Light emitting device, light emitting module, and method for manufacturing light emitting device

Abstract

To provide a light emitting device capable of suppressing an adhesive from interfering with an optical path of light.SOLUTION: A light emitting device includes a package having a lid body having an upper surface, a light emitting element arranged in the internal space of the package, a first spacer arranged on the upper surface of the lid body and having an upper surface, an optical member arranged on the lid body and having an upper surface and a lower surface, and a first joint that joins the lid body and the optical member, the first joint is provided between the upper surface of the lid body and the lower surface of the optical member, and between the upper surface of the first spacer and the lower surface of the optical member.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a light emitting device, a light emitting module, and a method for manufacturing a light emitting device. [Background technology]

[0002] JP 2022-123425 A discloses a light emitting device having a light emitting element, a package, a wave plate, and a lens member, in which the light emitting element is disposed in the internal space of the package, and the wave plate is provided between the package and the lens member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-123425 Summary of the Invention [Problem to be solved by the invention]

[0004] When bonding an optical member such as a wave plate onto a package, it may be preferable to prevent the adhesive from interfering with the optical path of light. On the other hand, when the light emitting device becomes smaller, restrictions may arise on the area in which the adhesive can be provided.

[0005] A structure is disclosed that allows for proper placement of adhesive to bond objects together. [Means for solving the problem]

[0006] The light emitting device disclosed in the embodiment comprises a package having a lid body having an upper surface, a light emitting element arranged in the internal space of the package, a first spacer arranged on the upper surface of the lid body and having an upper surface, an optical member arranged on the lid body and having an upper surface and a lower surface, and a first joint portion joining the lid body and the optical member, the first joint portion being provided between the upper surface of the lid body and the lower surface of the optical member, and between the upper surface of the first spacer and the lower surface of the optical member.

[0007] Moreover, the light emitting module disclosed in the embodiment includes a first light emitting device which is the above-mentioned light emitting device, a second light emitting device which does not include a wavelength plate, and a light guide plate into which light emitted from the first light emitting device and light emitted from the second light emitting device enter with their polarization directions aligned and their fast axis directions aligned, and the first light emitting device and the second light emitting device are arranged side by side in the fast axis direction.

[0008] In addition, a manufacturing method for a light emitting device disclosed in the embodiment includes the steps of preparing a package having a lid body having an upper surface, a light emitting element arranged in the internal space of the package, and a first spacer arranged on the upper surface of the lid body and having an upper surface, providing an adhesive so as to encompass the upper surface of the first spacer in a top view, and joining the upper surface of the lid body and the lower surface of an optical member via the adhesive.

[0009] In at least one of the one or more inventions disclosed in the embodiments, a light emitting device can be realized that can prevent an adhesive from interfering with the optical path of light. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view of the light emitting device according to the first embodiment. [Diagram 2] FIG. 2 is a side view of the light emitting device according to the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 5 is an enlarged view for explaining the state of the spacer and the bonding portion in the light emitting device according to the first embodiment. [Figure 6] FIG. 6 is a perspective view showing an optical member of the light emitting device according to the first embodiment. [Figure 7A] FIG. 7A is a top view showing an optical member of the light emitting device according to the first embodiment. [Figure 7B] FIG. 7B is an enlarged view of a portion of FIG. 7A. [Figure 8] FIG. 8 is a top view for explaining the positions of the spacers and bonding portions and their positional relationship with the base body in the light emitting device according to the first embodiment. [Figure 9] FIG. 9 is a perspective view showing the structure inside the package of the light emitting device according to the first embodiment. [Figure 10] FIG. 10 is a top view showing the structure inside the package of the light emitting device according to the first embodiment. [Figure 11] FIG. 11 is a bottom view of the package according to the first embodiment. [Figure 12] FIG. 12 is a top view showing an arrangement of the semiconductor laser element and the submount according to the first embodiment. [Figure 13] FIG. 13 is a side view showing an arrangement of the semiconductor laser element and the submount according to the first embodiment. [Figure 14] FIG. 14 is a schematic diagram illustrating a step of providing an adhesive in the light emitting device according to the first embodiment. [Figure 15] FIG. 15 is a schematic diagram showing an example of a position where an adhesive is provided in the light emitting device according to the first embodiment. [Figure 16] FIG. 16 is a schematic diagram showing another example of the position where the adhesive is provided in the light emitting device according to the first embodiment. [Figure 17A] FIG. 17A is a top view showing another example of the bonding portion formed in the light emitting device according to the first embodiment. [Figure 17B] FIG. 17B is an enlarged view of a portion of FIG. 17A. [Figure 18] FIG. 18 is a schematic diagram of a light emitting module according to the second embodiment. [Figure 19] FIG. 19 is a perspective view of a second light emitting device included in the light emitting module according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] In this specification and claims, polygons such as triangles and quadrangles are referred to as polygons, including shapes in which the corners of the polygons have been processed by rounding, chamfering, removing corners, rounding, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle parts of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while leaving the polygon as the base are included in the interpretation of "polygon" described in this specification and claims.

[0012] This is not limited to polygons, but also applies to words expressing specific shapes such as trapezoids, circles, and irregular shapes. The same is true when dealing with each side that forms the shape. In other words, even if the corners or middle part of a side have been processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0013] In addition, in this specification or the claims, descriptions such as up and down (upper / lower), left and right, front and back, front and back (front / rear), front and back, etc., merely describe relationships such as relative positions, orientations, and directions, and do not necessarily correspond to the relationships during use.

[0014] In addition, directions such as the X direction, the Y direction, and the Z direction may be indicated by using arrows in the drawings. The directions of these arrows are consistent among multiple drawings relating to the same embodiment. In addition, the direction of the arrows marked with X, Y, and Z in the drawings is the positive direction, and the opposite direction is the negative direction. For example, the direction marked with X at the tip of the arrow is the X direction and the positive direction. In this specification, the direction that is the X direction and the positive direction is referred to as the "positive X direction", and the opposite direction is referred to as the "negative X direction". When referring to the "X direction", it includes both the positive and negative directions. The same applies to the Y and Z directions.

[0015] In addition, in this specification, when an object is specified as "one or more" and the object is described, both the form in which the object is one and the form in which the object is multiple are described together. Thus, the description specifying "one or more" supports any of the following embodiments: an embodiment with one or more objects, an embodiment with at least one object, and an embodiment with multiple objects.

[0016] In addition, in this specification, the description of the "one or each" object is a description that combines a description of one object in an embodiment having one object, a description of one object in an embodiment having multiple objects, and a description of each of the objects in an embodiment having multiple objects. Therefore, the description of the "one or each" object supports all of the following: in an embodiment having one object, this one object has explanatory content; in an embodiment having multiple objects, at least one of these objects has explanatory content; in an embodiment having multiple objects, each of these multiple objects has explanatory content; and in an embodiment having one or multiple objects, all of the objects have explanatory content.

[0017] Furthermore, in this specification, the terms "component" and "part" may be used when explaining components, for example. A "component" refers to an object that is physically handled as a single unit. An object that is physically handled as a single unit can also be said to be an object that is handled as a single part in the manufacturing process. On the other hand, a "part" refers to an object that does not need to be physically handled as a single unit. For example, a "part" is used when referring to a portion of a single component, or when referring to multiple components collectively as a single object.

[0018] The distinction between "component" and "part" above does not indicate any intention to consciously limit the scope of the right in the interpretation of the doctrine of equivalents. In other words, even if there is a component described as a "component" in the scope of the patent claim, this does not mean that the applicant recognizes that treating this component as a single physical unit is essential for the application of the present invention.

[0019] In addition, in this specification or claims, when there are multiple elements of a certain type and each element needs to be expressed separately, the elements may be distinguished by adding "first" or "second" to the beginning of the element. In addition, the objects to be distinguished may differ between this specification and the claims. Therefore, even if the claims describe an element with the same notation as this specification, the object identified by this element may not be the same between this specification and the claims.

