Bus bar assembly and method for manufacturing the same

Abstract

To provide a bus bar assembly having a plurality of bus bars arranged on the same plane with a gap and capable of improving adhesion between components while improving manufacturing efficiency.SOLUTION: In a bus bar assembly of the present invention, an insulating resin film is bonded to the top surface of a plurality of bus bars arranged side by side with gaps, a rigid frame body along a plane-view peripheral edge region of a connected body of the bus bars connected by the film is bonded to the top surface of the film, each bus bar has a lower connection exposed outside on the bottom surface and an upper connection exposed outside through an opening formed in the insulating resin film in the center opening of the frame body on the top surface, and an insulating resin is provided in the gap so as to cover a boundary between the bus bar the insulating resin film.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a bus bar assembly in which a plurality of bus bars are electrically insulated and mechanically connected, and to a method for manufacturing the same. [Background technology]

[0002] Planar busbar assemblies have been proposed and are used in a variety of fields, in which multiple busbars are arranged in parallel with gaps between them in the same plane, are electrically insulated from each other but mechanically connected.

[0003] The applicant of the present application has filed an application and been granted a patent for a planar busbar assembly comprising a plurality of busbars arranged in parallel with gaps between them in the same plane, an insulating resin film adhered to the upper surfaces of the plurality of busbars so as to span the gaps and connect the plurality of busbars while the gaps remain, and a rigid frame adhered to the upper surface of the insulating resin film so as to follow the peripheral region in a plan view of a busbar connection formed by connecting the plurality of busbars by the insulating resin film (see Patent Document 1 below).

[0004] The bus bar assembly described in Patent Document 1 is effective in many respects. However, there is room for improvement in the adhesion between the components, i.e., the adhesion between the bus bar and the insulating resin film, and the adhesion between the insulating resin film and the frame. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 6788767 Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention has been made in consideration of the conventional technology, and has an object to provide a busbar assembly having a plurality of busbars arranged in parallel in the same plane with gaps between them, which can improve the adhesion between the constituent parts, and a method for manufacturing the same. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, a first aspect of the present invention provides a busbar assembly comprising: a plurality of busbars formed of conductive flat plate-like members and arranged in the same plane with a gap between opposing side surfaces; an insulating resin film adhered to upper surfaces of the plurality of busbars so as to connect the plurality of busbars with the gap; and a rigid frame body having a central opening that penetrates in the vertical direction, the frame body being adhered to the upper surface of the insulating resin film so as to follow a peripheral region in a plan view of a busbar connected body formed by the plurality of busbars connected by the insulating resin film, wherein the busbars have a lower connection portion on their lower surface that is exposed to the outside and an upper connection portion on their upper surface that is exposed to the outside via an opening formed in the insulating resin film within the central opening of the frame body, and an insulating resin is provided in the gap so as to cover the boundary between the busbars and the insulating resin film.

[0008] In the busbar assembly of the first aspect, the boundary between the inner surface of the frame body and the upper surface of the insulating resin film, and / or the boundary between the outer surface of the frame body and the upper surface of the insulating resin film is preferably covered with insulating resin.

[0009] In one configuration of the busbar assembly relating to the first aspect, the frame body has an inner frame portion that is positioned on the inside in a planar view and has the central opening, an outer frame portion that surrounds the inner frame portion while leaving a gap in a planar view, and a connecting portion that connects the inner frame portion and the outer frame body, and an insulating resin is provided within the gap so as to cover the boundaries between the inner frame portion and the outer frame portion and the insulating film.

[0010] Preferably, the boundary between the inner side surface of the inner frame portion and the insulating resin film and / or the boundary between the outer side surface of the outer frame portion and the insulating resin film is covered with an insulating resin.

[0011] In order to achieve the above-mentioned object, a second aspect of the present invention provides a busbar assembly comprising: a plurality of busbars formed of conductive flat plate-like members and arranged in the same plane with a gap between opposing side surfaces; an insulating resin film adhered to upper surfaces of the plurality of busbars so as to connect the plurality of busbars with the gap present; and an insulating resin body provided on the upper surface of the insulating resin film so as to follow a peripheral region in a plan view of a busbar connection body formed by connecting the plurality of busbars with the insulating resin film, wherein the busbars have, on their lower surfaces, a lower connection portion exposed to the outside, and on their upper surfaces, an upper connection portion exposed to the outside through an opening formed in the insulating resin film within a central opening of the frame, and an insulating resin is provided in the gap so as to cover the boundary between the busbars and the insulating resin film.

[0012] In order to achieve the above-mentioned object, a third aspect of the present invention is a method for manufacturing a busbar assembly including a plurality of busbars formed of a conductive flat plate-like member and arranged in parallel in the same plane with a gap between opposing side surfaces, an insulating resin film adhered to upper surfaces of the plurality of busbars so as to connect the plurality of busbars with the gap present, and a rigid frame having a central opening penetrating in the vertical direction and adhered to the upper surface of the insulating resin film so as to fit along a peripheral region in a plan view of a busbar connected body formed by connecting the plurality of busbars by the insulating resin film, the method including the steps of: preparing a conductive flat metal plate for busbars having a busbar assembly forming region for forming the plurality of busbars; a slit forming step of forming one or more slits in the busbar assembly forming region that penetrate between an upper surface and a lower surface and have the same width as the gap, thereby forming a plurality of busbar forming sites corresponding to the plurality of busbars; a film bonding step of bonding the insulating resin film to the upper surface of the busbar assembly forming region; and preparing the conductive flat metal plate for busbars. the frame body forming process being performed before, after, or in parallel with the processes from the step of forming a frame body to the film bonding step, the frame body forming process including a step of preparing a frame body flat plate having a frame body forming region having an outer shape corresponding to the frame body and a step of removing an unnecessary portion of the frame body forming region so as to leave a frame body forming portion corresponding to the frame body; a plate bonding step of bonding the frame body flat plate to the busbar conductive metal flat plate after the film bonding step so that the frame body forming region overlaps with the busbar assembly forming region in a plan view; a slit insulating resin providing step of providing insulating resin in the slits at an arbitrary timing after the film bonding step; a busbar exposing step of exposing at least a portion of an upper surface of each of the plurality of busbar forming portions at an arbitrary timing after the film bonding step; and a cutting step of cutting the busbar assembly forming region and the frame body forming region from the busbar conductive metal flat plate and the frame body flat plate after completion of both the busbar exposing step and the slit insulating resin providing step.

