Sample support

Abstract

To provide a sample support which enables high accuracy of an analysis.SOLUTION: A substrate of a sample support, includes: a first surface 2a; a second surface 2b on a reverse side to the first surface 2a; and voids 2d distributed in an irregular manner and open at least in the first surface 2a. The substrate includes: a measurement region 21 including a part of the first surface 2a; and a blocked region 22 positioned outside the measurement region 21 when viewed from a Z-axial direction. A porosity of the blocked region 22 is smaller than that of the measurement region 21.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a sample support. [Background technology]

[0002] A sample support having a porous substrate including a main surface and a side surface is known as a sample support used in the analysis of biological samples, etc. (For example, see Patent Document 1.) The porous substrate of such a sample support includes irregularly distributed pores that open to the main surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-43571 A Summary of the Invention [Problem to be solved by the invention]

[0004] According to the above-mentioned sample support, the amount of the sample remaining on the main surface of the porous substrate is appropriately adjusted, so that the components of the sample are suitably ionized, and as a result, high-precision analysis of the sample is realized. There are cases where such a sample support is required to further improve the accuracy of the sample analysis.

[0005] An object of the present invention is to provide a sample support that enables high-precision analysis. [Means for solving the problem]

[0006] The sample support of the present invention is [1] "a sample support for ionizing a sample, comprising a porous substrate including a first surface, a second surface opposite to the first surface, and voids that are irregularly distributed and open at least to the first surface, the porous substrate including a measurement region including a portion of the first surface, and a blocking region located outside the measurement region when viewed from a direction perpendicular to the first surface, the porosity of the blocking region being smaller than the porosity of the measurement region."

[0007] The porous substrate of the sample support includes pores that are irregularly distributed and open at least to the first surface. When a sample is introduced to the first surface of the porous substrate, the sample is appropriately diffused into the pores of the porous substrate, so that the amount of sample remaining on the first surface is appropriately adjusted. Therefore, the sample remaining on the first surface can be suitably ionized. Moreover, the porosity of the blocked region is smaller than the porosity of the measurement region. As a result, even if a foreign object is attached to the hand of an operator holding the side of the porous substrate, the foreign object is unlikely to pass through the blocked region, so that the intrusion of the foreign object into the measurement region is suppressed. Therefore, the generation of noise caused by the ionization of the foreign object is suppressed. Therefore, this sample support realizes high-precision analysis.

[0008] The sample support of the present invention may be [2] "the sample support according to the above [1], in which the blocking region surrounds the measurement region when viewed from a direction perpendicular to the first surface." This more reliably prevents foreign matter from entering the measurement region.

[0009] The sample support of the present invention may be [3] "the sample support according to the above [1] or [2], in which the voids in the closed region are filled with the same material as the porous substrate." This makes it possible to reduce the porosity of the closed region while increasing the rigidity of the porous substrate.

[0010] The sample support of the present invention may be [4] "the sample support according to any one of the above [1] to [3], wherein the closed region includes a main body portion whose thickness gradually increases from the second surface to the first surface." This makes it possible to increase the rigidity of the region of the porous substrate close to the first surface where the voids open. As a result, the flatness of the first surface used as the surface on which the sample remains is maintained, and as a result, high-precision analysis is achieved.

[0011] The sample support of the present invention may be [5] "the sample support according to any one of the above [1] to [4], wherein the side surface of the porous substrate includes an inclined region that inclines toward the outside of the second surface as it moves from the second surface to the first surface." In this way, when the side surface of the porous substrate is gripped with the first surface facing upward in the vertical direction, the porous substrate can be appropriately gripped while reducing the load on the porous substrate.

[0012] The sample support of the present invention may be [6] "the sample support according to any one of the above [1] to [5], wherein the blocking region includes a protruding portion that protrudes beyond the measurement region on the first surface." This prevents the sample remaining on the first surface from dripping from the first surface onto a side surface of the porous substrate.

