Grinding unit, grindstone unit, and mount
The innovative grinding unit and mount design with adjustable through holes enables a single wheel unit to simulate multiple sizes, simplifying inventory management and reducing resource complexity by allowing a single type to perform various grinding tasks.
Patent Information
- Application Number
- JP2023104018
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-26
- Publication Date
- 2025-01-15
AI Technical Summary
The management of multiple types of grinding wheels with varying sizes is complicated due to the need for inventorying different sizes to accommodate workpieces of different diameters, such as wafers ranging from 8 inches to 12 inches to 18 inches, which increases complexity and resource management.
A grinding unit and mount design that allows for a single type of grinding wheel unit to be configured with multiple through holes of different sizes, enabling the arrangement of grinding wheel units along annular regions of varying diameters, thereby simulating the functions of multiple grinding wheels.
This configuration simplifies inventory management by allowing a single type of grinding wheel unit to perform the functions of multiple sizes, reducing the need for multiple wheel types in stock and facilitating easy replacement and cost-effective operation.
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Figure 2025004370000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a grinding unit, a grindstone unit, and a mount used when grinding a workpiece. [Background technology]
[0002] In order to realize small and lightweight device chips, there are increasing opportunities to thin a disk-shaped wafer having a device such as an integrated circuit on the front side. For example, the front side of the wafer is held by a chuck table, and the chuck table and an annular grinding wheel to which a grinding wheel containing abrasive grains is fixed are rotated relative to each other, and the grinding wheel is pressed against the back side of the wafer while supplying a liquid such as pure water, thereby grinding the wafer to make it thinner.
[0003] The above-mentioned grinding wheel is generally attached to a disk-shaped mount fixed to the tip of a spindle, which serves as a rotation axis, by fasteners such as bolts (see, for example, Patent Document 1). Specifically, the mount is provided with a plurality of holes penetrating in the thickness direction, and the grinding wheel is attached to the mount by fastening fasteners to a plurality of fastening holes in the grinding wheel through each hole. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] JP 2006-224201 A Summary of the Invention [Problem to be solved by the invention]
[0005] Incidentally, when grinding a workpiece such as the above-mentioned wafer, a grinding wheel of a size appropriate for the size of the workpiece is used so that the workpiece is ground appropriately. That is, when the diameter of the workpiece becomes large, such as 8 inches, 12 inches, or 18 inches, the diameter of the grinding wheel also becomes large.
[0006] Therefore, for example, if it is planned to grind multiple types of workpieces of different sizes, it is necessary to prepare multiple types of grinding wheels in advance as inventory, which makes management of the wheels complicated.
[0007] SUMMARY OF THE PRESENT EMBODIMENT It is therefore an object of the present invention to provide a grinding unit, a grinding wheel unit, and a mount that are easy to manage in inventory. [Means for solving the problem]
[0008] According to one aspect of the present invention, there is provided a grinding unit used in grinding a workpiece, the grinding unit comprising: a mount fixed to a spindle having a plurality of through holes into which fasteners are inserted; and a plurality of grinding stone units attached to the mount, the grinding stone unit having a grinding stone base having a first surface through which fastening holes into which the fasteners are fastened are opened, a second surface opposite the first surface, a third surface configured to be able to come into surface contact with an adjacent grinding stone unit when the plurality of grinding stone units are arranged along an annular first region, and a fourth surface configured to be able to come into surface contact with an adjacent grinding stone unit when the plurality of grinding stone units are arranged along an annular second region of a different size from the first region; and a grinding stone fixed to the grinding stone base in a manner exposed on the second surface side of the grinding stone base.
[0009] Preferably, the plurality of through holes of the mount include a plurality of first through holes disposed along the first region and a plurality of second through holes disposed along the second region.
[0010] According to another aspect of the present invention, there is provided a grinding wheel unit for use in grinding a workpiece, the grinding wheel unit having a grinding wheel base having a first surface where a fastening hole into which a fastener is fastened is opened, a second surface opposite the first surface, a third surface configured to be able to make surface contact with an adjacent grinding wheel unit when a plurality of the grinding wheel units are arranged along a first annular region, and a fourth surface configured to be able to make surface contact with an adjacent grinding wheel unit when a plurality of the grinding wheel units are arranged along a second annular region of a different size from the first region, and a grinding wheel fixed to the grinding wheel base in a manner that is exposed on the second surface side of the grinding wheel base.