[0013] The manufacturing method according to the third aspect of the present invention may preferably further comprise a frame side insulating resin installation step of providing insulating resin so as to cover the boundary between at least one of the inner and outer sides of the frame forming portion and the insulating film at any timing after the flat plate bonding step and before the cutting step.

[0014] In one example of the manufacturing method relating to the third aspect, the frame forming portion formed by the frame forming process is positioned on the inside in a planar view and has an inner frame portion having the central opening, an outer frame portion surrounding the inner frame portion while leaving a gap in a planar view, and a connecting portion connecting the inner frame portion and the outer frame portion. In this case, the manufacturing method of the third aspect may include a frame gap insulating resin installation process, at any timing after the flat plate bonding process and before the cutting process, in which insulating resin is provided in the gap so as to cover the boundaries between the inner frame portion and the outer frame portion and the insulating film.

[0015] In order to achieve the above-mentioned object, a fourth aspect of the present invention is a manufacturing method for a busbar assembly including a plurality of busbars formed of a conductive flat plate member and arranged in parallel in the same plane with a gap between opposing side surfaces, and an insulating resin film adhered to upper surfaces of the plurality of busbars so as to connect the plurality of busbars with the gap, the method comprising the steps of: preparing a conductive metal flat plate for busbars having a busbar assembly forming region for forming the plurality of busbars; forming one or more slits in the busbar assembly forming region, the slits passing through between an upper surface and a lower surface and having the same width as the gap, to form a plurality of busbar forming sites corresponding to the plurality of busbars; and adhering the insulating resin film to the upper surface of the busbar assembly forming region. the busbar assembly forming method includes a film bonding step of bonding a film; an insulating resin body forming step of providing an insulating resin body on the upper surface of the insulating resin film so as to follow the planar peripheral region of the busbar assembly forming region; a slit insulating resin providing step of providing insulating resin in the slit at any timing after the film bonding step; a busbar exposing step of exposing at least a portion of the upper surface of each of the plurality of busbar forming sites at any timing after the film bonding step; and a cutting step of cutting the busbar assembly forming region and the frame body forming region from the busbar conductive metal flat plate and the frame body flat plate after both the busbar exposing step and the slit insulating resin providing step are completed.

[0016] In the manufacturing methods according to the third and fourth aspects, the bus bar exposing step is preferably configured to remove a predetermined portion of the insulating resin film by irradiating it with laser light. Effect of the Invention

[0017] According to the bus bar assembly of the present invention, the adhesion between the constituent members can be improved. Furthermore, according to the method for manufacturing a busbar assembly according to the present invention, the busbar assembly can be manufactured with good reproducibility. [Brief description of the drawings]

[0018] [Figure 1] Fig. 1(a) is a plan view of a busbar assembly according to a first embodiment of the present invention, Fig. 1(b) is a cross-sectional view taken along line I(b)-I(b) in Fig. 1(a), and Fig. 1(c) is a plan view of a busbar assembly having an opening in an insulating resin film with a modified configuration. [Diagram 2] FIG. 2(a) is a plan view of an insulating resin film in the busbar assembly according to the first embodiment, and FIG. 2(b) is a cross-sectional view taken along line II(b)-II(b) in FIG. 2(a). [Diagram 3] FIG. 3(a) is a plan view of a frame in the busbar assembly according to the first embodiment, and FIG. 3(b) is a cross-sectional view taken along line III(b)-III(b) in FIG. 3(a). [Figure 4] FIG. 4 is a vertical cross-sectional view of a semiconductor module in which semiconductor elements such as LEDs are mounted on the bus bar assembly according to the first embodiment. [Diagram 5] FIG. 5 is a plan view of a conductive metal flat plate for a bus bar used in a manufacturing method (first manufacturing method) of the bus bar assembly according to the first embodiment. [Figure 6] 6(a) is an enlarged view of part VI(a) in FIG. 5, and FIG. 6(b) is a cross-sectional view taken along line VI(b)-VI(b) in FIG. 6(a). [Figure 7] FIG. 7 is a plan view of the conductive metal plate for bus bars after the film bonding step in the first manufacturing method. [Figure 8] 8(a) is an enlarged view of part VIII(a) in FIG. 7, and FIG. 8(b) is a cross-sectional view taken along line VIII(b)-VIII(b) in FIG. 8(a). [Figure 9] FIG. 9 is a plan view of a frame flat plate used in the first manufacturing method. [Figure 10]10(a) is an enlarged view of part X(a) in FIG. 9, and FIG. 10(b) is a cross-sectional view taken along line X(b)-X(b) in FIG. 10(a). [Figure 11] FIG. 11 is a plan view of the conductive metal flat plates for bus bars and the flat plate for frame body after the flat plate bonding step in the first manufacturing method. [Figure 12] FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. [Figure 13] FIG. 13 is a cross-sectional view of the conductive metal flat plate for bus bars and the frame flat plate after the insulating resin for slits providing step in the first manufacturing method. [Figure 14] FIG. 14 is a schematic vertical cross-sectional view of a bus bar exposing step in the first manufacturing method. [Figure 15] FIG. 15 is a plan view of the conductive metal flat plate for bus bars and the flat plate for frame body, illustrating the cutting step in the first manufacturing method. [Figure 16] 16(a) to 16(c) are cross-sectional views of busbar assemblies according to first to third modified examples of the first embodiment, respectively. [Figure 17] Figure 17(a) is a plan view of a busbar assembly according to embodiment 2 of the present invention, and Figures 17(b) and (c) are cross-sectional views taken along lines XVII(b)-XVII(b) and XVII(c)-XVII(c) in Figure 17(a), respectively. [Figure 18] FIG. 18 is a vertical cross-sectional view of a semiconductor module in which semiconductor elements such as LEDs are mounted on the bus bar assembly according to the second embodiment. [Figure 19] Figure 19(a) is a plan view of a frame body in a busbar assembly of the second embodiment, and Figures 19(b) and (c) are cross-sectional views taken along lines XIX(b)-XIX(b) and XIX(c)-XIX(c) in Figure 19(a), respectively. [Figure 20] FIG. 20 is a plan view of a frame flat plate used in a manufacturing method (second manufacturing method) of the bus bar assembly according to the second embodiment. [Figure 21]21(a) is an enlarged view of part XX(a) in FIG. 20, and FIGS. 21(b) and (c) are cross-sectional views taken along lines XXI(b)-XXI(b) and XXI(c)-XXI(c) in FIG. 21(a), respectively. [Figure 22] 22(a) to 22(c) are cross-sectional views of busbar assemblies according to first to third modified examples of the second embodiment, respectively. [Figure 23] FIG. 23 is a vertical cross-sectional view of a semiconductor module in which semiconductor elements such as LEDs are mounted on a bus bar assembly according to the third embodiment of the present invention. [Figure 24] FIG. 24 is a plan view of the conductive metal flat plate for bus bars after the insulating resin body forming step in a manufacturing method (third manufacturing method) of the bus bar assembly according to the third embodiment. [Diagram 25] FIG. 25 is a cross-sectional view taken along the line XXV-XXV in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] First embodiment Hereinafter, an embodiment of a busbar assembly according to the present invention will be described with reference to the accompanying drawings. FIG. 1(a) shows a plan view of a busbar assembly 1 according to the present embodiment. FIG. 1(b) is a cross-sectional view taken along line I(b)-I(b) in FIG. 1(a).