[0013] The sample support of the present invention may be [7] "the sample support according to any one of the above [1] to [6], in which the boundary between the side surface of the porous substrate and the second surface is curved." This prevents injury to the worker even if the worker's hand comes into contact with the boundary between the side surface of the porous substrate and the second surface.

[0014] The sample support of the present invention may be [8] "the sample support according to any one of [1] to [7] above, further comprising a conductive layer provided on the surface of the porous substrate, the conductive layer including a first conductive region provided in the measurement region so as not to block the opening of the void in the first surface, and a second conductive region provided in the blocked region so as to be connected to the first conductive region." Since the porosity of the blocked region is smaller than the porosity of the measurement region, the second conductive region provided in the blocked region has better continuity than the first conductive region provided in the measurement region. Therefore, by applying a voltage to the second conductive region, a voltage can be stably applied to the first conductive region via the second conductive region.

[0015] The sample support of the present invention may be [9] "the sample support according to any one of the above [1] to [7], wherein the porous substrate has electrical conductivity." This makes it possible to omit the conductive layer even in cases where electrical conductivity is required for at least a part of the sample support.

[0016] The sample support of the present invention may be

[10] "the sample support according to any one of the above [1] to [7], wherein the porous substrate has insulating properties." This allows the sample support to be used in cases where electrical conductivity is not required for the sample support. Effect of the Invention

[0017] According to the present invention, it is possible to provide a sample support that enables high-precision analysis. [Brief description of the drawings]

[0018] [Figure 1] FIG. 2 is a plan view of an embodiment of a sample support. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. [Diagram 3] FIG. 2 is a schematic diagram of the porous structure of the porous substrate shown in FIG. [Figure 4] 2 is an SEM image of a first surface of the porous substrate shown in FIG. 1. [Diagram 5] 2 is a SEM image of a side view of the porous substrate shown in FIG. 1. [Figure 6] 2 is an SEM image of a cross section of the porous substrate shown in FIG. 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In each drawing, the same or corresponding parts are denoted by the same reference numerals, and duplicated explanations will be omitted.

[0020] [Sample support] The sample support 1 shown in FIG. 1 and FIG. 2 is used for ionizing a sample. The sample is a biological sample. The sample is, for example, a slice of fruit (lemon). The sample support 1 includes a substrate (porous substrate) 2 and a conductive layer 3. The substrate 2 is, for example, rectangular plate-like. The substrate 2 includes a first surface 2a, a second surface 2b opposite to the first surface 2a, and a side surface 2c. The thickness of the substrate 2 (the distance from the first surface 2a to the second surface 2b) is, for example, about 100 μm to 1500 μm. Note that the conductive layer 3 is not shown in FIG. 1.

[0021] The substrate 2 includes a measurement region 21 and a blocking region 22. When viewed from the Z-axis direction (direction perpendicular to the first surface 2a), the measurement region 21 is located inside the side surface 2c of the substrate 2. The measurement region 21 is separated from the side surface 2c. When viewed from the Z-axis direction, the measurement region 21 has, for example, a rectangular shape. The measurement region 21 includes a part of the first surface 2a and a part of the second surface 2b. The sample is ionized in the measurement region 21.

[0022] The blocked area 22 is located outside the measurement area 21 when viewed from the Z-axis direction. The blocked area 22 surrounds the measurement area 21 when viewed from the Z-axis direction. The blocked area 22 has, for example, a rectangular frame shape when viewed from the Z-axis direction. In this embodiment, the blocked area 22 is an area of ​​the substrate 2 other than the measurement area 21. In this embodiment, the blocked area 22 includes the side surface 2c of the substrate 2. In other words, the side surface 2c of the substrate 2 is formed by the outer surface 22c of the blocked area 22.

[0023] The blocked area 22 includes a main body 221 and a protrusion 222. The main body 221 is a portion of the blocked area 22 that overlaps with the measurement area 21 (a portion extending in the same area as the measurement area 21) when viewed from a direction perpendicular to the Z-axis direction (for example, the X-axis direction or the Y-axis direction). The main body 221 surrounds the measurement area 21 when viewed from the Z-axis direction. The main body 221 has a rectangular frame shape when viewed from the Z-axis direction.

