Direction alignment device

Abstract

To provide a direction alignment device capable of aligning directions of laminates in such a manner that a lamination direction of each laminate becomes vertical to an XY planes of a jig.SOLUTION: A direction alignment device 100 comprises: a retractable plate 110 which defines a plane including an X direction and a Y direction as a principal surface 112 and includes recesses 111 open in the principal surface 112; and a magnet 120 in which magnetic poles are disposed in a Z direction that is vertical to the X direction and the Y direction. Therein: the magnet 120 is moved to align, by a magnetic force of the magnet 120, directions of laminates 10 which are accommodated respectively in the recesses 111 of the retractable plate 110 and in each of which internal electrode layer are embedded; and the axis Z toward which polarity is directed inside of the magnet 120 is deviated from an axis in a lamination direction T of the laminate 10.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a direction alignment device. [Background technology]

[0002] Patent Document 1 describes a technology for aligning the lamination direction of a laminate in which internal electrodes are stacked. This technology involves inserting the laminate into a jig and then changing its orientation with a magnet so that the side faces face the Z-axis direction in order to perform some kind of processing on the faces perpendicular to the lamination direction, mainly the side faces. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-175902 A Summary of the Invention [Problem to be solved by the invention]

[0004] The technology of Patent Document 1 can align the orientation of the laminate so that the stacking direction of the laminate is the same as the XY plane of the jig. However, it is not possible to align the orientation of the laminate so that the stacking direction of the laminate is perpendicular to the XY plane of the jig (the same as the Z-axis direction of the jig).

[0005] The present invention has been made to solve the above problems, and aims to provide a direction alignment device that can align the orientation of a laminate so that the stacking direction of the laminate is perpendicular to the XY plane of the jig. [Means for solving the problem]

[0006] The direction alignment device of the present invention comprises a transfer plate having a main surface that is a plane including the X direction and the Y direction and a recess that opens onto the main surface, and a magnet having magnetic poles arranged in the Z direction perpendicular to the X direction and the Y direction, and is characterized in that the magnet is moved and the orientation of a laminate having internal electrode layers embedded therein and contained in the recess of the transfer plate is aligned by the magnetic force of the magnet, so that the axis along which the polarity faces within the magnet is misaligned with the axis of the stacking direction of the laminate. Effect of the Invention

[0007] According to the present invention, it is possible to provide a direction aligning device that can align the orientation of a laminate so that the stacking direction of the laminate is perpendicular to the XY plane of a jig. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view that diagrammatically illustrates an example of a laminate. [Diagram 2] FIG. 2 is a perspective view illustrating a typical example of a multilayer ceramic capacitor. [Diagram 3] FIG. 3 is a LT cross-sectional view (AA line cross-sectional view) of the multilayer ceramic capacitor shown in FIG. [Figure 4] FIG. 4 is a WT cross-sectional view (cross-sectional view taken along line BB) of the multilayer ceramic capacitor shown in FIG. [Diagram 5] FIG. 5 is a perspective view showing a schematic example of a transfer plate constituting the direction alignment device. [Figure 6] FIG. 6 is a perspective view that illustrates a state in which the laminate is housed in the recess. [Figure 7] FIG. 7 is a perspective view showing an example of a direction alignment device in its entirety. [Figure 8A] FIG. 8A is a process diagram that illustrates the process of changing the orientation of a laminate by magnetic force. [Figure 8B] FIG. 8B is a process diagram that illustrates the process of changing the orientation of the laminate by magnetic force. [Figure 8C]FIG. 8C is a process diagram that illustrates the process of changing the orientation of the laminate by magnetic force. [Figure 9] FIG. 9 is a top view showing a schematic example of the direction in which the magnet moves. [Figure 10] FIG. 10 is a plan view showing a schematic view of magnetic field lines directed toward the corners of the recess. [Figure 11] FIG. 11 is a side view that typically illustrates a process of mounting a multilayer ceramic capacitor, in which external electrodes are provided on a laminate, on a substrate-type terminal. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The direction alignment device of the present invention will now be described. However, the present invention is not limited to the following configurations, and can be modified and applied as appropriate within the scope of the present invention. Note that the present invention also includes a combination of two or more of the individual preferred configurations described below.