[0020] As shown in Figures 1(a) and 1(b), the busbar assembly 1 comprises a plurality of busbars 10 formed from a conductive flat plate-like member and arranged in the same plane with a gap 19 between opposing side surfaces, an insulating resin film 20 adhered to the upper surfaces of the plurality of busbars 10 so as to span the gap 19 and connect the plurality of busbars 10 with the gap 19 present, and a rigid frame 30 adhered to the upper surface of the insulating resin film 20 (the surface opposite to the lower surface adhered to the plurality of busbars 10).

[0021] The bus bar 10 is made of a conductive metal such as Cu. The busbar assembly 1 in this embodiment has three busbars, namely, first to third busbars 10(1) to 10(3), as the plurality of busbars 10, and has first and second gaps 19(1), 19(2) as the gaps 19.

[0022] That is, the busbar assembly 1 has the first busbar 10(1), a second busbar 10(2) arranged adjacent to the first busbar 10(1) via a first gap 19(1), and a third busbar 10(3) arranged adjacent to the second busbar 10(2) via a second gap 19(2).

[0023] Each of the bus bars 10(1) to 10(3), in the vertical cross-sectional view shown in FIG. 1(b), has an upper surface to which the insulating resin film 20 is adhered, a lower surface opposite the upper surface, and a side surface facing the adjacent bus bars 10(1) to 10(3) with the gap 19 therebetween.

[0024] Each of the bus bars 10(1) to 10(3) has a lower connection portion 15 on the lower surface thereof that is exposed to the outside. In the present embodiment, as shown in FIG. 1(b), the entire lower surface of each of the bus bars 10(1) to 10(3) is exposed to the outside, and the entire lower surface forms the lower connection portion 15.

[0025] The insulating resin film 20 is formed from various materials that have insulating properties and are strong enough to hold the multiple bus bars 10 while maintaining the gaps 19, and is formed from insulating resin materials such as polyamideimide, polyimide, polyamide, and epoxy.

[0026] The insulating resin film 20 has the same shape as the entirety of the plurality of bus bars 10 arranged in the same plane with the gaps 19 present, as viewed from above.

[0027] FIG. 2( a ) shows a plan view of the insulating resin film 20 . FIG. 2(b) is a cross-sectional view taken along line II(b)-II(b) in FIG. 2(a). The insulating resin film 20 has an opening that exposes at least a portion of the upper surface of each of the plurality of bus bars 10(1) to 10(3) to the outside.

[0028] As shown in Figures 1(a) and (b) and Figures 2(a) and (b), in this embodiment, the insulating resin film 20 has first to third openings 21(1) to 21(3) that expose a portion of the upper surface of each of the first to third bus bars 10(1) to 10(3).

[0029] The upper surfaces of each of the plurality of bus bars 10(1) to 10(3) that are exposed through openings (in this embodiment, the openings 21(1) to 21(3)) formed in the insulating resin film 20 form upper connection portions 17 of the bus bar assembly 1.

[0030] As shown in FIG. 1(c), it is also possible to form a single opening 25 in the insulating film 20 that integrally exposes at least a portion of the upper surface of each of the multiple bus bars 10(1) to 10(3).

[0031] The frame body 30 may be formed from various materials such as Cu, stainless steel, ceramic, etc., as long as it has the rigidity to cooperate with the insulating resin film 20 to hold the multiple bus bars 10 with the gaps 19 remaining, and is preferably formed from the same material as the bus bars 10.

[0032] The frame body 30 has a central opening 35 that penetrates vertically, and is adhered to the upper surface of the insulating resin film 20 so as to follow the peripheral region in a plan view of the busbar connection body formed by connecting the multiple busbars 10 by the insulating resin film 20.

[0033] FIG. 3( a ) shows a plan view of the frame 30 . FIG. 3(b) is a cross-sectional view taken along line III(b)-III(b) in FIG. 3(a). As shown in Figures 1(a) and (b) and Figures 3(a) and (b), in this embodiment, the frame body 30 has the same shape as the busbar connector in a plan view, and has the central opening 35 that penetrates vertically so as to open the central region of the busbar connector upward.

[0034] As shown in FIG. 1(b), in the bus bar assembly 1, insulating resin 40 is filled in the gaps 19(1) to 19(2).

