Electronic device

Abstract

To provide an electronic device capable of saving a space in a casing.SOLUTION: An electronic device includes: a casing 102; a heating element provided in the casing 102; a heat transfer member 2 abutting on the heating element so as to be capable of transferring heat; and one or multiple heat radiation mechanisms 3 for cooling the heat transfer member 2. The heat radiation mechanism 3 includes: a first cooling device 10 for cooling a first main surface 2a of the heat transfer member 2; and a second cooling device 20 for cooling a second main surface 2b opposite to the first main surface 2a of the heat transfer member 2. The first cooling device 10 has: a first heat sink 11 abutting on the first main surface 2a so as to be capable of transferring heat; and a first blowing mechanism 12 for allowing a gas G1 to flow so as to abut on the first heat sink 11. The second cooling device 20 has: a second heat sink 21 abutting on the second main surface 2b so as to be capable of transferring heat; and a second blowing mechanism 22 for allowing a gas G2 to flow so as to abut on the second heat sink 21.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to electronic devices. [Background technology]

[0002] In electronic devices such as notebook personal computers (notebook PCs), a cooling device is sometimes installed in the housing (see, for example, Patent Document 1). The cooling device is, for example, a heat dissipation fin and a fan for cooling electronic components such as a CPU. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-55310 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the electronic devices, the cooling device is large in size, which may affect the installation space for other components, and therefore there is a demand for space saving within the housing.

[0005] An object of one embodiment of the present invention is to provide an electronic device that can reduce the space inside its housing. [Means for solving the problem]

[0006] One aspect of the present invention provides an electronic device comprising: a housing, a heat generating element provided within the housing, a heat transfer member in thermally conductive contact with the heat generating element, and one or more heat dissipation mechanisms for cooling the heat transfer member, wherein the heat dissipation mechanism comprises a first cooling device for cooling a first main surface of the heat transfer member, and a second cooling device for cooling a second main surface of the heat transfer member opposite the first main surface, wherein the first cooling device has a first heat dissipation plate in thermally conductive contact with the first main surface and a first blowing mechanism for flowing gas so as to contact the first heat dissipation plate, and the second cooling device has a second heat dissipation plate in thermally conductive contact with the second main surface, and a second blowing mechanism for flowing gas so as to contact the second heat dissipation plate.

[0007] It is preferable that the first blowing mechanism blows the gas in a direction facing the first heat sink, thereby bringing the gas into contact with the first heat sink, and that the second blowing mechanism blows the gas in a direction facing the second heat sink, thereby bringing the gas into contact with the second heat sink.

[0008] It is preferable that the multiple heat dissipation mechanisms include a first heat dissipation mechanism and a second heat dissipation mechanism, and that the heat transfer member has a main portion that is in contact with the heat generating element so as to be able to transfer heat, a first extension portion extending outward from one side edge of the main portion, and a second extension portion extending outward from the other side edge of the main portion, and that the first heat dissipation mechanism is provided in the first extension portion and the second heat dissipation mechanism is provided in the second extension portion.

[0009] The heat transfer member is preferably a heat transport member in which a working fluid is sealed in an enclosed space formed between a pair of opposing main plates. Effect of the Invention

[0010] According to one aspect of the present invention, an electronic device capable of saving space inside a housing is provided. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a plan view of an electronic device according to an embodiment. [Diagram 2]4 is a plan view showing an internal structure of a second housing of the electronic device according to the embodiment. FIG. [Diagram 3] 2 is a plan view of a heat transfer member and a heat dissipation mechanism of the electronic device according to the embodiment. FIG. [Figure 4] 3 is a cross-sectional view of a heat transfer member and a heat dissipation mechanism of the electronic device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] [Electronic equipment] An electronic device according to an embodiment will be described. Fig. 1 is a plan view of an electronic device 100 according to an embodiment. Fig. 2 is a plan view showing an internal structure of a second housing 102. Fig. 3 is a plan view of a heat transfer member 2 and a heat dissipation mechanism 3. Fig. 4 is a cross-sectional view of the heat transfer member 2 and the heat dissipation mechanism 3. Fig. 4 is a cross-sectional view taken along line II of Fig. 3.

