Coil component, manufacturing method of the coil component, and electron and electric device

Abstract

To provide a coil component of which various specification is improved.SOLUTION: A coil component 100 comprises: a coil part 10 that includes a center shaft O along a Z1-Z2 direction, and includes an annular conductor part (a first spiral conductor part 11, a second spiral conductor part 21, and a via part VP) having two electric end parts (outer peripheral side end parts 13 and 23); and a main body part 30 that covers the annular conductor part with first and second surfaces 301 and 302 that are arranged to the Z1-Z2 direction, and contains a magnetic powder and a binder. The main body part contains a center region CR and a first surface of which all of outer peripheral edges contacts to an inner peripheral surface the annular conductor part of the annular conductor part, contains at least one part of a first region 31 and a second surface made by a first material, and a second region 32 made by a second material. In regard to the first and second materials, one selected from a group formed by a composition and a content amount of them is different in the case where they contain a composition of a magnetic powder, a formation distribution of the magnetic powder, a content amount of the magnetic powder, and a composition of the binder, a content amount of the binder, and a containing of a third component other than the magnetic powder and the binder.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a coil component, a manufacturing method thereof, and an electronic / electrical device in which the coil component is mounted. [Background technology]

[0002] Patent Document 1 discloses a power inductor comprising a body containing magnetic powder and a polymer, at least one substrate provided inside the body and having at least one coil pattern formed on at least one surface thereof, and an insulating layer formed between the coil pattern and the body, the body including at least one region in which the particles of the magnetic powder are distributed so as to have a different size from the rest. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent application 2019-532519 specification Summary of the Invention [Problem to be solved by the invention]

[0004] In a coil component having a configuration in which a coil is embedded in a main body, a magnetic circuit formed in the main body by energizing the coil proceeds in a direction along the central axis of the coil on the inner and outer circumferential sides of the coil, and proceeds in a direction crossing the central axis of the coil on the two bottom sides of the coil. It may be preferable that the magnetic properties of the inner circumferential side and the bottom side of the coil in the main body are different. Also, when the coil component is mounted on a board, the part of the coil located on the bottom side of the main body may be a part facing the board or a part protruding from the board. For this reason, it may be preferable that the above-mentioned part has different electrical properties, mechanical properties, etc. from the part located on the inner circumferential side of the coil in the main body.

[0005] An object of the present invention is to provide a coil component having an improved function of a main body, a method for manufacturing the coil component, and an electronic / electrical device in which the coil component is mounted. [Means for solving the problem]

[0006] A coil component according to one aspect of the present invention, which is provided to solve the above problems, includes a coil section having an annular conductor having a central axis along a first direction and two electrical ends, and a main body covering the annular conductor with a first surface and a second surface aligned in the first direction, and including a magnetic powder and a binder. The coil section is exposed from a surface of the main body at a first end surface connected to one of the two electrical ends of the annular conductor and a second end surface connected to the other of the two electrical ends of the annular conductor. The main body includes a first region made of a first material, including a central region whose entire outer periphery is in contact with an inner periphery of the annular conductor and the first surface, and a second region made of a second material, including at least a part of the second surface. The first material and the second material differ in at least one selected from the group consisting of the composition of the magnetic powder, the shape distribution which is the distribution of the shape of the magnetic powder, the content of the magnetic powder, the composition of the binder, the content of the binder, and, if a third component other than the magnetic powder and the binder is contained, the composition and the content of the third component. In the above coil component, the material of the first region including the central region can be different from the material of the second region including at least a part of the second surface. This can impart a new function to the main body and enhance the functionality of the main body.

[0007] In the coil component described above, the material of the first region including the central region can be made different from the material located in the vicinity of the second surface, so that the main body can have various characteristics.

[0008] In the coil component described above, the second material may have higher insulating properties than the first material, in which case short circuits and dielectric breakdown are less likely to occur on the second surface side where the second region is located.

[0009] The coil component may further include a first external electrode electrically connected to the first end face and a second external electrode electrically connected to the second end face, the first external electrode being spaced apart from each other and provided on the main body. In this case, the first external electrode may have a first covered portion covering a portion of the second face, the second external electrode may have a second covered portion covering a portion of the second face, and the second region may have a first opposing portion facing the first covered portion and a second opposing portion facing the second covered portion. Even when at least a portion of the external electrode is located on the second face, short circuits and dielectric breakdown are less likely to occur.

[0010] In the coil component described above, the first end face may have a first exposed surface exposed from the body portion at the second surface and in contact with the first external electrode, and the second end face may have a second exposed surface exposed from the body portion at the second surface and in contact with the second external electrode. Even if an end of the coil portion is located on the mounting surface side, a short circuit between the external electrodes is unlikely to occur.

[0011] In the above coil component, the second region may have a continuous portion that is continuous with both the first opposing portion and the second opposing portion and that includes a part of the second surface.

[0012] In the coil component, the resistivity of the second region may be higher than the resistivity of the first region. Since the resistivity of the second region is relatively high, the possibility of dielectric breakdown occurring in a portion located between the conductor having the first exposed surface and the conductor having the second exposed surface is reduced.

[0013] In the coil component, the magnetic powder may include a metal magnetic powder, and the relative magnetic permeability μ2 of the second region may be smaller than the relative magnetic permeability μ1 of the first region. One way to relatively increase the insulation of the second region is to increase the content of insulating material in the second material. In this case, the content of the metal magnetic powder is relatively decreased. Therefore, the relative magnetic permeability μ2 of the second region is likely to be smaller than the relative magnetic permeability μ1 of the first region. In this case, the distance d2 between the end of the coil part close to the second surface in the first direction and the second surface may be larger than the distance d1 between the end of the coil part close to the first surface in the first direction and the first surface. Even if the relative magnetic permeability μ2 of the second region is smaller than the relative magnetic permeability μ1 of the first region, if d2>d1, the magnetic resistance of the second region can be avoided from becoming excessively high.

[0014] In the coil component described above, the annular conductor may be in contact with the first region at an end portion on the second surface side in the first direction. Since the first material is not present between the annular conductor and the first region, the benefits of providing the second region (such as suppression of dielectric breakdown) may be obtained more stably.

[0015] In another aspect, the present invention provides a method for manufacturing a coil component including a coil part having an annular conductor part having a central axis in a first direction and two electric ends, and a main body part including a magnetic powder, covering the annular conductor part with a first surface and a second surface aligned in the first direction. The manufacturing method includes arranging a laminated structure including the coil component, a first member at least a part of which is located on one side of the coil component in the first direction and including a first magnetic powder and a first hardenable material, and a second member located on the other side of the coil component in the first direction and including a second magnetic powder and a second hardenable material in a cavity of a mold, and increasing a pressure in the cavity, thereby obtaining a molded body including the coil component and the main body part from the laminated structure. In the molded body, a central region in which the entire outer periphery is in contact with the inner periphery of the annular conductor part is made of a material based on the first member.

[0016] In the above manufacturing method, the first member and the second member may differ in one or more selected from the group consisting of a composition of the first magnetic powder and a composition of the second magnetic powder, a particle size distribution of the first magnetic powder and a particle size distribution of the second magnetic powder, a content of the first magnetic powder in the first member and a content of the second magnetic powder in the second member, a composition of the first hardenable material and a composition of the second hardenable material, a content of the first hardenable material in the first member and a content of the second hardenable material in the second member, and, in a case where the first member contains a first additive component other than the first hardenable material and the first magnetic powder and the second member contains a second additive component other than the second hardenable material and the second magnetic powder, a composition of the first additive component and a composition of the second additive component.

[0017] In this specification, the term "curable material" includes materials that are cured and materials that cause curing (such as polymerization initiators). In addition, the term "additive component" refers to a material that is not ferromagnetic and does not react with the curable material, and specific examples include non-polymerizable materials for softening members and inorganic particles for improving insulation.

[0018] The manufacturing method may include curing the first curable material and the second curable material. In this case, a second material body generated by curing the second curable material in the second member may have higher insulation properties than a first material body generated by curing the first curable material in the first member.

[0019] Furthermore, the coil portion may have a first connecting conductor portion connected to one of the two electrical ends of the annular conductor portion, and a second connecting conductor portion connected to the other of the two electrical ends of the annular conductor portion, in which case the first connecting conductor portion is exposed from the second surface at the first end face, and the second connecting conductor portion is exposed from the second surface at the second end face, and in the molded body, the first connecting conductor portion and the second connecting conductor portion may have portions embedded in the second material body.

[0020] In another aspect, the present invention provides an electronic / electrical device having the above-mentioned coil component mounted thereon, the coil component being connected to a substrate at terminals provided on exposed conductors located at two ends of the coil section and exposed to the outside. Examples of such electronic / electrical devices include power supplies and small portable communication devices equipped with a power switching circuit, a voltage step-up circuit, a smoothing circuit, etc. The electronic / electrical device according to the present invention has excellent overall characteristics as an inductance element since it includes the above-mentioned coil component. Effect of the Invention

[0021] According to the present invention, it is possible to impart new functions to the main body of the coil component, such as a function of ensuring insulation against external electrodes, a function of suppressing short circuits within the coil component, a function of positioning the coil component within the main body component, and a function of suppressing breakage upon impact. By imparting such functions to the main body, the main body is made highly functional, and a coil component having excellent electrical and other properties is provided. When this coil component is mounted in an electronic or electric device, the performance of the electronic or electric device can be improved and the dimensions of the electronic or electric device can be reduced. Furthermore, according to the present invention, an electronic or electric device in which the coil component is mounted is provided. Furthermore, a method for manufacturing the above coil component is also provided. [Brief description of the drawings]

