonder in an embodiment. [Diagram 2] FIG. 2 is a diagram for explaining a schematic configuration when viewed from the direction of arrow A in FIG. [Diagram 3] FIG. 3 is a schematic cross-sectional view showing a main part of the wafer supply unit shown in FIG. [Figure 4] FIG. 4 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. [Diagram 5] FIG. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. [Figure 6] FIG. 6 is a schematic cross-sectional view of a main part of the push-up unit shown in FIG. [Figure 7] FIG. 7 is a top view of the push-up unit shown in FIG. [Figure 8] FIG. 8 is a diagram for explaining a thrust sequence in one operation example of the thrust unit shown in FIG. [Figure 9] FIG. 9 is a diagram for explaining a push-up sequence in a first modified example of the push-up unit shown in FIG. [Figure 10] FIG. 10 is a top view of a block portion of a push-up unit in the second modified example. [Figure 11]FIG. 11 is a top view of the inner block in the third modified example. [Figure 12] FIG. 12 is a top view of a block portion of a push-up unit in the fourth modified example. [Figure 13] FIG. 13 is a schematic cross-sectional view of a main part of a push-up unit in a fifth modified example. [Figure 14] FIG. 14 is a top view of the block portion shown in FIG. [Figure 15] FIG. 15 is a diagram for explaining the thrust-up sequence of the thrust-up unit shown in FIG. [Figure 16] FIG. 16 is a schematic cross-sectional view of a main part of a push-up unit in a sixth modified example. [Figure 17] FIG. 17 is a top view of the block portion shown in FIG. [Figure 18] FIG. 18 is a schematic cross-sectional view of a main part of a push-up unit in a seventh modified example. [Figure 19] FIG. 19 is a top view of the block portion shown in FIG. [Figure 20] FIG. 20 is a schematic cross-sectional view of a main part of a push-up unit in the eighth modified example. [Figure 21] FIG. 21 is a top view of the block portion shown in FIG. [Figure 22] FIG. 22 is a top view of a block portion of a push-up unit in the ninth modified example. [Figure 23] FIG. 23 is a top view of a block portion of a push-up unit in a tenth modified example. [Figure 24] FIG. 24 is a schematic cross-sectional view of a main part of a push-up unit in an eleventh modified example. [Diagram 25] FIG. 25 is a top view of the block portion shown in FIG. [Figure 26] FIG. 26 is a schematic cross-sectional view of a main part of a push-up unit in a twelfth modified example. [Figure 27] FIG. 27 is a top view of the block portion shown in FIG. [Figure 28] FIG. 28 is a cross-sectional view of a main part of a push-up unit in a thirteenth modified example. [Figure 29] FIG. 29 is a cross-sectional view of a main part of a push-up unit in a fourteenth modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments and modifications will be described with reference to the drawings. However, in the following description, the same components are given the same reference numerals and repeated description may be omitted. Note that, in order to make the description clearer, the width, thickness, shape, etc. of each part may be shown in a schematic manner compared to the actual embodiment. Furthermore, the dimensional relationship between each element, the ratio of each element, etc. do not necessarily match between multiple drawings.

[0011] The configuration of a die bonder as an embodiment of a semiconductor manufacturing apparatus will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a schematic top view showing an example of the configuration of a die bonder in an embodiment. Fig. 2 is a diagram explaining the schematic configuration as seen from the direction of arrow A in Fig. 1. Fig. 3 is a schematic cross-sectional view showing a main part of a wafer supply unit shown in Fig. 1.

[0012] The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device) 80. The Y2-Y1 direction is the front-rear direction of the die bonder 1, the X2-X1 direction is the left-right direction, and the Z1-Z2 direction is the up-down direction. The wafer supply unit 10 is disposed on the front side of the die bonder 1, and the bonding unit 40 is disposed on the rear side.

[0013] The wafer supply section 10 includes a wafer cassette lifter 11, a wafer holder 12, a push-up unit 13, and a wafer recognition camera 14.

[0014] A wafer cassette lifter 11 moves a wafer cassette (not shown), in which a plurality of wafer rings WR are stored, up and down to the wafer transport height. A wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) removes the wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0015] The wafer holder 12 has an expand ring 121 that holds the wafer ring WR, and a support ring 122 that is held by the wafer ring WR and horizontally positions the dicing tape DT. The push-up unit 13 is disposed inside the support ring 122.

[0016] A wafer W is attached (pasted) onto a dicing tape DT, and the wafer W is divided into multiple dies D. The dicing tape DT is transparent to visible light. A film-like adhesive material DF called a die attach film (DAF) is attached between the wafer W and the dicing tape DT. The adhesive material DF hardens when heated.

[0017] Wafer holder 12 moves in the X1-X2 and Y1-Y2 directions by a drive unit, not shown, and moves the die D to be picked up to the position of push-up unit 13. Wafer holder 12 also rotates wafer ring WR in the XY plane by a drive unit, not shown. Push-up unit 13 moves in the vertical direction by a drive unit, not shown. Push-up unit 13 peels off die D from dicing tape DT. Wafer holder 12 and push-up unit 13 constitute a pickup device. The pickup device may include a pickup section 20.

[0018] The wafer recognition camera 14 detects the pick-up position of the die D to be picked up from the wafer W and inspects the surface of the die D.

[0019] The pickup unit 20 has a pickup head 21 and a Y drive unit 23. The pickup head 21 is provided with a collet 22 that suction-holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y1-Y2 direction. The pickup unit 20 has each drive unit (not shown) that raises and lowers, rotates, and moves the pickup head 21 in the X direction.

[0020] The intermediate stage unit 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has suction holes that adsorb the placed die D. The placed die D is temporarily held on the intermediate stage 31. The intermediate stage 31 is both a placement stage on which the die D is placed, and a pick-up stage on which the die D is picked up.

