Microchannel Assembly Cooling Power Circuit for Power Supply Box of Substrate Processing System

Abstract

A cooling system for a power circuit of a substrate processing tool is provided. The cooling system includes a microchannel assembly and a printed circuit board. The microchannel assembly includes an input manifold, an output manifold, and a microchannel layer. The microchannel layer includes microchannels extending from the input manifold to the output manifold and configured to pass coolant from the input manifold to the output manifold. The printed circuit board includes at least one component-carrying layer, the component-carrying layer attached to the microchannel layer between the input manifold and the output manifold. The at least one component-carrying layer includes a power circuit including electrical components configured to power one or more electrical components of the substrate processing tool.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of U.S. Provisional Application No. 63 / 271,636, filed October 25, 2021. The entire disclosure of the above application is incorporated herein by reference.

[0002] The present disclosure relates to a cooling system for an AC power supply of a substrate processing tool. [Background technology]

[0003] The background discussion provided herein is intended to generally present the context of the present disclosure. To the extent described in this background section, the work of the presently designated inventors, as well as aspects of the discussion that may not otherwise be considered prior art at the time of filing, are not admitted, explicitly or implicitly, as prior art to the present disclosure.

[0004] Substrate processing systems can be used to perform deposition, etching, and / or other processing of substrates, such as semiconductor wafers. During processing, a substrate is placed on a substrate support in a processing chamber of the substrate processing system. A gas mixture including one or more precursors can be introduced into the processing chamber, and a plasma can be struck to activate a chemical reaction.

[0005] A substrate processing system may include substrate processing tools disposed within a fabrication chamber. Each of the substrate processing tools may include multiple process modules or process chambers. Each of the processing tools performs a single type of process, such as a cleaning process, a deposition process, an etching process, etc. Substrates are transferred into the substrate processing tool through one or more intermediate chambers, such as a Front Opening Unified Pod (FOUP), a Front End of Equipment Module (EFEM), and / or a load lock. Substrates are transferred between the process modules in a Vacuum Transfer Module (VTM). The substrate processing tool includes various electronic components, devices, and systems powered by an alternating current (AC) source. Summary of the Invention

[0006] A cooling system for a power circuit of a substrate processing tool is provided. The cooling system includes a microchannel assembly and a printed circuit board. The microchannel assembly includes an input manifold, an output manifold, and a microchannel layer. The microchannel layer includes microchannels extending from the input manifold to the output manifold and configured to pass a coolant from the input manifold to the output manifold. The printed circuit board includes at least one component-carrying layer, the component-carrying layer attached to the microchannel layer between the input manifold and the output manifold. The at least one component-carrying layer includes a power circuit including electrical components configured to power one or more electrical components of the substrate processing tool.

[0007] In another feature, the microchannel layer is disposed between layers of the printed circuit board, whereby the microchannel layer is embedded within the printed circuit board. In another feature, the at least one component carrying layer includes a first component carrying layer disposed on a first side of the microchannel layer and a second component carrying layer disposed on a second side of the microchannel layer opposite the first side.

[0008] In another feature, the cooling system further includes a first conductive layer including a first pattern of conductive traces and disposed between the microchannel layer and the first component-carrying layer, and a second conductive layer including a second pattern of conductive traces and disposed between the microchannel layer and the second component-carrying layer. In another feature, the cooling system further includes an AC box. The microchannel assembly and the printed circuit board are mounted on the same interior sidewall of the AC box.

[0009] In another aspect, the cross-flow box is hermetically sealed. In another aspect, the microchannels include sets of microchannels. A distance between the sets of microchannels is greater than a distance between the microchannels within each of the sets of microchannels. In another aspect, each set of microchannels includes a different number of microchannels.

[0010] In another feature, the cooling system further includes a conductive layer and vias. The at least one component-carrying layer includes a component-carrying layer. The conductive layer is disposed between the microchannel layer and the component-carrying layer. The vias extend through the microchannel layer in spaces between the sets of microchannels and contact the conductive traces of the conductive layer.

[0011] In another aspect, the microchannel has a linear shape. In another aspect, the microchannel has a sinusoidal shape.

[0012] In another feature, the cooling system further includes a pump configured to circulate the coolant through the microchannel assembly and a controller configured to select operation in a laminar flow mode or a turbulent flow mode and operate the pump accordingly.

[0013] In another feature, a cooling system for a power circuit of a substrate processing tool. The cooling system includes a microchannel assembly and a plurality of printed circuit board layers. The microchannel assembly includes an input manifold, an output manifold, and a microchannel member. The microchannel member includes microchannels extending from the input manifold to the output manifold and configured to pass a coolant from the input manifold to the output manifold. The printed circuit board layers include a first printed circuit board layer and a second printed circuit board layer. The first printed circuit board layer is disposed on a first side of the microchannel member. The second printed circuit board layer is disposed on a second side of the microchannel member. The printed circuit board layers include a power circuit including an electrical component configured to power one or more electrical components of the substrate processing tool.

[0014] In another feature, the first printed circuit board layer includes a first component carrying layer and a first conductive layer. The second printed circuit board layer includes a second component carrying layer and a second conductive layer. In another feature, the first conductive layer includes a first pattern of conductive traces. The second conductive layer includes a second pattern of conductive traces.

[0015] In another aspect, the microchannel member includes flanges configured to connect to the input and output manifolds and a central member extending between the flanges and including the microchannels, hi another aspect, the flanges and the central member are integrally formed as a single component.

[0016] In another feature, the flange extends perpendicular to the central member. The flange and central member have an "H" shaped cross section. In another feature, the cooling system further includes a gasket disposed between the flange and the input and output manifolds. In another feature, the cooling system further includes an O-ring disposed between the flange and the input and output manifolds. In another feature, the input manifold, the output manifold, and the microchannel member are integrally formed as a single component.

[0017] In another aspect, the microchannel has a linear shape. In another aspect, the microchannel has a sinusoidal shape.

[0018] In another feature, the cooling system further includes a pump configured to circulate the coolant through the microchannel assembly and a controller configured to select operation in a laminar flow mode or a turbulent flow mode and operate the pump accordingly.

[0019] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

[0020] The present disclosure will become more fully understood from the detailed description and the accompanying drawings. [Brief description of the drawings]

[0021] [Figure 1] 1 is an exemplary substrate processing tool.

[0022] [Diagram 2] FIG. 2 is a plan view of another exemplary substrate processing tool.

[0023] [Diagram 3] FIG. 1 illustrates a functional block diagram of an example power system for a substrate processing tool including an example alternating current (AC) power box in accordance with the present disclosure.

