Circular disc manufacturing method

Abstract

To provide a circular disc manufacturing method that can manufacture a precise circular disc from a substrate by a cutting device.SOLUTION: A circular disc manufacturing method for manufacturing a circular disk from a substrate includes a holding step of holding the substrate on a holding surface of a holding table, a specifying step of specifying the position of the center of a circular portion included in the substrate after the holding step, and a cutting step of cutting out the circular portion from the substrate after the specifying step by adjusting the relative position of each of the holding table and a spindle in an X-direction and a Y-direction while rotating the holding table at least once in a state where a cutting blade rotating with the spindle penetrates through the substrate, thereby manufacturing the circular disc. In this cutting step, the circular portion is cut out from the substrate in a state where the tip of the cutting blade arranged perpendicularly to the Y-direction is positioned in the Y-direction or an opposite direction thereto as viewed from the center of the circular portion included in the substrate.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a disk from a substrate in a cutting device. [Background technology]

[0002] Devices such as integrated circuits or light-emitting diodes are generally formed using substrates made of semiconductors, glass, ceramics, etc. Although such substrates are distributed in standardized sizes, in order to facilitate handling and / or to extract a portion of good quality, a core drill is sometimes used to cut out a circular portion contained in the substrate to produce a disk (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-188101 A Summary of the Invention [Problem to be solved by the invention]

[0004] Device chips are generally manufactured by dividing a substrate on which multiple devices are formed along the boundaries of the multiple devices in a cutting machine. This cutting machine generally includes a holding table having holding surfaces parallel to the mutually orthogonal X and Y directions and rotatable about a straight line passing through the center of the holding surface as a rotation axis, and a spindle extending along the Y direction and having an annular cutting blade attached to its tip.

[0005] If the cutting device can cut out a circular portion of the substrate, it is preferable because it does not require the use of a separate device (e.g., a core drill) for this cutting. For example, such cutting is performed by moving the spindle so that the tip of the cutting blade draws a circular trajectory on an XY plane with the center of the holding surface as the origin, the X axis being a straight line parallel to the X direction, and the Y axis being a straight line parallel to the Y direction, without moving the holding table, while the cutting blade rotating with the spindle penetrates the substrate held on the holding surface of the holding table.

[0006] However, in this case, the portion located inside the boundary of the circular portion of the substrate must also be cut. For example, when cutting one end or the other end of this boundary in the X direction, the substrate is cut with the cutting blade positioned along the normal line of the boundary. Therefore, in this case, not only the boundary of the circular portion but also the portion located inside the one end and the other end of this boundary in the X direction is cut. As a result, in this case, an elliptical plate whose length in the X direction is shorter than the length in the Y direction is manufactured from the substrate, rather than a precise circular plate.

[0007] In view of this, an object of the present invention is to provide a method for manufacturing a disk that is capable of manufacturing a precise disk from a substrate in a cutting device. [Means for solving the problem]

[0008] According to the present invention, in a cutting device including a holding table having holding surfaces parallel to the mutually orthogonal X and Y directions and rotatable about a rotation axis that is a straight line passing through the center of the holding surface, and a spindle extending along the Y direction and having an annular cutting blade attached to its tip, a method for manufacturing a disk from a substrate includes a holding step of holding the substrate on the holding surface of the holding table, a specifying step of specifying the position of the center of a circular portion included in the substrate after the holding step, and a step of slightly rotating the holding table with the cutting blade, which rotates together with the spindle, penetrating the substrate after the specifying step. and a cutting out step of cutting out the circular portion from the substrate to manufacture the disc by adjusting the relative positions of the holding table and the spindle in each of the X direction and the Y direction while rotating the substrate at least once, in which the relative positions of the holding table and the spindle in each of the X direction and the Y direction are adjusted so that the tip of the cutting blade is located at coordinates (x, y) defined by the following mathematical expressions (1) and (2) in an XY plane having the center of the holding surface as the origin, a straight line parallel to the X direction as the X axis, and a straight line parallel to the Y direction as the Y axis.

number

number

[0009] In the cutting step of the present invention, the relative positions of the holding table and the spindle in the X and Y directions are adjusted so that the tip of the annular cutting blade attached to the tip of the spindle extending along the Y direction in the XY plane is located at the coordinates (x, y) defined by the above formulas (1) and (2).

