Workpiece dividing method

Abstract

To provide a workpiece dividing method which can reduce man-hours and inspection cost required for inspection before and after processing.SOLUTION: A workpiece dividing method includes: a pre-processing inspection step 1001 of holding a workpiece in which a support member is fixed to a holding surface of an inspection device, imaging the workpiece by a first imaging unit or a second imaging unit arranged on a side closer to a support member side, and inspecting presence / absence of at least one of air bubbles or foreign matter mixed in between the support member and the workpiece, curls from the workpiece of the support member, wrinkles of the support member, and foreign matter attached to the support member; a division step 1002 of dividing the workpiece having been determined to be normal by the pre-processing inspection step 1001; and a post-processing inspection step 1003 of holding the workpiece after division on the holding surface of the same inspection device, and inspecting a state of chipping of one surface and the other surface of the workpiece from the image of the workpiece imaged by each of the first imaging unit and the second imaging unit.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for dividing a workpiece. [Background technology]

[0002] There is known an inspection device that checks the processing quality after processing a workpiece (for example, see Patent Document 1). On the other hand, it is also known that before processing, whether a support member fixed to one side of the workpiece is properly fixed is checked by another inspection device or by an operator visually. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-032588 Summary of the Invention [Problem to be solved by the invention]

[0004] When separate inspection devices are used before and after processing, there is a problem that the labor required for checking (inspection) increases due to the increase in labor required for carrying the workpiece in and out of the two inspection devices, and the inspection cost also increases due to the increase in the cost of the devices. Also, even when an operator visually checks before inspection without using an inspection device, there is a problem that the labor required for checking (inspection) increases because the operator checks visually, and the inspection cost also increases due to the increase in labor costs.

[0005] The present invention has been made in consideration of the above problems, and an object of the present invention is to provide a method for dividing a workpiece that can reduce the number of steps and inspection costs required for inspection before and after processing. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the method of dividing a workpiece of the present invention is a method of dividing a workpiece having a support member fixed to one surface thereof, the method comprising: an inspection device having a holding table, at least a part of whose holding surface is made of a transparent material; a first imaging unit installed above the holding surface; and a second imaging unit installed below the holding surface; an image of the support member is captured by one of the first imaging unit and the second imaging unit, which is located on the support member side; and an image of the support member is captured by one of the first imaging unit and the second imaging unit, which is located on the support member side, to detect air bubbles or foreign matter mixed in between the support member and the workpiece. the presence or absence of at least one of the following: a pre-processing inspection step for inspecting the workpiece for any abnormality, curling of the support member from the workpiece, wrinkles on the support member, and foreign matter attached to the support member; a division step for dividing a workpiece determined to be normal in the pre-processing inspection step; and a post-processing inspection step for holding any side of the workpiece on the holding surface of the inspection device after the division step, and inspecting the state of chipping between one side and the other side of the workpiece from an image of the workpiece captured by the first imaging unit and an image of the workpiece captured through the holding surface by the second imaging unit.

[0007] In the pre-processing inspection step, the side of the support member may be held on the holding surface, and an image of the support member may be captured by the second imaging unit via the holding surface.

[0008] The pre-processing inspection step may include inspecting the presence or absence of at least one of foreign matter attached to the workpiece and chips formed in the workpiece using the first imaging unit or the second imaging unit arranged next to the workpiece.

[0009] The post-machining inspection step may inspect at least one of the presence or absence of foreign matter adhering to the workpiece and the presence or absence of foreign matter adhering to the support member. Effect of the Invention

[0010] The present invention uses the same inspection equipment both before and after processing, and is set up to inspect, before processing, for the presence or absence of at least one of the following: foreign matter or air bubbles between the support member and the workpiece, wrinkles on the support member, curling of the support member away from the workpiece, and foreign matter attached to the support member, and to inspect the chipping condition on both sides of the workpiece after processing, thereby reducing the labor hours and inspection costs required for inspection before and after processing compared to the conventional method. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a flowchart showing a processing procedure of the workpiece dividing method according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing an example of a workpiece to be divided by the workpiece dividing method according to the first embodiment. [Diagram 3] FIG. 3 is a perspective view showing an example of a workpiece to be divided by the workpiece dividing method according to the first embodiment. [Figure 4] FIG. 4 is a perspective view showing a configuration example of an inspection device for carrying out the workpiece dividing method according to the first embodiment. [Diagram 5] FIG. 5 is a perspective view showing a part of the inspection apparatus of FIG. [Figure 6] FIG. 6 is a perspective view showing a part of the inspection device of FIG. [Figure 7] FIG. 7 is a diagram showing an example of an image captured by the imaging unit of the inspection device of FIG. [Figure 8] FIG. 8 is a diagram showing an example of an image captured by the imaging unit of the inspection device of FIG. [Figure 9] FIG. 9 is a diagram showing an example of an image captured by the imaging unit of the inspection device of FIG. [Figure 10] FIG. 10 is a table showing an example of the inspection item data stored in the inspection device of FIG. [Figure 11] FIG. 11 is a table showing an example of the inspection item data stored in the inspection device of FIG. [Figure 12]FIG. 12 is a perspective view showing a configuration example of a processing device for performing the workpiece dividing method according to the first embodiment. [Figure 13] FIG. 13 is a perspective view showing a configuration example of an inspection and processing device that performs the workpiece dividing method according to the second embodiment. [Figure 14] FIG. 14 is a perspective view showing a configuration example of a processing device for carrying out the workpiece dividing method according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0013] [Embodiment 1] A workpiece dividing method according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a flowchart showing the processing procedure of the workpiece dividing method according to the first embodiment. As shown in Fig. 1, the workpiece dividing method according to the first embodiment includes a pre-machining inspection step 1001, a dividing step 1002, and a post-machining inspection step 1003.

[0014] 2 and 3 are both perspective views showing an example of a workpiece 300 to be processed by the workpiece dividing method according to embodiment 1. Fig. 2 shows the workpiece 300 before division in the dividing step 1002, i.e., the workpiece 300 to be inspected in the pre-machining inspection step 1001. Fig. 3 shows the workpiece 300 after division in the dividing step 1002, i.e., the workpiece 300 to be inspected in the post-machining inspection step 1003.

[0015] The workpiece 300 to be processed by the workpiece dividing method according to the first embodiment is, as shown in Figs. 2 and 3, a disk-shaped semiconductor wafer or an optical device wafer, for example, made of silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, or the like. Before being divided in the dividing step 1002, the workpiece 300 has a flat surface 301, as shown in Fig. 2, and chip-shaped devices 303 are formed in each area partitioned by a plurality of dividing lines 302 that intersect with each other. The workpiece 300 is divided in the dividing step 1002 to form dividing grooves 309 along the dividing lines 302, and divided to produce chips of a plurality of devices 303. In the present invention, the workpiece 300 may be a rectangular package substrate having a plurality of devices sealed with resin, a ceramic plate, a glass plate, or the like.

