Removal method of carrier plate

Abstract

To provide a removal method of a carrier plate, capable of easily removing the carrier plate from a composite substrate formed by fixing a workpiece via a temporal adhesive layer to the carrier plate.SOLUTION: A removal method of a carrier plate contains: an integration step of fixing an annular frame to an external peripheral part of a tape while adhering the tape to a workpiece side of a composition substrate so that the carrier plate side of the composition substrate is exposed; a processing step of processing an external edge part of the composition substrate so that the outer edge part of a temporal adhesive layer is removed; and a removing step of holding a second surface side of the carrier plate with a holding tool, and removing the carrier plate from the composition substrate by relatively moving the holding tool and the frame so that the workpiece is separated from the carrier plate.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a method for removing a carrier plate used when removing a carrier plate from a composite substrate in which a workpiece is fixed to the carrier plate via a temporary adhesive layer. [Background technology]

[0002] In electronic devices such as mobile phones and personal computers, device chips equipped with devices such as electronic circuits are essential components. Device chips are obtained, for example, by dividing the surface (one of the main surfaces) of a wafer made of a semiconductor such as silicon into a plurality of regions along division lines (streets), forming devices in each region, and then dividing the wafer along these division lines.

[0003] The device chip obtained by the above-mentioned method is, for example, fixed to a mother board for CSP (Chip Size Package), connected to terminals of the mother board by a method such as wire bonding, and then sealed with molding resin. By sealing the device chip with molding resin to form a package device in this manner, the device chip is appropriately protected from external factors such as impact, light, heat, and water.

[0004] In recent years, a packaging technology called FOWLP (Fan-Out Wafer Level Package) has been put to practical use, in which terminals are provided outside the area of ​​a device chip using wafer-level rewiring technology (see, for example, Patent Document 1). Also proposed is a packaging technology called FOPLP (Fan-Out Panel Level Packaging) in which package devices are manufactured collectively at the level of a panel (typically a glass substrate used in the manufacture of liquid crystal panels) that is larger than a wafer.

[0005] In FOPLP, for example, a laminate is prepared in which a wiring layer (RDL: Redistribution Layer) is provided on the surface (one main surface) of a carrier plate that serves as a temporary substrate via a temporary adhesive layer. A device chip is bonded to the wiring layer of this laminate, and then the device chip is sealed with a molding resin to obtain a package panel. Then, the package panel is divided to complete package devices. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2016-201519 A Summary of the Invention [Problem to be solved by the invention]

[0007] In the above-mentioned FOPLP, for example, after dividing the package panel into package devices, the carrier plate is removed from the package devices. Specifically, each package device is picked up from the carrier plate. However, if the size of the package device is small, it is difficult to pick up the package device from the carrier plate.

[0008] On the other hand, it is also possible to peel and remove the carrier plate from the package panel before dividing the package panel into package devices. However, since the adhesive strength of the temporary adhesive layer is relatively strong, it is difficult to peel the carrier plate from the package panel without damaging the package panel.

[0009] Therefore, an object of the present invention is to provide a method for removing a carrier plate, which can easily remove a carrier plate from a composite substrate having a workpiece such as a package panel fixed to the carrier plate via a temporary adhesive layer. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a method for removing a carrier plate from a composite substrate having a carrier plate having a first surface and a second surface opposite to the first surface, the carrier plate having a workpiece fixed to the first surface via a temporary adhesive layer, the method including: an integration step of attaching a tape to the workpiece side of the composite substrate so that the carrier plate side of the composite substrate is exposed, and fixing an annular frame to the outer periphery of the tape; a processing step of processing the outer edge of the composite substrate so that the outer edge of the temporary adhesive layer is removed; and a removal step of holding the second surface side of the carrier plate with a holder and moving the holder and the frame relatively so that the workpiece is separated from the carrier plate, thereby removing the carrier plate from the composite substrate, after performing the integration step and the processing step.