[0010] In this case, the cutting edge of the cutting blade, which is arranged perpendicular to the Y direction, is positioned in the Y direction or the opposite direction as viewed from the center of the circular portion included in the substrate, and the circular portion is cut from the substrate. That is, in this case, the substrate is cut with the cutting blade always positioned along the tangent line of the boundary of the circular portion. Therefore, in the present invention, cutting of the portion located inside the boundary is suppressed. As a result, in the present invention, it is possible to manufacture a precise disk from the substrate. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1(A) is a perspective view that illustrates an example of a frame unit including a substrate, and FIG. 1(B) is a cross-sectional view that illustrates the frame unit illustrated in FIG. 1(A). [Diagram 2] FIG. 2 is a perspective view that illustrates a schematic example of a cutting device that can cut the substrate shown in FIGS. 1(A) and 1(B). [Diagram 3] FIG. 3 is a plan view that illustrates a schematic diagram of some components of a cutting unit included in the cutting device illustrated in FIG. [Figure 4] FIG. 4 is a flow chart that illustrates an example of a disk manufacturing method for manufacturing a disk from the substrate shown in FIGS. 1(A) and 1(B) by using the cutting device shown in FIG. [Diagram 5] FIG. 5 is a partially sectional side view that illustrates the holding step S1 illustrated in FIG. [Figure 6] FIG. 6 is a plan view showing a schematic diagram of a circular portion whose center is identified in the identifying step S2 shown in FIG. [Figure 7]FIG. 7 is a plan view showing a schematic state in which the holding table is rotated by 90° in the cutting step S3 shown in FIG. [Figure 8] FIG. 8 is a plan view showing a schematic state in which the holding table is rotated 180° in the cutting step S3 shown in FIG. [Figure 9] FIG. 9 is a plan view showing a schematic state in which the holding table is rotated by 270° in the cutting step S3 shown in FIG. [Figure 10] FIG. 10 is a plan view that illustrates a state in which the holding table is rotated 360° in the cutting step S3 shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1(A) is a perspective view showing an example of a frame unit, and Fig. 1(B) is a cross-sectional view showing the frame unit shown in Fig. 1(A). The frame unit 1 shown in Fig. 1(A) and Fig. 1(B) includes a disk-shaped substrate 3 made of a material such as a semiconductor, glass, or ceramics.

[0013] The substrate 3 has a defective portion 3a that is of poorer quality than the other portions. The defective portion 3a is, for example, a portion made of polycrystals of the material that constitutes the substrate 3, and the other portions are, for example, portions made of single crystals of the material that constitutes the substrate 3.

[0014] In addition, a central portion of a disk-shaped tape 5 having a diameter larger than that of the substrate 3 is attached to one surface of the substrate 3. This tape 5 has, for example, a flexible film-like base layer and an adhesive layer (glue layer) provided on one surface of the base layer (the surface on the substrate 3 side).

[0015] Specifically, the base layer is made of polyolefin (PO), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polystyrene (PS), etc. The adhesive layer is made of ultraviolet-curing silicone rubber, an acrylic material, an epoxy material, etc.

[0016] In addition, an annular frame 7 made of a metal material such as aluminum (Al) is attached to the outer periphery of the tape 5. A circular opening 7a having a diameter larger than that of the substrate 3 is formed in the frame 7, and the frame 7 is attached to the tape 5 so that the center of the opening 7a coincides with the center of the substrate 3.

[0017] Fig. 2 is a perspective view that shows a schematic example of a cutting device capable of cutting the substrate 3. Note that the X direction and the Y direction shown in Fig. 2 are directions that are perpendicular to each other on a horizontal plane, and the Z direction is a direction (vertical direction) that is perpendicular to the X direction and the Y direction.