[0010] The laminate whose posture is to be controlled using the direction alignment device of the present invention is not particularly limited, but the device can be suitably used for controlling the posture of a laminate that is an electronic component such as a chip component. Examples of electronic components include a multilayer ceramic capacitor and a multilayer coil. Furthermore, since electronic components such as the multilayer ceramic capacitor and the multilayer coil described above include laminates, electronic components including laminates are also included in the laminates whose postures are to be controlled using the direction alignment device of the present invention. Before describing the direction alignment device of the present invention, a laminate constituting a multilayer ceramic capacitor will be described as an example of a laminate whose posture is to be controlled. Also, a multilayer ceramic capacitor formed with external electrodes on the laminate will be described.

[0011] FIG. 1 is a perspective view schematically showing an example of a laminate, and FIG. 2 is a perspective view schematically showing an example of a multilayer ceramic capacitor. The multilayer ceramic capacitor shown in FIG. 2 is obtained by forming external electrodes on the laminate shown in FIG. 1. The dimensions in the length direction, width direction, and stacking direction of the laminate and the multilayer ceramic capacitor are indicated by double-headed arrows L, W, and T, respectively. The stacking direction T is also the thickness direction of the laminate and the multilayer ceramic capacitor. When the dimension in the stacking direction of the laminate or the multilayer ceramic capacitor is T, the dimension in the width direction is W, and the dimension in the length direction is L, it is preferable that T < L and W < L. W may be equal to L, or W may not be equal to L. FIG. 3 is an LT cross-sectional view (cross-sectional view taken along line A-A) of the multilayer ceramic capacitor shown in FIG. 2, and FIG. 4 is a WT cross-sectional view (cross-sectional view taken along line B-B) of the multilayer ceramic capacitor shown in FIG. 2.

[0012] The laminate 10 shown in FIG. 1 includes a plurality of stacked dielectric layers 20 and a plurality of internal electrode layers (a first internal electrode layer 35 and a second internal electrode layer 36), a first main surface 10a and a second main surface 10b opposite to each other in the stacking direction T, a first side surface 10e and a second side surface 10f opposite to each other in the width direction W orthogonal to the stacking direction T, and a first end surface 10c and a second end surface 10d opposite to each other in the length direction L orthogonal to the stacking direction T and the width direction W. It is preferable that the laminate has rounded corners and ridgelines. A corner is a portion where three surfaces of the laminate intersect, and a ridgeline is a portion where two surfaces of the laminate intersect.

[0013] As the dielectric material constituting the dielectric layer 20, for example, a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3 can be used. Further, those obtained by adding components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds, which have a lower content than the main components, to these components may also be used. The dielectric layer includes an outer layer portion and an inner layer portion. The outer layer portion is located on both main surface sides of the laminate and is a dielectric layer located between the main surface and the internal electrode layer closest to the main surface. The region sandwiched between both outer layer portions is the inner layer portion. The thickness of the dielectric layer is preferably 0.4 μm or more and 2.0 μm or less.

[0014] The internal electrode layers preferably contain a ferromagnetic material. The ferromagnetic material includes nickel (Ni). When the internal electrode layers contain a ferromagnetic material, the laminate can be easily rotated by magnetic force. The internal electrode layers may further contain dielectric particles having the same composition as the dielectric ceramic contained in the dielectric layers. The thickness of the internal electrode layer is preferably 0.4 μm or more and 2.0 μm or less. The number of laminated internal electrode layers in the laminate is preferably 204 or more and 510 or less.

[0015] The multiple internal electrode layers include a first internal electrode layer 35 and a second internal electrode layer 36 . The first internal electrode layer 35 and the second internal electrode layer 36 each include a counter electrode portion that faces each other, and a lead electrode portion that extends from the counter electrode portion to an end face of the laminate. 3, the first internal electrode layer 35 is extended to a first end face 10c of the laminate 10 and connected to a first external electrode 16. The second internal electrode layer 36 is extended to a second end face 10d of the laminate 10 and connected to a second external electrode 17. In this embodiment, in each opposing electrode portion, the internal electrode layers face each other via a dielectric layer to form a capacitance, thereby functioning as a multilayer ceramic capacitor.

