LED and sensor combination device

Abstract

The mobile device includes an integrated structure (e.g., a semiconductor structure) including an LED matrix having one or more LED arrays and sensors on at least opposing edges of the LED matrix. Each LED array has LEDs separated by non-emitting regions, and the LEDs are driven independently to provide light. The light is converted to white light using phosphors disposed on the LEDs. The sensor detects ambient light or flicker. The semiconductor structure is attached to a semiconductor driver via conductive pillars and underfill between the conductive pillars. The driver is coupled to a PCB. The PCB is electrically coupled to the semiconductor structure via PCB contacts and LED contacts to drive the LEDs in dependence on ambient light.

Description

[Technical field]

[0001] The present disclosure relates to a lighting system that includes a light emitting diode (LED) array and a sensor on a printed circuit board (PCB).

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 284,953, filed December 1, 2021, the entirety of which is incorporated herein by reference. [Background technology]

[0003] There is a continuing effort to improve lighting systems, and in particular, there is a desire to provide adjustable lighting in commercial and domestic lighting environments. [Brief description of the drawings]

[0004] [Figure 1] FIG. 1 illustrates a side view of a mobile device, according to some embodiments. [Diagram 2] FIG. 2 illustrates an LED array, according to some embodiments. [Diagram 3] FIG. 3 illustrates a top view of a structure, according to some embodiments. [Figure 4] FIG. 4 illustrates a simplified flow chart for fabricating an LED structure, according to some embodiments. [Figure 5A] FIG. 5A shows an embodiment of an LED structure at a different point in the method described in FIG. [Figure 5B] FIG. 5B illustrates an embodiment of an LED structure at a different point in the method described in FIG. [Figure 5C] FIG. 5C illustrates an embodiment of an LED structure at a different point in the method described in FIG. [Figure 5D]FIG. 5D illustrates an embodiment of an LED structure at a different point in the method described in FIG. [Figure 5E] FIG. 5E illustrates an embodiment of an LED structure at a different point in the method described in FIG. [Figure 6] FIG. 6 illustrates a block diagram of a mobile device according to some embodiments. [Figure 7A] FIG. 7A shows an LED under low ambient lighting using different drive currents, according to some embodiments. [Figure 7B] FIG. 7B shows the LED under low ambient lighting using different drive currents, according to some embodiments. [Figure 7C] FIG. 7C shows the LED under low ambient lighting using different drive currents, according to some embodiments. [Figure 8A] FIG. 8A shows an LED under high ambient lighting using different drive currents, according to some embodiments. [Figure 8B] FIG. 8B shows the LED under high ambient lighting using different drive currents, according to some embodiments.

[0005] Corresponding reference characters indicate corresponding parts throughout the several views. Elements in the drawings are not necessarily drawn to scale. The configurations shown in the drawings are merely examples and should not be construed as limiting in any way. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0006] In many electronic devices, real estate (e.g., the physical area or volume that may be available for a given device) is at a premium. However, reducing the size of such devices is difficult due to their increasing complexity, especially in mobile devices. One component that has received great attention in mobile devices is the camera, which may have one or more different types of sensors and may be used in conjunction with a flash module. Integrating the flash module and the camera to reduce the overall size can be complicated, especially with respect to semiconductor manufacturing and circuit and board layout.

[0007] FIG. 1 illustrates a side view of a mobile device according to some embodiments. The mobile device 100 may include both a flash module 110 and a camera 120. The camera 120 may capture an image of the scene 104 during an exposure duration of the camera 120, whether or not the scene 104 is illuminated by the flash module 110. The processor 130 may be used to control various functions of the flash module 110 and the camera 120, including, for example, whether a shutter in an opening 108 in a housing of the mobile device 100 is open. The opening 108 may be a single opening, as shown in FIG. 1, or may include multiple separate openings. Similarly, the shutter may be a single shutter covering both the flash module 110 and the camera 120, or may include multiple separate shutters covering only one of the flash module 110 or the camera 120 and individually controllable by the processor 130.

[0008] The mobile device 100 may include one or more light emitting diode (LED) arrays 112. The one or more LED arrays 112 may include a plurality of LEDs 114 capable of generating light during at least a portion of an exposure period of the camera 120. Each of the one or more LED arrays 112 may include segmented ones of the LEDs 114. Each of the LEDs 114 may be formed from one or more inorganic materials (e.g., a binary compound such as gallium arsenide (GaAs), a ternary compound such as aluminum gallium arsenide (AlGaAs), a quaternary compound such as indium gallium phosphide (InGaAsP), or other suitable materials). Each of the LEDs 114 emits light in the visible spectrum (from about 400 nm to about 800 nm) and may also emit light in the infrared spectrum (greater than about 800 nm). Alternatively, a separate one or more LED arrays may be used to emit light in the infrared spectrum. Each of the LEDs 114 is individually controllable by the processor 130.

