Bus bar assembly

Abstract

To provide a bus bar assembly that acts as an anode and cathode for semiconductor elements and other electrical elements to be attached, and that has a frame for sealing resin to protect the electrical elements, while also being able to be miniaturized in the planar and thickness directions.SOLUTION: The bus bar assembly includes a planar conductive bus bar, an insulating resin film provided on the top surface of the bus bar, and a conductive frame mechanically fixed to the top surface of the bus bar via the insulating resin film in an electrically insulated state so as to form a housing space that opens upwards in the center of the top surface of the bus bar. The insulating resin film is provided with an opening that exposes at least part of the housing space on the top surface of the bus bar, forming an element mounting area in which electrical elements can be mechanically mounted in an electrically connected state. The bus bar and frame have their entire outer surfaces exposed.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a bus bar assembly to which an electric element such as a semiconductor element can be attached. [Background technology]

[0002] 2. Description of the Related Art Bus bar assemblies including a plurality of bus bars that are electrically insulated from one another and mechanically connected to one another have been proposed and are used in various fields.

[0003] For example, a stacked busbar assembly has been proposed in which one flat busbar and another flat busbar are stacked one on top of the other in a parallel state (see Patent Documents 1 and 2 below).

[0004] The laminated busbar assembly has a problem in that the opposing flat surfaces of one flat busbar and the opposing flat surfaces of another flat busbar are arranged to face each other across an insulating resin layer, making it difficult to ensure sufficient reliability in terms of insulation. In particular, if the thickness of the insulating resin layer between the one flat bus bar and the other flat bus bar is reduced in order to reduce the size in the vertical direction, there is a risk of leakage current flowing between the two bus bars.

[0005] In order to solve the problems with the laminated busbar assembly, the applicant has filed applications and received patents for a planar busbar assembly in which first and second busbars made of conductive metal plates are arranged in parallel on the same plane (see Patent Documents 3 and 4 below).

[0006] FIG. 17 shows a vertical cross-sectional view of a semiconductor module in which semiconductor elements (LEDs) are mounted on the planar bus bar assembly 500. As shown in FIG. As shown in FIG. 17, the planar bus bar assembly 500 includes a first bus bar 510(1) made of a conductive metal flat plate, a second bus bar 510(2) made of a conductive metal flat plate arranged in the same plane as the first bus bar 510(1) with a gap 515 between them, and an insulating resin layer 520 that electrically insulates and mechanically connects the first and second bus bars 510(1), 510(2).

[0007] The insulating resin layer 520 has a gap filling portion 525 filled in the gap 515, and a surface lamination portion 527 laminated on the surface of the busbar connection body formed by connecting the first and second busbars 510(1), 510(2) by the gap filling portion 525.

[0008] The surface laminated portion 527 has a first surface side laminated portion 530 and a second surface side laminated portion 540 which respectively cover a first surface on one thickness side of the busbar connector and a second surface on the other thickness side, and a side surface side laminated portion 550 which covers the outer surface of the busbar connector and connects the first and second surface side laminated portions 530, 540.

[0009] The first surface side laminate portion 530 has first and second openings 531(1), 531(2) that expose predetermined portions of the upper surfaces of the first and second bus bars 510(1), 510(2) to form first and second element connection regions 511(1), 511(2).

[0010] The semiconductor element 110 has an element body 115, and an upper electrode layer 111 and a lower electrode layer 112 respectively arranged on one side and the other side of the element body 115 in the thickness direction, with the lower electrode layer 112 mechanically and electrically connected to one of the first and second element connection regions 511(1), 511(2) (the first element connection region 511(1) in FIG. 17) via, for example, a plating layer (not shown), and the upper electrode layer 111 electrically connected to the other of the first and second element connection regions 511(1), 511(2) (the second element connection region 511(2) in FIG. 17) via a wire 120.

[0011] In the bus bar assembly 500, one of the first and second bus bars 510(1), 510(2) (e.g., the first bus bar 510(1)) acts as an anode, the other of the first and second bus bars 510(1), 510(2) (e.g., the second bus bar 510(2)) acts as a cathode, and exposed areas of the undersides of the first and second bus bars 510(1), 510(2) form electrical connections with the outside.

[0012] As shown in FIG. 17, the busbar assembly 500 further includes a frame 550 that is fixed to the upper surface of the busbar connection body formed by connecting the first and second busbars 510(1), 510(2) by the insulating resin layer 520 so as to surround, in a plan view, at least a portion including the first and second element connection regions 511(1), 511(2).

[0013] The frame 550 is a component for the sealing resin body 130 that protects the semiconductor element 110 and the wires 120 by surrounding them.

[0014] The sealing resin body 130 is provided by applying an insulating resin that forms the sealing resin body 130 to the upper surface of the busbar assembly 1 so as to surround components such as the semiconductor element 110 and the wires 120, and then hardening the resin. However, it is necessary to prevent the resin from flowing out after application until it hardens.

[0015] The frame 550 blocks the outflow of the resin and prevents the sealing resin body from coming off after hardening.

