Substrate processing device

Abstract

To provide a substrate processing device capable of adjusting a flow rate of a liquid discharged from a nozzle.SOLUTION: A substrate processing device includes a nozzle configured to supply a liquid to a substrate and a liquid supply device configured to supply the liquid to the nozzle. The liquid supply device includes: a supply pipe that allows a liquid supply source and a nozzle to perform fluid communication and has a first pipe constituting a first flow path from a diverging point to a converging point downstream of the diverging point and a second pipe constituting a second flow path from the diverging point to the converging point; a first valve attached to the first pipe; a second valve attached to the second pipe; and a fluid resistance element attached to the second pipe for making pressure loss of the liquid flowing in the second pipe larger than that of the liquid flowing in the first pipe.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus. [Background technology]

[0002] In the semiconductor manufacturing process, the substrate is polished by CMP (Chemical Mechanical Polishing). The surface of the substrate is polished by a polishing device. The polished substrate is then cleaned to remove any remaining polishing fluid, polishing debris, and other residues on the surface, and then dried before being passed to the next process. For this reason, substrate processing equipment equipped with a function for cleaning substrates and a function for drying substrates are used in semiconductor manufacturing processes.

[0003] For example, Patent Document 1 discloses a substrate processing apparatus having a function of drying a substrate. As shown in FIG. 2, the substrate processing apparatus 1 disclosed in Patent Document 1 includes a substrate holding unit 10 that holds and rotates a substrate W, a liquid nozzle 20, and a first back surface nozzle 71. The liquid nozzle 20 is located above the substrate W held by the substrate holding unit 10. The liquid nozzle 20 is configured to supply liquid to a front surface 2 of the substrate W by ejecting liquid from top to bottom. The first back surface nozzle 71 is located below the substrate W held by the substrate holding unit 10. The first back surface nozzle 71 is configured to supply liquid to a back surface 3 of the substrate W by ejecting liquid from bottom to top.

[0004] In the substrate processing apparatus 1 of Patent Document 1, the substrate holding unit 10 rotates the substrate W to remove the liquid on the substrate W. Also, in the substrate processing apparatus 1, the liquid nozzle 20 and the first back surface nozzle 71 supply liquid to the substrate W before the liquid on the substrate W is removed. As a result, a uniform film of liquid is formed covering the substrate W before the substrate W is dried. By forming a uniform film of liquid covering the substrate W before drying, the substrate processing apparatus 1 prevents watermarks from being formed on the substrate W during drying.

[0005] Furthermore, as shown in FIG. 2 of the substrate processing apparatus 1 of Patent Document 1, the substrate processing apparatus 1 includes a processing chamber 7 and a ventilation mechanism 8 disposed above a substrate holder 10. The ventilation mechanism 8 includes a fan 8A and a filter 8B that removes particles and dust in the air sent from the fan 8A. The ventilation mechanism 8 is configured to send clean air into the processing chamber 7. As a result, a downflow of clean air is formed within the processing chamber 7. By forming such a downflow of air, the ventilation mechanism 8 generates a regular airflow on the front surface 2 and back surface 3 of the substrate W, and can prevent adhesion of substrate contaminants due to turbulence in the airflow.

[0006] Also, a substrate processing apparatus having a function of cleaning a substrate is disclosed in Patent Document 2. As shown in FIG. 1, the substrate processing apparatus of Patent Document 2 includes a substrate holder 16 for holding a substrate W, a first cleaning liquid supply nozzle 26, and a first back surface nozzle 40. The first cleaning liquid supply nozzle 26 is configured to supply the cleaning liquid to the upper surface of the substrate W by discharging the cleaning liquid from top to bottom. On the other hand, the first back surface nozzle 40 is configured to supply the cleaning liquid to the lower surface of the substrate W by discharging the cleaning liquid from bottom to top. In the substrate processing apparatus of Patent Document 2, the first cleaning liquid supply nozzle 26 and the first back surface nozzle 40 supply the cleaning liquid to the substrate W, thereby cleaning both the front and back surfaces of the substrate W.

[0007] Furthermore, a substrate processing apparatus having a function of cleaning a substrate is also disclosed in Patent Document 3. As shown in FIG. 1, the substrate processing apparatus 1 of Patent Document 3 includes a substrate holding and rotating mechanism 20 for holding a substrate W, a nozzle 11, and a nozzle 15. The nozzle 11 is arranged in a direction from top to bottom. The nozzle 11 and the nozzle 15 are configured to supply the cleaning liquid to the front surface of the substrate W by discharging the cleaning liquid from bottom to top. On the other hand, the nozzle 15 is configured to supply the substrate cleaning liquid to the back surface of the substrate W by discharging the substrate cleaning liquid from bottom to top. In the substrate processing apparatus of Patent Document 3, the nozzle 11 and the nozzle 15 supply the substrate cleaning liquid to the substrate W, thereby cleaning both the front and back surfaces of the substrate W. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] International Publication No. 2021 / 251050 [Patent Document 2] JP 2004-235216 A [Patent Document 3] JP 2007-523463 A Summary of the Invention [Problem to be solved by the invention]

[0009] In a substrate processing apparatus, if liquid is not discharged from a nozzle for a long period of time, bacteria may grow in the liquid in the piping, and the liquid in the piping may deteriorate. For this reason, in the substrate processing apparatus, an operation of discharging the liquid in the piping from the nozzle in advance before the liquid is supplied from the nozzle to the substrate may be performed. This operation is called a dummy dispense. In the substrate processing apparatus, the old liquid accumulated in the piping is replaced with new liquid by performing the dummy dispense. As a result, the new liquid is supplied from the nozzle to the substrate.