[0011] According to a further aspect of the present invention, there is provided a grinding unit for use in grinding a workpiece, comprising: a mount fixed to a spindle having a plurality of through holes into which fasteners are inserted; and a plurality of grinding wheel units attached to the mount, the grinding wheel unit having a grinding wheel base having a first surface through which fastening holes into which the fasteners are fastened are opened and a second surface opposite the first surface, and a grinding wheel fixed to the grinding wheel base in a manner exposed on the second surface side of the grinding wheel base, the plurality of through holes of the mount including a plurality of first through holes arranged along a first annular region and a plurality of second through holes arranged along a second annular region of a different size than the first region.
[0012] Preferably, the grinding stone base of the grinding stone unit further has a third surface configured to be able to make surface contact with an adjacent grinding stone unit when the plurality of grinding stone units are arranged along the first region, and a fourth surface configured to be able to make surface contact with an adjacent grinding stone unit when the plurality of grinding stone units are arranged along the second region.
[0013] According to yet another aspect of the present invention, there is provided a mount having a plurality of through holes into which fasteners are inserted, fixed to a spindle, and to which a plurality of grinding wheel units used in grinding a workpiece are attached by the plurality of fasteners, the plurality of through holes including a plurality of first through holes arranged along a first annular region and a plurality of second through holes arranged along a second annular region of a different size than the first region. Effect of the Invention
[0014] The grinding unit according to each aspect of the present invention is configured so that a plurality of grindstone units can be arranged at least along an annular first region or an annular second region having a size different from that of the first region, and therefore, by arranging a plurality of grindstone units along any one of the regions, it is possible to realize the functions of at least two types of grinding wheels having different sizes.
[0015] In other words, in the grinding unit according to each aspect of the present invention, the functions of multiple grinding wheels are realized by one type of grinding wheel unit, so if this one type of grinding wheel unit is kept in stock, there is no need to keep multiple types of grinding wheels in stock as in the past. Therefore, the grinding unit according to each aspect of the present invention makes it easy to manage inventory. [Brief description of the drawings]
[0016] [Figure 1] FIG. 1 is a perspective view that illustrates an example of a grinding device. [Diagram 2] FIG. 2 is a bottom view showing a schematic view of a mount constituting the grinding unit. [Diagram 3] FIG. 3 is a perspective view showing a schematic diagram of a grinding wheel unit attached to a mount. [Figure 4] FIG. 4 is a perspective view showing a schematic view of the grindstone unit as viewed from the opposite direction to that shown in FIG. [Diagram 5] FIG. 5 is a bottom view diagrammatically showing the first state of the grinding unit. [Figure 6]FIG. 6 is a bottom view diagrammatically showing the second state of the grinding unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0017] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing a schematic diagram of an example of a grinding device on which a grinding unit of the present embodiment is mounted. In Fig. 1, some elements constituting a grinding device 2 are expressed by functional blocks. In addition, the X-axis (or first horizontal axis), Y-axis (or second horizontal axis), and Z-axis (or vertical axis) used in the following description are perpendicular to each other.
[0018] 1, the grinding device 2 includes a base 4 that supports various elements that constitute the grinding device 2. A long recess 4a is formed on the top surface of the base 4 in a direction generally parallel to the X-axis. A ball screw type X-axis moving mechanism 6 is disposed within the recess 4a. The X-axis moving mechanism 6 includes a rotational drive source (not shown) such as a motor connected to the ball screw, and a moving table (not shown), and moves the moving table along the X-axis.
[0019] The upper part of the moving table is covered by a table cover 8. In addition, accordion-shaped dustproof and drip-proof covers 10 that can expand and contract in accordance with the movement of the moving table (table cover 8) are attached to the front and rear of the table cover 8. A chuck table 12 configured to hold a plate-shaped workpiece 11 is disposed above the moving table in a manner that it is partially exposed from the table cover 8.
[0020] The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon. That is, the workpiece 11 has a circular front surface 11a and a circular back surface 11b opposite the front surface 11a. The front surface 11a side of the workpiece 11 is divided into a plurality of small regions by a plurality of intersecting streets (planned division lines), and a device such as an integrated circuit (IC) is formed in each small region.
