Immersion cooling platform

Abstract

To provide a computing system and a cooling system which utilize pressure and / or steam management and is immersed and cooled.SOLUTION: A two-phase immersion cooling system in which a heat generation computer component vaporizes a dielectric fluid in its liquid phase is used to condense the dielectric fluid back to the liquid phase to cool a computer component. The system operates below atmospheric pressure by using a pressure control vessel and a pressure controller. The system exerts influence on a temperature at which the dielectric fluid is vaporized by controlling operating pressure, and thereby achieves performance that increased from a given computer component 170. A self-heating type computing system is formed by utilizing an internal robot arm 230 and a slot-in type computing component.SELECTED DRAWING: Figure 7-1

Description

[Technical field]

[0001] The present invention relates to a computing system that is immersion cooled, i.e., pressure and / or vapor cooled. This invention relates to an immersion cooled computing system that utilizes air management. Summary of the Invention

[0002] A conventional computing and / or server system cools various components. Traditional liquid or water-cooled computers use air to cool the computer components. It uses a flowing liquid to remove heat from the computer components, but there is no direct contact between the computer components and the liquid itself. The development of non-conductive and / or dielectric fluids allows for direct contact with components. Computer components and other electronic parts are dielectric or non-conductive in order to transfer heat to the liquid in contact with them. This allows the use of immersion cooling, whereby the computer components can be immersed in a liquid. can be used to reduce the total energy required to cool It also reduces the amount of space and equipment required.

[0003] In the embodiments of the present disclosure described below, steam and pressure management systems and power pipes are The use of these processing systems has resulted in significantly improved computer systems that utilize liquid immersion cooling. These can be used individually or in combination to

[0004] Inventive embodiments of the present disclosure are directed to a liquid immersion cooled computing system. In one embodiment, the pressure-controlled vessel is a heat generating condenser. A liquid dielectric fluid in a sufficient amount to substantially immerse the computer components, and an atmospheric gas-containing dielectric fluid. The embodiment also includes a gas dielectric fluid for cooling and converting the gas dielectric fluid to a liquid dielectric fluid. The disclosed pressure management system further comprises a condensation system. This allows the dielectric fluid to evaporate and perform computing The temperature at which the system operates is reduced. The disclosed embodiments provide an improved thermal management system as described above. This allows for higher density of computer components and / or higher performance of computers. do. [Brief description of the drawings]

[0005] [Figure 1] FIG. 1 illustrates a schematic diagram of a pressure controlled vessel according to an example embodiment. [Diagram 2] FIG. 2 illustrates a schematic diagram of a pressure controlled vessel according to an example embodiment. [Diagram 3] FIG. 3 illustrates an external view of an exemplary embodiment of a pressure controlled vessel 110. [Figure 4] FIG. 4 illustrates an exemplary embodiment of a superstructure including multiple pressure controlled vessels. [Diagram 5] FIG. 5 illustrates an example data center embodiment showing multiple pressure controlled vessels connected to a central power supply. [Figure 6] FIG. 6 illustrates an example data center embodiment showing multiple pressure controlled vessels connected in series with each other. [Figure 7-1] 7A and 7B illustrate an example embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. [Figure 7-2]Figure 7C illustrates an example embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. Figure 7D illustrates an example embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. [Figure 8A] FIG. 8A illustrates an example embodiment of a rack system. [Figure 8B] FIG. 8B illustrates an exemplary embodiment of a rack system. [Figure 8C] FIG. 8C illustrates an exemplary embodiment of a rack system. [Figure 9A] FIG. 9A illustrates an exemplary embodiment of a chassis for mounting various components. [Figure 9B] FIG. 9B illustrates an exemplary embodiment of a chassis for mounting various components. [Figure 9C] FIG. 9C illustrates an exemplary embodiment of a chassis for mounting various components. [Figure 9D] FIG. 9D illustrates an exemplary embodiment of a chassis for mounting various components. [Figure 9E] FIG. 9E illustrates an exemplary embodiment of a chassis for mounting various components. [Figure 9F] FIG. 9F illustrates an exemplary embodiment of a chassis for mounting various components. [Figure 9G] FIG. 9G illustrates an exemplary embodiment of a chassis for mounting various components. [Figure 10A] FIG. 10A illustrates an exemplary embodiment of a pressure controlled vessel. [Figure 10B] FIG. 10B illustrates an exemplary embodiment of a pressure controlled vessel. [Figure 10C] FIG. 10C illustrates an exemplary embodiment of a pressure controlled vessel. [Figure 10D] FIG. 10D illustrates an exemplary embodiment of a pressure controlled vessel. [Figure 10E] FIG. 10E illustrates an exemplary embodiment of a pressure controlled vessel. [Figure 10F]FIG. 10F illustrates an exemplary embodiment of a pressure controlled vessel. [Figure 11] FIG. 11 illustrates an exemplary cooling and steam management system for a pressure controlled vessel. [Figure 12A] FIG. 12A shows another embodiment of the container. [Figure 12B] FIG. 12B shows another embodiment of the container. [Figure 12C] FIG. 12C shows another embodiment of the container. [Figure 12D] FIG. 12D shows another embodiment of the container. [Figure 12E] FIG. 12E shows another embodiment of the container. [Figure 13] FIG. 13 shows an example of a self-contained container. [Figure 14] FIG. 14 shows an example of an external housing for a self-contained container. [Figure 15A] FIG. 15A shows an exemplary magazine located on a platform that can protrude from the container. [Figure 15B] FIG. 15B shows an exemplary magazine located on a platform that can protrude from the container. [Figure 15C] FIG. 15C shows an exemplary magazine located on a platform that can protrude from the container. [Figure 15D] FIG. 15D shows an exemplary magazine located on a platform that can protrude from the container. [Figure 16] FIG. 16 illustrates a vapor recovery system according to an example embodiment. [Figure 17] FIG. 17 illustrates an example embodiment of a rack power distribution system. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0006] In the following description, specific examples are provided to provide a thorough understanding of the embodiments disclosed herein. Specific details such as quantity, size, arrangement, configuration, components, etc. are described, although the disclosure is not limited thereto. It will be apparent to one skilled in the art that the present invention may be practiced without such specific details. Therefore, details regarding such considerations and the like may be provided without departing from the spirit and scope of the present disclosure, unless such details are necessary to provide a complete understanding of the present disclosure. are omitted because they are not necessary for the purpose and are within the skill of those in the art.

[0007] The devices, components, systems, and subsystems of the following several disclosed embodiments are This disclosure does not imply that such components may be developed and / or sold under specific trade names. that the invention may be implemented with a number of similar components, whether or not the particular product name is used The features and / or invention features associated with the elements are not essential to the practice of the disclosed invention. It will be apparent to those skilled in the art that

[0008] Dielectric Fluid One aspect of immersion cooling is the use of a thermally conductive but electrically substantially non-conductive or substantially Use of dielectric fluids. Examples of such fluids include Novec 7100 from 3M (trademark The fluids include some of the Novec™ series designed by The disclosure is not limited to a particular dielectric fluid. The immersion fluid typically All of the computers in the disclosed system have a desired boiling point at which they can operate. The data components and other aspects are preferably not fusible and, if not, are dielectric. It is made of a material that does not break down dielectrically in the pressure-controlled vessel when in contact with the fluid. The boiling point of the dielectric fluid at subatmospheric pressure is less than about 100° C., less than about 80° C., less than about 60° C., It may be less than about 50° C. or even lower. In some embodiments, the dielectric flow rate at standard atmospheric pressure is The boiling point of the body may be greater than about 60° C., greater than about 40° C., greater than about 30° C., or greater than about 20° C. Certain embodiments of the fluid generally have a low vapor pressure. is a fluorocarbon and / or a fluorinated ketone. Particular embodiments of the dielectric fluid are , (CF3)2CFCF2OCH3, C4F9OCH3 or CF3CF2CF2CF 2OCH3, or a similar chemical formula. Contains fluoroethers and methoxy-nonafluorobutane.

[0009] Other desirable properties of the immersion cooling fluid include low toxicity, non-flammability and / or low surface tension. In an embodiment, the immersion cooling fluid is a cooling fluid that is suitable for use in computing Computer components and / or connections, wiring, cables, enclosures, etc., associated with computer components Some dielectric fluids have a viscosity in the range of about 1.8 to about 8. It has a dielectric constant of about 100 and a dielectric strength of about 15 megavolts per meter (MV / m). In certain embodiments, the MV / m is at least about 5 MV / m, at least about 8 MV / m, or at least about 10 In some embodiments, the dielectric strength is at least about 12 MV / m. The fluid has a dielectric strength of up to about 3MV / m, up to about 5MV / m, or up to about 8MV / m. In the disclosed embodiment, any liquid in contact with computer components 170 is No damage to computer components at specified application intervals and conditions. It has a sufficiently high dielectric strength so that

[0010] Some dielectric fluids have a dielectric constant of at least about 10 W / cm 2 , at least about 15 W / cm 2 , few At most about 18W / cm 2 Or at least about 20 W / cm 2It has a critical heat flux of The maximum electric current is about 15W / cm 2 , up to about 10W / cm 2 , maximum of about 8W / cm 2 Or a maximum of about 5W / cm 2 has a critical heat flux of

[0011] FIG. 1 illustrates a schematic diagram of a cooled computing system 110 in accordance with an example embodiment. The disclosed cooled computing system 110 (or computing system , system, vessel or pressure controlled vessel, all of which may be used interchangeably. The embodiment cools the computer components 170 by immersing the components in a bath of fluid. A liquid dielectric fluid 140 may be used to cool the electrical current passing through the component 170. As the component 170 heats up, the performance of the component decreases. The power supply may degrade or components may become damaged to the point of failure. It is advantageous to maintain the cooling components at a stable, relatively low temperature. The computer components 170 may be heated to temperatures below about 80° C., below about 70° C., below about 65° C., below about 60° C. In one embodiment, computer component 170 may be maintained at or below about 55° C. The temperature may be maintained at greater than about 60°C, greater than about 50°C, greater than about 40°C, greater than about 35°C, or greater than about 30°C. As the computer component 170 heats up, the heat is transferred to the liquid dielectric flow surrounding the component 170. When the liquid dielectric fluid reaches its boiling point, it transitions from the liquid phase to the gas phase. Component 1 in the dielectric fluid bath 142 will rise out of the liquid bath 142. 70 may be generally maintained near the boiling point of the particular dielectric fluid 140 being used.

[0012] The liquid dielectric fluid is heated to its vaporization point at the pressure employed for a given application. When heated to a gaseous state, bubbles of dielectric vapor rise from the liquid bath 142 and enter the system 110. The vapor then rises to the top of the condenser 130 where it is cooled to the condensation point. Depending on the configuration of the system 110, heating and cooling of the dielectric fluid from the liquid phase to the vapor phase to the liquid phase can be achieved. The cooling can generate convection currents as shown in FIG.

[0013] In one embodiment, the computer component 170 detects the liquid dielectric flow during operation of the system. In other words, the computer component 170 is completely immersed in the body 140. The upper portion of the dielectric liquid 140 is below the level of the dielectric liquid 140. The device changes the dielectric fluid from a liquid to a gas phase, allowing tiny bubbles of the dielectric fluid to penetrate into computer components. It should be clear that such components will still be in contact with the liquid dielectric In one embodiment, the computer component is considered to be completely immersed in the conductive fluid. The element 170 may be immersed in the liquid phase of the dielectric fluid 140. In one exemplary embodiment, this may include Including but not limited to motherboards, chips, servers, cards, blades, GPUs or CPUs of computer components, including any part of U and / or any peripheral components. If any part is in direct contact with the dielectric fluid 140 in the liquid phase, the computer component is considered to be immersed. In a particular embodiment, computer component 170 The liquid phase of the dielectric fluid 140 may be at least partially immersed in the liquid phase of the dielectric fluid 140. If 70 is not immersed but is sufficiently cooled by dielectric vapor, the computer component is considered to be at least partially immersed.

[0014] In some existing immersion cooling systems, the fluid is constantly boiling, so the dielectric fluid Failure to add dielectric fluid to tank 142 will result in the tank The height of the dielectric fluid at 142 is such that the components are exposed to the gas atmosphere and cannot be adequately cooled. This can result in degradation or damage to the component 170. possible.

[0015] In some embodiments, the fluid management system may include a dielectric fluid in its liquid state. There are several modes of operation that can be considered. These modes are: (1) when the dielectric fluid is stored; (2) initial fill, which is the process by which additional fluid is added to the vessel; (3) continuous leveling, which is the process by which excess fluid is removed from a vessel; (4) withdrawal, which is a process in which the fluid is diverted to a filter system and placed in a storage system; Active filtration is a process in which the air is continuously circulated through the filter to ensure the removal of any particulates. It may include

[0016] In one embodiment, the first three fluid management challenges are addressed: initial fill, continuous leveling, Inlet and outlet withdrawal can generally be accomplished by the same set of piping, pumps and valves. Dedicated tanks for storing liquid refrigerants are being used to store new fluids and vapors that have been removed and are currently undergoing vapor management processing. The set of pipes and pumps can be used for storage of excess fluid that is recondensed into During filling and leveling, the refrigerant (or dielectric fluid) is transported from the storage system to the vessel and then drawn off. It can be used to transport the material from the container back to the storage system during operation.

[0017] In one embodiment, the fourth of the fluid management challenges, namely, operating filters, The filtering can be accomplished by a series of skimmers and / or filters. It can be a large particle filter located in the bottom. The purpose of this filter is to filter out particles that are too large for the later stages. The second objective is to prevent particles that cannot be handled by the detector from entering the rest of the system. The stage is a medium particulate filter located in-line in the piping system between the first and third stages. This second stage medium particulate filter can be used to filter out the first stage filters that are too small. The particulate matter that cannot be removed but is still too large for the third stage filter to handle. A small barrel filter can be used to remove the ions. It may consist of one or more parallel filters with supports for the filter configuration. In this study, a particular type of filter was placed in the container environment to analyze the fluid after it was exposed to it. It is dedicated to working with a set of hardware components that Different hardware and / or components can be used to improve the longevity and effectiveness of the dielectric fluid. Different types of particulates and particles that may need to be filtered to ensure and chemicals are more likely to be produced.

[0018] Pressure Management Generally, the immersion cooling fluid must be kept free of dust, water and / or other contaminants. Since the computer components 170 are in direct contact with the immersion cooling fluid 140, only Even minor contaminants can cause short circuits or damage to computer components. Water or water vapor that can contaminate a volatile fluid will, as it becomes contaminated, Although the dielectric strength of the dielectric fluid is not reduced, it can degrade its dielectric properties, including its dielectric strength. In this case, computer components may short out or otherwise be damaged during operation. One way to reduce contamination is to maintain the pressure slightly above atmospheric or even higher. The objective of the present invention is to operate an immersion cooling system in an enclosure that is

[0019] As the computer component 170 operates, the computer component The heat generated by the immersion cooling system causes some of the dielectric fluid 140 to evaporate into a gas. When the gas is contained within a substantially sealed housing, this evaporation typically occurs within the Increase atmospheric pressure. Pressure relief valves, expansion enclosures and / or other techniques can be used to Limit the pressure increase and / or use a heater at or slightly above atmospheric pressure. It can be used to maintain pressure within the enclosure. Maintaining the immersion cooling of computing systems is a simple process. This may help reduce infiltration.

[0020] The current embodiment is a sealed, pressure-controlled enclosure 110 (or a cooled computing system 110) to provide a computing component 170 and an immersion cooling device, and associated The power supply, networking connections, wiring connections, etc. are contained within the pressure-controlled vessel. In contrast to the pressure controlled vessel 110, at least a slight vacuum is maintained, thereby 2. Lowering the boiling point of the dielectric fluid 140 to a temperature below its boiling point at standard atmospheric pressure. can be done.

[0021] The computing and immersion cooling system operates under vacuum, The dielectric fluid 170 can be maintained at a reduced low pressure boiling point of the dielectric fluid 140. This allows for more Allowing electricity to flow through various components 170 resulting in greater component performance By controlling the pressure in the pressure control vessel 110, Thus, the boiling point of the dielectric fluid 140 can also be controlled, allowing the same fluid 140 to be used in a wider range of applications. Many embodiments may benefit from lower temperatures. However, there is an ideal range for a particular computer component 170, and temperatures below that range By controlling the pressure in the pressure controlled vessel 110, The boiling point of the immersion cooling fluid 140 may also be controlled. In certain embodiments, the disclosed pressure management system The system is designed to detect and report when a computing system is started up, shut down, or undergoes other changes. It is used to dynamically control the pressure and therefore the boiling point of the dielectric fluid 140 depending on the conditions. This may also be the case.

[0022] The boiling point of the dielectric fluid 140 is lowered by operating in a pressure controlled vessel 110 at subatmospheric pressure. In addition to lowering the temperature, the computer components 170 themselves can dissipate heat more efficiently. The liquid dielectric fluid 140 may be modified to transmit from and to the liquid dielectric fluid 140. By increasing the surface area of ​​the component 170, e.g., the chip, exposed to the Heat transfer between the element 170 and the bath 142 of dielectric fluid 140 may be increased. An exemplary device for this purpose may be a copper boiler or a copper disk, which may be used in conjunction with other computers. The chip may be attached to the data component 170. In a particular embodiment, the adhesive used is , to be selected based on its heat transfer capabilities and its solubility in the dielectric cooling fluid. Suitable adhesives exhibit high thermal conductivity and low solubility in the selected dielectric fluid.

