Laminate film and manufacturing method of semiconductor device

Abstract

To provide a laminate film capable of preferably maintaining a peeling suppression function of a notch part even in the case of providing a fine adhesion layer to a protection film, and provide a manufacturing method of the semiconductor device.SOLUTION: A laminate film 1 comprises a protection film 2, a fine adhesion layer 3, a plurality of function films 4, and a pair of protection layers 7 and 7. Each function film 4 includes a support piece formation film 6 and a cutting auxiliary film 5. The cutting auxiliary film 5 includes an expansion region P bonded to the fine adhesion layer 3 so as to be expanded to the side outer from an edge of the support piece formation film 6, and includes a notch part 9 that is formed by notching the cutting auxiliary film 5 in a wedge-shape in the expansion region P. In a region between function films 4 and 4 that are adjacent to each other in a length direction D and the pair of protection layers 7 and 7, a cover layer covering the fine adhesion layer 3 exposed from the function film 4 is arranged.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a laminated film and a method for manufacturing a semiconductor device. [Background technology]

[0002] In recent years, in the field of semiconductor devices, there is an increasing demand for higher integration, smaller size, and faster speed. One aspect of a semiconductor device is a structure in which a semiconductor chip is stacked on a controller chip arranged on a substrate. The semiconductor assembly described in Patent Document 1 has a structure called a dolmen structure (or tunnel structure). This conventional semiconductor assembly includes a package substrate, a controller die arranged on the package substrate, and a memory die arranged above the controller die, and the memory die is supported by a support member such as a pillar. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2017-515306 Summary of the Invention [Problem to be solved by the invention]

[0004] In the semiconductor assembly of the above-mentioned Patent Document 1, a resin film with a silicon chip is used as a support member of a dolmen structure using a process similar to that of manufacturing a normal semiconductor chip. However, this method requires the use of relatively expensive silicon chips and a wafer polishing process. Therefore, a method of forming a support piece of a dolmen structure by dividing a support piece forming film into individual pieces without using a silicon chip is being considered.

[0005] In this method, for example, a laminated film in which a functional film is laminated on one side of a protective film can be used. The functional film is formed, for example, by laminating the above-mentioned support piece forming film and a cutting assist film for assisting cutting. Such a laminated film is manufactured, for example, by precutting the support piece forming film on one side of the protective film into a predetermined pattern, and then precutting the cutting assist film laminated on the support piece forming film into a predetermined pattern. At this time, if the support piece forming film in contact with the protective film does not have adhesiveness, it is considered that the support piece forming film is not fixed on the protective film, which may cause an obstacle to the progress of precutting the support piece forming film. To address such a problem, it has been considered to provide a weak adhesive layer on the protective film side. In this case, the support piece forming film can be fixed on the protective film by the weak adhesive layer, so that the precutting of the support piece forming film can be suitably performed.

[0006] In the manufacturing process of a semiconductor device using a laminated film, for example, a process of attaching a functional film to a semiconductor wafer is performed using a roll-to-roll method. In this attachment process, for example, a semiconductor wafer and a ring frame are placed on a stage, and the laminated film transported between a pay-out roll and a take-up roll is brought close to the semiconductor wafer and the ring frame. Then, the functional film peeled off from the protective film is pressed against the semiconductor wafer and the ring frame on the stage by a roller or the like, and the functional film is attached to the semiconductor wafer and the ring frame.

[0007] In the laminated film, a notch portion may be provided to suppress peeling of the cutting assist film from the semiconductor wafer when the support piece forming film is singulated. Such a notch portion is formed, for example, by making a wedge-shaped cut in the cutting assist film. The peeling force required for peeling the cut portion is greater than the peeling force required for peeling around the cut portion, suppressing peeling of the cutting assist film from the semiconductor wafer and the ring frame.

[0008] However, as described above, when the protective film is provided with a weak adhesive layer, it is possible that the weak adhesive layer will stick to the roll that transports the laminated film in the manufacturing process of the semiconductor device using the laminated film. If the weak adhesive layer sticks to the roll and tension is applied to the cutting assist film, the cut portion that forms the notch portion may be rolled up from the main body of the cutting assist film, and the peeling suppression function of the notch portion may be lost.