[0010] When the first back surface nozzle 71 of the substrate processing apparatus of Patent Document 1 discharges liquid at the same flow rate as when the liquid is supplied to the substrate W to perform dummy dispensing, the force of the discharged liquid is too strong, and the discharged liquid may hit the filter 8B arranged above the first back surface nozzle 71. If the liquid hits the filter 8B, the filter 8B may become wet and clogged. As a result, the ventilation mechanism 8 may malfunction. For this reason, it is required that the flow rate of the liquid discharged from the first back surface nozzle 71 is adjusted during dummy dispensing, and the liquid is discharged from the first back surface nozzle 71 at a flow rate lower than when the liquid is supplied to the substrate W.

[0011] Furthermore, since the first rear surface nozzle 40 of Patent Document 2 and the nozzle 15 of Patent Document 3 also eject liquid upward, similar problems can occur if a filter is placed above these nozzles.

[0012] Furthermore, in order to conserve the liquid used during pre-dispense, it is desirable not to eject too much liquid from the nozzle.

[0013] In view of the above, an object of the present disclosure is to provide a substrate processing apparatus capable of adjusting the flow rate of liquid discharged from a nozzle. [Means for solving the problem]

[0014] A substrate processing apparatus according to one embodiment includes a nozzle for supplying liquid to a substrate, and a liquid supply device for supplying the liquid to the nozzle. The liquid supply device includes a supply pipe for fluidly connecting a liquid supply source and the nozzle, the supply pipe having a first pipe constituting a first flow path from a branch point to a junction point downstream of the branch point, and a second pipe constituting a second flow path from the branch point to the junction point, a first valve attached to the first pipe, a second valve attached to the second pipe, and a fluid resistance element attached to the second pipe for making the pressure loss of the liquid flowing through the second pipe greater than the pressure loss of the liquid flowing through the first pipe. [Brief description of the drawings]

[0015] [Figure 1] 1 is a front view illustrating a substrate processing apparatus according to an embodiment of the present disclosure. [Diagram 2] 2 is a fluid circuit diagram showing a flow path configuration of the liquid supplying device shown in FIG. [Diagram 3] 3 is a fluid circuit diagram showing a flow path configuration of a liquid supplying device different from the liquid supplying device shown in FIG. 2. [Figure 4] 4 is a fluid circuit diagram showing a flow path configuration of a liquid supplying device different from the liquid supplying device shown in FIGS. 2 and 3. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals and redundant description will be omitted.

[0017] <Substrate Processing Apparatus 100> FIG. 1 is a front view showing a schematic diagram of a substrate processing apparatus 100 according to an embodiment of the present disclosure. The substrate processing apparatus 100 is an apparatus for processing a substrate W. Referring to FIG. 1, the substrate processing apparatus 100 includes a substrate holding device 110 for holding and rotating the substrate W, and a control device 190. The substrate W processed by the substrate processing apparatus 100 is a substrate polished by a chemical mechanical polishing process (CMP) and is a substrate after cleaning. Examples of cleaning methods include liquid cleaning (pure water, chemical liquid, etc.), mechanical cleaning (sliding with a roll, pencil, etc.), and further cleaning that combines liquid cleaning and mechanical cleaning. The substrate W has a surface 102 that has been subjected to a planarization process.

[0018] The substrate holding device 110 includes a plurality of chucks 111 for holding the peripheral portion of the substrate W, and a rotation motor 112 connected to the plurality of chucks 111. The plurality of chucks 111 are configured to hold the substrate W horizontally. The rotation motor 112 is electrically connected to a control device 190. The operation of the rotation motor 112 is controlled by the control device 190. The substrate W held by the chucks 111 is rotated around an axis CP of the substrate holding device 110 by the rotation motor 112. The substrate holding device 110 is configured to hold the substrate W with the center O of the substrate W aligned with the axis CP.

[0019] The substrate processing apparatus 100 also includes a liquid supply module 124 for supplying liquid to the substrate W, a solvent supply module 134 for supplying an organic solvent to the substrate W, an inert gas supply module 154 for supplying an inert gas to the substrate W, a first backside supply module 169 for supplying liquid to the substrate W, and a second backside supply module 170 for supplying an inert gas to the substrate W.

[0020] The liquid supply module 124 includes a liquid nozzle 120 for supplying liquid to the substrate W, a liquid supply pipe 121 for supplying liquid to the liquid nozzle 120, and a liquid flow rate control valve 123. The liquid supply module 124 has a function of supplying liquid from the liquid nozzle 120 to the substrate W. More specifically, the liquid supply pipe 121 is configured to fluidly connect the liquid nozzle 120 to a liquid supply source 901. The liquid nozzle 120 is disposed above the substrate W held by the substrate holding device 110 and faces downward (facing the surface 102 of the substrate W). As a result, the liquid is supplied from the liquid supply source 901 through the liquid supply pipe 121 to the liquid nozzle 120, and is further supplied from the liquid nozzle 120 to the surface 102 of the substrate W. The liquid supplied by the liquid supply source 901 is, for example, ultrapure water (DIW: De-Ionized Water).

[0021] Further, a liquid flow rate control valve 123 is attached to the liquid supply pipe 121. The liquid flow rate control valve 123 is configured to open and close the flow path of the liquid supply pipe 121, and has a function of adjusting the flow rate of the liquid flowing through the liquid supply pipe 121 (the flow rate of the liquid supplied to the substrate W). In addition, the liquid flow rate control valve 123 is controlled by a control device 190.

