Electronic component housing package and electronic module

Abstract

To provide an electronic component housing package and an electronic module enabling an increase in electrode terminals.SOLUTION: An electronic component housing package includes a base, a frame, and a wiring conductor. The base has a first region. The frame is positioned on the base and surrounds the first region. The frame has a first frame side surface. The wiring conductor is positioned on a surface of the frame. The frame has a first projecting portion projecting outward from the first frame side surface in a first direction. The wiring conductor has a first conductor and a second conductor. The second conductor is spaced outward from the first conductor in the first direction. The first conductor and the second conductor are positioned on the first projecting portion and on the same plane.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to packages for storing electronic components and electronic modules. [Background technology]

[0002] A conventional package for housing an element is described in, for example, Patent Document 1. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2015 / 012405 Summary of the Invention [Means for solving the problem]

[0004] In one embodiment (1), an electronic component storage package includes a base body, a frame body, and a wiring conductor. The base body has a first region. The frame body is located on the base body and surrounds the first region. The frame body has a first frame body side surface. The wiring conductor is located on a surface of the frame body. The frame body has a first protrusion that protrudes outward in a first direction from the first frame body side surface. The wiring conductor has a first conductor and a second conductor. The second conductor is located outwardly from the first conductor in the first direction with a space therebetween. The first conductor and the second conductor are located on the first protrusion and are located on the same plane.

[0005] (2) In the electronic component storage package described in (1) above, when a direction along a side surface of the first frame is defined as a second direction, the first conductors and the second conductors are positioned side by side along the second direction.

[0006] (3) In the electronic component storage package described in (1) or (2) above, the frame has a second frame side surface and a second protrusion. The second frame side surface faces the first frame side surface in the first direction. The second protrusion protrudes outward in the first direction from the second frame side surface. The wiring conductor has a third conductor and a fourth conductor. The fourth conductor is located with a space between it and the third conductor in the first direction. The third conductor and the fourth conductor are located on the second protrusion and are located on the same plane.

[0007] (4) In the electronic component housing package according to any one of (1) to (3) above, the base overlaps with the first protruding portion in plan view.

[0008] (5) In the electronic component storage package described in (4) above, the base has a first base side surface located along the first frame side surface, the first protrusion has a first protrusion side surface located along the first frame side surface, and a distance L1 in the first direction from the first frame side surface to the first base side surface is equal to or greater than half of a distance L2 in the first direction from the first frame side surface to the first protrusion side surface.

[0009] (6) In the electronic component housing package according to (4) or (5) above, the base overlaps the first conductor in plan view.

[0010] (7) In the electronic component housing package as described above in (6), the base is positioned with a gap between it and the second conductor in a plan view.

[0011] (8) In the electronic component storage package described in any one of (1) to (7) above, the frame is made of a ceramic material.

[0012] (9) In the electronic component storage package according to any one of (1) to (8) above, the base is made of a metal material.

[0013] (10) In the electronic component storage package described in any one of (1) to (9) above, the frame has a first top surface. The first protrusion has a second top surface. The first conductor and the second conductor are located on the second top surface. The first top surface is flush with the second top surface.

[0014] (11) In the package for storing electronic components as described in (10) above, the first top surface has a bonding area to which a lid or a seal ring is bonded. The bonding area is located apart from the first conductor and the second conductor.

[0015] (12) In the electronic component storage package described in (11) above, the first protrusion has a first protrusion side surface located along the first frame side surface, and a distance D1 in the first direction between the bonding region and the first conductor is greater than a distance D2 in the first direction between the first protrusion side surface and the second conductor.

[0016] (13) The electronic component storage package according to any one of (1) to (12) above further includes a light-transmitting member bonded to a base. The base has a through-hole penetrating the base in the first region. The light-transmitting member is positioned so as to overlap the through-hole.

[0017] (14) The electronic component storage package according to any one of (1) to (13) above further includes a first connector joined to the base. The first connector has at least two wiring terminals. The first connector is located on the first protrusion. The wiring terminals are electrically connected to the first conductor and the second conductor.

