Manufacturing apparatus of electronic component and manufacturing method of the electronic component

Abstract

To suppress both chips from being adhered due to a heating for losing an adhesive holding power of an adhesive sheet.SOLUTION: A heating mechanism 3 is arranged onto a back surface side of an adhesive sheet 20 adhered and held onto a front surface in a state where a plurality of chips 10 as a material of a plurality of electronic components are arranged so as to be contacted each other. A cooling mechanism 4 is arranged onto a front surface side of an adhesive sheet 20. The heating mechanism 3 can heat the adhesive sheet 20 to Ts or more, where Ts is a temperature that the adhesive sheet 20 loses an adhesive holding force. The cooling mechanism 4 can cool an average temperature of each of the plurality of chips 10 adhered and held to the adhesive sheet 20 so as to be less than Tg as a glass transmission temperature of a containing material of the plurality of chips 10.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to an apparatus for manufacturing electronic components and a method for manufacturing electronic components. [Background technology]

[0002] A prior art document disclosing a method for manufacturing cut pieces of a powder-molded plate is JP-B-6-79812 (Patent Document 1). In the method for manufacturing cut pieces of a powder-molded plate described in Patent Document 1, after a powder-molded plate adhered and fixed to an adhesive sheet is cut, the adhesive sheet is heated and foamed to eliminate the adhesive holding power, making it easier for the cut pieces to separate from the adhesive sheet. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 6-79812 Summary of the Invention [Problem to be solved by the invention]

[0004] Powder molded plates, obtained by molding a mixture of ceramic powder, binder, and solvent, become sticky when heated above the glass transition temperature of the materials contained therein, and the cut chips can stick together.

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to provide an electronic component manufacturing apparatus and an electronic component manufacturing method that can prevent chips from sticking together due to heating, which causes the adhesive sheet to lose its adhesive holding power. [Means for solving the problem]

[0006] The electronic component manufacturing apparatus according to the present invention includes a heating mechanism and a cooling mechanism. The heating mechanism is disposed on the back side of an adhesive sheet on whose surface a plurality of chips, which are materials for a plurality of electronic components, are adhesively held in contact with each other. The cooling mechanism is disposed on the front side of the adhesive sheet. The heating mechanism is capable of heating the adhesive sheet to a temperature Ts or higher, which is a temperature at which the adhesive sheet loses its adhesive holding power. The cooling mechanism is capable of cooling the average temperature of each of the plurality of chips adhesively held on the adhesive sheet to below Tg, which is the glass transition temperature of the material contained in the plurality of chips.

[0007] A method for manufacturing electronic components based on the present invention includes the steps of preparing an adhesive sheet having a plurality of chips, which are the material for a plurality of electronic components, arranged in contact with each other and adhesively held on its surface, and heating the adhesive sheet to a temperature Ts or higher, at which the adhesive sheet loses its adhesive holding power, while cooling the average temperature of each of the plurality of chips adhesively held on the adhesive sheet to below Tg, the glass transition temperature of the material contained in the plurality of chips. Effect of the Invention

[0008] According to the present invention, it is possible to prevent chips from sticking together due to heating, which causes the adhesive sheet to lose its adhesive holding power. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a flow diagram showing a method for manufacturing an electronic component according to an embodiment of the present invention. [Diagram 2] 1 is a cross-sectional view showing a configuration of an electronic component manufacturing apparatus according to an embodiment of the present invention. [Diagram 3] 1 is a cross-sectional view showing a state in which a support mechanism of an electronic component manufacturing apparatus according to an embodiment of the present invention is being brought close to an adhesive sheet on which a plurality of chips are adhesively held. [Figure 4] 4 is a cross-sectional view showing a state in which a support mechanism of an electronic component manufacturing apparatus according to one embodiment of the present invention is in contact with a rear surface of an adhesive sheet. FIG. [Diagram 5]1 is a cross-sectional view showing a state in which the adhesive sheet has been moved so that the chips adhesively held on the adhesive sheet come into contact with a cooling mechanism in an electronic component manufacturing apparatus according to one embodiment of the present invention. FIG. [Figure 6] 4 is a cross-sectional view showing a state in which a heating mechanism is in contact with a rear surface of an adhesive sheet in an electronic component manufacturing apparatus according to one embodiment of the present invention. FIG. [Figure 7] 1 is a cross-sectional view showing a state in which a plurality of chips are detached from an adhesive sheet and collected in an electronic component manufacturing apparatus according to one embodiment of the present invention. FIG. [Figure 8] FIG. 4 is a cross-sectional view showing a configuration of an electronic component manufacturing apparatus according to a first modified example of an embodiment of the present invention. [Figure 9] FIG. 11 is a cross-sectional view showing a configuration of an electronic component manufacturing apparatus according to a second modified example of an embodiment of the present invention. [Figure 10] FIG. 11 is a cross-sectional view showing the configuration of an electronic component manufacturing apparatus according to a third modified example of an embodiment of the present invention. [Figure 11] FIG. 11 is a cross-sectional view showing the configuration of an electronic component manufacturing apparatus according to a fourth modified example of an embodiment of the present invention. [Figure 12] FIG. 11 is a cross-sectional view showing a configuration of an electronic component manufacturing apparatus according to a fifth modified example of an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an electronic component manufacturing apparatus and an electronic component manufacturing method according to an embodiment of the present invention will be described with reference to the drawings. In the following description of the embodiment, the same or corresponding parts in the drawings are given the same reference numerals, and the description thereof will not be repeated.

