Method for cooling devices that apply pyroelectric effect and fluid dynamics, method for improving heat dissipation function, and method for making devices smaller and thinner
JP2024175626AInactive Publication Date: 2024-12-18PATENT FLARE CO LTD
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Patent Information
- Application Number
- JP2023102085
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-06
- Publication Date
- 2024-12-18
- Estimated Expiration
- Not applicable · inactive patent
Abstract
To solve the problem in which electronic components (such as CPUs) used in PCs and smartphones generate heat and become hot after long-term use, which affects the performance of the device, and therefore require cooling and heat dissipation, which was previously handled by fans with a windmill shape and heat sinks, etc., and to provide a different method from the conventional one, and contribute to the improvement of cooling and heat dissipation functions and the miniaturization, thinning, and power saving of devices.SOLUTION: By using a waterwheel-shaped fan instead of a conventional windmill-shaped fan, it is possible to make the fan smaller and thinner. By applying (coating) a pyroelectric material processed into powder or solution form to the surface of a heat-generating component, the component becomes a power source due to the pyroelectric effect, which also allows power saving. The problem is solved by changing the shape of the component and applying pyroelectric effect technology.SELECTED DRAWING: None
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