[0018] (15) An electronic module according to one embodiment includes an electronic component, a lid, and the electronic component storage package according to any one of (1) to (14). The electronic component is located on the first region. The lid is located on the frame. [Brief description of the drawings]

[0019] [Figure 1] 1 is a perspective view of an electronic component storage package according to an embodiment; [Diagram 2] 1 is a plan view of an electronic component storage package according to an embodiment, as viewed from above; [Diagram 3] 1 is a plan view of an electronic component storage package according to an embodiment, viewed from the bottom; [Figure 4] 4 is a cross-sectional view of the electronic component storage package shown in FIG. 2 taken along line IV-IV. [Diagram 5] 1 is a perspective view of an electronic component storage package according to one embodiment with a connector connected thereto; [Figure 6] FIG. 13 is a perspective view of an electronic component storage package according to another embodiment. [Figure 7] FIG. 2 is an exploded perspective view of an electronic module according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Conventionally, element housing packages such as that described in Patent Document 1 have been known, but in recent years, there has been a demand for an increase in the number of electrode terminals due to an increase in the number of electronic components housed in element housing packages. In addition to the increase in electrode terminals, there is also a demand for smaller and thinner element housing packages.

[0021] <Configuration of electronic component storage package> Hereinafter, some exemplary embodiments will be described with reference to the drawings. Note that, although any direction of the electronic component storage package may be regarded as upward or downward, for convenience, a Cartesian coordinate system xyz is defined, and the positive side of the z direction is regarded as upward. In addition, in this disclosure, a plan view is a concept including a planar perspective view.

[0022] As shown in FIGS. 1 to 5, in one embodiment, an electronic component storage package 100 includes a base body 1, a frame body 2, and a wiring conductor 3. The base body 1 includes a frame 2 and a wiring conductor 3. As shown in FIG.

[0023] The base 1 has a first region 1r. An electronic component 9, which will be described later, may be mounted directly or indirectly on the first region 1r. The base 1 is, for example, rectangular in plan view, with dimensions of 5 mm×10 mm to 25 mm×50 mm and a thickness of 0.5 mm to 20 mm. The base 1 may be rectangular with rounded or cut-out corners. With this configuration, the stress acting on the corners of the base 1 can be reduced.

[0024] Examples of the material of the substrate 1 include metal materials such as copper, iron, tungsten, molybdenum, nickel, and cobalt, or alloys containing these metal materials. In this case, the substrate 1 may be a single metal plate or a laminate of multiple metal plates. When the metal material constituting the substrate 1 is the above-mentioned metal material, a plating layer of nickel, gold, or the like may be formed on the surface of the substrate 1 by electroplating or electroless plating in order to reduce oxidation corrosion. The substrate 1 being made of a metal material as used herein may be substantially made of a metal material, and may include, for example, a nonmetallic material that is unavoidable in the manufacturing process.

[0025] The material of the base 1 is an insulating material, and may be, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0026] The frame 2 is located on the base 1 and surrounds the first region 1r. Examples of the material of the frame 2 that can be used include ceramic materials such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body, and dielectric materials such as a glass ceramic material or a glass epoxy material.

[0027] The material of the frame 2 may be, for example, a resin or a metal. The resin may be one selected from the group consisting of epoxy resin, phenol resin, unsaturated polyester resin, polytetrafluoroethylene resin, urea resin, melamine resin, and thermosetting polyimide resin. The surface of the frame 2 may be plated with a metal such as nickel or gold.

[0028] When the base body 1 and the frame body 2 are made of the same material (for example, when they are made of an aluminum nitride sintered body), the base body 1 and the frame body 2 may be formed as one unit. Furthermore, when the frame body 2 is a laminate, metal wiring may be located on the inner layer and surface of the frame body 2. The metal wiring may be electrically connected to the wiring conductor 3.

[0029] The frame body 2 has a first frame body side surface 21. The frame body 2 has a first protrusion 211 that protrudes outward from the first frame body side surface 21 in a first direction (in other words, the x direction in the drawings. Hereinafter, for convenience, the first direction will also be referred to as the x direction). In this disclosure, outward refers to a direction away from the first region 1r. The frame body 2 may have a first upper surface 2u, which will be described later. In one embodiment, the first protrusion 211 has a shape in which a portion of the first frame body side surface 21 protrudes outward. The first protruding portion 211 may have a shape in which the entire first frame side surface 21 protrudes. In this case, the first frame side surface 21 and a first protruding portion side surface 211s described below will coincide with each other.