[0024] The thickness of the main body 221 gradually increases from the second surface 2b toward the first surface 2a. The thickness of the main body 221 is the distance between the outer edge of the main body 221 and the inner edge of the main body 221 when viewed from the Z-axis direction (the distance in the X-axis direction or the Y-axis direction). The thickness of the main body 221 in a first cross section parallel to the XY plane is greater than the thickness of the main body 221 in a second cross section parallel to the XY plane. The first cross section is located on the first surface 2a side with respect to the second cross section. The average thickness of the main body 221 is approximately the same as the diameter of the particles 23 described later.

[0025] The outer side surface 22d of the main body portion 221 is inclined toward the outside of the second surface 2b as it goes from the second surface 2b to the first surface 2a. In other words, the outer side surface 22d is inclined in a direction away from the second surface 2b on the XY plane as it goes from the second surface 2b to the first surface 2a. The outer side surface 22d is inclined so as to go away from the measurement region 21 as it goes from the second surface 2b to the first surface 2a. The outer side surface 22d is an inclined region of the side surface 2c of the substrate 2. The circumferential length of the main body portion 221 in the first cross section is greater than the circumferential length of the main body portion 221 in the second cross section.

[0026] The protruding portion 222 is a portion of the blocked region 22 that does not overlap with the measurement region 21 when viewed from a direction perpendicular to the Z-axis direction (for example, the X-axis direction or the Y-axis direction). The protruding portion 222 is located on one side (the first surface 2a side) in the Z-axis direction with respect to the main body portion 221. The protruding portion 222 protrudes from the measurement region 21 on the first surface 2a. The protruding portion 222 surrounds the measurement region 21 when viewed from the Z-axis direction. The protruding portion 222 has a rectangular frame shape when viewed from the Z-axis direction. The protruding portion 222 can also be said to be a wall-like member formed to surround the outer periphery of the measurement region 21. In this embodiment, the region of the substrate 2 on the opposite side to the measurement region 21 with respect to the inner surface of the protruding portion 222 is the blocked region 22.

[0027] A boundary 223 between the side surface 2c and the second surface 2b of the substrate 2 has a curved shape. The boundary 223 is curved so as to be convex from the inside to the outside of the side surface 2c and the second surface 2b. In other words, the side surface 2c and the second surface 2b are smoothly connected.

[0028] As shown in FIG. 3, the substrate 2 includes voids (pores) 2d that are irregularly distributed and open to the first surface 2a. That is, the substrate 2 has an irregular porous structure. The "irregular porous structure" is, for example, a structure in which the voids 2d extend in irregular directions and are irregularly distributed in three dimensions. For example, the irregular porous structure includes a structure in which the voids enter the substrate 2 from one inlet (opening) on ​​the first surface 2a side and branch into multiple paths, or a structure in which the voids enter the substrate 2 from multiple inlets (openings) on the first surface 2a side and merge into one path. On the other hand, a structure in which multiple pores extending along the Z-axis direction are provided as the main pores (i.e., a regular structure composed of pores extending mainly in one direction) is not included in the irregular porous structure.

[0029] As shown in FIG. 3, the substrate 2 is formed by an aggregate of a plurality of particles. The aggregate of a plurality of particles is a structure in which a plurality of particles are gathered so as to contact each other. An example of an aggregate of a plurality of particles is a structure in which a plurality of particles are bonded or adhered to each other. That is, in order to form a structure in which a plurality of particles are fixed in a state in which they are in contact with each other, the plurality of particles may be directly connected by fusion or the like, or may be indirectly connected via another member. In this embodiment, the plurality of particles are bonded to each other by fusion. In this embodiment, the substrate 2 is formed by a plurality of particles 23 connected to each other. The particles 23 are, for example, spherical. The shape or diameter of each particle 23 may vary slightly. The diameters of the particles 23 may be the same as each other or different from each other.

