Simulation apparatus, simulation method, program, and article manufacturing method

Abstract

To make it possible to predict a spread shape of drops placed in a periphery of a shot region on a substrate with a high degree of accuracy and at high speed.SOLUTION: A simulation apparatus is configured to, in a process of bringing a member into contact with a plurality of droplets placed on a substrate to form a film of a curable composition on the substrate, predict spread of boundary droplets located in a boundary region which is a region on the substrate corresponding to at least an edge of the member when the member is contacted. The simulation apparatus includes: acquisition means configured to acquire information indicating placement of the plurality of droplets on the substrate and a first droplet region which is a predicted region in which each of the droplets spreads around the droplet; and prediction means configured to predict, as a second droplet region, a region in which each of the boundary droplets spreads around the boundary droplet in a different way from the first droplet region of droplets other than the boundary droplet in the first droplet region acquired by the acquisition means.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a simulation device, a simulation method, a program, and a method for manufacturing an article. [Background technology]

[0002] There is an imprinting technology in which a mold on which a fine pattern (relief pattern) is formed (transferred) is brought into contact with an imprinting material (e.g., photocurable resin) supplied onto a substrate to form a fine pattern. This imprinting technology has attracted attention as one of the nanolithography technologies for mass production of semiconductor devices and magnetic storage media. One of these imprinting technologies is a photocuring method that uses a photocurable resin as the imprinting material. In an imprinting device that employs this photocuring method, first, the imprinting material is supplied (applied) onto a substrate. Next, the mold on which the pattern is formed is brought into contact with the imprinting material and cured by irradiation with light such as ultraviolet light, and then the mold is released from the cured imprinting material, forming a pattern on the substrate.

[0003] In addition, in the imprinting apparatus, when resin is supplied onto a substrate, an array of droplets of the imprinting material is formed on the substrate by, for example, an inkjet method. Then, the droplets of the imprinting material on the substrate are brought into contact with a mold, so that the imprinting material fills (permeates) the recesses of the mold pattern. However, in the imprinting apparatus, defects may occur in the pattern formed on the substrate due to differences in the mold pattern or manufacturing variations, making it difficult to always form a good quality pattern. In order to avoid such problems, it is necessary to adjust the drop recipe (imprinting recipe), which is application information (application pattern) that indicates the supply positions of the resin droplets on the substrate.

[0004] The deposition pattern is corrected until the pattern formed on the substrate by the imprint process is free of defects. This correction requires repeated imprint processes and drop recipe corrections, which takes a lot of time.

[0005] To address such problems, Patent Document 1 proposes a method for simultaneously displaying a drop recipe and inspection or analysis information to support correction of the drop recipe. Patent Document 2 proposes a method for simulating the shape of the spreading drop using fluid calculations. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent Publication No. 2021-64662 [Patent Document 2] JP 2020-205413 A Summary of the Invention [Problem to be solved by the invention]

[0007] Patent Document 1 describes that the spreading state of droplets is shown by a Voronoi diagram. However, while the Voronoi diagram is effective for predicting the spreading shape of drops located mainly inside the shot area (inside the shot), the spreading shape of the drop may be predicted incorrectly in the peripheral area of ​​the shot area on the substrate (shot peripheral area). In addition, by performing a simulation involving fluid calculation as described in Patent Document 2, the correct spreading shape can be predicted even in the peripheral area of ​​the shot, but this requires a lot of calculation resources.

[0008] Therefore, an exemplary object of the present invention is to enable a highly accurate and fast prediction of the spread shape of a drop placed on the periphery of a shot area on a substrate. [Means for solving the problem]

[0009] In order to achieve the above-mentioned object, one aspect of the present invention is a simulation device that predicts the spreading of a boundary droplet located in a boundary region, which is a region on the substrate corresponding to at least the edge of the member, when the member is brought into contact with the plurality of droplets arranged on the substrate in a process of forming a film of a curable composition on the substrate, and is characterized in that the simulation device has an acquisition means that acquires information indicating the arrangement of the plurality of droplets on the substrate and a first droplet region, which is a region in which each of the droplets spreads around the predicted droplet, and a prediction means that predicts, from among the first droplet regions acquired by the acquisition means, a region in which each of the boundary droplets spreads around the boundary droplet as a second droplet region in a manner different from the first droplet regions of droplets other than the boundary droplets. Effect of the Invention

[0010] According to the present invention, for example, the spread shape of a drop placed on the periphery of a shot area on a substrate can be predicted with high accuracy and at high speed. [Brief description of the drawings]

[0011] [Figure 1] 1 is a schematic diagram showing a configuration of an imprint apparatus according to an embodiment. [Diagram 2] FIG. 1 illustrates an example of the configuration of a simulation device according to an embodiment. [Diagram 3] FIG. 1 illustrates an example of a hardware configuration in which a simulation device according to an embodiment is implemented; [Figure 4] FIG. 13 is a diagram showing an example of application information of an imprint material. [Diagram 5] 1A to 1C are diagrams for explaining the supply of an imprint material onto a substrate. [Figure 6] FIG. 13 is a diagram showing an example of an operation screen of an editor functioning as a user interface. [Figure 7] FIG. 2 is a configuration diagram illustrating a configuration example of a simulator according to the first embodiment. [Figure 8]11 is a flowchart showing an example of a simulation process for the spread of a drop on the periphery of a shot in the first embodiment. [Figure 9] 9 is a flowchart showing an example of the drop classification process in step S12 of FIG. 8. [Figure 10] FIG. 13 is a diagram showing an example of a Voronoi diagram acquired in step S121. [Figure 11] FIG. 13 is a diagram illustrating the process of step S122. [Figure 12] FIG. 13 is a diagram illustrating the process of step S123. [Figure 13] 11A and 11B are diagrams illustrating an example of a drop classification process. [Figure 14] FIG. 13 is a diagram showing a first example of a predicted shape of a drop spreading around the periphery of a shot using a method other than the Voronoi diagram. [Figure 15] FIG. 13 is a diagram showing a second example of a predicted shape of a drop spreading around the periphery of a shot using a method other than the Voronoi diagram. [Figure 16] FIG. 13 is a diagram showing a third example of a predicted shape of a drop spreading around a shot using a method other than the Voronoi diagram. [Figure 17] 13 is a flowchart illustrating an example of a process for adjusting a drop according to the second embodiment. [Figure 18] 11A and 11B are diagrams illustrating drop positions that can be arranged by a dispenser. [Figure 19] FIG. 11 is a diagram showing an example of a predicted spread shape of a drop on the periphery of a shot according to Example 2. [Figure 20] FIG. 13 is a diagram showing an example of seepage analysis information. [Figure 21] FIG. 13 is a diagram showing an example of analysis information of unfilled NF. [Figure 22] 13 is a diagram illustrating an example of a process for associating drops with seepage in step S4. FIG. [Figure 23] 13 is a diagram illustrating an example of a process for associating drops with non-filling in step S4. FIG. [Figure 24] FIG. 13 is a diagram showing an example in which a defect spans multiple drop spread shapes. [Diagram 25] FIG. 13 is a diagram showing an example in which a defect spans multiple drop spread shapes. [Figure 26] 13A and 13B are diagrams showing an example in which different types of defects exist in the spread shape of the same drop. [Figure 27] 11A and 11B are diagrams illustrating an example in which the movement amount of a drop is changed depending on the size of a defect. [Figure 28] 11A and 11B are diagrams illustrating an example in which the movement amount of a drop is changed depending on the size of a defect. [Figure 29] 13A and 13B are diagrams for explaining a process to be performed when another defect occurs after a drop is adjusted. [Diagram 30] 1A to 1C are diagrams for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. <Embodiment> FIG. 1 is a schematic diagram showing the configuration of the imprint apparatus IMP of this embodiment. The imprint apparatus IMP is a lithography apparatus that forms a pattern of an imprint material on a substrate using a mold (mold, mask) M. The imprint apparatus IMP is configured to form patterns in a plurality of shot areas of a substrate W by repeating an imprint process. Here, the imprint process refers to a series of cycles including supply of an imprint material R to the substrate W, contact between the mold M and the imprint material R, filling the pattern of the mold M with the imprint material R, alignment, curing (exposure), and peeling off the mold M. In this embodiment, the shot area means an area having a size equivalent to one pattern P of the mold M, that is, an area (molding area) where a pattern of the imprint material corresponding to the pattern of the mold M is formed in one imprint process.