[0035] The insulating resin 40 is formed by applying an insulating resin material having heat resistance and insulating properties, such as polyamideimide, polyimide, polyamide, or epoxy, into the gaps 19(1)-19(2) using a dispenser or the like, and then curing the applied resin. The insulating resin 40 is preferably formed using Insulead (registered trademark).

[0036] The insulating resin 40 is filled in the gaps 19 ( 1 ) to 19 ( 2 ) so as to cover at least the boundaries between the plurality of bus bars 10 ( 1 ) to 10 ( 3 ) and the insulating resin film 20 .

[0037] As shown in FIG. 1(b), in the present embodiment, the insulating resin 40 covers the boundaries between the multiple bus bars 10(1)-10(3) and the insulating resin film 20, and has a thickness thinner than the multiple bus bars 10(1)-10(3).

[0038] FIG. 4 shows a vertical cross-sectional view of an example of a semiconductor module 101 in which a semiconductor element 110 such as an LED is mounted on the bus bar assembly 1. In FIG. The semiconductor module 101 includes, as the semiconductor element 110, a first and a second semiconductor element 110(1) and 110(2).

[0039] Each of the first and second semiconductor elements 110(1), 110(2) has an upper electrode layer and a lower electrode layer 111, 112, respectively, on an upper surface on one side in the thickness direction and on a lower surface on the other side in the thickness direction, and has an element body 115 between the upper electrode layer and the lower electrode layer 111, 112.

[0040] In the semiconductor module 101, the first and second bus bars 10(1), 10(2) act as a first electrode which is one of the positive and negative electrodes (e.g., the positive electrode), and the third bus bar 10(3) acts as a second electrode which is the other of the positive and negative electrodes (e.g., the negative electrode).

[0041] That is, the first semiconductor element 110(1) has the lower electrode layer 112 fixed in an electrically connected state to the area of ​​the upper surface of the first bus bar 10(1) that acts as a first electrode, which is exposed by the first resin body opening 40(1), and the upper electrode layer 111 electrically connected to the area of ​​the upper surface of the third bus bar 10(3) that acts as a second electrode, which is exposed by the third resin body opening 40(3), via a first electrical connection member 120(1) such as wire bonding.

[0042] The second semiconductor element 110(2) has the lower electrode layer 112 fixed in an electrically connected state to a region of the upper surface of the second bus bar 10(2) that acts as a first electrode, the region being exposed by the second resin body opening 40(2), and the upper electrode layer 111 electrically connected via a second electrical connection member 120(2) such as wire bonding to a region of the upper surface of the third bus bar 10(3) that acts as a second electrode, the region being exposed by the third resin body opening 40(3).

[0043] Preferably, a plating layer (not shown) is provided on the upper surfaces of the first to third bus bars 10(1) to 10(3). In this case, the lower electrode layers 112 of the first and second semiconductor elements 110(1), 110(2) are die-bonded so as to be electrically connected to the plating layers on the upper surfaces of the first and second bus bars 10(1), 10(2), respectively, and the upper electrode layers 111 of the first and second semiconductor elements 110(1), 110(2) are wire-bonded to a plating layer (not shown) provided on the upper surface of the third bus bar 10(3) by the first and second electrical connection members 120(1), 120(2), respectively.

[0044] In addition, the reference numeral 130 in FIG. 4 denotes a sealing resin layer that is adhered to the upper surface of the bus bar assembly 1 to protect components such as the first and second semiconductor elements 110(1), 110(2) and the first and second electrical connection members 120(1), 120(2) mounted on the bus bar assembly 1.

[0045] The frame 30 prevents the resin material forming the sealing resin layer 130 from flowing out before hardening when the sealing resin layer 130 is provided. The sealing resin layer 130 is formed of a transparent resin material such as polyimide, polyamide, or epoxy.

[0046] Furthermore, in the busbar assembly 1 of this embodiment, at least the boundary between the upper surfaces of the multiple busbars 10 and the lower surface of the insulating resin film 20 is covered by the insulating resin 40 filled in the gap 19.

[0047] Therefore, the adhesion between the plurality of bus bars 10 and the insulating resin film 20 can be improved and maintained at a good level.

[0048] In addition, in the busbar assembly 1 according to this embodiment, the first to third busbars 10(1) to 10(3) are held by the insulating film 20 adhered to the upper surfaces of the first to third busbars 10(1) to 10(3) and the frame body 30 adhered to the upper surface of the insulating film 20, and the entire lower surfaces of the first to third busbars 10(1) to 10(3) are exposed. Therefore, when the bus bar assembly 1 is used as a semiconductor module 101, the heat dissipation characteristics via the lower surfaces of the first to third bus bars 10(1) to 10(3) can be improved.

[0049] An example of a method for manufacturing the busbar assembly 1 (hereinafter referred to as a first manufacturing method) will be described below. FIG. 5 shows a plan view of a conductive metal plate 200 for bus bars used in the first manufacturing method. 6(a) shows an enlarged view of part VI(a) in FIG. 5, and FIG. 6(b) shows a cross-sectional view taken along line VI(b)-VI(b) in FIG. 6(a).

[0050] As shown in Figures 5 and 6, the first manufacturing method includes a step of preparing a conductive metal flat plate 200 for a busbar, having a busbar assembly forming region 210 of the same thickness as the first to third busbars 10(1) to 10(3), and a slit forming step of forming a slit 215 in the busbar assembly forming region 210, the slit 215 having the same width as the gap 19 and penetrating between a first surface 211 on one side in the thickness direction and a second surface 212 on the other side in the thickness direction. 5 and 6 show the state after the slit forming step is completed.

[0051] As described above, the busbar assembly 1 according to this embodiment has three busbars, the first to third busbars 10(1) to 10(3), as the plurality of busbars 10. Therefore, in the busbar assembly forming region 210, first and second slits 215(1), 215(2) are formed as the slits 215. For example, when manufacturing a bus bar assembly in which two bus bars are arranged in parallel, one slit is formed.

