Heat radiation structure device, electronic device, vapor chamber and heat radiation device

Abstract

To provide a heat radiation structure device capable of improving cooling efficiency of an electronic device.SOLUTION: A heat radiation structure device according to the present disclosure comprises an electronic device, a vapor chamber, and a radiator. The vapor chamber includes a first sheet having a first thermal resistance value, and a second sheet including a thermal resistance part having a second thermal resistance value larger than the first thermal resistance value. The first sheet faces the electronic device, and the second sheet faces the radiator. At least a part of the thermal resistance part overlaps the electronic device in a plan view.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a heat dissipation structure device, an electronic device, a vapor chamber, and a heat dissipation apparatus. [Background technology]

[0002] Electronic devices such as mobile terminals use electronic devices that generate heat. Examples of such electronic devices include central processing units (CPUs), light-emitting diodes (LEDs), and power semiconductors. Examples of mobile terminals include mobile terminals and tablet terminals.

[0003] Such electronic devices are cooled by heat dissipation devices such as heat pipes (see, for example, Patent Document 1). In recent years, there has been a demand for thinner heat dissipation devices in order to make electronic devices thinner. Vapor chambers, which can be made thinner than heat pipes, have been developed as heat dissipation devices. In vapor chambers, an enclosed working fluid absorbs heat from the electronic device and disperses it inside, thereby releasing the heat from the electronic device and cooling the electronic device.

[0004] More specifically, the working fluid in the vapor chamber receives heat from the electronic device at a portion (evaporation section) close to the electronic device. The working fluid that receives the heat evaporates and becomes working vapor. The working vapor diffuses in a direction away from the evaporation section in a vapor flow path formed in the vapor chamber. The diffused working vapor is cooled and condensed to become working fluid. A liquid flow path as a capillary structure (wick) is provided in the vapor chamber. The working fluid is transported to the evaporation section by the capillary action of the liquid flow path. In the evaporation section, the working fluid receives heat again and evaporates. In this way, the working fluid circulates in the vapor chamber while repeating phase changes, that is, evaporation and condensation. As a result, the heat of the electronic device is diffused in the vapor chamber and released from the vapor chamber. In this way, the electronic device is cooled. However, there is a demand for improving the cooling efficiency of the electronic device. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2018 / 221369 Summary of the Invention [Problem to be solved by the invention]

[0006] The present disclosure aims to provide a heat dissipation structure device, an electronic device, a vapor chamber, and a heat dissipation apparatus that can improve the cooling efficiency of an electronic device. [Means for solving the problem]

[0007] [1] This disclosure: An electronic device; a vapor chamber thermally connected to the electronic device; a heat sink thermally connected to the vapor chamber and facing the electronic device via the vapor chamber; Equipped with The vapor chamber is a first sheet having a first thermal resistance value; a second sheet including a thermal resistance portion having a second thermal resistance value greater than the first thermal resistance value; Including, the first sheet faces the electronic device, the second sheet faces the heat sink, At least a portion of the thermal resistance portion overlaps with the electronic device in a plan view. It may be a heat dissipation structure device.

[0008] [2] This disclosure: An electronic device; a vapor chamber thermally connected to the electronic device; a heat sink thermally connected to the vapor chamber and facing the electronic device via the vapor chamber; Equipped with The vapor chamber is a first sheet having a first thermal conductivity; a second sheet including a thermal resistance portion having a second thermal conductivity smaller than the first thermal conductivity; the first sheet faces the electronic device, the second sheet faces the heat sink, At least a portion of the thermal resistance portion overlaps with the electronic device in a plan view. It may be a heat dissipation structure device.

[0009] [3] This disclosure: The vapor chamber includes a sealed space provided between the first sheet and the second sheet, The sealed space has a steam flow path through which the working steam passes and a liquid flow path including a capillary structure through which the working liquid passes. The heat dissipation structure device may be as described in [1] or [2].

[0010] [4] This disclosure: The vapor flow paths and the liquid flow paths extend in a first direction and are alternately arranged in a second direction perpendicular to the first direction. The heat dissipation structure device may be as described in [3].

[0011] [5] This disclosure: The vapor chamber further includes a main body sheet located between the first sheet and the second sheet. The heat dissipation structure device may be one according to any one of [1] to [4].

[0012] [6] This disclosure: The thermal resistance portion is formed over the entire area of ​​the second sheet. The heat dissipation structure device may be any one of the devices described in [1] to [5].

[0013] [7] This disclosure: The thickness of the thermal resistance portion is greater than the thickness of the first sheet. The heat dissipation structure device may be any one of the devices described in [1] to [6].

[0014] [8] This disclosure: The thermal resistance portion includes an isolation space portion. The heat dissipation structure device may be any one of those described in [1] to [7].

[0015] [9] This disclosure: Housing and a heat dissipation device according to any one of [1] to [8] housed in the housing; and The electronic device may be provided with:

[0016]

[10] This disclosure relates to: a first sheet having a first thermal resistance value; a second sheet including a thermal resistance portion having a second thermal resistance value greater than the first thermal resistance value; The vapor chamber may be provided with

[0017]

[11] This disclosure relates to: a first sheet having a first thermal conductivity; a second sheet including a thermal resistance portion having a second thermal conductivity smaller than the first thermal conductivity; The vapor chamber may be provided with

[0018]

[12] This disclosure relates to: a sealed space provided between the first sheet and the second sheet, The sealed space has a steam flow path through which the working steam passes and a liquid flow path including a capillary structure through which the working liquid passes.

[10] or

[11] . A vapor chamber according to the present invention.

[0019]

[13] This disclosure relates to: In a plan view, the steam flow paths and the liquid flow paths extend in a first direction and are alternately arranged in a second direction perpendicular to the first direction.

[12] The vapor chamber described in.

[0020]

[14] This disclosure relates to: Further comprising a main body sheet positioned between the first sheet and the second sheet. The vapor chamber according to any one of

[10] to

[13] .

[0021]

[15] This disclosure relates to: The thermal resistance portion is formed over the entire area of ​​the second sheet. The vapor chamber according to any one of

[10] to

[14] .

[0022]

[16] This disclosure relates to: The thickness of the thermal resistance portion is greater than the thickness of the first sheet. The vapor chamber according to any one of

[10] to

[15] .

[0023]

[17] This disclosure relates to: the second sheet includes a second sheet outer surface located opposite the first sheet; The thermal resistance portion includes a recess located on an outer surface of the second sheet. The vapor chamber according to any one of

[10] to

[16] .

