Compression molding device and compression molding method

Abstract

To provide a compression molding device and a compression molding method capable of preventing an occurrence of molding defects.SOLUTION: A compression molding device 1 according to the present invention uses a sealing mold 202 equipped with an upper mold 204 and a lower mold 206 to process a workpiece W having a configuration in which an electronic component Wb is mounted on a substrate Wa into a molded product Wp by sealing it with sealing resin R, wherein a first sealing resin Ra, which is a plate-shaped or block-shaped solid or semi-solid resin and has a first quantity, is used as the sealing resin R. The compression molding device includes a control calculation unit 150 that calculates a total amount of resin required based on data obtained by measuring the number of electronic components Wb mounted on the one substrate Wa for each workpiece W, and compares the total amount with a first quantity. When the first quantity is insufficient for the total amount, the control calculation unit 150 controls a supply of a second sealing resin R, which is a block-shaped solid or semi-solid resin or a highly viscous liquid resin and has a second quantity equivalent to a shortage, so that the second sealing resin R is additionally used as the sealing resin R.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a compression molding apparatus and a compression molding method. [Background technology]

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus and a resin sealing method for sealing a workpiece having electronic components mounted on a substrate with a sealing resin and processing it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technology in which a predetermined amount of sealing resin is supplied to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, a workpiece is placed in the sealing area, and the upper mold and lower mold are clamped to seal the workpiece with resin. As an example, when a sealing mold having a cavity in the upper mold is used, a technology is known in which the sealing resin is supplied all at once to the center position on the workpiece and molded. On the other hand, when a sealing mold having a cavity in the lower mold is used, a technology is known in which a release film (hereinafter sometimes simply referred to as a "film") that covers the mold surface including the cavity and the sealing resin are supplied and molded (Patent Document 1: JP 2019-145550 A). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-145550 A Summary of the Invention [Problem to be solved by the invention]

[0005] For example, when a strip-type wire-connected electronic component (semiconductor chip) is encapsulated with resin as a workpiece, the compression molding method in which a cavity is provided in the upper die has a problem that encapsulation is difficult because the wire portion of the workpiece held in the lower die comes into contact with the encapsulation resin previously supplied to the cavity or the encapsulation resin supplied onto the workpiece and deforms. Therefore, a compression molding method in which the workpiece is held in the upper die, a cavity is provided in the lower die, and encapsulation resin (granular resin, as an example) is supplied into the cavity has generally been adopted.

[0006] However, in a configuration in which a workpiece is held in the upper mold and a cavity is provided in the lower mold, when the workpiece is thin or large, there is a problem that it is difficult to hold the workpiece in the upper mold and it is likely to fall. In addition, although the sealing resin is usually supplied into the cavity of the lower mold through a film, when a thick molded product with a thickness (here, the thickness of the resin part after molding) of more than 1 mm is to be formed, the molding stroke becomes large, and there is a problem that the film is likely to be caught in the molded product, which is likely to cause molding defects. Furthermore, when a granular resin is used as the sealing resin, in addition to the problem of dust generation during molding and the problem of difficult handling, there is a problem that it is difficult to supply (spread) the sealing resin evenly to the entire area in the cavity provided in the lower mold, and uneven winding is likely to occur. In addition, there is a problem that the air contained in the gaps between the particles when the sealing resin is spread and the gas components due to degassing from the sealing resin when melted are not released, which is likely to cause molding defects. In particular, in the case of a workpiece in which electronic components are mounted by wire connections, there is a risk of wire flow (deformation or breakage of the wire) due to the flow of resin within the cavity during resin sealing.

[0007] On the other hand, regardless of the cavity arrangement, if an electronic component is missing from the workpiece to be sealed (for example, because it is not installed due to thinning out, or because it falls off after installation), the total amount of resin required for sealing increases, resulting in a shortage of resin and causing molding defects. [Means for solving the problem]

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a compression molding apparatus and a compression molding method that can solve the problems associated with a configuration in which a cavity is provided in an upper mold and that can solve the problems associated with a configuration in which a cavity is provided in a lower mold, that can prevent molding defects caused by the flow of sealing resin, uneven winding, residual gas, and insufficient resin amount, that can form molded products with large thickness dimensions, that allows easy handling of the sealing resin, and that can prevent the generation of dust during molding.

[0009] The present invention solves the above problems by the solution means described below as one embodiment.

[0010] A compression molding apparatus according to one embodiment is a compression molding apparatus that uses a sealing die having an upper die and a lower die to seal a workpiece having a configuration in which electronic components are mounted on a substrate with sealing resin to process it into a molded product, and is provided with a control and calculation unit that uses a first sealing resin that is a plate-shaped or block-shaped solid or semi-solid resin having a first amount as the sealing resin, calculates a total amount of resin required for each of the workpieces based on data obtained by measuring the number of electronic components mounted on the substrate and compares the total amount with the first amount, and is required to control the supply of a second sealing resin that is a block-shaped solid or semi-solid resin or a highly viscous liquid resin having a second amount equivalent to the amount of the shortage when the first amount is insufficient compared to the total amount.

[0011] According to the above embodiment, it is possible to prevent molding defects caused by flow of the sealing resin, uneven winding, and residual gas. In particular, even if the total amount of resin required increases due to missing electronic components of the work, the total amount of resin required can be easily and quickly secured, so that molding defects caused by insufficient resin amount can be prevented. In addition, even when forming a thick molded product with a thickness dimension exceeding 1 mm, it is possible to prevent the film from being caught. In addition, it is possible to facilitate handling of the sealing resin and prevent the generation of dust during molding due to granular resin.

[0012] As an example, when the upper mold has a cavity, it is preferable that the second sealing resin is placed on the electronic component mounting surface of the base material, and the first sealing resin is placed on the second sealing resin, and compression molding is performed in that state. In that case, it is preferable that the first sealing resin is not in contact with the electronic components when the second sealing resin is placed on the electronic component mounting surface of the base material, and the first sealing resin is placed on the second sealing resin.

[0013] As another example, when the lower mold has a cavity, it is preferable that the first sealing resin is placed on the bottom surface of the cavity and the compression molding is performed in a state where the second sealing resin is placed on the first sealing resin.