[0011] Hereinafter, an electronic component manufacturing apparatus and an electronic component manufacturing method according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a flow diagram showing an electronic component manufacturing method according to an embodiment of the present invention. In the following description of the electronic component manufacturing method, a multilayer ceramic capacitor manufacturing method will be described. However, the electronic component is not limited to a multilayer ceramic capacitor, and may be a multilayer ceramic coil or the like, as long as it is an electronic component manufactured from a chip including a material containing a resin or binder having a glass transition temperature. Here, the glass transition temperature is used to mean a temperature at which adhesion changes, and is not limited to only a sudden change point, but also includes a temperature range at which adhesion changes gradually, and also includes a temperature range at which a change in physical properties occurs in which chips stick to each other and do not separate even when handled.

[0012] As shown in FIG. 1, when a multilayer ceramic capacitor is manufactured by the manufacturing method of an electronic component according to an embodiment of the present invention, a ceramic dielectric slurry is first prepared (step S1). Specifically, a ceramic dielectric powder, an additive powder, a binder resin, a dissolving liquid, and the like are dispersed and mixed, and thus a ceramic dielectric slurry is prepared. The ceramic dielectric powder is, for example, dielectric particles having a perovskite structure such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder is, for example, at least one of a Si compound, an Mg compound, an Mn compound, an Fe compound, a Cr compound, an Ni compound, and a Co compound. As the binder resin, a polyurethane resin, a urea resin, a melamine resin, an epoxy resin, a vinyl acetate resin, an acrylic resin, or an aqueous polymer such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) can be used. These may be used alone or in a mixture of two or more kinds. The ceramic dielectric slurry may be either a solvent-based or water-based. When the ceramic dielectric slurry is a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder, a dispersant, etc. with a dielectric raw material dissolved in water.

[0013] Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet shape on a carrier film using a die coater, gravure coater, or microgravure coater, and then dried to form a ceramic dielectric sheet. From the viewpoint of miniaturization and high capacity of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.2 μm or more and 10 μm or less.

[0014] Next, a mother sheet is formed (step S3). Specifically, a ceramic dielectric sheet is coated with a conductive paste so as to have a predetermined pattern, thereby forming a mother sheet on which a predetermined internal electrode pattern is provided. The conductive paste contains Ni powder, a solvent, a dispersant, a binder, and the like, and is prepared so as to have a constant viscosity. As the binder, polyvinyl butyral (PVB) or polyvinyl alcohol (PVA) or the like is used. As a method for coating the conductive paste, a screen printing method, an inkjet method, a gravure printing method, or the like can be used. From the viewpoint of miniaturization and high capacity of the multilayer ceramic capacitor, the thickness of the internal electrode pattern is preferably 0.2 μm or more and 10 μm or less. In addition to the mother sheet having the internal electrode pattern, a ceramic dielectric sheet that has not been subjected to the above step S3 is also prepared as the mother sheet.

[0015] Next, a plurality of mother sheets are stacked (step S4). Specifically, a predetermined number of mother sheets, each of which does not have an internal electrode pattern and is made of only ceramic dielectric sheets, are stacked to a thickness of, for example, 0.5 μm or more and 5 μm or less. A predetermined number of mother sheets, each of which has an internal electrode pattern, are stacked thereon. The number of mother sheets, each of which has an internal electrode pattern, is, for example, 5 sheets or more and 1500 sheets or less. A predetermined number of mother sheets, each of which does not have an internal electrode pattern and is made of only ceramic dielectric sheets, are stacked thereon to a thickness of, for example, 0.5 μm or more and 10 μm or less. This forms a mother sheet group.

[0016] Next, the group of mother sheets is pressed together to form a dielectric block (step S5). Specifically, the group of mother sheets is pressed in the stacking direction by a hydrostatic press or a rigid press to form a dielectric block. At this time, the ceramic dielectric sheets are pressed at a predetermined temperature to adhere to each other. In addition, by arranging and pressing a ceramic dielectric sheet of a certain thickness on the outermost layer in the stacking direction, it is possible to protect the dielectric sheet on which the internal electrode pattern is formed.

[0017] Next, the dielectric block is attached to the adhesive sheet (step S6). The adhesive sheet has an adhesive layer on its front surface and a base layer on its back surface. The adhesive sheet loses its adhesive holding power when heated to a temperature Ts or higher. The adhesive sheet may, for example, have an adhesive layer containing an acrylic acid ester, and the adhesive layer loses its adhesive holding power when the adhesive sheet is heated to a glass transition temperature (Ts) of the acrylic acid ester or higher. Alternatively, the adhesive sheet may, for example, have an adhesive layer containing a material that foams when heated, and the adhesive layer loses its adhesive holding power when the adhesive sheet is heated to a foaming temperature (Ts) of the material or higher, as a result of the surface area of ​​the adhesive layer increasing. For example, the thickness of the adhesive layer is 1 μm or more and 100 μm or less, and the thickness of the base layer is 30 μm or more and 300 μm or less.

[0018] Next, the dielectric block adhesively held on the adhesive sheet is divided to form chips (step S7). Specifically, the dielectric block is divided into a matrix shape by press-cutting, dicing, or laser cutting, and is divided into a plurality of individual chips. When dividing the dielectric block, the dielectric block may be divided in a state in which it is heated and softened. For example, the dielectric block may be cut with a press-cutting blade while being heated to a certain temperature that is higher than the glass transition temperature Tg of the binder contained in the dielectric block and lower than the temperature Ts at which the adhesive sheet loses its adhesive holding power. This reduces damage to the press-cutting blade. In step S7, an adhesive sheet is prepared on the surface of which a plurality of chips are adhesively held in a state in which they are arranged in contact with each other. Note that, after being cut with the press-cutting blade, the dielectric block is cooled to a temperature equal to or lower than the glass transition temperature Tg of the binder contained in the dielectric block, so that the divided adjacent chips are not stuck to each other and are held on the adhesive sheet in a state in which they are separated from each other. Note that, if the chips are stuck to each other, the chips may be separated from each other by chip breaking using a roller or a blade.

