Compositions containing copper corrosion inhibitors for removing photoresist and etching residues from substrates and uses thereof - Patents.com

Abstract

A stripper solution is provided for removing photoresist and etch residues. The disclosed and claimed compositions relate to stripper solutions containing triazine (eg, benzoguanamine) corrosion inhibitors for removing photoresist and etch residues.

Description

[Technical field]

[0001] Field

[0002] The disclosed and claimed subject matter relates to compositions for removing photoresist and etch residues from substrates and methods of using such compositions. The disclosed and claimed compositions are stripper solutions containing a triazine corrosion inhibitor for removing photoresist and etch residues. [Background technology]

[0003] Related Technology

[0004] In semiconductor wafer manufacturing, Wafer Level Packaging (WLP) is a technique used to package integrated circuits at the wafer level, which involves adding protective layers and electrical connections to the substrate before dicing. Typically, the interconnects are metal bumps that are fabricated from various processes including photolithography and metal deposition. The photolithography process creates structures with deep holes, and then the solder bump metal fills these holes. The bumps are then formed by removing the photoresist mask layer.

[0005] The photoresist layer is usually removed by a wet process using a photoresist stripper. The requirements for an effective photoresist stripper are not only the photoresist removal efficiency, but also good compatibility with the exposed substrate, such as metal bumps and copper substrates. Photoresist strippers and etch residue removers for removing photoresist and etch residue used in wafer level packaging are typically composed of different combinations of solvents, bases, corrosion inhibitors, optional co-solvents, and other additives. Conventional removers have DMSO (dimethyl sulfoxide) or NMP (N-methyl-2-pyrrolidone) as the solvent, and quaternary ammonium hydroxide or inorganic base or combinations thereof as the base. The base is an essential component for the removal of photoresist and etch residue. However, during the process of removing the photoresist layer, the copper substrate exposed to the photoresist stripper tends to undergo undesired etching. Therefore, it is very important that the photoresist stripper and etch residue remover does not erode copper during the cleaning process, which can be achieved by introducing an effective and robust copper corrosion inhibitor.

[0006] Corrosion inhibitors are used to suppress the etching of exposed copper substrates. Much effort has been made to find good copper corrosion inhibitors in photoresist strippers. Known copper corrosion inhibitors such as benzotriazole are effective in aqueous solutions. However, they do not work well in organic solvent-rich strippers that contain strong bases. Metal salts such as copper salts are used as effective corrosion inhibitors, but these salts have solubility and stability issues in photoresist strippers. Sugar alcohols are also used as copper corrosion inhibitors, but their efficiency in such organic solvent-rich strippers may not meet the requirements for copper protection.

[0007] Triazines and their derivatives have only been selectively used as copper corrosion inhibitors. For example, JP 2003-213463(A) discloses the use of triazine derivatives as corrosion inhibitors for copper or copper alloys in alkaline or acidic aqueous cleaning solutions for cleaning semiconductor devices with metal wiring. In JP 2003-213463(A), the alkaline solution is an aqueous ammonia solution and / or an aqueous tetramethylammonium hydroxide solution.

[0008] Therefore, there is a need to develop a photoresist stripper containing a copper corrosion inhibitor to effectively protect copper substrates with high photoresist removal efficiency. Summary of the Invention [Problem to be solved by the invention]

[0009] This Summary section is not intended to identify every embodiment and / or incrementally novel aspect of the disclosed and claimed subject matter. Instead, this Summary merely provides a preliminary discussion of different embodiments and corresponding points of novelty over the prior art and known techniques. For additional details and / or possible aspects of the disclosed and claimed subject matter and embodiments, the reader is directed to the Detailed Description section and corresponding figures of this disclosure, further discussed below.

[0010] The disclosed and claimed subject matter relates to photoresist strippers and etch residue remover solutions (collectively "stripper solutions") for removing or stripping (i) positive or negative tone photoresist, (ii) photoresist etch residue after an etching process, and / or (iii) etch residue from a substrate. The disclosed and claimed stripper compositions are particularly compatible with copper, even when applied at high spin speeds. [Means for solving the problem]

[0011] The disclosed subject matter comprises: (i) one or more base components comprising one or more of an amine, a quaternary ammonium hydroxide, an inorganic base, and combinations thereof; (ii) one or more organic solvents, and (iii) one or more triazine derivative corrosion inhibitors of formula (I), [ka] In the formula, each R 1 , R 2 , and R 3 are each independently selected from a hydrogen atom, a hydroxyl group, a mercapto group, an amino group, a carboxyl group, a phenyl group, a substituted phenyl group, an alkoxy group, or an alkyl group; one or more triazine derivative corrosion inhibitors, In one aspect of this embodiment, the present invention relates to a remover solution comprising, consisting essentially of, or consisting of R 1 , R 2 , and R 3 Two of them are -NH2.

[0012] In a further aspect, the solution optionally further comprises, consists essentially of, or consists of (iv) one or more second solvents. In a further aspect, the solution optionally further comprises, consists essentially of, or consists of (v) one or more non-triazine corrosion inhibitors. In a further aspect, the solution optionally further comprises, consists essentially of, or consists of (iv) one or more second solvents and (v) one or more non-triazine corrosion inhibitors. In one aspect of these embodiments, the triazine corrosion inhibitor is a guanamine compound. In one aspect of these embodiments, the triazine corrosion inhibitor is benzoguanamine. In one aspect of these embodiments, the (iv) one or more second solvents comprises, consists essentially of, or consists of water.

[0013] The disclosed and claimed subject matter further relates to the use and synthesis of the disclosed and claimed chemical formulations. Among other things, the photoresist stripper and etch residue remover solutions can be used to remove polymeric resist materials present in single layer or certain types of bilayer resists. For example, bilayer resists typically have a first inorganic layer covered with a second polymer layer, or they may have two polymer layers.

[0014] In another embodiment, the disclosed and claimed subject matter relates to a method of using a triazine derivative corrosion inhibitor to enhance the anti-corrosion properties of another non-triazine corrosion inhibitor (e.g., (v) one or more non-triazine corrosion inhibitors). In one aspect of this embodiment, the triazine corrosion inhibitor is a guanamine compound. In one aspect of this embodiment, the triazine corrosion inhibitor is benzoguanamine.

[0015] Other features and advantages of the disclosed and claimed subject matter will become apparent from the following more detailed description, taken in conjunction with example solutions illustrating the principles of the disclosed and claimed subject matter.

[0016] Embodiments of the disclosed and claimed subject matter provide one or more of the following benefits: a photoresist stripper and etch residue remover with good cleaning properties, high loading capacity, and excellent compatibility with passivation materials such as copper, silicon, silicon oxide, and polyimides.

[0017] The order of discussion of the various steps described herein is presented for clarity. In general, the steps disclosed herein may be performed in any suitable order. In addition, although each of the different features, techniques, configurations, etc. disclosed herein may be discussed in different places in this disclosure, it is intended that each of the concepts may be practiced independently of one another or in combination with one another, as appropriate. Thus, the subject matter disclosed and claimed may be embodied and considered in many different ways.

[0018] definition For the purposes of promoting an understanding of the claimed subject matter, reference will now be made to illustrated embodiments and specific language will be used to describe the same, it being understood, however, that no limitation of the scope of the claimed subject matter is intended thereby, and that such changes, further modifications, and further applications of the claimed principles as would normally occur to one of ordinary skill in the art to which the disclosure pertains are contemplated.

[0019] All references cited in this specification, including publications, patent applications, and patents, are herein incorporated by reference to the same extent as if each reference was individually and specifically indicated to be incorporated by reference and was set forth in its entirety herein.

[0020] The use of the terms "a," "an," and "the," and similar referents in the context of describing the disclosed and claimed subject matter (particularly in the context of the claims below) should be construed to encompass both the singular and the plural, unless otherwise indicated herein or otherwise clearly contradicted by context. The terms "comprising," "having," "including," and "containing" should be construed as open-ended terms (i.e., meaning "including, but not limited to"), unless otherwise indicated. The recitation of ranges of values ​​herein is merely intended to be used as a shorthand method of separately referring to each individual value falling within the range, unless otherwise indicated herein, and each individual value is incorporated herein by reference as if it were separately recited herein. All methods described herein may be performed in any suitable order, unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any examples or exemplary language (e.g., "such as") provided herein is intended merely to better illustrate the disclosed and claimed subject matter and does not impose limitations on the scope of that subject matter unless specifically asserted otherwise. No language in the specification should be construed as indicating any non-claimed element as essential to the practice of the disclosed and claimed subject matter.

[0021] Preferred embodiments of the disclosed and claimed subject matter are described herein, including the best mode known to the inventors for carrying out the disclosed and claimed subject matter. Variations of these preferred embodiments will become apparent to those skilled in the art upon reading the above description. The inventors anticipate that such variations will be employed by those skilled in the art as appropriate, and the inventors intend for the disclosed and claimed subject matter to be practiced otherwise than as specifically described herein. Accordingly, the disclosed and claimed subject matter includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law. Moreover, any combination of the above-described elements in all possible variations thereof is encompassed by the disclosed and claimed subject matter unless otherwise indicated herein or otherwise clearly contradicted by context.

[0022] For ease of reference, a "microelectronic device" or "semiconductor substrate" corresponds to a semiconductor wafer, flat panel display, phase change memory device, solar panel and other products including solar cell substrates, photovoltaic devices, and microelectromechanical systems (MEMS) manufactured for use in microelectronic, integrated circuit, or computer chip applications. It is understood that the term "microelectronic device" is not intended to be limiting in any way and includes any substrate that will ultimately become a microelectronic device or microelectronic assembly. A microelectronic device or semiconductor substrate may include low-k dielectric materials, barrier materials, and metals such as Al, Cu, Cu alloys, SnAg alloys, W, Ti, TiN, one or more passivation layers such as polyimide or polybenzoxazole, as well as Si, SiO x , and other materials thereon.

[0023] As defined herein, "low-k dielectric material" refers to any material used as a dielectric material in layered microelectronic devices, which has a dielectric constant less than about 3.5. Preferably, the low-k dielectric material includes low polarity materials such as silicon-containing organic polymers, silicon-containing hybrid organic / inorganic materials, organosilicate glass (OSG), TEOS, fluorinated silicate glass (FSG), silicon oxide, and carbon-doped oxide (CDO) glass. It is understood that low-k dielectric materials can have different densities and different porosities.

[0024] As defined herein, the term "barrier material" refers to any material used in the art to encapsulate metal lines, e.g., copper interconnects, and to minimize the diffusion of said metals, e.g., copper, into dielectric materials. Preferred barrier layer materials include tantalum, titanium, titanium tungsten, ruthenium, hafnium, and other refractory metals, as well as their nitrides and silicides.

[0025] "Substantially free" is defined herein as less than about 1% by weight, more preferably less than about 0.5% by weight, and most preferably less than about 0.2% by weight. "Substantially free" also includes about 0.0% by weight. The term "free" means 0.0% by weight.