[0023] FIG. 1 illustrates a schematic diagram of an exemplary embodiment of the disclosed computing system. An embodiment of the system includes a pressure controlled vessel 110 (or a cooled computing system 110). 10), a pressure controller 150, at least a volume of dielectric fluid 140 and a condensation structure. The immersion cooling system includes the pressure sensor 130, as well as the desired computer components 170. The force system may be configured to maintain a desired degree of reduced pressure. including, but not limited to, power, data, networking, cooling and / or communications systems 1. While allowing multiple penetrations into the pressure control vessel 110 for various connections, including systems. Some embodiments may be configured to maintain a negative pressure. Utilizing the continuum, a computing system is operated in a pressure controlled vessel 110 at less than atmospheric pressure. Making it work requires a series of changes to the system as a whole. These changes are: Some are described below and some will be immediately apparent to those skilled in the art.

[0024] 3 shows an external view of an exemplary embodiment of the pressure controlled vessel 110. In one embodiment, the disclosed The pressure control vessel 110 is at least 2 feet high, at least 3 feet high, Both are at least 4 feet tall or at least 5 feet tall. The container may be up to about 3 feet tall, up to about 4 feet tall, or up to about 5 feet tall. It is.

[0025] In certain embodiments, the pressure controlled vessel has a volume of at least about 100 cubic feet, at least Approximately 150 cubic feet, at least approximately 200 cubic feet, at least approximately 250 cubic feet at least about 300 cubic feet, at least about 350 cubic feet, or at least It also has an internal volume of about 400 cubic feet.

[0026] In one embodiment, the pressure controlled vessel is capable of withstanding approximately 12 inches of vertical fluid dielectric flow during operation. The dielectric fluid vapor is configured to contain approximately 36 inches of the body and vertically. In this state, the ratio of gas volume to liquid volume is such that the gas is forced into the condensing structures, generating convection currents and converting the vapor back to liquid. In one embodiment, the pressure controlled vessel is adapted to direct the dielectric vapor during operation. The volume of the liquid dielectric fluid is configured to have a ratio of about 1:6 to the volume of the solid dielectric fluid. In another embodiment, the pressure controlled vessel has a pressure of about 1000 psi per volume of gas dielectric fluid during operation. 1:3, about 1:5, about 1:8, about 1:10, or about 1:15 by volume of liquid dielectric fluid. It is configured to

[0027] In one exemplary embodiment, the pressure management system may include a pressure controller 150. The force controller 150 may be a vacuum source. For example, the pressure controller 150 may be a pressure regulator. The vacuum pump may be connected to the control vessel 110. In some embodiments, the vacuum pump 150 may be remote and the vacuum may be conveyed to the pressure control vessel 110 using piping. In a preferred embodiment, a pressure sensor 180 is included within the pressure control vessel 110. It is used to adjust and / or maintain a desired negative pressure within the vessel 110. In one embodiment, The pressure sensor 180 and / or the pressure regulator 190 use the pressure sensor 180 to measure the pressure. The pressure in the force control vessel 110 is monitored and adjusted using a pressure regulator 190. The processor may be connected to

[0028] Certain embodiments include an operator protection mechanism. In one exemplary embodiment, operator protection The protection mechanism will shut down if either the lid or the service panel to the pressure control vessel is not in place. In one exemplary embodiment, the operator may have a locking mechanism that prevents the stem from moving. The data protection mechanism is designed to immediately shut down if one of the doors or panels of the pressure control vessel is tampered with. A controller may be included to shut off power to the system. In addition, operator protection mechanisms are enhanced for deployments where sensitive data is contained within the vessel. A security configuration may be provided that allows the system to be normally powered on without interruption of power. Improves the effectiveness of disk protection mechanisms by ensuring that devices are inaccessible during operation. A high level of assurance in efficiency can be achieved. The data protection mechanism uses a run-time stored encryption key to protect the data stored on the pressure control vessel. It's fine.

[0029] In certain embodiments, in addition to denying unsafe access to the pressure controlled vessel: Sensors may be deployed to verify that the system is operating as designed. The essential sensor package consists of a temperature sensor in the vapor space, a temperature sensor in the liquid space, This may include a humidity sensor in the vapor space and / or a pressure sensor in the vapor space. These sensor readings are used to ensure that the system is operating in a safe and healthy manner. It may be monitored by software and / or a human operator for In an embodiment, the sensor data is recorded or later analyzed.

[0030] In some embodiments, additional sensors are included within the container or superstructure (defined below). Such a sensor may be used, for example, to detect leakage of a dielectric fluid into the surrounding environment. Thermal imaging cameras by FLIR, VESDA or other forms of smoke extraction designed to The device may include a temperature sensor and / or a refrigerant leak detector.

[0031] In some embodiments, the vessel and / or superstructure may include indicators regarding the operating status of the system. Indicator lights may also be provided.

[0032] The cooled computing system 110 may also be referred to as a pressure controlled system 110. However, those skilled in the art will appreciate that some, if not all, of the cooled computing system 110 However, it is recognized that many benefits can be achieved without using a "pressure controlled system." do.

[0033] Steam Management System Immersion cooling systems can be operated in different ways. Some continuously inject immersion fluid directly into the Some operate by cooling the liquid to its maximum liquidus temperature. It can operate by boiling a liquid from its liquid phase into the vapor phase. A two-phase immersion cooling system is an immersion cooling system that operates by using a dielectric The reactive fluid is boiled and / or vaporized, and additional fluid is periodically added to replace the fluid lost to the atmosphere. Often substitutes.

[0034] The disclosed embodiment utilizes an immersion cooling system contained within a pressure controlled vessel 110. This has the advantage that the dielectric fluid 140 is not lost even after it is converted into gas form. In the sealed or substantially sealed pressure controlled vessel 110, the gas dielectric fluid is Liquid that is condensed and actively used to cool computing components 170 The dielectric fluid 140 is then added back to the reservoir 142. The condensation step can be performed, for example, by Condensation can be carried out in any suitable manner by passing the treated water through a heat transfer pipe. The structure 130 may include radiator fins and / or similar devices that increase the surface area of ​​the condenser. may be provided, thereby allowing for greater and / or faster condensation of the gaseous dielectric fluid. In one embodiment, the treated water is at ambient temperature and is actively In other embodiments, the treated water is cooled using evaporative cooling, dry cooling towers and / or The water may be cooled using other methods known in the art for cooling the water.

[0035] In one embodiment, there are two interfaces between the pressure controlled vessel and the external system. The first interface may be a treated water supply interface. The cooled treated water is delivered from the equipment that supplies it to a distribution manifold on the pressure control vessel. The second interface may be a treated water return interface. This can be a pipe that returns the treated water to a facility that supplies cooled water. The cooling water may be returned to the facility after it has flowed through the pressure control vessel and associated cooling components. The cooling components may include, for example, a condenser in the vessel, a condensation coil and / or a radiator, and, for example, a motor. of any powered components, including motors, pumps and / or utility cabinets. In some embodiments, the upper structure and the external system may include a coil to insulate the heat from the exhaust. There may be two interfaces between the pressure control volume and the The two interfaces between the device and the external system may be similar or substantially similar.

[0036] In one embodiment, the location of the condensation structure 130 within the pressure controlled vessel 110 is determined by the vapor phase dielectric constant. The condensation device may be configured to optimize the flow of condensing fluid to increase the rate and / or efficiency of condensation. In some embodiments, the geometry of the pressure controlled vessel 110 itself determines the rate and / or efficiency of condensation. may be controlled to increase

[0037] As shown in Figures 1-3, in one exemplary embodiment, the pressure controlled vessel is approximately 10 feet long. The tank 142 is approximately 130 gallons of Nova A pressure controlled vessel 110 may be formed using an ec™ dielectric fluid 140. This may include Leave a layer of liquid dielectric fluid approximately 12 inches deep in the immersion cooling tank at the bottom of the pressure control vessel. On the other hand, most of the volume of the pressure control vessel is gas. The ceiling of the pressure control vessel is a vertical structure. The ceiling and / or lid 120 is angled upwardly to provide a pressure controlled volume. The condensation structure 130 is located at the side of the pressure control vessel 110. The condensation structure 130 in this exemplary embodiment is approximately 12 inches wide and 12 inches high. Approximately 24 inches and extends substantially the entire length of the pressure control vessel 110. includes a radiator such as a material with large surface area fins that is cooled using flowing process water. Some embodiments may additionally or alternatively include a heat exchanger.

[0038] As shown in FIG. 2, the structural arrangement within the pressure-controlled vessel 110 is such that the dielectric fluid vapor is The structural arrangement directs convection of the dielectric fluid vapor as it rises from the liquid bath 142. The convection currents are directed towards the ceiling of the pressure control vessel, where the large surface area condensation structures 13 0 and recondenses into liquid form. The dielectric fluid 140 then In this embodiment, the total amount of dielectric fluid 140 is contained within this sealed housing. The dielectric fluid can be held in a metal housing by using convection currents to circulate the dielectric fluid vapor. The disclosed embodiments can operate without a mechanical pump to circulate the reactive liquid. , thereby allowing the total energy usage of the disclosed system to be reduced.

[0039] Certain embodiments may be used when the pressure controlled vessel must be opened and / or when the liquid dielectric To allow for redundant and robust control of the active fluid height, the system start-up and / or startup Utilizing additional tanks and / or storage vessels of dielectric fluid that can be used during shutdown Good too.

[0040] FIG. 11 illustrates an example cooling and steam management system 600 for the pressure controlled vessel 110. In this exemplary embodiment, the cooling and vapor management system 600 is configured to condense the dielectric fluid 140. The system may include a reservoir 611 of cooled process water that passes through a cooling coil 132 to provide a cooling effect. After passing through the cooling coil 132, the treated water may proceed to treated water return storage 612. The vapor management system 600 also includes a tank 614 for the vapor reservoir and a dielectric fluid reservoir 616 for the dielectric fluid reservoir. Tank 615 may include, for example, a tank 614 and a tank 615. During start-up and / or shutdown of the device, a dielectric fluid or vapor may be provided. In the embodiment shown, tanks 614 and 615 are coupled via a condensation structure 616. If there is an excess supply of steam in tank 614, condensation structure 616 may remove the steam. and adding it to the fluid storage tank 615 as a dielectric fluid.

[0041] In one embodiment, during operation, the pressure controlled vessel is maintained at approximately 3 psi below atmospheric pressure. , which lowers the boiling point of the dielectric fluid, thereby improving the boiling point of computer chips and other components. In one embodiment, the pressure controlled vessel 110 is heated to atmospheric pressure. At least about 2 psi lower than the pressure, at least about 4 psi lower than the pressure, at least about 6 psi low, at least about 8 psi low, or at least about 10 psi low below atmospheric pressure. can be.

[0042] In some embodiments, components may be selected that have some tolerance to pressure fluctuations. By adjusting the operating pressure of the system, the boiling point of the refrigerant and its It is capable of withstanding a wide range of pressures to allow operation over the approximate operating temperature of the entire system. Given the nature of operation of two-phase systems, it is preferable to use Standard operating conditions for the configuration are ±4 PSIg variation. Rapid system start-up or during shutdown, a difference of 3 additional PSIg may result. In some embodiments, it is possible to better control those variables and make them more controlled and defined. System level adjustments can be made to keep the signal within the specified range.

[0043] In a particular embodiment, the computer component 170 is at least about 3% above atmospheric pressure. Low pressure, at least about 5% below atmospheric pressure, at least about 10% below atmospheric pressure, at least about 15% lower pressure, at least about 20% lower pressure, at least about 25% lower pressure, Or operated at a pressure that is at least about 30% lower.

[0044] In one embodiment, the pressure controlled vessel is configured to operate at a pressure of less than about 750 torr, about 710 torr, or less than about 750 torr during operation. Less than about 650 torr, less than about 600 torr, less than about 550 torr, less than about 5 Less than about 400 torr, less than about 450 torr, less than about 400 torr, or maintained at less than In one embodiment, the pressure controlled vessel is configured to provide a pressure of greater than about 650 torr, greater than about 600 torr, or greater than about 650 torr during operation. over torr, over about 550 torr, over about 500 torr, over about 450 torr, about 400 torr or greater than about 300 torr.

[0045] Certain embodiments may include a vapor scrubbing process to control the gas atmosphere within the pressure controlled vessel. and / or utilize an initial purging process, which removes the gas atmosphere from the pressure-controlled vessel. The removal of the unwanted parts of the atmosphere such as air and water vapor. and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses into a liquid. Due to the specialized properties and boiling points of dielectric fluids, many naturally occurring contaminants can be present in this manner. The removal of the fluid that is not readily condensable can be achieved by using the The fluid acts to maintain its purity. The condensation point of the fluid is equal to that of the dielectric fluid at standard atmospheric pressure. More than 20°C below the condensation point, or if the condensation point of the fluid is 10°C at standard atmospheric pressure If it is less than this, it is considered not to be immediately condensable.

[0046] During maintenance, start-up and / or shutdown operations, the pressure control vessel is opened and / or or nitrogen gas to reduce the amount of dielectric fluid lost when exposed to atmospheric conditions. Any layer of inert gas may be introduced into the pressure controlled vessel. The vapor management system 600 may include an inert gas tank 613, which contains an inert gas. A gas can be provided to reduce loss of dielectric fluid.

[0047] Certain disclosed embodiments include a substantially self-contained server and / or computing system. In some embodiments, specialized seals and / or connections may be provided to the pressure control volume. In some embodiments, the system may be used to reduce the total number of penetrations into the vessel 110. To minimize penetrations into the pressure control vessel to reduce the possibility of leaks while under vacuum , power, water, vacuum and networking connections are bundled into a line bundle.

[0048] FIG. 4 illustrates an exemplary embodiment of a superstructure including multiple pressure control vessels. In this embodiment, two pressure controlled vessels 110 are pre-assembled within the modular superstructure 210. This allows the embodiment to be prefabricated and substantially It can be delivered as a complete, self-contained system. Modular System may be connected to other modular embodiments of the disclosed computing system. In one embodiment, the modular superstructure 210 may be configured with a single power connection. It only requires a power connection and supplies the necessary voltages to computer components and / or other electronic parts. The device will be pre-wired with the appropriate electronics.

[0049] FIG. 5 is an exemplary data center implementation showing multiple pressure controlled vessels connected to a central power source. FIG. 6 illustrates an example data center showing multiple pressure controlled vessels connected in series with one another. In these exemplary embodiments, the pressure controlled vessel 110 is It may or may not be located within a structure.

[0050] 7A-D show a cooled robot having an inner robot arm, an airlock, and an outer robot arm. 1 illustrates an example embodiment of a computing system, A pressure controlled airlock is used to remove the component 170 and transport the removed component to the airlock 220. An internal robotic arm 230 contained within the vessel 110 may be used. , the airlock 220 is used to control the pressure, atmosphere, dielectric fluid, and / or or other conditions. When the element 170 is removed from the pressure controlled vessel 110, the replacement components are inserted into the airlock 220. The replacement component can then be introduced into the pressure controlled vessel 110 using the internal robotic arms. The server can be installed by a “slot-in” server such as a blade server or a chassis. This process is greatly facilitated by the use of components that can be installed in the " obtain.

[0051] Disturbances to the conditions within the pressure-controlled vessel are detected by sensors located within the pressure-controlled vessel, e.g. The disturbance can be detected by a pressure sensor. A large deviation from the conditions in the pressure-controlled vessel can be indicated by a deviation of at least 10%. Disturbance is indicated by a deviation of at least 30% outside the normal range of operating conditions at that condition. obtain.

[0052] In certain embodiments, a self-contained diagnostic analyzes the performance of components within the pressure control vessel 110. A diagnostic program may be executed. If component 170 is not working as desired, The robot arm 230 can be used to automatically remove and / or replace the components. In this manner, a self-healing, self-contained server and / or computing system In certain embodiments, such a self-healing system can be significantly Shipped or delivered to remote locations using traditional methods to provide efficient computing power It is prefabricated and prewired to form a modular unit that can be shipped Requires limited setup and / or maintenance.

[0053] In one embodiment, the vapor is cooled to condense it from the gas state back into the liquid state. The first vapor management challenge is accomplished entirely within the closed system of the vessel through the use of condensing coils. The treated water is piped through a condensation coil inside the vessel. The shape and geometry of the vessel itself The shape of the coil promotes vapor flow from the vessel region to the coil region, and gravity draws back the recondensed liquid. This acts to return the water to the bath area.

[0054] In some embodiments, a second vapor management task is to monitor and maintain the internal pressure of the vessel. This problem is accomplished through the use of an integrated pressure sensor in the vessel and through the use of a purge system. In one embodiment, the purge system removes excess vapor from the container and directs it into the liquid storage tank. It is used to condense it back into a liquid for storage in the refrigeration tank.

[0055] In one embodiment, the non-condensable components of the steam present during system start-up are controlled and removed. The third steam management objective is accomplished through the same mechanism as the second objective. The system is designed to remove any non-condensable gases from the system as it is pressurized during its initial start-up. It can be used to remove the body.

[0056] In one embodiment, a fourth vapor management challenge, that of controlling the inert gas overlay, is addressed by a dedicated This can be accomplished using a nitrogen overlay supply system. The overlay is done by placing the refrigerant below the top of the vessel. and minimize loss of refrigerant during periods when the vessel is opened to service components therein. A dedicated set of nitrogen gas from a set of nitrogen storage tanks through a dedicated set of layered pipes in the vessel is possible. The use piping allows for the addition of an inert overlay if the operator wishes to open the system. This gas, along with any other non-condensables, may be present during system start-up. The overall steam management process is controlled by user commands and the system. Managed and monitored through condition-based control system software obtain.