[0009] The present disclosure has been made to solve the above-mentioned problems, and aims to provide a laminated film that can favorably maintain the peel-suppression function of the notch portion even when a weak adhesive layer is provided on the protective film, and a manufacturing method for a semiconductor device using such a laminated film. [Means for solving the problem]

[0010] A laminated film according to one aspect of the present disclosure comprises a long protective film, a weak adhesive layer provided on one side of the protective film, a plurality of functional films arranged at a distance from each other along the longitudinal direction of the protective film and joined to one side of the protective film via the weak adhesive layer, and a pair of protective layers extending longitudinally at both widthwise ends of the protective film, wherein the functional film comprises a support piece forming film joined to one side of the protective film via the weak adhesive layer, and a cutting aid film overlapping the support piece forming film, wherein the cutting aid film has a protruding region that protrudes outward beyond the edge of the support piece forming film and is joined to the weak adhesive layer, and wherein the cutting aid film has a notch portion formed by cutting the cutting aid film into a wedge shape in the protruding region, and when viewed in a plane of the protective film, a cover layer is arranged in the region between the longitudinally adjacent functional films and the pair of protective layers to cover the weak adhesive layer exposed from the functional film.

[0011] In this laminated film, the area of ​​the weak adhesive layer exposed from the functional film is reduced by disposing a cover layer in the region between the functional film adjacent in the longitudinal direction and the pair of protective layers. This makes it possible to prevent the weak adhesive layer from sticking to the roll that transports the laminated film in the manufacturing process of the semiconductor device. By preventing the weak adhesive layer from sticking to the roll, it is possible to prevent the incision that forms the notch portion from being rolled up from the main body of the cutting assist film, and the peeling suppression function of the notch portion can be favorably maintained.

[0012] The cover layers may be arranged in pairs so as to be continuous with each of the pair of protective layers, and the pair of cover layers may be opposed to each other in the width direction while being spaced apart from each other, and may be arranged spaced apart from the functional films adjacent in the longitudinal direction. By making the pair of cover layers continuous with the pair of protective layers, the area of ​​the weak adhesive layer exposed from the functional film can be further reduced. By separating the pair of cover layers from each other in the width direction and also from the functional films adjacent in the longitudinal direction, the weak adhesive layer exposed from the functional film can be made continuous in the longitudinal direction of the protective film. Therefore, the precutting of the functional film and the subsequent peeling off of the excess portion of the functional film can be performed continuously using a roll, and the manufacturing efficiency of the laminated film can be sufficiently ensured.

[0013] In the pair of cover layers, the portions facing each other in the width direction may be sharpened. In this case, even if the distance between adjacent functional films in the longitudinal direction is small, the cover layer can be disposed between the functional films, and the area of ​​the weak adhesive layer exposed from the functional film can be sufficiently reduced. In addition, by providing a sharpened portion on the cover portion, the distance between the functional film and the cover layer can be secured. This can suppress the occurrence of a defect such as the excess portion being torn off when the excess portion of the functional film is continuously peeled off using a roll.

[0014] The tip width of the cover layer in the longitudinal direction may be smaller than the distance between adjacent functional films in the longitudinal direction. In this case, even if the distance between adjacent functional films in the longitudinal direction is small, the cover layer can be disposed between the functional films, and the area of ​​the weak adhesive layer exposed from the functional film can be sufficiently reduced.

[0015] The cover layer may be disposed at a distance from both the functional film and the pair of protective layers adjacent to each other in the longitudinal direction. In this case, by ensuring the distance between the functional film and the pair of protective layers and the cover layer, it is possible to suppress the occurrence of a defect such as the excess portion of the functional film being torn off when the excess portion is continuously peeled off using a roll.

[0016] The support piece forming film may have a thermosetting resin layer and a high-rigidity layer having a higher rigidity than the thermosetting resin layer, and the high-rigidity layer may be bonded to one side of the protective film via a weak adhesive layer. By including a high-rigidity layer in the support piece forming film, the followability to the push-up jig is reduced, while the followability to a pick-up tool such as a suction collet can be increased. In addition, by bonding the high-rigidity layer to one side of the protective film via a weak adhesive layer, the support piece forming film is firmly fixed to the protective film, and the precutting of the support piece forming film can be suitably performed.

[0017] A manufacturing method for a semiconductor device according to one aspect of the present disclosure includes a transporting process for transporting the laminated film toward a semiconductor wafer and a ring frame, a peeling process for folding the protective film back over the functional film using a peeling plate and peeling the protective film from the functional film, and an attachment process for attaching the function to the semiconductor wafer and the ring frame.