[0020] For example, if there are elements in this specification that are distinguished by the notation "first," "second," and "third," and the elements to which "first" and "third" are attached in this specification are described in the claims, the elements may be distinguished by the notation "first" and "second" in the claims from the viewpoint of readability. In this case, the elements to which "first" and "second" are attached in the claims refer to the elements to which "first" and "third" are attached in this specification, respectively. Note that this rule is not limited to elements, and can be applied rationally and flexibly to other objects as well.

[0021] Hereinafter, the embodiment for carrying out the present invention will be described. Furthermore, a specific embodiment for carrying out the present invention will be described with reference to the drawings. Note that the embodiment for carrying out the present invention is not limited to this specific embodiment. In other words, the illustrated embodiment is not the only embodiment in which the present invention can be realized. Note that the size and positional relationship of the members shown in each drawing may be exaggerated for ease of understanding.

[0022] First Embodiment A light emitting device 1 according to the first embodiment will be described. FIGS. 1 to 17B are drawings for explaining an exemplary embodiment of the light emitting device 1. FIG. 1 is a perspective view of the light emitting device 1. FIG. 2 is a side view of the light emitting device 1. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. The rectangular dashed line indicates the area shown in an enlarged manner in FIG. 5. FIG. 5 is an enlarged view for explaining the state of the spacer 80 and the joint 90 in the light emitting device 1. For ease of viewing, the joint 90 is hatched, and the spacer 80 included in the joint 90 is shown by a dashed line. FIG. 6 is a perspective view showing the optical member 70 of the light emitting device 1 through the light. The optical member 70 through the light is shown by a dotted line. FIG. 7A is a top view showing the optical member 70 of the light emitting device 1 through the light. The rectangular dashed line indicates the area shown in an enlarged manner in FIG. 7B. Moreover, the first region R1 and the second region R2 are shown by hatching with oblique lines, and the main part of the light irradiated to the upper surface 14A or the lower surface 71B is shown by hatching with diagonal lines. Moreover, in the portion where the first region R1 and the second region R2 overlap with the irradiation region of the main part of the light, only the hatching of the irradiation region is shown. FIG. 7B is an enlarged view of the region where the spacer 80 and the bonding portion 90 are arranged. Note that the third region R3 and the fourth region R4 are shown by hatching with oblique lines. FIG. 8 is a top view for explaining the positional relationship between the first spacer 80A, the second spacer 80B, the first bonding portion 90A, and the second bonding portion 90B in the light emitting device 1 and the base body 11. Note that the spacers and bonding portions are shown by dotted lines. FIG. 9 is a perspective view showing the structure inside the package of the light emitting device 1. FIG. 10 is a top view showing the structure inside the package of the light emitting device 1. FIG. 11 is a bottom view of the package 10. Fig. 12 is a top view showing the arrangement of the light emitting element 20 and the submount 30. Fig. 13 is a side view showing the arrangement of the light emitting element 20 and the submount 30. Fig. 14 is a schematic diagram for explaining the step of providing an adhesive in the manufacture of the light emitting device 1. Note that the rectangular dashed lines indicate the areas shown in enlarged form in Figs. 15 and 16. Fig. 15 is a schematic diagram showing an example of the application position of the adhesive AD in the step of providing the adhesive.FIG. 16 is a schematic diagram showing another example of the application position of the adhesive AD in the step of applying the adhesive. FIG. 17A is a top view showing a joint formed when the adhesive is applied to the application position shown in FIG. 16. The rectangular dashed line indicates the area shown in an enlarged view in FIG. 17B. The first area R1 and the second area R2 are shown by hatching with diagonal lines, and the main part of the light irradiated to the upper surface 14A or the lower surface 71B is shown by hatching with halftone dots. In addition, in the area where the first area R1 and the second area R2 overlap with the irradiation area of ​​the main part of the light, only the hatching of the irradiation area is shown. FIG. 17B is an enlarged view of the area where the spacer 80 and the joint 90 are arranged. The third area R3 and the fourth area R4 are shown by hatching with diagonal lines.

[0023] The light emitting device 1 includes a plurality of components, including a package 10, one or more light emitting elements 20, one or more submounts 30, one or more reflective members 40, one or more protective elements 50, and a plurality of wirings 60.

[0024] The light emitting device 1 may include other components. For example, the light emitting device 1 may include further light emitting elements in addition to the one or more light emitting elements 20. The light emitting device 1 may not include some of the components listed here.

[0025] First, each component will be described.

[0026] (Package 10) The package 10 includes a base 11 and a lid 14. The lid 14 is joined to the base 11 to form the package 10. An internal space is defined in the package 10 in which other components are disposed. This internal space is a closed space surrounded by the base 11 and the lid 14. In addition, this internal space can be a space sealed in a vacuum or airtight state.

[0027] When viewed from above, the outer edge shape of the package 10 is rectangular. This rectangle can be a rectangle having a long side and a short side. In the illustrated package 10, the short side direction of this rectangle is the same as the X direction, and the long side direction is the same as the Y direction. Note that when viewed from above, the outer edge shape of the package 10 does not have to be rectangular.

[0028] In the package 10, an internal space is formed in which other components are disposed. The first upper surface 11A of the package 10 is a part of an area that defines the internal space. In addition, each of the inner side surfaces 11E and the lower surface 14B of the package 10 is also a part of an area that defines the internal space.

[0029] The base 11 has a first upper surface 11A and a lower surface 11B. The base 11 has a second upper surface 11C. The base 11 has one or more outer surfaces 11D. The base 11 has one or more inner surfaces 11E. The one or more outer surfaces 11D intersect with the second upper surface 11C. The one or more outer surfaces 11D intersect with the lower surface 11B. The one or more inner surfaces 11E intersect with the second upper surface 11C.

[0030] When viewed from above, the outer edge shape of base 11 is rectangular. When viewed from above, the outer edge shape of base 11 is the outer edge shape of package 10. When viewed from above, the outer edge shape of first top surface 11A is rectangular. This rectangle can be a rectangle having long sides and short sides. The long side direction of first top surface 11A and the long side direction of the outer edge shape of base 11 are parallel. Note that when viewed from above, the outer edge shape of first top surface 11A does not have to be rectangular.

[0031] In top view, first top surface 11A is surrounded by second top surface 11C. Second top surface 11C is an annular surface surrounding first top surface 11A in top view. Second top surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of second top surface 11C is referred to as the inner frame of second top surface 11C, and the frame defined by the outer edge of second top surface 11C is referred to as the outer frame of second top surface 11C.

[0032] The base 11 has a recess surrounded by a frame by the second top surface 11C. The recess defines a portion of the base 11 that is recessed below the second top surface 11C. The first top surface 11A is a part of the recess. The one or more inner surfaces 11E are a part of the recess. The second top surface 11C is located above the first top surface 11A.

[0033] The base 11 has one or more step portions 11F. The step portion 11F has an upper surface 11G and a side surface 11H that intersects with the upper surface 11G and extends downward from the upper surface 11G. Here, one step portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0034] The or each step portion 11F is provided inside the inner frame of the second top surface 11C in top view. The or each step portion 11F is formed along a part or all of the inner side surface 11E in top view. In the base 11, the side surface 11H is an inner side surface, but the side surface 11H and the inner side surface 11E are different surfaces. The or each inner side surface 11E and the or each side surface 11H are perpendicular to the first top surface 11A. Here, the perpendicular allows a difference of ±3 degrees.

[0035] The one or more step portions 11F may include a first step portion 11F1 and a second step portion 11F2. The first step portion 11F1 and the second step portion 11F2 are provided at positions where their respective side surfaces 11H face each other. The first step portion 11F1 and the second step portion 11F2 are provided on the short side of the inner frame of the second upper surface 11C.

[0036] The base 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N may be members made of different materials. The base 11 may be configured to include a base member corresponding to the base portion 11M and a frame member corresponding to the frame portion 11N.

[0037] The base 11M includes a first upper surface 11A. The frame 11N includes a second upper surface 11C. The frame 11N includes one or more outer surfaces 11D and one or more inner surfaces 11E. The frame 11N includes one or more step portions 11F.

