Display unit
The display device achieves improved translucency by incorporating a second region with lower resolution and transmission areas, addressing the light-blocking issue in OLEDs to enable backside camera functionality.
Patent Information
- Application Number
- JP2023104290
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-26
- Publication Date
- 2025-01-15
Smart Images

Figure 2025004547000001_ABST
Abstract
Description
[Technical field]
[0001] The present embodiment relates to a display device. [Background technology]
[0002] In recent years, display devices that use organic light-emitting diodes (OLEDs) as display elements have been put to practical use. These display elements include a lower electrode, an organic layer that covers the lower electrode, and an upper electrode that covers the organic layer. A common voltage is applied to the upper electrodes of each display element through wiring arranged in the display area.
[0003] In addition, light transmittance may be required in at least a part of a display region in which display elements are arranged. However, if the lower electrode or the wiring is made of a material having a light blocking property such as a metal, the light transmittance of the display device may be significantly reduced. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] JP 2000-195677 A [Patent Document 2] JP 2004-207217 A [Patent Document 3] JP 2008-135325 A [Patent Document 4] JP 2009-32673 A [Patent Document 5] JP 2010-118191 A [Patent Document 6] International Publication No. 2018 / 179308 [Patent Document 7] US Patent Application Publication No. 2022 / 0077251 Summary of the Invention [Problem to be solved by the invention]
[0005] An object of the present invention is to provide a display device having excellent light-transmitting properties. [Means for solving the problem]
[0006] According to one aspect of the embodiment, the display device includes a first region and a second region each including a plurality of sub-pixels, a conductive lower portion, and an upper portion having an end portion protruding from a side surface of the lower portion, and a partition wall surrounding each of the plurality of sub-pixels. Each of the plurality of sub-pixels includes a lower electrode, an organic layer covering the lower electrode and emitting light in response to application of a voltage, and an upper electrode covering the organic layer and in contact with the lower portion of the partition wall. The second region has a plurality of transmissive regions surrounded by the partition wall and not overlapping with the lower electrode. Furthermore, the resolution of the second region is lower than that of the first region.
[0007] According to another aspect of the embodiment, the plurality of sub-pixels include a first sub-pixel disposed in the first region and a second sub-pixel disposed in the second region and displaying the same color as the first sub-pixel, and the first sub-pixel and the second sub-pixel have different shapes or sizes.
[0008] According to yet another aspect of the embodiment, the display device includes a lower electrode, a first organic layer covering the lower electrode and emitting light in response to application of a voltage, a second organic layer spaced apart from the first organic layer and covering the lower electrode and emitting light in response to application of a voltage, a partition including a conductive lower portion and an upper portion having an end protruding from a side surface of the lower portion, at least a portion of which is located between the first organic layer and the second organic layer, a first upper electrode covering the first organic layer and in contact with the lower portion, and a second upper electrode covering the second organic layer and in contact with the lower portion. [Brief description of the drawings]
[0009] [Figure 1] FIG. 1 is a diagram showing an example of the configuration of a display device according to a first embodiment. [Diagram 2] FIG. 2 is a schematic plan view showing an example of a layout of sub-pixels in the first region according to the first embodiment. [Diagram 3] FIG. 3 is a schematic cross-sectional view of the display device taken along line III-III in FIG. [Figure 4] FIG. 4 is a schematic plan view of the second region according to the first embodiment. [Diagram 5] FIG. 5 is a schematic cross-sectional view of the display device taken along line VV in FIG. [Figure 6] FIG. 6 is a schematic cross-sectional view showing another example applicable to the transmissive region included in the second region. [Figure 7] FIG. 7 is a schematic cross-sectional view showing still another example applicable to the transmissive region. [Figure 8] FIG. 8 is a schematic cross-sectional view showing still another example applicable to the transmissive region. [Figure 9] FIG. 9 is a schematic cross-sectional view showing still another example applicable to the transmissive region. [Figure 10] FIG. 10 is a schematic plan view showing an enlarged view of a part of the second region according to the first embodiment. [Figure 11] FIG. 11 is a schematic plan view of the second region according to the second embodiment. [Figure 12] FIG. 12 is a schematic plan view of the second region according to the third embodiment. [Figure 13] FIG. 13 is a schematic plan view of two sub-pixels included in the second region according to the third embodiment. [Figure 14] FIG. 14 is a schematic cross-sectional view of the display device taken along line XIV-XIV in FIG. [Figure 15] FIG. 15 is a schematic plan view of the second region according to the fourth embodiment. [Figure 16] FIG. 16 is a schematic plan view of the second region according to the fifth embodiment. [Figure 17] FIG. 17 is a schematic plan view of the second region according to the sixth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0010] Some embodiments will be described with reference to the drawings. The disclosure is merely an example, and those who are skilled in the art can easily conceive of appropriate modifications while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, the drawings may be schematic in width, thickness, shape, etc. of each part compared to the actual embodiment in order to make the explanation clearer, but they are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and each figure, components that perform the same or similar functions as those described above with respect to the previous figures are given the same reference numerals, and duplicate detailed explanations may be omitted as appropriate.
[0011] In addition, in the drawings, an X-axis, a Y-axis, and a Z-axis that are perpendicular to each other are shown as necessary to facilitate understanding. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction of a plane that includes the X-direction and the Y-direction. Moreover, viewing various elements parallel to the Z-direction is called planar view.
[0012] The display device according to each embodiment is an organic electroluminescence display device having an organic light-emitting diode (OLED) as a display element, and can be installed in various electronic devices such as televisions, personal computers, in-vehicle devices, tablet terminals, smartphones, mobile phone terminals, and wearable terminals.
[0013] [First embodiment] 1 is a diagram showing an example of the configuration of a display device DSP according to a first embodiment. The display device DSP includes an insulating substrate 10. The substrate 10 has a display area DA for displaying an image and a peripheral area SA around the display area DA. The substrate 10 may be made of glass or a flexible resin film.
[0014] In this embodiment, the shape of the substrate 10 in a plan view is rectangular. However, the shape of the substrate 10 in a plan view is not limited to a rectangular shape, and may be another shape such as a square shape, a circle shape, or an ellipse shape.
