Cooling system and method of cooling assembly

Abstract

To provide an improved cooling system and cooling method.SOLUTION: A cooling system for cooling at least one heat-generating electronic device includes a heat removal device having a surface that is thermally couplable to the at least one heat-generating electronic device. The heat removal device includes an inlet area and at least one jet impingement feature fluidly coupled to the inlet area. The at least one jet impingement feature is positioned to direct a primary cooling fluid toward the surface that is thermally coupled to the at least one heat-generating electronic device.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE Exemplary embodiments relate to the art of heat exchangers, and more particularly, to heat exchangers for cooling power electronics. [Background technology]

[0002] Power electronic devices, such as motor drives, generate waste heat during operation of the device. Furthermore, as power electronic devices heat up, the device's operating efficiency may decrease and the amount of heat generated may increase. For example, when utilized in a cooling system to drive a cooling system compressor, effective thermal integration of these devices may be a critical aspect to the efficiency and reliability of the overall system. Thus, the goal of the system integrator is to maintain these components within an operating temperature range that maximizes system efficiency. Thus, there remains a need in the art for heat exchangers configured to be tightly integrated with power electronic devices that can maintain optimal temperatures of these components under various load conditions. Summary of the Invention [Problem to be solved by the invention]

[0003] SUMMARY OF THE PRESENT EMBODIMENT It is therefore an object of the present invention to provide an improved cooling system and method. [Means for solving the problem]

[0004] According to one embodiment, a cooling system for cooling at least one heat-generating electronic device includes a heat removal device having a surface thermally coupleable to the at least one heat-generating electronic device. The heat removal device includes an inlet region and at least one jet impingement feature fluidly coupled to the inlet region. The at least one jet impingement feature is positioned to direct a primary cooling fluid toward the surface thermally coupled to the at least one heat-generating electronic device.

[0005] In addition to or as an alternative to one or more of the features described herein, in a further embodiment, the heat removal device includes a heat exchanger having an outlet header, wherein a surface thermally coupled to the at least one heat-generating electronic device is disposed within the outlet header, and the primary cooling fluid and the secondary cooling fluid are disposed in heat transfer relationship within the at least one heat exchanger.

[0006] In addition to or as an alternative to one or more of the features described herein, in a further embodiment, a heat exchanger includes an inlet header and a plurality of heat exchange tubes extending between the inlet header and the outlet header, and at least one jet impingement feature is separate from and fluidly coupled to the plurality of heat exchange tubes.

[0007] In addition to or as an alternative to one or more of the features described herein, in a further embodiment, the heat exchanger further comprises an inlet header and a plurality of heat exchange tubes extending between the inlet header and the outlet header, wherein the at least one jet impingement feature is integrated with at least one of the plurality of heat exchange tubes.

[0008] In addition to or as an alternative to one or more of the functions described herein, in a further embodiment the fluid movement device is operable to move a secondary cooling fluid through the heat removal device.

[0009] In addition to or as an alternative to one or more of the features described herein, in a further embodiment the fluid movement device is a fan and the secondary cooling fluid is air.

[0010] In addition to or as an alternative to one or more of the features described herein, in a further embodiment, the heat removal device includes a plurality of heat exchangers, each of which is disposed on and thermally coupled to a respective heat-generating electronic device.

[0011] In addition to or as an alternative to one or more of the features described herein, in a further embodiment, at least some of the multiple heat exchangers are arranged in series with respect to the flow of the primary cooling fluid.

[0012] In addition to or as an alternative to one or more of the features described herein, in a further embodiment, at least some of the multiple heat exchangers are arranged in parallel with respect to the flow of the primary cooling fluid.

[0013] In addition to or as an alternative to one or more of the features described herein, in a further embodiment, the primary cooling fluid supplied to the inlet region is a two-phase liquid.

[0014] In addition to or as an alternative to one or more of the features described herein, in a further embodiment, the primary cooling fluid supplied to the heat removal device is a single-phase liquid.

[0015] According to one embodiment, a method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device includes cooling a secondary cooling fluid via a primary cooling fluid, flowing the cooled secondary cooling fluid over the at least one peripheral heat-generating device, and ejecting the primary cooling fluid onto a surface of a heat removal device thermally coupled to the at least one heat-generating electronic device via at least one jet impingement feature to cool the at least one heat-generating electronic device.

[0016] In addition to or as an alternative to one or more of the features described herein, in a further embodiment, the heat removal device is a heat exchanger, and cooling of the secondary cooling fluid via the primary cooling fluid occurs within a plurality of heat exchange tubes of the heat exchanger.