[0038] The lower surface of base 11M constitutes a part or the entire area of ​​lower surface 11B of base 11. When the lower surface of base 11M constitutes a part of the area of ​​lower surface 11B of base 11, the lower surface of frame 11N constitutes the remaining area of ​​lower surface 11B of the base.

[0039] The base 11 has a plurality of wiring portions 12A. The plurality of wiring portions 12A include one or more first wiring portions 12A1 disposed in the internal space of the package 10 and one or more second wiring portions 12A2 provided on the outer surface of the package 10.

[0040] The or each first wiring portion 12A1 is provided on the upper surface 11G of the step portion 11F. The base 11 has one or more first wiring portions 12A1 provided on the upper surface 11G of the first step portion 11F1. The base 11 has one or more first wiring portions 12A1 provided on the upper surface 11G of the second step portion 11F2.

[0041] The or each second wiring portion 12A2 is provided on the bottom surface 11B of the package 10. The or each second wiring portion 12A2 is provided on the bottom surface of the frame portion 11N. Note that the second wiring portion 12A2 may be provided on an outer surface of the package 10 different from the bottom surface 11B.

[0042] When viewed from above, the base 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base 11 in the region that includes the upper surface 11G of the first step portion 11F1 when the base 11 is divided into two regions by a virtual line passing through the side surface 11H of the first step portion 11F1 and parallel to this side surface 11H.

[0043] When viewed from above, the base 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base 11 in the region that includes the upper surface 11G of the second step portion 11F2 when the base 11 is divided into two regions by a virtual line that passes through the side surface 11H of the second step portion 11F2 and is parallel to this side surface 11H.

[0044] In the base 11, one or each of the first wiring portions 12A1 is electrically connected to the second wiring portion 12A2. One or more of the first wiring portions 12A1 are electrically connected to different second wiring portions 12A2.

[0045] The base 11 has a bonding pattern 13A. The bonding pattern 13A is provided on the second upper surface 11C. The bonding pattern 13A is provided in an annular shape. The bonding pattern 13A is provided in a rectangular annular shape. In a top view, the first upper surface 11A is surrounded by the bonding pattern 13A.

[0046] The base 11 can be formed, for example, using ceramic as the main material. Examples of the ceramic that is the main material of the base 11 include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0047] Here, the main material refers to the material that occupies the largest proportion of the mass or volume of the target structure. Note that when the target structure is formed from one material, that material is the main material. In other words, when a material is the main material, it includes the possibility that the proportion of that material can be 100%.

[0048] The base 11 may be formed using a base member and a frame member formed using different main materials. The base member may be formed using, for example, a material having excellent heat dissipation properties, such as a metal or a metal-containing composite, graphite, or diamond, as the main material. Examples of metals that are the main material of the base member include copper, aluminum, and iron. Examples of metal-containing composites that are the main material of the base member include copper molybdenum and copper tungsten. The frame member may be formed using, for example, the ceramics listed above as the main material of the base 11 as the main material.

[0049] The wiring portion 12A can be formed, for example, by using a metal material as a main material. Examples of the metal material that is the main material of the wiring portion 12A include simple metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, and alloys containing these metals. The wiring portion 12A can be composed of, for example, one or more metal layers.

[0050] The bonding pattern 13A can be formed, for example, by using a metal material as a main material. Examples of the metal material that is the main material of the bonding pattern 13A include simple metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, and alloys containing these metals. The bonding pattern 13A can be formed, for example, by one or more metal layers.

[0051] The lid body 14 has an upper surface 14A and a lower surface 14B. The lid body 14 also has one or more side surfaces 14C. The lid body 14 is configured in a rectangular parallelepiped flat plate shape. However, it does not have to be a rectangular parallelepiped.

[0052] The lid 14 is bonded to the base 11. The lower surface 14B of the lid 14 is bonded to the second upper surface 11C of the base 11. The lid 14 is bonded to the bonding pattern 13A of the base 11. The lid 14 is bonded to the base 11 via an adhesive.

[0053] In top view, the lid body 14 is disposed inside the outer edge of the base body 11. In top view, the outer edge of the lid body 14 is disposed outside the inner frame of the second upper surface 11C of the base body 11.

[0054] The lid body 14 has a translucency that transmits light. Here, translucency means that the transmittance of light incident on the lid body 14 is 80% or more. The lid body 14 may have a non-translucent region (a region that does not have translucency) in part.

[0055] The cover 14 can be formed, for example, using glass as a main material, or can be formed, for example, using sapphire as a main material.

[0056] (Light emitting element 20) The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and multiple side surfaces 21C. The shape of the upper surface 21A is rectangular. This rectangle has long sides and short sides. The outer shape of the light-emitting element 20 when viewed from above is rectangular. This rectangle has long sides and short sides. Note that the shape of the upper surface 21A and the outer shape of the light-emitting element 20 when viewed from above are not limited to this.

[0057] The light-emitting element 20 has a light emitting surface 22 that emits light. For example, the side surface 21C can be the light emitting surface 22. The side surface 21C that becomes the light emitting surface 22 intersects with a short side of the top surface 21A. Alternatively, for example, the top surface 21A can be the light emitting surface 22. The light-emitting element 20 has one or more light emitting surfaces 22.

[0058] For example, a light emitting element that emits blue light can be used as the light emitting element 20. Also, for example, a light emitting element that emits green light can be used as the light emitting element 20. Also, for example, a light emitting element that emits red light can be used as the light emitting element 20. Note that a light emitting element that emits light of other colors or wavelengths may also be used as the light emitting element 20.

[0059] Here, blue light refers to light whose emission peak wavelength is in the range of 420nm to 494nm, green light refers to light whose emission peak wavelength is in the range of 495nm to 570nm, and red light refers to light whose emission peak wavelength is in the range of 605nm to 750nm.

[0060] The light emitting element 20 that emits blue light or the light emitting element 20 that emits green light may be a light emitting element containing a nitride semiconductor. For example, a GaN-based semiconductor such as GaN, InGaN, or AlGaN may be used as the nitride semiconductor. The light emitting element 20 that emits red light may be a light emitting element containing an InAlGaP-based, GaInP-based, or GaAs-based semiconductor such as GaAs or AlGaAs.

[0061] For example, a semiconductor laser element can be used as the light emitting element 20. A single-emitter semiconductor laser element having one emitter can be used as the light emitting element 20. A multi-emitter semiconductor laser element having multiple emitters can be used as the light emitting element 20. Note that the light emitting element 20 is not limited to a semiconductor laser element, and a light emitting diode or the like may also be used.

[0062] Here, a semiconductor laser element, which is an example of the light emitting element 20, will be described.

[0063] The semiconductor laser element emits directional laser light. Diverging light with a spread is emitted from the light emission surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emission surface 22. The FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light emission surface of the semiconductor laser element.

[0064] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis or the light passing through the optical axis. Also, in the light intensity distribution of the FFP, the peak intensity value is 1 / e 2 The light having an intensity equal to or greater than this will be referred to as the main portion of the light.

[0065] The shape of the FFP of the light emitted from the semiconductor laser element is an ellipse in which the stacking direction is longer than the direction perpendicular to the stacking direction on a plane parallel to the light emitting surface 22. The stacking direction is the direction in which multiple semiconductor layers including the active layer are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the in-plane direction of the semiconductor layers. The long axis direction of the elliptical shape of the FFP can also be called the fast axis direction of the semiconductor laser element, and the short axis direction can also be called the slow axis direction of the semiconductor laser element.

[0066] Based on the light intensity distribution of FFP, the peak light intensity is 1 / e 2 The angle at which the light of the semiconductor laser element spreads is defined as the spread angle of the light. Here, the spread angle of the light is the angle between the light of the peak light intensity (light passing through the optical axis) and 1 / e of the peak light intensity. 2 The spread angle of light is expressed as the angle between the light with a peak light intensity of 1 / e 2 In addition to the light intensity at half the peak light intensity, the light intensity may also be calculated from the light intensity at half the peak light intensity. 2 This refers to the spread angle of light at a light intensity of

[0067] The divergence angle of the light emitted from the semiconductor laser element in the fast axis direction can be 15 degrees or more and less than 40 degrees. The divergence angle of this light in the slow axis direction can be more than 0 degrees and less than 10 degrees. The divergence angle of this light in the fast axis direction is larger than the divergence angle of the light in the slow axis direction.

