System for modifying a useful structure, a property measurement assembly, and a manufacturing assembly

Abstract

The system for deforming an effective structure (1) comprises a laminate comprising a continuous effective structure (1) and a buffer matrix (2), the laminate having an interface between the effective structure (1) and the buffer matrix (2), the interface having an average plane, compression means designed to apply a compression force (F) to the laminate along an axis perpendicular to the average plane of the interface, and shear means designed to apply a longitudinal shear force (f) to the buffer matrix (2) parallel to the average plane of the interface, the buffer matrix (2) being designed to transmit the shear force (f) to the effective structure (1) in the average plane of the interface, thereby deforming the effective structure (1).

Description

[Technical field]

[0001] The present invention relates to the technical field of engineering and science of deformations on materials.

[0002] The present invention relates in particular to - Operando property measurements of material deformation, - the manufacture of modern substrates or components containing modified materials; -Manufacture of adjustable components containing deformed materials, allowing for adjustment of the deformation of the material when the component is functioning It finds its applications in the fields of

[0003] prior art The deformation of a material can strongly affect its physical properties.

[0004] In particular, the electronic band structure of semiconductor materials changes significantly upon deformation, which is -Changes in carrier mobility, - A regular change in the energy of the forbidden band, possibly transitioning from indirect to direct types of bands, -Regular variation of the energy barriers of heterostructures (or quantum wells) This could result in:

[0005] These changes in electronic properties can offer important potential advantages.

[0006] Deformation of perovskite-type materials can further dramatically change the physical properties, in particular with phase changes leading to the appearance of, for example, ferroelectricity or ferromagnetism.

[0007] Known prior art systems for deforming the payload include devices that include diamond anvils. - an effective structure to be deformed; - two anvils made of a hard material (typically diamond, sapphire or ruby) on either side of the active structure; - compression means designed to apply a compression force to the anvil along a compression axis. Summary of the Invention [Problem to be solved by the invention]

[0008] Prior art systems of this type: (i) To obtain a tensile deformation of the effective structure along an axis perpendicular to the compression axis, significant pressures (on the order of several hundred atmospheres) must be applied to the anvils; (ii) despite the large anvil pressures, the tensile deformation achieved is very limited (e.g., on the order of 0.05%); (iii) The effective structure must have high mechanical strength to withstand large pressures. is not entirely satisfactory. [Means for solving the problem]

[0009] Description of the Invention The present invention aims to remedy some or all of the above mentioned drawbacks. To this end, the invention is directed to a system for modifying an active structure, said system comprising: a laminate comprising successively an effective structure and a buffer matrix, the laminate having an interface between the effective structure and the buffer matrix, the interface having an average surface; - compression means designed to apply a compressive force to the laminate along an axis perpendicular to the mean plane of the interfaces; - shear means designed to apply a longitudinal shear force parallel to the mean plane of the interface to the buffer matrix, The buffer matrix is ​​designed to transmit shear forces to the effective structure at the average plane of the interface, causing the effective structure to deform.

[0010] definition - "deformation" means modifying the stress state; "stress state" means stress resulting from internal forces acting between the deformed parts of the effective structure, the internal forces being either tensile or compressive. When the internal forces are zero or substantially zero, the expression relaxed state is used to mean the corresponding stress state.

[0011] "useful structure" means a structure which comprises the material to be deformed. The useful structure may be a component. The useful structure may be a structure from which a component is manufactured. The component may be intended for application in particular in the fields of microelectronics, optics, optoelectronics, piezoelectrics, ferroelectrics, antiferroelectrics, pyroelectrics or spintronics.

[0012] - "laminate" means a vertically continuous component;

[0013] "Continuously" means from the lowest level of the stack to the highest level of the stack.

[0014] "Buffer matrix" means a material that covers the payload structure in such a way that it smooths out local variations in stresses applied to the payload structure during compression of the stack.

[0015] - "Average plane" means the reference plane at three points of the contact surface (defining the interface between the effective structure and the buffer matrix) as defined in standard ASTM F534, § 3.1.2 for measurement of warpage or standard ASTM F1390 for measurement of deflection.

[0016] Thus, in contrast to the prior art, a system of this kind according to the invention allows the deformation of a payload structure comprising a brittle material, thanks to the presence of a buffer matrix of this kind, which in fact allows an improvement in the uniformity of the load of the payload structure, thereby reducing the risk of fracture of the material to be deformed.

[0017] Furthermore, the shear means allows for much greater deformation of the effective structure along an axis perpendicular to the compression axis than the prior art.

[0018] Furthermore, the simultaneous action of the shear means and compression means can increase the strength of the interface between the useful structure and the buffer matrix by reducing the risk of separation and by improving the effectiveness with which shear forces are transmitted to the useful structure.

[0019] The system according to the invention may have one or more of the following features.

[0020] According to one aspect of the invention, the shearing means includes a member for holding the buffer matrix for movement in a longitudinal direction parallel to the average plane of the interface.

[0021] Thus, one advantage gained is that of obtaining a means of shearing external to the laminate that is easily usable in an industrial context.

[0022] According to one feature of the invention, the shearing means includes an articulated parallelogram designed to move the retaining member longitudinally.

[0023] The advantage thus offered by a mechanism having four bars (articulated to one another by pivot connections) is that it can be easily moved.

[0024] According to one feature of the invention, the retaining member is rotatable about an axis of rotation perpendicular to the mean plane of the interface.

[0025] One advantage thus gained is the ability to control the longitudinal axis of the shear force applied to the buffer matrix in a plane parallel to the average plane of the interface between the payload structure and the buffer matrix.

[0026] According to one aspect of the invention, the laminate comprises a rubber layer, a buffer matrix is ​​between the payload structure and the rubber layer, and the shear means comprises the rubber layer, the rubber layer designed to convert a compressive force into a longitudinal shear force parallel to the mean plane of the interface applied to the buffer matrix.

[0027] definition - "layer" means one layer or multiple sub-layers of the same type.

[0028] - "Rubber" means that the layer is made of a material based on natural or synthetic rubber. "Based" means that rubber is the primary and majority material that makes up the layer.