[0024] [Figure 4] 1 is an exemplary microchannel assembly according to the present disclosure.

[0025] [Diagram 5] FIG. 2 is an exploded view of a portion of a microchannel assembly cooling power circuit showing microchannels, conductive layers, and printed circuit board layers according to the present disclosure.

[0026] [Figure 6] FIG. 2 is a perspective view of an exemplary portion of a microchannel assembly showing a set of microchannels disposed between a pair of manifolds according to the present disclosure.

[0027] [Figure 7] FIG. 7 is an exemplary temperature distribution diagram for a microchannel assembly similar to that shown in FIG. 6.

[0028] [Figure 8A] FIG. 2 is a perspective view of an example AC power box including an exploded view of an example microchannel assembly cooling power circuit according to the present disclosure.

[0029] [Figure 8B]FIG. 7C is a perspective view of the AC power box of FIG. 7B with the microchannel assembly cooling power circuit attached to the side wall of the AC power box.

[0030] [Figure 9A] FIG. 13 is a perspective view of another exemplary microchannel assembly cooling power circuit having a gasket sealed manifold in accordance with the present disclosure.

[0031] [Figure 9B] FIG. 8B is an exploded view of the microchannel assembly cooling power circuit of FIG. 8A.

[0032] [Figure 10A] FIG. 13 is a perspective view of another exemplary microchannel assembly cooling power circuit having an O-ring sealed manifold in accordance with the present disclosure.

[0033] [Figure 10B] FIG. 10B is an exploded view of the microchannel assembly cooling power circuit of FIG. 10A.

[0034] [Figure 11A] FIG. 13 is a perspective view of another exemplary microchannel assembly cooling power circuit having an integrally formed manifold in accordance with the present disclosure.

[0035] [Figure 11B] FIG. 11B is an exploded view of the microchannel assembly cooling power circuit of FIG.

[0036] [Figure 12] FIG. 1 is a perspective view of a microchannel portion of a microchannel assembly including a straight shaped microchannel according to the present disclosure.

[0037] [Figure 13] FIG. 1 is a perspective view of a portion of a microchannel assembly including a sinusoidally shaped microchannel according to the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0038] In the drawings, reference numbers may be reused to identify similar and / or identical elements.

[0039] A substrate processing tool may include one or more processing modules for processing a substrate. The processing modules may be configured to perform, for example, etching, deposition, and cleaning operations. The substrate processing tool may include one or more AC boxes for powering various circuits, devices, and components. Each of the AC boxes may be allocated to one or more modules (e.g., processing modules) and / or systems of the substrate processing tool. Each AC box may be configured to meet high power requirements and may include AC circuit components and a cooling assembly. As an example, some of the AC circuit components (e.g., solid state relays (SSRs), fuses, and contactors) may be mounted on a printed circuit board (PCB), and the PCB may be mounted on a heat exchanger of the cooling assembly. The PCB may be mounted on the heat exchanger via a spacer that separates the PCB from the heat exchanger.

[0040] The AC circuit components are connected to the PCB and generate heat, which may be absorbed by a heat exchanger. The heat exchanger may include a cooling pad (or block) formed of aluminum with copper tubing embedded therein for circulating a coolant (e.g., water) to cool the cooling pad. The AC circuit components on the PCB may be in contact with the cooling pad or may be spaced apart from the cooling pad. The copper tubing may be implemented as a process cooling water (PCW) line.

[0041] The SSR on the PCB may be the primary heat source generating 65 watts (W) and the PCB in the AC power box may generate a total of 100 W. The AC power box may have a rated capacity of 16.6 kilowatts (kW). Heat generated by the SSR is dissipated to the process cooling water via cooling pads and PCW lines. The SSR may be in contact with the cooling pads. Fans may be used to provide forced convection cooling to ensure that the operating temperature of the components in the AC box does not exceed the maximum operating temperature of the components. The described combination of PCW driven heat exchanger and forced convection maintains the required temperature in the AC box.

[0042] To facilitate demanding processes and meet more stringent node-level requirements (e.g., dimensions of features on a substrate), each generation of etch tools comes with higher power requirements. As an example, node-level requirements have decreased from 40 nanometer (nm) pitch levels (or distance between features) to 3-4 nm, and the rated capacity of AC power boxes has increased to 38.4 kW. To meet the increased power requirements, the AC boxes and corresponding components may be enlarged with expanded heat dissipation features. Active cooling of the components within the AC boxes may be achieved using conventional cooling assemblies as described above, including fans and heat exchangers along with heat sinks and cooling channels. However, the cooling assemblies may be bulky, require significant amounts of energy to operate the fans, and have a limited amount of cooling capacity.

[0043] Examples described herein include a microchannel assembly cooling power circuit including a PCB and a microchannel layer. The microchannel layer may be embedded within the respective PCB. The microchannel assembly cooling power circuit does not include a cooling fan, is compact, and provides improved cooling capacity over conventional heat exchanger designs. The microchannel assembly cooling power circuit may be implemented within an AC box, which may be included within a substrate processing tool to power various components, devices, and systems of the substrate processing tool. An exemplary substrate processing tool pair is shown in FIGS. 1-2. The microchannel assembly cooling power circuit and AC box disclosed herein are applicable to other substrate processing tools.

[0044] Referring now to FIG. 1, a top-down view of an exemplary substrate processing tool 100 is shown. The substrate processing tool 100 includes process modules (PMs) 104. By way of example only, each of the PMs 104 may be configured to perform one or more respective processes on a substrate. A substrate to be processed is loaded into the substrate processing tool 100 via a port in a loading station of an atmospheric-to-vacuum (ATV) transfer module, such as an equipment front-end module (EFEM) 108, and then transferred into one or more of the PMs 104. For example, a transfer robot 112 is positioned to transfer the substrate from the loading station 116 to an airlock or load lock 120, and a robot 124 of a vacuum transfer module 128 is positioned to transfer the substrate from the load lock 120 to the various PMs 104. In the example shown in FIG. 1, the substrate processing tool 100 has a circular configuration. Thus, the PMs 104 are azimuthally arranged around the VTM 128. A manufacturing room may include some of the substrate processing tools 100.

[0045] 2 illustrates a top view of another example configuration of a substrate processing tool 200. The processing tool 200 includes a loading station 204, a front-end equipment module (EFEM) 208, a load lock 212, and a vacuum transfer module (VTM) 216 arranged in a linear configuration. By way of example only, the loading station 204 may be implemented as a front-opening unified pod (FOUP). In some examples, the load lock 212 may be fully or partially integrated within the EFEM 208. In another example, the load lock 212 is located outside of and adjacent to the EFEM 208.