[0017] In addition to or as an alternative to one or more of the features described herein, further embodiments provide a secondary cooling fluid to the heat exchanger via a fluid transfer device.

[0018] In addition to or as an alternative to one or more of the features described herein, further embodiments provide the primary cooling fluid to a separate heat removal device disposed in and thermally coupled to at least one heat-generating electronic device, the separate heat removal device being disposed in series downstream of the heat removal device with respect to the flow of the primary cooling fluid.

[0019] In addition to or as an alternative to one or more of the features described herein, further embodiments provide the primary cooling fluid to a separate heat removal device disposed in and thermally coupled to the at least one heat-generating electronic device, the separate heat removal device being disposed in parallel with the heat removal device relative to the flow of the primary cooling fluid.

[0020] The following description should not be construed as limiting in any sense.With reference to the accompanying drawings, like elements are numbered the same, and in which: [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 is a schematic diagram of an example cooling system, according to one embodiment. [Diagram 2] 2 is a schematic diagram of another example of a heating, ventilation, air conditioning and refrigeration (HVAC&R) system, according to one embodiment. [Diagram 3] FIG. 1 illustrates an embodiment of a cooling system for cooling a heat generating device, according to one embodiment. [Figure 4] 1 illustrates a cross-sectional view of a heat removal device of a cooling system according to one embodiment. [Diagram 5] 1 is a cross-sectional view of a heat removal device of a cooling system according to another embodiment. [Figure 6] FIG. 1 is a perspective view of a prior art cooling system for a variable frequency drive, according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] A detailed description of one or more embodiments of the disclosed apparatus and methods is presented herein by way of example, and not by way of limitation, with reference to the drawings.

[0023] 1, an example of a refrigeration system, such as a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system 20, is shown generally. Exemplary refrigeration systems 20 include, but are not limited to, residential, split, packaged, chiller, rooftop, supermarket, transportation, fuel cell systems, and the like. In the illustrated non-limiting embodiment, the refrigeration system 20 includes a refrigeration circuit 22 that includes a compressor 24, a condenser 26, an expansion device 28, and an evaporator 30 arranged in series and having a volume of refrigeration fluid, such as a refrigerant, flowing therethrough.

[0024] Another example of the cooling system 20 is shown in Figure 3. In addition to the compressor 24, condenser 26, expansion device 28, and evaporator 30 previously described, the cooling circuit 22 includes an economizer heat exchanger 32. The economizer heat exchanger 32 may be disposed between the condenser 26 and the expansion device 28, relative to the flow of cooling fluid through the cooling circuit 22. Although the economizer heat exchanger 32 is illustrated as being disposed immediately downstream of the outlet 34 of the condenser 26, it should be understood that embodiments in which one or more other components of the cooling system 20 are disposed between the condenser 26 and the inlet of the economizer heat exchanger 32 are also contemplated herein.

[0025] In one embodiment, the economizer heat exchanger 32 is a brazed plated fin heat exchanger. However, other suitable types of heat exchangers are within the scope of the present disclosure. Additionally, the economizer heat exchanger 32 is a cooling fluid-to-cooling fluid heat exchanger and, as such, has multiple different fluid flow paths formed therein. In the illustrated non-limiting embodiment, the economizer heat exchanger 32 each has a first flow path and a second flow path.

[0026] In the illustrated non-limiting embodiment, an inlet 36 of a first flow path of the economizer heat exchanger 32, also referred to herein as the “main flow path,” is disposed in direct fluid communication with the outlet 34 of the condenser 26. Alternatively, or in addition, an outlet 38 of the main flow path of the economizer heat exchanger 32 may be disposed immediately upstream of and in fluid communication with the inlet of the expansion device 28.

[0027] In operation, a first portion R1 of the cooling fluid output from the condenser 26 is provided to the main flow path of the economizer heat exchanger 32 via the main conduit 40. Although the main flow path is shown as a single path through the economizer heat exchanger 32, it should be understood that in other embodiments, the main flow path may include multiple paths through the economizer heat exchanger 32. At the outlet 38 of the main flow path of the economizer heat exchanger 32, the first portion R1 of the cooling fluid is configured to flow to the expansion device 28. From the expansion device 28, the cooling fluid expands in the evaporator 30. The first portion R1 of the cooling fluid output from the evaporator 30 is provided to the main suction inlet 42 of the compressor 24 via the first compressor inlet path. Thus, the fluid loop of the first portion R1 of the cooling fluid includes the compressor 24, the condenser 26, the main flow path of the economizer heat exchanger 32, the expansion device 28, and the evaporator 30.