[0026] In some embodiments, when referring to a composition that is substantially free of water, it is intended to mean that water may be added with the ingredients as an impurity, but the amount of water added with the ingredients should be less than approximately 0.1% by weight, however water may also be absorbed from the atmosphere during manufacturing and use. In other embodiments, substantially free of water may mean a composition in which water is not present in excess of approximately 1% by weight. In other embodiments, substantially free of water may mean a composition in which water is not present in excess of approximately 3% by weight. In other embodiments, water may be added as part of the raw materials, and the water level may be present at greater than 2% by weight but less than 5%.

[0027] In some embodiments, the disclosed and claimed subject matter does not include an amidoxime compound. In some embodiments, the disclosed and claimed subject matter does not include a metal-containing compound.

[0028] The terms "about" or "approximately," when used in connection with a measurable, numerical variable, mean the stated value of the variable and all values ​​of the variable within experimental error of the stated value (e.g., within a 95% confidence limit for the mean) or within a percentage of the stated value (e.g., ±10%, ±5%), whichever is greater.

[0029] In all compositions where a particular component of a composition is discussed with reference to a weight percent range that includes a lower limit of zero, it is understood that such components may or may not be present in various specific embodiments of the composition, and that when such components are present, they may be present in concentrations as low as 0.001 weight percent, based on the total weight of the composition in which such component is used. It should be noted that all stated weight percents of components are based on the total weight of the composition, unless otherwise specified. Furthermore, unless otherwise specified, all weight percentages are "neat," meaning that they do not include the aqueous solution in which they are present when added to the composition. Any reference to "at least one" can be replaced with "one or more." "At least one" and / or "one or more" includes "at least two" or "two or more" and "at least three" and "three or more," etc.

[0030] When a composition (or solution) is referred to herein in terms of weight percent, it is understood that the weight percent of all components, including non-essential components such as impurities, should not, in any event, exceed 100 weight percent in total. In a composition "consisting essentially of" listed components, such components may total 100 weight percent of the composition, or may total less than 100 weight percent. When components total less than 100 weight percent, such compositions may contain some small amount of non-essential contaminants or impurities. For example, in one such embodiment, the composition may contain 2 weight percent or less of impurities. In another embodiment, the composition may contain 1 weight percent or less of impurities. In a further embodiment, the composition may contain 0.05 weight percent or less of impurities. In other such embodiments, the feedstock components may form at least 90 weight percent, more preferably at least 95 weight percent, more preferably at least 99 weight percent, more preferably at least 99.5 weight percent, and most preferably at least 99.8 weight percent, and may include other feedstock components that do not affect the performance of the wet etchant. Otherwise, in the absence of significant non-essential impurity components, the composition of all essential components is understood to add up to essentially 100% by weight. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the claimed subject matter. The objects, features, advantages, and concepts of the disclosed subject matter will be apparent to those skilled in the art from the description provided herein, and the disclosed subject matter will be readily practiced by those skilled in the art based on the description found herein. The description of "preferred embodiments" and / or examples illustrating preferred modes for carrying out the disclosed subject matter are included for illustrative purposes and are not intended to limit the scope of the claims.

[0032] It will also be apparent to those skilled in the art that various modifications can be made to how the disclosed subject matter is practiced in accordance with the embodiments described herein without departing from the spirit and scope of the subject matter disclosed herein.

[0033] As described above, the disclosed subject matter comprises: (i) one or more base components comprising one or more of an amine, a quaternary ammonium hydroxide, an inorganic base, and combinations thereof; (ii) one or more organic solvents, and (iii) one or more triazine derivative corrosion inhibitors of formula 1, [ka] In the formula, each R 1 , R 2 , and R 3 each independently represents a hydrogen atom, an oxygen-containing group, a hydroxyl group, a mercapto group, a nitrogen-containing group, an amine (i.e., [ka] ), C1~C 10 Amino groups substituted with alkyl groups (i.e. [ka] ), carboxyl group, phenyl group, substituted phenyl group, alkoxy group, C1-C 20 Straight chain alkyl group, C3-C 20 Branched chain alkyl groups, C3-C 10 Cyclic alkyl groups, C5-C 12 Aryl groups, C2-C 10 Straight chain alkenyl group, C3-C 10 Branched alkenyl groups, C2-C 10 Straight-chain alkynyl groups, C3-C 10 Branched alkynyl groups, C1-C substituted with halide 20 Linear alkyl groups, and [ka] C1 to C substituted with 20 selected from alkyl, one or more triazine derivative corrosion inhibitors, In one aspect of these embodiments, the triazine corrosion inhibitor is a guanamine compound (i.e., where R 1 , R 2 , and R 3 wherein at least two of are -NH2. In one aspect of these embodiments, the triazine corrosion inhibitor is benzoguanamine.

[0034] In a further aspect, the solution further comprises, consists essentially of, or consists of, optionally (iv) one or more second solvents. Thus, in one aspect of this embodiment, the solution comprises (i), (ii), (iii), and (iv). In one aspect of this embodiment, the solution consists essentially of (i), (ii), (iii), and (iv). In a further aspect of this embodiment, the solution consists of (i), (ii), (iii), and (iv). In one aspect of these embodiments, the triazine corrosion inhibitor is a guanamine compound. In one aspect of these embodiments, the triazine corrosion inhibitor is benzoguanamine.

[0035] In a further aspect, the solution further optionally comprises, consists essentially of, or consists of (v) one or more non-triazine corrosion inhibitors. Thus, in one aspect of this embodiment, the solution comprises (i), (ii), (iii), and (v). In one aspect of this embodiment, the solution consists essentially of (i), (ii), (iii), and (v). In a further aspect of this embodiment, the solution consists of (i), (ii), (iii), and (v). In one aspect of these embodiments, the triazine corrosion inhibitor is a guanamine compound. In one aspect of these embodiments, the triazine corrosion inhibitor is benzoguanamine.

[0036] In a further aspect, the solution further comprises, consists essentially of, or consists of, optionally, (iv) one or more second solvents, and (v) one or more non-triazine corrosion inhibitors. Thus, in one aspect of this embodiment, the solution comprises (i), (ii), (iii), (iv), and (v). In one aspect of this embodiment, the solution consists essentially of (i), (ii), (iii), (iv), and (v). In a further aspect of this embodiment, the solution consists of (i), (ii), (iii), (iv), and (v). In one aspect of these embodiments, the triazine corrosion inhibitor is a guanamine compound. In one aspect of these embodiments, the triazine corrosion inhibitor is benzoguanamine.

[0037] In another embodiment, the disclosed and claimed subject matter relates to a method of using the disclosed and claimed photoresist stripper and etch residue remover solutions to remove photoresist and associated polymeric materials from a substrate. In one aspect of this embodiment, the photoresist is removed from a substrate having photoresist thereon by contacting the substrate with one or more of the photoresist stripper and etch residue remover solutions for a time sufficient to remove a desired amount of photoresist or etch residue, removing the substrate from the stripper solution, rinsing the stripper solution from the substrate with DI water or a solvent, and drying the substrate.

[0038] In another embodiment, the disclosed and claimed subject matter relates to a method of using a triazine derivative corrosion inhibitor to enhance the anti-corrosion properties of another non-triazine corrosion inhibitor (e.g., (v) one or more non-triazine corrosion inhibitors). In one aspect of these embodiments, the triazine corrosion inhibitor is a guanamine compound. In one aspect of these embodiments, the triazine corrosion inhibitor is a benzoguanamine.

[0039] (i) Base component

[0040] As noted above, the solutions of the disclosed and claimed subject matter include one or more base components including one or more of an amine, a quaternary ammonium hydroxide, an inorganic base, and combinations thereof.

[0041] Amin

[0042] As noted above, the one or more base components may include one or more amines. Suitable amines include benzylamines, alkanolamines, and alkylamines.Suitable alkanolamines include, but are not limited to, ethanolamine, N-methylethanolamine, N-ethylethanolamine, N-propylethanolamine, N-butylethanolamine, dimethylethanolamine, diethylethanolamine, diethanolamine, triethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine, isopropanolamine, diisopropanolamine, triisopropanolamine, N-methylisopropanolamine, N-ethyl Isopropanolamine, N-propylisopropanolamine, 2-aminopropan-1-ol, N-methyl-2-aminopropan-1-ol, N-ethyl-2-aminopropan-1-ol, 1-aminopropan-3-ol, N-methyl-1-aminopropan-3-ol, N-ethyl-1-aminopropan-3-ol, 1-aminobutan-2-ol, N-methyl-1-aminobutan-2-ol, N-ethyl-1-aminobutan-2-ol, 2-aminobutan-1-ol, N-methyl-2-aminobutan N-ethyl-2-aminobutan-1-ol, 3-aminobutan-1-ol, N-methyl-3-aminobutan-1-ol, N-ethyl-3-aminobutan-1-ol, 1-aminobutan-4-ol, N-methyl-1-aminobutan-4-ol, N-ethyl-1-aminobutan-4-ol, 1-amino-2-methylpropan-2-ol, 2-amino-2-methylpropan-1-ol, 1-aminopentan-4-ol, 2-amino-4-methylpentan-1-ol, 2-aminohexane- 1-aminol, 3-aminoheptan-4-ol, 1-aminooctan-2-ol, 5-aminooctan-4-ol, 1-aminopropane-2,3-diol, 2-aminopropane-1,3-diol, tris(oxymethyl)aminomethane, 1,2-diaminopropan-3-ol, 1,3-diaminopropan-2-ol, 2-(2-aminoethoxy)ethanol, 4-(2-hydroxyethyl)morpholine, 1-(2-hydroxyethyl)piperidine, and 1-(2-hydroxyethyl)piperazine.Suitable alkylamines include, but are not limited to, diethylenetriamine, triethylenetetramine, 1,5-diamino-2-methylpentane, 1,3-diaminopentane, piperazine, 1-(2-aminoethyl)piperazine, 1,2-diaminocyclohexane, 1,3-diaminopropane, 1-(2-aminoethyl)piperidine, and tetraethylenepentamine, pentamethyldiethylenetriamine. Preferred alkanolamines include N-methylethanolamine, N-ethylethanolamine, ethanolamine, N-methyldiethanolamine, monoisopropanolamine, and aminoethoxyethanol. Preferred alkylamines include diethylenetriamine, pentamethyldiethylenetriamine, and triethylenetetramine.

[0043] In one embodiment, the solution comprises from about 0.5% to about 20% by weight of one or more alkanolamines. In one embodiment, the solution comprises from about 2.5% to about 15% by weight of one or more alkanolamines. In one embodiment, the solution comprises from about 5% to about 15% by weight of one or more alkanolamines. In one embodiment, the solution comprises from about 5% to about 10% by weight of one or more alkanolamines. In one embodiment, the solution comprises from about 10% to about 20% by weight of one or more alkanolamines.