[0024]

[18] This disclosure relates to:

[10] to

[17] , and a vapor chamber according to any one of the above. A heat sink thermally connected to the vapor chamber; A heat dissipation device comprising:

[0025]

[19] This disclosure relates to: Housing and an electronic device contained within the housing; a heat dissipation device according to

[18] , thermally connected to the electronic device; An electronic device equipped with Effect of the Invention

[0026] According to the present disclosure, the cooling efficiency of an electronic device can be improved. [Brief description of the drawings]

[0027] [Figure 1] FIG. 1 is a schematic perspective view illustrating an electronic device according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a schematic diagram illustrating a heat dissipation structure device according to an embodiment of the present disclosure. [Diagram 3] FIG. 3 is a plan view showing the vapor chamber shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 5 is a plan view showing a first main body surface of the main body sheet shown in FIG. [Figure 6] FIG. 6 is a diagram for explaining a method for calculating the thermal resistance value. [Figure 7] FIG. 7 is a diagram for explaining a method for calculating the thermal resistance value. [Figure 8] FIG. 8 is a diagram for explaining the heat dissipation performance of the heat dissipation structure device shown in FIG. [Figure 9] FIG. 9 is a diagram for explaining the heat dissipation performance of the heat dissipation structure device shown in FIG. [Figure 10] FIG. 10 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 11] FIG. 11 is a schematic diagram showing a modification of the heat dissipation structure device shown in FIG. [Figure 12] FIG. 12 is a schematic diagram showing another modified example of the heat dissipation structure device shown in FIG. [Figure 13] FIG. 13 is a plan view of the thermal resistance portion shown in FIG. [Figure 14] FIG. 14 is an enlarged cross-sectional view of the thermal resistance portion shown in FIG. [Figure 15] FIG. 15 is a plan view of a modified example of the thermal resistance portion shown in FIG. [Figure 16] FIG. 16 is an enlarged cross-sectional view of a modification of the thermal resistance portion shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings attached to this specification, the scale and aspect ratios are appropriately changed and exaggerated from those of the actual objects for the convenience of illustration and understanding.

[0029] The geometric conditions, physical characteristics, terms specifying the degree of the geometric conditions or physical characteristics, and numerical values ​​indicating the geometric conditions or physical characteristics used in this specification may be interpreted without being bound by strict meaning. These geometric conditions, physical characteristics, terms, and numerical values ​​may be interpreted including the range of the degree to which similar functions can be expected. Examples of terms specifying geometric conditions include "length", "angle", "shape", "parallel", "orthogonal", and "same". Furthermore, in order to clarify the drawings, the shapes of multiple parts that can be expected to have similar functions are regularly described. However, without being bound by strict meaning, the shapes of the parts may be different from each other within the range in which the functions can be expected. In the drawings, the boundary lines indicating the joint surfaces between members are shown as simple straight lines for convenience, but they are not limited to being strictly straight lines, and the shape of the boundary line is arbitrary within the range in which the desired joint performance can be expected.

[0030] A heat dissipation structure device, an electronic device, a vapor chamber, and a heat dissipation apparatus according to embodiments of the present disclosure will be described with reference to FIGS.

[0031] 1 and 2, a heat dissipation structure device 90 according to this embodiment includes an electronic device D that generates heat, and a heat dissipation device 80 (see FIG. 2). The heat dissipation structure device 90 is a device having a heat dissipation structure, and is configured such that the heat of the electronic device D is dissipated by the heat dissipation device 80 to cool the electronic device D. A device including such a heat dissipation device 80 will be referred to as a heat dissipation structure device 90 and will be described below.

[0032] The heat dissipation structure device 90 is accommodated in a housing H of an electronic device E. Examples of the electronic device E include mobile terminals such as mobile terminals and tablet terminals. Examples of the electronic device D include a central processing unit (CPU), a light emitting diode (LED), and a power semiconductor.

[0033] 1 shows an example in which the electronic device E equipped with the heat dissipation device 90 is a tablet terminal. The electronic device E may include a housing H and a heat dissipation device 90 accommodated in the housing H. In the electronic device E shown in FIG. 1, a touch panel display TD is provided on the front surface of the housing H. The heat dissipation device 90 is accommodated in the housing H.

[0034] As shown in FIG. 2, the heat dissipation device 80 may include a vapor chamber 30 and a heat sink 81. The heat sink 80 is a device for dissipating heat from the electronic device D to cool the electronic device D. The heat sink 80 is thermally connected to the electronic device D and receives heat generated by the electronic device D when the electronic device E is used. More specifically, the heat of the electronic device D is received by the vapor chamber 30 and dissipated to the heat sink 81. The heat sink 81 dissipates the heat to the outside. In this way, the heat of the electronic device D is dissipated and the electronic device D is effectively cooled. When the electronic device E is a tablet terminal, the electronic device D corresponds to a central processing unit or the like. The electronic device D may be mounted on a board not shown, but may not be mounted. The term "thermally connected" refers to two objects being in direct contact with each other, or being in contact with each other via a TIM sheet or a material with good thermal conductivity, which will be described later, and being intentionally made in a state in which heat can be transferred between them. The material with good thermal conductivity may be a grease with good thermal conductivity or a double-sided tape with good thermal conductivity.

[0035] The vapor chamber 30 is thermally connected to the electronic device D. The vapor chamber 30 is filled with working fluids 31a and 31b (see FIG. 5). The vapor chamber 30 has a sealed space 32 (see FIGS. 3 and 4) in which the working fluids 31a and 31b are filled. The working fluids 31a and 31b in the sealed space 32 are configured to repeatedly change phases to cool the electronic device D. Examples of the working fluids 31a and 31b include pure water, ethanol, methanol, acetone, and mixtures thereof.

[0036] The vapor chamber 30 includes a first outer surface 30a and a second outer surface 30b. The first outer surface 30a faces the electronic device D and may be thermally connected to the electronic device D. The first outer surface 30a may be a surface that receives heat from the electronic device D. The second outer surface 30b is located on the opposite side to the first outer surface 30a. The second outer surface 30b faces the heat sink 81 and may be thermally connected to the heat sink 81. The second outer surface 30b may be a surface that dissipates heat to the heat sink 81.

[0037] A TIM (Thermal Interface Material) sheet 70 may be interposed between the first outer surface 30a of the vapor chamber 30 and the electronic device D. In this case, the vapor chamber 30 and the electronic device D may be attached via the TIM sheet 70. The TIM sheet 70 may be made of a material with good thermal conductivity. However, instead of the TIM sheet 70, grease with good thermal conductivity or double-sided tape with good thermal conductivity may be interposed between the vapor chamber 30 and the electronic device D. In this case, the gap between the vapor chamber 30 and the electronic device D can be made small. This can reduce the thermal resistance and smoothly transfer heat.

[0038] The vapor chamber 30 may have an evaporation section 33. The evaporation section 33 may be a portion of the vapor chamber 30 that overlaps with the electronic device D in a plan view. In the evaporation section 33, the working liquid 31b is heated and evaporated to generate the working vapor 31a. The working liquid 31b may also evaporate in the vicinity of the evaporation section 33. In FIG. 2 and FIG. 3, an example is shown in which the evaporation section 33 is located at the center of the vapor chamber 30 in the X direction and at the center of the vapor chamber 30 in the Y direction. However, the position of the evaporation section 33 is arbitrary. For example, the evaporation section 33 may be located at one end of the vapor chamber 30 in the X direction and / or at one end of the vapor chamber 30 in the Y direction.