[0046] Tool 200 includes two parallel rows of linearly configured PMs 220 adjacent to and offset from VTM 216. PM 220 may include substrate processing chambers configured to perform etching, deposition, cleaning, or other processing operations on a substrate. Etching may include dielectric etching (e.g., inductively coupled plasma (ICP) etching) or capacitive etching (e.g., capacitively coupled plasma (CCP) etching).

[0047] The VTM 216 may include one or more robots 224 having various configurations. Although shown with one arm 230, each of the robots 224 may have a configuration that includes one, two, or more than two of the arms 230. In some examples, the robot 224 may include one or two end effectors 232 on each of the arms 230.

[0048] The substrate processing tool 200 may include one or more storage buffers 236. The storage buffer 236 is configured to store one or more substrates between processing stages, before or after processing, etc., and / or store edge rings, covers, and other components of the PM 220. In another example, one or more of the storage buffer 236, additional process modules, post-processing modules, and / or other components may be located at an end of the VTM 216 opposite the loading station 204. In some examples, one or more of the EFEM 208, load locks 212, VTM 216, and PM 220 may have a vertically stacked configuration.

[0049] Each of the PMs 220 includes associated internal and external components (not shown), including, but not limited to, radio frequency (RF) generator components, power circuit components, and gas delivery system components. For example, each of the process modules 220 includes an RF generator 240 and a gas box 244 (e.g., including one or more manifolds, valves, flow controllers, and other components). In a substrate processing tool 200 according to the present disclosure, the RF generator 240 and the gas box 244 are disposed above the PMs 220. The RF generator 240 and the gas box 244 are disposed side-by-side above the process modules 220. The RF generator and the gas box may be disposed in other arrangements.

[0050] FIG. 3 illustrates an example power system 300 for a substrate processing tool including a cooling system 301 having an example AC power box 302. The AC power box 302 may be replaced with any of the AC power boxes disclosed herein and may include a microchannel assembly cooling power circuit 304. The microchannel assembly cooling power circuit 304 receives a coolant (e.g., water, a dielectric stable fluorocarbon-based fluid including perfluorinated compounds (PFCs), or other coolant) from a coolant source 312 (e.g., a reservoir) via coolant lines (e.g., conduits or hoses) 308. The coolant lines 308 are connected to input and output connectors on the microchannel assembly cooling power circuit 304. The microchannel assembly cooling power circuit 304 provides a compact closed loop configuration with the lines 308 and the pump 310. Examples of connectors are shown in FIGS. 9A-13. The coolant lines 308 may be connected to the pump 310, which may in turn be connected to a coolant source 312.

[0051] The microchannel assembly cooling power circuit 304 includes an AC power circuit 314 that is cooled by the microchannel assembly. Examples of the microchannel assembly and portions thereof are shown in FIGS. 4-13 along with example printed circuit board (PCB) layers on which the AC power circuit 314 may be implemented. The AC power circuit 314 may receive conventional power from a conventional power source 316. The AC power box 302 may include other AC power components such as capacitors, electrical connectors, etc., which may be connected to the AC power circuit 314.

[0052] The AC power box 302 may, by way of example, convert 396 volts (V) AC power to 528V AC power having a frequency of 50-60 Hertz (Hz) and a current of up to 80 Amps (A). The AC power circuitry 314 and AC power components 318 may, for example, power direct current (DC) components and devices 320, heaters 322, electrodes 324 (e.g., electrodes in a showerhead and substrate support), valves 326, pumps 328, and other components and devices 330. The DC components and devices 320 may include an Ethernet hub DC enclosure. The heaters 322 may include tool heaters, PM heaters, and the like. The electrodes 324 may include upper and lower electrodes in a PM. The pumps 328 may include turbomolecular pumps, roughing pumps, water pumps, and / or other vacuum pumps.

[0053] The pump 310 and AC power circuit 314 may be controlled by a controller 340. The controller 340 may control the flow rate of coolant through the microchannels of the microchannel assemblies of the microchannel assembly cooling power circuit 304. The controller 340 may control the power supplied to the power DC components and devices 320, heaters 322, electrodes 324, valves 326, pumps 328, and other components and devices 330.

[0054] 4 shows a microchannel assembly 400 including an input manifold 402, microchannels 404, and an output manifold 406. The input manifold 402 may include an input connector 408. The output manifold 406 may include an output connector 410. The connectors 408, 410 may be disposed at various locations on the manifolds 402, 406. The microchannels 404 extend from the input manifold 402 to the output manifold 406. By way of example, the microchannels 404 and the manifolds 402, 406 may be formed of plastic and / or other suitable materials.

[0055] The number of microchannels, N, is determined by the length, L, of the microchannel 404. microAs an example, the number of microchannels N can be selected using Equations 1-3, where D micro is the diameter of the microchannel, T is the temperature of the coolant in the microchannel 404, and h micro is the thermal convection coefficient, Q is the coolant flow rate, K is temperature in Kelvin, m is meters, W is watts, and T PCB is the temperature of the PCB, T Fluid is the temperature of the coolant passing through the microchannel 404. As an example, Q=67 W, T PCB = 60°C, T Fluid = 25°C, and D micro =500×10 -6 m. These values ​​are given for illustrative purposes only and may vary from those shown. These values ​​and Equations 1-3 are given for a microchannel having a circular cross section, as further defined below.

number

number

number

[0056] The microchannel 404 may have a variety of different cross-sectional shapes. A cross-section of a microchannel refers to a transverse slice through the microchannel in a direction perpendicular to the longitudinal length (or longitudinal centerline) of the microchannel. The microchannel 404 may have a circular, rectangular, square, oval, or other shaped cross-section. In one embodiment, the microchannel 404 has a rectangular or oval cross-section. Rectangular and oval cross-sections provide better heat transfer characteristics than circular cross-section microchannels. Rectangular and oval cross-section microchannels have relatively high Nusselt numbers relative to other shaped cross-sections of similar dimensions (i.e., cross-sectional length and width). The Nusselt number may be determined using Equation 4, where A is the area of ​​the cross-section of the microchannel, P is the perimeter of the cross-section of the microchannel, and I p * is the polar moment of inertia.