[0021] The grinding device 2 of this embodiment is used, for example, when grinding (grinding) the back surface 11b side of the workpiece 11. When grinding the back surface 11b side of the workpiece 11, a protective member, typified by a protective tape made of a material such as resin, may be attached to the front surface 11a side of the workpiece 11. By attaching the protective member to the front surface 11a side of the workpiece 11, the impact applied to the front surface 11a side during grinding of the back surface 11b side is mitigated, and devices of the workpiece 11 and the like are protected.
[0022] In addition, in this embodiment, a disk-shaped wafer made of a semiconductor material such as silicon is used as the workpiece 11, but the material, shape, structure, size, etc. of the workpiece 11 are not limited to this embodiment. For example, a substrate made of other materials such as semiconductors, ceramics, resins, metals, etc. may be used as the workpiece 11. Similarly, the type, number, shape, structure, size, arrangement, etc. of the devices are not limited to the above embodiment. The workpiece 11 does not need to have any devices formed thereon.
[0023] The chuck table 12 includes a disk-shaped (cylindrical) frame 14 made of, for example, ceramics or the like. A recess having a circular opening at its upper end is formed on the upper surface side of the frame 14. A holding plate 16 made of, for example, ceramics or the like and having a porous disk shape is fixed to this recess.
[0024] The upper surface (holding surface) 16a of the holding plate 16 is configured, for example, in a shape corresponding to the side surface of a cone, and functions as a holding surface for holding the workpiece 11. The difference in height (height difference) between the center of the upper surface 16a, which corresponds to the apex of the cone, and the outer circumferential edge of the upper surface 16a is about 10 μm to 30 μm.
[0025] The lower surface side of the holding plate 16 is connected to a suction source (not shown) via a flow path (not shown) provided inside the frame 14, a valve (not shown) arranged outside the frame 14, or the like. Therefore, when the suction source is operated and the valve is opened with the workpiece 11 (or a protective member) in contact with the upper surface 16a of the holding plate 16, a suction force acts on the workpiece 11 from the upper surface 16a, and the workpiece 11 is held by the chuck table 12. Note that, as the suction source, for example, a vacuum pump combining an air supply source and an ejector is used.
[0026] A rotation drive source (not shown) such as a motor is connected to the lower part of the frame 14. The chuck table 12 rotates by the power generated by this rotation drive source around a rotation axis parallel to the Z axis or a rotation axis slightly tilted with respect to the Z axis, so that the center of the upper surface 16a of the holding plate 16 becomes the center of rotation.
[0027] When the moving table is moved along the X-axis by the above-mentioned X-axis moving mechanism 6, the chuck table 12 also moves along the X-axis. Specifically, the X-axis moving mechanism 6 moves the chuck table 12, for example, between a forward load-unloading area where the workpiece 11 is loaded onto the chuck table 12 or unloaded from the chuck table 12, and a grinding area behind the load-unloading area.
[0028] A columnar support structure 18 is provided behind the grinding area (i.e., behind the X-axis moving mechanism 6). A Z-axis moving mechanism 20 is disposed on the front side of the support structure 18. The Z-axis moving mechanism 20 includes a pair of guide rails 22 that are long along the Z axis, and a moving plate 24 is attached to the pair of guide rails 22 in such a manner that it can slide along the Z axis.
[0029] A nut portion (not shown) constituting a ball screw is provided on the rear side of the moving plate 24, and a long screw shaft 26 is connected to this nut portion in a manner that allows it to rotate along the Z axis. A rotation drive source 28 such as a motor is connected to one end of the screw shaft 26. By rotating the screw shaft 26 by the rotation drive source 28, the moving plate 24 moves along the guide rail 22, i.e., along the Z axis.
[0030] A support 30 is provided on the front surface of the moving plate 24. A grinding unit 32 capable of grinding the workpiece 11 held by the chuck table 12 in the grinding area is supported on this support 30. The grinding unit 32 includes a spindle housing 34 fixed to the support 30. A spindle 36 having a rotation axis parallel to the Z axis or a rotation axis slightly inclined with respect to the Z axis is accommodated in the spindle housing 34 in a manner that the spindle 36 can rotate about its axis.
[0031] The lower end of the spindle 36 is exposed from the lower end surface of the spindle housing 34, and a plate-shaped mount 38 made of a metal such as stainless steel or aluminum is fixed to the lower end of the spindle 36. Figure 2 is a bottom view showing a schematic diagram of the mount 38 constituting the grinding unit 32.
