Electroplating apparatus and electroplating method

Abstract

The present invention discloses a liquid storage device and a plating apparatus. The liquid storage device comprises a tank body including a plurality of work cycle drains for supplying solution to a plurality of work chambers and a thermal cycle liquid inlet for introducing heated solution into the tank body. Opposite side walls of the tank body have work cycle drains. A side wall connecting the two side walls has a thermal cycle liquid inlet disposed near or in the middle of the length of the side wall. The liquid storage device further includes a guide element disposed within the tank body. The guide element is connected to the thermal cycle liquid inlet, such that solution entering from the thermal cycle liquid inlet flows through the guide element into the tank body and toward each work cycle drain. The invention has the advantage of equalizing the temperature and flow rate of solutions entering different work chambers through a single liquid storage device.

Description

[Technical field]

[0001] The present invention relates to the field of semiconductor devices, and more particularly to electroplating apparatus and methods. [Background technology]

[0002] In electroplating equipment, the liquid storage tank is one of the most basic devices, which is mainly used to store solutions for zinc plating, copper plating, nickel plating, gold plating, etc. During electroplating, the flow rate and temperature of the solution are important factors that affect the quality of the plating.

[0003] In existing single-chamber wafer electroplating equipment, in order to save costs, one liquid storage tank often supplies solution to different electroplating chambers, and the liquid storage tank supplies solution to different electroplating chambers through drains in different work cycles.

[0004] If the body of the liquid storage tank includes multiple work cycle drains and the work cycle drains are arranged at different positions on the body of the liquid storage tank, the solution temperature at each work cycle drain may be different due to the non-uniformity of the temperature distribution in the body of the liquid storage tank, which may affect the temperature of the solution entering different work chambers and affect the plating of the wafer. In addition, if the temperature of the solution entering the work chamber is too low, crystallization may occur, causing contamination of the work chamber and the wafer. Summary of the Invention

[0005] In order to solve the problems in the current technology, the objective of the present invention is to solve the problem that a single liquid storage tank supplies solutions of different temperatures to different working chambers. Therefore, the present invention provides a liquid storage device and electroplating apparatus which has the advantage of supplying solutions of approximately the same temperature to different working chambers from a single liquid storage tank.

[0006] In order to solve the above-mentioned problems, one embodiment of the present invention is a liquid storage device, comprising a tank body, the tank body including a plurality of work cycle drains for supplying a solution to a plurality of work chambers, and a thermal cycle liquid inlet for introducing a heated solution into the tank body, the plurality of work cycle drains are arranged on opposite side walls of the tank body, the thermal cycle liquid inlet is provided on a side wall connecting the two side walls, and the thermal cycle liquid inlet is arranged near or in the middle of the length of one side wall; Further, the tank body is provided with a guide element, the guide element is connected to the thermal cycle liquid inlet, and the solution entering the thermal cycle liquid inlet flows through the guide element into the tank body and into each work cycle drain.

[0007] Furthermore, in another embodiment of the present invention, the tank body has an upper portion and a lower portion, and includes first, second, third, and fourth side walls connecting the upper portion and the lower portion and connected in sequence along a circumference of the tank body, the first side wall facing the third side wall, and the second side wall facing the fourth side wall; Additionally, a cooling coil is provided located within the tank body and secured to the bottom to facilitate heat exchange with the solution within the tank body.

[0008] Furthermore, in another embodiment of the present invention, the first side wall and the third side wall are provided with the work cycle drain outlet, and the thermal cycle liquid inlet is located in the second side wall near or in the middle of the length of the second side wall.

[0009] Furthermore, in another embodiment of the invention, the thermal cycling fluid inlet is located near the center of the length of the second side wall, and the end of the guide element remote from the thermal cycling fluid inlet extends toward the fourth side wall, forming an outlet for solution to flow out.

[0010] Furthermore, in another embodiment of the present invention, the side wall of the guide element has at least one diversion port through which the solution in the guide element flows into the tank body.

[0011] In yet another embodiment of the present invention, the thermal cycle fluid inlet is located at the center of the length of the second side wall, and the cooling coil is fixed at a central position of the bottom, an end of the guide element extends upward away from the thermal cycle liquid inlet to form an upper outlet, the upper outlet being located inside the cooling coil; or Alternatively, the ends of the guide element extend upward and downward away from the thermal cycle liquid inlet to form upper and lower outlets, the upper and lower outlets being located inside the cooling coil.