number

[0057] Microchannels with different cross sections have different aspect ratios. The aspect ratio ε refers to the ratio between the width and length dimensions of the cross section. As an example, for an aspect ratio ε of 0.25, Nu rect =6.75, Nu ellipse =6, and Nu Circular = 4. Elliptical and rectangular cross sections have 50% to 60% better heat transfer characteristics than circular cross sections. The convective heat transfer coefficient, h, expressed by Equation 5, where k is the thermal conductivity of the microchannel and d is the hydraulic diameter of the microchannel:

number

[0058] Rectangular and oval cross sections can be fabricated using direct-write assembly methods to provide the required surface roughness using appropriate nozzle geometries for ink drafting. Nozzle geometries can include circular, rectangular, and oval nozzles to provide circular, rectangular, and oval microchannels. The total heat transfer of the microchannel can be characterized by Equation 6, where A is the surface area under convection and ΔT is the total temperature rise of the coolant as it exits the output manifold. q = hA(ΔT) (6)

[0059] The microchannel assemblies disclosed herein may be manufactured using one or more methods. In one embodiment, the microchannel assemblies are manufactured using a direct-write assembly method. FIG. 5 shows a portion 500 of a microchannel assembly cooling power circuit including a microchannel layer 502, conductive layers 504, 506, and component-carrying layers 508, 510. The layers 502, 504, 506, 508, 510 may be referred to as PCB layers of a PCB (or simply layers of a PCB). Although shown separately, the layers 502, 504, 506, 508, 510 may be in contact with one another. The microchannel layer 502 includes sets 520, 522, 524, 526 of microchannels, each set including a plurality of microchannels extending from a first end 530 of the microchannel layer 502, through the microchannel layer 502, to a second end 532 of the microchannel layer 502. The spacing between the sets of microchannels 520, 522, 524, 526 and the distance (or pitch) between adjacent microchannels can be set to adjust the amount of cooling in the corresponding area.

[0060] The microchannel assembly cooling power circuits can be formed using a direct-write method using a fugitive ink inside the resin. For example, a syringe with a micro-nozzle can be used to apply a fugitive organic ink (e.g., wax) to a substrate (e.g., PCB layer and / or conductive layer) to provide ink lines (or molds) in the shape of the channels to be formed. Resin can then be applied to fill the gaps between the ink lines. After resin hardening, the ink is removed, resulting in the microchannels. This can be done using hot water to remove the wax as it is applied. The substrate is removed from the resin plate, and then manifolds can be attached to the inputs and outputs of the microchannels. If the PCB layers are not already attached, they can be attached to both sides of the resin plate. As shown, a conductive layer can be disposed between the resin plate and the component-carrying layer. The resin plate acts as a heat sink, transferring thermal energy from the conductive layer and the component-carrying layer to the coolant passing through the microchannels. The resin plate can be formed of, for example, acrylonitrile butadiene styrene (ABS).

[0061] Alternative manufacturing methods may be used to form the microchannel assembly cooling power circuit of Figure 5 and other microchannel assembly cooling power circuits disclosed herein. Manufacturing methods include stereolithography, through which the manifolds and / or multichannel layers, members, and / or plates may be formed of resin, multi-jet fusion (MJF), through which the manifolds and / or multichannel layers, members, and / or plates may be formed of nylon, and selective laser melting (SLM), through which the manifolds and / or multichannel layers, members, and / or plates may be formed of stainless steel (SST) or aluminum alloys such as age hardened cast aluminum alloys (e.g., AlSi10Mg).

[0062] The layers 502, 504, 506, 508, 510 may be attached to one another using epoxy and / or fasteners. The microchannel layer 502 is disposed between the PCB layers 504, 508 and the PCB layers 506, 510, and is therefore referred to as being embedded within the PCB to maximize heat dissipation. The microchannel layer 502, which may be formed of resin, is "sandwiched" between two adjacent conductive layers 504, 506, which are in turn sandwiched between two component-carrying layers 508, 510. The conductive layers 504, 506 may include conductive trace patterns formed of copper, for example. The conductive layers 504, 506 may be used to connect various circuit components mounted on the component-carrying layers 508, 510. The conductive layers 504, 508 may include traces, some of which are at a ground reference potential and / or one or more power supply voltage potentials. The component support layers 508, 510 may be formed of a fiberglass epoxy laminate material.

[0063] The stacked configuration of layers 502, 504, 506, 508, 510 helps dissipate heat from the SSR and other circuit components. This configuration typically dissipates heat at 70-80 W / cm 2 Low thermal resistance and high heat dissipation capacity (e.g., 750 watts per square centimeter (W / cm)) compared to conventional heat exchanger designs. 2)). The microchannel assembly cooling power circuit has a small form factor and is tightly coupled to the heat source, thereby minimizing thermal resistance given the close proximity to the components. The microchannel assembly cooling power circuit may eliminate the need for a secondary forced convection medium (e.g., a fan) for additional heat dissipation. The secondary forced convection medium, when supplemented with a conventional heat exchanger, contributes approximately 18-20% of the total heat load dissipation at 25°C and a flow rate of 1 gallon per minute (GPM) for the heat exchanger. The use of fans also requires that a heating ventilation and air conditioning (HVAC) system be operated to cool the environment of the substrate processing tool in order to maintain the temperature of the environment, thereby increasing operating costs. The elimination of the fan and increased heat transfer to the coolant results in reduced HVAC system operating costs and a more reliable cooling system.

[0064] The low thermal resistance and high heat dissipation allow for a small overall footprint of the microchannel assembly cooling power circuit. The elimination of the fan and replacement of the conventional heat exchanger with the embedded and / or centrally disposed microchannels provides a volume reduction of approximately 60%. This volume reduction is related to the external dimensions of the microchannel assembly cooling power circuit (or the combined cooling assembly and power circuit). As an example, a conventional cooling assembly including a conventional heat exchanger may consume 114.3 cubic inches of space, whereas the exemplary embodiment may consume 41 cubic inches of space, thereby providing a net volume reduction of 64%. The elimination of the fan also saves 18 W of power that would normally be used to operate the fan.

[0065] The compact microchannel assembly cooling power circuitry may be disposed within a hermetically sealed AC box and the corresponding microchannel assembly may be constructed in a unitary construction. As further described below in conjunction with Figures 8A-8B, the described hermetically sealed AC box and unitary construction helps provide inlet protection against dust and protection against liquid exposure.

[0066] The microchannel assembly cooling power circuit disclosed herein may include layers stacked similar to the layers of the microchannel assembly cooling power circuit. The component-carrying layers may include various circuit components, including SSRs, fuses, contactors, and other circuit components, which may be densely arranged to achieve a high density of components. This high density of components is made possible by the high heat dissipation capabilities of the microchannel assembly. The outer dimensions of the AC box disclosed herein are minimal due to the compact configuration and high density of components packaged on the component-carrying layers. The microchannel assembly cooling power circuit is scalable in size for a variety of applications.