[0016] The laminate may be green or sintered at the time it is oriented by the orientation aligner. The size of the laminate is not particularly limited, but it is preferable that the width (W direction dimension) is 0.33 mm or more and 1.45 mm or less, the thickness (T direction dimension) is 0.33 mm or more and 1.45 mm or less, and the length (L direction dimension) is 0.63 mm or more and 2.20 mm or less.

[0017] In the multilayer ceramic capacitor 1, a first external electrode 16 is connected to a first end face 10c of the laminate 10, and a second external electrode 17 is connected to a second end face 10d. The first external electrode 16 and the second external electrode 17 are end face external electrodes. The end face external electrodes are formed on the end faces of the laminate, and further extend from the end faces to the side faces and main faces.

[0018] The external electrodes may include a base electrode layer and a plating layer disposed on the base electrode layer. The base electrode layer may include at least one layer selected from the group consisting of a baked layer, a resin layer, a thin film layer, and the like. The baking layer is a layer containing glass and metal. The glass contains Si, and the metal preferably contains at least one selected from the group consisting of Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc. The baking layer may be a multi-layered layer. The fired layer is a layer formed by applying a conductive paste containing glass and metal to the laminate and firing it, and may be a layer fired simultaneously with the internal electrode layer, or a layer fired after firing the internal electrode layer.

[0019] The resin layer may be a resin layer containing conductive particles and a thermosetting resin. When forming a resin layer, the resin layer may be directly formed on the laminate without forming a baked layer. The resin layer may be a multi-layered layer.

[0020] The thin film layer is formed by a thin film forming method such as sputtering or vapor deposition, and is a layer of 1 μm or less in thickness in which metal particles are deposited.

[0021] The plating layer preferably contains at least one selected from the group consisting of Cu, Ni, Sn, Ag, Pd, an Ag-Pd alloy, and AuNi. The plating layer may be a multi-layer structure. Preferably, it is a two-layer structure of a Ni plating layer and a Sn plating layer. The Ni plating layer can prevent the base electrode layer from being eroded by solder when mounting electronic components. The Sn plating layer improves the wettability of the solder when mounting electronic components, making it easy to mount the electronic components.

[0022] The laminates to be aligned in the direction alignment device of the present invention are not limited to the laminates and multilayer ceramic capacitors of the forms described above, and may be, for example, a through-type laminate in which the internal electrode layers are drawn out also on the side surfaces. In a multilayer ceramic capacitor including a through-type laminate, external electrodes are also formed on the side surfaces of the laminate.

[0023] Next, an embodiment of the direction alignment device of the present invention will be described. FIG. 5 is a perspective view showing a schematic example of a transfer plate constituting the direction alignment device. 5 shows the transfer plate 110, and illustrates the X, Y, and Z directions of the transfer plate. The transfer plate 110 has a recess 111 formed therein. The upper surface of the transfer plate 110 is a plane including the X direction and the Y direction, which is taken as the main surface 112, and the recess 111 opens onto the main surface 112. The portion of the recess 111 that opens onto the main surface 112 is taken as an opening 113. The recess 111 is a bottomed hole having the opening 113. The bottom surface of the recess 111 is part of the transfer plate 110.

[0024] A plurality of recesses 111 are provided in a matrix (grid) on the transfer plate 110. The depth of the recesses is preferably greater than the width or thickness of the laminate. The opening 113 of the recess 111 is rectangular in shape to rotate the laminate, and it is preferable that the length in the short direction is greater than the length of the diagonal formed by the ridge line extending in the stacking direction of the laminate and the ridge line extending in the width direction (the length indicated by the double arrow d in Figure 4). The material of the transfer plate 110 is preferably a material that is not affected by a magnet or is less affected by a magnet. The material of the transfer plate 110 is preferably a non-magnetic material, and is preferably a resin material.

[0025] The transfer plate 110 is set in a shaker (vibration imparting device) etc. A plurality of laminates are placed on the transfer plate 110, and the laminates are accommodated in the recesses 111 of the transfer plate 110 by applying vibration and tilt.