[0029] The advantage offered by the rubber layer is therefore that it provides a means of internal shear in the laminate. The rubber layer is very effective in converting compressive forces (perpendicular to the mean plane of the interfaces) into longitudinal shear forces (parallel to the mean plane of the interfaces). In fact, the rubber layer has interesting properties of elasticity and incompressibility, with Young's modulus ranging from 1 MPa to 100 MPa and Poisson's coefficient close to 0.5. Furthermore, the rubber layer can increase the uniformity of loading of the buffer matrix, which results in a good uniformity of deformation of the effective structure.

[0030] It can be shown that the pressure exerted on the laminate by the compression means and the thickness of the rubber layer are the two main parameters that allow the adjustment of the target deformation of the active structure (see equation below). TIFF2024543556000002.tif18127, where -σ V is the pressure associated with the compressive force applied to the laminate perpendicular to the interface, -ε L is the isotropic biaxial deformation of the effective structure / buffer matrix combination, -E is the Young's modulus of the rubber layer, -h is the height of the rubber layer when considered as a cylinder, - TIFF2024543556000003.tif18127, where r is the radius of the rubber layer when considered as a cylinder, - TIFF2024543556000004.tif15127, where E' L is the biaxial elastic modulus of the effective structure / buffer matrix combination, and t L is the thickness of the effective structure / buffer matrix combination.

[0031] The choice of a small thickness for the rubber layer must be compensated by a large pressure applied to the laminate. The choice of a large thickness for the rubber layer allows a reduction in the pressure required for a given lateral deformation. On the contrary, a larger pressure favors friction and is potentially useful to prevent slippage between the buffer matrix and the active structure or between the buffer matrix and the rubber layer.

[0032] Such shear means inside the laminate can be combined with shear means outside the laminate, which allows for biaxial (and possibly anisotropic) deformation of the effective structure in the average plane of the interface between the effective structure and the buffer matrix.

[0033] According to one feature of the present invention, the rubber layer comprises: Silicone-based polymers, preferably including polydimethylsiloxane, -vinyl ethylene acetate, -Polyurethane, -Polyacrylic, -butadiene, -butyl group-containing compounds, -EPDM rubber, fluoroelastomers, in particular perfluoroelastomers, -isoprene, - compounds containing nitrile groups, -polychloroprene, -Styrene-butadiene The present invention is made of a material selected from the following:

[0034] definition "EPDM" is an abbreviation for Ethylene-Propylene-Diene Monomer.

[0035] A particular advantage of polydimethylsiloxane (PDMS) is its high optical transparency in the visible and near infrared, a property that is of interest for the optical characterization of deformations of active structures.

[0036] According to one feature of the invention, the buffer matrix has a Young's modulus of 1 GPa or greater.

[0037] One advantage thus obtained is that of obtaining a buffer matrix that is elastic to compressive forces applied to the laminate. The material of the buffer matrix is ​​advantageously selected to have a Young's modulus that matches that of the effective structure, so that the gradient of the Young's modulus is as low as possible and the risk of cracking of the effective structure associated with localized non-uniform deformations is reduced. For the buffer matrix and the effective structure, the quantities corresponding to the thickness multiplied by the Young's modulus are preferably of the same order of magnitude.

[0038] According to one aspect of the invention, the effective structure is τ R1 The deformation ratio at break is denoted by τ R2 and has a deformation ratio at break of τ R2 >τ R1 Meet the conditions.

[0039] Thus, one advantage gained is that it protects the payload structure from cracking or breaking during compression of the laminate.

[0040] According to one aspect of the invention, the buffer matrix comprises: polymers, preferably polyimides, polycarbonates, polyetherimides, polyamide-imides, polyethylene, glass, polyetheretherketones, polypropylene, polymethylmethacrylate, polyethersulfones, polyvinylchloride, polystyrene, polyethylene terephthalate, -Ceramic, preferably SiN, SiC, Al 2 O 3 It is made of a material selected from the following:

[0041] In accordance with one aspect of the present invention, the effective structure comprises: - Structures based on semiconductor-based materials, - structures based on perovskite-based materials, -Photonic crystal structure, - Structures based on composite materials, -crystal, -metal, -polymer, -ceramic, -Chalk, -cement is selected from.

[0042] definition By "based on" it is meant that the corresponding material is the primary or majority material that makes up the active structure.

[0043] According to one feature of the invention, the compression means comprises a lower plate and an upper plate designed to fit tightly around the periphery of the stack.

[0044] definition The terms "lower" and "upper" indicate the relative position of the corresponding plates (with respect to the stack in the vertical direction): a lower plate is located below the stack and an upper plate is located above the stack.

[0045] According to one feature of the invention, the upper plate has an uneven surface in contact with the rubber layer, the uneven contact surface being geometrically designed such that the rubber layer converts the compression force into a longitudinal shear force parallel to the mean plane of the interface that is anisotropically applied to the buffer matrix.

[0046] One advantage thus obtained is that it allows anisotropic biaxial deformation of the effective structure in the average plane of the interface between the effective structure and the buffer matrix without the need for shear means external to the laminate.

[0047] In accordance with one feature of the invention, the laminate includes an anti-slip layer between the payload structure and the buffer matrix, the anti-slip layer having a coefficient of friction designed to hold the payload structure in place within the laminate.

[0048] One advantage thus obtained is that it prevents the buffer matrix from sliding on the useful structures, as well as preventing the buffer matrix from directly contacting the useful structures.

[0049] According to one feature of the invention, the laminate includes an adhesive film between the payload structure and the buffer matrix.

[0050] One advantage thus obtained is that it prevents the buffer matrix from sliding on the useful structures, as well as preventing the buffer matrix from directly contacting the useful structures.

[0051] The invention also aims at an assembly for measuring the properties of a useful structure to be deformed, said assembly comprising: a system according to the invention, a characteristic measuring device designed to measure the deformation of the effective structure, the characteristic measuring device preferably comprising: A spectrometer, preferably an X-ray diffractometer, a Raman spectrometer, a photoluminescence spectrometer, a reflectance spectrometer; An apparatus for measuring electrical resistivity, preferably by the four-point method or the Van Der Pauw method is selected from.