[0030] The gaps 2d of the substrate 2 are gaps between the particles 23. In this embodiment, the gaps 2d are open not only to the first surface 2a but also to the second surface 2b. A component of a sample introduced to the first surface 2a can pass through the gaps 2d and pass through the second surface 2b to the outside of the substrate 2. That is, in this embodiment, in the measurement region 21, the first surface 2a and the second surface 2b communicate with each other via the gaps 2d between the particles 23.

[0031] In this embodiment, the material of the particles 23 has light absorbing properties. The particles 23 absorb, for example, the energy of a laser beam irradiated onto the surface of the substrate 2. The particles 23 melt when they absorb a predetermined amount of energy. The particles 23 are formed of, for example, an insulating material. The material of the particles 23 is, for example, glass or ceramic. In this embodiment, soda glass, which has a relatively low melting point among glasses, is used as the material of the particles 23 from the viewpoint of facilitating the production of the aggregate structure. The particles 23 are, for example, glass beads. In this embodiment, the substrate 2 has electrical insulating properties.

[0032] 2 and 3, the conductive layer 3 is provided on the surface of the substrate 2. The conductive layer 3 covers the entire area of ​​each of the first surface 2a and the side surface 2c of the substrate 2. Specifically, the conductive layer 3 includes a first conductive region 31 and a second conductive region 32. The first conductive region 31 is provided in the measurement region 21. The first conductive region 31 is provided on the first surface 2a so as not to block the opening of the gap 2d on the first surface 2a.

[0033] The first conductive region 31 covers the first surface 2a along the uneven shape of the first surface 2a formed by the plurality of particles 23. That is, the thickness of the first conductive region 31 is made very thin compared to the size (diameter) of the particles 23. As a result, the shape of the outer surface of the conductive layer 3 formed on the surface of the particles 23 follows the original surface shape of the particles 23. Therefore, as shown in FIG. 3, the uneven shape of the first surface 2a is maintained even after the first conductive region 31 is formed.

[0034] The second conductive region 32 is provided in the blocked region 22. The second conductive region 32 is provided on the outer side surface 22c (side surface 2c of the substrate 2) of the blocked region 22. The second conductive region 32 extends to the inner side surface of the protruding portion 222. The second conductive region 32 is connected to the first conductive region 31. The thickness of the second conductive region 32 may be greater than the thickness of the first conductive region 31.

[0035] The conductive layer 3 is made of a conductive material. The material of the conductive layer 3 is preferably a metal having low affinity (reactivity) with the sample and high conductivity. From this viewpoint, the material of the conductive layer 3 is preferably, for example, Au (gold), Pt (platinum), etc. The conductive layer 3 is formed to a thickness of about 1 nm to 350 nm by, for example, a plating method, an atomic layer deposition method (ALD: atomic layer deposition), a vapor deposition method, a sputtering method, etc. Note that the material of the conductive layer 3 may be, for example, Cr (chromium), Ni (nickel), Ti (titanium), etc.

[0036] The porosity of the blocked region 22 is smaller than the porosity of the measurement region 21. The aperture ratio of the voids 2d in the side surface 2c of the substrate 2 is smaller than the aperture ratio of the voids 2d in the first surface 2a. The volume of the voids 2d contained in the blocked region 22 per unit volume is smaller than the volume of the voids 2d contained in the measurement region 21 per unit volume. In this embodiment, the blocked region 22 contains almost no voids 2d. Fluids such as air or liquid are less likely to pass through the blocked region 22 than through the measurement region 21. In this embodiment, the porosity of the measurement region 21 is, for example, about 25% to 40%, and the porosity of the blocked region 22 is, for example, about 10% or less.