[0013] The imprint material R uses a curable composition (sometimes called uncured resin) that is cured when curing energy is applied. The curing energy may be electromagnetic waves, heat, or the like. The electromagnetic waves may be, for example, infrared light, visible light, ultraviolet light, or other light having a wavelength selected from the range of 10 nm or more and 1 mm or less. That is, the imprint material R may be an ultraviolet curable resin that is cured by irradiation with ultraviolet light, or may be a thermoplastic or thermosetting resin.

[0014] The curable composition is a composition that is cured by irradiation with light or by heating. The photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent, as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0015] The substrate W may be made of glass, ceramics, metal, semiconductor, resin, or the like, and may have a member made of a material different from that of the substrate formed on its surface as required. Specifically, the substrate may be made of a silicon wafer, a compound semiconductor wafer, quartz glass, or the like.

[0016] The imprint apparatus IMP of this embodiment includes a substrate chuck 301 (substrate holding unit) that holds a substrate W, a substrate stage 302, a mold chuck 303 (mold holding unit), and a mold stage 304 (mold driving unit). It may also include a dispenser D (supply unit), an alignment scope 305, a light source 308, a detection light source 309, and a mirror 310.

[0017] The substrate chuck 301 holds the substrate W. The substrate chuck 301 holds the substrate W by, for example, a vacuum suction pad or the like. The substrate stage 302 holds the substrate chuck 301 and is driven by a driving mechanism (not shown) to move the substrate W in six axes, thereby aligning the substrate W with the mold M. The driving mechanism may be composed of a plurality of driving mechanisms such as a coarse movement driving mechanism and a fine movement driving mechanism. The substrate W is a substrate onto which a concave-convex pattern is transferred, and includes, for example, a single crystal silicon substrate or an SOI (Silicon on Insulator) substrate.

[0018] The mold chuck 303 holds the mold M on which a pattern (pattern portion) P is formed. The mold chuck 303 holds the mold M by, for example, vacuum suction force or electrostatic force. The mold stage 304 holds the mold chuck 303 and drives the mold chuck 303 by a driving mechanism (not shown). The mold M has, for example, a rectangular outer periphery, and a predetermined concave-convex pattern is formed three-dimensionally on the surface facing the substrate W, and is made of a material (such as quartz) that transmits ultraviolet light.

[0019] The dispenser D may have, for example, a tank that contains the imprint material R, a nozzle N that discharges the imprint material R supplied from the tank through a supply path onto the substrate W, a valve provided in the supply path, and a supply amount control unit. The supply amount control unit controls the amount of the imprint material supplied to the substrate W by controlling the valve, for example, so that the imprint material R is applied to one shot area in one discharge operation of the imprint material R.

[0020] The alignment scope 305 is fixed to the mold stage 304, and detects an alignment mark (substrate side mark 306) formed on the substrate W and an alignment mark (mold side mark 307) formed on the mold M. The substrate side mark 306 is formed in a shot area on the substrate W, and the mold side mark 307 is formed in a pattern P of the mold M. A calculation unit 221 in the control unit 220 described later obtains a relative positional deviation between the mold M and the substrate W from the detection result of the substrate side mark 306 and the mold side mark 307 detected by the alignment scope 305. The control unit 220 drives the substrate stage 302 and the mold stage 304 based on the result of the obtained relative positional deviation, and corrects the relative positional deviation between the mold M and the substrate W. The relative positional deviation is not limited to a shift component, but also includes errors of magnification and rotation components. The shape of the pattern P of the mold M can be corrected to match the shot area formed on the substrate W. An interference signal such as a moire signal reflecting the relative positions of the two marks can be used to detect the substrate side mark 306 and the mold side mark 307. Alternatively, the relative positions of the two marks may be obtained by detecting the images of the respective marks.

[0021] The light source 308 is a light source that radiates (irradiates, illuminates) exposure light (ultraviolet light), and the detection light source 309 is a light source for detection that radiates detection light. The mirror 310 is a dichroic mirror and has the property of reflecting the exposure light and transmitting the detection light. The exposure light from the light source 308 is reflected by the mirror 310 and irradiated onto the imprint material R, thereby curing the imprint material R. As a result, the pattern P of the mold M is formed (transferred) onto the substrate W.

[0022] The detection light from the detection light source 309 passes through the mirror 310, the mold stage 304, and the mold chuck 303, and illuminates the shot area on the substrate W. The light illuminating the shot area is reflected by the surface of the substrate W and the pattern surface of the mold M, and the reflected light from the substrate W and the reflected light from the mold M are detected as detection light by the imaging unit CAM. The detection light detected by the imaging unit CAM is displayed on the monitor 201, allowing the operator to observe the state of the imprint processing. In other words, the imaging unit CAM can acquire an image of the spread of the imprint material R when the mold M is brought into contact with the imprint material R, and the imaging unit CAM has a function as an image acquisition means. The image acquired by the imaging unit CAM can be treated as inspection information.