[0015] The display area DA includes a plurality of pixels PX arranged in a matrix in the X and Y directions. The pixels PX include a plurality of subpixels SP that display different colors. In this embodiment, it is assumed that the pixel PX includes a blue subpixel SP1, a green subpixel SP2, and a red subpixel SP3. However, the pixel PX may include subpixels SP of other colors, such as white, in addition to the subpixels SP1, SP2, and SP3, or instead of any of the subpixels SP1, SP2, and SP3.
[0016] The subpixel SP includes a pixel circuit 1 and a display element DE driven by the pixel circuit 1. The pixel circuit 1 includes a pixel switch 2, a drive transistor 3, and a capacitor 4. The pixel switch 2 and the drive transistor 3 are switching elements constituted by, for example, thin film transistors.
[0017] In the display area DA, there are arranged a plurality of scanning lines G that supply scanning signals to the pixel circuits 1 of each subpixel SP, a plurality of signal lines S that supply video signals to the pixel circuits 1 of each subpixel SP, and a plurality of power supply lines PL. In the example of Fig. 1, the scanning lines G and the power supply lines PL extend in the X direction, and the signal lines S extend in the Y direction.
[0018] The gate electrode of the pixel switch 2 is connected to the scanning line G. One of the source electrode and the drain electrode of the pixel switch 2 is connected to the signal line S, and the other is connected to the gate electrode of the drive transistor 3 and the capacitor 4. In the drive transistor 3, one of the source electrode and the drain electrode is connected to the power line PL and the capacitor 4, and the other is connected to the display element DE.
[0019] It should be noted that the configuration of the pixel circuit 1 is not limited to the example shown in the drawing. For example, the pixel circuit 1 may include more thin film transistors and capacitors.
[0020] The display area DA includes a first area A1 and a second area A2 having higher light transmittance than the first area A1. For example, a camera CR is disposed on the back side of the second area A2. This camera CR can capture an image of an object on the display surface side through the second area A2. Note that, instead of the camera CR, other types of light receiving elements such as an illuminance sensor that detects external light may be disposed. The display area DA may also include a plurality of second areas A2 facing the camera CR or the illuminance sensor.
[0021] For example, the second region A2 is smaller than the first region A1. In the example of FIG. 1, the second region A2 is located near the edge of the display region DA and is surrounded by the first region A1. However, the arrangement position of the second region A2 is not limited to this example. The second region A2 does not necessarily have to be surrounded entirely by the first region A1, and may be arranged so that one or two sides of the second region A2 face the surrounding region SA. The second region A2 is, for example, rectangular, but may be another shape such as circular.
[0022] Fig. 2 is a schematic plan view showing an example of the layout of subpixels SP1, SP2, and SP3 in the first region A1. In the example of Fig. 2, subpixels SP2 and SP3 are aligned with subpixel SP1 in the X direction. Furthermore, subpixels SP2 and SP3 are aligned with subpixel SP1 in the Y direction.
[0023] When the subpixels SP1, SP2, and SP3 are laid out in this manner, the display area DA is formed with a column in which the subpixels SP2 and SP3 are alternately arranged in the Y direction, and a column in which multiple subpixels SP1 are repeatedly arranged in the Y direction. These columns are arranged alternately in the X direction. Note that the layout of the subpixels SP1, SP2, and SP3 is not limited to the example in FIG.
[0024] A rib 5 is disposed in the display area DA. The rib 5 has pixel apertures AP1, AP2, and AP3 in the subpixels SP1, SP2, and SP3, respectively. In the example of Fig. 2, the pixel aperture AP1 is larger than the pixel aperture AP2, and the pixel aperture AP2 is larger than the pixel aperture AP3. That is, among the subpixels SP1, SP2, and SP3, the subpixel SP1 has the largest aperture ratio, and the subpixel SP3 has the smallest aperture ratio.
[0025] The subpixel SP1 includes a lower electrode LE1, an upper electrode UE1, and an organic layer OR1 that overlap the pixel aperture AP1. The subpixel SP2 includes a lower electrode LE2, an upper electrode UE2, and an organic layer OR2 that overlap the pixel aperture AP2. The subpixel SP3 includes a lower electrode LE3, an upper electrode UE3, and an organic layer OR3 that overlap the pixel aperture AP3.
[0026] The lower electrode LE1, the upper electrode UE1, and the organic layer OR1 overlapping with the pixel aperture AP1 constitute the display element DE1 of the subpixel SP1. The lower electrode LE2, the upper electrode UE2, and the organic layer OR2 overlapping with the pixel aperture AP2 constitute the display element DE2 of the subpixel SP2. The lower electrode LE3, the upper electrode UE3, and the organic layer OR3 overlapping with the pixel aperture AP3 constitute the display element DE3 of the subpixel SP3. The display elements DE1, DE2, and DE3 may further include a cap layer, which will be described later. The rib 5 surrounds each of these display elements DE1, DE2, and DE3.
[0027] A conductive partition wall 6 is disposed on the rib 5. The partition wall 6 overlaps the rib 5 as a whole and has the same planar shape as the rib 5. That is, the partition wall 6 has openings in each of the subpixels SP1, SP2, and SP3. From another perspective, the rib 5 and the partition wall 6 are lattice-shaped in a planar view and surround each of the subpixels SP1, SP2, and SP3. The partition wall 6 serves as wiring that supplies a common voltage to the upper electrodes UE1, UE2, and UE3.
[0028] Fig. 3 is a schematic cross-sectional view of the display device DSP taken along line III-III in Fig. 2. A circuit layer 11 is disposed on the above-mentioned substrate 10. The circuit layer 11 includes various circuits and wiring such as the pixel circuits 1, scanning lines G, signal lines S, and power lines PL shown in Fig. 1. The circuit layer 11 is covered with an organic insulating layer 12. The organic insulating layer 12 functions as a planarizing film that planarizes unevenness caused by the circuit layer 11.
[0029] The lower electrodes LE1, LE2, and LE3 are disposed on the organic insulating layer 12. The rib 5 is disposed on the organic insulating layer 12 and the lower electrodes LE1, LE2, and LE3. Ends of the lower electrodes LE1, LE2, and LE3 are covered by the rib 5. Although not shown in the cross section of FIG. 3, the lower electrodes LE1, LE2, and LE3 are each connected to the pixel circuit 1 of the circuit layer 11 through a contact hole provided in the organic insulating layer 12.