[0016] The workpiece 300 has a support member 305 fixed to a back surface 304, which is one surface of the workpiece 300, and an annular frame 306 attached to the outer edge of the support member 305. That is, the workpiece 300 is fixed to an opening of the annular frame 306 via the support member 305. Here, in the first embodiment, the support member 305 is an adhesive tape having a base layer and a glue layer (adhesive layer), and the glue layer (adhesive layer) side is attached to the back surface 304 of the workpiece 300 and the annular frame 306.

[0017] Fig. 4 is a perspective view showing a configuration example of an inspection device 100 that performs the workpiece dividing method according to the first embodiment. Figs. 5 and 6 are both perspective views showing a part of the inspection device 100 of Fig. 4. Fig. 5 shows a part including a holding table 110 of the inspection device 100, and Fig. 6 shows a part including an imaging unit 120 of the inspection device 100. As shown in Fig. 4, the inspection device 100 includes the holding table 110, the imaging unit 120, a moving unit 130, a display unit 140, and a control unit 150. The inspection device 100 performs a pre-machining inspection step 1001 and a post-machining inspection step 1003 of the workpiece dividing method according to the first embodiment by itself.

[0018] As shown in Fig. 4 and Fig. 5, the holding table 110 has a disk-shaped transparent member 111 and an annular frame 112 that holds the outer edge of the transparent member 111. The transparent member 111 is made of a transparent material such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, magnesium fluoride, or the like, and is formed in a disk shape with a constant thickness. The outer diameter of the transparent member 111 is larger than the outer diameter of the workpiece 300 and smaller than the inner diameter (opening diameter) of the annular frame 306. The outer edge of the transparent member 111 is supported by the frame 112 and is exposed above and below the holding table 110.

[0019] The upper surface of the transparent member 111 serves as a holding surface 113 on which the workpiece 300 is placed and which holds one of the surfaces of the placed workpiece 300. In this manner, at least a part of the holding surface 113 of the holding table 110 is formed of the transparent member 111. The transparent member 111 is formed so that the holding surface 113 is flat and parallel to the XY plane, which is a horizontal plane. In the first embodiment, the holding surface 113 of the transparent member 111 holds the back surface 304 side of the workpiece 300 via a support member 305.

[0020] The inspection device 100 inspects the surface of the workpiece 300 held on the holding surface 113 of the holding table 110 by imaging the surface on the holding surface 113 side with the second imaging unit 122 of the imaging unit 120 described later through the holding surface 113. For this reason, it is preferable that the holding table 110 has a larger area of ​​the holding surface 113 formed of the transparent member 111, because the area in which the surface of the workpiece 300 held on the holding surface 113 can be inspected increases. Note that, when the area to be inspected (or to be inspected) of the surface of the workpiece 300 held on the holding surface 113 on the holding surface 113 side is determined in the pre-machining inspection step 1001 and the post-machining inspection step 1003, it is sufficient that at least a part of the area of ​​the holding surface 113 including the area of ​​the holding surface 113 corresponding to the area to be inspected of the surface of the workpiece 300 on the holding surface 113 side is formed of the transparent member 111, rather than the entire surface of the holding surface 113.

[0021] The frame 112 is made of a metal such as stainless steel. The frame 112 is formed so that the inner diameter is equal to the outer diameter of the transparent member 111, and is attached to the outer edge of the transparent member 111. The upper surface 114 of the frame 112 is formed flat along the horizontal direction and is disposed on the same plane as the holding surface 113. The annular frame 306 attached to the workpiece 300 is placed on the upper surface 114 of the frame 112, and holds the placed annular frame 306. In the first embodiment, the upper surface 114 of the frame 112 holds the annular frame 306 attached to the workpiece 300 via the support member 305. Both ends of the frame 112 are supported by the X-axis moving unit 131 of the moving unit 130 so as to be movable in the X-axis direction parallel to the horizontal direction, and thus the holding table 110 is provided so as to be movable in the X-axis direction by the X-axis moving unit 131 of the moving unit 130.

[0022] The frame 112 has a suction groove (not shown) that is recessed from the upper surface 114 and has a circular planar shape on the inner edge of the upper surface 114, and is connected to a suction source (not shown) through a suction path (not shown) that is formed penetrating the inside of the suction groove. The holding table 110 holds the workpiece 300 and the annular frame 306 by suction on the holding surface 113 and upper surface 114 via the support member 305 as a suction source (not shown) sucks the suction groove through the suction path.

[0023] 6, the imaging unit 120 includes a first imaging unit 121, a second imaging unit 122, and a unit body 123. The first imaging unit 121 is provided at the upper end of the unit body 123 formed in a column shape whose longitudinal direction is parallel to the vertical direction and parallel to the Z-axis direction perpendicular to the XY plane, and is installed above the holding surface 113 of the holding table 110, and images the surface side of the workpiece 300 held on the holding table 110 facing upward. The second imaging unit 122 is provided at the lower end of the unit body 123, and is installed below the holding surface 113 of the holding table 110, and images the surface side of the workpiece 300 held on the holding table 110 facing downward.

[0024] The first imaging unit 121 and the second imaging unit 122 are provided so as to be movable in the Z-axis direction by separate Z-axis direction moving units 133 of the moving unit 130. The unit body 123 is provided so as to be movable in the Y-axis direction, which is parallel to the horizontal direction and perpendicular to the X-axis direction, by a Y-axis direction moving unit 132 of the moving unit 130, and the first imaging unit 121 and the second imaging unit 122 are integrally movable in the Y-axis direction via the unit body 123.

[0025] The first imaging unit 121 and the second imaging unit 122 each include an imaging element that images the upward and downward surfaces of the workpiece 300 held on the holding table 110. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The first imaging unit 121 and the second imaging unit 122 each image the upward and downward surfaces of the workpiece 300 held on the holding table 110, and output the obtained images to the control unit 150. In the first embodiment, the first imaging unit 121 and the second imaging unit 122 each image the front surface 301 side and the back surface 304 side of the workpiece 300 held on the holding table 110. In the following description of the present specification, the front surface 301 side of the workpiece 300 to which the support member 305 is not fixed will be referred to as the workpiece side or the workpiece 300 side, as appropriate, and the back surface 304 side of the workpiece 300 to which the support member 305 is fixed will be referred to as the support member side or the support member 305 side, as appropriate.

[0026] 7, 8, and 9 are diagrams showing images 401, 402, and 403, which are examples of images captured by the imaging unit 120 of the inspection device 100 shown in FIG. 4, respectively. The image 401 shown in FIG. 7 is obtained by imaging the front surface 301 side of the workpiece 300 before division in the division step 1002, using the first imaging unit 121. The image 402 shown in FIG. 8 is obtained by imaging the back surface 304 side of the workpiece 300 before division in the division step 1002, using the second imaging unit 122. The image 403 shown in FIG. 9 is obtained by imaging the front surface 301 side of the workpiece 300 after division in the division step 1002, using the first imaging unit 121.