[0032] 1 and 2, the mount 38 is configured in a disk shape having a circular upper surface (first surface) 38a and a circular lower surface (second surface) 38b opposite to the upper surface 38a. The lower end of the spindle 36 described above is fixed to the center of the upper surface 38a of the mount 38.
[0033] In the area of the mount 38 excluding the area where the spindle 36 is fixed, a plurality of through holes 38c are provided that penetrate the mount 38 in the thickness direction. That is, each through hole 38c penetrates the mount 38 from the upper surface 38a to the lower surface 38b. As shown in Fig. 1, each through hole 38c is configured to have a size and shape that allows a fastener 40 such as a screw or a bolt to be inserted from the upper surface 38a side.
[0034] 2, the through holes 38c include a plurality of first through holes 38d provided along a first annular region surrounding the center of the lower surface 38b, and a plurality of second through holes 38e provided along a second annular region surrounding the center of the lower surface 38b on the inner side of the first region. That is, the size of the first region where the first through holes 38d are arranged (the distance from the center of the lower surface 38b) is different from the size of the second region where the second through holes 38e are arranged (the distance from the center of the lower surface 38b). The first region and the second region are set concentrically.
[0035] In this embodiment, the two first through holes 38d in each set are arranged close to each other so that a plurality of sets of first through holes 38d, each of which is composed of two first through holes 38d, are realized. Similarly, in this embodiment, the two second through holes 38e in each set are arranged close to each other so that a plurality of sets of second through holes 38e, each of which is composed of two second through holes 38e, are realized.
[0036] The interval between the two first through holes 38d constituting the set of first through holes 38d is approximately equal to the interval between the two second through holes 38e constituting the set of second through holes 38e. In other words, the set of first through holes 38d and the set of second through holes 38e are configured so that a common object (component) can be fixed using a fastener 40. However, the form of the through holes 38c provided in the mount 38 is not limited to this.
[0037] For example, the set of first through holes 38d may be composed of one or three or more first through holes 38d. Similarly, the set of second through holes 38e may be composed of one or three or more second through holes 38e. Also, for example, the multiple through holes 38c may not include the second through hole 38e (or the first through hole 38d). Furthermore, the multiple through holes 38c may include multiple third through holes provided along an annular third region different from the first region and the second region, multiple fourth through holes provided along an annular fourth region, etc.
[0038] A plurality of grinding wheel units 42 are fixed to the lower surface 38b of the mount 38 configured in this manner by the above-mentioned fasteners 40. Fig. 3 is a perspective view showing the grinding wheel unit 42 attached to the mount 38, and Fig. 4 is a perspective view showing the grinding wheel unit 42 as viewed from the opposite direction to that shown in Fig. 3. As shown in Figs. 3 and 4, each grinding wheel unit 42 includes a grinding wheel base 44 formed using a metal such as stainless steel or aluminum.
[0039] The grindstone base 44 includes an upper surface (first surface) 44a, a lower surface (second surface) 44b facing the opposite side to the upper surface 44a, an outer surface 44c adjacent to the upper surface 44a and the lower surface 44b, and an inner surface 44d adjacent to the upper surface 44a and the lower surface 44b and facing the opposite side to the outer surface 44c. The upper surface 44a is configured so as to be able to come into contact with the lower surface 38b of the mount 38. On the other hand, a plurality of grinding wheels 46 fixed to the grindstone base 44 are exposed on the lower surface 44b side of the grindstone base 44.
[0040] The grindstone base 44 also includes a side surface 44e adjacent to all of the upper surface 44a, the lower surface 44b, the outer surface 44c, and the inner surface 44d, and a side surface 44f adjacent to all of the upper surface 44a, the lower surface 44b, the outer surface 44c, and the inner surface 44d and facing the opposite side to the side surface 44e. The side surface 44e has at least a portion (third surface) 44g adjacent to the outer surface 44c and a portion (fourth surface) 44h adjacent to the inner surface 44d. The side surface 44f has at least a portion (third surface) 44i adjacent to the outer surface 44c and a portion (fourth surface) 44j adjacent to the inner surface 44d.
[0041] The upper surface 44a of the grindstone base 44 thus configured has two fastening holes 44k for fastening the fasteners 40 inserted into the through holes 38c of the mount 38. That is, each fastening hole 44k is a female screw having a screw thread on the inside. The distance between the two fastening holes 44k is approximately equal to the distance between the two first through holes 38d that make up the set of the first through holes 38d and the distance between the two second through holes 38e that make up the set of the second through holes 38e.