[0052] In this way, one advantage gained is that it is possible to obtain operando property measurements of the deformation of the effective structure, in other words to obtain measurements during deformation of the effective structure.

[0053] According to one aspect of the present invention, The compression means comprises a lower plate and an upper plate arranged in a tight fit around the stack. The laminate is a first rubber layer between the buffer matrix and the upper plate; a second rubber layer between the lower plate and the active structure; The laminate has an additional interface between the active structure and the second rubber layer, the additional interface having an average surface; the shear means comprises a first rubber layer designed to convert a compressive force into a longitudinal shear force parallel to the mean plane of the interface applied to the buffer matrix; The second rubber layer is designed to convert the compression force into a longitudinal shear force acting on the effective structure at the average plane of the additional interface.

[0054] Thus, one advantage provided by such first and second rubber layers is to obtain a high level of deformation of the effective structure along an axis perpendicular to the compression axis.

[0055] The object of the invention is an assembly for manufacturing a modified payload structure on a support substrate, the manufacturing assembly comprising: a system according to the invention, a supporting substrate; The laminate is formed on a supporting substrate.

[0056] One advantage thus obtained is that it is possible to produce advanced substrates or components that contain a deformation material of the active structure. By compressing the stack, it is possible to slide the active structure on the support substrate and then bond them so as to maintain the deformation. It is also possible to obtain tunable components that contain a deformation material, where the deformation of the material can be adjusted when the component is functioning. For example, if the active structure is a photonic crystal, the deformation can modify the period of the nanostructure.

[0057] According to one feature of the invention, the stack includes an air space below the useful structure that is designed to separate the useful structure from the supporting substrate.

[0058] One advantage thus obtained is that frictional forces between the support substrate and the effective structure are eliminated, and deformation of the effective structure is uninhibited.

[0059] According to one feature of the invention, the support substrate is permeable to air and the manufacturing assembly includes circulation means designed to circulate an air flow from the support substrate towards the air layer, the air flow creating a retention force that holds the payload structure in place within the stack.

[0060] Thus, one advantage gained is that the air layer is used as a cushion of air to hold the payload in place within the stack.

[0061] According to one feature of the invention, the circulation means includes a regulator designed to regulate the flow of air circulating within the air layer.

[0062] Thus, one advantage gained is the ability to control the retention of airflow.

[0063] The object of the invention is an assembly for manufacturing a modified payload structure on a support substrate, the manufacturing assembly comprising: a laminate comprising, in succession, a support substrate, an adhesive film, a useful structure, and a buffer matrix, the laminate having an interface between the useful structure and the buffer matrix, the interface having an average surface; - compression means designed to apply a compressive force to the laminate along an axis perpendicular to the mean plane of the interfaces; - shear means designed to apply a longitudinal shear force parallel to the mean plane of the interface to the buffer matrix, The buffer matrix is ​​designed to transmit shear forces to the effective structure at the average plane of the interface, causing the effective structure to deform.

[0064] In accordance with one aspect of the invention, the manufacturing assembly includes a separation layer between the adhesive film and the payload structure, the separation layer being designed to separate the support substrate when the separation layer is heat treated.

[0065] According to one feature of the invention, the adhesive film is made of a polymeric material and the manufacturing assembly comprises radiating means designed to radiate electromagnetic radiation to irradiate the adhesive film through a supporting substrate, the supporting substrate being transparent to the electromagnetic radiation. [Brief description of the drawings]