[0016] In the busbar assembly 500 shown in FIG. 17, the frame body 550 has an outer shape corresponding to the outer shape of the busbar connector in a plan view, and has a predetermined thickness with a central hole in the center in a plan view that surrounds at least the first and second element connection regions, and the outer peripheral surface of the frame body 550 is covered with an insulating resin layer.

[0017] The planar busbar assembly 500 described in Patent Documents 3 and 4 is useful in that it can solve the problems of the stacked busbar assembly. However, it has a problem in that it is difficult to reduce the size of the first and second busbars 510(1), 510(2) in the planar direction. [Prior art documents] [Patent documents]

[0018] [Patent Document 1] Patent No. 4432913 [Patent Document 2] Patent No. 6487769 [Patent Document 3] Patent No. 6637002 [Patent Document 4] Patent No. 6637003 Summary of the Invention [Problem to be solved by the invention]

[0019] The present invention has been made in consideration of the conventional technology, and has an object to provide a busbar assembly having an anode and a cathode for an electrical element, such as a semiconductor element, to be mounted thereon, which has a frame body for a sealing resin body for protecting the electrical element, while being miniaturized in the planar and thickness directions. [Means for solving the problem]

[0020] In order to achieve the above-mentioned object, a first aspect of the present invention provides a busbar assembly comprising: a planar busbar formed of a conductive material; an insulating resin film provided on an upper surface of the busbar; and a frame body formed of a conductive material, the frame body being mechanically fixed in an electrically insulated state to the upper surface of the busbar via the insulating resin film so as to define a storage space that opens upwards in the centre of the upper surface of the busbar, wherein the insulating resin film is provided with an opening that exposes at least a portion of the interior of the storage space on the upper surface of the busbar to form an element mounting area to which an electrical element can be mechanically attached in an electrically connected state, and the entire outer surfaces of the busbar and the frame body are exposed.

[0021] In a second aspect, the present invention provides a busbar assembly comprising: a planar busbar formed of a conductive member; an insulating resin film provided on an upper surface of the busbar; and a frame body formed of a conductive member, the frame body being mechanically fixed to the upper surface of the busbar in an electrically insulated state via the insulating resin film so as to define a storage space that opens upwards in the center of the upper surface of the busbar, wherein the insulating resin film is provided with an opening that exposes at least a part of the interior of the storage space on the upper surface of the busbar to form an element mounting area to which an electrical element can be mechanically attached in an electrically connected state, the entire outer surface of the busbar is exposed, and the outer surface of the frame body other than the lower surface in contact with the insulating resin film is covered with a frame body side insulating resin layer, and the frame body side insulating resin layer is provided with an opening that forms an element connection portion that can be electrically connected to an electrical element mounted in the element mounting area, and an opening that forms a frame body side external connection portion that can be electrically connected to the outside.

[0022] In a third aspect, the present invention provides a busbar assembly comprising: a planar busbar formed of a conductive member; a busbar-side insulating resin coating covering the entire outer surface of the busbar; and a frame body formed of a conductive member, the frame body being mechanically fixed in an electrically insulated state to an upper surface of the busbar via the busbar-side insulating resin coating so as to define an accommodation space that opens upwards in the centre of the upper surface of the busbar, wherein the busbar-side insulating resin coating has an opening exposing at least a part of the interior of the accommodation space on the upper surface of the busbar to form an element mounting area to which an electrical element can be mechanically attached in an electrically connected state, and an opening exposing the lower surface of the busbar to form a busbar-side external connection part that can be electrically connected to the outside, and the frame body has an exposed outer surface.

[0023] a fourth aspect of the present invention provides a busbar assembly comprising: a planar busbar formed of a conductive member; a busbar-side insulating resin coating covering the entire outer surface of the busbar; and a frame body formed of a conductive member, the frame body mechanically fixed to the upper surface of the busbar in an electrically insulated state via the busbar-side insulating resin coating so as to define an accommodation space that opens upwards in the center of the upper surface of the busbar, wherein the busbar-side insulating resin coating has an opening exposing at least a part of the interior of the accommodation space on the upper surface of the busbar to form an element mounting area to which an electrical element can be mechanically attached in an electrically connected state, and an opening exposing a lower surface of the busbar to form a busbar-side external connection part that can be electrically connected to the outside, and the outer surface of the frame body other than the lower surface that is fixed to the upper surface of the busbar via the busbar-side insulating resin coating is covered with a frame-side insulating resin layer, and the frame-side insulating resin layer has an opening forming an element connection part that can be electrically connected to an electrical element mounted in the element mounting area, and an opening forming a frame-side external connection part that can be electrically connected to the outside.

[0024] In addition, a fifth aspect of the present invention provides a busbar assembly comprising: a planar busbar formed of a conductive material; and a frame body formed of a conductive material, the frame body being mechanically fixed in an electrically insulated state to an upper surface of the busbar so as to define a storage space that opens upwards in the center of the upper surface of the busbar, wherein the entire outer surface of the busbar is exposed and the entire outer surface of the frame body is covered with a frame body side insulating resin layer, and the frame body side insulating resin layer is provided with an opening that forms an element connection portion that can be electrically connected to an electrical element mounted on the upper surface of the busbar within the storage space, and an opening that forms a frame body side external connection portion that can be electrically connected to the outside.