[0037] The substrate 2 is manufactured by cutting, for example, a base substrate formed of an aggregate of a plurality of particles 23 by laser cutting. The blocked region 22 is formed by the particles 23 fused by the irradiation of the laser light. A part of the particles 23 melted and deformed by the irradiation of the laser light is filled in the void 2d included in the region to be blocked of the base substrate that is to become the blocked region 22. That is, the void 2d in the blocked region 22 is filled with the same material (fused particles 23) as the substrate 2. In this way, the measurement region 21 is not affected by the irradiation of the laser light during the laser cutting, and is a region that does not include the particles 23 that are melted and solidified by the irradiation of the laser light. In contrast, the blocked region 22 is a region that includes the particles 23 that are melted and solidified by the irradiation of the laser light.

[0038] The porosity of each of the measurement region 21 and the blocked region 22 is obtained, for example, as follows. First, an image of the surface or cross section of the substrate 2 is obtained. Next, the image is subjected to, for example, a binarization process to extract a group of pixels corresponding to the voids 2d included in the target region (a predetermined range in the image), and the area of ​​the voids 2d is obtained based on the size per pixel. Next, the porosity is obtained by dividing the area of ​​the voids 2d by the area of ​​the target region.

[0039] Fig. 4 is an example of an SEM image of the first surface 2a of the substrate 2. In the SEM image shown in Fig. 4, the black parts are voids 2d, the circular white parts are particles 23, and the white parts extending continuously along the Y-axis direction are blocked regions 22. When observing the SEM image of the first surface 2a shown in Fig. 4, it can be recognized that the porosity of the blocked regions 22 is smaller than the porosity of the measurement regions 21.

[0040] Fig. 5 is an example of an SEM image of the side surface 2c of the substrate 2. In the SEM image shown in Fig. 5, the planar white portion is the blocked region 22. When observing the SEM image shown in Fig. 5, it can be recognized that the voids 2d do not open to the side surface 2c. Note that, although circular white portions and black portions between the circular white portions can be recognized in the SEM image shown in Fig. 5, the white portions and the black portions are particles 23 and voids 2d present inside the blocked region 22.

[0041] Fig. 6 is an example of an SEM image of a cross section of the substrate 2. In the SEM image shown in Fig. 6, the white portion is the measurement region 21, and the gray portion is the blocked region 22. By observing the SEM image shown in Fig. 6, it can be recognized that the thickness of the main body 221 of the blocked region 22 gradually increases from the second surface 2b toward the first surface 2a, that the protruding portion 222 of the blocked region 22 protrudes from the first surface 2a, and that the boundary portion 223 between the side surface 2c of the substrate 2 and the second surface 2b is curved.

[0042] [Method of manufacturing the sample support] The sample support 1 is manufactured, for example, as follows. First, a base substrate formed of an aggregate of a plurality of particles 23 is prepared. The base substrate has one surface and another surface opposite to the one surface. Next, a laser beam is irradiated onto the other surface of the base substrate. The particles 23 in the area of ​​the other surface irradiated with the laser beam melt. As a result, a groove made up of the fused particles 23 is formed on the other surface of the base substrate. The width of the groove gradually decreases from the other surface toward the one surface.

[0043] As the laser light continues to be irradiated onto the other surface of the base substrate, the groove deepens, and as a result, the base substrate is cut. This results in the formation of the substrate 2 as described above. The blocked region 22 of the substrate 2 is formed by the irradiation of the laser light. The boundary 223 between the side surface 2c and the second surface 2b of the substrate 2 is formed at the beginning of the irradiation of the laser light onto the other surface of the base substrate. The protrusion 222 of the blocked region 22 is formed when the molten particles 23 move to one surface side of the base substrate due to the action of air pressure when the base substrate is cut.