[0027] As shown in Fig. 7, image 401 shows defective parts on the workpiece 300 side before division, including workpiece-side foreign matter 317, which is a foreign matter attached to the surface 301 of the workpiece 300 before division in the division step 1002, and workpiece-side chip 318, which is a chip formed on the surface 301 side of the workpiece 300. As shown in Fig. 8, image 402 shows defective parts on the support member 305 side before division, including contaminated foreign matter 311 and air bubbles 312 mixed between the back surface 304 of the workpiece 300 before division in the division step 1002 and the glue layer of the support member 305, wrinkles 313 of the support member 305, curls 314 of the support member 305, and support member-side foreign matter 315 attached to the base layer side of the support member 305. Image 402 also shows that when contaminated foreign matter 311 is present, air bubbles 312 are also formed around the contaminated foreign matter 311. The turned-up portion 314 of the support member 305 refers to a portion of the support member 305 that is turned up from the rear surface 304 of the workpiece 300 .

[0028] 9, the image 403 shows a defective portion on the workpiece 300 side after division, including the surface chipping 321, which is chipping generated on the surface 301 side of the workpiece 300 due to division in the division step 1002, and the workpiece-side foreign matter attached to the surface 301 of the workpiece 300. Although not shown, an image obtained by imaging the back surface 304 side of the workpiece 300 after division in the division step 1002 shows, in a substantially similar manner to the image 403, back surface chipping, which is chipping generated on the back surface 304 side of the workpiece 300 due to division in the division step 1002, and the workpiece-side foreign matter attached to the base layer side of the support member 305 after division. The chipping refers to minute chips or cracks generated on the outer periphery of the chip of the device 303 divided from the workpiece 300.

[0029] The moving unit 130 relatively moves (relatively moves) the holding table 110 and the imaging unit 120 (the first imaging unit 121 and the second imaging unit 122) along the X-axis direction, the Y-axis direction, and the Z-axis direction. As shown in FIG. 4, the moving unit 130 has an X-axis direction moving unit 131, a Y-axis direction moving unit 132, and a Z-axis direction moving unit 133. The X-axis direction moving unit 131, the Y-axis direction moving unit 132, and the Z-axis direction moving unit 133 relatively move the holding table 110 and the imaging unit 120 (the first imaging unit 121 and the second imaging unit 122) in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. In the first embodiment, the X-axis direction moving unit 131 moves the holding table 110 relatively to the imaging unit 120 along the X-axis direction. In the first embodiment, the Y-axis direction moving unit 132 and the Z-axis direction moving unit 133 move the imaging unit 120 relatively to the holding table 110 along the Y-axis direction and the Z-axis direction, respectively.

[0030] The X-axis direction moving unit 131, the Y-axis direction moving unit 132, and the Z-axis direction moving unit 133 are all known ball screw mechanisms having a motor, a ball screw, and a guide. The X-axis direction moving unit 131, the Y-axis direction moving unit 132, and the Z-axis direction moving unit 133 each include an encoder that reads the rotational position of the motor, and detects the relative positions of the holding table 110 and the imaging unit 120 in the X-axis direction, the Y-axis direction, and the Z-axis direction based on the rotational position of the motor read by the encoder, and outputs the detected relative positions to the control unit 150. Here, for the relative positions in the X-axis direction, the Y-axis direction, and the Z-axis direction, an apparatus coordinate system (such as XYZ coordinates, which are an orthogonal coordinate system, or RθZ coordinates, which is a cylindrical coordinate system) provided in the inspection apparatus 100 is used. In addition, the X-axis direction moving unit 131, the Y-axis direction moving unit 132 and the Z-axis direction moving unit 133 are not limited to a configuration in which the relative positions of the holding table 110 and the imaging unit 120 are detected by an encoder, and may be configured by a linear scale parallel to the X-axis direction, the Y-axis direction and the Z-axis direction, respectively, and a reading head that is freely movable in the X-axis direction, the Y-axis direction and the Z-axis direction by the X-axis direction moving unit 131, the Y-axis direction moving unit 132 and the Z-axis direction moving unit 133, respectively, and reads the graduations of the linear scale.

[0031] In the first embodiment, as shown in FIG. 4, the display unit 140 is provided on a cover (not shown) of the inspection device 100 with the display surface facing outward. The display unit 140 displays a screen for setting various conditions related to various processes of the inspection device 100, such as imaging and inspection by the imaging unit 120, acquired images and data, various processing results by the control unit 150, and the like, so that the operator can visually confirm them. The display unit 140 is configured with a liquid crystal display device or the like. The display unit 140 is provided with an input unit 141 that the operator uses when inputting information related to the above-mentioned various conditions of the inspection device 100 and information related to the display of images, etc. The input unit 141 provided on the display unit 140 is configured with at least one of a touch panel provided on the display unit 140, a mouse, a touch pad, a keyboard, and the like. The display unit 140 is not fixed to the inspection device 100, but is provided on an arbitrary communication device, and the arbitrary communication device may be connected to the inspection device 100 wirelessly or by wire.

[0032] The control unit 150 controls the operation of each component of the inspection device 100 to cause the inspection device 100 to perform various processes including a pre-machining inspection step 1001 and a post-machining inspection step 1003 of the workpiece dividing method according to the first embodiment. The control unit 150 controls the imaging unit 120 (the first imaging unit 121 and the second imaging unit 122) and the moving unit 130 to capture an image of the workpiece 300 using the imaging unit 120, and acquire images of the workpiece 300 such as an image 401 shown in Fig. 7, an image 402 shown in Fig. 8, and an image 403 shown in Fig. 9. The control unit 150 can display the acquired images of the workpiece 300 on the display unit 140 so that the images can be visually recognized by the operator.

[0033] Fig. 10 and Fig. 11 are tables showing inspection item data 451 and inspection item data 452, which are examples of the inspection item data stored in the inspection device 100 of Fig. 4. The control unit 150 stores the inspection item data 451 shown in Fig. 10 and the inspection item data 452 shown in Fig. 11, which are input in advance by an operator from the input unit 141.

[0034] 10, the inspection item data 451 is a data set that links together the inspection items of the workpiece 300 before division in the division step 1002 and information on the surface of the workpiece 300 to be imaged, which indicates from which surface of the workpiece 300 an image used for inspecting the inspection items is to be imaged. In the example of the first embodiment shown in FIG. 10, the inspection item data 451 includes, as inspection items, a mixed foreign matter 311, an air bubble 312, a wrinkle 313 of the support member 305, a turn-up 314 of the support member 305, a foreign matter 315 on the support member side, a foreign matter 317 on the workpiece side, and a chipped part 318 on the workpiece side, but the present invention is not limited thereto, and may include inspection items related to other defective parts on the workpiece 300 side before division and defective parts on the support member 305 side.