[0013] 1, electronic device 100 includes a first housing 101, a second housing 102, a circuit board 1 (see FIG. 2), a heat transfer member 2 (see FIG. 2), and a pair of heat dissipation mechanisms 3 (see FIG. 2). Electronic device 100 is, for example, a notebook PC (PC: personal computer).

[0014] The first housing 101 is also called a display housing. The first housing 101 is equipped with a display 103. The display 103 is, for example, a liquid crystal display or an organic EL (EL: Electro-Luminescence) display. One end of the first housing 101 is called a first base end 101b. The end opposite to the first base end 101b is called a first open end 101a.

[0015] The second housing 102 (housing) is also called a system housing. The second housing 102 is a flat case body including an upper plate 111 (first cover member) and a lower plate 112 (second cover member). The upper plate 111 and the lower plate 112 face each other. When the second housing 102 is placed on a placement surface (such as the top surface of a desk), the lower plate 112 faces the placement surface.

[0016] A keyboard 107 and a touch pad 108 are provided on an inner surface 102c of the second housing 102. When the first housing 101 is closed relative to the second housing 102, the inner surface 102c faces the display 103.

[0017] One end of the second housing 102 is called a second base end 102b. The end opposite to the second base end 102b is called a second open end 102a. The second base end 102b of the second housing 102 is connected to the first base end 101b of the first housing 101 via a hinge mechanism 110.

[0018] The positional relationship of each component of the second housing 102 may be described using an XYZ Cartesian coordinate system. The Y direction is the front-rear direction along the inner surface 102c. The +Y direction is rearward. The -Y direction is forward. The -Y direction is from the second base end 102b to the second open end 102a. The X direction is perpendicular to the Y direction in a plane along the inner surface 102c. In FIG. 1, the X direction is the left-right direction. The +X direction is rightward. The -X direction is leftward. The X direction is perpendicular to the Y direction. The Z direction is the thickness direction of the second housing 102. The Z direction is perpendicular to the X and Y directions.

[0019] When the second housing 102 is placed on a horizontal placement surface with the inner surface 102c facing upward, the Z direction is the up-down direction. The +Z direction is upward. The -Z direction is downward. Viewing from the Z direction is called planar view. The plane along the X and Y directions is the XY plane.

[0020] 2, the circuit board 1, the heat transfer member 2, and the heat dissipation mechanism 3 are housed in a second housing 102. The circuit board 1 is, for example, a printed circuit board (PCB). The circuit board 1 has a rectangular shape.

[0021] The circuit board 1 includes a central processing unit 4 (CPU) and a plate-shaped base material 5. The central processing unit is referred to as the "CPU." The CPU 4 is mounted on one surface (mounting surface) of the base material 5. The CPU 4 is a processor that executes application programs and performs general processing. One surface of the CPU 4, a first main surface 4a, is a heat transfer area that transfers heat to the heat transfer member 2.

[0022] The CPU4 is an electronic component that is an example of a "heat generating element." Heat generating elements include processing devices, integrated circuits, storage devices (memory, etc.), communication modules, sensors, optical devices, batteries, and heat transport materials (heat spreaders, heat pipes, etc.). Processing devices include CPUs and graphics processing units (GPUs).

[0023] The heat transfer member 2 is made of a material with high thermal conductivity, for example, a metal such as copper or aluminum. The heat transfer member 2 is in contact with the CPU 4 so as to be able to transfer heat therethrough. The heat transfer member 2 is in direct or indirect contact with the first main surface 4a of the CPU 4, for example. The heat transfer member 2 may be in direct contact with the CPU 4. The heat transfer member 2 may also be in indirect contact with the CPU 4 via thermally conductive grease, a heat dissipation sheet, or the like.