[0039] The vapor chamber 30 will be described in detail later.

[0040] The heat sink 81 is thermally connected to the vapor chamber 30. The heat sink 81 faces the electronic device D via the vapor chamber 30. The heat sink 81 is attached to the vapor chamber 30. The heat sink 81 may overlap the electronic device D in a plan view. In the present embodiment, the heat sink 81 overlaps the entire area of ​​the vapor chamber 30, and a portion of the heat sink 81 overlaps the electronic device D.

[0041] The heat dissipation body 81 is configured to dissipate heat from the vapor chamber 30 to the outside. The heat dissipation body 81 may be a heat sink. The heat sink may include a base in contact with the vapor chamber 30 and a plurality of protrusions extending from the base. The protrusions are also called fins. The heat dissipation body 81 is not limited to being a heat sink. For example, the heat dissipation body 81 may be a cooling device that uses water as a cooling medium. Alternatively, the heat dissipation body 81 may be a block-shaped member formed of a metal material. Alternatively, the heat dissipation body 81 may be a member that constitutes the housing H described above.

[0042] A TIM sheet 71 may be interposed between the second outer surface 30b of the vapor chamber 30 and the heat sink 81. In this case, the vapor chamber 30 and the heat sink 81 may be attached via the TIM sheet 71. The TIM sheet 71 may be configured similarly to the above-mentioned TIM sheet 70. This can reduce the thermal resistance value and allow the heat to be transmitted more smoothly. However, instead of the TIM sheet 71, grease with good thermal conductivity or double-sided tape with good thermal conductivity may be interposed between the vapor chamber 30 and the heat sink 81. In this case, the gap between the vapor chamber 30 and the heat sink 81 can be reduced. This can reduce the thermal resistance value and allow the heat to be transmitted more smoothly. Alternatively, the heat sink 81 may be fixed to the vapor chamber 30 by soldering or the like. In this case, the thermal resistance value between the vapor chamber 30 and the heat sink 81 can be reduced and the heat can be transmitted even more smoothly.

[0043] Next, an example of the vapor chamber 30 according to the present embodiment will be described in more detail.

[0044] As shown in Fig. 3 and Fig. 4, the vapor chamber 30 may include a first sheet 40, a second sheet 50, and a main body sheet 60. In the illustrated example, the vapor chamber 30 is configured by laminating the first sheet 40, the main body sheet 60, and the second sheet 50 in this order. The above-mentioned sealed space 32 is located between the first sheet 40 and the second sheet 50. The sealed space 32 includes a vapor flow path 65 and a liquid flow path 66, which will be described later. In this embodiment, an example of the vapor chamber 30 having a three-layer structure will be described.

[0045] The vapor chamber 30 may be formed in a thin flat plate shape. As shown in FIG. 3, the planar shape of the vapor chamber 30 may be rectangular. As shown in FIG. 3, the planar shape of the vapor chamber 30 may be a rectangle having a longitudinal direction in the X direction and a transverse direction in the Y direction. However, this is not limited to this, and the planar shape of the vapor chamber 30 may be any shape such as a square shape, a circular shape, an elliptical shape, an L-shape, a T-shape, or a U-shape. The first sheet 40, the second sheet 50, and the main body sheet 60 constituting the vapor chamber 30 may also have a planar shape similar to the planar shape of the vapor chamber 30 shown in FIG. 3.

[0046] The X direction is an example of a first direction, and corresponds to the left-right direction in FIG. 2 and FIG. 3. The Y direction is an example of a second direction, and corresponds to a direction perpendicular to the X direction in a plan view. The Y direction corresponds to the up-down direction in FIG. 3. The direction perpendicular to the X direction and the Y direction is the Z direction. The Z direction corresponds to the up-down direction in FIG. 2, and corresponds to the thickness direction of the vapor chamber 30. A plan view means a state seen in the Z direction, and a state seen in a direction perpendicular to the first outer surface 30a and the second outer surface 30b described above.

[0047] As shown in FIG. 2, the first sheet 40 receives heat from the electronic device D. As shown in FIG. 4, the first sheet 40 includes a first sheet outer surface 40a and a first sheet inner surface 40b. The first sheet outer surface 40a is located on the opposite side to the main body sheet 60 and faces the electronic device D (see FIG. 2). The first sheet inner surface 40b is located on the opposite side to the first sheet outer surface 40a and faces the main body sheet 60. The first sheet outer surface 40a constitutes the first outer surface 30a of the vapor chamber 30 described above and is thermally connected to the electronic device D. The first sheet 40 may be formed in a generally flat shape. The first sheet 40 may have a constant thickness overall. As shown in FIG. 2, the thickness t1 of the first sheet 40 may be, for example, 6 μm or more and 200 μm or less.

[0048] 2, the second sheet 50 receives heat from the first sheet 40 and releases it to the heat sink 81. The second sheet 50 receives heat from the working steam 31a that has evaporated due to the heat of the first sheet 40, and also receives the heat of the first sheet 40 via the main sheet 60, not via the working steam 31a.

[0049] As shown in FIG. 4, the second sheet 50 includes a second sheet inner surface 50a and a second sheet outer surface 50b. The second sheet inner surface 50a faces the main body sheet 60. The second sheet outer surface 50b is located on the opposite side of the second sheet inner surface 50a and the opposite side of the main body sheet 60. The second sheet outer surface 50b faces the heat sink 81 (see FIG. 2). The second sheet outer surface 50b constitutes the second outer surface 30b of the vapor chamber 30 described above and is thermally connected to the heat sink 81. The second sheet 50 may be formed in a generally flat shape. The second sheet 50 may have a constant thickness overall. As shown in FIG. 2, the thickness t2 of the second sheet 50 may be equal to the thickness t1 of the first sheet 40. However, the thickness t2 of the second sheet 50 may be thicker than the thickness t1 of the first sheet 40. Alternatively, if a second thermal resistance value of thermal resistance section 51 described below is greater than the first thermal resistance value of first sheet 40, thickness t2 of second sheet 50 may be smaller than thickness t1 of first sheet 40.

[0050] As shown in FIG. 4, the main body sheet 60 is a sheet in which a vapor flow path 65 and a liquid flow path 66 are formed. The main body sheet 60 may be located between the first sheet 40 and the second sheet 50. The main body sheet 60 includes a first main body surface 60a and a second main body surface 60b. The first main body surface 60a faces the first sheet 40. The second main body surface 60b faces the second sheet 50 on the opposite side to the first main body surface 60a. The first main body surface 60a may be joined to the first sheet inner surface 40b by thermocompression bonding. The second main body surface 60b may be joined to the second sheet inner surface 50a by thermocompression bonding. Examples of joining by thermocompression bonding include diffusion bonding and brazing.