[0057] Ballast Block In certain embodiments of the disclosed system, such as that shown in FIG. A deep tank portion 142 for containing a majority of the conductive fluid 140 and a wide shelf region 112 adjacent the tank. It may include a board, a card, a chip, a blade, and / or any other computer configuration. Element 170 is substantially contained within deep vessel portion 142 of pressure controlled vessel 110. 12 also includes a liquid dielectric fluid 140 and / or a dielectric fluid that is recondensed from the vapor phase to the liquid phase. The fluid 140 may be collected. In certain embodiments, the dielectric liquid in the pressure controlled vessel 110 The depth of the can be increased by utilizing ballast blocks 160. , are used to occupy unnecessary volume on the shelf, thereby The dielectric liquid 140 that was present is eliminated, and the liquid is then oxidized without the need for the addition of additional dielectric liquid 140. In one embodiment, the ballast block 160 can raise the water level of the current. The condensed liquid is not blocked by the ballast block 160 and flows into the deep tank of the pressure control vessel. The ballast block 160 is then moved downward to allow fluid to continue to flow into the ballast block 160. The riser legs 161 are capable of supporting the vehicle.

[0058] The ballast block 160 may be of any material that does not interfere with the operation of the disclosed immersion cooling system. The ballast block may be made of materials including, but not limited to, metal, rubber, silicone. and / or polymer-containing materials. Suitable materials are substantially soluble in the dielectric fluid. Not possible. The block must be denser than the dielectric fluid, but it does not have to be solid. In a preferred embodiment, the blocks are arranged in a manner that makes them easier to handle and manipulate. Some ballast blocks 160 have handles or cutouts that allow them to be operated. The embodiment is an interlocking type so that the blocks can be stacked on top of each other in a fixed manner. The interlocking top and bottom sections are used to slide the blocks together. or the risk of the block damaging nearby components if displaced from its desired position. In some embodiments, the bottom block does not impede fluid flow and provides a large volume. To occupy the block, a block is fixedly loaded on top of the bottom block, thereby allowing a large amount of additional Allows the level of dielectric liquid to rise without the need for additional dielectric liquid to be added. The interlocking top has recesses on the bottom that align with the legs and / or risers so that the Includes parts.

[0059] In one embodiment, the ballast block 160 is connected to the pressure controlled vessel 110 and / or the shelf 11. In another embodiment, the ballast block 160 is configured to span the entire length of the bridge 2. The lock may be of virtually any size that allows it to be handled. Now, multiple modular ballast blocks can be used to provide as much or as little volume as desired. In one embodiment, one ballast block may be configured to have a length of approximately 2 ft., about 3 ft. long, about 4 ft. long or more, about 6 in. wide, about 8 in. wide 12 inches or more wide, and 1 inch high, 3 inches wide, or 6 inches tall The device has exterior dimensions of approximately 8 inches or more and a height of approximately 8 inches or more.

[0060] superstructure The disclosed computing system comprises a variety of components, all of which are shown in FIG. As shown, the physical structure 210 may be directly or indirectly attached to the physical structure 210. 210 includes any required electrical sensors, controls, power, fluid controls, pressure controls, and This allows for pre-wiring and pre-piping of the electrical and / or communication systems, which is quicker and simpler. Allows for field deployment and factory testing prior to delivery to customer.

[0061] The superstructure 210 is typically constructed from metal components and is skid mounted or It may be configured to be handled by a forklift, hoist or crane. In one embodiment, the superstructure 210 fits within a standard container to facilitate shipping. The superstructure 210 and associated components are configured to accommodate a total of approximately 58,000 liters. The system is constructed to weigh less than 1.5 kg and is designed to facilitate shipping without the need for special equipment. In one embodiment, the superstructure 210 and and related components are less than about 50,000 lbs, less than about 40,000 lbs, less than about 30,000 lbs In one embodiment, the upper structure 2 has a weight of less than about 20,000 lbs. 10 and related components are greater than about 5,000 lbs, greater than about 10,000 lbs, greater than about 20,000 lbs lbs or greater than about 30,000 lbs. Many embodiments may include multiple pressure controlled vessels 110, sub-vessels, and / or sub-vessels. - Barrack 310 and associated immersion cooling equipment, and power transmission and distribution and networks It is large enough to contain the equipment necessary to manage the connections.

[0062] The overall design of the superstructure 210 is customizable to fit the needs of existing facilities. to accommodate the unique aspects of each deployment, including the size and number of interconnections for power and process water. can be adjusted.

[0063] The control and management system for all of the components within the disclosed pressure controlled vessel is A preferred embodiment of the disclosed system includes: Necessary pumps, valves, regulators, steam management systems, pressure management systems and other related equipment All of the mechanical systems required to maintain and operate a dual-phase immersion cooling environment, including all of the components Including.

[0064] The superstructure 210 may be an open frame design and may include side panels and an access door. This may include a software package that allows for deployment inside an existing structure or off-site. The superstructure 210 may be modified to include weather-resistant construction to withstand harsh environments. In one embodiment, the superstructure is a skid / module. It may be a framework.

[0065] Various systems, configurations and / or capabilities may be used to interact with other components of the pressure controlled vessel and the pressure controlled vessel. To support, monitor and control any environment contained within or associated with the device. In some embodiments, such a system may be included in the superstructure 210. Among other things, fire detection and / or suppression capabilities, dedicated air conditioning and / or environmental management This may include security configurations such as authentication capabilities, access control, and / or surveillance configurations.

[0066] Power System Certain superstructure 210 embodiments may accept various means of electrical inputs and connect them to the superstructure. It is designed to connect to an existing electrical distribution system built into the structure. One form involves a 415V input to the main breaker, which then supplies the 415V AC input. The power is distributed to a series of power shelves that converts the power to a 12V DC output. In a preferred embodiment, this conversion is It is essentially a single conversion step, thereby eliminating the damage normally associated with such conversion. Traditional computer server locations typically use This converts the power from a high AC voltage, such as 415V, to a reduced AC voltage, such as 120V. The conversion results in a loss of energy to heat. Under typical circumstances, this is about 6% of the energy And the 120V voltage can be a huge energy loss for various computer components. This second conversion is called the energy The second loss is about 6% from energy to heat. By directly converting it to heat, the total loss of energy can be reduced.

[0067] Another exemplary embodiment is an AC400 to DC480V power supply to a power shelf that converts the AC480V input to a DC48V output. It includes the connection of an 80V input and a 48V DC output, which then converts the 48V DC input to, e.g., A series of relay power supplies that convert various DC outputs including V, 5V, 3.5V, 3.3V and others distributed to the source.

[0068] In some embodiments, there may be a single set of power supplies operating at different input and output voltages. There may be multiple power sources connected to the power supply. The exact configuration will depend on the needs of the particular equipment being installed. The specific design of the power system is determined by the application requirements. , to suit the needs of the particular environment in which the disclosed computing system is deployed. Customization can be achieved by adjusting both the power input and output to the system. This may include type, capacity and interface.

[0069] In one embodiment, the rack power distribution system includes a modular power system and / or A set of modular power systems may be included. A particular configuration may be used, so long as it is capable of transmitting the desired amount and type of power to the rack. So, the modular power system can be used with one, two or even multiple power distribution lines. They may be configured in parallel or series or a combination thereof to provide a path to the rack. The specific path may be direct or indirect, and the components involved, the amount of power, and If desired, the path to the rack may be The distributed power may include power distribution to chassis located within the rack. The desired voltage may be transmitted at one or more desired voltages, which may vary depending on the For example, 12V, 5V, and / or 3.5V. In one embodiment, the chassis If employed, it may employ one or more subsystems. The system may be configured to accommodate any desired substation that does not interfere with the desired amount and type of power delivered to the rack. One example is a power-on-package subsystem. Such a package can receive AC current and output DC current, depending on what is desired. For example, a particularly useful power-on- Cage subsystems include AC208, 240, 380, 400, 415, 480 and / Or it can receive 600 volt input power and directly convert that power to DC power, e.g. DC48V. It can be designed to convert

[0070] The modular power system or systems may be directly or indirectly powered in any suitable manner. For example, a modular power system may be powered through a main power distribution system in the chassis. Depending on the type and amount of power and other components, the chassis may be powered by a set of Using an interface such as a spring-loaded pin or other suitable connector interface Electrical continuity may be established between the power distribution paths and the chassis itself. interface connector and the desired server or other computer located on the chassis. A power supply may be established between any desired power input interface in the power supply component. In one embodiment, the power-on-package module is integrated into the chassis itself. This may be used within each chassis to directly convert the voltage to the appropriate level. It may be used for various types of power distribution, but may be particularly useful for example for 48V power distribution. FIG. 17 illustrates an example embodiment of a rack power distribution system 950. In this example embodiment, The rack 310 is connected to an AC input 96 at an AC interface 311 of the rack 310. The power distribution system 950 generates a DC output 320 and receives a DC output 3 20 may be distributed among one or more chassis 400.

[0071] In one embodiment, a reliable power supply is ensured to computer components in a rack. To that end, one embodiment may select a particular input voltage. to provide the required output voltage to the blade and / or component level power supplies. Some embodiments use a power supply that provides redundancy. Each blade includes multiple power sources to support

[0072] In some embodiments, one or more switches may require power. Appropriate interfaces connect to the backplane to provide rack-level communication to each blade. The switch may be a standard data center grade switch with It distributes the voltage between the power rails and each of the blades. This can be achieved by a power rail and interface system with connectors, Located directly on the power supply input rail or between the power supply power leads and the rack level voltage distribution system. The voltage is transmitted via a relay connector placed in the

[0073] In one embodiment, there are one or more power rails that distribute the main voltage along the bottom of the rack. This rail may be connected to one or more main power adjustment units, which are often located external to the pressure control vessel. The power is supplied from the power source and transmitted to each rack via a cable or busbar system. The use of higher voltages at the power distribution level, e.g. 48 volts, reduces the need for power distribution systems. Reduced current carrying capacity required for efficient connection between distribution rail and load interface Can interface.

[0074] In one embodiment, two main power distribution systems located within the superstructure platform The first main distribution system is the Primary Equipment Power System (PEPS) and the second main distribution system is the The system is a Secondary Equipment Power System (SEPS). The purpose of the PEPS is to provide electrical services. The system provides electrical power to components within the enclosure. It receives input through the system and transmits it to the chassis, computer components and / or other critical A high-voltage, high-current distribution system that transmits current to the main power source, which is responsible for supplying the necessary load equipment with the necessary current. Power enters the host structure at a specified point and is connected to the master service disconnect breaker. All power redundancy configurations used in electrical services and systems The element is upstream of this point. This input is, for example, 415 or 480 volts AC. The main equipment loads are supplied from the breaker panel downstream of the master disconnect breaker. It is driven by a power supply or rectifier that is powered by a

[0075] The purpose of SEPS is to provide a system for the management of infrastructure support systems and components located within the superstructure. The primary objective of the secondary equipment infrastructure is to provide electrical services to all Since the components involved may assume a lower input voltage, the SEPS is Powered by a step-down converter connected via a secondary service disconnect upstream of the disconnect breaker. It is possible.

[0076] This arrangement allows the SEP The upper structural support and infrastructure systems, including all of the components powered by S, are on. All of the management and control systems and steam control systems are capable of being operated in a controlled manner. Aspects of the present invention may be capable of operating independently of the operation of the PEPS.

[0077] In one embodiment, an uninterruptible power supply (UPS) is provided as part of or in conjunction with the power distribution system. In addition to the UPS, the UPS provides protection in the event of a temporary interruption to the external power source. The disclosed computing system allows for continuous operation.

[0078] Components of the disclosed power distribution system include, but are not limited to, uninterruptible power supplies, DC power systems, AC power systems and / or power control and monitoring systems Such components may include, but are not limited to, any commercially available component. Vertiv products, such as Liebert and / or Chloride UPS products; Al conversion online UPS, line interactive UPS, standby UPS, lithium UPS products may include single-phase or three-phase UPS, Other exemplary power distribution system components include, for example, Emerson Network Power wer Products, NetSureDC Power Systems, Vertiv, Liebert, Chl oride and / or NetSure power distribution units, as well as, for example, inverters, rectifiers, The present invention may include related components such as transfer switches and combinations thereof. Commercially available monitoring units, controller units and / or software that It may be included in the specific embodiment shown.

[0079] Pressure Control Vessels and Pressure Management Systems Embodiments of the disclosed system include a pressure The pressure controlled vessel 110 includes a reservoir 142 of dielectric cooling fluid 140, a vapor phase dielectric A condenser 130 having a cooling coil 132 for condensing the fluid into a liquid, and a computer configuration The pressure control vessel 110 is connected to the power supply 170 and supplies power to the power system. Includes the physical mechanisms and / or equipment required to dispense the components.

[0080] During operation, the pressure controlled vessel 110 may be maintained at a slight vacuum. A variety of specialized connections for operating computing systems within the control vessel 110 It should be clear that further consideration must be given to the following:

[0081] Certain disclosed system embodiments include a system for routing fiber through panels and cable trays. In addition to distributing the data to the optical fiber 310, a set of optical fiber media transfer protocols (MTP ) interface to allow connection of the fiber to the pressure controlled vessel 110. The arrangement reduces the total number of penetrations into the pressure control vessel 110 to reduce the likelihood of leaks in the vessel. Reduce.

[0082] Some embodiments of the pressure controlled vessel 110 include sensors to ensure safe operation. The sensor may include, but is not limited to, temperature sensors to ensure and / or automate the operation of the system. Sensors, fluid height sensors, pressure sensors 180, gas partial pressure sensors, position sensors, electrical sensors The input / output device may include a microphone and / or a camera.

[0083] In one exemplary embodiment, the temperature sensor is located within, but not limited to, the pressure controlled vessel 110. a sensor for measuring the temperature of the gas phase in a pressure controlled vessel; sensors for measuring the temperature of the water and / or other process fluids, and / or The system may include sensors for measuring the temperature of other components, including computer components 170. In some embodiments, the thermocouples, thermistors and / or silicone sensors are included in the computer configuration. In one embodiment, the system may be utilized to measure the temperature of the component itself. Information provided by the device and via device-provided APIs or HTTP or SNMP It is generally accepted that other programmatic interfaces such as JSON Determine equipment temperature by relying on information obtained or monitored through the use of a communications protocol. It may be determined.

[0084] Some embodiments may include various life safety features to ensure the safety of the user. These configurations include, but are not limited to, automatic electromagnetic locking mechanisms, fail-safe systems, Fire and / or smoke detection and / or suppression systems, ventilation systems and / or In certain embodiments, these configurations may include a comprehensive platform. It may be included as part of the form.

[0085] Certain embodiments are advantageous in that any loss of fluid in the pressure controlled vessel is quickly detected. These systems include automatic steam detection and leak detection systems that ensure a substantial leak A pressure sensor in the pressure control vessel 110 monitors the pressure to ensure that there is no The presence of any dielectric vapors that may have leaked from the pressure control vessel and / or the The pressure control vessel may include a gas sensor located external to the pressure control vessel that detects

[0086] The particular design, configuration and / or layout of an embodiment of the disclosed system may vary depending on the In some embodiments, the size, materials, internal systems, and structure may be adjusted based on the conditions in which the device is used. Component packaging and configuration options, pressure controlled vessel 110, computer components 170 and All interfaces between the power systems are adjusted based on the conditions under which the systems are used. It is possible.

[0087] Rack System 8A-C show an example embodiment of a rack system 310 (or rack 310). The rack 310 is connected to the electrical and communication systems installed in the pressure control vessel 110 and the rack 31 0. The computer component 170 is a computer component 170 in the pressure control vessel 110. The racks 310 may be mounted to control spacing, orientation, position and / or configuration. In one embodiment, each computer component 170 is The power supply 410 may be mounted on the chassis 400.

[0088] The rack 310 may be, but is not limited to, a frame, bracket, support, or other structure. Any physical structure that can be used to mount computer components 170, including any building material The computer components 170 may be directly or indirectly connected to the rack 310. and held in a substantially fixed position. Some embodiments may use dedicated mechanical guide plates as mounting mechanisms, bulk Wiring harness and / or power and signal wrap that attaches to the head fitting This may include the use of relay power and backplane receiver 331 for distribution within the network.

[0089] The particular design of the rack system 310 is tailored based on the conditions in which the system is to be deployed. Some rack 310 embodiments may include dedicated switches. The uplink interface is connected via a fiber infrastructure and / or The link access interface is a backplane receiver 331 interface or The rack may be connected to the computers via any other suitable manner of connecting the computing equipment. The wireless LAN may be connected to a wireless communication device 170.

[0090] In a particular embodiment, the rack system 310 provides the appropriate voltage from the power interface. A housing for one or more relay power supplies that can be distributed to other devices installed in the rack 310. The interface that interconnects power from the distribution system to the intermediate power sources may include a By disconnecting the interfaces between the individual racks, power and communication systems, Rack 3 may be removed and / or replaced with an alternative rack configuration. 10 may be included in the design.