[0019] Next, the chip is detached from the adhesive sheet (step S8). Here, the configuration of an electronic component manufacturing apparatus according to one embodiment of the present invention, which is used when detaching the chip from the adhesive sheet, will be described. Fig. 2 is a cross-sectional view showing the configuration of an electronic component manufacturing apparatus according to one embodiment of the present invention.

[0020] 2, electronic component manufacturing apparatus 1 according to one embodiment of the present invention includes a heating mechanism 3 and a cooling mechanism 4. Electronic component manufacturing apparatus 1 further includes a support mechanism 2, a vibration mechanism 5, an air blower 6, and a rocking mechanism 7. However, electronic component manufacturing apparatus 1 does not necessarily have to include support mechanism 2, vibration mechanism 5, air blower 6, and rocking mechanism 7.

[0021] The heating mechanism 3 is disposed on the back side of the adhesive sheet. The heating mechanism 3 is capable of heating the adhesive sheet to a temperature equal to or higher than Ts, which is a temperature at which the adhesive sheet loses its adhesive holding power. The heating mechanism 3 is capable of heating the heating surface to a temperature within a range of 100°C to 140°C, for example.

[0022] The heating mechanism 3 is, for example, a heating plate with an electric heating wire embedded therein, or a heating plate with a plurality of holes into which cartridge heaters are inserted, or the heating mechanism 3 may be the heating surface of a Peltier element.

[0023] In this embodiment, the surface of the heating plate is flat. The material of the heating plate is not particularly limited and may be ceramic or metal. The area of ​​the surface of the heating plate is preferably larger than the area of ​​the dielectric block on the side in contact with the adhesive sheet. The surface of the heating plate may be subjected to a surface treatment such as embossing, slitting, or Teflon (registered trademark) processing in order to increase the contact area with the adhesive sheet and improve the contact with the adhesive sheet.

[0024] A temperature control unit is provided in the heating mechanism 3. The temperature control unit is electrically connected to a temperature sensor built into the heating mechanism 3, a contact-type temperature sensor that directly measures the surface temperature of the heating surface, or a non-contact-type temperature sensor such as an infrared thermograph, and feedback-controls the heating mechanism 3 so that the temperature measured by the temperature sensor approaches the set temperature.

[0025] The cooling mechanism 4 is disposed on the front side of the adhesive sheet. The cooling mechanism 4 can cool the average temperature of each of the chips adhesively held on the adhesive sheet to below Tg, which is the glass transition temperature of the material contained in the chips. The cooling mechanism 4 can cool the cooling surface or cold air to a temperature in the range of 5°C to 60°C, for example.

[0026] The cooling mechanism 4 is, for example, a water-cooled, air-cooled, oil-cooled or refrigerated cooling plate, or a blower that blows air for cooling, or may be the cooling surface of a Peltier element.

[0027] In this embodiment, the surface of the cooling plate is flat. The material of the cooling plate is not particularly limited and may be ceramics or metal. The area of ​​the surface of the cooling plate is preferably larger than the area of ​​the dielectric block facing the cooling plate. The surface of the cooling plate may be subjected to surface treatment such as embossing, slitting, or Teflon coating in order to increase the contact area with the dielectric block and improve the contact with the dielectric block.

[0028] The cooling mechanism 4 is provided with a temperature control unit. The temperature control unit is electrically connected to a temperature sensor built into the cooling mechanism 4, a contact-type temperature sensor that directly measures the surface temperature of the cooling surface or the temperature of the cold air, or a non-contact-type temperature sensor such as an infrared thermograph, and feedback-controls the cooling mechanism 4 so that the temperature measured by the temperature sensor approaches the set temperature.

[0029] In order to efficiently cool the chip, the cooling mechanism 4 is preferably disposed below the heating mechanism 3. In this case, it is possible to make it difficult for heat from the heating mechanism 3 to be transmitted to the cooling mechanism 4.

[0030] The support mechanism 2 supports the adhesive sheet. The support mechanism 2 supports the back side of the adhesive sheet by any of a vacuum suction method, an electrostatic adsorption method, an adhesive method, and a mechanical method. In this embodiment, the support mechanism 2 is disposed around the heating mechanism 3 and is provided so as to be movable in the vertical direction. Note that, if the support mechanism 2 is not provided, the adhesive sheet adhesively holding the multiple chips is supported by being sandwiched between the heating mechanism 3 and the cooling mechanism 4.

[0031] The vibration mechanism 5 is in contact with the heating mechanism 3 and vibrates the heating mechanism 3. The vibration mechanism 5 has a piezoelectric element capable of oscillation. In this embodiment, the vibration mechanism 5 is disposed on the heating mechanism 3.

[0032] The air blower 6 can blow air from the side into the region between the heating mechanism 3 and the cooling mechanism 4. The air blower 6 is disposed upstream in the sliding direction when the chips are slid down for collection, as described later.

[0033] The rocking mechanism 7 is configured to be able to tilt at least one of the heating mechanism 3 and the cooling mechanism 4, whichever is located lower. In this embodiment, the rocking mechanism 7 is provided in the cooling mechanism 4. The rocking mechanism 7 is configured to be able to rock the cooling mechanism 4 between a horizontal position and an inclined position around a rotation axis. The rocking mechanism 7 may be provided in each of the heating mechanism 3 and the cooling mechanism 4, or, when the heating mechanism 3 is disposed lower than the cooling mechanism 4, the rocking mechanism 7 may be provided in the heating mechanism 3.