[0024] As shown in FIG. 3, the heat transfer member 2 has a pair of opposing main plates 2A, 2B. The main plate 2A is an upper plate. The main plate 2B is a lower plate. The main plates 2A, 2B are parallel to the XY plane. A first main surface 2a, which is the upper surface of the main plate 2A, is the upper surface of the heat transfer member 2. A second main surface 2b, which is the lower surface of the main plate 2B, is the lower surface of the heat transfer member 2. The second main surface 2b is the surface opposite to the first main surface 2a.

[0025] An enclosed space 2C is formed between the main plates 2A and 2B (see FIG. 4). The enclosed space 2C is formed over the entire region of the heat transfer member 2, including the main portion 6 and the extension portions 7A and 7B. A working fluid is sealed in the enclosed space 2C within the heat transfer member 2 so as to be able to flow. The heat transfer member 2 is a heat transport member. The heat transfer member 2 is, for example, a vapor chamber.

[0026] Examples of the working fluid include water, alternative fluorocarbons, acetone, butane, etc. The working fluid flows in an enclosed space. The working fluid can change phase in the enclosed space. For example, a wick is provided in the enclosed space to transport the condensed working fluid by capillary action.

[0027] The heat transfer member 2 includes a main portion 6 and a pair of extension portions 7. The main portion 6 is rectangular in plan view. The main portion 6 may be, for example, rectangular in shape with its long side extending in the X direction. The main portion 6 is in direct or indirect contact with the first main surface 4a of the CPU 4.

[0028] One of the pair of extension portions 7 is a first extension portion 7A. The first extension portion 7A extends from a side edge 6a (one side edge) on the +X side of the main portion 6 to the +X side (outside). The other of the pair of extension portions 7 is a second extension portion 7B. The second extension portion 7B extends from a side edge 6b (the other side edge) on the -X side of the main portion 6 to the -X side (outside). The extension portion 7 is rectangular in plan view. The "outside" is the direction in which the side edges 6a and 6b of the main portion 6 move away from each other. The outward side of the side edge 6a faces the -X side. The outward side of the side edge 6b faces the +X side.

[0029] As shown in FIG. 4, the upper surface (surface on the +Z side) of the extension portion 7 is the first principal surface 7a. The first principal surface 7a is formed flat. The first principal surface 7a is part of the first principal surface 2a, which is the upper surface of the heat transfer member 2. The lower surface (surface on the -Z side) of the extension portion 7 is the second principal surface 7b. The second principal surface 7b is formed flat. The second principal surface 7b is part of the second principal surface 2b, which is the lower surface of the heat transfer member 2. The first principal surface 7a and the second principal surface 7b are parallel to the XY plane.

[0030] 3, one of the pair of heat dissipation mechanisms 3 is a first heat dissipation mechanism 3A. The other of the pair of heat dissipation mechanisms 3 is a second heat dissipation mechanism 3B. The first heat dissipation mechanism 3A is provided in the first extension section 7A. The second heat dissipation mechanism 3B is provided in the second extension section 7B.

[0031] As shown in FIG. 4, the heat dissipation mechanism 3 (first heat dissipation mechanism 3A) includes a first cooling device 10 and a second cooling device 20. The first cooling device 10 and the second cooling device 20 include a first cooling device 10 and a second cooling device 20. The first cooling device 10 includes a first heat sink 11, a first air blowing mechanism 12, and a first support 15.

[0032] The first heat sink 11 has a rectangular shape. The first heat sink 11 is made of a material with high thermal conductivity, for example, a metal such as copper or aluminum. The first heat sink 11 is overlaid on the first main surface 7a of the first extension portion 7A from above. The first heat sink 11 is in contact with the first main surface 7a of the first extension portion 7A so as to be capable of transferring heat. The first heat sink 11 has an area that covers most of the area of ​​the first main surface 7a in a plan view, for example. The first heat sink 11 is parallel to the XY plane.