[0025] In the second, fourth and fifth aspects, preferably, the opening forming the element connection portion is configured to expose a portion of the inner surface of the frame body, and the opening forming the frame body side external connection portion is configured to expose a portion of the outer surface of the frame body. Effect of the Invention

[0026] The bus bar assembly according to the present invention can be made smaller in both the planar and thickness directions while having a frame for a sealing resin body for protecting an electrical element such as a semiconductor element mounted thereon. Furthermore, according to the method for manufacturing a busbar assembly according to the present invention, the busbar assembly can be manufactured efficiently. [Brief description of the drawings]

[0027] [Figure 1] FIG. 1(a) is a plan view of a busbar assembly according to a first embodiment of the present invention, and FIG. 1(b) is a cross-sectional view taken along line I(b)-I(b) in FIG. 1(a). [Diagram 2] FIG. 2 is a vertical cross-sectional view of a semiconductor module in which a semiconductor element is mounted on the bus bar assembly according to the first embodiment. [Diagram 3]Figures 3(a) to (d) are respectively a plan view of a busbar assembly according to a first modified example of embodiment 1, a cross-sectional view taken along line III(b)-III(b) in Figure 3(a), a side view of the busbar assembly according to the first modified example, and a cross-sectional view taken along line III(d)-III(d) in Figure 3(a). [Figure 4] FIG. 4 is a vertical cross-sectional view of a semiconductor module in which a semiconductor element is mounted on the bus bar assembly according to the first modified example. [Diagram 5] Figures 5(a) to (d) are respectively a plan view of a busbar assembly according to a second modified example of embodiment 1, a cross-sectional view taken along line V(a)-V(a) in Figure 5(a), a side view of the busbar assembly according to the second modified example, and a cross-sectional view taken along line V(d)-V(d) in Figure 5(a). [Figure 6] FIG. 6 is a vertical sectional view of a semiconductor module in which a semiconductor element is mounted on the bus bar assembly according to the second modified example. [Figure 7] FIG. 7 is a plan view of a busbar plate used in the method for manufacturing a busbar according to the first embodiment. [Figure 8] FIG. 8 is a plan view of the busbar plate after the busbar-side insulating resin layer forming step in the manufacturing method. [Figure 9] FIG. 9 is a plan view of a frame plate used in the frame forming process in the manufacturing method. [Figure 10] FIG. 10 is a plan view of the busbar-forming flat plate and the frame-forming flat plate after the flat plate fixing step in the manufacturing method. [Figure 11] FIG. 11 is a plan view of the bus bar forming plate and the frame forming plate after the opening forming step in the manufacturing method. [Figure 12] FIG. 12 is a vertical cross-sectional view of bus bar assemblies according to third to fifth modified examples of the first embodiment. [Figure 13]Figure 13(a) is a plan view of the busbar flat plate with an insulating resin coating provided on the outer peripheral surface, and Figure 13(b) is a cross-sectional view taken along line XIII(b)-XIII(b) in Figure 13(a), showing the state after openings have been formed in the insulating resin coating to expose the element mounting area and the busbar side external connection parts, respectively. [Figure 14] Fig. 14(a) is a plan view of the frame plate after the frame-side insulating resin layer forming step in the manufacturing method, and Fig. 14(b) and (c) are cross-sectional views taken along line XIV-XIV in Fig. 14(a). Fig. 14(b) and (c) respectively show a state in which a frame-side insulating resin layer with an exposed lower surface is provided, and a state in which a frame-side insulating resin layer covering the lower surface is provided. [Figure 15] Figures 15(a) to (d) are respectively a plan view of a busbar assembly according to embodiment 2 of the present invention, a cross-sectional view taken along line XV(a)-XV(a) in Figure 15(a), a side view of the busbar assembly according to embodiment 2, and a cross-sectional view taken along line XV(d)-XV(d) in Figure 15(a). [Figure 16] FIG. 16 is a vertical cross-sectional view of a semiconductor module in which a semiconductor element is mounted on the bus bar assembly according to the second embodiment. [Figure 17] FIG. 17 is a vertical cross-sectional view of a semiconductor module in which semiconductor elements are mounted on a conventional planar bus bar assembly. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] First embodiment Hereinafter, an embodiment of a busbar assembly according to the present invention will be described with reference to the accompanying drawings. FIG. 1(a) shows a plan view of a busbar assembly 1 according to the present embodiment. FIG. 1(b) is a cross-sectional view taken along line I(b)-I(b) in FIG. 1(a).

[0029] The bus bar assembly 1 includes a bus bar 10 formed of a conductive material, and a frame body 30 formed of a conductive material.

[0030] As shown in Figures 1(a) and 1(b), the busbar 10 has an upper surface 11, a lower surface 12 opposite the upper surface 11, and a side surface 13 connecting the periphery of the upper surface 11 and the lower surface 12. The bus bar 10 is formed of a conductive metal plate such as Cu.

[0031] The busbar 10 has an element mounting area 15 on at least a part of an upper surface 11 to which an electrical element such as a semiconductor element can be electrically and mechanically mounted, and has a busbar side external connection portion 16 on at least a part of a lower surface 12 to which the busbar side external connection portion 16 can be electrically connected to the outside.