[0021] The bonding section 40 has a bond head 41, a Y drive section 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that suction-holds the die D at its tip. The Y drive section 43 moves the bond head 41 in the Y1-Y2 direction. The substrate recognition camera 44 captures an image of a position recognition mark (not shown) on the substrate S and recognizes the bond position. Here, the substrate S has a plurality of product areas (hereinafter referred to as package areas P) that will eventually become one package. A position recognition mark is provided for each package area P. When the die D is placed on the substrate S, the bond stage 46 is raised and supports the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum-suctioning the substrate S, and can fix the substrate S. The bond stage 46 has a heating section (not shown) for heating the substrate S. The bonding section 40 has various drive sections (not shown) for raising and lowering, rotating, and moving the bond head 41 in the X direction.

[0022] With this configuration, the bond head 41 corrects the pick-up position and attitude based on the imaging data of the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die D onto the package area P of the substrate S based on the imaging data of the substrate recognition camera 44, or bonds the die D by stacking it on top of a die already bonded onto the package area P of the substrate S.

[0023] The transport section 50 has a transport claw 51 that grips and transports the substrate S, and a transport lane 52 along which the substrate S moves. The substrate S moves in the X direction by driving a nut (not shown) of the transport claw 51 provided on the transport lane 52 by a ball screw (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply section 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading section 70 and hands the substrate S over to the substrate unloading section 70.

[0024] The substrate supplying section 60 removes the substrate S, which has been stored in the transport jig and carried in, from the transport jig and supplies it to the transporting section 50. The substrate unloading section 70 stores the substrate S transported by the transporting section 50 in the transport jig.

[0025] Next, the control unit 80 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing a schematic configuration of a control system of the die bonder shown in Fig. 1.

[0026] The control system 8 includes a control unit (control device) 80, a drive unit 86, a signal unit 87, an optical system 88, etc. The control unit 80 mainly includes a control / arithmetic unit 81 composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus line 84, and a power supply unit 85. The storage device 82 includes a main storage device 82a and an auxiliary storage device 82b. The main storage device 82a is composed of a RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage device 82b is composed of a HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data, image data, etc. required for control.

[0027] The input / output device 83 includes a monitor 83a for displaying the device status and information, a touch panel 83b for inputting an operator's instruction, a mouse 83c for operating the monitor 83a, and an image capture device 83d for capturing image data from the optical system 88. The input / output device 83 further includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls the XY table (not shown) of the wafer supply unit 10, the ZY drive shaft of the bond head table, the drive unit of the push-up unit 13, and the like. The I / O signal control device 83f captures or controls signals from a signal unit 87 including switches and volumes for controlling the brightness of various sensors and lighting devices. The optical system 88 includes a wafer recognition camera 14, a stage recognition camera 34, and a substrate recognition camera 44. The control / arithmetic device 81 captures and calculates necessary data via the bus line 84, controls the pickup head 21, and sends information to the monitor 83a, and the like.

[0028] A part of the manufacturing process of a semiconductor device using the die bonder 1 (a method for manufacturing a semiconductor device) will be described with reference to Fig. 5. Fig. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by a control unit 80.

[0029] (Wafer loading process: process S1) The wafer ring WR is supplied to the wafer cassette of the wafer cassette lifter 11. The supplied wafer ring WR is then supplied to the wafer holder 12. The wafer W is previously inspected for each die by an inspection device such as a prober, and wafer map data indicating whether the die is good or bad is generated. This wafer map data is stored in a storage device of the control unit 80.

[0030] (Substrate loading process: Process S2) The transport jig storing the substrate S is supplied to the substrate supply section 60. In the substrate supply section 60, the substrate S is taken out of the transport jig and fixed to the transport claws 51.

[0031] (Pickup process: process S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 14, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder, and the die is positioned. Note that the die position reference point is previously held at a predetermined position of the wafer holder 12 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

[0032] The positioned die D is peeled off from the dicing tape DT by the push-up unit 13 and the pick-up head 21. The die D peeled off from the dicing tape DT is attracted to and held by a collet 22 provided on the pick-up head 21, and is transported to and placed on the intermediate stage 31.

[0033] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and the positioning and surface inspection of the die D are performed based on the image data acquired by photographing. The image data is subjected to image processing to calculate the amount of deviation (X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder, and positioning is performed. Note that the die position reference point is previously held at a predetermined position of the intermediate stage 31 as the initial setting of the device. The image data is subjected to image processing to perform surface inspection of the die D.

[0034] The pickup head 21 that transported the die D to the intermediate stage 31 is returned to the wafer supply unit 10. The next die D is peeled off from the dicing tape DT according to the above-mentioned procedure, and thereafter, the dies D are peeled off one by one from the dicing tape DT according to the same procedure.

[0035] (Bond process: Process S4) The substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and the substrate S is positioned and its surface inspected based on the image data acquired by the image capture. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder 1. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting of the device. The image data is processed to inspect the surface of the substrate S.

[0036] The suction position of the bond head 41 is corrected based on the deviation of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41, which has sucked the die D from the intermediate stage 31, bonds the die D to a predetermined location of the substrate S supported by the bond stage 46. Here, the predetermined location of the substrate S is the package area P of the substrate S, or an area where an element is already placed and an element is to be bonded in addition to the already placed element, or a bonding area of ​​an element to be laminated and bonded. The substrate recognition camera 44 photographs the die D bonded to the substrate S, and an inspection is performed based on image data acquired by photographing to determine whether the die D has been bonded at the desired location, etc.

[0037] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until a die D is bonded to every package area P of the substrate S.