[0034] Here, the operation of the electronic component manufacturing apparatus 1 will be described. FIG. 3 is a cross-sectional view showing a state in which the support mechanism of the electronic component manufacturing apparatus according to one embodiment of the present invention is brought close to the adhesive sheet on which a plurality of chips are adhesively held. As shown in FIG. 3, in a state in which a plurality of chips 10 adhesively held on the surface of the adhesive sheet 20 are placed on the table 9, the heating mechanism 3, the support mechanism 2, the vibration mechanism 5, and the table 9 move relatively so that the support mechanism 2 approaches the back surface of the adhesive sheet 20. That is, the heating mechanism 3, the support mechanism 2, and the vibration mechanism 5 may be lowered, or the table 9 may be raised. At this time, the lower end of the support mechanism 2 is located below the heating surface of the heating mechanism 3. It is preferable that the support mechanism 2 supports an area of ​​the adhesive sheet 20 outside the area in which the plurality of chips 10 are adhesively held.

[0035] FIG. 4 is a cross-sectional view showing a state where the support mechanism of the electronic component manufacturing apparatus according to one embodiment of the present invention is in contact with the back surface of the adhesive sheet. As shown in FIG. 4, the lower end of the support mechanism 2 is in contact with the back surface of the adhesive sheet 20 to support the adhesive sheet 20. When the support mechanism 2 supports the adhesive sheet 20, the heating mechanism 3, the support mechanism 2, and the vibration mechanism 5 are relatively separated from the table 9, so that the adhesive sheet 20 is lifted up from the table 9 and moved. That is, the heating mechanism 3, the support mechanism 2, and the vibration mechanism 5 may rise, and the table 9 may fall. At this time, since the heating mechanism 3 is not in contact with the adhesive sheet 20, heating by the heating mechanism 3 may or may not be started. Note that, when the support mechanism 2 supports the adhesive sheet 20 with the lower end of the support mechanism 2 positioned flush with the heating surface of the heating mechanism 3, heating by the heating mechanism 3 has not been started at the timing of this support.

[0036] Fig. 5 is a cross-sectional view showing a state in which an adhesive sheet is moved so that a chip adhesively held on the adhesive sheet comes into contact with a cooling mechanism in an electronic component manufacturing apparatus according to one embodiment of the present invention. As shown in Fig. 5, the heating mechanism 3, the support mechanism 2, the vibration mechanism 5, and the cooling mechanism 4 move relatively to each other so that a chip 10 adhesively held on the adhesive sheet 20 comes into contact with a cooling surface of the cooling mechanism 4. That is, the heating mechanism 3, the support mechanism 2, and the vibration mechanism 5 may be lowered, and the cooling mechanism 4 may be raised.

[0037] Fig. 6 is a cross-sectional view showing a state where the heating mechanism is in contact with the back surface of the adhesive sheet in an electronic component manufacturing apparatus according to one embodiment of the present invention. As shown in Fig. 6, the heating mechanism 3 and the vibration mechanism 5 and the cooling mechanism 4 move relatively to each other so that the back surface of the adhesive sheet 20 comes into contact with the heating surface of the heating mechanism 3. That is, the heating mechanism 3 and the vibration mechanism 5 may be lowered, and the cooling mechanism 4 and the support mechanism 2 may be raised.

[0038] As a result, the heating mechanism 3 is placed on the back side of the adhesive sheet 20, on whose surface a plurality of chips 10, which are materials for a plurality of electronic components, are adhesively held with the chips 10 arranged in contact with each other. The plurality of chips 10 are held on the adhesive sheet 20 with the cut surfaces exposed by cutting the dielectric block facing and in contact with each other. The heating mechanism 3 is capable of heating the adhesive sheet 20 supported by the support mechanism 2 to a temperature equal to or higher than Ts, which is the temperature at which the adhesive sheet 20 loses its adhesive holding power.

[0039] The cooling mechanism 4 cools the chips 10 while in contact with each of the chips 10 adhesively held on the adhesive sheet 20. The cooling mechanism 4 is capable of cooling the average temperature of each of the chips 10 adhesively held on the adhesive sheet 20 to below Tg, which is the glass transition temperature of the material contained in the chips 10. Here, the average temperature of each of the chips 10 is the average temperature of both sides in the stacking direction of each chip 10. When the chip 10 contains multiple types of binders, the glass transition temperature Tg of the material contained in the chip 10 is a weighted average value calculated by multiplying the weight percentage of each binder in the total binder and the glass transition temperature Tg.

[0040] In step S8 shown in Figure 1, the heating mechanism 3 heats the adhesive sheet 20 to a temperature Ts or higher, which is the temperature at which the adhesive sheet 20 loses its adhesive holding power, while the cooling mechanism 4 cools the average temperature of each of the multiple chips 10 adhesively held to the adhesive sheet 20 to below Tg, which is the glass transition temperature of the material contained in the multiple chips 10.

[0041] Let Th be the temperature on the heating surface of the heating mechanism 3, Tc be the temperature on the cooling surface of the cooling mechanism 4, Ts be the temperature at which the adhesive sheet 20 loses its adhesive holding force, and Tg be the glass transition temperature of the material contained in the plurality of chips. Then, the relationship Tc < Tg < Ts < Th is satisfied. Thereby, while heating the adhesive sheet 20 to cause it to lose its adhesive holding force, it is possible to suppress the binder from melting out from the cut surfaces of the plurality of heated chips 10. Therefore, it is possible to suppress the adjacent chips 10 from sticking to each other while detaching the plurality of chips 10 from the adhesive sheet 20 (step S8 shown in FIG. 1).