[0022] The solvent supply module 134 includes a solvent nozzle 130 for supplying an organic solvent to the substrate W, a supply pipe 131 for supplying the organic solvent to the solvent nozzle 130, and a control valve 133. The solvent supply module 134 has a function of supplying the organic solvent from the solvent nozzle 130 to the substrate W. More specifically, the supply pipe 131 is configured to fluidly connect the solvent nozzle 130 to an organic solvent supply source 902. The solvent nozzle 130 is disposed above the substrate W held by the substrate holding device 110 and faces downward (facing the surface 102 of the substrate W). As a result, the organic solvent is supplied from the organic solvent supply source 902 through the supply pipe 131 to the solvent nozzle 130, and is further supplied from the solvent nozzle 130 to the surface 102 of the substrate W. The organic solvent supplied by the organic solvent supply source 902 is, for example, a liquid or gas, and includes IPA (isopropyl alcohol) and a fluorine-based solvent containing alcohol.

[0023] In addition, a control valve 133 is attached to the supply pipe 131. The control valve 133 is configured to open and close the flow path of the supply pipe 131, and has a function of adjusting the flow rate of the organic solvent flowing through the supply pipe 131 (the flow rate of the organic solvent supplied to the surface 102 of the substrate W). In addition, the control valve 133 is controlled by the control device 190.

[0024] The inert gas supply module 154 includes an inert gas nozzle 150 for supplying an inert gas to the substrate W, an inert gas supply pipe 151 for supplying an inert gas to the inert gas nozzle 150, and an inert gas flow control valve 153. The inert gas supply module 154 has a function of supplying an inert gas from the inert gas nozzle 150 to the substrate W. The inert gas supply pipe 151 is configured to fluidly connect the inert gas nozzle 150 to an inert gas supply source 903. The inert gas nozzle 150 is disposed above the substrate W held by the substrate holding device 110 and faces downward (facing the surface 102 of the substrate W). As a result, the inert gas is supplied from the inert gas supply source 903 through the inert gas supply pipe 151 to the inert gas nozzle 150, and is further supplied from the inert gas nozzle 150 to the surface 102 of the substrate W. The inert gas supplied by the inert gas supply source 903 is, for example, nitrogen.

[0025] Further, an inert gas flow control valve 153 is attached to the inert gas supply pipe 151. The inert gas flow control valve 153 is configured to open and close the flow path of the inert gas in the inert gas supply pipe 151, and has a function of adjusting the flow rate of the inert gas flowing through the inert gas supply pipe 151 (the flow rate of the inert gas supplied to the surface 2 of the substrate W). Further, the inert gas flow control valve 153 is controlled by the control device 190.

[0026] The first back surface side supply module 169 includes a first back surface nozzle (nozzle) 171 for supplying liquid to the substrate W, and a liquid supply device 200. The first back surface side supply module 169 has a function of supplying liquid from the first back surface nozzle 171 to the substrate W. The first back surface nozzle 171 is located directly below the substrate W held by the substrate holding device 110, and is configured to eject liquid upward. The liquid supply device 200 is configured to supply liquid to the first back surface nozzle 171. The detailed configuration of the liquid supply device 200 will be described later.

[0027] The second back side supply module 170 includes a second back side nozzle 172 for supplying an inert gas to the substrate W, a second back side supply pipe 176 for supplying an inert gas to the second back side nozzle 172, and a second back side flow control valve 180. The second back side supply module 170 has a function of supplying an inert gas from the second back side nozzle 172 to the substrate W. More specifically, the second back side supply pipe 176 connects the second back side nozzle 172 to an inert gas supply source 90. 5. The second back surface nozzle 172 is located directly below the substrate W held by the substrate holding device 110 and is configured to eject the inert gas upward. Thus, the inert gas is supplied from the inert gas supply source 905 through the second back surface side supply piping 176 to the second back surface nozzle 172, and is further supplied from the second back surface nozzle 172 to the back surface 103 of the substrate W. The inert gas supplied by the inert gas supply source 905 is, for example, nitrogen.

[0028] In addition, a second back side flow control valve 180 is attached to the second back side supply piping 176. The second back side flow control valve 180 is configured to open and close the flow path of the inert gas in the second back side supply piping 176, and has a function of adjusting the flow rate of the inert gas flowing through the second back side supply piping 176 (the flow rate of the inert gas supplied to the back surface 3 of the substrate W). In addition, the second back side flow control valve 180 is controlled by the controller 190.

[0029] The substrate processing apparatus 100 further includes a nozzle movement module 160 for moving the liquid nozzle 120, the solvent nozzle 130, and the inert gas nozzle 150. The nozzle movement module 160 includes an arm 161 disposed above the substrate W held by the substrate holding device 110, a rotation motor 162 for rotating the arm 161, and a rotation shaft 163 connected to the rotation motor 162. The arm 161 has a length longer than the radius of the substrate W. The liquid nozzle 120, the solvent nozzle 130, and the inert gas nozzle 150 are attached to the tip of the arm 161. The rotation shaft 163 is connected to the other end of the arm 161.

