Method for manufacturing a holding member and holding member

Abstract

To provide a manufacturing method of a holding member that makes it easy to make the thickness of an internal electrode uniform.SOLUTION: A manufacturing method of a holding member 10 having an internal electrode 50 therein includes a first conductor layer formation step of printing a conductive paste on a first bonding surface of a first green sheet 60 to form a first conductor layer 61 that becomes a part of the internal electrode 50, a second conductor layer formation step of printing a conductive paste on a second bonding surface of a second green sheet 70 to form a second conductor layer 73 that becomes a part of the internal electrode 50, a lamination step of laminating the first green sheet 60 and the second green sheet 70 in a lamination direction with the first and second bonding surfaces arranged facing each other, and a firing step of firing a green sheet laminate 90 obtained by the lamination step, and in the second conductor layer formation step, the second conductor layer 73 is formed having a first border portion 74 arranged in a position overlapping the outer edge portion of the first conductor layer 61 in the lamination direction.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a method for manufacturing a retention member. [Background technology]

[0002] Conventionally, a heating device described in JP 2022-48064 A (Patent Document 1 below) is known as a holding device for holding an object such as a wafer. This heating device includes a holder formed of an insulating material such as ceramics. An internal electrode such as a resistance heating element is formed inside the holder.

[0003] Patent Document 1 describes that a method of laminating multiple green sheets containing aluminum nitride powder or the like can be used to form a holder. In detail, a metallization paste is printed on multiple green sheets to form unsintered conductor layers that will later become internal electrodes, and then multiple green sheets are laminated. Then, a holder having internal electrodes can be formed by carrying out processes such as compression bonding, firing, and polishing and drilling. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2022-48064 Summary of the Invention [Problem to be solved by the invention]

[0005] According to the above-mentioned method for forming a support, the thickness of the internal electrode of the support may become non-uniform due to the compression of the unsintered conductor layer when the multiple green sheets are pressed together. Specifically, the thickness of the internal electrode tends to be smaller at the outer edge than at the center. For example, when such an internal electrode having uneven thickness and projections is used as a high-frequency electrode for generating plasma, the in-plane uniformity of the plasma density cannot be ensured.

[0006] The present disclosure has been completed in light of the above circumstances, and an object of the present disclosure is to provide a manufacturing method for a holding member that can easily make the thickness of an internal electrode uniform. [Means for solving the problem]

[0007] The manufacturing method of a holding member disclosed herein is a manufacturing method of a holding member having an internal electrode therein, and includes a first conductor layer formation process of printing a conductive paste on a first compression surface of a first green sheet to form a first conductor layer that becomes part of the internal electrode, a second conductor layer formation process of printing a conductive paste on a second compression surface of a second green sheet to form a second conductor layer that becomes part of the internal electrode, a lamination process of stacking the first green sheet and the second green sheet in a stacking direction with the first compression surface and the second compression surface arranged facing each other, and a firing process of firing the green sheet laminate obtained by the lamination process, wherein in the second conductor layer formation process, the second conductor layer is formed to have a first border portion arranged in a position overlapping an outer edge portion of the first conductor layer in the stacking direction. Effect of the Invention

[0008] According to the present disclosure, it is possible to provide a manufacturing method for a holding member that can easily make the thickness of an internal electrode uniform. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view illustrating an external configuration of an electrostatic chuck according to a first embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view of the electrostatic chuck. [Diagram 3] FIG. 3 is an explanatory diagram showing a manufacturing method of the holding member. [Figure 4] FIG. 4 is a diagram showing the first conductor layer as viewed from the lamination direction. [Diagram 5] FIG. 5 is a diagram showing the second conductor layer as viewed from the lamination direction. [Figure 6]FIG. 6 is a diagram showing the overlap between the first conductor layer and the second conductor layer in the lamination direction. [Figure 7] FIG. 7 is a schematic cross-sectional view of a holding member according to the second embodiment. [Figure 8] FIG. 8 is an explanatory diagram showing a manufacturing method of the holding member according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described. (1) A manufacturing method of a holding member disclosed herein is a manufacturing method of a holding member having an internal electrode therein, comprising: a first conductor layer forming process of printing a conductive paste on a first bonding surface of a first green sheet to form a first conductor layer that becomes part of the internal electrode; a second conductor layer forming process of printing a conductive paste on a second bonding surface of a second green sheet to form a second conductor layer that becomes part of the internal electrode; a lamination process of laminating the first green sheet and the second green sheet in a lamination direction with the first and second bonding surfaces arranged facing each other; and a firing process of firing the green sheet laminate obtained by the lamination process, wherein in the second conductor layer forming process, the second conductor layer is formed having a first border portion arranged in a position overlapping an outer edge portion of the first conductor layer in the lamination direction.