[0038] (Substrate unloading process: Process S5) The substrate S with the die D bonded thereto is transported to the substrate unloading section 70. In the substrate unloading section 70, the substrate S is removed from the transport claws 51 and stored in a transport jig. The transport jig storing the substrate S is unloaded from the die bonder 1.

[0039] As described above, the die D is mounted on the substrate S and is carried out from the die bonder 1. Thereafter, for example, a transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, and the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to a molding process, and the die D and the Au wires are sealed with molding resin (not shown), thereby completing a semiconductor package.

[0040] In the case of stacked bonding, following the wire bonding process, a transport jig on which a substrate S on which a die D is mounted is loaded and stored is transported into a die bonder, and the die D is stacked on the die D mounted on the substrate S. Then, after being transported out of the die bonder, the die D is electrically connected to the electrodes of the substrate S via Au wires in a wire bonding process. The dies D above the second stage are peeled off from the dicing tape DT by the above-mentioned method, transported to the bonding section, and stacked on the dies D. After the above process is repeated a predetermined number of times, the substrate S is transported to a molding process, and a stacked package is completed by sealing the multiple dies D and the Au wires with molding resin (not shown).

[0041] Next, the push-up unit 13 will be described with reference to Fig. 6 and Fig. 7. Fig. 6 is a schematic cross-sectional view of a main part of the push-up unit shown in Fig. 2. Fig. 7 is a top view of the push-up unit shown in Fig. 6.

[0042] The push-up unit 13 has a block portion 131 provided on a cylindrical dome 132. A plurality of suction ports 1321 and a plurality of grooves 1322 connecting the plurality of suction ports 1321 are provided on the periphery of the upper surface of the dome 132. The inside of the suction port 1321 is depressurized by a suction mechanism (not shown) when the push-up unit 13 is raised and its upper surface is brought into contact with the back surface of the dicing tape DT. At this time, the back surface of the dicing tape DT is sucked downward and comes into close contact with the upper surface of the dome 132.

[0043] A block portion 131 having blocks B0 to B4 that push up the dicing tape DT is assembled in the center of the dome 132. Block B0 is a rectangular prism and has multiple rectangular openings that penetrate in the Z1-Z2 direction. Blocks B1 to B4 are also rectangular prisms and are disposed in the openings of block B0. Blocks B1 to B4 are rectangular in plan view.

[0044] The outer periphery of the block B0 is approximately the same size as or slightly larger than the outer periphery of the die D. In other words, the length of the block B0 in the Y1-Y2 direction (length in the short side direction, width) is approximately the same as the length of the die D in the Y1-Y2 direction (length in the short side direction, width), and the length of the block B0 in the X1-X2 direction (length in the long side direction) is approximately the same as the length of the die D in the X1-X2 direction (length in the long side direction).

[0045] 6, blocks B0 to B4 can be moved up and down independently by drive shafts ND0 to ND4 of a drive unit 133. The drive unit 133 includes four motors (not shown) and plunger mechanisms that convert the rotation of the motors into up and down movement by means of a cam or link, and applies up and down movement to the drive shafts ND0 to ND4.

[0046] Next, a method for setting and controlling the operation of the thrust-up unit 13 will be described.

[0047] Based on the time chart recipe, the control unit 80 is configured to control the drive axes ND0 to ND4 that drive the blocks B0 to B4, respectively. The time chart recipe sets the operation of the blocks B0 to B4 of the thrust-up unit 13 for each block and step, including the step time, the rising or falling speed of the block, and the height (position) of the block.

[0048] A plurality of time chart recipes with different setting items are prepared, and the user selects one of the plurality of time chart recipes using a GUI (Graphical User Interface) and inputs setting values ​​to the items of the selected time chart recipe. Alternatively, the user transmits data of the time chart recipe, in which setting values ​​have been input in advance, from an external device to a semiconductor manufacturing apparatus such as a die bonder, or installs the time chart recipe from an external storage device to the semiconductor manufacturing apparatus. The external storage device is, for example, a magnetic tape, a magnetic disk such as a flexible disk or a hard disk, an optical disk such as a CD or a DVD, a magneto-optical disk such as an MO, or a semiconductor memory such as a USB memory or a memory card.

[0049] As described above, by setting the time chart recipe, the operation of each of the blocks B0 to B7 of the thrust-up unit 13 can be freely set within the thrust-up operation steps, and the thrust-up unit 13 can perform various operations.

[0050] An example of the operation of the thrust-up unit 13 will be described with reference to Fig. 8. Fig. 8 is a diagram for explaining a thrust-up sequence in one example of the operation of the thrust-up unit shown in Fig. 6.

[0051] (Zeroth step: STEP0) The pick-up operation starts when the target die D on the dicing tape DT is positioned by the push-up unit 13 and the collet 22. When positioning is complete, the control unit 80 sucks the dicing tape DT onto the upper surface of the push-up unit 13 by drawing a vacuum through the suction port 1321 of the push-up unit 13 and the gaps between the blocks B0 to B4. At this time, the upper surfaces of the blocks B0 to B4 are at the same height (initial position) as the upper surface of the dome 132. In this state, the control unit 80 supplies a vacuum from a vacuum supply source (not shown), and lowers the collet 22 toward the device surface of the die D while drawing a vacuum, until it lands.

[0052] (First step: STEP 1) Thereafter, the control unit 80 simultaneously raises the blocks B0 to B4 to a predetermined height (H2) at a predetermined speed (s1). Here, the die D rises while being sandwiched between the collet 22 and the blocks B0 to B4, but the peripheral portion of the dicing tape DT remains vacuum-adsorbed to the suction port 1321 of the dome 132, which is the periphery of the push-up unit 13, so tension is generated around the die D. As a result, peeling of the dicing tape DT starts around the die D.