[0052] As shown in Figures 5 and 6(a), in this embodiment, the conductive metal plate 200 for a busbar has a busbar row 205 including a plurality of the busbar assembly forming regions 210 arranged in series along the Y direction in the XY plane in which the conductive metal plate 200 is located, and a connecting region 230 connecting adjacent busbar assembly forming regions 210 in the Y direction, so that processing can be performed simultaneously on the plurality of busbar assembly forming regions 210.

[0053] In this embodiment, the conductive metal plate 200 for busbars has a pair of gripping pieces 207 respectively connected to one side and the other side of the longitudinal direction (Y direction) of the busbar row 205, and alignment holes 208 are provided in the pair of gripping pieces 207.

[0054] It is also possible to arrange a plurality of busbar rows 205 in parallel in the X direction, and to integrally hold the plurality of busbar rows 205 arranged in parallel in the X direction by the pair of gripping pieces 207, 207. According to this modified configuration, a larger number of bus bar assemblies 1 can be manufactured at the same time.

[0055] In this embodiment, the busbar assembly forming region 210 has its Y-direction length set to be the same as the length of the busbar assembly 1 in a direction parallel to the gap 19, and its X-direction length and Y-direction length are set to be the same as the length of the busbar assembly 1 in a direction perpendicular to the gap 19.

[0056] The slits 215(1), 215(2) form the first and second gaps 19(1), 19(2), and have the same width as the corresponding first and second gaps 19(1), 19(2). The widths of the first and second gaps 19(1), 19(2) are determined according to the specifications of the busbar assembly 1.

[0057] As shown in FIG. 6(a), in this embodiment, first and second slits 215(1), 215(2) formed in one busbar assembly forming area 210A extend at one longitudinal side (Y direction) into one connecting area 230A(1) connected to one longitudinal side (Y direction) of the one busbar assembly forming area 210A, and extend at the other longitudinal side (Y direction) into another connecting area 230A(2) connected to the other longitudinal side (Y direction) of the one busbar assembly forming area 230A.

[0058] In the state after the slit forming step, the first to third busbar forming regions 220(1) to 220(3) adjacent to each other via the first and second slits 215(1) and 215(2) formed in the one busbar assembly forming region 210A are , are configured to be maintained in a connected state with respect to each other via the one connecting region 230A(1) and the other connecting region 230A(2). With this configuration, the first and second slits 215(1), 215(2) (the first and second gaps 19(1), 19(2)) can be formed with high precision.

[0059] The first manufacturing method includes, after the slit forming process, a film bonding process of bonding a film body 20' that forms the insulating resin film 20 to a first surface 211 (the upper surface on which the semiconductor element 110 is mounted) on one side in the thickness direction of the busbar assembly forming area 210.

[0060] FIG. 7 shows a plan view of the conductive metal plate 200 for bus bars after the film bonding step. 8(a) shows an enlarged view of part VIII(a) in FIG. 7, and FIG. 8(b) shows a cross-sectional view taken along line VIII(b)-VIII(b) in FIG. 8(a).

[0061] In this embodiment, the film body 20 ′ has the same outer shape as the bus bar assembly forming area 210 in a plan view, and is configured to cover the entire upper surface of the bus bar assembly forming area 210 .

[0062] The first manufacturing method includes a frame forming process which is carried out in parallel with, or before or after, the processes from the process of preparing the conductive metal plate 200 for bus bars to the film bonding process.

[0063] FIG. 9 shows a plan view of a frame plate 300 used in the frame forming process. 10(a) shows an enlarged view of part X(a) in FIG. 9, and FIG. 10(b) shows a cross-sectional view taken along line X(b)-X(b) in FIG. 10(a).

[0064] The frame body forming process includes a step of preparing a frame body flat plate 300 including a frame body forming region 310 having the same thickness as the frame body 30 and an outer shape corresponding to the frame body 30 in a planar view, and a removal step of removing unnecessary portions of the frame body forming region 310 by punching, etching, or the like so as to leave a frame body forming portion 320 corresponding to the frame body 30.

[0065] FIG. 9 shows the state after the removal step. As shown in FIG. 9, in the present embodiment, in the removing step, the center of the frame forming region 310 in plan view is removed to form the central opening.

[0066] The frame plate 300 is made of various materials having rigidity. Preferably, the frame body flat plate 300 is formed from the same material as the bus bar conductive metal flat plate 200 .

[0067] The frame body flat plate 300 is configured so that, when it is laminated on the bus bar conductive metal flat plate 200, the frame body forming region 310 is aligned with the bus bar assembly forming region 210. In this embodiment, the frame body 30 has the same external shape as the busbar connector when viewed in a plan view, and therefore the frame body forming area 310 has the same external shape as the busbar assembly forming area 210 when viewed in a plan view.

[0068] In detail, as described above, the conductive metal plate 200 for busbars has a busbar row 205 including a plurality of the busbar assembly forming regions 210 arranged in series along the Y direction, and a connecting region 230 connecting adjacent busbar assembly forming regions 210 in the Y direction.

[0069] Therefore, as shown in Figure 9, the frame body flat plate 300 has a frame body row 305 including a plurality of frame body forming regions 310 arranged in series in the Y direction at the same pitch as the plurality of busbar assembly forming regions 210, and a connecting region 330 connecting adjacent frame body forming regions 310 in the Y direction.

[0070] As described above, the conductive metal plate 200 for busbars has a pair of gripping pieces 207 respectively connected to one side and the other side in the longitudinal direction (Y direction) of the busbar row 205, and alignment holes 208 are provided in the pair of gripping pieces 207.

[0071] Accordingly, as shown in Figure 9, the frame body flat plate 300 is also provided with a pair of gripping pieces 307 respectively connected to one side and the other side of the frame body row 305 in the longitudinal direction (Y direction), and the pair of gripping pieces 307 are provided with alignment holes 308 corresponding to the alignment holes 208.