[0009] The one or more LED arrays 112 may include one or more non-emitting regions (e.g., non-emitting regions 204) disposed between adjacent ones of the LEDs 114, as shown in FIG. 2. The size of the non-emitting regions disposed between adjacent ones of the LEDs 114 (i.e., the distance between adjacent ones of the LEDs 114) may be significant (e.g., about 5% to about 10%) relative to the physical size of the LEDs 114 (i.e., the distance between adjacent sides of the LEDs 114) in the one or more LED arrays 112. In some implementations, one or more of the non-emitting regions may surround the LEDs 114 in the one or more LED arrays 112, which may cause dark bands to appear in the illumination emitted by the one or more LED arrays 112. In some examples, the non-emitting regions may be relatively small enough to counteract the effect of the non-emitting regions and may be optical elements or other elements in the flash module 110.

[0010] The flash module 110 may include at least one lens 116 or other optical element. The lens 116 may direct light emitted by the one or more LED arrays 112 toward the scene 104 as the illumination 102. In some embodiments, the flash module 110 may include an actuator (such as a voice coil motor) to translate the one or more LED arrays 112 and / or the lens 116 (e.g., physical translation or movement of the LED array 112 relative to the lens 116) during an exposure duration of the camera 120 controlled by the processor 130 to blur dark bands in the illumination 102 in an image of the scene 104. In other embodiments, an actuator may not be present. Instead, such a system may have a fixed lens, and therefore a fixed aperture. In a system including an actuator, the actuator can translate one or more LED arrays 112 and / or lenses 116 in a direction of motion generally orthogonal to a longitudinal axis extending from the one or more LED arrays 112, through the center of the lens 116, and to the scene 104, a distance equal to or greater than the width of one or more non-emitting regions of the one or more LED arrays 112. That is, the actuator can translate either or both of the one or more LED arrays 112 and lenses 116 in one or more lateral (xz) directions, where the y direction is shown in FIG. 2 as varying the distance separating the one or more LED arrays 112 and lenses 116. The actuator can oscillate the one or more LED arrays 112 and / or lenses 116 with an oscillation period that is shorter than the exposure duration of the camera 120.

[0011] In addition to or instead of translation, a plurality of one or more LED arrays including segmented LEDs may be used to illuminate the scene. In this case, non-emitting regions between the LEDs that form dark bands in the illumination may be offset between the different one or more LED arrays such that the dark bands at least partially overlap. The offset may help reduce or eliminate dark bands in the total illumination at the scene that may be present if only one of the one or more LED arrays and lenses is used.

[0012] The camera 120 may sense at least one or more wavelengths of light emitted by the one or more LED arrays 112. The camera 120 may include optical elements (e.g., at least one camera lens 122) that may collect reflected light 106 reflected from and / or emitted by the scene 104. The camera lens 122 may direct the reflected light 106 onto the multi-pixel sensor 124 to form an image of the scene 104 on the multi-pixel sensor 124. The processor 130 may receive a data signal representing the image of the scene 104. The processor 130 may additionally drive the LEDs 114 in the one or more LED arrays 112. For example, the processor 130 may control one or more LEDs 114 in the one or more LED arrays 112, optionally independently of another one or more LEDs 114 in the one or more LED arrays 112, to illuminate the scene in a specified manner.

[0013] In addition, one or more detectors 126 may be integrated into the camera 120. In other embodiments, instead of being integrated into the camera 120, one or more detectors 126 may be integrated into one or more different areas, such as the flash module 110 or other locations proximate the camera 120 and the strobe. The one or more detectors 126 may include multiple different sensors for sensing visible light and / or infrared light (and possibly ultraviolet light) to sense ambient light and / or ambient light fluctuations / flicker in addition to receiving reflected light from the LEDs 114. The multi-pixel sensor 124 of the camera 120 may be of higher resolution than the sensors of the one or more detectors 126 to obtain an image of the scene with a desired resolution. The sensors of the one or more detectors 126 may have one or more segments (that may be sensitive to the same wavelength / wavelength range or different wavelengths / wavelength ranges). In some embodiments, when multiple detectors are used, one or more of the detectors may detect visible wavelengths and one or more of the detectors may detect infrared wavelengths. That is, the detectors may be individually controllable by the processor 130 .