[0030] The partition 6 includes a conductive lower portion 61 disposed on the rib 5, and an upper portion 62 disposed on the lower portion 61. The upper portion 62 has a width greater than that of the lower portion 61. As a result, both ends of the upper portion 62 protrude beyond the side surfaces of the lower portion 61. Such a shape of the partition 6 is called an overhang shape.
[0031] In the example of FIG. 3, the lower part 61 has a bottom layer 63 arranged on the rib 5 and a shaft layer 64 arranged on the bottom layer 63. For example, the bottom layer 63 is formed thinner than the shaft layer 64. In addition, in the example of FIG. 3, both ends of the bottom layer 63 protrude from the side surfaces of the shaft layer 64.
[0032] The organic layer OR1 covers the lower electrode LE1 through the pixel opening AP1. The upper electrode UE1 covers the organic layer OR1 and faces the lower electrode LE1. The organic layer OR2 covers the lower electrode LE2 through the pixel opening AP2. The upper electrode UE2 covers the organic layer OR2 and faces the lower electrode LE2. The organic layer OR3 covers the lower electrode LE3 through the pixel opening AP3. The upper electrode UE3 covers the organic layer OR3 and faces the lower electrode LE3. The upper electrodes UE1, UE2, and UE3 are in contact with the side surfaces of the lower portion 61 of the partition wall 6.
[0033] The display element DE1 includes a cap layer CP1 disposed on an upper electrode UE1. The display element DE2 includes a cap layer CP2 disposed on an upper electrode UE2. The display element DE3 includes a cap layer CP3 disposed on an upper electrode UE3. The cap layers CP1, CP2, and CP3 serve as optical adjustment layers that improve the extraction efficiency of light emitted by the organic layers OR1, OR2, and OR3, respectively.
[0034] In the following description, a multilayer body including an organic layer OR1, an upper electrode UE1, and a cap layer CP1 will be referred to as a laminate film FL1, a multilayer body including an organic layer OR2, an upper electrode UE2, and a cap layer CP2 will be referred to as a laminate film FL2, and a multilayer body including an organic layer OR3, an upper electrode UE3, and a cap layer CP3 will be referred to as a laminate film FL3.
[0035] A part of the laminated film FL1 is located on the upper part 62. This part is separated from a part of the laminated film FL1 located below the partition wall 6 (a part that constitutes the display element DE1). Similarly, a part of the laminated film FL2 is located on the upper part 62, and this part is separated from a part of the laminated film FL2 located below the partition wall 6 (a part that constitutes the display element DE2). Furthermore, a part of the laminated film FL3 is located on the upper part 62, and this part is separated from a part of the laminated film FL3 located below the partition wall 6 (a part that constitutes the display element DE3).
[0036] Sealing layers SE1, SE2, and SE3 are disposed in the subpixels SP1, SP2, and SP3, respectively. The sealing layer SE1 continuously covers the cap layer CP1 and the partition wall 6 around the subpixel SP1. The sealing layer SE2 continuously covers the cap layer CP2 and the partition wall 6 around the subpixel SP2. The sealing layer SE3 continuously covers the cap layer CP3 and the partition wall 6 around the subpixel SP3.
[0037] 3, the stacked film FL1 and the sealing layer SE1 on the partition wall 6 between the subpixels SP1 and SP2 are separated from the stacked film FL2 and the sealing layer SE2 on the partition wall 6. In addition, the stacked film FL1 and the sealing layer SE1 on the partition wall 6 between the subpixels SP1 and SP3 are separated from the stacked film FL3 and the sealing layer SE3 on the partition wall 6.
[0038] The sealing layers SE1, SE2, and SE3 are covered with a resin layer 13. The resin layer 13 is covered with a sealing layer 14. The sealing layer 14 is covered with a resin layer 15. The resin layers 13, 15, and the sealing layer 14 are provided continuously at least throughout the display area DA, and a portion of them extends into the peripheral area SA.
[0039] A cover member such as a polarizing plate, a touch panel, a protective film, or a cover glass may be further disposed above the resin layer 15. Such a cover member may be adhered to the resin layer 15 via an adhesive layer such as OCA (Optical Clear Adhesive).
[0040] The organic insulating layer 12 is formed of an organic insulating material such as polyimide. The rib 5 and the sealing layers 14, SE1, SE2, and SE3 are formed of an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3). In one example, the rib 5 is formed of silicon oxynitride, and the sealing layers 14, SE1, SE2, and SE3 are formed of silicon nitride. The resin layers 13 and 15 are formed of a resin material (organic insulating material) such as epoxy resin or acrylic resin.
[0041] The lower electrodes LE1, LE2, and LE3 each have a reflective layer made of, for example, silver, and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer. Each conductive oxide layer can be made of a transparent conductive oxide such as, for example, ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide).
[0042] The upper electrodes UE1, UE2, UE3 are formed of a metal material such as an alloy of magnesium and silver (MgAg), etc. For example, the lower electrodes LE1, LE2, LE3 correspond to anodes, and the upper electrodes UE1, UE2, UE3 correspond to cathodes.
[0043] The organic layers OR1, OR2, and OR3 are composed of a plurality of thin films including a light-emitting layer. In one example, the organic layers OR1, OR2, and OR3 have a structure in which a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer are laminated in this order in the Z direction. However, the organic layers OR1, OR2, and OR3 may have other structures such as a so-called tandem structure including a plurality of light-emitting layers.
[0044] The cap layers CP1, CP2, and CP3 have a laminated structure in which, for example, a plurality of transparent layers are stacked. These transparent layers may include layers formed of inorganic materials and layers formed of organic materials. In addition, these transparent layers have different refractive indices. For example, the refractive indices of these transparent layers are different from the refractive indices of the upper electrodes UE1, UE2, and UE3 and the sealing layers SE1, SE2, and SE3. At least one of the cap layers CP1, CP2, and CP3 may be omitted.