[0044] In one embodiment, the solution comprises about 2.6 wt.% neat DMDPAH (dimethyldipropylammonium hydroxide) and about 1 wt.% to about 12 wt.% monoethanolamine (MEA). In a further aspect of this embodiment, the solution comprises about 2 wt.% to about 10 wt.% MEA. In another aspect of this embodiment, the solution comprises about 3 wt.% to about 9 wt.% MEA. In another aspect of this embodiment, the solution comprises about 4 wt.% to about 8 wt.% MEA. In another aspect of this embodiment, the solution comprises about 5 wt.% to about 7 wt.% MEA. In another aspect of this embodiment, the solution comprises about 2.5 wt.% MEA. In another aspect of this embodiment, the solution comprises about 3 wt.% MEA. In another aspect of this embodiment, the solution comprises about 3.5 wt.% MEA. In another aspect of this embodiment, the solution comprises about 4 wt.% MEA. In another aspect of this embodiment, the solution comprises about 4.5% MEA by weight. In another aspect of this embodiment, the solution comprises about 5% MEA by weight. In another aspect of this embodiment, the solution comprises about 6% MEA by weight.

[0045] In one embodiment, the solution comprises about 2.6% by weight neat DMDPAH and about 1% to about 12% by weight N-methyldiethanolamine (NMDEA). In a further aspect of this embodiment, the solution comprises about 2% to about 10% by weight NMDEA. In another aspect of this embodiment, the solution comprises about 3% to about 9% by weight NMDEA. In another aspect of this embodiment, the solution comprises about 4% to about 8% by weight NMDEA. In another aspect of this embodiment, the solution comprises about 5% to about 7% by weight NMDEA. In another aspect of this embodiment, the solution comprises about 2% by weight NMDEA. In another aspect of this embodiment, the solution comprises about 2.5% by weight NMDEA. In another aspect of this embodiment, the solution comprises about 3% by weight NMDEA. In another aspect of this embodiment, the solution comprises about 3.5% by weight NMDEA. In another aspect of this embodiment, the solution comprises about 4% NMDEA by weight. In another aspect of this embodiment, the solution comprises about 4.5% NMDEA by weight. In another aspect of this embodiment, the solution comprises about 5% NMDEA by weight. In another aspect of this embodiment, the solution comprises about 6% NMDEA by weight.

[0046] B. Quaternary ammonium hydroxide

[0047] As mentioned above, the one or more base components may include one or more quaternary ammonium hydroxides. Suitable quaternary ammonium hydroxides include, but are not limited to, tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH), tetrabutylammonium hydroxide (TBAH), ethyltrimethylammonium hydroxide (ETMAH), benzyltrimethylammonium hydroxide (BTMAH), choline hydroxide, and dimethyldipropylammonium hydroxide (DMDPAH). In some embodiments, TEAH is preferentially included. In such embodiments, TEAH is used as an aqueous solution, for example a 35% by weight aqueous solution. In other embodiments, DMDPAH is preferentially included. In such embodiments, DMDPAH is used as a 20% by weight solution in propylene glycol. In some embodiments, the solution does not include TMAH.

[0048] The quaternary ammonium hydroxide may be present in any neat amount within the range of about 0.5% to about 20% by weight, 1% to about 15% by weight, or about 1% to about 14% by weight, or about 1% to about 13% by weight, or about 1% to about 12% by weight, or about 1% to about 11% by weight, or about 1% to about 10% by weight, or about 1% to about 9% by weight, or about 1% to about 8% by weight, or about 1% to about 7% by weight, or about 1% to about 6% by weight, or about 1% to about 5% by weight, or about 1% to about 4% by weight, or about 1% to about 3% by weight, or about 1% to about 2% by weight, or about 0.1% to about 0.9% by weight, or about 0.4% to about 0.5% by weight, or about 0.1% to about 0.2% by weight, based on the total weight of the composition. More preferably, the quaternary ammonium hydroxide is present, but in an amount of 20% by weight or less. In certain preferred compositions, the quaternary ammonium hydroxide is present at about 8% to 15% by weight. In certain preferred compositions, the quaternary ammonium hydroxide is present at about 8% to 13% by weight. In certain preferred compositions, the quaternary ammonium hydroxide is present at about 10% to 15% by weight.

[0049] In one embodiment, the solution comprises about 7% to about 15% by weight of neat TEAH. In a further aspect of this embodiment, the solution comprises about 8% to about 14% by weight of neat TEAH. In another aspect of this embodiment, the solution comprises about 9% to about 13% by weight of neat TEAH. In another aspect of this embodiment, the solution comprises about 10% to about 11% by weight of neat TEAH. In another aspect of this embodiment, the solution comprises about 12% by weight of neat TEAH. In another aspect of this embodiment, the solution comprises about 12.2% by weight of neat TEAH. In another aspect of this embodiment, the solution comprises about 12.4% by weight of neat TEAH. In another aspect of this embodiment, the solution comprises about 12.6% by weight of neat TEAH. In another aspect of this embodiment, the solution comprises about 12.8% by weight of neat TEAH. In another aspect of this embodiment, the solution comprises about 13% by weight neat TEAH. In another aspect of this embodiment, the solution comprises about 13.2% by weight neat TEAH. In another aspect of this embodiment, the solution comprises about 13.4% by weight neat TEAH. In another aspect of this embodiment, the solution comprises about 13.6% by weight neat TEAH.

[0050] In one embodiment, the solution comprises about 1% to about 5% by weight of neat DMDPAH. In a further aspect of this embodiment, the solution comprises about 1% to about 4.5% by weight of neat DMDPAH. In another aspect of this embodiment, the solution comprises about 1.5% to about 4% by weight of neat DMDPAH. In another aspect of this embodiment, the solution comprises about 2% to about 3.5% by weight of neat DMDPAH. In another aspect of this embodiment, the solution comprises about 2% to about 3% by weight of neat DMDPAH. In another aspect of this embodiment, the solution comprises about 2.1% by weight of neat DMDPAH. In another aspect of this embodiment, the solution comprises about 2.2% by weight of neat DMDPAH. In another aspect of this embodiment, the solution comprises about 2.3% by weight of neat DMDPAH. In another aspect of this embodiment, the solution comprises about 2.4% by weight neat DMDPAH. In another aspect of this embodiment, the solution comprises about 2.6% by weight neat DMDPAH. In another aspect of this embodiment, the solution comprises about 2.8% by weight neat DMDPAH. In another aspect of this embodiment, the solution comprises about 3% by weight neat DMDPAH.

[0051] In one embodiment, the solution comprises about 8% to about 15% by weight of neat choline hydroxide. In a further aspect of this embodiment, the solution comprises about 9% to about 14% by weight of neat choline hydroxide. In a further aspect of this embodiment, the solution comprises about 10% to about 13% by weight of neat choline hydroxide. In a further aspect of this embodiment, the solution comprises about 11% to about 12% by weight of neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 12% to about 13% by weight of neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 11.25% by weight of neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 10.2% by weight of neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 10.4% by weight of neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 10.6% by weight neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 10.8% by weight neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 11% by weight neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 11.2% by weight neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 11.4% by weight neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 11.6% by weight neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 11.8% by weight neat choline hydroxide. In another aspect of this embodiment, the solution comprises about 12% by weight neat choline hydroxide.

[0052] C. Inorganic bases

[0053] As mentioned above, one or more base components include one or more inorganic bases. Preferably, the one or more inorganic bases include at least one alkali metal hydroxide or a mixture of different alkali metal hydroxides. Suitable inorganic bases include, but are not limited to, sodium hydroxide, potassium hydroxide, lithium hydroxide, rubidium hydroxide, and cesium hydroxide. In some embodiments, potassium hydroxide is preferentially included. In such embodiments, potassium hydroxide is used as an aqueous solution, for example, a 48% by weight aqueous solution. In other such embodiments, potassium hydroxide is used as a solid, for example, 85% by weight or 90% by weight flakes.

[0054] The metal hydroxide may be present in any neat amount within the range of about 0.1% to about 5%, or about 0.1% to about 4%, or about 0.9% to about 4%, or about 0.1% to about 0.8%, or about 0.4% to about 0.5%, or about 0.1% to about 0.2% based on the total weight of the composition. More preferably, the metal hydroxide is present but in an amount of 3.5% or less. In certain preferred compositions, the metal hydroxide is present at about 1.0% to 2.5% by weight. In certain preferred compositions, the metal hydroxide is present at about 1.5% to 2.25% by weight.

[0055] In one embodiment, the solution comprises about 0.5% to about 3.5% by weight of neat KOH. In one embodiment, the solution comprises about 1.0% to about 2.5% by weight of neat KOH. In a further aspect of this embodiment, the solution comprises about 1.75% to about 2.25% by weight of neat KOH. In another aspect of this embodiment, the solution comprises about 1.75% to about 2.1% by weight of neat KOH. In another aspect of this embodiment, the solution comprises about 1.75% to about 2.05% by weight of neat KOH. In another aspect of this embodiment, the solution comprises about 1.75% to about 2.0% by weight of neat KOH. In another aspect of this embodiment, the solution comprises about 1% by weight of neat KOH. In another aspect of this embodiment, the solution comprises about 1.25% by weight of neat KOH. In another aspect of this embodiment, the solution comprises about 1.5% by weight neat KOH. In another aspect of this embodiment, the solution comprises about 1.75% by weight neat KOH. In another aspect of this embodiment, the solution comprises about 1.8% by weight neat KOH. In another aspect of this embodiment, the solution comprises about 1.9% by weight neat KOH. In another aspect of this embodiment, the solution comprises about 2.0% by weight neat KOH. In another aspect of this embodiment, the solution comprises about 2.05% by weight neat KOH. In another aspect of this embodiment, the solution comprises about 2.1% by weight neat KOH. In another aspect of this embodiment, the solution comprises about 2.15% by weight neat KOH. In another aspect of this embodiment, the solution comprises about 2.2% by weight neat KOH. In another aspect of this embodiment, the solution comprises about 2.25% by weight neat KOH. In another aspect of this embodiment, the solution comprises about 2.3% by weight neat KOH.

[0056] In one embodiment, the solution comprises about 1.0% to about 2.5% by weight of neat NaOH. In a further aspect of this embodiment, the solution comprises about 1.75% to about 2.25% by weight of neat NaOH. In another aspect of this embodiment, the solution comprises about 1.75% to about 2.1% by weight of neat NaOH. In another aspect of this embodiment, the solution comprises about 1.75% to about 2.05% by weight of NaOH. In another aspect of this embodiment, the solution comprises about 1.75% to about 2.0% by weight of neat NaOH. In another aspect of this embodiment, the solution comprises about 1% by weight of neat NaOH. In another aspect of this embodiment, the solution comprises about 1.25% by weight of neat NaOH. In another aspect of this embodiment, the solution comprises about 1.5% by weight of neat NaOH. In another aspect of this embodiment, the solution comprises about 1.75% by weight neat NaOH. In another aspect of this embodiment, the solution comprises about 1.8% by weight neat NaOH. In another aspect of this embodiment, the solution comprises about 1.9% by weight neat NaOH. In another aspect of this embodiment, the solution comprises about 2.0% by weight neat NaOH. In another aspect of this embodiment, the solution comprises about 2.05% by weight neat NaOH. In another aspect of this embodiment, the solution comprises about 2.1% by weight neat NaOH. In another aspect of this embodiment, the solution comprises about 2.15% by weight neat NaOH. In another aspect of this embodiment, the solution comprises about 2.2% by weight neat NaOH. In another aspect of this embodiment, the solution comprises about 2.25% by weight neat NaOH. In another aspect of this embodiment, the solution comprises about 2.3% by weight neat NaOH.