[0018] In the method for manufacturing a semiconductor device, by using the laminated film described above, it is possible to prevent the weak adhesive layer from sticking to the roll that transports the laminated film. By preventing the weak adhesive layer from sticking to the roll, it is possible to prevent the cut that forms the notch portion from being turned up from the main body of the cutting assist film, and it is possible to preferably maintain the peeling-prevention function of the notch portion.

[0019] In the peeling step, air may be supplied to the folded position of the protective film relative to the functional film to assist peeling. The supply of air makes it easier for the protective film to warp from the functional film, and thus peeling failure of the protective film can be suitably suppressed. Effect of the Invention

[0020] According to the present disclosure, even when a weak adhesive layer is provided on a protective film, the peel-suppressing function of the notch portion can be suitably maintained. [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 is a plan view of a laminated film according to an embodiment of the present disclosure. [Diagram 2] 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] 2 is an enlarged plan view of a main portion of the laminated film shown in FIG. [Figure 4] FIG. 13 is a schematic perspective view showing the function of a notch portion. [Diagram 5] 1 is a schematic diagram showing a configuration of a bonding device applied in a manufacturing method of a semiconductor device according to an embodiment of the present disclosure. [Figure 6] FIG. 11 is an enlarged plan view of a main portion of a laminated film according to a modified example. [Figure 7] FIG. 11 is an enlarged plan view of a main portion of a laminate film according to another modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, preferred embodiments of the laminate film and the method for manufacturing a semiconductor device according to one aspect of the present disclosure will be described in detail with reference to the drawings.

[0023] Fig. 1 is a plan view of a laminated film according to an embodiment of the present disclosure. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. The laminated film 1 is a member used in the manufacture of a support piece that supports a stack of memory chips on a substrate in a manufacturing process of a semiconductor device such as a NAND flash memory. The laminated film 1 is generally stored in a rolled state, and when used, the required amount is unwound from the roll.

[0024] As shown in Figures 1 and 2, the laminated film 1 includes a protective film 2, a weak adhesive layer 3 provided on one side of the protective film 2, and a functional film 4 provided on one side of the weak adhesive layer 3. The functional films 4 are precut into a predetermined pattern and arranged at predetermined intervals in the longitudinal direction D of the protective film 2 on one side of the protective film 2. In this embodiment, the functional film 4 is composed of a cutting assist film 5 and a support piece forming film 6. In addition to the functional film 4, the laminated film 1 also includes a protective layer 7 and a cover layer 8.

[0025] The protective film 2 is a long film that extends in one direction with a predetermined width. The protective film 2 is a film that serves as a base for the laminated film 1. The protective film 2 is made of a material such as polyethylene terephthalate (PET) or polyolefin. The protective film 2 may have heat shrinkability.

[0026] The weak adhesive layer 3 is a layer for suppressing the misalignment of the functional film 4 with respect to the protective film 2 during precutting. The weak adhesive layer 3 is disposed on the entire surface of one side of the protective film 2. The weak adhesive layer 3 may be made of, for example, an acrylic adhesive, an acrylic rubber adhesive, a natural rubber adhesive, a synthetic rubber adhesive, a urethane adhesive, or a silicone adhesive. The weak adhesive layer 3 has an appropriate weak adhesiveness so that the functional film 4 is fixed to one side of the protective film 2 with an appropriate adhesive force during precutting, and the functional film 4 is peeled off from the protective film 2 with a weak force when the functional film 4 is used. The adhesive force of the weak adhesive layer with respect to the functional film 4 (high rigidity layer 11 described later) is, for example, 0.03 N / 25 mm to 0.1 N / 25 mm.

[0027] The cutting assist film 5 is a film for fixing the support piece forming film 6 to the ring frame R (see FIG. 5). The cutting assist film 5 has, for example, an ultraviolet-curing adhesive layer, and has the property that the adhesiveness decreases when irradiated with ultraviolet light. In addition to an ultraviolet-curing adhesive, a pressure-sensitive adhesive (non-UV-curing adhesive) can also be used for the adhesive layer of the cutting assist film 5. From the viewpoint of functionality, a film commonly known as a dicing film can also be used as the cutting assist film 5.