[0011] According to such a method for manufacturing the holding member, it is possible to prevent the thickness of the internal electrode from becoming thin at the outer edge portion of the internal electrode.

[0012] (2) In the manufacturing method of a retaining member described in (1), it is preferable that the internal electrode has a through hole, and in the first conductor layer forming process, the first conductor layer is formed having a first through hole corresponding to the through hole, and in the second conductor layer forming process, the second conductor layer is formed having a second edging portion arranged in a position overlapping with the hole edge portion of the first through hole in the stacking direction.

[0013] According to such a method for manufacturing the holding member, it is possible to prevent the thickness of the internal electrode from becoming thin at the edge of the through hole of the internal electrode.

[0014] (3) In the manufacturing method of a holding member described in (1) or (2), it is preferable that the internal electrodes are connected to vias, the second green sheet has via holes for forming the vias, and the inside of the via holes is filled with a conductive paste, and in the second conductor layer forming process, the second conductor layer is formed to have a pad portion having an area larger than that of the via hole at a position overlapping the via hole in the stacking direction.

[0015] According to such a method for manufacturing a holding member, it is possible to suppress a local increase in thickness of the internal electrode at the connection portion between the internal electrode and the via.

[0016] (4) In the method for manufacturing a holding member according to any one of (1) to (3), the internal electrode is a high-frequency electrode connected to a high-frequency power source.

[0017] According to this method for manufacturing a holding member, when a high frequency voltage is applied to the internal electrode to generate plasma, the in-plane uniformity of the plasma density can be improved.

[0018] (5) In the manufacturing method of a holding member described in any one of (1) to (4), it is preferable that the holding member has a holding surface for holding an object, the green sheet laminate has a surface that becomes the holding surface, and in the stacking process, the first green sheet is arranged on the surface side of the second green sheet.

[0019] According to such a method for manufacturing the holding member, it is easy to keep the distance from the holding surface to the internal electrode constant.

[0020] [Details of the First Embodiment of the Present Disclosure] A specific example of the first embodiment of the present disclosure will be described with reference to FIGS. 1 to 6. Note that the present disclosure is not limited to these examples, but is intended to include all modifications within the scope of the claims and meaning equivalent thereto. In the following description, for multiple identical members, only some of the members may be labeled with a reference number, and the reference numbers of other members may be omitted. In this specification, the configuration of the holding member and holding device will be described with the Z-axis positive direction as the upward direction, the Z-axis negative direction as the downward direction, and the XY plane direction as the horizontal direction, but the holding member and holding device may be arranged differently in the actual use mode. In this specification, "orthogonal" also includes an arrangement that is recognized as substantially orthogonal.

[0021] <Electrostatic chuck> A holding device including a holding member 10 according to the present disclosure is an electrostatic chuck 1 capable of attracting and holding an object such as a semiconductor wafer, a glass substrate, or the like (hereinafter referred to as a "wafer W") The electrostatic chuck 1 is attached to, for example, a processing chamber of a semiconductor manufacturing device (not shown), and is used to perform various processes (film formation, etching, etc.) on the wafer W using plasma.

[0022] 1, the electrostatic chuck 1 includes a holding member 10 and a base member 20. The holding member 10 and the base member 20 are joined by a joint 30. The joint 30 is formed of an adhesive such as a silicone resin, an acrylic resin, or an epoxy resin. The electrostatic chuck 1 is capable of attracting and holding the wafer W by electrostatic attraction.

[0023] The electrostatic chuck 1 has a pin insertion hole 11 formed therein, which penetrates the holding member 10, the base member 20, and the joint portion 30 in the Z-axis direction. A lift pin (not shown) is inserted into the pin insertion hole 11, and the wafer W can be separated from the holding surface 10A of the electrostatic chuck 1 by moving the lift pin.