[0045] The bottom layer 63 and the shaft layer 64 of the partition wall 6 are formed of a metal material. Examples of the metal material for the bottom layer 63 include molybdenum, titanium, titanium nitride (TiN), a molybdenum-tungsten alloy (MoW), and a molybdenum-niobium alloy (MoNb). Examples of the metal material for the shaft layer 64 include aluminum, an aluminum-neodymium alloy (AlNd), an aluminum-yttrium alloy (AlY), and an aluminum-silicon alloy (AlSi). The shaft layer 64 may be formed of an insulating material.
[0046] For example, the upper portion 62 of the partition wall 6 has a laminated structure of a lower layer formed of a metal material and an upper layer formed of a conductive oxide. The metal material forming the lower layer may be, for example, titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. The conductive oxide forming the upper layer may be, for example, ITO or IZO. The upper portion 62 may have a single layer structure of a metal material. Furthermore, the upper portion 62 may include a layer formed of an insulating material.
[0047] A common voltage is supplied to the partition 6. This common voltage is supplied to each of the upper electrodes UE1, UE2, and UE3 in contact with the side surfaces of the lower portion 61. A pixel voltage corresponding to the video signal of the signal line S is supplied to each of the lower electrodes LE1, LE2, and LE3 through the pixel circuits 1 of the subpixels SP1, SP2, and SP3, respectively.
[0048] The organic layers OR1, OR2, and OR3 emit light in response to the application of a voltage. Specifically, when a potential difference is formed between the lower electrode LE1 and the upper electrode UE1, the light-emitting layer of the organic layer OR1 emits light in the blue wavelength region. When a potential difference is formed between the lower electrode LE2 and the upper electrode UE2, the light-emitting layer of the organic layer OR2 emits light in the green wavelength region. When a potential difference is formed between the lower electrode LE3 and the upper electrode UE3, the light-emitting layer of the organic layer OR3 emits light in the red wavelength region.
[0049] As another example, the light-emitting layers of the organic layers OR1, OR2, and OR3 may emit light of the same color (e.g., white). In this case, the display device DSP may include color filters that convert the light emitted by the light-emitting layers into light of the colors corresponding to the subpixels SP1, SP2, and SP3. The display device DSP may also include a layer including quantum dots that are excited by the light emitted by the light-emitting layers to generate light of the colors corresponding to the subpixels SP1, SP2, and SP3.
[0050] 4 is a schematic plan view showing the second region A2 and a part of the first region A1 surrounding the second region A2. The dotted parts in the figure correspond to the partition walls 6. In the first region A1, a plurality of subpixels SP1, SP2, and SP3 are arranged in the layout shown in FIG. 2. The subpixel SP1 has a horizontal stripe pattern, the subpixel SP2 has a diagonal stripe pattern, and the subpixel SP3 has a vertical stripe pattern.
[0051] The second region A2 has a plurality of transmissive regions TA. The transmissive regions TA are surrounded by partition walls 6. From another perspective, the partition walls 6 have a plurality of openings corresponding to the transmissive regions TA. In the example of FIG. 4, the first region A1 does not have a transmissive region TA. As another example, the first region A1 may have at least one transmissive region TA.
[0052] In the example of Fig. 4, the shape of the transmissive region TA in a planar view is circular. This example is not limited to this, and the transmissive region TA may have other shapes, such as a rectangular shape. The size of the transmissive region TA is not particularly limited, but in one example, it has an area larger than the smallest subpixel among the subpixels SP1, SP2, and SP3 (subpixel SP3 in the example of Fig. 4). The transmissive region TA may have an area larger than each of the subpixels SP1, SP2, and SP3.
[0053] Similar to the first region A1, the second region A2 also has subpixels SP1, SP2, and SP3 arranged therein. In the example of Fig. 4, the subpixels SP1, SP2, and SP3 arranged in the first region A1 and the subpixels SP1, SP2, and SP3 arranged in the second region A2 have the same shape and size.
[0054] In each of the X direction and the Y direction, the resolution of the second region A2 (the density of the sub-pixels SP1, SP2, SP3) is lower than the resolution of the first region A1. In the example of Fig. 4, the resolution of the second region A2 is half the resolution of the first region A1 in each of the X direction and the Y direction.
[0055] From another perspective, the pixels PX are thinned out in the second region A2 compared to the first region A1, and the transparent regions TA are arranged in the resulting spaces. In the example of Fig. 4, the transparent regions TA and the pixels PX are arranged alternately in each of the X direction and the Y direction.
[0056] Note that the shape and size of the second region A2 shown in Fig. 4 are merely an example. The second region A2 may include more pixels PX and transmissive regions TA than in the example of Fig. 4. Also, the second region A2 may include fewer pixels PX and transmissive regions TA than in the example of Fig. 4.
[0057] Fig. 5 is a schematic cross-sectional view of the display device DSP taken along line VV in Fig. 4. The circuit layer 11 shown in Fig. 3 includes an inorganic insulating layer 31 and metal wiring 32 disposed on the inorganic insulating layer 31. The inorganic insulating layer 31 and the wiring 32 are covered, for example, by an organic insulating layer 12. Note that in Fig. 5, a portion of the circuit layer 11 located below the inorganic insulating layer 31 and the substrate 10 are omitted.
[0058] 5, the transmissive region TA overlaps with the organic insulating layer 12 and the rib 5. The lower electrodes LE1, LE2, LE3, the stacked films FL1, FL2, FL3, and the sealing layers SE1, SE2, SE3 are not arranged in the transmissive region TA. The resin layer 13 covers the rib 5 in the transmissive region TA.
[0059] In such a configuration, external light L incident on the display surface of the display device DSP passes through the transmissive region TA and is transmitted to the rear side. On the other hand, in the region other than the transmissive region TA, the external light L is blocked by the partition 6 and the lower electrodes LE1, LE2, LE3, etc.
[0060] As will be described in detail later, the wiring 32 supplies a pixel voltage to the subpixels SP1, SP2, and SP3 arranged in the second region A2. In the example of Fig. 5, the lower electrode LE2 of the subpixel SP2 is in contact with the wiring 32 through a contact hole provided in the organic insulating layer 12. From the viewpoint of enhancing the light transmittance in the transmissive region TA, it is preferable that the various wirings included in the circuit layer 11 (for example, the wiring 32, and the scanning lines G, signal lines S, and power lines PL shown in Fig. 1) do not overlap the transmissive region TA. However, some of these wirings may overlap the transmissive region TA.