[0022] [Figure 1] FIG. 1 is a perspective view conceptually showing the shape of a coil component according to an embodiment of the present invention. [Diagram 2] 2 is an XZ cross-sectional view taken along line AA' in FIG. [Diagram 3] 3 is an XY cross-sectional view taken along line BB' in FIG. 2. [Figure 4] FIG. 13 is a diagram illustrating different shape distributions of magnetic powder particles. [Figure 5A] 5 is an explanatory diagram (comparative example) of an example of the function of a main body of a coil component according to one embodiment of the present invention. FIG. [Figure 5B] 5A to 5C are explanatory diagrams (examples of the present invention) of an example of the function of a main body of a coil component according to one embodiment of the present invention. [Figure 5C] FIG. 13 is a diagram illustrating different shape distributions of magnetic powder particles. [Figure 6] FIG. 11 is an XZ cross-sectional view illustrating a modified example (part 1) of the coil component according to one embodiment of the present invention. [Figure 7] FIG. 11 is an XZ cross-sectional view illustrating a modified example (part 2) of the coil component according to one embodiment of the present invention. [Figure 8] FIG. 11 is an XZ cross-sectional view illustrating a modified example (third example) of the coil component according to one embodiment of the present invention. [Figure 9] FIG. 11 is an XZ cross-sectional view illustrating a fourth modified example of the coil component according to an embodiment of the present invention. [Figure 10A] FIG. 2 is an explanatory diagram (part 1) of an example of a manufacturing method of a coil component according to an embodiment of the present invention, and is an XY plan view of a coil array sheet. [Figure 10B] FIG. 10B is an XZ cross-sectional view taken along line CC' in FIG. 10A. [Figure 11] FIG. 11 is an explanatory diagram (part 2) of an example of a manufacturing method for a coil component according to an embodiment of the present invention, and is an XZ cross-sectional view showing a state in which a coil array sheet, etc. is placed in a cavity of a mold. [Figure 12] FIG. 11 is an explanatory diagram (part 3) of an example of a manufacturing method for a coil component according to an embodiment of the present invention, and is an XZ cross-sectional view showing a state in which molding is performed using a mold to form a molded body. [Figure 13] FIG. 11 is an explanatory diagram (part 4) of the example of the manufacturing method of the coil component according to one embodiment of the present invention, showing a state before cutting the molded body. [Figure 14] FIG. 13 is an explanatory diagram (part 5) of the example of the manufacturing method of the coil component according to one embodiment of the present invention, showing a state in which the molded body is cut to obtain coil chips. [Figure 15] 6 is an explanatory diagram (part 1) of another example of the method for manufacturing a coil component according to one embodiment of the present invention. FIG. [Figure 16] 6 is an explanatory diagram (part 2) of another example of the method for manufacturing a coil component according to one embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0024] Fig. 1 is a perspective view conceptually showing the shape of a coil component according to an embodiment of the present invention. Fig. 2 is an XZ cross-sectional view taken along line A-A' in Fig. 1. For convenience of explanation, Fig. 2 also shows a state in which the coil component is joined to a substrate. Fig. 3 is an XY cross-sectional view taken along line B-B' in Fig. 2. Fig. 4 is a diagram explaining different shape distributions of magnetic powder.

[0025] (Overall composition) A coil component 100 according to one embodiment of the present invention includes a coil portion 10 having a coil conductor portion 20, a main body portion 30, a first external electrode 41, a second external electrode 42, and exterior coats 50 and 60.

[0026] (coil) As shown in FIG. 2 and FIG. 3, the coil portion 10 has a coil conductor portion 20 having a first spiral conductor portion 11 in a spiral shape around a central axis O along a first direction (Z1-Z2 direction). The first spiral conductor portion 11 is an example of a part of an annular conductor portion. The spiral shape of the first spiral conductor portion 11 is a shape that moves away from the central axis O from an inner circumference side end portion 12, which is an end portion on the inner circumference side of a pair of ends of the first spiral conductor portion 11, toward an outer circumference side end portion 13, which is an end portion on the outer circumference side of a pair of ends of the first spiral conductor portion 11. In FIG. 3, the first spiral conductor portion 11 has a conductor arranged in a spiral shape that moves away from the central axis O in a clockwise direction from the inner circumference side end portion 12 toward the outer circumference side end portion 13 when viewed from the Z1-Z2 direction Z1 side. In this specification, the "spiral direction" of the spiral portion means the direction from the inner circumference side end portion to the outer circumference side end portion.

[0027] The coil conductor portion 20 has a second spiral conductor portion 21 arranged alongside the first spiral conductor portion 11 in the first direction. The second spiral conductor portion 21 is another example of a part of an annular conductor portion. The second spiral conductor portion 21 has a spiral shape around a central axis O along the first direction (Z1-Z2 direction) that moves away from the central axis O from one end (inner circumference side end portion 22) that is an end portion on the inner circumference side of the second spiral conductor portion 21 to the other end (outer circumference side end portion 23) that is an end portion on the outer circumference side of the second spiral conductor portion 21. In the second spiral conductor portion 21, a conductor is arranged in a spiral shape that moves away from the central axis O in the opposite direction (counterclockwise in FIG. 3) to the first spiral conductor portion 11 when viewed from the Z1 side in the Z1-Z2 direction.

[0028] The average value of the separation distance in the first direction (Z1-Z2 direction) between the first spiral conductor portion 11 and the second spiral conductor portion 21 is not particularly limited. The smaller this separation distance, the easier it is to reduce the height (dimension in the Z1-Z2 direction) of the coil component 100, but if it is too small, the insulation between the first spiral conductor portion 11 and the second spiral conductor portion 21 is likely to decrease. From the viewpoint of achieving both a low profile (low height) of the coil component 100 and high insulation between the first spiral conductor portion 11 and the second spiral conductor portion 21, it may be preferable that the separation distance is 0.4 μm or more and 20 μm or less. In terms of reducing the variation in the separation distance and more reliably supporting the coil in the same plane in terms of manufacturing, the separation distance is more preferably 1.0 μm or more, and even more preferably 5.0 μm or more.

[0029] The conductor (conductive material) constituting the coil conductor portion 20 is not limited as long as it has appropriate conductivity. Specific examples of the conductor constituting the coil conductor portion 20 include metals such as copper, copper alloys, aluminum, and aluminum alloys, and the coil conductor portion 20 can be manufactured using a film forming technique such as plating. The coil portion 10 has an insulating coil insulation portion 80 on the surface of the coil conductor portion 20. This coil insulation portion 80 ensures insulation between adjacent conductors in the coil conductor portion 20 (between the surfaces of the conductors facing each other). The coil insulation portion 80 is not provided at the ends of the two ends (first lead-out end portion 14E, second lead-out end portion 24E) of the coil conductor portion 20, and the coil portion 10 can be electrically connected to other members at these ends.

[0030] The inner peripheral end 12 of the first spiral conductor portion 11 and the inner peripheral end 22 of the second spiral conductor portion 21 are electrically connected by the via portion VP. When the connection portion to the via portion VP is taken as the starting point, the first spiral conductor portion 11 and the second spiral conductor portion 21 are spiraled in opposite directions to each other. The via portion VP may be made of the same conductor as the coil conductor portion 20. In a specific example, the via portion VP is manufactured in the process of manufacturing the first spiral conductor portion 11 and the second spiral conductor portion 21. In this case, the via portion VP is integrated with the inner peripheral end 12 of the first spiral conductor portion 11 and the inner peripheral end 22 of the second spiral conductor portion 21. Therefore, in this embodiment, the annular conductor portion has the first spiral conductor portion 11 and the second spiral conductor portion 21 as well as the via portion VP, and the outer peripheral end portions 13 and 23 are two electrical ends of the annular conductor portion.

[0031] The first lead-out portion 14 is connected to the outer peripheral end 13 of the first spiral conductor portion 11, and the second lead-out portion 24 is connected to the outer peripheral end 23 of the second spiral conductor portion 21. Therefore, the outer peripheral end 13 of the first spiral conductor portion 11 is substantially an interface with the first lead-out portion 14, and the outer peripheral end 23 of the second spiral conductor portion 21 is substantially an interface with the second lead-out portion 24. In a specific example, the first lead-out portion 14 and the second lead-out portion 24 are manufactured together in the process of manufacturing the first spiral conductor portion 11 and the second spiral conductor portion 21. In this case, the first lead-out portion 14 has a portion that is integrated with the outer peripheral end 13 of the first spiral conductor portion 11 without a boundary, and the second lead-out portion 24 has a portion that is integrated with the outer peripheral end 23 of the second spiral conductor portion 21 without a boundary.

[0032] The coil component 100 according to this embodiment has a first connection conductor 15 extending from the first lead-out portion 14 toward the second surface 302 (Z2 side in the Z1-Z2 direction), and a second connection conductor 25 extending from the second lead-out portion 24 toward the second surface 302 (Z2 side in the Z1-Z2 direction). The first connection conductor 15 is exposed from the second surface 302 of the main body portion 30 at the first connection end 15E, and the second connection conductor 25 is exposed from the second surface 302 of the main body portion 30 at the second connection end 25E. That is, the first connection end 15E is a first exposed surface that is exposed from the main body portion 30 at the second surface 302 and contacts the first external electrode 41, and the second connection end 25E is a second exposed surface that is exposed from the main body portion 30 at the second surface 302 and contacts the second external electrode 42.

[0033] In this embodiment, the coil conductor portion 20 has a first spiral conductor portion 11, a first draw-out portion 14, a second spiral conductor portion 21, a second draw-out portion 24, a first connecting conductor portion 15, a second connecting conductor portion 25, and a via portion VP, which are manufactured so as to have integrated portions in a common manufacturing process.

[0034] (external electrode) 1, the coil component 100 according to this embodiment has external electrodes provided on the outside of the main body 30 as terminal portions of the coil component 100. In other words, the external electrodes are provided on exposed conductor portions that are portions of the coil portion 10 exposed to the outside. Specifically, the external electrodes include a first external electrode 41 and a second external electrode 42.

[0035] More specifically, the first external electrode 41 is continuous from a first lateral external electrode 41a located on the outer surface of the main body 30 to a first intersecting plane external electrode 41b located on the second surface 302 of the main body 30. The first intersecting plane external electrode 41b is a first covering portion of the first external electrode 41 that covers a part of the second surface 302. The first lateral external electrode 41a is electrically connected to the first extraction end 14E, and the first intersecting plane external electrode 41b is electrically connected to the first connection end 15E. The second external electrode 42 is continuous from a second lateral external electrode 42a located on the outer surface of the main body 30 to a second intersecting plane external electrode 42b located on the second surface 302 of the main body 30. The second intersecting plane external electrode 42b is a second covering portion of the second external electrode 42 that covers a part of the second surface 302. The second lateral external electrode 42a is electrically connected to the second extraction end portion 24E, and the second cross-plane external electrode 42b is electrically connected to the second connection end portion 25E.

[0036] 2, solder S1 is located between the first board electrode E1 and the first lateral external electrode 41a, which extend in the X1-X2 direction from a position on the board SB sufficiently distal to the first lateral external electrode 41a (on the X2 side in the X1-X2 direction) to a position facing the second surface 302, and between the first board electrode E1 and the first intersecting plane external electrode 41b. Similarly, solder S2 is located between the second board electrode E2 and the second lateral external electrode 42a, which extend in the X1-X2 direction from a position on the board SB sufficiently distal to the second lateral external electrode 42a (on the X1 side in the X1-X2 direction) to a position facing the second surface 302, and between the second board electrode E2 and the second intersecting plane external electrode 42b. Because the first board electrode E1 and the second board electrode E2 are so wide, stable electrical connections are obtained between the first external electrode 41 via the solder S1 and between the second external electrode 42 via the solder S2.