[0023] 2 is a diagram showing an example of the configuration of a simulation device 200 according to this embodiment. The simulation device 200 may include a console unit 210, a control unit 220, a monitor 201, and an input device 202.

[0024] The console unit 210 generates and manages an operation screen (editing screen) such as an editor (Drop Adjustment Editor) 600, which functions as a user interface. The console unit 210 also manages, for example, a database DB and a drop recipe, which is application information RP of the imprint material R, and displays the drop recipe on the monitor 201. In other words, the console unit 210 functions as a display control means. The monitor 201 is a display device that displays the operation screen, and also functions as a display means. The input device 202 is, for example, a keyboard or a mouse.

[0025] The control unit 220 controls the operations of each component of the imprint apparatus IMP in FIG. 1, such as the substrate stage 302, the mold stage 304, and the dispenser D. The control unit 220 can be connected to each component of the imprint apparatus IMP via a line (wired or wireless). The method according to this embodiment is executed by a computer as a program. The control unit 220 also has a calculation unit 221 and a simulator 230.

[0026] The calculation unit 221 determines the relative positional deviation between the mold M and the substrate W from the detection results of the substrate side mark 306 and the mold side mark 307 detected by the alignment scope 305, for example.

[0027] The simulator 230 predicts the spread of the imprint material R when the mold M is brought into contact with the imprint material R in the imprint process, and adjusts (changes) the drop recipe as necessary. The configuration of the simulator 230 will be described in detail later.

[0028] 3 is a diagram showing an example of the configuration of hardware in which a simulation apparatus 200 of this embodiment is implemented. The simulation apparatus 200 is a computer that predicts and simulates the spread of the imprint material R when the mold M is brought into contact with the imprint material R based on a drop recipe in an imprint process, and displays the adjusted drop recipe as necessary. The simulation apparatus 200 includes a CPU 101, a ROM 102, a RAM 103, and an input / output 104 to an external storage device, etc., which are interconnected by a bus 105.

[0029] CPU 101 operates based on programs stored in ROM 102 or the like, and controls each part of simulation device 200. ROM 102 stores a boot program executed by CPU 101 when simulation device 200 is started, programs dependent on the hardware of simulation device 200, and the like. CPU 101 executes a program loaded on RAM 103, for example, to realize a flow to be described later. Note that CPU 101 may obtain these programs from another device, for example, via a network, and execute them.

[0030] The input / output 104 receives input signals from an external device (such as an imaging device or an operating device) in a format that can be processed by the simulation device 200, and outputs output signals to an external device (such as a display device) in a format that can be processed.

[0031] 4 is a diagram showing an example of application information RP for the imprint material R. The application information RP is managed by the console unit 210, and coordinates and an amount indicating a position when the imprint material R is supplied to the substrate W are set (recorded) as a drop recipe. The control unit 220 controls the substrate stage 302 and the dispenser D so that the imprint material R is supplied to the position on the substrate W that is set in the application information RP.

[0032] FIG. 5 is a diagram for explaining the supply of the imprint material onto the substrate. Specifically, it is a diagram showing a state in which the imprint material R is supplied (applied) onto the substrate W based on the coordinate information of the application information RP shown in FIG. 4. The control unit 220 controls the substrate stage 302 to move the substrate stage 302, for example, in the direction of the arrow 501. Then, the imprint material R is discharged from a plurality of nozzles N arranged in the dispenser D based on the coordinate information of the application information RP, thereby supplying droplets of the imprint material R onto the substrate W. As a result, the droplets of the imprint material R are supplied onto the substrate W in an arrangement based on the application information RP. As a method of supplying the imprint material R onto the substrate W, the imprint material R may be discharged while moving the dispenser D instead of moving the substrate stage 302, or the substrate stage 302 and the dispenser D may be moved relative to each other.

[0033] Based on the application information RP, the imprint material R is applied onto the substrate W, and then the mold M is brought into contact with the imprint material R supplied to the substrate W (imprinting, pattern formation), so that the imprint material R fills the recesses within the pattern P of the mold M.

[0034] The surface opposite to the pattern P surface at the center of the mold chuck 303 has a recess larger than the area of ​​the pattern P, which is sealed by the mold and a seal glass (not shown). A pressure control unit (not shown) is connected to this sealed space (cavity portion), and the pressure in the sealed space can be controlled. When imprinting, the pressure in the cavity portion is increased to deform the mold M into a convex shape, thereby preventing air bubbles from being trapped between the substrate W and the mold M during imprinting. When the imprint material on the substrate W comes into contact with the mold M, the pressure in the cavity portion is returned, so that the imprint material on the substrate W comes into complete contact with the pattern P of the mold M. After the contact, the imprint material is cured by irradiating it with light of a predetermined wavelength, and a pattern is formed in the imprint material R in a predetermined pattern area of ​​the substrate W. Then, the mold M is separated from the cured imprint material R. As a result, a three-dimensional pattern (concave-convex pattern) is formed on the substrate W.

[0035] Example 1 FIG. 6 is a diagram showing an example of an operation screen of an editor 600 functioning as a user interface. The editor 600 is for generating and editing application information RP, and is generated by the control unit 220 and provided as a user interface. In this embodiment, the editor 600 generated by the control unit 220 is managed by the console unit 210 and displayed on the monitor 201. However, the editor 600 may be generated by the control unit 220 included in the imprint apparatus IMP, or may be generated by an information processing device outside the imprint apparatus IMP. Similarly, the editor 600 may be displayed on the monitor 201 included in the imprint apparatus IMP, or may be displayed on a monitor outside the imprint apparatus IMP. Note that here, an example in which the editor 600 is displayed on the monitor 201 will be described.

[0036] The editor 600 displays application information RP in an area 601, which indicates the position and amount of imprint material R to be supplied onto the substrate W. The editor also has an area 602 in which a parameter can be set to switch the display content of the area 601 between displaying the entire substrate or displaying a shot area. The editor also has an area 603 in which parameters such as a configuration information file for acquiring inspection information after imprint can be set. Area 604 displays information acquired from the configuration information file.

[0037] The program for operating the editor 600 may be included in the simulation apparatus 200 described in this embodiment. Furthermore, the program may be included in a computer (not shown) connected to the outside of the simulation apparatus 200 or the imprint apparatus IMP via a wired or wireless communication line.