[0028] The cutting assist film 5 is precut into a circle having a diameter smaller than the width of the protective film 2 by processing means such as a roll blade, and is arranged so as to cover the support piece forming film 6. The peripheral portion of the cutting assist film 5 is an area that is attached to the ring frame R in the manufacturing process of the semiconductor device, and in the laminate film 1, it forms an overhanging area P that overhangs outward from the edge of the support piece forming film 6 and is joined to the weak adhesive layer 3.

[0029] The protruding region P of the cutting assist film 5 has a notch portion 9 formed by cutting the cutting assist film 5 into a wedge shape. The notch portion 9 is a portion that suppresses peeling of the cutting assist film 5 from the ring frame R when the support piece forming film 6 is singulated in the manufacturing process of the semiconductor device. The notch portion 9 is formed by a cut that penetrates the cutting assist film 5 in the thickness direction. In this embodiment, the notch portion 9 is U-shaped, semicircular, or tongue-shaped in a plan view of the protective film 2, and is provided in a ring shape along the protruding region P in such a direction that the center of the functional film 4 is convex. There is no particular limitation on the number of notch portions 9 arranged, but they may be arranged around the center of the functional film 4 at intervals of, for example, 2° to 3°.

[0030] Fig. 3 is a schematic perspective view showing the function of the notch portion. When the notch portion 9 is provided in the protruding region P, when a peeling force acts on the cutting assist film 5 attached to the ring frame R, as shown in Fig. 3, the portion 9a outside the notch portion 9 peels off first, and the portion 9b inside the notch portion 9 remains on the ring frame R in a convex state.

[0031] When the peeling force is further applied, the inner part 9b is pulled by the outer part 9a and tries to peel off, but as the peeling area increases, the point of action of the pull moves further back than the inner part 9b, so a larger force is required to peel off the inner part 9b. Therefore, by providing the notch part 9 in the protruding region P, the peel strength of the cutting assist film 5 with respect to the ring frame R can be improved, and the cutting assist film 5 can be prevented from peeling off from the ring frame R during the manufacturing process of the semiconductor device. For example, when the support piece forming film 6 is cut, it is expected that pressure from cooling water will be applied to the support piece forming film 6, but the peeling prevention effect of the notch part 9 can suitably prevent the cutting assist film 5 from peeling off due to such pressure.

[0032] The support piece forming film 6 is a film from which the support piece is formed. The support piece forming film 6 is precut into a circle having a diameter slightly smaller than that of the cutting assist film 5 by a processing means such as a roll blade. In this embodiment, the support piece forming film 6 is configured in two layers, a thermosetting resin layer 10 and a high-rigidity layer 11 having a higher rigidity than the thermosetting resin layer 10, as shown in FIG. 2. The thermosetting resin layer 10 is located on the cutting assist film 5 side. The high-rigidity layer 11 is located on the protective film 2 side and is bonded to one side of the protective film 2 by a weak adhesive layer 3.

[0033] The thermosetting resin layer 10 can go through a semi-cured (B stage) state and then become a completely cured (C stage) state by a subsequent curing treatment. The thermosetting resin composition contains an epoxy resin, a curing agent, and an elastomer (e.g., an acrylic resin). The thermosetting resin composition further contains an inorganic filler, a curing accelerator, and the like, as necessary.

[0034] The high-rigidity layer 11 may be, for example, a polyimide layer or a metal layer. By including the high-rigidity layer 11 in the support piece forming film 6, the ability of the support piece to follow the pick-up tool when producing the support piece can be improved. When a metal layer is used as the high-rigidity layer 11, the optical contrast between the resin material and the metal material can improve the visibility of the support piece when picked up. The metal layer may be, for example, a copper layer, an aluminum layer, or the like.

[0035] The protective layer 7 is a portion that protects the functional film 4 from pressure when the laminated film 1 is wound into a roll. In this embodiment, the protective film 2 is composed of the above-mentioned cutting assist film 5. In the region between the protective layer 7 and the functional film 4, the excess portion of the cutting assist film 5 is peeled off when the functional film 4 is pre-cut, and the weak adhesive layer 3 is exposed.

[0036] 2, in the thickness direction of the laminated film 1, no support piece-forming film 6 is disposed between the protective layer 7 and the protective film 2, and the protective layer 7 is directly bonded to one side of the protective film 2 by the weak adhesive layer 3. The protective layer 7 has a role of eliminating unevenness between the center and both ends of the laminated film 1 in the width direction B when the laminated film 1 is wound into a roll. This makes it possible to avoid the occurrence of defects such as winding slippage and voids due to unevenness, even when the number of turns of the laminated film 1 is increased.