[0091] 8A shows a top view of the rack 310. In this exemplary embodiment, the rack 310 includes: The rack 310 includes an AC interface 311 and a data interface 312. The power supply 313 and the redundant power supply 314 (or backup power supply) are also included as a pair of power supplies. The power supply 310 may also include a rectifier and a controller. The device and controller can be used to quickly repair the rack 310 or even to ensure that the main power is working. (This allows the rack 310 to continue functioning even if the power supply is stopped.) The rack 310 can receive a plurality of chassis 400 and mount the chassis 400 thereon. It is configured to hold it in a substantially fixed position.

[0092] In some embodiments, the entire rack 310 may be immersed in the dielectric fluid. This includes immersing the rectifier, power connections and / or data connections in a dielectric liquid in a To reduce and / or eliminate plastic contamination of the dielectric fluid, certain embodiments In such an embodiment, the plastic insulation and / or cable jacket may be eliminated. In this case, the dielectric fluid is applied to the cables and / or connections that would otherwise be exposed. may act to insulate the

[0093] FIG. 8B shows a perspective view of a rack 310 including multiple chassis 400. The configuration facilitates hot swappability of the chassis 400. In this exemplary embodiment, the rack The AC interface 310 connects the AC interface 311 to a power source 313 and / or a redundant power source 314. The power supply 313 and / or redundant power supply 314 may include multiple AC cables 318. The backplane receiver 331 generates a DC output 320 that can be transmitted via a DC cable 321. The rack 310 may include a data interface 312 connected to a backplane It may also include a number of data cables 319 that connect to the receiver 331. 331 connects the data connector on the bottom of the chassis 400 to the data connector on the top of the rack. This may be used to provide data.

[0094] 8C shows a side view of the rack 310. In one embodiment, the rack 310 It provides mechanical stability and / or housing for the rack 400 and its components. 310 is a diagram showing the structure of the power cable and the data cable, which are generally accessible within the enclosure. The cables connect to the chassis 400 from the top of the rack 310, which is accessible from the top of the rack. This facilitates routing to the bottom of the rack 310.

[0095] Chassis and Interface Systems In one exemplary embodiment, the disclosed chassis system 400 is intended to be a Standardization Between Dedicated Computing Components 170 and the Disclosed Rack System 310 In one exemplary embodiment, the backplane is configured to act as a physical relay component. The purpose of the lane receiver 331 is to provide a slot-in type interface between the chassis 400 and the rack 310. 400. The chassis 400 is provided with a plurality of interfaces for various computing components. A power supply in a power system and a network switch in a communication system having a The purpose of the present invention is to enable the distribution of power and signals between the switches.

[0096] In one embodiment, the pressure controlled vessel of the present disclosure is configured to control one or more servers, e.g., blade servers. Each server may include at least one rack 310, which may include a chassis 400 ( 9A to 9G show various components. 1 shows an example embodiment of a chassis 400 for mounting the pressure control This may facilitate the installation of servers on the racks of the container or their removal from the system. In an embodiment, other electronic components of the pressure control vessel may be mounted on the chassis. Any part of a computer component, such as a power board, chip, card, GPU, or CPU Other components or hardware that can be installed in the chassis include power supplies, power inlets, Components such as interface or network communication interface can be mounted on the chassis. It is Noh.

[0097] In one exemplary embodiment, the chassis comprises a component (e.g., a server) and a pressure-controlled vessel. The chassis can act as a common interface between the components. or provide a variety of mounting, power and connection configurations that can be customized based on design. In other words, various aspects of the chassis can be changed based on the design specifications of the components. In this way, the chassis can accommodate almost any model or type of hardware. For example, a chassis may be made of specifically designed hardware or off-the-shelf hardware. This can promote the use of hardware.

[0098] Embodiments of chassis 400 may be implemented using a combination of existing off-the-shelf components, custom designed components, or a combination of both. and / or the use of specialized chassis for specific applications. The embodiments may include components designed to support standard motherboards and specialized configuration elements. In certain embodiments, such components may include an adaptation kit for NVi Gigabyte motherboard with Dia GPU and / or Intel CPU Includes ultra-compact motherboards.

[0099] FIG. 9A illustrates a chassis 400 for mounting a server on a rack according to an example embodiment. In this exemplary embodiment, the chassis 400 includes a back wall 410 and two side walls 420. The rear wall 410 may be a rectangular box containing a plurality of holes 416. The rear wall 410 may be a rectangular box containing a plurality of holes 416. The chassis 400 may include a plurality of holes 411 for supporting the guide rails 420 on each side wall 420. 21 may be included.

[0100] FIG. 9B illustrates several components within the chassis 400 according to an example embodiment. In the illustrated embodiment, the back wall 410 is removed. module 431, GPU module 432, CPU module 433 and interface 4. In one exemplary embodiment, the server 430 includes a card 434. The components are components used in blade servers, such as CPU module 4. 33 and GPU module 432. Additionally, the components within the chassis 400 include , other components not traditionally included in servers, such as power supply modules 431 or The chassis 400 may also include an interface card 434. Since no fan or heat sink is required, chassis 400 does not include a fan or heat sink within the chassis. In this way, the chassis provides a very thin processor for the computing power of the chassis. Have a file.

[0101] FIG. 9C shows a schematic diagram of the components within the chassis. In this exemplary embodiment, the server a power supply board 445, a plurality of power supply modules 431 and an interface card 434, The chassis 400 is mounted on the backplane 400. Storage devices and / or other peripheral components may also be mounted on the backplane 400. and / or a power module and a communication system module. Both may be mounted on the chassis 400 .

[0102] In one example, an on-board interface is a single piece of hardware that is fixed to the chassis. On the inner surface of the chassis 400 are , components (e.g., motherboards, GPUs, CPUs, interface cards and other Provisions may be made to allow the installation of the relevant components (including the chassis) on the chassis. The specific arrangement of the chassis system 400 is 400 and / or the equipment and / or components mounted on the rack. Certain embodiments of the chassis 400 may include an interchangeable mounting plate that can be used for mounting equipment. A set of standard mounting plates may be provided for common or frequently used configurations. May be used for elements.

[0103] The power and network interface module in the chassis system 400 The code and configuration elements are based on the needs and requirements of the specific components and / or user-specified equipment. In one example, the power subsystem of a chassis can be tailored to the needs of a particular component. In another example, the size of the chassis can be changed to accommodate one of any size. In yet another example, the chassis may be designed to accommodate one or more pieces of hardware. Different networking options available depending on the network connection card installed in the chassis Due to these and other configurations of the chassis, the chassis can be As a result, the assembly of these components of the pressure control vessel For example, the chassis can be The robot may include a power server, and the robot may mount the chassis to a rack in the pressure controlled vessel. In this way, the robot can be easily installed or removed without human intervention. The dossar can be removed and replaced, thereby minimizing human exposure to the dielectric fluid It is possible.

[0104] In one exemplary embodiment, the chassis includes a microphone capable of communicating with the management system of the pressure controlled vessel. The microcontroller may be located within the chassis or externally. Sensor data can be received from various sensors. For example, the chassis The server may include a sensor for detecting whether the server is properly positioned within the rack. If the rack can be connected to the sensor, the sensor is appropriately placed in the rack. It can be determined whether the chassis is properly positioned in the rack. The sensors can send data to a microcontroller, which can then use the data to The microcontroller generates a signal that indicates whether the chassis is properly positioned in the rack. The information can be provided to a management system.

[0105] In one embodiment, the microcontroller controls the components mounted in the chassis. The microcontroller may be coupled to a switch that can turn the power on or off. A power on or off signal can be received from the management system, and in response to receiving the signal, The microcontroller then controls components, such as a switch that powers a server on or off. In one exemplary embodiment, the microcontroller can transmit a signal to The microcontroller can manage and control this data. The operational data is an indicator of the server's vital performance. The operational data can indicate the speed of the computational operation, the duration of the computational operation, and the number of operations. These may include degradation, power consumption, circuit temperature and system bandwidth.

[0106] In one exemplary embodiment, the microcontroller controls the electrical and communication infrastructure of the blade server. For example, current (i.e., amperes) can be monitored, managed, and controlled. and voltage indications to ensure that the system can protect itself, e.g., overcurrent or overcurrent It will be monitored to ensure that no shortcomings are identified.

[0107] In one exemplary embodiment, the chassis is configured to allow a robot to grasp and remove the chassis. For example, the chassis may include a front wall, a rear wall, The chassis may be in the shape of a rectangular box having a top wall and a side wall. The upper wall of the chassis may have a plate that can be connected to the robot arm. Using this plate, the robotic arm can perform unloading and other handling operations. The plate can be grasped for operation.

[0108] In one exemplary embodiment, the chassis is configured to properly align and insert the chassis in the rack. The mechanical guide rails and locating pins may be included to ensure that the mechanical guide rails are aligned. The rail may be disposed on a side wall of the chassis.

[0109] In one exemplary embodiment, the chassis may include various features that facilitate fluid flow. For example, the chassis may be in the shape of a rectangular box having a front wall, a rear wall, and side walls. The chassis may also include a top wall and a bottom wall. In this example, at least one of the walls of the chassis is At least one of the walls may include fluid flow holes throughout. For example, the back wall may include facilitating the flow of fluid to and from the chassis when the chassis is immersed in a liquid bath; The nozzle may include a plurality of holes that are advanceable.

[0110] In one exemplary embodiment, the chassis is adapted to retain the liquid when the chassis is removed from the liquid bath. The rack may include an opening to ensure that all fluid within the rack can drain. , may be placed in a liquid bath that cools the computer components held by the rack. To remove the chassis, the robot grasps the plate of the chassis and lifts the chassis from the rack. The chassis can then be lifted out of the liquid bath (thereby removing the chassis from the liquid bath). When the fluid is removed from the body reservoir, a certain amount of fluid may remain within the chassis. The bottom wall of the chassis ensures that fluid can escape even if the container is not perfectly level. The notch or drain may be located at the corner of the bottom wall. It may be present in the part.

[0111] In one exemplary embodiment, the chassis includes a power interface and / or a communication interface. The interface may include a laser interface for connecting components mounted in the chassis. The power interface and / or pressure control vessel may be electrically coupled to the The processor and / or communication interface may be located on a backplane. The servers mounted on the chassis are connected to the chassis interface through various wiring and cables. When the chassis is placed in the rack, the interface i.e. backplane receiver) and / or other interface connected to pressure controlled vessel. The two interfaces (i.e., the backplane The electrical coupling between the power supply and the backplane receiver provides power to the server and It can be connected to a communication network inside or outside the pressure control vessel. The coupling between the interface can be performed automatically during mechanical insertion of the chassis into the rack. Similarly, removing the chassis from the rack removes the rack and / or pressure controlled vessel from the server. can be separated from

[0112] In one embodiment, the backplane interface 330 and the communication system interface 330 By providing standardized interoperability over a data interface, Minimize the chance of misconnecting sources, reducing the need to troubleshoot connections It is possible.

[0113] In a particular embodiment, the chassis 400 includes standard power and network interface The network interface is a 1Gb / s Or Cat6A or Cat7 compatible for connection to 10G Ethernet interfaces In such an embodiment, the power interface may be in the form of an RJ45 interface. The interface uses standard Molex connectors for connection to standard motherboards and / or peripheral components. It may include a set of x-style connectors.

[0114] In one exemplary embodiment, the pressure controlled vessel is configured to The pressure control device may include an internal database for storing information. For example, an internal database may be a repository of components installed in the system. The system can store the make and model of each server and power supply installed in the system. The components are replaced or substituted, for example, by robots, so that the management system can be Changes and updates to the information stored in the database can be tracked. It may also be connected to an external database via a network.

[0115] In one exemplary embodiment, each chassis is labeled, for example, as a bar code on the chassis. The components may be located within a chassis and associated with a unique serial number. When a component is specified, the component specification (or the component configuration and model) is associated with a unique serial number. The chassis is then installed in the pressure controlled vessel. Once the pressure control vessel is installed, it can look up its unique serial number in an external database. For example, a robot arm can be referenced by a The barcode can be scanned, and the management system can use the barcode to access external databases. The management system can retrieve information from an external database. The information can be used to update the internal database. Once removed from the container, the robotic arm scans the barcode associated with the chassis. The management system can then determine whether the components installed in the chassis are no longer configured in the system. The internal database can be updated to indicate that the

[0116] In one exemplary embodiment, the chassis may include an RFID tag. The arm may include a scanner capable of emitting radio frequencies to detect RFID tags. The robot arm scans the RFID tag while handling the chassis. and provides the management system with a unique serial number to update its internal database. It is possible.

[0117] In one exemplary embodiment, the chassis includes an identification plate that may include a user-specific asset identification number. This asset identification number may be stored in association with the components installed within the chassis. In one embodiment, the identification plate is configured to store an asset identification number. It may be a chip.

[0118] In one exemplary embodiment, the chassis includes a pump that enhances the flow of fluid within the chassis. To maximize heat exchange between components within the chassis and the liquid bath, the chassis may include: The chassis may include a pump capable of circulating fluid through the chassis and around the components. It draws fluid from various conduits spread around the periphery and pushes the fluid out of the chassis. or vice versa.

[0119] In one exemplary embodiment, the chassis is adapted to dry the chassis and the components mounted thereon. The chassis may contain various conduits around the periphery to allow for easy access to the fluid tank. When the chassis is opened, a certain amount of liquid may remain within the chassis or components therein. Induces the flow of gas within the chassis or around components to promote drying of the chassis and components In one exemplary embodiment, the pressure controlled vessel may include a variety of conduits. The chassis can be exposed to a gas flow before being delivered to a user. For example, The chassis may include an input pipe for receiving a flow of gas, and a pressure controlled vessel. can provide a flow of gas through an input pipe.

[0120] 9D illustrates the bottom wall 415 of the chassis 400 in accordance with an exemplary embodiment. In one embodiment, the bottom wall 415 includes a power interface 416 and a communication interface 417. 9D also shows guide rails 421 on the side walls 420 of the chassis 400.

[0121] 9E illustrates the top wall 425 of the chassis 400 in accordance with an exemplary embodiment. In one embodiment, the upper wall 425 may include a plate 426 and a pair of handles 427. The arm can then be used to remove the chassis 400 using the plate 426 .

[0122] 9F illustrates the side wall 420 of the chassis 400 in accordance with an exemplary embodiment. In one embodiment, the side wall 420 may include guide rails 421. FIG. 9F also illustrates the rear wall 410. , handle 427 and power interface 416 are shown.

[0123] FIG. 9G illustrates an exploded view of the bottom drain hole 450 of the chassis 400 according to an example embodiment. In this exemplary embodiment, the bottom drain hole 450 is formed through the bottom wall 415, the side wall 420 and the back wall 420. It can be placed at a corner of the face wall 410.

[0124] 10A-F show an exemplary embodiment of a pressure controlled vessel 500. In particular, FIG. An exemplary embodiment of a generator 500, e.g., a 600 KW skid, is shown. The container 500 includes a modular skid to facilitate movement and transportation of the container 500 to a desired location. The vessel 500 may include a plurality of forklift tubes 514 for propelling the vessel. The vessel receives treated water from the power supply 511 and treated water pipe 512 with minimal penetration through the vessel itself. These connections allow the modular enclosures in the data center to be sealed together. In some embodiments, the connection may be located at the top of the container to facilitate data center connectivity. The front and / or sides of the container are provided to accommodate the vertical load of multiple modular containers. In some embodiments, the containers may be stacked vertically on top of one another. The vertical space may be provided between the containers to facilitate the placement of the containers in the vertical space. This may provide additional space for connections, air flow and / or insulation. By using a 100% 100% 150% 200% 100% 250% 300% 400% 500% 600% 700% 800% 900% 1000% 15 ...2000% 2500% 3000% 4000% 5000% 6000 The vessel 500 receives an input 511 and provides power and network connectivity across the vessel 500. The container 515 may include a power and communication box configured to distribute A sealing lid 51 that may facilitate the addition and / or removal of components from the container 500. 5 may be included.

[0125] 10B shows another view of the container 500. In one embodiment, the container can be emptied without opening it. An inventory of replacement components so that components can be replaced using a robotic system within the vessel The robot system may be housed within the container 500. The robot system uses a gantry motor 516. In such an embodiment, if a component is damaged or requires repair, Replacement components are installed in the system and components that are either damaged or removed, even if undamaged. can be stored in the cassette until the cassette is full. At that point, the removed The cassette containing the component is removed from the container and a new cassette with a new replacement component is inserted. A container may be inserted into the container for future use. In certain embodiments, the containers disclosed are approximately 15 feet, approximately 7 feet wide and approximately 10 feet tall. The system achieves 600KW of computing power in approximately 150 square feet. The NI 8111 supplies power for the NI 8111.

[0126] In some embodiments, the vessel 500 may also include one or more bellows tanks 517. The pressure tank 517 can be used to regulate the pressure in the vessel. When the pumping and / or cooling system is first activated, the expanding dielectric fluid is released into the environment. Orient the bellows tank so as not to lose it and / or to avoid pressure build-up within the vessel. In one embodiment, the bellows tank 517 contains approximately twice the amount of liquid dielectric fluid. The container may be large enough to hold the entire volume of the container.

[0127] FIG. 10C shows a cross-sectional view of the container 500. The bottom of the container 500 contains a computing structure. The rack 310 containing the components and / or the chassis 400 may include any dielectric vapor Condenser coils 132 are located on the rack to cool and condense the refrigerant. Power is provided through power bus bars 518. This allows power to be distributed among the individual components in a hot swappable manner. The power bus bar 518 allows the power to be distributed to the computing components. The enclosure can receive external power using only one or a small number of penetrations through the enclosure. This design simplifies installation and operation of the vessel system. The power busbar can provide 600 amps of power to five racks. In such an embodiment, there may be two sets of bus bars, one on each side of the container. In some embodiments, the busbar does not include plastic insulation. may be viewed as a contaminant of the dielectric fluid and is generally avoided in some embodiments. This will be the case.