[0038] The editor 600 acquires inspection information (inspection data) for the entire surface or part of the substrate W after the imprint process, and performs image analysis to extract features (feature amounts). Here, the inspection information is, for example, an image acquired by the imaging unit CAM, and includes image information of the pattern P formed on the substrate after the imprint process. Then, the acquired inspection information is analyzed to acquire analysis information related to the result of the imprint process. Here, the analysis information is, for example, defect information related to defects in the substrate W after the imprint process. Display examples of the analysis information described later are shown in FIGS. 19 and 20. The analysis information is acquired by analyzing the type, size, shape, etc. of the defect using the inspection information to acquire information on the defect. In addition, the analysis information may be generated as information representing the spread of the droplets (drops) of the imprint material, that is, information on filling the pattern of the mold M, based on the inspection information. Furthermore, information for correcting (adjusting) the application information is calculated based on the analysis information obtained by analyzing the acquired inspection information.

[0039] To correct the application information RP based on the acquired defect information, the defects are associated with the drops. When adjusting the placement of the drops around the shot, the location where the seepage and non-filling defects occur changes depending on the placement of the drops. To suppress seepage and non-filling around the shot, it is necessary to identify the drop that is causing these defects and adjust its position. The defect and the drop can be associated by predicting how the drop will spread. In this embodiment, the spread prediction simulation is performed on the simulation device 200, and the predicted information on the drop spread itself is displayed, or the associated drop is displayed in the editor 600.

[0040] 7 is a diagram illustrating an example of the configuration of the simulator 230 according to Example 1. The simulator 230 includes an information acquisition unit 231, a prediction unit 232, an identification unit 234, and an adjustment unit 235.

[0041] The information acquisition unit 231 acquires, for example, from the console unit 210, application information including information on the arrangement and amount of multiple droplets of the imprint material on the substrate W. The information acquisition unit 231 also predicts and acquires information indicating a first droplet region, which is a region into which each droplet spreads, centered on the droplet of the imprint material R. Details of the information indicating the first droplet region will be described later.

[0042] In the imprint process, the prediction unit 232 predicts, as a second droplet region, a region into which each boundary droplet spreads, centering on a droplet (boundary droplet) of the imprint material R located in a boundary region, which is a region on the substrate corresponding to the edge of the mold M. The second droplet region will be described in detail later.

[0043] The identifying unit 234 identifies droplets of the imprint material R that require adjustment of their placement positions by comparing the spread image of the imprint material R acquired by the imaging unit CAM with the second droplet area predicted by the prediction unit 232. The identifying unit 234 may also identify droplets of the imprint material R that require adjustment of their placement positions by comparing the second droplet area predicted by the prediction unit 232 with defect information.

[0044] The adjustment unit 235 determines the adjustment amount and adjustment direction of the placement of the droplets of the imprint material R on the substrate W. In other words, the adjustment unit 235 calculates the adjustment amount and adjustment direction of the placement of the imprint material R for changing the application information RP.

[0045] Next, a flow of an entire process of simulating the spread of the imprint material R in the simulation apparatus 200 according to the embodiment 1 will be described with reference to Fig. 8. Fig. 8 is a flowchart showing an example of a process of simulating the spread of a drop in the periphery of a shot in the embodiment 1. Each operation (step) shown in this flowchart can be executed under the control of the CPU 101 of the simulation apparatus 200.

[0046] In step S11, the information acquisition unit 231 reads the droplets of the imprint material R, that is, the coordinate information of the drops on the substrate W (drop placement information) from the drop recipe.

[0047] In step S12, the prediction unit 232 classifies the multiple drops of imprint material R arranged on the substrate W into a group of drops on the periphery of the shot and a group of drops inside the shot. Here, the group of drops on the periphery of the shot is a group of droplets of the imprint material R located in a boundary region, which is a region on the substrate corresponding to the edge of the mold M in the imprint process. In other words, it is a group of droplets of the imprint material R located in the peripheral region of the shot region of the substrate W. Moreover, the group of drops inside the shot is a group of droplets of the imprint material R arranged on the substrate W other than the group of drops on the periphery of the shot.

[0048] Here, an example of a method for classifying drops into a group of drops on the periphery of a shot and a group of drops inside the shot will be described with reference to Fig. 9. Fig. 9 is a flowchart showing an example of the drop classification process of step S12 in Fig. 8. Each operation (step) shown in this flowchart can be executed under the control of CPU 101 of simulation device 200. Note that the method for classifying drops into a group of drops on the periphery of a shot and a group of drops inside the shot is not limited to the method described here.

[0049] First, in step S121, the information acquisition unit 231 predicts and acquires a Voronoi diagram VD from the drop arrangement information. The Voronoi diagram VD is information indicating a first droplet region. Specifically, a geometric Voronoi diagram VD is used. Here, the Voronoi diagram VD is a diagram in which a plurality of points (mother points) arranged at any position in a certain metric space are divided into regions according to which mother points other points in the same metric space are closer to, and here, a Voronoi diagram is created and predicted with the points as drops of the imprint material R. Note that the Voronoi diagram VD created by an external device may be acquired by the information acquisition unit 231. FIG. 10 is a diagram showing an example of the Voronoi diagram VD acquired in step S121. In this figure, a certain area in the lower right of the shot area is enlarged to display drops of the imprint material R. The Voronoi diagram VD shows a Voronoi region VR (first droplet region) which is a region in which each drop spreads around the drop of imprint material R. It can be said that the Voronoi region VR is a predicted region in which each drop spreads around the drop of imprint material R. That is, the information acquisition unit 231 predicts and acquires the first droplet region based on the arrangement of multiple droplets of imprint material on the substrate W.

[0050] Next, in step S122, the prediction unit 232 classifies the drop group 701 in the peripheral area of ​​the first shot. Specifically, the prediction unit 232 determines whether the Voronoi region VR of each drop of the imprint material R is in contact with the shot edge SE. Here, the shot edge SE is the edge of the shot area. FIG. 11 is a diagram for explaining the processing of step S122. When the Voronoi region VR is in contact with the shot edge SE, the prediction unit 232 extracts the drop of the imprint material R that is the mother point of the Voronoi region VR as the drop group 701 in the peripheral area of ​​the first shot. In this figure, the drops indicated by black circles are the drop group 701 in the peripheral area of ​​the first shot.