[0042] The grinding wheels 46 exposed on the lower surface 44b side of the grinding wheel base 44 are formed in a rectangular parallelepiped shape, with abrasive grains such as diamond dispersed in a binder such as vitrified or resinoid. In this embodiment, three grinding wheels 46 are fixed to each grinding wheel base 44 by adhesive or the like. However, the structure, arrangement, number, etc. of the grinding wheels 46 may be changed according to the target workpiece 11, etc. For example, only one grinding wheel 46 may be fixed to each grinding wheel base 44, or two, four or more grinding wheels 46 may be fixed.
[0043] The grinding unit 32 of this embodiment is realized by selectively mounting a plurality of grinding wheel units 42 to the above-mentioned mount 38. Specifically, for example, one of the first through hole 38d and the second through hole 38e is selected, and the fastener 40 is inserted into the selected one, thereby mounting the grinding wheel unit 42 to the mount 38. Fig. 5 is a bottom view diagrammatically showing the first state of the grinding unit 32, and Fig. 6 is a bottom view diagrammatically showing the second state of the grinding unit 32.
[0044] 5, in the first state of the grinding unit 32, the first through holes 38d are selected, and one grindstone unit 42 is attached to each set of the first through holes 38d. That is, a plurality of grindstone units 42 are arranged along the large-diameter first region on the outside. In this embodiment, a total of 14 grindstone units 42 are attached to the mount 38. However, the number of grindstone units 42 attached to the mount 38 is appropriately changed depending on the size of the first region in which the first through holes 38d are arranged, the size of the grindstone units 42, and the like.
[0045] 5, in the first state of the grinding unit 32, a portion 44g of a side surface 44e of a certain grindstone unit 42 adjacent to the outer surface 44c is in contact with a portion 44i of a side surface 44f of the adjacent grindstone unit 42 adjacent to the outer surface 44c. In other words, the portion 44g of the side surface 44e and the portion 44i of the side surface 44f are configured to be able to come into surface contact with the adjacent grindstone unit 42 (grindstone base 44) when the multiple grindstone units 42 are arranged along the annular first region.
[0046] As a result, the position and orientation of a certain grinding wheel unit 42 is fixed by the adjacent grinding wheel unit 42, so that the position and orientation of the grinding wheel unit 42 are unlikely to change even if, for example, a large load is applied to the grinding wheel 46 when grinding the workpiece 11. When the grinding wheel unit 42 is properly attached to the mount 38, the outer surface 44c of the grinding wheel unit 42 faces outward along the radial direction of the mount 38, and the inner surface 44d of the grinding wheel unit 42 faces inward along the radial direction of the mount 38.
[0047] 6, in the second state of the grinding unit 32, the second through holes 38e are selected, and one grindstone unit 42 is attached to each set of the second through holes 38e. That is, a plurality of grindstone units 42 are arranged along the small-diameter second region on the inside. In this embodiment, a total of eight grindstone units 42 are attached to the mount 38. However, the number of grindstone units 42 attached to the mount 38 is appropriately changed depending on the size of the second region in which the second through holes 38e are arranged, the size of the grindstone units 42, and the like.
[0048] 6, in the second state of the grinding unit 32, a portion 44h of a side surface 44e of a certain grindstone unit 42 adjacent to the inner surface 44d is in contact with a portion 44j of a side surface 44f of the adjacent grindstone unit 42 adjacent to the inner surface 44d. In other words, the portion 44h of the side surface 44e and the portion 44j of the side surface 44f are configured to be able to come into surface contact with the adjacent grindstone unit 42 (grindstone base 44) when the multiple grindstone units 42 are arranged along the annular second region.
[0049] As a result, the position and orientation of a certain grinding wheel unit 42 is fixed by the adjacent grinding wheel unit 42, so that the position and orientation of the grinding wheel unit 42 are unlikely to change, for example, even if a large load is applied to the grinding wheel 46 when grinding the workpiece 11. Note that even in this second state, when the grinding wheel unit 42 is properly attached to the mount 38, the outer surface 44c of the grinding wheel unit 42 faces outward along the radial direction of the mount 38, and the inner surface 44d of the grinding wheel unit 42 faces inward along the radial direction of the mount 38.