[0024] The base member 20 is a disk-shaped member, and can be molded into a shape having, for example, a diameter of about 340 mm and a thickness of about 35 mm. The base member 20 is mainly made of a conductive material such as aluminum or an aluminum alloy. The "mainly made material" here refers to the main component, and means the material with the highest content ratio (weight ratio) (the same applies below). As shown in FIG. 2, the upper surface 20A of the base member 20 is disposed on the holding member 10 side. The upper surface 20A of the base member 20 is joined to the lower surface 10B of the holding member 10, which will be described later, by a joint 30.

[0025] A coolant flow path 21 is provided inside the base member 20. The coolant flow path 21 is connected to a coolant circulation device (not shown). The coolant circulation device is configured to be able to circulate a coolant such as a fluorine-based inert liquid or water through the coolant flow path 21. When a coolant flows through the coolant flow path 21, the base member 20 is cooled, and the holding member 10 is cooled by heat transfer (heat withdrawal) between the base member 20 and the holding member 10 via the joint 30, and the wafer W held by a holding surface 10A of the holding member 10 (described later) is cooled. This allows the temperature of the wafer W to be controlled.

[0026] <Retaining material> The holding member 10 is generally disk-shaped and can be molded into a shape having, for example, a diameter of about 300 mm and a thickness of about 5 mm. The holding member 10 is an insulating substrate. The material that mainly forms the holding member 10 is, for example, ceramics such as aluminum nitride (AlN) or alumina (Al2O3).

[0027] The upper surface of the holding member 10 is a holding surface 10A that is perpendicular to the Z-axis direction. The holding surface 10A is a circular flat surface, and functions as a surface that holds the wafer W. A lower surface 10B of the holding member 10, which is disposed on the opposite side to the holding surface 10A, is joined to the base member 20 via a joining portion 30.

[0028] An internal electrode 50 and a chuck electrode 40 made of a conductive material (e.g., tungsten, molybdenum, platinum, etc.) are disposed inside the holding member 10. Furthermore, an electrode other than the internal electrode 50 and the chuck electrode 40 (e.g., a heater, etc.) may be provided inside the holding member 10 as necessary.

[0029] The holding member 10 can be produced by preparing multiple ceramic green sheets, processing predetermined green sheets by forming via holes, filling and printing metallization paste, etc., thermocompression bonding these green sheets, processing by cutting, etc., and firing them. The detailed manufacturing method of the holding member 10 will be described later.

[0030] <Internal electrode> The internal electrode 50 of the first embodiment is a high-frequency electrode connected to a high-frequency power source not shown. By applying a high-frequency voltage from the high-frequency power source to the internal electrode 50, plasma can be generated. The shape of the internal electrode 50 as viewed in the Z-axis direction is, for example, substantially circular. A through hole 51 is formed in the internal electrode 50. A pin insertion hole 11 is arranged inside the through hole 51. The internal electrode 50 is also connected to a via 52 extending in the Z-axis direction inside the holding member 10. The via 52 is made of a conductive material and is a part of a power supply path that electrically connects the internal electrode 50 and the high-frequency power source. In detail, the internal electrode 50 is connected to the high-frequency power source through the via 52, a terminal not shown, or the like.

[0031] The dimension (thickness) of the internal electrode 50 in the Z-axis direction tends to be smaller at the outer edge (horizontal edge) of the internal electrode 50 and at the hole edge of the through hole 51. In detail, the outer edge of the internal electrode 50 has an outer edge inclined portion 53 whose thickness decreases toward the outside. Also, the hole edge of the through hole 51 has a hole edge inclined portion 54 whose thickness decreases toward the inside of the through hole 51. In the process of forming the internal electrode 50, the conductor layer that is printed on the green sheet and is the basis of the internal electrode 50 is compressed in the vertical direction. As a result, the conductor layer spreads outward from the outer edge or hole edge, and the inclined portion as described above is formed.

[0032] The internal electrode 50 of the first embodiment includes thick portions 55A and 55B that are thicker than the surroundings. The thick portion 55A is disposed near the outer edge of the internal electrode 50 and is continuous with the outer edge inclined portion 53. The thick portion 55B is disposed near the hole edge of the through hole 51 and is continuous with the hole edge inclined portion 54. As will be described later, the first conductor layer 61 and the second conductor layer 73 are laminated to form the thick portions 55A and 55B.

[0033] By forming the thick portion 55A near the outer edge of the internal electrode 50, it becomes easier to reduce the region where the outer edge inclined portion 53 is formed, i.e., the region where the thickness of the internal electrode 50 is reduced. By forming the thick portion 55B near the hole edge of the through hole 51, it becomes easier to reduce the region where the hole edge inclined portion 54 is formed, i.e., the region where the thickness of the internal electrode 50 is reduced.