[0044] [Mass spectrometry method] A mass spectrometry method using the sample support 1 will be described. First, the sample support 1 is prepared (first step). The sample support 1 may be prepared by being manufactured by the practitioner of the ionization method and the mass spectrometry method, or may be prepared by being transferred from the manufacturer or seller of the sample support 1. Next, the sample is transferred to the measurement area 21 of the substrate 2 (second step). The sample is, for example, a slice of fruit (lemon). For example, the sample is pressed against the first surface 2a of the substrate 2 to attach a part of the sample to the first surface 2a. Next, the sample support 1 is placed in the ionization chamber of the mass spectrometry device. Next, a laser beam is irradiated to the area of ​​the first surface 2a of the substrate 2 where the sample is present, and a voltage is applied to the second conductive area 32 of the conductive layer 3. This ionizes the components of the sample on the first surface 2a. Next, the ionized components of the sample (sample ions) are detected.

[0045] [Action and Effects] The substrate 2 of the sample support 1 includes voids 2d that are irregularly distributed and open to the first surface 2a. When a sample is introduced to the first surface 2a of the substrate 2, the sample is appropriately diffused into the voids 2d of the substrate 2, so that the amount of the sample remaining on the first surface 2a is appropriately adjusted. Therefore, when an energy ray (e.g., laser light) is irradiated to the first surface 2a, the sample remaining on the first surface 2a is appropriately ionized. Moreover, the porosity of the blocked region 22 is smaller than the porosity of the measurement region 21. As a result, even if a foreign object is attached to the hand of an operator holding the side surface 2c of the substrate 2, the foreign object is unlikely to pass through the blocked region 22, so that the intrusion of the foreign object into the measurement region 21 is suppressed. Similarly, even if the side surface 2c of the substrate 2 comes into contact with a fixing member or the like of a measuring device (analyzer), even if a foreign object is attached to the fixing member, the foreign object is unlikely to pass through the blocked region 22, so that the intrusion of the foreign object into the measurement region 21 is suppressed. Therefore, the generation of noise due to ionization of foreign matter is suppressed. Therefore, the sample support 1 realizes high-precision analysis. In addition, since the sample present in the gap 2d of the measurement region 21 is unlikely to pass through the blocked region 22, adhesion of the sample to the hand of an operator who touches the side surface 2c of the substrate 2 or to a fixing member of a measuring device is suppressed.

[0046] The blocking area 22 surrounds the measurement area 21 when viewed from the Z-axis direction. This more reliably prevents foreign matter from entering the measurement area 21.

[0047] The voids 2d in the closed region 22 are filled with the same material as the substrate 2. This makes it possible to reduce the porosity of the closed region 22 while increasing the rigidity of the substrate 2.

[0048] The closed region 22 includes a main body portion 221 whose thickness gradually increases from the second surface 2b toward the first surface 2a. This can increase the rigidity of the region of the substrate 2 close to the first surface 2a where the gap 2d opens. As a result, the flatness of the first surface 2a, which is used as the surface on which the sample is retained and is irradiated with the energy beam, is maintained, and the analysis can be performed with high precision. In addition, since the thickness of the main body portion 221 increases closer to the first surface 2a, the intrusion of foreign matter into the first surface 2a, which is used as the surface on which the sample is retained and is irradiated with the energy beam, is more effectively prevented.

[0049] The side surface 2c of the substrate 2 includes an inclined region (the outer side surface 22d of the main body portion 221) that inclines toward the outside of the second surface 2b as it moves from the second surface 2b toward the first surface 2a. This allows the substrate 2 to be appropriately held while reducing the load on the substrate 2 when the side surface 2c of the substrate 2 is held with the first surface 2a facing upward in the vertical direction. Also, as described above, the thickness of the main body portion 221 can be gradually increased from the second surface 2b toward the first surface 2a while maintaining the area of ​​the measurement region 21 when viewed from the Z-axis direction.

[0050] The blocking region 22 includes a protruding portion 222 that protrudes from the first surface 2a beyond the measurement region 21. This prevents the sample remaining on the first surface 2a from dripping from the first surface 2a to the side surface 2c of the substrate 2. In addition, when the side surface 2c of the substrate 2 is held by an operator's hand, particularly when the side surface 2c of the substrate 2 is held with the first surface 2a of the substrate 2 facing the operator's hand, the measurement region 21 is prevented from coming into contact with the operator's hand. In addition, when the thickness of the protruding portion 222 is greater than the thickness of the main body portion 221 (particularly the thickness of the region of the main body portion 221 close to the second surface 2b), the above-mentioned effect becomes even more remarkable.