[0018] The cutting device 2 shown in Fig. 2 includes a base 4 that supports each of the components. A recess 4a extending along the X direction is formed on the upper surface of the base 4. Inside the recess 4a, a flat table cover 6 and a bellows-like dust-proof and drip-proof cover 8 that expands and contracts as the table cover 6 moves are provided.

[0019] A holding table 10 is provided above the table cover 6. The holding table 10 has a disk-shaped frame 10a made of ceramics or the like. The frame 10a has a disk-shaped bottom wall and a cylindrical side wall standing upright from the outer periphery of the bottom wall. A disk-shaped porous plate 10b made of, for example, porous ceramics is fixed to a recess defined by the bottom wall and the side wall of the frame 10a.

[0020] The porous plate 10b has a diameter approximately equal to the inner diameter of the side wall of the frame 10a. Furthermore, the porous plate 10b communicates with a suction source (not shown) such as an ejector provided inside the recess 4a through a through hole or the like formed in the bottom wall of the frame 10a. The upper surface of the side wall of the frame 10a and the upper surface of the porous plate 10b are parallel to the X direction and the Y direction, respectively, and function as a holding surface of the holding table 10 when holding the substrate 3 via the tape 5.

[0021] Specifically, when the frame unit 1 is carried into the cutting device 2, the substrate 3 is placed on the holding table 10 via the tape 5. Then, when a suction source communicating with the porous plate 10b is operated in this state, a suction force acts on the substrate 3 via the tape 5. As a result, the substrate 3 is held on the holding surface of the holding table 10.

[0022] In addition, a plurality of clamps 12 are provided around the holding table 10. The clamps 12 are provided at approximately equal angular intervals along the circumferential direction of the holding table 10. When the frame unit 11 is carried into the cutting device 2, the clamps 12 grip the frame 7 at a position lower than the upper surface of the holding table 10.

[0023] The holding table 10 and the clamps 12 are connected to an X-direction movement mechanism (not shown) provided inside the recess 4a. This X-direction movement mechanism includes, for example, a ball screw and a motor connected to the ball screw. When this X-direction movement mechanism is operated, the holding table 10 and the clamps 12 move in the X direction or the opposite direction. Furthermore, in conjunction with this movement, the table cover 6 moves in the X direction or the opposite direction, and the dust-proof and drip-proof cover 8 expands and contracts.

[0024] The holding table 10 and the clamps 12 are connected to a rotation drive source (not shown) provided inside the recess 4a. The rotation drive source includes, for example, a spindle and a motor connected to the spindle. When the rotation drive source is operated, the holding table 10 and the clamps 12 rotate around a rotation axis that passes through the center of the holding surface of the holding table 10 and is aligned in the Z direction.

[0025] A support structure 14 is provided in a region near the recess 4a on the upper surface of the base 4. The support structure 14 has an erected portion 14a erected from the upper surface of the base 4, and an arm portion 14b extending in the opposite direction to the Y direction from an upper portion of the erected portion 14a so as to cross the recess 4a. A Y-direction movement mechanism 16 is provided on the front side of the arm portion 14b.

[0026] The Y-direction movement mechanism 16 has a pair of guide rails 18 fixed to the front surface of the arm portion 14b and extending along the Y direction. A moving plate 20 is connected to the front surface of the pair of guide rails 18 in a manner that allows it to slide along the pair of guide rails 18.

[0027] A screw shaft 22 extending along the Y direction is disposed between the pair of guide rails 18. A motor (not shown) for rotating the screw shaft 22 is connected to one end of the screw shaft 22. A nut (not shown) for accommodating a large number of balls that roll on the surface of the rotating screw shaft 22 is provided on the surface of the screw shaft 22 on which a spiral groove is formed, thereby forming a ball screw.