[0067] FIG. 6 illustrates a microchannel assembly 600 showing a set of microchannels disposed between a pair of manifolds 602, 604. The envelope (or inner boundary dimensions) of each of the microchannels and the coolant flow are represented by a set of lines 606, 608, 610, 612, each of which includes a different group of microchannels with different amounts of separation between the sets. Exemplary separations S1, S2, S3 are shown between the sets of lines 606, 608, 610, 612. In FIG. 6, the physical microchannel layers (or plates) are not shown. The pitch (or separation between adjacent microchannels in each set) can also be adjusted to achieve a desired amount of cooling within a certain area. The representative coolant flow paths shown by the lines 606, 608, 610, 612 can be surrounded by resin or other materials as described above to provide the microchannels.

[0068] In the illustrated example, the manifolds 602, 604 include tubular ends 620, 622 and plates 624, 626. The tubular ends 620, 622 can be connected to input and output connectors for receiving and outputting coolant. The plates 624, 626 can include microchannels that correspond to the microchannels extending from the plate 624 to the plate 626.

[0069] 5-6, a microchannel layer 502, which may be configured to include sets of spaced apart microchannels as represented by Fig. 6, may include conductive vias extending through the microchannel layer 502 between the conductive layers 504, 506 to connect terminals and / or other components mounted on the component carrying layer 508 to terminals and / or other components mounted on the component carrying layer 510. An exemplary via 540 is shown in Fig. 5 and is disposed in the space between the sets of microchannels 520, 522, 524, 526.

[0070] FIG. 7 shows a temperature distribution diagram 700 for a microchannel assembly similar to that shown in FIG. 6. A set of lines 702, 704, 706, 708 are shown representing the temperatures of the coolant line paths of the microchannels of the microchannel assembly. As shown, the coolant is between about 25° C. and 40° C., indicating that the coolant remains cool during operation. As an example, the flow rate may be 300 milliliters per minute (mlpm), the inlet temperature may be 25° C., and the coolant pressure drop ΔP across the microchannel may be 50 Pascals at 300 mlpm, or 0.007 pounds per square inch (psi). As another example, the microchannel assembly may extract 67 W of energy, provided that the coolant flow rate is 300 mlpm and the inlet temperature is 25° C. or less. The flow rates, pressures, temperatures, and dissipation valves described are for illustrative purposes only and may be different, particularly for microchannels of different sizes and shapes.

[0071] 8A-B show an AC power box 800 including a microchannel assembly cooling power circuit 802. The AC power box 800 is shown having a bottom wall 804 and side walls 806 and may include a top wall (not shown). The AC power box 800 may be hermetically sealed. The microchannel assembly cooling power circuit 802 may be attached to one of the side walls 806 with a spacer 810 and a fastener 812 as shown. The fastener may include a bolt 812 with a nut 814. The bolt 812 extends through a hole in the side wall, a hole in the spacer, and holes in the component-carrying layer, the conductive layer, and the microchannel layer of the microchannel assembly cooling power circuit 802. The nut 814 is threaded onto the bolt 812 to secure the described elements in place. The spacer 810 separates the microchannel assembly cooling power circuit 802 from the side walls 806.

[0072] 9A-B show a microchannel assembly cooling power circuit 900 including a microchannel assembly 902 including manifolds 904, 906, a microchannel member 908 including microchannels, and component support layers 910, 912. The component support layers 910, 912 are shown without electronic components mounted thereon, but in use would include electronic components mounted thereon. The electronic components may be mounted on a first outer surface 914 of the first component support layer 910 and on an opposing surface 916 of the second component support layer 912. The component support layers 910, 912 are mounted on opposite sides of the microchannel member 908. The manifolds 904, 906 may include connectors 920, 922, which may be threaded into the manifolds 904, 906. Each of the component carrying layers 910, 912 may be implemented as one or more PCB layers, a combination of component carrying layers and conductive layers (not shown), or a PCB. In one embodiment, a conductive layer (not shown) is disposed between the component carrying layers 910, 912 and the microchannel member 908. In another embodiment, two PCBs are disposed on either side of the microchannel member 908.

[0073] In one embodiment, the microchannel member 908 is a single "H" shaped component having a central member 930 and external flanges 932, 934. The distance between the flanges 932, 934 can vary depending, for example, on the size and length of the component-carrying layers 910, 912. The central member 930 may be referred to as a plate or layer. The component-carrying layers 910, 912 are attached to either side of the central member 930. The microchannel member 908 extends between and is connected to the manifolds 904, 906. The external flanges 932, 934 can extend perpendicular to the central member 930. Gaskets 936, 938 are disposed between the manifolds 904, 906 and the microchannel member 908. The flanges 932, 934 and gaskets 936, 938 include holes 940, 942 through which fasteners 944 can extend and be threaded into the manifolds 904, 906. The manifolds 904, 906 include recessed inner sections (one recessed inner section 950 of manifold 904 is shown) that receive the gaskets 936, 938 and flanges 932, 934.

[0074] The component carrying layers 910, 912 are attached to the microchannel member 908 via fasteners (e.g., the fasteners shown in FIG. 8A ) that extend through holes 960, 962 in the component carrying layers 910, 912 and the microchannel member 908 and are attached to the sidewall of the AC box. The connectors 920, 922 may have O-rings 970, 972, respectively, that seal the connectors 920, 922 to the manifolds 904, 906. The connectors 920, 922 are received in holes 974, 976 in the manifolds 904, 906.

[0075] The microchannels may extend through the central member 930 and the flanges 932, 934. The microchannels may be linear or may have different patterns, such as sinusoidal patterns. Exemplary linear and sinusoidal patterns are shown in FIGS. 12 and 13. The microchannels may be spaced as previously described and / or may have other spacings and / or groupings. Each of the gaskets 936, 938 may include slits (slits 980, 982 are shown) and / or one or more other holes that correspond to the ends of the microchannels in the central member 930. Each of the manifolds 904, 906 may include one or more passages that correspond to the holes in the corresponding one of the gaskets 936, 938 and the corresponding ends of the microchannels. The one or more passages in the manifold 904 are represented by slots 990.

[0076] The manifolds 904, 906 may be formed of high density polyethylene ethylene (HDPE). The gaskets 936, 938 may be implemented as rubber gaskets. These are just one example set of materials, and other suitable materials may be used.

[0077] 10A-B show a microchannel assembly cooling power circuit 1000 similar to the microchannel assembly cooling power circuit 900 of FIGS. 9A-B, but including an O-ring sealed manifold rather than a gasket sealed manifold. The microchannel assembly cooling power circuit 1000 includes a microchannel assembly 1002 including manifolds 1004, 1006, a microchannel member 1008 including microchannels, and component support layers 1010, 1012. The component support layers 1010, 1012 are shown without electronic components mounted thereon, but in use would include electronic components mounted thereon. The electronic components may be mounted on a first outer surface 1014 of the first component support layer 1010 and on an opposing surface 1016 of the second component support layer 1012. The component support layers 1010, 1012 are mounted on opposite sides of the microchannel member 1008. The manifolds 1004,1006 may include connectors 1020,1022, which may be threaded into the manifolds 1004,1006.