[0057] In one embodiment, the solution comprises about 1.0% to about 7.5% by weight neat CsOH. In a further aspect of this embodiment, the solution comprises about 1.75% to about 7.25% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 1.75% to about 7% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 1.75% to about 6.0% by weight CsOH. In another aspect of this embodiment, the solution comprises about 1.75% to about 5.0% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 1% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 1.5% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 2.0% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 2.5% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 3.0% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 3.5% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 4.0% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 4.5% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 5.0% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 5.5% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 6.0% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 6.5% by weight neat CsOH. In another aspect of this embodiment, the solution comprises about 7.0% by weight neat CsOH.In another aspect of this embodiment, the solution comprises about 7.5% by weight neat CsOH.

[0058] (ii) Organic Solvent

[0059] The solutions of the disclosed and claimed subject matter comprise one or more organic solvents and optionally a second solvent.

[0060] In one embodiment, the solution comprises about 50% to about 98% by weight of one or more organic solvents. In a further aspect of this embodiment, the solution comprises about 94% to about 97% by weight of one or more organic solvents. In a further aspect of this embodiment, the solution comprises about 90% to about 94% by weight of one or more organic solvents. In a further aspect of this embodiment, the solution comprises about 83% to about 90% by weight of one or more organic solvents. In a further aspect of this embodiment, the solution comprises about 75% to about 83% by weight of one or more organic solvents. In a further aspect of this embodiment, the solution comprises about 65% to about 75% by weight of one or more organic solvents. In a further aspect of this embodiment, the solution comprises about 60% to about 65% by weight of one or more organic solvents. In a further aspect of this embodiment, the solution comprises about 50% to about 60% by weight of one or more organic solvents. In a further aspect of this embodiment, the solution comprises from about 40% to about 98% by weight of one or more organic solvents. In a further aspect of this embodiment, the solution comprises from about 40% to about 50% by weight of one or more organic solvents. In a further aspect of this embodiment, the amount (wt %) of one or more organic solvents is greater than the amount (wt %) of any second solvent present.

[0061] In some embodiments, the solvent is selected from ether alcohols. One type of ether alcohol solvent may be glycol ether. Suitable glycol ether solvents include, but are not limited to, diethylene glycol butyl ether (DB), diethylene glycol methyl ether, diethylene glycol ethyl ether, diethylene glycol propyl ether, propylene glycol methyl ether, dipropylene glycol methyl ether, propylene glycol propyl ether, dipropylene glycol propyl ether, propylene glycol phenyl ether, propylene glycol n-butyl ether, dipropylene glycol n-butyl ether, ethylene glycol propyl ether, ethylene glycol butyl ether, ethylene glycol phenyl ether, tripropylene glycol methyl ether, dipropylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, triethylene glycol monomethyl ether (TEGME), triethylene glycol monoethyl ether, triethylene glycol monopropyl ether, and triethylene glycol monobutyl ether. Other suitable types of ether alcohol solvents that are not glycol ethers (i.e., other alcohols with ether groups). Examples are 3-methoxy-3-methyl-1-butanol (MMB), furfuryl alcohol, tetrahydrofurfuryl alcohol. Other suitable solvents are DMSO, NMP, and sulfolane.

[0062] In one embodiment, the solvent comprises diethylene glycol monoethyl ether (DE solvent). In a further aspect of this embodiment, the solvent is about 40% to about 80% by weight diethylene glycol monoethyl ether (DE solvent). In another embodiment, the solvent comprises DMSO. In a further aspect of this embodiment, the solvent comprises about 50% to about 90% by weight DMSO.

[0063] In some embodiments, the solution is free or essentially free of amide-containing solvents, where essentially free means less than 1%, alternatively less than 0.1%, alternatively less than 0.01%, or less than 0.001% by weight, or free, and free means undetectable or zero.

[0064] In other embodiments, the solution may be free or essentially free of sulfur-containing solvents. In a further aspect of this embodiment, the composition is free or essentially free of N-methyl-2-pyrrolidone (NMP). In a further aspect of this embodiment, the composition is free or essentially free of DMSO. Essentially free means less than 1%, alternatively less than 0.1% by weight, alternatively less than 0.01% by weight, or alternatively less than 0.001% by weight, or free, and free means undetectable or 0.

[0065] (iii) Triazine derivative corrosion inhibitors

[0066] As noted above, the solutions of the disclosed and claimed subject matter include one or more triazine derivative corrosion inhibitors of formula (I): [ka] In the formula, each R 1 , R 2 , and R 3 each independently represents a hydrogen atom, an oxygen-containing group, a hydroxyl group, a mercapto group, a nitrogen-containing group, an amine (i.e., [ka] ), C1~C 10 Amino groups substituted with alkyl groups (i.e. [ka] ), carboxyl group, phenyl group, substituted phenyl group, alkoxy group, C1-C 20 Straight chain alkyl group, C3-C 20 Branched chain alkyl groups, C3-C10 Cyclic alkyl groups, C5-C 12 Aryl groups, C2-C 10 Straight chain alkenyl group, C3-C 10 Branched alkenyl groups, C2-C 10 Straight-chain alkynyl groups, C3-C 10 Branched alkynyl groups, C1-C substituted with halide 20 Linear alkyl groups, and [ka] C1 to C substituted with 20 In one embodiment, R 1 , R 2 , and R 3 At least one of the groups is a phenyl group.

[0067] In one embodiment, R 1 , R 2 , and R 3 At least one of the groups is an amine.

[0068] In one embodiment, R 1 , R 2 , and R 3 At least two of the are amines.

[0069] In one embodiment, R 1 , R 2 , and R 3 One of the groups is a phenyl group, and R 1 , R 2 , and R 3 The remaining two are amines.

[0070] In one embodiment, R 1 , R 2 , and R 3At least one of the groups is a substituted phenyl group. In one aspect of this embodiment, the phenyl group is substituted with one or more of a hydroxyl group, a mercapto group, an amino group, an imino group, a carboxyl group, a phenyl group, an alkoxy group and an alkyl group having 1 to 10 carbon atoms, a linear or branched group.

[0071] In one embodiment, R 1 , R 2 , and R 3 At least one of them is an alkoxy group having 1 to 10 carbon atoms, which is one or more of a methoxy group, an ethoxy group, a propoxy group, and a butoxy group.

[0072] In one embodiment, R 1 , R 2 , and R 3 At least one of is an alkyl group having 1 to 20 carbons that is one or more of a methyl group, an ethyl group, a propyl group, a butyl group, a nonyl group, and a lauryl group. In a further aspect of this embodiment, the alkyl group having 1 to 20 carbons is substituted with one or more of a hydroxyl group, a mercapto group, an amino group, an imino group, a carboxyl group, a phenyl group, and an alkoxy group having 1 to 10 carbon atoms.

[0073] In one embodiment, the one or more triazine derivative corrosion inhibitors are one or more of 1,2,3-triazine, 1,2,4-triazine, and 1,3,5-triazine, and substituted triazines. 1,3,5-triazines and substituted 1,3,5-triazines are preferred copper corrosion inhibitors in the disclosed and claimed subject matter, specific examples include, but are not limited to, 2,4-diamino-6-methyl-1,3,5-triazine and 2,4-diamino-1,3,5-triazine, 2-amino-1,3,5-triazine, 2,4-diamino-6-isobutyl-1,3,5-triazine, 2,4-diamino-6-xylyl-1,3,5-triazine, 2,4-diamino-6-hydroxy-1,3,5-triazine, 2,4-diamino-6-phenyl-1,3,5-triazine, 2-amino-4-methoxy-6-methyl-1,3,5-triazine, and 2,4,6-triamino-1,3,5-triazine. Other preferred triazines include 2-amino-1,2,4-triazine and 3-amino-5,6-dimethyl-1,2,4-triazine.

[0074] In one preferred embodiment, the one or more triazine derivative corrosion inhibitors are represented by Formula 2, where R 2 and R 3 is -NH2) (i.e., R 1 , R 2 , and R 3 wherein two of the groups are each -NH2). [ka]

[0075] In one preferred embodiment, the one or more triazine derivative corrosion inhibitors are represented by Formula 3, where R 2 and R 3 is -NH2) (i.e., 1 , R 2 , and R 3 wherein two of R are each -NH2; 1is selected from hydrogen, an -OH group, a carboxyl group, a phenyl group, a substituted phenyl group, an amine, a C1 to C6 linear alkyl group, and a C3 to C6 branched alkyl group. [ka]

[0076] In one preferred embodiment, the one or more triazine derivative corrosion inhibitors are R 1 , R 2 , and R 3 Two of the groups are -NH2 and R 1 , R 2 , and R 3 wherein the remainder of the substituents is a phenyl group. [ka]

[0077] In another embodiment, the one or more triazine derivative corrosion inhibitors are 1 , R 2 , and R 3 Each of these is 1,3,5-triazine-2,4,6-triamine (melamine). [ka]

[0078] In one embodiment, the one or more triazine derivative corrosion inhibitors are present in the solution at a level in the range of about 0.005% to about 10% by weight. In one embodiment, the solution may contain about 0.1% to about 10% by weight, or about 0.5% to about 10% by weight, or about 0.5% to about 5% by weight, or about 0.5% to about 3% by weight, or 0.1% to about 4% by weight, or about 0.25% to about 2% by weight, or about 0.01% to about 4% by weight, or about 0.05% to about 4% by weight, or about 0.1% to about 4% by weight. In one embodiment, the solution may contain about 0.25% to about 1% by weight. The one or more corrosion inhibitors may be present in any amount defined by an endpoint selected from the following weight percent: 0.005, 0.02, 0.08, 0.1, 0.2, 0.25, 0.3, 0.4, 0.5, 0.7, 0.9, 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10.

[0079] (iv) a second solvent (optionally)

[0080] Some embodiments may include a second solvent in addition to the DMSO or ether alcohol solvents described above. Alternatively, in some embodiments, the stripper solution may be free or substantially free of a second solvent.

[0081] In some embodiments, the (iv) second solvent comprises one of water, an alcohol, and a polyhydroxyl compound. In one aspect of this embodiment, the (iv) second solvent is water. In another aspect of this embodiment, the (iv) second solvent is one or more of ethylene glycol, propylene glycol, and glycerol. In one embodiment, the (iv) second solvent is about 13% to about 40% water by weight. In another embodiment, the (iv) second solvent is about 5% to about 15% propylene glycol by weight.