[0033] The lower surface of the first heat sink 11 is in direct or indirect contact with, for example, the first main surface 7a of the first extension section 7A. The first heat sink 11 may be in direct contact with the first main surface 7a. The first heat sink 11 may be in indirect contact with the first main surface 7a via thermally conductive grease, a heat dissipation sheet, or the like. When the first heat sink 11 is in direct contact with the first main surface 7a, the first heat sink 11 is in planar contact with the first main surface 7a.

[0034] The first blower mechanism 12 is provided above the first heat dissipation plate 11. The first blower mechanism 12 is located at a position spaced above the upper surface of the first heat dissipation plate 11, for example.

[0035] The first blowing mechanism 12 includes a case 13 and an actuator 14 (vibration element). The case 13 includes an inner plate 13A, a side plate 13B, and an outer plate 13C. The inner plate 13A is, for example, rectangular in a plan view. The inner plate 13A is, for example, parallel to the XY plane. The inner plate 13A is, for example, spaced upward from the upper surface of the first heat dissipation plate 11. The inner plate 13A faces the first heat dissipation plate 11 in the vertical direction. The inner plate 13A is formed with an outlet 13D for discharging the gas G1.

[0036] The side plate 13B rises from the peripheral edge of the inner plate 13A. The side plate 13B has a rectangular frame shape in a plan view. The outer plate 13C extends from the upper edge of the side plate 13B. The outer plate 13C is, for example, rectangular in plan view. The outer plate 13C is, for example, parallel to the XY plane. The outer plate 13C has the same shape as the inner plate 13A. The outer plate 13C is separated upward from the inner plate 13A. The outer plate 13C faces the inner plate 13A vertically. The outer plate 13C is formed with an intake port 13E for taking in the gas G1 into the case 13.

[0037] The actuator 14 is sheet-shaped (membrane-shaped). The actuator 14 is oriented so as to intersect with the up-down direction. The actuator 14 is deformable (flexible) in the thickness direction. For example, the actuator 14 vibrates in the up-down direction when current is applied. The actuator 14 operates in the thickness direction to take in gas G1 (e.g., air) into the case 13 from the intake port 13E and release the gas G1 in the case 13 downward (facing the first heat sink 11) from the discharge port 13D.

[0038] The first blower mechanism 12 is disposed so as to overlap with the first extension section 7A in a plan view. For example, the first blower mechanism 12 has an area covering most of the area of ​​the first extension section 7A in a plan view. The first blower mechanism 12 is supported by a first support 15. The first support 15 extends upward from an end of the first heat sink 11.

[0039] The second cooling device 20 includes a second heat dissipation plate 21 , a second air blowing mechanism 22 , and a second support 25 . The second heat sink 21 has a rectangular shape. The second heat sink 21 is made of a material with high thermal conductivity, for example, a metal such as copper or aluminum. The second heat sink 21 is stacked from below on the second main surface 7b of the first extension portion 7A. The second heat sink 21 is in contact with the second main surface 7b of the first extension portion 7A so as to be capable of transferring heat. For example, the second heat sink 21 has an area covering most of the area of ​​the second main surface 7b in a plan view. The second heat sink 21 is parallel to the XY plane.

[0040] The upper surface of the second heat sink 21 is in direct or indirect contact with, for example, the second main surface 7b of the first extension section 7A. The second heat sink 21 may be in direct contact with the second main surface 7b. The second heat sink 21 may be in indirect contact with the second main surface 7b via thermally conductive grease, a heat dissipation sheet, or the like. When the second heat sink 21 is in direct contact with the second main surface 7b, the second heat sink 21 is in planar contact with the second main surface 7b.

[0041] The second blower mechanism 22 is provided below the second heat dissipation plate 21. The second blower mechanism 22 is located, for example, at a position spaced downward from the lower surface of the second heat dissipation plate 21.