[0051] Boundary 223 between side surface 2c and second surface 2b of substrate 2 is curved. This prevents injury to the worker even if the worker's hand comes into contact with boundary 223 between side surface 2c and second surface 2b of substrate 2.

[0052] The sample support 1 includes a conductive layer 3 provided on the surface of the substrate 2. The conductive layer 3 includes a first conductive region 31 provided in the measurement region 21 so as not to block the opening of the gap 2d on the first surface 2a, and a second conductive region 32 provided in the blocked region 22 so as to be connected to the first conductive region 31. Since the porosity of the blocked region 22 is smaller than the porosity of the measurement region 21, the second conductive region 32 provided in the blocked region 22 has better continuity than the first conductive region 31 provided in the measurement region 21. Therefore, by applying a voltage to the second conductive region 32, a voltage can be stably applied to the first conductive region 31 via the second conductive region 32.

[0053] [Variations] Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment. The materials and shapes of each component are not limited to the above materials and shapes, and various materials and shapes can be adopted. In addition, some components included in the sample support 1 according to the above embodiment may be omitted or modified as appropriate. For example, in the above embodiment, some characteristic components included in the sample support 1 and some effects exerted by each component have been described, but the sample support according to the present invention does not necessarily need to be configured to exert all the effects described in the above embodiment, and may be configured to exert only some of the effects described in the above embodiment. In the latter case, the sample support only needs to have a configuration essential for exerting at least the part of the effect, and a configuration that is not essential for exerting the part of the effect may be omitted or modified as appropriate. Note that, when focusing on one effect, the configuration essential for exerting the one effect should be reasonably understood based on technical common sense and the description of this specification, with a person skilled in the art as the standard. Below, some specific modified examples of the sample support of the present invention are illustrated.

[0054] In the embodiment, an example has been shown in which the blocking area 22 surrounds the measurement area 21, but the blocking area 22 does not have to surround the measurement area 21. The blocking area 22 may be, for example, a pair of areas of the substrate 2 that face each other with the measurement area 21 in between.

[0055] In the embodiment, an example in which the substrate 2 is manufactured by laser cutting has been shown, but the substrate 2 does not have to be manufactured by laser cutting. The substrate 2 may be manufactured by cutting the base substrate with a blade or the like. In this case, the blocked region 22 of the substrate 2 may be formed by melting the cut surface by, for example, heat treatment or chemical treatment. The voids 2d in the blocked region 22 may not be blocked by the fused particles 23. If the porosity of the blocked region 22 is smaller than the porosity of the measurement region 21, that is, if the opening rate of the voids 2d in the side surface 2c of the substrate 2 is smaller than the opening rate of the voids 2d in the first surface 2a, the voids 2d in the blocked region 22 may be blocked by, for example, fine particles or powder of the same material as the particles 23, or may be blocked by a material (for example, resin, etc.) different from the particles 23. The blocked region 22 may be a plate material or the like that is fixed to the side surface 2c of the substrate 2 and has a porosity smaller than the porosity of the measurement region 21.

[0056] In the embodiment, an example in which the blocked region 22 contains almost no voids 2d has been shown, but the blocked region 22 may contain voids 2d as long as the porosity of the blocked region 22 is smaller than the porosity of the measurement region 21. The voids 2d of the blocked region 22 may be narrower than the voids 2d of the measurement region 21.

[0057] In the embodiment, an example has been shown in which the side surface 2c of the substrate 2 is constituted by the outer side surface 22c of the blocked area 22, but the blocked area 22 may be located, for example, on the inner side of the side surface 2c of the substrate 2 and away from the side surface 2c of the substrate 2. The blocked area 22 may be located between the measurement area 21 and the side surface 2c of the substrate 2.