[0030] The rotation motor 162 is electrically connected to the control device 190, and the operation of the rotation motor 162 is controlled by the control device 190. The rotation motor 162 rotates the rotation shaft 163 by a predetermined angle to rotate the arm 161 in a plane parallel to the substrate W. In other words, the rotation of the arm 161 moves the liquid nozzle 120, the solvent nozzle 130, and the inert gas nozzle 150 fixed to the arm 161 in the radial direction of the substrate W. During processing of the substrate W, the nozzle movement module 160 can move the liquid nozzle 120, the solvent nozzle 130, and the inert gas nozzle 150 together from the center of the substrate W toward the peripheral portion of the substrate W.

[0031] The control device 190 is configured to control the operation of the substrate holding device 110, the liquid supply module 124, the solvent supply module 134, the inert gas supply module 154, the first backside supply module 169, the second backside supply module 170, and the nozzle movement module 160. The control device 190 includes a storage device 190a in which a program is stored, and a calculation device 190b that performs calculations according to instructions included in the program. The calculation device 190b includes a CPU (Central Processing Unit), a GPU (Graphic Processing Unit), and the like that perform calculations according to instructions included in the program stored in the storage device 190a. The storage device 190a includes a main storage device (e.g., a random access memory) that can be accessed by the calculation device 190b, and an auxiliary storage device (e.g., a hard disk drive or a solid state drive) that stores data and programs. The program in the control device 190 also includes a recipe for the substrate processing device 100 to execute a processing method for the substrate W.

[0032] The substrate processing apparatus 100 further includes a partition 106 and a ventilation device 108 disposed above the substrate holding device 110 and the substrate W. The internal space of the partition 106 constitutes a processing chamber 107. The substrate holding device 110, the liquid nozzle 120, the solvent nozzle 130, the inert gas nozzle 150, the nozzle movement module 160, the first back surface nozzle 171, and the second back surface nozzle 172 are disposed inside the processing chamber 107. The partition 106 is provided with a door (not shown). The substrate W is carried into the processing chamber 107 through this door, and the processing chamber 107 is opened. The partition 106 is unloaded from the processing chamber 107. A clean air inlet 106a is formed in the upper part of the partition 106. An exhaust duct 109 is formed in the lower part of the partition 106. The ventilation device 108 is installed on the upper surface of the partition 106. The ventilation device 108 includes a fan 108A and a filter 108B. The filter 108B is located directly above the substrate holding device 110 and the substrate W held by the substrate holding device 110, and has a function of removing particles and dust from the air sent from the fan 108A. The ventilation device 108 sends clean air into the processing chamber 107 through the clean air inlet 106a and exhausts the gas inside the processing chamber 107 from the exhaust duct 9. As a result, a downflow of clean air is formed inside the processing chamber 107. In other words, the ventilation device 108 is configured to provide the downflow of air to the substrate W. By forming such a downflow of air, a regular airflow is generated on the front surface 102 and the back surface 103 of the substrate W, and adhesion of substrate contaminants due to turbulence of the airflow is suppressed.

[0033] <Liquid supply device 200> Fig. 2 is a fluid circuit diagram showing a flow path configuration of the liquid supply apparatus 200 shown in Fig. 1. A detailed configuration of the liquid supply apparatus 200 will be described with reference to Fig. 2. With reference to Fig. 2, the liquid supply apparatus 200 includes a supply pipe 220, a first valve 242, a second valve 244, and a fluid resistance element 246.

[0034] The supply pipe 220 is configured to fluidly connect the first back surface nozzle 171 to the liquid supply source 904. More specifically, the supply pipe 220 includes a first pipe 222, a second pipe 224, an upstream pipe 226, and a downstream pipe 228. The first pipe 222 constitutes a first flow path from the branch point 230 to a junction point 232 downstream of the branch point 230. The second pipe 224 constitutes a second flow path separate from the first flow path from the branch point 230 to the junction point 232. The upstream pipe 226 constitutes a flow path from the liquid supply source 904 to the branch point 230. The downstream pipe 228 constitutes a flow path from the junction point 232 to the first back surface nozzle 171. Since the supply pipe 220 has such a configuration, the liquid supplied from the liquid supply source 904 can be supplied to the first back surface nozzle 171 through one of the first pipe 222 and the second pipe 224. In other words, the liquid supply device 200 can supply the liquid to the first back surface nozzle 171 through the first pipe 222 or through the second pipe 224. Note that the liquid supplied by the liquid supply source 904 is, for example, ultrapure water (DIW: De-Ionized Water). However, in another embodiment according to the present disclosure, the liquid supplied by the liquid supply source 904 may be a liquid other than ultrapure water.

[0035] The fluid resistance element 246 is attached to the second pipe 224 downstream of the second valve 244. The fluid resistance element 246 is, for example, an orifice, and has a function of making the pressure loss of the liquid flowing through the second pipe 224 larger than the pressure loss of the liquid flowing through the first pipe 222. That is, in the liquid supply device 200, the pressure loss of the liquid flowing through the second pipe 224 is larger than the pressure loss of the liquid flowing through the first pipe 222. As a result, the flow rate of the liquid discharged from the first back surface nozzle 171 through the second pipe 224 is smaller than the flow rate of the liquid discharged from the first back surface nozzle 171 through the first pipe 222. That is, in the substrate processing apparatus 100, the flow rate of the liquid discharged from the first back surface nozzle 171 changes depending on the pipes (the first pipe 222 and the second pipe 224) used. In other words, the substrate processing apparatus 100 can adjust the flow rate of the liquid discharged from the first back surface nozzle 171. In another embodiment according to the present disclosure, the fluid resistance element 246 may be a component other than an orifice that applies a pressure loss to the liquid flowing through the second pipe 224. For example, the fluid resistance element 246 may include a constriction that narrows the pipe diameter, a bend, or the like.