[0050] A nozzle (not shown) capable of supplying liquid (grinding fluid) such as pure water to the contact area between the workpiece 11 and the grinding wheel 46 is disposed below the grinding unit 32. Instead of or together with this nozzle, a liquid supply port used for supplying liquid may be provided in the mount 38 or the like.
[0051] 1, a controller (control unit) 48 is connected to each element of the grinding device 2. This controller 48 is configured by a computer including, for example, a processing device 50 and a storage device 52, and controls the operation of each element of the grinding device 2 described above so that the workpiece 11 is appropriately ground.
[0052] The processing device 50 is typically a CPU (Central Processing Unit) and performs various processes required to control the above-mentioned elements. The storage device 52 includes, for example, a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a hard disk drive or a flash memory. The functions of the controller 48 are realized, for example, by the processing device 50 operating in accordance with a program stored in the storage device 52.
[0053] An input / output device 54 serving as a user interface is connected to the controller 48. The input / output device 54 is, for example, a touch screen, and inputs commands from an operator to the controller 48. Note that a keyboard, a mouse, or the like may be used as the input device. Similarly, a display device such as a liquid crystal display without an input function, a speaker capable of transmitting information by voice, or an indicator light capable of transmitting information by the color of light or the state of light emission (light emitting, blinking, off, etc.) may be used as the output device.
[0054] A program for causing the processing device 50 to execute a series of procedures required for grinding the workpiece 11 is stored in a portion of the storage device 52, which is also a non-transitory recording medium readable by a computer or the like. The processing device 50 executes various procedures required for grinding the workpiece 11 in accordance with this program.
[0055] When grinding the workpiece 11, for example, the controller 48 moves the chuck table 12 holding the workpiece 11 from the carry-in / carry-out area to the grinding area. Then, the controller 48 rotates each of the chuck table 12 and the spindle 36, and lowers the grinding unit 32 while supplying liquid from the nozzle. As a result, the grinding wheel 46 comes into contact with the upper surface of the workpiece 11 held by the chuck table 12, and the workpiece 11 is ground.
[0056] As described above, the grinding unit 32 according to this embodiment is configured so that a plurality of grindstone units 42 can be arranged along an annular first region or an annular second region having a size different from that of the first region. Therefore, by arranging a plurality of grindstone units 42 along one of the first region and the second region, it is possible to realize the functions of two types of grinding wheels having different sizes.
[0057] That is, in the grinding unit 32 according to this embodiment, the functions of a plurality of grinding wheels are realized by one type of grindstone unit 42, so if this one type of grindstone unit 42 is prepared as inventory, there is no need to prepare multiple types of grinding wheels as inventory as in the past. Therefore, the grinding unit 32 according to this embodiment makes it easy to manage inventory.
[0058] In addition, in the grinding unit 32 according to this embodiment, the function of a grinding wheel is realized by mounting a plurality of grinding wheel units 42 to the mount 38, so that, for example, even if any one of the grinding wheels 46 is damaged, the function as a grinding wheel can be restored simply by replacing the grinding wheel unit 42 including the affected grinding wheel 46. In other words, there is no need to discard the entire grinding wheel as in the conventional case, and as a result, the cost required for grinding the workpiece 11 can be kept low.
[0059] The present invention is not limited to the above-described embodiment, and may be modified in various ways. For example, in the above-described embodiment, the side surface 44e is composed of a portion (third surface) 44g adjacent to the outer side surface 44c and a portion (fourth surface) 44h adjacent to the inner side surface 44d, but the side surface 44e may further include another portion (fifth surface, etc.).
[0060] Similarly, in the above embodiment, the side surface 44f is composed of a portion (third surface) 44i adjacent to the outer side surface 44c and a portion (fourth surface) 44j adjacent to the inner side surface 44d, but the side surface 44f may further include another portion (fifth surface, etc.). In this case, it is possible to realize the functions of three or more types of grinding wheels with different sizes.
[0061] In the above embodiment, the portion 44g (third surface) of the side surface 44e, the portion 44h (fourth surface) of the side surface 44e, the portion 44i (third surface) of the side surface 44f, and the portion 44j (fourth surface) of the side surface 44f are all flat surfaces, but they may be curved surfaces. Similarly, any other surface of the grindstone base 44 may be curved surfaces.