[0042] The second blowing mechanism 22 includes a case 23 and an actuator 24 (vibration element). The case 23 includes an inner plate 23A, a side plate 23B, and an outer plate 23C. The inner plate 23A is, for example, rectangular in plan view. The inner plate 23A is, for example, parallel to the XY plane. The inner plate 23A is, for example, spaced downward from the lower surface of the second heat dissipation plate 21. The inner plate 23A faces the second heat dissipation plate 21 in the vertical direction. The inner plate 23A has an outlet 23D formed therein for discharging the gas G2.

[0043] The side plate 23B hangs down from the peripheral edge of the inner plate 23A. The side plate 23B has a rectangular frame shape in a plan view. The outer plate 23C extends from the lower edge of the side plate 23B. The outer plate 23C is, for example, rectangular in plan view. The outer plate 23C is, for example, parallel to the XY plane. The outer plate 23C has the same shape as the inner plate 23A. The outer plate 23C is separated downward from the inner plate 23A. The outer plate 23C faces the inner plate 23A vertically. The outer plate 23C is formed with an intake port 23E for taking in the gas G2 into the case 23.

[0044] The actuator 24 is in the form of a sheet. The actuator 24 is oriented so as to intersect with the vertical direction. The actuator 24 is capable of deformation (flexural deformation) in the thickness direction. For example, the actuator 24 vibrates in the vertical direction when current is applied. By operating in the thickness direction, the actuator 24 takes in gas G2 (e.g., air) into the case 23 from the intake port 23E and releases the gas G2 in the case 23 upward (in a direction facing the second heat sink 21) from the discharge port 23D.

[0045] The second blower mechanism 22 is disposed so as to overlap with the first extension section 7A in a plan view. For example, the second blower mechanism 22 has an area covering most of the area of ​​the first extension section 7A in a plan view. The second blower mechanism 22 is supported by a second support 25. The second support 25 extends downward from an end of the second heat sink 21.

[0046] 3, the second heat dissipation mechanism 3B has a structure similar to that of the first heat dissipation mechanism 3A. That is, the second heat dissipation mechanism 3B includes a first cooling device 10 and a second cooling device 20 (see FIG. 4).

[0047] The first heat sink 11 of the first cooling device 10 is placed on the first main surface 7a of the second extension section 7B from above. The first heat sink 11 is in contact with the first main surface 7a of the second extension section 7B so as to be capable of transferring heat. The first blowing mechanism 12 is provided above the first heat sink 11 and spaced apart from the first heat sink 11 (see FIG. 4). The second heat dissipation plate 21 of the second cooling device 20 is overlapped from below on the second main surface 7b of the second extension portion 7B. The second heat dissipation plate 21 is in contact with the second main surface 7b of the second extension portion 7B so as to be capable of transferring heat. The second blowing mechanism 22 is provided below the second heat dissipation plate 21 and spaced apart from the second heat dissipation plate 21 (see FIG. 4).

[0048] Next, the operation of the electronic device 100 will be described. The CPU 4 may generate heat. Since the heat transfer member 2 is in direct or indirect contact with the first main surface 4a of the CPU 4, the heat of the CPU 4 is transferred to the heat transfer member 2 (more specifically, to the main portion 6). The heat transfer member 2 diffuses the heat generated by the CPU 4. The heat is transferred not only to the main portion 6 but also to the extension portion 7.

[0049] Since the heat transfer member 2 is a heat transport member in which a working fluid is sealed in a sealed space 2C (see FIG. 4), the flow of the working fluid efficiently transfers heat from the main portion 6 to the extension portion 7. Since the first heat sink 11 and the second heat sink 21 of the heat dissipation mechanism 3 are in contact with the extension portion 7, the heat of the extension portion 7 is transferred to the first heat sink 11 and the second heat sink 21.