[0028] An economizer expansion device 44 may be disposed in the refrigeration circuit 22 in fluid communication with the condenser 26. The economizer expansion device 44 is operable to expand and cool a refrigeration fluid provided thereto. The economizer expansion device 44 is shown disposed in an economizer conduit 45 that is fluidly coupled to extend from the main conduit 40 at a location upstream of the first inlet 36, although it should be understood that an economizer conduit 45 that is fluidly coupled to the outlet 34 of the condenser 26 in another suitable manner is also contemplated herein.

[0029] Downstream of the economizer expansion device 44 is located an inlet 46 of a second flow path of the economizer heat exchanger 32, also referred to herein as the "economizer flow path." Additionally, an outlet 48 of the second flow path of the economizer heat exchanger 32 may, but need not, be directly connected to an economizer inlet or port 50 of the compressor 24. In the illustrated non-limiting embodiment, the inlet 36 of the main flow path and the inlet 46 of the economizer flow path are located on adjacent sides of the economizer heat exchanger 32. However, it should be understood that in other embodiments, the inlets 36, 46 of both flow paths may be located on the same side of the economizer heat exchanger 32 or on opposite sides. Similarly, the outlets 38, 48 of both the main flow path and the economizer flow path may be located on opposite sides, the same side, or adjacent sides depending on the desired flow configuration of the economizer heat exchanger 32. Additionally, although the economizer flow path is shown as a single pass, it should be understood that in some embodiments, the economizer flow path may include multiple passes through the economizer heat exchanger 32 .

[0030] In the economizer flow path, the second portion R2 of the cooling fluid is configured to absorb heat from the first portion R1 of the cooling fluid in the main flow path, thereby cooling the first portion R1 of the cooling fluid. As a result of this heat transfer, the second portion R2 of the cooling fluid in the economizer flow path can become steam. From the outlet 48 of the economizer flow path, the second portion R2 of the cooling fluid is supplied to an economizer inlet 50 located in the middle of the compressor 24. Thus, the second portion R2 of the cooling fluid bypasses the expansion device 28 and the evaporator 30 of the cooling circuit 22. In the compressor 24, the first portion R1 and the second portion R2 of the cooling fluid are mixed and then supplied to the discharge port 52 to repeat the cycle. Thus, the fluid loop of the second portion R2 of the cooling fluid includes the compressor 24, the condenser 26, the economizer expansion device 44, and the economizer flow path of the economizer heat exchanger 32. It should be understood that the cooling system 20 shown and described herein is intended as an example only, and that cooling system stems 20 having alternative configurations are within the scope of the present disclosure.

[0031] With continued reference to both FIG. 1 and FIG. 2, in one embodiment, the cooling system 20 includes at least one cooling system 60 for cooling one or more heat-generating devices 62. As used herein, the term "heat-generating device" may refer to any electronic component that generates heat during its operation. Examples of heat-generating devices 62 include, but are not limited to, a processor, a power electronics device, or another device capable of providing a controlled output power by modulating and / or converting a supplied input power (e.g., variable frequency drive, power rectifier, power converter, etc.). Such heat-generating devices 62 may be used to control the speed of a compressor and / or the speed of a fan associated with the cooling system based on various predetermined system conditions. In one embodiment, the at least one heat-generating device 62 includes a variable frequency drive operably coupled to the compressor 24 of the cooling system 20. As shown, at least a portion R3 of the refrigerant output from the outlet of the condenser 26 may redirect flow toward the cooling system 60. Depending on the cooling demand to be met by the cooling system 60, the refrigerant portion R3 may pass through the expansion valve 54, described in more detail below, or may bypass the expansion valve before reaching the heat removal device 74 of the cooling system 60.