[0035] The control unit 150 refers to the inspection item data 451 and performs image processing for detecting shading, boundary lines, etc. based on images obtained by capturing the surface 301 side of the workpiece 300 before division in the division step 1002, such as image 401, as well as image processing for detecting and inspecting defective parts (presence or absence) on the workpiece 300 before division, including workpiece-side foreign body 317 and workpiece-side chip 318, thereby performing a pre-division surface side inspection process to inspect for defective parts (presence or absence) on the workpiece 300 before division, including workpiece-side foreign body 317 and workpiece-side chip 318.

[0036] The control unit 150 refers to the inspection item data 451 and performs image processing based on the image obtained by capturing the back surface 304 of the workpiece 300 before division by division step 1002, such as image 402, to detect shading, boundary lines, etc., as well as image processing to detect and inspect defective parts on the support member 305 before division, including mixed foreign matter 311, air bubbles 312, wrinkles 313 in the support member 305, turn-over 314 in the support member 305, and foreign matter on the support member side 315 (presence or absence), thereby performing a back surface side inspection process before division to inspect defective parts on the support member 305 before division, including mixed foreign matter 311, air bubbles 312, wrinkles 313 in the support member 305, turn-over 314 in the support member 305, and foreign matter on the support member side 315 (presence or absence).

[0037] 11, the inspection item data 452 is a data linking the inspection items of the workpiece 300 after division in the division step 1002 with information on the surface of the workpiece 300 to be imaged, which indicates from which surface of the workpiece 300 an image used for inspecting the inspection items is to be imaged. In the example of the first embodiment shown in FIG. 11, the inspection item data 452 includes front surface chipping 321, back surface chipping, workpiece side foreign matter, and support member side foreign matter as inspection items, but the present invention is not limited thereto, and may include inspection items related to other defective parts on the workpiece 300 side after division and defective parts on the support member 305 side.

[0038] The control unit 150 refers to the inspection item data 452 and performs image processing for detecting shading, boundary lines, etc., based on images obtained by capturing the surface 301 side of the workpiece 300 after division in division step 1002, such as image 403, as well as image processing for detecting and inspecting defective parts (presence or absence) on the side of the workpiece 300 after division, including surface chipping 321 and workpiece-side foreign matter, thereby performing a post-division surface side inspection process to inspect the defective parts (presence or absence) on the side of the workpiece 300 after division, including the surface chipping 321 and workpiece-side foreign matter.

[0039] The control unit 150 refers to the inspection item data 452 and performs image processing for detecting shading, boundary lines, etc., based on the images obtained by capturing the back surface 304 side of the workpiece 300 after division in division step 1002, such as image 403, as well as image processing for detecting and inspecting defective parts (presence or absence) on the support member 305 after division, including back surface chipping and support member side foreign matter, thereby performing a post-division back surface side inspection process to inspect for defective parts (presence or absence) on the support member 305 after division, including back surface chipping and support member side foreign matter.

[0040] Here, the control unit 150 may detect and inspect each inspection item by determining whether or not a predetermined threshold value of shape, brightness, etc., preset for each inspection item is exceeded in a predetermined direction (above, large, below, or small) in image processing for detecting and inspecting each detection item according to each inspection item, which is performed in the pre-division front side inspection process, pre-division back side inspection process, post-division front side inspection process, and post-division back side inspection process, or may detect and inspect each inspection item by learning abnormal images for each inspection item as teacher data by machine learning, and detecting and inspecting each inspection item by a learned program. The control unit 150 can display the image of the workpiece 300 after such image processing on the display unit 140 so that the operator can visually confirm it.

[0041] When the control unit 150 performs the pre-division surface side inspection process, it calculates a pre-division surface defect rate, which is the ratio of the area of ​​the region where defective parts on the workpiece 300 before division, including workpiece side foreign bodies 317 and workpiece side chips 318, were detected to the area of ​​the surface 301 of the workpiece 300, and if the pre-division surface defect rate is less than a predetermined threshold value (e.g., 10%), it determines that the condition of the surface 301 side of the workpiece 300 before division is normal, and if the pre-division surface defect rate is equal to or greater than the predetermined threshold value (e.g., 10%), it determines that the condition of the surface 301 side of the workpiece 300 before division is abnormal.

[0042] When the control unit 150 performs the pre-division back surface side inspection process, it calculates a pre-division back surface defect rate, which is the ratio of the total area of ​​the area in which defective parts on the side of the support member 305 before division, including mixed foreign matter 311, air bubbles 312, wrinkles 313 in the support member 305, curls 314 in the support member 305, and support member side foreign matter 315, are detected to the area of ​​the back surface 304 of the workpiece 300, and if the pre-division back surface defect rate is less than a predetermined threshold value (e.g., 10%), it determines that the condition of the back surface 304 side of the workpiece 300 before division is normal, and if the pre-division back surface defect rate is equal to or greater than a predetermined threshold value (e.g., 10%), it determines that the condition of the back surface 304 side of the workpiece 300 before division is abnormal.

[0043] When the control unit 150 performs the pre-division front surface side inspection process and the pre-division back surface side inspection process and determines that the state of the front surface 301 side of the workpiece 300 before division is normal and also determines that the state of the back surface 304 side of the workpiece 300 before division is normal, it determines that the state of the workpiece 300 before division is normal and therefore it is appropriate to perform the dividing step 1002 by the processing device 200. When the control unit 150 determines that the state of the front surface 301 side of the workpiece 300 before division is abnormal or determines that the state of the back surface 304 side of the workpiece 300 before division is abnormal, it determines that the state of the workpiece 300 before division is abnormal and therefore it is inappropriate to perform the dividing step 1002 by the processing device 200.

[0044] When the control unit 150 performs the post-division surface side inspection process, it calculates a post-division surface defect rate, which is the ratio of the total area of ​​the regions where defective parts on the post-division workpiece 300 side, including surface chipping 321 and workpiece side foreign matter, are detected to the area of ​​the surface 301 of the workpiece 300, and if the post-division surface defect rate is less than a predetermined threshold value (e.g., 10%), it determines that the condition of the surface 301 side of the post-division workpiece 300 is normal, and if the post-division surface defect rate is equal to or greater than the predetermined threshold value (e.g., 10%), it determines that the condition of the surface 301 side of the post-division workpiece 300 is abnormal.

[0045] When the control unit 150 performs the post-division back surface side inspection process, it calculates a post-division back surface defect rate, which is the ratio of the total area of ​​the area in which defective parts on the back surface 305 side after division, including back surface chipping and support member side foreign matter, are detected to the area of ​​the back surface 304 of the workpiece 300, and if the post-division back surface defect rate is less than a predetermined threshold value (e.g., 10%), it determines that the condition of the back surface 304 side of the workpiece 300 after division is normal, and if the post-division back surface defect rate is equal to or greater than the predetermined threshold value (e.g., 10%), it determines that the condition of the back surface 304 side of the workpiece 300 after division is abnormal.