[0053] (Second step: STEP2) Next, the control unit 80 lowers the block B0 to the same height as the upper surface of the dome 132 at a predetermined speed (s2).

[0054] (Third step: STEP3) Next, the control unit 80 lowers the block B1 at a predetermined speed (s2) until the block B1 is at the same height as the upper surface of the dome 132. Here, as the block B1 descends to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0055] (Fourth step: STEP 4) Next, the control unit 80 lowers the block B2 at a predetermined speed (s2) until the block B2 is at the same height as the upper surface of the dome 132. Here, as the block B2 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0056] (Fifth step: STEP5) Next, the control unit 80 lowers the block B3 at a predetermined speed (s2) to the same height as the upper surface of the dome 132. Here, as the block B3 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0057] Thereafter, the control unit 80 lifts the collet 22 upward, and lowers the block B4 at a predetermined speed (s3) to return it to the initial position, thereby completing the operation of peeling the die D from the dicing tape DT.

[0058] The above-mentioned thrust sequence (operation) is referred to as RMS (Reverse Multi Step) in this specification.

[0059] The push-up unit 13 is applicable to dies with a high aspect ratio, for example, an aspect ratio of 5:1 or more. For example, it is applicable to dies for LCD (liquid crystal display) drivers. It is also applicable to dies with a narrow short side length (width) even if the aspect ratio is less than 5:1.

[0060] For example, the width (overhang) of the outer frame where block B0 contacts the dicing tape DT is about 0.2 mm, the length (width) of blocks B1 to B4 in the Y1-Y2 direction is 0.1 mm or more, and taking into account the gaps between the blocks, it is possible to accommodate a die with a minimum width of about 0.6 mm. Since the push-up block in the Y1-Y2 direction is two-stage, it is preferable that the width of blocks B1 to B4 is not too large, for example, 1.5 mm or less. In this case, the maximum width of the die is about 2 mm.

[0061] According to the embodiment, it is possible to push up in two or more stages even for push-up blocks with narrow short sides (width), so damage to the die can be reduced when pushing up a die with a small width. Push-up in even more stages is possible for long sides, and the overhang when the outer blocks are lowered can be reduced, so damage (defects) such as cracking and chipping of the die can be reduced. Here, overhang refers to the outer periphery of the die D protruding outward from the end of the outermost block that is in contact with the dicing tape DT.

[0062] <Modification> Below, some representative modified examples of the embodiment are exemplified. In the following description of the modified examples, the same reference numerals as those in the above-mentioned embodiment may be used for parts having the same configuration and function as those described in the above-mentioned embodiment. The description of such parts may be appropriately cited within the scope of technical inconsistency. Furthermore, a part of the above-mentioned example and all or a part of the multiple modified examples may be appropriately applied in a composite manner within the scope of technical inconsistency.

[0063] (First Modification) FIG. 9 is a diagram for explaining a push-up sequence in a first modified example of the push-up unit shown in FIG.

[0064] The thrust-up sequence in the first modified example is the same as that in the embodiment except for the first step (STEP 1).

[0065] In the push-up sequence in the first modification, in the first step of the embodiment, the control unit 80 stops the block B0 at a predetermined height (H1) (STEP 1a) and further raises the blocks B1 to B4 to a predetermined height (H2) (STEP 1b). This prevents the step from becoming large when the blocks B1 to B4 are raised after the block B0 is made to function as a peeling starting point, and reduces deformation of the surrounding die D and the die D to be peeled. This reduces stress on the die D to be peeled and the surrounding die D, and prevents damage such as cracking and chipping of the die D.

[0066] It is also preferable to lower the block B0 in parallel with the rise of the blocks B1 to B4 from H1 to H2, which makes it possible to increase the peeling speed of the die D.

[0067] (Second Modification) FIG. 10 is a top view of a block portion of a push-up unit in the second modified example.

[0068] In the embodiment, the inner blocks B1 to B4 are rectangular when viewed in a plan view. On the other hand, in the second modified example, the inner blocks B1 to B4 are circular when viewed in a plan view. The inner blocks B1 to B4 are cylindrical blocks.

[0069] By making the inner blocks B1 to B4 cylindrical, it is possible to make the diameter about 0.6 mm, which is smaller than the width of the blocks B1 to B4 in the embodiment.

[0070] (Third Modification) FIG. 11 is a top view of the inner block in the third modified example.

[0071] The shape of the inner blocks B1 to B4 in plan view may be a polygon such as a hexagon or octagon, or an ellipse, as shown in Fig. 11. If the shape is a polygon (including the quadrangle in the embodiment), it is preferable to provide curved surfaces at the corners. This can prevent damage to the blocks due to burrs at the corners.

[0072] (Fourth Modification) FIG. 12 is a top view of a block portion of a push-up unit in the fourth modified example.

[0073] In the second modified example, the outer block B0 has multiple openings and surrounds all the side surfaces of the inner blocks B1 to B4. On the other hand, in the fourth modified example, the outer block B0 has one opening and the contact surface of the outer block B0 with the dicing tape DT is configured intermittently or discontinuously. Blocks B0 are present on the side surface of block B1 near the four corners formed by the long and short sides of the die D. Blocks B0 are present only on the side surfaces of blocks B2 to B4 on the long side of the die D. When block B0 is pulled down, selective peeling starting points can be formed in the vicinity of blocks B1 to B4, for example.

[0074] (Fifth Modification) The configuration of the push-up unit 13 in the fifth modified example will be described with reference to Fig. 13 and Fig. 14. Fig. 13 is a schematic cross-sectional view of a main part of the push-up unit in the fifth modified example. Fig. 14 is a top view of a block part of the push-up unit shown in Fig. 13.