[0011] Preferably, in the removal step, the second surface side of the carrier plate is held from above by the holder, and a downward force is applied to the frame from above by a pressing tool, thereby moving the holder and the frame relative to each other so that the workpiece is separated from the carrier plate.

[0012] Also, preferably, in the processing step, the composite substrate is held on a chuck table via the tape, and a rotating cutting blade is caused to cut into the outer edge portion of the composite substrate, thereby processing the outer edge portion of the composite substrate.

[0013] Also preferably, the processing step involves cutting the rotating cutting blade into the outer edge of the composite substrate such that the outer edge of the workpiece is removed along with the outer edge of the temporary adhesive layer. Effect of the Invention

[0014] In a method for removing a carrier plate according to one aspect of the present invention, a tape is applied to the workpiece side of the composite substrate and a ring-shaped frame is fixed to the outer periphery of the tape, the outer edge of the composite substrate is processed so that the outer edge of the temporary adhesive layer is removed, and the carrier plate is then held with a holder and the holder and frame are moved relative to each other so that the workpiece is separated from the carrier plate, thereby making it easy to remove the carrier plate from the composite substrate. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a cross-sectional view that illustrates a schematic diagram of a composite substrate including a carrier plate and a workpiece. [Diagram 2] FIG. 2 is a cross-sectional view that typically shows a composite substrate that is integrated with a frame via a tape. [Diagram 3] FIG. 3 is a cross-sectional view that typically shows the composite substrate being held by the chuck table via the tape. [Figure 4] FIG. 4 is a cross-sectional view that typically shows the composite substrate in a state in which it is being cut by a cutting blade. [Diagram 5] FIG. 5 is a cross-sectional view that typically shows the composite substrate in a state in which the carrier plate side is held by a holder. [Figure 6] FIG. 6 is a schematic cross-sectional view of a workpiece being separated from a carrier plate by a downward force being applied to the frame. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, an embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. The method for removing a carrier plate according to this embodiment is used when removing a carrier plate from a composite substrate in which a workpiece is provided on the surface of the carrier plate via a temporary adhesive layer, and includes an integration step (see FIG. 3), a processing step (see FIG. 4 and FIG. 5), and a removal step (see FIG. 6).

[0017] In the integration step, a tape is applied to the workpiece side of the composite substrate so that the carrier plate side of the composite substrate is exposed, and an annular frame is fixed to the outer periphery of the tape. In the processing step, the outer edge of the composite substrate is processed so that the outer edge of the temporary adhesive layer is removed. In the removal step, the carrier plate side of the composite substrate is held by a holder, and the holder and the frame are moved relative to each other so that the workpiece is separated from the carrier plate, thereby removing the carrier plate from the composite substrate.

[0018] 1 is a cross-sectional view showing a composite substrate 1 used in the present embodiment. The composite substrate 1 includes a carrier plate 3 formed of an insulator such as soda glass, borosilicate glass, or quartz glass. The carrier plate 3 has, for example, a substantially flat first surface (front surface) 3a and a second surface (back surface) 3b opposite to the first surface 3a, and is rectangular in plan view from the first surface 3a side or the second surface 3b side. The thickness of the carrier plate 3 is, for example, 2 mm or less, typically 1.1 mm.

[0019] In this embodiment, the carrier plate 3 is made of an insulator such as soda glass, borosilicate glass, or quartz glass, but there is no particular limitation on the material, shape, structure, size, etc. of the carrier plate 3. For example, a plate made of a material such as a semiconductor, ceramic, resin, or metal may be used as the carrier plate 3. Also, a disk-shaped semiconductor wafer or the like may be used as the carrier plate 3.

[0020] The workpiece 7 is provided on the first surface 3a side of the carrier plate 3 via a temporary adhesive layer 5. The temporary adhesive layer 5 is formed on almost the entire first surface 3a by, for example, overlapping a metal film, an insulator film, or the like, and has the function of adhering the carrier plate 3 and the workpiece 7. However, the temporary adhesive layer 5 may be composed of a resin film or the like that functions as an adhesive.