[0082] In one aspect, the (iv) second solvent includes added water (i.e., water added as a solvent, as opposed to only small amounts of water present as an impurity in other feed ingredients). In one embodiment, the (iv) second solvent is about 0.1% to about 45% water by weight. In one embodiment, the (iv) second solvent is about 0.2% to about 45% water by weight. In one embodiment, the (iv) second solvent is about 5% to about 35% water by weight. In one embodiment, the (iv) second solvent is about 0.5% to about 25% water by weight. In one embodiment, the (iv) second solvent is about 0.2% water by weight. In one embodiment, the (iv) second solvent is about 0.5% water by weight. In one embodiment, the (iv) second solvent is about 1% water by weight. In one embodiment, the (iv) second solvent is about 2.5% water by weight. In one embodiment, the (iv) second solvent is about 5% water by weight. In one embodiment, the (iv) second solvent is about 7.5% water by weight. In one embodiment, the (iv) second solvent is about 10% water by weight. In one embodiment, the (iv) second solvent is about 15% water by weight. In one embodiment, the (iv) second solvent is about 20% water by weight. In one embodiment, the (iv) second solvent is about 24% water by weight. In one embodiment, the (iv) second solvent is about 25% water by weight. In one embodiment, the (iv) second solvent is about 30% water by weight. In one embodiment, the (iv) second solvent is about 35% water by weight. In one embodiment, the (iv) second solvent is about 40% water by weight. In one embodiment, the (iv) second solvent is about 45% water by weight.

[0083] In one embodiment, (iv) the second solvent is free of water. In one embodiment, (iv) the second solvent is substantially free of water. In one embodiment, (iv) the second solvent comprises less than about 0.05% water by weight. In one embodiment, (iv) the second solvent comprises less than 0.1% water by weight.

[0084] The second organic solvent alcohol or polyhydroxy compound may be a straight or branched chain aliphatic or aromatic alcohol. Examples of the second alcohol that the composition may include include methanol, ethanol, propanol, isopropyl alcohol, butanol, tert-butyl alcohol, tert-amyl alcohol, 3-methyl-3-pentanol, 1-octanol, 1-decanol, 1-undecanol, 1-dodecanol, 1-tridecanol, 1-tetradecanol, 1-pentadecanol, 1-hexadecanol, 9-hexadecen-1-ol, 1-heptadecanol, 1-octadecanol, 1-nonadecanol, 1-eicosanol, 1-heneicosanol, 1-docosanol, 13-docosene-1-ol, 1-tetracosanol, 1-hexacosanol, 1-heptacosanol, 1-octacosanol, 1-triacontanol, 1-dotriacontanol, 1-tetratriacontanol, cetearyl alcohol, ethylene glycol, propylene glycol, and glycerol.

[0085] If used, (iv) the second organic solvent may comprise from about 0.02% to about 50%, or from about 0.08% to about 38%, or from about 0.1% to about 35%, or from about 0.2% to about 33%, or from about 0.3% to about 20%, or from about 5% to about 15% of the composition. In alternative embodiments, the second solvent may be present in any amount defined by an endpoint selected from the following weight percents: 0.02, 0.08, 0.1, 0.2, 0.3, 0.4, 0.5, 0.7, 0.9, 1, 3, 5, 8, 10, 12, 15, 17, 20, 23, 25, 38, 30, 32, 35, 37, 40, 43, 45, 47, and 50.

[0086] In a further aspect of the above embodiment, the amount (wt %) of the one or more organic solvents is greater than the amount (wt %) of the second solvent present.

[0087] (v) optional non-triazine corrosion inhibitors

[0088] In a further embodiment, the solution further optionally comprises, consists essentially of, or consists of (v) one or more non-triazine corrosion inhibitors. Suitable non-triazine corrosion inhibitors include, but are not limited to, organic corrosion inhibitors such as aromatic hydroxyl and polyhydroxyl compounds, such as catechol and resorcinol, alkyl catechols (e.g., methyl catechol, ethyl catechol, and t-butyl catechol), phenols, and pyrogallol; aromatic triazoles, such as benzotriazole (BZT), alkyl benzotriazole and methyl benzotriazole, aminobenzotriazole (e.g., 1-aminobenzotriazole); thiazoles, such as 2-aminobenzothiazole (ABT); sugar alcohols, such as glycerol, xylitol, and sorbitol, 8-HQ (8-hydroxyquinoline), histidine, and copper salts, such as copper nitrate.

[0089] In one embodiment, (v) one or more optional non-triazine corrosion inhibitors are present in solution at a level in the range of about 0.005% to about 10% by weight. In one embodiment, the solution may contain from about 0.005% to about 5% by weight, or from about 0.025% to about 4% by weight, or from about 0.05% to about 4% by weight, or from about 0.1% to about 4% by weight, or from 0.1% to about 10% by weight, or from about 0.25% to about 8% by weight, or from about 0.5% to about 7% by weight, or from about 0.5% to about 6% by weight, or from about 0.5% to about 5% by weight, or from about 0.5% to about 4% by weight, or from about 0.5% to about 3% by weight. The one or more corrosion inhibitors may be present in any amount defined by an endpoint selected from the following weight percent: 0.005, 0.02, 0.08, 0.1, 0.2, 0.25, 0.3, 0.4, 0.5, 0.7, 0.9, 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10.

[0090] In some embodiments, (v) one or more non-triazine corrosion inhibitors include one or more of BZT, sorbitol, resorcinol, sebacic acid, glycerol, and copper (II) nitrate. In some embodiments, these corrosion inhibitors are present at about 0.01% to about 2% by weight (alone or in combination). In some embodiments, these non-triazine corrosion inhibitors are present at about 0.2% to about 1% by weight (alone or in combination). In some embodiments, these corrosion inhibitors are present at about 0.5% by weight (alone or in combination).

[0091] In some embodiments, (v) the one or more non-triazine corrosion inhibitors include BZT. In one aspect of this embodiment, the solution includes about 0.1% to about 1% by weight BZT. In another aspect of this embodiment, the solution includes about 0.1% by weight BZT. In another aspect of this embodiment, the solution includes about 0.5% by weight BZT. In another aspect of this embodiment, the solution includes about 1.0% by weight BZT.

[0092] In some embodiments, (v) the one or more non-triazine corrosion inhibitors comprise sorbitol. In one aspect of this embodiment, the solution comprises about 0.2% to about 5% sorbitol by weight. In one aspect of this embodiment, the solution comprises about 0.2% to about 3% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 0.2% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 0.5% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 1.0% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 1.5% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 2.0% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 2.5% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 3.0% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 3.5% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 4.0% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 4.5% sorbitol by weight. In another aspect of this embodiment, the solution comprises about 5.0% sorbitol by weight.

[0093] In some embodiments, (v) the one or more non-triazine corrosion inhibitors comprise resorcinol. In one aspect of this embodiment, the solution comprises about 0.2% to about 2% resorcinol by weight. In one aspect of this embodiment, the solution comprises about 0.2% to about 4% resorcinol by weight. In another aspect of this embodiment, the solution comprises about 0.2% resorcinol by weight. In another aspect of this embodiment, the solution comprises about 0.5% resorcinol by weight. In another aspect of this embodiment, the solution comprises about 1.0% resorcinol by weight. In another aspect of this embodiment, the solution comprises about 1.5% resorcinol by weight. In another aspect of this embodiment, the solution comprises about 2.0% resorcinol by weight. In another aspect of this embodiment, the solution comprises about 2.5% resorcinol by weight. In another aspect of this embodiment, the solution comprises about 3.0% resorcinol by weight. In another aspect of this embodiment, the solution comprises about 3.5% by weight resorcinol.In another aspect of this embodiment, the solution comprises about 4.0% by weight resorcinol.

[0094] In some embodiments, (v) the one or more non-triazine corrosion inhibitors include glycerol. In one aspect of this embodiment, the solution includes about 0.2% to about 1% by weight glycerol. In another aspect of this embodiment, the solution includes about 0.2% by weight glycerol. In another aspect of this embodiment, the solution includes about 0.5% by weight glycerol. In another aspect of this embodiment, the solution includes about 1.0% by weight glycerol.

[0095] In some embodiments, (v) the one or more non-triazine corrosion inhibitors include sebacic acid. In one aspect of this embodiment, the solution includes about 0.2% to about 1% by weight of sebacic acid. In another aspect of this embodiment, the solution includes about 0.2% by weight of sebacic acid. In another aspect of this embodiment, the solution includes about 0.5% by weight of sebacic acid. In another aspect of this embodiment, the solution includes about 1.0% by weight of sebacic acid.

[0096] In some embodiments, (v) the one or more non-triazine corrosion inhibitors comprise copper nitrate. In one aspect of this embodiment, the solution comprises about 0.005% to about 0.5% copper nitrate by weight. In another aspect of this embodiment, the solution comprises about 0.01% copper nitrate by weight. In another aspect of this embodiment, the solution comprises about 0.2% copper nitrate by weight. In another aspect of this embodiment, the solution comprises about 0.5% copper nitrate by weight.

[0097] In a further aspect, the solution optionally further comprises, consists essentially of, or consists of (v) two or more non-triazine corrosion inhibitors. In some embodiments, the (v) two or more non-triazine corrosion inhibitors include one or more of BZT, sorbitol, resorcinol, 8-HQ, sebacic acid, glycerol, histidine, and copper(II) nitrate. In some embodiments, the (v) two or more non-triazine corrosion inhibitors include BZT and one or more of sorbitol, resorcinol, 8-HQ, sebacic acid, glycerol, histidine, and copper(II) nitrate. In one embodiment, the (v) two or more non-triazine corrosion inhibitors include BZT and sorbitol. In one embodiment, the (v) two or more non-triazine corrosion inhibitors include BZT and copper(II) nitrate. In one embodiment, the (v) two or more non-triazine corrosion inhibitors include BZT and resorcinol. In one embodiment, the (v) two or more non-triazine corrosion inhibitors include BZT and 8-HQ. In one embodiment, the (v) two or more non-triazine corrosion inhibitors include BZT and histidine. In one embodiment, the (v) two or more non-triazine corrosion inhibitors include BZT and glycerol. In one embodiment, the (v) two or more non-triazine corrosion inhibitors include BZT and sebacic acid.

[0098] Exemplary embodiments

[0099] All numerical values ​​in the following exemplary embodiments are neat values ​​unless otherwise specified.

[0100] EMBODIMENT 1

[0101] In one embodiment, the disclosed and claimed solution comprises: (i) one or more base components comprising, consisting essentially of, or consisting of one or more of DMDPAH, TEAH, KOH, TMAH, ETMAH, choline hydroxide, monoethanolamine, and combinations thereof; (ii) one or more organic solvents comprising, consisting essentially of, or consisting of one or more of DMSO, propylene glycol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, 3-methoxy-3-methyl-1-butanol, and combinations thereof; and (iii) one or more triazine derivative corrosion inhibitors comprising, consisting essentially of, or consisting of one or more guanamine compounds of formula 2: [ka] In the formula, R 1 is a hydrogen atom, an oxygen-containing group, a hydroxyl group, a mercapto group, a nitrogen-containing group, an amine (i.e., [ka] ), C1~C 10 Amino groups substituted with alkyl groups (i.e. [ka] ), carboxyl group, phenyl group, substituted phenyl group, alkoxy group, C1-C 20 Straight chain alkyl group, C3-C 20 Branched chain alkyl groups, C3-C 10 Cyclic alkyl groups, C5-C 12 Aryl groups, C2-C 10Straight chain alkenyl group, C3-C 10 Branched alkenyl groups, C2-C 10 Straight-chain alkynyl groups, C3-C 10 Branched alkynyl groups, C1-C substituted with halide 20 Linear alkyl groups, and [ka] C1 to C substituted with 20 selected from alkyl, one or more triazine derivative corrosion inhibitors, Comprising, consisting essentially of, or consisting of.