[0075] In the embodiment, an example was described in which the seven inner blocks are composed of four types of blocks B1 to B4 that have different operations. On the other hand, in the fifth modified example, the seven inner blocks are composed of seven types of blocks B1 to B7 that have different operations. Blocks B1, B2, B3, B4, B5, B6, and B7 are arranged in this order from the X2 side to the X1 side. In the fifth modified example, the blocks B0 to B7 are moved up and down using the drive shafts ND0 to ND7. The drive unit 133 includes eight sets of a motor (not shown) and a plunger mechanism that converts the rotation of the motor into up and down movement by a cam or link, and applies up and down movement to the drive shafts ND0 to ND4.

[0076] An example of the operation of the thrust-up unit 13 in the fifth modified example will be described with reference to Fig. 15. Fig. 15 is a diagram for explaining the thrust-up sequence of the thrust-up unit shown in Fig. 13.

[0077] From the zeroth step (STEP0) to the second step (STEP2), the same operations as the thrust-up sequence shown in FIG. 8 of the embodiment are performed.

[0078] (Third step: STEP3) Next, the control unit 80 lowers the block B1 at a predetermined speed (s2) until the block B1 is at the same height as the upper surface of the dome 132. Here, as the block B1 descends to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0079] (Fourth step: STEP 4) Next, the control unit 80 lowers the block B2 at a predetermined speed (s2) until the block B2 is at the same height as the upper surface of the dome 132. Here, as the block B2 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0080] (Fifth step: STEP5) Next, the control unit 80 lowers the block B3 at a predetermined speed (s2) to the same height as the upper surface of the dome 132. Here, as the block B3 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0081] (Sixth step: STEP6) Next, the control unit 80 lowers the block B4 at a predetermined speed (s2) until the block B4 is at the same height as the upper surface of the dome 132. Here, as the block B4 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0082] (Seventh step: STEP7) Next, the control unit 80 lowers the block B5 at a predetermined speed (s2) until the block B5 is at the same height as the upper surface of the dome 132. Here, as the block B5 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0083] (Eighth Step: STEP8) Next, the control unit 80 lowers the block B6 at a predetermined speed (s2) until the block B6 is at the same height as the upper surface of the dome 132. Here, as the block B6 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0084] Thereafter, the control unit 80 lifts the collet 22 upward, and lowers the block B7 at a predetermined speed (s3) to return it to the initial position, thereby completing the operation of peeling the die D from the dicing tape DT.

[0085] According to the fifth modification, the die can be peeled off by a sliding action in which the inner block operates in sequence from one end to the other end. Note that the fifth modification also allows the RMS action in the embodiment.

[0086] (Sixth Modification) Fig. 16 is a schematic cross-sectional view of a main part of a push-up unit in a sixth modified example, and Fig. 17 is a top view of a block part of the push-up unit shown in Fig. 16.

[0087] In the fifth modified example, the seven inner blocks are composed of seven types of blocks B1 to B7 that have different operations. On the other hand, in the sixth modified example, the seven inner blocks are composed of three types of blocks B1, B2, and B3 that have different operations. Blocks B1, B1, B2, B2, B2, B3, and B3 are arranged in this order from the X2 side to the X1 side. In the sixth modified example, the blocks B0 to B3 are moved up and down using the drive shafts ND0 to ND3.

[0088] The operation of the thrust-up unit 13 in the sixth modified example will be described below. The thrust-up unit 13 performs the same operations as those from the zeroth step (STEP0) to the second step (STEP2) of the thrust-up sequence shown in FIG.

[0089] (Third step: STEP3) Next, the control unit 80 lowers the block B1 at a predetermined speed (s2) until the block B1 is at the same height as the upper surface of the dome 132. Here, as the block B1 descends to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0090] (Fourth step: STEP 4) Next, the control unit 80 lowers the block B2 at a predetermined speed (s2) until the block B2 is at the same height as the upper surface of the dome 132. Here, as the block B2 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0091] Thereafter, the control unit 80 lifts the collet 22 upward, and lowers the block B3 at a predetermined speed (s3) to return it to the initial position, thereby completing the operation of peeling the die D from the dicing tape DT.

[0092] In the sixth modified example, since the inner blocks are arranged in groups of adjacent blocks, the number of drive shafts can be reduced.

[0093] (Seventh Modification) Fig. 18 is a schematic cross-sectional view of a main part of a push-up unit in a seventh modified example, and Fig. 19 is a top view of a block part of the push-up unit shown in Fig. 18.

[0094] In the third modified example, the inner blocks B1 to B4 are cylindrical blocks. On the other hand, in the seventh modified example, the inner blocks B1 to B4 are cylindrical blocks (pipes) in which the blocks B5 to B8 are provided. The blocks B5 to B8 are cylindrical blocks (pins). For example, the blocks B5 to B8 are very thin pins that are concentrically inserted into the blocks B1 to B4 that are thin pipes. In the seventh modified example, the blocks B0 to B8 are moved up and down using the drive shafts ND0 to ND8.

[0095] The thrust unit 13 in the seventh modification performs an RMS operation. The zeroth step (STEP0) to the second step (STEP2) in the seventh modification perform the same operation as the zeroth step (STEP0) to the second step (STEP2) of the thrust sequence shown in Fig. 8 of the embodiment. However, blocks B5 to B7 perform the same operation as blocks B1 to B4.

[0096] The third step (STEP 3) to the fifth step (STEP 5) in the seventh modified example are similar to the third step (STEP 3) to the fifth step (STEP 5) of the thrust-up sequence shown in FIG. 8 of the embodiment.