[0078] Each of the component-carrying layers 1010, 1012 may be implemented as one or more PCB layers, a combination of component-carrying layers and conductive layers (not shown), or a PCB. In one embodiment, a conductive layer (not shown) is disposed between the component-carrying layers 1010, 1012 and the microchannel member 1008. In another embodiment, two PCBs are disposed on either side of the microchannel member 1008.

[0079] In one embodiment, the microchannel member 1008 is a single "H" shaped component having a central member 1030 and external flanges 1032, 1034. The central member 1030 may be referred to as a plate or layer. The component-carrying layers 1010, 1012 are attached to either side of the central member 1030. The microchannel member 1008 extends between and is connected to the manifolds 1004, 1006. O-rings 1036, 1038 are disposed between the manifolds 1004, 1006 and the microchannel member 1008. The flanges 1032, 1034 include holes 1040 through which fasteners 1044 may extend and be threaded into the manifolds 1004, 1006. The manifolds 1004,1006 include recessed inner sections (one recessed inner section 1050 of the manifold 1004 is shown) that receive the O-rings 1036,1038 and the flanges 1032,1034.

[0080] The component carrying layers 1010, 1012 are attached to the microchannel member 1008 via fasteners (e.g., the fasteners shown in FIG. 8A ) that extend through holes 1060, 1062 in the component carrying layers 1010, 1012 and the microchannel member 1008 and are attached to the sidewall of the AC box. The connectors 1020, 1022 may have O-rings 1070, 1072, respectively, that seal the connectors 1020, 1022 to the manifolds 1004, 1006. The connectors 1020, 1022 are received in holes 1074, 1076 in the manifolds 1004, 1006.

[0081] The microchannels may extend through the central member 1030 and the flanges 1032, 1034. The microchannels may be linear or may have different patterns, such as a sinusoidal pattern. Groups of microchannels in the central member 1030 are represented by slots 1080, 1082, 1084, 1086. Exemplary linear and sinusoidal patterns are shown in FIGS. 12 and 13. The microchannels may be spaced as previously described and / or may have other spacings and / or groupings. Each of the manifolds 1004, 1006 may include one or more passages corresponding to the ends of the microchannels. One or more passages in the manifold 1004 are represented by slots 1090. The manifolds 1004, 1006 may be formed of HDPE.

[0082] 11A-B show perspective views of another exemplary microchannel assembly cooling power circuit 1100 having integrally formed manifolds 1102, 1104. The microchannel assembly cooling power circuit 1100 includes a microchannel assembly 1101 including manifolds 1102, 1104, a microchannel member 1108 including microchannels, and component support layers 1110, 1112. The component support layers 1110, 1112 are shown without electronic components mounted thereon, but in use would include electronic components mounted thereon. The microchannels extend from the input manifold 1102 to the output manifold 1104. The electronic components may be mounted on a first outer surface 1114 of the first component support layer 1110 and on an opposing surface 1116 of the second component support layer 1112. Component carrying layers 1110, 1112 are attached to either side of the microchannel member 1108. The microchannel member 1108 may be referred to as a plate and / or a layer.

[0083] Each of the component carrying layers 1110, 1112 may be implemented as one or more PCB layers, a combination of component carrying layers and conductive layers (not shown), or a PCB. In one embodiment, a conductive layer (not shown) is disposed between the component carrying layers 1110, 1112 and the microchannel member 1108. In another embodiment, a PCB is disposed on both sides of the microchannel member 1108.

[0084] The manifolds 1104, 1106 may include barbed connection portions 1120, 1122, into which the barbed connection portions 1120, 1122 may be threaded. The microchannel assembly 1101 may be formed as a single component including the manifolds 1102, 1104, the microchannel member 1108, and the barbed connection portions 1120, 1122. This unitary construction eliminates the chance of leakage between the manifold and the microchannel member, as the manifold and microchannel member are integrally formed as a single component. The microchannel member 1108 includes microchannels similar to those shown in Figures 4, 5, 9B, 10B, 12, and 13. The barbed connection portions 1120, 1122 may be connected to connectors, which may be threaded against the barbed connection portions 1120, 1122 and sealed by O-rings. 9A-10B, except that the connectors have female threaded ends configured to screw into prong connecting portions 1120, 1122. The component carrying layers 1110, 1112 may be held onto the microchannel member 1108 via fasteners that extend through holes 1130, 1132 for attachment to the sidewalls of the AC box.

[0085] FIG. 12 shows a microchannel portion 1200 of a microchannel assembly including sets of linear microchannels 1204, 1206, 1208, 1210. The sets of linear microchannels 1204, 1206, 1208, 1210 include respective numbers of microchannels. Although four sets of microchannels are shown, different numbers of sets may be included. The number of microchannels in each of the sets of microchannels may be the same as shown, or different. The spacing between the microchannels in each set of microchannels may be the same as or different from the spacing between the microchannels in each other set of microchannels. In the illustrated example, the spacing between the microchannels in each set of microchannels is the same. The spacing between adjacent sets of microchannels may be the same as shown, or different. The microchannel assembly may be configured similarly to the microchannel assembly 1101 of FIG. 11. Although not shown in FIG. 12, the microchannel assembly includes a manifold having input and output protruding connection portions.

[0086] Figure 13 shows a portion of a microchannel assembly 1300 that includes a set of sinusoidally shaped (or corrugated) microchannels 1304, 1306, 1308, 1310. The microchannel assembly may be configured similarly to the microchannel assembly 1101 of Figure 11 and may include manifolds (or manifold ends) 1320, 1322 and a microchannel member 1324 as shown. The microchannel member 1324 extends between the manifolds 1320, 1322, includes the microchannels 1304, 1306, 1308, 1310, and may include holes 1327 through which fasteners extend to connect the PCB layer and the sidewall of the AC box. The manifold ends 1320, 1322 extend laterally across the ends of the microchannels 1304, 1306, 1308, 1310 and include channels 1324, 1326, respectively, that supply and receive coolant from the microchannels 1304, 1306, 1308, 1310. The manifolds of the microchannel assembly of FIG. 12, not shown in FIG. 12, can be configured similarly to the manifold ends 1320, 1322 of the manifold assembly of FIG. 13. The manifold ends 1320, 1322 include prong connecting portions 1330, 1332.