[0037] The material and configuration of the first external electrode 41 and the second external electrode 42 are not limited as long as they have appropriate conductivity. A non-limiting example of the first external electrode 41 and the second external electrode 42 is a layer having a structure of Cu plating / Ni plating / Sn plating from the side proximal to the surface of the main body 30. The first external electrode 41 and the second external electrode 42 may be composed of a coating type electrode in which a conductive material such as silver is dispersed in a resin or the like. The first external electrode 41 and the second external electrode 42 may also be a combination of plating and a coating type electrode.

[0038] (Exterior court) The upper surface (surface on the Z1 side in the Z1-Z2 direction) of the main body 30 and the side surfaces arranged in the Y1-Y2 direction are provided with insulating exterior coats 50 and 60 as surface insulating parts. An insulating exterior coat may also be provided on a portion of the bottom surface (surface on the Z2 side in the Z1-Z2 direction) of the main body 30 where the first intersecting plane external electrode 41b and the second intersecting plane external electrode 42b are not provided. The coil component 100 may not include the exterior coats 50 and 60. The exterior coats 50 and 60 can be formed at any position on the surface of the main body 30 depending on the purpose. The exterior coats 50 and 60 may include the metal magnetic powder contained in the main body 30. In this case, it may be preferable that the area of ​​the metal magnetic powder in the cross section of the exterior coats 50 and 60 is 50% or less of the area of ​​the metal magnetic powder in the cross section of the main body 30.

[0039] (Coil insulation) The coil insulating part 80 may be made of, for example, a resin material, but is not limited to a specific material, and may be an inorganic material or a mixture of an organic material and an inorganic material. The coil insulating part 80 may be thermoplastic, and a specific example of the thermoplastic resin may be a paraxylylene-based polymer. Other examples of the thermoplastic resin include polyethylene, polypropylene, polyamide, polyester, polyamide-imide, polyimide, polysulfone, polycarbonate, liquid crystal polymer, polyvinylidene fluoride, and polytetrafluoroethylene. The coil insulating part 80 may have thermoplastic properties as a whole, and may contain, for example, inorganic insulating particles in addition to the above-mentioned thermoplastic resin. In addition to the above-mentioned thermoplastic resin, examples of the material of the coil insulating part 80 include organic materials such as thermosetting resins and inorganic materials such as oxides.

[0040] The coil insulating portion 80 preferably has excellent insulating properties. Specifically, the volume resistivity obtained by ASTM D257 is preferably 1.0×10 14 In some cases, it may be preferable for the volume resistivity to be 1.0×10 Ωcm or more. 15 More preferably, it is 1.0×10 16 It is more preferable that the volume resistivity is 1.0×10 Ωcm or more. The upper limit of the volume resistivity is not particularly limited. 20It may be Ωcm or less. In addition, it is preferable that the coil insulating part 80 has excellent dielectric properties, and specifically, it may be preferable that the relative dielectric constant at 60 Hz obtained by ASTM D150 is 4.0 or less. This relative dielectric constant is more preferably 3.5 or less, and even more preferably 3.0 or less. The lower limit of this relative dielectric constant is not particularly limited. The relative dielectric constant may be 1.0 or more. The method for measuring the volume resistivity and relative dielectric constant of the coil insulating part 80 is not limited as long as the results are expected to be equivalent to those obtained by the above-mentioned ASTM D257 and D150. For example, a method is exemplified in which a measurement sample is separately prepared by preparing a material corresponding to the coil insulating part 80 to a size required for measurement, and the constituent materials are identified using this measurement sample through analysis methods such as component analysis and FT-IR, and the characteristics of the material, such as volume resistivity, are evaluated.

[0041] (Main body) The main body 30 covers the first spiral conductor 11 and the second spiral conductor 21 at least with a pair of intersecting surfaces (first surface 301, second surface 302) arranged in a first direction (Z1-Z2 direction), and contains magnetic powder and a binder. In this embodiment, the main body 30 has four outer surfaces extending in the first direction (Z1-Z2 direction) between the pair of intersecting surfaces, and has a substantially rectangular parallelepiped shape. The main body 30 includes a portion other than the outermost end surface (X2 side in the X1-X2 direction and both sides in the Z1-Z2 direction) of the first lead-out portion 14 and the outermost end surface (X1 side in the X1-X2 direction and both sides in the Z1-Z2 direction) of the second lead-out portion 24, which are located at the end of the coil portion 10.

[0042] The coil portion 10 is exposed from the surface of the main body portion 30 at a first end face (first pull-out end 14E, first connection end 15E) connected to one of the two electrical ends of the annular conductor portion (outer peripheral end 13), and at a second end face (second pull-out end 24E, second connection end 25E) connected to the other of the two electrical ends of the annular conductor portion (outer peripheral end 23).

[0043] The main body 30 is composed of a first region 31 made of a first material and including a first surface 301, and a second region 32 made of a second material and including at least a part of a second surface 302. The first region 31 includes a central region CR whose entire outer periphery faces the inner periphery of the annular conductor (the first spiral conductor 11 and the second spiral conductor 21, and the via portion VP). The length (thickness) of the central region CR in the first direction is appropriately set according to the characteristics required for the central region CR and the shape of the inner periphery side of the annular conductor. The thickness of the central region CR may be equal to the length of the annular conductor in the first direction (the thickness of the annular conductor), or may be half the thickness of the annular conductor, or may be, for example, 1 / 4. When the thickness of the central region CR is thinner than the thickness of the annular conductor portion, the central region CR may be positioned biased toward the first surface 301, may be positioned biased toward the second surface 302, or may be positioned so as to be approximately evenly spaced from the first surface 301 and the second surface 302.

[0044] In this embodiment, the first material and the second material differ in one or more properties selected from the group consisting of the following [1] to [6]. [1] Composition of magnetic powder [2] Shape distribution, which is the distribution of the shape of magnetic powder [3] Magnetic powder content [4] Binder composition [5] Binder content [6] If a third component other than the magnetic powder and binder is included, its composition and content

[0045] By making the first material and the second material different in at least one of these properties, it is possible to make the characteristics of the first region 31 and the second region 32 in the main body portion 30 different. As a result, it may be possible to impart an additional function to the main body portion 30.

[0046] The positional relationship between the boundary between the first region 31 and the second region 32 arranged in the first direction in the main body 30 and the end in the first direction of the portion of the coil section 10 where the annular conductor is located is not particularly limited. For example, the portion of the coil section 10 consisting of the annular conductor may contact the second region 32 at the end in the first direction. In FIG. 2, the end (second end 102) on the Z2 side in the Z1-Z2 direction of the portion of the coil section 10 where the second spiral conductor 21 is located contacts the second region 32. In this way, since there is no other material (e.g., the first material) between the portion of the coil section 10 consisting of the annular conductor and the second region 32, the benefit of providing the second region 32 (such as improved insulation) may be more stably enjoyed in some cases.

[0047] (Magnetic powder) Here, the magnetic powder will be described. The composition of the magnetic powder can be classified into a case where the magnetic substance of the magnetic powder is made of a conductive material and a case where the magnetic substance of the magnetic powder is made of an insulating material.

[0048] A specific example of the conductive material is a metal material, and when the magnetic powder is a metal magnetic powder, the crystallographic structure is not limited. This structure may include a crystalline phase or an amorphous phase. Here, a crystalline material is defined as a material consisting of a crystalline phase, an amorphous material is defined as a material consisting of an amorphous phase, and a composite material is defined as a material consisting of a crystalline phase and an amorphous material. If a diffraction spectrum obtained by a general X-ray diffraction method includes a sharp diffraction peak that can identify the type of crystalline phase, the material includes a crystalline phase. If a diffraction spectrum obtained by a general X-ray diffraction method includes a broad peak indicating an amorphous phase, the material includes an amorphous phase. If a DSC curve obtained by differential thermal analysis includes a peak indicating crystallization, that is, heat generation associated with a phase change from an amorphous phase to a crystalline phase, the material also includes an amorphous phase.

[0049] The material system of the magnetic body is not limited. Specific examples of crystalline materials include Fe-Si-Cr alloys, Fe-Ni alloys, Fe-Co alloys, Fe-V alloys, Fe-Al alloys, Fe-Si alloys, Fe-Si-Al alloys, pure iron, and Mn-Zn ferrite. Carbonyl iron powder is preferable as the powder of pure iron. Specific examples of amorphous materials include Fe-Si-B alloys, Fe-PC alloys, and Co-Fe-Si-B alloys. Specific examples of composite materials include Fe-Zr alloys, Fe-Zr-B alloys, Fe-Nb-B alloys, Fe-Si-B-Nb-Cu alloys, and Fe-Si-BP-Cu alloys. When the magnetic body contains Fe, the synergistic effect of improving the magnetic properties is particularly large.

[0050] The chemical composition of the magnetic material is not limited. For example, the Fe-Si-Cr alloy may be composed of 1.0-10.0 mass% Si, 1.0-10.0 mass% Cr, and the balance of Fe and impurities. Also, for example, the Fe-Ni alloy may be composed of 1.0-99.0 mass% Ni, and the balance of Fe and impurities. Furthermore, for example, the Fe-PC alloy may be composed of 1.0-13.0 atomic% P, 1.0-13.0 atomic% C, Fe, and impurities. This Fe-PC alloy may contain one or more elements selected from the group consisting of Ni, Sn, Cr, B, and Si as optional elements. In this case, for example, the amount of Ni may be 0-10.0 atomic%, the amount of Sn may be 0-3.0 atomic%, the amount of Cr may be 0-6.0 atomic%, the amount of B may be 0-9.0 atomic%, and the amount of Si may be 0-7.0 atomic%. The amount of Fe is preferably 65 atomic % or more. For example, the Fe-Si-B-Nb-Cu alloy may be composed of 1.0 to 16.0 atomic % of Si, 1.0 to 15.0 atomic % of B, 0.50 to 5.0 atomic % of Nb, 0.50 to 5.0 atomic % of Cu, and the balance being composed of Fe and impurities. In this case, the amount of Fe is preferably 65 atomic % or more.

[0051] A specific example of the magnetic powder made of insulating material is Ni-Zn ferrite.