[0014] Moreover, a compression molding method according to one embodiment is a compression molding method for processing a workpiece having a configuration in which electronic components are mounted on a substrate into a molded product by using a sealing die having an upper die and a lower die, and includes a resin preparation step of preparing a first sealing resin which is a plate-shaped or block-shaped solid or semi-solid resin having a first amount as the sealing resin; a calculation step of calculating a total amount of resin required based on data obtained by measuring the number of electronic components mounted on one of the substrates for each of the workpieces and comparing the total amount with the first amount; and an additional resin preparation step of additionally preparing a second sealing resin which is a block-shaped solid or semi-solid resin or a highly viscous liquid resin having a second amount equivalent to the shortfall as the sealing resin when the first amount is insufficient relative to the total amount. Effect of the Invention

[0015] According to the present invention, it is possible to solve the problems of a configuration in which a cavity is provided in an upper mold and to solve the problems of a configuration in which a cavity is provided in a lower mold. It is also possible to prevent molding defects caused by flow of the sealing resin, uneven winding, residual gas, and insufficient amount of resin. It is also possible to form a thick molded product with a thickness exceeding 1 mm. It is also possible to facilitate handling of the sealing resin and prevent the generation of dust during molding. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a plan view showing an example of a compression molding device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a side view showing an example of a press device of the compression molding device according to the first embodiment of the present invention. [Diagram 3] FIG. 2 is a front cross-sectional view showing an example of a sealing mold of the compression molding apparatus according to the first embodiment of the present invention. [Figure 4] FIG. 1 is an explanatory diagram of a compression molding method according to a first embodiment of the present invention. [Diagram 5] FIG. 5 is an explanatory diagram following FIG. [Figure 6] FIG. 6 is an explanatory diagram following FIG. [Figure 7] Fig. 7A is an enlarged view of part VII in Fig. 6. Fig. 7B is an explanatory view following Fig. 7A. [Figure 8] FIG. 7B is an explanatory diagram following FIG. 7B. [Figure 9] FIG. 9 is an explanatory diagram following FIG. [Figure 10] 1 is a perspective view showing an example of a sealing resin (first sealing resin) used in a compression molding apparatus and a compression molding method according to an embodiment of the present invention. [Figure 11] 11A is a perspective view showing an example of a sealing resin (second sealing resin) used in a compression molding apparatus and a compression molding method according to an embodiment of the present invention, in which Fig. 11A shows an example of the second sealing resin, Fig. 11B shows another example of the second sealing resin, and Fig. 11C shows another example of the second sealing resin. [Figure 12] FIG. 11 is a side view showing an example of a press device of a compression molding device according to a second embodiment of the present invention. [Figure 13] FIG. 11 is a front cross-sectional view showing an example of a sealing mold of a compression molding apparatus according to a second embodiment of the present invention. [Figure 14] FIG. 4 is an explanatory diagram of a compression molding method according to a second embodiment of the present invention. [Figure 15] FIG. 15 is an explanatory diagram following FIG. 14. [Figure 16] FIG. 16 is an explanatory diagram following FIG. [Figure 17] FIG. 17 is an explanatory diagram following FIG. 16. [Figure 18] FIG. 18 is an explanatory diagram following FIG. 17. [Figure 19] 1A and 1B are explanatory diagrams of a compression molding device and a compression molding method according to a conventional embodiment. [Figure 20] 1A and 1B are explanatory diagrams of a compression molding device and a compression molding method according to a conventional embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] [First embodiment] (Overall composition) Hereinafter, the first embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a plan view (schematic view) showing an example of a compression molding apparatus 1 according to this embodiment (a configuration view common to the second embodiment). For convenience of explanation, arrows in the drawing indicate the left-right direction (X direction), the front-back direction (Y direction), and the up-down direction (Z direction) in the compression molding apparatus 1. In addition, in all the drawings for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0018] The compression molding apparatus 1 according to this embodiment is an apparatus that performs resin sealing (compression molding) of a workpiece (molded article) W using a sealing die 202 including an upper die 204 and a lower die 206. The lower die 206 is provided with one or more workpiece holding portions 205 that hold the workpiece W. The upper die 204 is provided with one or more cavities 208 depending on the shape and number of the workpieces W. A film F is adsorbed and held within this cavity 208. However, the present invention is not limited to this configuration.

[0019] First, the workpiece W to be molded has a configuration in which electronic components Wb are mounted on a substrate Wa. More specifically, examples of the substrate Wa include plate-shaped members such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, and a wafer. Examples of the electronic components Wb include a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, and a spacer. The shape of the substrate Wa is a rectangular shape (striped shape), a square shape, a circular shape, and the like. The number of electronic components Wb mounted on one substrate Wa is set to one or more (for example, in a matrix shape, etc.).

[0020] Examples of methods for mounting the electronic components Wb on the substrate Wa include wire bonding mounting, flip chip mounting, etc. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) Wa is peeled off from the molded product Wp after resin sealing, there is also a method in which the electronic components Wb are attached using a thermally peelable adhesive tape or an ultraviolet-curable resin that is cured by exposure to ultraviolet light.

[0021] In this embodiment, the sealing resin R is a thermosetting resin (for example, but not limited to, an epoxy resin containing a filler) and is a solid or semi-solid resin having a predetermined shape (details will be described later) corresponding to the shape of the workpiece W. Note that the above "semi-solid" does not mean a completely solid state, but a state in which the resin has melted to the so-called B stage.

[0022] As examples of film F, film materials having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride, are preferably used.

[0023] Next, an overview of the compression molding apparatus 1 according to this embodiment will be described. As shown in FIG. 1, the compression molding apparatus 1 mainly comprises a supply unit 100A for supplying the workpiece W, a press unit 100B for sealing the workpiece W with resin and processing it into a molded product Wp, and a storage unit 100C for storing the molded product Wp. As an example, the supply unit 100A, the press unit 100B, and the storage unit 100C are arranged in this order along the X direction in FIG. 1. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units (particularly the number of press units), the arrangement order of the units, and the like can be changed. In addition, the configuration can also include units other than those described above (all not shown).

[0024] The compression molding apparatus 1 also includes a resin supplying section 120 that supplies the sealing resin R. In this embodiment, a first sealing resin Ra and a second sealing resin Rb are used as the sealing resin R, which will be described in detail later. The resin supplying section 120 according to this embodiment is configured to detachably hold a stocker or the like that accommodates a plurality of preformed sealing resins R (i.e., the first sealing resin Ra and the second sealing resin Rb) and sequentially take out and supply the sealing resins R. However, the present invention is not limited to this configuration, and may include a resin forming mechanism that forms the sealing resin R (i.e., the first sealing resin Ra and the second sealing resin Rb) and sequentially forms and supplies the sealing resins R (not shown).