[0012] In yet another embodiment of the present invention, the first side wall and the third side wall have the work cycle drain outlet, the thermal cycle liquid inlet is located at the center of the upper part, and the end of the guide element remote from the thermal cycle liquid inlet extends downward to form a lower outlet; The cooling coil is fixed to a central position of the bottom, and an end of the guide element is disposed inside the cooling coil at a position away from the thermal cycle liquid inlet.

[0013] Furthermore, in another embodiment of the present invention, the cooling coil has a coil body, a base, and a number of supports arranged vertically on the base, the supports being spaced apart around the periphery of the base, the supports having a number of mounting holes spaced apart in the height direction, and the coil body being spiral-shaped and secured to the number of mounting holes.

[0014] Additionally, in another embodiment of the present invention, each support is provided with multiple sets of mounting holes.

[0015] Furthermore, in another embodiment of the present invention, the tank body has three work cycle drain outlets, namely a first drain outlet, a second drain outlet, and a third drain outlet, the first drain outlet and the second drain outlet being spaced apart and disposed on the first side wall, while the third drain outlet is disposed on the third side wall.

[0016] In addition, in another embodiment of the present invention, the tank body further includes a work cycle inlet and a thermal cycle outlet, the work cycle inlet is used to allow the solution flowing out of the multiple work chambers to enter the tank body, and the thermal cycle outlet is used to allow the solution in the tank body to flow out for heating; The work cycle inlet is located at the top of the tank body, and the heat cycle outlet is located at the bottom of the tank body.

[0017] Another embodiment of the present invention provides an electroplating apparatus including the liquid reservoir described above.

[0018] Furthermore, another embodiment of the present invention further includes a plurality of working chambers for depositing a metal layer on a surface of a substrate, and a plurality of working pumps, the plurality of working chambers being connected to corresponding plurality of working pumps, and the plurality of working pumps being connected to a plurality of working cycle drain ports, so that the solution in the tank body can be introduced into the corresponding working chambers.

[0019] Furthermore, in another embodiment of the present invention, when the tank body includes three work cycle drain ports, namely a first drain port, a second drain port, and a third drain port, and the tank body further includes a work cycle inlet and a heat cycle drain port, the plurality of working chambers are composed of a first working chamber, a second working chamber, and a third working chamber, and the plurality of working pumps are composed of a first working pump, a second working pump, and a third working pump; The first working pump and the first working chamber are connected in series between the first drain port and the working cycle inlet to form a first working cycle loop; The second working pump and the second working chamber are connected in series between the second outlet and the working cycle inlet to form a second working cycle loop; The third working pump and the third working chamber are connected in series between the third outlet and the working cycle inlet to form a third working cycle loop.

[0020] Furthermore, another embodiment of the present invention further includes a heat cycle pump and a heating device, the heat cycle pump and the heating device being connected in series between the heat cycle liquid inlet and the heat cycle drain outlet to form a heat cycle loop.

[0021] As described above, the liquid storage device and electroplating apparatus of the present invention have the following advantages:

[0022] When the tank body is equipped with multiple work cycle drains, the thermal cycle liquid inlet is located near or in the middle of the length of one side wall, and a guide element is installed at the thermal cycle liquid inlet, so that the heated solution enters through the thermal cycle inlet and flows out through the guide element, thereby making the temperature and flow rate distribution of the solution in the tank body uniform. The temperature and flow rate of the solution from each work cycle drain tend to be equal. The temperature and flow rate of the solution from each work cycle drain to the corresponding work chamber also tend to be equal. This not only prevents the plating of the substrate in the work chamber from being affected, but also avoids the inconsistency in the temperature of the solution entering different work chambers. This prevents an excessively low temperature from occurring in one of the work chambers.