[0087] The microchannels 1304, 1306, 1308, 1310 have a wave pattern such that the length of the microchannel for a given distance between channels 1324, 1326 is increased compared to a straight microchannel for the same given distance. The increased length increases the amount of coolant in the microchannel at any instant, the cooling capacity of the microchannel, and the amount of heat dissipation achieved by the microchannel. The sinusoidal microchannel increases the rate at which it can absorb thermal energy compared to a straight microchannel. Although four sets of sinusoidal microchannels are shown, a different number of sets may be included. The number of microchannels in each set of sinusoidal microchannels may be the same as shown, or different. The spacing between the sinusoidal microchannels in each set of sinusoidal microchannels may be the same as or different from the spacing between the sinusoidal microchannels in each other set of sinusoidal microchannels. In the illustrated example, the spacing between the microchannels of each set of sinusoidally shaped microchannels is the same. The spacing between adjacent sets of sinusoidally shaped microchannels can be the same, as shown, or different.

[0088] The microchannels of the embodiments of Figures 4, 5 and 8A-13 may have circular, oval (or elliptical), and / or rectangular cross-sections. As an example, a rectangular cross-section may have a length of 2000 micrometers (μm) and a width (or height) of 500 μm. A circular cross-section may have a diameter of 500 μm. An oval cross-section may have an aspect ratio of 1:0.25 with a long dimension of 2000 μm and a short dimension of 500 μm. By having the circular, oval, and rectangular cross-sections have the same width (or height) dimension, there is no net increase in width (or height) of the microchannel member. The width (or height) of the microchannel member is the dimension measured in a direction parallel to the channels 1324, 1326 and perpendicular to the direction of coolant flow from the inlet channel 1324 to the outlet channel 1326 in Figure 13.

[0089] The microchannel layers and members disclosed herein can be constructed and the flow rate through the microchannels can be set to provide laminar or turbulent flow of the coolant through the microchannels. Laminar flow refers to flow that occurs along constant streamlines, whereas turbulent flow refers to a chaotic flow pattern. The more chaotic the flow, the more heat transfer to the coolant. The flow rate of the coolant can be adjusted to provide laminar or turbulent flow. When the flow rate is below a first predetermined threshold, laminar flow can be provided, and when it exceeds a second predetermined threshold, turbulent flow can be provided. Turbulent flow provides improved cooling over laminar flow because the coolant can better absorb thermal energy as it travels through the microchannels.

[0090] As an example, laminar flow may be provided when the Reynolds number Re of the microchannel is less than 1000, and turbulent flow may be provided when the Reynolds number is greater than 2500. The Reynolds number range of 1500-2500 is a transitional range where the coolant flow may be laminar or turbulent. The Reynolds number range of 1000-1500 refers to an unclassified range where the coolant flow may be laminar or turbulent. The Reynolds number Re may be set, determined, and / or satisfied by the controller 340 of FIG. 3. The controller 340 may determine whether to operate in laminar or turbulent mode and set the flow rate and / or the Reynolds number accordingly. An exemplary relationship between the flow rate and the Reynolds number Re is given by Equations 6-8, where v is the average velocity of the fluid, d is the hydraulic diameter of the microchannel, s is seconds, ρ is density, and μ is mechanical viscosity.

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[0091] The examples disclosed herein include an integrated microchannel assembly with a reduced overall footprint that has a high dissipation capacity for a given heat load. The disclosed stacking of layers, microchannel members, PCBs, etc., results in a low profile configuration that is easily attached to the sidewalls of the AC box, allowing for increased space within the AC box. The compact low profile configuration has lower thermal mass and provides 10 times the amount of heat dissipation than conventional designs. The examples are scalable and may use various types of coolants. The examples may include microchannels with various numbers of microchannels, spacing between microchannels, spacing between sets of microchannels, microchannels with various shaped cross sections, and microchannels with various types of routing patterns between manifolds (e.g., linear or sinusoidal).

[0092] The above description is merely exemplary in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure may be implemented in various forms. Thus, while the disclosure includes certain examples, other modifications will become apparent upon examination of the drawings, specification, and the following claims, and the true scope of the disclosure should not be so limited. It should be understood that one or more steps in a method may be performed in different orders (or simultaneously) without altering the principles of the disclosure. Furthermore, although each of the embodiments has been described above as having several features, any one or more of the features described with respect to any embodiment of the disclosure may be implemented in combination with any feature of the other embodiments and / or with any feature of the other embodiments, even if the combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and substitution of one or more embodiments with each other remains within the scope of the disclosure.

[0093] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms including "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Unless expressly described as "direct," when a relationship between a first element and a second element is described in the above disclosure, the relationship may be a direct relationship if no other intervening elements are present between the first element and the second element, but may also be an indirect relationship if one or more intervening elements are present (spatially or functionally) between the first element and the second element. In this specification, the phrase at least one of A, B, and C should be interpreted as meaning the logic (A OR B OR C) using a non-exclusive logical OR, and not as meaning "at least one of A, at least one of B, and at least one of C."

[0094] In some implementations, the controller is part of a system, which may be part of the aforementioned examples. Such systems may include semiconductor processing equipment, including processing tools, chambers, platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems, etc.). Such systems may be integrated with electronic circuitry for controlling the operation of the system before, during, and after processing of a semiconductor wafer or substrate. The electronic circuitry may be referred to as a "controller," and the controller may control various components or subparts of the system. Depending on the processing requirements and / or type of the system, the controller may be programmed to control any of the processes disclosed herein, including delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow settings, fluid delivery settings, position and motion settings, wafer transfer in and out of the tool, and other transfer tools and / or load locks connected to or interfaced with the particular system.

[0095] Broadly speaking, a controller may be defined as an electronic circuit having various integrated circuits, logic, memory, and / or software that receives instructions, issues instructions, controls operations, enables cleaning scans, enables end-point measurements, etc. Integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to a controller or system in the form of various individual settings (or program files) for performing a particular process or that define operational parameters for a semiconductor wafer. The operational parameters may, in some embodiments, be part of a recipe defined by a process engineer for performing one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or one or more processing steps during the manufacture of a die of a wafer.