[0062] In the above-described embodiment, the lower surface 38b of the mount 38 is configured to be generally flat except for the opening of the through hole 38c, but the lower surface 38b of the mount 38 may be provided with a groove, a recess, or the like for defining the position of the grindstone unit 42. In this case, the position and orientation of the grindstone unit 42 are further stabilized.
[0063] In addition, the structures, methods, and the like according to the above-described embodiment and each modified example may be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]
[0064] 2: Grinding equipment 4: Base 4a: Recess 6:X-axis movement mechanism 8: Table cover 10: Dust-proof and water-resistant cover 12: Chuck table 14:Frame body 16: Holding plate 16a:Top surface (holding surface) 18:Support structure 20:Z-axis movement mechanism 22: Guide rail 24: Moving plate 26: Screw shaft 28: Rotational drive source 30: Support 32: Grinding unit 34: Spindle housing 36: Spindle 38: Mount 38a:Top surface (first surface) 38b: Bottom surface (second surface) 38c: Through hole 38d: First through hole 38e: Second through hole 40: Fasteners 42: Grinding wheel unit 44:Whetstone base 44a:Top surface (first surface) 44b: Bottom surface (second surface) 44c: Outer surface 44d: Inside surface 44e: Side 44f: Side 44g: Part (3rd side) 44h: Part (4th side) 44i: Part (3rd side) 44j: Part (4th side) 44k : Fastening hole 46: Grinding wheel 48: Controller (control unit) 50: Processing equipment 52: Storage device 54: Input / Output device 11: Workpiece 11a: Surface 11b: Back side
Claims
1. A grinding unit used when grinding a workpiece, comprising: a mount secured to the spindle and having a plurality of through holes into which fasteners are inserted; a plurality of grinding stone units attached to the mount; The grinding wheel unit comprises: a grindstone base having a first surface on which a fastening hole for fastening the fastener is opened, a second surface opposite to the first surface, a third surface configured to be able to come into surface contact with an adjacent grindstone unit when the plurality of grindstone units are arranged along an annular first region, and a fourth surface configured to be able to come into surface contact with an adjacent grindstone unit when the plurality of grindstone units are arranged along an annular second region having a size different from that of the first region; a grinding wheel fixed to the wheel base in a manner that the grinding wheel is exposed on the second surface side of the wheel base.
2. The plurality of through holes of the mount include a plurality of first through holes disposed along the first region; 2. The grinding unit of claim 1, further comprising a plurality of second through holes disposed along the second region.
3. A grinding wheel unit used when grinding a workpiece, comprising: a grindstone base having a first surface on which a fastening hole for fastening a fastener is opened, a second surface opposite to the first surface, a third surface configured to be able to come into surface contact with an adjacent grindstone unit when a plurality of the grindstone units are arranged along an annular first region, and a fourth surface configured to be able to come into surface contact with an adjacent grindstone unit when a plurality of the grindstone units are arranged along an annular second region having a size different from that of the first region; a grinding wheel fixed to the wheel base in a manner that the grinding wheel is exposed on the second surface side of the wheel base.
4. A grinding unit used when grinding a workpiece, comprising: a mount secured to the spindle and having a plurality of through holes into which fasteners are inserted; a plurality of grinding stone units attached to the mount; The grinding wheel unit comprises: a grindstone base having a first surface in which a fastening hole into which the fastener is fastened is opened, and a second surface opposite to the first surface; a grinding wheel fixed to the wheel base in a manner that the grinding wheel is exposed on the second surface side of the wheel base; The plurality of through holes of the mount include a plurality of first through holes provided along an annular first region; a plurality of second through holes disposed along a second annular region having a different size than the first region.
5. The grindstone base of the grindstone unit is The grinding unit according to claim 4, further comprising: a third surface configured to be able to make surface contact with an adjacent grinding wheel unit when the plurality of grinding wheel units are arranged along the first region; and a fourth surface configured to be able to make surface contact with an adjacent grinding wheel unit when the plurality of grinding wheel units are arranged along the second region.
6. A mount having a plurality of through holes into which fasteners are inserted, the mount being fixed to a spindle, and a plurality of grinding wheel units used in grinding a workpiece being attached by the plurality of fasteners, The plurality of through holes include a plurality of first through holes provided along an annular first region; a second plurality of through holes disposed along a second annular region of a different size than the first region.
Citation Information
Patent Citations
Grinding wheel
JP2006224201A