[0037] As shown in FIG. 1, a pair of protective layers 7 are disposed at both ends of the protective film 2 in the width direction B, and extend in the longitudinal direction D of the protective film 2 so as to surround each of the functional films 4. In the example of FIG. 1, the protective layer 7 has concave portions 7a and convex portions 7b arranged alternately along the longitudinal direction D. Both of the concave portions 7a and the convex portions 7b face the center in the width direction B. The concave portions 7a of one protective layer 7 and the concave portions 7a of the other protective layer 7 face each other in the width direction, so that the circular functional film 4 is surrounded by the protective layers 7.

[0038] The cover layer 8 is a portion that covers the weak adhesive layer 3 exposed from the functional film 4. In this embodiment, the cover layer 8 is composed of the above-mentioned cutting assist film 5, similar to the protective film 2. In the thickness direction of the laminated film 1, the support piece forming film 6 is not disposed between the cover layer 8 and the protective film 2, and the protective layer 7 is directly bonded to one surface side of the protective film 2 by the weak adhesive layer 3. The cover layer 8 reduces the exposed area of ​​the weak adhesive layer 3, thereby preventing the weak adhesive layer 3 from sticking to the roll that transports the laminated film 1 in the manufacturing process of the semiconductor device.

[0039] 4, in a plan view of the protective film 2, the cover layer 8 is disposed in a region between the functional films 4, 4 adjacent to each other in the longitudinal direction D and a pair of protective layers 7, 7 located at both ends in the width direction B. In this embodiment, a pair of cover layers 8 are disposed so as to be continuous with each of the convex portions 7b, 7b of the pair of protective layers 7, 7. The pair of cover layers 8, 8 face each other in the width direction B while being spaced apart from each other, and are disposed at a distance from the functional films 4, 4 adjacent to each other in the longitudinal direction D.

[0040] In this embodiment, the tip width W2 of the cover layer 8 in the longitudinal direction D is smaller than the interval W1 between adjacent functional films 4 in the longitudinal direction d. This allows the cover layer 8 to be disposed between the functional films 4, 4. Furthermore, in this embodiment, from the viewpoint of disposing the cover layer 8 between the functional films 4, 4, the portions of the pair of cover layers 8, 8 facing each other in the width direction B are sharpened portions 8a.

[0041] In the example of Fig. 4, the pair of cover layers 8, 8 are in the shape of an approximately isosceles trapezoid or an approximately isosceles triangle. In order to make the shape of the cover layer 8 conform to the shape of the circular functional film 4, the oblique side of the cover layer 8 is gently curved in a concave shape. The cover layer 8 is continuous with the convex portion 7b so that its base contacts the tip of the convex portion 7b and its top faces the center in the width direction B, and is integrated with the protective layer 7. The pointed portion 8a does not necessarily have to be sharply pointed, and may have a rounded tip.

[0042] Next, a method for manufacturing a semiconductor device using the above-mentioned laminated film 1 will be described.

[0043] The method for manufacturing a semiconductor device according to this embodiment includes a transporting step, a peeling step, and an attaching step. In the transporting step, the laminated film 1 is transported toward the ring frame R. In the peeling step, the protective film 2 is folded back over the functional film 4 using a peeling plate 25, and the protective film 2 is peeled off from the functional film 4. In the attaching step, the functional film 4 is attached to the ring frame R.

[0044] Each of the above steps is performed using, for example, a bonding device 21 shown in Fig. 5. In the example of Fig. 5, the bonding device 21 includes a stage 22, a plurality of transport rollers 23, a detection unit 24, a peeling plate 25, an air supply unit 26, and a pressure roller 27.

[0045] A ring frame R to which the functional film 4 is to be attached is placed on the stage 22. The transport rollers 23 transport the laminated film 1 at a constant speed between a pay-out roller that pays out the laminated film 1 and a take-up roller that winds up the protective film 2 after the functional film 4 has been used. A predetermined tension is applied to the laminated film 1 during transport by the multiple transport rollers 23.

[0046] The detection unit 24 has, for example, a light emitting unit that outputs detection light, and a light receiving unit that receives the detection light that has been transmitted through or reflected by the laminate film 1. The detection unit 24 detects the leading edge of the functional film 4 of the transported laminate film 1 based on the difference between the received light intensity of the detection light when transmitted through or reflected by the protective film 2 and the received light intensity of the detection light when transmitted through or reflected by the functional film 4. Information indicating the result of detecting the leading edge of the functional film 4 is used for controlling the operation of the air supply unit 26, the operation of the pressure roller 27, etc.

