Induction heating cooker

Abstract

To obtain an induction heating cooker that allows greater flexibility in the installation of sensors.SOLUTION: An induction heating cooker has an induction heating coil substrate with an induction heating coil with conductors wound on an insulating substrate, and a sensor installed on the induction heating coil substrate at a position that does not contact the conductors of the induction heating coil.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present technology relates to an induction heating cooker that performs cooking by induction heating a cooking vessel or the like placed on a top plate, and in particular to the installation of a sensor that detects physical quantities such as temperature. [Background technology]

[0002] An induction heating cooker, which is a type of heating device, supplies a high-frequency current to an induction heating coil wound in a flat shape. In an induction heating cooker, an eddy current is generated in a metal cooking utensil by a high-frequency magnetic field generated in the induction heating coil by electromagnetic induction, and the cooking utensil itself is heated by Joule heat generated by the eddy current, thereby heating the food to be cooked. The induction heating coil is made by winding a Litz wire in a spiral shape and bonding it to an insulating plate (see, for example, Patent Document 1). This requires many manufacturing steps, such as bonding the induction heating coil, and strict temperature control is required. Therefore, an induction heating coil formed by winding a copper thin film wire around an insulating layer has been proposed (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2015 / 029441 [Patent Document 2] JP 2022-043697 A Summary of the Invention [Problem to be solved by the invention]

[0004] An induction cooking appliance has various sensors for detecting physical quantities, such as a temperature sensor for detecting the temperature of a cooking container and an object to be heated that are placed on a top plate. Here, the sensors of an induction cooking appliance should be installed in positions where they can perform detection as accurately as possible.

[0005] However, as in Patent Document 1, if a sensor is to be installed between induction heating coils in which Litz wire is wound in a spiral shape, the structure for mounting the sensor becomes complicated. This requires time for processing and assembling the parts. In addition, the position where the sensor is installed is restricted by the coil shape of the induction heating coil, but it is difficult to change the shape of the induction heating coil. This makes it difficult to install the sensor in a position where it can detect accurate physical quantities.

[0006] Therefore, an object of the present invention is to provide an induction heating cooker in which a sensor can detect a physical quantity more accurately. [Means for solving the problem]

[0007] The disclosed induction heating cooker comprises an induction heating coil substrate having an induction heating coil in which a conductor is wound on an insulating substrate, and a sensor installed on the induction heating coil substrate in a position not in contact with the conductor of the induction heating coil. Effect of the Invention

[0008] According to the induction heating cooker of the present disclosure, a sensor is installed on the surface of the induction heating coil substrate so as not to come into contact with the conductive induction heating coil. Since the induction heating coil can be configured to match the position of the sensor so as not to come into contact with the sensor, the sensor can be installed in a position where detection can be performed more accurately. [Brief description of the drawings]