[0026] 6 is a perspective view showing a state in which a laminated ceramic capacitor is accommodated in the recess as a laminate. The insertion plate is shown in a see-through view to show the laminated ceramic capacitor. The internal electrode layers are shown through the external electrodes to show the lamination direction of the laminate. FIG. 6 shows a state in which the orientations of the multilayer ceramic capacitors 1 housed in the recess 111 are not uniform, with multilayer ceramic capacitors 1M whose stacking direction is the same as the Z direction and multilayer ceramic capacitors 1S whose stacking direction is the same as the X direction being mixed in the recess 111.

[0027] The orientation alignment device of the present invention includes a swing-in plate and a magnet. FIG. 7 is a perspective view showing an example of a direction alignment device in its entirety. The orientation alignment device 100 shown in FIG. FIG. 7 shows a state in which the multilayer ceramic capacitors 1M and 1S are accommodated in the recesses 111 of the transfer plate 110, and a cover 130 covering the recesses 111 is arranged.

[0028] The magnet 120 has its magnetic poles arranged in the Z direction, which is perpendicular to the X and Y directions. With this magnetic pole arrangement, the axis along which the polarity faces within the magnet is the Z direction. The north pole 120N faces the main surface 112 of the transfer plate 110, and the south pole 120S is located on the surface opposite the transfer plate 110. The arrangement of the north and south poles may be reversed, with south pole 120S facing main surface 112 of transfer plate 110 and north pole 120N located on the opposite surface of transfer plate 110.

[0029] The shape of the magnet is not particularly limited, but it is preferable that the magnet has a circular shape when viewed in a plane including the X direction and the Y direction (a disk-shaped magnet). The magnet may be a permanent magnet or an electromagnet. The material of the magnet is not particularly limited, but a neodymium magnet is preferable. Moreover, the magnetic force of the magnet is preferably not less than 0.13 T and not more than 4 T. The strength of the magnetic force of the magnet can be measured by a tesla meter.

[0030] When the magnet 120 is moved, the magnetic force of the magnet 120 can align the orientation of the multilayer ceramic capacitor 1, which is a laminate with internal electrode layers embedded and is accommodated in the recess 111 of the transfer plate 110. A magnet is placed in a region outside the recessed area where the laminates to be aligned are placed in the row or column direction, and the magnet is moved in the row or column direction to align the stacking direction of the laminates so that it is perpendicular to the XY plane of the transfer plate (Z direction). Note that for laminates whose stacking direction is perpendicular to the XY plane of the transfer plate (Z direction), that orientation is maintained.

[0031] In the direction alignment device of the present invention, the laminate to be aligned is a laminate whose lamination direction axis is shifted from the axis (Z direction) along which the polarity faces within the magnet. One example is a laminate whose lamination direction is in the XY plane. The lamination direction of the laminate to be aligned may match the X direction or the Y direction. Also, it does not have to match either the X direction or the Y direction, and may be inclined at a predetermined angle with respect to the X direction or the Y direction.

[0032] 8A, 8B, and 8C are process diagrams that show the process of changing the orientation of the laminate by magnetic force. The direction of the magnetic field lines in Fig. 8A, 8B, and 8C are indicated by arrows (X direction), and the two-dot chain lines indicate the magnetic field lines. Since magnet 120 has magnetic poles arranged in the Z direction perpendicular to the X and Y directions, the direction of magnetic field lines in the recess near the area through which magnet 120 passes is the X direction (or Y direction). The magnet moves in the order of Figures 8A, 8B, and 8C. The direction of movement of the magnet is from the front of the paper to the back, or from the back to the front, that is, the +Y direction or the -Y direction.