[0051] As shown in FIG. 4 and FIG. 5, the main body sheet 60 may include a frame body portion 62 and a plurality of land portions 63. The frame body portion 62 may be formed in a rectangular frame shape in a plan view. Each land portion 63 may be located within the frame body portion 62 in a plan view. Each land portion 63 may extend in the X direction. Each land portion 63 may be formed in an elongated rectangular shape in a plan view. Each land portion 63 may be spaced apart in the Y direction and located parallel to each other. The ends of each land portion 63 in the X direction may be spaced apart from the frame body portion 62. Although not shown, a plurality of support portions may be provided to support the land portion 63 on the frame body portion 62.

[0052] 4 and 5, a vapor flow passage 65 may be provided in the main body sheet 60. The vapor flow passage 65 is a flow passage through which mainly the working vapor 31a, which is the vapor of the working fluid, passes. The vapor flow passage 65 may also be used for the working liquid 31b, which is the liquid of the working fluid.

[0053] The vapor flow passages 65 may include at least one first vapor flow passage 65a and at least one second vapor flow passage 65b.

[0054] The first steam flow path 65a may be provided between the frame portion 62 and each land portion 63, and between two adjacent land portions 63. As shown in Fig. 5, the first steam flow path 65a may extend in the X direction.

[0055] The second steam flow paths 65b may be provided between each end of each land portion 63 in the X direction and the frame portion 62. The second steam flow paths 65b may extend in the Y direction and may be in communication with each of the first steam flow paths 65a.

[0056] As shown in FIG. 4, the first steam flow passage 65a and the second steam flow passage 65b may penetrate the main body sheet 60 from the first main body surface 60a to the second main body surface 60b. The first steam flow passage 65a and the second steam flow passage 65b have a relatively large flow passage cross-sectional area so that the working steam 31a passes through. The minimum width of the first steam flow passage 65a and the minimum width of the second steam flow passage 65b may be, for example, 400 μm or more and 2000 μm or less. As shown in FIG. 4, the cross-sectional shape of the first steam flow passage 65a and the cross-sectional shape of the second steam flow passage 65b may be an hourglass shape formed so that the contour line protrudes inward. However, this is not limited to this, and the cross-sectional shape of each of the steam flow passages 65a, 65b may be any shape such as a rectangular shape, a trapezoidal shape, a barrel shape, etc. Each of such steam flow passages 65a, 65b constitutes a part of the above-mentioned sealed space 32.

[0057] Unlike the first vapor flow path 65a, the second vapor flow path 65b does not have to penetrate the main body sheet 60. In this case, the second vapor flow path 65b may be formed in a concave shape in the first main body surface 60a and may not extend to the second main body surface 60b. In this case, the second vapor flow path 65b may be formed by half-etching the first main body surface 60a.

[0058] As shown in FIG. 4 and FIG. 5, a liquid flow path 66 may be provided on the first main surface 60a of each land portion 63 of the main body sheet 60. In this case, the main body sheet 60 is also called a wick sheet. The liquid flow path 66 is a flow path through which the working liquid 31b mainly passes. The working steam 31a may also pass through the liquid flow path 66. The liquid flow path 66 may include a groove 66a. The groove 66a may extend in the X direction. In this case, the grooves 66a may be connected to each other by a groove (not shown) extending in the Y direction, or may be connected to the steam flow path 65. In this way, the groove 66a may be connected to the above-mentioned steam flow path 65.

[0059] The liquid flow path 66 is configured as a capillary structure (wick) for transporting the working liquid 31b. The groove 66a has a flow path cross-sectional area smaller than that of the vapor flow path 65 so that the working liquid 31b flows by capillary action. The width of the groove 66a may be, for example, 5 μm or more and 150 μm or less. The depth of the groove 66a may be, for example, 3 μm or more and 150 μm or less.

[0060] As described above, in this embodiment, a plurality of first vapor flow paths 65a and a plurality of liquid flow paths 66 are formed in the main body sheet 60. The first vapor flow paths 65a and the liquid flow paths 66 each extend in the X direction. The first vapor flow paths 65a and the liquid flow paths 66 are arranged alternately in the Y direction. The first vapor flow paths 65a and the liquid flow paths 66 may be formed parallel to each other.

[0061] The liquid flow path 66 may not be provided in the second main body surface 60b of each land portion 63. However, the liquid flow path 66 may be provided in the second main body surface 60b of each land portion 63. The liquid flow path 66 may be provided in both the first main body surface 60a and the second main body surface 60b, or may be provided in one of them and not in the other. Such a liquid flow path 66 constitutes a part of the sealed space 32 described above.

[0062] 2, the thickness t3 of the main body sheet 60 may be, for example, not less than 50 μm and not more than 400 μm. The thickness t0 of the vapor chamber 30 may be, for example, not less than 100 μm and not more than 1000 μm.

[0063] Incidentally, the first sheet 40 according to the present embodiment may have a first thermal resistance value. The first thermal resistance value is a value indicating how difficult it is for heat to be transmitted from the first sheet outer surface 40a to the first sheet inner surface 40b of the first sheet 40. A method for calculating the first thermal resistance value will be described later.

[0064] The first sheet 40 and the main body sheet 60 may be made of a material with high thermal conductivity. The first sheet 40 and the main body sheet 60 may be made of a metal material such as copper or a copper alloy. Copper and copper alloys have good thermal conductivity and corrosion resistance when pure water is used as the working fluid. Examples of copper include pure copper and oxygen-free copper (C1020). Examples of copper alloys include copper alloys containing tin, copper alloys containing titanium (C1990, etc.), and Corson copper alloys (C7025, etc.), which are copper alloys containing nickel, silicon, and magnesium. An example of a copper alloy containing tin is phosphor bronze (C5210, etc.).

[0065] 2, the second sheet 50 according to the present embodiment may include a thermal resistance portion 51. The thermal resistance portion 51 may be a portion of the second sheet 50 having a relatively large thermal resistance value. At least a portion of the thermal resistance portion 51 may overlap the electronic device D in a plan view. At least a portion of the thermal resistance portion 51 may be located in the evaporation portion 33.

[0066] The thermal resistance portion 51 may have a second thermal resistance value. The second thermal resistance value is a numerical value indicating how difficult it is for heat to be transmitted from the second sheet inner surface 50a to the second sheet outer surface 50b of the second sheet 50. The thermal resistance portion 51 according to this embodiment is formed over the entire area of ​​the second sheet 50. The entire area of ​​the second sheet 50 functions as the thermal resistance portion 51.