[0028] That is, when the screw shaft 22 rotates, a large number of balls circulate inside the nut, and the nut moves in the Y direction or the opposite direction. In addition, this nut is fixed to the rear side of the moving plate 20. Therefore, when the screw shaft 22 is rotated by a motor connected to one end of the screw shaft 22, the moving plate 20 moves together with the nut in the Y direction or the opposite direction.

[0029] A Z-direction movement mechanism 24 is provided on the front side of the moving plate 20. This Z-direction movement mechanism 24 is fixed to the front side of the moving plate 20 and has a pair of guide rails 26 extending along the Z direction. A moving plate 28 is connected to the front side of the pair of guide rails 26 in a manner that allows it to slide along the pair of guide rails 26.

[0030] A screw shaft 30 extending along the Z direction is disposed between the pair of guide rails 26. A motor 32 for rotating the screw shaft 30 is connected to one end (upper end) of the screw shaft 30. A nut (not shown) that houses a large number of balls that roll on the surface of the rotating screw shaft 30 is provided on the surface of the screw shaft 30 on which a spiral groove is formed, thereby forming a ball screw.

[0031] That is, when the screw shaft 30 rotates, a large number of balls circulate inside the nut, and the nut moves in the Z direction or the opposite direction. The nut is fixed to the rear side of the moving plate 28. Therefore, when the screw shaft 30 is rotated by the motor 32, the moving plate 28 moves together with the nut in the Z direction or the opposite direction.

[0032] A cylindrical housing 34 is fixed to the lower part of the moving plate 28. A cutting unit 36 ​​is contained in the housing 34. However, some of the components of the cutting unit 36 ​​are exposed from the side surface of the housing 34 facing the holding table 10.

[0033] Fig. 3 is a plan view showing typically the components of the cutting unit 36 ​​that are exposed and not housed in the housing 34. The components of the cutting unit 36 ​​shown in Fig. 3 are concentric structures centered on a straight line along the Y direction. Therefore, Fig. 3 can also be expressed as a front view showing typically the components of the cutting unit 36 ​​that are exposed and not housed in the housing 34.

[0034] The cutting unit 36 ​​has a spindle 38 that extends along the Y direction and has a tip portion thereof protruding from the housing 34. The spindle 38 is supported by the housing 34 in a manner that allows it to rotate about a straight line parallel to the Y direction as a rotation axis.

[0035] A cutting blade 40 is attached to the tip of the spindle 38. This cutting blade 40 includes a binder made of metal, ceramic, resin, or the like, and abrasive grains made of diamonds or the like dispersed in the binder.

[0036] The base end of the spindle 38 is connected to a rotary drive source (not shown) such as a motor housed in the housing 34. When the rotary drive source is operated, the cutting blade 40 rotates together with the spindle 38 around a straight line along the Y direction as a rotation axis.

[0037] 2, an imaging unit 42 capable of capturing an image of the holding surface side of the holding table 10 is fixed to the lower part of the moving plate 28. The imaging unit 42 includes, for example, a light source such as an LED (Light Emitting Diode), an objective lens, and an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0038] Fig. 4 is a flow chart showing an example of a disk manufacturing method for manufacturing a disk by cutting out a circular portion of the substrate 3 except for the defective portion 3a in the cutting device 2. In this method, the substrate 3 is first held on the holding surface of the holding table 10 (holding step S1). Fig. 5 is a partially sectional side view showing the holding step S1.

[0039] In this holding step S1, first, the frame unit 1 is placed on the holding surface of the holding table 10 so that the center of the holding surface of the holding table 10 and the center of the substrate 3 overlap in the Z direction and the tape 5 is downward. Next, a suction source communicating with the porous plate 10b of the holding table 10 is operated and the frame 7 is gripped by the multiple clamps 12. As a result, the substrate 3 is held on the holding surface of the holding table 10.