[0128] In some embodiments, the container 500 may include a desiccant 519. The condensable vapor is removed from the head space of the vessel 500 and any non-condensable components are removed from the dielectric flow. Water may be condensed in a manner that allows it to be removed from the body. It will not condense under the same conditions. Thus, the system removes water contaminants from the dielectric fluid. It can be used to remove

[0129] In one embodiment, the vessel 500 includes a fluid filter 520, a fluid pipe 521, and a fluid pot 522. In one embodiment, the dielectric fluid may include a pump 522. may be added to the container in a manner that allows the container to overflow from the bucket 310 into the reservoir area 523, and The fluid is filtered using a fluid filter 520 and a fluid pump 522 and a fluid pump 523. The system can be pumped distally into the vessel using a new filter. The dielectric fluid is circulated through the container so that the dielectric fluid It can be reused to cool components.

[0130] 10D shows a cross-sectional view of the vessel 500. In this embodiment, the liquid dielectric fluid level is , a fluid height greater than the height of the rack 310 and / or the computing components therein. As a result, the rack 310 and / or the computing configuration may be maintained at a height of 524. The element is immersed in a dielectric fluid. A saturated dielectric vapor is placed above the fluid level 524, e.g. For example, the saturated dielectric vapor may be present up to an intermediate height 525. 525, which may be approximately half the height of the condenser coil 132. In some embodiments, a head space exists above the saturated vapor that may contain a low density dielectric vapor.

[0131] Communication Systems The disclosed communication system embodiment includes the disclosed host structure 210, pressure controlled vessel 110, and and / or a standard level for equipment within or associated with a computing system. It is designed to provide connectivity and management interfaces for ears 1-3.

[0132] In one embodiment, the series of MTP interfaces includes multiple high density multimode fibers. The pressure control vessel 110 includes a pressure sensor 112 that provides a means for connecting the pressure control vessel 110 to the driver. The fiber connection can be achieved by using a dedicated breakout cable, breakout interface, , individual patch panels and / or sets of patch panels for distribution to racks 310 It may be divided into switch level connections.

[0133] One embodiment of the disclosed system is a switch that is installed through a short patch panel. Dedicated fiber patch panels are installed in each rack 310 to allow connection to the switch system. In other embodiments, the device may include a dedicated patch panel port. or patch panel cell extending from each switch system to the MTP distribution interface. There may also be a

[0134] In one embodiment, the interface between the switch system and the chassis 400 is: This may be via a backplane interface 330 and / or Alternatively, the connector may be connected to the power supply via some other mechanism, which may or may not include the use of a connector. In some embodiments, the relay rack level switch system may not be required. The embodiment may include a pressure controlled device that is adapted to connect to various computing devices located therein. A centralized set of switches within the container 110 may be used.

[0135] The standard interface between the switch system and the chassis 400 is This is achieved by using a patch panel attached to the switch at 0 and connecting the ports on the patch panel to the switch. backplane system 330 with patch cables that connect to the appropriate ports on the system It can be done.

[0136] In one embodiment, the communication system cabinet is connected to the MTP in each pressure control vessel 110. A small (6U) rack rail area containing patch panels that interconnect interfaces, and centralized communication systems that serve to interconnect the switch systems with each other and / or with the outside world. In such an embodiment, the end user or customer may They set up their own routing means in the space and communicate with the disclosed computing system and the outside world. providing external connections thereto, which provide connections between the pressure control vessel 110 or the upper structure; Choose between providing a fiber connection between the structure 210 and the existing network environment. It is possible.

[0137] Access, communication and / or networking functions utilized within embodiments of a communication system environment Rack components may be standard equipment or user specified. 10 and the backplane interface 330 system eliminates the need for an existing switch. , replace it with some standard switch (such as a 1U switch) and add the desired interface. to the backplane network interface panel. The switch system located within block 310 may include functionality for switching.

[0138] In certain embodiments, the backplane system 330 may be directly interfaced with the backplane system 330. Products designed for this purpose may be used. Such products may be used for specialized, dedicated inter-networking. via a working interface, via a commercially available protocol, or via a network Chassis 400 via the Specification for the Design of Network Level Interconnect Interfaces Specifically designed to interconnect patch panel systems and / or switch ports A direct electrical interface may be utilized.

[0139] In some embodiments, the connection between each blade or chassis and the switch may include multiple interfaces. One interface may be available on a commercially available switch. A common interface may be a standard switch port, which may be a standard port that can 1GBA using Cat6 or Cat7 twisted pair copper connection between switch and host device It can be SE-T or 10GBASE-T. Other interfaces are standard switch ports. Patch panel with standard patch cable from the port to the front side of the patch panel and Hard-wired connections from the rear side of the patch panel to the signal interfaces on the signal backplane The switch may be a backplane repeater that may consist of any of a set of connected Alternatively, this may be implemented as a standard switch port to establish a connection between a backplane. Specialized cables and / or standard RJ45 interfaces from the switch ports to the board Still other interfaces may consist of a standard switch port to route the signal Interface system signal backplane that distributes signals from the One or more of the signal paths can be lanes. Still other interfaces may be terminated with connectors on the corresponding PCBs. This may be a signal backplane interface. A connector located on the chassis itself that mates with a connector on the stem signal backplane. It can be a data bus that interfaces the system signal backplane and the chassis Yet another interface is the chassis network. This can be a network interface from the chassis network interface. Patch cable to RJ45 interface on chassis mounted server The connector may be a standard patch interface allowing connection of

[0140] Robot System In one disclosed system embodiment, hot swapping of components within the pressure controlled vessel 110 is performed. This paper presents a promising method to address the need for robustness by remotely removing a failed component 170. The need for interchangeable capabilities can be addressed by robots.

[0141] Certain embodiments of the disclosed system combinations include an internal robotic arm 230 and / or an external robotic arm 230. The robot may include an external robotic arm 240. Certain embodiments, such as those for a computing environment, include hot swapping of components. In other hyperscale GPU and CPU environments, this may be a fundamental requirement. The disclosed robotic system embodiments may be implemented without requiring any other components. This allows for replacement of chassis and / or other computer components without interruption. In some embodiments, failed cards and / or components may be automatically and / or reprogrammed. This allows for short-term use of embodiments of the disclosed system. and fully remote and autonomous operation for moderate periods of time.

[0142] The mechanism of the internal robotic arm 230 is located within the environment of the pressure controlled vessel 110. As shown in Figures 1A-D, in an exemplary embodiment, if a card or component is not working properly, If so, a removal sequence may be initiated. When the removal sequence is initiated, the inner arm 230 3, the appropriate computer components 170 and / or associated chassis 400 are mounted in the rack 310. 10 and move it to the airlock 220 located within the pressure controlled vessel 110, and Once this sequence is complete, the inner airlock door will close. 222 is closed, the airlock pressure is equalized to the outside air pressure, and the outer airlock door 22 When the exterior door 224 is opened, the exterior robot arm 240 enters chassis 4. Remove 00 from Airlock 220 and place it in an empty storage slot.

[0143] In one embodiment, airlock 220 is vented to the outside environment. The system is purged with nitrogen, other inert gases and / or non-condensable gases. This has the effect of reducing or eliminating the loss of dielectric vapor when the airlock is opened and closed. In certain embodiments, the airlock is matched with a one-way valve, either internally, externally, or both. In embodiments having one-way valves both inside and outside the airlock, Purging the pressure control vessel 110 prevents cross-contamination of the internal atmosphere of the vessel 110 by the external environment. This also prevents loss of dielectric vapor.

[0144] When a card or component exchange sequence is initiated, the external robotic arm 240 4. Remove the replacement component and / or chassis 400 from the storage slot and place the component in the airlock. 220. Once complete, the outer airlock door 224 closes and the airlock is depressurized. The internal pressure of the pressure controlled vessel 110 is equalized and the inner door 222 is opened. Once the airlock 220 is open, the internal robotic arm 230 removes the chassis 400 from the airlock 220. 3 and insert it into the appropriate rack 310.

[0145] When coupled with a remotely accessible management system, the internal and external robotic arms 23 0 and 240 allow remote operation and management of data center environments. This reduces human Reduces the need for operators to be on standby, reducing costs and / or downtime In one embodiment, the external robotic arm 240 is mounted on a movable base, Thereby, one external robotic arm system can be connected to the disclosed computing system. It is possible to act in multiple embodiments.

[0146] When integrated with custom-developed workflow management systems and virtualization technologies, the disclosed robots The system must be fully autonomous and self-regulating, providing the highest level of system reliability. This enables the development of data center solutions that are easy to use.

[0147] In some embodiments, the unique human and / or machine readable serial number and / or product ID number may be An asset tag having a tag code is included with each computer component and / or chassis. In these embodiments, the asset tag may be a unique serial number. The tag may include a printed barcode or a QR code, and may be used by embodiments of the disclosed robotic system. The tag code may be used for detailed inventory control and automation systems. It may also be used in conjunction with a management software system that provides detailed component information. The adhesive and any associated adhesives or other components are preferably made of a material that is compatible with the dielectric fluid. The tag preferably comprises a slot that is readable when the chassis is inserted into the rack. In one embodiment, a secondary or additional tag is located on the chassis at the pot. may be located in other areas of the chassis to aid in component and / or inventory control identification. good.

[0148] An embodiment of the disclosed robotic system is capable of temporarily removing and This allows for a process called "reseat" in which the battery is replaced during troubleshooting. , is useful when it is determined that a hard power cycle of the component is desired. This is accomplished by cutting all power, waiting a moment, and then reconnecting it.

[0149] In some embodiments, individual cards and / or chassis are inserted into a pressure controlled enclosure through an airlock. In one embodiment, the robotic system may include a rack. Remove the chassis from the slot, move it to the airlock, and the airlock is opened. This signal indicates the completion of this task, allowing the card and / or chassis to be removed. Some embodiments may route replacement components through the same airlock used for removal. and / or allow the chassis to be placed in a particular rack slot. In this state, the robotic system removes the chassis from the airlock and places it in the appropriate rack. 4. Place the selected component in the lot to signal the completion of this task.

[0150] Robots in internal systems Embodiments of the disclosed system may include a "robot-intra-robot" robotic system. In such an embodiment, the pressure controlled vessel is adapted to house the robotic arm for operation within the vessel. The enclosure may be expanded to accommodate a computer on a rack containing operational computer components. The mounting structure may be configured to accommodate movement or transportation of computer components and / or chassis. It is understood that the pressure controlled vessel may also be referred to as a tank, a pod, and / or a vacuum chamber. Alternatively, certain components of a pressure-controlled vessel may be referred to as tanks or pods. You will probably find something.

[0151] FIG. 10E illustrates a computing component, such as the chassis 400 of the rack 310. The disclosure includes a gantry robot 526 configured to remove, replace, and / or install 5 illustrates an embodiment of the system. In one embodiment, the gantry robot 526 To remove, replace and / or install DC rectifiers and / or other components of a power system Some embodiments of the disclosed computer components and power distribution components may be configured The gantry robot 526 may be designed to be hot-swappable. It should be appreciated that the device may include a handle or other structure to facilitate handling. In one embodiment, the gantry robot 526 is configured to travel in both the x and y directions. and can be lowered in the z-direction to remove and / or install replacement components. In one embodiment, the gantry robot 526 grasps the chassis 400 and / or the power supply. For example, the gripping tool can grip the plate 426.

[0152] FIG. 10E illustrates a top cross-sectional view of an exemplary embodiment of the disclosed tank. An array of racks 310 is mounted on a chassis 400 and / or a computing board. In one embodiment, each chassis 400 utilizes approximately 6KW of power, and each rack 31 0 may contain 10 chassis. This allows for a rack 310 that contains 10 such racks. In an embodiment, the vessel can utilize approximately 600 KW of power for computing. In one embodiment, the chassis 400 may include additional racks 310 and / or magazines 527. and a DC power rectifier is housed in the vessel 500 and used as a replacement component and / or Space may be provided to store components removed from the container 500 .

[0153] External system robot 12A-E show another embodiment of the container. In particular, FIG. 12A shows a chassis 400 and and / or a gantry robot external to the tank 710 housing the computing components. 526 is shown in FIG. 7. In this embodiment, the tank 710 is A smaller, but external, gantry robot 526 is mounted on the chassis 400 inside the tank 710. and / or need to be opened more frequently to access power sources. The vessel is housed in a modular enclosure, such as reservoir 716, external to tank 710. In one embodiment, the tank 710 may include multiple doors 711. , so that components or the chassis 400 can be easily removed, installed, and / or To limit exposure of the interior of the tank 710 when one door 711 is opened for replacement purposes. In such an embodiment, the replacement component can be used without unnecessarily opening the tank. To avoid this, the fuel cell 710 may be stored outside the tank 710.

[0154] Additionally, the vessel 700 includes one or more transformers 712, a power distribution panel 713, and treated water pipes 514. 12 and an electrical chase 714. The vessel 700 may include a Programmable logic controller (PLC) cabinet for monitoring and controlling the status The power distribution panel 713 may also include a transformer 712, a power distribution panel 713, a treated water pipe 512, and an electric The chase 714 and PLC cabinet 715 may be located outside the tank 710. good.

[0155] FIG. 12B illustrates a vessel 70 in which the tank 710 is accessible to an external gantry robot 526. In this exemplary embodiment, the condenser coil 132, the rack 310 and the base 310 are Rose 717 is located in tank 710. FIG. 12C shows the external gantry robot and 7 shows a side view of a vessel 700 having a tank 710 with multiple doors 711. In an embodiment, the tank 710 removes the fluid from the reservoir area and passes the fluid to the fluid filter 520. The container 700 includes a fluid pump for pumping fluid through the fluid pipe 521. A magazine 718 for storage is also included. In this exemplary embodiment, the magazine 718 includes a tank In one embodiment, the amount of liquid dielectric fluid in the tank 710 is Spacers and / or ballast blocks 160 may be used to reduce the overall volume. good.

[0156] 12D illustrates a rack 310 according to an example embodiment. 314 may be located on the opposite side of the rack 310 rather than adjacent to the primary power source 313 . Additionally, power and / or data cables 318 and 319 may be connected to the power supply 316 and / or data cables 318 and 319 depending on the specific requirements of a particular deployment. In this exemplary embodiment, the battery The cuplain receiver 331 is located at the bottom of the rack 310 .

[0157] FIG. 12E illustrates an example hinged door that may be used in certain alternative embodiments of the disclosed tank 710. In one embodiment, to reduce or avoid induced currents in the dielectric vapor, Sliding doors may be used instead of hinged doors. Slowly slide the door. Opening the door by swinging it open is much slower than swinging a hinged door open to create mixed currents. This results in less fluctuation in dielectric vapor.

[0158] Management System The management system communicates with users of the disclosed computing system and the computing system. An embodiment of the management system includes: The present invention provides an operational representation of a computing system, a pressure controlled vessel 110, a robotic system, Various systems and components, including In one exemplary embodiment, the management system includes: , may be implemented in the PLC cabinet 715 of FIG. The management system may be implemented in the power and communications box 513 of FIG. In an embodiment, the power management system may include a controller or other suitable device, such as a computer. The present invention can be implemented as a software program on a personal computer.

[0159] In certain embodiments, data points accessible through a simple network management protocol are A set of components will monitor key operating parameters via a third-party monitoring system. A log of all activities may be made available to users of the management system to enable auditing. may be maintained and a chart may be provided for user updating of the operating condition data.

[0160] Routine maintenance of system components is scheduled and maintained through a management system. The user may be provided with periodic reminders for scheduled maintenance, The user will see it as running within the interface. All data may be retained as part of the performance log information for historical performance review.

[0161] In some embodiments, operational functionality may be achieved by remotely controlling the computing system and associated components. API interface to allow remote programmatic monitoring and management may be published via the may include a full set of performance monitoring and alerting features.

[0162] Centralized server version or hosted cloud-based management version The management system of the system is available to customers using multiple pressure control vessel computing systems. This can be used as a single point of contact for the management of a group of pressure controlled vessel computing systems. A single programmatic, user-accessible interface is provided to the operator.

[0163] In one embodiment, the software-based interface module is Software System Center and VMWare VCenter Interoperability with software management platforms and third-party management utilities The API interface provided by the user and management system is The disclosed computing platform enables full interoperability with the internet system. This enables complete remote and programmatic autonomous operation and management of the system.

[0164] In some embodiments, the control system controls operations including temperature, pressure, flow and / or power management. In one embodiment, the user authentication system allows for the coordination and control of multiple unique Allows users to be authenticated to the system. Some embodiments use role-based and / or The present invention includes an element-based authorization system. In such an embodiment, an administrator may Configure multiple roles that can be assigned to individual users and / or grant specific permissions outside of their role assignments. This can be applied to users.

[0165] Some embodiments record video input from cameras that may be located within the vessel and / or superstructure. In one embodiment, the camera includes a video manager to provide users with the ability to record and retrieve video. The camera may obtain visual data that may be analyzed by the processor. The processor controls the vessel, the robot, and / or the superstructure in response to the acquired visual data. Computer vision techniques may be used to control the operation of the system.