[0072] The first manufacturing method includes a plate bonding process of polymerizing the conductive metal plate 200 for busbars and the plate 300 for frame body, and bonding the frame body forming region 310 to the first surface 211 of the corresponding busbar assembly forming region 210 via the insulating resin film 20.

[0073] FIG. 11 shows a plan view of the conductive metal plate 200 for bus bars and the frame plate 300 after the plate bonding step. FIG. 12 is a cross-sectional view taken along line XII-XII in FIG.

[0074] The first manufacturing method further includes a step of providing insulating resin for slits, which provides the insulating resin 40 in the slits 19 at an arbitrary timing after the film bonding step.

[0075] In this embodiment, the step of providing insulating resin for slits is performed after the step of bonding the flat plates. FIG. 13 shows a cross-sectional view of the conductive metal flat plate 200 for bus bars and the frame body flat plate 300 after the slit insulating resin providing step.

[0076] The insulating resin installation process for the slit is configured to provide the insulating resin body 40 in the slit 19 by applying an insulating resin material having heat resistance and insulating properties, such as polyamideimide, polyimide, polyamide, epoxy, etc., using a dispenser or the like from the side opposite the film body 20' into the slit 19 and curing it.

[0077] With one thickness-wise end of the slit 19 blocked by the film body 20', an insulating resin material is injected into the slit 19 from the other thickness-wise side of the slit 19 to provide the insulating resin 40, whereby the boundary between the upper surface of the busbar 10 and the lower surface of the film body 20' can be effectively covered by the insulating resin 40.

[0078] The first manufacturing method further includes a busbar exposing step of exposing at least a part of the portion of the upper surface of each of the plurality of busbar forming portions 220 that is surrounded by the frame body forming portion 320.

[0079] In this embodiment, the bus bar exposing step is configured to irradiate laser light L onto the portion to be exposed.

[0080] FIG. 14 is a schematic vertical cross-sectional view showing the bus bar exposing step. In addition, the symbol L in FIG. 14 denotes a laser beam.

[0081] As described above, in the bus bar assembly 1, the insulating film 20 has the same number of openings 21(1) to 21(3) as the plurality of bus bars 10(1) to 10(3). Therefore, in the present embodiment, the bus bar exposing step is configured to form the openings 21(1) to 21(3) in the film body 20' to obtain the insulating film 20.

[0082] In the first manufacturing method of this embodiment, the film bonding process is configured to bond the film body 20' covering the entire upper surface of the busbar assembly formation area 210, and the busbar exposure process is configured to form the predetermined openings 21(1) to 21(3) in the film body 20' to obtain the insulating film 20.

[0083] Alternatively, in the film bonding step, it is also possible to modify the insulating film 20, in which the predetermined openings 21(1) to 21(3) are formed in advance, so as to bond the insulating film 20 to the upper surface of the busbar assembly forming region 210. In this case, the busbar exposing step is omitted.

[0084] The first manufacturing method further includes a cutting process of cutting the busbar assembly forming region 210 and the frame body forming region 310 from the busbar conductive metal flat plate 200 and the frame body flat plate 300 after both the busbar exposing process and the slit insulating resin installing process are completed.

[0085] The cutting step is configured to cut the busbar assembly forming region 210 and the frame body forming region 310 along cutting lines C1 and C2 along edges on one and the other sides in the Y direction, respectively, as shown in FIG.

[0086] 16(a) to (c) show cross-sectional views corresponding to FIG. 1(b) of busbar assemblies 1A to 1C according to first to third modified examples of the present embodiment, respectively. In the figure, the same members as those in this embodiment are denoted by the same reference numerals.

[0087] Compared to the busbar assembly 1 according to the present embodiment, the busbar assembly 1A according to the first modified example further has an insulating resin 42 that covers the boundary between the inner surface of the frame body 30 and the upper surface of the insulating resin film 20.

[0088] Compared to the busbar assembly 1 according to the present embodiment, the busbar assembly 1B according to the second modified example further has an insulating resin 44 covering the boundary between the outer surface of the frame body 30 and the upper surface of the insulating resin film 20.

[0089] The bus bar assembly 1C according to the third modified example further includes the insulating resin 42 and the insulating resin 44, as compared with the bus bar assembly 1 according to the present embodiment.

[0090] The busbar assemblies 1A to 1C according to the first to third modified examples have the same effects as the busbar assembly 1 according to the present embodiment, and can further improve the adhesion between the frame body 30 and the insulating film 20.

[0091] The insulating resins 42 and 44 are provided at any timing after the plate bonding step and before the cutting step, and are preferably provided at the same timing as the slit insulating resin providing step.

[0092] Embodiment 2 Hereinafter, another embodiment of the bus bar assembly according to the present invention will be described with reference to the accompanying drawings.

[0093] FIG. 17(a) shows a plan view of a busbar assembly 2 according to this embodiment. 17(b) and (c) are cross-sectional views taken along lines XVII(b)-XVII(b) and XVII(c)-XVII(c) in FIG. 17(a), respectively. Further, FIG. 18 shows a vertical cross-sectional view of an example of a semiconductor module 102 in which a semiconductor element 110 such as an LED is mounted on the bus bar assembly 2. As shown in FIG. In the figure, the same members as those in the first embodiment are given the same reference numerals.

[0094] As shown in Figures 17(a) to (c) and 18, the busbar assembly 2 of this embodiment differs from the busbar assembly 1 of the first embodiment in that the frame body 30 is changed to a frame body 430.

[0095] FIG. 19( a ) shows a plan view of the frame 430 . 19(b) and (c) are cross-sectional views taken along lines XIX(b)-XIX(b) and XIX(c)-XIX(c) in FIG. 19(a), respectively.

[0096] As shown in Figures 19(a) to (c), the frame body 430 has an inner frame portion 440 that is positioned on the inside when viewed in a plane and has the central opening 35, an outer frame portion 450 that surrounds the inner frame portion 440 while leaving a gap 445 when viewed in a plane, and a connecting portion 460 that connects the inner frame portion 440 and the outer frame body 450.

[0097] In this embodiment, as shown in FIG. 17(a) and FIG. 19(a), a plurality of the connecting portions 460 are arranged spaced apart in the circumferential direction.