[0034] Moreover, the internal electrode 50 of the first embodiment also has a thick portion 55C in the vicinity of the via 52. When viewed in the Z-axis direction, the via 52 is disposed inside the thick portion 55C. If the thick portion 55C is not formed, in the process of forming the internal electrode, the portion of the conductor layer that is the basis of the internal electrode that overlaps with the via in the Z-axis direction may have a locally protruding shape. However, in the present embodiment, since the thick portion 55C is formed, it is possible to suppress the portion corresponding to the via 52 from protruding locally, and to make the convex shape formed in the vicinity of the via 52 gentler.

[0035] As described above, since the internal electrode 50 of this embodiment has the thick portions 55A and 55B, it is possible to prevent the thickness of the internal electrode 50 from becoming thin at the outer edge portion or the edge portion of the through hole 51. In addition, the thick portion 55C can prevent the thickness of the internal electrode 50 from becoming locally large in the vicinity of the via 52. That is, it is easy to make the thickness of the internal electrode 50 uniform as a whole. Therefore, when a high-frequency voltage is applied to the internal electrode 50 to generate plasma, it is expected that the in-plane uniformity of the plasma density can be easily ensured.

[0036] <Chuck electrode> The shape of the chuck electrode 40 as viewed in the Z-axis direction is, for example, substantially circular. A through hole 41 is formed in the chuck electrode 40. A pin insertion hole 11 is arranged inside the through hole 41. Note that, like the internal electrode 50, the chuck electrode 40 also has an inclined outer edge portion and an inclined hole edge portion. However, for simplicity, the inclined outer edge portion and the inclined hole edge portion of the chuck electrode 40 are not illustrated in this specification. When a voltage is applied to the chuck electrode 40 from a power source (not illustrated), an electrostatic attractive force is generated, and the wafer W is attracted and fixed to the holding surface 10A of the holding member 10 by this electrostatic attractive force.

[0037] <Method of manufacturing the holding member> In this embodiment, the holding member 10 is manufactured by laminating a plurality of green sheets. The internal electrode 50 is composed of a first conductor layer 61 and a second conductor layer 73. The manufacturing method of the holding member 10 of this embodiment includes a first conductor layer forming step, a second conductor layer forming step, a lamination step, and a firing step.

[0038] First, a plurality of green sheets made of ceramics are prepared. The plurality of green sheets include a first green sheet 60, a second green sheet 70, and a third green sheet 80, as shown in FIG. 3. The first green sheet 60 has a first surface 60A and a second surface 60B disposed on the opposite side to the first surface 60A. The second green sheet 70 has a third surface 70A and a fourth surface 70B disposed on the opposite side to the third surface 70A. The third green sheet 80 has a fifth surface 80A and a sixth surface 80B disposed on the opposite side to the fifth surface 80A.

[0039] <First conductor layer formation process> In the first conductor layer forming step, a first conductor layer 61 is formed on a first green sheet 60. The first conductor layer 61 is formed by printing a conductive paste on a second surface 60B (an example of a first pressure-bonding surface) of the first green sheet 60. As shown in FIG. 4, the first conductor layer 61 has a circular shape when viewed in the Z-axis direction. The first conductor layer 61 has a first through hole 62 corresponding to the through hole 51 of the internal electrode 50.

[0040] 3, a third conductor layer 63 that serves as the base of the chuck electrode 40 is formed on a first surface 60A of the first green sheet 60. The third conductor layer 63 has a third through hole 64 that corresponds to the through hole 41 of the chuck electrode 40.

[0041] <Second conductor layer forming process> The second green sheet 70 has via holes 71 for forming vias 52 connected to the internal electrodes 50. The via holes 71 penetrate the second green sheet 70 in the Z-axis direction. A conductive paste is filled inside the via holes 71 to form columnar conductor portions 72 that become the bases of the vias 52. In the second conductor layer forming step, a second conductor layer 73 is formed on the second green sheet 70. The second conductor layer 73 is formed by printing a conductive paste on a third surface 70A (an example of a second pressure-bonding surface) of the second green sheet 70. The second conductor layer 73 is formed to include a first border portion 74, a second border portion 75, and a pad portion 76.