[0033] FIG. 8A shows a state in which a multilayer ceramic capacitor 1S, whose lamination direction is the same as the X direction, is placed in a recess 111 of a transfer plate 110. The magnetic field lines in the recess 111 are oriented from left to right (X direction). When a magnet 120 carrying such magnetic field lines passes near the multilayer ceramic capacitor 1S, the laminate rotates so that the orientation of the internal electrode layers becomes parallel to the direction of the magnetic field lines, as shown in Figures 8B and 8C. As a result, as shown in Figure 8C, the multilayer ceramic capacitor 1 in the recess 111 becomes a multilayer ceramic capacitor 1M whose stacking direction is the same as the Z direction, and the orientation of the laminate is aligned.

[0034] In order to prevent the laminate from being held by the magnet 120, a cover 130 that covers the recess 111 is provided on the main surface 112 of the transfer plate 110. The thickness of cover 130 is not particularly limited, but is preferably thick enough to allow the magnetic force of magnet 120 to pass through. For example, it may be 0.1 mm or more and 20 mm or less. Also, because cover 130 may warp depending on the material, it is more preferable that the thickness be 5 mm or more to ensure rigidity. The material of cover 130 is preferably a material other than metal, which is a ferromagnetic material, so as to allow the magnetic force of magnet 120 to pass therethrough, and is preferably resin.

[0035] FIG. 9 is a top view showing a schematic example of the direction in which the magnet moves. In Fig. 9, the direction of magnet movement is indicated by an arrow. In this figure, magnet 120 moves in the -Y direction, then moves slightly in the -X direction, moves in the +Y direction, moves slightly in the -X direction, and then moves again in the - direction. In other words, it can be said that the magnet alternates between moving in the long direction (Y direction) of the rectangular shape of the recess of the transfer plate when viewed from above and moving in the short direction (X direction) of the rectangle.

[0036] Here, the direction in which the magnet moves is defined as the positive direction, and the direction in which the magnet passes is defined as the negative direction. These positive and negative directions are a different concept from the +X and -X directions of the X coordinate, and the +Y and -Y directions of the Y coordinate in Figure 9 etc. For example, magnet 120 in the position shown in Fig. 9 moves in the -Y direction, and in this case the positive direction is the -Y direction and the negative direction is the +Y direction. In Fig. 9, when magnet 120 reaches the position at the bottom of the drawing and moves in the -X direction, the positive direction is the -X direction and the negative direction is the +X direction. The magnet then moves in the positive X direction or the positive Y direction relative to the main surface of the transfer plate, aligning the orientation of the laminated body arranged on the negative side.

[0037] It is preferable to scan the magnet in a one-way direction, and not back and forth over the same location multiple times, as this can cause rotation of the stack in unexpected locations. Moreover, the moving speed of the magnet is preferably 50 mm / s or more and 1000 mm / s or less.

[0038] In the direction alignment device of the present invention, it is preferable that the shape of the recess in plan view is rectangular, and that the magnetic field lines generated by the magnet are directed toward the corners of the rectangle. FIG. 10 is a plan view showing a schematic view of magnetic field lines directed toward the corners of the recess. The multilayer ceramic capacitor 1S is housed in the recess 111 shown at the right end in Fig. 10. The recess 111 has a rectangular shape when viewed from above. The magnet 120 shown in Fig. 10 is disk-shaped, and magnetic field lines extend radially from the center of the disk. These magnetic field lines are directed toward corners 111a of the rectangle when the recess 111 is viewed from above. In Fig. 10, the direction of the magnetic field lines from the magnet 120 is indicated by dashed two-dot arrows. When magnetic field lines extend in this direction and act on the multilayer ceramic capacitor 1S in the recess 111, the position of the multilayer ceramic capacitor 1S tilts in the recess 111, causing the capacitor to lose its posture. When the posture of the multilayer ceramic capacitor 1S is lost, the multilayer ceramic capacitor 1S becomes more likely to rotate in the recess 111, and the orientation of the multilayer ceramic capacitor 1 becomes more likely to be aligned. Furthermore, since the position of the laminate (multilayer ceramic capacitor) may move within the recess, it is preferable that the magnetic field lines generated by the magnet be directed toward the corners that form the rectangle on the upper surface of the rectangular parallelepiped that constitutes the laminate when viewed from above.