[0036] Also, the fluid resistance element 246 adjusts the flow rate of the liquid flowing through the second pipe 224 to, for example, 80 ml / min, 100 ml / min, 200 ml / min, 240 ml / min, 270 ml / min, or 50 to 300 ml / min. It may be configured to provide a pressure drop to the body.

[0037] Incidentally, if the liquid discharged from the first back surface nozzle 171 hits the filter 108B during dummy dispensing of the first back surface nozzle 171, the filter 108B may become wet and clogged, which may cause malfunction of the ventilation device 108 (see FIG. 1). In contrast, in the substrate processing apparatus 100, the fluid resistance element 246 is configured to give a pressure loss to the liquid flowing through the second pipe 224 so that the flow rate of the liquid discharged from the first back surface nozzle 171 is such that the liquid does not hit the filter 108B. Therefore, the liquid discharged from the first back surface nozzle 171 through the second pipe 224 does not hit the filter 108B. As a result, in the substrate processing apparatus 100, the filter 108B does not get wet and clogged, and malfunction of the ventilation device 108 caused by the clogging does not occur.

[0038] Furthermore, even if the second valve 244 fails and cannot be closed, the fluid resistance element 246 applies a pressure loss to the liquid flowing through the second pipe 224. As a result, the fluid resistance element 246 can reliably reduce the flow rate of the liquid flowing through the second pipe 224 and supplied to the first back surface nozzle 171 compared to the flow rate of the liquid flowing through the first pipe 222 and supplied to the first back surface nozzle 171. In other words, in the substrate processing apparatus 100, even if the second valve 244 fails, the liquid discharged from the first back surface nozzle 171 through the second pipe 224 is reliably prevented from hitting the filter 108B.

[0039] Moreover, the first valve 242 is attached to the first pipe 222 and is controlled by the control device 190. The first valve 242 is configured to open and close the first flow path of the first pipe 222. Thus, when the first valve 242 is opened, the liquid is supplied to the first back surface nozzle 171 via the first pipe 222. On the other hand, when the first valve 242 is closed, the liquid is stopped from being supplied to the first back surface nozzle 171 via the first pipe 222.

[0040] Moreover, the first valve 242 is, for example, a needle valve, and is configured so that the valve opening degree when opened can be adjusted. When the first valve 242 has such a configuration, an operator can adjust the valve opening degree of the first valve 242 when opened. Furthermore, the flow rate of the liquid flowing through the first pipe 222 depends on the valve opening degree of the first valve 242 when opened. Therefore, an operator can adjust the flow rate of the liquid flowing through the first pipe 222 by adjusting the valve opening degree of the first valve 242 when opened. That is, the substrate processing apparatus 100 can set the flow rate of the liquid discharged from the first back surface nozzle 171 through the first pipe 222 to a flow rate set by the operator. Note that, for example, the valve opening degree of the first valve 242 when opened may be adjusted so that the flow rate of the liquid flowing through the first pipe 222 is 1000 ml / min.

[0041] In this way, in the liquid supplying apparatus 200, the flow rate of the liquid supplied to the first back surface nozzle 171 via the first pipe 222 can be changed by the operator adjusting the valve opening degree when the first valve 242 is open. However, the task of adjusting the valve opening degree to change the flow rate can be time-consuming for the operator. In contrast, as described above, the liquid supplying apparatus 200 can supply the liquid to the first back surface nozzle 171 also via the second pipe 224. In other words, the liquid supplying apparatus 200 can supply the liquid to the first back surface nozzle 171 at different flow rates without the operator having to adjust the valve opening degree when the first valve 242 is open.

[0042] Further, the second valve 244 is attached to the second pipe 224 and is controlled by the control device 190. The second valve 244 is configured to open and close the second flow path of the second pipe 224. Thus, when the second valve 244 is opened, the liquid is supplied to the first back surface nozzle 171 via the second pipe 224. On the other hand, when the second valve 244 is closed, the liquid is stopped from being supplied to the first back surface nozzle 171 via the second pipe 224. The second valve 244 is, for example, an on / off valve. In the present disclosure, the on / off valve means a valve that can have only two configurations: a configuration in which the valve opening degree is fully open and a configuration in which the valve opening degree is fully closed. An example in which the valve opening degree when the second valve is open is adjustable will be described later.

[0043] Moreover, the liquid supply apparatus 200 further includes a flow meter 248 (see FIG. 2). The flow meter 248 is attached upstream of the branch point 230 of the supply pipe 220. In other words, the flow meter 248 is attached to the upstream pipe 226. The flow meter 248 is, for example, an ultrasonic flow meter, and has a function of measuring the flow rate of the liquid flowing through the upstream pipe 226. In this way, the flow meter 248 can measure the flow rate of the liquid discharged from the first back surface nozzle 171.

[0044] Note that the flow meter may be attached to a position other than the upstream position of the branch point 230 of the supply pipe 220 as long as it can measure the flow rate of the liquid discharged from the first back surface nozzle 171. For example, the flow meter may be attached to a position shown in FIG. 3. FIG. 3 is a fluid circuit diagram showing a flow path configuration of a liquid supply device 400 different from the liquid supply device 200. Referring to FIG. 3, the flow meter 448 is attached downstream of the junction 232 of the supply pipe 220. In other words, the flow meter 428 is attached to the downstream pipe 228. Even if the flow meter 428 is attached to such a position, it can measure the flow rate of the liquid discharged from the first back surface nozzle 171.