[0068] For example, the spread angle in the fast axis direction of blue light emitted from the semiconductor laser element can be 15 degrees or more and less than 30 degrees, and the spread angle in the slow axis direction can be 2 degrees or more and less than 10 degrees. For example, the spread angle in the fast axis direction of green light emitted from the semiconductor laser element can be 15 degrees or more and less than 30 degrees, and the spread angle in the slow axis direction can be 2 degrees or more and less than 10 degrees. For example, the spread angle in the fast axis direction of red light emitted from the semiconductor laser element can be 20 degrees or more and less than 40 degrees, and the spread angle in the slow axis direction can be 3 degrees or more and less than 10 degrees.

[0069] (Submount 30) The submount 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be said to be a mounting surface on which other components are mounted. The shape of the upper surface 31A is rectangular. This rectangle of the upper surface 31A can have short sides and long sides. It should be noted that the shape of the upper surface 31A does not have to be rectangular.

[0070] The outer shape of the submount 30 when viewed from above is rectangular. This rectangle of the submount 30 may have a short side and a long side. It should be noted that the outer shape of the submount 30 when viewed from above does not have to be rectangular. The submount 30 may have an outer shape in which the length in one direction (hereinafter, this direction will be referred to as the short side direction of the submount 30) when viewed from above is smaller than the length in the direction perpendicular to the short side direction (hereinafter, this direction will be referred to as the long side direction of the submount 30). In the illustrated submount 30, the short side direction is the same as the X direction, and the long side direction is the same as the Y direction.

[0071] The submount 30 may be configured to include a substrate 32A and an upper metal member 32B. The submount 30 may further be configured to include a lower metal member 32C. The upper metal member 32B is provided on the upper surface side of the substrate 32A. The lower metal member 32C is provided on the lower surface side of the substrate 32A. The submount 30 further includes a wiring layer 33. The wiring layer 33 is provided on the upper metal member 32B.

[0072] The substrate 32A has insulating properties. The substrate 32A is made of, for example, silicon nitride, aluminum nitride, or silicon carbide. It is preferable to select ceramic, which has relatively good heat dissipation properties (high thermal conductivity), as the main material of the substrate 32A.

[0073] The upper metal member 32B is mainly made of a metal such as copper or aluminum. The upper metal member 32B has one or more metal layers. The upper metal member 32B may have multiple metal layers made of different metals as main materials.

[0074] The lower metal member 32C is mainly made of a metal such as copper or aluminum. The lower metal member 32C has one or more metal layers. The lower metal member 32C may have multiple metal layers made of different metals as main materials.

[0075] The wiring layer 33 can be formed using a metal. For example, the wiring layer 33 can be formed using AuSn solder (a metal layer of AuSn).

[0076] For example, the length of the short side or lateral direction of the submount 30 is 700 μm or more and 1400 μm or less. The length of the long side or longitudinal direction of the submount 30 is 1200 μm or more and 2700 μm or less. The difference between the length of the long side and the length of the lateral direction of the submount 30 is 100 μm or more and 2000 μm or less.

[0077] For example, the thickness of the submount 30 (width in a direction perpendicular to the upper surface 31A) is 200 μm or more and 400 μm or less. Also, for example, the thickness of the substrate 32A is 100 μm or more and 300 μm or less. Also, for example, the thickness of the upper metal member 32B is 25 μm or more and 75 μm or less. Also, for example, the thickness of the lower metal member 32C is 25 μm or more and 75 μm or less. Also, for example, the thickness of the wiring layer 33 is 1 μm or more and 5 μm or less.

[0078] (Reflective member 40) The reflecting member 40 has a lower surface 41A and a light reflecting surface 41B that reflects light. The light reflecting surface 41B is inclined with respect to the lower surface 41A. A straight line connecting the lower end and the upper end of the light reflecting surface 41B is inclined with respect to the lower surface 41A. The angle at which the light reflecting surface 41B is inclined with respect to the lower surface 41A is referred to as the inclination angle of the light reflecting surface 41B.

[0079] The light reflecting surface 41B is a flat surface. The light reflecting surface 41B may be a curved surface. The inclination angle of the light reflecting surface 41B is 45 degrees. The inclination angle of the light reflecting surface 41B does not have to be 45 degrees.

[0080] The main material of the reflective member 40 may be glass, metal, or the like. It is preferable to use a heat-resistant material as the main material of the reflective member 40. The main material may be, for example, glass such as quartz or BK7 (borosilicate glass), or metal such as Al. The reflective member 40 may also be formed using Si as the main material.

[0081] If the main material is a reflective material such as Al, the light reflecting surface 41B can be formed from the main material. Instead of forming the light reflecting surface 41B from the main material, the general shape of the reflecting member 40 may be formed from the main material, and the light reflecting surface 41B may be formed on the surface of the general shape. In this case, the light reflecting surface 41B can be formed using, for example, a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0082] The light reflecting surface 41B has a reflectance of 90% or more for the peak wavelength of light irradiated onto the light reflecting surface 41B. This reflectance may be 95% or more. This reflectance can also be 99% or more. The light reflectance is 100% or less or less than 100%.

[0083] (Protection element 50) The protection element 50 has an upper surface 51A, a lower surface 51B, and one or more side surfaces 51C. The shape of the protection element 50 is a rectangular parallelepiped. Note that the shape of the protection element 50 does not have to be a rectangular parallelepiped.

[0084] The protective element 50 is intended to prevent an excessive current from flowing through a specific element (e.g., the light emitting element 20) and causing the element to be destroyed. An example of the protective element 50 is a Zener diode. The Zener diode may be made of Si.

[0085] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends become joints with other components. The wiring 60 is used for electrical connection between two components. The wiring 60 is, for example, a metal wire. Examples of metals that can be used include gold, aluminum, silver, and copper.

[0086] (Optical member 70) The optical member 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical member 70 imparts an optical effect to light incident on the optical member 70. Examples of the optical effects imparted to light by the optical member 70 include light collection, collimation, diffusion, polarization control, diffraction, wave combining, light guiding, reflection, and wavelength conversion.

[0087] The optical member 70 has an optically active surface that provides an optical effect. The upper surface 71A, the lower surface 71B, or the side surface 71C can be the optically active surface. Alternatively, the optically active surface may be located at a position different from the upper surface 71A, the lower surface 71B, or the side surface 71C. For example, the optically active surface may be formed inside the optical member 70, rather than on the surface thereof.

[0088] The upper surface 71A and the lower surface 71B are flat surfaces. When viewed from above, the outer shape of the optical member 70 is rectangular. Note that, the outer shape of the optical member 70 when viewed from above does not have to be rectangular. The lower surface 71B is flat. The shape of the lower surface 71B is rectangular. Note that, the shape of the lower surface 71B does not have to be rectangular.

[0089] The optical member 70 is translucent. The optical member 70 has a transmittance of 80% or more for the peak wavelength of light incident on the optical member 70. The optical member 70 may have a region having translucency and a region not having translucency (hereinafter referred to as a non-translucent region). In the non-translucent region, the transmittance for the peak wavelength of light incident on the optical member 70 is 50% or less. The optical member 70 can be formed using glass such as BK7.

[0090] For example, the optical member 70 is a wave plate. The wave plate emits light with a polarization different from the polarization of the incident light. Examples of wave plates include a half wave plate that rotates the polarization direction of linearly polarized light and a quarter wave plate that converts linearly polarized light into circularly polarized light. For example, a half wave plate can be used as the wave plate.

[0091] (Spacer 80) The spacer 80 has an upper surface 81A and a lower surface 81B. The spacer 80 has a side surface 81C. When viewed from above, the outer edge shape of the spacer 80 is circular or elliptical. The shape of the spacer 80 is cylindrical or elliptical cylindrical. Note that, when viewed from above, the outer edge shape of the spacer 80 does not have to be circular or elliptical. The shape of the spacer 80 does not have to be cylindrical or elliptical cylindrical.