[0098] In the busbar assembly 2, as shown in Figures 17(b) and (c) and Figure 18, an insulating resin 46 is provided in the gap 445 between the inner frame portion 440 and the outer frame portion 450, so as to cover the boundaries between the inner frame portion 440 and the outer frame portion 450 and the insulating film 20.

[0099] According to the busbar assembly 2 of this embodiment, the insulating resin 40 improves the adhesion between the upper surfaces of the multiple busbars 10 and the lower surface of the insulating resin film 20, and the insulating resin 46 improves the adhesion between the lower surface of the frame body 430 and the upper surface of the insulating resin film 20.

[0100] A manufacturing method for manufacturing the bus bar assembly 2 (hereinafter, referred to as a second manufacturing method) is modified from the first manufacturing method in that a frame body flat plate 500 is used instead of the frame body flat plate 300.

[0101] FIG. 20 shows a plan view of the frame plate 500. As shown in FIG. 21(a) to (c) respectively show an enlarged view of part XX(a) in FIG. 20, a cross-sectional view taken along line XXI(b)-XXI(b) in FIG. 21(a), and a cross-sectional view taken along line XXI(c)-XXI(c) in FIG. 21(a).

[0102] The frame body flat plate 500 has a frame body forming region 510 which has the same thickness as the frame body 430 and has an outer shape corresponding to the frame body 430 in a planar view, and a frame body forming portion 520 corresponding to the frame body 430 is formed by removing unnecessary portions of the frame body forming region 510 by punching, etching, or the like.

[0103] Compared to the first manufacturing method, the second manufacturing method further includes a frame gap insulating resin installation process, in which the insulating resin 46 is provided in the gap 445 between the inner frame portion 440 and the outer frame portion 450 at any timing after the flat plate bonding process and before the cutting process.

[0104] The bus bar assembly 2 according to the present embodiment may also include the insulating resin 42 and / or the insulating resin 44. 22(a) to (c) are cross-sectional views corresponding to FIG. 17(b) of busbar assemblies 2A to 2C according to first to third modified examples of the present embodiment, respectively.

[0105] In the bus bar assembly 2A according to the first modified example, the boundary between the inner side surface of the inner frame portion 440 and the insulating resin film 20 is covered with the insulating resin 42, as shown in FIG. 22(a).

[0106] In the bus bar assembly 2B according to the second modified example, the boundary between the outer surface of the outer frame portion 450 and the insulating resin film 20 is covered with the insulating resin 44, as shown in FIG. 22(b).

[0107] In the busbar assembly 2C of the third modified example, as shown in Figure 22 (c), the boundary between the inner surface of the inner frame portion 440 and the insulating resin film 20 is covered with the insulating resin 42, and the boundary between the outer surface of the outer frame portion 450 and the insulating resin film 20 is covered with the insulating resin 44.

[0108] Third embodiment Hereinafter, still another embodiment of a bus bar assembly according to the present invention will be described with reference to the accompanying drawings.

[0109] FIG. 23 shows a vertical cross-sectional view of an example of a semiconductor module 103 in which a semiconductor element 110 such as an LED is mounted on a bus bar assembly 3 according to the present embodiment. In the figure, the same members as those in the first and second embodiments are denoted by the same reference numerals.

[0110] Compared to the busbar assembly 1 according to the first embodiment, the busbar assembly 3 according to the present embodiment includes an insulating resin body 50 instead of the frame body 30.

[0111] The insulating resin body 50 is formed from an insulating resin material having heat resistance and insulating properties, such as polyamideimide, polyimide, polyamide, epoxy, etc., and is provided on the upper surface of the insulating resin film 20 so as to follow the planar peripheral region of the busbar connector connected by the insulating resin film 20.

[0112] A method (third manufacturing method) for manufacturing the busbar assembly 3 in this embodiment includes an insulating resin body forming process instead of the frame body forming process (the process of preparing a flat plate for the frame body and the process of removing unnecessary portions of the frame body forming region) and the flat plate bonding process, as compared to the first manufacturing method.

[0113] FIG. 24 shows a plan view of the conductive metal plate 200 for bus bars after the insulating resin body forming step. FIG. 25 shows a cross-sectional view taken along line XXV-XXV in FIG.

[0114] The insulating resin body forming process is configured to apply the insulating resin material along the planar peripheral region of the busbar forming region 210 using a dispenser or the like, and then harden the insulating resin material to provide the insulating resin body 50 on the upper surface of the insulating film 20.

[0115] The insulating resin body 50 has a height that can prevent the resin material forming the sealing resin layer 130 from flowing out before it is cured. [Explanation of symbols]

[0116] 1~3 Busbar Assembly 10(1)~10(3) 1st~3rd busbars 19 Gap 20 Insulating resin film 21(1)~21(3) 1st~3rd film openings 30, 430 frame 40, 42, 44, 46 Insulating resin 50 Insulating resin body 200 Conductive metal flat plate for busbar 210 Busbar assembly forming area 215(1), 215(2) First and second slits 220(1)~220(3) 1st~3rd busbar forming area 300 Frame plate 310 Frame forming area 440 Inner frame 445 Gap 450 Outer frame 460 Connection section L Laser light

Claims

1. A plurality of bus bars formed of conductive flat plate members and arranged in the same plane with a gap between opposing side surfaces; an insulating resin film bonded to upper surfaces of the bus bars so as to connect the bus bars with the gaps present; a rigid frame having a central opening penetrating vertically, the frame being adhered to an upper surface of the insulating resin film so as to follow a peripheral region in a plan view of a bus bar connected body formed by connecting the plurality of bus bars with the insulating resin film, the bus bar has, on a lower surface, a lower connection portion exposed to the outside, and on an upper surface, an upper connection portion exposed to the outside through an opening formed in the insulating resin film within a central opening of the frame, a bus bar assembly including: an insulating resin provided in the gap so as to cover a boundary between the bus bar and the insulating resin film;

2. 2. The bus bar assembly according to claim 1, wherein a boundary between an inner surface of the frame and an upper surface of the insulating resin film is covered with an insulating resin.