[0066] Other features and advantages will become apparent in the detailed description of the embodiments of the invention, which includes embodiments and which refers to the accompanying drawings. [Figure 1a] 1 is a schematic cross-sectional view of a system according to the present invention for providing a property measurement assembly before the stack is compressed; [Figure 1b] FIG. 1b is a view similar to FIG. 1a, but with the laminate in compression. [Figure 2a] FIG. 1b is a view similar to FIG. 1a, showing the presence of an anti-slip layer or adhesive film between the active structure and the buffer matrix. [Figure 2b] FIG. 2b is a view similar to FIG. 2a, but with the laminate in compression. [Figure 3a] FIG. 2 is a schematic cross-sectional view of a system according to the invention for providing a property measurement assembly, including shear means external to the laminate allowing deformation under tension of the active structure. [Figure 3b] FIG. 3a is a view similar to FIG. 3a, showing the presence of an anti-slip layer or adhesive film between the active structure and the buffer matrix. [Figure 4a] FIG. 2 is a schematic cross-sectional view of a system according to the invention for providing a characteristic measurement assembly, showing the presence of shear means external to the laminate allowing the compressive deformation of the active structure. [Figure 4b] FIG. 4a is a view similar to FIG. 4a, showing the presence of an anti-slip layer or adhesive film between the active structure and the buffer matrix. [Figure 5a]1 is a schematic cross-sectional view of a characteristic measurement assembly according to the present invention; [Figure 5b] FIG. 5b is a view similar to FIG. 5a, showing the presence of an anti-slip layer or adhesive film between the active structure and the buffer matrix. [Figure 6a] 1 is a schematic cross-sectional view of a manufacturing assembly according to the present invention before the laminate is compressed; [Figure 6b] FIG. 6b is a view similar to FIG. 6a, but with the laminate in compression. [Figure 7a] FIG. 6a is a view similar to FIG. 6a, showing the presence of an anti-slip layer or adhesive film between the active structure and the buffer matrix. [Figure 7b] FIG. 7b is a view similar to FIG. 7a, with the stack in compression. [Figure 8a] FIG. 2 is a schematic cross-sectional view of a manufacturing assembly according to the invention, including shear means external to the laminate allowing deformation under tension of the active structure. [Figure 8b] FIG. 8a is a view similar to FIG. 8a, showing the presence of an anti-slip layer or adhesive film between the active structure and the buffer matrix. [Figure 9a] 1 is a schematic cross-sectional view of a manufacturing assembly according to the present invention, including a rotational shear means external to the laminate; [Figure 9b] FIG. 9a is a view similar to FIG. 9a, showing the presence of an anti-slip layer or adhesive film between the active structure and the buffer matrix. [Figure 10] FIG. 2 is a schematic cross-sectional view of a stack of a system according to the invention for comprising a characteristic measurement assembly, showing a useful structure having a pattern covered by a buffer matrix. [Figure 11a] FIG. 2 is a schematic cross-sectional view of a manufacturing assembly according to the present invention, showing the presence of an air layer below the active structure. [Figure 11b] FIG. 2 is a schematic cross-sectional view of a manufacturing assembly according to the present invention, showing the presence of an air cushion below the payload structure. [Figure 12] 1 is a schematic partial cross-sectional view of a characteristic measurement assembly according to the present invention, illustrating deformation of the effective structure due to geometric frustration. [Figure 13]1 is a schematic partial cross-sectional view of a manufacturing assembly according to the present invention, illustrating deformation of the effective structure due to geometric frustration. [Figure 14] FIG. 2 is a schematic partial cross-sectional view of a system according to the invention, showing the presence of a stiffening material embedded in a rubber layer. [Figure 15a] 15A-15C are a set of schematic partial views in cross section of a system according to the invention, illustrating the evolution of the deformation of the rigid material along axis X in FIG. 14 when the effective structure is relaxed; [Figure 15b] 15A-15C are a set of schematic partial views in cross section of a system according to the invention, illustrating the evolution of the deformation of the rigid material along axis Y in FIG. 14 when the effective structure is relaxed. [Figure 16a] 15 is a graph showing the compressive force applied to the laminate perpendicular to the interface on the horizontal axis and the deformation rate of the effective structure along axis X of FIG. 14 on the vertical axis. [Figure 16b] 15 is a graph showing the compressive force applied to the laminate perpendicular to the interface on the horizontal axis and the deformation rate of the effective structure along axis Y in FIG. 14 on the vertical axis. [Figure 17a] FIG. 1 is a schematic cross-sectional view of a manufacturing assembly according to the present invention, showing the presence of a means for emitting electromagnetic (infrared) radiation configured to obtain a sliding interface between the useful structure and the adhesive (e.g., thermoplastic) film relative to the adhesive film. [Figure 17b] FIG. 17b is a cross-sectional view similar to FIG. 17a, showing compression of the laminate to deform the payload structure after the sliding interface has been achieved. [Figure 18a] 1 is a schematic cross-sectional view of a manufacturing assembly according to the present invention, showing the presence of an adhesive (eg, heat-set) film having a sliding interface and a payload structure. [Figure 18b] 18a, showing the presence of a means for emitting electromagnetic (ultraviolet) radiation arranged to interact with the adhesive film to fix the deformed state of the useful structure. [Figure 19a] FIG. 2 is a schematic cross-sectional view of a system according to the invention, showing the presence of a reinforcement integrated into the rubber layer before the laminate is compressed. [Figure 19b] FIG. 19b is a cross-sectional view similar to FIG. 19a, with the stack in compression. [Figure 20] FIG. 2 is a schematic cross-sectional view of a system according to the present invention showing an upper plate having an uneven surface and a rubber layer covered by a polymer layer having an uneven surface.

[0067] It should be noted that the above-mentioned figures are schematic and are not necessarily drawn to scale for ease of reading and understanding. These cross sections are perpendicular to the average plane of the interface between the active structure and the buffer matrix. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0068] For simplicity, identical components or components having the same functionality will be given the same references in the various embodiments.

[0069] system One of the objects of the invention is a system for deforming an effective structure 1, said system comprising: a laminate comprising in succession an effective structure 1 and a buffer matrix 2, the laminate having an interface between the effective structure 1 and the buffer matrix 2, the interface having an average surface; - compression means designed to apply a compression force F to the laminate along an axis Z'-Z perpendicular to the mean plane of the interfaces; - shear means designed to apply a longitudinal shear force f parallel to the mean plane of the interface to the buffer matrix 2, The buffer matrix 2 is designed to transmit a shear force f to the effective structure 1 in the average plane of the interface so as to deform the effective structure 1.

[0070] Initial length R along the longitudinal axis of shear force f 0 Stretching (or shortening) δ of effective structure 1 with respect to R are shown in Figures 1b, 2b, 6b, and 7b.

[0071] Laminate The effective structure 1 is τ R1 The deformation ratio at the time of destruction is shown in the table below. - Structures based on semiconductor-based materials, - structures based on perovskite-based materials, -Photonic crystal structure, - Structures based on composite materials, -crystal, -metal, -polymer, -ceramic, -Chalk, -cement may be selected from:

[0072] The material to be deformed in the effective structure 1 is a solid. As non-limiting examples, the effective structure 1 can be manufactured in the form of a two-dimensional (2D) material, including a thin or thick film, a film arranged in a pattern (as shown in FIG. 10), an array of nanometer filaments, a monolayer of one to several atoms. The advantage offered by a film arranged in a pattern is that the elastic deformation limit can be increased. In fact, the elastic deformation limit of a structure depends on its shape. The area of ​​the effective cross section (in the cross-sectional plane perpendicular to the axis Z'-Z of the compressive force F) varies inversely correlated with the elastic deformation limit. The effective structure 1 advantageously has a shape compatible with micro / nanotechnology. In other words, the effective structure 1 can have a thickness of a few nm to a few μm. By "thickness" we mean the dimension along the axis Z'-Z perpendicular to the average plane of the interface between the effective structure 1 and the buffer matrix 2. However, the effective structure 1 may also be macroscopic. If the effective structure 1 is macroscopic, its area may be several tens of cm 2 As a non-limiting example, the useful structure 1 may be a layer of silicon having a thickness of from 200 nm to 2 μm, inclusive.