[0047] The peeling plate 25 peels off the protective film 2 (and the weak adhesive layer 3 on the protective film 2) from the functional film 4. The peeling plate 25 is disposed near the stage 22 in the transport path of the laminated film 1. Of the laminated film 1, the protective film 2 and the weak adhesive layer 3 are folded back along the tip shape of the peeling plate 25 and transported to the take-up roller by the transport roller 23. The functional film 4 is not folded back by the peeling plate 25, and advances toward the pressing roller 27 in a state where it is slightly warped relative to the protective film 2 and weak adhesive layer 3 to be peeled off.

[0048] The air supply unit 26 supplies air 28 to assist the peeling. The air 28 is supplied toward a target position from, for example, one or more supply holes provided in an air supply pipe. The target position of the air 28 is set, for example, at the folding back position S of the protective film 2 with respect to the functional film 4. The target position of the air 28 may be set at a position forward of the folding back position S in the traveling direction of the functional film 4 (toward the pressure roller 27).

[0049] Based on information indicating the result of detecting the leading end of the functional film 4 from the detection unit 24, the pressing roller 27 presses the functional film 4 toward the ring frame R at the timing when the functional film 4 after the protective film 2 and the weak adhesive layer 3 are peeled off reaches the position of the pressing roller 27. As a result, the functional film 4 is attached to the ring frame R.

[0050] As described above, in the laminated film 1, the cover layer 8 is disposed in the region between the functional films 4, 4 adjacent to each other in the longitudinal direction D and the pair of protective layers 7, 7, thereby reducing the area of ​​the weak adhesive layer 3 exposed from the functional film 4. This makes it possible to prevent the weak adhesive layer 3 from sticking to the rolls (conveyor roller 23, etc.) that transport the laminated film 1 during the manufacturing process of the semiconductor device. By preventing the weak adhesive layer 3 from sticking to the rolls, it is possible to prevent the cuts that form the notch portion 9 from being rolled up from the main body of the cutting assist film 5, and the peeling-inhibiting function of the notch portion 9 can be suitably maintained.

[0051] In this embodiment, the cover layer 8 is arranged in a pair so as to be continuous with each of the pair of protective layers 7, 7. The pair of cover layers 8, 8 face each other in the width direction B while being spaced apart from each other, and are arranged spaced apart from the functional films 4, 4 adjacent to each other in the longitudinal direction D. By making the pair of cover layers 8, 8 continuous with the pair of protective layers 7, 7, the area of ​​the weak adhesive layer 3 exposed from the functional film 4 can be further reduced. In addition, by separating the pair of cover layers 8, 8 from each other in the width direction B and also separating them from the functional films adjacent to each other in the longitudinal direction D, the weak adhesive layer 3 exposed from the functional film 4 can be made continuous in the longitudinal direction D of the protective film 2. Therefore, the precutting of the functional film 4 and the subsequent peeling off of the excess portion of the functional film 4 can be performed continuously using a roll, and the manufacturing efficiency of the laminated film 1 can be sufficiently ensured.

[0052] In this embodiment, the portions of the pair of cover layers 8, 8 facing each other in the width direction B are sharpened portions 8a. As a result, even if the gap between adjacent functional films 4 in the longitudinal direction D is small, the cover layer 8 can be disposed between the functional films 4, 4, and the area of ​​the weak adhesive layer 3 exposed from the functional film 4 can be sufficiently reduced. Furthermore, by providing the cover layer 8 with the sharpened portions 8a, the gap between the functional film 4 and the cover layer 8 can be secured. This can prevent problems such as the excess portion of the functional film 4 being torn off when the excess portion is continuously peeled off using a roll.

[0053] In this embodiment, the tip width W2 of the cover layer 8 in the longitudinal direction D is smaller than the interval W1 between the functional films 4, 4 adjacent to each other in the longitudinal direction D. As a result, even if the interval between the functional films 4, 4 adjacent to each other in the longitudinal direction D is small, the cover layer 8 can be disposed between the functional films 4, 4, and the area of ​​the weak adhesive layer 3 exposed from the functional film 4 can be sufficiently reduced.