[0046] When the control unit 150 performs the post-division front surface side inspection process and the post-division back surface side inspection process and determines that the state of the front surface 301 side of the workpiece 300 is normal and also determines that the state of the back surface 304 side of the workpiece 300 after division is normal, it determines that the dividing step 1002 by the processing device 200 has been properly performed since the state of the workpiece 300 after division is normal. In addition, when the control unit 150 determines that the state of the front surface 301 side of the workpiece 300 after division is abnormal or the state of the back surface 304 side of the workpiece 300 after division is abnormal, it determines that the state of the workpiece 300 after division is abnormal and therefore the dividing step 1002 by the processing device 200 has not been properly performed.

[0047] The control unit 150 records the results of the above-mentioned various tests (test results) and the results of judgment (judgment results). Furthermore, the control unit 150 can display a screen displaying the above-mentioned various test results and judgment results on the display unit 140 so that the operator can visually confirm the results. Furthermore, the control unit 150 can display a screen on the display unit 140 that prompts the operator to take a predetermined action or response according to the above-mentioned various test results and judgment results.

[0048] The above-mentioned inspection items, image processing, thresholds, judgments, and the like performed by the control unit 150 are specific examples in the first embodiment, and the present invention is not limited to these and can be changed as appropriate.

[0049] In the first embodiment, the control unit 150 includes a computer system. The computer system included in the control unit 150 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface device. The arithmetic processing device of the control unit 150 performs arithmetic processing according to a computer program stored in the storage device of the control unit 150, and outputs a control signal for controlling the inspection device 100 to each component of the inspection device 100 via the input / output interface device of the control unit 150.

[0050] Fig. 12 is a perspective view showing a configuration example of a processing apparatus 200 that performs the workpiece dividing method according to embodiment 1. As shown in Fig. 12, the processing apparatus 200 includes a holding table 210, a processing unit 220, an imaging unit 230, a moving unit 240, and a control unit 250. The processing apparatus 200 performs the dividing step 1002 of the workpiece dividing method according to embodiment 1.

[0051] The holding table 210 is a so-called chuck table that includes a disk-shaped frame body with a recess formed therein and a disk-shaped suction part fitted into the recess. The suction part of the holding table 210 is made of porous ceramics or the like with a large number of porous holes, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The upper surface of the suction part of the holding table 210 is a holding surface 211 on which the workpiece 300 is placed and which suction-holds the placed workpiece 300 by negative pressure introduced from the vacuum suction source. The holding surface 211 and the upper surface of the frame body of the holding table 210 are arranged on the same plane and are formed parallel to the XY plane, which is a horizontal plane. The holding table 210 is provided so as to be movable in the X-axis direction by an X-axis movement unit 241 of the movement unit 240. The holding table 210 is provided so as to be rotatable around the Z-axis by a rotation drive source (not shown).

[0052] As shown in FIG. 12, the processing unit 220 is a cutting unit including a cutting blade 221 and a spindle 222. The cutting blade 221 is attached to the tip of the spindle 222, and is rotated by the spindle 222, which serves as a rotation shaft, to cut the workpiece 300 held on the holding table 210. The spindle 222 is provided rotatably around an axis parallel to the Y-axis direction, and rotates around the axis by a motor (not shown) connected to the spindle 222. The spindle 222 supports the cutting blade 221 attached to the tip of the spindle 222 rotatably around an axis parallel to the Y-axis direction. The processing unit 220 is provided so as to be movable in the Y-axis direction and the Z-axis direction by the Y-axis direction moving unit 242 and the Z-axis direction moving unit 243 of the moving unit 240, respectively.

[0053] In the processing unit 220, the cutting blade 221 attached to the tip of the spindle 222 rotates around an axis parallel to the Y-axis direction by the rotating motion of the spindle 222, while the X-axis direction moving unit 241 moves (processing feed) the cutting blade 221 along the X-axis direction, which is the processing feed direction, relative to the workpiece 300 on the holding table 210, with the cutting blade 221 cutting the workpiece 300 from the front surface 301 side along the intended division line 302 until it reaches the back surface 304 side, forming a division groove 309 (see Figure 3) that penetrates in the thickness direction, and dividing the workpiece 300 along the intended division line 302.

[0054] The imaging unit 230 includes an imaging element that captures an image of the workpiece 300 held on the holding table 210. The imaging element is, for example, a CCD imaging element or a CMOS imaging element. The imaging unit 230 captures an image of the surface 301 of the workpiece 300 held on the holding table 210 to obtain an image for performing alignment between the workpiece 300 and the machining unit 220. In the first embodiment, the imaging unit 230 is fixed adjacent to the machining unit 220 and moves integrally with the machining unit 220.

[0055] The moving unit 240 moves the holding table 210, the processing unit 220, and the imaging unit 230 relatively along the X-axis direction, the Y-axis direction, and the Z-axis direction. As shown in FIG. 12, the moving unit 240 has an X-axis direction moving unit 241, a Y-axis direction moving unit 242, and a Z-axis direction moving unit 243. The X-axis direction moving unit 241, the Y-axis direction moving unit 242, and the Z-axis direction moving unit 243 move the holding table 210, the processing unit 220, and the imaging unit 230 relatively along the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. In the first embodiment, the X-axis direction moving unit 241 moves the holding table 210 relative to the processing unit 220 and the imaging unit 230 along the X-axis direction. In the first embodiment, the Y-axis direction moving unit 242 and the Z-axis direction moving unit 243 move the processing unit 220 and the imaging unit 230 relative to the holding table 210 along the Y-axis direction and the Z-axis direction, respectively. The X-axis direction moving unit 241 , the Y-axis direction moving unit 242 and the Z-axis direction moving unit 243 are each configured to have the same mechanism as the X-axis direction moving unit 131 , the Y-axis direction moving unit 132 and the Z-axis direction moving unit 133 .

[0056] The control unit 250 controls the operation of each component of the processing device 200, and causes the processing device 200 to perform various processes including the dividing step 1002 of the workpiece dividing method according to embodiment 1. In embodiment 1, the control unit 250 includes a computer system similar to that of the control unit 150. The arithmetic processing device of the control unit 250 performs arithmetic processing according to a computer program stored in a storage device of the control unit 250, and outputs control signals for controlling the processing device 200 to each component of the processing device 200 via an input / output interface device of the control unit 250.

[0057] Next, this specification describes a method for dividing a workpiece according to embodiment 1. In the pre-processing inspection step 1001, an inspection device 100 has a holding table 110 whose holding surface 113 is formed of a transparent member 111, a first imaging unit 121 installed above the holding surface 113, and a second imaging unit 122 installed below the holding surface 113. In a state where one surface of the workpiece 300 is held on the holding surface 113 of the inspection device 100, the first imaging unit 121 and the second imaging unit 122, which are arranged on the support member 305 side, are imaged to inspect the presence or absence of at least one of a foreign object (mixed foreign object 311) or air bubbles 312 mixed between the support member 305 and the workpiece 300, a wrinkle 313 of the support member 305, a turn-up 314 of the support member 305, and a foreign object (support member side foreign object 315) attached to the support member 305.