[0021] The thickness of the temporary adhesive layer 5 is, for example, 20 μm or less, typically about 0.6 μm. When the carrier plate 3 is separated and removed from the workpiece 7 in a removal step described later, the temporary adhesive layer 5 is separated into a first portion 5a (see FIG. 6) in close contact with the carrier plate 3 side and a second portion 5b (see FIG. 6) in close contact with the workpiece 7 side.

[0022] The workpiece 7 is also called, for example, a package panel or a package wafer, and includes a wiring layer (RDL) (not shown) in contact with the temporary adhesive layer 5, a plurality of device chips 9 bonded to the wiring layer, and a molded resin layer 11 that seals each of the device chips 9. The workpiece 7 is configured, for example, to have approximately the same size and shape as the carrier plate 3 in a plan view. The thickness of the workpiece 7 is, for example, 1.5 mm or less, typically 0.6 mm, 0.1 mm, etc.

[0023] The exposed first surface (front surface) 7a of the workpiece 7 may be processed by a method such as grinding. Furthermore, planned division lines (planned cutting lines) are set in the regions between adjacent device chips 9 in the workpiece 7. By cutting the workpiece 7 along any of the planned division lines, the workpiece 7 is divided into a plurality of workpiece pieces each including one or a plurality of device chips 9.

[0024] By cutting the workpiece 7 (or workpiece pieces) along all of the planned division lines, a plurality of package devices corresponding to each device chip 9 can be obtained. However, there are no particular limitations on the material, shape, structure, size, etc. of the workpiece 7. For example, the workpiece 7 may be mainly composed of a wiring layer and may not include a device chip 9, a molded resin layer 11, etc.

[0025] In the carrier plate removal method according to this embodiment, first, an integration step is performed in which the composite substrate 1 is integrated with an annular frame. Fig. 2 is a cross-sectional view that shows a schematic diagram of the composite substrate 1 integrated with the frame 23 via the tape 21. As shown in Fig. 2, in this embodiment, the composite substrate 1 is integrated with the frame 23 via the tape 21.

[0026] The tape 21 includes a thin base material (film) formed in a circular shape from a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and an adhesive layer (glue layer) formed on the base material from an epoxy-, acrylic-, or rubber-based adhesive, etc. However, the adhesive layer may be made of an ultraviolet-curable resin that hardens when irradiated with ultraviolet light.

[0027] Here, the adhesive strength of the tape 21 to the composite substrate 1 is desirably 1 N / 20 mm or more, and more desirably 2 N / 20 mm or more. If the adhesive strength of the tape 21 is less than 1 N / 20 mm, there is a high possibility that the tape 21 will peel off from the composite substrate 1 when the workpiece 7 is separated from the carrier plate 3. In this embodiment, as an example, the tape 21 having an adhesive strength of about 3 N / 20 mm is used.

[0028] Frame 23 is made of a metal such as SUS (stainless steel) and has a circular opening 23a in the center thereof, penetrating frame 23 in the thickness direction. The diameter of opening 23a is larger than the maximum distance (width) between any two corners of composite substrate 1 (diameter, if composite substrate 1 is disk-shaped), and composite substrate 1 is disposed inside opening 23a.

[0029] Specifically, for example, a central portion of the adhesive layer side of tape 21 is attached to the workpiece 7 side of composite substrate 1 so that the carrier plate 3 side of composite substrate 1 is exposed. In addition, an annular frame 23 is fixed to the outer periphery of the adhesive layer side of tape 21. Note that the attachment of tape 21 to composite substrate 1 and the fixing of frame 23 to tape 21 may be performed in any order. Furthermore, these may be performed substantially simultaneously.

[0030] After the integration step is performed, a processing step is performed to process the outer edge of the composite substrate 1 so as to remove the outer edge of the temporary adhesive layer 5. Specifically, first, the workpiece 7 side of the composite substrate 1 is held by a chuck table so that the carrier plate 3 side of the composite substrate 1 is exposed upward. Fig. 3 is a cross-sectional view that shows a schematic view of the composite substrate 1 in a state in which the workpiece 7 side is held.