[0061] 6 is a schematic cross-sectional view showing another example applicable to the transmissive region TA. In the example of this figure, the rib 5 has an opening 5a in the transmissive region TA. The resin layer 13 contacts the organic insulating layer 12 through the opening 5a. The opening 5a has, for example, the same planar shape (for example, a circular shape) as the transmissive region TA.
[0062] 7 is a schematic cross-sectional view showing yet another example applicable to the transmissive region TA. In the example shown in this figure, in the transmissive region TA, the rib 5 has an opening 5a, and the organic insulating layer 12 has an opening 12a. The opening 12a has, for example, the same planar shape (for example, a circular shape) as the transmissive region TA.
[0063] 7, the opening 5a is slightly larger than the opening 12a. The edge of the rib 5 along the opening 5a is located on the organic insulating layer 12. The resin layer 13 is in contact with the inorganic insulating layer 31 through the openings 5a and 12a.
[0064] Fig. 8 is a schematic cross-sectional view showing yet another example applicable to the transmissive region TA. As in the example of Fig. 7, the rib 5 has an opening 5a, and the organic insulating layer 12 has an opening 12a. However, in the example of Fig. 8, the opening 5a is slightly smaller than the opening 12a. The edge of the organic insulating layer 12 along the opening 12a is covered by the rib 5.
[0065] Fig. 9 is a schematic cross-sectional view showing yet another example applicable to the transmissive region TA. As in the examples of Fig. 7 and Fig. 8, the organic insulating layer 12 has an opening 12a. However, in the example of Fig. 9, the rib 5 does not have an opening 5a. The edge of the organic insulating layer 12 along the opening 12a is covered by the rib 5.
[0066] 6 to 9, the light transmittance of the transmissive region TA can be increased by removing at least one of the rib 5 and the organic insulating layer 12 in the transmissive region TA. In addition, when the edge of the organic insulating layer 12 is covered with the rib 5 as in Figures 8 and 9, the organic insulating layer 12 can be protected from etching when, for example, the partition wall 6 and the laminated films FL1, FL2, and FL3 are patterned.
[0067] 10 is a schematic plan view showing an enlarged view of a portion of the second region A2. At least one of the pixel circuits 1 (see FIG. 1) of the subpixels SP1, SP2, and SP3 arranged in the second region A2 may be arranged in the first region A1. In this way, by reducing the number of pixel circuits 1 arranged in the second region A2, it is possible to improve the efficiency of the layout of the second region A2 and ensure a large space for arranging the transmissive region TA.
[0068] In the example of Fig. 10, a pixel circuit 1a for applying a voltage to the lower electrode LE2 of the subpixel SP2 in the second region A2 is disposed in the first region A1. The lower electrode LE2 and the pixel circuit 1a are connected by a wiring 32 which is also shown in the cross sections of Fig. 5 to Fig. 9. Similarly, for the subpixels SP1 and SP3 in the second region A2, a pixel circuit 1 for applying a voltage to the lower electrodes LE1 and LE3 may be disposed in the first region A1.
[0069] It is preferable that the wiring 32 does not overlap the transparent region TA. In the example of Fig. 10, a part of the wiring 32 is curved to avoid the transparent region TA. Note that, like the wiring 32, the scanning lines G, the signal lines S, and the power lines PL passing through the second region A2 may also be curved to avoid the transparent region TA.
[0070] According to the present embodiment described above, the display area DA has the second area A2 including the transmissive area TA. This allows the camera CR and other components shown in FIG. 1 to be arranged so as to overlap the display area DA. In this embodiment, sub-pixels SP1, SP2, and SP3 are also arranged in the second area A2. This allows the second area A2 to display an image similar to that in the first area A1.
[0071] If the transmissive area TA includes a linear outer shape, halation is likely to occur in the image captured by the camera CR. In contrast, if the transmissive area TA is circular as shown in Fig. 4 or has another curved outer shape, halation can be suppressed. In this embodiment, the outer shape of the transmissive area TA is mainly determined by the light-shielding partition wall 6. In this case, the design freedom of the shape of the transmissive area TA is increased.
[0072] The configurations of the subpixels SP1, SP2, SP3 and the transmissive region TA in the second region A2 are not limited to those disclosed in this embodiment. In the following second to sixth embodiments, other configurations that can be applied to the second region A2 are disclosed. The configurations disclosed in the first embodiment (for example, the configurations shown in Figures 1 to 3 and Figures 5 to 10) are also applicable to each of the embodiments. In each embodiment, the same elements as in the first embodiment are given the same reference symbols, and duplicated explanations will be omitted.
[0073] [Second embodiment] 11 is a schematic plan view showing the second region A2 and a part of the first region A1 surrounding the second region A2 according to the second embodiment. As in FIG. 4, the partition 6 has a dot pattern, the subpixel SP1 has a horizontal stripe pattern, the subpixel SP2 has a diagonal stripe pattern, and the subpixel SP3 has a vertical stripe pattern.
[0074] In this embodiment, the subpixels SP1, SP2, and SP3 arranged in the second region A2 are referred to as subpixels SP1a, SP2a, and SP3a, respectively. In the example of Fig. 11, the subpixels SP1a, SP2a, and SP3a are all rectangular and of the same size. Note that the "size of a subpixel" corresponds to the area of the opening of the partition wall 6 in the subpixel in a planar view, more specifically, the area of the region surrounded by the upper portion 62 of the partition wall 6 in a planar view.
[0075] In the example of Fig. 11, the blue subpixels SP1 and SP1a are different in size. The green subpixels SP2 and SP2a are also different in size. The red subpixels SP3 and SP3a are the same in Fig. 11, but may be different in size.
[0076] For example, the subpixels SP1a, SP2a, and SP3a are the same size. In this case, the subpixels SP1a and SP2a arranged in the second region A2 are smaller than the subpixels SP1 and SP2 arranged in the first region A1.