[0025] As an example, the resin supply section 120 is disposed in the supply unit 100A, but may be disposed in the storage unit 100C or the press unit 100B, or in another unit other than the above when the storage unit 100C or the press unit 100B is provided (not shown). Alternatively, as another example, the resin supply section 120 may be disposed outside the compression molding apparatus 1 and transported into the apparatus using a transport device such as a belt conveyor or a robot hand (not shown).

[0026] The compression molding apparatus 1 also includes a measuring unit 140 that measures the number of electronic components Wb (mounted or missing, and may also include measuring the height of the electronic components Wb) mounted on one base material Wa for each workpiece W to be sealed. As an example, the measuring unit 140 is configured to calculate the number of electronic components Wb by measuring the weight of the workpiece W. However, the present invention is not limited to this configuration, and the measuring unit 140 may also be configured to image the electronic component mounting surface of the base material Wa and calculate the number of electronic components Wb by image processing.

[0027] As an example, the measuring unit 140 is disposed in the supply unit 100A, but may be disposed in the storage unit 100C or the press unit 100B, or in another unit other than the above when the storage unit 100C or the press unit 100B is provided. Alternatively, as another example, the measuring unit 140 may be disposed outside the compression molding apparatus 1, and measurement data on the presence or absence of electronic components Wb measured for each workpiece W may be transmitted to this apparatus (compression molding apparatus 1) (not shown).

[0028] Furthermore, in the compression molding apparatus 1, a guide rail 130 is provided linearly across each unit, and a transport device (first loader) 132 for transporting the workpiece W and the sealing resin R, and a transport device (second loader) 134 for transporting the molded product Wp are provided so as to be movable between predetermined units along the guide rail 130. However, the configuration is not limited to the above, and a configuration including a common (single) transport device (loader) for transporting the workpiece W, the sealing resin R, and the molded product Wp (not shown) may also be used. Furthermore, the transport device may be configured to include a robot hand or the like instead of a loader.

[0029] In addition, in the compression molding apparatus 1, a control and calculation unit 150 that controls the operation of each mechanism in each unit is disposed in the supply unit 100A (it may be disposed in another unit).

[0030] (Supply unit) Next, the supply unit 100A included in the compression molding apparatus 1 will be described in detail.

[0031] The supply unit 100A includes a supply magazine 102 that stores a plurality of workpieces W. Here, as the supply magazine 102, a known stack magazine, slit magazine, or the like is used.

[0032] The supply unit 100A may be configured to include a work stage or the like (not shown) on which the work W taken out from the supply magazine 102 is placed. The supply unit 100A may also be configured to include a resin stage or the like (not shown) on which the sealing resin R supplied from the resin supply section 120 is placed.

[0033] The workpiece W and the sealing resin R are held by the first loader 132 and transported to the press unit 100B, and are set at a predetermined position in the sealing mold 202. In this embodiment, the workpiece W is held by the workpiece holding portion 205 of the lower mold 206, and the sealing resin R is placed on the workpiece W held by the workpiece holding portion 205 (details of the process will be described later). Note that a known holding mechanism (e.g., a clamping configuration with holding claws, a suction hole communicating with a suction device and a suction configuration, etc.) is used as the holding mechanism for the workpiece W and the sealing resin R in the first loader 132 (not shown).

[0034] As a modified example of the above-described conveying device, instead of the first loader 132 moving in the X and Y directions, a conveying device (loader) that moves in the X direction to convey between units and a conveying device (loader) that moves in the Y direction to carry in and set into the sealing mold 202 may be separately provided (not shown).

[0035] The supply unit 100A also includes a preheater (not shown) for preheating the workpiece W and the sealing resin R. As an example, a known heating mechanism (e.g., an electric wire heater, an infrared heater, etc.) is used for the preheater. This allows the workpiece W and the sealing resin R to be preheated before being carried into the sealing mold 202. Note that a configuration without a preheater is also possible. Also, instead of or together with the preheater, a configuration may be used in which the first loader 132 is provided with a heater for preheating (not shown).

[0036] (Press unit) Next, the press unit 100B included in the compression molding apparatus 1 will be described in detail.

[0037] The press unit 100B is provided with a sealing die 202 having a pair of dies (for example, a combination of a plurality of die blocks, die plates, die pillars, etc., made of alloy tool steel, and other members) that can be opened and closed. The press unit 100B is also provided with a press device 250 that drives the sealing die 202 to open and close to resin seal the workpiece W. As an example, the press unit 100B is configured to include one press device 250, but may include multiple press devices (not shown). A side view (schematic view) of the press device 250 provided in the press unit 100B is shown in FIG. 2, and a front cross-sectional view (schematic view) of the sealing die 202 is shown in FIG. 3.

[0038] Here, as shown in FIG. 2, the press machine 250 is configured to include a pair of platens 254, 256, a plurality of tie bars 252 on which the pair of platens 254, 256 are supported, and a drive device for moving (raising and lowering) the platen 256. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 262 (however, the present invention is not limited to this). In this embodiment, the platen 254 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 252), and the platen 256 on the lower side is set as a movable platen (a platen slidably held by the tie bars 252 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0039] 3, the sealing mold 202 includes an upper mold 204 on the upper side in the vertical direction and a lower mold 206 on the lower side as a pair of molds disposed between the pair of platens 254, 256 in the press device 250. That is, the upper mold 204 is assembled to the upper platen (in this embodiment, the fixed platen 254), and the lower mold 206 is assembled to the lower platen (in this embodiment, the movable platen 256). The upper mold 204 and the lower mold 206 move toward and away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction).

[0040] In the present embodiment, as an example, a film supply mechanism 211 is provided that transports (supplies) a roll-shaped film F to the inside of the sealing die 202. Depending on the configuration of the workpiece W, the film F may be in a strip shape instead of a roll shape.

[0041] Next, the upper mold 204 of the sealing mold 202 will be described in detail. As shown in Fig. 3, the upper mold 204 includes an upper mold chase 210, a cavity piece 226 held thereby, a clamper 228, etc. The upper mold chase 210 is fixed to the lower surface of a support plate 214 via a support pillar 212. A cavity 208 is provided on the lower surface of the upper mold 204 (the surface on the lower mold 206 side).