[0032] As shown in FIGS. 1(a) and 1(b), the busbar assembly 1 according to this embodiment has a busbar-side insulating resin layer 20 provided on an upper surface 11 of the busbar 10.

[0033] The frame body 30 is fixed to the upper surface 11 of the busbar 10 via the busbar side insulating resin layer 20, and is thereby mechanically fixed to the upper surface 11 of the busbar 10 in an electrically insulated state.

[0034] In this embodiment, the bus bar side insulating resin layer 20 is formed of an insulating resin film 25 . The insulating resin film 25 is made of various materials having insulating properties, and preferably, polyamideimide is used.

[0035] The bus bar side insulating resin layer 20 is provided with an opening 21 through which the element mounting region 15 is exposed.

[0036] As shown in Figures 1(a) and 1(b), the frame body 30 is mechanically fixed in an electrically insulated state to the upper surface 11 of the busbar 10 via the busbar side insulating resin layer 20 so as to define an accommodation space S that opens upwardly in at least the central portion of the upper surface 11 of the busbar 10 including the element mounting region 15.

[0037] The frame body 30 is a protective member for a sealing resin body 130 (see Figure 2 below) that protects the electrical elements mounted in the element mounting area 15 and the electrical connection members such as wires 120 connected to the electronic elements (see Figure 2 below). Preferably, the frame 30 is formed from the same conductive material as the bus bar 10 .

[0038] FIG. 2 shows a vertical cross-sectional view of a semiconductor module 101 in which a semiconductor element 110 such as an LED is mounted as the electric element on the bus bar assembly 1. As shown in FIG.

[0039] The semiconductor element 110 has an upper electrode layer 111 and a lower electrode layer 112 on an upper surface on one side in the thickness direction and a lower surface on the other side in the thickness direction, respectively, and has an element body 115 between the upper electrode layer 111 and the lower electrode layer 112.

[0040] The semiconductor element 110 is fixed by adhesion or the like in a state in which the lower electrode layer 112 is electrically connected to the element mounting region 15 .

[0041] As shown in FIG. 2, the semiconductor module 101 is provided with the sealing resin body 130 that covers the semiconductor element 110, the wires 120, and other components that are mounted on the bus bar assembly 1.

[0042] The sealing resin body 130 is provided by applying a resin that forms the sealing resin body 130 to the upper surface of the storage space S of the busbar assembly 1 so as to surround components such as the semiconductor element 110 and the wires 120, and then hardening the resin. However, it is necessary to prevent the resin from flowing out after application until it hardens. The frame 30 blocks the outflow of the uncured resin and prevents the sealing resin body 130 from coming off after curing.

[0043] In this embodiment, the frame 130 is configured to fit along the peripheral region of the bus bar 10 in a plan view.

[0044] As described above, in this embodiment, the frame body 30 is formed from a conductive material, and the frame body 30 is configured to have an element connection portion 36 that can be electrically connected to the semiconductor element 110 mounted in the element mounting region 15, and a frame body side external connection portion 38 that can be electrically connected to the outside.

[0045] As shown in FIG. 2, the element connection portion 36 is electrically connected to the upper electrode layer 111 of the semiconductor element 110 via the wire 120 .

[0046] That is, in this embodiment, the bus bar 10 is electrically connected to the lower electrode layer 112 of the semiconductor element 110 and acts as one of the anode and cathode (e.g., the anode) for the semiconductor element 110, and the frame body 30 provided for the sealing resin body 130 is electrically connected to the upper electrode layer 111 of the semiconductor element 110 and also acts as the other of the anode and cathode (e.g., the cathode) for the semiconductor element 110.

[0047] The busbar assembly 1 having such a configuration has the following advantages compared to a laminated busbar assembly (hereinafter referred to as conventional configuration 1) in which a first flat busbar and a second flat busbar are stacked one above the other in a parallel state with an insulating resin layer in between, and a planar busbar assembly 500 (see FIG. 17 , referred to as conventional configuration 2) including first and second busbars 510(1), 510(2) arranged in parallel in the same plane with a gap 515 therebetween, insulating resin layers 520 provided in the gap 515 and on the upper surfaces of the first and second busbars 510(1), 510(2), and a frame body 550 fixed via the insulating resin layer 520 to the upper surface of a busbar connection body of the first and second busbars 510(1), 510(2) formed by connecting the first and second busbars 510(1), 510(2) by the insulating resin layer 520.

[0048] That is, in the conventional configuration 1, since the first and second bus bars are disposed opposite each other over the entire surface, there is a problem that it is difficult to ensure sufficient reliability regarding the insulation between the first and second bus bars.

[0049] Furthermore, when a frame body is provided in conventional configuration 1, the first bus bar, the second bus bar and the frame body are stacked in the thickness direction, which makes it difficult to reduce the size in the thickness direction.

[0050] In contrast, in the busbar assembly 1 of this embodiment, the frame body 30, which acts as the other of the anode and cathode, faces only a portion of the plane of the busbar 10 (the peripheral region in the illustrated form), which acts as one of the anode and cathode.Therefore, it is possible to sufficiently ensure insulation between the busbar 10 and the frame body 30 without making the insulating resin layer 20 between the busbar 10 and the frame body 30 thick.