[0023] Other features and corresponding advantages of the present invention are described in detail hereinafter, and at least some of the advantages will be apparent from the description of the invention. [Brief description of the drawings]

[0024] FIG. 1 is a perspective view of a liquid storage device provided by an embodiment of the present invention, in which the tank body of the liquid storage device is depicted in a transparent schematic diagram, and the schematic structure of the guide elements in the tank body is shown. FIG. 2 is another perspective view of the liquid storage device provided according to the first embodiment of the present invention. FIG. 3 is another perspective view of the liquid storage device provided according to embodiment 1 of the present invention. FIG. 4 is a top view of a liquid storage device provided according to the first embodiment of the present invention. FIG. 5 shows a partial schematic view of one diversion port of a guide element of a liquid storage device provided according to embodiment 1 of the present invention. FIG. 6 shows a partial schematic diagram of a guide element of a liquid storage device provided according to embodiment 1 of the present invention, with four branch ports. FIG. 7 is another perspective view of the liquid storage device provided by embodiment 1 of the present invention, in which the tank body is drawn in a transparent schematic diagram, showing the schematic structures of the guide elements and cooling coils in the tank body. FIG. 8 is a perspective view of a cooling coil of a liquid storage device provided according to embodiment 1 of the present invention. FIG. 9 is a perspective view of a liquid storage device provided by embodiment 2 of the present invention, in which the tank body of the liquid storage device is drawn in a transparent schematic diagram, and the schematic structure of the guide element and coil body in the tank body is shown. FIG. 10 is a top view of a liquid storage device provided according to a second embodiment of the present invention. FIG. 11 is a perspective view of a liquid storage device provided by embodiment 3 of the present invention, in which the tank body of the liquid storage device is drawn in a transparent schematic diagram, and the schematic structures of the guide elements and coil body in the tank body are shown. FIG. 12 is a perspective view of a liquid storage device provided by embodiment 4 of the present invention, in which the tank body of the liquid storage device is drawn in a transparent schematic diagram, and the schematic structure of the guide element and coil body within the tank body is shown. FIG. 13 is a schematic diagram of the working principle of the electroplating apparatus provided by embodiment 5 of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] The embodiments of the present invention are described below through specific examples, so that other advantages and effects of the present invention can be easily understood based on the disclosure of this specification. The description of the present invention is shown with preferred embodiments, but this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of introducing the invention with the embodiments is to cover other alternatives and modifications deriving from the claims of the present invention. In order to provide a detailed understanding of the present invention, the following description includes many specific details. It is also possible to practice the present invention without these details. Furthermore, certain details are omitted from the description to avoid confusing or obscuring the focus of the present invention. It should be noted that the embodiments of the present invention and the features within these embodiments can be combined with each other unless there is a contradiction.

[0026] In this specification, like labels or letters in the inner figures represent like items, and therefore, once an item is defined in one figure, it will not be further defined or explained in subsequent figures.

[0027] The technical solutions of the present invention are clearly and completely described below in conjunction with the accompanying drawings. It is obvious that the described embodiments are part of this invention, but are not all. Based on the embodiments of this invention, other embodiments obtained by the technician without creative efforts are included in the protection scope of this invention.

[0028] In the description of this invention, terms such as "middle", "top", "bottom", "left", "right", "vertical", "horizontal", "inner", "outer" and the like that indicate positions and relationships are based on the positions and relationships shown in the drawings. It should be noted that these terms are used to facilitate and simplify the description of the invention, and do not indicate that the invention must have a specific orientation or be constructed or operated in a specific orientation. Therefore, these terms should not be considered as limiting the invention. Furthermore, terms such as "first", "second", "third", and the like are used for the purpose of explanation, and do not indicate relative importance.

[0029] It should be further noted that in the description of this invention, unless expressly specified, the terms "attached," "connected," and "linked" should be understood broadly. For example, they may be fixedly connected, removably connected, or integrally connected. They may be mechanically connected or electrically connected. They may be directly connected or indirectly connected through an intermediate. They may also include mutual communication between two components. In this invention, a technician can understand the specific meaning of these terms based on the specific situation.

[0030] In order to make the objectives, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be described in more detail with reference to the drawings.

[0031] EMBODIMENT 1 Referring to FIG. 1, embodiment 1 of the present invention provides a liquid storage device 10. The liquid storage device 10 includes a tank body 100. The tank body 100 has a work cycle inlet 110 and multiple work cycle outlets. The multiple work cycle outlets are used to supply solution to multiple work chambers (first work chamber 310, second work chamber 320, and third work chamber 330 as shown in FIG. 13). These work chambers are typically used for electroplating of substrates. The solution flowing out from the multiple work chambers can be recirculated to the tank body 100 through the work cycle inlet 110. In this embodiment, the solution in the tank body 100 can be used for gold plating, zinc plating, copper plating, or nickel plating, etc.

