Grain polishing device

Abstract

To provide a grain polishing device which can reduce replacement time and effort and cost for a replacement component in the device.SOLUTION: A grain polishing device 100 includes a cylindrical casing 10 which is formed in a cylindrical shape by connecting multiple divided porous wall sections 11, and a grain polishing roll 30 which is rotatably arranged inside the cylindrical casing 10. A grain polishing chamber 15 is formed between the inner peripheral surface of the cylindrical casing 10 and the outer peripheral surface of the grain polishing roll 30. A grinding section 13 that comes into contact with grains is provided on the inner peripheral surface of the cylindrical casing 10. The grinding section 13 includes multiple protrusions 1311 that protrude to the inner peripheral surface of the cylindrical casing 10. The protrusions 1311 are configured such that protrusion members 1313 can be attached to / detached from fitting holes 1312 formed in the grinding section 13.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a grain polishing device capable of removing the germ and pericarp of grains. [Background technology]

[0002] Conventionally, the germ and pericarp of corn have been removed using grain polishing equipment. For example, Patent Document 1 discloses an apparatus in which a rotor is disposed within a polishing drum having a porous wall portion (sieve portion) and a filing surface (protrusions), and the gap between the polishing drum and the rotor is formed in a germ removal chamber (working chamber).

[0003] The inner surface of the grinding drum is configured such that perforated walls forming the sieve section and file surfaces forming the file section are alternately arranged in the direction of rotation of the rotor, so that the corn wear debris formed in the file section can be removed from the germ removal chamber in the sieve section immediately after its formation. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 3308539 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the above-mentioned conventional device, the projections on the file surface wear out in proportion to the operating time of the device, so that the entire file surface needs to be replaced, which increases the labor required for replacing the file surface and the cost of the replaced file surface.

[0006] In view of the above-mentioned problems, an object of the present invention is to provide a grain polishing apparatus that can reduce the effort and cost required for replacing replacement parts in the grain polishing apparatus. [Means for solving the problem]

[0007] The invention related to (1) is a grain polishing device comprising a cylindrical casing formed into a cylindrical shape by connecting multiple divided porous wall portions, and a grain polishing roll rotatably arranged within the cylindrical casing, in which a grain polishing chamber is formed between the inner surface of the cylindrical casing and the outer surface of the grain polishing roll, wherein a grinding portion with which grains come into contact is provided on the inner surface of the cylindrical casing, the grinding portion has a plurality of convex portions protruding from the inner surface of the cylindrical casing, and the convex portions are configured so that a protruding member can be attached and detached to a fitting hole formed in the grinding portion.

[0008] The invention related to (2) is the grain polishing device described in (1) above, in which the grinding section is arranged between the two porous wall sections and is arranged in multiple sections within the cylindrical casing.

[0009] The invention related to (3) is a grain polishing device described in (2) above, wherein the cylindrical casing has a plurality of pillar portions supporting the upper and lower ends of the cylindrical casing, and the grinding portion is arranged on the pillar portions.

[0010] The invention related to (4) is a grain polishing device described in any of (1) to (3) above, in which the grinding section is divided into an upper and lower part and consists of an upper grinding section and a lower grinding section, and the upper grinding section and the lower grinding section have different grinding surfaces.

[0011] The inventions related to (5) and (6) are the grain polishing devices described in any one of (1) to (4) above, in which the protrusion has a spring pin fitted therein. Effect of the Invention

[0012] According to the present invention, a grinding portion is provided on the inner surface of the cylindrical casing of the grain polishing device, and a plurality of detachable convex portions are provided on the grinding portion. This makes it possible to replace only the worn convex portions without replacing the entire grinding portion, thereby making it possible to significantly reduce the costs associated with maintaining the grain polishing device compared to conventional methods. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic cross-sectional view of a grain polishing device in one embodiment of the present invention. [Diagram 2] FIG. 2 is an exploded oblique view of the grain polishing section in one embodiment of the present invention. [Diagram 3] FIG. 2 is a cross-sectional view of the grain polishing section in one embodiment of the present invention. [Figure 4] FIG. 2 is an oblique view of a cylindrical casing of the grain polishing section in one embodiment of the present invention. [Diagram 5] FIG. 2 is a perspective view of a cylindrical casing showing an arrangement of a grinding portion in one embodiment of the present invention. [Figure 6] 3A and 3B are a plan view and a side view of a grinding unit in one embodiment of the present invention. [Figure 7] FIG. 4 is a perspective view of the grinding portion, illustrating a manner in which a spring pin is installed in the grinding portion in one embodiment of the present invention. [Figure 8] 4A to 4C are side views of a spring pin and diagrams illustrating dimensions of the spring pin in one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, one embodiment of a grain polishing device of the present invention will be described with reference to the drawings.