[0014] In some embodiments, instead of or in addition to being included in the camera 120, one or more of the sensors of the one or more detectors 126 may be included in the flash module 110. In some embodiments, the flash module 110 and the camera 120 may be integrated into a single module, while in other embodiments, the flash module 110 and the camera 120 may be separate modules disposed on a PCB. In other embodiments, the flash module 110 and the camera 120 may be mounted on different PCBs - for example, the camera 120 may be thicker than the flash module 110, which may result in design issues if the flash module 110 and the camera 120 were mounted on the same PCB. In the latter embodiment, multiple openings may be present in the housing, at least one of which may be eliminated using an integrated version of the flash module 110 and the camera 120.

[0015] The LEDs 114 may be driven using, for example, a direct current (DC) driver or pulse width modulation (PWM). Using DC drive may encounter color differences when the segmented LED array 112 or more are driven with different current densities, while PWM drive may produce artifacts due to ambient light conditions. The flicker sensor may sense the artificial lighting variations at the wall current frequency or electronic ballast frequency (e.g., 50 Hz or 60 Hz, or integer multiples thereof) in addition to the phase of the flicker. The camera sensor is then tuned to an integral time of an integer multiple of the time period (1 / f) or triggered at the phase where the lighting changes most slowly (minimum or maximum intensity, with maximum intensity being preferred for signal-to-noise ratio considerations). The LEDs 114 may be driven using PWM with varying phase shift between the LEDs 114 to reduce potential current surge issues. As shown, one or more drivers 132 can be used to drive the LEDs 114 in one or more LED arrays 112 as well as other components, such as actuators.

[0016] Mobile device 100 may also include a user-activated input device, such as a button that is pressed to take a picture. Flash module 110 and camera 120 may be located within a single housing.

[0017] FIG. 2 illustrates an LED array 200 according to some examples. The LEDs 202, which are segmented in the LED array 200, can form corresponding illumination regions in the illumination 102 in the scene 104. The non-emitting regions 204 can form dark bands in the illumination 102 in the scene 104. In some examples, the dark bands in the first illumination 102 in the scene 104 can correspond to the non-emitting areas 204 extending along a first direction and the non-emitting areas extending along a second direction generally orthogonal to the first direction. In some examples, the LEDs 202 can be arranged in a rectilinear array along orthogonal first and second dimensions. In some examples, each of the non-emitting regions 204 can be arranged as an elongated region extending along one of the first or second dimensions. In some examples, at least one of the non-emitting regions 204 (corresponding to a dark band) can extend in an unbroken line along the entire extent of the first linear array. In some examples, at least one of the non-emitting regions 204 may include parallel segments. In other embodiments in which multiple LED arrays of the LED array 200 are used, the non-emitting regions 204 of the LED arrays 200 may not coincide and / or may be different (e.g., only one may have a discontinuity).

[0018] In other embodiments, the LED array 200 is, for example, a micro LED array that includes thousands to millions of tiny LED pixels that can emit light and can be controlled individually or in groups of pixels (e.g., 5×5 groups of pixels). Micro LEDs are small (e.g., smaller than 0.01 mm on a side) and can provide monochromatic or polychromatic light, typically red, green, and blue, using inorganic semiconductor materials.

[0019] As noted above, the flash module 110 of FIG. 1 may be an adaptive flash that includes individually addressable LED segments to enable selective illumination of the scene 104. For array sizes larger than a 3×3 matrix, the LED segments may be combined with an integrated driver to enable individual addressability functionality and obtain the small form factor desired for mobile devices without issues in the layout of the semiconductor layers used to create the integrated device. In addition, integrating the driver and LEDs into a single device increases the thermal challenges of the overall structure due to increased heat load in the combined structure. Furthermore, as noted above, the number of openings in the housing of the mobile device may be reduced in embodiments where sensors for ambient light and / or flicker detection are integrated into the flash module / camera. Limiting the number of openings in the housing may increase the structural integrity of the housing, as well as improving the industrial design of the mobile device.

[0020] FIG. 3 illustrates a top view of a structure 300 according to some embodiments. Only some of the elements in the structure 300 are illustrated in FIG. 3. The structure 300 may include, among other things, an LED matrix 302, a plurality of sensors 304, and a driver 306. The structure 300 may be disposed, for example, on a compound metal oxide semiconductor (CMOS) backplane or a glass backplane, on which semiconductor material may be deposited to form transistors that control the individual pixel units of the LED matrix 302. The structure 300 may be attached to a PCB (not shown in FIG. 3) or a polyethylene terephthalate (PET) film deposited or otherwise formed with a semiconductor layer. Various electronic components, such as a processor, memory, and a PWM generator (or current generator), among other things, may be provided on the PCB. The structure 300 may include contact pads 308 used for input and output data signals, test signals, power, etc.