[0067] The second thermal resistance value may be higher than the above-mentioned first thermal resistance value. In this embodiment, the second sheet 50 may have a thermal conductivity smaller than that of the first sheet 40 and that of the main body sheet 60. In this case, the second sheet 50 may be made of a material having a thermal conductivity smaller than that of the first sheet 40 and the main body sheet 60. The second sheet 50 may be made of a metal material such as stainless steel, aluminum, or titanium. When the first sheet 40 and the main body sheet 60 are made of pure copper or oxygen-free copper, the second sheet 50 may be made of a copper alloy having a thermal conductivity smaller than that of pure copper and that of oxygen-free copper. Examples of such copper alloys include copper alloys containing tin, copper alloys containing titanium (C1990, etc.), and Corson copper alloys (C7025, etc.), which are copper alloys containing nickel, silicon, and magnesium. The copper alloy containing tin is, for example, phosphor bronze (C5210, etc.).

[0068] The method for calculating the thermal resistance value is explained below. th is calculated by the following formula (1).

number

[0069] Hereinafter, the second thermal resistance value R of the thermal resistance portion 51 th Here, the thermal resistance value R calculated in the form shown in FIG. th1 The thermal resistance value R calculated in the form shown in Figure 7 is th2The second thermal resistance value R is obtained by subtracting th A method for calculating the above will be described.

[0070] 6, the heat source 100 is attached to the second sheet inner surface 50a of the thermal resistance portion 51 via a TIM sheet 101a. The heat insulating material 102 is attached to the second sheet outer surface 50b of the thermal resistance portion 51 via a TIM sheet 101b. The heat source 100, the two TIM sheets 101a, 101b, and the thermal resistance portion 51 are formed so as not to protrude from each other. The heat insulating material 102 is formed so as to protrude from the thermal resistance portion 51.

[0071] A thermocouple 103a is positioned between the heat source 100 and the TIM sheet 101a. The thermocouple 103a may be attached to the heat source 100 or may be attached to the TIM sheet 101a. A thermocouple 103b is positioned between the insulating material 102 and the TIM sheet 101b. The thermocouple 103b may be attached to the insulating material 102 or may be attached to the TIM sheet 101b.

[0072] In the state shown in FIG. 6, heat is applied from the heat source 100 to the thermal resistance portion 51, and a predetermined pressing force F is applied from the heat source 100 to the thermal insulating material 102. After the steady state is reached, the temperature T in1 , T out The amount of heat P1 per unit time is calculated from the amount of heat given by the heat source 100 to the thermal resistance portion 51, and the thermal resistance value R in the configuration shown in FIG. th1 is calculated.

number

[0073] Next, as shown in Fig. 7, the thermal resistance portion 51 is removed from the configuration shown in Fig. 6. In this case, the TIM sheet 101a and the TIM sheet 101b are in contact with each other. In this state, heat is applied from the heat source 100 to the thermal resistance portion 51, and a predetermined pressing force F is applied from the heat source 100 to the insulating material 102 to reach a steady state. Then, the temperature Tin2 , T out2 The amount of heat P2 per unit time is calculated from the amount of heat given by the heat source 100 to the thermal resistance portion 51, and the thermal resistance value R in the configuration shown in FIG. th2 is calculated.

number

[0074] Then, the thermal resistance value R in the configuration shown in FIG. 6 is calculated as follows: th1 From the above, the thermal resistance value R th2 By subtracting th is calculated.

number

[0075] In this way, the thermal resistance value R th1 From the above, the thermal resistance value R th2 By subtracting the second thermal resistance value R th By applying the pressing force F as described above, the contact thermal resistance between the members can be reduced, and the calculation accuracy of the thermal resistance value can be improved. However, if the value of the pressing force F is the same between the form shown in FIG. 6 and the form shown in FIG. 7, the value of the pressing force F itself can be arbitrary. If the same member is used for the insulating material 102 in the form shown in FIG. 6 and the form shown in FIG. 7, the material and thickness of the insulating material 102 can be arbitrary. If the other conditions are also the same between the form shown in FIG. 6 and the form shown in FIG. 7, the calculation accuracy of the thermal resistance value can be improved.

[0076] The first thermal resistance value of the first sheet 40 is calculated in the same manner as the second thermal resistance value described above. In the embodiment shown in Fig. 6, a heat source 100 is attached to the first sheet outer surface 40a of the first sheet 40 via a TIM sheet 101a. A heat insulating material 102 is attached to the first sheet inner surface 40b of the first sheet 40 via a TIM sheet 101b.

[0077] By comparing the first thermal resistance value and the second thermal resistance value obtained as described above, the magnitude relationship between the first thermal resistance value and the second thermal resistance value can be confirmed.

[0078] The configuration of the vapor chamber 30 is not limited to the above-mentioned configuration and may be any configuration.

[0079] For example, it is not limited to one main body sheet 60 being located between the first sheet 40 and the second sheet 50. For example, two or more main body sheets 60 may be located between the first sheet 40 and the second sheet 50. In this case, the vapor chamber 30 may be configured with four or more layers. The configuration of the vapor flow path 65 and the liquid flow path 66 is arbitrary. The configurations of the two or more main body sheets 60 may be the same or different from each other. When the vapor chamber 30 is configured with four or more layers, the sealed space 32 may be in contact with the first sheet 40 or may not be in contact with the first sheet 40 as long as it is located between the first sheet 40 and the second sheet 50. Similarly, the sealed space 32 may be in contact with the second sheet 50 or may not be in contact with the second sheet 50 as long as it is located between the first sheet 40 and the second sheet 50.

[0080] When the vapor chamber 30 is composed of four or more layers, for example, another sheet may be interposed between the first sheet 40 and the main body sheet 60. In this case, the sealed space 32 may be in contact with the first sheet 40 as long as it is located between the first sheet 40 and the second sheet 50, or may be in contact with the other sheet without contacting the first sheet 40. Similarly, another sheet may be interposed between the second sheet 50 and the main body sheet 60. In this case, the sealed space 32 may be in contact with the second sheet 50 as long as it is located between the first sheet 40 and the second sheet 50, or may be in contact with the other sheet without contacting the second sheet 50.

[0081] For example, the main body sheet 60 is not limited to being located between the first sheet 40 and the second sheet 50. For example, the main body sheet 60 does not have to be located between the first sheet 40 and the second sheet 50. In this case, the vapor chamber 30 may have a two-layer structure. In this case, the vapor flow path 65 and the liquid flow path 66 may be formed in either one of the sheets, or may be formed in both sheets. When the vapor flow path 65 is formed in either one of the sheets, the liquid flow path 66 may be formed in the same sheet, or may be formed in the other sheet.

[0082] Next, a method for manufacturing the vapor chamber 30 according to this embodiment having such a configuration will be described.

[0083] First, in a preparation step, a first sheet 40, a second sheet 50, and a main body sheet 60 are prepared. Each of the sheets 40, 50, and 60 may be formed using a rolled material. The preparation step may include an etching step of forming the main body sheet 60 by an etching process. In the etching step, the main body sheet 60 may be formed by etching the rolled material using a patterned resist film (not shown) formed by photolithography technology.

[0084] After the preparation step, the first sheet 40, the second sheet 50 and the main body sheet 60 are permanently joined together in a joining step.