[0009] [Figure 1] 1 is a perspective view of an induction heating cooker according to a first embodiment. [Diagram 2] FIG. 2 is a diagram illustrating a configuration inside a main body case 1 of the induction heating cooker according to the first embodiment. [Diagram 3] FIG. 2 is a schematic diagram showing an internal configuration of the induction heating cooker according to the first embodiment. [Figure 4] FIG. 1 is a diagram illustrating a configuration of an induction heating unit 100 in an induction heating cooker according to a first embodiment. [Diagram 5] 1 is a perspective view of an induction heating unit 100 according to a first embodiment, as viewed from the front. [Figure 6] 1 is a diagram showing the positional relationship between an induction heating unit 100 and a top plate 10 according to the first embodiment. [Figure 7] FIG. 2 is a diagram illustrating the configuration of an induction heating coil substrate 110 according to the first embodiment. [Figure 8] FIG. 2 is a diagram showing an induction heating coil substrate 110 according to the first embodiment as viewed from the front side. [Figure 9] FIG. 2 is a diagram for explaining the wiring relationship on the front and back surfaces of the induction heating coil substrate 110 according to the first embodiment. [Figure 10] 1 is a perspective view of an induction heating unit 100 according to embodiment 1, as viewed from the rear side. [Figure 11] FIG. 11 is a diagram showing an induction heating coil substrate 110 according to a second embodiment as viewed from the front side. [Figure 12] FIG. 11 is a diagram showing an induction heating unit 100 according to embodiment 3 as viewed from the front. [Figure 13] FIG. 11 is a diagram illustrating the configuration of an induction heating coil substrate 110 according to a fourth embodiment. [Figure 14] FIG. 11 is a diagram showing an induction heating coil substrate 110 according to embodiment 5 as viewed from the front side. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an induction heating cooker in an embodiment will be described with reference to the drawings. Here, the present disclosure is not limited to the embodiment described below. In addition, the size relationship of each component in the following drawings, including FIG. 1, may differ from the actual one. Furthermore, in the following description, terms indicating directions are used as appropriate to facilitate understanding, but these terms are for the purpose of explanation and do not limit the present disclosure. Examples of terms indicating directions include "up", "down", "right", "left", "front" and "rear". And, the induction heating cooker includes a composite heating cooker having multiple types of heating means.

[0011] Embodiment 1 Fig. 1 is a perspective view of an induction heating cooker according to the first embodiment. As shown in Fig. 1, the induction heating cooker according to the first embodiment is a cooking cooker that uses electromagnetic induction to heat a cooking container and an object to be heated (food to be cooked), which are heating targets. A main body case 1 of the induction heating cooker houses an appliance that performs cooking. Here, with regard to the installed induction heating cooker, particularly in plate-like members such as various boards described below, the surface facing upward is the front surface, and the surface opposite the front surface is the back surface.

[0012] A top plate 10 serving as a baking tray is placed on top of the main body case 1, and a metal cooking container containing an object to be heated is placed on it. The top plate 10 is made of, for example, crystallized glass that transmits infrared rays. The top plate 10 in the first embodiment corresponds to an induction heating unit 100 described below, and has two heating areas 11 that are regions where the cooking container and the object to be heated (hereinafter, these are referred to as the object to be heated) placed on the surface of the top plate 10 can be induction heated. The boundaries of the heating areas 11 that can be heated are indicated to the user by a circular pattern printed on the top plate 10.

[0013] The induction heating cooker in the first embodiment also has an operation display panel 30 on the upper front surface for operating and displaying various cooking condition settings and warning and abnormality information. Furthermore, the induction heating cooker in the first embodiment has a grill cooker 20 on the lower left side when viewed from the front. The grill cooker 20 is installed on the left side of the front surface of the induction heating cooker, and has a grill door 21 for opening and closing a grill chamber (not shown).

[0014] FIG. 2 is a diagram for explaining the configuration inside the main body case 1 of the induction heating cooker of the first embodiment. In FIG. 2, the top plate 10 is removed. The main body case 1 of the induction heating cooker has an air intake port 40 at the rear for taking in air from the outside to be sent to the grill chamber of the grill cooker 20. The main body case 1 also has an exhaust port 41 for discharging smoke generated from the heated object in the grill chamber together with the air. When a fan (not shown) installed in the main body case 1 is driven, the air taken in from the air intake port 40 into the main body case 1 passes through the fan and is discharged from the exhaust port 41. Here, a part of the air taken in from the air intake port 40 is also used to cool the induction heating unit 100 described later.

[0015] Moreover, the induction heating cooker in the first embodiment has two induction heating units 100. The induction heating unit 100 has an induction heating coil 112 described later, and induction heats an object to be heated placed on the heating area 11 of the top plate 10. The induction heating unit 100 will be described later. Here, the number of induction heating units 100 included in the induction heating cooker is not limited to two.