[0058] In the pre-machining inspection step 1001, first, the undivided workpiece 300 is transported and placed on the holding surface 113 of the holding table 110 of the inspection device 100, and the control unit 150 of the inspection device 100 suction-holds the undivided workpiece 300 placed on the holding surface 113 on the holding surface 113. In the pre-machining inspection step 1001, next, the control unit 150 captures an image of the back surface 304 side of the undivided workpiece 300 to which the support member 305 is fixed, using the first imaging unit 121 or the second imaging unit 122 arranged on the back surface 304 side to which the support member 305 of the undivided workpiece 300 is fixed, to obtain an image.

[0059] In the pre-machining inspection step 1001, in the first embodiment, the control unit 150 holds the side of the support member 305 on the holding surface 113, and captures an image of the side of the support member 305 by the second imaging unit 122 through the holding surface 113. That is, in the pre-machining inspection step 1001, in the first embodiment, the control unit 150 suction-holds the workpiece 300 before division on the holding surface 113 in a state in which the back surface 304 side to which the support member 305 of the workpiece 300 before division is fixed is directed toward the holding surface 113 side and the front surface 301 side of the workpiece 300 before division is exposed upward, and captures an image of the back surface 304 side to which the support member 305 of the workpiece 300 before division is fixed by the second imaging unit 122 arranged on the back surface 304 side to which the support member 305 of the workpiece 300 before division is fixed. In this way, by holding the back surface 304 side to which the support member 305 is fixed on the holding surface 113, there is an effect that the workpiece 300 is not damaged as compared with the case where the front surface 301 of the workpiece 300 to which the support member 305 is not fixed is held on the holding surface 113. Note that in the pre-machining inspection step 1001, the present invention is not limited to the above-mentioned form, and instead of the above-mentioned form, the control unit 150 may suction and hold the workpiece 300 before division on the holding surface 113 in a state in which the front surface 301 side of the workpiece 300 before division faces the holding surface 113 side and the back surface 304 side to which the support member 305 of the workpiece 300 before division is fixed is exposed upward, and an image of the back surface 304 side to which the support member 305 of the workpiece 300 before division is fixed of the workpiece 300 before division may be captured by the first imaging unit 121 arranged on the back surface 304 side to which the support member 305 of the workpiece 300 before division is fixed.

[0060] In the pre-processing inspection step 1001, the control unit 150 performs a pre-division back side inspection process based on the image of the back side 304 of the workpiece 300 before division to which the support member 305 is fixed, which has been captured and acquired. If it is determined that the condition of the back side 304 of the workpiece 300 before division is normal, it determines that it is appropriate to perform the division step 1002 by the processing device 200, and if it is determined that the condition of the back side 304 of the workpiece 300 before division is abnormal, it determines that it is inappropriate to perform the division step 1002 by the processing device 200.

[0061] In the pre-machining inspection step 1001, the control unit 150 may further inspect the presence or absence of at least one of a foreign substance attached to the workpiece 300 and a chip formed in the workpiece 300 by the first imaging unit 121 or the second imaging unit 122 arranged on the side of the workpiece 300. That is, in the pre-machining inspection step 1001, the first imaging unit 121 or the second imaging unit 122 arranged on the side of the surface 301 of the workpiece 300 before division may image the surface 301 side of the workpiece 300 before division, and a pre-division surface side inspection process may be performed based on the image of the surface 301 side of the workpiece 300 before division acquired by imaging.

[0062] In the pre-processing inspection step 1001, when the control unit 150 performs a pre-division front side inspection process in addition to the pre-division back side inspection process, and determines that the condition of the front side 301 of the workpiece 300 before division is normal, and further determines that the condition of the back side 304 of the workpiece 300 before division is normal, it determines that the condition of the workpiece 300 before division is normal, and therefore it is appropriate to perform the division step 1002 by the processing device 200, and proceeds with the processing of the workpiece division method of embodiment 1 to the division step 1002.

[0063] On the other hand, in the pre-machining inspection step 1001, when the control unit 150 performs the pre-division front-side inspection process in addition to the pre-division back-side inspection process, if the control unit 150 determines that the state of the front surface 301 side of the workpiece 300 before division is abnormal, or determines that the state of the back surface 304 side of the workpiece 300 before division is abnormal, the control unit 150 determines that it is inappropriate to perform the division step 1002 by the processing device 200 since the state of the workpiece 300 before division is abnormal, and ends the process of the workpiece division method according to the first embodiment without proceeding to the division step 1002. Note that in the pre-machining inspection step 1001, instead of ending the process of the workpiece division method according to the first embodiment without proceeding to the division step 1002, the division step 1002 to be performed next may be changed to perform the division process while avoiding the defective parts on the workpiece 300 side before division and the defective parts on the support member 305 side.

[0064] The dividing step 1002 is a step for dividing the workpiece 300 determined to be normal in the pre-machining inspection step 1001. In the dividing step 1002, first, the workpiece 300 determined to be normal by the control unit 150 in the pre-machining inspection step 1001 is transported and placed on the holding surface 211 of the holding table 210 of the processing device 200, and the control unit 250 of the processing device 200 suction-holds the workpiece 300 placed on the holding surface 211 on the holding surface 211.

[0065] In the dividing step 1002, next, the control unit 250 rotates the spindle 222 to rotate the cutting blade 221 around an axis parallel to the Y-axis direction, while moving (cutting-feeding) the cutting blade 221 along the cutting feed direction (X-axis direction) relative to the workpiece 300 on the holding table 210 with the X-axis movement unit 241, so that the cutting blade 221 cuts the workpiece 300 along the division lines 302, reaches the back surface 304 side, forms division grooves 309 penetrating in the thickness direction, and divides the workpiece 300 along the division lines 302. In the dividing step 1002, the control unit 250 forms division grooves 309 along all of the division lines 302 to be processed.

[0066] The post-processing inspection step 1003 is a step of holding either side of the workpiece 300 on the holding surface 113 of the holding table 110 of the inspection device 100 after the dividing step 1002, and inspecting the state of chipping on both sides of the workpiece 300 from an image of the workpiece 300 captured by the first imaging unit 121 and an image of the workpiece 300 captured through the holding surface 113 by the second imaging unit 122. The post-processing inspection step 1003 may further inspect at least one of the presence or absence of foreign matter attached to the workpiece 300 and the presence or absence of foreign matter attached to the support member 305 fixed to the workpiece 300.

[0067] In the post-processing inspection step 1003, the control unit 150 uses the first imaging unit 121 and the second imaging unit 122 to capture and acquire an image of the front surface 301 side of the workpiece 300 after division, and an image of the back surface 304 side of the workpiece 300 after division to which the support member 305 is fixed.

[0068] In post-processing inspection step 1003, the control unit 150 performs post-division front-side inspection processing based on the captured image of the front side 301 of the divided workpiece 300 to inspect for front-side chipping 321 and workpiece-side foreign matter (presence or absence). In post-processing inspection step 1003, the control unit 150 performs post-division back-side inspection processing based on the captured image of the back side 304 of the divided workpiece 300 to which the support member 305 is fixed to inspect for back-side chipping and support member-side foreign matter (presence or absence).