[0092] In top view, the spacer 80 is contained within a square of 500 μm on each side. Also, in top view, the spacer 80 can be contained within a square of 150 μm on each side. The thickness of the spacer 80 in the vertical direction is 10 μm or more and 100 μm or less. Also, the thickness of the spacer 80 in the vertical direction can be 30 μm or more and 50 μm or less.

[0093] The upper surface 81A of the spacer 80 is a flat surface. The upper surface of the spacer 80 does not have to be a flat surface. For example, the upper surface 81A of the spacer 80 may be a curved surface. For example, the upper surface 81A of the spacer 80 may be a curved and convex surface, or a curved and concave surface.

[0094] The spacer 80 can be formed, for example, using a metal material as the main material. Examples of the metal material that is the main material of the spacer 80 include elemental metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, and alloys containing these metals. By using a metal, the shape of the spacer 80 is stabilized.

[0095] (joint part 90) The joint 90 refers to a state in which the adhesive AD has hardened. For example, an adhesive containing a resin is used as the adhesive AD that forms the joint 90. Examples of adhesives that contain a resin include ultraviolet curing resin and thermosetting resin. The adhesive AD may be applied to multiple locations. Therefore, multiple joints 90 may be formed by the joining process. Note that the adhesive AD that forms the joint 90 does not need to be of one type. For example, multiple types of adhesive AD may be applied to different positions to form multiple joints 90.

[0096] Next, the light emitting device 1 will be described.

[0097] (Light emitting device 1) In the light emitting device 1, one or each of the light emitting elements 20 is disposed in the internal space of the package 10. One or each of the light emitting elements 20 is disposed on the base 11. One or each of the light emitting elements 20 is disposed on the first upper surface 11A. One or each of the light emitting elements 20 is disposed in a sealed space surrounded by the base 11 and the lid 14.

[0098] Light emitted from one or each light emitting element 20 enters the lid body 14. The light incident on the lower surface 14B of the lid body 14 passes through the lid body 14 and exits from the upper surface 14A of the lid body 14. The light exiting the lid body 14 is divergent light.

[0099] In the light emitting device 1, one or each light emitting element 20 is disposed on a submount 30. One or each light emitting element 20 is disposed on the first upper surface 11A via the submount 30. One or each submount 30 is bonded to the first upper surface 11A at the lower surface 31B, and is bonded to the light emitting element 20 at the upper surface 31A. The number of light emitting elements 20 disposed on one submount 30 is one or more.

[0100] The or each light emitting element 20 has a light exit surface 22 on the side surface 21C and emits light laterally from the light exit surface 22. The or each light emitting element 20 emits light in a first direction. The first direction and a direction perpendicular to the light exit surface 22 may be parallel. In the illustrated light emitting device 1, the positive Y direction may be considered as the first direction.

[0101] In the light emitting device, one or each reflective member 40 is disposed on the base 11. The one or each reflective member 40 is disposed in the internal space of the package 10. The one or each reflective member 40 is disposed on the first top surface 11A. The one or each reflective member 40 is disposed at a position spaced apart from the light emitting element 20 in the first direction.

[0102] The or each reflecting member 40 reflects light emitted from the light-emitting element 20. The or each light-emitting element 20 emits light toward a light reflecting surface 41B of the reflecting member 40. The light reflected by the light reflecting surface 41B is incident on the lid 14. Note that the light emitted from the light-emitting element 20 may be incident on the lid 14 without utilizing reflection by the reflecting member 40.

[0103] The or each reflective member 40 is spaced from the inner surface 11E of the package 10. The or each reflective member 40 is disposed with the light reflecting surface 41B facing the light emitting surface 22 of the light emitting element 20 and with the side opposite the light reflecting surface 41B facing the inner surface 11E.

[0104] In a top view, the length of the light emitting element 20 in the first direction is greater than the length of the reflecting member 40. In a top view, the length of the submount 30 in the first direction is greater than the length of the reflecting member 40.

[0105] In top view, an imaginary line that passes through a midpoint of the width in the first direction of first top surface 11A and is parallel to a second direction perpendicular to the first direction passes through light-emitting element 20 and does not pass through reflective member 40. In top view, an imaginary line that passes through a midpoint of the width in the first direction of the inner frame of second top surface 11C and is parallel to the second direction perpendicular to the first direction passes through light-emitting element 20 and does not pass through reflective member 40.

[0106] The or each light emitting element 20 is a semiconductor laser element, and light passing through an optical axis emitted from the light emitting surface 22 is reflected by the reflecting member 40 in a direction perpendicular to the first upper surface 11A.

[0107] When realizing a compact light emitting device 1, the width in the first direction of the first upper surface 11A approaches the sum of the length in the first direction of the light emitting element 20 or the submount 30 and the length in the first direction of the reflecting member 40. Therefore, the light reflecting surface 41B is disposed at a position shifted from the center of the first upper surface 11A, and the light passing through the optical axis is also emitted from the lid body 14 at a position shifted from the center of the lid body 14. In addition, since divergent light is emitted from the lid body 14, the area where the main part of the light is irradiated on the upper surface 14A of the lid body 14 is also shifted in the first direction from the center of the light emitting device 1 in the top view.

[0108] In the light emitting device 1, one or each protective element 50 is disposed on the base 11. The one or each protective element 50 is disposed in the internal space of the package 10. The one or more protective elements 50 include a protective element 50 disposed on an upper surface 11G of a stepped portion 11F of the base 11. The protective element 50 protects the light emitting element 20 disposed on the base 11.

[0109] The light emitting device 1 has a plurality of wirings 60 electrically connected to the light emitting element 20. The plurality of wirings 60 includes one or more wirings 60 joined to the light emitting element 20. The plurality of wirings 60 includes one or more wirings 60 joined to the first step portion 11F1 of the base 11. The plurality of wirings 60 includes one or more wirings 60 joined to the second step portion 11F2 of the base 11.

[0110] The multiple wirings 60 are joined to the first wiring portion 12A1, and electrically connect the light emitting elements 20 to the second wiring portion 12A2.

[0111] In the light emitting device 1, one or more spacers 80 are disposed on the upper surface 14A. The one or more spacers 80 are provided on the upper surface 14A. The one or more spacers 80 include one or more first spacers 80A and one or more second spacers 80B.

[0112] When the upper surface 14A is divided into a first region R1 and a second region R2 by a virtual line passing through the midpoint of the width of the upper surface 14A in the first direction and parallel to the second direction, one or each of the first spacers 80A is arranged in the first region R1, and one or each of the second spacers 80B is arranged in the second region R2. In top view, the first region R1 includes a reflective member 40. In top view, the second region R2 does not include a reflective member 40. The first region R1 is located further in the first direction than the second region R2, and the second region R2 is located in a direction opposite to the first direction than the first region R1.

[0113] The or each second spacer 80B is disposed on the top surface 14A at a position away from the first spacer 80A in a direction opposite to the first direction. The or each spacer 80 is disposed at a position away from an illumination area where a major portion of light is illuminated on the top surface 14A in the fast axis direction of the illumination area. The or each first spacer 80A is disposed at a position away from the illumination area in the first direction, and the or each second spacer 80B is disposed at a position away from the illumination area in a direction opposite to the first direction.

[0114] The or each of the first spacers 80A is disposed at a position overlapping the second upper surface 11C in a top view. The or each of the second spacers 80B is disposed at a position overlapping the second upper surface 11C in a top view. By disposing the spacers 80 in this manner, the spacers 80 are disposed outside the optical path of the light of the main portion, and a light emitting device 1 can be realized in which the spacers 80 are disposed outside the optical path of the light and the spacers 80 do not interfere with the optical path of the light.

[0115] The or each first spacer 80A is disposed at a position farther away in the first direction than the reflective member 40 in top view. The or each second spacer 80B is disposed at a position farther away in the direction opposite to the first direction than the light emitting element 20 in top view.