[0058] In the embodiment, an example has been shown in which the void 2d is also open to the second surface 2b of the substrate 2, but the void 2d does not have to be open to, for example, the second surface 2b of the substrate 2. The void 2d only needs to be open to at least the first surface 2a of the substrate 2. For example, the substrate 2 may be composed of a flat plate including the second surface 2b and a porous structure provided on the surface of the plate opposite to the second surface 2b. As an example, the substrate 2 may be composed of a glass plate and a porous structure provided on the glass plate.

[0059] In the embodiment, an example is shown in which the conductive layer 3 covers the entire area of ​​each of the first surface 2a and the side surface 2c of the substrate 2, but the second conductive area 32 of the conductive layer 3 may not be provided in, for example, some areas of the outer surface 22c of the blocked area 22.

[0060] In the embodiment, the material of the particles 23 is glass or ceramic, but the material of the particles 23 may be a metal such as aluminum. That is, the substrate 2 may be conductive. In this case, the conductive layer 3 can be omitted even when at least a part of the sample support 1 is required to be conductive.

[0061] When the substrate 2 has electrical insulation properties, the sample support 1 does not need to have the conductive layer 3. In this case, the sample support 1 can be used when electrical conductivity is not required for the sample support 1 (when electrical insulation is required). For example, the sample support 1 can be used for Desorption Electrospray Ionization (DESI) in which charged microdroplets are irradiated onto the first surface 2a of the substrate 2.

[0062] The sample is not limited to a slice of fruit (lemon) as exemplified in the embodiment. The sample may have a flat surface or an uneven surface. The sample may be something other than fruit, such as a leaf of a plant. In this case, by transferring the components of the surface of the leaf as the sample to the first surface 2a, it becomes possible to perform imaging analysis of the surface (veins) of the leaf.

[0063] The particles 23 are not limited to being spherical, and may have a shape other than spherical.

[0064] In the embodiment, an example in which the sample support 1 is used in a mass spectrometry method has been shown, but the sample support 1 may be used in various analyses of samples. The sample support 1 may be used for ionizing a sample. [Explanation of symbols]

[0065] 1...sample support, 2...substrate, 2a...first surface, 2b...second surface, 2c...side surface, 2d...void, 21...measurement area, 22...occlusion area, 3...conductive layer, 31...first conductive area, 32...second conductive area, 22d...outer surface (slanted area), 221...main body, 222...protrusion, 223...border.

Claims

1. A sample support for ionization of a sample, comprising: a porous substrate including a first surface, a second surface opposite the first surface, and irregularly distributed voids opening at least to the first surface; The porous substrate includes a measurement area including a portion of the first surface, and a blocking area located outside the measurement area when viewed from a direction perpendicular to the first surface, A sample support, wherein the porosity of the blocking region is less than the porosity of the measurement region.

2. 2. The sample support of claim 1, wherein the blocking region surrounds the measurement region when viewed perpendicular to the first surface.

3. The sample support of claim 1 , wherein the voids in the blocked region are filled with the same material as the porous substrate.

4. 2. The sample support of claim 1, wherein the closed region includes a body portion that increases in thickness from the second surface to the first surface.

5. 2. The sample support according to claim 1, wherein a side surface of the porous substrate includes a sloping region that slopes outwardly from the second surface as it moves from the second surface to the first surface.

6. The sample support of claim 1 , wherein the blocking region includes a protrusion on the first surface that protrudes beyond the measurement region.

7. The sample support according to claim 1 , wherein a boundary between the side surface of the porous substrate and the second surface is curved.

8. Further comprising a conductive layer provided on the surface of the porous substrate, 2. The sample support according to claim 1, wherein the conductive layer includes a first conductive region provided in the measurement region so as not to block the opening of the gap in the first surface, and a second conductive region provided in the blocked region so as to be connected to the first conductive region.

9. The sample support of claim 1 , wherein the porous substrate is electrically conductive.

10. The sample support according to claim 1 , wherein the porous substrate has insulating properties.

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