[0032] In other embodiments, the cooling system 60 need not be integrated with or part of the vapor compression cycle of the cooling system 20. Rather, the cooling system 60 may be a separate fluid loop and may use any suitable cooling fluid therein. In the illustrated non-limiting embodiment of FIG. 3, the circuit of the cooling system 60 has a closed loop configuration and includes a pump 70 for moving the primary cooling fluid C1 therethrough. The filter 72 may be disposed upstream of at least one heat removal device 74 arranged to directly cool a corresponding heat-generating electronic device, such as the heat-generating device 62. Downstream of the one or more heat removal devices 74 is a cooling heat exchanger 76 configured to remove heat from the primary cooling fluid C1. The circuit may further include a reservoir or accumulator 78 in which excess primary cooling fluid C1 is stored. As shown, the circuit may include multiple valves disposed immediately upstream (V1) of the heat removal device 74, immediately downstream (V2) of the heat removal device 74 and associated with a bypass conduit 80 (V3) for bypassing the cooling heat exchanger 76, and / or associated with another bypass conduit 82 (V4) for bypassing both the heat removal device 74 and the cooling heat exchanger 76. While the illustrated non-limiting embodiment includes a single heat removal device 74 associated with a single heat generation device 62, it should be understood that embodiments including multiple heat removal devices 74 operably coupled to one or more heat generation devices 62 may be arranged in series or parallel with respect to the flow of the primary cooling fluid C1.

[0033] 4, an example of at least a portion of a cooling system 60 for cooling one or more heat generating devices 62 is shown. As shown, the heat removal device 74 may be a heat exchanger, such as a microchannel heat exchanger having a plurality of substantially parallel microchannel heat exchanger tubes 100 extending between an inlet header 102 and an outlet header 104, each of the plurality of heat exchanger tubes 100 defining a plurality of fluid flow paths (not shown). However, examples of other types of heat exchangers that may be used may include, but are not limited to, microtube, double tube, shell-and-tube, tube-and-fin, plate, plate-and-shell, adiabatic shell, plate-fin, pillow plate, and fluid heat exchangers. The type of heat exchanger 74 selected may depend, at least in part, on the type of fluid supplied thereto.

[0034] The primary cooling fluid C1 and the secondary cooling fluid C2 are disposed in a heat transfer relationship in a heat exchanger 74. In the non-limiting embodiment shown in FIG. 4, the heat exchanger 74 has a single path configuration for both the primary cooling fluid C1 and the secondary cooling fluid C2. However, in other embodiments, at least one of the primary cooling fluid C1 and the secondary cooling fluid C2 may pass through the heat exchanger 74 multiple times. Furthermore, the primary cooling fluid C1 and the secondary cooling fluid C2 may be arranged in any suitable flow configuration in the heat exchanger, such as cross-flow, parallel flow, counter-flow, or any combination thereof.

[0035] In one embodiment, at least one jet impingement feature, such as a nozzle, jet or mouth, hole, or opening, is formed in the plate 110, and in some embodiments, multiple jet impingement features 110 are disposed in the outlet header 104, such as in an inlet region of the outlet header 104. Each jet impingement feature 110 is fluidly coupled to at least one fluid flow path of one or more heat exchanger tubes 100. An outlet end of the jet impingement feature 110 may be directed toward a surface of the outlet header 104 that is thermally coupled to at least one selected heat generating device 62, for example, a bottom surface of the outlet header 104. Although the one or more jet impingement features 110 are illustrated and described herein as being separate from the heat exchange tube 100, in one embodiment, the outlet end of the heat exchange tube 100 may be contoured such that the one or more jet impingement features 110 are integral therewith. The jet impingement features 110 may be configured as a free surface type, or a submerged type, or a limited submerged type. Additionally, the jets or streams ejected from the jet impingement feature 110 may be of any geometric shape in cross section, such as circular, polygonal, star-shaped, etc.

[0036] In some embodiments, the heat exchanger 74 is directly coupled to a surface of the at least one selected heat generating device 62. In such a direct connection, a thermal interface material may, but need not, be disposed between the surface 112 of the at least one selected heat generating electronic device 62 and the adjacent surface 114 of the heat removal device 74 to facilitate the transfer of heat from the at least one selected heat generating device 62 to the heat removal device 74.

[0037] The inlet header 102 of the heat exchanger 74 may be fluidly connected to a first fluid inlet 120, and the outlet header 104 may be fluidly connected to a first fluid outlet 122 to form a first flow path of a primary cooling fluid C1. During operation, a primary cooling fluid C1, such as, for example, a refrigerant, is supplied from the first fluid inlet 120 to the inlet header 102 of the heat exchanger 74. The primary cooling fluid C1 supplied to the inlet header 102 may be single-phase, such as, for example, a cryogenic liquid or a cooling liquid, or may be two-phase (i.e., a combination of a fluid and a vapor). The primary cooling fluid C1 flows from the inlet header 102 through the multiple heat exchange tubes 100 of the heat exchanger 74 toward the outlet header 104.