[0052] The magnetic powder may be subjected to a surface insulating treatment. When the magnetic powder is subjected to a surface insulating treatment, the insulation resistance of the main body 30 is improved. The type of surface insulating treatment applied to the magnetic powder is not limited. Examples include phosphoric acid treatment, phosphate treatment, and oxidation treatment. The magnetic powder may have an insulating coating on the surface of the magnetic particles. This insulating coating may contain at least one selected from the group consisting of Si, P, and B, and O (oxygen).

[0053] The magnetic powder may be a mixture of multiple powder materials. The magnetic powder is preferably a ferromagnetic material, and more preferably a soft magnetic material.

[0054] The shape distribution, which is the distribution related to the shape of the magnetic powder, includes the shape of the magnetic powder itself (spherical, acicular, amorphous, etc.), the distribution related to the particle size, etc. An example of the range of the particle size of the magnetic powder is, for example, 0.10 to 50.0 μm. Specific examples of the distribution related to the particle size include a volumetric particle size distribution obtained by subjecting the magnetic powder to particle size measurement by a laser diffraction / scattering method, and a distribution of the average circular equivalent diameter of the magnetic powder obtained by analyzing an image (secondary electron image) obtained by photographing the cut surface of the main body 30 with a scanning electron microscope.

[0055] (Binder) In the main body 30, the binder contained in the second region 32 may contain a second polymer, and the binder contained in the first region 31 may contain a first polymer. Since the physical properties of a polymer can be easily adjusted by adjusting the monomer composition and the degree of polymerization, the binder containing a polymer makes it easy to adjust the properties of the binder. Examples of the polymer include acrylic resin, silicone resin, epoxy resin, phenol resin, urea resin, melamine resin, and polyester resin. The binder may contain an inorganic material, a specific example of which is a glass-based material such as water glass.

[0056] The weight average molecular weight of the second polymer may be larger than the weight average molecular weight of the first polymer. The second region 32 including the polymer with a relatively large molecular weight tends to have higher insulating properties and mechanical properties as a whole than the first region 31. In this case, the difference between the weight average molecular weight of the second polymer and the weight average molecular weight of the first polymer may be 1% or more and 5% or less based on the weight average molecular weight of the second polymer. The benefits of the second region 32 being higher in terms of insulating properties and mechanical properties can be stably enjoyed.

[0057] The density of unreacted groups in the second polymer may be lower than that of unreacted groups in the first polymer. Examples of unreacted groups include active functional groups that are highly reactive with other functional groups, such as glycidyl groups, isocyanate groups, and carboxy groups, and functional groups having active hydrogen that react with such active functional groups (such as hydroxyl groups and amino groups). When the polymer is polymerized using a radical polymerization catalyst, ethylenic unsaturated bonds can also be unreacted groups.

[0058] The second region 32 containing the polymer with a relatively low density of unreacted groups tends to have higher insulating properties and mechanical properties overall than the first region 31. In this case, the difference between the density of unreacted groups in the second polymer and the density of unreacted groups in the first polymer may be 1% or more and 5% or less based on the density of unreacted groups in the second polymer. The second region 32 can stably enjoy the benefits of having higher insulating properties and mechanical properties.

[0059] In the case where the second material contains a polymerization catalyst for forming a binder and the first material contains a polymerization catalyst for forming a binder, the content of the polymerization catalyst in the second material may be greater than the content of the polymerization catalyst in the first material. The polymerization catalyst is appropriately set according to the monomer for forming the polymer. Examples of the polymerization catalyst include a urethane polymerization catalyst such as 2-(dimethylamino)ethanol, an epoxy polymerization catalyst such as tetrabutylphosphonium bromide, and an olefin polymerization catalyst such as a metallocene compound. The second region 32 containing a polymer with a relatively high content of the polymerization catalyst tends to have high strength and high viscosity as a whole. In this case, the difference between the content of the polymerization catalyst in the second material and the content of the polymerization catalyst in the first material may be 1% or more and 5% or less based on the content of the polymerization catalyst in the second material. The second region 32 can stably enjoy the benefits of having high insulation and mechanical properties.

[0060] The hardness of the binder contained in the second region 32 measured by a nanoindenter may be smaller than the hardness of the binder contained in the first region 31 measured by a nanoindenter. The second region 32 containing a relatively hard binder tends to have higher insulating properties and mechanical properties than the first region 31 as a whole. In this case, the difference between the hardness of the second binder measured by a nanoindenter and the hardness of the first binder measured by a nanoindenter may be 1% or more and 5% or less based on the hardness of the second binder measured by a nanoindenter. The benefits of the second region 32 being higher in terms of insulating properties and mechanical properties can be stably enjoyed.

[0061] (Insulating) In the main body 30, the second material may have higher insulating properties than the first material. In this case, a new function of ensuring insulation against external electrodes is imparted to the main body 30. When the second surface 302 is the mounting surface side (the side facing the substrate SB) as shown in FIG. 2 and other figures, short circuits are less likely to occur on the mounting surface side. In particular, when bottom electrodes such as the first intersecting plane external electrode 41b and the second intersecting plane external electrode 42b are provided as in this embodiment, insulation between the bottom electrodes and the main body 30 is ensured, so that short circuits are less likely to occur between the bottom electrodes.

[0062] One method for making the insulating property of the second material higher than that of the first material is to make the resistivity of the second region 32 higher than that of the first region 31.

[0063] When the magnetic powder contains metal magnetic powder, it may be preferable that the relative magnetic permeability μ2 of the second region 32 is smaller than the relative magnetic permeability μ1 of the first region 31 from the viewpoint of stably realizing that the second material has higher insulating properties than the first material. When the magnetic powder contains metal magnetic powder, the magnetic powder may come into contact with the inside of the main body 30, increasing the possibility of forming a conductive path that reduces the insulating properties. Therefore, one method for relatively increasing the insulating properties of the second region 32 is to increase the content of insulating material in the second material. In this case, the content of metal magnetic powder is reduced, so that the relative magnetic permeability μ2 of the second region 32 is likely to be smaller than the relative magnetic permeability μ1 of the first region 31.

[0064] In this case, the distance d2 between the end of the coil portion 10 proximal to the second surface 302 in the first direction, i.e., the second end 102, and the second surface 302 may be greater than the distance d1 between the first end 101 and the first surface 301. Even if the relative permeability μ2 of the second region 32 is smaller than the relative permeability μ1 of the first region 31, as long as d2>d1, it is possible to prevent the magnetic resistance of the second region 32 from becoming excessively high.

[0065] When μ2<μ1 as described above, the following formula (1) may be satisfied. When the following formula (1) is satisfied, the magnetic resistance of the second region 32 is unlikely to become excessively high. Therefore, deterioration of the magnetic characteristics of the coil device 100 is more reliably avoided. |μ1×d1-μ2×d2| / (μ1×d1)≦0.1 (1)

[0066] In order to more stably achieve an insulating property of the second material greater than that of the first material when the magnetic powder contains metal magnetic powder, when the second region 32 is cut in a plane perpendicular to the first direction (XY plane) to obtain a second cut surface, and the first region 31 is cut in a plane perpendicular to the first direction to obtain a first cut surface, at least one of the following (A) or (B) may be satisfied. (A) a second area ratio, which is an area ratio of the magnetic powder on the second cut surface, is lower than a first area ratio, which is an area ratio of the magnetic powder on the first cut surface. (B) A second average equivalent circular diameter, which is an average equivalent circular diameter of the magnetic powder at the second cut surface, is larger than a first average equivalent circular diameter, which is an average equivalent circular diameter of the magnetic powder at the first cut surface.

[0067] With regard to (A), by making the second area ratio<the first area ratio, μ2<μ1 is easily realized. In this case, the area ratio of the binder is higher in the second region 32, so the insulating property of the second region 32 is easily increased. FIG. 4 is used as an example. FIG. 4 is a diagram for explaining the different shape distribution of the magnetic powder, the left figure corresponds to an observation image of the first cut surface, and the right figure corresponds to an observation image of the second cut surface. Within the region of the dashed circle, the cross section of the magnetic powder is shown hatched, and the cross section of the material (matrix) other than the magnetic powder, such as the binder, is shown colorless. A specific example of the binder is a polymer, as described later, and in this case, the magnetic powder, which is a metal magnetic powder, has lower insulating properties than the matrix. Therefore, of the two diagrams shown in FIG. 4, when the cross section shown in the left diagram, in which the area ratio of the magnetic powder is relatively low, is the second cut surface, and the cross section shown in the right diagram is the first cross section, (A) is satisfied.

[0068] Regarding (B), when the average equivalent circular diameter of the magnetic powder is relatively large, the filling rate is likely to decrease. Therefore, by making the second average equivalent circular diameter > the first average equivalent circular diameter, μ2 < μ1 is likely to be realized. In this case, the area ratio of the binder is likely to be higher in the second region 32, and therefore the resistivity of the second region 32 is likely to be higher.

[0069] From the viewpoint of more stably realizing the insulation of the second material to be higher than that of the first material, the second material may contain insulating inorganic particles as a third component. Many insulating inorganic particles have a higher dielectric strength than the binder, and this tendency is remarkable when the binder is a polymer. By including inorganic particles as a third component of the second material, the possibility of dielectric breakdown occurring in the second region 32 can be reduced. The type of inorganic particles is not limited. Inorganic oxide particles such as silica, alumina, and zirconia may be preferable from the viewpoint of availability.

[0070] From the viewpoint of more stably realizing the insulation property of the second material to be higher than that of the first material, the magnetic powder contained in the second region 32 may include a metal magnetic powder having an insulating coating on its surface. When the magnetic powder is a metal magnetic powder, the magnetic powder forms a conductive path in the event of dielectric breakdown. Therefore, by having an insulating coating on the surface of the metal magnetic powder, it may be possible to reduce the possibility of dielectric breakdown occurring in the second region 32.

[0071] (Prevents short circuits in the coil) Fig. 5A is an explanatory diagram (comparative example) of an example of the function of the main body of the coil component according to one embodiment of the present invention, Fig. 5B is an explanatory diagram (inventive example) of an example of the function of the main body of the coil component according to one embodiment of the present invention, and Fig. 5C is a diagram explaining the difference in shape distribution of the magnetic powder.

[0072] 5A, a coil insulation section 80 is provided around the first spiral conductor section 11 and the second spiral conductor section 21 to prevent a short circuit between the turns of the same spiral conductor section. In addition, an insulating interposer 90 is disposed between the first spiral conductor section 11 and the second spiral conductor section 21 as an insulating section to prevent a short circuit between the turn of the first spiral conductor section 11 and the turn of the second spiral conductor section 21 aligned with this turn in the first direction.