[0021] The LED matrix 302 and the sensor 304 may be integrated onto a semiconductor structure such as a CMOS chip 310. As will be apparent, the amount of space used by the LED matrix 302 and the sensor 304 will correspondingly increase the amount of semiconductor used and enlarge the CMOS chip 310. In addition to increasing the CMOS area, the integration of the LED matrix 302 and the sensor 304 may reduce the number of power and communication contacts. The increase in CMOS area may improve the thermal design of the CMOS chip 310 by providing additional area to aid in the dissipation of heat. In some embodiments, a heat sink may also be placed on the extended area of ​​the CMOS chip 310.

[0022] The sensors 304 may be of the same type and may be symmetrically arranged with respect to the LED matrix 302. This arrangement may enable spatially symmetric detection. In particular, in such an embodiment, the CMOS chip 310 including the LED matrix 302 and the sensors 304 may be placed in the flash module 110 of FIG. 1 below the lens 116 used to image the LED matrix. In this case, the lens 116 and the LED array 112 may form an optical axis. As shown in FIG. 3, the sensors 304 are on opposite sides of the LED matrix 302. When the sensors 304 are placed on both sides of the LED matrix 302, the detection through the common lens becomes spatially symmetric. In other embodiments, the sensors 304 may be placed on all (four) sides of the LED matrix 302. In other embodiments where the LED matrix 302 is non-rectangular (e.g., octagonal), a greater number of sensors 304 may be symmetrically arranged around the perimeter of the LED matrix 302.

[0023] In other embodiments, sensors other than flicker sensors may be additionally disposed around the LED matrix 302 or incorporated into the structure 300. These sensors may include other optical sensors (such as red, green, blue (RGB) ambient light sensors) or non-optical sensors such as accelerometers, gyroscopes, or near field communication (NFC) sensors. As noted above, the LED matrix 302 may be segmented into one or more LED arrays, and the LEDs within each LED array may be driven individually, or the LED arrays themselves may be driven individually.

[0024] FIG. 4 shows a simplified flow chart for manufacturing an LED structure according to some embodiments. FIG. 5A-FIG. 5E show the LED structure at different points in the method 400 described in FIG. 4. Note that only some operations of the method 400 are shown, i.e., other operations may exist but are not shown for convenience. In operation 402, the driver may be fabricated in a semiconductor structure using conventional semiconductor processes, including photolithography, etching, metallization, deposition, and cleaning processes. The driver may be formed in silicon (Si) or any other suitable semiconductor, or in a semiconductor layer formed on or within a dielectric material. The driver may have multiple semiconductor, metal, and insulating (e.g., oxide) layers to provide active circuitry and contacts, among others. Performance testing of the driver may be performed before the following further processes are performed.

[0025] Once the driver has been tested and the response is found to be acceptable according to a predefined set of clients, contacts may be fabricated on the semiconductor structure in operation 404. The contacts may include PCB contacts used to connect to a PCB and LED contacts used to connect to an LED array structure. The PCB contacts may include, for example, one or more of input / output, test, power, and ground contacts. The PCB contacts may be formed, for example, as wire bonds, copper (Cu) pillars, or solder bumps using through substrate vias (TSVs), and the LED contacts may be formed, for example, using copper (Cu) pillars.

[0026] In operation 406, a protective layer can be deposited on the semiconductor structure 502. Upon reading and understanding the disclosed subject matter, one skilled in the art will recognize that non-semiconductor structures (e.g., dielectric structures having one or more semiconductor films formed thereon) can be used as well. The overall structure is shown in FIG. 5A. In particular, as shown in FIG. 5A, a protective layer 506, such as a resist, can be deposited on the semiconductor structure 502 to protect the PCB contacts 504a, while leaving exposed the solder bumps forming the LED contacts 504b.

[0027] In operation 408, a CMOS chip containing an LED array and a sensor can be attached to the semiconductor structure 502. As described above, surface mount technology can be used to mount the CMOS chip on the solder bumps (LED contacts 504b). Alternatively, Cu pillars can be used to wafer bond the LED die to the CMOS chip.

[0028] In operation 410, and as shown in FIG. 5B, an underfill 508 may be used to fill the gap between the CMOS chip 510 including the integrated LED array and the sensor structure 512, and a substrate 514 may be attached to the semiconductor structure 502. The underfill may be formed, for example, from a resin or Si epoxy. That is, the LED array and the sensor structure 512 are fabricated on the substrate 514 using semiconductor processes (e.g., deposition, etching, plating) as described below such that they are integrated into the same overall set of layers.