[0015] Figure 1 shows a schematic cross-sectional view of a grain polishing apparatus 100 according to one embodiment of the present invention, which is capable of removing the germ and pericarp from grains such as corn. That is, the apparatus at least includes a drive motor 40 for rotating the grain polishing roll 30 of the grain polishing section 1 shown in Figure 2, an air blower 50 for blowing air to the grain polishing section 1, a supply section 60 for supplying grains to the grain polishing section 1, and a discharge section 20 for discharging the germ of the grain. The grain polishing device 100 can also polish rice, wheat, and other grains.

[0016] 2 shows an exploded perspective view of the grain polishing unit 1 in this embodiment. The grain polishing roll 30 is surrounded by a cylindrical casing 10 having a plurality of divided screens 11 arranged in series to form a cylindrical shape. A frame 12 that covers the screens 11 is disposed on the outer periphery of the cylindrical casing 10.

[0017] Figure 3 shows a cross-sectional view of the grain polishing unit 1 seen from above, and Figure 4 shows a perspective view of the cylindrical casing 10. As shown in the figure, a grain polishing chamber 15 (see Figure 3) is formed between the inner peripheral surface of the cylindrical casing 10 and the outer peripheral surface of the grain polishing roll 30, and the grain is polished while flowing as shown by the arrows.

[0018] In this embodiment, an abrasive plate 13, which serves as a grinding portion that grinds grains, is provided on the inner peripheral surface of the cylindrical casing 10 in addition to the above-mentioned screen 11. As shown in Figs. 3 and 4, the abrasive plate 13 is disposed between the two screens 11 and a plurality of abrasive plates 13 are disposed inside the cylindrical casing 10.

[0019] In the illustrated embodiment, the cylindrical casing 10 is provided with four pillars 14 that support the upper and lower ends thereof, and the above-mentioned abrasive plate 13 is disposed on the pillars 14. Fig. 5 shows an embodiment in which the abrasive plate 13 is attached to the four pillars 14 of the cylindrical casing 10, and in this embodiment, the abrasive plate 13 is divided into upper and lower portions and is composed of an upper abrasive plate 131 (upper grinding portion) and a lower abrasive plate 132 (lower grinding portion).

[0020] As shown in the enlarged view of FIG. 5 and the plan view and side view of the abrasive plate 13 in FIG. 6, the abrasive plate 13 is formed with a plurality of protrusions 1311 that protrude toward the inner peripheral surface of the cylindrical casing 10.

[0021] More specifically, as shown in FIG. 7, a plurality of fitting holes 1312 are formed in the ground surface of the abrasive plate 13, and spring pins 1313, which are protruding members, are inserted into the fitting holes 1312 so as to protrude 0.5 to 3 mm from the plate surface.

[0022] The abrasive plate 13 of this embodiment has a flat plate with a fitting hole 1312 of a predetermined size drilled therein, and a spring pin 1313 as shown in Fig. 8 is inserted into the fitting hole 1312 to form a protrusion 1311. That is, by hammering the spring pin 1313 into the fitting hole 1312, the outer diameter of the spring pin 1313 is reduced, and the spring pin 1313 is fixed in place by the repulsive force.

[0023] As described above, the spring pin 1313 is hammered into the fitting hole 1312 and fixed therein. Therefore, when all or part of the spring pin 1313 reaches the end of its wear life, it is possible to replace only the spring pin 1313 to be replaced, without replacing the abrasive plate 13. With this configuration, it is possible to significantly reduce the cost of maintenance compared to the conventional method.

[0024] The size of the spring pin 1313 is not particularly limited, and for example, a spring pin 1313 having an outer diameter of 2 to 5 mm as shown in FIG. 8 can be used.

[0025] By forming the convex portion 1311 on the abrasive plate 13 by the spring pin 1313 as described above, it becomes possible to effectively separate, for example, the endosperm portion of corn from the germ and pericarp by the grinding action of the abrasive plate 13.

[0026] That is, with the above-mentioned configuration, the protruding portion of the spring pin 1313 has more opportunities to collide with the germ portion of the corn kernel in the polishing chamber 15, making it possible to efficiently separate the germ from the endosperm portion while keeping the internal pressure of the polishing chamber 15 low. Also, by being able to lower the internal pressure of the polishing chamber 15, the frictional force between the kernels decreases, reducing the crushing of the endosperm portion and making it possible to suppress the generation of powdery matter.

[0027] In addition, the amount of powdery matter discharged outside the polishing chamber 15 can be reduced, improving product yield. Also, the protruding portion of the spring pin 1313 exerts a grinding action on the endosperm surface, and the pericarp is separated from the endosperm portion, making it possible to suppress deterioration of polished grain quality.