[0166] In one embodiment, the control system and software may be implemented as a computing platform as disclosed herein. The operation and status of the entire system, individual subsystems and / or components of the platform. The device may be configured to generate reports relating to the

[0167] Exemplary Merging System Embodiments It should be understood that the disclosed systems may be utilized individually or in combination. There are numerous embodiments of the merged computing system that can be adapted to various use cases. be.

[0168] One exemplary embodiment is the Crypto series, which is a special-purpose computing Hardware, guide plates and wiring harnesses designed for that hardware 3, a variation of the architecture of the communication system 360, and 1 is an ultra-high density embodiment of the disclosed technology utilizing a pressure controlled vessel 110 and power distribution system. A typical user of this embodiment uses a customized computing component. those wishing to carry out cryptocurrency mining or other very power-dense processing on the Computing engineers who wish to develop a full-area two-phase immersion cooling system that includes their own hardware The manufacturer of the mounting components.

[0169] Another exemplary embodiment is the GPU series, which is a high density GPU of the technology of this disclosure. This is an example of supercomputing. This example shows how to achieve ultra-fast GPU communication. Gigabyte motherboards use NVidia NVLink technology to boost GPUs A custom chassis designed to contain the board and NVidia GPU 400; The technology of the rack 310 and backplane interface 330 is utilized. Typical users include graphic rendering, particle simulation and general research activities. General-purpose parallel processing that can take advantage of GPU-based computing and memory capabilities Includes applications.

[0170] Yet another exemplary embodiment is the CPU series, which is a high density CMOS processor of the disclosed technology. This is an example of PU computing. This example is a high-end Supermicro o-based motherboard, Intel Xeon CPU, high-speed network interface It utilizes semiconductor memory devices for interfaces, high-speed memory, and local storage. Typical users of the technology are those who develop and deploy software for their own internal applications or for which they have third-party customers. and data centers that use high performance computing for services provided to other organizations. , enterprise and cloud / VPS hosting providers and service providers.

[0171] Yet another exemplary embodiment includes the Edge Series, which is a Specifically designed for use in, or in, or associated with, traditional business and data center environments. 1 is a scaled down example of a computing system of the disclosure. It is specialized for safe weatherproof environments with full remote monitoring and management capabilities. Target users of the technology include network operators and other organizations with distributed field infrastructure. operators of fielded and distributed technologies, and minimal changes to existing facilities or structures Operators of existing facilities wishing to augment their computing power with new The system includes various expansion functions for external structures, electricity, water and network. This may simplify connection to systems of utility services, including connections.

[0172] Self-Contained Embodiment Certain disclosed embodiments do not require an external water source. A closed loop chiller for cooling water or other fluid that may be circulated through a condenser such as By using a closed loop chiller rather than an external water supply, the system is essentially self-contained. This allows for a variety of molded embodiments.

[0173] FIG. 13 illustrates an exemplary self-contained container 750. The exemplary embodiment of FIG. The condenser 710 is a skid mounted device for cooling water or other liquid used in the condenser in the immersion tank 710. By using a built-in closed loop chiller 719, the external It eliminates the need for a cooling water source and requires no external power or network to be fully operational. This provides a self-contained data center solution that only requires a network connection. 50 includes bellows 717, door 711, gantry robot 526, power distribution panel 713, A PLC cabinet 715 and a magazine 718 may also be included.

[0174] In one embodiment, the closed loop chiller 719 is mounted in the outer housing of the modular pressure controlled vessel. In such an embodiment, the chiller may be a skid-mounted closed loop chiller that is enclosed within the cooling system. , heat is transferred from the computer components to the dielectric liquid in the tank 710. The dielectric liquid is converted to a dielectric vapor as described herein. The dielectric vapor is then transferred to a tank. 710 and is cooled by the condenser, thereby converting the dielectric vapor into a dielectric liquid. The heat transferred from the dielectric vapor to the condenser is then transferred to the refrigerant in the condenser. Or it is transferred to the condensed fluid and then transferred to the closed-loop chiller 719. In one embodiment , the chiller 719 is a vapor compression, compressor, evaporator, heat exchanger, or refrigerant or condensing fluid Heat is removed from the refrigerant or condensing fluid using other methods of cooling in a closed loop. The heat from the fluid is ultimately dissipated via air cooling. In some embodiments, this is It will be a self-contained modular air-cooled two-phase immersion computing system. has generally taught the opposite to air cooling, especially for self-contained devices, The air cooling of this self-contained embodiment is surprising.

[0175] Certain disclosed embodiments may be provided in a space-saving footprint form factor. The configuration is a single unit containing ten blades or servers that are immersed in a dielectric liquid as described above. In one embodiment, each server can draw approximately 6 kW of power. It therefore provides approximately 60 kW of computer power in a small footprint.

[0176] The exemplary embodiment shown in FIG. 13 is approximately 4 feet 2 inches deep and 8 feet 8.5 inches wide. This exemplary embodiment is within a footprint of approximately 8 feet 8 inches in height. With 60 kW of computer power and other operating components and systems, it is approximately 36.3 m2. The operating components of the vessel include, but are not limited to, a computer. A tank or pod containing the dielectric fluid, condenser, power and data connections for the controller components. It should be understood that the vessel may contain sensors, controls, power cabinets, Rose 717, vacuum systems, fluid filters, purge systems and / or other components. Some self-contained embodiments may include an outer housing. an outer housing that encloses the vessel, provides structural support, and is skid mountable; It may be ventilated, weather and / or water resistant, and / or decorative. In an embodiment, the outer housing of the self-contained vessel includes a radiator coil, a fan grate, a heat transfer It may include air-cooling components to facilitate the use of components and / or closed-loop chillers.

[0177] In one embodiment, a self-contained computing system has a capacity of 1000 sq. ft. At least about 1.5 kW per square foot, at least about 1.6 kW per square foot, At least about 1.65 kW per square foot, at least about 1.8 kW per square foot, At least about 2.0 kW per ft, or at least about 3.0 kW per square foot In one embodiment, the self-contained computing The system can generate up to about 1.5kW per square foot of space and up to 1.5kW per square foot of space. Approximately 1.6 kW, up to approximately 1.65 kW per square foot, up to approximately 1.8 kW, or a maximum of approximately 2.0 kW per square foot, or a maximum of approximately Provides 3.0kW of computing power. Self-contained system with adjustable height. This allows more or less computing resources to be provided within a given footprint. It should be clear that this allows for even higher power consumption.

[0178] The dimensions, components, arrangements and configurations of the disclosed exemplary embodiments are illustrative and may vary in various form factors. It will be appreciated that modifications, additions and / or deletions may be made to create such potential embodiments. It should be.

[0179] In some embodiments, the self-contained computing system may be, for example, a blade server. To remove, replace and / or install a battery, power supply or other component, such as the chassis 400 The robot system may include a gantry robot 526 configured as follows: A type system can be either an "internal robot" or an "external robot" of the system. In a smaller footprint embodiment, a smaller magazine 7 of replacement components may be provided. 18 may be used. In one embodiment, the magazine of replacement components 718 is shown in FIG. In one embodiment, the tank 710 may be mounted on the outside of the tank 710. The computer components, power supplies, replacement magazine 718 and gantry robot 526 The gantry robot 526 moves substantially in only one direction while removing, replacing and / or removing components. When the various components are arranged in a substantially linear manner, The gantry robot 526 removes and replaces the desired component without traveling in a second direction. and / or can travel along a single axis to place. It has been found that the actuator may be capable of lifting and lowering components in addition to moving in a single linear direction. It should be easy.

[0180] By utilizing small components such as the embodiment shown in FIG. 13, a self-contained 2PL The IC system can be easily transported. The inclusion of the Closed Loop Chiller 719 Thus, a two-phase immersion cooling system may not have access to a practical source of cooled water. It can be used in remote conditions and does not require external cooling water. In one embodiment, only two external connections are required: one power connection and one data connection. Thus, a self-contained computing system is formed that does not

[0181] In one embodiment, the computing system is housed in an outer housing as shown in FIG. In some embodiments, the components identified diagrammatically in FIG. 13 and / or described herein may be included within the The components disclosed in may be included within the outer housing. The volume of the housing depends on the anticipated cooling requirements, the configuration of the closed loop chiller, and / or the self-contained cooling system. The embodiments may be adapted based on the environment in which the computing system is expected to be deployed.

[0182] The disclosed self-contained, self-healing and small form factor embodiments are Use as a standalone solution to provide monitoring capabilities almost anywhere or in any environment In some applications, multiple small computing systems may They may be located nearby and / or linked together to form a cluster. The outer housing is designed for maintenance and repair while only having access to one or two sides of the outer housing. This arrangement allows for the carrying out of equipment and / or service work. ,Individual self-contained computing systems have decreased between each self-contained system. Or they can be arranged at a minimum distance.

[0183] In one exemplary embodiment, four exemplary classes of self-contained computing systems are The computer is a self-contained computer with approximately 240 kW in a footprint of approximately 140 square feet. In some embodiments, these units may be strategically placed to allow for power. , may be in power and / or data communication with each other, thereby providing a single external power connection and allows operation of a multi-unit cluster with only a single data connection. In an embodiment, the data center includes a plurality of small computing systems or such The network may be established using multiple clusters of computing systems.

[0184] Certain disclosed embodiments and / or the computing system disclosed herein may be implemented using a modern data center and / or climate controlled environments, the disclosed self-contained Some embodiments of the computing system may be deployed in remote locations and / or in harsh environmental conditions. In some embodiments, the outer housing is weatherproof, water resistant, and and / or otherwise constructed to withstand exposure to harsh environments for extended periods of time. Certain disclosed embodiments provide for the delivery of large amounts of computing resources to remote or difficult locations. Certain self-contained embodiments require no access to power and data connections. In some implementations, the device may be operatively deployed in substantially any location where access to the device is possible. In some configurations, uninterruptible power supplies and / or generators provide a more reliable or constant source of electrical power. It may be operatively connected to a computing system to provide access.

[0185] Certain disclosed self-contained embodiments are designed to be stackable. Certain embodiments may be designed to be low profile. Particular embodiments are approximately 5 feet 5 inches tall and 15 inches deep. The dimensions of the stand can be as wide as 5 feet 6 inches and 9 feet wide. This covers a 42 square foot installation area. Such a unit would provide approximately 60kW of computer power in the same 42-sq. Vertically loaded to provide 120kW of computer power in a 100m footprint This may be done.

[0186] The disclosed computing system embodiment is stacked and has multiple loads adjacent to each other. This reduces the need for aisle space between individual computing systems. This reduces the power consumption, thereby allowing for higher overall power density within the data center.

[0187] Some embodiments require access to only one side of a self-contained computing system. Such an embodiment may be designed to be fully operational and maintainable. This is advantageous because it makes it easier to place self-contained systems in close proximity to one another. Additionally, in some self-contained embodiments, the entire immersion tank is accessible to only one side of the device. In certain embodiments, the tanks may be individually modular and may be removed and / or replaced. They may be modular and / or skid mounted.

[0188] In some embodiments, the self-contained computing system has a smaller footprint. The disclosed system may be arranged vertically to take advantage of the vertical design of the system. delivers approximately 60kW of computing power in a footprint of approximately 22.9 square feet. As with other disclosed embodiments, several vertically oriented self-contained components may be provided. The computing systems may be located in close proximity to one another. As described above, some vertically oriented self-contained computing systems It can be operated and maintained with access to only one side. In some embodiments, the entire tank is This arrangement allows multiple blade servers and and / or other computing components may be rapidly replaced.

[0189] Mobile embodiment A self-contained computing system that does not require an external source of cooling water Novel computing applications are possible. In one embodiment, the generator Power is supplied to the system using the In some embodiments, the system relies on wireless data communications. may be also possible.

[0190] In certain self-contained embodiments that do not rely on a fixed power source or wired data communications, The disclosed embodiments may be implemented in virtually any environment. A self-contained in-vehicle computer that can be used to provide large amounts of computing power in In one embodiment, the truck-mounted wireless computing system The system is operated within wireless communication range of an existing or temporary network, effectively It can provide large amounts of computing power with no setup or installation time.

[0191] Natural water embodiment In one embodiment, the computing system is adapted to be used in a boat, a ship, an oil rig, a floating used on a floating platform or other vessel or structure located in close proximity to a body of water. In such an embodiment, the dielectric vapor may be arranged to be The condenser used to convert back to a dielectric fluid may be cooled using water from a body of water. In one exemplary embodiment, the modular computing system includes a water inlet, a water outlet, and a pump or impeller. The pump and / or impeller may move water from the body of water to the condenser. Some embodiments may include condensers, piping, and other components. Designed to protect computing system components from sources of contamination in bodies of water In some embodiments, the condenser and other components may include filters and / or processing components. The material is arranged to withstand prolonged contact with brackish or salt water, for example sea water.

[0192] Horizontal Magazine Swap In one embodiment, the magazine of replacement components is connected to a computing system external to the tank. For example, chassis, servers, blades, and Replacement components, such as fuel and / or power components, are removed from the magazine and refitted in the tank. The magazine can be used to replace components. The magazine can be used to replace components from the magazine. configured to extend from an outer housing of a computing system to enable The device may be on a platform that supports the

[0193] In one non-limiting example, if a blade server in a tank is not functioning properly, a robot The team removes the inoperative component from the tank and places the inoperative component in the magazine compartment. The robot arm can then be used to move the machine from the magazine to a storage slot. Remove the functioning blade server and install it where the non-working server was previously located. A new server may be installed, thereby replacing the inoperative server with a new operational server.

[0194] Over time, the magazines become more flexible and allow the robot system to continue operating for a long period of time. , store inoperative components that can be replaced with new operational components. So, the magazine is on a platform that can extend outside the outer housing. Advantageously, this allows an operator to access the magazine. In this case, the platform allows components to slide in and out of the magazine. The magazine is configured to rotate from a substantially vertical position to a substantially horizontal position to allow do.

[0195] In one embodiment, an adjustable height cart allows a human operator to load components into a magazine. The weight of the component must not be lifted or supported while it is being removed or replaced from the It can be used to move, load and / or receive components, such as by rotating to a generally horizontal position. The magazine is configured to load and unload functional components into the magazine. It should be appreciated that removal of the element may also be facilitated.

[0196] 15A-D show a platform 820 that can extend outside the container. 15A shows an example magazine 810. In FIG. 15A, the magazine 810 includes a rotating member 821, a support The support member 822 and the platform including the rail 823 may be connected to the platform. In addition, the support member 822 is stored in the magazine 810 and the magazine. Rails 82 that allow the weight of any server or other component to be supported and moved 15A, the platform 820 may be connected to the extended position. is located.

[0197] As shown in FIG. 15B, during normal operation, the support member 822 supports the computing system During normal operation, the magazine 810 is supported by rails 823. In one embodiment, the weight of the magazine 810 can be supported on the rails 823. Regardless of the position of member 822 , it is supported by support member 822 and rail 823 .

[0198] In one embodiment, a computer, such as a server, that is utilized in the disclosed embodiments. The components may be denser and / or heavier than traditional computer components. In some embodiments, the weight of a blade server may be reduced due to the increased cooling capacity of the disclosed embodiments. At least about 50 lbs, at least about 60 lbs, at least about 70 lbs about 1 s, at least about 80 lbs, at least about 90 lbs, or at least about 1 In one embodiment, the blade server may weigh up to approximately 500 lbs. lbs, up to about 60 lbs, up to about 70 lbs, up to about 80 lbs For example, the maximum load may be about 90 lbs or about 100 lbs. Thus, the magazine 810 can hold multiple chassis 400 or blade servers. Each blade server can weigh about 73 lbs. The magazine can hold three such servers. When such a server is loaded, the total weight of the magazine 810 and the server is approximately 395 lbs. It could be.

[0199] In one embodiment, the servers used are blade servers mounted in a chassis. The server and / or chassis are used to install and operate the server in a computing system. In some embodiments, the server may include a backplane system to facilitate easy removal. In some embodiments, individual servers may be submerged servers that do not include fans or other air cooling devices. The board can be configured with 16 GPUs and draw approximately 6KW of power. In an embodiment, the server is a 1.5U server. Such a server may be an OIU server. Such a server may be 1.5U high and have immersion cooling. In one embodiment, a single tank in a computing system is configured for 10 1OIU servers were operated, and all 10 servers were essentially operating at full power. In one embodiment, the computer may be configured to provide approximately 60 KW of power when the computer is in operation. A cooling system may include one or two of such tanks. In this embodiment, the computing system may be configured to compute a number of tanks, e.g., 10 such tanks. The tank may include:

[0200] In one embodiment, as shown in FIG. 15A, the magazine is read from the computing system. When the support member is to be removed from the storage position, the support member moves along the rail from the storage position to the computer. The housing is cantilevered externally of the outer housing of the coupling system.

[0201] As also shown in Figs. 15C-D, the magazine is pulled out or not pulled out. The device may slide along a rail and be cantilevered outside of the computing system. In an embodiment, as shown in FIGS. 15C-D, the magazine removal tool removes the entire magazine and the magazine. In one embodiment, the method may be used to remove components contained within the gin. The magazine removal tool lifts the magazine from the support member for transport. It can be used to slide on rails.

[0202] In one embodiment, when the magazine is moved outside the computing system, the The platform allows the magazine to be rotated to a nearly horizontal position. The servers contained in the magazine can be slid out of the magazine.