[0045] However, it is preferred that the flow meter be located upstream of the split point 230, such as flow meter 248, for reasons that will be explained below.

[0046] It is generally known that air bubbles are less likely to occur in a pressurized liquid than in a non-pressurized liquid. In the liquid supplying device 200 and the liquid supplying device 400, when the first valve 242 or the second valve 244 is closed, the upstream side of the first valve 242 or the second valve 244 is not in fluid communication with the first back surface nozzle 171, and is always subjected to the pressure of the liquid supplied from the liquid supply source 904. On the other hand, the downstream side of the first valve 242 or the second valve 244 is in fluid communication with the first back surface nozzle 171 even when the first valve 242 and the second valve 244 are closed. Therefore, the pressure of the liquid supplied from the liquid supply source 904 is not applied to the downstream side of the first valve 242 or the second valve 244. For these reasons, air bubbles are less likely to occur inside the supply pipe 220 on the upstream side of the first valve 242 or the second valve 244 than inside the supply pipe 220 on the downstream side of the first valve 242 or the second valve 244.

[0047] Furthermore, if the liquid whose flow rate is measured by the flow meter contains air bubbles, the flow meter may not be able to measure the flow rate properly. For this reason, it is preferable for the flow meter to measure the flow rate at a position where liquid containing few air bubbles flows. In other words, the flow meter can measure the flow rate more properly if it is disposed upstream of the first valve 242 or the second valve 244, where air bubbles are less likely to occur. Therefore, the flow meter 248 of the liquid supplying apparatus 200 can measure the flow rate more properly than the flow meter 448 of the liquid supplying apparatus 400.

[0048] Furthermore, the control device 190 may control the liquid supply device 200 to supply liquid to the first back surface nozzle 171 through the first pipe 222 when the substrate holding device 110 holds the substrate W (see FIG. 2). In other words, the control device 190 may control the liquid supply device 200 to open the first valve 242 and close the second valve 244 when the substrate holding device 110 holds the substrate W. On the other hand, when the substrate holding device 110 does not hold the substrate W (during dummy dispensing), the control device 190 may control the liquid supply device 200 to supply liquid to the first back surface nozzle 171 through the second pipe 224. In other words, the control device 190 may control the liquid supply device 200 to open the first valve 242 and close the second valve 244 when the substrate holding device 110 does not hold the substrate W (during dummy dispensing). The liquid supply apparatus 200 may be controlled to close the first valve 2 and open the second valve 244.

[0049] By the control device 190 performing such control, the first back surface nozzle 171 can supply liquid at a higher flow rate to the substrate W. On the other hand, the liquid supply device 200 can reduce the flow rate when the substrate holding device 110 is not holding the substrate W (during dummy dispensing).

[0050] As described above, if the liquid whose flow rate is measured by the flow meter contains air bubbles, the flow meter may not be able to measure the flow rate properly. Also, air bubbles are likely to accumulate in the horizontally extending portion of the pipe. For this reason, if the flow meter is attached to the horizontally extending portion of the pipe, a problem may occur in which the flow rate cannot be measured properly due to the influence of the accumulated air bubbles. In contrast, in the liquid supplying device 200, the flow meter 248 is attached to a portion of the supply pipe 220 that extends at an angle to the horizontal direction. Air bubbles are unlikely to accumulate in such a portion. In other words, in the liquid supplying device 200, the above problem is unlikely to occur.

[0051] <Liquid supply device 300> 4 is a fluid circuit diagram showing a flow path configuration of liquid supply apparatus 300, which is different from liquid supply apparatus 200. Liquid supply apparatus 300 can be used in substrate processing apparatus 100 in place of liquid supply apparatus 200. Liquid supply apparatus 300 has a part of the configuration in common with liquid supply apparatus 200. Below, liquid supply apparatus 300 will be described, focusing on the parts that differ from liquid supply apparatus 200, and the common configuration will be denoted by the same reference numerals in the drawings and description thereof will be omitted.

[0052] 4, the liquid supply device 300 includes a flow meter 248 attached to the upstream pipe 226. Therefore, the flow meter 248 can measure the flow rate of the liquid flowing through the second pipe 224 when the first valve 242 is closed and the second valve 244 is open.

[0053] Furthermore, while a flow meter generally has a range of flow rates that it can measure, in liquid supplying apparatus 300, flow meter 248 is configured so that the range that it can measure includes the flow rate of the liquid flowing through second piping 224. In other words, flow meter 248 is configured so as to be able to measure the flow rate of the liquid flowing through second piping 224. As a result, liquid supplying apparatus 300 provides the following operational effects.

[0054] If the flow meter 248 cannot measure the flow rate of the liquid flowing through the second pipe 224, the operator cannot know that a clog has occurred in the second pipe 224. In contrast, in the liquid supplying apparatus 300, the flow meter 248 can measure the flow rate of the liquid flowing through the second pipe 224. As a result, if a clog has occurred in the second pipe 224, the measurement value of the flow meter 248 approaches zero. As a result, the operator can know that a clog has occurred in the second pipe 224.