[0042] The clamper 228 is configured in an annular shape so as to surround the cavity piece 226, and is assembled to be movable up and down while being spaced (floating) from the lower surface of the support plate 214 via a push pin 222 and a clamper spring (a biasing member exemplified by a coil spring, for example) 224 (however, the assembly structure is not limited to this). The cavity piece 226 constitutes the inner part (bottom part) of the cavity 208, and the clamper 228 constitutes the side part of the cavity 208. The shape and number of cavities 208 provided in one upper mold 204 are appropriately set according to the shape and number of workpieces W (one or multiple).

[0043] In addition, suction paths (holes, grooves, etc.) (not shown) communicating with a suction device are provided on the lower surface of the clamper 228 and at the boundary between the clamper 228 and the cavity piece 226. This allows the film F supplied from the film supply mechanism 211 to be adsorbed and held on the mold surface 204a including the inner surface of the cavity 208. In addition, the cavity 208 can be degassed when the mold is closed and resin sealing is performed.

[0044] In this embodiment, an upper die heating mechanism (not shown) is provided to heat the upper die 204 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, and the like, and heating is controlled by the control and calculation unit 150. As an example, the heater is built into the upper die chase 210 and configured to apply heat to the entire upper die 204 and the sealing resin R contained in the cavity 208. The heater heats the upper die 204 to a predetermined temperature (e.g., 100°C to 300°C).

[0045] Next, a detailed description will be given of the lower mold 206 of the sealing mold 202. As shown in Fig. 3, the lower mold 206 includes a lower mold chase 240, a lower plate 242 held thereby, and the like.

[0046] In this embodiment, a workpiece holding section 205 is provided to hold the workpiece W at a predetermined position on the upper surface of the lower plate 242. As an example, the workpiece holding section 205 has a workpiece guide pin (not shown) and a suction passage (hole, groove, etc.) that is arranged penetrating the lower plate 242 and communicates with a suction device (not shown). Specifically, one end of the suction passage is connected to the die surface 206a of the lower die 206, and the other end is connected to a suction device arranged outside the lower die 206. This makes it possible to suck the workpiece W from the suction passage by driving the suction device, and to hold the workpiece W by suction on the die surface 206a (here, the upper surface of the lower plate 242). Instead of the above-mentioned suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that clamp the outer periphery of the workpiece W (not shown). The shape and number of the workpiece holding sections 205 provided on one lower die 206 are appropriately set according to the shape and number of the workpieces W (one or multiple).

[0047] In this embodiment, a lower die heating mechanism (not shown) is provided to heat the lower die 206 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control calculation unit 150. As an example, the heater is built into the lower die chase 240 and configured to apply heat to the entire lower die 206 and the workpiece W held by the workpiece holding unit 205. The heater heats the lower die 206 to a predetermined temperature (e.g., 100°C to 300°C).

[0048] (Storage unit) Next, the storage unit 100C included in the compression molding apparatus 1 will be described in detail.

[0049] The molded product Wp is held by the second loader 134, removed from the sealing mold 202, and transported to the storage unit 100C. Note that the second loader 134 uses a known holding mechanism for the molded product Wp (for example, a clamping mechanism with holding claws, a suction hole communicating with a suction device for suction, etc.) (not shown).

[0050] As a modified example of the above-described conveying device, instead of the second loader 134 moving in the X and Y directions, a conveying device (loader) that moves in the X direction to convey between units and a conveying device (loader) that moves in the Y direction to unload from the sealing mold 202 may be separately provided (not shown).

[0051] The storage unit 100C includes a storage magazine 104 for storing a plurality of molded products Wp. The storage magazine 104 may be a known stack magazine, slit magazine, or the like.

[0052] The storage unit 100C may be configured to include a molded product stage (not shown) on which the molded product Wp transferred from the press unit 100B is placed.

[0053] (Resin sealing operation) Next, the operation of performing resin sealing (compression molding) using the compression molding apparatus 1 according to this embodiment (i.e., the compression molding method according to this embodiment) will be described. Here, Figs. 4 to 9 are explanatory views of each step and are illustrated as front cross-sectional views in the same direction as Fig. 3.

[0054] First, as a preparation step, a heating step (upper die heating step) is performed in which the upper die 204 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the upper die heating mechanism (upper die heating step). Also, a heating step (lower die heating step) is performed in which the lower die 206 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the lower die heating mechanism (lower die heating step). Also, a film setting step is performed in which the film supply mechanism 211 is operated to set a new film F in the sealing die 202.

[0055] Before, after, or in parallel with the above-mentioned preparation step, a resin preparation step is carried out to prepare a first sealing resin Ra which is a plate-shaped or block-shaped solid or semi-solid resin having a first amount (amount of resin, i.e., grams). Specifically, the resin supply unit 120 supplies the first sealing resin Ra so that it can be transported by a transport device (in this embodiment, the first loader 132). As an example, the first sealing resin Ra is configured so that one piece constitutes the first amount, but as another example, the first sealing resin Ra may be configured so that several pieces (e.g., about two or three pieces) constitute the first amount. An example of the configuration (shape) of the first sealing resin Ra will be described later.

[0056] Before, after, or in parallel with the above-mentioned resin preparation step and calculation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 205 of the lower die 206 (see FIG. 4). Specifically, the workpiece W supplied from the supply magazine 102 is held by the first loader 132 and carried into the sealing die 202, where it is held by the workpiece holding portion 205.

[0057] At any time before the above-mentioned workpiece holding step, the measuring unit 140 or the like measures the number of electronic components Wb (the number of electronic components Wb mounted or missing, which may include measuring the height of the electronic components Wb, or may measure the weight) mounted on one substrate Wa for each workpiece W. Next, the control and calculation unit 150 performs a calculation step of calculating the total amount of sealing resin R required to seal the measured workpiece W based on the measurement data, and comparing the total amount with the first amount. As described above, the measuring unit 140 may be arranged outside the compression molding apparatus 1, and measurement data such as the number of electronic components Wb measured for each workpiece W may be transmitted to the control and calculation unit 150 of the apparatus (not shown).

[0058] Next, when the calculation step results in a shortage of the first portion relative to the total amount, an additional resin preparation step is performed to additionally prepare the second sealing resin Rb, which is a block-shaped solid or semi-solid resin and has a second portion equivalent to the shortage, as the sealing resin R. Specifically, the control calculation unit 150 issues a command to additionally supply the second sealing resin Rb having the second portion equivalent to the shortage, and the resin supply unit 120 supplies the second sealing resin Rb, so that the workpiece W can be transported by the transport device (the first loader 132 in this embodiment). Here, the shortage occurs due to a missing (not mounted or lost) electronic component Wb in the workpiece W. Therefore, it is preferable to form the second sealing resin Rb so as to have a second portion equivalent to the amount of resin that can satisfy the volume of one electronic component Wb. According to this, it is possible to supply an appropriate amount of resin to be added without excess or deficiency by simply supplying the same number of second sealing resins Rb as the number of missing electronic components Wb. However, the present invention is not limited to this configuration. An example of the configuration (shape) of the second sealing resin Rb will be described later.