[0039] The laminate, the orientation of which has been aligned by the direction alignment device, is mounted on a mounting target such as a substrate after external electrodes are formed. An example in which a multilayer ceramic capacitor is mounted on a substrate-type terminal will be described below. FIG. 11 is a side view that typically illustrates a process of mounting a multilayer ceramic capacitor, in which external electrodes are provided on a laminate, on a substrate-type terminal. FIG. 11 shows a side view of the multilayer ceramic capacitor 1 as viewed from the second external electrode 17 side. Fig. 11 shows a process for mounting the multilayer ceramic capacitor 1 on a substrate-type terminal 200. Fig. 11 shows a downward arrow which indicates the direction in which the multilayer ceramic capacitor 1 is mounted on the substrate-type terminal 200. The substrate-type terminal 200 has an insulating substrate 221, and the multilayer ceramic capacitor 1 is mounted on the second main surface 221b side of the insulating substrate 221. Solder paste is applied to the mounting electrodes 223 of the substrate-type terminals 200 by, for example, a screen printing method. Next, the multilayer ceramic capacitor 1 is placed on the substrate-type terminal 200 and reflowed so that the solder paste adheres to the first external electrode 16 (not shown in FIG. 11) and the second external electrode 17 of the multilayer ceramic capacitor 1. The molten solder paste is solidified by reflow, and the multilayer ceramic capacitor 1 is mounted on the substrate-type terminal 200.

[0040] 11, the orientation of the internal electrode layers in the mounted multilayer ceramic capacitor 1 is indicated by a dotted line in the second external electrode 17. The lamination direction of the internal electrode layers is a direction (Z direction) perpendicular to the main surface of the substrate-type terminal 200, and both the main surface of the substrate-type terminal 200 and the main surfaces of the internal electrode layers are planes including the X direction and the Y direction. As described above, the direction alignment device can align the laminate so that the stacking direction is the same as the Z direction, so that the orientation of the internal electrode layers of the mounted multilayer ceramic capacitor can be oriented as shown in Figure 11.

[0041] The direction of the laminate may be aligned by a direction alignment device so that the lamination direction is the same as the Z direction, and the laminated ceramic capacitor may be mounted on a substrate-type terminal while maintaining that direction.

[0042] If the main surfaces of the board-type terminals and the main surfaces of the internal electrode layers are both planes that include the X and Y directions and are oriented in the same direction, vibrations caused by the piezoelectric effect are less likely to be transmitted, and the audible sound (known as "crying") generated by the propagation of vibrations can be reduced.

[0043] An example of a process for manufacturing a multilayer ceramic capacitor as an electronic component and mounting the multilayer ceramic capacitor on a substrate-type terminal can be summarized as follows. 1. Form a ceramic green sheet to form the dielectric layer. 2. Print the internal electrode patterns that will become the internal electrode layers onto the ceramic green sheets. 3. The ceramic green sheets with the internal electrode layers printed on them are stacked to obtain a laminate. This usually results in a large-sized laminate (mother block) with many electronic component patterns printed on it. 4. The mother block is divided into individual pieces to obtain multiple laminates. 5. A conductive paste is applied to the end faces and side faces of the laminate, followed by drying and other processes to form external electrodes, thereby completing the multilayer ceramic capacitor. 6. Using the transfer device, the multilayer ceramic capacitor is inserted into the recess of the transfer plate of the direction alignment device and accommodated therein. 7. Place the cover over the opening of the recess. 8. A magnet with its magnetic poles arranged in the Z direction is placed above the cover, in an area outside the recessed area in which the multilayer ceramic capacitors to be oriented are housed, and the magnet is moved in the row or column direction to align the orientation of the multilayer ceramic capacitors. 9. The multilayer ceramic capacitors are picked up from the transfer plate and mounted one by one on the collective board of substrate-type terminals.

[0044] The present specification discloses the following:

[0045] <1> A transfer plate having a main surface that is a plane including the X direction and the Y direction and having a recess that opens onto the main surface; a magnet having magnetic poles arranged in a Z direction perpendicular to the X direction and the Y direction; The magnet is moved, and the orientation of the laminate in which the internal electrode layers are embedded and accommodated in the recess of the transfer plate is aligned by the magnetic force of the magnet; A direction alignment device, characterized in that the axis along which the polarity faces within the magnet is offset from the axis along which the laminate is stacked.

