Connector package for fastenerless circuit joining.

Abstract

A system for high voltage interconnection and interfacing may include a package for the circuit including a housing for the circuit, and a gate connector centrally located on one side of an exterior surface of the housing, the gate connector allowing wiring outside the package to be coupled to the gate connector from any of a plurality of orientations. In certain embodiments, the package for the housing further includes a pressure body near the exterior surface of the housing, and the system further includes leads extending from the circuit within the housing through openings in the housing and beyond the exterior surface, the leads being deformable over the pressure body at the exterior surface such that the pressure body can apply pressure to the leads against a contact surface of a second structure.

Description

[Technical field]

[0001] [STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT] This invention was made with Government support under Contract No. DE-EE0009135 awarded by the DOE. The Government has certain rights in this invention. [Background technology]

[0002] In power electronics, voltages are converted by converter circuits, which are coupled to other components via buses or other interconnect or interface structures. Traditionally, silicon-based semiconductors have been used heavily in such converter circuits. However, wide bandgap semiconductors are increasingly being used in converter circuits due to their many superior physical characteristics, such as operation over a wider range of temperatures, voltages, and frequencies. This combination results in faster and more efficient designs that can be implemented in more compact architectures.

[0003] To accommodate faster wide bandgap semiconductor transistors such as silicon carbide MOSFETs, converter circuits must significantly reduce parasitics (e.g., components that introduce inductance and capacitance) by a factor of 10 or more. Modern interconnect structures rely on bolts, nuts, and screws to connect to the package. The insertion of bolts and nuts causes loss of power density due to dimensional tolerances required for electrical isolation and mechanical placement. In addition, the use of large bolts, nuts, and screws creates additional dimensional increases in placement of the conductive plates of the interconnect structure by forcing the package housing design to align the semiconductor switch power terminals. These dimensional increases increase parasitics and degrade semiconductor switch performance. Summary of the Invention [Means for solving the problem]

[0004] A connector package for fastenerless circuit coupling is provided. Rather than connecting terminals with holes and corresponding screws or nuts, the terminals can be connected to the interconnect or interface structure by direct contact and pressure. The fastener-free package not only provides a compact, low parasitic architecture, but also allows greater flexibility in underlying circuit geometry and terminal location compared to fastener-based packaging. The connector package configuration described allows the entire package to be rotatable to accommodate different wire / package connection configurations.

[0005] A system for high voltage interconnection and interfacing can include a package for the circuit, the package including a housing for the circuit and a pressure body near an exterior surface of the housing, and leads extending from the circuit within the housing through openings in the housing and beyond the exterior surface, the leads being deformable over the pressure body at the exterior surface such that the pressure body can apply pressure to the leads against a contact surface of a second structure.

[0006] This Summary is provided to introduce various concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. [Brief description of the drawings]

[0007] [Figure 1A] 1 illustrates a system for high voltage interconnections and interfaces. [Figure 1B] 1 illustrates a system for high voltage interconnections and interfaces. [Diagram 2] Shown is a system of two assemblies sandwiching a busbar interface. [Figure 3A] 1 illustrates an example of a system pressurizer for high voltage interconnections and interfaces. [Figure 3B]1 illustrates an example of a system pressurizer for high voltage interconnections and interfaces. [Figure 4A] 1 shows an example of a package housing. [Figure 4B] 1 shows an example of a package housing. [Figure 5A] 1 shows yet another embodiment of a package. [Figure 5B] 1 shows yet another embodiment of a package. [Figure 5C] 1 shows yet another embodiment of a package. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] A connector package for fastenerless circuit coupling is provided. Rather than connecting terminals with holes and corresponding screws or nuts, the terminals can be connected to the interconnect or interface structure by direct contact and pressure. The fastener-free package not only provides a compact, low parasitic architecture, but also allows greater flexibility in underlying circuit geometry and terminal location compared to fastener-based packaging. The connector package configuration described allows the entire package to be rotatable to accommodate different wire / package connection configurations.