[0030] As shown in Figs. 1, 2 and 4, the frame body 2 may have a stepped shape in a cross-sectional view and a shelf portion 24 protruding inward. In the present disclosure, "inward" refers to a direction approaching the first region 1r. When the frame body 2 has a shelf portion 24, one or more wiring conductors 3 may be located on the frame body 2. The wiring conductor 3 located on the shelf portion 24 may be electrically connected to the first conductor 31 and / or the second conductor 32. The wiring conductor 3 located on the shelf portion 24 may also be electrically connected to the electronic component 9 via a bonding wire or the like.

[0031] The wiring conductor 3 is located on the surface of the frame body 2. The wiring conductor 3 has a first conductor 31 and a second conductor 32. Examples of materials for the wiring conductor 3 include metal materials such as gold, silver, copper, nickel, tungsten, molybdenum, and manganese. The wiring conductor 3 may be formed by sintering a metal paste on the surface of the frame body 2, or may be formed using a thin film formation technique such as a vapor deposition method or a sputtering method.

[0032] 2, the first conductor 31 and the second conductor 32 may have a rectangular shape with a long side in the x-direction. Furthermore, the first conductor 31 and the second conductor 32 may have the same shape or different shapes. The first conductor 31 and the second conductor 32 may be electrically connected to an electronic component 9 described later. With this configuration, the electronic component 9 can be protected while being electrically connected to the inside and outside of the electronic component housing package 100. In addition, the electronic component 9 can be hermetically sealed.

[0033] The second conductor 32 is positioned outwardly from the first conductor 31 in the x direction. In other words, the second conductor 32 is closer to the first protrusion side surface 211s than the first conductor 31. In one embodiment, the second conductor 32 is positioned in a line with the first conductor 31 in the x direction as shown in Figs. 1 and 2, but this is not necessarily required. In other words, the second conductor 32 and the first conductor 31 only need to be positioned apart from each other in the x direction, and for example, the second conductor 32 and the first conductor 31 may be positioned offset from each other in the y direction.

[0034] The first conductor 31 and the second conductor 32 are located on the first protruding portion 211 and on the same plane. More specifically, the first conductor 31 and the second conductor 32 are located on a second upper surface 211u described later. By arranging the first conductor 31 and the second conductor 32 as described above, the electronic component storing package 100 can be made smaller and thinner, while the number of wiring conductors 3 located on the surface of the frame body 2 can be increased. This allows more electronic components 9 to be mounted on the electronic component storing package 100. In addition, the degree of freedom in wiring design can be improved when connecting to an external wiring board or electronic circuit. In the x direction, beyond the second conductor 32, the wiring conductor 3 does not have to be located on the first protrusion 211. In other words, the wiring conductor 3 does not have to be located between the second conductor 32 and the first protrusion side surface 211s. The first conductor 31 and / or the second conductor 32 may be used as a power terminal, a signal terminal, or a ground terminal.

[0035] When the direction along the first frame side surface 21 is defined as the second direction (in other words, the y direction in the drawings. Hereinafter, for convenience, the second direction will also be referred to as the y direction), the first conductors 31 and the second conductors 32 may be positioned in a line along the y direction. With this configuration, it is possible to increase the number of wiring conductors 3 positioned on the surface of the frame 2 without increasing the number of conductors positioned in the x direction. In the above case, all of the multiple first conductors 31 may have the same shape, or some of the multiple first conductors 31 may have a different shape from the other first conductors 31. Furthermore, all of the multiple second conductors 32 may have the same shape, or some of the multiple second conductors 32 may have a different shape from the other second conductors 32. Furthermore, either of the multiple first conductors 31 or the multiple second conductors 32 may be used as a signal terminal.

[0036] 2, in one embodiment, the spacing between the multiple first conductors 31 and the multiple second conductors 32 (spacing in the y direction in the drawing) is constant, but the spacing between the multiple first conductors 31 and / or the multiple second conductors 32 may be different. For example, the first conductors 31 and / or the second conductors 32 may be positioned with an appropriate shape and spacing for each connecting member (described later) connected to each of them.