[0073] Advantageously, the buffer matrix 2 has a Young's modulus of 1 GPa or more. R2 and has a deformation ratio at break of τ R2 >τ R1 It is advantageous to satisfy the following condition: The buffer matrix 2 is polymers, preferably polyimides, polycarbonates, polyetherimides, polyamide-imides, polyethylene, glass, polyetheretherketones, polypropylene, polymethylmethacrylate, polyethersulfones, polyvinylchloride, polystyrene, polyethyleneterephthalate, -Ceramic, preferably SiN, SiC, Al 2 O 3 Advantageously, it is made of a material selected from

[0074] The laminate advantageously comprises a rubber layer 3, the buffer matrix 2 being located between the useful structure 1 and the rubber layer 3. The rubber layer 3 comprises: -Silicone-based polymers, including polydimethylsiloxane (PDMS); -vinyl ethylene acetate, -Polyurethane, -Polyacrylic, -butadiene, -butyl group-containing compounds, -EPDM rubber, fluoroelastomers, in particular perfluoroelastomers, -isoprene, - compounds containing nitrile groups, -polychloroprene, -Styrene-butadiene Advantageously, it is made of a material selected from

[0075] If the buffer matrix 2 is a polyimide film and the rubber layer 3 is made of PDMS, the rubber layer 3 may be bonded to the buffer matrix 2 at room temperature using a specific reagent 3 mercaptopropyltrimethoxysilane (MPTMS). If the useful structure 1 is a silicon layer, the polyimide film may be bonded to the useful structure 1 using an adhesive (e.g. HD3007 or HD3008 from HD Microsystems™).

[0076] As shown in Figure 14 and Figures 15a and 15b, the laminate may include a rigid material 30 embedded in the rubber layer 3. By "rigid" we mean that the rigid material 30 has a Young's modulus of 100 MPa or more, preferably 1 GPa or more. The rigid material 30 is geometrically designed to have different tensile strengths in the axes X and Y, based on a single compressive force F applied to the laminate along the axis Z'-Z perpendicular to the mean plane of the interface, as shown in Figures 16a and 16b. Indeed, starting from a threshold value of the compressive force F, as shown in Figure 16a, the tensile strength along the axis X corresponds to the sum of the coefficients α and β, while the tensile strength along the axis Y corresponds to the coefficient β, as shown in Figure 16b. As a non-limiting example, the rigid material 30 may be a polymer, preferably a polyimide, if the rubber layer 3 is made of PDMS. When the active structure 1 is compressed in the vertical direction, the undulations of the rigid material 30 cause different lateral deformations along the axes X and Y. The undulating rigid material 30 has the same resistance to elongation along axis X, unless the rigid material 30 "unfolds", whereas the rigid material 30 has resistance to elongation along axis Y, regardless of its undulations. The undulations of the rigid material 30 disappear starting from a certain degree of compression. The resistance to elongation along the two axes X and Y becomes equal. As shown in Figures 16a and 16b, the deformation is initially rapid along axis X, because along this axis the rigid material 30 unfolds without resistance. As soon as the rigid material 30 unfolds under the effect of a normal pressure, the resistance of the rigid material 30 appears along axis X. The slope then becomes the same as the slope indicating the change along axis Y. This resistance to deformation is not related to the presence or state of the undulations.

[0077] As shown in Figures 19a and 19b, the laminate may include a reinforcement 31, made of a rigid material and integrated in the rubber layer 3, for example by a moulding process. The reinforcement 31 may have a Young's modulus of the order of 1 GPa. The reinforcement 31 may have a thickness of several hundreds of microns. The reinforcement 31 has a non-flat surface. The reinforcement 31 may have different shapes along an axis defining a plane parallel to the average plane of the interface between the effective structure 1 and the buffer matrix 2. The action of the compressive force F causes the reinforcement 31 to be flattened, favouring a tensile deformation of the buffer matrix 2 and thus of the effective structure 1. The reinforcement 31 may have a variable thickness (in other words a dimension perpendicular to the average plane of the interface between the buffer matrix 2 and the effective structure 1) so as to achieve a non-uniform deformation.

[0078] As shown in Figures 2a, 2b, 3b, 4b, 5b, 7a, 7b, 8b, 9b, the laminate can include an anti-slip layer 4 between the effective structure 1 and the buffer matrix 2, the anti-slip layer 4 having a coefficient of friction designed to hold the effective structure 1 in place within the laminate. Alternatively, the laminate can include an adhesive film 4' between the effective structure 1 and the buffer matrix 2.

[0079] Compression Method The compression means may include a lower plate 5a and an upper plate 5b designed to fit tightly around the stack.

[0080] The lower plate 5a and the upper plate 5b are rigid. By "rigid" we mean that the lower plate 5a and the upper plate 5b have a Young's modulus of 100 MPa or more, preferably 1 GPa or more.

[0081] 12 and 13, the upper plate 5b may have an uneven surface in contact with the rubber layer 3, which is geometrically designed such that the rubber layer 3 transforms the compressive force F into a longitudinal shear force f parallel to the mean plane of the interface, which is anisotropically applied to the buffer matrix 2. This is called deformation of the effective structure 1 with geometric frustration.

[0082] As shown in FIG. 20, the rubber layer 3 may be covered by a polymer layer 32 having an uneven surface 320. The upper plate 5b may have an uneven surface 51 configured to contact the polymer layer 32. The uneven surface 320 of the polymer layer 32 may have a different shape than the uneven surface 51 of the upper plate 5b. The different shapes of the uneven surface 51 of the upper plate 5b and the uneven surface 320 of the polymer layer 32 may be designed to obtain an asymmetry of the deformation that occurs, which may be, for example, uniaxial in compression along one axis or tension along another axis. The polymer layer 32 formed on the rubber layer 3 has a Young's modulus strictly greater than that of the rubber layer 3.

[0083] As shown in Figures 8a, 8b, 9a and 9b, the lower plate 5a may take the form of a frame designed to receive the stack.

[0084] shearing means As shown in Figures 3a, 3b, 4a, 4b, 8a, 8b, 9a and 9b, the shearing means can comprise a member 6 for holding the buffer matrix 2 so that it can be moved in a longitudinal direction parallel to the mean plane of the interface. The shearing means advantageously comprise an articulated parallelogram designed to move the holding member 6 in the longitudinal direction. The holding member 6 can advantageously rotate around an axis of rotation ω perpendicular to the mean plane of the interface. The holding member 6 can comprise two holding arms 60 arranged transversely of the buffer matrix 2. As shown in Figures 8a, 8b, 9a and 9b, the holding member 6 can be attached to a frame 5a. The frame 5a can advantageously rotate around an axis of rotation ω perpendicular to the mean plane of the interface. The centrifugal force generated by the rotation can thus deform the effective structure 1. The centrifugal force can be increased by adding weights around the buffer matrix 2. This type of shearing means is external to the stack.