[0097] (Sixth step: STEP6) Next, the control unit 80 lowers the block B5 at a predetermined speed (s2) until the block B5 is at the same height as the upper surface of the dome 132. Here, as the block B5 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0098] (Seventh step: STEP7) Next, the control unit 80 lowers the block B6 at a predetermined speed (s2) until the block B6 is at the same height as the upper surface of the dome 132. Here, as the block B6 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0099] (Eighth Step: STEP8) Next, the control unit 80 lowers the block B7 at a predetermined speed (s2) until the block B7 is at the same height as the upper surface of the dome 132. Here, as the block B7 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0100] Thereafter, the control unit 80 lifts the collet 22 upward, and lowers the block B8 at a predetermined speed (s3) to return it to the initial position, thereby completing the operation of peeling the die D from the dicing tape DT.

[0101] Since the number of block stages in the Y1-Y2 direction of the block portion 131 is greater than in the embodiment, it is possible to reduce overhang.

[0102] (Eighth Modification) Fig. 20 is a schematic cross-sectional view of a main part of a push-up unit in an eighth modified example, and Fig. 21 is a top view of a block part of the push-up unit shown in Fig. 20.

[0103] In the seventh modified example, the fourteen inner blocks are composed of eight types of blocks B1 to B8 that have different operations. On the other hand, in the eighth modified example, the fourteen inner blocks are composed of fourteen types of blocks B1 to B14 that have different operations. Blocks B1, B2, B3, B4, B5, B6, and B7 are arranged in this order from the X2 side to the X1 side. Blocks B8 to B14 are provided within each of the blocks B1 to B7. In the eighth modified example, the blocks B0 to B14 are moved up and down using drive shafts ND0 to ND14.

[0104] The operation of the thrust-up unit 13 in the eighth modified example is different from that of the seventh modified example, and performs the same sliding operation as that of the fifth modified example. The operation of the thrust-up unit 13 in the eighth modified example will be described.

[0105] The zeroth step (STEP0) to the second step (STEP2) in the eighth modified example are similar to the zeroth step (STEP0) to the second step (STEP2) in the thrust sequence of the fourth modified example shown in Fig. 13. However, blocks B5 to B14 are similar to blocks B1 to B7.

[0106] The third step (STEP 3) to the eighth step (STEP 8) in the eighth modified example are similar to the third step (STEP 3) to the eighth step (STEP 8) of the thrust-up sequence shown in FIG. 15 in the fifth modified example.

[0107] (Ninth Step: STEP 9) Next, the control unit 80 lowers the block B8 at a predetermined speed (s2) until the block B8 is at the same height as the upper surface of the dome 132. Here, as the block B8 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0108] (Tenth Step: STEP 10) Next, the control unit 80 lowers the block B9 at a predetermined speed (s2) until the block B9 is at the same height as the upper surface of the dome 132. Here, as the block B9 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0109] (Eleventh Step: STEP 11) Next, the control unit 80 lowers the block B10 at a predetermined speed (s2) to the same height as the upper surface of the dome 132. Here, as the block B10 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0110] (Twelfth Step: STEP 12) Next, the control unit 80 lowers the block B11 at a predetermined speed (s2) to the same height as the upper surface of the dome 132. Here, as the block B11 descends to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0111] (Step 13) Next, the control unit 80 lowers the block B12 at a predetermined speed (s2) to the same height as the upper surface of the dome 132. Here, as the block B12 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0112] (Fourteenth Step: STEP14) Next, the control unit 80 lowers the block B13 at a predetermined speed (s2) to the same height as the upper surface of the dome 132. Here, as the block B13 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0113] Thereafter, the control unit 80 lifts the collet 22 upward, and lowers the block B14 at a predetermined speed (s3) to return it to the initial position, thereby completing the operation of peeling the die D from the dicing tape DT.

[0114] Since the number of block stages in the Y1-Y2 direction of the block portion 131 is greater than that of the embodiment, the overhang can be reduced.

[0115] (Ninth Variation) FIG. 22 is a top view of a block portion of a push-up unit in the ninth modified example.

[0116] In the second modified example, the inner blocks B1 to B4 are cylindrical blocks of the same diameter. On the other hand, in the seventh modified example, the diameters (sizes) of the inner blocks B1 to B4 are made smaller in the order of blocks B1, B2, B3, and B4. In the seventh modified example, the push-up unit 13 performs an RMS operation, so that the amount of overhang can be changed (increased) as the peeling of the die D from the dicing tape DT progresses.

[0117] (Tenth Modification) FIG. 23 is a top view of a block portion of a push-up unit in a tenth modified example.

[0118] In the ninth modified example, an RMS operation is performed. On the other hand, in the tenth modified example, a slide operation is performed. In the tenth modified example, the inner blocks B1 to B7 are arranged in the order of blocks B1, B2, B3, B4, B5, B6, and B7 from the X2 side to the X1 side. In the tenth modified example, the diameters (sizes) of the inner blocks B1 to B7 are made smaller in the order of blocks B1, B2, B3, B4, B5, B6, and B7. This allows the amount of overhang to be changed (increased) as the peeling of the die D from the dicing tape DT progresses.

[0119] (Eleventh Variation) Fig. 24 is a schematic cross-sectional view of a main part of a push-up unit in an eleventh embodiment, and Fig. 25 is a top view of a block part of the push-up unit shown in Fig. 24.

[0120] In the sixth modified example, blocks B1 to B3 are arranged inside one outer block B0. On the other hand, in the eleventh modified example, the outer block B0 is divided into three inner blocks B3 to B5, which are arranged as blocks B0, B1, and B2. Each of the blocks B0, B1, and B2 has an opening and is arranged side by side along the X1-X2 direction. The outer block B0 surrounds the two blocks B5, the outer block B1 surrounds the three blocks B4, and the outer block B2 surrounds the two blocks B3. In the eleventh modified example, the blocks B0 to B5 are moved up and down using drive shafts ND0 to ND5.