[0116] When the upper surface 14A is divided into a third region R3 and a fourth region R4 by a virtual line L1 (hereinafter referred to as a first virtual line L1) that passes through a point where light passing through the optical axis is emitted from the light emitting surface 22 and is parallel to the direction in which light passing through the optical axis proceeds from the light emitting surface 22, the one or more first spacers 80A include a first spacer 80A arranged in the third region R3 and a first spacer 80A arranged in the fourth region R4. The one or more first spacers 80A do not include a first spacer 80A that passes through the first virtual line L1. The one or more second spacers 80B include a second spacer 80B arranged in the third region R3 and a second spacer 80B arranged in the fourth region R4. The one or more second spacers 80B do not include a second spacer 80B that passes through the first virtual line L1.

[0117] The illustrated first virtual line L1 overlaps with the fast axis of the FFP of the light irradiated to the upper surface 14A of the lid body 14. In other words, the first virtual line L1 may be a virtual line that passes through the fast axis of the FFP of the light irradiated to the upper surface 14A of the lid body 14 and is parallel to the fast axis.

[0118] The maximum width in the first direction of one or each spacer 80 is 10 μm or more and 200 μm or less. A spacer having a smaller width while still fulfilling its role as a spacer can reduce the ratio of the area where the adhesive AD contacts the spacer 80 to the area where the adhesive AD contacts the spacer 80 and the lid body 14, thereby relatively increasing the area where the adhesive AD contacts the lid body 14.

[0119] In the light emitting device 1, the optical member 70 is disposed on the package 10. The optical member 70 is disposed on the lid 14. The optical member 70 is disposed above the top surface 14A. Light emitted from the light emitting element 20 and emitted from the top surface 14A is incident on the optical member 70. The light incident on the optical member 70 is given an optical effect and is emitted from the optical member 70. For example, when the optical member 70 is a wave plate, the light is emitted from the optical member 70 in a polarization direction different from the polarization direction of the light incident on the optical member 70.

[0120] The optical member 70 is bonded to the package 10 via an adhesive AD provided between the upper surface 14A of the package 10 and the lower surface 71B of the optical member 70. By bonding the package 10 and the optical member 70, the adhesive AD hardens to become a bonding portion 90. In the light emitting device 1, the bonding portion 90 bonds the lid 14 and the optical member 70 together.

[0121] The optical member 70 is bonded to the package 10 via an adhesive AD provided on the spacer 80. The bonding portion 90 is provided between the upper surface 14A of the cover 14 and the lower surface 71B of the optical member 70, and between the upper surface 81A of the spacer 80 and the lower surface 71B of the optical member 70 (see FIG. 5). By using the spacer 80, the thickness of the adhesive AD can be adjusted according to the thickness of the spacer 80, and the adhesive AD can be prevented from spreading too much. This makes it possible to realize a light emitting device 1 that prevents the adhesive AD or the bonding portion 90 from interfering with the optical path of light. In addition, the maximum distance from the spacer 80 to the bonding portion 90 is smaller when the adhesive AD is provided on the spacer 80 than when the adhesive is provided outside the spacer 80, and the light emitting device 1 can be designed to be compact.

[0122] The adhesive AD is provided at a position corresponding to one or each spacer 80. Each joint 90 formed corresponding to one or each spacer 80 can be provided between the upper surface 14A of the lid 14 and the lower surface 71B of the optical member 70, and between the upper surface 81A of the spacer 80 and the lower surface 71B of the optical member 70.

[0123] With regard to the spacer 80 and the joint portion 90 corresponding to this spacer 80, in a top view, the spacer 80 is contained in the joint portion 90. In a top view, the outer edge of the spacer 80 is inside the outer edge of the joint portion 90. Such a positional relationship holds for one or each spacer 80. This allows the light emitting device 1 to be designed to be compact.

[0124] With regard to the spacer 80 and the joint 90 corresponding to this spacer 80, in a top view, the outer edge of the joint 90 intersects with an imaginary line passing through the spacer 80 at two points, a first position P1 and a second position P2, inside the outer edge of the lid 14, and the centers of the first position P1 and the second position P2 overlap with the spacer 80 in a top view (see FIG. 7B). This allows the light emitting device 1 to be designed to be compact. Note that in the illustrated light emitting device 1, this imaginary line can be a line parallel to the X direction.

[0125] The joint 90 formed by the hardening of the adhesive AD provided corresponding to the first spacer 80A and the joint 90 formed by the hardening of the adhesive AD provided corresponding to the second spacer 80B are separated from each other. Here, the joint 90 provided in contact with the first spacer 80A is referred to as the first joint 90A, and the joint 90 provided in contact with the second spacer 80B is referred to as the second joint 90B.

[0126] The first bonding portion 90A may be provided in a one-to-one relationship for one or more first spacers 80A. That is, the first bonding portion 90A corresponding to any first spacer 80A is separated from all the first bonding portions 90A corresponding to the other first spacers 80A. Note that adhesive AD provided corresponding to two first spacers 80A may be connected to form one first bonding portion 90A.

[0127] The second bonding portion 90B may be provided in a one-to-one relationship for one or more second spacers 80B. That is, the second bonding portion 90B corresponding to any second spacer 80B is separated from all the second bonding portions 90B corresponding to the other second spacers 80B. Note that the adhesive AD provided corresponding to two second spacers 80B may be connected to form one second bonding portion 90B.

[0128] Regarding the first spacer 80A and the first joint 90A corresponding to this first spacer 80A, in a top view, the first joint 90A passes through the first spacer 80A and intersects with a virtual straight line parallel to the first direction at two points, the third position P3 and the fourth position P4, and the distance D1 from the first spacer 80A to the third position P3 is smaller than the distance D2 from the first spacer 80A to the fourth position P4 (see FIG. 17B). In addition, in a top view, the distance from the first spacer 80A to the light emitting element 20 is larger than the distance from the third position P3 to the light emitting element 20 and is smaller than the distance from the fourth position P4 to the light emitting element 20. This makes it possible to realize a light emitting device 1 that prevents the joint 90 from interfering with the optical path of light.

[0129] The width in the first direction of the first joint 90A in top view is more than 1 time and not more than 5 times the width in the first direction of the first spacer 80A in top view. By restricting the width in the first direction of the first joint 90A to 4 times or less, interference with light by the first joint 90A can be suppressed and a small-sized light emitting device can be realized.

[0130] A point P5 at which the first bonding portion 90A formed corresponding to the first spacer 80A provided in the third region R3 is at a minimum distance from the light emitting element 20 in the first direction is located at a position 100 μm or more away from the first virtual line L1 in the second direction. When the light emitting element 20 is a semiconductor laser element, the fast axis of light is located on the first virtual line L1 on the lower surface 71B of the optical member 70, so that by providing point P5 at a position away from the first virtual line L1, it is possible to suppress optical interference caused by the first bonding portion 90A.

[0131] A point P6 at which the first joint 90A formed corresponding to the first spacer 80A provided in the fourth region R4 is at a minimum distance from the light emitting element 20 in the first direction is located at a position 100 μm or more away from the first virtual line L1 in the second direction. In the light emitting device 1, there is no first spacer 80A that passes through the first virtual line L1. In the light emitting device 1, there is no first joint 90A that passes through the first virtual line L1.

[0132] In a top view, at least a portion of the optical member 70 overlaps at least a portion of the reflective member 40. In a top view, at least a portion of the optical member 70 overlaps at least a portion of the light-emitting element 20. In a top view, at least a portion of the or each spacer 80 overlaps at least a portion of the optical member 70. In a top view, the or each spacer 80 may be included in an outer edge of the optical member 70.

[0133] The one or more first bonding portions 90A include a first bonding portion 90A at least a portion of which is disposed outside the optical member 70 in a top view. The one or more second bonding portions 90B include a second bonding portion 90B at least a portion of which is disposed outside the optical member 70 in a top view.

[0134] In top view, the width in the first direction of the optical member 70 is larger than the width in the first direction of the first upper surface 11A. In top view, the width in the second direction of the optical member 70 is smaller than the width in the second direction of the first upper surface 11A.

[0135] In top view, a part of the outer edge of the optical member 70 is located between the outer edge of the lid 14 and the outer edge of the base 11. By arranging the optical member 70 in this manner, the adhesive AD can be provided so that the joint 90 approaches the outer edge of the lid 14, making it easier to avoid interference of the joint 90 with light.