[0096] The controller may be part of or coupled to a computer that is integrated with, coupled to, or networked to the system, or a combination thereof, in some implementations. For example, the controller may be in all or part of a "cloud" or manufacturing host computer system that may enable remote access of wafer processing. The computer may enable remote access to the system to monitor the current progress of a manufacturing operation, examine the history of past manufacturing operations, examine trends or performance metrics from multiple manufacturing operations, change parameters of a current process, set processing steps following a current process, or start a new process. In some examples, a remote computer (e.g., a server) may provide process recipes to the system over a network, which may include a local network or the Internet. The remote computer may include a user interface that allows for entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool with which the controller is configured to interface or control. Thus, as discussed above, the controller may be distributed, such as by having one or more separate controllers that are networked together and function toward a common purpose, such as the processes and controls described herein. One example of a distributed controller for such a purpose is one or more integrated circuits on the chamber that communicate with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that are combined to control the process on the chamber.

[0097] Without being limited thereto, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing system that may be associated with or used in the fabrication and / or manufacturing of semiconductor wafers.

[0098] As mentioned above, depending on the process steps to be performed by the tool, the controller may communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used in material transport to carry containers of wafers between tool locations and / or load ports within a semiconductor manufacturing factory.

Claims

1. 1. A cooling system for a power circuit of a substrate processing tool, comprising:

1. A microchannel assembly comprising: an input manifold; an output manifold; a microchannel layer including a plurality of microchannels extending from the input manifold to the output manifold and configured to deliver a coolant from the input manifold to the output manifold; a microchannel assembly comprising: a printed circuit board comprising at least one component carrying layer attached to the microchannel layer between the input manifold and the output manifold, the at least one component carrying layer comprising the power circuit including a plurality of electrical components configured to power one or more electrical components of the substrate processing tool; A cooling system comprising:

2. 2. The cooling system of claim 1, The cooling system wherein the microchannel layer is disposed between layers of the printed circuit board, whereby the microchannel layer is embedded within the printed circuit board.

3. 2. The cooling system of claim 1, The at least one component-carrying layer is a first component-bearing layer disposed on a first side of the microchannel layer; a second component-supporting layer disposed on a second side of the microchannel layer opposite the first side; A cooling system comprising:

4. 4. The cooling system of claim 3, a first conductive layer comprising a first pattern of conductive traces and disposed between the microchannel layer and the first component-carrying layer; a second conductive layer comprising a second pattern of conductive traces and disposed between the microchannel layer and the second component-carrying layer; The cooling system further comprises:

5. 2. The cooling system of claim 1, It also has an exchange box. The cooling system wherein the microchannel assembly and the printed circuit board are mounted on the same interior side wall of the AC box.

6. 6. The cooling system of claim 5, wherein the AC box is hermetically sealed.

7. 2. The cooling system of claim 1, the plurality of microchannels comprises a plurality of sets of microchannels including a first set of microchannels and a second set of microchannels; A cooling system, wherein a distance between two adjacent sets of said plurality of sets of microchannels is greater than a distance between microchannels within each of said plurality of sets of microchannels.

8. 8. The cooling system of claim 7, A cooling system, wherein a number of microchannels in the first set of microchannels is different from a number of microchannels in the second set of microchannels.

9. 8. The cooling system of claim 7, A cooling system, wherein a number of microchannels in the first set of microchannels is the same as a number of microchannels in the second set of microchannels.

10. 8. The cooling system of claim 7, A cooling system, wherein a distance between a first adjacent set of the plurality of sets of microchannels is different from a distance between a second adjacent set of the plurality of sets of microchannels.

11. 8. The cooling system of claim 7, A cooling system, wherein a distance between a first adjacent set of said plurality of sets of microchannels is the same as a distance between a second adjacent set of said plurality of sets of microchannels.

12. 8. The cooling system of claim 7, A plurality of conductive layers, the at least one component-carrying layer comprises a plurality of component-carrying layers; a plurality of conductive layers, the plurality of conductive layers being disposed between the microchannel layer and the plurality of component-bearing layers; vias extending through the microchannel layer in spaces between the sets of the plurality of microchannels and contacting the conductive traces of the plurality of conductive layers; The cooling system further comprises:

13. 2. The cooling system of claim 1, The cooling system, wherein the plurality of microchannels are linear.

14. 2. The cooling system of claim 1, The cooling system wherein the plurality of microchannels have a sinusoidal shape.

15. 2. The cooling system of claim 1, The cooling system, wherein the input manifold, the output manifold, and the microchannel layer form a unitary structure.

16. 2. The cooling system of claim 1, a pump configured to circulate the coolant through the microchannel assembly; a controller configured to select between laminar and turbulent flow mode operation and operate the pump accordingly; The cooling system further comprises:

17. 1. A cooling system for a power circuit of a substrate processing tool, comprising:

1. A microchannel assembly comprising: an input manifold; an output manifold; a microchannel member including a plurality of microchannels extending from the input manifold to the output manifold and configured to deliver a coolant from the input manifold to the output manifold; a microchannel assembly comprising: a plurality of printed circuit board layers including a first printed circuit board layer and a second printed circuit board layer, the first printed circuit board layer disposed on a first side of the microchannel member and the second printed circuit board layer disposed on a second side of the microchannel member, the plurality of printed circuit board layers comprising the power circuit including a plurality of electrical components configured to power one or more electrical components of the substrate processing tool; A cooling system comprising:

18. 20. The cooling system of claim 17, the first printed circuit board layer comprises a first component carrying layer and a first conductive layer; The second printed circuit board layer comprises a second component carrying layer and a second conductive layer.

19. 20. The cooling system of claim 18, the first conductive layer comprising a first pattern of conductive traces; the second conductive layer comprising a second pattern of conductive traces.

20. 20. The cooling system of claim 17, The microchannel member is a plurality of flanges configured to connect to the input manifold and the output manifold; a central member extending between said flanges and containing said microchannels; A cooling system comprising:

21. 21. The cooling system of claim 20, A cooling system wherein the plurality of flanges and the central member are integrally formed as a single component.

22. 21. The cooling system of claim 20, the plurality of flanges extend perpendicular to the central member; The cooling system wherein the plurality of flanges and the central member have an "H" shaped cross section.

23. 21. The cooling system of claim 20, The cooling system further comprising a plurality of gaskets disposed between the plurality of flanges and the input and output manifolds.

24. 21. The cooling system of claim 20, The cooling system further comprises a plurality of O-rings disposed between the plurality of flanges and the input and output manifolds.

25. 20. The cooling system of claim 17, A cooling system wherein the input manifold, the output manifold, and the microchannel member are integrally formed as a single component.

26. The cooling system of claim 17 , wherein the plurality of microchannels are linear.

27. The cooling system of claim 17 , wherein the plurality of microchannels have a sinusoidal shape.

28. 20. The cooling system of claim 17, a pump configured to circulate the coolant through the microchannel assembly; a controller configured to select between laminar and turbulent flow mode operation and operate the pump accordingly; The cooling system further comprises:

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