[0042] As described in the experimental examples to be described later, the larger the difference between the value of (Th + Tc) / 2 and the temperature Tg, the more effectively the adhesion between the adjacent chips 10 can be suppressed.

[0043] FIG. 7 is a cross-sectional view showing a state in which a plurality of chips are detached and recovered from an adhesive sheet in a manufacturing apparatus for an electronic component according to an embodiment of the present invention. As shown in FIG. 7, the heating mechanism 3, the support mechanism 2, and the vibration mechanism 5 and the cooling mechanism 4 move relative to each other so that the heating mechanism 3 and the cooling mechanism 4 are separated. That is, the heating mechanism 3, the support mechanism 2, and the vibration mechanism 5 may move upward, or the cooling mechanism 4 may move downward. The chips 10 that have been detached from the adhesive sheet 20 are supported by the cooling mechanism 4.

[0044] At this time, the vibration mechanism 5 may be operated to vibrate the heating mechanism 3 in contact with the adhesive sheet 20, thereby detaching the plurality of chips 10 from the adhesive sheet 20 that has lost its adhesive holding force. Thereby, it is possible to facilitate the detachment of the plurality of chips 10 from the adhesive sheet 20.

[0045] Alternatively, the rocking mechanism 7 may be operated to tilt the cooling mechanism 4 as shown in Fig. 7, thereby allowing the chips 10 detached from the adhesive sheet 20 to slide down and be thrown into the box 10 for collection. At this time, the rocking mechanism 7 may be repeatedly operated as shown by arrow A in Fig. 7 to vibrate the cooling mechanism 4, thereby promoting the sliding down of the chips 10. Note that Fig. 7 shows a state in which the heating mechanism 3 is also tilted, similar to the cooling mechanism 4, but if the distance between the cooling mechanism 4 and the heating mechanism 3 is large, only the cooling mechanism 4 may be tilted.

[0046] Furthermore, the air blower 6 may be operated to blow air from the side into the region between the heating mechanism 3 and the cooling mechanism 4, thereby blowing off the multiple chips 10 and collecting them in the box 10.

[0047] 1, the chip is then fired (step S11). Specifically, the chip is heated, and the dielectric material and conductive material contained in the chip are fired to form a laminate. The firing temperature is appropriately set according to the dielectric material and conductive material.

[0048] Next, external electrodes are formed (step S12). For example, a conductive paste applied to both end faces of the laminate is fired to form a base electrode layer, and the base electrode layer is Ni-plated and Sn-plated in this order to form a plating layer, thereby forming external electrodes on the outer surfaces of the laminate.

[0049] Through the above-mentioned series of steps, a multilayer ceramic capacitor can be manufactured.

[0050] (Experimental Example) Hereinafter, a description will be given of Experimental Example 1 in which the effect of the cooling mechanism in suppressing sticking between chips will be described.

[0051] First, a ceramic dielectric sheet containing polyvinyl butyral (PVB) as a binder was prepared, and a mother sheet having a predetermined internal electrode pattern was formed on the ceramic dielectric sheet. 100 to 600 mother sheets having internal electrode patterns were laminated to form eight types of dielectric blocks having thickness dimensions (T dimensions) in the lamination direction of 0.11 mm, 0.25 mm, 0.33 mm, 0.42 mm, 0.74 mm, 1.25 mm, 2.00 mm, and 2.76 mm. Each of the eight types of dielectric blocks had a lengthwise dimension (L dimension) and a widthwise dimension (W dimension) of 200 mm.

[0052] Next, the dielectric block was attached to an adhesive sheet having a foaming temperature of 110°C. The dielectric block attached to the adhesive sheet was heated to 90°C and cut. The L dimensions of the chips formed by cutting the eight types of dielectric blocks were 0.25mm, 0.4mm, 0.6mm, 1.0mm, 1.6mm, 2.0mm, 3.2mm, and 3.2mm in the above order described for the T dimensions. That is, eight types of chips were formed with nominal sizes of 0201 size, 0402 size, 0603 size, 1005 size, 1608 size, 2012 size, 3216 size, and 3225 size.

[0053] Next, the chip was detached from the adhesive sheet. Specifically, a cartridge heater with a rated capacity of 50 W and a heating plate with a built-in temperature sensor were used as the heating mechanism 3. The heating mechanism 3 was set so that the temperature of the heating surface was 120°C.

[0054] As a comparative example, when chips were detached from the adhesive sheet without using the cooling mechanism 4, the adhesive sheet was heated to 120° C. by contacting the heating surface with the back surface of the adhesive sheet adhesively holding multiple chips. The chips detached from the adhesive sheet that had lost its adhesive holding power due to heating were collected.

[0055] In the embodiment, when the chips were detached from the adhesive sheet using the cooling mechanism 4, the heating surface was brought into contact with the back surface of the adhesive sheet holding the chips adhesively, and the adhesive sheet was heated to 120°C while the cooling surface of the cooling mechanism 4, which had a temperature of 10°C, was held in contact with each of the chips for 30 seconds. The cooling mechanism 4 was then tilted to collect the chips that had been detached from the adhesive sheet, which had been heated and lost its adhesive holding power. The cooling surface of a Peltier element with a maximum heat absorption of 140W and a maximum current value of 7.5A was used as the cooling mechanism 4.