[0054] In this embodiment, the support piece forming film 6 has a thermosetting resin layer 10 and a high-rigidity layer 11 having a higher rigidity than the thermosetting resin layer 10, and the high-rigidity layer 11 is bonded to one side of the protective film 2 via a weak adhesive layer 3. By including a high-rigidity layer in the support piece forming film 6, the followability to the push-up jig is reduced, while the followability to a pick-up tool such as a suction collet can be improved. In addition, by bonding the high-rigidity layer 11 to one side of the protective film 2 via the weak adhesive layer 3, the support piece forming film 6 is firmly fixed to the protective film 2, and the precutting of the support piece forming film 6 can be suitably performed.

[0055] In the manufacturing method of the semiconductor device according to this embodiment, by using the above-mentioned laminated film 1, it is possible to prevent the weak adhesive layer 3 of the protective film 2 from sticking to the roll that transports the laminated film 1. By preventing the weak adhesive layer 3 from sticking to the roll, it is possible to prevent the cut that forms the notch portion 9 from being turned up from the main body of the cutting assist film 5, and the peeling-inhibiting function of the notch portion 9 can be suitably maintained.

[0056] In this embodiment, in the peeling process, air 28 to assist peeling is supplied to the folding position S of the protective film 2 relative to the functional film 4. The supply of air 28 makes it easier for the protective film 2 to warp from the functional film 4, and peeling failure of the protective film 2 can be suitably suppressed.

[0057] The present disclosure is not limited to the above embodiment. For example, in the above embodiment, the support piece forming film 6 is configured as two layers, the thermosetting resin layer 10 and the high rigidity layer 11, but the support piece forming film 6 may be configured as three layers, the high rigidity layer 11 and a pair of thermosetting resin layers 10, 10 sandwiching the high rigidity layer 11.

[0058] In the above embodiment, the pair of cover layers 8, 8 are disposed so as to be continuous with each of the pair of protective layers 7, 7, but the cover layer 8 may be disposed so as to be spaced apart from both the functional film 4 and the pair of protective layers 7, 7 adjacent to each other in the longitudinal direction D. The cover layer 8 does not necessarily have to have the sharpened portion 8a.

[0059] In the example of FIG. 6, the cover layer 8 has a substantially rectangular shape with rounded corners. The width W3 of the cover layer 8 in the longitudinal direction D is smaller than the interval W1 between the functional films 4, 4 adjacent to each other in the longitudinal direction D. The cover layer 8 is spaced apart from both the functional films 4, 4 adjacent to each other in the longitudinal direction D and the pair of protective layers 7, 7 at both ends in the width direction B, and is disposed in the center of the region between the functional films 4, 4 and the pair of protective layers 7, 7 so that the short side is aligned with the longitudinal direction D and the long side is aligned with the width direction B. In addition, from the viewpoint of making the shape of the cover layer 8 conform to the shape of the circular functional film 4, the cover layer 8 may have a substantially rectangular shape with rounded corners, with the long side gently curved toward the center, as in the example of FIG. 7.

[0060] 6 and 7, as in the above embodiment, the area of ​​the weak adhesive layer 3 exposed from the functional film 4 can be reduced by the cover layer 8. Therefore, in the manufacturing process of the semiconductor device, the weak adhesive layer 3 can be prevented from sticking to the roll, and the cut forming the notch portion 9 can be prevented from being rolled up from the main body of the cutting aid film 5. Furthermore, with this configuration, by ensuring the spacing between the functional films 4,4 and the pair of protective layers 7,7 and the cover layer 8, it is possible to prevent the occurrence of problems such as the excess portion being torn off when the excess portion of the functional film 4 is continuously peeled off using a roll.