[0051] Furthermore, since the frame 30 for the sealing resin body 130 is used as both an anode and a cathode, the bus bar assembly 1 can be made smaller in size in the thickness direction.

[0052] Compared to conventional configuration 1, conventional configuration 2 can be made smaller in the thickness direction while sufficiently ensuring reliability of the insulation between the first and second bus bars 510(1), 510(2). However, since the first and second bus bars 510(1), 510(2), which act as one and the other of the anode and cathode, are arranged in the same plane, there is a problem in that it is difficult to make the configuration smaller in the planar direction.

[0053] In contrast, in the busbar assembly 1 of this embodiment, the frame body 30 for the sealing resin body 130 is used both as an anode and a cathode, so that it is possible to obtain the same effect as the conventional configuration 2, that is, to achieve a reduction in size in the thickness direction while ensuring sufficient reliability in terms of the insulation between a pair of busbars that act as an anode and a cathode, and further to achieve a reduction in size in the planar direction.

[0054] As shown in Figures 1(b) and 2, in this embodiment, the entire outer peripheral surface of the frame body 30 is exposed to the outside, and any position on the outer peripheral surface can be used as the element connection portion 36 and the frame body side external connection portion 38.

[0055] Figures 3(a) to (d) respectively show a plan view of a busbar assembly 1A according to a first modified example of the present embodiment, a cross-sectional view taken along line III(b)-III(b) in Figure 3(a), a side view of the busbar assembly 1A, and a cross-sectional view taken along line III(d)-III(d) in Figure 3(a). FIG. 4 is a vertical cross-sectional view of a semiconductor module 101A in which the semiconductor element 110 is mounted on the bus bar assembly 1A according to the first modified example.

[0056] In the busbar assembly 1A of the first modified example, a frame body side insulating resin layer 31A is provided to cover the upper surface, inner side surface (the side surface facing the accommodating space S) and outer side surface (the side surface facing the opposite side to the accommodating space S) of the frame body 30.

[0057] The frame body side insulating resin layer 31A has an opening that exposes a portion of the inner surface to form the element connection portion 36, and an opening that exposes a portion of the outer surface to form the frame body side external connection portion 38.

[0058] Figures 5(a) to (d) respectively show a plan view of a busbar assembly 1B according to a second modified example of the present embodiment, a cross-sectional view taken along line V(a)-V(a) in Figure 5(a), a side view of the busbar assembly 1B, and a cross-sectional view taken along line V(d)-V(d) in Figure 5(a). FIG. 6 is a vertical cross-sectional view of a semiconductor module 101B in which the semiconductor element 110 is mounted on the bus bar assembly 1B according to the second modified example.

[0059] In the bus bar assembly 1B according to the second modified example, a frame-side insulating resin layer 31B that covers the upper surface, inner surface, outer surface and lower surface of the frame 30 is provided.

[0060] The frame body side insulating resin layer 31B has an opening that exposes a portion of the inner surface to form the element connection portion 36, and an opening that exposes a portion of the outer surface to form the frame body side external connection portion 38.

[0061] The frame-side insulating resin layers 31A, 31B having the openings can be formed, for example, by applying an insulating resin paint to the frame 30 while covering the area where the openings are to be formed with a mask, and then curing the paint.

[0062] An example of a method for manufacturing the busbar assembly 1 will now be described. FIG. 7 shows a plan view of a bus bar plate 200 made of a conductive metal and used in the manufacturing method.

[0063] The manufacturing method includes a step of preparing a busbar forming plate 200 having a busbar forming region 210 with the same thickness as the busbar 10 .

[0064] In this embodiment, as shown in FIG. 7 , the busbar flat plate 200 has a busbar row 205 including a plurality of the busbar forming regions 210 arranged in series along the Y direction in the XY plane in which the busbar flat plate 200 is located, and a connecting region 230 connecting adjacent busbar forming regions 210 in the Y direction.

[0065] In this embodiment, the busbar flat plate 200 has a pair of gripping pieces 207 respectively connected to one side and the other side of the longitudinal direction (Y direction) of the busbar row 205, and alignment holes 208 are provided in the pair of gripping pieces 207.

[0066] It is also possible to arrange a plurality of busbar rows 205 in parallel in the X direction, and to integrally hold the plurality of busbar rows 205 arranged in parallel in the X direction by the pair of gripping pieces 207, 207.

[0067] The manufacturing method includes a busbar side insulating resin layer forming step of forming the busbar side insulating resin layer 20 on a first surface 211 (the upper surface on which the semiconductor element 110 is mounted) on one side in the thickness direction of the busbar forming region 210.

[0068] In the present embodiment, the busbar side insulating resin layer forming step is configured to adhere an insulating resin film 25 to a first surface of the busbar forming region 210 . FIG. 8 shows a plan view of the busbar plate 200 after the busbar-side insulating resin layer forming step.

[0069] The insulating resin film 25 has the same outer shape as the bus bar forming region 210 in a plan view.