[0056] In each of the comparative examples and examples, the total weight of the collected chips was measured. Then, the collected chips were passed through a sieve with an opening area slightly larger than the T and W dimensions of each size of chip to separate the stuck chips, and the total weight of the unstuck chips that passed through the sieve was measured.

[0057] Here, the sticking rate (%) was defined as the total weight of the stuck chips / the total weight of the collected chips×100, and the sticking rate was calculated for each chip size for the comparative example and the example. In addition, the sticking rate in the example was defined as the index showing the sticking suppression effect in the example, i.e., (sticking rate in the example-sticking rate in the comparative example) / sticking rate in the comparative example×100=sticking suppression rate (%).

[0058] [Table 1]

[0059] Table 1 summarizes the sticking rate and sticking suppression rate calculated for each chip size for the comparative example and the embodiment. As shown in Table 1, in the 0402 size to 3216 size, a sticking suppression rate of -7% or more was observed. In the 0201 size, the T dimension of the chip is small, so the average temperature of the heating surface temperature and the cooling surface temperature becomes the average temperature of the chip, and a temperature gradient in the stacking direction in the chip is not formed, and the average temperature of the chip becomes equal to the temperature of the heating surface, so the sticking suppression rate was low. On the other hand, in the 3225 size, the T dimension of the chip is large, so the cooling effect from the cooling surface does not reach the center in the stacking direction of the chip, so the sticking suppression rate was low. In other words, it was confirmed that in the 0402 size to 3216 size, where the average temperature of the chip, which is the temperature of the center in the stacking direction of the chip, could be reduced by cooling from the cooling surface, a sticking suppression rate of -7% or more could be secured.

[0060] Next, experimental example 2 will be described, which examines the relationship between the average temperature of the chip and the glass transition temperature Tg of the binder, and the sticking suppression rate. A 1608 size chip containing a binder having a glass transition temperature Tg shown in Table 2 below was prepared, and the chip was detached from the adhesive sheet using cooling mechanism 4 in the same manner as in the embodiment of experimental example 1, and the sticking suppression rate was calculated. The temperatures of the heating surface and the cooling surface were set to the temperatures shown in Table 2. The temperature of the heating surface was set to the temperature at which the adhesive sheet lost its adhesive holding power.

[0061] [Table 2]

[0062] As shown in Table 2, it was confirmed that the sticking suppression rate can be secured by -7% or more by lowering the average chip temperature, which is the temperature at the center in the stacking direction inside the chip, below the glass transition temperature Tg of the binder. It was confirmed that the sticking suppression rate tends to be improved as the average chip temperature becomes lower relative to the glass transition temperature Tg of the binder.

[0063] From the above experimental examples, it was confirmed that by heating the adhesive sheet 20 to a temperature Ts or higher, which is the temperature at which the adhesive sheet 20 loses its adhesive holding power, and then cooling the average temperature of each of the multiple chips 10 adhesively held to the adhesive sheet 20 to below Tg, which is the glass transition temperature of the material contained in the multiple chips 10, it is possible to prevent the chips 10 from sticking together due to heating that causes the adhesive sheet 20 to lose its adhesive holding power.

[0064] In other words, the heating mechanism 3 is capable of heating the adhesive sheet 20 to a temperature Ts or higher, which is the temperature at which the adhesive sheet 20 loses its adhesive holding power, and the cooling mechanism 4 is capable of cooling the average temperature of each of the multiple chips 10 adhesively held to the adhesive sheet 20 to below Tg, which is the glass transition temperature of the material contained in the multiple chips 10, thereby preventing the chips 10 from sticking together due to heating that causes the adhesive sheet 20 to lose its adhesive holding power.

[0065] In the electronic component manufacturing apparatus according to this embodiment, cooling mechanism 4 cools the multiple chips 10 while in contact with each of the multiple chips 10 adhesively held on adhesive sheet 20. This makes it possible to cool the multiple chips evenly.

[0066] The electronic component manufacturing apparatus according to this embodiment further includes a support mechanism 2 that supports an adhesive sheet 20. A heating mechanism 3 is capable of heating the adhesive sheet 20 supported by the support mechanism 2 to a temperature equal to or higher than Ts, which is a temperature at which the adhesive sheet 20 loses its adhesive holding power. This allows the adhesive sheet 20, on which a plurality of chips 10 are adhesively held, to be sandwiched with good positional accuracy between the heating mechanism 3 and the cooling mechanism 4. As a result, the variation in the sticking suppression rate can be reduced, and sticking between the chips 10 can be stably suppressed.

[0067] The electronic component manufacturing apparatus according to this embodiment further includes a vibration mechanism 5 that vibrates the heating mechanism 3 in contact with the adhesive sheet 20, thereby detaching the multiple chips 10 from the adhesive sheet 20 that has lost its adhesive holding power. This allows the multiple chips 10 to be reliably detached from the adhesive sheet 20 that has lost its adhesive holding power.

[0068] The electronic component manufacturing apparatus according to this embodiment further includes an air blower 6 that blows air from the side into the region between the heating mechanism 3 and the cooling mechanism 4. This makes it possible to easily recover a plurality of chips 10 that have detached from adhesive sheet 20 that has lost its adhesive retaining power.

[0069] The electronic component manufacturing apparatus according to this embodiment further includes a swinging mechanism that tilts at least the lower one of the heating mechanism 3 and the cooling mechanism 4 to slide off the multiple chips 10 that have detached from the adhesive sheet 20 that has lost its adhesive holding power. This makes it possible to easily collect the multiple chips 10 that have detached from the adhesive sheet 20 that has lost its adhesive holding power, and also makes it possible to prevent the chips 10 from sticking together after being detached from the adhesive sheet 20.