[0085] The shear means advantageously comprise a rubber layer 3, which is designed to convert a compressive force F into a longitudinal shear force f parallel to the average plane of the interface, acting on the buffer matrix 2. Shear means of this kind are internal to the laminate and can be provided together with shear means external to the laminate, which allows to envisage a biaxial (possibly anisotropic) deformation of the effective structure 1 in the average plane of the interface between the effective structure 1 and the buffer matrix 2. It is likewise possible to use only shear means internal to the laminate and to eliminate the shear means external to the laminate.

[0086] The shear means may include a rigid structure around the rubber layer 3 to control the deformation of the rubber layer 3. More precisely, the rigid structure is geometrically designed to control the deformation of the rubber layer 3 in a plane parallel to the mean plane of the interface while converting the compressive force F into a longitudinal shear force f parallel to the mean plane of the interface applied to the buffer matrix 2. This kind of rigid structure can prevent biaxial deformation of the effective structure 1 in several directions on the mean plane of the interface between the effective structure 1 and the buffer matrix 2. As a non-limiting example, the rigid structure can be manufactured using a mold. By "rigid" it is meant that the rigid structure has a Young's modulus of 100 MPa or more, preferably 1 GPa or more.

[0087] Additional Equipment The system may include an enclosure designed to receive the laminate. The enclosure may include multiple walls designed to allow access to compression means and, if appropriate, shear means external to the laminate to be activated. This type of enclosure allows the laminate to be subjected to a thermal treatment (for example, a heat treatment) to obtain, for example, a specific operating point of the active structure 1. For example, the electrical conductivity of the active structure 1 may change depending on the temperature.

[0088] The system advantageously includes fixed side walls designed to fit laterally around the rubber layer 3. Side walls of this kind may be part of the mould. Side walls of this kind allow the control of the lateral deformation of the rubber layer 3, this is called frustrated deformation. It is likewise possible to provide a lubricant between the side walls and the laminate.

[0089] Characterization Assembly As shown in Figs. 5a and 5b, one of the objects of the invention is an assembly for measuring the properties of an effective structure 1 to be deformed, said assembly comprising: a system according to the invention, a characteristic measuring device 7 designed to measure the deformation of the useful structure 1, the characteristic measuring device 7 preferably A spectrometer, preferably an X-ray diffractometer, a Raman spectrometer, a photoluminescence spectrometer, a reflectance spectrometer; Preferably, an instrument for measuring electrical resistivity is selected, preferably by the four-point method or the Van Der Pauw method.

[0090] Other spectroscopic techniques are possible, such as light absorption, x-ray absorption, etc.

[0091] According to one embodiment, the compression means comprise a lower plate 5a and an upper plate 5b designed to seal tightly against the periphery of the stack; The laminate is a first rubber layer 3 between the buffer matrix 2 and the upper plate 5b; a second rubber layer 3' between the lower plate 5a and the active structure 1; The laminate has an additional interface between the effective structure 1 and the second rubber layer 3', the additional interface having an average surface; the shear means comprises a first rubber layer 3 designed to convert a compressive force F into a longitudinal shear force f parallel to the mean plane of the interface applied to the buffer matrix 2; The second rubber layer 3' is designed to convert the compressive force F into a longitudinal shear force f acting on the utility structure 1 in the average plane of the additional interface.

[0092] As a non-limiting example, the upper plate 5b can be made of polymethylmethacrylate (PMMA) and the lower plate 5a can be made of a metal such as Al. PMMA has the advantage of its stiffness and transparency (especially in the visible range). As shown in Figures 5a and 5b, the compression means can include two clamping screws 50, the clamping torque of which can be measured using a dynamometer screwdriver.

[0093] The first rubber layer 3 and the second rubber layer 3' are Silicone-based polymers, preferably including polydimethylsiloxane (PDMS), -Ethylene vinyl acetate, -Polyurethane, -Polyacrylic, -butadiene, -butyl group-containing compounds, -EPDM rubber, fluoroelastomers, in particular perfluoroelastomers, -isoprene, - compounds containing nitrile groups, -polychloroprene, -Styrene butadiene Advantageously, it is made of a material selected from

[0094] If the first and second rubber layers 3, 3' are made of PDMS, there is no need to glue them to the upper and lower plates 5b, 5a, respectively. Indeed, PDMS has a very high coefficient of friction due to its low Young's modulus.

[0095] As shown in FIG. 12, the lower plate 5a may have an uneven surface in contact with the second rubber layer 3′, the uneven contact surface being geometrically designed such that the second rubber layer 3′ converts the compression force F into a longitudinal shear force f that is applied to the effective structure 1 anisotropically in the average plane of the additional interface.

[0096] First Manufacturing Assembly As shown in Figs. 6a, 6b, 7a, 7b, 8a, 8b, 9a, 9b, 11a and 11b, one of the objects of the invention is an assembly for manufacturing a modified effective structure 1 on a support substrate S, said assembly comprising: a system according to the invention, a supporting substrate S, The laminate is formed on a supporting substrate S.

[0097] As a non-limiting example, the support substrate S may be Si, Ge, Al 2 O 3 (sapphire), and glass.

[0098] As shown in Figures 11a and 11b, the stack may include an air layer 8 underneath the effective structure 1, designed to separate the effective structure 1 from the support substrate S. The retaining members 6 for the buffer matrix 2 are advantageously arranged at the lateral edges of the stack, so as to define the air layer 8. After the effective structure 1 has been deformed, the air is removed from the air layer 8, for example by vacuum means, and the stack adheres to the support substrate S.

[0099] In the embodiment shown in Fig. 11b, the support substrate S is permeable to air and the manufacturing assembly comprises circulation means designed to circulate an air flow from the support substrate S towards the air layer 8, said air flow creating a retention force that holds the useful structure 1 in place within the stack. The circulation means advantageously comprises a regulator designed to regulate the air flow circulating within the air layer 8. The regulator may comprise an air compressor.