[0077] In the second region A2 in FIG. 11, a transmissive region TA is disposed between two of the subpixels SP1a, SP2a, and SP3a that are adjacent in the X direction and between two of the subpixels SP1a, SP2a, and SP3a that are adjacent in the Y direction. More specifically, the second region A2 includes a column C1a in which the subpixels SP1a and the transmissive regions TA are alternately disposed in the Y direction, a column C2a in which the subpixels SP2a and the transmissive regions TA are alternately disposed in the Y direction, and a column C3a in which the subpixels SP3a and the transmissive regions TA are alternately disposed in the Y direction. The columns C1a, C2a, and C3a are repeatedly arranged in the X direction. The pitch at which the columns C1a, C2a, and C3a are arranged in the X direction is the same as the pitch at which the subpixels SP1 and SP2 (or subpixels SP1 and SP3) are arranged in the X direction.
[0078] The shape of the transmissive region TA is, for example, circular as in Fig. 4, but may be another shape. The transmissive region TA in Fig. 11 is smaller than in the example of Fig. 4. Furthermore, more transmissive regions TA are arranged in the second area A2 than in the example of Fig. 4.
[0079] In this embodiment, by making the size of the sub-pixels arranged in the second region A2 different from the size of the sub-pixels arranged in the first region A1, the degree of freedom in the layout of the transmissive region TA in the second region A2 can be increased. This makes it possible, for example, to make the transmissive region TA as large as possible and improve the translucency of the second region A2.
[0080] [Third embodiment] 12 is a schematic plan view showing the second region A2 and a part of the first region A1 surrounding the second region A2 according to the third embodiment. As in FIG. 4, the partition 6 has a dot pattern, the subpixel SP1 has a horizontal stripe pattern, the subpixel SP2 has a diagonal stripe pattern, and the subpixel SP3 has a vertical stripe pattern.
[0081] In the present embodiment, the subpixels SP1, SP2, and SP3 arranged in the second region A2 are referred to as subpixels SP1b, SP2b, and SP3b, respectively. In the example of Fig. 12, the subpixels SP1b, SP2b, and SP3b have shapes different from the subpixels SP1, SP2, and SP3, respectively.
[0082] Specifically, the subpixels SP1, SP2, and SP3 are rectangular, and the subpixels SP1b, SP2b, and SP3b are circular. For example, the sizes (diameters) of the subpixels SP1b, SP2b, and SP3b are the same, but may be different from each other.
[0083] 12, the second region A2 includes a column C1b in which two subpixels SP1b and one transmissive region TA are alternately arranged in the Y direction, a column C2b in which two subpixels SP2b and one transmissive region TA are alternately arranged in the Y direction, and a column C3b in which two subpixels SP3b and one transmissive region TA are alternately arranged in the Y direction. The columns C1a, C2a, and C3a are repeatedly arranged in the X direction. The shape of the transmissive region TA is, for example, circular as in FIG. 4, but may be another shape.
[0084] As in the present embodiment, by making the shape of the sub-pixels arranged in the second region A2 different from the shape of the sub-pixels arranged in the first region A1, the degree of freedom in the layout of the transmissive region TA in the second region A2 can be increased. This makes it possible, for example, to make the transmissive region TA as large as possible and improve the light transmittance of the second region A2.
[0085] 13 is a schematic plan view of two subpixels SP1b aligned in the Y direction. In the following description, the display element of one subpixel SP1b is referred to as the first display element DE11, and the display element of the other subpixel SP1b is referred to as the second display element DE12.
[0086] The rib 5 has a first pixel aperture AP11 surrounding the first display element DE11, and a second pixel aperture AP12 surrounding the second display element DE12. In the example of Fig. 13, the pixel apertures AP11 and AP12 are both circular.
[0087] In addition, the partition 6 has a first opening AP61 surrounding the first pixel opening AP11 and a second opening AP62 surrounding the second pixel opening AP12. In the example of Fig. 13, these openings AP61 and AP62 are also circular like the pixel openings AP11 and AP12.
[0088] The display elements DE11 and DE12 share a common lower electrode LE1b. In the example of Fig. 13, the lower electrode LE1b has a first portion P1 overlapping with the first pixel aperture AP11, a second portion P2 overlapping with the second pixel aperture AP12, and a third portion P3 connecting the first portion P1 and the second portion P2. The first portion P1 and the second portion P2 are, for example, circular. For example, the width of the third portion P3 in the X direction is smaller than the width (diameter) of the first portion P1 and the second portion P2 in the X direction.
[0089] Fig. 14 is a schematic cross-sectional view of the display device DSP taken along line XIV-XIV in Fig. 13. The first display element DE11 has a first organic layer OR11 covering the lower electrode LE1b through the first pixel opening AP11, a first upper electrode UE11 covering the first organic layer OR11, and a first cap layer CP11 covering the first upper electrode UE11. The second display element DE12 has a second organic layer OR12 covering the lower electrode LE1b through the second pixel opening AP12, a second upper electrode UE12 covering the second organic layer OR12, and a second cap layer CP12 covering the second upper electrode UE12.
[0090] The first organic layer OR11, the first upper electrode UE11, and the first cap layer CP11 overlap with the first opening AP61 of the partition wall 6. In addition, the second organic layer OR12, the second upper electrode UE12, and the second cap layer CP12 overlap with the second opening AP62 of the partition wall 6.
[0091] The upper electrodes UE11, UE12 are in contact with at least one of the bottom layer 63 and the axis layer 64 of the partition wall 6. The first organic layer OR11 emits blue light in response to the potential difference between the lower electrode LE1b and the first upper electrode UE11. Similarly, the second organic layer OR12 emits blue light in response to the potential difference between the lower electrode LE1b and the second upper electrode UE12.
[0092] A part of the partition wall 6 is located between the display elements DE11 and DE12. That is, the organic layers OR11 and OR12 are separated from each other via the partition wall 6. Similarly, the upper electrodes UE11 and UE12 are also separated from each other, and the cap layers CP11 and CP12 are also separated from each other. The display elements DE11 and DE12 and the partition wall 6 therebetween are continuously covered with the sealing layer SE1b.
[0093] In such a configuration, the display elements DE11 and DE12 can be driven by one pixel circuit 1 (see FIG. 1). This makes it possible to secure a large space for arranging the transmissive region TA even when the pixel circuit 1 is arranged in the second area A2.