[0040] After the holding step S1, the position of the center of the circular portion included in the substrate 3 is identified (identification step S2). Fig. 6 is a plan view showing a schematic diagram of the circular portion whose center is identified in the identification step S2. This position is identified, for example, by referring to a predetermined radius r of the circular portion and an image formed by imaging the substrate 3 held on the holding surface of the holding table 10 by the imaging unit 42.

[0041] Specifically, in the identification step S2, this image is referenced and an arbitrary point included in a portion of the substrate 3 that is at least the radius r of the circular portion 3b away from each of the outer edge of the substrate 3 and the defective portion 3a is identified as the position of the center of the circular portion 3b.

[0042] The coordinate C0 of the center of the circular portion 3b in the XY plane, in which the center of the holding surface of the holding table 10 is defined as the origin O, a straight line parallel to the X direction is defined as the X axis, and a straight line parallel to the Y direction is defined as the Y axis, can be expressed as follows:

number

[0043] After the identification step S2, with the cutting blade 40 rotating together with the spindle 38 penetrating the substrate 3, the holding table 10 is rotated at least once while adjusting the relative positions of the holding table 10 and the spindle 38 in each of the X direction and Y direction, thereby cutting out the circular portion 3b from the substrate 3 to produce a disk (cutting step S3).

[0044] In this cutting step S3, first, the holding table 10 is moved in the X direction or the opposite direction, and the spindle 38 is moved in the Y direction or the opposite direction so that the tip of the cutting blade 40 (i.e., its lower end) is positioned above the substrate 3 and at a position spaced a radius r from the center of the circular portion 3b in the Y direction. This positions the tip of the cutting blade 40 at the following coordinate P0 on the XY plane.

number

[0045] Next, the cutting blade 40 is rotated together with the spindle 38. Next, while the cutting blade 40 is rotated, the spindle 38 is lowered so that the tip of the cutting blade 40 is positioned lower than the substrate 3 and higher than the holding surface of the holding table 10 (i.e., inside the tape 5). As a result, the cutting blade 40 penetrates the substrate 3 at the coordinate P0.

[0046] Next, while rotating the cutting blade 40, the holding table 10 is moved in the X direction or the opposite direction, and the spindle 38 is moved in the Y direction or the opposite direction so that the tip of the cutting blade 40 is always positioned in the Y direction at a distance of the radius r of the circular portion 3b from the center of the circular portion 3b.

[0047] In other words, in the XY plane, the holding table 10 is moved in the X direction or its opposite direction, and the spindle 38 is moved in the Y direction or its opposite direction so that the tip of the cutting blade 40 is located at the coordinates (x, y) defined by the following mathematical equations (1) and (2).

number

number

[0048] The movements of the holding table 10 and the spindle 38 in the cutting step S3 will be described in detail below with reference to Figures 7 to 10. Figures 7 to 10 are plan views that typically show the holding table 10 rotated by 90°, 180°, 270°, or 360°, respectively.

[0049] Specifically, when the holding table 10 is rotated by 90°, the coordinate C0 is changed to the following coordinate C so as to trace a circular arc with a central angle of 90° and a radius R with the origin O as the center. 90 The center of the circular portion 3b moves to the position shown in FIG.

number

[0050] In parallel with the movement of the center of the circular portion 3b, the trajectory T of the cutting edge of the cutting blade 40 90 The holding table 10 and the spindle 38 are moved so that the central angle of the circular portion 3b, which is a point a radius r away from the origin O in the Y direction (i.e., the coordinates (0, r)), is 90° and overlaps with an arc of radius R.

[0051] Specifically, during a period in which the center of circular portion 3b is located in the first quadrant of the XY plane, holding table 10 is moved in the X direction, and spindle 38 is moved in the Y direction. Also, during a period in which the center of circular portion 3b is located in the second quadrant of the XY plane, holding table 10 is moved in the X direction, and spindle 38 is moved in the direction opposite to the Y direction.