[0032] The tank body 100 further has a thermal cycle liquid inlet 130 and a thermal cycle drain port 140. The solution in the tank body 100 flows out from the thermal cycle drain port 140, is heated, and then is injected back into the tank body 100 through the thermal cycle liquid inlet 130.

[0033] Two opposing side walls of the tank body 100 are provided with work cycle drain ports, making maximum use of the spatial arrangement of the tank body 100. The side wall connecting these two opposing side walls has a thermal cycle liquid inlet 130, which is located near or in the middle of the length of that side wall.

[0034] The liquid storage device 10 also includes a guide element 200 disposed inside the tank body 100. The guide element 200 is connected to the thermal cycle liquid inlet 130. The solution entering the thermal cycle liquid inlet 130 flows through the guide element 200 into the tank body 100 and then into each work cycle outlet. The guide element 200 is hollow and provides a path for the solution to flow.

[0035] In this embodiment, when the tank body 100 is equipped with multiple work cycle drains, the heated solution enters through the thermal cycle liquid inlet 130 and flows into the tank body 100 through the guide element 200. This configuration achieves uniform temperature distribution in the tank body 100, and the temperature of the solution at each work cycle drain tends to be equal. Therefore, the temperature of the solution entering different work chambers from these drains also tends to be the same. This can prevent the temperature fluctuation of the solution from affecting the plating on the substrate. In addition, since the solution temperature in the tank body is uniformly distributed, the temperature of each work cycle drain tends to be equal, which can avoid the problem that the solution temperature is too low when entering a certain work chamber, causing crystallization and contaminating the work chamber or substrate. Therefore, this liquid storage device 10 has the advantage of equalizing the temperature of the solution entering different work chambers.

[0036] In addition, by locating the thermal cycle liquid inlet 130 at the center of the side wall connected to the opposite side wall, the uniform distribution of the solution flow rate in the tank body 100 is also ensured. This uniformity ensures that the solution flow rate at each work cycle outlet is even, and avoids the situation where the work cycle outlet on one side of the tank body 100 has a higher flow rate than the other side, which may affect the quality of electroplating. Therefore, this liquid storage device 10 not only has the advantage of equalizing the temperature of the solution entering different work chambers, but also ensures that the flow rate of the solution entering different work chambers is even.

[0037] 1 to 3, the tank body 100 includes an opposing top 105 and bottom, and a first side wall 101, a second side wall 102, a third side wall 103, and a fourth side wall 104, which connect the top 105 and bottom and are connected sequentially along the periphery of the tank body 100. The first side wall 101 is opposite the third side wall 103, and the second side wall 102 is opposite the fourth side wall 104. In this embodiment, the first side wall 101 and the third side wall 103 are opposite each other in the width direction W of the tank body 100, while the second side wall 102 and the fourth side wall 104 are opposite each other in the length direction L of the tank body 100.

[0038] The tank body 100 has a work cycle inlet 110 at the top 105 and a heat cycle outlet 140 at the bottom.

[0039] The tank body 100 is provided with a first drain outlet 121, a second drain outlet 122, and a third drain outlet 123. The first drain outlet 121 and the second drain outlet 122 are arranged at an interval on the first side wall 101, and the third drain outlet 123 is arranged on the third side wall 103.

[0040] The thermal cycle liquid inlet 130 is located in the second side wall 102 located near the center of its length, and the end of the guide element 200 remote from the thermal cycle liquid inlet 130 extends toward the fourth side wall 104 to form an outlet 202 for the solution to flow out. The length direction of the second side wall 102 also coincides with the length direction L of the tank body 100. The first drain port 121, the second drain port 122, the third drain port 123, and the thermal cycle liquid inlet 130 are all located at the bottom of the tank body 100.