[0073] However, when the magnetic powder MP1 contained in the first material constituting the first region 31 contains a metal magnetic powder, if the particle size of the magnetic powder MP1 is larger than the thickness of the interposer 90, there is a concern that the magnetic powder MP1 may be positioned so as to form a short circuit path EP between the turn of the first spiral conductor portion 11 and the turn of the second spiral conductor portion 21, as shown in FIG. 5A. A similar short circuit phenomenon may occur between the first lead-out portion 14 and the turn of the second spiral conductor portion 21, or between the second lead-out portion 24 and the turn of the first spiral conductor portion 11. When a material containing the magnetic powder MP1 is placed around the coil portion 10 and pressurized to form the main body portion 30, the magnetic powder MP1 may come into contact with the conductor of the coil portion 10 while partially destroying the insulating portion (coil insulating portion 80, interposer 90) of the coil portion 10, and at this time, the possibility of the above-mentioned short circuit phenomenon occurring increases.

[0074] Therefore, by making the shape distribution of the magnetic powder MP1 contained in the first material different from that of the magnetic powder MP2 contained in the second material, a new function of suppressing short circuits in the coil section 10 is imparted to the main body section 30. In Fig. 5B, the magnetic powder MP1 contained in the first material is a metal magnetic powder having a smaller diameter than the magnetic powder MP2 contained in the second material. Therefore, even if the magnetic powder MP1 comes into contact with the conductor of the coil section 10 while partially destroying the insulating section (coil insulating section 80, interposer 90) of the coil section 10, a short circuit is unlikely to occur.

[0075] The material constituting the interposer 90 is not limited as long as it has appropriate insulating properties. The interposer 90 has a volume resistivity of 1.0×10 14 In some cases, it may be preferable for the volume resistivity to be 1.0×10 Ωcm or more. 15 More preferably, it is 1.0×10 16 It is more preferable that the volume resistivity is 1.0×10 Ωcm or more. The upper limit of the volume resistivity is not particularly limited. 20 The dielectric constant of the interposer 90 may be Ωcm or less. In addition, it is preferable that the interposer 90 has excellent dielectric properties, and specifically, it may be preferable that the relative dielectric constant at 60 Hz obtained by ASTM D150 is 4.0 or less. This relative dielectric constant is more preferably 3.5 or less, and even more preferably 3.0 or less. The lower limit of this relative dielectric constant is not particularly limited. The relative dielectric constant may be 1.0 or more. To measure the volume resistivity and relative dielectric constant of the interposer 90, a material corresponding to the interposer 90 that is separately prepared is prepared to a size required for measurement and used. The material corresponding to the interposer 90 can be identified, for example, through an analysis method such as component analysis or FT-IR, as in the case of the coil insulating part 80.

[0076] The material constituting the interposer 90 may be made of an organic material, may be made of an inorganic material, or may be a composite material of an organic material and an inorganic material. When the interposer 90 is made of a composite material, the inorganic material may have a particle shape and may be dispersed in a matrix made of an organic material. Specific examples of the organic material include polyimide resin, polyethylene resin, polypropylene resin, polyamide resin, polyester resin, polyamideimide resin, polysulfone resin, polycarbonate resin, liquid crystal polymer resin, polyvinylidene fluoride resin, and polytetrafluoroethylene resin. Specific examples of inorganic materials, particularly inorganic materials in composite materials, include inorganic materials such as oxides, carbides, nitrides, and inorganic salts. Examples of oxides include silica, alumina, and zirconia. Examples of carbides and nitrides include inorganic materials such as silicon carbide and boron nitride, respectively. Examples of inorganic salts include minerals such as wollastonite, kaolin, and mica. Among these, oxide-based materials such as oxides, silicates, and phosphates are preferable in terms of cost and insulation. For example, it is preferable that the inorganic material contains at least one selected from the group consisting of silicon (Si), phosphorus (P), boron (B), and calcium (Ca).

[0077] From the viewpoint of more stably reducing the possibility of the above-mentioned short circuit phenomenon occurring, it may be preferable that, with regard to the shape distribution of the magnetic powder, when the second region is cut in a plane perpendicular to the first direction to obtain a second cut surface, and the first region is cut in a plane perpendicular to the first direction to obtain a first cut surface, the second cut surface and the first cut surface are compared to satisfy at least one of the following (a) to (d). (a) A first average equivalent circle diameter, which is the average equivalent circle diameter of the magnetic powder MP1 at the first cut surface, is smaller than a second average equivalent circle diameter, which is the average equivalent circle diameter of the magnetic powder MP2 at the second cut surface. (b) A first median diameter, which is the median diameter of the magnetic powder MP1 at the first cut surface, is smaller than a second median diameter, which is the median diameter of the magnetic powder MP2 at the second cut surface. (c) A first maximum equivalent circle diameter, which is a maximum equivalent circle diameter of the magnetic powder MP1 at the first cut surface, is smaller than a second maximum equivalent circle diameter, which is a maximum equivalent circle diameter of the magnetic powder MP2 at the second cut surface. (d) At least one of the second diameter distribution, which is the distribution of the circular equivalent diameters of the magnetic powder MP2 on the second cross section, and the first diameter distribution, which is the distribution of the circular equivalent diameters of the magnetic powder MP1 on the first cross section, has two or more peaks, and the first peak diameter, which is the circular equivalent diameter with the highest frequency at the peak on the largest diameter side among the peaks in the first diameter distribution, is smaller than the second peak diameter, which is the circular equivalent diameter with the highest frequency at the peak on the largest diameter side among the peaks in the second diameter distribution.

[0078] Regarding (a), since the first region 31 is more likely to contain magnetic powder with a relatively small particle size, when the main body portion 30 is formed by applying pressure to a material containing magnetic powder MP1, even if the insulating portion (coil insulating portion 80, interposer 90) provided on the surface of the annular conductor portion (first spiral conductor portion 11, second spiral conductor portion 21, and via portion VP) is locally broken by the magnetic powder due to the application of pressure, a short circuit is less likely to occur within the annular conductor portion.

[0079] The difference between the second average equivalent circle diameter and the first average equivalent circle diameter may be preferably 1% or more and 5% or less based on the second average equivalent circle diameter. From the viewpoint of preventing short circuits in the annular conductor part (the first spiral conductor part 11, the second spiral conductor part 21, and the via part VP), the smaller the first average equivalent circle diameter, the more preferable it is. However, since a small average equivalent circle diameter tends to increase the packing rate, if the first average equivalent circle diameter is excessively small, the packing rate of the second region 32 becomes relatively low, and there is a concern that the magnetic resistance of the second region 32 increases. If the above range is set, it is possible to appropriately suppress short circuits in the annular conductor part while suppressing the magnetic resistance of the second region 32 from becoming too high relatively.

[0080] Regarding (b), since the first region 31 is more likely to contain magnetic powder with a relatively small particle size, when the main body 30 is formed by applying pressure to a material containing magnetic powder MP1, even if the insulating portion provided on the surface of the annular conductor portion is locally broken by the magnetic powder due to the application of pressure, a short circuit is less likely to occur within the annular conductor portion.

[0081] The difference between the second median diameter and the first median diameter may be 1% or more and 5% or less based on the second median diameter. From the viewpoint of preventing short circuits in the annular conductor, the smaller the first median diameter, the more preferable. However, since a small median diameter tends to increase the packing rate, if the first median diameter is excessively small, the packing rate of the second region 32 becomes relatively low, and there is a concern that the magnetic resistance of the second region 32 increases. If the above range is set, it is possible to appropriately suppress short circuits in the annular conductor while suppressing the magnetic resistance of the second region 32 from becoming too high relatively.

[0082] Regarding (c), since the first region 31 is more likely to contain magnetic powder with a relatively small particle size, when the main body 30 is formed by applying pressure to a material containing magnetic powder MP1, even if the insulating portion provided on the surface of the annular conductor portion is locally broken by the magnetic powder MP1 due to the application of pressure, a short circuit is less likely to occur within the annular conductor portion.

[0083] The difference between the second maximum equivalent circle diameter and the first maximum equivalent circle diameter may preferably be 1% or more and 5% or less based on the second maximum equivalent circle diameter. From the viewpoint of preventing short circuits in the annular conductor, the smaller the first maximum equivalent circle diameter, the more preferable it is. However, since a small maximum equivalent circle diameter may tend to increase the packing rate, if the first maximum equivalent circle diameter is excessively small, the packing rate of the second region 32 may be relatively low, and there may be a concern that the magnetic resistance of the second region 32 may increase. If the above range is set, it is possible to appropriately suppress short circuits in the annular conductor while suppressing the magnetic resistance of the second region 32 from becoming too high relatively.

[0084] It may be preferable that the second maximum equivalent circle diameter is 12.0 μm or more and 50.0 μm or less, and the first maximum equivalent circle diameter is 2.0 μm or more and 10.0 μm or less. By being in the above range, it is more likely that the effect of an increase in the magnetic resistance of the second region 32 can be suppressed while appropriately suppressing a short circuit in the annular conductor portion.

[0085] Regarding (d), since the first region 31 is more likely to have magnetic powder with a relatively small particle size, when the main body 30 is formed by pressurizing a material containing the magnetic powder MP1, even if the insulating portion provided on the surface of the annular conductor is locally broken by the magnetic powder MP1 due to pressurization, a short circuit is unlikely to occur in the annular conductor. Of the two distributions of circle equivalent diameters shown in FIG. 5C, the distribution on the right has two peaks. Comparing the peaks on the largest diameter side of the peaks of both distributions, the distribution on the right has a larger diameter. Therefore, of the two distributions of circle equivalent diameters shown in FIG. 5C, the left side is an example of the first diameter distribution, and the right side is an example of the second diameter distribution.

[0086] The difference between the second peak diameter and the first peak diameter may be preferably 1% or more and 5% or less based on the second peak diameter. From the viewpoint of preventing short circuits in the annular conductor, the smaller the first peak diameter, the more preferable it is. However, since a small peak diameter tends to increase the packing rate, if the first peak diameter is excessively small, the packing rate of the second region 32 becomes relatively low, and there is a concern that the magnetic resistance of the second region 32 increases. If the above range is set, it is possible to appropriately suppress short circuits in the annular conductor while suppressing the magnetic resistance of the second region 32 from becoming too high relatively.

[0087] It may be preferable that the second diameter distribution has a larger number of peaks than the first diameter distribution. In the second region 32 containing the relatively large diameter magnetic powder, the small diameter magnetic powder is contained to an extent that the small diameter magnetic powder has a peak, so that it is easy to increase the packing rate of the magnetic powder MP2, and the magnetic properties of the second region 32 are easily improved. Of the two distributions of the equivalent circle diameters shown in Figure 5C, the distribution on the right, which is an example of the second diameter distribution, has two peaks.