[0042] As shown in Fig. 5, the first edging portion 74 has a circular ring shape when viewed in the Z-axis direction. As shown in Fig. 6, the first edging portion 74 is disposed at a position overlapping with the outer edge portion of the first conductor layer 61 in the Z-axis direction. The first edging portion 74 is formed to protrude outward in the XY plane direction beyond the outer edge portion of the first conductor layer 61. The overlapping of the first edging portion 74 and the first conductor layer 61 in the Z-axis direction forms a thick portion 55A in the vicinity of the outer edge portion of the internal electrode 50.

[0043] As shown in Fig. 5, the second border portion 75 has a circular ring shape when viewed in the Z-axis direction. As shown in Fig. 6, the second border portion 75 is disposed at a position overlapping with the hole edge portion of the first through hole 62 in the Z-axis direction. The second border portion 75 is formed to protrude inward of the first through hole 62 in the XY plane direction. The second border portion 75 has a second through hole 75A disposed inside the first through hole 62. By overlapping the second border portion 75 and the first conductor layer 61 in the Z-axis direction, a thick portion 55B is formed in the vicinity of the hole edge portion of the through hole 51 of the internal electrode 50.

[0044] As shown in Fig. 5, the pad portion 76 is disposed at a position overlapping with the via hole 71 in the Z-axis direction. The pad portion 76 is formed to have an area larger than that of the via hole 71 as viewed in the Z-axis direction. As viewed in the Z-axis direction, the via hole 71 is disposed inside the pad portion 76. As shown in Fig. 6, the pad portion 76 and the first conductor layer 61 overlap in the Z-axis direction, thereby forming a thick portion 55C in the vicinity of the via 52 of the internal electrode 50.

[0045] <Lamination process> In the lamination step, as shown in Fig. 3, the first green sheet 60, the second green sheet 70, and the third green sheet 80 are laminated in the Z-axis direction (lamination direction). At this time, the second surface 60B of the first green sheet 60 and the third surface 70A of the second green sheet 70 are arranged to face each other. Also, the first surface 60A of the first green sheet 60 and the sixth surface 80B of the third green sheet 80 are arranged to face each other. The third green sheet 80 is a plain green sheet that does not have a conductive layer or the like. The fifth surface 80A (an example of a surface) of the third green sheet 80 becomes the holding surface 10A of the holding member 10.

[0046] Although not shown, in the lamination step, a plurality of green sheets other than the first green sheet 60, the second green sheet 70, and the third green sheet 80 are laminated below the fourth surface 70B of the second green sheet 70. This results in a green sheet laminate 90. The green sheet laminate 90 is appropriately processed, such as by drilling holes or cutting. For example, through holes 91 that will become the pin insertion holes 11 of the holding member 10 are formed.

[0047] <Firing process> In the firing step, the green sheet laminate 90 is fired to obtain a fired body. The fired body is further subjected to polishing or the like to form the holding member 10.

[0048] <Effects of the First Embodiment> As described above, the manufacturing method of the holding member 10 of embodiment 1 is a manufacturing method of a holding member 10 having an internal electrode 50 therein, and includes a first conductor layer formation process of printing a conductive paste on the first compression surface (second surface 60B) of the first green sheet 60 to form a first conductor layer 61 that becomes a part of the internal electrode 50, a second conductor layer formation process of printing a conductive paste on the second compression surface (third surface 70A) of the second green sheet 70 to form a second conductor layer 73 that becomes a part of the internal electrode 50, a lamination process of laminating the first green sheet 60 and the second green sheet 70 in the lamination direction with the first compression surface and the second compression surface arranged to face each other, and a firing process of firing the green sheet laminate 90 obtained by the lamination process, and in the second conductor layer formation process, the second conductor layer 73 is formed having a first border portion 74 arranged in a position overlapping the outer edge portion of the first conductor layer 61 in the lamination direction.

[0049] According to such a method for manufacturing the holding member 10, it is possible to prevent the thickness of the internal electrode 50 from becoming thin at the outer edge portion of the internal electrode 50.

[0050] In the manufacturing method of the retaining member 10 of embodiment 1, the internal electrode 50 has a through hole 51, and in the first conductor layer formation process, the first conductor layer 61 is formed having a first through hole 62 corresponding to the through hole 51, and in the second conductor layer formation process, the second conductor layer 73 is formed having a second edging portion 75 arranged in a position overlapping with the hole edge portion of the first through hole 62 in the stacking direction.