[0100] In a variant of the air layer 8, the support substrate S can include a temporary adhesive film on which the laminate is formed. The temporary adhesive film can be made of a material that can undergo a controllable phase change. The temporary adhesive film is subjected to a heat treatment designed to prevent final adhesion and to allow longitudinal sliding of the effective structure 1 (in the average plane of the interface between the temporary adhesive film and the effective structure 1).

[0101] In this respect, the manufacturing assembly can include an enclosure designed to receive the system and the support substrate S. The enclosure can include several walls designed to allow access to compression means, which can be actuated if suitable for shear means external to the stack. This type of enclosure makes it possible in particular to subject the temporary adhesive film (for example thermoplastic polyimide) to a heat treatment designed to modify the mechanical properties of the temporary adhesive film so as to allow the effective structure 1 to slide in the longitudinal direction, so that the effective structure 1 is deformed. Reducing the temperature of the heat treatment makes it possible to polymerize the temporary adhesive film again and to fix the deformed state of the effective structure 1. In a variant, a heat treatment (for example at a temperature between 80 ° C. and 120 ° C.) is applied to the support substrate S and the temporary adhesive film to limit the adhesive energy between the effective structure 1 and the temporary adhesive film, so that a sliding interface is obtained between the effective structure 1 and the temporary adhesive film. When the effective structure 1 is deformed, the adhesion between the effective structure 1 and the temporary adhesive film is optimized by either cooling the assembly to room temperature (direct adhesion) or by heating the assembly to 300°C while applying an adhesion pressure (thermal compression).

[0102] After the effective structure 1 is deformed on the support substrate S, the components covering the effective structure 1 (e.g., the anti-slip layer 4, the buffer matrix 2, the rubber layer 3) can be removed to expose the effective structure 1. The deformed effective structure 1 can be, for example, an oxide-oxide (e.g., SiO 2 ) adhesion, preferably with plasma (e.g., O, O 2 ) onto the final substrate. The support substrate S is then removed to complete the transfer of the deformed useful structure 1.

[0103] Second Manufacturing Assembly As shown in Figs. 17a, 17b, 18a and 18b, one of the objects of the invention is an assembly for manufacturing a modified effective structure 1 on a support substrate S, said assembly comprising: a laminate comprising, in succession, a support substrate S, an adhesive film FC, an effective structure 1 and a buffer matrix 2, the laminate comprising an interface between the effective structure 1 and the buffer matrix 2, the interface having an average surface; - compression means designed to apply a compression force F to the laminate along an axis Z'-Z perpendicular to the mean plane of the interfaces; shear means designed to apply a longitudinal shear force f parallel to the mean plane of the interface to the buffer matrix 2; The buffer matrix 2 is designed to transmit a shear force f to the effective structure 1 at the average plane of the interface, causing the effective structure 1 to deform.

[0104] The laminate can be obtained using a support substrate S of the SoP (Semiconductor on Polymer) type, on which a buffer matrix 2 is formed. A semiconductor layer 2 of the support substrate S of the SoP type forms the useful structure 1. A polymer layer of the support substrate S of the SoP type forms an adhesive film FC.

[0105] The laminate may comprise an adhesive film 4' between the useful structure 1 and the buffer matrix 2, which has an anti-slip function.

[0106] The compression means may include a lower plate 5a and an upper plate 5b designed to fit tightly against the laminate.

[0107] The manufacturing assembly may include a separation layer CD between the adhesive film FC and the useful structure 1, which is designed to separate the support substrate S when the separation layer CD is heat treated. As a non-limiting example, the separation layer CD may be made of a thermoplastic material. An alternative is for the adhesive film FC to have an inherent separation function.

[0108] The adhesive film FC is advantageously made of a polymer material. The manufacturing assembly can include radiation means 9 designed to emit electromagnetic radiation 90 to irradiate the adhesive film FC through a support substrate S, the support substrate S being transparent to the electromagnetic radiation 90. By way of non-limiting example, the support substrate S can be made of glass or sapphire.

[0109] According to one embodiment, the adhesive film FC is made of a thermoplastic polymer (e.g. polyimide) and the radiating means 9 are designed to radiate infrared electromagnetic radiation 90 at a wavelength that may be of the order of 1 μm. Thermoplastic polymers are not transparent to infrared radiation. This embodiment allows a so-called "cold wall" heating of the adhesive film FC. The electromagnetic radiation 90 passes through the infrared-transparent laminate material and heats the target infrared-non-transparent laminate material. The radiating means may include an infrared lamp 9 under the lower plate 5a. The radiating means 9 are switched off to fix the deformed state of the useful structure 1.

[0110] In one embodiment, the adhesive film FC is made of a thermosetting polymer (e.g. epoxy resin) and the radiating means 9 are designed to emit ultraviolet electromagnetic radiation 90. The ultraviolet electromagnetic radiation 90 is activated and polymerizes the adhesive film FC to fix the deformed state of the useful structure 1.

[0111] The present invention is not limited to the above-described embodiments, and those skilled in the art can consider their technically effective combinations and equivalent replacements.

Claims

1. A system for deforming an effective structure (1), comprising: a stack comprising successively an effective structure (1) and a buffer matrix (2), with an interface between said effective structure (1) and said buffer matrix (2), said interface having an average surface; - compression means designed to apply a compressive force (F) to said laminate along an axis (Z'-Z) perpendicular to the mean plane of the interfaces; shearing means designed to apply a longitudinal shear force (f) parallel to the mean plane of the interface to said buffer matrix (2); The buffer matrix (2) is designed to transmit the shear force (f) to the effective structure (1) in the average plane of the interface, thereby deforming the effective structure (1).

2. 2. The system of claim 1, wherein the shearing means comprises a holding member (6) for holding the buffer matrix (2) so that it can move longitudinally parallel to the mean plane of the interface.

3. 3. The system according to claim 2, wherein said shearing means comprises an articulated parallelogram designed to move the holding member (6) in said longitudinal direction.

4. 4. A system according to claim 2 or 3, wherein the holding member (6) is rotatable about an axis of rotation (ω) perpendicular to the mean plane of the boundary surface.

5. The laminate includes a rubber layer (3), The buffer matrix (2) is located between the effective structure (1) and the rubber layer (3), The shearing means includes the rubber layer (3), 4. The system according to claim 1, wherein the rubber layer (3) is designed to convert the compressive force (F) into a longitudinal shear force (f) applied to the buffer matrix (2) parallel to the mean plane of the interface.