[0070] The insulating resin film 20 is made of an insulating resin material having heat resistance and insulating properties, such as polyamideimide, polyimide, polyamide, or epoxy.

[0071] The manufacturing method is configured to perform a frame body formation process for forming the frame body 30 in parallel with, or before or after, the processes from the process of preparing the busbar flat plate 200 to the process of forming the busbar side insulating resin layer.

[0072] FIG. 9 shows a plan view of a frame plate 300 made of conductive metal and used in the frame formation process. The frame body forming process includes a step of preparing a frame body flat plate 300 including a frame body forming region 310 having the same thickness as the frame body 30 and an outer shape corresponding to the busbar forming region 210 in a planar view, and a punching step of punching out the center of the frame body forming region 310 so as to leave a frame body forming portion corresponding to the frame body 30. FIG. 9 shows the state after the punching step.

[0073] The frame plate 300 is formed from various conductive materials. Preferably, the frame body flat plate 300 is formed from the same material as the bus bar flat plate 200 .

[0074] The frame body flat plate 300 is configured so that, when it is laminated on the bus bar flat plate 200 , the frame body forming region 310 is aligned with the bus bar forming region 210 .

[0075] In detail, as described above, the busbar plate 200 has a busbar row 205 including a plurality of the busbar forming regions 210 arranged in series along the Y direction, and a connecting region 230 connecting adjacent busbar forming regions 210 in the Y direction.

[0076] Therefore, as shown in Figure 9, the frame body flat plate 300 has a frame body row 305 including a plurality of frame body forming regions 310 arranged in series in the Y direction at the same pitch as the plurality of busbar forming regions 210, and a connecting region 330 connecting adjacent frame body forming regions 310 in the Y direction.

[0077] As mentioned above, the busbar flat plate 200 has a pair of gripping pieces 207 respectively connected to one side and the other side of the longitudinal direction (Y direction) of the busbar row 205, and alignment holes 208 are provided in the pair of gripping pieces 207.

[0078] Accordingly, as shown in Figure 9, the frame body flat plate 300 is also provided with a pair of gripping pieces 307 respectively connected to one side and the other side of the frame body row 305 in the longitudinal direction (Y direction), and the pair of gripping pieces 307 are provided with alignment holes 308 corresponding to the alignment holes 208.

[0079] The manufacturing method includes a flat plate fixing process of polymerizing the busbar forming flat plate 200 and the frame body forming flat plate 300, and fixing the frame body forming region 310 to the first surface 211 of the corresponding busbar forming region 210 via the insulating resin layer 20 (the insulating resin film 25 in this embodiment). FIG. 10 shows a plan view of the busbar forming plate 200 and the frame forming plate 300 after the plate fixing step.

[0080] The flat plate fixing process is performed, for example, by adhering the frame body forming region 310 to the insulating resin layer 20 (the insulating resin film 25 in this embodiment) on the first surface 211 of the corresponding busbar forming region 210 using an adhesive.

[0081] The manufacturing method further includes an opening forming step of forming the opening 21 in the bus bar side insulating resin layer 20 for exposing the element mounting region 15 .

[0082] In this embodiment, the opening forming step is configured to form the opening 21 by irradiating the insulating resin film 25 with laser light after the flat plate fixing step. FIG. 11 shows a plan view of the busbar forming plate 200 and the frame forming plate 300 after the opening forming step.

[0083] The manufacturing method further includes a cutting step of cutting the busbar forming region 210 and the frame body forming region 310 in a fixed state from the busbar forming plate 200 and the frame body forming plate 300.

[0084] As shown in FIG. 11, the cutting step is configured to cut along cutting lines C1 and C2 along edges of the busbar forming region 210 and the frame forming region on one and the other sides in the Y direction, respectively.

[0085] In this embodiment, the opening formation process is carried out after the flat plate fixing process and before the cutting process, but instead, it is also possible to form the openings 21 in advance in the insulating resin film 25 before it is adhered to the bus bar forming region 210. In this case, the bus bar side insulating resin layer forming step is configured to adhere the insulating resin film 25 in a state in which the openings 21 are formed, to the bus bar forming region 210 .

[0086] Alternatively, the insulating resin film 25 can be irradiated with laser light after the bus bar side insulating resin layer forming step and before the flat plate fixing step (the state shown in Figure 8), or after the cutting step.

[0087] In the present embodiment, the openings 21 are formed by laser light irradiation, but instead, the openings 21 can be formed by etching. In this case, the openings 21 are formed by performing etching in a state where the areas of the bus bar side insulating resin layer 20 other than the areas where the openings 21 are to be formed are masked.

[0088] Furthermore, in the case where the opening 21 is formed before the insulating resin film 25 is bonded to the busbar forming region 210, the opening 21 can also be formed by punching the insulating resin film 25.

[0089] In this embodiment, as described above, the bus bar side insulating resin layer 20 is formed by the insulating resin film 25. However, instead of this, it is also possible to form the bus bar side insulating resin layer 20 by an insulating resin coating film 27.