[0136] When viewed from above, side surface 71C of optical element 70, which is located in the first direction from light-emitting element 20, is located between side surface 14C of cover body 14, which is located in the first direction from light-emitting element 20, and outer side surface 11D of base 11, which is located in the first direction from light-emitting element 20.

[0137] In top view, the total length of the outer edge of the optical member 70 is shorter than the total length of the outer edge of the lid 14. In top view, the shape of the optical member 70 may be smaller than the shape of the lid 14. This allows the light emitting device 1 to be made lighter.

[0138] The or each spacer 80 is disposed at a position spaced apart in the fast axis direction of light on lower surface 71B from an illumination area of ​​a major portion of light incident on lower surface 71B of optical member 70. The or each first spacer 80A is disposed at a position spaced apart from this illumination area in the first direction, and the or each second spacer 80B is disposed at a position spaced apart from this illumination area in a direction opposite to the first direction.

[0139] Such a light emitting device 1 can be manufactured by a method including the steps of preparing a package 10 having a lid body 14 with an upper surface 14A, a light emitting element 20 arranged in the internal space of the package 10, and one or more spacers 80 each having an upper surface 81A and arranged on the upper surface 14A of the lid body 14, providing an adhesive AD so as to encompass the upper surface 81A of the one or each spacer 80 in a top view, and bonding the upper surface 14A of the lid body 14 and the lower surface 71B of the optical member 70 via the adhesive AD.

[0140] Moreover, each of these steps can be performed so that the above-mentioned positional relationships are satisfied among the multiple components included in the light emitting device 1.

[0141] For example, in the process of applying adhesive AD, as shown in FIG. 15, an apparatus for applying adhesive AD from a nozzle may be controlled to eject adhesive AD from the nozzle at a position where the center of the nozzle overlaps with the center of spacer 80 when viewed from above, and adhesive AD may be applied to upper surface 81A of spacer 80.

[0142] Also, for example, in the process of applying adhesive AD, as shown in FIG. 16 , an apparatus for applying adhesive AD from a nozzle may be controlled to eject adhesive AD from the nozzle at a position where the center of the nozzle is shifted from the center of spacer 80 when viewed from above, and adhesive AD may be applied to upper surface 81A of spacer 80. <Second embodiment> A light emitting module 901 according to the second embodiment will be described. Fig. 18 is a diagram for explaining an exemplary embodiment of the light emitting module 901. Fig. 18 is a schematic diagram of the light emitting module 901.

[0143] The light emitting module 901 includes one or more first light emitting devices, one or more second light emitting devices 2, and a light guide plate 101. The first light emitting device is the light emitting device 1 in the first embodiment. Hereinafter, it will be referred to as the first light emitting device 1. The second light emitting device 2 is a light emitting device different from the light emitting device 1. Specifically, unlike the light emitting device 1, the second light emitting device 2 does not include an optical member 70. Therefore, the spacer 80 and the joint 90 related to the joining of the optical member 70 are not required. The second light emitting device 2 can include other components included in the light emitting device 1.

[0144] 9 to 13 and 19 are diagrams for explaining an exemplary embodiment of the second light emitting device 2. FIG. 9 is a perspective view showing the internal structure of the package of the second light emitting device 2. FIG. 10 is a top view showing the internal structure of the package of the second light emitting device 2. FIG. 11 is a bottom view of the package 10. FIG. 12 is a top view showing the arrangement of the light emitting element 20 and the submount 30. FIG. 13 is a side view showing the arrangement of the light emitting element 20 and the submount 30. FIG. 19 is a perspective view of the second light emitting device 2.

[0145] (Light emitting module 901) The color of light emitted from the first light emitting device 1 is different from the color of light emitted from the second light emitting device 2. The peak emission wavelength of the light emitted from the first light emitting device 1 is different from the peak emission wavelength of the light emitted from the second light emitting device 2. The difference between the peak emission wavelength of the light emitted from the first light emitting device 1 and the peak emission wavelength of the light emitted from the second light emitting device 2 is at least 20 nm or more.

[0146] The polarization direction of light emitted from the light emitting element 20 (hereinafter referred to as the first light emitting element) included in the first light emitting device 1 differs from the polarization direction of light emitted from the light emitting element 20 (hereinafter referred to as the second light emitting element) included in the second light emitting device 2. The optical member 70 included in the first light emitting device 1 is a wave plate.

[0147] The one or more first light emitting devices 1 and the one or more second light emitting devices 2 include a first light emitting device 1 and a second light emitting device 2 that emit light in the same direction. Here, emitting light in the same direction means that the fast axis directions of the light are the same and the slow axis directions of the light are the same. Both the first light emitting device 1 and the second light emitting device 2 emit light from the upper surface 14A, whose fast axis direction is parallel to the first direction and whose slow axis direction is parallel to the second direction. The first light emitting device 1 and the second light emitting device 2 are arranged side by side in the first direction.

[0148] The polarization directions of the light emitted from the first light emitting device 1 and the light emitted from the second light emitting device 2 are aligned. Furthermore, the fast axis directions of the light emitted from the first light emitting device 1 and the light emitted from the second light emitting device 2 are aligned. The optical member 70 included in the first light emitting device 1 changes the polarization direction of the light emitted from the first light emitting element, causing the second light emitting device 2 to emit light with the same polarization direction as the light emitted from the first light emitting device 1. This makes it possible to align the polarization directions of the light emitted from the first light emitting device 1 and the second light emitting device 2.

[0149] The one or more second light emitting devices 2 may include two second light emitting devices emitting light of different colors. The one or more second light emitting devices 2 include two second light emitting devices 2 emitting light of different emission peak wavelengths. The difference in emission peak wavelengths between these two second light emitting devices 2 is at least 20 nm or more.

[0150] The one or more first light emitting devices 1 and the one or more second light emitting devices 2 include a light emitting device having a light emitting element 20 that emits red light, a light emitting device having a light emitting element 20 that emits green light, and a light emitting device having a light emitting element 20 that emits blue light. For example, the light emitting module 901 may include a first light emitting device 1 having a light emitting element 20 that emits red light, a second light emitting device 2 having a light emitting element 20 that emits green light, and a second light emitting device 2 having a light emitting element 20 that emits blue light.

[0151] In addition, the light emitting module 901 may include a second light emitting device 2 having a light emitting element 20 that emits red light, a first light emitting device 1 having a light emitting element 20 that emits green light, and a first light emitting device 1 having a light emitting element 20 that emits blue light.

[0152] Alternatively, the light emitting module 901 may be composed of a first light emitting device 1 having a light emitting element 20 that emits red light, a second light emitting device 2 having a light emitting element 20 that emits green light, and a second light emitting device 2 having a light emitting element 20 that emits blue light.

[0153] Light emitted from one or more first light emitting devices 1 and one or more second light emitting devices 2 enters the light guide plate 101. The light emitted from the first light emitting device 1 and the light emitted from the second light emitting device 2 enter the light guide plate 101 with their polarization directions aligned.

[0154] Although each embodiment of the present invention has been described above, the light emitting device and light emitting module according to the present invention are not strictly limited to the light emitting device and light emitting module of each embodiment. In other words, the present invention can be realized without being limited to the external shape and structure of the light emitting device and light emitting module disclosed in each embodiment. The present invention can be applied without necessarily having all the components. For example, if some of the components of the light emitting device disclosed in the embodiment are not described in the claims, the freedom of design by those skilled in the art, such as substitution, omission, deformation of shape, and change of material, is allowed for those components, and the invention described in the claims is specified to be applied.