[0016] Fig. 3 is a schematic diagram showing the internal configuration of the induction heating cooker according to the first embodiment. Fig. 3 shows the internal configuration of the induction heating cooker as seen from the right side. The operation board 31 performs display on the operation display panel 30 and processes instructions entered by operation. A control box 50 is also installed inside the main body case 1. The control box 50 houses a filter board 51, an inverter board 52, a control device, and the like. These boards have components such as semiconductor integrated circuits, resistors, capacitors, and transistors fixed thereto, and have circuits formed by wiring between the components with copper foil.

[0017] The filter board 51 is an insulating board having a filter circuit. The filter circuit converts AC power supplied from a commercial power source (not shown) via a power cord 56 into DC power and rectifies it. The inverter board 52 is an insulating power control board having an inverter circuit. The inverter circuit converts the DC power converted in the filter board 51 into AC power of a predetermined frequency based on the control of the control device, and supplies it to the induction heating unit 100 via the lead wire 60 and the terminal block 170. The lead wire 60 is a wire in which a twisted wire is insulated. The terminal block 170 will be described later. The switching element 53 and the heat sink 54 are installed on the upper side of the inverter board 52. The switching element 53 is a part of the inverter circuit and is a power control element that performs DC-AC conversion by switching operation. Here, the switching element 53 is, for example, an IGBT (insulated gate bipolar transistor) capable of high-speed switching operation. Furthermore, the aluminum heat sink 54 dissipates heat generated by, for example, the switching operation of the switching element 53. The control device performs heating control in the induction heating cooker. Furthermore, as will be described later, an electrical signal from the sensor 180 is input to the control device via the sensor terminal 190 and the sensor lead wire 63.

[0018] The induction heating unit 100 described above is supported from the back side by a spring 131, which is an elastic body, and is pressed against the back side of the top plate 10 by the elastic force of the spring 131, and is fixed in place. As will be described later, the induction heating coil substrate 110 on which the induction heating coil 112 is formed is fixed at a position with a certain distance therebetween by a spacer 160. This makes it possible to prevent damage caused by contact between the induction heating coil substrate 110 and the top plate 10.

[0019] Fig. 4 is a diagram illustrating the configuration of the induction heating unit 100 in the induction heating cooker according to embodiment 1. Fig. 4 is an exploded view of the induction heating unit 100. The induction heating unit 100 in embodiment 1 has an induction heating coil substrate 110, ferrite 120, a holding member 130, a magnetic shielding member 140, a fixing screw 150, and a spacer 160.

[0020] The induction heating coil substrate 110 has an induction heating coil 112 and a coil connection portion 113. The substrate made of an insulating material is a printed circuit board on which the induction heating coil 112 is formed, and is a heat-resistant substrate because it receives radiant heat from the object to be heated. The induction heating coil 112 generates a magnetic field based on the power supplied from the inverter substrate 52 via the coil connection portion 113 and the lead wire 60, and forms an eddy current by electromagnetic induction. The induction heating coil 112 and the coil connection portion 113 in the first embodiment are formed on the printed circuit board by a thin film conductor such as copper foil. Therefore, no jig for winding copper wire is required in the manufacturing process, and the coil shape that can be manufactured has a high degree of freedom. Here, the coil connection portion 113 in the first embodiment has a plurality of coil connection portions 113 (an outer end coil connection portion 113A and an inner end coil connection portion 113B). The coil connection portion 113 becomes a pad for wiring connection. And, each coil connection portion 113 is formed at the same position on the front and back surfaces of the printed circuit board. As described later, a terminal block 170 serving as a connection part for connecting a lead wire 60 is mounted on the coil connection portion 113. Here, the induction heating coil 112 and the like may be protected by applying a solder resist to the induction heating coil substrate 110. The induction heating coil substrate 110 will be described in detail later.