[0059] After the workpiece holding step, a resin placing step is performed in which the prepared sealing resin R (i.e., the first sealing resin Ra prepared in the resin preparation step and the second sealing resin Rb prepared in the additional resin preparation step) is placed at a predetermined position. In this embodiment, the second sealing resin Rb supplied from the resin supply unit 120 is held by the first loader 132 and carried into the sealing die 202, and placed on the workpiece W held by the workpiece holding unit 205 (specifically, on the electronic component mounting surface of the substrate Wa) (see FIG. 5). Next, the first sealing resin Ra supplied from the resin supply unit 120 is held by the first loader 132 and carried into the sealing die 202, and placed on the second sealing resin Rb (see FIG. 6). According to this, even if the total amount of resin required increases due to missing electronic components Wb of the workpiece W, the total amount of resin required can be easily and quickly secured, and therefore, molding defects caused by a shortage of the amount of resin can be prevented.

[0060] Alternatively, as another example of the resin placing step, the sealing resin R (first sealing resin Ra, second sealing resin Rb) may be placed on the workpiece W before the above-mentioned workpiece holding step. In that case, the workpiece holding step is a step of holding the workpiece W in a state where the sealing resin R is placed (i.e., the second sealing resin Rb is placed on the electronic component mounting surface of the substrate Wa, and the first sealing resin Ra is placed on the second sealing resin Rb) in the workpiece holding part 205. That is, the first loader 132 holds the workpiece W in a state where the sealing resin R is placed, carries it into the sealing die 202, and holds it in the workpiece holding part 205. There is an advantage in that the workpiece W and the sealing resin R (first sealing resin Ra, second sealing resin Rb) are carried into the sealing die 202 at one time, rather than separately. In addition, since they are placed in the sealing die 202 at the same time, there is also an advantage in that the thermal history of the first sealing resin Ra and the second sealing resin Rb becomes the same.

[0061] After the resin placing step, a resin sealing step is performed in which the workpiece W is sealed with sealing resin R (first sealing resin Ra, second sealing resin Rb) and processed into a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is lowered relatively within the cavity 208 to perform a mold closing step in which the sealing resin R is heated and pressurized against the workpiece W. This thermally hardens the sealing resin R, completing the resin sealing (compression molding) (see FIG. 8).

[0062] As described above, for example, in a conventional compression molding apparatus in which a cavity is provided in the upper die for a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, there is a problem that resin sealing is difficult because the wire portion of the workpiece held by the lower die comes into contact with the sealing resin previously supplied to the cavity or the sealing resin supplied onto the workpiece during the mold closing process and is deformed. Therefore, for such a workpiece W, a compression molding apparatus in which a cavity is provided in the lower die has generally been adopted. However, there are also problems (mentioned above) due to the configuration in which a cavity is provided in the lower die.

[0063] In this embodiment, the above-mentioned problems can be solved by adopting a configuration in which the sealing resin R (first sealing resin Ra, second sealing resin Rb) formed as a solid or semi-solid resin is placed in the above-mentioned state. In particular, it is preferable that the second sealing resin Rb is placed on the electronic component mounting surface of the base material Wa, and the first sealing resin Ra is placed on the second sealing resin Rb so that the first sealing resin Ra does not come into contact with the electronic components Wb (including the wires in the case of electronic components Wb having wires).

[0064] Here, as a specific example of the configuration (shape) of the sealing resin R (first sealing resin Ra, second sealing resin Rb), the first sealing resin Ra is formed in a plate shape that becomes a "main body" as shown in FIG. 10. Alternatively, it may be a shape other than a plate shape, for example, a block shape having a concave portion or a convex portion (not shown). However, it is not limited to these shapes. The first sealing resin Ra is a size that fits into the cavity 208 in a plan view, and considering the resin flow, it is preferable that the size is slightly smaller than the shape of the cavity 208 (particularly the cavity piece 226). In FIG. 10, the four corners are rounded, but they may be angular.

[0065] As shown in FIG. 11, the second sealing resin Rb is formed in a block shape with a plurality of "legs" intermittently (or continuously) erected on one surface of the first sealing resin Ra (the surface facing the electronic component Wb of the work W). For example, it is formed in a cylindrical shape as shown in FIG. 11A, a prismatic shape as shown in FIG. 11B, a prismatic shape with one side longer as shown in FIG. 11C, or the like (combinations of these are also acceptable). However, it is not limited to these shapes. In addition, the leg (second sealing resin) Rb needs to have a height H so that the main body (first sealing resin) Ra does not abut against the electronic component Wb, but this does not exclude contact to the extent that the wire is not plastically deformed. In addition, the second sealing resin Rb is arranged at a position where it does not abut against the electronic component Wb in a plan view of the first sealing resin Ra and where the first sealing resin Ra does not tilt when placed on the work W. Furthermore, it is preferable that the second sealing resin Rb is arranged between the electronic components Wb or at the outer periphery of the electronic components Wb so as not to damage the wiring (particularly the wires) of the work W even a little during molding. The second sealing resin Rb is also prepared in a number of types, each having a length, width, height, and weight (1 g, 3 g, 5 g, etc.), and the number of the types is calculated according to the weight of the second sealing resin Rb corresponding to the shortage, and the position to arrange it on the work W is determined and placed. As far as possible, it is preferable that the first sealing resin Ra and the second sealing resin Rb are resins of the same type of resin properties. In addition, the second sealing resin Rb is provided to prevent the first sealing resin Ra from contacting the electronic components, and may be a high-viscosity liquid resin that is used to gain height and to provide a predetermined resin amount. When the second sealing resin Rb is a liquid resin, the resin properties may be slightly different from those of the solid / semi-solid resin of the first sealing resin Ra, but there is an advantage that the resin amount and arrangement can be freely combined by moving the supply nozzle in the XY direction.