[0070] In the electronic component manufacturing apparatus according to this embodiment, the heating mechanism 3 may be the heating surface of a Peltier element, and the cooling mechanism 4 may be the cooling surface of a Peltier element. In this case, the heating mechanism 3 and the cooling mechanism 4 can be easily configured.

[0071] In the following, modified examples of the electronic component manufacturing apparatus according to one embodiment of the present invention will be described. In the following description of the modified example of the electronic component manufacturing apparatus, differences from the electronic component manufacturing apparatus 1 according to one embodiment of the present invention will be described, and the same reference numerals will be used to designate the same components as those in the electronic component manufacturing apparatus 1 according to one embodiment of the present invention, and the description thereof will not be repeated.

[0072] Fig. 8 is a cross-sectional view showing the configuration of an electronic component manufacturing apparatus according to a first modified example of one embodiment of the present invention. As shown in Fig. 8, an electronic component manufacturing apparatus 1a according to the first modified example is provided with a cooling mechanism 4a. The cooling mechanism 4a blows air onto the multiple chips 10 to cool the multiple chips 10. This makes it possible to detach the multiple chips 10 from the adhesive sheet 20 that has lost its adhesive holding power while preventing the chips 10 from sticking to each other, and also makes it possible to prevent the chips 10 from sticking to each other after being detached from the adhesive sheet 20.

[0073] Fig. 9 is a cross-sectional view showing the configuration of an electronic component manufacturing apparatus according to a second modified example of one embodiment of the present invention. As shown in Fig. 9, in an electronic component manufacturing apparatus 1b according to the second modified example, a cooling mechanism 4 is located above a heating mechanism 3. In the second modified example, since a plurality of chips 10 detached from an adhesive sheet 20 that has lost its adhesive holding power are located on the heating mechanism 3, by operating a vibration mechanism 5 with the heating mechanism 3 tilted, the plurality of chips 10 detached from an adhesive sheet 20 that has lost its adhesive holding power can be easily collected, and the chips 10 can be prevented from sticking together after being detached from the adhesive sheet 20.

[0074] Fig. 10 is a cross-sectional view showing the configuration of an electronic component manufacturing apparatus according to a third modified example of an embodiment of the present invention. As shown in Fig. 10, an electronic component manufacturing apparatus 1c according to the third modified example includes a heating mechanism 3c having a cylindrical heating surface, a cooling mechanism 4c having a cylindrical cooling surface facing the heating surface, and a support mechanism 2c located on the heating surface of the heating mechanism 3c. That is, in the third modified example, the surface of the heating mechanism 3c facing the adhesive sheet 20 is a curved surface. This allows the proximity distance between the chips 10 adhesively held on the adhesive sheet 20 to be widened, and therefore the chips 10 can be detached from the adhesive sheet 20 that has lost its adhesive holding power while preventing them from sticking to each other.

[0075] Fig. 11 is a cross-sectional view showing the configuration of an electronic component manufacturing apparatus according to a fourth modified example of one embodiment of the present invention. As shown in Fig. 11, in an electronic component manufacturing apparatus 1d according to the fourth modified example, the cooling mechanism is the cooling surface 44 of the Peltier element 40. A fan 50 is provided on the heating surface 43 side of the Peltier element 40. This allows the heat of the heating surface 43 to be efficiently discharged, and the cooling surface 44 can effectively cool the multiple chips 10. The unevenness formed on the heating surface 43 facing the fan 50 also allows the heat of the heating surface 43 to be efficiently discharged to the outside air.

[0076] Fig. 12 is a cross-sectional view showing the configuration of an electronic component manufacturing apparatus according to a fifth modified example of the embodiment of the present invention. As shown in Fig. 12, in the electronic component manufacturing apparatus 1e according to the fifth modified example, a plurality of heating mechanisms and cooling mechanisms are arranged alternately. Specifically, a plurality of Peltier elements 40 are stacked, and the cooling surface 44 and the heating surface 43 are arranged alternately so that the cooling surface 44 of the Peltier element 40 located at the lower position faces the heating surface 43 of the Peltier element 40 located at the upper position. This can improve the productivity of electronic components per occupied area of ​​the electronic component manufacturing apparatus 1e.

[0077] (Additional Note) It will be understood by those skilled in the art that the above-described exemplary embodiment is a specific example of the following aspects, and the support mechanism 2, the vibration mechanism 5, the air blower 6, and the swing mechanism 7 may be combined in various modified forms.

[0078] <1> a heating mechanism disposed on the rear surface side of an adhesive sheet on which a plurality of chips, which are materials for a plurality of electronic components, are adhesively held in contact with each other and on a surface thereof; A cooling mechanism is provided on the front surface side of the pressure-sensitive adhesive sheet, the heating mechanism is capable of heating the adhesive sheet to a temperature Ts or higher, the temperature at which the adhesive sheet loses its adhesive holding power; An electronic component manufacturing apparatus, wherein the cooling mechanism is capable of cooling the average temperature of each of the plurality of chips adhesively held on the adhesive sheet to below Tg, which is the glass transition temperature of the material contained in the plurality of chips.

[0079] <2> the cooling mechanism cools the plurality of chips while being in contact with each of the plurality of chips adhesively held on the adhesive sheet; <1> An apparatus for manufacturing electronic components according to claim 1.

[0080] <3> The cooling mechanism cools the plurality of chips by blowing air onto the plurality of chips. <1> An apparatus for manufacturing electronic components according to claim 1.