[0029] 5C, and in operation 412, the substrate 514 on which the LED array and sensor structure 512 is grown may be removed. In some cases, the substrate 514 may be formed from sapphire, and a lift-off and / or laser ablation process may be used to remove the substrate 514. Thus, only the integrated LED array and sensor structure 512 remains attached to the semiconductor structure 502 via the LED contacts 504b and the underfill 508.

[0030] In operation 414, the integrated LED array and sensor structures 512 remaining after lift-off may be cleaned, for example, using a solvent and deionized water. The integrated LED array and sensor structures 512 may then be inspected, for example, visually or optically, for defects and impurities prior to further manufacturing processes.

[0031] After cleaning and inspection, in operation 416, and as shown in FIG. 5D, a phosphor layer 516 may be attached or otherwise laminated or formed on the LED array and sensor structure 512. The addition of the phosphor layer 516 may produce white (or other color) light from the light emitted by the LED array. In some embodiments, the LEDs may produce light having wavelengths that may be in the blue or violet portion of the visible spectrum. The light from the LEDs may be used to excite phosphors in the phosphor layer 516, which, after absorption of some or all of the light, may emit light at a wavelength longer than the excitation wavelength to produce white light. The LED / sensor structure 530 is shown in its entirety in FIG. 5D.

[0032] After deposition of the phosphor layer 516, in operation 418, the protective layer 506 (e.g., resist, see FIG. 5A) may be removed from the underlying structures. In particular, the protective layer 506 may be removed from the PCB contacts 504a on the semiconductor structure 502.

[0033] After removal of protective layer 506, in operation 420, and as shown in FIG. 5E, semiconductor structure 502 may be attached to PCB 522 via bonding layer 520. Bonding layer 520 may be, for example, epoxy. After semiconductor structure 502 is attached to PCB 522, PCB contacts 504a may be wirebonded to corresponding PCB contacts 524 on PCB 522 using wire bonds 518.

[0034] Other layers and structures may be added to the above. For example, multiple phosphor layers or reflective layers to better direct light may be added to the structures shown in Figures 5A-5E. Thus, as shown, an integrated semiconductor structure includes an LED array and sensor structure 512 integrated on a single CMOS chip.

[0035] FIG. 6 illustrates a block diagram of a mobile device according to some embodiments. The mobile device 600 may be a UE, such as a dedicated computer, a personal or laptop computer (PC), a tablet PC, or a smartphone. Various elements may be provided on the PCB. An embodiment may include or operate on logic, or numerous components, modules, or mechanisms, as described herein. Modules and components are tangible entities (e.g., hardware) capable of performing specified operations and may be configured or arranged in a predetermined manner. In one example, a circuit may be configured in a specified manner as a module (e.g., internally or with respect to external entities such as other circuits). In one example, one or more computer systems (e.g., standalone, client, or server computer systems) or one or more hardware processors may be configured in whole or in part as a module that operates to perform operations specified by firmware or software (e.g., instructions, application parts, or applications). In one example, the software may reside on a machine-readable medium. In one example, the software, when executed by a module's underlying hardware, causes the hardware to perform specified operations.

[0036] Accordingly, the terms "module" (and "component") are understood to encompass tangible entities, that is physically constructed, specifically configured (e.g., hardwired), or temporarily (e.g., for a short period of time) configured (e.g., programmed) to operate in a specified manner or to perform some or all of any of the operations described herein. Given embodiments in which the modules are temporarily configured, each of the modules need not be instantiated at any one time. For example, if the modules include a general-purpose hardware processor configured using software, the general-purpose hardware processor may be configured as different modules at different times. The software may accordingly configure the hardware processor, for example, to configure a particular module at one time and a different module at a different time.

[0037] The mobile device 600 may include a hardware processor (or equivalent processing circuitry) 602 (e.g., a central processing unit (CPU), a GPU, a hardware processor core, or any combination thereof), a main memory 604, and a static memory 606, some or all of which may communicate with each other via an interlink (e.g., a bus) 608. The main memory 604 may include any or all of removable and non-removable storage, volatile and non-volatile memory. The mobile device 600 may further include a display 610, such as a video display, an alphanumeric input device 612 (e.g., a keyboard), and a user interface (UI) navigation device 614 (e.g., a mouse). In one example, the display 610, the input device 612, and the UI navigation device 614 may be touch screen displays. The mobile device 600 may additionally include a storage device (e.g., a drive unit) 616, a signal generating device 618 (e.g., a speaker), a network interface device 620, one or more cameras 628, and one or more sensors 630, such as a Global Positioning System (GPS) sensor, a compass, an accelerometer, or other sensors such as those described herein. The mobile device 600 may further include an output controller, such as a serial (e.g., Universal Serial Bus (USB)), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection, to communicate with or control one or more peripheral devices (e.g., a printer, a card reader, etc.).