[0041] In this embodiment, the tank body 100 consisting of three work cycle drains can meet the demands of three work chambers. Considering the space factor of the tank body 100, the third drain 123 is arranged on the opposite side to the first drain 121 and the second drain 122. That is, the third drain 123 is arranged on the third side wall 103. The heated solution enters the tank body 100 from the thermal cycle liquid inlet 130 and the guide element 200, and flows toward the first drain 121, the second drain 122, and the third drain 123. This arrangement ensures that the temperature and flow rate of the solution at the three work cycle drains are equal. This setup aims to realize stable flow and temperature control for supplying solution to the three work chambers using a single liquid storage device 10. This can achieve the purpose of stable solution supply to the three work chambers.

[0042] Additionally, hollow guide element 200 has a circular cross-section. In alternative embodiments, hollow guide element 200 may have a rectangular, triangular, diamond-shaped, sector-shaped, or polygonal shape with four or more sides.

[0043] Referring to FIG. 4, in this embodiment, the protrusion at the end of the guide element 200 away from the thermal cycle liquid inlet 130 on the first side wall 101 is located between the first drain outlet 121 and the second drain outlet 122, ensuring that the temperature and flow rate of the solution on both sides of the guide element 200 are similar, thereby tending to make the temperature and flow rate of the solution at the first drain outlet 121, the second drain outlet 122, and the third drain outlet 123 equal.

[0044] Furthermore, the first drain outlet 121 and the second drain outlet 122 are arranged in sequence along the direction from the second side wall 102 to the fourth side wall 104. The distance between the third drain outlet 123 and the second side wall 102 is equal to or less than the distance between the second drain outlet 122 and the second side wall 102. This means that the first drain outlet 121 is closer to the second drain outlet 122 than to the second side wall 102.

[0045] Since after the heated solution flows out of the guide element 200, the solution temperature near the fourth side wall 104 may be higher than the solution temperature near the second side wall 102, by making the distance between the third drain outlet 123 and the second side wall 102 equal to or less than the distance between the second drain outlet 122 and the second side wall 102, inconsistency in the solution temperatures at the third drain outlet 123 and the second drain outlet 122 can be avoided.

[0046] If there is no diversion port 210 on the side wall of the guide element 200 , all the solution from the thermal cycle liquid inlet 130 will enter the tank body 100 through the outlet 202 of the guide element 200 .

[0047] The side wall of the guide element 200 may optionally have at least one diversion port 210, allowing the solution in the guide element 200 to enter the tank body 100. This means that the solution in the guide element 200 enters the tank body 100 through the outlet 202 and the diversion port 210 of the guide element 200.

[0048] Optionally, there are four evenly spaced diverter openings 210 on the side wall of the guide element 200. The solution in the guide element 200 enters the tank body 100 through the four diverter openings 210. The four diverter openings 210 can be located on the same side of the guide element 200, or can be alternately located on different sides of the guide element 200.

[0049] In the liquid storage device 10 provided by the present invention, whether to install the diversion port 210 on the side wall of the guide element 200 and the number of the diversion port 210 can be selected according to actual needs. The size of the diversion port 210 can be set according to actual requirements.

[0050] In addition, the solution entering through the thermal cycle solution inlet 130 serves as a feed solution. The feed temperature of the feed solution is variable. For example, the temperature of the feed solution after initial heating and the thermal cycle temperature during stable operation may be different. Therefore, in this embodiment, the value of the feed temperature is not specified and is derived based on actual needs.

[0051] 4, 7 and 8, the liquid storage device 10 is disposed within the tank body 100 and also includes a cooling coil 700 secured to the bottom. The cooling coil 700 is used to cool the solution entering the tank body 100 and serves to balance the temperature of the solution.

[0052] The liquid storage device 10 also includes a temperature sensor 800 installed on the upper portion 105 of the tank body 100 to detect the temperature of the solution in the tank body 100. The location, number and type of the temperature sensor 800 can be determined based on the specific actual situation. In this embodiment, no specific restrictions are specified. The cooling coil 700 is composed of a winding body 710, a substrate 720, and a plurality of supports 730 vertically set on the substrate 720. These supports 730 are spaced apart around the substrate 720, and a plurality of mounting holes 731 are provided on the supports 730 along the height direction H of the supports 730. The coil body 710 is spiral and fixed in these multiple mounting holes 731. In this embodiment, the coil body 710 is set vertically, the number of mounting holes 731 corresponds to the number of coils of the coil body 710, and the centers of the mounting holes 731 on each support 730 are aligned on a straight line.