[0094] Note that the two subpixels SP2b aligned in the Y direction in FIG. 12 and the two subpixels SP3b aligned in the Y direction can each have a structure similar to that of the subpixel SP1b shown in FIGS.
[0095] [Fourth embodiment] 15 is a schematic plan view showing the second region A2 and a part of the first region A1 surrounding the second region A2 according to the fourth embodiment. As in FIG. 4, the partition 6 has a dot pattern, the subpixel SP1 has a horizontal stripe pattern, the subpixel SP2 has a diagonal stripe pattern, and the subpixel SP3 has a vertical stripe pattern.
[0096] In this embodiment, the subpixels SP1, SP2, and SP3 arranged in the second region A2 are referred to as subpixels SP1c, SP2c, and SP3c, respectively. In the example of Fig. 15, the subpixels SP1 and SP1c have the same shape and size. On the other hand, the subpixels SP2c and SP3c have shapes different from the subpixels SP2 and SP3, respectively.
[0097] Specifically, the sub-pixels SP1, SP2, SP3, and SP1c are rectangular, and the sub-pixels SP2c and SP3c are circular. For example, the sizes (diameters) of the sub-pixels SP2c and SP3c are the same, but may be different from each other.
[0098] 15, the second region A2 includes a column C1c in which subpixels SP1c and transmissive regions TA are alternately arranged in the Y direction, and a column C2c in which subpixels SP3c, subpixels SP2c, and transmissive regions TA are alternately arranged in the Y direction. The columns C1c and C2c are repeatedly arranged in the X direction. The shape of the transmissive regions TA is, for example, circular as in FIG. 4, but may be another shape.
[0099] 15, the size of the subpixel SP1c is larger than the sizes of the subpixels SP2c and SP3c. This size relationship is similar to the size relationship between the subpixel SP1 and the subpixels SP2 and SP3. This makes it possible to reduce the difference in display quality between the first region A1 and the second region A2.
[0100] [Fifth embodiment] 16 is a schematic plan view showing the second region A2 and a part of the first region A1 surrounding the second region A2 according to the fifth embodiment. As in FIG. 4, the partition 6 has a dot pattern, the subpixel SP1 has a horizontal stripe pattern, the subpixel SP2 has a diagonal stripe pattern, and the subpixel SP3 has a vertical stripe pattern.
[0101] In this embodiment, the subpixels SP1, SP2, and SP3 arranged in the second region A2 are called subpixels SP1d, SP2d, and SP3d, respectively. In the example of Fig. 16, the subpixels SP1d, SP2d, and SP3d are all rectangular like the subpixels SP1, SP2, and SP3. Moreover, the subpixels SP1 and SP1d have the same size.
[0102] On the other hand, the subpixels SP2d and SP3d have different sizes from the subpixels SP2 and SP3. Specifically, the sizes of the subpixels SP2d and SP3d are larger than the sizes of the subpixels SP2 and SP3. For example, the shapes and sizes of the subpixels SP1d, SP2d, and SP3d may be the same or different from each other.
[0103] 16, the second region A2 includes a column C1d in which subpixels SP1d and transmissive regions TA are alternately arranged in the Y direction, a column C2d in which subpixels SP2d and transmissive regions TA are alternately arranged in the Y direction, and a column C3d in which subpixels SP3d and transmissive regions TA are alternately arranged in the Y direction. The columns C1d, C2d, and C3d are repeatedly arranged in the X direction. The shape of the transmissive regions TA is, for example, circular as in FIG. 4, but may be another shape.
[0104] [Sixth embodiment] 17 is a schematic plan view showing the second region A2 and a part of the first region A1 surrounding the second region A2 according to the sixth embodiment. As in FIG. 4, the partition 6 has a dot pattern, the subpixel SP1 has a horizontal stripe pattern, the subpixel SP2 has a diagonal stripe pattern, and the subpixel SP3 has a vertical stripe pattern.
[0105] In this embodiment, the subpixels SP1, SP2, and SP3 arranged in the second region A2 are called subpixels SP1e, SP2e, and SP3e, respectively. In the example of Fig. 17, the subpixels SP1d, SP2d, and SP3d are all rectangular like the subpixels SP1, SP2, and SP3. However, while the sides of the subpixels SP1, SP2, SP3, and SP1e are parallel to the X and Y directions, the sides of the subpixels SP2e and SP3e are inclined with respect to the X and Y directions. The shape of the transmissive region TA is, for example, circular like that in Fig. 4, but may be other shapes.
[0106] The sizes of the subpixels SP1e, SP2e, and SP3e are smaller than the sizes of the subpixels SP1, SP2, and SP3, respectively. In the example of FIG. 17, the size of the subpixel SP1e is larger than the sizes of the subpixels SP2e and SP3e. This size relationship is similar to the size relationship between the subpixels SP1 and the subpixels SP2 and SP3. As a result, as in the example of FIG. 15, it is possible to reduce the difference in display quality between the first region A1 and the second region A2.
[0107] In the second region A2, groups GR each consisting of subpixels SP1e, SP2e, SP3e and transmissive regions TA are repeatedly arranged in the X and Y directions. The pitches of the groups GR in the X and Y directions are the same as the pitches of the pixels PX arranged in the first region A1 in the X and Y directions.
[0108] 17, the same resolution as that of the first area A1 is achieved in the second area A2, thereby reducing the difference in display quality between the first area A1 and the second area A2.
[0109] In the second to sixth embodiments described above, the first subpixel arranged in the first region A1 and the second subpixel arranged in the second region A2 and displaying the same color as the first subpixel have different shapes or sizes. That is, in the second embodiment (FIG. 11), the blue subpixels SP1 and SP1a have different sizes, and the green subpixels SP2 and SP2a also have different sizes. In the third embodiment (FIG. 12), the blue subpixels SP1 and SP1b have different shapes, the green subpixels SP2 and SP2b have different shapes, and the red subpixels SP3 and SP3b have different shapes. In the fourth embodiment (FIG. 15), the green subpixels SP2 and SP2b have different shapes, and the red subpixels SP3 and SP3c also have different shapes. In the fifth embodiment (FIG. 16), the green subpixels SP2 and SP2d have different sizes, and the red subpixels SP3 and SP3d also have different sizes. In the sixth embodiment (FIG. 17), the blue subpixels SP1 and SP1e are different in size, the green subpixels SP2 and SP2e are different in size, and the red subpixels SP3 and SP3e are different in size. In addition to these embodiments, various shapes or sizes may be applied to the first subpixels arranged in the first region A1 and the second subpixels arranged in the second region A2.