[0038] The storage device 616 may include a non-transitory machine-readable medium 622 (hereinafter simply referred to as a machine-readable medium) having stored thereon one or more sets of data structures or instructions 624 (e.g., software) that embody or are utilized by any one or more of the techniques or functions described herein. The instructions 624 may also reside, completely or at least partially, within the main memory 604, within the static memory 606, and / or within the hardware processor 602 during execution thereof by the mobile device 600. Although the machine-readable medium 622 is illustrated as a single medium, the term "machine readable medium" may include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) configured to store one or more instructions 624.

[0039] The term "machine-readable medium" may include any medium capable of storing, encoding, or carrying instructions for execution by the mobile device 600 and capable of causing the mobile device 600 to perform any one or more of the techniques of this disclosure or capable of storing, encoding, or carrying data structures used by or associated with such instructions. Non-limiting examples of machine-readable media may include solid-state memory, or optical or magnetic media. Specific examples of machine-readable media may include non-volatile memory such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices, magnetic disks such as internal hard disks and removable disks, magneto-optical disks, random access memory (RAM), and CD-ROM and DVD-ROM disks.

[0040] The instructions 624 may further be transmitted or received across a communications network using a transmission medium 626 via a network interface device 620 utilizing any one of a number of wireless local area network (WLAN) transport protocols (e.g., Frame Relay, Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), HyperTransfer Protocol (HTTP), etc.). Exemplary communications networks may include local area networks (LANs), wide area networks (WANs), packet data networks (e.g., the Internet), mobile telephone networks (e.g., cellular networks), plain old telephone service (POTS) networks, and wireless data networks. Communications across the network may include one or more different protocols. Among these are the Institute of Electrical and Electronics Engineers (IEEE) 802.11 family of standards known as Wi-Fi, the IEEE 802.16 family of standards known as WiMax, the IEEE 802.15.4 family of standards, the Long Term Evolution (LTE) family of standards, the Universal Mobile Telecommunications System (UMTS) family of standards, peer-to-peer (P2P) networks, Next Generation (NG) / Fifth Generation (5G), etc. In one example, the network interface device 620 may include one or more physical jacks (e.g., Ethernet, coaxial, or phone jacks) or one or more antennas for connecting to the transmission medium 626.

[0041] Note that the term “circuitry” as used herein refers to, is a part of, or includes hardware components, such as electronic circuits, logic circuits, processors (shared, dedicated, or groups) and / or memories (shared, dedicated, or groups), application specific integrated circuits (ASICs), field programmable devices (FPDs) (e.g., field programmable gate arrays (FPGAs), programmable logic devices (PLDs), complex PLDs (CPLDs), high capacity PLDs (HCPLDs), structured ASICs, or programmable SoCs), digital signal processors (DSPs), etc., configured to provide a described functionality. In some embodiments, a circuit may execute one or more software or firmware programs to provide at least some of the described functionality. The term “circuitry” may also refer to a combination of one or more hardware elements (or combination of circuits used in an electrical or electronic system) with program code used to perform the functions of the program code. In these embodiments, the combination of hardware elements and program code may be referred to as a particular type of circuit.

[0042] Thus, as used herein, the term "processor circuitry" or "processor" refers to, is a part of, or includes circuitry that is capable of sequentially and automatically performing a sequence of arithmetic or logical operations or recording, storing, and / or transmitting digital data. The term "processor circuitry" or "processor" can refer to one or more application processors, one or more baseband processors, physical central processing units (CPUs), single or multi-core processors, and / or any other device capable of executing or otherwise operating computer-executable instructions, such as program code, software modules, and / or functional processes.