[0052] As a result, the cutting edge of the cutting blade 40 is aligned with the following coordinates P 90 to reach.

number

[0053] Then, when the holding table 10 is rotated by another 90° (total 180°), the coordinate C is rotated so that the central angle of the coordinate C with the origin O as the center traces an arc of 90°. 90 From the following coordinate C 180 The center of the circular portion 3b moves to the position shown in FIG.

number

[0054] In parallel with the movement of the center of the circular portion 3b, the trajectory T of the cutting edge of the cutting blade 40 180 The holding table 10 and the spindle 38 are moved so that the central angle of the circular arc having the coordinates (0, r) as its center is 90° and the circular arc having the radius R is overlapped.

[0055] Specifically, during a period in which the center of circular portion 3b is located in the second quadrant of the XY plane, holding table 10 is moved in the X direction, and spindle 38 is moved in the opposite Y direction. Also, during a period in which the center of circular portion 3b is located in the third quadrant of the XY plane, holding table 10 is moved in the opposite X direction, and spindle 38 is moved in the opposite Y direction.

[0056] As a result, the cutting edge of the cutting blade 40 is aligned with the following coordinates P 180 to reach.

number

[0057] Then, when the holding table 10 is rotated by another 90° (total 270°), the coordinate C is rotated so that the central angle of the coordinate C with the origin O as the center traces an arc of 90°. 180 From the following coordinate C 270 The center of the circular portion 3b moves to the position shown in FIG.

number

[0058] In parallel with the movement of the center of the circular portion 3b, the trajectory T of the cutting edge of the cutting blade 40 270 The holding table 10 and the spindle 38 are moved so that the central angle of the circular arc having the coordinates (0, r) as its center is 90° and the circular arc having the radius R is overlapped.

[0059] Specifically, during a period in which the center of circular portion 3b is located in the third quadrant of the XY plane, holding table 10 is moved in the opposite direction to the X direction, and spindle 38 is moved in the opposite direction to the Y direction. Also, during a period in which the center of circular portion 3b is located in the fourth quadrant of the XY plane, holding table 10 is moved in the opposite direction to the X direction, and spindle 38 is moved in the Y direction.

[0060] As a result, the cutting edge of the cutting blade 40 is aligned with the following coordinates P 270 to reach.

number

[0061] Then, when the holding table 10 is rotated by another 90° (total 360°), the coordinate C is rotated so that the central angle of the coordinate C with the origin O as the center traces an arc of 90°. 270 The center of the circular portion 3b moves from to the coordinate C0 (see FIG. 10).

[0062] In parallel with the movement of the center of the circular portion 3b, the trajectory T of the cutting edge of the cutting blade 40 360 The holding table 10 and the spindle 38 are moved so that the central angle of the circular arc having the coordinates (0, r) as its center is 90° and the circular arc having the radius R is overlapped.

[0063] Specifically, during a period in which the center of circular portion 3b is located in the fourth quadrant of the XY plane, holding table 10 is moved in the direction opposite to the X direction, and spindle 38 is moved in the Y direction. Also, during a period in which the center of circular portion 3b is located in the first quadrant of the XY plane, holding table 10 is moved in the X direction, and spindle 38 is moved in the Y direction.

[0064] As a result, the cutting edge of the cutting blade 40 reaches the coordinate P0 on the XY plane. As a result, the entire boundary of the circular portion 3b is cut, and an annular through passage 3f with a radius r and centered at the coordinate C0 is formed in the substrate 3. That is, the circular portion 3b is cut out from the substrate 3, and the disk 9 is manufactured.

[0065] In the cutting step S3 shown in FIG. 4, the relative positions of the holding table 10 and the spindle 38 in the X and Y directions are adjusted so that the cutting edge of the annular cutting blade 40 attached to the tip of the spindle 38 extending along the Y direction in the XY plane is located at the coordinates (x, y) defined by the above formulas (1) and (2).

[0066] In this case, the cutting edge of the cutting blade 40, which is arranged perpendicular to the Y direction, is positioned in the Y direction as viewed from the center of the circular portion 3b included in the substrate 3, and the circular portion 3b is cut from the substrate 3. That is, in this case, the substrate 3 is cut with the cutting blade 40 always positioned along the tangent to the boundary of the circular portion 3b. Therefore, in this method, cutting of the portion located inside the boundary is suppressed. As a result, in this method, it is possible to manufacture a precise disk 9 from the substrate 3.