[0090] Figures 12(a) to (c) show longitudinal cross-sectional views of busbar assemblies 1C to 1E relating to third to fifth modified examples in which the busbar side insulating resin layer 20 is formed of an insulating resin coating film 27 instead of the insulating resin film 25 in the busbar assemblies 1, 1A and 1B relating to this embodiment, the first modified example and the second modified example, respectively.

[0091] In the manufacturing methods of the busbar assemblies 1C to 1E according to the third to fifth modified examples, the busbar side insulating resin layer forming step is configured to apply an insulating resin paint to the outer circumferential surface of the busbar forming plate 200 and harden it.

[0092] FIG. 13(a) shows a plan view of the bus bar plate 200 with an insulating resin coating film 27 provided on the outer circumferential surface.

[0093] In this case, the opening forming step is configured to form, by laser light irradiation or etching, openings 22 that expose the bus bar side external connection portions 16 in addition to the openings 21 that expose the element mounting region 15.

[0094] FIG. 13(b) is a cross-sectional view taken along line XIII(b)-XIII(b) in FIG. 13(a), showing a state in which the openings 21 and 22 have been formed.

[0095] The opening formation process may be performed after the busbar side insulating resin layer formation process and before the flat plate bonding process, as shown in FIG. 13(b), or alternatively, may be performed after the flat plate bonding process and before the cutting process, or after the cutting process.

[0096] In addition, in the manufacturing method for the configuration in which the frame body side insulating resin layers 31A, 31B are provided (the first, second, fourth and fifth modified examples), the frame body forming process includes, after the punching step, a frame body side insulating resin layer forming step in which an insulating resin paint is applied and hardened while masking the areas of the outer surface of the frame body forming portion in which the element connection portion 36 and the frame body side external connection portion 38 are to be formed.

[0097] FIG. 14(a) shows a plan view of the frame body flat plate 300 after the frame body side insulating resin layer forming step. 14(b) and (c) are cross-sectional views taken along line XIV-XIV in FIG. 14(a). Figures 14(b) and (c) respectively show a configuration in which the frame body side insulating resin layer 31A is provided (the first and fourth modified examples) and a configuration in which the frame body side insulating resin layer 31B is provided (the second and fifth modified examples).

[0098] In addition, in a configuration (the second to fifth modified examples) in which an insulating resin coating is provided on at least one of the contact areas of the frame body 30 and the bus bar 10 (i.e., at least one of the areas of the lower surface of the frame body 30 and the upper surface of the bus bar 10 that abuts against the frame body 30), the flat plate fixing process can be performed when the insulating resin coating is in a semi-cured state.

[0099] According to such a configuration, the busbar forming plate 200 and the frame forming plate 300 can be fixed together by utilizing the hardening action of an insulating resin coating film instead of or in addition to the action of an adhesive.

[0100] Embodiment 2 Hereinafter, another embodiment of the bus bar assembly according to the present invention will be described with reference to the accompanying drawings. Figures 15(a) to (d) respectively show a plan view of a busbar assembly 2 in this embodiment, a cross-sectional view taken along line XV(a)-XV(a) in Figure 15(a), a side view of the busbar assembly 2, and a cross-sectional view taken along line XV(d)-XV(d) in Figure 15(a). FIG. 16 is a vertical cross-sectional view of a semiconductor module 102 in which the semiconductor element 110 is mounted on the bus bar assembly 2. As shown in FIG. In the figure, the same members as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

[0101] The busbar assembly 2 of this embodiment differs from the busbar assembly 1 of embodiment 1 in that the busbar side insulating resin layer 20 is omitted, and the frame body 30 and the busbar 10 are insulated only by the frame body side insulating resin layer 30B.

[0102] That is, in this embodiment, a frame body side insulating resin layer 30B is provided to cover at least the lower surface of the frame body 30 (the surface opposite the upper surface 11 of the bus bar 10), and the frame body 30 formed of a conductive material is mechanically fixed in an electrically insulated state to the upper surface 11 of the bus bar 10 via the frame body side insulating resin layer 30B.

[0103] The busbar assembly 2 having such a configuration can also obtain the same effects as the busbar assembly 1 according to the first embodiment, compared to the conventional configurations 1 and 2.

[0104] In this embodiment, the frame body side insulating resin layer 30B is configured to cover the entire outer peripheral surface of the frame body 30, and the frame body side insulating resin layer 30B is provided with an opening for forming the element connection portion 36 and an opening for forming the frame body side external connection portion 38.

[0105] The bus bar assembly 2 according to this embodiment is efficiently manufactured by the following manufacturing method.

[0106] That is, the manufacturing method includes a step of preparing the flat plate 200 for a bus bar, and a frame body forming process which is performed before or after the step of preparing the flat plate 200 for a bus bar, or in parallel with the step of preparing the flat plate 200 for a bus bar.

[0107] The frame body forming process includes a step of preparing the frame body flat plate 300, a punching step of punching out the central portion of the frame body forming region 310 to form a frame body forming portion, and a frame body side insulating resin layer forming step of applying an insulating resin paint to at least the surface of the outer surface of the frame body forming portion that faces the first surface 11 of the busbar 10 and curing it to form the frame body side insulating resin layer 30B.