[0043] In addition to reducing the number of contacts, improving the thermal issues of the CMOS device, and reducing the number of openings in the housing of the mobile device, the integration of the LED matrix and flicker sensor in the CMOS device allows the use of a flicker sensor to control the minimum current through each LED to generate a white appearance from the entire structure. In particular, there are variations in the various layers (semiconductor and other) due to various issues including, among others, variations in gas flow and etch rates on the wafers used to fabricate the integrated structure. Such variations can cause large operational variations in the emission of the LEDs at low applied currents. This can cause the problem that at relatively low currents or when there is no current, the LED array can appear yellowish / orange due to the presence of phosphor. To make the LED array appear white (typically desired), the LEDs can be activated with at least a minimum amount of current, which can vary from LED to LED due to the manufacturing variations mentioned above. This minimum amount of current can cause the LEDs to emit light at an intensity greater than the ambient light. However, due to variations in LEDs at low currents, the ability to provide white light (intensity or color) across the LED array may not be uniform. Therefore, it would be desirable to individually control the current to the LEDs to account for variations in LED manufacturing and to adjust the amount of ambient light. A flicker sensor, formed on the same structure as the LEDs, can be used by the processor on the PCB to help adjust the current to individual LEDs to avoid such variations. The amount of current applied to each LED can be calibrated during manufacturing to ensure that the LEDs appear white.

[0044] In addition, while multiple lenses are shown in FIG. 1, in certain embodiments, it may be desirable to use a single lens for several reasons. For example, by placing the sensor symmetrically around the LED, and therefore the lens, the detection provided by the sensor may be more symmetric in space. That is, the field of view (FOV) for the lens may be symmetric instead of off-axis (if separate, the sensor signal from the lens may be more off-axis). Of course, in other embodiments, one or more individual lens elements may be provided for the flicker sensor. In some embodiments, to maintain the whitish appearance of the LED array, the sensor may detect reflections off the lens under dark conditions to adjust the current to a designed flux output level depending on the ambient light level. In some embodiments, synchronous detection of pulsed LED emission may help to increase sensitivity.

[0045] 7A-7C show LEDs under low ambient light using different drive currents, according to some embodiments. In particular, FIGS. 7A-7C show a comparison of the appearance of LEDs under 50 lux ambient light, where FIG. 7A shows 0A applied to each LED in the LED array (essentially a yellow LED array), FIG. 7B shows 10 μA applied to each LED (essentially a pale yellow LED array), and FIG. 7C shows 20 μA applied to each LED (essentially a white LED array), with the current values ​​depending on the individual LED.

[0046] 8A-8B show LEDs under high ambient light using different drive currents, according to some embodiments. In particular, FIGS. 8A-8B show a comparison of LED appearances under 3500 lux ambient light, where FIG. 8A shows 0 A applied to each LED (essentially a yellow LED array) and FIG. 8B shows 100 μA applied to each LED (essentially a white LED array).

[0047] While only certain features of the systems and methods have been illustrated and described herein, many modifications and changes will occur to those skilled in the art. It is therefore to be understood that the appended claims are intended to cover all such modifications and changes. Method actions may be performed substantially simultaneously or in different orders.

[0048] Although the embodiments have been described with reference to certain exemplary embodiments, it will be apparent that various modifications and changes can be made thereto without departing from the broader scope of the present disclosure. Accordingly, the specification and drawings are to be considered in an illustrative, rather than a restrictive, sense. The accompanying drawings, which form a part of this specification, show, by way of example, and not by way of limitation, specific embodiments in which technical matters may be practiced. The illustrated embodiments are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed herein. Other embodiments may be utilized and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of the present disclosure. Accordingly, this detailed description is not to be construed in a limiting sense, and the scope of the various embodiments is defined solely by the appended claims, along with the full scope of equivalents to which such claims are entitled.

[0049] Technical matters may be referred to herein, individually and / or collectively, by the term "embodiment" for mere convenience and are not intended to spontaneously limit the scope of the present application to any single inventive concept when more than one is actually disclosed. Thus, although specific embodiments have been illustrated and described herein, it should be understood that any configuration calculated to achieve the same purpose may be substituted for the specific embodiment shown. The present disclosure is intended to cover any and all adaptations or variations of the various embodiments. Combinations of the above embodiments, as well as other embodiments not specifically described herein, will be apparent to those of skill in the art upon reviewing the above description.

[0050] As used herein, the term "a" or "an" is used to include one or more than one, as is common in the patent literature, regardless of any other instance or usage of "at least one" or "one or more." As used herein, the term "or" is used to refer to a non-exclusive, such that "A or B" includes "A but not B," "B but not A," and "A and B," unless otherwise indicated. As used herein, the terms "including" and "in The term "which" is used as the plain-English equivalent of the terms "comprising" and "wherein," respectively. Also, in the following claims, the terms "comprising" and "comprising" are open-ended, i.e., systems, UEs, articles of manufacture, compositions, formulations, or processes that include elements in addition to those recited after such terms in a claim are still considered to be within the scope of that claim. Moreover, in the following claims, the terms "first," "second," and "third" are used merely as labels and are not intended to impose numerical requirements on their objects.

[0051] The Abstract of the Disclosure is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the above Detailed Description, it can be seen that various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure should not be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment.