[0053] 8, each support 730 has multiple sets of side-by-side mounting holes 731 for fixing different diameter coil bodies 710. In this embodiment, there are four supports 730, and each support 730 has two sets of multiple mounting holes 731.

[0054] Additionally, between every two adjacent supports 730 there is a cross beam 750, and between any two cross beams 750 there is a support beam so that all four supports 730 are vertically positioned and reinforced.

[0055] EMBODIMENT 2 9 and 10, which respectively show only the coil body 710 of the cooling coil (see FIG. 8 for the cooling coil 700). The liquid storage device 10 provided by the embodiment 2 of the present invention is different from the liquid storage device 10 provided by the embodiment 1 in that the thermal cycle liquid inlet 130 is disposed at the center position of the length of the second side wall 102, and the cooling coil is fixed at the center position of the bottom.

[0056] The end of the guide element 200A away from the thermal cycle liquid inlet 130 extends upward to form an upper outlet 203, which is located inside the coil body 710 of the cooling coil. Therefore, the heated solution first flows out of the upper outlet 203 and then enters the inside of the coil body 710, so that the temperature of the solution can be kept more uniform.

[0057] In this embodiment, the thermal cycle liquid inlet 130 is located in the middle of the length of the second side wall 102, the cooling coil is fixed at the center position of the bottom, and the upper outlet 203 of the guide element 200A is located inside the coil body 710, aiming to make the distances from the upper outlet 203 of the guide element 200A to the first drain 121, the second drain 122, and the third drain 123 approximately equal. This configuration has the effect of equalizing the temperature and flow rate of the solution at the first drain 121, the second drain 122, and the third drain 123.

[0058] EMBODIMENT 3 As shown in Fig. 11, this shows only the windings 710 of the cooling coil (see Fig. 8 for the cooling coil 700). The liquid storage device 10 provided by the embodiment 3 of the present invention is different from the liquid storage device 10 provided by the embodiment 2 in that the ends of the guide element 200B away from the thermal cycle liquid inlet 130 extend upward and downward respectively to form the upper outlet 204 and the lower outlet 205, making the guide element 200B "T" shaped.

[0059] The heated solution enters the guide element 200B through the thermal cycle liquid inlet 130, flows out from both the upper outlet 204 and the lower outlet 205, and is used to exchange heat with the winding body 710 to keep the temperature of the solution more uniform. At the same time, it ensures that the temperature and flow rate of the solution in the first outlet 121, the second outlet 122, and the third outlet 123 are approximately equal.

[0060] EMBODIMENT 4 As shown in Fig. 12, this figure shows only the trunk part 710 of the winding of the cooling coil (see Fig. 8 for the cooling coil 700). The liquid storage device 10 provided by the embodiment 4 of the present invention is different from the liquid storage device 10 provided by the embodiment 1 in that the thermal cycle liquid inlet 130 is disposed in the upper part 105, specifically, in the center of the upper part 105. The end of the guide element 200C remote from the thermal cycle liquid inlet 130 extends toward the lower bottom and forms the lower outlet 206.

[0061] The cooling coil is fixed at the center of the bottom, and the lower outlet 206 of the guide element 200C is located inside the winding 710 of the cooling coil. The heated solution enters the guide element 200C from the thermal cycle liquid inlet 130 at the center of the upper part 105, flows out from the lower outlet 206, and exchanges heat with the winding 710 while adjusting the temperature and flow rate of the solution at the first drain outlet 121, the second drain outlet 122, and the third drain outlet 123 to be uniform.

[0062] EMBODIMENT 5 As shown in Fig. 13, an electroplating apparatus 1000 provided by embodiment 5 of the present invention uses the liquid storage device 10 of embodiment 1. It should be noted that the positions of the thermal cycle liquid inlet 130, the first drain outlet 121, the second drain outlet 122, and the third drain outlet 123 shown in Fig. 13 do not represent the actual positions, but are shown for reference.

[0063] The electroplating apparatus 1000 also includes a plurality of working chambers and a plurality of working pumps used for depositing a metal layer on the surface of a substrate. The plurality of working chambers are connected to corresponding working pumps, and the plurality of working pumps are connected to a plurality of working cycle drains, so that the solutions in the tank body 100 can be introduced into the corresponding working chambers, which are used for electroplating the substrate. The working cycle inlet 110 is connected to the plurality of working chambers, so that after electroplating on the substrate is completed, the solutions discharged from the plurality of working chambers can enter the tank body 100 through the working cycle inlet 110.