3. 3. The busbar assembly according to claim 1, wherein a boundary between an outer surface of the frame and an upper surface of the insulating resin film is covered with an insulating resin.

4. The frame body has an inner frame portion disposed on the inside in a plan view and having the central opening, an outer frame portion surrounding the inner frame portion with a gap in a plan view, and a connecting portion connecting the inner frame portion and the outer frame body, The bus bar assembly according to claim 1 , wherein an insulating resin is provided in the gap so as to cover boundaries between the inner frame portion and the insulating film, and between the outer frame portion and the insulating film.

5. The bus bar assembly according to claim 4, wherein a boundary between an inner surface of the inner frame portion and the insulating resin film is covered with an insulating resin.

6. 6. The bus bar assembly according to claim 4, wherein a boundary between an outer surface of the outer frame portion and the insulating resin film is covered with an insulating resin.

7. A plurality of bus bars formed of conductive flat plate members and arranged in the same plane with a gap between opposing side surfaces; an insulating resin film bonded to upper surfaces of the bus bars so as to connect the bus bars with the gaps present; an insulating resin body provided on an upper surface of the insulating resin film so as to extend along a peripheral region in a plan view of a bus bar connected body formed by connecting the plurality of bus bars with the insulating resin film, the bus bar has, on a lower surface, a lower connection portion exposed to the outside, and on an upper surface, an upper connection portion exposed to the outside through an opening formed in the insulating resin film within a central opening of the frame, a bus bar assembly including: an insulating resin provided in the gap so as to cover a boundary between the bus bar and the insulating resin film;

8. A method for manufacturing a busbar assembly including: a plurality of busbars formed of conductive flat plate-like members and arranged in parallel in the same plane with gaps between opposing side surfaces; an insulating resin film adhered to upper surfaces of the plurality of busbars so as to connect the plurality of busbars with the gaps; and a rigid frame having a central opening passing therethrough in a vertical direction, the frame being adhered to the upper surface of the insulating resin film so as to fit along a peripheral region in a plan view of a busbar connected body formed by connecting the plurality of busbars by the insulating resin film, preparing a conductive metal plate for bus bars having a bus bar assembly forming region for forming the plurality of bus bars; a slit forming step of forming one or more slits in the bus bar assembly forming region, the slits penetrating between the upper surface and the lower surface and having the same width as the gap, to form a plurality of bus bar forming portions corresponding to the plurality of bus bars; a film bonding step of bonding the insulating resin film to an upper surface of the bus bar assembly forming region; a frame forming process carried out before or after, or in parallel with, the process from the process of preparing the conductive metal plate for bus bars to the process of adhering the film, the frame forming process including a process of preparing a frame plate having a frame forming region having an outer shape corresponding to the frame, and a process of removing unnecessary portions of the frame forming region so as to leave a frame forming portion corresponding to the frame; a plate bonding process for bonding the frame plate to the bus bar conductive metal plate after the film bonding process so that the frame plate forming region overlaps the bus bar assembly forming region in a plan view; a slit insulating resin providing step of providing insulating resin in the slit so as to cover a boundary between the bus bar and the insulating resin film at an arbitrary timing after the film bonding step; a bus bar exposing step of exposing at least a part of an upper surface of each of the plurality of bus bar forming portions at an arbitrary timing after the film bonding step; a cutting process for cutting the busbar assembly forming region and the frame body forming region from the busbar conductive metal flat plate and the frame body flat plate after both the busbar exposing process and the slit insulating resin installing process are completed.

9. The method for manufacturing a busbar assembly as described in claim 8, further comprising a frame side insulating resin installation process, which provides insulating resin to cover the boundary between at least one of the inner and outer sides of the frame forming portion and the insulating film at any timing after the flat plate bonding process and before the cutting process.

10. the frame forming portion formed by the frame forming process is disposed on the inside in a plan view, and has an inner frame portion having the central opening, an outer frame portion surrounding the inner frame portion while leaving a gap in a plan view, and a connecting portion connecting the inner frame portion and the outer frame portion, The manufacturing method for a busbar assembly as described in claim 8 or 9, characterized in that the manufacturing method further includes a frame gap insulating resin installation process, which provides insulating resin in the gap so as to cover the boundaries between the inner frame portion and the outer frame portion and the insulating film at any timing after the flat plate bonding process and before the cutting process.

11. A method for manufacturing a bus bar assembly including a plurality of bus bars formed of a conductive flat plate member and arranged in parallel in the same plane with a gap between opposing side surfaces, and an insulating resin film bonded to upper surfaces of the plurality of bus bars so as to connect the plurality of bus bars with the gap, the method comprising the steps of: preparing a conductive metal plate for bus bars having a bus bar assembly forming region for forming the plurality of bus bars; a slit forming step of forming one or more slits in the bus bar assembly forming region, the slits penetrating between the upper surface and the lower surface and having the same width as the gap, to form a plurality of bus bar forming portions corresponding to the plurality of bus bars; a film bonding step of bonding the insulating resin film to an upper surface of the bus bar assembly forming region; an insulating resin body forming step of providing an insulating resin body on an upper surface of the insulating resin film so as to be aligned along a peripheral region of the bus bar assembly forming region in a plan view; a slit insulating resin providing step of providing insulating resin in the slit so as to cover a boundary between the bus bar and the insulating resin film at an arbitrary timing after the film bonding step; a bus bar exposing step of exposing at least a part of an upper surface of each of the plurality of bus bar forming portions at an arbitrary timing after the film bonding step; a cutting process for cutting the busbar assembly forming region and the frame body forming region from the busbar conductive metal flat plate and the frame body flat plate after both the busbar exposing process and the slit insulating resin installing process are completed.

12. 12. The method for manufacturing a bus bar assembly according to claim 8, 9 or 11, wherein the bus bar exposing step is performed by removing a predetermined portion of the insulating resin film by irradiating it with laser light.

Images