[0009] The described connector package can be directly connected to an interconnect or interface structure by compression (e.g., without fasteners such as nuts, bolts, and screws). This feature allows the package housing the freedom to use any geometric shape, the power and control terminals can be anywhere within the enclosure, and there are no alignment requirements or limitations on the number of terminals for a given switch. These factors provide the package with an optimal framework for reducing parasitics and balancing the transmission line effects between the switch dies for both the power and control connections such as the gate and Kelvin terminals. In fact, the entire package can be made rotatable to accommodate different wire / package connection configurations.

[0010] Advantageously, the parasitics of the entire circuit can be reduced, in some cases by an order of magnitude or more. Furthermore, the described package allows terminals on both sides of the interconnect or interface structure, whereas current solutions only allow single-sided placement. As a result, not only are parasitics reduced by a factor of 10, but unprecedented power densities can also be achieved.

[0011] The described packages are suitable for technologies incorporating wide bandgap silicon carbide and gallium nitride as well as ultra-wide bandgap diamond semiconductor switches. In some cases, the described packages are suitable for high voltage interconnects and interfaces ranging from 0.6 kV to 60 kV. Thus, as used herein, "high voltage" refers to voltages of 600 V or greater.

[0012] 1A and 1B show a system for high voltage interconnection and interfacing. FIG. 1A shows a side view showing how the leads are located. FIG. 1B shows a top view showing the positioning of the pressure body as well as the leads. Referring to FIG. 1A, the system for high voltage interconnection and interfacing can include a package for a circuit 105. The package can include a housing 100 for the circuit 105 and a pressure body 110 near the exterior surface of the housing 100. The package can further include leads 115 that extend from the circuit 105 in the housing 100 through an opening 120 in the housing 100 and beyond the exterior surface, and the leads 115 can be deformed on the pressure body 110 at the exterior surface so that the pressure body 110 can apply pressure to the leads 115 against a contact surface of a second structure, such as a busbar interface seen in FIG. 2. The circuit 105 can be a power electronics circuit, such as a power electronics circuit including wide band gap transistors. The leads 115 can be a connection between the circuit and any external element, such as a second structure. The lead 115 can be, for example, a wire and can include an insulating coating on a portion of the lead 115. The lead 115 can also include an external lead package that can be made at least in part from a more durable material to prevent damage to the lead 115 when subjected to the action of the pressure body 110.

[0013] 1B, there may be at least one pressure body 110 spaced across the exterior surface of the housing 100. The pressure bodies 110 may be, for example, evenly spaced across the exterior surface. Although four pressure bodies 110 are shown, fewer or more pressure bodies may be used. One or more pressure bodies 110 may be positioned proximate to corresponding openings 120 that allow leads 115 to pass through the surface of the housing 100. In FIG. 1B, only one of the leads is shown deformed above the pressure body 110 as seen on the right side of FIG. 1A.

[0014] FIG. 2 shows a system of two assemblies sandwiching a busbar interface. With reference to FIG. 2, the assembly 200 can be formed from a number of packages 205. Each package can be constructed as described with respect to FIGS. 1A and 1B, by way of example. The assembly can further include a heat sink 210. The heat sink 210 can be formed from individual heat sinks for each package, or can be a larger heat sink to which the packages of the assembly are coupled. The assembly 200 is coupled to a busbar interface 215. The busbar interface can be used to couple one or more circuits (e.g. housed in the package 205) with an external bus or system. Thus, the leads 220 of the package 205 are in physical and electrical contact with contact surfaces of a second structure in the form of conductive pads on the busbar interface 215, due to pressure exerted by a corresponding pressure body on the exterior surface of the package housing against the deformed leads 220 thereon. Because the leads 220 can be connected to the busbar interface 215 by mechanical pressure applied by a pressure body rather than by screws and bolts, the entire package can be rotated to accommodate different wire / package connection configurations.