[0088] When the magnetic powder MP1 contains metal magnetic powder and the above-mentioned short circuit is a concern, from the standpoint of more stably reducing the possibility of the short circuit phenomenon occurring, it may be preferable that at least one of the second particle size distribution which is the volumetric particle size distribution of the magnetic powder contained in the second region 32 and the first particle size distribution which is the volumetric particle size distribution of the magnetic powder contained in the first region 31 has two or more peaks, and that the first particle size which is the particle size with the greatest frequency at the peak on the largest diameter side among the peaks in the first particle size distribution is smaller than the second particle size which is the particle size with the greatest frequency at the peak on the largest diameter side among the peaks in the second particle size distribution.

[0089] Since the first region 31 is more likely to contain magnetic powder with a relatively small particle size, when the main body 30 is formed by applying pressure to a material containing magnetic powder MP1, even if the insulating portion provided on the surface of the annular conductor portion is locally broken by the magnetic powder MP1 due to the application of pressure, a short circuit is less likely to occur within the annular conductor portion.

[0090] The difference between the second particle size and the first particle size may preferably be 1% or more and 5% or less based on the second particle size. From the viewpoint of preventing short circuits in the annular conductor, the smaller the first particle size, the more preferable. However, since a small particle size as defined above may tend to increase the packing rate, if the first particle size is excessively small, the packing rate of the second region 32 may become relatively low, and there may be a concern that the magnetic resistance of the second region 32 may increase. If the difference is within the above range, it is possible to appropriately suppress short circuits in the annular conductor while suppressing the magnetic resistance of the second region 32 from becoming too high relatively.

[0091] It may be preferable that the second particle size distribution has a larger number of peaks than the first particle size distribution. In the second region 32 containing the relatively large diameter magnetic powder, the small diameter magnetic powder is contained to an extent that the small diameter magnetic powder has a peak, so that it is easy to increase the packing rate of the magnetic powder MP2, and the magnetic properties of the second region 32 are easily improved.

[0092] (Mechanical properties) The second material may be harder than the first material. Since most of the second region 32 is an area where the coil portion 10 does not exist, by making the second region 32 hard, defects due to loss or deformation of the main body portion 30 are less likely to occur. In addition, as described below, when the main body portion 30 is formed by pressing a material containing a magnetic powder and a hardenable material in a first direction, it becomes easier to control the position of the coil portion 10 within the main body portion 30.

[0093] From the standpoint of reliably realizing that the second material is harder than the first material, it may be preferable that the second area ratio, which is the area ratio of the magnetic powder in the second cut surface obtained by cutting the second region 32 in a plane perpendicular to the first direction, is higher than the first area ratio, which is the area ratio of the magnetic powder in the first cut surface obtained by cutting the first region 31 in a plane perpendicular to the first direction.

[0094] From the viewpoint of achieving both the harder second region 32 and maintaining appropriate magnetic and electrical characteristics of the coil component 100 by suppressing the effect of high magnetic resistance in the first region 31, it may be preferable that the difference between the second area ratio and the first area ratio be 1% or more and 5% or less based on the second area ratio.

[0095] (Modification) FIG. 6 is an XZ cross-sectional view for explaining a modified example (part 1) of a coil component according to an embodiment of the present invention. The coil component 100A according to one of the modified examples of this embodiment shown in FIG. 6 has a basic structure in common with the coil component 100, so only the differences in structure will be explained, and the common structure will be omitted. In the coil component 100A according to this example, an intermediate layer 33 made of a mixed material of a first material and a second material is present between the first region 31 and the second region 32. Such an intermediate layer 33 is inevitably formed depending on the manufacturing method. The intermediate layer 33 may include a gradient region in which the composition changes in a direction including the first direction. By having such an intermediate layer 33, it may be possible to avoid influences based on changes in characteristics between regions, such as a local increase in magnetic resistance and a local decrease in mechanical characteristics.

[0096] 7 is an XZ cross-sectional view for explaining a modified example (part 2) of the coil component according to an embodiment of the present invention. The coil component 100B according to one of the modified examples of this embodiment shown in FIG. 7 has a basic structure in common with the coil component 100, so only the differences in structure will be explained, and the explanation of the common structure will be omitted. In the coil component 100 shown in FIG. 2 and the like, the second region 32 includes the entire second surface 302 of the main body 30, but in the coil component 100B according to this example, the second region 32 has a first facing portion 32F1 facing the first intersecting plane external electrode 41b corresponding to the first covering portion of the first external electrode 41, and a second facing portion 32F2 facing the second intersecting plane external electrode 42b corresponding to the second covering portion of the second external electrode 42. Therefore, the second region 32 includes a part of the second surface 302, and the first region 31 includes a part of the second surface 302 that is not included in the second region 32. Since the first region 31 and the second region 32 are arranged in such a manner, even if the second region 32 has a trade-off function (high insulation but low magnetic permeability), it is possible to minimize the effect of the second region 32 while obtaining the benefit of providing the second region 32.

[0097] In addition, coil component 100 including all of second surface 302 of main body portion 30 as shown in Figure 2 etc., in relation to coil component 100B, can also be said to include first opposing portion 32F1 and second opposing portion 32F2, and to have continuous portion 32C that is continuous with both first opposing portion 32F1 and second opposing portion 32F2 and includes part of second surface 302.

[0098] Fig. 8 is an XZ cross-sectional view for explaining a modified example (part 3) of the coil component according to an embodiment of the present invention. The coil component 100C according to one of the modified examples of this embodiment shown in Fig. 8 has a basic structure in common with the coil component 100, so only the differences in structure will be explained, and the explanation of the common structure will be omitted. The annular conductor portion of the coil component 100 is in contact with the second region 32 at the second end portion 102, which is the end portion on the second surface 302 side in the first direction, but in the coil component 100C according to this example, the second end portion 102 of the annular conductor portion is in contact with the first region 31.

[0099] That is, in the coil device 100C according to this example, the first region 31 extends in the first direction so as to be in contact with both of the two ends (the first end 101 and the second end 102) in the first direction in the portion of the coil section 10 where the annular conductor is located, and specifically, the first region 31 includes a first surface 301, is in contact with the first end 101, and is composed of a main portion 31C including a central region CR, and an extending portion 31E in contact with the second end 102 and extends in the XY direction. In this way, since the materials in contact with the annular conductor are all the first material, there are cases where the benefits of providing the first region 31 made of the first material (such as suppression of short circuits in the coil section 10 due to local breakage of the insulating portion) can be enjoyed more stably.

[0100] FIG. 9 is an XZ cross-sectional view for explaining a modified example (part 4) of the coil component according to an embodiment of the present invention. The coil component 100D according to one of the modified examples of this embodiment shown in FIG. 9 has a basic structure in common with the coil component 100, so only the differences in structure will be explained, and the explanation of the common structure will be omitted. In the coil component 100D according to this example, the first external electrode 41 does not have the first lateral external electrode 41a and is composed of the first intersecting plane external electrode 41b, and the second external electrode 42 does not have the second lateral external electrode 42a and is composed of the second intersecting plane external electrode 42b. In the coil component 100D, an exterior coat 61 is located in the portion where the first lateral external electrode 41a is located, and an exterior coat 62 is located in the portion where the second lateral external electrode 42a is located.

[0101] Therefore, in the coil component 100D, the first end face of the coil section 10 is composed of the first connection end 15E, the second end face of the coil section 10 is composed of the second connection end 25E, and the portion in electrical contact with the first board electrode E1 and the second board electrode E2 is located only on the mounting surface side (Z2 side in the Z1-Z2 direction). Therefore, in the board SB on which the coil component 100D is mounted, the areas of the first board electrode E1 and the second board electrode E2 can be reduced, specifically, the portion of the first board electrode E1 extending in the X1-X2 direction X2 can be shortened, and the portion of the second board electrode E2 extending in the X1-X2 direction X1 can be shortened. That is, by using the coil component 100D, the mounting density of the components mounted on the board SB can be increased.

[0102] (Manufacturing method of coil parts) There is no particular limitation on the method for manufacturing the coil component according to the present embodiment. A non-limiting example of the manufacturing method is as follows.

[0103] FIG. 10A is an explanatory diagram (part 1) of an example of a manufacturing method for a coil component according to an embodiment of the present invention, and is an XY plan view of a coil array sheet. FIG. 10B is an XZ cross-sectional view taken along the line CC' in FIG. 10A. FIG. 11 is an explanatory diagram (part 2) of an example of a manufacturing method for a coil component according to an embodiment of the present invention, and is an XZ cross-sectional view showing a state in which a coil array sheet or the like is arranged in a cavity of a die. FIG. 12 is an explanatory diagram (part 3) of an example of a manufacturing method for a coil component according to an embodiment of the present invention, and is an XZ cross-sectional view showing a state in which molding is performed using a die to form a molded body. FIG. 13 is an explanatory diagram (part 4) of an example of a manufacturing method for a coil component according to an embodiment of the present invention, and is a view showing a state before cutting the molded body. FIG. 14 is an explanatory diagram (part 5) of an example of a manufacturing method for a coil component according to an embodiment of the present invention, and is a view showing a state in which the molded body is cut to obtain a coil chip.

[0104] First, as shown in the XY plan view of Fig. 10A and the XZ cross-sectional view of Fig. 10B, a coil array sheet 500 is formed in which a plurality of coil sections 10 including the first spiral conductor section 11 and the second spiral conductor section 21, the first lead section 14 and the second lead section 24, and the first connection conductor section 15 and the second connection conductor section 25 are connected to each other via the first linking conductor section 16 and the second linking conductor section 26. The manufacturing method is not limited, but a plating process can be used as described below. Specifically, first, a conductor layer (seed layer) is formed on both sides (Z1 side and Z2 side in the Z1-Z2 direction) of the surface of an insulating sheet base material. Next, an electroplating process is performed to form a conductor including the first spiral conductor portion 11 and the second spiral conductor portion 21, the first lead-out portion 14 and the second lead-out portion 24, the first connecting conductor portion 15 and the second connecting conductor portion 25, and the first connecting conductor portion 16 and the second connecting conductor portion 26 on the conductor layer by a plating deposit, as shown in Figure 10B.

[0105] The method of forming the conductor is not limited. For example, a pattern of an insulating layer that is a negative pattern of the conductor may be formed on a conductor layer on an insulating sheet substrate, and an electric plating process may be performed to pass electricity through the conductor layer, thereby depositing a plating deposit on the conductor layer exposed around the negative pattern to form a conductor having a desired shape. In this plating process, the plating deposit may be filled into the through hole of the sheet substrate to form a via portion VP.