[0110] All display devices that can be implemented by those skilled in the art through appropriate design modifications based on the display devices described above as the embodiments of the present invention belong to the scope of the present invention as long as they include the gist of the present invention.
[0111] Within the scope of the concept of the present invention, a person skilled in the art may conceive of various modifications, and such modifications are also understood to fall within the scope of the present invention. For example, those in which a person skilled in the art appropriately adds or removes components or modifies the design of the above-mentioned embodiment, or adds or omits steps or modifies conditions, are also included in the scope of the present invention as long as they include the gist of the present invention.
[0112] Furthermore, with regard to other effects and advantages brought about by the aspects described in the above-mentioned embodiments, those which are obvious from the description in this specification or which can be appropriately thought up by a person skilled in the art are naturally understood to be brought about by the present invention. [Explanation of symbols]
[0113] DSP...display device, DA...display area, SA...peripheral area, PX...pixel, SP1, SP2, SP3...subpixel, LE1, LE2, LE3...lower electrode, OR1, OR2, OR3...organic layer, UE1, UE2, UE3...upper electrode, SE1, SE2, SE3...sealing layer, A1...first area, A2...second area, TA...transmissive area, 5...rib, 6...partition wall, 61...lower part, 62...upper part, 63...bottom layer, 64...axis layer.
Claims
1. a first region and a second region each including a plurality of sub-pixels; a partition wall including a conductive lower portion and an upper portion having an end portion protruding from a side surface of the lower portion, the partition wall surrounding each of the plurality of sub-pixels; Equipped with Each of the plurality of sub-pixels is A lower electrode; an organic layer covering the lower electrode and emitting light in response to application of a voltage; an upper electrode covering the organic layer and in contact with the lower portion of the partition wall; Including, the second region has a plurality of transmissive regions that are surrounded by the partition wall and do not overlap with the lower electrode, The resolution of the second region is lower than the resolution of the first region. Display device.
2. an organic insulating layer disposed below the lower electrode; a rib covering an end portion of the lower electrode and the organic insulating layer, the rib having a pixel opening in each of the plurality of sub-pixels; Further equipped with the organic layer covers the lower electrode through the pixel opening; The partition is disposed on the rib. The display device according to claim 1 .
3. The transparent region overlaps the organic insulating layer and the rib. The display device according to claim 2 .
4. At least one of the organic insulating layer and the rib has an opening overlapping the transmissive region. The display device according to claim 2 .
5. The first region does not have the transmissive region. The display device according to claim 1 .
6. a plurality of pixel circuits that apply a voltage to the lower electrodes of the plurality of sub-pixels; the pixel circuit of at least one of the sub-pixels arranged in the second region is arranged in the first region; The display device according to claim 1 .
7. The transmission area is circular in plan view. The display device according to claim 1 .
8. a first region and a second region each including a plurality of sub-pixels; a partition wall including a conductive lower portion and an upper portion having an end portion protruding from a side surface of the lower portion, the partition wall surrounding each of the plurality of sub-pixels; Equipped with Each of the plurality of sub-pixels is A lower electrode; an organic layer covering the lower electrode and emitting light in response to application of a voltage; an upper electrode covering the organic layer and in contact with the lower portion of the partition wall; Including, the second region has a plurality of transmissive regions that are surrounded by the partition wall and do not overlap with the lower electrode, The plurality of sub-pixels include A first subpixel disposed in the first region; a second sub-pixel disposed in the second region and displaying the same color as the first sub-pixel; Including, The first subpixel and the second subpixel have different shapes or sizes. Display device.
9. The size of the second subpixel is smaller than the size of the first subpixel. The display device according to claim 8.
10. The size of the second subpixel is larger than the size of the first subpixel. The display device according to claim 8.
11. The first subpixel has a rectangular shape, The second subpixel is circular. The display device according to claim 8.
12. an organic insulating layer disposed below the lower electrode; a rib covering an end portion of the lower electrode and the organic insulating layer, the rib having a pixel opening in each of the plurality of sub-pixels; Further equipped with the organic layer covers the lower electrode through the pixel opening; The partition is disposed on the rib. The display device according to claim 8.
13. The transparent region overlaps the organic insulating layer and the rib. The display device according to claim 12.
14. At least one of the organic insulating layer and the rib has an opening overlapping the transmissive region. The display device according to claim 12.
15. The first region does not have the transmissive region. A display device according to any one of claims 8 to 14.
16. a plurality of pixel circuits that apply a voltage to the lower electrodes of the plurality of sub-pixels; the pixel circuit of at least one of the sub-pixels arranged in the second region is arranged in the first region; A display device according to any one of claims 8 to 14.
17. The transmission area is circular in plan view. A display device according to any one of claims 8 to 14.
18. A lower electrode; a first organic layer that covers the lower electrode and emits light in response to application of a voltage; a second organic layer that is spaced apart from the first organic layer, covers the lower electrode, and emits light in response to application of a voltage; a partition wall including a conductive lower portion and an upper portion having an end portion protruding from a side surface of the lower portion, at least a portion of which is located between the first organic layer and the second organic layer; a first upper electrode covering the first organic layer and in contact with the lower portion; a second upper electrode covering the second organic layer and in contact with the lower portion; A display device comprising:
19. the first organic layer and the second organic layer emit light of the same color in response to application of a voltage; The display device according to claim 18.
20. The partition wall is a first opening overlapping the first organic layer; a second opening overlapping the second organic layer; It has 20. The display device according to claim 18 or 19.
Citation Information
Patent Citations
Organic el display device and its manufacture
JP2000195677A
Display device and manufacturing method of the same
JP2004207217A
Organic el display device, and manufacturing method therefor
JP2008135325A
Organic electroluminescent display device and its manufacturing method
JP2009032673A
Organic electroluminescent display device and its manufacturing method
JP2010118191A