[0015] A second assembly 230 formed from at least a second package 235 may face the first assembly 200 across the busbar interface 215. The second assembly 230 may be the same or similar to the first assembly 200, for example, including a second package 235 and a heat sink 240. The second package 235 may be configured as described with respect to Figures 1A and 1B. For example, the second package 235 may include a second housing for a second circuit, a second pressure body near an outer surface of the second housing, and a second lead 245 extending from the second circuit in the second housing through an opening in the second housing and beyond the outer surface, the second lead 245 deforming on the second pressure body at the outer surface such that the second pressure body can apply pressure to the second lead 245 against a second contact surface 250 of the busbar interface 215 (in this case the second contact surface is the surface of the busbar interface 215 opposite that contacted by the first assembly 200).

[0016] 3A and 3B show examples of pressure bodies for systems for high voltage interconnection and interfacing. FIG. 3A shows a view of the pressure body independent of the system and housing. The pressure body can include some type of insert 302, a potential energy storage device 304, and a base 306. The insert 302 can be wider at one end to improve contact. The insert 302 can be made of a variety of materials including conductive and non-conductive materials such as brass. The potential energy storage device 304 can be a variety of different types of devices, such as stacked Belleville washers, as shown. Other spring or pneumatic systems could be used. The base 306 can be used to fix the pressure body relative to the housing or to better maintain the potential energy by providing a hard surface that does not flex and reduce the stored energy. Referring to FIG. 3B, a cross-sectional view of the pressure body can be seen housed in a support for the pressure body in a housing. As described with respect to FIGS. 1A and 1B, the leads 308 can receive pressure from the pressure body as a result of deforming on the pressure body.

[0017] Figures 4A and 4B show examples of the housing of the package. Figure 4A shows the peripheral substructure of the housing, and Figure 4B shows the completed housing. With reference to Figure 4A, the peripheral substructure of the housing can include ribs 405, mounting portions 410, and supports 415 for the pressure body. The housing can be at least partially constructed of an insulating material, such as polyphenylene sulfide resin.

[0018] The ribs 405 allow wires or other materials to be routed around the housing. The ribs 405 can also maximize creepage distance along the surface. The mountings 410 allow the housing, and thus the entire package, to be attached to another surface, such as a base plate or a lid. The housing can be attached to allow for improved stabilization, access to additional heat sinks, or the addition of modules, such as measurement tools. The mountings 410 can be, for example, threaded holes and corresponding screws. The supports 415 for the pressure bodies can accommodate the pressure bodies and separate other internal parts of the package from the pressure bodies to allow clearance. The supports 415 can also ensure that the maximum force is applied towards the outer surface by increasing the force exerted by the corresponding pressure bodies by providing a hard surface that maintains rigidity. With reference to FIG. 4B, the finished housing can be seen. The pressure bodies 420 and associated leads 425 can be seen. The outer surface can include divots and slits 430 to allow for further wiring. On the periphery, laser marking can be used to label the specific system.

[0019] 5A-5C show further embodiments of the package. Referring to FIG. 5A, a schematic diagram can be seen showing how a gate connector can be added to the circuit diagram seen in FIG. 1A. The circuit 505 within the package 500 can extend to the exterior of the housing of the package 500 by leads 510 that pass through an opening in the housing. However, the circuit 505 can also be coupled to internal wiring that is connected to a gate connector 515 that also serves as an opening to couple the circuit 505 to the exterior of the package 500.

[0020] With reference to FIG. 5B, the gate connector 515 can be seen in the design of the package 500. The gate connector 515 can be a female gate connector 520 as seen in FIG. 5B. The gate connector 515 can be located in the center of one side of the package 500 and can be located on the same outer surface as the pressing body. The package 500 can feature ribs (e.g., ribs 405 in FIG. 4A) that allow wiring from outside the package to reach the gate connector 515 from multiple directions, for example, around the periphery. With reference to FIG. 5C, the gate connector 515 can alternatively be a male gate connector 525. The gate connector 515 can be rotatable. The female gate connector 520 can be configured to allow connection with a male connector / wire from any direction, for example, by having a circular acceptor that does not require a specific orientation. The male gate connector 525 can be rotated such that the "L" shape allows connection in any direction (e.g., from a rib on the surface).