[0051] Next, in step S123, the prediction unit 232 classifies the drop group 702 in the second shot peripheral area. Specifically, the prediction unit 232 draws a line segment OUTL (Line) between adjacent drops in a direction parallel to the shot end SE of the drop group 701 in the first shot peripheral area extracted in step S122. Then, the prediction unit 232 determines whether a Voronoi region VR having a drop other than the drop group 701 in the first shot peripheral area as a mother point is in contact with the generated line segment OUTL. If it is in contact, the drop is extracted as the drop group 702 in the second shot peripheral area. FIG. 12 is a diagram for explaining the processing of step S123. In this figure, the drop indicated by a gray circle is the drop group 702 in the second shot peripheral area. Then, the drop group 701 in the first shot peripheral area and the drop group 702 in the second shot peripheral area are combined to form the drop group OUTR in the shot peripheral area, and the rest are drop groups inside the shot.

[0052] Next, another example of a method for classifying the drop group into the drop group in the periphery of the shot and the drop group in the inside of the shot will be described with reference to FIG. 13. FIG. 13 is a diagram for explaining an example of a drop classification process. In FIG. 13, the drop group is simply classified into the drop group in the periphery of the shot and the drop group in the inside of the shot by a threshold T (Threshold). For example, the lower part of the shot area may be classified into the drop group OUTR in the periphery of the shot by a threshold T1, and the right part of the shot area may be classified into the drop group in the inside of the shot by a threshold T2. Instead of classifying the entire side of the shot area by one threshold, the threshold may be changed according to the location of the side. Also, the drop group may be manually classified into the drop group in the periphery of the shot and the drop group in the inside of the shot. Also, only the drops whose Voronoi region VR overlaps (contacts) with the shot end SE may be classified into the drop group in the periphery of the shot.

[0053] The different spreading shapes of the drop group OUTR on the periphery of the shot and the drop group inside the shot thus obtained are predicted on the simulation device 200, and the predicted drop spreading shape information is displayed on the editor 600.

[0054] Returning to FIG. 8, a specific method for acquiring the spread shape of the drops in the peripheral area of ​​the shot in step S13 will now be described. In step S13, the prediction unit 232 predicts the spread shape of the drops in the drop group inside the shot using a Voronoi diagram. On the other hand, the prediction unit 232 can predict the spread shape of the drops in the drop group OUTR in the peripheral area of ​​the shot with higher accuracy by predicting it using a method other than the Voronoi diagram. That is, the prediction unit 232 predicts the area (second droplet area) in which each drop in the drop group OUTR in the peripheral area of ​​the shot spreads using a method different from the area (first droplet area) in which each drop spreads around a drop in the drop group inside the shot.

[0055] Here, we will explain why drops inside a shot spread according to the Voronoi diagram, that is, in the Voronoi region VR, while drops on the periphery of the shot do not spread according to the Voronoi diagram. Inside a shot, drops are surrounded by drops, so the drops are prevented from spreading by the surrounding drops and do not break the Voronoi diagram. However, even if the drops on the periphery of a shot are surrounded by drops, the force preventing the drops from spreading is weaker than the force trying to spread, so the Voronoi diagram breaks down. Therefore, the periphery of the shot does not spread according to the Voronoi diagram.

[0056] FIG. 14 is a diagram showing a first example of a prediction of the spread shape SS (Spread Shape) of the drops in the peripheral area of ​​the shot using a method different from the Voronoi diagram. This diagram shows a prediction of the spread shape SS of the drop group OUTR in the peripheral area of ​​the shot, that is, the second droplet area, using a simple rectangle. In the case of a drop located at the lower end of the shot area as shown in FIG. 14, a rectangle is drawn with the midpoint between the drops in the adjacent shot interior as the upper limit, and the midpoint between the drops in the peripheral area of ​​the adjacent shots as the left and right ends. In other words, the prediction unit 232 predicts the spread shape SS of the drop group OUTR in the peripheral area of ​​the shot by drawing a rectangle so as to spread from the midpoint between the drops in the peripheral areas of the adjacent shots toward the shot end SE. When the drops in the peripheral area of ​​the shot are arranged in a rectangular lattice on the substrate W, it is effective to predict the spread shape of the drops in the peripheral area of ​​the shot using a simple rectangle as shown in this diagram, and the time required for the prediction process can also be shortened.

[0057] FIG. 15 is a diagram showing a second example of the spread shape SS of the drops in the peripheral area of ​​the shot predicted using a method different from the Voronoi diagram. In FIG. 15, the intersection point of the Voronoi region VR of the drops in the peripheral area of ​​an arbitrary shot and the line segment OUTL connecting the drop in the peripheral area of ​​the arbitrary shot and two drops adjacent to the drop is calculated. Then, the area obtained by extending a line from the intersection point in a direction perpendicular to the line segment OUTL toward the shot end direction is used as the spread shape SS. This makes it possible to predict the spread shape SS of the drops in the peripheral area of ​​the shot with higher accuracy. In the Voronoi diagram shown in FIG. 12, the drops in the peripheral area of ​​the shot that do not touch the shot end SE, i.e., the drop group 702 in the peripheral area of ​​the second shot, do not spread according to the Voronoi diagram because the force of spreading breaks the Voronoi region VR. However, according to the method shown in FIG. 15, the spread shape of the drops in the peripheral area of ​​the second shot as well can be predicted with higher accuracy.

[0058] FIG. 16 is a diagram showing a third example of a drop spread shape SS in the periphery of a shot predicted using a method different from the Voronoi diagram. The prediction unit 232 predicts a second droplet region according to the droplet amount of the imprint material R. Specifically, FIG. 16 shows a diagram when a drop LVR (Large Volume Resist) in which the drop amount is greater than a threshold is set in the application information RP. The prediction unit 232 predicts that the spread prediction of the drop LVR in which the drop amount is greater than the threshold spreads more than the case of FIG. 15. In other words, the prediction unit 232 predicts that the second droplet region of the drop LVR in which the drop amount is greater than the threshold is larger than the drop in which the drop amount is equal to or less than the threshold. This makes it possible to predict the spread shape of the drop in the periphery of the shot with higher accuracy according to the amount of the imprint material contained in the drop.

[0059] As described above, according to this embodiment, the spread of drops on the periphery of a shot can be predicted quickly and with high accuracy.

[0060] Example 2 Next, an example of adjusting a drop using a predicted shape of the drop spreading in the peripheral part of a shot (second droplet region) will be described. Specifically, in this embodiment, in addition to the first embodiment, a drop is adjusted using a predicted shape of the drop spreading in the peripheral part of a shot as shown in the flowchart of FIG. 17. FIG. 17 is a flowchart showing an example of a process of adjusting a drop according to the second embodiment. Each operation (step) shown in this flowchart can be executed under the control of the CPU 101 of the simulation device 200.