[0069] The method of dividing a workpiece according to embodiment 1 having the above-mentioned configuration uses the same inspection device 100 before and after processing, and is set up to inspect, before processing, for the presence or absence of at least one of the following: foreign matter (contaminated foreign matter 311) or air bubbles 312 that has become mixed in between the support member 305 and the workpiece 300, wrinkles 313 on the support member 305, curls 314 on the support member 305, and foreign matter (foreign matter 315 on the support member side) attached to the support member 305, and to inspect the chipping condition on both sides of the workpiece 300 after processing, thereby achieving the advantageous effect of reducing the labor and inspection costs required for inspection before and after processing compared to the conventional method.

[0070] In addition, in the method for dividing a workpiece according to the first embodiment, the control unit 150 of the same inspection device 100 records the inspection result of the workpiece 300 before processing and the inspection result of the workpiece 300 after processing. Therefore, even if the control unit 150 of the inspection device 100 is not connected to a network capable of communicating the inspection results with other devices, the position (coordinates) of each inspection item detected in the inspection of the workpiece 300 before processing and the position (coordinates) of each inspection item detected in the inspection of the workpiece 300 after processing can be collated, allowing an operator to easily isolate and pursue whether the cause of the inspection item of the workpiece 300 after processing is due to the inspection item of the workpiece 300 before processing. For example, the method for dividing a workpiece according to the first embodiment allows an operator to easily isolate and pursue whether the cause of the abnormality of chipping, which is an inspection item of the workpiece 300 after processing, is due to the adhesion of the support member 305 to the workpiece 300, which is an inspection item of the workpiece 300 before processing.

[0071] In addition, in the workpiece dividing method according to embodiment 1, in the pre-processing inspection step 1001, the back surface 304 side of the workpiece 300 to which the support member 305 is fixed is held on the holding surface 113 of the holding table 110 of the inspection device 100, and the back surface 304 side of the workpiece 300 to which the support member 305 is fixed is imaged by the second imaging unit 122 via the holding surface 113. Therefore, in the workpiece dividing method of embodiment 1, in the pre-processing inspection step 1001, the workpiece 300 is stably held on the holding surface 113 via the support member 305, and a higher quality image can be obtained of the back surface 304 side of the workpiece 300 to which the support member 305 is fixed, thereby improving the quality of inspection for the presence or absence of foreign matter (contaminated foreign matter 311) or air bubbles 312 that have become mixed between the support member 305 and the workpiece 300, wrinkles 313 in the support member 305, curls 314 in the support member 305, and foreign matter attached to the support member 305 (foreign matter on the support member side 315).

[0072] Furthermore, in the pre-machining inspection step 1001, the workpiece dividing method according to the first embodiment further inspects the presence or absence of at least one of a foreign substance adhering to the workpiece 300 (workpiece-side foreign substance 317) and a chip formed in the workpiece (workpiece-side chip 318) by the first imaging unit 121 or the second imaging unit 122 arranged on the surface 301 side of the workpiece 300. Therefore, the workpiece dividing method according to the first embodiment further inspects the surface 301 side of the workpiece 300 in the pre-machining inspection step 1001, thereby improving the quality of the inspection of the workpiece 300 before machining.

[0073] Furthermore, in the workpiece dividing method according to embodiment 1, the post-processing inspection step 1003 further inspects for at least the presence or absence of foreign matter adhering to the workpiece 300 and the presence or absence of foreign matter adhering to the support member 305, thereby improving the quality of inspection of the workpiece 300 after processing.

[0074] [Embodiment 2] A workpiece dividing method according to the second embodiment of the present invention will be described. Fig. 13 is a perspective view showing a configuration example of an inspection and processing device 500 that implements the workpiece dividing method according to the second embodiment. In Fig. 13, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0075] The workpiece dividing method according to the second embodiment is a modification of the workpiece dividing method according to the first embodiment, in which a pre-processing inspection step 1001, a dividing step 1002, and a post-processing inspection step 1003 are all performed using one inspection and processing device 500. As shown in Fig. 13, the inspection and processing device 500 is a single device that integrates the inspection device 100 and processing device 200 similar to those in the first embodiment, and various modifications have been made accordingly.

[0076] 13, the inspection and processing apparatus 500 includes an inspection apparatus 100, a processing apparatus 200, a cassette placement stage 510, a transport unit 520, a cleaning unit 530, and a control unit 550. In the inspection and processing apparatus 500, the control unit 150 of the inspection apparatus 100 and the control unit 250 of the processing apparatus 200 are integrated into a control unit 550 that includes the configurations and functions of both the control units 150 and 250. The cassette placement stage 510 is a placement stage on which a cassette 515, which is a container for accommodating a plurality of workpieces 300, is placed, and the cassette 515 placed thereon is raised and lowered in the Z-axis direction.

[0077] 13, the transport unit 520 includes a transport unit 521 and a transport unit 522. The transport unit 521 transports the workpiece 300 between the inside of the cassette 515 placed on the cassette placement table 510, the holding surface 211 of the holding table 210 on the processing device 200 side, and the spinner table 531 of the cleaning unit 530. The transport unit 522 transports the workpiece 300 between the processing device 200 side and the inspection device 100 side, and transports the workpiece 300, for example, between the inside of the cassette 515 placed on the cassette placement table 510 and the holding surface 113 of the holding table 110 on the inspection device 100 side, or between the holding surface 211 of the holding table 210 on the processing device 200 side and the holding surface 113 of the holding table 110 on the inspection device 100 side.

[0078] The cleaning unit 530 includes a spinner table 531. The spinner table 531 has a configuration similar to that of the holding table 110, and the workpiece 300 is placed on the spinner table 531 with the front surface 301 facing upward, and the placed workpiece 300 is suction-held from the rear surface 304 side via a support member 305. The cleaning unit 530 cleans the workpiece 300 held on the spinner table 531, and removes contamination such as processing debris that is generated when processing for dividing the workpiece 300 is performed by the processing unit 220 and adheres to the workpiece 300.

[0079] In the workpiece dividing method according to the second embodiment, before performing the pre-machining inspection step 1001, the control unit 550 causes the conveying unit 522 of the conveying unit 520 to convey the unmachined workpiece 300 from inside the cassette 515 placed on the cassette placement table 510 onto the holding surface 113 of the holding table 110 on the inspection device 100 side. After performing the pre-machining inspection step 1001 and before performing the division step 1002, the control unit 550 causes the conveying unit 522 of the conveying unit 520 to convey the unmachined workpiece 300 from the holding surface 113 of the holding table 110 on the inspection device 100 side onto the holding surface 211 of the holding table 210 on the processing device 200 side.