[0064] In this embodiment, by optimizing the design of the thermal cycle liquid inlet 130 and the multiple work cycle drains of the liquid storage device of embodiment 1, a more uniform distribution of the temperature and flow rate of the solution in the tank body 100 is realized. Therefore, the temperature and flow rate of the solution entering the corresponding work chamber from the drain of the corresponding work cycle tend to be equal. This allows the electroplating apparatus 1000 using the liquid storage device 10 to simultaneously provide a stable flow rate and temperature of solution to multiple work chambers using a single liquid storage device 10. In addition, the uniform temperature distribution of the solution in the tank body 100 may make the temperature of each work cycle drain even, which may prevent the occurrence of crystallization caused by the extremely low temperature of the solution entering the work chamber of the electroplating apparatus 1000.

[0065] In the first embodiment, the tank body 100 of the liquid storage device 10 is provided with three work cycle drain ports. Correspondingly, the multiple work chambers of the electroplating apparatus 1000 include a first work chamber 310, a second work chamber 320, and a third work chamber 330. The multiple work pumps include a first work pump 410, a second work pump 420, and a third work pump 430.

[0066] The first working pump 410 and the first working chamber 310 are sequentially connected between the first drain port 121 and the working cycle inlet 110 to form a first working cycle loop. The liquid storage device 10 supplies the solution to the first working chamber 310 through the first working pump 410.

[0067] The second working pump 420 and the second working chamber 320 are sequentially connected between the second outlet 122 and the working cycle inlet 110 to form a second working cycle loop. The liquid storage device 10 supplies the solution to the second working chamber 320 through the second working pump 420.

[0068] The third working pump 430 and the third working chamber 330 are sequentially connected between the third drain port 123 and the working cycle inlet 110 to form a third working cycle loop. The liquid storage device 10 supplies the solution to the third working chamber 330 through the third working pump 430. In this embodiment, there is one working cycle inlet 110, and the main pipeline connected to the working cycle inlet 110 has three branch pipelines, which are respectively connected to the working chambers.

[0069] In this embodiment, the liquid storage device 10 ensures uniform temperature distribution of the solution in the tank body 100. The temperature and flow rate of the solution at the drain port of each work cycle tend to be equal. Therefore, the temperature and flow rate of the solution at the multiple work pumps of the electroplating apparatus 1000 also tend to be equal. Therefore, the temperature and flow rate of the solution entering different work chambers also tend to be equal.

[0070] The electroplating apparatus 1000 also includes a heating device 500 and a thermal cycle pump 600. The thermal cycle pump 600 and the heating device 500 are connected in series between the thermal cycle fluid inlet 130 and the thermal cycle drain 140 to form a thermal cycle loop. The thermal cycle pump 600 extracts cooling solution from the tank body 100 through the thermal cycle drain 140. This cooling solution is heated by the external heating device 500 and then pumped back into the tank body 100 through the thermal cycle fluid inlet 130.

[0071] It should be noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and are not intended to limit them. Based on the above embodiments, the present invention has been described in detail, but the skilled person can modify the described embodiments or substitute some or all of the technical features thereof by equivalent replacement. These modifications or replacements do not deviate from the essence of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid storage device, comprising a tank body, the tank body including a plurality of work cycle drains for supplying a solution to a plurality of work chambers, and a thermal cycle liquid inlet for introducing a heated solution into the tank body, the plurality of work cycle drains being arranged on opposing side walls of the tank body, the thermal cycle liquid inlet being provided on a side wall connecting the two side walls, the thermal cycle liquid inlet being arranged near or in the center of the length of one side wall, The liquid storage device further comprises a guide element disposed on the tank body, the guide element being connected to the thermal cycle liquid inlet, and the solution entering the thermal cycle liquid inlet flows through the guide element into the tank body and into each work cycle drain.

2. the tank body has an upper portion and a lower portion, and includes first, second, third, and fourth side walls connecting the upper portion and the lower portion and connected in sequence along a periphery of the tank body, the first side wall facing the third side wall, and the second side wall facing the fourth side wall; 10. The liquid storage device of claim 1, further comprising a cooling coil located within the tank body and secured to a bottom thereof to facilitate heat exchange with the solution within the tank body.