[0031] In this embodiment, the processing step is carried out using a cutting device 2 shown in Fig. 3 and the like. The cutting device 2 is provided with a chuck table 4 for holding the composite substrate 1. The chuck table 4 includes a disk-shaped frame 6 made of a metal such as stainless steel. A recess that opens onto the upper surface of the frame 6 is provided in the upper part of the frame 6, and a holding plate 8 made of a porous flat material such as ceramics is fixed to this recess. In addition, a plurality of clamps (not shown) for fixing a frame 23 are provided around the frame 6.

[0032] The lower surface side of the holding plate 8 is connected to a suction source 12 including an ejector or the like via a flow path 6a provided inside the frame 6 and a valve 10 arranged outside the frame 6. Therefore, when the valve 10 is opened while the suction source 12 is operating, the negative pressure of the suction source 12 acts on the upper surface 8a of the holding plate 8. In this manner, the upper surface 8a of the holding plate 8 serves as a holding surface for sucking and holding the workpiece 7 side of the composite substrate 1.

[0033] A rotary drive source (not shown) such as a motor is connected to the lower part of the frame 6, and the power generated by this rotary drive source rotates the chuck table 4 about a rotation axis that is approximately perpendicular to the upper surface (holding surface) 8a of the above-mentioned holding plate 8. The chuck table 4 is also supported by a first horizontal movement mechanism (not shown), and the power generated by this first horizontal movement mechanism moves along a first axis (X-axis) that is approximately parallel to the above-mentioned upper surface 8a (processing feed).

[0034] When the composite substrate 1 is held on the chuck table 4, as shown in Fig. 3, the composite substrate 1 is placed on the upper surface 8a of the chuck table 4 via the tape 21 so that the first surface 7a of the workpiece 7 faces the upper surface 8a of the chuck table 4 via the tape 21. Thereafter, the valve 10 is opened with the suction source 12 operating.

[0035] As a result, the negative pressure of suction source 12 acts on upper surface 8a, and composite substrate 1 is held by chuck table 4 via tape 21. That is, the workpiece 7 side of composite substrate 1 is held by chuck table 4 via tape 21, and the carrier plate 3 side of composite substrate 1 is exposed upward. At the same time, frame 23 is fixed by a clamp.

[0036] After the composite substrate 1 is held by the chuck table 4, the outer edge of the composite substrate 1 is machined. FIG. 4 is a cross-sectional view that shows a schematic view of the composite substrate 1 in a state in which the outer edge is machined. As shown in FIG. 4, a cutting unit 14 is disposed above the chuck table 4. The cutting unit 14 includes a spindle 16 that is generally parallel to the upper surface 8a and aligned with a second axis (Y-axis) that is generally perpendicular to the first axis. An annular cutting blade 18 made of a binder with abrasive grains dispersed therein is attached to one end of the spindle 16.

[0037] A rotary drive source (not shown) such as a motor is connected to the other end of the spindle 16, and the cutting blade 18 attached to one end of the spindle 16 rotates by the power generated by this rotary drive source. The cutting unit 14 is supported by, for example, a second horizontal movement mechanism (not shown) and an elevation mechanism (not shown), and moves along the second axis (indexing feed) by the power generated by the second horizontal movement mechanism, and moves along a third axis (Z-axis) perpendicular to the first and second axes by the power generated by the elevation mechanism.

[0038] When processing the composite substrate 1, first, the rotary drive source rotates the chuck table 4 holding the composite substrate 1 so that a part of the outer edge of the composite substrate 1 to be processed (a part corresponding to one side of a rectangle in a plan view) is generally parallel to the first axis. Next, the first horizontal movement mechanism moves the chuck table 4 along the first axis, and the second horizontal movement mechanism moves the cutting unit 14 along the second axis so that the cutting blade 18 is positioned above an extension line of the part of the outer edge described above.