[0061] The gist of this disclosure is as follows: [1] to [8] [1] A laminated film comprising: a long protective film; a weak adhesive layer provided on one side of the protective film; a plurality of functional films arranged at a distance from each other along the longitudinal direction of the protective film and joined to one side of the protective film via the weak adhesive layer; and a pair of protective layers extending in the longitudinal direction at both ends of the protective film in the width direction, wherein the functional film has a support piece forming film joined to one side of the protective film via the weak adhesive layer, and a cutting aid film overlapping the support piece forming film, wherein the cutting aid film has a protruding region that protrudes outward beyond the edge of the support piece forming film and is joined to the weak adhesive layer, and has a notch portion in the protruding region formed by cutting the cutting aid film into a wedge shape, and in a plan view of the protective film, a cover layer is arranged in the region between the functional films adjacent to each other in the longitudinal direction and the pair of protective layers to cover the weak adhesive layer exposed from the functional film. [2] The laminated film described in [1], wherein the cover layers are arranged in a pair so as to be continuous with each of the pair of protective layers, and the pair of cover layers are opposed to each other in the width direction while being spaced apart from each other and are arranged at a distance from the functional films adjacent to each other in the longitudinal direction. [3] The laminated film according to [2], wherein the portions of the pair of cover layers facing each other in the width direction are sharpened portions. [4] The laminate film according to any one of [1] to [3], wherein the tip width of the cover layer in the longitudinal direction is smaller than the distance between adjacent functional films in the longitudinal direction. [5] The laminated film described in [1], wherein the cover layer is positioned at a distance from both the functional film and the pair of protective layers adjacent to each other in the longitudinal direction. [6] The film for forming a support piece has a thermosetting resin layer and a high-rigidity layer having higher rigidity than the thermosetting resin layer, and the high-rigidity layer is bonded to one side of the protective film via the weak adhesive layer. The laminate film according to any one of [1] to [5]. [7] A method for manufacturing a semiconductor device, comprising: a transporting step of transporting a laminated film described in any one of [1] to [6] toward a semiconductor wafer and a ring frame; a peeling step of folding back the protective film onto the functional film using a peeling plate, thereby peeling the protective film from the functional film; and an attachment step of attaching the functional film to the semiconductor wafer and the ring frame. [8] The method for manufacturing a semiconductor device according to [7], wherein in the peeling step, air is supplied to a folding position of the protective film relative to the functional film to assist peeling. [Explanation of symbols]

[0062] 1...laminated film, 2...protective film, 3...low-adhesive layer, 4...functional film, 5...cutting assist film, 6...support piece forming film, 7...protective layer, 8...cover layer, 8a...sharp portion, 9...notch portion, 10...thermosetting resin layer, 11...high-rigidity layer, 25...peeling plate, 28...air, B...width direction, D...longitudinal direction, P...extension area, S...fold-back position.

Claims

1. A long protective film, A weak adhesive layer provided on one surface of the protective film; A plurality of functional films are arranged apart from each other along a longitudinal direction of the protective film and are bonded to one surface of the protective film via the weak adhesive layer; a pair of protective layers extending in the longitudinal direction at both ends in the width direction of the protective film; The functional film is a support piece forming film bonded to one surface of the protective film via the weak adhesive layer; A cutting assist film overlapping the support piece forming film, The cutting assist film has a protruding region that protrudes outward from the edge of the support piece forming film and is joined to the weak adhesive layer, and has a notch portion formed by cutting the cutting assist film into a wedge shape in the protruding region, A laminated film, in which, when viewed in a planar view of the protective film, a cover layer is arranged in the area between the functional films adjacent to each other in the longitudinal direction and the pair of protective layers, covering the low-adhesive layer exposed from the functional film.

2. The cover layer is disposed in a pair so as to be continuous with each of the pair of protective layers, The laminated film according to claim 1 , wherein the pair of cover layers are opposed to each other in the width direction while being spaced apart from each other, and are arranged spaced apart from the functional films adjacent to each other in the longitudinal direction.

3. The laminated film according to claim 2 , wherein portions of the pair of cover layers facing each other in the width direction form sharp tips.

4. The laminated film according to claim 1 , wherein a width of an end of the cover layer in the longitudinal direction is smaller than a distance between adjacent functional films in the longitudinal direction.

5. The laminated film according to claim 1 , wherein the cover layer is disposed apart from both the functional film and the pair of protective layers adjacent to each other in the longitudinal direction.

6. The support piece forming film has a thermosetting resin layer and a high-rigidity layer having a higher rigidity than the thermosetting resin layer, 2. The laminated film according to claim 1, wherein the high-rigidity layer is bonded to one side of the protective film via the weak adhesive layer.

7. A conveying step of conveying the laminated film according to any one of claims 1 to 6 toward a semiconductor wafer and a ring frame; a peeling step of folding back the protective film onto the functional film using a peeling plate to peel the protective film from the functional film; and a bonding step of bonding the functional film to the semiconductor wafer and the ring frame.

8. The method for manufacturing a semiconductor device according to claim 7 , wherein in the peeling step, air for assisting peeling is supplied to a folding position of the protective film relative to the functional film.

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