3. 3. The liquid storage device of claim 2, wherein the first side wall and the third side wall are provided with the work cycle drain outlet and the thermal cycle liquid inlet is located in the second side wall near or in the middle of the length of the second side wall.

4. 4. The liquid storage device of claim 3, wherein the thermal cycling liquid inlet is located near the center of the length of the second side wall, and the end of the guide element remote from the thermal cycling liquid inlet extends toward the fourth side wall and forms an outlet for solution to flow out.

5. The liquid storage device according to claim 4 , wherein the side wall of the guide element has at least one diversion port through which the solution in the guide element flows into the tank body.

6. the thermal cycle fluid inlet is located at a center of the length of the second side wall, and the cooling coil is fixed at a center position of the bottom; an end of the guide element extends upward away from the thermal cycle liquid inlet to form an upper outlet, the upper outlet being located inside the cooling coil; or Alternatively, the ends of the guide element extend upward and downward away from the thermal cycle liquid inlet to form upper and lower outlets, the upper and lower outlets being located inside the cooling coil.

7. the first side wall and the third side wall have the work cycle drain outlet, the thermal cycle fluid inlet is centrally located in the upper portion, and an end of the guide element remote from the thermal cycle fluid inlet extends downward to form the lower portion outlet; 3. The liquid storage device of claim 2, wherein the cooling coil is fixed at a central position of the bottom, and an end of the guide element is disposed inside the cooling coil at a position away from the thermal cycle liquid inlet.

8. 8. A liquid storage device as described in any one of claims 2 to 7, wherein the cooling coil has a coil body, a base, and a plurality of supports arranged vertically on the base, the supports being spaced apart around the periphery of the base, the supports having a plurality of mounting holes spaced apart in the height direction, and the coil body is spiral-shaped and fixed to the plurality of mounting holes.

9. 9. A liquid storage device according to claim 8, wherein each support comprises a plurality of sets of mounting holes.

10. 8. A liquid storage device as described in any one of claims 3 to 7, wherein the tank body has three work cycle drain outlets, namely a first drain outlet, a second drain outlet, and a third drain outlet, the first drain outlet and the second drain outlet being spaced apart and arranged on the first side wall, while the third drain outlet is arranged on the third side wall.

11. The tank body further comprises a work cycle inlet and a thermal cycle outlet, the work cycle inlet being used for allowing the solution flowing out of the multiple work chambers to enter the tank body, and the thermal cycle outlet being used for allowing the solution in the tank body to flow out for heating; 11. The liquid storage device of claim 10, wherein the work cycle inlet is located at the top of the tank body and the heat cycle outlet is located at the bottom of the tank body.

12. 12. An electroplating apparatus comprising a liquid storage device according to any one of claims 1 to 11.

13. 13. The electroplating apparatus of claim 12, further comprising a plurality of working chambers for depositing a metal layer on a surface of a substrate, and a plurality of working pumps, the plurality of working chambers being connected to corresponding one of the plurality of working pumps, and the plurality of working pumps being connected to the plurality of working cycle drains, so that the solution in the tank body can be introduced into the corresponding one of the working chambers.

14. When the tank body includes three work cycle drains, namely, the first drain, the second drain, and the third drain, and the tank body further includes the work cycle inlet and the heat cycle drain, the plurality of working chambers are composed of a first working chamber, a second working chamber, and a third working chamber, and the plurality of working pumps are composed of a first working pump, a second working pump, and a third working pump; The first working pump and the first working chamber are connected in series between the first outlet and the working cycle inlet to form a first working cycle loop; The second working pump and the second working chamber are connected in series between the second outlet and the working cycle inlet to form a second working cycle loop; 14. The electroplating apparatus of claim 13, wherein said third work pump and said third work chamber are connected in series between said third outlet and said work cycle inlet to form a third work cycle loop.

15. 15. The electroplating apparatus of claim 14, further comprising a thermal cycle pump and a heating device, said thermal cycle pump and said heating device being connected in series between said thermal cycle liquid inlet and said thermal cycle drain outlet to form a thermal cycle loop.

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