[0085] After the joining step, as an injection step, the sealed space 32 is evacuated and the hydraulic fluid 31b is injected into the sealed space 32 from an injection part (not shown).

[0086] After the injection step, the injection part is sealed as a sealing step, whereby communication between the sealed space 32 and the outside space is blocked, and the sealed space 32 is sealed. The sealed space 32 is filled with the hydraulic fluid 31b, and the hydraulic fluid 31b in the sealed space 32 is prevented from leaking to the outside.

[0087] In this manner, the vapor chamber 30 according to the present embodiment is obtained.

[0088] Next, a method for manufacturing the heat dissipation structure device 90 according to the present embodiment will be described.

[0089] For example, first, the heat sink 81 is attached to the vapor chamber 30. The heat sink 81 is attached to the vapor chamber 30 via the TIM sheet 71. This allows the heat sink 81 to be thermally connected to the vapor chamber 30. In this manner, the heat dissipation device 80 according to the present embodiment is obtained.

[0090] Next, the electronic device D is attached to the vapor chamber 30. The electronic device D is attached to the vapor chamber 30 via the TIM sheet 70. In this way, the electronic device D is thermally connected to the vapor chamber 30.

[0091] In this manner, the heat dissipation structure device 90 according to the present embodiment is obtained. Note that the order of the step of attaching the heat sink 81 to the vapor chamber 30 and the step of attaching the electronic device D to the vapor chamber 30 may be arbitrary.

[0092] Next, a method of operating the heat dissipation structure device 90 including the vapor chamber 30, that is, a method of cooling the electronic device D, will be described.

[0093] The heat dissipation structure device 90 obtained as described above is installed in a housing H of a mobile terminal or the like. When the electronic device D generates heat, the first sheet 40 of the vapor chamber 30 receives the heat. The working liquid 31b located in the evaporation section 33 of the vapor chamber 30 receives the heat from the first sheet 40. The received heat is absorbed as latent heat, and the working liquid 31b evaporates, generating working vapor 31a. The working vapor 31a generated in the vapor chamber 30 diffuses around the evaporation section 33 through the first vapor flow path 65a and the second vapor flow path 65b of the vapor flow path 65, as shown by the solid arrows in FIG. 5.

[0094] The diffused working steam 31a is cooled by releasing heat mainly to the second sheet 50. The heat received by the second sheet 50 from the working steam 31a is released to the heat sink 81. The heat received by the heat sink 81 is transmitted inside the heat sink 81 and released to the outside of the heat sink 81. For example, the heat sink 81 may release heat to the outside air, or to a surrounding structure.

[0095] The working vapor 31a that has released heat is condensed to generate working liquid 31b. Meanwhile, working liquid 31b continues to evaporate in the evaporation section 33. Therefore, working liquid 31b condensed around the evaporation section 33 is transported to the evaporation section 33. More specifically, as indicated by the dashed arrow in FIG. 5, working liquid 31b is transported to the evaporation section 33 by capillary action of the groove 66a of the liquid flow path 66.

[0096] The working fluid 31b that has reached the evaporation section 33 receives heat again from the electronic device D and evaporates. Then, the working vapor 31a diffuses in the vapor flow path 65. In this manner, the working fluids 31a and 31b circulate in the sealed space 32 while repeatedly undergoing phase changes, i.e., evaporation and condensation. As a result, the heat of the electronic device D is transported and released by the diffusion of the working vapor 31a in the vapor flow path 65.

[0097] In this manner, the vapor chamber 30 according to the present embodiment dissipates the heat of the electronic device D to the heat sink 81, and the heat sink 81 dissipates the heat to the outside.

[0098] While the electronic device D is generating heat, the heat received by the first sheet 40 of the vapor chamber 30 is received by the working liquid 31b, which evaporates and is diffused around the evaporation section 33. In this way, the heat received by the first sheet 40 can be diffused throughout the entire vapor chamber 30.

[0099] However, a part of the heat received by the first sheet 40 is not diffused by the working vapor 31a, but is transferred to the heat sink 81 via the main sheet 60 and the second sheet 50. This heat means heat transferred by thermal conduction from the first sheet 40 to the second sheet 50 via the main sheet 60. In a typical vapor chamber 30, as shown by the large arrow in FIG. 8, the amount of heat transferred to the heat sink 81 via the main sheet 60 and the second sheet 50 may increase. In this case, as shown in FIG. 8, the temperature of the part of the second sheet 50 corresponding to the evaporation section 33 and the part in the vicinity thereof tends to increase. For this reason, the difference between the temperature of the evaporation section 33 and the temperature around the evaporation section 33 increases, and the cooling efficiency of the electronic device D may decrease. The solid line shown in FIG. 8 indicates the temperature characteristic in the X direction of the vapor chamber 30 including the evaporation section 33.

[0100] On the other hand, when the second sheet 50 includes the thermal resistance portion 51, the amount of heat transferred from the electronic device D to the heat sink 81 through the main sheet 60 and the second sheet 50 can be reduced. More specifically, the thermal resistance portion 51 is located at a position overlapping the electronic device D, and the second thermal resistance value of the thermal resistance portion 51 is large. In this case, as shown in FIG. 9, the amount of heat transferred from the first sheet 40 in the portion corresponding to the evaporation portion 33 and the portion nearby to the heat sink 81 through the main sheet 60 and the second sheet 50 can be reduced. This can increase the amount of heat used to generate the working steam 31a out of the heat received by the first sheet 40. Therefore, the amount of evaporation of the working steam 31a can be increased, and the diffusion of heat can be promoted. In this case, as shown by the solid line in FIG. 9, the temperature of the second sheet 50 in the evaporation portion 33 can be reduced, and the difference between the temperature of the evaporation portion 33 and the temperature around the evaporation portion 33 can be reduced. In this case, the temperature around the evaporation portion 33 can be increased, and the heat can be diffused over a wide range. Therefore, heat can be released to the heat sink 81 from a wide range of the vapor chamber 30. As a result, heat dissipation from the electronic device D can be promoted, and the cooling efficiency of the electronic device D can be improved. The solid line shown in FIG. 9 indicates the temperature characteristic in the X direction of the vapor chamber 30 including the evaporation section 33. An almost constant temperature distribution is obtained. The dashed line indicates the temperature characteristic shown in FIG. 8.

[0101] Thus, according to this embodiment, the second sheet 50 includes a thermal resistance portion 51 that overlaps the electronic device D in a plan view. The thermal resistance portion 51 has a second thermal resistance value that is greater than the first thermal resistance value. This makes it possible to increase the second thermal resistance value of the thermal resistance portion 51, and to reduce the amount of heat that the first sheet 40 receives from the electronic device D and that is transferred to the heat sink 81 via the second sheet 50 without passing through the working steam 31a. This makes it possible to increase the amount of evaporation of the working steam 31a, and promote the diffusion of heat. This makes it possible to improve the cooling efficiency of the electronic device D.