[0039] Then, the lifting mechanism moves the cutting unit 14 along the third axis so that the lower end of the cutting blade 18 is positioned slightly lower than the interface between the temporary adhesive layer 5 and the workpiece 7. Thereafter, with the cutting blade 18 rotating, the first horizontal movement mechanism moves the chuck table 4 along the first axis.

[0040] 4, the rotating cutting blade 18 cuts into the outer edge of the composite substrate 1, and the outer edge of the composite substrate 1 is removed by the cutting blade 18. That is, the outer edges of the carrier plate 3, the temporary adhesive layer 5, and the workpiece 7 that constitute the composite substrate 1 are each removed.

[0041] In general, the outer edge of the carrier plate 3 and the outer edge of the workpiece 7 are strongly bonded by the outer edge of the temporary adhesive layer 5. Therefore, by removing the outer edge of the temporary adhesive layer 5, the workpiece 7 can be easily separated from the carrier plate 3 later. Note that in this embodiment, the outer edges of the carrier plate 3 and the workpiece 7 are removed together with the outer edge of the temporary adhesive layer 5, but it is sufficient that at least the outer edge of the temporary adhesive layer 5 is removed.

[0042] After a portion of the outer edge of the composite substrate 1 is removed by the above-mentioned procedure, another portion of the outer edge of the composite substrate 1 is removed by the same procedure. This procedure is repeated, and when, for example, the entire outer edge of the composite substrate 1 is removed, the processing step is completed. Note that in this embodiment, the entire outer edge of the composite substrate 1 is removed, but as long as at least a portion of the outer edge of the composite substrate 1 is removed, the next removal step can be appropriately performed.

[0043] Furthermore, the specific procedures of this processing step can be appropriately changed according to the shape of the composite substrate 1. For example, when the composite substrate 1 is configured in a disk shape, the outer edge of the composite substrate 1 is removed by rotating the chuck table 4 while cutting the cutting blade 18 into the outer edge of the composite substrate 1. Of course, in this case, only a part of the outer edge of the composite substrate 1 may be removed.

[0044] After the integration step and the processing step are performed, a removal step is performed to remove the carrier plate 3 from the composite substrate 1. Specifically, first, the carrier plate 3 side of the composite substrate 1 is held from above by a holder. Fig. 5 is a cross-sectional view that typically shows the composite substrate 1 in a state in which the carrier plate 3 side is held from above.

[0045] In this embodiment, the removal step is performed using a separation device 22 shown in Fig. 5 etc. The separation device 22 is provided with a holder (holding member) 24 for holding the carrier plate 3 side of the composite substrate 1 from above. A holding surface 24a having a size approximately equal to that of the second surface 3b of the carrier plate 3 is formed on the lower part of the holder 24.

[0046] A suction source (not shown) including an ejector or the like is connected to the holding surface 24a via a flow path (not shown) and a valve (not shown). Therefore, when the valve is opened while the suction source is in operation, the negative pressure of the suction source acts on the holding surface 24a. In addition, the holder 24 is supported by a lifting mechanism (not shown) and moves up and down by the power of this lifting mechanism.

[0047] 5, when the carrier plate 3 side is held from above by the holder 24, the holding surface 24a of the holder 24 contacts the second surface 3b of the carrier plate 3, and the valve is opened while the suction source is in operation. As a result, the negative pressure of the suction source acts on the holding surface 24a, and the carrier plate 3 side of the composite substrate 1 is held by the holder 24 from above.

[0048] After the carrier plate 3 side of the composite substrate 1 is held by the holder 24, the holder 24 and the frame 23 are moved relatively to each other so that the workpiece 7 is separated from the carrier plate 3. Fig. 6 is a cross-sectional view showing a schematic view of the workpiece 7 separated from the carrier plate 3. As shown in Fig. 6, a rod-shaped pressing tool (pressing member) 26 is disposed on the side of the holder 24 at a position corresponding to the frame 23 when the composite substrate 1 is held by the holder 24.