[0102] In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of DMDPAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of TEAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of KOH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of TMAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of ETMAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of choline hydroxide. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of DMSO. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of propylene glycol. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of diethylene glycol monoethyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of diethylene glycol monoethyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of diethylene glycol monobutyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of triethylene glycol monomethyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of 3-methoxy-3-methyl-1-butanol, or consist essentially of 3-methoxy-3-methyl-1-butanol.

[0103] In a further aspect of this embodiment, the solution (iv) comprises, consists essentially of, or consists of water as the one or more second solvents. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of resorcinol as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of BZT as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of sorbitol as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of copper(II) nitrate as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of 8-HQ as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of (v) one or more non-triazine corrosion inhibitors, one or more of resorcinol, BZT, sorbitol, 8-HQ, and copper(II) nitrate. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of (v) two or more non-triazine corrosion inhibitors, two or more of resorcinol, BZT, sorbitol, 8-HQ, and copper(II) nitrate.

[0104] EMBODIMENT 2

[0105] In another preferred embodiment, the disclosed and claimed solution comprises: (i) one or more base components comprising, consisting essentially of, or consisting of one or more of DMDPAH, TEAH, KOH, TMAH, ETMAH, choline hydroxide, monoethanolamine, and combinations thereof; (ii) one or more organic solvents comprising, consisting essentially of, or consisting of one or more of DMSO, propylene glycol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, 3-methoxy-3-methyl-1-butanol, and combinations thereof; and (iii) one or more triazine derivative corrosion inhibitors comprising, consisting essentially of, or consisting of a guanamine compound of formula 3: [ka] In the formula, R 1 is selected from hydrogen, an -OH group, a carboxyl group, a phenyl group, a substituted phenyl group, an amine, a C1 to C6 linear alkyl group, and a C3 to C6 branched alkyl group; one or more triazine derivative corrosion inhibitors, Comprising, consisting essentially of, or consisting of.

[0106] In a further aspect of this embodiment, R of formula 3 1 is hydrogen. In a further aspect of this embodiment, R 1 is an —OH group. In a further aspect of this embodiment, R 1 is a carboxyl group. In a further aspect of this embodiment, R 1 is a phenyl group. In a further aspect of this embodiment, R 1 is a substituted phenyl group. In a further aspect of this embodiment, R 1 In a further aspect of this embodiment, R of formula 3 is an amine. 1 is a C1-C6 linear alkyl group. In a further aspect of this embodiment, R 1 is a C3 to C6 branched alkyl group.

[0107] In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of DMDPAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of TEAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of KOH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of TMAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of ETMAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of choline hydroxide. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of monoethanolamine. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of DMSO. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of propylene glycol. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of diethylene glycol monoethyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of diethylene glycol monoethyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of diethylene glycol monobutyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of triethylene glycol monomethyl ether.In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of 3-methoxy-3-methyl-1-butanol.

[0108] In a further aspect of this embodiment, the solution (iv) comprises, consists essentially of, or consists of water as the one or more second solvents. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of resorcinol as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of BZT as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of sorbitol as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of copper(II) nitrate as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of (v) one or more non-triazine corrosion inhibitors, one or more of resorcinol, BZT, sorbitol, 8-HQ, and copper(II) nitrate. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of (v) two or more non-triazine corrosion inhibitors, two or more of resorcinol, BZT, sorbitol, 8-HQ, and copper(II) nitrate.

[0109] EMBODIMENT 3

[0110] In another preferred embodiment, the disclosed and claimed solution comprises: (i) one or more base components comprising, consisting essentially of, or consisting of one or more of DMDPAH, TEAH, KOH, TMAH, ETMAH, choline hydroxide, monoethanolamine, and combinations thereof; (ii) one or more organic solvents comprising, consisting essentially of, or consisting of one or more of DMSO, propylene glycol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, 3-methoxy-3-methyl-1-butanol, and combinations thereof; and (iii) one or more triazine derivative corrosion inhibitors comprising, consisting essentially of, or consisting of benzoguanamine; Comprising, consisting essentially of, or consisting of. [ka]

[0111] In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of DMDPAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of TEAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of KOH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of TMAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of ETMAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of choline hydroxide. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of monoethanolamine. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of DMSO. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of propylene glycol. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of diethylene glycol monoethyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of diethylene glycol monoethyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of diethylene glycol monobutyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of triethylene glycol monomethyl ether.In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of 3-methoxy-3-methyl-1-butanol.

[0112] In a further aspect of this embodiment, the solution (iv) comprises, consists essentially of, or consists of water as the one or more second solvents. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of resorcinol as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of BZT as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of sorbitol as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution (v) comprises, consists essentially of, or consists of copper(II) nitrate as the one or more non-triazine corrosion inhibitors. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of (v) two or more of resorcinol, BZT, sorbitol, and copper(II) nitrate as the one or more non-triazine corrosion inhibitors.

[0113] EMBODIMENT 4

[0114] In another preferred embodiment, the disclosed and claimed solution comprises: (i) one or more base components comprising, consisting essentially of, or consisting of about 2.6% by weight DMDPAH and about 6% by weight monoethanolamine; (ii) one or more organic solvents comprising, consisting essentially of, or consisting of about 80% by weight DMSO and about 10.5% by weight propylene glycol; and (iii) one or more triazine derivative corrosion inhibitors comprising, consisting essentially of, or consisting of about 0.75% to about 1.0% by weight of benzoguanamine; Comprising, consisting essentially of, or consisting of.

[0115] In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 0.8% by weight benzoguanamine. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 1% by weight benzoguanamine. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of one or more of resorcinol, 8-HQ, copper nitrate (e.g., about 18.7% by weight copper nitrate solution; "NADA"), histidine, and sorbitol. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 0.1% by weight resorcinol. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 0.8% by weight resorcinol. In a further aspect of this embodiment, the ratio of benzoguanamine to resorcinol is about 4:1 to about 1:4. In a further aspect of this embodiment, the ratio of benzoguanamine to resorcinol is about 4:1. In a further aspect of this embodiment, the ratio of benzoguanamine to resorcinol is about 3:1. In a further aspect of this embodiment, the ratio of benzoguanamine to resorcinol is about 2:1. In a further aspect of this embodiment, the ratio of benzoguanamine to resorcinol is about 1:1. In a further aspect of this embodiment, the ratio of benzoguanamine to resorcinol is about 1:2. In a further aspect of this embodiment, the ratio of benzoguanamine to resorcinol is about 1:3. In a further aspect of this embodiment, the ratio of benzoguanamine to resorcinol is about 1:4. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 0.8% by weight benzoguanamine and about 0.1% by weight resorcinol. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 0.8% by weight benzoguanamine and about 0.8% by weight resorcinol.In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 0.5% by weight 8-HQ. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 0.01% by weight NADA. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 0.3% by weight histidine. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 1% by weight sorbitol. In a further aspect of this embodiment, the ratio of benzoguanamine to sorbitol is about 4:1 to about 1:4. In a further aspect of this embodiment, the ratio of benzoguanamine to sorbitol is about 4:1. In a further aspect of this embodiment, the ratio of benzoguanamine to sorbitol is about 3:1. In a further aspect of this embodiment, the ratio of benzoguanamine to sorbitol is about 2:1. In a further aspect of this embodiment, the ratio of benzoguanamine to sorbitol is about 1:1. In a further aspect of this embodiment, the ratio of benzoguanamine to sorbitol is about 1:2. In a further aspect of this embodiment, the ratio of benzoguanamine to sorbitol is about 1:3. In a further aspect of this embodiment, the ratio of benzoguanamine to sorbitol is about 1:4. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 0.15% by weight copper nitrate. In a further aspect of this embodiment, the ratio of benzoguanamine to copper nitrate is about 4:1 to about 1:4. In a further aspect of this embodiment, the ratio of benzoguanamine to copper nitrate is about 4:1. In a further aspect of this embodiment, the ratio of benzoguanamine to copper nitrate is about 3:1. In a further aspect of this embodiment, the ratio of benzoguanamine to copper nitrate is about 2:1. In a further aspect of this embodiment, the ratio of benzoguanamine to copper nitrate is about 1: 1. In a further aspect of this embodiment, the ratio of benzoguanamine to copper nitrate is about 1: 2. In a further aspect of this embodiment, the ratio of benzoguanamine to copper nitrate is about 1: 3.In a further aspect of this embodiment, the ratio of benzoguanamine to copper nitrate is about 1:4.

[0116] EMBODIMENT 5

[0117] In another preferred embodiment, the disclosed and claimed solution comprises: (i) one or more base components comprising, consisting essentially of, or consisting of about 1.75% to about 2.0% by weight KOH; (ii) one or more organic solvents comprising, consisting essentially of, or consisting of about 55% to about 97.5% by weight diethylene glycol monoethyl ether; and (iii) one or more triazine derivative corrosion inhibitors comprising, consisting essentially of, or consisting of about 0.25% to about 0.75% by weight benzoguanamine; Comprising, consisting essentially of, or consisting of.

[0118] In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 10% to about 45% water by weight. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 41% or less water by weight. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of the balance (i.e., the balance) of water. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 1.8% KOH by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 57.5% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 72.5% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 82.5% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 97.5% by weight diethylene glycol monoethyl ether. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 0.5% by weight benzoguanamine. In a further aspect of this embodiment, the disclosed and claimed solution is substantially free of water. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 15% by weight water. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 25% by weight water. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 40% by weight water.

[0119] EMBODIMENT 6

[0120] In another preferred embodiment, the disclosed and claimed solution comprises: (i) one or more base components comprising, consisting essentially of, or consisting of about 2.5% by weight to about 3.0% by weight DMDPAH; (ii) one or more organic solvents comprising, consisting essentially of, or consisting of about 10.5% by weight propylene glycol and about 45% to about 86.5% by weight diethylene glycol monoethyl ether; and (iii) one or more triazine derivative corrosion inhibitors comprising, consisting essentially of, or consisting of about 0.25% to about 0.75% by weight benzoguanamine; Comprising, consisting essentially of, or consisting of.

[0121] In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 10% to about 45% water by weight. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 40% or less water by weight. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of the balance (i.e., the remainder) of water. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 2.6% DMDPAH by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 46.4% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 61.4% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 61.9% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 71.4% by weight diethylene glycol monoethyl ether. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 86.4% by weight diethylene glycol monoethyl ether. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 0.5% by weight benzoguanamine. In a further aspect of this embodiment, the disclosed and claimed solution is substantially free of water. In a further aspect of this embodiment, the disclosed and claimed solution is free of water. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 15% by weight water. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 25% by weight water. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 40% by weight water.