[0067] The above is one aspect of the present invention, and the present invention is not limited to the above. For example, in the present invention, as long as it is possible to manufacture a disk 9 having a predetermined size, there is no limitation on the shape of the substrate used to manufacture the disk 9. Specifically, the substrate may have an elliptical, rectangular, or diamond shape. Alternatively, the substrate may have a shape in which a part of the predetermined shape is broken and chipped.

[0068] Furthermore, in the cutting step S3 of the present invention, the holding table 10 may be moved in the X direction or the opposite direction, and the spindle 38 may be moved in the Y direction or the opposite direction, so that the tip of the cutting blade 40 is always positioned at a position a radius r of the circular portion 3b in the opposite direction to the Y direction when viewed from the center of the circular portion 3b.

[0069] In other words, in the cutting step S3 of the present invention, the holding table 10 may be moved in the X direction or its opposite direction, and the spindle 38 may be moved in the Y direction or its opposite direction, so that the tip of the cutting blade 40 is located at the coordinates (x, y) defined by the above formula (1) and the following formula (2') in the XY plane.

number

[0070] Furthermore, in the present invention, it is sufficient that the holding table 10 and the spindle 38 can be moved relatively, and there is no limitation on the structure for this purpose. For example, the present invention may be implemented in a cutting device provided with a Y-direction movement mechanism capable of moving the holding table 10 in the Y direction or the opposite direction, and an X-direction movement mechanism capable of moving the spindle 38 in the X direction or the opposite direction, instead of or in addition to the X-direction movement mechanism and Y-direction movement mechanism 16 provided inside the recess 4a.

[0071] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0072] 1: Frame unit 2:Cutting device 3: Board (3a: defective part, 3b: circular part, 3c, 3d, 3e, 3f: through path) 4: Base (4a: recess) 5: Tape 6: Table cover 7: Frame (7a: opening) 8: Dust-proof and water-resistant cover 9: Disk 10: Holding table (10a: frame, 10b: porous plate) 12: Clamp 14: Support structure (14a: standing part, 14b: arm part) 16:Y direction movement mechanism 18: Guide rail 20: Moving plate 22: Screw shaft 24:Z direction movement mechanism 26: Guide rail 28: Moving plate 30: Screw shaft 32: Motor 34: Housing 36: Cutting unit 38: Spindle 40:Cutting blade 42: Imaging unit

Claims

[Claim 1] A method for manufacturing a disk from a substrate in a cutting device including a holding table having holding surfaces parallel to mutually orthogonal X and Y directions and rotatable about a straight line passing through the center of the holding surfaces as a rotation axis, and a spindle extending along the Y direction and having an annular cutting blade attached to a tip end thereof, comprising: a holding step of holding the substrate on the holding surface of the holding table; a step of identifying a position of a center of a circular portion included in the substrate after the holding step; and a cutting step of cutting out the circular portion from the substrate to manufacture the disk, after the identifying step, by adjusting the relative positions of the holding table and the spindle in each of the X direction and the Y direction while rotating the holding table at least once with the cutting blade rotating together with the spindle penetrating the substrate, In the cutting step, the center of the holding surface is defined as the origin, a straight line parallel to the X direction is defined as the X axis, and a straight line parallel to the Y direction is defined as the Y axis in an XY plane, in which the tip of the cutting blade is located at coordinates (x, y) defined by the following mathematical expressions (1) and (2). [0010] [0025] (In formulas (1) and (2), R is the length of a line segment connecting the origin and the center of the circular portion identified in the identification step in the XY plane, θ is the angle by which the holding table is rotated in the cut-out step, φ is the angle between the X-axis and the line segment in the XY plane, and r is the radius of the circular portion.)

Images