[0203] 15A-D are exemplary diagrams for removing a server from a magazine, according to an example embodiment. A series of steps are shown. In the illustrated embodiment, the magazine is secured to a linear guide behind the access door. As shown in Figures 15C-D, the magazine can be attached to a pull rail system. The magazine can be manually removed and cantilevered outside the computing system. It may be extracted or installed in the computing system using a motorized or automated system. As shown in FIG. 15D, the magazine may be moved to the outside of the stem. The rack may be rotated approximately 90 degrees to orient the servers and / or other components mounted thereon in a generally horizontal position. Once in the generally horizontal position, the servers and / or other components slide out of the magazine. , on a cart or other tool configured to receive the server and / or other components. As shown in FIG. 15C, the scissor lift cart can slide to the server or The height of the rotating surface may be adjusted to accommodate other components. The server can load the magazine without requiring a human operator to support the weight of the server. This may be used to allow the device to be transported from the gin onto a cart. Thus, when the server is slid onto a cart having a grinding or rotating surface, the server or other The components will be shipped to another location to be replaced or repaired. It should be appreciated that the magazine can be loaded using substantially the same steps in reverse order. be.

[0204] In an alternative embodiment, the magazine is supported on a rotatable and extendable arm without rails. In such an embodiment, the magazine may be maintained in the computing system during normal operation. The components in the magazine can be stored in a generally vertical position within the outer housing of the stem. When it is determined that the magazine should be removed, the magazine is attached to the outer housing by means of an extendable arm. When the magazine is extended beyond the outer housing, the magazine To allow components stored in the magazine to be removed horizontally from the magazine. The imaging device can be rotated from a substantially vertical position to a substantially horizontal position.

[0205] Bellows In some embodiments, a bellows and / or vapor collection system may be utilized. Before the embodiment is first operated, the dielectric fluid, computer components such as a server, and Other system components may be brought into thermal equilibrium. Computer components, such as servers, may begin to generate heat that can be dissipated into the dielectric fluid. This process causes a portion of the dielectric fluid to transition from a liquid state to a vapor state. As the temperature of the body increases, a greater portion of the dielectric fluid can transition to the vapor state. In this system, an increase in the volume of the dielectric vapor will result in an increase in pressure within the system. In one embodiment, the tank containing the dielectric fluid is in fluid and / or vapor communication with the recovery system. It can be a state.

[0206] FIG. 16 illustrates a vapor recovery system 900 according to an example embodiment. is connected to a tank 710 containing a dielectric vapor. The dielectric vapor is piped from the tank 710. In one embodiment, the vapor recovery system The system 900 includes an expanding and contracting bellows 905 configured to receive a dielectric vapor. This reduces or eliminates any pressure buildup in the tank 710. When the dielectric vapor is removed or a portion of the dielectric vapor is condensed into a dielectric liquid, the bellows It can be folded or contracted to substantially maintain pressure balance.

[0207] In one embodiment, the vapor recovery system 900 includes a step of introducing atmospheric air into the vapor recovery system. In such an embodiment, the dielectric vapor is passed through a valve 912 configured to By mixing the dielectric vapor with the atmosphere, the temperature of the dielectric vapor is reduced. In one embodiment, the mixed air / steam is directed through a carbon bed 911. The carbon media in the carbon bed 911 may be used to circulate the air through the carbon media. 900, for example, via an outlet valve 913 while allowing the dielectric vaporizer to ventilate. In such an embodiment, the heated dielectric vapor may be , can be cooled and collected by carbon media.

[0208] After operating for a sufficient period of time, an embodiment of the computing system The cooling components reach a stable thermal state based on the power capacity utilized. If more or less computing power is utilized, more or less The bellows 905 can then be heated to a temperature within the range of 100° C. to 150° C., whereby the dielectric fluid can be transitioned to a dielectric vapor. The material may expand and / or contract in response to heat dissipated into the material.

[0209] In some embodiments, the bellows 905 may include one or more pouches. The bellows pouch may comprise a metal foil and polymer laminate structure. In one embodiment, the expanded bellows pouch The total volume of the tank may be at least about 15% of the liquid fluid volume of the tank. The total volume of the expanded bellows pouch is at least about 20% of the liquid fluid volume of the tank, but not less than about 10%. It may be at least about 23% or at least about 25% or more. In this state, the total volume of the expanded bellows pouch is approximately 40% of the liquid volume of the tank. It may be up to about 30% or up to about 25% or less.

[0210] In one embodiment, once the computing system has substantially reached thermal stability, The air recovery system 900 is closed to the cooling atmosphere and allows air to be exhausted from the system. The valve allowing the carbon bed to be cooled may be closed. In one embodiment, the tank and bellows may be configured to open only using A desorption heater configured to circulate heat through the carbon medium is configured to increase the temperature of the carbon medium. As the temperature of the carbon media increases, the carbon dioxide previously captured by the carbon media is absorbed by the carbon media. Any dielectric fluid that is drawn away from the carbon will be returned to the tank, which It may be condensed back into the dielectric fluid as previously described.

[0211] In some embodiments, when a computing system is powered on below a previous steady state, In this case, the portion of the dielectric fluid in the vapor state may be reduced, and in some embodiments, the bellows In some embodiments, the bellows may be shrunk to accommodate the loss of dielectric vapor. The valve that allows air to enter the bellows is opened to further reduce the pressure difference. In some embodiments, nitrogen, rather than air, reduces the pressure difference and provides a better cooling effect from air. This may also be used to avoid the introduction of potential contamination from

[0212] In some embodiments, the bellows and / or vapor recovery system are completely or substantially passive. In some embodiments, the bellows and / or the vapor recovery system may be computer-implemented. Sensing from temperature, pressure and / or power sensors located throughout the operating system The system may be powered and / or automated based on sensor data.

[0213] In one embodiment, a computing system having a vapor recovery system includes a system In some embodiments, the system is emission-free, even if it is not a closed system. Nitrogen is introduced into the system with little or no release of dielectric fluid into the surrounding atmosphere. and can be pumped out of the system.

[0214] Example Embodiments The disclosed embodiments provide for reduced density of computer components and / or computing power. Two-phase immersion cooled computer components 1 in a pressure controlled vessel 110 In some embodiments, including 70, the components are less than about 1 inch, less than about 0.7 inches, or The individual components may be spaced apart from one another by less than about 0.5 inches. In one embodiment, the individual components are More than about 0.3 inches, more than about 0.5 inches, more than about 0.7 inches, more than about 1 inch, or more than about 1.5 inches They may be spaced apart by more than an inch.

[0215] Certain disclosed embodiments provide improved power usage efficiency (P By using the disclosed embodiments, computer component 170 This allows for a reduction in the amount of energy used to cool the data center, thereby reducing the total energy consumption of the data center. Energy usage is reduced and the PUE approaches 1.0. For a data center with immersion-cooled computer components in a pressure-controlled vessel 110 , data centers are less than about 1.15, less than about 1.10, less than about 1.08, or less than about 1.05 One embodiment provides a pressure controlled dual phase immersion cooled computer component. Regarding the data center provided in the container 110, the data center is greater than about 1.05 and is about 1.06 greater than about 1.08 or greater than about 1.10.

[0216] In one embodiment, a heat-conducting, condensable dielectric fluid is used in a two-phase immersion cooling system. The computer components are provided to operate at sub-atmospheric pressure, which is achieved by using a dielectric fluid. reduces the temperature at which the dielectric fluid vaporizes, resulting in a lower liquid phase compared to standard atmospheric pressure. Computer components generate heat as they operate. Heat is transferred to a dielectric liquid in contact with the computer components, vaporizing the dielectric liquid into a gas. The gaseous dielectric fluid may be condensed using a condenser. Water is passed through a condenser. When the gaseous dielectric fluid is cooled by the condenser, it is condensed. The liquid returns to its liquid phase and descends back into the bath of liquid dielectric fluid.

[0217] Certain disclosed embodiments relate to high density data centers. Conventional data centers have a density of about Approximately 1 megawatt (MW) of computing power distributed across 10,000 square feet High-end data centers are spread across approximately 6,000 square feet. The disclosed embodiments may include a dual-phase immersion cooled The data center includes a pressure controlled vessel 110 and a computer component 170. The data centers are approximately 3,000 square feet, approximately 1,500 square feet, and approximately 1,000 square feet. 1MW distributed over approximately 800 square feet or approximately 600 square feet In one embodiment, the disclosed computing system Multiple pressure controlled vessels containing the pressure regulators may be arranged in a row and powered by a central power source. In an embodiment, multiple embodiments of the disclosed computing system are connected in series with each other. This may be continued.

[0218] The disclosed embodiment includes computer components 17 that are immersion cooled within a pressure controlled vessel 110. 0, whereby the components are immersed in a pressure controlled vessel and in a dielectric liquid 140. Certain disclosed embodiments provide minimal air filtration and and / or cleaning requirements. In one embodiment, the data center , without HEPA filter or equivalent, with MERV 11 filter or equivalent It operates without a filter or MERV8 filter or equivalent.

[0219] The disclosed embodiment includes computer components 17 that are immersion cooled within a pressure controlled vessel 110. 0, so that the components are not cooled by gaseous air. Data that operates without a cooling fan and / or other similar device for circulating air Includes the center.

[0220] The disclosed embodiments relate to an environmentally friendly data center. The computer includes computer components 170 that are immersion cooled within a pressure controlled vessel 110. Little or no water is consumed for the process. A closed circuit dry cooling tower is used to cool the dielectric fluid and condense the dielectric fluid vapor into a dielectric fluid liquid. This reduces the temperature of the water circulated through the disclosed condensation structure 130. The embodiment operates as a closed loop without significant water input or output, and the dry cooling tower uses evaporative cooling. The data center does not rely on water flow for cooling or operation. Less than 10,000 gallons of water per day, Less than 1,000 gallons of water per day, Less than 1,000 gallons of water per day Uses less than 100 gallons of water, less than about 10 gallons of water per day, or 0 gallons of water per day Some data center embodiments use and / or discharge more than about 100 gallons per day. Water, more than 1,000 gallons of water per day, more than 10,000 gallons of water per day and / or discharge.

[0221] The disclosed embodiments include a pressure controller and / or a pressure regulator operably connected to a vacuum source. a pressure-controlled vessel having an interior and an exterior and configured to contain an atmosphere within the interior; a volume of a thermally conductive condensable dielectric fluid and a computer component. a rack for carrying out a thermal conduction test for a predetermined volume of computer components when the computer components are mounted on the rack; a rack positioned to be at least partially immersed in the dielectric fluid; and a condensation structure. a volume of thermally conductive dielectric fluid, a rack, a computer component, and a condensation structure; In one embodiment, the object is contained within a pressure-controlled vessel. a pressure controller for reducing the internal pressure to below atmospheric pressure; A thermally conductive condensable liquid supply system is provided for operatively connecting the liquid and gas phases to a volume of the thermally conductive condensable liquid supply system. a pressure controlled vessel configured to include a dielectric fluid capable of detecting a pressure change in one or more of the following components: The element is at least partially immersed in a volume of the liquid phase of a thermally conductive, condensable dielectric fluid. and one or more computer components arranged to obtain a gas phase dielectric fluid. and a condenser for condensing the air on the body.

[0222] In one embodiment, the pressure controlled vessel is mounted in a host structure and the blade servers are The pressure control vessel is constructed so that it can be swapped without interrupting the power supply system. a pressure control vessel having an open top; A lid configured to sealably close the mouth and the opening, the lid controlling the rising steam pressure The pressure control vessel is configured to be oriented from a middle portion of the vessel to a side portion of the pressure control vessel, the pressure control vessel being approximately 1 00 cubic feet and approximately 300 cubic feet internal volume and / or pressure controlled vessel The dielectric fluid comprises a ratio of between about 1:3 and about 1:8 of liquid dielectric fluid to gas dielectric fluid. The embodiment includes a ballast block, a blade server and a blade server chassis, a robot, The airlock is a large disturbance to the atmosphere in the pressure control vessel. A robot configured to allow access to an interior of a pressure controlled vessel without Arm and airlock, and / or purge system with a volume of thermally conductive dielectric The system further comprises a purge system configured to remove contaminants from the fluid. In this embodiment, the purge system removes a portion of the atmosphere from the pressure control vessel and removes any remaining atmosphere from the vessel. The dielectric fluid is configured to condense any remaining vapor and discard any remaining vapor. In an embodiment, the purge system condenses at least a portion of the gaseous dielectric fluid to remove gaseous contaminants. The device is configured to dispose of the object.

[0223] One embodiment relates to a method of cooling a computer component, the method comprising: providing a housing for storing a thermally conductive condensable dielectric fluid and a heat generating The housing includes computer components and is configured to withstand at least a slight vacuum. and a step of operating the computer components, The step of operating the computer components generates heat, and the computer components are in contact with the dielectric fluid. generating a vacuum within the housing; and wherein the pressure is at least about 1 atmosphere. maintaining a vacuum in the housing while the computer components are operating; the pressure in the housing is less than about one atmosphere; evaporating the dielectric fluid from a liquid state to a gaseous state using heat generated by the condensation. condensing the dielectric fluid from a gaseous state to a liquid state using a device; and removing non-condensable liquid. and / or replacing parts of computer components while the system is in operation. The step of removing the non-condensable fluid may include isolating a portion of the gas atmosphere from within the housing. condensing any dielectric fluid from the gas atmosphere; and Returning the dielectric fluid to the housing and discarding any remaining portion of the gas atmosphere. and / or the housing is configured to generate convection.

[0224] Some embodiments may be used to heat computer components in contact with a thermally conductive dielectric fluid at subatmospheric pressure. In one embodiment, the method comprises the step of operating the computer at full capacity. The embodiment includes the steps of vaporizing the dielectric fluid and condensing the dielectric fluid at less than atmospheric pressure. The device further comprises a

[0225] One embodiment relates to a method of cooling a computer component, the method comprising: providing a condensable dielectric fluid in liquid and gas phases; in at least partial contact with a thermally conductive, condensable, dielectric fluid in the liquid phase in the presence of a dielectric fluid. and operating the computer components at subatmospheric pressure. The embodiment is adapted to convert at least some of the heat generated by operating computer components into vaporizing the dielectric fluid from a liquid phase to a gas phase using the at least one portion of the dielectric fluid; condensing a portion from the gas phase to a liquid phase; and removing a non-readily condensable fluid from the dielectric fluid. and / or removing at least a portion of the computer component; and replacing at least one computer component while the can.

[0226] One embodiment relates to a method for cooling a computer component, the method comprising: operating the computer components at at least 1 psi below atmospheric pressure; The thermal component is at least partially in contact with a thermally conductive dielectric fluid, and the dielectric fluid has a boiling point of An embodiment may be configured to have computer components that do not exceed about 80° C. The method further comprises the step of condensing the dielectric fluid under such conditions.

[0227] Various disclosed embodiments may incorporate some or all of the components even if not described herein. It should be understood that the specific components and their characteristics may be included in each specific embodiment. The variations can be adjusted based on the characteristics of the system. and network connection systems, pressure management systems, steam management systems and specialization This may include a selection of selected equipment and components.

[0228] From the above description, those skilled in the art can easily ascertain the essential features of this disclosure and the gist of the disclosure. Various modifications and variations may be made to adapt the present disclosure to various uses and conditions without departing from the scope of the present invention. The above-described embodiments are merely illustrative and are not intended to be limiting of the present disclosure. It should not be construed as a limitation of scope.

[0229] Immersion cooling process 1. A method comprising: At least partially immersing the computer components in a thermally conductive, condensable, dielectric fluid. The method comprises the steps of: The computer component includes a backplane for receiving power from the rack. It is mounted on a chassis that The computer component is configured to receive the dielectric when the computer component is in operation. configured to dissipate heat to the fluid; Steps and condensing the dielectric fluid in a gas phase to the dielectric fluid in a liquid phase using a condenser; The rack is provided with a pressure controller for decreasing or increasing the internal pressure of the tank. The method is as follows: 2. The tank shall have at least 300 watts of power distributed across each square foot of space. 2. The method of embodiment 1, wherein the computing power density is 100 MHz. 3. The method further comprises the step of removing the chassis from the rack using a robot; 2. The method of embodiment 1, wherein the robot is located within the tank. 4. The method further comprises using the robot to transport the chassis to an airlock. The airlock allows the inside of the tank to be opened without significantly disturbing the pressure inside the tank. 4. The method of embodiment 3, configured to enable access to the portion. 5. Opening the inner door of the airlock; placing the chassis in the airlock; closing the inner door of the airlock; Equalizing the pressure in the airlock to atmospheric pressure; opening an outer door of the airlock; The method of embodiment 4, further comprising: 6. The method further comprises the step of storing the chassis in a magazine using the robot. The method of embodiment 3. 7. The magazine is positioned on a platform including a support member, a rotating member, and a rail. The method of embodiment 6, 8. The robot includes a gantry configured to remove, replace, or install the chassis. The method of embodiment 3, wherein the robot is a 9. The gantry robot is configured to move in a horizontal plane and descend vertically. The method of embodiment 8. 10. The robot is configured to remove, replace, or install components of an electrical distribution system. The method of embodiment 9, 11. The robot includes a gripping tool for gripping the chassis. How to. 12. The method of embodiment 1, wherein the tank is mounted within a superstructure that contains a plurality of tanks. . 13. The method of embodiment 1, further comprising removing contaminants from the dielectric fluid. 14. The method of embodiment 1, further comprising removing gaseous contaminants. 15. The method further comprises providing power, a network connection, and process fluids to the tank. The method of embodiment 1. 16. The method of embodiment 1, wherein the tank comprises an opening at the top and a removable lid. 17. The tank has an internal volume of between about 100 cubic feet and about 300 cubic feet. The method of embodiment 1. 18. The method of embodiment 1, wherein the chassis does not include a heat sink or a fan. 19. The chassis includes a blade server, a processor, a power supply, or an interface card. 2. The method of embodiment 1, comprising: 20. The backplane supports connection to a 1G or 10G Ethernet interface. The interface card is a Cat6A or Cat7 compatible RJ45 interface for 20. The method of embodiment 19, wherein the semiconductor device is electrically connected to a power supply.