[0021] The ferrite 120 is a magnetic material that guides the magnetic flux generated by the magnetism in the induction heating coil 112 to the object to be heated located above the induction heating unit 100 via the top plate 10, and suppresses magnetic flux leakage downward from the induction heating coil 112. The ferrite 120 suppresses magnetic flux leakage, thereby preventing the control device in the control box 50 from malfunctioning due to magnetism. The holding member 130 is a member that holds the ferrite 120 by sandwiching it between the induction heating coil board 110 and the holding member 130. The holding member 130 is fixed to the induction heating coil board 110 by a fixing screw 150, and suppresses warping of the induction heating coil board 110 due to heat. The holding member 130 has a coil connection through hole 132 and a sensor terminal through hole 133, as described below.

[0022] 5 is a perspective view of the induction heating unit 100 according to the first embodiment, seen from the front. The magnetic shielding member 140 is a plate-shaped member made of a non-magnetic metal that prevents the magnetism generated in the induction heating coil 112 from leaking outside the heating area 11. For this reason, the magnetic shielding member 140 covers the outer periphery of the induction heating unit 100, leaving the induction heating coil 112 exposed. In addition, the magnetic shielding member 140 sandwiches the holding member 130 and the induction heating coil substrate 110, suppressing warping of the induction heating coil substrate 110. Here, the magnetic shielding member 140 is not a member that necessarily needs to be attached.

[0023] The fixing screws 150 fix the induction heating coil substrate 110, the holding member 130, and the magnetic shielding member 140. By fixing the induction heating coil substrate 110, the holding member 130, and the magnetic shielding member 140 by fastening with the fixing screws 150, an adhesive for fixing the induction heating coil substrate 110 is not required when manufacturing the induction heating unit 100, and assembly can be easily performed.

[0024] FIG. 6 is a diagram showing the arrangement relationship between the induction heating unit 100 and the top plate 10 according to the first embodiment. The spacer 160 is an elastic member such as rubber that keeps the distance between the induction heating coil substrate 110 and the top plate 10 constant. Although not particularly limited, the distance between the induction heating coil substrate 110 and the top plate 10 is, for example, about 3 mm to about 4 mm. By not contacting the induction heating coil substrate 110 and the top plate 10 but leaving a certain distance between them, for example, a space is secured for a sensor 180 to be described later to be installed on the surface of the induction heating coil substrate 110. In addition, by providing a gap between the induction heating coil substrate 110 and the top plate 10, the influence of heat from the heated object on the induction heating coil 112 can be suppressed. Furthermore, the air flowing in from the air inlet 40 passes over the induction heating coil 112, thereby cooling the induction heating coil 112. The spacer 160 can stabilize the distance between the sensor 180 installed on the induction heating coil substrate 110 and the top plate 10, thereby improving the accuracy of temperature detection.

[0025] In the induction heating coil board 110 of the first embodiment, the terminal block 170 is mounted on the coil connection part 113 on the back surface side of the induction heating coil board 110, and electrically connects the lead wire 60 to the terminal block 170. The coil connection part 113 and the terminal block 170 are fixed by soldering.

[0026] FIG. 7 is a diagram for explaining the configuration of the induction heating coil substrate 110 according to the first embodiment. FIG. 7 shows a surface of the induction heating coil substrate 110 cut along the line BB in FIG. 8 described later. The sensor 180 is a means for detecting a physical quantity. The sensor 180 converts the detected physical quantity into an electrical signal based on the physical quantity. Here, the sensor 180 in the first embodiment is a temperature sensor that detects the temperature of the object to be heated. The sensor 180 is attached to the surface of the induction heating coil substrate 110. The sensor 180 in the first embodiment is a thermistor that contacts the back surface of the top plate 10 and detects the temperature through the top plate 10. However, the present invention is not limited to this, and the sensor 180 may be an infrared temperature sensor that detects the temperature without contact.