[0066] As described above, it is preferable that the second sealing resin Rb is placed on the electronic component mounting surface of the substrate Wa, and the first sealing resin Ra is placed on the second sealing resin Rb so that the first sealing resin Ra does not come into contact with the electronic components Wb. For this purpose, it is important that the second sealing resin Rb, which becomes the leg portion, can be erected. Specifically, the above state can be realized by setting the resin amount of the first sealing resin Ra (i.e., the "first amount") to be less than the total amount (i.e., the "maximum amount") required to seal the workpiece W when there is no missing electronic components Wb mounted on the substrate Wa, and setting the resin amount of the second sealing resin Rb (second amount) so that the difference between the maximum amount and the first amount is at least the amount that can erect the number of legs (second sealing resin) Rb that can separate the main body portion (first sealing resin) Ra. Note that if a further shortage occurs due to missing electronic components Wb, it can be dealt with by simply increasing the second sealing resin Rb. Therefore, the first sealing resin Ra may be produced in advance by a resin manufacturer in multiple types (width, length, thickness, resin properties, etc.) and supplied in the same manner as mini-tablets used in existing transfer molding.

[0067] According to the above configuration, during the mold closing process, the sealing resin R is softened and melted by heating, as shown in FIG. 7A to FIG. 7B (FIG. 7A and FIG. 7B are enlarged views of part VII in FIG. 6). At this time, the resin (specifically, the first sealing resin Ra) comes into contact with all the wires uniformly and substantially simultaneously (see FIG. 7B). As a result, the effect of suppressing wire sweep is obtained.

[0068] The inventors of the present application actually conducted experiments using the compression molding apparatus 1 of this embodiment and confirmed that wire flow was suppressed and molding quality was improved compared to conventional compression molding apparatuses in which a workpiece is held in the upper mold, a cavity is provided in the lower mold, and sealing resin (specifically, granular resin) is supplied to the cavity.

[0069] Furthermore, by using a solid or semi-solid resin as the sealing resin R, it is possible to solve the problems of uneven winding, residual gas, and dust generation during molding, which are caused by granular resins in the past, as well as the problems of difficult handling. Also, even when forming a thick molded product with a thickness exceeding 1 mm, it is possible to prevent the film F from getting caught in the molded product Wp.

[0070] The steps following the mold closing step are the same as those in the conventional compression molding method. In summary, a mold opening step is performed in which the sealing mold 202 is opened and the molded product Wp and the used film F are separated so that the molded product Wp can be removed (see FIG. 9). Next, a molded product carrying-out step is performed in which the second loader 134 carries out the molded product Wp from the sealing mold 202 and carries it out to the storage unit 100C. After or in parallel with the molded product carrying-out step, a film setting step is performed in which the film supply mechanism 211 is operated to send out the used film F from the sealing mold 202 and send a new film F into the sealing mold 202.

[0071] The above are the main steps of the compression molding method performed using the compression molding apparatus 1. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as no problems occur.

[0072] [Second embodiment] Next, a second embodiment of the present invention will be described. The compression molding apparatus 1 and compression molding method according to this embodiment are basically the same as those of the first embodiment described above, but have differences in the configuration of the press unit 100B (particularly, the configuration of the press device and the sealing die) and the process performed mainly by the press unit 100B. Hereinafter, this embodiment will be described focusing on the differences.

[0073] The press unit 100B according to this embodiment includes a sealing die 302 having a pair of dies (for example, a combination of a plurality of die blocks, die plates, die pillars, and other members made of alloy tool steel) that are opened and closed. The press unit 100B also includes a press device 350 that opens and closes the sealing die 302 to resin seal the workpiece W. As an example, the press device 350 (shown in common with the press device 250 in FIG. 1) is configured to include one press device, but a plurality of press devices may be included (not shown). A side view (schematic view) of the press device 350 is shown in FIG. 12, and a front cross-sectional view (schematic view) of the sealing die 302 is shown in FIG. 13.

[0074] Here, as shown in FIG. 12, the press machine 350 is configured to include a pair of platens 354, 356, a plurality of tie bars 352 on which the pair of platens 354, 356 are supported, and a drive device for moving (raising and lowering) the platen 356. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 360 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 362 (however, the present invention is not limited to this). In this embodiment, the platen 354 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 352), and the platen 356 on the lower side is set as a movable platen (a platen slidably held by the tie bars 352 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0075] 13, the sealing mold 302 includes an upper mold 304 on the upper side in the vertical direction and a lower mold 306 on the lower side as a pair of molds disposed between the pair of platens 354, 356 in the press device 350. That is, the upper mold 304 is assembled to the upper platen (in this embodiment, the fixed platen 354), and the lower mold 306 is assembled to the lower platen (in this embodiment, the movable platen 356). The upper mold 304 and the lower mold 306 move toward and away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction).

[0076] In the present embodiment, as an example, a film supply mechanism 311 is provided that transports (supplies) a roll-shaped film F to the inside of the sealing die 302. Depending on the configuration of the workpiece W, the film F may be in a strip shape instead of a roll shape.

[0077] Next, the lower mold 306 of the sealing mold 302 will be described in detail. As shown in Fig. 13, the lower mold 306 includes a lower mold chase 310, a cavity piece 326 held thereby, a clamper 328, etc. The lower mold chase 310 is fixed to the upper surface of a support plate 314 via a support pillar 312. A cavity 308 is provided on the upper surface of the lower mold 306 (the surface on the upper mold 304 side).

[0078] The clamper 328 is configured in an annular shape so as to surround the cavity piece 326, and is assembled to be movable up and down while being spaced (floating) from the upper surface of the support plate 314 via a pushing pin 322 and a clamper spring (a biasing member exemplified by a coil spring, for example) 324 (however, the assembly structure is not limited to this). The cavity piece 326 constitutes the inner part (bottom part) of the cavity 308, and the clamper 328 constitutes the side part of the cavity 308. The shape and number of cavities 308 provided in one lower mold 306 are appropriately set according to the shape and number of the workpieces W (one or multiple).

[0079] Furthermore, suction paths (holes, grooves, etc.) (not shown) communicating with a suction device are provided on the upper surface of the clamper 328 and at the boundary between the clamper 328 and the cavity piece 326. This allows the film F supplied from the film supply mechanism 311 to be adsorbed and held on the mold surface 306a including the inner surface of the cavity 308. Furthermore, the cavity 308 can be degassed when the mold is closed and resin sealing is performed.

[0080] In this embodiment, a lower die heating mechanism (not shown) is provided to heat the lower die 306 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control and calculation unit 150. As an example, the heater is built into the lower die chase 310 and configured to apply heat to the entire lower die 306 and the sealing resin R contained in the cavity 308. The heater heats the lower die 306 to a predetermined temperature (e.g., 100°C to 300°C).