[0102] According to this embodiment, the second sheet 50 includes a thermal resistance portion 51 that overlaps the electronic device D in a plan view. The thermal resistance portion 51 has a second thermal conductivity smaller than the first thermal conductivity. This makes it possible to increase the second thermal resistance value of the thermal resistance portion 51, and to reduce the amount of heat that the first sheet 40 receives from the electronic device D and that is transferred to the heat sink 81 via the second sheet 50 without passing through the working steam 31a. This makes it possible to increase the amount of evaporation of the working steam 31a, and to promote the diffusion of heat along the plane along the X-direction and Y-direction. This makes it possible to improve the cooling efficiency of the electronic device D.

[0103] According to this embodiment, the vapor chamber 30 includes a main body sheet 60 located between the first sheet 40 and the second sheet 50. The main body sheet 60 can function as a thermal resistor against heat transferred by thermal conduction without passing through the working vapor 31a. This can further reduce the amount of heat transferred from the electronic device D to the first sheet 40 via the second sheet 50 to the heat sink 81 without passing through the working vapor 31a. This can increase the amount of evaporation of the working vapor 31a and promote the diffusion of heat. This can improve the cooling efficiency of the electronic device D.

[0104] According to this embodiment, the thermal resistance portion 51 is formed over the entire area of ​​the second sheet 50. This makes it possible to easily configure the thermal resistance portion 51 having a second thermal resistance value greater than the first thermal resistance value of the first sheet 40. This makes it possible to improve the manufacturing efficiency of the vapor chamber 30.

[0105] The first modified example will be described.

[0106] For example, the liquid flow path 66 of the vapor chamber 30 is not limited to including the groove 66a as a flow path. For example, as shown in FIG. 10, the liquid flow path 66 may include a wick member 67 instead of the groove 66a. The wick member 67 may be located in each of the vapor flow paths 65a, 65b of the vapor flow path 65. In the example shown in FIG. 10, the wick member 67 is located in the sealed space 32. The wick member 67 may be formed of a metal mesh, a porous sintered body, a nonwoven fabric, or the like, as long as it is a member that exhibits capillary action. When the wick member 67 is formed of a metal mesh, the metal mesh may be formed by forming copper wire or stainless steel wire into a plain weave, twill weave, plain tatami weave, twill tatami weave, or the like. The wick member 67 is configured to exert a capillary action to provide the working liquid 31b with a driving force toward the evaporation section 33.

[0107] A second modified example will be described.

[0108] In the above-described embodiment, an example has been described in which the thermal resistance portion 51 has a thermal conductivity smaller than that of the first sheet 40, and the thickness t2 of the second sheet 50 is equal to the thickness t1 of the first sheet 40. However, the present disclosure is not limited to this. For example, as shown in FIG. 11, the thickness t2 of the second sheet 50 may be thicker than the thickness t1 of the first sheet 40. In this case, the thermal conductivity of the thermal resistance portion 51 may be equal to the thermal conductivity of the first sheet 40, or may be smaller than the thermal conductivity of the first sheet 40. Alternatively, if the second thermal resistance value of the thermal resistance portion 51 is larger than the first thermal resistance value of the first sheet 40, the thermal conductivity of the thermal resistance portion 51 may be larger than the thermal conductivity of the first sheet 40. In the example shown in FIG. 11, the thermal resistance portion 51 may also be formed over the entire area of ​​the second sheet 50.

[0109] 11, the second thermal resistance value of the thermal resistance portion 51 can be increased. This reduces the amount of heat transferred from the electronic device D to the first sheet 40 via the second sheet 50 to the heat sink 81 without passing through the working steam 31a. This increases the amount of evaporation of the working steam 31a, facilitating the diffusion of heat. This improves the cooling efficiency of the electronic device D.

[0110] A third modified example will be described.

[0111] In the above-described embodiment, an example has been described in which the thermal resistance portion 51 is formed over the entire area of ​​the second sheet 50. However, the present disclosure is not limited to this. For example, as shown in FIG. 12, the thermal resistance portion 51 may be formed in a portion of the second sheet 50. The thermal resistance portion 51 may overlap the electronic device D of the second sheet 50 in a plan view, or may be located in the evaporation portion 33. The thermal resistance portion 51 may not be formed around the portion overlapping with the electronic device D.

[0112] 12 to 14, the heat resistance portion 51 may include an isolated space portion 52 located on the second sheet outer surface 50b. The isolated space portion 52 is isolated from the sealed space 32 of the vapor chamber 30 and is isolated from the external space of the vapor chamber 30. As shown in Fig. 12, a plurality of isolated spaces 52 may be located on the second sheet outer surface 50b. The isolated spaces 52 may be isolated from each other.

[0113] The thermal resistance portion 51 is a portion of the second sheet 50 where a plurality of isolated spaces 52 are formed. The thickness of the thermal resistance portion 51 may be equal to the thickness t2 of the second sheet 50. The material constituting the thermal resistance portion 51 may be the same as the material constituting the second sheet 50.

[0114] The isolated space 52 may be located in the evaporation section 33. The isolated space 52 does not have to be formed around the evaporation section 33. However, the isolated space 52 may be formed around the evaporation section 33.

[0115] More specifically, as shown in FIG. 13 and FIG. 14, the recesses 53 that define each of the isolation spaces 52 may be located on the second sheet outer surface 50b. A plurality of recesses 53 may be formed on the second sheet outer surface 50b. The recesses 53 may be spaced apart from each other. As shown in FIG. 13, the planar shape of the recesses 53 may be circular. However, the planar shape of the recesses 53 may be any shape, such as a rectangular shape or an elliptical shape. Alternatively, the recesses 53 may be formed to extend elongatedly in any direction as long as the isolation spaces 52 can be formed. In the example shown in FIG. 13, the recesses 53 are located along each of the X direction and the Y direction. However, the recesses 53 may be located at any position, for example, in a staggered or checkered pattern. For example, the recesses 53 adjacent to each other in the Y direction may be shifted from each other in the X direction. This shift amount may be half the arrangement pitch of the recesses 53 in the X direction.

[0116] When the heat sink 81 is attached to the second sheet 50 via the TIM sheet 71, the recess 53 and the TIM sheet 71 form the isolated space 52. In this case, the TIM sheet 71 may be inserted into the recess 53, or may be configured to leave a space in the recess 53. For example, as shown in FIG. 13, when the recess 53 has a circular planar shape, the diameter d1 of the recess 53 may be 5 μm to 10,000 μm, and the interval d2 between two adjacent recesses 53 may be 5 μm to 10,000 μm. As shown in FIG. 14, the depth d3 of the recess 53 may be 3 μm to 150 μm. For example, the thickness t4 of the TIM sheet 71 may be 100 μm to 4,000 μm.