[0061] In step S1, the prediction unit 232 performs a simulation process (processing shown in FIG. 8) for predicting the spread of a drop in the peripheral portion of a shot in the first embodiment.

[0062] Here, an example of predicting the spread of the drops around the periphery of the shot is shown, assuming that the drops are adjusted. As described above, in the imprint apparatus IMP, the head for applying droplets of the imprint material R onto the substrate is called the dispenser D. Due to the structure of the dispenser D, there are restrictions on the drop positions that can be arranged. FIG. 18 is a diagram for explaining the drop positions that can be arranged by the dispenser D. Since the nozzle pitch NP (Nozzle Pitch) of the dispenser D is fixed, for example, the imprint material R cannot be discharged between the nozzles as shown by the dashed grid in FIG. 18. By controlling the dispenser D to go back and forth, it is also possible to discharge the imprint material R on the return path to a place where it could not be discharged on the forward path. However, if the number of round trips increases, there is a problem that the throughput decreases and the time until the imprint process starts becomes longer, causing the resist droplets discharged earlier to volatilize. Therefore, when adjusting the drop arrangement position, it is preferable to adjust the drop arrangement according to the restrictions. FIG. 19 is a diagram showing an example of predicting the spread shape SS of the drops around the periphery of the shot according to the second embodiment. 19 shows a prediction of the spread shape SS of the drops on the periphery of the shot when the minimum unit of the drop movement can only move at a fixed pitch up, down, left, and right depending on the nozzle interval NP as an example of the constraints on the drop placement position. The prediction unit 232 predicts the spread shape SS of the drop group on the periphery of the shot to be perpendicular to the shot end SE. This makes it possible to easily adjust the drop placement position even if there are constraints on the drop placement position due to the structure of the dispenser D.

[0063] Returning to FIG. 17, next, in step S2, defect information is read. Here, the defect information may be information that is determined by a person, that is ... Here, the area surrounded by the dashed line is specified as a rectangle and larger than the area of ​​the overflow E, but this area may be used as the analysis information, or the overflow E itself may be used as the analysis information. FIG. 21 is a diagram showing an example of analysis information of an unfilled NF (NonFill). In FIG. 21, the white areas in the area surrounded by the dashed line are unfilled. Similarly, here, the area surrounded by the dashed line is specified as a rectangle and larger than the area of ​​the unfilled NF, but this area may be used as the analysis information, or the unfilled NF itself may be used as the analysis information.

[0064] Returning to FIG. 17, next, in step S3, the prediction unit 232 judges whether the defect is within the tolerance range. It is preferable that the defect is no longer present at this point. If the defect is within the tolerance range (Yes), the process ends. On the other hand, if the defect is not within the tolerance range (No), the process proceeds to step S4.

[0065] Next, in step S4, the identifying unit 234 associates the drop with the defect based on the simulation result. FIG. 22 is a diagram for explaining an example of a process for associating the drop with the seepage E in step S4. This diagram shows the spread shape SS of the drop of the imprint material R and the seepage E in the peripheral area of ​​the shot. The identifying unit 234 determines (identifies) the drop corresponding to the area of ​​the spread shape SS where the seepage E exists as the corresponding drop CR (Corresponding Resist). In other words, the identifying unit 234 determines the droplet of the imprint material where the seepage E exists in the second droplet area as the corresponding drop CR. FIG. 23 is a diagram for explaining an example of a process for associating the drop with the unfilled NF in step S4. This diagram shows the spread shape SS of the drop of the imprint material R and the unfilled NF in the peripheral area of ​​the shot. The identifying unit 234 determines the drop corresponding to the area of ​​the spread shape SS where the unfilled NF exists as the corresponding drop CR. In other words, the specifying unit 234 determines a droplet of the imprint material in which an unfilled portion NF exists within the second droplet region as the corresponding drop CR.

[0066] Next, in step S5, the adjustment unit 235 adjusts the drop. Specifically, the adjustment unit 235 calculates the movement direction and movement amount of the drop to adjust the drop. The movement direction DM (Direction of Movement) for adjusting the drop is shown in FIG. 22 and FIG. 23. Here, it is assumed that the drop position is moved at a predetermined pitch in the up, down, left and right directions, which is the minimum unit depending on the nozzle interval NP. The adjustment unit 235 determines the direction in which the drop is moved depending on the type of the detected defect. Specifically, in the case of seepage E as shown in FIG. 24, the drop is moved away from the seepage E. In the case of unfilled NF as shown in FIG. 25, the drop is moved closer to unfilled NF.

[0067] 24 and 25, a process for a case where a defect is large and spans multiple drop spread shapes SS will be described. FIGS. 24 and 25 are diagrams showing an example where a defect spans multiple drop spread shapes SS. When multiple drops are associated with a single defect, the defect may be eliminated without adjusting all of the drop positions. Therefore, the adjustment unit 235 may determine not to move some of the drops associated with a single defect depending on the proportion of the defects in the spread shape SS.

[0068] Using FIG. 26, a process when different types of defects exist in the same drop spread shape SS will be described. FIG. 26 is a diagram showing an example where different types of defects exist in the same drop spread shape SS. In such a case, the adjustment unit 235 compares the size of the seepage E and the unfilled NF, and adjusts the drop position so as to correct the larger defect. In the case shown in this figure, since the unfilled NF is larger than the seepage E, the drop is moved so as to approach the unfilled NF. Alternatively, a setting may be made to give priority to adjustment of defects near corners, or conversely, a setting may be made to give priority to correction of defects far from corners.

[0069] An example of changing the amount of movement of the drop depending on the size of the defect will be described with reference to Figs. 27 and 28. Figs. 27 and 28 are diagrams for explaining an example of changing the amount of movement of the drop depending on the size of the defect. In Fig. 27, the drop is moved a small amount depending on the size of the defect because the defect is a relatively small unfilled SNF (Small NonFill). In Fig. 28, the drop is moved a large amount depending on the size of the defect because the defect is a relatively large unfilled LNF (Large NonFill). That is, the adjustment unit 235 determines the amount of movement of the drop depending on the size of the defect. Specifically, for example, a table of movement amounts depending on the size of the defect may be prepared, and the movement amount may be determined based on the table. By such processing, the amount of movement of the drop can be changed depending on the size of the defect.