[0021] Advantageously, by incorporating the gate connector 515 at a central location in the package 500, the impedance distribution between the circuits (e.g., circuit 105) within the package housing can be optimized for wide and ultra-wide bandgap circuits. Furthermore, the ribs allow the gate connection to be accessible from any direction, thereby minimizing the length of the gate connection to its driver. Furthermore, the rotatability of the gate connector supports connection from various directions. Indeed, as seen in FIG. 5B, the female gate connector 520 (or the male gate connector 525 seen in FIG. 5C) can be rotated to support connection from at least four directions 530A, 530B, 530C, and 530D. Furthermore, the gate connector 515 configuration (e.g., of the female gate connector 520 and / or the male gate connector 525) can be applied to packages that do not include pressure body-based interconnects.

[0022] As mentioned above, the entire package is rotatable to accommodate different wire / package connection configurations. For example, as shown in Figures 1B and 5B, the package can have four pressing bodies (each of which may have a corresponding lead) that are symmetrically positioned about a central axis (e.g., the gate connector). If the package is rotated, for example, 90 degrees, it can be easily connected to the busbar interface as before the rotation. The rotational ability of the gate connector can aid in the rotational ability of the package.

[0023] In some cases, an interconnect and interface system includes a package for the circuitry and a gate connector positioned in the center of one of the exterior surfaces of the housing. The package includes a housing for the circuitry. The gate connector allows wiring outside the package to be coupled to the gate connector from any of a number of orientations (e.g., four orientations 530A, 530B, 530C, and 530D).

[0024] Optionally, the housing in any of these cases includes ribs that allow wiring outside the package to reach the gate connector from multiple directions. Optionally, the gate connector in any of the above cases is rotatable. Optionally, the gate connector in any of the above cases is L-shaped. Optionally, the housing in any of the above cases includes ribs that allow wiring outside the package to reach the gate connector around the periphery.

[0025] In some cases, the circuit packaging of any of the above cases further includes a pressure body near an exterior surface of the housing and a lead extending from the circuit within the housing through an opening in the housing and beyond the exterior surface, the lead being deformable over the pressure body at the exterior surface such that the pressure body can apply pressure to the lead against a contact surface of the second structure. In some cases, the pressure body of any of the above cases is provided in multiple locations near the exterior surface of the housing and positioned symmetrically with respect to the rotatable gate connector. In some cases, the pressure body of any of the above cases includes stacked Belleville washers.

[0026] Optionally, the second structure in any of the above cases is a busbar interface. Optionally, the busbar interface in any of the above cases includes a contact surface on one side that contacts the lead and a second contact surface on the opposite side, and the system in any of the above cases further includes a second package for the second circuit and a second lead extending from the second circuit in the second housing through a second opening in the second housing and beyond the outer surface. The second package includes a second housing for the second circuit and a second pressure body near the outer surface of the second housing. The second lead is deformable over the second pressure body at the outer surface such that the second pressure body can apply pressure to the second lead against the second contact surface of the busbar interface.

[0027] Optionally, the circuit of any of the above cases is a power electronics circuit. Optionally, the power electronics circuit of any of the above cases includes wide bandgap transistors. Optionally, the housing of any of the above cases includes an insulating material. Optionally, the insulating material of any of the above cases is polyphenylene sulfide resin. Optionally, the system of any of the above cases further includes a heat sink.

[0028] Although subject matter has been described in language specific to structural features and / or operations, it is to be understood that the subject matter recited in the appended claims is not necessarily limited to the specific features or operations described above. Rather, the specific features and operations described above are disclosed as example forms of implementing the claims, and other equivalent features and operations are intended to be within the scope of the claims.

Claims

1. a package for the circuit including a housing for the circuit; a gate connector located in the center of a recessed surface on the outer surface of the housing and configured to be connectable to a complementary connector and associated wiring from outside the housing; the outer surface of the housing includes a slit communicating with the recessed surface; The slit is configured to receive the associated wiring of the complementary connector so that the associated wiring can reach the gate connector from multiple directions.

2. 10. The system of claim 1, wherein the gate connector has a circular acceptor and the complementary connector is rotatable relative to the gate connector, thereby allowing the complementary connector to be connected to the gate connector in any direction or orientation.