[0081] Next, a detailed description will be given of the upper mold 304 of the sealing mold 302. As shown in Fig. 13, the upper mold 304 includes an upper mold chase 340, an upper plate 342 held thereby, and the like.

[0082] In this embodiment, a workpiece holding section 305 is provided to hold the workpiece W at a predetermined position on the lower surface of the upper plate 342. As an example, the workpiece holding section 305 has a workpiece guide pin (not shown) and a suction passage (hole, groove, etc.) that is arranged penetrating the upper plate 342 and communicates with a suction device (not shown). Specifically, one end of the suction passage is connected to the die surface 304a of the upper die 304, and the other end is connected to a suction device arranged outside the upper die 304. This makes it possible to suck the workpiece W from the suction passage by driving the suction device, and to hold the workpiece W by suction on the die surface 304a (here, the lower surface of the upper plate 342). Instead of the above-mentioned suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that clamp the outer periphery of the workpiece W (not shown). The shape and number of the workpiece holding sections 305 provided on one upper die 304 are appropriately set according to the shape and number of the workpieces W (one or multiple).

[0083] In this embodiment, an upper die heating mechanism (not shown) is provided to heat the upper die 304 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control calculation unit 150. As an example, the heater is built into the upper die chase 340 and is configured to apply heat to the entire upper die 304 and the workpiece W held by the workpiece holding unit 305. The heater heats the upper die 304 to a predetermined temperature (e.g., 100°C to 300°C).

[0084] Next, steps of the compression molding method according to this embodiment performed using the compression molding apparatus 1 having the above configuration will be described. Here, Fig. 14 to Fig. 18 are explanatory views of each step and are illustrated as front cross-sectional views in the same direction as Fig. 13.

[0085] First, a preparation step is performed in the same manner as in the first embodiment. Specifically, a heating step (upper die heating step) is performed in which the upper die 304 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the upper die heating mechanism (upper die heating step). In addition, a heating step (lower die heating step) is performed in which the lower die 306 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the lower die heating mechanism (lower die heating step). In addition, a film setting step is performed in which a new film F is set in the sealing die 302 by operating the film supply mechanism 311.

[0086] Before or after the above preparation step, or in parallel with the above preparation step, a resin preparation step is carried out to prepare a first sealing resin Ra which is a plate-shaped or block-shaped solid or semi-solid resin having a first amount (amount of resin, i.e., grams). The specific steps are the same as those in the first embodiment.

[0087] Before, after, or in parallel with the above-mentioned resin preparation step and calculation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 305 of the upper die 304 (see FIG. 14). Specifically, the workpiece W supplied from the supply magazine 102 is held by the first loader 132 and carried into the sealing die 302, where it is held by the workpiece holding portion 305.

[0088] At any time before the above-mentioned workpiece holding step, the measuring unit 140 or the like measures the number of electronic components Wb (the number of electronic components Wb mounted or missing, and may also include measuring the height of the electronic components Wb) mounted on one substrate Wa for each workpiece W. Next, the control and calculation unit 150 performs a calculation step of calculating the total amount of sealing resin R required to seal the measured workpiece W based on the measurement data, and comparing the total amount with the first amount. As described above, the measuring unit 140 may be arranged outside the compression molding apparatus 1, and the measurement data of the number of electronic components Wb measured for each workpiece W may be transmitted to the control and calculation unit 150 of the apparatus (not shown).

[0089] Next, when the calculation step results in a shortage of the first portion relative to the total amount, an additional resin preparation step is performed to additionally prepare a second sealing resin Rb, which is a block-shaped solid or semi-solid resin and has a second portion equivalent to the shortage, as the sealing resin R. The specific steps are the same as those in the first embodiment.

[0090] After the workpiece holding step, a resin placing step is performed in which the prepared sealing resin R (i.e., the first sealing resin Ra prepared in the resin preparation step and the second sealing resin Rb prepared in the additional resin preparation step) is placed at a predetermined position. In this embodiment, the first sealing resin Ra supplied from the resin supply unit 120 is held by the first loader 132 and carried into the sealing die 302, and placed on the bottom surface of the cavity 308 of the lower die 306 (i.e., on the upper surface of the cavity piece 326) (see FIG. 15). Next, the second sealing resin Rb supplied from the resin supply unit 120 is held by the first loader 132 and carried into the sealing die 302, and placed on the first sealing resin Ra (see FIG. 16). According to this, even if the total amount of resin required increases due to missing electronic components Wb of the workpiece W, the total amount of resin required can be easily and quickly secured, and therefore, molding defects caused by a shortage of the amount of resin can be prevented.

[0091] Alternatively, as another example of the resin placing step, the second sealing resin Rb supplied from the resin supply unit 120 may be placed on the first sealing resin Ra supplied from the resin supply unit 120, and then the first loader 132 holds them and carries them into the sealing die 302, and places them on the bottom surface of the cavity 308 of the lower die 306 (i.e., on the upper surface of the cavity piece 326). This has the advantage that the sealing resins R (first sealing resin Ra, second sealing resin Rb) are not carried in separately, but are carried in one go. In addition, since they are placed in the sealing die 302 at the same time, there is also the advantage that the thermal history of the first sealing resin Ra and the second sealing resin Rb becomes the same.

[0092] After the resin placing step, a resin sealing step is performed in which the workpiece W is sealed with sealing resin R (first sealing resin Ra, second sealing resin Rb) and processed into a molded product Wp. Specifically, the sealing mold 302 is closed, and the cavity piece 326 is relatively raised in the cavity 308 to perform a mold closing step in which the sealing resin R is heated and pressurized against the workpiece W. This thermally hardens the sealing resin R, completing the resin sealing (compression molding) (see FIG. 17).

[0093] In a conventional compression molding apparatus in which a cavity is provided in the lower mold, when granular resin is used as the sealing resin, the particle size and height (lamination thickness) of the sealing resin (granular resin) contained in the cavity are not uniform. Therefore, for example, depending on the type and melting state of the granular resin, it may not be completely liquid (low viscosity state), and when a mold closing process is performed on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, as shown in Figure 19, depending on the position, a problem may occur in which the wire part of the workpiece held by the upper mold comes into strong (large) contact with the sealing resin (granular resin) and is deformed. Furthermore, as shown in Figure 20, a problem may occur in which the resin flows significantly in the cavity, causing the wire part to be cut or deformed.