[0051] According to such a method for manufacturing the holding member 10, it is possible to prevent the thickness of the internal electrode 50 from becoming thin at the hole edge portion of the through hole 51 of the internal electrode 50.

[0052] In the manufacturing method of the retaining member 10 of embodiment 1, the internal electrode 50 is connected to the via 52, the second green sheet 70 has a via hole 71 for forming the via 52, and the inside of the via hole 71 is filled with a conductive paste. In the second conductor layer formation process, the second conductor layer 73 is formed with a pad portion 76 having an area larger than that of the via hole 71 at a position overlapping with the via hole 71 in the stacking direction.

[0053] According to such a method for manufacturing the holding member 10, a local increase in thickness of the internal electrode 50 at the connection portion between the internal electrode 50 and the via 52 can be suppressed.

[0054] In the manufacturing method of the holding member 10 of the first embodiment, the internal electrode 50 is a high-frequency electrode that is connected to a high-frequency power source.

[0055] According to such a manufacturing method for the holding member 10, when a high frequency voltage is applied to the internal electrode 50 to generate plasma, the in-plane uniformity of the plasma density can be improved.

[0056] In the manufacturing method of the holding member 10 of embodiment 1, the holding member 10 has a holding surface 10A that holds an object (wafer W), and the green sheet laminate 90 has a surface (fifth surface 80A) that becomes the holding surface 10A, and in the lamination process, the first green sheet 60 is arranged on the surface side of the second green sheet 70.

[0057] According to such a method for manufacturing the holding member 10, it is easy to keep the distance from the holding surface 10A to the internal electrode 50 constant.

[0058] [Details of the second embodiment of the present disclosure] A specific example of the second embodiment of the present disclosure will be described with reference to Fig. 7 and Fig. 8. Configurations similar to those of the first embodiment are given the same reference numerals as those of the first embodiment, and descriptions thereof may be omitted.

[0059] 7, the holding member 110 of the second embodiment includes a via 142 and a via connection portion 143 disposed inside the through hole 51 of the internal electrode 50 when viewed in the Z-axis direction. The via 142 and the via connection portion 143 are connected to the chuck electrode 40.

[0060] The manufacturing method of the holding member 110 according to the second embodiment is substantially the same as the manufacturing method of the holding member 10 according to the first embodiment, and therefore only the differences between the two will be briefly described below. The multiple green sheets constituting the holding member 110 include a first green sheet 160, a second green sheet 170, and a third green sheet 80, as shown in FIG.

[0061] A via hole 165 is formed in the first green sheet 160, and a columnar conductor portion 166 is formed in the via hole 165. The via hole 165 and the columnar conductor portion 166 are arranged inside the first through hole 62 when viewed in the Z-axis direction. The columnar conductor portion 166 is connected to the third conductor layer 63. A pad portion 167 that becomes a part of the via connection portion 143 is formed on the second surface 60B of the first green sheet 160. The pad portion 167 is arranged inside the first through hole 62. The pad portion 167 is connected to the columnar conductor portion 166.

[0062] A via hole 177 is formed in the second green sheet 170, and a columnar conductor portion 178 is formed in the via hole 177. The via hole 177 and the columnar conductor portion 178 are arranged inside the second through hole 75A when viewed in the Z-axis direction. A pad portion 179 that becomes a part of the via connection portion 143 is formed on the third surface 70A of the second green sheet 170. The pad portion 179 is arranged inside the second through hole 75A. The pad portion 179 is connected to the columnar conductor portion 178.

[0063] A green sheet laminate 190 is obtained by laminating a plurality of green sheets including the above-mentioned first green sheet 160, second green sheet 170, and third green sheet 80.

[0064] The effects of the second embodiment are similar to those of the first embodiment, and therefore will not be described.

[0065] <Other embodiments> (1) In the first and second embodiments, the first conductor layer 61 has a circular shape when viewed in the Z-axis direction, but the first conductor layer does not have to have a circular shape. For example, the first conductor layer may have a semicircular shape, a sector shape, an annular shape, or the like.

[0066] (2) In the first and second embodiments, the first and second border portions 74 and 75 are annular. However, the first and second border portions can be modified to fit the shape of the first conductor layer.