[0037] Furthermore, one or more connection members, which will be described later, may be connected to the wiring conductor 3. More specifically, a plurality of connection members of one type or a plurality of types of connection members may be connected to the wiring conductor 3. The same connection member may be connected to all of the plurality of first conductors 31, or a flexible printed circuit (FPC) may be connected to some of the plurality of first conductors 31, and a connector may be connected to the remaining first conductors 31. For example, a connector may be connected to the first conductor 31, and a flexible printed circuit may be connected to the second conductor 32. Also, for example, different types of connectors may be connected to the first conductor 31 and the second conductor 32, respectively. For example, all of the first conductors 31 may be used as signal terminals, and all of the second conductors 32 may be used as ground terminals and / or power supply terminals. With this configuration, the first conductors 31 that transmit signals can be located closer to the first region 1r in a plan view than the second conductors 32, thereby reducing the transmission distance of signals with the electronic component 9. Therefore, when transmitting high-frequency signals, signal loss between the electronic component 9 and the first conductors 31 can be reduced.

[0038] The frame 2 may include a second frame side surface 22 and a second protruding portion 222. The second frame side surface 22 may face the first frame side surface 21 in the x direction. The second protruding portion 222 protrudes outward from the second frame side surface 22 in the x direction.

[0039] The wiring conductor 3 may have a third conductor 33 and a fourth conductor 34. The fourth conductor 34 may be located at a distance from the third conductor 33 in the x direction. The third conductor 33 and the fourth conductor 34 may be located on the second protruding portion 222 and on the same plane. With this configuration, the wiring conductor 3 can be formed on the opposite side of the first protruding portion 211 in the x direction, so that the number of wiring conductors 3 located on the surface of the frame body 2 can be increased. Therefore, more electronic components 9 can be mounted on the electronic component housing package 100. In addition, the degree of freedom of wiring design can be improved when connecting to an external wiring board or electronic circuit. More specifically, the third conductors 33 and the fourth conductors 34 are located on a third upper surface 222u described later. Note that a plurality of the third conductors 33 and the fourth conductors 34 may be arranged side by side along the y direction. 2 and other figures, the third conductor 33 and the fourth conductor 34 may have a rectangular shape with a long side in the x-direction. Furthermore, the shapes of the third conductor 33 and the fourth conductor 34 may be the same or different.

[0040] 2, in a plan view, the base 1 may overlap with the first protrusion 211. In other words, at least a portion of the first protrusion 211 is supported by the base 1. With this configuration, it is possible to reduce the possibility that the frame 2 will be deformed or damaged due to stress being applied to the first protrusion 211 when a connecting member such as a lead terminal, a flexible printed circuit (FPC), or a connector is joined to the first conductor 31 and / or the second conductor 32.

[0041] As shown in FIG. 2, the base 1 may have a first base side surface 11s located along the first frame side surface 21. The first protrusion 211 may have a first protrusion side surface 211s located along the first frame side surface 21. In this case, the distance L1 in the first direction from the first frame side surface 21 to the first base side surface 11s may be half or more of the distance L2 in the first direction from the first frame side surface 21 to the first protrusion side surface 211s. With this configuration, even if stress is applied to the end side of the first protrusion 211 (in other words, the first protrusion side surface 211s side) when the connecting member is joined, the first protrusion 211 is efficiently supported by the base 1, so that the possibility of the first protrusion 211 and the frame 2 being deformed can be reduced. In addition, by joining the base 1 and the part of the lower surface of the first protrusion 211 that overlaps with the base 1 with a joining material, the possibility of the first protrusion 211 being deformed can be further reduced. The base 1 may have a second base side surface 12s located along the second frame side surface 22. The second protrusion 222 may have a second protrusion side surface 222s located along the second frame side surface 22.