[0094] In this embodiment, the above-mentioned problem can be solved by adopting a configuration in which the sealing resin R (first sealing resin Ra, second sealing resin Rb) formed as a solid or semi-solid resin is placed in the above-mentioned state. In particular, when the sealing mold 302 is closed, the upper mold 304 is gradually brought closer to the lower mold 306, and the first sealing resin Ra is placed on the bottom surface of the cavity 308, and the second sealing resin Rb is placed on the first sealing resin Ra so that the main body part (first sealing resin) Ra of the sealing resin R does not come into contact with the electronic component Wb of the work W (the electronic component Wb having wires includes the wires) in a state in which the tip part (upper end part) of the leg part (second sealing resin) Rb of the sealing resin R contained in the cavity 308 comes into contact with the base material Wa of the work W held by the work holding part 305.

[0095] For this purpose, it is important to be able to erect the second sealing resin Rb that will become the legs, as in the first embodiment described above. Specifically, the above state can be realized by setting the resin amount (i.e., the "first amount") of the first sealing resin Ra to be less than the total amount (i.e., the "maximum amount") required to seal the workpiece W when there is no missing electronic component Wb mounted on the substrate Wa, and setting the resin amount (second amount) of the second sealing resin Rb so that the difference between the maximum amount and the first amount is at least an amount that can erect a number of legs (second sealing resin) Rb that can separate the main body portion (first sealing resin) Ra. If a further shortage occurs due to missing electronic components Wb, it can be dealt with by simply increasing the second sealing resin Rb.

[0096] Here, the specific configuration (shape) of the sealing resin R is similar to the specific example (FIG. 10, FIG. 11A to FIG. 11B) in the first embodiment described above, but is not limited to these configurations.

[0097] The steps following the mold closing step are the same as those in the conventional compression molding method. In summary, the mold opening step is performed by opening the sealing mold 302 and separating the molded product Wp from the used film F so that the molded product Wp can be removed (see FIG. 18). Next, the molded product carrying-out step is performed by carrying the molded product Wp out of the sealing mold 302 by the second loader 134 and transporting it to the storage unit 100C. After or in parallel with the molded product carrying-out step, the film supply mechanism 311 is operated to send out the used film F from the sealing mold 302 and to carry a new film F into the sealing mold 302 and set it therein.

[0098] Other configurations according to this embodiment are similar to those of the first embodiment described above, and therefore repeated description will be omitted.

[0099] As described above, according to the present invention, it is possible to solve the problems of the configuration in which the cavity is provided in the upper mold and the problems of the configuration in which the cavity is provided in the lower mold. In addition, it is possible to prevent molding defects caused by flow of the sealing resin, uneven winding, and residual gas. In particular, even if the total amount of resin required increases due to missing electronic components of the work, the total amount of resin required can be easily and quickly secured, so that molding defects caused by a shortage of the amount of resin can be prevented. In addition, it is possible to facilitate handling of the sealing resin and prevent the generation of dust during molding. In addition, it is possible to form not only thin molded products (thickness dimension less than 1 mm) but also thick molded products (thickness dimension 1 mm or more). It is considered that the upper limit of the thickness dimension can be sufficiently formed up to about 10 mm, although it depends on various setting conditions.

[0100] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. [Explanation of symbols]

[0101] 1. Compression molding equipment 202, 302 Sealing mold 204, 304 upper mold 205, 305 Work holding part 206, 306 lower mold 208, 308 cavity 250, 350 Press Equipment F Release Film R Sealing resin Ra 1st sealing resin Rb 2nd sealing resin Double work Wa base material Wb electronic components Wp molded product

Claims

1. A compression molding apparatus that uses a sealing die having an upper die and a lower die to seal a workpiece having a configuration in which an electronic component is mounted on a substrate with a sealing resin and processes the workpiece into a molded product, As the sealing resin, a first sealing resin is used which is a plate-shaped or block-shaped solid or semi-solid resin and has a first amount, a control and calculation unit that calculates a total amount of resin required based on data obtained by measuring the number of electronic components mounted on one of the substrates for each of the workpieces and compares the total amount with the first amount; The control and calculation unit performs control to supply a second sealing resin, which is a block-shaped solid or semi-solid resin or a highly viscous liquid resin and has a second amount corresponding to the shortage amount, as the sealing resin when the first amount is insufficient with respect to the total amount. A compression molding apparatus comprising:

2. When the upper die has a cavity, the second sealing resin is placed on the electronic component mounting surface of the base material, and compression molding is performed in a state where the first sealing resin is placed on the second sealing resin.

2. The compression molding apparatus according to claim 1,

3. The second sealing resin is placed on the electronic component mounting surface of the base material, and the first sealing resin is placed on the second sealing resin so that the first sealing resin does not come into contact with the electronic components.

3. The compression molding apparatus according to claim 2,

4. When the lower mold has a cavity, the first sealing resin is placed on a bottom surface of the cavity, and the compression molding is performed in a state where the second sealing resin is placed on the first sealing resin.

2. The compression molding apparatus according to claim 1,

5. A compression molding method for processing a workpiece having a configuration in which an electronic component is mounted on a substrate into a molded product by encapsulating the workpiece with an encapsulating resin using an encapsulating die having an upper die and a lower die, a resin preparation step of preparing a first sealing resin as the sealing resin, the first sealing resin being a plate-shaped or block-shaped solid or semi-solid resin having a first amount; a calculation step of calculating a total amount of resin required based on data obtained by measuring the number of electronic components mounted on one of the substrates for each of the workpieces, and comparing the total amount with the first amount; an additional resin preparation step of additionally preparing, as the sealing resin, a second sealing resin which is a block-shaped solid or semi-solid resin or a highly viscous liquid resin and has a second amount corresponding to the shortage amount when the first amount is insufficient with respect to the total amount; To be prepared A compression molding method comprising the steps of:

6. When the upper mold has a cavity, the method further comprises a resin sealing step of placing the second sealing resin on the electronic component mounting surface of the base material and compressing the first sealing resin in a state where the first sealing resin is placed on the second sealing resin. The compression molding method according to claim 5,

7. In the resin sealing step, the first sealing resin is not in contact with the electronic component. a step of placing the second sealing resin on the electronic component mounting surface of the base material, and placing the first sealing resin on the second sealing resin. The compression molding method according to claim 6,

8. When the lower mold has a cavity, the method further comprises a resin sealing step of placing the first sealing resin on a bottom surface of the cavity and compressing the second sealing resin in a state in which the second sealing resin is placed on the first sealing resin. The compression molding method according to claim 5,

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