[0106] Next, in the sheet base material on which the conductor is formed, at least a part of the exposed portion not covered by the conductor in the Z1-Z2 direction is removed. Specifically, the sheet base material is removed so as to include an area of ​​the sheet base material surrounded by the inner edges of the first spiral conductor portion 11 and the second spiral conductor portion 21 when viewed in the first direction (Z1-Z2 direction). As described above, when a negative pattern made of an insulating layer is used in the conductor forming step, the insulating layer is first removed, and then the conductor layer exposed in the Z1-Z2 direction due to the removal of the insulating layer is removed. In this way, a part of the sheet base material is exposed in the Z1-Z2 direction as an exposed portion, and a process of removing this exposed portion is performed.

[0107] A specific removal process for the sheet substrate is appropriately set depending on the constituent material of the sheet substrate. The removal process is broadly classified into a dry process such as plasma etching and a wet process such as wet etching. A part of the sheet substrate may be removed by the removal process, and a remaining part may not be removed. For example, the sheet substrate may be made of a composite material of a matrix portion made of an organic material and an inorganic material dispersed in the matrix portion, and the sheet substrate may be removed by removing the matrix portion made of the organic material in the removal process.

[0108] Next, the coil insulating section 80 is formed so as to cover the exposed surface of the conductor. This forms the coil array sheet 500. In the above manufacturing method, the insulating section of the coil array sheet 500, the portion of which both sides in the Z1-Z2 direction are covered with the conductor, is composed of the remaining portion of the sheet base material, not the coil insulating section 80, but is omitted in FIG. 10B and is treated as the same as the coil insulating section 80.

[0109] A laminated structure including the coil array sheet 500 including the plurality of coil components 100 thus obtained, a first member 311 including a first magnetic powder and a first hardening material, at least a part of which is located on one side of the coil array sheet 500 in the first direction (Z1 side in the Z1-Z2 direction), and a second member 321 including a second magnetic powder and a second hardening material, is placed in a cavity 70C of a mold 70. Specifically, as shown in FIG. 11, the second member 321, a part 311A ​​of the first member, the coil array sheet 500, and another part 311B of the first member are placed in order from the lower mold 71 side (Z2 side in the Z1-Z2 direction) to the upper mold 72 side (Z1 side in the Z1-Z2 direction) of the mold 70. In this manner, the laminated structure including the coil array sheet 500, the first member 311, and the second member 321 is placed in the cavity 70C of the mold 70.

[0110] The first member 311 includes a first magnetic powder and a first hardenable material, and becomes a first material body 310 made of a first material that constitutes a first region 31 including a central region CR after molding. The second member 321 includes a second magnetic powder and a second hardenable material, and becomes a second material body 320 made of a second material that constitutes a second region 32 after molding.

[0111] As described above, in this specification, the term "curable material" includes materials that are cured and materials that are cured (such as polymerization initiators). Specifically, compounds that contain active functional groups that are highly reactive with other functional groups, such as glycidyl groups, isocyanate groups, and carboxy groups, and compounds that contain functional groups (such as hydroxyl groups and amino groups) that have active hydrogen that reacts with such active functional groups are included. Crosslinking substances that contain multivalent ions, such as magnesium and calcium, are also included in the curable material. When the curable material is polymerized by a radical polymerization catalyst, a compound that has an ethylenically unsaturated bond can also be a curable material. Polymerization catalysts that initiate and continue the polymerization reaction of the above-mentioned polymerization-reacting substances are also included in the curable material. Examples of polymerization catalysts include urethane polymerization catalysts such as 2-(dimethylamino)ethanol, epoxy polymerization catalysts such as tetrabutylphosphonium bromide, and olefin polymerization catalysts such as metallocene compounds.

[0112] The second member 321 and the first member 311 are different in one or more points selected from the group consisting of the following [1] to [6]. [1] The composition of the second magnetic powder and the composition of the first magnetic powder; [2] The particle size distribution of the second magnetic powder and the particle size distribution of the first magnetic powder; [3] The content of the second magnetic powder in the second member 321 and the content of the first magnetic powder in the first member 311, [4] A composition of a second hardenable material and a composition of a first hardenable material; [5] The content of the second hardening material in the second member 321 and the content of the first hardening material in the first member 311, and [6] When the second member 321 contains a second additive component other than the second hardening material and the second magnetic powder, and the first member 311 contains a first additive component other than the first hardening material and the first magnetic powder, the composition of the second additive component and the composition of the first additive component are

[0113] This allows the second material formed from the second component 321 to be different from the first material formed from the first component 311, and allows the characteristics of the second region 32 to be different from the characteristics of the first region 31.

[0114] The laminated structure thus obtained is subjected to a molding process including increasing the pressure in the cavity, so that a molded body 500A having a coil section 10 and a main body section 30 is obtained from the laminated structure, specifically, a coil array sheet 500 including a plurality of coil sections 10 and a main body section constituent member 300 that provides the main body section 30, as shown in Fig. 12. The molding process for obtaining the molded body 500A from the laminated structure may involve heating in addition to pressurization. As will be described later, when the degree of hardening of the first hardening material in the first member 311 is low, the hardening may be completed by, for example, heating.

[0115] Although the second member 321 and the part 311A ​​of the first member 311 are made of different materials, they may be integrated together by a preliminary heating process, etc. In this case, it becomes easy to arrange the laminated structure in the cavity 70C of the mold 70.

[0116] The above molding process may include hardening the first hardenable material and the second hardenable material. By carrying out such a hardening process, the first member 311 and the first material body 310 are made of different materials, and the second member 321 and the second material body 320 are made of different materials. Therefore, the first member 311 and the second member 321 can be given unique functions in terms of molding process.

[0117] A specific example of such a unique function is a positioning function of the coil array sheet 500 in a mold in the molding process to form the molded body 500A. Specifically, as shown in FIG. 11, when the first direction is along the vertical direction (Z1-Z2 direction) and the second member 321 is arranged to be located below the coil array sheet 500, the second member 321 is made harder than the first member 311. As a result, when a compressive force in the first direction is applied to the mold 70, the coil array sheet 500 is easily embedded in the relatively soft first member 311, especially the inside of the part 311A ​​of the first member, but is difficult to embed in the relatively hard second member 321. As a result, during the molding process, the bottom part of the coil array sheet 500 on the vertical lower side (Z2 side in the Z1-Z2 direction) is stabilized in a state of contacting the upper end of the second member 321. Therefore, the positional accuracy in the vertical direction (first direction) of the coil array sheet 500 in the molded body 500A can be improved. Specifically, in the coil device 100, the distance between the end of the coil portion 10 on the Z2 side in the Z1-Z2 direction and the second surface 302 can be easily set within an appropriate range.

[0118] In Figure 11, before a compressive force in the first direction is applied to the mold 70, the first connecting conductor 15, the second connecting conductor 25 and the second linking conductor 26 which protrude downward (Z2 side in the Z1-Z2 direction) within the cavity 70C of the mold 70 have their tips embedded inside a part 311A ​​of the relatively soft first member and abut against the upper ends (Z2 side in the Z1-Z2 direction) of the relatively hard second member 321. By moving the upper mold 72 downward from this state and clamping it, the tips of the first connecting conductor portion 15 as well as the second connecting conductor portion 25 and the second linking conductor portion 26 are embedded in the second member 321, while the lower side of the annular conductor portion, i.e., the lower side of the second spiral conductor portion 21, is maintained in abutment against the upper end (Z2 side in the Z1-Z2 direction) of the second member 321, and this part ensures the positioning accuracy of the coil array sheet 500 within the cavity 70C of the mold 70.

[0119] 12, the first member 311 and the second member 321 are hardened and integrated to form a main body component 300 made of a first material body 310 and a second material body 320. The lower side of the second spiral conductor 21 is located at the boundary between the first material body 310 and the second material body 320 in the main body component 300, thereby ensuring the positioning accuracy of the coil array sheet 500 in the molded body 500A.

[0120] The first member 311 and the second member 321 are in a so-called B-stage state, and may be softened and then hardened when hardened by heating. In this case, the annular conductor is likely to be embedded in the first member 311 while the first member 311 is softened, and the first connecting conductor 15 and the tip of the second connecting conductor 25 and the tip of the second linking conductor 26 are likely to be embedded in the second member 321 while the second member 321 is softened. Even in this case, if the second member 321 is relatively harder than the first member 311, the lower side of the second spiral conductor 21 can maintain a state of abutting against the end of the upper side (Z2 side in the Z1-Z2 direction) of the second member 321, even in the softened state. Furthermore, by allowing the hardening of the first member 311 and the second member 321 to proceed in this state, the adhesion between the first material body 310 and the second material body 320 will also improve, making it easier to properly ensure the mechanical and magnetic properties of the main body component 300.

[0121] Making the second member 321 harder than the first member 311 may be achieved by satisfying at least one of the following (I) to (VI). (I) For the laminated structure disposed in the cavity, the viscosity of the second hardenable material is higher than the viscosity of the first hardenable material. (II) For the laminated structure disposed in the cavity, the degree of polymerization of the second hardenable material is higher than the degree of polymerization of the first hardenable material. (III) For the laminated structure disposed in the cavity, the content of the uncured material contained in the second curable material is less than the content of the uncured material contained in the first curable material. (IV) The second curable material and the first curable material each contain a polymerization catalyst, and for the laminated structure disposed in the cavity, the content of the polymerization catalyst contained in the second curable material is greater than the content of the polymerization catalyst contained in the first curable material. (V) With respect to the laminated structure disposed in the cavity, the volume ratio of the second magnetic powder contained in the second member 321 is greater than the volume ratio of the first magnetic powder contained in the first member 311. (VI) When the gel time defined in JIS K5600-9-1:2006 is measured for the second curable material and the first curable material contained in the laminated structure disposed in the cavity, the gel time of the second curable material is shorter than the gel time of the first curable material.

[0122] The second member 321 may have higher insulating properties than the first member 311. In this case, the insulating properties of the second material formed from the second member 321 can be made higher than the insulating properties of the first material formed from the first member 311.