[0067] (3) In embodiment 1, a pin insertion hole is arranged inside the through hole 51 of the internal electrode 50, and in embodiment 2, a via 142 and a via connection portion 143 are arranged inside the through hole 51 of the internal electrode 50, but a configuration different from the above may be arranged inside the through hole of the internal electrode.

[0068] (4) In the first and second embodiments, the internal electrode 50 is a high-frequency electrode, but the internal electrode may be an electrode other than the high-frequency electrode. For example, the internal electrode may be a chuck electrode. [Explanation of symbols]

[0069] 1: Electrostatic chuck 10: Holding member, 10A: Holding surface, 10B: Bottom surface, 11: Pin insertion hole 20: base member, 20A: upper surface, 21: refrigerant flow path 30: Joint 40: chuck electrode, 41: through hole 50: internal electrode, 51: through hole, 52: via, 53: outer edge inclined portion, 54: hole edge inclined portion, 55A, 55B, 55C: thick portion 60: first green sheet, 60A: first surface, 60B: second surface, 61: first conductor layer, 62: first through hole, 63: third conductor layer, 64: third through hole, 70: second green sheet, 70A: third surface, 70B: fourth surface, 71: via hole, 72: columnar conductor portion, 73: second conductor layer, 74: first border portion, 75: second border portion, 75A: second through hole, 76: pad portion, 80: third green sheet, 80A: fifth surface, 80B: sixth surface, 90: green sheet laminate, 91: through hole 110: Holding member 142: via, 143: via connection 160: first green sheet, 165: via hole, 166: columnar conductor portion, 167: pad portion, 170: second green sheet, 177: via hole, 178: columnar conductor portion, 179: pad portion, 190: green sheet laminate W: Wafer

Claims

1. A method for manufacturing a holding member having an internal electrode therein, a first conductor layer forming step of printing a conductive paste on a first compression bonding surface of the first green sheet to form a first conductor layer that will become a part of the internal electrode; a second conductor layer forming step of printing a conductive paste on the second compression bonding surface of the second green sheet to form a second conductor layer that becomes a part of the internal electrode; a lamination step of laminating the first green sheet and the second green sheet in a lamination direction with the first pressure-bonding surface and the second pressure-bonding surface facing each other; a firing step of firing the green sheet laminate obtained by the lamination step, A method for manufacturing a holding member, wherein in the second conductor layer forming process, the second conductor layer is formed with a first border portion arranged in a position overlapping the outer edge portion of the first conductor layer in the stacking direction.

2. the internal electrode has a through hole; In the first conductor layer forming step, the first conductor layer is formed to have a first through hole corresponding to the through hole, 2. The method for manufacturing a holding member according to claim 1, wherein in the second conductor layer forming process, the second conductor layer is formed with a second edging portion arranged in a position overlapping with the hole edge portion of the first through hole in the stacking direction.

3. the internal electrodes are connected to vias, the second green sheet has via holes for forming the vias, and the via holes are filled with a conductive paste; 3. The method for manufacturing a holding member according to claim 1, wherein in the second conductor layer forming process, the second conductor layer is formed with a pad portion having an area larger than that of the via hole at a position overlapping the via hole in the stacking direction.

4. The method for manufacturing a holding member according to claim 1 or 2, wherein the internal electrode is a high-frequency electrode connected to a high-frequency power source.

5. The holding member has a holding surface for holding an object, the green sheet laminate has a surface that serves as the holding surface, 3. The method for manufacturing a holding member according to claim 1, wherein in the laminating step, the first green sheet is disposed closer to the front surface than the second green sheet.

6. A dielectric member having a holding surface for holding an object to be held; an internal electrode disposed inside the dielectric member; A holding member comprising: the internal electrode has, at its horizontal edge portion, an inclined portion whose thickness decreases toward the end portion, and a thick portion; The holding member is characterized in that the thick portion has a first thick portion that is thicker than the surrounding area and located near the edge portion and connected to the inclined portion.

7. The internal electrode has an electrode through-hole penetrating in the thickness direction, 7. The holding member according to claim 6, wherein the first thick portion is disposed on at least one of an outer peripheral edge of the internal electrode and an edge of the electrode through-hole.

8. A via formed from a conductive material, extending from the internal electrode in a direction opposite to the holding surface, and electrically connected to the internal electrode; The holding member according to claim 6 or 7, characterized in that the thick portion further has a second thick portion extending in the thickness direction inside the dielectric member and positioned so as to overlap the via in a planar view.

Images