[0042] 2 and 3, in plan view, the base 1 may overlap the first conductor 31. This configuration can reduce the possibility that the first protrusion 211 will be deformed due to stress applied when a connection member is connected onto the first conductor 31. Note that in Fig. 3, the first conductor 31 to the fourth conductor 34 are each illustrated in a see-through manner. As shown in FIG. 3, the base 1 may be spaced apart from the second conductor 32 in a plan view. In other words, the base 1 may not overlap the second conductor 32 in a plan view. More specifically, the base 1 may overlap only the first conductor 31 in a plan view. This configuration allows the base 1 to be made smaller, and therefore the electronic component housing package 100 can be made smaller. In addition, the above configuration exposes a part of the lower surface of the first protruding portion 211, and therefore the wiring conductor 3 can be formed also on the lower surface of the first protruding portion 211.

[0043] The frame 2 may be made of a ceramic material. It is possible to easily form the wiring conductors 3 and metal wiring on the surface and inside of the frame 2. In addition, the electronic component 9 can be sealed airtight. The base 1 may be made of a metal material. With this configuration, heat generated by the electronic components 9 mounted in the first region 1r can be efficiently dissipated to the outside of the package 100 for storing electronic components.

[0044] As shown in FIG. 2, the frame 2 may have a first upper surface 2u. The first protrusion 211 may have a second upper surface 211u. The first conductor 31 and the second conductor 32 are located on the second upper surface 211u. The first upper surface 2u may be flush with the second upper surface 211u. This configuration can reduce the dimension of the electronic component storage package 100 in the z direction. Therefore, the electronic module 10 can be made smaller. The first upper surface 2u can be defined as a surface on which a bonding region 26r described later is located. In other words, the surface on which the cover 8 or the seal ring 6 is bonded to the frame 2 can be defined as the first upper surface 2u. In FIG. 2, the seal ring 6 is omitted.

[0045] 2, the first upper surface 2u may have a bonding region 26r to which the lid 8 or the seal ring 6 is bonded. In this case, the bonding region 26r may be located apart from the first conductor 31 and the second conductor 32. With this configuration, when the seal ring 6 or the lid 8 is bonded to the first upper surface 2u via a bonding material, the bonding material may come into contact with the first conductor 31 and / or the second conductor 32, reducing the possibility that the wiring conductor 3 will be short-circuited.

[0046] As shown in FIG. 2, the first protrusion 211 may have a first protrusion side surface 211s located along the first frame side surface 21. In this case, the distance D1 in the x direction between the bonding region 26r and the first conductor 31 may be greater than the distance D2 in the x direction between the first protrusion side surface 211s and the second conductor 32. With this configuration, when the seal ring 6 or the lid 8 is bonded to the first upper surface 2u via a bonding material, the bonding material comes into contact with the first conductor 31 and / or the second conductor 32, which can effectively reduce the possibility of short-circuiting the wiring conductor 3, and can increase the number of wiring conductors 3 located on the surface of the frame 2. In addition, the dimension of the first protrusion 211 in the x direction can be reduced, so that the electronic component storage package 100 can be made smaller.

[0047] 3, the electronic component storing package 100 may further include a light-transmitting member 5 bonded to the base 1. The base 1 may have a through hole 1o penetrating the base 1 in the first region 1r. In this case, the light-transmitting member 5 may be positioned so as to overlap the through hole 1o. With this configuration, when the electronic component 9 is an optical semiconductor element such as a semiconductor laser (LD) or a photodiode (PD), or an optical sensor, light can be transmitted and received between the electronic component 9 stored in the electronic component storing package 100 and the inside and outside of the electronic component storing package 100.

[0048] The shape of the through-hole 1o may be rectangular, circular, or substantially rectangular with rounded corners in a plan view. The base 1 may have a plurality of through-holes 1o. More specifically, the light-transmitting member 5 may be located inside the through-hole 1o. With this configuration, the dimension of the electronic component storing package 100 in the z direction can be made smaller than when the light-transmitting member 5 is bonded to the lower surface of the base 1. Therefore, the electronic component storing package 100 and the electronic module 10 can be made smaller. Furthermore, the base 1 may have a step portion 25 in which a part of the through hole 1o protrudes into the through hole 1o. With this configuration, the light-transmitting member 5 can be joined to the step portion 25. Therefore, compared to a case where the step portion 25 does not exist, it is possible to more easily join the light-transmitting member 5 into the through hole 1o.