[0070] Further, a process in the case where another defect occurs after the drop adjustment will be described with reference to FIG. 29. FIG. 29 is a diagram for explaining a process in the case where another defect occurs after the drop adjustment. In this figure, since an unfilled NF1 exists, an example is shown in which an unfilled NF2, which is a new defect, occurs in the opposite direction to the shot end SE after the drop R1 to be adjusted is moved toward the shot end SE. In such a case, the imprint material of the minimum unit amount is added to the drop R1 to be adjusted. That is, when a new defect occurs after the drop placement adjustment, the adjustment unit 235 calculates the adjustment amount of the total amount of the drop R1 to be adjusted. Then, the drop recipe is changed so as to increase the amount of the imprint material of the drop R1 to be adjusted. If an unfilled defect still occurs, for example, the drop recipe is changed so as to add an imprint material of the minimum unit plus one unit amount to the drop R1 to be adjusted, thereby making it possible to perform drop adjustment that does not cause a defect.

[0071] Note that such defect information may be associated with the drop adjustment direction and adjustment amount for the defect and stored in, for example, a storage unit (not shown), and the adjustment unit 235 may use the stored information to determine the drop adjustment direction or adjustment amount. This makes it possible to adjust the drop to reduce the occurrence of defects with higher accuracy and speed.

[0072] 17, after the drop adjustment in step S5 is completed, steps S1 to S3 are repeated again until the defect falls within the allowable range. Then, when the defect falls within the allowable range in step S3, the process ends.

[0073] After the drop adjustment in step S5 is completed, the adjusted drop recipe may be displayed on the monitor 201 via the console unit 210. This allows the user to check the adjusted drop recipe.

[0074] As described above, according to this embodiment, by predicting the spread of the drops on the periphery of the shot at high speed and with high accuracy, it becomes possible to easily adjust the drops and reduce the occurrence of defects.

[0075] <Embodiment of the article manufacturing method> The pattern of the cured material formed by performing the imprint process using the simulation result of the simulation device 200 is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of the electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of the molds include molds for imprinting.

[0076] The pattern of the cured product is used as it is as at least a part of a component of the article, or is used temporarily as a resist mask, which is removed after etching or ion implantation in a substrate processing step.

[0077] Next, a specific method for manufacturing the article will be described. As shown in Fig. 30(A), a substrate 1z such as a silicon wafer having a workpiece 2z such as an insulator formed on its surface is prepared, and then a composition 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state in which the composition 3z in the form of multiple droplets is applied onto the substrate is shown.

[0078] As shown in Fig. 30(B), the imprinting mold 4z is placed with the side on which the concave-convex pattern is formed facing the composition 3z on the substrate. As shown in Fig. 30(C), the substrate 1z to which the composition 3z is applied is brought into contact with the mold 4z, and pressure is applied. The composition 3z fills the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z in this state as energy for curing, the composition 3z is cured.

[0079] As shown in Fig. 30(D), after the composition 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured product of the composition 3z is formed on the substrate 1z. In this cured product pattern, the concave portions of the mold correspond to the convex portions of the cured product, and the convex portions of the mold correspond to the concave portions of the cured product, that is, the concave-convex pattern of the mold 4z is transferred to the composition 3z.

[0080] As shown in FIG. 30(E), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured material or where only a thin portion remains is removed, forming a groove 5z. As shown in FIG. 30(F), when the pattern of the cured material is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured material is removed, but it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, a component of an article, without being removed after processing. Note that, although an example of using a mold for transferring a circuit pattern with a concave-convex pattern has been described as the mold 4z, a mold (flat template) having a flat portion without a concave-convex pattern may also be used.

[0081] <Other embodiments> Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention.

[0082] The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) for implementing one or more of the functions.

[0083] The disclosure of this embodiment includes the following configuration. (Configuration 1) A simulation device for predicting the spreading of boundary droplets located in a boundary region, which is a region on the substrate corresponding to at least an edge of the member, when the member is brought into contact with the boundary region, in a process of forming a film of a curable composition on the substrate by bringing the member into contact with the boundary region, comprising: an acquisition means for acquiring information indicating an arrangement of the plurality of droplets on the substrate and a first droplet region, which is a predicted region in which each of the droplets spreads around the droplet; a prediction means for predicting, as a second droplet region, an area into which each of the boundary droplets expands around the boundary droplet in a manner different from the first droplet region of droplets other than the boundary droplet, among the first droplet regions acquired by the acquisition means.

[0084] (Configuration 2) 2. The simulation apparatus according to configuration 1, wherein the acquisition means predicts and acquires the first droplet region based on an arrangement of the plurality of droplets on the substrate.

[0085] (Configuration 3) 3. The simulation device according to configuration 2, wherein the acquisition means predicts the first droplet region using a Voronoi diagram with the droplet as a generating point.

[0086] (Configuration 4) The simulation device according to any one of configurations 1 to 3, characterized in that the prediction means identifies the boundary droplet and predicts the second droplet region based on information indicating the first droplet region acquired by the acquisition means.

[0087] (Configuration 5) The simulation device described in any one of configurations 1 to 4, characterized in that the prediction means identifies, among the multiple droplets, a first droplet whose first droplet region contacts the edge of a molding region on the substrate, and a second droplet whose first droplet region contacts a line segment connecting adjacent first droplets, as the boundary droplet.

[0088] (Configuration 6) The simulation device described in configuration 5, wherein the prediction means predicts the second droplet region from the intersection of a line segment connecting adjacent first droplets and the boundary line of the first droplet region, in a direction perpendicular to the line segment, and extending toward the edge of the molding region.

[0089] (Configuration 7) The simulation device according to any one of configurations 1 to 6, wherein the prediction means predicts the second droplet region so as to extend from a midpoint of adjacent boundary droplets toward an edge of a molding region on the substrate.

[0090] (Configuration 8) 8. The simulation device according to any one of configurations 1 to 7, wherein the prediction means predicts the second droplet region according to a droplet amount of the curable composition.

[0091] (Configuration 9) an image acquisition means for acquiring an image of the droplet spreading when the member is brought into contact with the droplet disposed on the substrate; The simulation device according to any one of configurations 1 to 8, further comprising: an identification means for identifying the droplets whose placement positions require adjustment by comparing the spread image acquired by the image acquisition means with the second droplet area predicted by the prediction means.

[0092] (Configuration 10) a determining unit that determines the droplets that require adjustment of their placement positions by comparing the second droplet region predicted by the determining unit with defect information in the film of the curable composition, 10. The simulation device according to any one of configurations 1 to 9, wherein the defect information includes information on defects in the film of the curable composition that are detected manually or automatically.

[0093] (Configuration 11) An adjustment means for adjusting the placement of the droplets, 11. The simulation device according to any one of configurations 1 to 10, wherein the adjustment means determines a direction in which the droplet is moved depending on a type of defect in the film of the curable composition.