[0121] The operation of the thrust-up unit 13 in the eleventh modified example will be described. The zeroth step (STEP0) and the first step (STEP1) in the eleventh modified example are performed in the same manner as the zeroth step (STEP0) and the first step (STEP1) in the sixth modified example. However, blocks B0 to B2 in the eleventh modified example are performed in the same manner as block B0 in the sixth modified example. Blocks B3 to B5 in the eleventh modified example are performed in the same manner as blocks B1 to B3 in the sixth modified example.

[0122] (Second step: STEP2) Next, the control unit 80 lowers the block B0 to the same height as the upper surface of the dome 132 at a constant speed (s2).

[0123] (Third step: STEP3) Next, the control unit 80 lowers the block B1 to the same height as the upper surface of the dome 132 at a constant speed (s2).

[0124] (Fourth step: STEP 4) Next, the control unit 80 lowers the block B2 to the same height as the upper surface of the dome 132 at a constant speed (s2).

[0125] (Fifth step: STEP5) Next, the control unit 80 lowers the block B3 at a predetermined speed (s2) to the same height as the upper surface of the dome 132. Here, as the block B3 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0126] (Sixth step: STEP6) Next, the control unit 80 lowers the block B4 at a predetermined speed (s2) until the block B4 is at the same height as the upper surface of the dome 132. Here, as the block B4 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0127] Thereafter, the control unit 80 lifts the collet 22 upward, and lowers the block B5 at a predetermined speed (s3) to return it to the initial position, thereby completing the operation of peeling the die D from the dicing tape DT.

[0128] This makes it possible to create peripheral peeling starting points at multiple times as the peeling progresses.

[0129] (Twelfth Variation) Fig. 26 is a schematic cross-sectional view of a main part of a push-up unit in a twelfth embodiment, and Fig. 27 is a top view of a block part of the push-up unit shown in Fig. 26.

[0130] In the eleventh modified example, the outer block B0 surrounds two blocks B5, the outer block B1 surrounds three blocks B4, and the outer block B2 surrounds two blocks B3. On the other hand, in the twelfth modified example, the outer block B0 surrounds one block B5, and the outer block B1 surrounds one block B6. The outer block B2 surrounds one block B7, the outer block B3 surrounds one block B8, and the outer block B4 surrounds one block B9. In the twelfth modified example, the blocks B0 to B9 are moved up and down using the drive shafts ND0 to ND9.

[0131] The operation of the thrust-up unit 13 in the twelfth modified example will be described. The zeroth step (STEP0) and the first step (STEP1) in the twelfth modified example are performed in the same manner as the zeroth step (STEP0) and the first step (STEP1) in the fifth modified example. However, blocks B0 to B4 in the twelfth modified example are performed in the same manner as block B0 in the fifth modified example. Blocks B5 to B9 in the twelfth modified example are performed in the same manner as blocks B1 to B3 in the fifth modified example.

[0132] (Second step: STEP2) Next, the control unit 80 lowers the block B0 to the same height as the upper surface of the dome 132 at a constant speed (s2).

[0133] (Third step: STEP3) Next, the control unit 80 lowers the block B1 to the same height as the upper surface of the dome 132 at a constant speed (s2).

[0134] (Fourth step: STEP 4) Next, the control unit 80 lowers the block B2 to the same height as the upper surface of the dome 132 at a constant speed (s2).

[0135] (Fifth step: STEP5) Next, the control unit 80 lowers the block B3 to the same height as the upper surface of the dome 132 at a constant speed (s2).

[0136] (Sixth step: STEP6) Next, the control unit 80 lowers the block B4 to the same height as the upper surface of the dome 132 at a constant speed (s2).

[0137] (Seventh step: STEP7) Next, the control unit 80 lowers the block B5 at a predetermined speed (s2) until the block B5 is at the same height as the upper surface of the dome 132. Here, as the block B5 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0138] (Eighth Step: STEP8) Next, the control unit 80 lowers the block B6 at a predetermined speed (s2) until the block B6 is at the same height as the upper surface of the dome 132. Here, as the block B6 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0139] (Ninth Step: STEP 9) Next, the control unit 80 lowers the block B7 at a predetermined speed (s2) until the block B7 is at the same height as the upper surface of the dome 132. Here, as the block B7 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0140] (Tenth Step: STEP 10) Next, the control unit 80 lowers the block B8 at a predetermined speed (s2) until the block B8 is at the same height as the upper surface of the dome 132. Here, as the block B8 lowers to the height of the upper surface of the dome 132, the support of the dicing tape DT is eliminated, and peeling of the dicing tape DT progresses further due to the tension of the dicing tape DT.

[0141] Thereafter, the control unit 80 lifts the collet 22 upward, and lowers the block B9 at a predetermined speed (s3) to return it to the initial position, thereby completing the operation of peeling the die D from the dicing tape DT.

[0142] This makes it possible to create peripheral peeling starting points at multiple times as the peeling progresses.

[0143] (Thirteenth Variation) FIG. 28 is a cross-sectional view of a main part of a push-up unit in a thirteenth modified example.

[0144] In the embodiment, the cross section of the outer periphery of the outer block B0 is rectangular. On the other hand, in the thirteenth modification, the cross section of the outer periphery of the outer block B0 is trapezoidal. This can increase the strength of the block B0.

[0145] (Fourteenth Variation) FIG. 29 is a cross-sectional view of a main part of a push-up unit in a fourteenth modified example.