[0080] Furthermore, in the workpiece dividing method according to the second embodiment, after dividing step 1002 is performed and before post-processing inspection step 1003 is performed, control unit 550 causes conveying unit 521 of conveying unit 520 to convey processed workpiece 300 from holding surface 211 of holding table 210 on the processing apparatus 200 side to spinner table 531 of cleaning unit 530, cleans processed workpiece 300 by cleaning unit 530, and conveys processed and cleaned workpiece 300 from spinner table 531 of cleaning unit 530 to holding surface 113 of holding table 110 on the inspection apparatus 100 side by conveying unit 522 of conveying unit 520. Also, after the post-processing inspection step 1003 is performed, the transport unit 522 of the transport unit 520 transports the workpiece 300 from the holding surface 113 of the holding table 110 on the inspection device 100 side into the cassette 515 placed on the cassette mounting table 510.

[0081] The workpiece dividing method according to the second embodiment having the above-mentioned configuration is a modification of the workpiece dividing method according to the first embodiment, in which the pre-processing inspection step 1001, the dividing step 1002, and the post-processing inspection step 1003 are performed by an inspection and processing device 500 that integrates the inspection device 100 and the processing device 200 similar to those of the first embodiment, so that the method has the same effect as that of the first embodiment. Moreover, the workpiece dividing method according to the second embodiment automatically carries out the transfer between the inspection device 100 and the processing device 200, so that the method has the effect of further reducing the man-hours and inspection costs required for the pre-processing and post-processing inspections compared to the conventional method.

[0082] [Embodiment 3] A workpiece dividing method according to the third embodiment of the present invention will be described. Fig. 14 is a perspective view showing a configuration example of a processing device 200-2 which performs the workpiece dividing method according to the third embodiment. In Fig. 14, the same parts as those in the first and second embodiments are denoted by the same reference numerals and the description thereof will be omitted.

[0083] 14, the processing apparatus 200-2 includes a holding table 210, a processing unit 220-2, an imaging unit 230, a moving unit 240, and a control unit 250. The processing apparatus 200-2 performs the dividing step 1002 of the workpiece dividing method according to the third embodiment. In the processing apparatus 200-2, the holding table 210 is provided so as to be movable in the X-axis direction and the Y-axis direction by the X-axis direction moving unit 241 and the Y-axis direction moving unit 242 of the moving unit 240, respectively.

[0084] 14, the processing unit 220-2 is a laser processing unit equipped with a laser beam irradiator that irradiates a laser beam to the workpiece 300. In the processing unit 220-2, a collector that condenses the laser beam irradiated from the laser beam irradiator toward the workpiece 300 is provided so as to be movable in the Z-axis direction by the Z-axis direction moving unit 243 of the moving unit 240.

[0085] In the processing unit 220-2, a laser beam of a wavelength that is absorbed by the workpiece 300 is applied to the workpiece 300 held on the holding table 210 by the laser beam applicator, while the X-axis movement unit 241 moves (processing feeds) the workpiece 300 on the holding table 210 along the processing feed direction relative to the collector of the laser beam applicator, thereby ablating (sublimating or evaporating) the workpiece 300 with the laser beam, and ablates the workpiece 300 held on the holding table 210 along the intended division line 302 to form a division groove 309.

[0086] In addition, the processing unit 220-2 uses a laser beam irradiator to irradiate the workpiece 300 held on the holding table 210 with a laser beam having a wavelength that is transparent to the workpiece 300, while moving the workpiece 300 on the holding table 210 along the processing feed direction (processing feed) relative to the condenser of the laser beam irradiator using the X-axis direction moving unit 241, thereby forming a modified layer and cracks extending from the modified layer toward the front and back surfaces of the workpiece 300 along the planned division line 302 inside the workpiece 300 with the laser beam, and further forming a division groove 309 that divides the workpiece 300 along the planned division line 302 by breaking the modified layer and the cracks as starting points by pressing with a roller or the like (not shown). Here, the modified layer means a region in which the density, refractive index, mechanical strength, and other physical properties are different from those of the surroundings, and examples thereof include a melting treatment region, a crack region, an insulation breakdown region, a refractive index change region, and a region in which these regions are mixed.

[0087] The workpiece dividing method of the third embodiment is the same as the workpiece dividing method of the first and second embodiments, except that the dividing step 1002 is changed to form a dividing groove 309 by irradiating a laser beam by a processing unit 220-2. The other configurations are the same as those of the first and second embodiments.

[0088] The workpiece dividing method of the third embodiment having the above-mentioned configuration is the same as the workpiece dividing method of the first and second embodiments, except that the dividing step 1002 is changed to form a dividing groove 309 by irradiating a laser beam by the machining unit 220-2. Therefore, the same effect as the first and second embodiments is achieved.

[0089] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. [Explanation of symbols]

[0090] 100 Inspection Equipment 110 Holding table 111 Transparent materials 113 Holding surface 121 First Imaging Unit 122 Second Imaging Unit 300 Workpiece 305 Support member 311 Contaminants 312 Bubbles 313 Wrinkles 314 Turned over 315 Foreign object on support member side 317 Foreign matter on workpiece side 318 Chipping on workpiece side 321 Surface chipping 1001 Pre-processing inspection step 1002 division steps 1003 Post-processing inspection step

Claims

1. A method for dividing a workpiece, the method comprising the steps of: dividing a workpiece having a support member fixed to one surface thereof, the steps comprising the steps of: a pre-processing inspection step in which, while holding any surface of a workpiece on a holding surface of an inspection device having a holding table with at least a portion of the holding surface made of a transparent material, a first imaging unit installed above the holding surface, and a second imaging unit installed below the holding surface, the support member is imaged by the first imaging unit or the second imaging unit, whichever is located on the support member side, to inspect for the presence or absence of at least any of the following: air bubbles or foreign matter mixed in between the support member and the workpiece, curling of the support member from the workpiece, wrinkles in the support member, and foreign matter attached to the support member; a dividing step of dividing the workpiece determined to be normal in the pre-machining inspection step; a post-processing inspection step in which, after the dividing step, one of the surfaces of the workpiece is held on the holding surface of the inspection device, and a chipping state between one surface and the other surface of the workpiece is inspected from an image of the workpiece captured by the first imaging unit and an image of the workpiece captured through the holding surface by the second imaging unit; A method for dividing a workpiece comprising the steps of:

2. 2. The method for dividing a workpiece according to claim 1, wherein in the pre-machining inspection step, the side of the support member is held on the holding surface, and an image of the support member is taken by the second imaging unit through the holding surface.

3. 3. The method for dividing a workpiece as described in claim 1 or 2, wherein the pre-processing inspection step inspects the presence or absence of at least one of foreign matter attached to the workpiece and chips formed in the workpiece using the first imaging unit or the second imaging unit arranged on the side of the workpiece.

4. 3. The method for dividing a workpiece according to claim 1 or 2, characterized in that the post-processing inspection step inspects at least one of the presence or absence of foreign matter adhering to the workpiece and the presence or absence of foreign matter adhering to the support member.

Images