[0049] A connection member may be connected to the wiring conductor 3. The connection member may be, for example, a lead terminal, a flexible board, a printed circuit board (PCB) on which an electronic circuit is formed, or a connector. Furthermore, a flexible board or a printed circuit board on which an electronic circuit is formed may be connected to the tip of the connection member.

[0050] More specifically, the electronic component storing package 100 may further include a first connector 71 as shown in Fig. 5. The first connector 71 may be located on the first protrusion 211. The first connector 71 may have at least two wiring terminals. In this case, the wiring terminals may be electrically connected to the first conductor 31 and the second conductor 32. This configuration makes it easy to connect a plurality of wirings to the electronic component storing package 100.

[0051] More specifically, the first connector 71 may have a first socket 711 and a first plug 712. In this case, the first socket 711 may be located on the first protrusion 211. This configuration makes it possible to easily attach and detach the first connector 71. Furthermore, when a defect occurs in the electronic module 10 or the first connector 71, each of them can be easily replaced. The first plug 712 may have one or more first wiring cables 7121.

[0052] As shown in FIG. 5, the electronic component storing package 100 may further include a second connector 72. The second connector 72 may be located on the second protruding portion 222. The second connector 72 may have at least two wiring terminals. In this case, the wiring terminals may be electrically connected to the third conductor 33 and the fourth conductor 34. More specifically, the second connector 72 may have a second socket 721 and a second plug 722. In this case, the second socket 721 may be located on the second protruding portion 222. The second plug 722 may have one or more second wiring cables 7221.

[0053] (Other embodiments) An electronic component storage package 100 according to an embodiment will be described with reference to Fig. 6. Only parts of the configuration of the other embodiments that differ from the configuration of the above-mentioned embodiment will be described, and the other configurations will be denoted by the same reference numerals as those of the respective embodiments and will not be described.

[0054] 6, a part of the base 1 and the frame 2 are integrated. More specifically, a metal plate is fitted into a part of the base 1. With this configuration, the location where the electronic component 9 is mounted is made of the metal body 13 with high heat dissipation properties, and this makes it possible to improve the heat dissipation properties of the electronic component housing package 100 while facilitating the manufacture of the electronic component housing package 100. In this case, the part of the base 1 other than the metal body 13 (in other words, the ceramic part of the base 1) and the frame 2 may both be made of a ceramic material.

[0055] As in another embodiment shown in Fig. 6, the light-transmitting member 5 may be joined to a portion of the base 1 other than the metal body 13. That is, the ceramic portion of the base 1 may have the through-hole 1o. The light-transmitting member 5 may be joined to the metal body 13. That is, the metal body 13 may have the through-hole 1o. Furthermore, both the ceramic portion of the base 1 and the metal body 13 may have the through-hole 1o.

[0056] <Electronic module configuration> As shown in FIG. 7, an electronic module 10 according to one embodiment includes an electronic component 9, a lid 8, and a package 100 for storing an electronic component.

[0057] The electronic component 9 is located on the first region 1r. The electronic component 9 may be, for example, a semiconductor laser (LD) or an optical semiconductor element such as a photodiode (PD), a semiconductor integrated circuit element, a sensor element such as an optical sensor, a power amplifier IC, etc. The electronic component 9 may be formed of a semiconductor material such as gallium arsenide or gallium nitride.

[0058] The electronic component 9 may be located directly on the first region 1r, or may be located indirectly on the first region 1r via, for example, a submount. The number of electronic components 9 is not limited to one, and may be multiple. For example, the electronic component 9 may be a light receiving element and a light emitting element. The electronic module 10 may also have optical components such as a collimator lens, a Dylonic filter, a mirror, etc. The optical components may be located on the first region 1r or on the shelf portion 24.

[0059] The lid body 8 is located on the frame body 2. The lid body 8 protects the electronic components 9 together with the frame body 2. Examples of materials for the lid body 8 include metal materials, alloys in which a plurality of metal materials are combined, and ceramics. Note that a light-transmitting member 5 may be attached to the lid body 8 side.