[0094] (Configuration 12) An adjustment means for adjusting the placement of the droplets, 12. The simulation device according to any one of configurations 1 to 11, wherein the adjustment means determines an amount by which the droplet is moved depending on a size of a defect in the film of the curable composition.

[0095] (Configuration 13) An adjustment means for adjusting the placement of the droplets, 13. The simulation device according to any one of configurations 1 to 12, wherein the adjustment means calculates an adjustment amount for the total amount of the droplets when a new defect occurs after adjusting the placement of the droplets.

[0096] (Configuration 14) An adjustment means for adjusting the placement of the droplets; 14. The simulation device according to any one of configurations 1 to 13, further comprising: a display control means for causing a display device to display the drop recipe after the placement adjustment has been performed.

[0097] (Method 1) A simulation method for predicting the spreading of boundary droplets located in a boundary region, which is a region on the substrate corresponding to at least an edge of the member, when the member is brought into contact with the boundary region in a process of forming a film of a curable composition on the substrate by bringing the member into contact with the boundary region, the boundary region being a region on the substrate corresponding to at least an edge of the member, comprising: obtaining information indicative of an arrangement of the droplets on the substrate and a predicted first droplet area, the first droplet area being an area in which each of the droplets extends around the droplet; A simulation method comprising: predicting, from among the acquired first droplet regions, a region into which each of the boundary droplets expands around the boundary droplet as a second droplet region using a method different from the first droplet regions of droplets other than the boundary droplet.

[0098] (Configuration 15) A program for causing a computer to execute the simulation method according to method 1.

[0099] (Method 2) A forming process of forming a pattern on a substrate using a prediction result of the simulation apparatus according to any one of configurations 1 to 14; A processing step of processing the substrate on which the pattern has been formed in the forming step, A method for manufacturing an article, comprising manufacturing an article from the substrate processed in the processing step. [Explanation of symbols]

[0100] 1z,W board 4z,M type 101 CPU 104 Input / Output 105 Bus 200 Simulation Device 201 Monitor 202 Input Devices 210 Console section 220 Control section 221 Arithmetic section 230 Simulator 231 Information Acquisition Department 232 Prediction Department 234 Specific part 235 Adjustment section 600 Editor IMP Imprinting Equipment P-pattern R Imprint material RP Application Information

Claims

1. A simulation device for predicting the spreading of boundary droplets located in a boundary region, which is a region on the substrate corresponding to at least an edge of the member, when the member is brought into contact with the boundary region, in a process of forming a film of a curable composition on the substrate by bringing the member into contact with the boundary region, the boundary region being a region on the substrate corresponding to at least an edge of the member, comprising: an acquisition means for acquiring information indicating an arrangement of the plurality of droplets on the substrate and a first droplet region, which is a predicted region in which each of the droplets spreads around the droplet; a prediction means for predicting, as a second droplet region, an area into which each of the boundary droplets expands around the boundary droplet in a manner different from the first droplet region of droplets other than the boundary droplet, among the first droplet regions acquired by the acquisition means.

2. 2. The simulation device according to claim 1, wherein the acquisition means predicts and acquires the first droplet region based on an arrangement of the plurality of droplets on the substrate.

3. 3. The simulation device according to claim 2, wherein the acquisition means predicts the first droplet region using a Voronoi diagram with the droplet as a generating point.

4. The simulation device according to claim 1 , wherein the prediction means identifies the boundary droplet and predicts the second droplet region based on information indicating the first droplet region acquired by the acquisition means.

5. The simulation device according to claim 1, characterized in that the prediction means identifies, among the plurality of droplets, a first droplet whose first droplet region contacts the edge of a molding region on the substrate, and a second droplet whose first droplet region contacts a line segment connecting adjacent first droplets as the boundary droplet.

6. The simulation device according to claim 5, characterized in that the prediction means predicts the second droplet region from the intersection of a line segment connecting adjacent first droplets and the boundary line of the first droplet region, in a direction perpendicular to the line segment, and extending toward the edge of the molding region.

7. 2. The simulation device according to claim 1, wherein the prediction means predicts the second droplet region so as to extend from a midpoint between adjacent boundary droplets toward an edge of a molding region on the substrate.

8. The simulation device according to claim 1 , wherein the prediction means predicts the second droplet area in accordance with a droplet volume of the curable composition.

9. an image acquisition means for acquiring an image of the droplet spreading when the member is brought into contact with the droplet disposed on the substrate; The simulation device according to claim 1, further comprising: an identification means for identifying the droplets whose placement positions require adjustment by comparing the spread image acquired by the image acquisition means with the second droplet area predicted by the prediction means.

10. a determining unit that determines the droplets that require adjustment of their placement positions by comparing the second droplet region predicted by the determining unit with defect information in the film of the curable composition, The simulation device according to claim 1 , wherein the defect information includes information on defects in the film of the curable composition that are detected manually or automatically.

11. An adjustment means for adjusting the placement of the droplets, 2. The simulation device according to claim 1, wherein the adjusting means determines a direction in which the droplet is moved depending on a type of defect in the film of the curable composition.

12. An adjustment means for adjusting the placement of the droplets, 2. The simulation device according to claim 1, wherein the adjustment means determines an amount by which the droplet is moved depending on a size of a defect in the film of the curable composition.

13. An adjustment means for adjusting the placement of the droplets, 2. The simulation device according to claim 1, wherein the adjustment means calculates an adjustment amount for the total amount of droplets when a new defect occurs after the droplet placement adjustment.

14. An adjustment means for adjusting the placement of the droplets; 2. The simulation device according to claim 1, further comprising a display control means for displaying, on a display device, the drop recipe after the placement adjustment has been performed.

15. A simulation method for predicting the spreading of boundary droplets located in a boundary region, which is a region on the substrate corresponding to at least an edge of the member, when the member is brought into contact with the boundary region in a process of forming a film of a curable composition on the substrate by bringing the member into contact with the boundary region, the boundary region being a region on the substrate corresponding to at least an edge of the member, comprising: obtaining information indicative of an arrangement of the droplets on the substrate and a predicted first droplet area, the first droplet area being an area in which each of the droplets extends around the droplet; A simulation method characterized by predicting, from the acquired first droplet area, an area into which each of the boundary droplets expands around the boundary droplet as a second droplet area in a manner different from the first droplet areas of droplets other than the boundary droplet.

16. A program for causing a computer to execute the simulation method according to claim 15.

17. a forming step of forming a pattern on a substrate using a prediction result of the simulation apparatus according to claim 1; A processing step of processing the substrate on which the pattern has been formed in the forming step, A method for manufacturing an article, comprising manufacturing an article from the substrate processed in the processing step.

Images