[0155] Through the contents described so far in this specification, the following technical matters are disclosed. (Section 1) a package having a lid with a top surface; A light emitting device disposed in an internal space of the package; a first spacer disposed on an upper surface of the lid and having an upper surface; an optical member disposed on the lid and having an upper surface and a lower surface; a first bonding portion that bonds the lid body and the optical member; Equipped with the first joint portion is provided between an upper surface of the lid body and a lower surface of the optical member, and between an upper surface of the first spacer and a lower surface of the optical member. (Section 2) the package has a base having a first top surface and a second top surface that surrounds the first top surface in a top view and is located above the first top surface; 2. The light emitting device according to item 1, wherein the first spacer is disposed at a position overlapping the second upper surface in a top view. (Section 3) When viewed from above, the lid body is disposed inside the outer edge of the base body, 3. The light emitting device according to claim 1, wherein a part of an outer edge of the optical member is located between an outer edge of the lid body and an outer edge of the base body in a top view. (Section 4) When viewed from above, the outer edge shape of the optical member is rectangular, Item 4. The light emitting device according to any one of items 1 to 3, wherein a total length of an outer edge of the optical member is shorter than a total length of an outer edge of the lid. (Section 5) The light emitting element further includes a reflecting member arranged at a position away from the light emitting element in a first direction and configured to reflect light emitted from the light emitting element. Item 5. The light emitting device according to any one of items 1 to 4, wherein the first spacer is disposed at a position farther away in the first direction than the reflective member in a top view. (Section 6) a second spacer having an upper surface and disposed on the upper surface of the lid at a position spaced from the first spacer in a second direction opposite to the first direction in a top view; a second bonding portion that bonds the lid body and the optical member; Further equipped with the second joint portion is provided between an upper surface of the lid body and a lower surface of the optical member, and between an upper surface of the second spacer and a lower surface of the optical member, Item 6. The light emitting device according to item 5, wherein the second spacer is disposed at a position away from the light emitting element in the second direction in a top view. (Section 7) Item 7. The light emitting device according to item 5 or 6, wherein a width in the first direction of the first joint portion in a top view is more than 1 time and not more than 5 times a width in the first direction of the first spacer in a top view. (Section 8) the light emitting element is a semiconductor laser element that emits light having an elliptical far-field pattern, the optical member is a wave plate, Item 8. The light emitting device according to any one of items 1 to 7, wherein the first spacer is disposed at a position away from an irradiation area of ​​a main portion of the light incident on the lower surface of the wave plate in a fast axis direction of the light on the lower surface of the wave plate. (Section 9) Item 9. The light emitting device according to any one of items 1 to 8, wherein, in a top view, an outer edge of the first joint intersects with a virtual straight line passing through the first spacer at two locations, a first position and a second position, inside the outer edge of the lid body, and, in a top view, the centers of the first position and the second position overlap with the first spacer. (Section 10) A first light emitting device which is the light emitting device according to item 8; a second light-emitting device that does not include a wave plate; a light guide plate into which the light emitted from the first light emitting device and the light emitted from the second light emitting device are incident with their polarization directions aligned and with their fast axis directions aligned; Equipped with The first light emitting device and the second light emitting device are arranged side by side in the fast axis direction of the light emitting module. (Section 11) preparing a package having a lid having an upper surface, a light emitting element disposed in an internal space of the package, and a first spacer disposed on the upper surface of the lid and having an upper surface; providing an adhesive so as to encompass an upper surface of the first spacer in a top view; bonding an upper surface of the lid body and a lower surface of the wave plate via the adhesive; A method for manufacturing a light emitting device, comprising: [Industrial Applicability]

[0156] The light-emitting device and the light-emitting module described in the embodiment can be used as a backlight for a head-mounted display or other displays. In other words, the display field can be said to be one application form to which the present invention is applied. However, the present invention is not limited to this, and can be used in various applications such as a projector, lighting, exposure, and vehicle headlights. [Explanation of symbols]

[0157] 1, 2 Light emitting device 10 Packages 11 Base 11A 1st top surface 11B Bottom side 11C Second upper surface 11D Outer surface 11E Inner surface 11F Step portion 11F1 First step portion 11F2 Second step portion 11G Upper surface 11H Side surface 11M Base portion 11N Frame portion 12A Wiring portion 12A1 First wiring portion 12A2 Second wiring portion 13A Bonding pattern 14 Cover body 14A Upper surface 14B Lower surface 14C Side surface 20 Light emitting element 21A Upper surface 21B Lower surface 21C Side surface 22 Light emitting surface 30 Submount 31A Upper surface 31B Lower surface 31C Side surface 32A Substrate 32B Upper metal member 32C Lower metal member 33 Wiring layer 40 Reflective member 41A Lower surface 41B Light reflecting surface 50 Protective element 51A Upper surface 51B Lower surface 51C Side surface 60 Wiring 70 Optical member 71A Upper surface 71B Lower surface 71C Side surface 80 Spacer 80A First spacer 80B Second spacer 81A Upper surface 81B Lower surface 81C Side surface 90 Joint portion 90A 1st joint 90B 2nd joint 101 Light guide plate 901 Light Emitting Module

Claims

1. a package having a lid with a top surface; A light emitting device disposed in an internal space of the package; a first spacer disposed on an upper surface of the lid and having an upper surface; an optical member disposed on the lid and having an upper surface and a lower surface; a first bonding portion that bonds the cover body and the optical member; Equipped with The light emitting device, wherein the first joint portion is provided between an upper surface of the lid body and a lower surface of the optical member, and between an upper surface of the first spacer and a lower surface of the optical member.

2. the package has a base having a first top surface and a second top surface that surrounds the first top surface in a top view and is located higher than the first top surface; The light emitting device according to claim 1 , wherein the first spacer is disposed at a position overlapping the second upper surface in a top view.

3. the package has a base having a first top surface and a second top surface that surrounds the first top surface in a top view and is located higher than the first top surface; When viewed from above, the lid body is disposed inside the outer edge of the base body, The light emitting device according to claim 1 , wherein a part of an outer edge of the optical member is located between an outer edge of the lid body and an outer edge of the base body in a top view.

4. When viewed from above, the optical member has a rectangular outer shape; The light emitting device according to claim 1 , wherein a total length of an outer edge of the optical member is shorter than a total length of an outer edge of the lid when viewed from above.

5. A reflecting member is further provided, the reflecting member being disposed at a position spaced apart from the light emitting element in a first direction and configured to reflect the light emitted from the light emitting element. The light emitting device according to claim 1 , wherein the first spacer is disposed at a position farther away in the first direction than the reflecting member in a top view.

6. a second spacer having an upper surface and disposed on the upper surface of the lid at a position spaced from the first spacer in a direction opposite to the first direction in a top view; a second bonding portion that bonds the lid body and the optical member; Further equipped with the second joint portion is provided between an upper surface of the lid body and a lower surface of the optical member, and between an upper surface of the second spacer and a lower surface of the optical member, The light emitting device according to claim 5 , wherein the second spacer is disposed at a position farther away from the light emitting element in a direction opposite to the first direction in a top view.

7. The light emitting device according to claim 5 , wherein a width in the first direction of the first joint portion in a top view is more than 1 time and not more than 5 times a width in the first direction of the first spacer in a top view.

8. the light emitting element is a semiconductor laser element that emits light having an elliptical far-field pattern, the optical member is a wave plate, The light emitting device according to claim 5 , wherein the first spacer is disposed at a position away from an irradiation area of ​​a major portion of the light incident on the lower surface of the optical member in a fast axis direction of the light on the lower surface of the optical member.

9. 2. The light emitting device of claim 1, wherein, in a top view, an outer edge of the first joint intersects with a virtual straight line passing through the first spacer at two locations, a first position and a second position, inside the outer edge of the cover body, and, in a top view, the centers of the first position and the second position overlap with the first spacer.

10. A first light emitting device which is the light emitting device according to claim 8; a second light emitting device that does not include a wave plate; a light guide plate into which the light emitted from the first light emitting device and the light emitted from the second light emitting device are incident with their polarization directions aligned and with their fast axis directions aligned; Equipped with The first light emitting device and the second light emitting device are arranged side by side in the fast axis direction.

11. preparing a package having a lid having an upper surface, a light emitting element disposed in an internal space of the package, and a first spacer disposed on the upper surface of the lid and having an upper surface; providing an adhesive so as to encompass an upper surface of the first spacer in a top view; bonding an upper surface of the lid body and a lower surface of the optical member via the adhesive; A method for manufacturing a light emitting device, comprising:

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