[0038] The secondary cooling fluid C2 is configured to flow through gaps 106 defined between adjacent heat exchanger tubes 100. In the illustrated non-limiting embodiment, the secondary cooling fluid C2 is a flow of air moved (in a direction extending into the plane of the page) by at least one fluid moving device, such as a fan 31. In one embodiment, it is associated with at least one of the condenser 26 or the evaporator 30 of the cooling system 20. However, it should be understood that any fluid, including a liquid, may be used as the secondary cooling fluid C2. In the illustrated non-limiting embodiment, a plurality of fins 126 are disposed within the gaps 106 defined between adjacent heat exchanger tubes 100, although embodiments that do not include such fins are also contemplated herein. Within the multiple passages of the heat exchange tubes 100, heat from the secondary cooling fluid C2 is transferred to the primary cooling fluid C1. As a result, the cooled secondary cooling fluid C2 provided to the outlet of the heat exchanger 74 may be configured to flow over nearby or surrounding heat generating devices, such as, for example, within a variable frequency drive.

[0039] At least a portion of the now slightly warmed primary cooling fluid C1 is output from the plurality of heat exchange tubes 100 to one or more jet impingement features 110 disposed within the outlet header 104. Within the jet impingement feature 110, the flow rate of the primary cooling fluid C1 is increased such that the primary cooling fluid C1 is discharged from the outlet of the jet impingement feature on the surface of the outlet header 104 that is vertically aligned with the selected heat generating device 62.

[0040] At least a portion of the heat from the at least one selected heat generating device 62 is transferred from the heat generating device 62 to the primary cooling fluid C1. The primary cooling fluid C1 continuously impinges on a surface of the outlet header 104 that is thermally coupled to the heat generating device 62, thereby transferring heat from the surface of the outlet header 104 to the primary cooling fluid C1, thereby cooling the at least one selected heat generating device 62.

[0041] Depending on the temperature of the secondary cooling fluid C2, the primary cooling fluid C1 may partially evaporate or remain in a liquid state as it flows through the multiple heat exchange tubes 100 of the heat exchanger 74 toward the outlet header 104. As the primary cooling fluid C1 partially evaporates, the velocity of the primary cooling fluid C1 exiting the one or more jet impingement features 110 increases, which enhances heat transfer from the surface of the outlet header 104 to the primary cooling fluid C1. In one embodiment, after impinging on the surface 114, the primary cooling fluid C1 is configured to begin boiling or evaporating, and in some embodiments, to reach a completely vapor state. After contacting the surface of the outlet header 104, the resulting warm superheated vapor primary cooling fluid C1 exits the outlet header 104 of the heat exchanger 74 and flows toward the first fluid outlet 122.

[0042] 5, another example of a heat removal device 74 suitable for use in the cooling system 60 is shown. The heat removal device 74 may be similar to that described above with respect to FIG. 4. However, in the illustrated non-limiting embodiment, the heat removal device does not include a heat exchanger portion for receiving the secondary cooling fluid C2. As shown, the heat removal device 74 includes an inlet region 200 and at least one jet impingement feature 210, and in some embodiments, multiple jet impingement features 210 fluidly coupled to the inlet region 200. As with the heat exchangers previously described herein, the outlet end of the jet impingement feature 210 is directed toward a surface of the heat removal device 74 that is thermally coupled to at least one selected heat-generating electronic device 62, such as, for example, a bottom surface 202 of the heat removal device 74.

[0043] In each of the configurations disclosed in FIG. 4 and FIG. 5, at least one valve may be disposed in the first fluid inlet 120 and / or the first fluid outlet 122 to control the flow of the primary cooling fluid C1 to and from the heat exchanger 74. In one embodiment, the position of one or more flow control valve(s) V, and therefore the flow rate through the heat exchanger 74, is actively managed based on one or more conditions indicative of, for example, a heat load in the heat exchanger 74. The heat load may be determined using information collected by one or more sensors, represented generally by T and P. In the illustrated non-limiting embodiment, the first sensor T is operable to monitor the temperature of the heat generating device 62, and the second sensor T is operable to monitor the temperature of the primary cooling fluid C1 in conjunction with a pressure sensor P in the outlet header 104. The combination of the temperature sensor and the pressure sensor may determine the superheat of the exhausted primary cooling fluid C1. The flow control valve V may be adjustable to increase or decrease the flow rate based on the determined superheat of the primary cooling fluid C1. At least one sensor T or P may be operable to measure temperature and / or pressure directly, or may be configured to monitor another parameter that correlates with or can be used to derive temperature and / or pressure therefrom.