[0027] In the first embodiment, the sensor 180 on the front surface of the induction heating coil substrate 110 and the sensor connection portion 117 formed on the rear surface of the induction heating coil substrate 110 are electrically connected via the sensor vias 118 and the sensor connection pattern wires 119 made of thin-film conductors. Therefore, an electrical signal related to the physical quantity detected by the sensor 180 is sent to the sensor connection portion 117 via the sensor vias 118 and the sensor connection pattern wires 119 made of thin-film conductors. The electrical signal is further sent to the control device via the sensor lead wires 63 connected to a sensor terminal 190 installed on the sensor connection portion 117. The sensor terminal 190 is not particularly limited, but may be, for example, a connector or a socket. The sensor connection portion 117 and the sensor terminal 190 are fixed by soldering.

[0028] 8 is a view of the induction heating coil substrate 110 according to the first embodiment as viewed from the front. As described above, the induction heating coil substrate 110 has the induction heating coil 112 and the coil connection part 113. The induction heating coil 112 is a thin film conductor formed by winding from the inside to the outside, with the start of the coil winding being located at a position that is approximately the center of the induction heating coil substrate 110. The part that becomes the outer end, which is the end of the winding of the induction heating coil 112, is electrically connected to the outer end coil connection part 113A. In addition, a coil via 115 is provided at the start of the coil winding.

[0029] FIG. 9 is a diagram for explaining the wiring relationship on the front and back surfaces of the induction heating coil substrate 110 according to the first embodiment. In FIG. 9, the wiring pattern on the front surface is drawn with dotted lines, and the wiring pattern on the back surface is drawn with solid lines. In the induction heating coil substrate 110 according to the first embodiment, the part that becomes the inner end, which is the start of winding of the induction heating coil 112, is electrically connected to the inner end coil connection part 113B on the back surface. Here, the inner end coil connection part 113B is disposed on the outer periphery side of the induction heating coil substrate 110. Therefore, in the first embodiment, the inner end of the induction heating coil 112 on the front surface of the induction heating coil substrate 110 and the inner end coil connection part 113B on the back surface are electrically connected via the coil via 115 and the coil connection pattern line 116 of a thin film conductor formed on the back surface of the induction heating coil substrate 110. The coil connection part 113 is located on the outer periphery side of the induction heating coil 112, and the outer end coil connection part 113A and the inner end coil connection part 113B are disposed side by side along the same side. By arranging the outer end coil connection portion 113A and the inner end coil connection portion 113B side by side, the work of connecting the lead wire 60 can be performed efficiently.

[0030] As described above, the sensor 180 on the front surface of the induction heating coil substrate 110 and the sensor connection portion 117 formed on the back surface of the induction heating coil substrate 110 are electrically connected via the sensor vias 118 and the sensor connection pattern wire 119 made of a thin-film conductor. A sensor terminal 190 is provided on the sensor connection portion 117. The sensor connection portion 117 is located on the back surface of the induction heating coil substrate 110, closer to the outer periphery than the induction heating coil 112, which facilitates the task of connecting the sensor lead wire 63 to the sensor connection portion 117.

[0031] 10 is a perspective view of the induction heating unit 100 according to embodiment 1 as viewed from the back side. The holding member 130 has a coil connection portion through hole 132 corresponding to the terminal block 170. The holding member 130 also has a sensor terminal through hole 133 corresponding to the sensor terminal 190. Therefore, the terminal block 170 and the sensor terminal 190 can be exposed at the bottom of the induction heating unit 100.

[0032] As described above, according to the induction heating cooker of the first embodiment, the sensor 180 is installed on the surface of the induction heating coil substrate 110 so as not to come into contact with the induction heating coil 112 made of a thin film conductor. In the induction heating cooker of the first embodiment, the induction heating coil 112 is made of a thin film conductor, which increases the degree of freedom in winding. Therefore, after positioning the sensor 180, the induction heating coil 112 can be configured so as not to come into contact with the sensor 180, which increases the degree of freedom in the installation position of the sensor 180.