[0146] In the thirteenth modification, the outer peripheral portion of the outer block B0 has a trapezoidal cross section, whereas in the fourteenth modification, the upper portion B0a of the outer peripheral portion of the block B0 has a rectangular cross section as in the embodiment, and the lower portion B0b has a cross section that becomes wider in the downward direction.

[0147] The disclosure made by the present inventors has been specifically described above based on embodiments and modified examples. However, it goes without saying that the present disclosure is not limited to the above-described embodiments and modified examples, and various modifications are possible.

[0148] For example, in the embodiment, an example in which the number of inner blocks is seven has been described, but the number of blocks may be more or less than seven depending on the die size, etc.

[0149] In addition, in the embodiment, an example in which a die attach film is used has been described, but it is also possible to provide a preform portion for applying an adhesive to the substrate and not use a die attach film.

[0150] In the embodiment, a die bonder has been described in which a pick-up head picks up a die from a wafer supply unit, places it on an intermediate stage, and bonds the die placed on the intermediate stage to a substrate with a bonding head. However, the present invention is not limited to this, and can be applied to a die bonding device that picks up a die from a die supply unit.

[0151] For example, the present invention can also be applied to a die bonder that does not have an intermediate stage and a pick-up head, and that bonds a die from a wafer supply section to a substrate with a bonding head.

[0152] It is also applicable to a flip chip bonder that does not have an intermediate stage, picks up a die from a wafer supply unit, rotates the die pickup head upward, delivers the die to the bonding head, and bonds the die to a substrate with the bonding head.

[0153] In the embodiment, a die bonder has been described as an example, but the present invention can also be applied to a semiconductor manufacturing device that places a picked-up die on a tray. [Explanation of symbols]

[0154] 1. Die bonder (semiconductor manufacturing equipment) 12 Wafer holder 13 Thrust unit 131 Block section B0··· block (outer block) B1~B4···Blocks (inner blocks) 132 Dome

Claims

1. a wafer holder that holds a dicing tape to which the die is attached; a push-up unit having a block portion that pushes up the dicing tape; Equipped with The block portion is an outer block having a length in a first direction longer than a length in a second direction in a plan view and having a plurality of openings; an inner block disposed inside the opening; Equipped with The semiconductor manufacturing apparatus includes a plurality of inner blocks arranged side by side along the first direction.

2. 2. The semiconductor manufacturing apparatus according to claim 1, an outer block having a length in the first direction longer than a length in the second direction in a plan view and having one opening, A semiconductor manufacturing apparatus in which the outer block comes into contact with the dicing tape at intermittent or discontinuous positions.

3. 2. The semiconductor manufacturing apparatus according to claim 1, Instead of the outer block, a plurality of outer blocks each having one opening are provided, The outer blocks are arranged side by side along the first direction, In the semiconductor manufacturing apparatus, at least one of the inner blocks performing the same push-up operation is disposed in each of the plurality of outer blocks.

4. 4. The semiconductor manufacturing apparatus according to claim 1, The inner block of the semiconductor manufacturing apparatus is circular in plan view.

5. 4. The semiconductor manufacturing apparatus according to claim 1, A semiconductor manufacturing apparatus, wherein the size of the inner block in the second direction is 0.1 mm or more and 1.5 mm or less.

6. 4. The semiconductor manufacturing apparatus according to claim 1, The inner block of the semiconductor manufacturing apparatus is polygonal or elliptical in plan view.

7. 7. The semiconductor manufacturing apparatus according to claim 6, A semiconductor manufacturing apparatus in which the corners of the inner block, which is polygonal in plan view, are arc-shaped.

8. 2. The semiconductor manufacturing apparatus according to claim 1, The inner block is a semiconductor manufacturing device in which multiple components are arranged concentrically.

9. 2. The semiconductor manufacturing apparatus according to claim 1, The inner block has a different size in a plan view depending on its position in the semiconductor manufacturing device.

10. 2. The semiconductor manufacturing apparatus according to claim 1, The outer peripheral surface of the outer block has a gradient with respect to a central axis of the push-up, and the width of the outer peripheral side of the outer block becomes wider toward the bottom.

11. 2. The semiconductor manufacturing apparatus according to claim 1, The semiconductor manufacturing apparatus further comprises a control unit that independently raises and lowers the outer block and the inner block.

12. 12. The semiconductor manufacturing apparatus according to claim 11, The control unit is configured to lower the inner blocks in sequence from both outer sides toward the center.

13. 12. The semiconductor manufacturing apparatus according to claim 11, The control unit is configured to lower the inner block in sequence from one end to the other end of the semiconductor manufacturing apparatus.

14. 12. The semiconductor manufacturing apparatus according to claim 11, The push-up unit further includes a dome disposed around the block portion, The control unit is configured to raise the entire inner block while adsorbing the dicing tape by the dome, and then to lower the inner block from both outer sides in turn.

15. 12. The semiconductor manufacturing apparatus according to claim 11, The control unit is configured to raise the outer block and all of the inner blocks, and then raise all of the inner blocks while lowering the outer blocks.

16. Equipped with a block section that pushes up the dicing tape, The block portion is an outer block having a length in a first direction longer than a length in a second direction in a plan view and having a plurality of openings; an inner block disposed inside the opening; Equipped with The inner block is a push-up unit arranged in a row along the first direction.

17. carrying a wafer ring holding the dicing tape into a semiconductor manufacturing device comprising: a wafer holder that holds a dicing tape to which a die is affixed; and a push-up unit having a block portion that pushes up the dicing tape, the block portion having a length in a first direction longer than a length in a second direction in a plan view, the block portion comprising an outer block having a plurality of openings, and an inner block disposed inside the openings, the inner blocks being disposed in a plurality of rows along the first direction; peeling the die from the dicing tape; A method for manufacturing a semiconductor device having the above structure.

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