[0122] EMBODIMENT 7

[0123] In another preferred embodiment, the disclosed and claimed solution comprises: (i) one or more base components comprising, consisting essentially of, or consisting of about 10% by weight to about 15% by weight TEAH; (ii) one or more organic solvents comprising, consisting essentially of, or consisting of about 45% to about 65% by weight diethylene glycol monoethyl ether; and (iii) one or more triazine derivative corrosion inhibitors comprising, consisting essentially of, or consisting of about 0.25% to about 0.75% by weight benzoguanamine; Comprising, consisting essentially of, or consisting of.

[0124] In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 20% to about 40% water by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 10% to about 13.5% TEAH by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 13% TEAH by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 46.5% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 62.5% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 0.5% benzoguanamine by weight. In a further aspect of this embodiment, the disclosed and claimed solution is substantially free of water. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 24% water by weight.In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 40% water by weight.

[0125] EMBODIMENT 8

[0126] In another preferred embodiment, the disclosed and claimed solution comprises: (i) one or more base components comprising, consisting essentially of, or consisting of about 10% by weight to about 15% by weight of choline hydroxide; (ii) one or more organic solvents comprising, consisting essentially of, or consisting of about 45% to about 75% by weight diethylene glycol monoethyl ether; and (iii) one or more triazine derivative corrosion inhibitors comprising, consisting essentially of, or consisting of about 0.25% to about 0.75% by weight benzoguanamine; Comprising, consisting essentially of, or consisting of.

[0127] In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 15% to about 45% water by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 11.25% choline hydroxide by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 48.25% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 63.25% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 73.25% diethylene glycol monoethyl ether by weight. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 0.5% benzoguanamine by weight. In a further aspect of this embodiment, the disclosed and claimed solution is substantially free of water. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 15% water by weight. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 25% water by weight. In a further aspect of this embodiment, the disclosed and claimed solution comprises, consists essentially of, or consists of about 40% water by weight.

[0128] EMBODIMENT 9

[0129] In another preferred embodiment, the disclosed and claimed solution comprises: (i) one or more base components comprising, consisting essentially of, or consisting of about 10% by weight to about 15% by weight TEAH; (ii) about 62.5% by weight of one or more organic solvents comprising, consisting essentially of, or consisting of DMSO, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, and 3-methoxy-3-methyl-1-butanol; (iii) one or more triazine derivative corrosion inhibitors comprising, consisting essentially of, or consisting of about 0.5% by weight benzoguanamine; (iv) one or more second solvents comprising, consisting essentially of, or consisting of about 24% by weight water; Comprising, consisting essentially of, or consisting of.

[0130] In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of about 62.5% by weight DMSO. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of about 62.5% by weight diethylene glycol monoethyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of about 62.5% by weight diethylene glycol monobutyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of about 62.5% by weight triethylene glycol monomethyl ether. In a further aspect of this embodiment, (ii) the one or more organic solvents comprise, consist essentially of, or consist of about 62.5% by weight 3-methoxy-3-methyl-1-butanol.

[0131] In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 10% to about 13.5% by weight TEAH. In a further aspect of this embodiment, the solution comprises, consists essentially of, or consists of about 13% by weight TEAH.

[0132] EMBODIMENT 10

[0133] In another preferred embodiment, the disclosed and claimed solution comprises: (i) one or more base components comprising, consisting essentially of, or consisting of one of about 1.5% to about 2.0% by weight KOH, about 2.5% to about 3.0% by weight DMDPAH, 10% to about 15% by weight TEAH, 5% to about 15% by weight TMAH, 5% to about 15% by weight ETMAH, and about 10% to about 13% by weight choline hydroxide; (ii) one or more organic solvents comprising, consisting essentially of, or consisting of about 60% to about 73% by weight diethylene glycol monoethyl ether; (iii) one or more triazine derivative corrosion inhibitors comprising, consisting essentially of, or consisting of about 0.5% by weight benzoguanamine; (iv) one or more second solvents comprising, consisting essentially of, or consisting of about 24% to about 25% by weight water; Comprising, consisting essentially of, or consisting of.

[0134] In a further aspect of this embodiment, (ii) the one or more organic solvents further comprise, consist essentially of, or consist of about 10.5 wt% propylene glycol. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of about 1.8 wt% KOH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of about 2.6 wt% DMDPAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of about 10 wt% to about 13.5 wt% TEAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of about 13 wt% TEAH. In a further aspect of this embodiment, (i) the one or more base components comprise, consist essentially of, or consist of about 8 wt% TMAH. In a further aspect of this embodiment, the (i) one or more base components comprise, consist essentially of, or consist of about 8% by weight ETMAH. In a further aspect of this embodiment, the (i) one or more base components comprise, consist essentially of, or consist of about 11.25% by weight choline hydroxide.

[0135] Other ingredients included or excluded as desired

[0136] In some embodiments, the disclosed and claimed solutions are substantially free or free of one or more of nitrogen-containing solvents, bis-choline salts, tri-choline salts, oxoammonium compounds, hydroxylamine and its derivatives, hydrogen peroxide, oxidizing agents, surfactants, sulfur-containing compounds, inorganic acids, organic acids such as carboxylic acids, and combinations thereof, in any combination, as these terms are defined above.

[0137] In some embodiments, the compositions disclosed herein are formulated to be substantially free or free of at least one of the following chemical compounds: alkylthiols and organosilanes.

[0138] In some embodiments, the disclosed and claimed solutions are formulated to be substantially free or free of one or more halide-containing compounds, e.g., the solutions may be substantially free or free of one or more of fluorine-containing compounds, bromine-containing compounds, chlorine-containing compounds, or iodine-containing compounds.

[0139] In some embodiments, the disclosed and claimed subject matter does not include an amidoxime compound. In some embodiments, the disclosed and claimed subject matter does not include a metal-containing compound.

[0140] In some embodiments, the disclosed and claimed solutions are substantially free or free of sulfonic acid and / or phosphoric acid and / or sulfuric acid and / or nitric acid and / or hydrochloric acid.

[0141] In some embodiments, the disclosed and claimed solutions are substantially free or free of one or more of ethyldiamine, sodium-containing compounds, and / or calcium-containing compounds, and / or manganese-containing compounds, or magnesium-containing compounds, and / or chromium-containing compounds, and / or sulfur-containing compounds, and / or silane-containing compounds, and / or phosphorus-containing compounds.

[0142] In some embodiments, the disclosed and claimed solutions are substantially free or free of surfactants.

[0143] In some embodiments, the disclosed and claimed solutions are substantially free or free of amphoteric salts, and / or cationic surfactants, and / or anionic surfactants, and / or zwitterionic surfactants, and / or non-ionic surfactants.

[0144] In some embodiments, the disclosed and claimed solutions are free or devoid of imidazole and / or anhydride.

[0145] In some embodiments, the disclosed and claimed solutions are substantially free or free of pyrrolidone and / or acetamide.

[0146] In some embodiments, the disclosed and claimed solutions are substantially free or free of peroxy compounds, and / or peroxides, and / or persulfates, and / or percarbonates, and acids thereof, and salts thereof.

[0147] In some embodiments, the disclosed and claimed solutions are substantially free or free of iodates, and / or perborates, and / or percarbonates, and / or peracids, and / or cerium compounds, and / or cyanides, and / or periodic acid, and / or ammonium molybdate, and / or ammonia, and / or abrasives.

[0148] In some embodiments, the disclosed and claimed solutions are substantially free or free of copper salt(s). In some embodiments, the disclosed and claimed solutions are substantially free or free of sugar alcohol(s). In some embodiments, the disclosed and claimed solutions are substantially free or free of copper salt(s) and sugar alcohol(s).

[0149] How to use

[0150] The disclosed and claimed subject matter further includes methods for removing one or more photoresists or etch residues or similar materials from a substrate, either in whole or in part, using one or more of the disclosed and claimed photoresist stripper and etch residue remover solutions. As mentioned above, the disclosed and claimed photoresist stripper and etch residue remover solutions can be used to remove polymeric resist materials present in a single layer or in certain types of bilayer resists. Using the methods taught below, a single polymeric resist layer can be effectively removed from a standard wafer having a single polymeric layer. The same methods can also be used to remove a single polymeric layer from a wafer having a bilayer composed of a first inorganic layer and a second or outer polymeric layer. And further, two polymeric layers can be effectively removed from a wafer having a bilayer composed of two polymeric layers.

[0151] In one aspect of this embodiment, a process or method for removing photoresist or etch residue from a substrate comprises: (i) contacting the substrate with one or more of a photoresist stripper and etch residue remover solution for a time sufficient to remove a desired amount of photoresist or similar material; (ii) removing the substrate from the solution; (iii) rinsing the solution from the substrate with DI water or a solvent; and (iv) optionally drying the substrate; Includes.

[0152] In one embodiment, step (i) comprises immersing the substrate in one or more of the photoresist stripper and etch residue remover solutions and optionally agitating the substrate to facilitate removal of the photoresist. Such agitation may be accomplished by mechanical stirring, circulation, or bubbling of an inert gas through the composition.

[0153] In one embodiment, step (ii) comprises rinsing the substrate with water or alcohol. In one aspect of this embodiment, the preferred form of water is DI water. In another aspect of this embodiment, the preferred solvent is isopropanol (IPA). In another aspect of this embodiment, the components that undergo oxidation may be rinsed or rinsed under an inert atmosphere.

[0154] Using the above method (and variations thereof), the disclosed and claimed photoresist stripper and etch residue remover solutions can be used to remove thick and thin positive tone or negative tone photoresists. Thick photoresists can be about 5 μm to about 100 μm or more, or about 15 μm to 100 μm, or about 20 μm to about 100 μm in advanced packaging applications for semiconductor devices. In other cases, the chemical solutions can be used to remove photoresists from about 0.1 μm to about 100 μm or more, or about 0.2 μm to 100 μm, or about 0.3 μm to about 100 μm. EXAMPLES

[0155] Reference is now made to more specific embodiments of the present disclosure and experimental results which provide support for such embodiments. These examples are presented below in order to more fully illustrate the disclosed subject matter, and should not be construed as limiting the disclosed subject matter in any manner.

[0156] It will be apparent to those skilled in the art that various modifications and variations can be made in the subject matter disclosed herein and in the specific examples provided without departing from the spirit or scope of the disclosed subject matter. Accordingly, the disclosed subject matter, including the description provided by way of the following examples, is intended to cover modifications and variations of the disclosed subject matter that fall within the scope of any claims and their equivalents.

[0157] Materials and Methods:

[0158] All materials used in this patent were purchased and / or available from Sigma Aldrich and were used in the formulations as received. All material amounts in the tables are reported as weight percent values ​​and reflect "neat" values ​​where appropriate unless otherwise noted. The balance of the formulation weight is due to moisture present in the raw materials.