[0050] In the first cooling device 10 of the heat dissipation mechanism 3, the first blowing mechanism 12 operates the actuator 14 in the thickness direction to discharge the gas G1 (e.g., air) in the case 13 downward (facing the first heat dissipation plate 11) from the discharge port 13D. The direction in which the gas G1 is discharged is a direction intersecting the first heat dissipation plate 11 (e.g., a direction perpendicular to the first heat dissipation plate 11). The gas G1 discharged from the discharge port 13D is blown onto the upper surface of the first heat dissipation plate 11. The gas G1 contacts the upper surface of the first heat dissipation plate 11, flows along the upper surface in the +Y direction, and is discharged outside the second housing 102 (see FIG. 2). The first heat dissipation plate 11 is cooled by contact with the gas G1.

[0051] In the second cooling device 20, the second blowing mechanism 22 operates the actuator 24 in the thickness direction to discharge the gas G2 (e.g., air) in the case 23 upward (facing the second heat sink 21) from the discharge port 23D. The direction in which the gas G2 is discharged is a direction intersecting the second heat sink 21 (e.g., a direction perpendicular to the second heat sink 21). The gas G2 discharged from the discharge port 23D is blown onto the lower surface of the second heat sink 21. The gas G2 comes into contact with the lower surface of the second heat sink 21, flows along the lower surface in the +Y direction, and is discharged outside the second housing 102 (see FIG. 2). The second heat sink 21 is cooled by contact with the gas G2.

[0052] The extension portion 7 is cooled by cooling the first heat sink 11 and the second heat sink 21. The extension portion 7 is cooled by cooling the main portion 6. The main portion 6 is cooled by cooling the CPU 4 (see FIG. 3).

[0053] [Effects of the Electronic Device of the Embodiment] In the electronic device 100 of this embodiment, the heat dissipation mechanism 3 includes a first cooling device 10 that cools the first main surface 7a of the heat transfer member 2, and a second cooling device 20 that cools the second main surface 7b of the heat transfer member 2. The first cooling device 10 and the second cooling device 20 cool both sides of the heat transfer member 2 (more specifically, the extension section 7), allowing for efficient cooling. Therefore, the installation area of ​​the heat dissipation mechanism 3 can be made smaller than when only one side of the heat transfer member 2 is cooled.

[0054] In the electronic device 100, the cooling devices 10 and 20 have air blowing mechanisms 12 and 22. The air blowing mechanisms 12 and 22 cool the heat transfer member 2 by flowing gases G1 and G2 so as to contact the heat dissipation plates 11 and 21, and therefore can efficiently cool the heat transfer member 2. This makes it possible to reduce the installation area of ​​the heat dissipation mechanism 3. This makes it possible to save space inside the second housing 102.

[0055] In the electronic device 100, the first blower mechanism 12 and the second blower mechanism 22 blow the gases G1 and G2 in a direction facing the heat sinks 11 and 21, thereby promoting heat transfer from the heat sinks 11 and 21 to the gases G1 and G2. As a result, the heat transfer member 2 can be efficiently cooled.

[0056] The electronic device 100 has a first heat dissipation mechanism 3A and a second heat dissipation mechanism 3B. The first heat dissipation mechanism 3A is provided in a first extension portion 7A of the heat transfer member 2. The second heat dissipation mechanism 3B is provided in a second extension portion 7B of the heat transfer member 2. The electronic device 100 can cool both extension portions 7A and 7B of the heat transfer member 2 by the first heat dissipation mechanism 3A and the second heat dissipation mechanism 3B, and therefore can efficiently cool the heat transfer member 2.

[0057] The heat transfer member 2 is a heat transport member in which a working fluid is sealed in an enclosed space 2C formed between the main plates 2A and 2B. Therefore, the flow of the working fluid in the enclosed space 2C can increase the efficiency of heat transfer between the extension parts 7A and 7B and the main part 6. Therefore, the CPU 4 can be cooled efficiently.