[0055] Referring again to FIG. 4, liquid supplying apparatus 300 includes second valve 344 instead of second valve 244 included in liquid supplying apparatus 200. Second valve 344 is attached to second pipe 224 and controlled by control device 190. Second valve 344 is configured to open and close the second flow path of second pipe 224. Second valve 344 is, for example, a needle valve. Unlike second valve 244, second valve 344 is configured to be adjustable in valve opening when open. Therefore, an operator can adjust the valve opening of second valve 344 when open. Furthermore, the flow rate of liquid flowing through second pipe 224 depends on the valve opening of second valve 344 when open. Therefore, an operator can adjust the flow rate of liquid flowing through second valve 344 by adjusting the valve opening of second valve 344 when open. That is, liquid supplying apparatus 300 can set the flow rate of the liquid discharged from first back surface nozzle 171 via second piping 224 to a flow rate set by the operator.

[0056] In addition, the specifications of the liquid supply source 904 are changed so that the pressure of the liquid supplied by the liquid supply source 904 is If the pressure of the liquid supplied by the liquid supply source 904 changes, the flow rate of the liquid flowing through the second pipe 224 changes. In this case, the flow rate of the liquid flowing through the second pipe 224 may fall outside the range of flow rates that can be measured by the flow meter 248. However, in the liquid supply device 300, as described above, an operator can adjust the flow rate of the liquid flowing through the second valve 344 by adjusting the valve opening degree of the second valve 344 when it is open. Therefore, even if the pressure of the liquid supplied by the liquid supply source 904 changes, the operator can adjust the flow rate of the liquid flowing through the second pipe 224 to prevent the flow rate of the liquid flowing through the second pipe 224 from falling outside the range of flow rates that can be measured by the flow meter 248.

[0057] 3 includes the second valve 244. The second valve 244 is an on / off valve, for example. However, in another embodiment according to the present disclosure, the liquid supplying apparatus 400 may include, instead of the second valve 244, a second valve 344 whose valve opening degree when open is adjustable.

[0058] [Note] A part or all of the above-described embodiments can be described as, but is not limited to, the following supplementary notes.

[0059] (Appendix 1) A substrate processing apparatus according to Appendix 1 is a substrate processing apparatus comprising: a nozzle for supplying a liquid to a substrate; and a liquid supply device for supplying the liquid to the nozzle, wherein the liquid supply device comprises a supply piping for fluidly connecting a liquid supply source and the nozzle, the supply piping having a first piping that constitutes a first flow path from a branch point to a junction point downstream of the branch point, and a second piping that constitutes a second flow path from the branch point to the junction point, a first valve attached to the first piping, a second valve attached to the second piping, and a fluid resistance element attached to the second piping for making a pressure loss of the liquid flowing through the second piping greater than the pressure loss of the liquid flowing through the first piping.

[0060] The substrate processing apparatus according to Supplementary Note 1 can supply liquid to the nozzle via the first pipe or via the second pipe. That is, the substrate processing apparatus can adjust the flow rate of the liquid discharged from the nozzle. Furthermore, even if the second valve fails and cannot be closed, the fluid resistance element imparts a pressure loss to the liquid flowing through the second pipe. As a result, the fluid resistance element can reliably make the flow rate of the liquid flowing through the second pipe and supplied to the nozzle smaller than the flow rate of the liquid flowing through the first pipe and supplied to the nozzle.

[0061] (Appendix 2) The substrate processing apparatus according to claim 2 is the substrate processing apparatus according to claim 1, wherein the fluid resistance element is an orifice.

[0062] In the substrate processing apparatus according to supplementary note 2, the orifice increases the pressure loss of the liquid flowing through the second pipe.

[0063] (Appendix 3) The substrate processing apparatus according to Supplementary Note 3 is the substrate processing apparatus according to Supplementary Note 1 or 2, further comprising a ventilation device disposed above the substrate and configured to provide a downflow of air to the substrate.

[0064] According to the substrate processing apparatus of supplementary note 3, the ventilation device creates a downflow of air to generate uniform airflows on the front and back surfaces of the substrate. As a result, the substrate processing apparatus can prevent adhesion of substrate contaminants to the substrate due to turbulence of the airflow.

[0065] (Appendix 4) The substrate processing apparatus according to Appendix 4 is the substrate processing apparatus described in Appendix 3, wherein the ventilation device has a filter positioned directly above the substrate, the nozzle is positioned directly below the substrate and is configured to eject the liquid upward, and the fluid resistance element is configured to impart a pressure loss to the liquid flowing through the second piping so that the liquid ejected from the nozzle has a flow rate such that it does not hit the filter.

[0066] If the filter is hit by liquid, the filter may become wet and clogged, which may cause the ventilation device to malfunction. In contrast, in the substrate processing apparatus described in Appendix 4, the liquid discharged from the nozzle through the second piping does not hit the filter. Therefore, in this substrate processing apparatus, the filter does not get wet and clogged, and the ventilation device does not malfunction due to the clogging.

[0067] (Appendix 5) The substrate processing apparatus of Appendix 5 is the substrate processing apparatus of Appendix 1 or 2, comprising a substrate holding device for holding the substrate, and a control device, wherein the nozzle is configured to supply the liquid to the substrate held by the substrate holding device, and the control device controls the liquid supply device to supply the liquid to the nozzle via the first piping when the substrate holding device is holding the substrate, and the control device controls the liquid supply device to supply the liquid to the nozzle via the second piping when the substrate holding device is not holding the substrate.

[0068] The substrate processing apparatus according to supplementary note 5 can reduce the flow rate when the substrate holding device is not holding a substrate (during pre-dispense).

[0069] (Appendix 6) The substrate processing apparatus according to claim 6 is the substrate processing apparatus according to claim 1 or 2, wherein the first valve is configured so that a valve opening degree when opened is adjustable.