[0046] <2> The magnet moves in the positive direction of the X direction or the positive direction of the Y direction relative to the main surface to align the orientation of the laminate arranged on the negative direction side. <1> A direction alignment device as described in

[0047] <3> The recess has a rectangular shape in a plan view, The magnetic field lines generated by the magnet are directed toward the corners of the rectangle. <1> or <2> A direction alignment device as described in

[0048] <4> The magnet is circular when viewed in plan in the plane. <1> ~ <3> 3. A direction alignment device as described in any one of claims 1 to 2.

[0049] <5> The moving speed of the magnet is 50 mm / s or more and 1000 mm / s or less. <1> ~ <4> 3. A direction alignment device as described in any one of claims 1 to 2.

[0050] <6> The magnetic force of the magnet is 0.13T or more and 4T or less. <1> ~ <5> 3. A direction alignment device as described in any one of claims 1 to 2.

[0051] <7> The laminate is a laminate that becomes a multilayer ceramic capacitor and has a plurality of internal electrode layers containing Ni, which is a ferromagnetic material, therein. <1> ~ <6> 3. A direction alignment device as described in any one of claims 1 to 2.

[0052] Also described herein is a method for aligning a stack using the alignment device of the present invention. The method for directional alignment of a stack described herein includes: A method for aligning the orientation of a laminate having an internal electrode layer embedded therein, using the alignment device of the present invention, comprising the steps of: A step of inserting and accommodating the laminate in a recess of an insert plate having a main surface that is a plane including the X direction and the Y direction and a recess that opens on the main surface; The method for aligning the orientation of a laminate includes the steps of: placing a magnet with magnetic poles arranged in the Z direction perpendicular to the X and Y directions in an area outside the area of ​​the recess in which the laminate to be oriented is housed; and moving the magnet to align in the Z direction the orientation of the laminate housed in the recess of the transfer plate, the stacking direction of which deviates from the Z direction. [Explanation of symbols]

[0053] 1, 1M, 1S Multilayer ceramic capacitor (laminate) 10. Laminate 10a First main surface 10b Second main surface 10c 1st end face 10d 2nd end face 10e First Side 10f 2nd side 16 1st external electrode 17 2nd external electrode 20 Dielectric layer 35 First internal electrode layer 36 Second internal electrode layer 100-way alignment device 110 Transfer Plate 111 Recess 111a Corner of recess 112 Main surface 113 Opening 120 Magnet 120N N pole 120S S pole 130 Cover 200 PCB-type terminals 221 Insulating Substrate 221b Second main surface of insulating substrate 223 Mounting electrode

Claims

1. A transfer plate having a main surface that is a plane including the X direction and the Y direction and having a recess that opens onto the main surface; a magnet having magnetic poles arranged in a Z direction perpendicular to the X direction and the Y direction; The magnet is moved, and the orientation of the laminate in which the internal electrode layers are embedded and accommodated in the recess of the transfer plate is aligned by the magnetic force of the magnet; A direction alignment device, characterized in that the axis along which the polarity faces within the magnet is offset from the axis along which the laminate is stacked.

2. The direction alignment device according to claim 1 , wherein the magnet moves in a positive X direction or a positive Y direction relative to the main surface to align the orientation of the stack disposed on the negative direction side.

3. The recess has a rectangular shape in a plan view, The directional alignment device of claim 1 or 2, wherein magnetic field lines emanating from the magnet are directed toward corners of the rectangle.

4. The directional alignment device of claim 3 , wherein the magnet is circular when viewed in plan in the plane.

5. 3. The direction alignment device according to claim 1, wherein the moving speed of the magnet is 50 mm / s or more and 1000 mm / s or less.

6. 3. The direction alignment device according to claim 1, wherein the magnetic force of the magnet is 0.13 T or more and 4 T or less.

7. 3. The alignment device according to claim 1, wherein the laminate is a laminate that becomes a multilayer ceramic capacitor and has a plurality of internal electrode layers that contain Ni, which is a ferromagnetic material, therein.

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