[0108] The manufacturing method further includes a flat plate fixing process of laminating the busbar flat plate 200 and the frame body flat plate 300 and fixing the frame body forming region 310 to the first surface 211 of the corresponding busbar forming region 210, and a cutting process of cutting the busbar forming region 210 and the frame body forming region 310 in a fixed state from the busbar flat plate 200 and the frame body flat plate 300.

[0109] The fixing of the frame body forming region 310 and the busbar forming region 210 in the flat plate fixing process can be performed by the bonding action of an adhesive, or instead of or in addition to the bonding action of an adhesive, the fixing can be performed by polymerizing the frame body forming region 310 and the busbar forming region 210 when the insulating resin coating provided on the opposing surface of the frame body 30 is in a semi-cured state, thereby utilizing the hardening action of the coating. [Explanation of symbols]

[0110] 1, 1A~1E, 2 Busbar Assembly 10 Busbar 15 Element mounting area 16 Busbar side external connection 20 Busbar side insulating resin layer 25 Insulating resin film 27 Insulating resin coating 30 Frame 31A, 31B Frame side insulating resin layer 36 Element connection part 38 External connection part on element side S Storage space

Claims

1. a planar bus bar formed of a conductive member, an insulating resin film provided on an upper surface of the bus bar, and a frame body formed of a conductive member, the frame body being mechanically fixed to the upper surface of the bus bar via the insulating resin film in an electrically insulated state so as to define an accommodation space that opens upward at the center of the upper surface of the bus bar, the insulating resin film is provided with an opening that exposes at least a portion of an upper surface of the bus bar within the accommodation space to form an element mounting area to which an electric element can be mechanically mounted in an electrically connected state; A busbar assembly, characterized in that the entire outer surfaces of the busbar and the frame are exposed.

2. a planar bus bar formed of a conductive member, an insulating resin film provided on an upper surface of the bus bar, and a frame body formed of a conductive member, the frame body being mechanically fixed to the upper surface of the bus bar via the insulating resin film in an electrically insulated state so as to define an accommodation space that opens upward at the center of the upper surface of the bus bar, the insulating resin film is provided with an opening that exposes at least a portion of an upper surface of the bus bar within the accommodation space to form an element mounting area to which an electric element can be mechanically mounted in an electrically connected state; The busbar has an entire outer surface exposed, the outer surface of the frame, except for the lower surface in contact with the insulating resin film, is covered with a frame-side insulating resin layer; A busbar assembly characterized in that the frame body side insulating resin layer is provided with an opening that forms an element connection portion that can be electrically connected to an electrical element mounted in the element mounting area, and an opening that forms a frame body side external connection portion that can be electrically connected to the outside.

3. a busbar-side insulating resin coating that covers an entire outer surface of the busbar; and a frame body that is made of a conductive member and is mechanically fixed in an electrically insulated state to an upper surface of the busbar via the busbar-side insulating resin coating so as to define an accommodation space that opens upwards at the center of an upper surface of the busbar, the busbar-side insulating resin coating film is provided with an opening that exposes at least a portion of an upper surface of the busbar within the accommodating space to form an element mounting area to which an electric element can be mechanically mounted in an electrically connected state, and an opening that exposes a lower surface of the busbar to form a busbar-side external connection portion that can be electrically connected to the outside, A busbar assembly, wherein the frame has an entire outer surface exposed.

4. a busbar-side insulating resin coating that covers an entire outer surface of the busbar; and a frame body that is made of a conductive member and is mechanically fixed in an electrically insulated state to an upper surface of the busbar via the busbar-side insulating resin coating so as to define an accommodation space that opens upwards at the center of an upper surface of the busbar, the busbar-side insulating resin coating film is provided with an opening that exposes at least a portion of an upper surface of the busbar within the accommodating space to form an element mounting area to which an electric element can be mechanically mounted in an electrically connected state, and an opening that exposes a lower surface of the busbar to form a busbar-side external connection portion that can be electrically connected to the outside, an outer surface of the frame body other than a lower surface that is fixed to an upper surface of the bus bar via the bus bar side insulating resin coating film is covered with a frame body side insulating resin layer; A busbar assembly characterized in that the frame body side insulating resin layer is provided with an opening that forms an element connection portion that can be electrically connected to an electrical element mounted in the element mounting area, and an opening that forms a frame body side external connection portion that can be electrically connected to the outside.

5. a planar bus bar formed of a conductive member; and a frame body formed of a conductive member, the frame body being mechanically fixed to an upper surface of the bus bar in an electrically insulated state so as to define an accommodation space at the center of an upper surface of the bus bar and opening upward, The busbar has an entire outer surface exposed, The entire outer surface of the frame is covered with a frame-side insulating resin layer, A busbar assembly characterized in that the frame body side insulating resin layer is provided with an opening that forms an element connection portion that can be electrically connected to an electrical element mounted on the upper surface of the busbar within the accommodating space, and an opening that forms a frame body side external connection portion that can be electrically connected to the outside.

6. A busbar assembly as described in any one of claims 2, 4 and 5, characterized in that the opening forming the element connection portion is configured to expose a portion of the inner surface of the frame body, and the opening forming the frame body side external connection portion is configured to expose a portion of the outer surface of the frame body.

Images