[0117] When the thermal resistance portion 51 includes the isolated space portion 52, the thermal conductivity of the material constituting the second sheet 50 may be equal to the thermal conductivity of the material constituting the first sheet 40, or may be smaller than the thermal conductivity of the material constituting the first sheet 40. Alternatively, if the second thermal resistance value of the thermal resistance portion 51 is larger than the first thermal resistance value of the first sheet 40, the thermal conductivity of the material constituting the second sheet 50 may be larger than the thermal conductivity of the material constituting the first sheet 40.

[0118] When the thermal resistance portion 51 includes the isolated space portion 52, the thickness t2 of the second sheet 50 may be equal to the thickness t1 of the first sheet 40. However, the second sheet 50 may have a thickness different from the thickness t1 of the first sheet 40, or may be thicker than the thickness t1 of the first sheet 40. Alternatively, as long as the second thermal resistance value of the thermal resistance portion 51 is greater than the first thermal resistance value of the first sheet 40, the thickness t2 of the second sheet 50 may be thinner than the thickness t1 of the first sheet 40.

[0119] 12, the isolated space portion 52 can function as an air layer and as a thermal resistor against the heat transmitted through the second sheet 50. This can increase the second thermal resistance value of the thermal resistance portion 51, and reduce the amount of heat received by the first sheet 40 from the electronic device D and transmitted to the heat sink 81 via the second sheet 50 without passing through the working steam 31a. This can increase the amount of evaporation of the working steam 31a and promote the diffusion of heat. This can improve the cooling efficiency of the electronic device D.

[0120] 12, when the thermal resistance portion 51 includes the isolated space portion 52, it is not necessary to make the thickness t2 of the second sheet 50 thicker than the thickness t1 of the first sheet 40. This allows the thickness of the vapor chamber 30 to be thin, and the weight of the vapor chamber 30 to be reduced.

[0121] In the example shown in FIG. 12 to FIG. 14, the thermal resistance portion 51 includes a plurality of isolated spaces 52 that are separated from each other, and a recess 53 is formed on the second sheet outer surface 50b so as to define each isolated space 52. However, the configuration of the thermal resistance portion 51 is not limited to this. For example, as shown in FIG. 15 and FIG. 16, the thermal resistance portion 51 may include one isolated space 52, and a recess 53 that defines the isolated space 52 may be formed on the second sheet outer surface 50b. In the example shown in FIG. 15 and FIG. 16, the recess 53 may be formed over the entire area of ​​the evaporation portion 33. A protrusion 54 that abuts against the heat sink 81 via the TIM sheet 71 may be provided in the recess 53. This can prevent the TIM sheet 71 from entering the recess 53, and a space can be left in the recess 53. The position of the protrusion 54 is arbitrary, similar to the position of the recess 53 described above.

[0122] The present disclosure is not limited to the above-mentioned embodiments and modifications, and can be embodied by modifying the components in the implementation stage without departing from the gist of the present disclosure. In addition, various inventions can be formed by appropriate combinations of the multiple components disclosed in the above-mentioned embodiments and modifications. Some components may be deleted from all the components shown in each embodiment and modification. [Explanation of symbols]

[0123] 30 Vapor Chamber 31a Working steam 31b Hydraulic fluid 40 Sheet 1 50 2nd Sheet 50b Second sheet outer surface 51 Heat resistance section 52 Isolated Space Section 53 Recess 60 Main Sheet 80 Heat dissipation device 81 Heat sink 90 Heat dissipation structure device D. Electronic Devices

Claims

1. An electronic device; a vapor chamber thermally connected to the electronic device; a heat sink thermally connected to the vapor chamber and facing the electronic device via the vapor chamber; Equipped with The vapor chamber is a first sheet having a first thermal resistance value; a second sheet including a thermal resistance portion having a second thermal resistance value greater than the first thermal resistance value; Including, the first sheet faces the electronic device; the second sheet faces the heat sink, At least a portion of the thermal resistance portion overlaps with the electronic device in a plan view. Heat dissipation structure device.

2. An electronic device; a vapor chamber thermally connected to the electronic device; a heat sink thermally connected to the vapor chamber and facing the electronic device via the vapor chamber; Equipped with The vapor chamber is a first sheet having a first thermal conductivity; a second sheet including a thermal resistance portion having a second thermal conductivity smaller than the first thermal conductivity; the first sheet faces the electronic device; the second sheet faces the heat sink, At least a portion of the thermal resistance portion overlaps with the electronic device in a plan view. Heat dissipation structure device.

3. The vapor chamber includes a sealed space provided between the first sheet and the second sheet, The sealed space has a steam flow path through which the working steam passes and a liquid flow path including a capillary structure through which the working liquid passes. The heat dissipation structure device according to claim 1 .

4. The vapor flow paths and the liquid flow paths extend in a first direction and are alternately arranged in a second direction perpendicular to the first direction. The heat dissipation structure device according to claim 3 .

5. The vapor chamber further includes a main body sheet located between the first sheet and the second sheet. The heat dissipation structure device according to claim 1 .

6. The thermal resistance portion is formed over the entire area of ​​the second sheet. The heat dissipation structure device according to claim 1 .

7. The thickness of the thermal resistance portion is greater than the thickness of the first sheet. The heat dissipation structure device according to claim 1 .

8. The thermal resistance portion includes an isolation space portion. The heat dissipation structure device according to claim 1 .

9. Housing and The heat dissipation structure device according to claim 1 or 2, which is accommodated in the housing; An electronic device equipped with

10. a first sheet having a first thermal resistance value; a second sheet including a thermal resistance portion having a second thermal resistance value greater than the first thermal resistance value; Equipped with a vapor chamber.

11. a first sheet having a first thermal conductivity; a second sheet including a thermal resistance portion having a second thermal conductivity smaller than the first thermal conductivity; Equipped with a vapor chamber.

12. a sealed space provided between the first sheet and the second sheet, The sealed space has a steam flow path through which the working steam passes and a liquid flow path including a capillary structure through which the working liquid passes. The vapor chamber according to claim 10 or 11.

13. In a plan view, the vapor flow paths and the liquid flow paths extend in a first direction and are alternately arranged in a second direction perpendicular to the first direction. The vapor chamber of claim 12.

14. Further comprising a main body sheet positioned between the first sheet and the second sheet. The vapor chamber according to claim 10 or 11.

15. The thermal resistance portion is formed over the entire area of ​​the second sheet. The vapor chamber according to claim 10 or 11.

16. The thickness of the thermal resistance portion is greater than the thickness of the first sheet. The vapor chamber according to claim 10 or 11.

17. the second sheet includes a second sheet outer surface located opposite the first sheet; The thermal resistance portion includes a recess located on an outer surface of the second sheet. The vapor chamber according to claim 10 or 11.

18. A vapor chamber according to claim 10 or 11, A heat sink thermally connected to the vapor chamber; A heat dissipation device comprising:

19. Housing and an electronic device contained within the housing; 20. The heat dissipation apparatus of claim 18 thermally connected to the electronic device; An electronic device equipped with

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