[0044] FIG. 6 illustrates an existing cooling system for cooling one or more heat generating components of a variable frequency drive (VFD). As shown, the cooling system includes two cooling plates on which the heat generating devices 62 that require the most cooling are mounted. Additionally, an air-cooled heat exchanger is used to cool peripheral components that are not mounted on the cooling plates. If a heat removal device 74 is integrated into the cooling system of the VFD, a separate air-cooled heat exchanger can be eliminated because the heat exchanger is mounted directly to the heat generating components that are also mounted on the cooling plates. Such a combination results in a more compact, lower cost, and more efficient cooling system. The elimination of the separate air-cooled heat exchanger results in significant cost savings.

[0045] The term "about" is intended to include the degree of error associated with measurement of the particular quantity, based on the equipment available at the time of application.

[0046] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that the terms "comprise" and / or "comprising", as used herein, specify the presence of stated features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0047] Although the present disclosure has been described with reference to one or more exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for the elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope of the present disclosure. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out the disclosure, but that the present disclosure will include all embodiments falling within the scope of the appended claims.

Claims

1. 1. A cooling system for cooling at least one heat-generating electronic device, the cooling system comprising: a heat removal device including a surface thermally coupleable to the at least one heat-generating electronic device, the heat removal device including an inlet region and at least one jet impingement feature fluidly coupled to the inlet region, the at least one jet impingement feature positioned to direct a primary cooling fluid toward the surface thermally coupled to the at least one heat-generating electronic device; The cooling system comprising:

2. 2. The cooling system of claim 1, wherein the heat removal device includes a heat exchanger having an outlet header, the surface thermally coupled to the at least one heat-generating electronic device being disposed within the outlet header, and the primary and secondary cooling fluids being disposed in heat transfer relationship within the at least one heat exchanger.

3. The heat exchanger includes: an inlet header, the inlet region being defined by the inlet header; 3. The cooling system of claim 2, further comprising a plurality of heat exchange tubes extending between the inlet header and the outlet header, the at least one jet impingement feature being separate from and fluidly coupled to the plurality of heat exchange tubes.

4. The heat exchanger includes: an inlet header, the inlet region being defined by the inlet header; 3. The cooling system of claim 2, further comprising a plurality of heat exchange tubes extending between the inlet header and the outlet header, the at least one jet impingement feature being integral with at least one of the plurality of heat exchange tubes.

5. The cooling system of any preceding claim, further comprising a fluid movement device operable to move the secondary cooling fluid through the heat removal device.

6. The cooling system of claim 5 , wherein the fluid movement device is a fan and the secondary cooling fluid is air.

7. 7. The cooling system of claim 1, wherein the heat removal device further comprises a plurality of heat exchangers, each of the plurality of heat exchangers disposed and thermally coupled to a respective heat-generating electronic device.

8. The cooling system of claim 7 , wherein at least some of the plurality of heat exchangers are disposed in series with respect to the flow of the primary cooling fluid.

9. The cooling system of claim 7 , wherein at least some of the plurality of heat exchangers are arranged in parallel with respect to the flow of the primary cooling fluid.

10. The cooling system of claim 1 , wherein the primary cooling fluid supplied to the inlet region is a two-phase liquid.

11. The cooling system of claim 1 , wherein the primary cooling fluid supplied to the heat removal device is a single-phase liquid.

12. 1. A method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device, the method comprising: cooling a secondary cooling fluid via a primary cooling fluid; flowing the cooled secondary cooling fluid over the at least one peripheral heat-generating device; projecting the primary cooling fluid via at least one jet impingement feature onto a surface of a heat removal device thermally coupled to the at least one heat-generating electronic device to cool the at least one heat-generating electronic device; The method comprising:

13. The method of claim 12 , wherein the heat removal device is a heat exchanger, and the cooling of the secondary cooling fluid via the primary cooling fluid occurs within a plurality of heat exchange tubes of the heat exchanger.

14. The method of claim 13 further comprising supplying the secondary cooling fluid to the heat exchanger through a fluid transfer device.

15. 15. The method of claim 12, further comprising supplying the primary cooling fluid to a further heat removal device disposed and thermally coupled to the at least one heat-generating electronic device, the further heat removal device being disposed in series downstream of the heat removal device with respect to the flow of the primary cooling fluid.

16. 15. The method of claim 12, further comprising supplying the primary cooling fluid to a further heat removal device disposed on and thermally coupled to the at least one heat-generating electronic device, the further heat removal device being disposed in parallel with the heat removal device with respect to the flow of the primary cooling fluid.

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