6. The rubber layer (3) is - silicone-based polymers, preferably including polydimethylsiloxane (PDMS), - vinyl ethylene acetate, - polyurethane, - polyacrylic, -butadiene, -butyl group-containing compounds, - EPDM rubber, fluoroelastomers, in particular perfluoroelastomers, -isoprene, - compounds containing nitrile groups, - polychloroprene, - styrene-butadiene 6. The system of claim 5, made of a material selected from the group consisting of:

7. The system according to any one of claims 1 to 3, wherein the buffer matrix (2) has a Young's modulus of 1 GPa or more.

8. The effective structure (1) is τ Ｒ１ and has a deformation rate at break indicated by The buffer matrix (2) is τ Ｒ２ and has a deformation rate at break indicated by τ Ｒ２ >τ Ｒ１ The system according to any one of claims 1 to 3, which satisfies the above conditions.

9. The buffer matrix (2) is polymers, preferably polyimides, polycarbonates, polyetherimides, polyamide-imides, polyethylene, glass, polyetheretherketone, polypropylene, polymethyl methacrylate, polyethersulfone, polyvinyl chloride, polystyrene, polyethylene terephthalate, - ceramic, preferably SiN, SiC, Al ２ O ３ The system according to any one of claims 1 to 3, made of a material selected from the group consisting of:

10. The effective structure (1) is - structures based on semiconductor-based materials, - structures based on perovskite-based materials, - photonic crystal type structures, - structures based on composite materials, -crystal, -metal, -polymer, -ceramic, - Chalk, -cement The system according to any one of claims 1 to 3, wherein the system is selected from the group consisting of:

11. A system according to any one of claims 1 to 3, wherein the compression means comprises a lower plate (5a) and an upper plate (5b) designed to fit tightly around the periphery of the stack.

12. The compression means comprises a lower plate (5a) and an upper plate (5b) designed to fit tightly around the periphery of the laminate; 6. The system according to claim 5, wherein the upper plate (5b) has an uneven contact surface in contact with the rubber layer (3), the uneven contact surface being geometrically designed such that the rubber layer (3) converts the compressive force (F) into a longitudinal shear force (f) parallel to the mean plane of the interface, which is applied anisotropically to the buffer matrix (2).

13. The laminate comprises an anti-slip layer (4) between the active structure (1) and the buffer matrix (2), A system according to any one of claims 1 to 3, wherein the anti-slip layer (4) has a coefficient of friction designed to hold the effective structure (1) in place within the stack.

14. The system according to any one of claims 1 to 3, wherein the laminate comprises an adhesive film (4') between the useful structure (1) and the buffer matrix (2).

15. A characteristic measurement assembly for measuring a characteristic of an effective structure (1) to be deformed, comprising: a system according to any one of claims 1 to 3, a characteristic measuring device (7) designed to measure the deformation of said useful structure (1), The characteristic measuring device (7) preferably includes: a spectrometer, preferably an X-ray diffractometer, a Raman spectrometer, a photoluminescence spectrometer, a reflectance spectrometer; Apparatus for measuring electrical resistivity, preferably by the four-point method or the Van der Pauw method The characteristic measurement assembly is preferably selected from:

16. - the compression means comprise a lower plate (5a) and an upper plate (5b) designed to fit tightly around the stack; The laminate is a first rubber layer (3) between the buffer matrix (2) and the upper plate (5b); a second rubber layer (3') between the lower plate (5a) and the active structure (1); The laminate has an additional interface between the effective structure (1) and the second rubber layer (3'), the additional interface having an average surface; - the shear means comprises said first rubber layer (3) designed to convert said compressive force (F) into a longitudinal shear force (f) applied to said buffer matrix (2) parallel to the mean plane of said interface, the second rubber layer (3') is designed to convert said compressive force (F) into said longitudinal shear force (f) acting on said effective structure (1) in the mean plane of said additional interface; 16. The characteristic measurement assembly of claim 15.

17. A manufacturing assembly for manufacturing a modified effective structure (1) on a support substrate (S), said manufacturing assembly comprising: a system according to any one of claims 1 to 3, a supporting substrate (S), The laminate is formed on the support substrate (S). Manufacturing assembly.

18. 18. A manufacturing assembly according to claim 17, wherein the stack comprises an air layer (8) below the effective structure (1) designed to separate the effective structure (1) from the support substrate (S).

19. The support substrate (S) is permeable to air, 19. The manufacturing assembly according to claim 18, comprising circulation means designed to circulate an air flow from the support substrate (S) towards the air layer (8), said air flow generating a holding force that holds the effective structure (1) in place within the stack.

20. 20. A manufacturing assembly according to claim 19, wherein the circulation means comprises a regulator designed to regulate the air flow circulating in the air layer (8).

21. A manufacturing assembly for manufacturing a modified effective structure (1) on a support substrate (S), said manufacturing assembly comprising: a laminate comprising, in succession, said support substrate (S), an adhesive film (FC), said effective structure (1) and a buffer matrix (2), said laminate having an interface between said effective structure (1) and said buffer matrix (2), said interface having an average plane; - compression means designed to apply a compressive force (F) to said laminate along an axis (Z'-Z) perpendicular to said mean plane of the interface; - shear means designed to apply a longitudinal shear force (f) parallel to the mean plane of the interface to the buffer matrix (2); A manufacturing assembly, wherein the buffer matrix (2) is designed to transmit the shear force (f) to the effective structure (1) in the mean plane of the interface, causing the effective structure (1) to deform.

22. A separation layer is provided between the adhesive film (FC) and the effective structure (1), 22. A manufacturing assembly according to claim 21, wherein the separation layer is designed to separate the support substrate (S) when the separation layer is heat treated.

23. The adhesive film (FC) is formed from a polymer material, said manufacturing assembly comprising radiation means (9) designed to emit electromagnetic radiation (90) to irradiate said adhesive film (FC) through said support substrate (S), 23. A manufacturing assembly according to claim 21 or 22, wherein the support substrate (S) is transparent to the electromagnetic radiation (90).

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