Terminal structure, wiring board, and method for manufacturing terminal structure

Abstract

To provide a terminal structure and a wiring board capable of suppressing short circuits between adjacent solder layers.SOLUTION: A wiring board 10 has a wiring layer 31, an insulating layer 40 covering the wiring layer 31, an opening 41 penetrating the insulating layer 40 in the thickness direction, a via wiring 51 formed in the opening 41, and a wiring layer 52 electrically connected to the via wiring 51 and formed on the upper surface of the insulating layer 40. The wiring board 10 has a protective metal layer 60 formed on the upper surface of the wiring layer 52, a solder layer 80 formed on the upper surface of the protective metal layer 60, and an intermetallic compound layer 70 formed at the interface between the protective metal layer 60 and the solder layer 80. The protective metal layer 60 has a protruding portion 63 that protrudes outward from the side surface of the wiring layer 52. The intermetallic compound layer 70 covers only the upper surface of the protective metal layer 60. The solder layer 80 covers only the upper surface of the intermetallic compound layer 70.SELECTED DRAWING: Figure 2

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