[0033] In the induction heating cooker in the first embodiment, the sensor connection part 117 is provided on a surface other than the surface of the induction heating coil substrate 110. Therefore, the influence of heat from the object to be heated is suppressed in the sensor connection part 117. Also, the induction heating cooker can be easily assembled. At this time, by disposing the sensor connection part 117 on the outer periphery side of the induction heating coil substrate 110, the sensor lead wire 63 can be easily attached and routed. By connecting the sensor connection part 117 and the sensor via 118 with the sensor connection pattern wire 119, production efficiency can be improved and costs can be reduced.

[0034] In addition, in the first embodiment, sensor 180 is a temperature sensor that is installed to avoid the thin-film conductor of induction heating coil 112, and therefore can detect the temperature at a position closer to the object to be heated. If sensor 180 is a thermistor, it can come into contact with the object to be heated at a position closer to the object on top plate 10 on which the object to be heated is placed, and can detect the temperature more accurately. If sensor 180 is an infrared sensor, it can detect the temperature without contact.

[0035] Embodiment 2 FIG. 11 is a view of the induction heating coil substrate 110 according to the second embodiment as viewed from the front. The induction heating coil 112 in the first embodiment is a coil formed by winding a thin-film conductor. In the induction heating unit 100 of the induction heating cooker in the second embodiment, a plurality of induction heating coils 112 made of thin-film conductors are arranged on the surface of the induction heating coil substrate 110. Then, a plurality of sensors 180 are arranged in positions corresponding to the induction heating coils 112 where the thin-film conductors that become the induction heating coils 112 are not attached. Therefore, the plurality of sensors 180 can detect the temperature corresponding to each induction heating coil 112, and the control device can perform control based on the detected temperature. This can improve the cooking performance of the induction heating cooker. In the second embodiment, a plurality of induction heating coils 112 are arranged on the surface of the induction heating coil substrate 110. By controlling each of them individually, heating control such as generating convection in the cooking vessel can be performed.

[0036] Embodiment 3 FIG. 12 is a view of the induction heating unit 100 according to the third embodiment as seen from the front. As shown in FIG. 12, the induction heating coil 112 is a coil in which a thin-film conductor is formed on a substrate. Therefore, the sensor 180 can be positioned, and the induction heating coil 112 can be formed while changing the shape so as to avoid the sensor 180. Therefore, the sensor 180 can be installed at a desired position on the induction heating coil substrate 110, and the degree of freedom of the installation position of the sensor 180 can be increased, and the degree of freedom of the shape of the induction heating coil 112 can be increased, and the density of the induction heating coil 112 can also be increased. Therefore, not only can the detection accuracy of the sensor 180 be increased, but also the efficiency of heating can be improved. In addition, the sensor 180 can be used for purposes other than detecting the temperature of the heated object, and can also be used to detect the atmospheric temperature around the induction heating coil 112, thereby improving safety.

[0037] Embodiment 4 Fig. 13 is a diagram illustrating the configuration of an induction heating coil substrate 110 according to embodiment 4. Fig. 13 shows a surface of the induction heating coil substrate 110 cut along line BB in Fig. 8 described in embodiment 1. In the above-described embodiment 1, a sensor connection portion 117 is provided on the back surface of the induction heating coil substrate 110, and sensor vias 118 and sensor terminals 190 are electrically connected by sensor connection pattern wires 119 and sensor connection portion 117 made of thin-film conductors.

[0038] However, this is not limited to this. For example, as shown in Fig. 13, the sensor connection part 117 may not be provided on the back surface of the induction heating coil substrate 110, and the sensor connection pattern line 119 and the sensor terminal 190 may be connected by a sensor lead wire 191. This allows the sensor terminal 190 to be installed in any position.

[0039] Embodiment 5. Fig. 14 is a view of induction heating coil substrate 110 according to embodiment 5 as viewed from the front. In induction heating coil substrate 110 in embodiment 1, magnetic shielding member 140 is attached to the upper side of induction heating coil substrate 110 so as to surround the outer periphery of induction heating coil 112. In the induction heating cooker in embodiment 5, as shown in Fig. 14, magnetic shielding pattern 141 made of a thin film conductor is formed on the surface of induction heating coil substrate 110 in embodiment 2 so as to surround the outer periphery of induction heating coil 112. For this reason, induction heating coil substrate 110 does not need to have magnetic shielding member 140.