3. 2. The system of claim 1, wherein the gate connector is L-shaped.

4. 2. The system of claim 1, wherein the housing includes ribs that allow wiring outside the package to pass through a periphery to reach the gate connector.

5. 10. The system of claim 1, wherein the package for the circuit comprises: a pressure body adjacent the outer surface of the housing; a lead extending from the circuit within the housing through an opening in the housing and beyond the exterior surface, the lead being deformable over the pressure body at the exterior surface such that the pressure body can apply pressure to the lead against a contact surface of a second structure; The system further comprises:

6. The system according to claim 5 , wherein a plurality of the pressure bodies are provided near the outer surface of the housing and positioned symmetrically with respect to the gate connector.

7. 6. The system of claim 5, wherein the pressure body comprises a stack of Belleville washers.

8. 6. The system of claim 5, wherein the second structure is a bus interface.

9. 10. The system of claim 8, wherein the busbar interface includes a contact surface on one side that contacts the lead wire and a second contact surface on an opposite side, the system comprising: a second package for a second circuit, the second package including a second housing for the second circuit and a second pressure body adjacent an outer surface of the second housing; a second lead extending from the second circuit within the second housing through a second opening in the second housing and beyond the outer surface, the second lead being deformable over the second pressure body at the outer surface such that the second pressure body can apply pressure to the second lead against the second contact surface of the busbar interface; A system further equipped with.

10. 6. The system of claim 5, wherein the circuit is a power electronics circuit.

11. 11. The system of claim 10, wherein the power electronics circuitry includes wide bandgap transistors.

12. 10. The system of claim 1, wherein the housing comprises an insulating material.

13. 13. The system of claim 12, wherein the insulating material is polyphenylene sulfide resin.

14. The system of claim 1 further comprising a heat sink.

15. 1. A system for interconnection and interfacing, comprising: a package for a circuit, the package including a housing for the circuit and a pressure body adjacent an outer surface of the housing; a lead extending from the circuit within the housing through an opening in the housing and beyond the exterior surface, the lead being deformable over the pressure body at the exterior surface such that the pressure body can apply pressure to the lead against a contact surface of a second structure; A system with.

16. 16. The system of claim 15, further comprising a gate connector positioned in a center of the recessed surface of the exterior of the housing and configured to be connectable to a complementary connector and associated wiring from outside the housing; the outer surface of the housing includes a slit communicating with the recessed surface; The slit is configured to receive the associated wiring of the complementary connector so that the associated wiring can reach the gate connector from multiple directions.

17. 17. The system of claim 16, wherein the gate connector has a circular acceptor and the complementary connector is rotatable relative to the gate connector such that the complementary connector can be connected to the gate connector in any direction or orientation.

18. 17. The system according to claim 16, wherein a plurality of the pressure bodies are provided near the outer surface of the housing and positioned symmetrically with respect to the gate connector.

19. 16. The system of claim 15, wherein the circuit is a power electronics circuit.

20. 20. The system of claim 19, wherein the power electronics circuitry includes wide bandgap transistors.

21. 16. The system of claim 15, wherein the pressure body comprises a stack of Belleville washers.

22. 16. The system of claim 15, wherein the housing comprises an insulating material.

23. 23. The system of claim 22, wherein the insulating material is polyphenylene sulfide resin.

24. 16. The system of claim 15, further comprising a heat sink.

25. 16. The system of claim 15, wherein the housing includes ribs that allow wiring outside the package to pass around the periphery and reach the gate connector.

26. 16. The system of claim 15, wherein the second structure is a bus interface.

27. 27. The system of claim 26, wherein the busbar interface includes the contact surface on one side that contacts the lead wire and a second contact surface on an opposite side, the system comprising: a second package for a second circuit, the second package including a second housing for the second circuit and a second pressure body adjacent an outer surface of the second housing; a second lead extending from the second circuit within the second housing through a second opening in the second housing and beyond the outer surface, the second lead being deformable over the second pressure body at the outer surface such that the second pressure body can apply pressure to the second lead against the second contact surface of the busbar interface; A system further equipped with.

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