[0230] Vessel design and construction for immersion cooling 1. An apparatus comprising: a tank configured to hold a thermally conductive condensable dielectric fluid; A pressure controller that reduces or increases the internal pressure of the tank; a rack at least partially immersed in the dielectric fluid; a condenser for condensing the dielectric fluid in a gas phase; a robot configured to move a chassis within the rack; An apparatus comprising: 2. The apparatus includes a modular skid having a plurality of forklift tubes. , The device of embodiment 1. 3. The tank shall have at least 300 watts of power distributed across each square foot of space. 2. The apparatus of embodiment 1, having a computing power density of 1000 MHz. 4. The device of embodiment 1, wherein the exterior of the device includes a power input and a communications input. 5. The power input and the communication input are electrically connected to a box; The box is configured to connect the power input unit and the communication input unit to the rack using a plurality of wirings. 5. The apparatus of embodiment 4, 6. The rack includes a backplane configured to distribute power and communication signals to the chassis. 6. The apparatus of embodiment 5, comprising a plain receiver. 7. The chassis comprises: receiving the power and the communication signals from the backplane receiver of the rack; Distributing said power and said communication signals to computer components within said chassis 7. The apparatus of embodiment 6, comprising a backplane configured to: 8. The apparatus of embodiment 5, wherein the plurality of wires does not include plastic insulation. 9. The apparatus of embodiment 5, wherein the rack includes a transformer. 10. The device of embodiment 1, wherein the device is stackable. 11. The apparatus of embodiment 1, wherein the apparatus comprises a magazine for storing replacement components. 12. The robot removes the chassis from the rack and places the chassis in the magazine. 12. The apparatus of embodiment 11, configured to be placed in 13. The magazine is positioned on a platform including a rotating member, a support member, and a rail. The device of embodiment 12. 14. The platform is configured to guide the magazine out of the device. The device of embodiment 13. 15. The device includes a desiccant configured to remove water vapor contaminants from the device. , The device of embodiment 1. 16. A reservoir area; A pump, Filters and and a pump for pumping the dielectric fluid into the tank portion before the pump pumps the dielectric fluid into the tank portion. The dielectric fluid is removed from the reservoir area and passed through the filter. The device of embodiment 1, 17. The apparatus of embodiment 1, wherein the dielectric fluid has a boiling point within the range of 20°C to 100°C. . 18. The dielectric fluid is (CF3)2CFCF2OCH3, C4F9OCH3 or Chemicals with the formula CF3CF2CF2CF2OCH3, hydrofluoroethers, or methacrylates 2. The device of embodiment 1, comprising toxy-nonafluorobutane. 19. The device will operate if any of the lids or doors of the device are not secured. 2. The apparatus of embodiment 1, further comprising a lock to prevent 20. A system that shuts down power to the device in the event of unauthorized access to the lid or door. 20. The apparatus of embodiment 19, further comprising a controller configured to:

[0231] Robotics and Automation for Immersion Cooling 1. An apparatus comprising: a tank configured to hold a thermally conductive condensable dielectric fluid; A pressure controller that reduces or increases the internal pressure of the tank; a computer component at least partially immersed in the dielectric fluid; a condenser for condensing the dielectric fluid in a gas phase; a robot configured to retrieve the computer component; An apparatus comprising: 2. The apparatus of embodiment 1, further comprising an airlock. 3. The apparatus of embodiment 2, wherein the airlock comprises an inner door and an outer door. 4. The airlock is adapted to purify the dielectric fluid in the gas phase before the outer door is opened. 4. The apparatus of embodiment 3, configured to receive an inert gas to be sprayed. 5. The apparatus of embodiment 3, wherein the robot is located outside the tank. 6. The apparatus of embodiment 3, wherein the robot is located within the tank. 7. The robot removes the computer component from the rack and 7. The apparatus of embodiment 6, configured to transport a component to the airlock. 8. The robot further comprises: Opening the inner door of the airlock; placing said computer components in said airlock; closing the inner door of the airlock; Equalizing the pressure in the airlock to atmospheric pressure; Opening the outer door of the airlock The device of embodiment 7, configured as follows. 9. The apparatus of embodiment 8, further comprising a second robot located outside the tank. 10. The second robot detects the computer component when the outer door is opened. 10. The apparatus of embodiment 9, configured to remove from the airlock. 11. The second robot is adapted to place the computer component into a storage slot. The device of embodiment 9, configured as follows. 12. The airlock is adapted to equalize the pressure in the airlock after the outer door is closed. 10. The apparatus of embodiment 9, configured to: 13. The device is configured to receive instructions from a server located external to the device. , The device of embodiment 1. 14. An embodiment in which the computer component is located within a chassis that exhibits an asset tag. State 1 device. 15. The robot scans the asset tag and stores the asset tag in a management system. 15. The apparatus of embodiment 14, configured to relay to. 16. The robot is configured to remove, replace, or install the computer component. 2. The apparatus of embodiment 1, wherein the apparatus is a gantry robot. 17. An embodiment in which the gantry robot is configured to move horizontally and vertically. 8 devices. 18. The robot is configured to remove, replace, or install components of an electrical distribution system. The device of embodiment 1. 19. The apparatus of embodiment 18, wherein the component of the power distribution system is a transformer or a power supply. Place. 20. The robot includes a grasping tool for grasping the computer component. The device of embodiment 1.

[0232] Ballast blocks for immersion cooling 1. An apparatus comprising: A tank, A reservoir portion for holding a thermally conductive condensable dielectric fluid and computer components. and, a shelf portion configured to hold at least one ballast block; A tank comprising: A pressure controller that reduces or increases the internal pressure of the tank; a condenser for condensing the dielectric fluid in a gas phase; a robot configured to retrieve the computer component; An apparatus comprising: 2. The device of embodiment 1, wherein the bottom point of the tank portion has a height that is lower than the height of the shelf portion. Place. 3. The bath portion is configured such that the computer components are at least partially immersed in the dielectric fluid. The device of embodiment 1, configured to be immersed. 4. The computer component is a blade server, a processor, a power supply, or a transformer. The device of embodiment 3. 5. The height of the dielectric fluid is sufficient to cover at least a portion of the shelf portion. The device of embodiment 1. 6. The apparatus of embodiment 1, wherein the shelf portion is adjacent to the condenser. 7. The embodiment, wherein the shelf portion is configured to receive condensed dielectric fluid from the condenser. The apparatus of embodiment 6. 8. The ballast block displaces the dielectric fluid from the shelf to an area above the tank portion. 2. The apparatus of embodiment 1, configured to occupy a volume of the tank on the shelf so as to 9. The ballast block is configured so that the dielectric fluid flows under the ballast block. 2. The apparatus of embodiment 1, comprising a plurality of riser feet for enabling 10. The device of embodiment 1, wherein the ballast block is not soluble in the dielectric fluid. Place. 11. The ballast block is made of metal, rubber, silicone or polymer. State 1 device. 12. The apparatus of embodiment 1, wherein the ballast block is denser than the dielectric fluid. . 13. The ballast block has a handle for removing or replacing the ballast block. 2. The device of embodiment 1, having a notch or plate. 14. The robot uses the handle, the notch, or the plate to adjust the balance. 14. The apparatus of embodiment 13, configured to lift the lift block. 15. The ballast block is not supported by other ballast from the top or bottom side of the ballast block. 2. The apparatus of embodiment 1, configured to interlock with a block. 16. The interlock prevents the other ballast block from sliding. , The device of embodiment 15. 17. The other ballast block is located on the upper side or the bottom side of the ballast block. 16. The apparatus of embodiment 15, configured to be present. 18. The ballast block has a recess on the upper side thereof, thereby The riser feet of the other ballast block are in the recess of the ballast block. 16. The device of embodiment 15, configured to lock together. 19. The ballast block is configured to extend over at least 40% of the total length of the shelf portion. The device of embodiment 1, 20. The ballast block is approximately 2 feet long, 8 inches wide, and 1 inch high. 2. The device of embodiment 1, having an exterior dimension.

[0233] Server case for immersion cooling 1. An apparatus comprising: a tank configured to hold a thermally conductive condensable dielectric fluid; A pressure controller that reduces or increases the internal pressure of the tank; a chassis at least partially immersed in the dielectric fluid; a condenser for condensing the dielectric fluid in a gas phase; a robot configured to retrieve the chassis; An apparatus comprising: 2. The apparatus of embodiment 1, wherein the chassis does not require a heat sink and a fan. 3. The apparatus of embodiment 1, wherein the chassis includes a blade server. 4. The chassis includes a processor, a power supply, or an interface card. Equipment. 5. The interface card is a 1G or 10G Ethernet interface Embodiment 4, which is a Cat6A or Cat7 compatible RJ45 interface for connection. Equipment. 6. The apparatus of embodiment 1, wherein the chassis is removably mounted to a rack. 7. The chassis has a slot-in type interface between the chassis and the rack. 7. The apparatus of embodiment 6, comprising a backplane provided. 8. The backplane distributes the power and signals received from the rack within the chassis. 8. The apparatus of embodiment 7, configured to distribute 9. The backplane transmits power and data to the blade servers via cables. The apparatus of embodiment 8, configured to: 10. The chassis is a substantially rectangular box having a back wall and two side walls,

[0023] In one embodiment, a face wall has a plurality of holes to facilitate circulation of the dielectric fluid within the chassis. 1 device. 11. The chassis of embodiment 10, further comprising a guide rail on each of the two side walls. Device. 12. The chassis has a mounting interface for holding computer components. The device of embodiment 1, comprising: 13. The chassis includes a plane, and the robot uses the plate to move the chassis. The apparatus of embodiment 1, configured to lift the shi. 14. The apparatus of embodiment 1, wherein the chassis includes a microcontroller. 15. The microcontroller comprises: A sensor mounted on the chassis determines whether the chassis is properly positioned in the rack. receiving sensor data indicating whether Transmitting the sensor data to a management system The device of embodiment 14, configured as follows. 16. The microcontroller comprises: Receives a power signal from the management system; Sending the power signal to a switch configured to interrupt the power in the chassis. do The device of embodiment 14, configured as follows. 17. The microcontroller comprises: receiving operational data from a computer component mounted within the chassis; Transmitting the operational data to the management system. The device of embodiment 14, configured as follows. 18. The microcontroller controls the electrical and communication equipment of the blade server. The apparatus of embodiment 14, configured as follows: 19. The apparatus of embodiment 1, wherein the chassis comprises an RFID tag. 20. The robot scans the RFID tag and transmits a signal to a management system. The device of embodiment 19, configured as follows.

[0234] Vapor management for immersion cooling using bellows 1. An apparatus comprising: A thermally conductive condensable dielectric fluid and a computer component are configured to hold the thermally conductive condensable dielectric fluid and the computer component. The tank and A pressure controller that reduces or increases the internal pressure of the tank; a vapor management system for condensing the dielectric fluid in a vapor phase; a robot configured to retrieve the computer component; An apparatus comprising: 2. The apparatus of embodiment 1, wherein the vapor management system includes a condensation structure within the tank. 3. The condensation structure according to embodiment 2, comprising a heat-conducting tube, a coil and a heat-dissipating fin. Device. 4. The condensation structure is connected to a source of cooling liquid so that the cooling liquid passes through the condensation structure. 3. The apparatus of embodiment 2, configured to be coupled to 5. The apparatus is configured to cool the cooling liquid using an evaporative or dry cooling tower. The device of embodiment 2. 6. The apparatus of embodiment 2, wherein the vapor management system includes an intake pipe and an exhaust pipe. 7. The intake pipe receives cooling fluid from a chilled cooling fluid source and condenses the cooling fluid. 7. The apparatus of embodiment 6, configured to be guided to a structure. 8. The discharge pipe receives the cooling liquid from the condensation structure and delivers the cooling liquid to the cooled cooling 7. The apparatus of embodiment 6, configured to return the coolant to a coolant supply source. 9. The vapor management system includes a storage unit for storing the dielectric fluid. Form 1 device. 10. The vapor management system directs the dielectric fluid from the storage unit to the tank. 10. The apparatus of embodiment 9, configured to direct 11. The vapor management system includes a vapor storage unit for storage of the vapor of the dielectric fluid. 2. The apparatus of embodiment 1, comprising: 12. The apparatus of embodiment 11, wherein the vapor storage unit is a bellows. 13. The bellows expands or contracts to maintain the internal pressure of the tank. The apparatus of embodiment 12, configured as follows: 14. The device of embodiment 12, wherein the bellows comprises one or more pouches. 15. The vapor storage unit allows the introduction of air into the vapor management system. 12. The apparatus of embodiment 11, comprising a valve for reducing the temperature of said vapor of dielectric fluid. 16. The vapor storage unit comprises a carbon bed that separates the dielectric fluid vapor from the air. 16. The apparatus of embodiment 15, operably connected to 17. The carbon bed is heated to increase the temperature of the carbon bed. 17. The apparatus of embodiment 16, comprising a desorption heater configured to raise the temperature. 18. The apparatus of embodiment 1, wherein the vapor management system comprises a filter. 19. The device of embodiment 17, wherein the filter is configured to remove air and water vapor. Place. 20. The steam management system comprises: An inert gas storage unit is provided, During start-up or shut-down operations, the inert gas storage unit may leak into the tank. 2. The apparatus of embodiment 1, configured to input an active gas.

Claims

1. 1. A cooling system for a computing component, comprising: A pressure controlled vessel, comprising: a pressure control means for reducing the internal pressure of the pressure controlled vessel to less than atmospheric pressure; and configured to hold a thermally conductive, condensable dielectric fluid in liquid and gas phases. A pressure controlled vessel; one or more computer components, the one or more computer components being The thermally conductive, condensable dielectric fluid is at least partially immersed in a volume of the thermally conductive, condensable dielectric fluid of the phase. one or more computer components being a processor or a network card, With a condenser for condensing the gas phase dielectric fluid into a liquid phase dielectric fluid; The cooling system comprising:

2. 10. The cooling system of claim 1, wherein the pressure controlled vessel is mounted within a host structure. 。

3. The cooling system of claim 1 further comprising a backplane system.

4. The one or more computer components may be configured to detect a significant disturbance in the internal pressure of the pressure controlled vessel.

13. The cooling system of claim 1, wherein the cooling system is swappable to a

5. a robot arm and an airlock, the airlock being disposed within the pressure controlled vessel; To allow access to the interior of the pressure-controlled vessel without significantly disturbing the pressure in the The cooling system of claim 1 , wherein the cooling system is configured as follows:

6. a purge system, the purge system configured to purge the volume of thermally conductive dielectric The cooling system of claim 1 configured to remove contaminants from a refrigerant fluid.

7. The purge system condenses at least a portion of the gaseous dielectric fluid and removes gaseous contaminants. The cooling system of claim 6 , configured to discard

8. The pressure controlled vessel is operably connected to a power source, a water source, and a network connection. The cooling system of claim 1 .

9. 10. The cooling system of claim 1, wherein the pressure controlled vessel comprises an opening at the top and a removable lid. Cooling system.

10. One or more of the lids direct the thermally conductive dielectric fluid in a gas phase to the sides of the pressure-controlled vessel. The cooling system of claim 9 , configured to direct the airflow in a direction parallel to the axis of the cooling axis.

11. The pressure controlled vessel has an internal volume of between about 100 cubic feet and about 300 cubic feet. The cooling system of claim 1 .

12. The pressure control vessel contains a dielectric fluid volume ratio of between about 1:3 and about 1:8 of gas. The cooling system of claim 1 comprising a volume of liquid dielectric fluid.

13. The cooling system of claim 1 further comprising a ballast block.

14. 1. A cooling system for a computing component, comprising:

1. A pressure controlled vessel comprising: a pressure controller for reducing the internal pressure of the pressure control vessel to less than atmospheric pressure; A volume of a thermally conductive, condensable, dielectric fluid in the liquid and gas phases. A pressure control vessel comprising: a condenser for condensing the gas phase dielectric fluid into a liquid phase dielectric fluid; a structure for housing the pressure control vessel; A power distribution system, comprising: a power distribution system for converting AC power to DC power; the power distribution system being at least partially immersed in a dielectric fluid of an uninterruptible power supply operably connected to the power distribution system; The cooling system comprising:

15. The power distribution system converts AC power above 400 volts to DC power below 50 volts. The system of claim 14 .

16. The power distribution system converts approximately 415 volts AC power to approximately 48 volts DC power. The system of claim 14.

17. The power distribution system converts approximately 415 volts AC power to approximately 3.5 volts DC power. The system of claim 14 .

18. The system of claim 14 further comprising a graphics processor unit.

19. a power distribution system configured to operatively connect to the power distribution system and to control operation of the pressure controlled vessel; The system of claim 14 , further comprising a processor configured to control.

20. The processor is adapted to at least partially immerse the thermally conductive dielectric fluid in the volume of the liquid phase. The system of claim 19 , wherein the system is immersed in

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