[0040] Various aspects of the present disclosure are summarized below as appendices.

[0041] (Appendix 1) an induction heating coil substrate having an induction heating coil in which a conductor is wound on an insulating substrate; a sensor disposed on the induction heating coil substrate at a position not in contact with the conductor of the induction heating coil; An induction heating cooker comprising: (Appendix 2) A sensor connection unit electrically connects a control device that controls the device and the sensor, 2. The induction heating cooker according to claim 1, wherein the sensor connection portion is disposed on a surface of the induction heating coil substrate opposite to a surface on which the induction heating coil is provided. (Appendix 3) 3. The induction heating cooker according to claim 2, wherein the sensor connection portion is disposed on an outer circumferential side of the induction heating coil in the induction heating coil substrate. (Appendix 4) 4. The induction heating cooker according to claim 3, wherein the sensor and the sensor connection portion are connected by pattern wiring on the induction heating coil substrate. (Appendix 5) 5. The induction heating cooker according to any one of claims 1 to 4, wherein the sensor is a temperature sensor that detects the temperature of an object to be heated. (Appendix 6) 6. The induction heating cooker according to claim 5, wherein the sensor is a thermistor. (Appendix 7) 6. The induction heating cooker according to claim 5, wherein the sensor is an infrared sensor. (Appendix 8) 8. The induction heating cooker according to claim 1, wherein a plurality of the sensors are provided on the induction heating coil substrate. [Explanation of symbols]

[0042] 1 main body case, 10 top plate, 11 heating area, 20 grill cooking device, 21 grill door, 30 operation display panel, 31 operation board, 40 intake port, 41 exhaust port, 50 control box, 51 filter board, 52 inverter board, 53 switching element, 54 heat sink, 56 power cord, 60 lead wire, 63, 191 sensor lead wire, 100 induction heating unit, 110 induction heating coil board, 112 induction heating coil, 113 coil connection part, 113A outer end coil connection part, 113B inner end coil connection part, 115 coil via, 116 coil connection pattern wire, 117 sensor connection part, 118 sensor via, 119 sensor connection pattern wire, 120 ferrite, 130 holding member, 131 spring, 132 coil connection part through hole, 133 Sensor terminal through hole, 140 magnetic shielding material, 141 magnetic shielding pattern, 150 fixing screw, 160 spacer, 170 terminal block, 180 sensor, 190 sensor terminal.

Claims

1. an induction heating coil substrate having an induction heating coil in which a conductor is wound on an insulating substrate; a sensor disposed on the induction heating coil substrate at a position not in contact with the conductor of the induction heating coil; An induction heating cooker comprising:

2. A sensor connection unit electrically connects a control device that controls the device and the sensor, The induction heating cooker according to claim 1 , wherein the sensor connection portion is disposed on a surface of the induction heating coil board opposite to a surface on which the induction heating coil is disposed.

3. The induction heating cooker according to claim 2 , wherein the sensor connection portion is disposed on the induction heating coil substrate on an outer circumferential side relative to the induction heating coil.

4. The induction heating cooker according to claim 3 , wherein the sensor and the sensor connection portion are connected by a pattern wiring on the induction heating coil board.

5. The induction heating cooker according to any one of claims 1 to 4, wherein the sensor is a temperature sensor that detects the temperature of an object to be heated.

6. 6. The induction heating cooker according to claim 5, wherein the sensor is a thermistor.

7. 6. The induction heating cooker according to claim 5, wherein the sensor is an infrared sensor.

8. The induction heating cooker according to any one of claims 1 to 4, wherein a plurality of the sensors are provided on the induction heating coil substrate.

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