[0070] In the substrate processing apparatus according to supplementary note 6, the flow rate of the liquid discharged from the nozzle via the first pipe can be set to a flow rate set by an operator.

[0071] (Appendix 7) The substrate processing apparatus according to claim 7 is the substrate processing apparatus according to claim 1 or 2, wherein the second valve is configured so that a valve opening degree when opened is adjustable.

[0072] In the substrate processing apparatus according to supplementary note 7, the flow rate of the liquid discharged from the nozzle via the second pipe can be set to a flow rate that is set by an operator.

[0073] (Appendix 8) The substrate processing apparatus according to claim 8 is the substrate processing apparatus according to claim 1 or 2, wherein the liquid supply device includes a flow meter for measuring a flow rate of the liquid supplied to the nozzle by the liquid supply device.

[0074] The substrate processing apparatus according to claim 8 can measure the flow rate of the liquid discharged from the nozzle by using a flow meter.

[0075] (Appendix 9) The substrate processing apparatus according to claim 9 is the substrate processing apparatus according to claim 8, wherein the flow meter is configured to measure a flow rate of liquid flowing through the second pipe.

[0076] If the flow meter cannot measure the flow rate of the liquid flowing through the second pipe, the operator cannot know that the second pipe is clogged. In contrast, in the substrate processing apparatus according to Supplementary Note 9, the flow meter is configured to be able to measure the flow rate of the liquid flowing through the second pipe. This allows the operator to know that the second pipe is clogged.

[0077] (Appendix 10) The substrate processing apparatus according to claim 10 is the substrate processing apparatus according to claim 8, wherein the flow meter is disposed upstream of the branch point.

[0078] In the substrate processing apparatus of Appendix 10, the flow meter can measure the flow rate at a position where liquid containing few air bubbles flows, and can measure the flow rate more appropriately than when it is positioned downstream of the first valve or the second valve.

[0079] (Appendix 11) The substrate processing apparatus according to claim 11 is the substrate processing apparatus according to claim 8, wherein the flow meter is attached to a portion of the supply pipe extending at an angle with respect to a horizontal direction.

[0080] In the substrate processing apparatus according to the appended claim 11, the flow meter is attached to a portion of the supply pipe that extends at an angle with respect to the horizontal direction. In such a portion, air bubbles are unlikely to accumulate. In other words, in this substrate processing apparatus, malfunctions of the flow meter due to air bubbles are unlikely to occur. [Explanation of symbols]

[0081] 100: Substrate processing device 108: Ventilation system 108B: Filter 110: Substrate holding device 171: 1st back nozzle (nozzle) 190: Control device 200,300,400:Liquid supply device 220: Supply piping 222: First pipe 224: Second piping 230: Divergence point 232: Confluence 242: First valve 244,344: Second valve 246: Fluid resistance element (orifice) 248,448:Flowmeter 904:Liquid source W: Substrate

Claims

1. A substrate processing apparatus, comprising: A nozzle for supplying liquid to the substrate; a liquid supply device for supplying the liquid to the nozzle; Equipped with The liquid supply device includes: a supply pipe for fluidly connecting a liquid supply source and the nozzle, the supply pipe including: a first pipe constituting a first flow path from a branch point to a junction point downstream of the branch point; and a second pipe constituting a second flow path from the branch point to the junction point; a first valve attached to the first pipe; a second valve attached to the second pipe; a fluid resistance element attached to the second pipe for making a pressure loss of the liquid flowing through the second pipe greater than a pressure loss of the liquid flowing through the first pipe; Equipped with Substrate processing equipment.

2. The substrate processing apparatus according to claim 1 , The fluid resistance element is an orifice. Substrate processing equipment.

3. 3. The substrate processing apparatus according to claim 1, a ventilation device disposed above the substrate and configured to provide a downflow of air to the substrate; Substrate processing equipment.

4. The substrate processing apparatus according to claim 3, the ventilation device includes a filter located directly above the substrate; the nozzle is positioned directly below the substrate and configured to eject the liquid upward; The fluid resistance element is configured to give a pressure loss to the liquid flowing through the second pipe so that the liquid discharged from the nozzle has a flow rate that does not hit the filter. Substrate processing equipment.

5. 3. The substrate processing apparatus according to claim 1, a substrate holding device for holding the substrate; A control device; Equipped with the nozzle is configured to supply the liquid to the substrate held by the substrate holding device; the control device controls the liquid supply device to supply the liquid to the nozzle via the first piping when the substrate holding device holds the substrate; the control device controls the liquid supply device to supply the liquid to the nozzle via the second piping when the substrate holding device is not holding the substrate. Substrate processing equipment.

6. 3. The substrate processing apparatus according to claim 1, The first valve is configured so that the valve opening degree when opened can be adjusted. Substrate processing equipment.

7. 3. The substrate processing apparatus according to claim 1, The second valve is configured so that the valve opening degree when opened can be adjusted. Substrate processing equipment.

8. 3. The substrate processing apparatus according to claim 1, the liquid supply device includes a flow meter for measuring a flow rate of the liquid supplied by the liquid supply device to the nozzle; Substrate processing equipment.

9. The substrate processing apparatus according to claim 8, The flow meter is configured to measure the flow rate of the liquid flowing through the second pipe. Substrate processing equipment.

10. The substrate processing apparatus according to claim 8, The flow meter is disposed upstream of the dividing point. Substrate processing equipment.

11. The substrate processing apparatus according to claim 8, The flow meter is attached to a portion of the supply pipe extending at an angle with respect to a horizontal direction. Substrate processing equipment.

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