[0159] Testing was performed using blanket Cu wafers. For the immersion process, three coupon-sized samples of the semiconductor wafer were processed in a beaker. The beaker was charged with 100 grams of the stripping composition and heated to the target temperature. Once the stripping composition was at the target temperature of 70°C, the three coupons were placed in a holder in the beaker and slight agitation was applied with a stir bar. The temperature was maintained at the process temperature in the table throughout the process. After a total processing time of 10 to 30 minutes, the coupons were removed from the beaker, rinsed with DI water and IPA, and dried with a stream of nitrogen.

[0160] The etch rate of Cu is determined by measuring the film thickness before and after treatment in the formulation using a CDE four-point probe RESMAP. The typical starting layer thickness was 1000 Å for copper substrates. The copper substrates were treated in the prepared formulations at 70 °C for 10-30 min at different stirring speeds, after which the copper substrates were rinsed with water and dried by blowing nitrogen gas.

[0161] The following abbreviations are used in the various compositions in the table below: [Table 1]

[0162] All amounts of materials in the tables are reported as weight percent values ​​and reflect "neat" values ​​where appropriate unless otherwise noted. All ingredients listed for the exemplary and comparative formulations total 100 weight percent. The comparative formulations do not contain guanamine (e.g., BZG) corrosion inhibitors.

[0163] Non-Aqueous Examples and Comparative Examples

[0164] Formulations 1 and 2 were prepared by combining the following ingredients: [Table 2]

[0165] The stock formulation consisted of 80.9% DMSO, 6.0% monoethanolamine, and 13.10% DMDPAH+PG. Different copper corrosion inhibitors were added to the base formulation at various different concentrations to test their protection against copper etching compared to Formulation 1. The copper etch rate was tested at two agitation speeds, 100 rpm and 400 rpm, for 20 minutes at 70°C.

[0166] Table 2 shows that among the corrosion inhibitors tested, 2,4-diamino-6-phenyl-1,3,5-triazine (benzoguanamine) and melamine showed obviously lower copper etch rates at different stirring speeds. The formulations containing these two corrosion inhibitors did not show any color change. The Cu surface also showed no color change. Higher concentrations of these two corrosion inhibitors were also tested, which are listed in Table 3. The results clearly indicated that these two corrosion inhibitors were good copper corrosion inhibitors in a wide concentration range. Although both resorcinol and catechol showed lower copper etch rates at certain concentrations, their formulations showed dark color change, suggesting the instability of these corrosion inhibitors. [Table 3] [Table 4]

[0167] Copper salts were also tested as copper corrosion inhibitors and the results are shown in Table 4. Apparently, copper salts were also good copper etching inhibitors. However, after treatment, the color of the copper surface changed to a darker color, suggesting adsorption to the copper surface. These formulations also showed precipitation over time, which was more evident at higher concentrations of copper salt. The instability of copper salts as copper corrosion inhibitors is shown in Table 4. The copper etch rate gradually increased with aging time for copper nitrate, whereas with benzoguanamine, no significant change in copper etch rate was observed and no color change in the copper surface was observed. [Table 5]

[0168] Combinations of other corrosion inhibitors with benzoguanamine were also tested for copper etch inhibition, as shown in Table 5. The results showed that combining other corrosion inhibitors with benzoguanamine significantly reduced the copper etch rate. Among these corrosion inhibitors, the combination of resorcinol and benzoguanamine showed the lowest copper etch rate. [Table 6]

[0169] The copper etch rate of the combination of benzoguanamine (0.8 wt%) and resorcinol (0.8 wt%) was also tested in an accelerated aging test at 50° C., as shown in Table 6. As shown, the copper etch rate did not show significant change with aging time, indicating the stable copper corrosion inhibition behavior of benzoguanamine. [Table 7]

[0170] Table 7 shows the etch rates for other metals using Formulation 2. [Table 8]

[0171] Examples and Comparative Examples Containing Water

[0172] Formulations containing water were prepared with different base combinations as shown in Table 8 (KOH), Table 9 (DMDPAH), Table 10 (TEAH), Table 11 (TEAH), and Table 12 (misc.). [Table 9] [Table 10] [Table 11] [Table 12] [Table 13]

[0173] Analysis of Example Formulations: Corrosion Inhibitors and Etch Rates

[0174] Tables 8-12 show (i) comparative stripper solutions and (ii) solutions in accordance with the disclosed and claimed subject matter that were tested using an immersion process to measure Cu etch rates. The thickness of the Cu layer was measured before and after processing for each coupon using RESMAP, and the thickness change and etch rate were estimated.

[0175] Different water levels of 0 wt%, 15 wt%, 25 wt%, and 40 wt% were tested to monitor the Cu etch rate of DE solvent and strong base. Exemplary solutions of the disclosed and claimed subject matter shown in Tables 8-12 showed that benzoguanamine significantly reduced the Cu etch rate regardless of the water level when using various strong bases. The Cu etch rates of formulations containing TEAH and various solvents such as DMSO, DE solvent, DB solvent, MMB, and TEGME were tested with and without triazine corrosion inhibitors. Exemplary solutions of the disclosed and claimed subject matter also showed that benzoguanamine significantly reduced the Cu etch rate when using various different solvents and solvent mixtures. As demonstrated, the solutions of the disclosed and claimed subject matter showed that the use of benzoguanamine unexpectedly significantly reduced the Cu etch rate regardless of the strong base.

[0176] Although the disclosed and claimed subject matter has been described and illustrated in a certain degree of detail, it will be understood that the disclosure is made by way of example only, and that numerous changes in the conditions and sequence of steps can be made by those skilled in the art without departing from the spirit and scope of the disclosed and claimed subject matter.

Claims

1. (i) one or more base components comprising one or more of an amine, a quaternary ammonium hydroxide, an inorganic base, and combinations thereof; (ii) one or more organic solvents, and (iii) one or more guanamine compounds of formula 2: 【Chemical 1】 In the formula, R １ represents a hydrogen atom, an oxygen-containing group, a hydroxyl group, a mercapto group, a nitrogen-containing group, an amine, C １ ~C １０ an amino group substituted with an alkyl group, a carboxyl group, a phenyl group, a substituted phenyl group, an alkoxy group, C １ ~C ２０ Straight-chain alkyl group, C ３ ~C ２０ Branched alkyl group, C ３ ~C １０ Cyclic alkyl group, C ５ ~C １２ Aryl group, C ２ ~C １０ linear alkenyl group, C ３ ~C １０ Branched alkenyl group, C ２ ~C １０ Straight-chain alkynyl group, C ３ ~C １０ Branched alkynyl group, halide-substituted C １ ~C ２０ a linear alkyl group, and 【Chemistry 2】 C substituted with １ ~C ２０ selected from alkyl, one or more guanamine compounds, 1. A photoresist stripper and etching residue remover solution comprising:

2. The photoresist stripper and etching residue remover solution of claim 1, wherein the solution does not contain DMSO.

3. R １ is hydrogen, —OH group, phenyl group, substituted phenyl group, amine, carboxyl group, C １ ~C ６ Linear alkyl groups, and C ３ ~C ６ 10. The photoresist stripper and etching residue remover solution of claim 1, wherein the alkyl group is selected from branched alkyl groups.

4. R １ 2. The photoresist stripper and etching residue remover solution of claim 1, wherein is a phenyl group.

5. R １ 10. The photoresist stripper and etch residue remover solution of claim 1, wherein is a substituted phenyl group.

6. 10. The photoresist stripper and etch residue remover solution of claim 1, wherein the (i) one or more base components comprise one or more of DMDPAH, TEAH, KOH, TMAH, ETMAH, choline hydroxide, and monoethanolamine.

7. 2. The photoresist stripper and etch residue remover solution of claim 1, wherein the (ii) one or more organic solvents comprise one or more of DMSO, propylene glycol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, and 3-methoxy-3-methyl-1-butanol.

8. 10. The photoresist stripper and etch residue remover solution of claim 1, further comprising: (iv) water as one or more second solvents.

9. 10. The photoresist stripper and etch residue remover solution of claim 1, further comprising (iv) water as one or more second solvents, and wherein the amount (wt %) of the (ii) one or more organic solvents is greater than the amount (wt %) of the (iv) one or more second solvents.

10. (v) the photoresist stripper and etch residue remover solution of claim 1, further comprising one or more non-triazine corrosion inhibitors, such as one or more of resorcinol, BZT, sorbitol, 8-HQ, and copper (II) nitrate.

11. (v) the photoresist stripper and etch residue remover solution of claim 1, further comprising as one or more non-triazine corrosion inhibitors BZT and one or more of resorcinol, sorbitol, 8-HQ, and copper (II) nitrate.

12. (i) about 10% to about 15% by weight of TEAH; (ii) from about 46.5% to about 62.5% by weight of one or more of diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, and 3-methoxy-3-methyl-1-butanol; (iii) about 0.25% to about 0.75% by weight of benzoguanamine, and (iv) about 24% to about 40% by weight of water; Including, 10. The photoresist stripper and etch residue remover solution of claim 1, wherein the solution is DMSO-free.

13. 13. The photoresist stripper and etch residue remover solution of claim 12 comprising about 13% by weight TEAH.

14. 13. The photoresist stripper and etch residue remover solution of claim 12 comprising about 0.5% by weight of benzoguanamine.

15. 13. The photoresist stripper and etch residue remover solution of claim 12 comprising about 40% by weight water.

16. 13. The photoresist stripper and etch residue remover solution of claim 12 comprising about 24% water by weight.

17. 13. The photoresist stripper and etch residue remover solution of claim 12 comprising about 62.5% by weight diethylene glycol monoethyl ether.

18. (i) about 1.75 wt. % to about 2.0 wt. % KOH; (ii) about 55% to about 97.5% by weight of diethylene glycol monoethyl ether; (iii) about 0.25% to about 0.75% by weight of benzoguanamine, and (iv) the remaining amount of water; 10. The photoresist stripper and etch residue remover solution of claim 1, comprising:

19. (i) about 2.5 wt.% to about 3.0 wt.% DMDPAH; (ii) about 10.5% by weight propylene glycol, and about 45% to about 86.5% by weight diethylene glycol monoethyl ether; (iii) about 0.25% to about 0.75% by weight of benzoguanamine, and (iv) the remaining amount of water; 10. The photoresist stripper and etch residue remover solution of claim 1, comprising:

20. (i) about 2.6 wt. % DMDPAH, and about 6 wt. % monoethanolamine; (ii) about 80% by weight DMSO and about 10.5% by weight propylene glycol; and (iii) about 0.75% to about 1.0% by weight of benzoguanamine; 10. The photoresist stripper and etch residue remover solution of claim 1, comprising:

21. 21. The photoresist stripper and etch residue remover solution of claim 20, further comprising one or more of resorcinol, 8-HQ, copper nitrate, histidine, and sorbitol.

22. 1. A method for removing photoresist or etch residue from a substrate, comprising: (i) contacting the substrate with one or more of the photoresist stripper and etch residue remover solutions of claim 1 for a time sufficient to remove a desired amount of the photoresist or etch residue; (ii) removing the substrate from the solution; (iii) rinsing the solution from the substrate with DI water or a solvent; and (iv) optionally drying the substrate; A method comprising:

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