[0123] When the coil portion 10 has an insulating portion (such as the coil insulating portion 80) covering the surface of the annular conductor portion as in this embodiment, and the first magnetic powder contains metal magnetic powder, it may be preferable that when the second member 321 is cut to obtain a second member cut surface and the first member 311 is cut to obtain a first member cut surface, at least one of the following (i) to (iv) is satisfied. (i) A first member average equivalent circle diameter, which is an average equivalent circle diameter of the first magnetic powder at a cut surface of the first member, is smaller than a second member average equivalent circle diameter, which is an average equivalent circle diameter of the second magnetic powder at a cut surface of the second member. (ii) A first member median diameter, which is a median diameter of the first magnetic powder at a cut surface of the first member, is smaller than a second member median diameter, which is a median diameter of the second magnetic powder at a cut surface of the second member. (iii) A first member maximum equivalent circle diameter, which is a maximum equivalent circle diameter of the first magnetic powder at a cut surface of the first member, is smaller than a second member maximum equivalent circle diameter, which is a maximum equivalent circle diameter of the second magnetic powder at a cut surface of the second member. (iv) at least one of the second member diameter distribution, which is a distribution of the circular equivalent diameters of the second magnetic powder at the cut surface of the second member, and the first member diameter distribution, which is a distribution of the circular equivalent diameters of the first magnetic powder at the cut surface of the first member, has two or more peaks, and the first member peak diameter, which is the circular equivalent diameter with the highest frequency at the peak on the largest diameter side among the peaks of the first member diameter distribution, is smaller than the second member peak diameter, which is the circular equivalent diameter with the highest frequency at the peak on the largest diameter side among the peaks of the second member diameter distribution.

[0124] Once the molded body 500A is formed in the cavity 70C of the mold 70, it is removed from the mold 70 and cut along dicing lines DL1 and DL2 shown in Fig. 13. This results in a coil chip 100Z having a main body portion 30 consisting of a first region 31 and a second region 32, and a coil portion 10, as shown in Fig. 14. Exterior coats 50 and 60 are formed on this coil chip 100Z, and a first external electrode 41 and a second external electrode 42 are further formed, thereby obtaining a coil component 100.

[0125] 15 and 16 are explanatory diagrams (parts 1 and 2) of another example of the method for manufacturing a coil component according to an embodiment of the present invention, which is a method for manufacturing coil component 100B. The manufacturing method of this example is basically the same as the example of the method for manufacturing coil component 100 described above, so only differences in structure or method will be described, and descriptions of the common structure and method will be omitted.

[0126] In the manufacturing method of coil device 100B according to the present example, since first region 31 in coil device 100 includes a part of second surface 302 of main body portion 30, second members 321 providing second region 32 are discretely present on the bottom surface of cavity 70C of mold 70, unlike in the manufacturing method of coil device 100. Therefore, in the manufacturing method according to the present example, as shown in Fig. 15, a peeling member RS ​​on which second members 321 are discretely arranged is placed on the bottom surface of cavity 70C, and a coil array sheet 500 and first members 311 are placed thereon.

[0127] In this state, upper die 72 is moved in the first direction to close the die, and first member 311 and second member 321 are hardened by heating or the like to obtain molded body 501A in which second material bodies 320 are positioned discretely and first material bodies 310 are positioned so as to contact the outer periphery in the XY directions, as shown in Fig. 16. Thereafter, a manufacturing method similar to that for molded body 500A is carried out to obtain coil device 100B.

[0128] (Electronic and Electrical Equipment) The electronic / electrical device according to one embodiment of the present invention is an electronic / electrical device in which the coil components 100, 100A, 100B, 100C, and 100D according to one embodiment of the present invention are mounted, and the coil components 100, 100A, 100B, 100C, and 100D are connected to the substrate SB at terminal portions (first external electrode 41 and second external electrode 42) provided on exposed conductor portions (for example, first lead-out end 14E and second lead-out end 24E) located at two ends of the coil portion 10 and exposed to the outside. The electronic / electrical device according to one embodiment of the present invention is mounted with the coil components 100, 100A, 100B, 100C, and 100D according to one embodiment of the present invention, so that the device can be easily miniaturized. In particular, the coil component 100D can be easily mounted at a high density, so that the device including these components can be easily miniaturized. Furthermore, even if a large current flows through the device or a high frequency is applied, the coil components 100, 100A, 100B, 100C, and 100D are unlikely to suffer from deterioration in their characteristics or problems caused by heat generation.

[0129] The above-described embodiments and examples are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design modifications and equivalents that fall within the technical scope of the present invention. [Explanation of symbols]

[0130] 100, 100A, 100B, 100C, 100D: Coil parts 10: Coil section 11: First spiral conductor section 12, 22: Inner circumference end 13, 23: Outer periphery end 14: First drawer 14E: First pull-out end 15: First connecting conductor portion 15E: First connection end 16: First connecting conductor portion 20: Coil conductor 21: Second spiral conductor section 24: Second drawer 24E: Second pull-out end 25: Second connecting conductor part 25E: Second connection end 26: Second connecting conductor part 30: Main body 31: First Area 31C: Main part 31E: Extension part 32: Second Area 32C:Continuous section 32F: Second opposing part 32F1: First opposing part 32F2: Second opposing part 33: Middle class 41: First external electrode 41a: first lateral external electrode 41b: first intersecting surface external electrode 42: Second external electrode 42a: second lateral external electrode 42b: second intersecting surface external electrode 50, 60, 61, 62: Exterior coat 70: Mold 70C: Cavity 71: Lower mold 72: Upper mold 80: Coil insulation 90: Interposer 100Z: Coil tip 101: First end 102: Second end 300: Main body component 301: First page 302: The second side 310: First material body 311: First member 311A: Part of the first member 311B: Another part of the first member 320: Second material body 321: Second member 500: Coil array sheet 500A, 501A: Molded body CR: Central area DL1, DL2: Dicing line E1: First substrate electrode E2: Second substrate electrode EP: Short circuit MP1, MP2: Magnetic powder O: Central axis RS: Peeling material S1, S2: Solder SB: Substrate VP: Beer Department d1, d2: Separation distance

Claims

1. a coil portion having an annular conductor portion having a central axis along a first direction and having two electrical ends; a main body portion that covers the annular conductor portion with a first surface and a second surface aligned in the first direction and that includes a magnetic powder and a binder; Equipped with the coil portion is exposed from a surface of the main body portion at a first end surface connected to one of the two electrical ends of the annular conductor portion and a second end surface connected to the other of the two electrical ends of the annular conductor portion; The main body portion is a first region including a central region whose entire outer periphery is in contact with an inner periphery surface of the annular conductor portion and the first surface, the first region being made of a first material; a second region comprising at least a portion of the second surface and made of a second material; Including, The first material and the second material are The composition of the magnetic powder, A shape distribution which is a distribution related to the shape of the magnetic powder; The content of the magnetic powder, The composition of the binder, The content of the binder, and When a third component other than the magnetic powder and the binder is contained, the composition and content of the third component The difference is one or more selected from the group consisting of A coil component characterized by:

2. The coil component according to claim 1 , wherein the second material has a higher insulating property than the first material.

3. a first external electrode provided on the main body and spaced apart from each other, the first external electrode being electrically connected to the first end surface and a second external electrode being electrically connected to the second end surface; the first external electrode has a first covering portion covering a portion of the second surface, and the second external electrode has a second covering portion covering a portion of the second surface; The coil component according to claim 2 , wherein the second region has a first opposing portion opposing the first covered portion and a second opposing portion opposing the second covered portion.

4. the first end face has a first exposed surface that is exposed from the main body at the second face and is in contact with the first external electrode; The coil component according to claim 3 , wherein the second end face has a second exposed surface that is exposed from the main body portion at the second surface and is in contact with the second external electrode.

5. The coil component according to claim 3 , wherein the second region has a continuous portion that is continuous with both the first opposing portion and the second opposing portion and that includes a part of the second surface.

6. The coil component according to claim 2 , wherein the second region has a resistivity greater than that of the first region.

7. The magnetic powder includes a metal magnetic powder, The coil component according to claim 2 , wherein the relative permeability μ2 of the second region is smaller than the relative permeability μ1 of the first region.

8. 8. The coil component according to claim 7, wherein a distance d2 between an end of the coil portion proximal to the second surface in the first direction and the second surface is greater than a distance d1 between an end of the coil portion proximal to the first surface in the first direction and the first surface.

9. The coil component according to claim 1 , wherein the annular conductor portion is in contact with the first region at an end portion on the second surface side in the first direction.

10. a coil portion having an annular conductor portion having a central axis in a first direction and having two electrical ends; a main body portion that covers the annular conductor portion with a first surface and a second surface aligned in the first direction and that includes a magnetic powder; A method for manufacturing a coil component comprising: In the mold cavity, The coil component; a first member, at least a portion of which is located on one side of the coil component in the first direction, the first member including a first magnetic powder and a first hardenable material; a second member located on the other side of the coil component in the first direction and including a second magnetic powder and a second hardenable material; A laminated structure consisting of and increasing the pressure in the cavity to obtain a molded body including the coil component and the main body from the laminated structure, In the molded body, a central region in which the entire outer periphery is in contact with the inner periphery surface of the annular conductor portion is made of a material based on the first member. A method for manufacturing a coil component, comprising the steps of:

11. The first member and the second member are a composition of the first magnetic powder and a composition of the second magnetic powder; a particle size distribution of the first magnetic powder and a particle size distribution of the second magnetic powder; a content of the first magnetic powder in the first member and a content of the second magnetic powder in the second member; a composition of the first hardenable material and a composition of the second hardenable material; a content of the first hardenable material in the first member and a content of the second hardenable material in the second member; and When the first member contains a first additive component other than the first hardenable material and the first magnetic powder, and the second member contains a second additive component other than the second hardenable material and the second magnetic powder, the composition of the first additive component and the composition of the second additive component, The method for manufacturing a coil component according to claim 10 , wherein the first and second electrodes are different in at least one selected from the group consisting of:

12. The method of claim 10, further comprising curing the first hardenable material and the second hardenable material.

13. 12. The method for manufacturing a coil component according to claim 11, wherein a second material body produced by hardening the second hardenable material in the second member has higher insulating properties than a first material body produced by hardening the first hardenable material in the first member.

14. the coil portion has a first connection conductor portion connected to one of the two electrical ends of the annular conductor portion and a second connection conductor portion connected to the other of the two electrical ends of the annular conductor portion, the first connection conductor portion is exposed from the second surface at a first end surface, the second connection conductor is exposed from the second surface at a second end surface, The method for manufacturing a coil component according to claim 13 , wherein in the compact, the first connection conductor portion and the second connection conductor portion have portions embedded in the second material body.

15. 2. An electronic / electrical device incorporating the coil component described in claim 1, wherein the coil component is connected to a substrate at terminal portions provided on exposed conductor portions that are located at each of two ends of the coil portion and exposed to the outside.

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