[0049] In this embodiment, one pressing tool 26 is disposed at each of two positions sandwiching the holder 24. Each pressing tool 26 is supported, for example, by a lifting mechanism (not shown) separate from the lifting mechanism that moves the holder 24, and moves up and down independently of the holder 24 by the power of this lifting mechanism. There is no limitation on the shape, arrangement, number, etc. of the pressing tools 26. For example, one or three or more rod-shaped pressing tools 26 may be used. The pressing tool 26 may be configured in a cylindrical (annular) or semi-cylindrical (arcuate) shape surrounding the holder 24.

[0050] When the workpiece 7 is separated from the carrier plate 3, for example, each lifting mechanism moves both the holder 24 and the pressing tool 26 upward. As a result, a space is formed below the composite substrate 1 and the frame 23. Next, for example, while the lifting mechanism for the holder 24 maintains the position of the holder 24, the lifting mechanism for the pressing tool 26 moves the pressing tool 26 downward, so that the lower end of the pressing tool 26 comes into contact with the frame 23 from above. Then, the lifting mechanism for the pressing tool 26 moves the pressing tool 26 further downward, applying a downward force to the frame 23. That is, the frame 23 moves downward relative to the holder 24.

[0051] As described above, the carrier plate 3 side of the composite substrate 1 is held from above by the holder 24, and the outer edge of the temporary adhesive layer 5 has been removed. Therefore, when a downward force is applied from the pressing tool 26 to the frame 23 and the frame 23 moves relatively downward, the workpiece 7 integrated with the frame 23 via the tape 21 is separated from the carrier plate 3 at the boundary of the temporary adhesive layer 5 and falls. When the entire workpiece 7 is separated from the carrier plate 3 and the carrier plate 3 is removed from the composite substrate 1, the removal process is completed.

[0052] As described above, in the method for removing the carrier plate in this embodiment, tape 21 is attached to the workpiece 7 side of the composite substrate 1 and a ring-shaped frame 23 is fixed to the outer periphery of the tape 21, the outer edge of the composite substrate 1 is processed so that the outer edge of the temporary adhesive layer 5 is removed, and then the carrier plate 3 is held by the holder 24, and the holder 24 and the frame 23 are moved relative to each other so that the workpiece 7 is moved away from the carrier plate 3, so that the carrier plate 3 can be easily removed from the composite substrate 1.

[0053] In particular, the method of removing a carrier plate according to this embodiment is extremely effective when separating a workpiece 7 that is not sufficiently strong from the carrier plate 3. For example, when separating a workpiece 7 having a thickness of 0.2 mm or less from the carrier plate 3, the use of the tape 21 and the annular frame 23 as in this embodiment can sufficiently reduce the possibility of the workpiece 7 being damaged. In addition, since the frame 23 is used in this embodiment, the thin workpiece 7 separated from the carrier plate 3 is not warped.

[0054] The present invention is not limited to the above-described embodiment, and may be modified in various ways. For example, in the above-described embodiment, the processing step is performed after the integration step, but the processing step may be performed before the integration step.

[0055] Furthermore, for example, the pressing tool 26 in the above-described embodiment is configured to be able to move up and down independently of the holder 24, but the pressing tool 26 may be configured to be able to move up and down at least relatively to the holder 24. For example, the pressing tool 26 can be moved relatively to the holder 24 even when the pressing tool 26 is fixed to a housing (not shown) of the separation device 22 or the like and only the holder 24 is moved.

[0056] Furthermore, in the above-described embodiment, the outer edge of the composite substrate 1 is processed by cutting into the substrate with the cutting blade 18, but the outer edge of the composite substrate 1 may be processed by, for example, irradiating a laser beam. In this case, a laser processing device (laser processing unit) capable of irradiating a laser beam with a wavelength absorbed by the composite substrate 1 is used instead of the cutting device 2 (cutting unit 14). That is, the outer edge of the composite substrate 1 is ablated with the laser beam.