[0060] The electronic module 10 may further include a seal ring 6 located between the cover 8 and the frame 2. The seal ring 6 is located on the frame 2 and surrounds the electronic components 9 in a plan view. When the seal ring 6 is not provided on the frame 2, the cover 8 may be bonded to the frame 2 (i.e., onto the first upper surface 2u) via an adhesive such as solder, brazing material, glass, or a resin adhesive.

[0061] It should be noted that various combinations of the embodiments and modifications are not limited to the above-described embodiments, and combinations of the embodiments and modifications may also be possible. [Explanation of symbols]

[0062] 1 Base 1r 1st area 1o through hole 11s 1st base side 12s 2nd base side 13 Metal body 2 frame 2u 1st top surface 21 1st frame side 211 1st protrusion 211u 2nd top surface 211s 1st protrusion side 22 Second frame side 222 Second protrusion 222u 3rd top surface 222s 2nd protrusion side 24 Shelf 25 Step 26r joint area 3. Wiring conductor 31 First Conductor 32 Second Conductor 33 Third Conductor 34 4th Conductor 5. Translucent material 6 Seal ring 71 First Connector 711 1st Socket 712 First plug 7121 First distribution cable 72 Second Connector 721 Second Socket 722 2nd plug 7221 Second distribution cable 8 Lid 9. Electronic Components 10 Electronic Module 100 Electronic component storage packages

Claims

1. a substrate having a first region; a frame located on the base, surrounding the first region, and having a first frame side surface; A wiring conductor located on a surface of the frame body, the frame has a first protruding portion protruding outward in a first direction from the first frame side surface, the wiring conductor includes a first conductor and a second conductor positioned outwardly from the first conductor in the first direction, the first conductor and the second conductor are located on the first protruding portion and on the same plane.

2. When a direction along the side surface of the first frame is defined as a second direction, The electronic component housing package according to claim 1 , wherein a plurality of the first conductors and a plurality of the second conductors are positioned side by side along the second direction.

3. the frame includes a second frame side surface facing the first frame side surface in the first direction, and a second protruding portion protruding outward in the first direction from the second frame side surface, the wiring conductor includes a third conductor and a fourth conductor positioned with a space therebetween in the first direction, 2. The electronic component housing package according to claim 1, wherein the third conductor and the fourth conductor are located on the second protruding portion and on the same plane.

4. The electronic component storage package according to claim 1 , wherein the base overlaps the first protrusion in a plan view.

5. the base has a first base side surface located along the first frame side surface, the first protrusion has a first protrusion side surface located along the first frame side surface, 5. The electronic component storage package according to claim 4, wherein a distance L1 in the first direction from the first frame side surface to the first base side surface is equal to or greater than half a distance L2 in the first direction from the first frame side surface to the first protrusion side surface.

6. The electronic component housing package according to claim 4 , wherein the base overlaps the first conductor in a plan view.

7. 7. The electronic component housing package according to claim 6, wherein the base is positioned with a space between the base and the second conductor in a plan view.

8. 2. The electronic component housing package according to claim 1, wherein said frame is made of a ceramic material.

9. 9. The electronic component housing package according to claim 8, wherein the base is made of a metal material.

10. The frame has a first upper surface, the first protrusion has a second upper surface on which the first conductor and the second conductor are located; The electronic component storage package according to claim 1 , wherein the first top surface is flush with the second top surface.

11. the first upper surface has a joining area to which a lid or a seal ring is joined; The electronic component storage package according to claim 10 , wherein the bonding region is spaced apart from the first conductor and the second conductor.

12. the first protrusion has a first protrusion side surface located along the first frame side surface, 12 . The electronic component housing package according to claim 11 , wherein a distance D1 in the first direction between the joining region and the first conductor is greater than a distance D2 in the first direction between the first protruding portion side surface and the second conductor.

13. Further comprising a light-transmitting member bonded to the base, the base has a through hole penetrating the base in the first region, The electronic component housing package according to claim 1 , wherein the light-transmitting member is positioned so as to overlap the through hole.

14. a first connector having at least two wiring terminals and located on the first protrusion; 2. The electronic component housing package according to claim 1, wherein the wiring terminal is electrically connected to the first conductor and the second conductor.

15. an electronic component located on the first region; A lid body located on the frame body; An electronic module comprising: an electronic component storage package according to any one of claims 1 to 14.

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