[0028] Furthermore, as mentioned above, by being able to reduce the internal pressure of the grain polishing chamber 15, it is possible to extend the wear life of components such as the screen 11 and the abrasive plate 13 arranged on the inner surface of the cylindrical casing 10.

[0029] (Other embodiments) Although one embodiment of the present invention has been described above with reference to the drawings, the grain polishing device of the present invention is not necessarily limited to the above-described embodiment.

[0030] For example, the number of spring pins 1313 installed on the abrasive plate 13 is not particularly limited. The upper abrasive plate 131 and the lower abrasive plate 132 shown in the figure each have a length of 250 cm. 2 It is preferable that 100 to 300 spring pins 1313 are provided on each of the ground surfaces to form the protrusions 1311. In other words, the number of spring pins 1313 provided per unit area on the ground surface is 0.4 to 1.2 pins / cm. 2 It becomes.

[0031] In addition, in the above-described embodiment, the abrasive plates 13 are arranged on the pillar portions 14 at four locations, but this is not necessarily limited to this, and it is also possible to arrange the abrasive plates 13 at three or five locations within the cylindrical casing 10.

[0032] In the above embodiment, the abrasive plate 13 is divided into an upper abrasive plate 131 and a lower abrasive plate 132, but it is not essential to divide the abrasive plate 13 into two, and the abrasive plate 13 may be a single abrasive plate 13. Furthermore, the division of the abrasive plate 13 is not limited to two as described above, and it is also possible to divide the abrasive plate 13 into three or more. In addition, the division of the abrasive plate 13 is not necessarily limited to the vertical division as described above, and it may be divided in the rotation direction of the grain polishing roll 30.

[0033] In addition, in the above-described embodiment, the upper abrasive plate 131 and the lower abrasive plate 132 have the same grinding surface as shown in Fig. 5 etc., but it is also possible to configure the upper and lower abrasive plates to have different grinding surfaces. In other words, by arranging the upper abrasive plate 131 and the lower abrasive plate 132 with different grinding effects according to the type of grain as the raw material and the grain polishing conditions, it is possible to obtain the optimal grinding effect for the target grain.

[0034] In the above-described embodiment, the embodiment in which the spring pin 1313 is inserted as the protrusion 1311 has been shown as the most preferable example. However, it is not necessarily limited to the spring pin 1313, and it is possible to use a round bar or other object with a hook shape, and any object that can be detached and replaced can be used.

[0035] Although one embodiment of the present invention and other embodiments have been described above, the above-mentioned embodiments of the invention are intended to facilitate understanding of the present invention and do not limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention includes equivalents thereof. Furthermore, the components described in the claims and specification may be combined or omitted within the scope of solving at least part of the above-mentioned problems or achieving at least part of the effects. [Explanation of symbols]

[0036] 1 Grain milling department 10. Cylindrical casing 11 Screen (perforated wall) 12 Frames 13 Abrasive plate (grinding part) 131 Upper abrasive plate (upper grinding part) 132 Lower abrasive plate (lower grinding part) 1311 Convex 1312 Fitting hole 1313 Spring pin (protruding part) 14 Pillar section 15 Grain mill 20 Discharge section 30 Grain Roll 40 Drive motor 50 Blower 60 Supply section 100 Grain milling equipment

Claims

1. A grain polishing device comprising a cylindrical casing having a plurality of divided porous wall portions connected together to form a cylindrical shape, and a grain polishing roll rotatably disposed within the cylindrical casing, in which a grain polishing chamber is formed between an inner peripheral surface of the cylindrical casing and an outer peripheral surface of the grain polishing roll, The cylindrical casing has an inner peripheral surface provided with a grinding portion with which the grain comes into contact, The grinding portion includes a plurality of protrusions protruding from an inner peripheral surface of the cylindrical casing, The convex portion is configured so that a protruding member can be attached and detached to a fitting hole formed in the ground portion. A grain polishing device characterized by the above.

2. The grinding portion is disposed between the two porous wall portions and a plurality of grinding portions are disposed within the cylindrical casing. A grain milling apparatus as claimed in claim 1.

3. the cylindrical casing includes a plurality of pillars supporting an upper end portion and a lower end portion of the cylindrical casing; The grinding portion is disposed on the column portion. A grain milling apparatus as claimed in claim 2.

4. The grinding section is divided into an upper grinding section and a lower grinding section, The upper grinding portion and the lower grinding portion have different grinding surfaces. A grain milling apparatus according to any one of claims 1 to 3.

5. The protrusion has a spring pin fitted therein. A grain milling apparatus according to any one of claims 1 to 3.

6. The protrusion has a spring pin fitted therein. A grain milling apparatus as claimed in claim 4.

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