[0058] The specific configuration of the present invention is not limited to the above-mentioned embodiment, and includes designs and the like within the scope of the gist of the present invention. The configurations described in the above-mentioned embodiment can be combined in any combination. 4, in the electronic device 100 of the embodiment, the air blowing mechanisms 12, 22 emit the gases G1, G2 in a direction facing the heat sinks 11, 21, but the direction in which the gases G1, G2 are emitted is not particularly limited. For example, the air blowing mechanisms 12, 22 may emit the gases G1, G2 parallel to the heat sinks 11, 21. The air blowing mechanisms 12, 22 may emit the gases G1, G2 in a direction inclined to the heat sinks 11, 21 (a direction intersecting the heat sinks 11, 21).

[0059] 3, the electronic device 100 of the embodiment includes two heat dissipation mechanisms 3, but the number of heat dissipation mechanisms is not particularly limited. The number of heat dissipation mechanisms may be one or more (any number equal to or greater than two). That is, the number of heat dissipation mechanisms may be one or more. As shown in FIG. 4, the heat transfer member 2 is preferably a heat transport member in which a working fluid is sealed in an enclosed space 2C, but the heat transfer member may also be a plate body with a solid structure. The electronic device is not limited to a notebook PC, but may be a tablet terminal, a smartphone, a desktop PC, or the like. [Explanation of symbols]

[0060] 2...heat transfer member, 2a...first main surface, 2b...second main surface, 2A...main board, 2B...main board, 2C...sealed space, 3...heat dissipation mechanism, 3A...first heat dissipation mechanism (heat dissipation mechanism), 3B...second heat dissipation mechanism (heat dissipation mechanism), 4...CPU (heat generating element), 6...main part, 6a...side edge (one side edge), 6b...side edge (other side edge), 7A...first extension part, 7B...second extension part, 10...first cooling device, 11...first heat dissipation plate, 12...first ventilation mechanism, 20...second cooling device, 21...second heat dissipation plate, 22...second ventilation mechanism, 100...electronic device, 102...second housing (housing), G1, G2...gas

Claims

1. A housing and A heating element provided within the housing; A heat transfer member that is in contact with the heat generating element so as to be capable of transferring heat thereto; one or more heat dissipation mechanisms for cooling the heat transfer member; Equipped with The heat dissipation mechanism includes: a first cooling device that cools a first main surface of the heat transfer member; a second cooling device that cools a second main surface of the heat transfer member opposite to the first main surface; Equipped with the first cooling device includes a first heat dissipation plate in contact with the first main surface so as to be capable of transferring heat therethrough, and a first blowing mechanism that causes a gas to flow so as to contact the first heat dissipation plate, The second cooling device includes a second heat dissipation plate in contact with the second main surface so as to be capable of transferring heat therethrough, and a second blowing mechanism that causes a gas to flow so as to contact the second heat dissipation plate. electronic equipment.

2. the first blowing mechanism blows the gas in a direction facing the first heat dissipation plate to bring the gas into contact with the first heat dissipation plate; the second blowing mechanism blows the gas in a direction facing the second heat dissipation plate, thereby bringing the gas into contact with the second heat dissipation plate.

2. The electronic device according to claim 1.

3. the plurality of heat dissipation mechanisms include a first heat dissipation mechanism and a second heat dissipation mechanism; the heat transfer member has a main portion in contact with the heat generating element so as to be capable of transferring heat therethrough, a first extension portion extending outward from one side edge of the main portion, and a second extension portion extending outward from the other side edge of the main portion; the first heat dissipation mechanism is provided in the first extension portion, The second heat dissipation mechanism is provided in the second extension portion.

2. The electronic device according to claim 1.

4. The heat transfer member is a heat transport member in which a working fluid is sealed in an enclosed space formed between a pair of opposing main plates.

2. The electronic device according to claim 1.

Images