Claims

1. A light emitting diode (LED) structure comprising a semiconductor structure, The semiconductor structure comprises: an LED matrix including one or more LED arrays; Each LED array includes a plurality of LEDs separated by non-emitting regions; the plurality of LEDs are configured to be independently driven to provide light; LED matrix, and a sensor disposed on a plurality of edges of the LED matrix; The sensor is configured to detect ambient light. Sensors, , an LED structure.

2. The sensor is a flicker sensor.

2. The LED structure of claim 1.

3. The sensors are disposed on opposite sides of the LED matrix.

2. The LED structure of claim 1.

4. The sensors are disposed on all edges of the LED matrix.

4. The LED structure of claim 3.

5. The LED structure further comprises: a phosphor disposed on the LED matrix; 2. The LED structure of claim 1.

6. The LED structure further comprises: a driver configured to drive the LED matrix; the semiconductor structure is coupled to the driver via a conductive pillar and an underfill between the conductive pillars.

2. The LED structure of claim 1.

7. The LED structure further comprises: a printed circuit board (PCB) having a plurality of PCB contacts; the semiconductor construction having a plurality of LED contacts; the semiconductor structure is mounted on the PCB; the PCB is electrically coupled to the semiconductor structure via the plurality of PCB contacts and the plurality of LED contacts; 2. The LED structure of claim 1.

8. The semiconductor structure further comprises an optical or non-optical sensor.

2. The LED structure of claim 1.

9. 1. A mobile device comprising: A semiconductor structure, a light emitting diode (LED) matrix including one or more LED arrays; Each LED array includes a plurality of LEDs separated by non-emitting regions; the plurality of LEDs are configured to be independently driven to provide light; LED matrix and a sensor disposed on a plurality of edges of the LED matrix; The sensor is configured to detect ambient light. Sensors, and Multiple LED contacts, a semiconductor structure comprising: a driver configured to drive the LED matrix; the semiconductor structure is coupled to the driver via a conductive pillar and an underfill between the conductive pillars. Driver and a printed circuit board (PCB) coupled to the driver; It has multiple PCB contacts, electrically coupled to the semiconductor structure via the plurality of PCB contacts and the plurality of LED contacts; PCB and Including mobile devices.

10. The sensor is a flicker sensor. The mobile device of claim 9.

11. the sensors are disposed on opposite edges of the LED matrix; The mobile device of claim 10.

12. The sensors are disposed on all sides of the LED matrix. The mobile device of claim 11.

13. The mobile device further comprises: a phosphor disposed on the LED matrix; The mobile device of claim 9.

14. The sensor further comprises: configured to detect flicker in the ambient light. The mobile device of claim 9.

15. The mobile device further includes a processor; The processor, determining an amount of ambient light based on a signal from the ambient light sensor; and controlling the driver to drive the LED matrix to generate white light using a minimum amount of current dependent on the determined amount of ambient light. It is configured as follows: The mobile device of claim 14.

16. each of the plurality of LEDs has an independent minimum amount of current to produce the white light that is dependent on the amount of ambient light; and The processor, independently driving each of the plurality of LEDs to generate the white light using the minimum amount of current for the LEDs. It is configured as follows:

16. The mobile device of claim 15.

17. The mobile device further comprises: a single lens configured for use with both the LED matrix and the sensor; The mobile device of claim 9.

18. 1. A method for manufacturing a light emitting diode (LED) structure, the method comprising: using conductive pillars to couple the structure to a semiconductor driver, the semiconductor structure comprising: an LED matrix including one or more LED arrays; Each LED array includes a plurality of LEDs separated by non-emitting regions; the plurality of LEDs are configured to be independently driven to provide light; LED matrix, sensors disposed on opposing edges of the LED matrix; The sensor is configured to detect ambient light. Sensors, and a substrate on which said LED matrix and said sensor are fabricated; and providing an underfill between the conductive pillars to adhere the structure to the semiconductor driver; the semiconductor driver is configured to drive the LED matrix; Steps and A method comprising:

19. The method further comprises: depositing a phosphor onto the structure; The phosphor is configured to emit white light when light from the LED matrix strikes the phosphor. Steps and lifting off the substrate after the underfill has been applied; 20. The method of claim 18, comprising:

20. The method further comprises: attaching the semiconductor driver to a printed circuit board (PCB) having a plurality of PCB contacts; the structure having a plurality of LED contacts; The structure is mounted on the PCB. Steps and electrically coupling the PCB to the structure via the plurality of PCB contacts and the plurality of LED contacts; 20. The method of claim 18, comprising:

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