[0081] <4> Further comprising a support mechanism for supporting the pressure-sensitive adhesive sheet, The heating mechanism is capable of heating the adhesive sheet supported by the support mechanism to a temperature equal to or higher than Ts, which is a temperature at which the adhesive sheet loses its adhesive retaining power. <1> from <3> 13. An apparatus for manufacturing electronic components according to any one of claims 1 to 12.

[0082] <5> The adhesive sheet further includes a vibration mechanism that vibrates the heating mechanism in contact with the adhesive sheet to detach the chips from the adhesive sheet that has lost its adhesive holding force. <1> from <4> 13. An apparatus for manufacturing electronic components according to any one of claims 1 to 12.

[0083] <6> The heating mechanism further includes an air blower that blows air from a side into a region between the heating mechanism and the cooling mechanism. <1> from <5> 13. An apparatus for manufacturing electronic components according to any one of claims 1 to 12.

[0084] <7> a swinging mechanism for tilting at least one of the heating mechanism and the cooling mechanism, which is located lower, to slide off the plurality of chips that have detached from the adhesive sheet that has lost its adhesive holding power; <1> from <6> 13. An apparatus for manufacturing electronic components according to any one of claims 1 to 12.

[0085] <8> A plurality of the heating mechanisms and the cooling mechanisms are arranged alternately. <1> from <7> 13. An apparatus for manufacturing electronic components according to any one of claims 1 to 12.

[0086] <9> the heating mechanism is a heating surface of a Peltier element, The cooling mechanism is a cooling surface of the Peltier element. <1> from <8> 13. An apparatus for manufacturing electronic components according to any one of claims 1 to 12.

[0087] <10> The surface of the heating mechanism facing the adhesive sheet is a curved surface. <1> from <9> 13. An apparatus for manufacturing electronic components according to any one of claims 1 to 12.

[0088] <11> preparing an adhesive sheet having a surface on which a plurality of chips, which are materials for a plurality of electronic components, are adhesively held in contact with each other; and heating the adhesive sheet to a temperature Ts or higher, at which the adhesive sheet loses its adhesive holding power, while cooling the average temperature of each of the plurality of chips adhesively held to the adhesive sheet to below Tg, which is the glass transition temperature of the material contained in the plurality of chips.

[0089] In the above description of the embodiments, configurations that can be combined may be combined with each other.

[0090] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0091] 1, 1a, 1b, 1c, 1d, 1e manufacturing equipment, 2, 2c support mechanism, 3, 3c heating mechanism, 4, 4a, 4c cooling mechanism, 5 vibration mechanism, 6 air blower, 7 swing mechanism, 9 table, 10 chip, 20 adhesive sheet, 40 Peltier element, 43 heating surface, 44 cooling surface, 50 fan.

Claims

1. a heating mechanism disposed on the rear surface side of an adhesive sheet on which a plurality of chips, which are materials for a plurality of electronic components, are adhesively held in contact with each other and on a surface thereof; A cooling mechanism is provided on the front surface side of the pressure-sensitive adhesive sheet, the heating mechanism is capable of heating the adhesive sheet to a temperature Ts or higher, the temperature at which the adhesive sheet loses its adhesive holding power; An electronic component manufacturing apparatus, wherein the cooling mechanism is capable of cooling the average temperature of each of the plurality of chips adhesively held on the adhesive sheet to below Tg, which is the glass transition temperature of a material contained in the plurality of chips.

2. 2 . The electronic component manufacturing apparatus according to claim 1 , wherein the cooling mechanism cools the plurality of chips while being in contact with each of the plurality of chips adhesively held on the adhesive sheet.

3. 2. The electronic component manufacturing apparatus according to claim 1, wherein said cooling mechanism cools said plurality of chips by blowing air onto said plurality of chips.

4. Further comprising a support mechanism for supporting the pressure-sensitive adhesive sheet, The electronic component manufacturing apparatus according to claim 1 , wherein the heating mechanism is capable of heating the adhesive sheet supported by the support mechanism to a temperature equal to or higher than Ts, which is a temperature at which the adhesive sheet loses its adhesive retention force.

5. The electronic component manufacturing apparatus according to claim 1 , further comprising a vibration mechanism that vibrates the heating mechanism in contact with the adhesive sheet, thereby detaching the plurality of chips from the adhesive sheet that has lost its adhesive holding force.

6. 2. The electronic component manufacturing apparatus according to claim 1, further comprising an air blower configured to blow air from a side into a region between said heating mechanism and said cooling mechanism.

7. 2. The electronic component manufacturing apparatus of claim 1, further comprising a rocking mechanism that tilts at least one of the heating mechanism and the cooling mechanism, which is located lower, to slide off the plurality of chips that have detached from the adhesive sheet that has lost its adhesive retention force.

8. The electronic component manufacturing apparatus according to claim 1 , wherein a plurality of the heating mechanisms and the cooling mechanisms are arranged alternately.

9. the heating mechanism is a heating surface of a Peltier element, The electronic component manufacturing apparatus according to claim 1 , wherein the cooling mechanism is a cooling surface of the Peltier element.

10. The electronic component manufacturing apparatus according to claim 1 , wherein the surface of the heating mechanism facing the adhesive sheet is a curved surface.

11. preparing an adhesive sheet having a surface on which a plurality of chips, which are materials for a plurality of electronic components, are adhesively held in contact with each other; a step of heating the adhesive sheet to a temperature Ts or higher, at which the adhesive sheet loses its adhesive holding power, while cooling the average temperature of each of the plurality of chips adhesively held to the adhesive sheet to below Tg, which is the glass transition temperature of the material contained in the plurality of chips.

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