[0057] Furthermore, when the workpiece 7 is separated from the carrier plate 3 in the removal step, a fluid may be sprayed onto the region between the carrier plate 3 and the workpiece 7 (the region where the temporary adhesive layer 5 is present). For example, by spraying a fluid onto the region between the carrier plate 3 and the workpiece 7 with a nozzle or the like while the pressing tool 26 applies a downward force to the frame 23, the workpiece 7 can be more easily separated from the carrier plate 3.

[0058] Of course, the pressing tool 26 may apply a downward force to the frame 23 after a fluid is sprayed by a nozzle or the like onto the region between the carrier plate 3 and the workpiece 7. For example, air or water may be used as the fluid sprayed onto the region between the carrier plate 3 and the workpiece 7. However, there is no particular limitation on the type of fluid.

[0059] Also, a tank (liquid tank) for storing liquid such as water may be disposed below the holder 24 of the separation device 22. In this case, the workpieces 7 separated from the carrier plate 3 in the removal step fall into the liquid stored in the tank, so that the impact of the fall is smaller than when the workpieces 7 fall in the air, and damage to the workpieces 7 is prevented.

[0060] Furthermore, in the above-mentioned embodiment and each modified example, the carrier plate 3 side of the composite substrate 1 is held from above by the holder 24, and a downward force is applied from the pressing tool 26 to the frame 23, but the directional relationship shown in the embodiment and each modified example can be freely changed. For example, the carrier plate 3 side of the composite substrate 1 may be held from below by a holder, and an upward force may be applied from the pressing tool to the frame 23.

[0061] In addition, the structures, methods, and the like according to the above-described embodiments and modifications may be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0062] 1: Composite board 3: Carrier plate 3a: 1st side (front) 3b: 2nd side (back side) 5: Temporary adhesive layer 5a: 1st part 5b: 2nd part 7: Workpiece 7a: 1st side (front) 9: Device chip 11: Mold resin layer 21: Tape 23: Frame 23a: Opening 2:Cutting device 4: Chuck table 6: Frame 6a: Flow path 8: Holding plate 8a:Top surface (holding surface) 10: Valve 12: Suction source 14: Cutting unit 16: Spindle 18: Cutting blade 22: Separation device 24: Holder (holding member) 24a: Holding surface 26: Pressing tool (pressing member)

Claims

1. A method for removing a carrier plate from a composite substrate having a carrier plate having a first surface and a second surface opposite to the first surface, the carrier plate having a workpiece fixed to the first surface via a temporary adhesive layer, the method comprising: an integration step of attaching a tape to the workpiece side of the composite substrate so that the carrier plate side of the composite substrate is exposed, and fixing an annular frame to an outer periphery of the tape; A processing step of processing an outer edge portion of the composite substrate so that an outer edge portion of the temporary adhesive layer is removed; a removal step of removing the carrier plate from the composite substrate by holding the second surface side of the carrier plate with a holder and moving the holder and the frame relatively so that the workpiece is separated from the carrier plate after performing the integration step and the processing step.

2. The method for removing a carrier plate as described in claim 1, wherein in the removal process, the second surface side of the carrier plate is held from above by the holder, and a downward force is applied to the frame from above by a pressing tool, thereby moving the holder and the frame relative to each other so that the workpiece is separated from the carrier plate.

3. A method for removing a carrier plate as described in claim 1 or claim 2, wherein in the processing step, the composite substrate is held on a chuck table via the tape, and a rotating cutting blade is cut into the outer edge portion of the composite substrate, thereby processing the outer edge portion of the composite substrate.

4. The method for removing a carrier plate as described in claim 3, wherein the processing step comprises cutting the rotating cutting blade into the outer edge of the composite substrate so as to remove the outer edge of the workpiece together with the outer edge of the temporary adhesive layer.

Images