Electric power conversion system

Abstract

To provide an electric power conversion system which enables efficient cooling of a first electronic component and a second electronic component and downsizing of the electric power conversion system.SOLUTION: An electric power conversion system 10 includes a housing body 20 including a first housing 11 and a second housing 21. The first housing 11 includes a passage formation part 12 made of a perforated pipe which defines a plurality of first passages 12a arranged parallel to each other. First electronic components 31 are disposed on both surfaces in a third direction Z of the first housing 11 in a manner that enables heat exchange with a coolant flowing in the first passages 12a. The second housing 21 is disposed at one of the surfaces in the third direction Z in the first housing 11. In the second housing 21, a second passage 27 communicating with the first passages 12a is defined. A second electronic component 41 is disposed in the second housing 21 in a manner that enables heat exchange with a coolant flowing in the second passage 27.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a power conversion device. [Background technology]

[0002] The power conversion device includes electronic components that generate heat, and a cooler that cools the electronic components. For example, a power module disclosed in Patent Document 1 includes a body to be cooled as the heat generating component, and a heat sink as a cooler that recovers heat from the body to be cooled.

[0003] The heat sink has a two-layer structure including a first heat sink body having a supply water passage formed therein, and a second heat sink body provided on the surface of the first heat sink body and having a lower bending rigidity than the first heat sink body. The second heat sink body is a multi-hole pipe. A cooling water passage is formed inside the second heat sink body, which is connected to the supply water passage formed in the first heat sink body.

[0004] The object to be cooled is mounted on a portion of the surface of the second heatsink body that is located directly above the cooling water passage. The object to be cooled mounted on the second heatsink body is cooled by the coolant flowing from the supply water passage of the first heatsink body to the cooling water passage of the second heatsink body. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2007-273755 A Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, there has been a demand for power conversion devices that are more compact and have a greater ability to cool electronic components. [Means for solving the problem]

[0007] A power conversion device for solving the above problems comprises a housing main body including a first housing in which a first electronic component, which is a heat-generating component, is arranged, and a second housing in which a second electronic component, which is a heat-generating component, is arranged, and the first housing has a flow path forming section made of a multi-hole pipe that defines a plurality of first flow paths arranged in parallel, and when a direction in which the plurality of first flow paths are arranged in the flow path forming section and a direction perpendicular to a direction in which the first flow paths extend are defined as a thickness direction of the first housing, the first electronic component is arranged on at least one side of both sides of the first housing in the thickness direction so as to be able to exchange heat with a cooling medium flowing through the first flow path, and the second housing is arranged on either one side of both sides of the first housing in the thickness direction, and the second housing defines a second flow path therein that is connected to the first flow path, and the second electronic component is arranged in the second housing so as to be able to exchange heat with the cooling medium flowing through the second flow path.

[0008] According to this, the first electronic component arranged in the first housing can be cooled by heat exchange with the cooling medium flowing through the first flow path. Also, the second electronic component arranged in the second housing can be cooled by heat exchange with the cooling medium flowing through the second flow path. Therefore, the first electronic component is individually cooled in the first housing, and the second electronic component is individually cooled in the second housing. And, each of the first housing and the second housing is a housing in which the electronic components can be arranged, and at the same time, a cooler that can cool the electronic components. For example, the power conversion device can be made smaller than a case in which a cooler is provided separately from the first housing in which the first electronic component is arranged, or a cooler is provided separately from the second housing in which the second electronic component is arranged. As a result, each of the first electronic component and the second electronic component can be efficiently cooled, and the power conversion device can be made smaller.

[0009] In the power converter, the second housing may include a fin exposed to the second flow path. This allows the surface area of ​​the second housing exposed to the second flow path to be larger than in the case where there are no fins, so that heat generated in the second electronic component can be efficiently dissipated from the fins to the cooling medium flowing through the second flow path, thereby more effectively cooling the second electronic component than in the case where there are no fins.

[0010] In a power conversion device, the flow path forming portion may have an attachment hole for attaching the second housing to the first housing, and the attachment hole may be formed between adjacent first flow paths in the direction in which the multiple first flow paths are arranged.

[0011] According to this, even if the first housing uses a flow passage forming portion made of a multi-hole pipe, the second housing can be attached. In the power conversion device, a header flow path communicating with the plurality of first flow paths is defined in the first housing, and the flow path forming portion is provided with a header flow path forming recess that opens to one side of the flow path forming portion in the plate thickness direction and defines the header flow path, and the first flow path and the second flow path may be communicated through the header flow path forming recess.

[0012] This makes it easier to form the header flow path than when the header flow path is formed in the first housing by, for example, post-processing a flow path forming portion to define the header flow path. Effect of the Invention

[0013] According to the present invention, the first electronic component and the second electronic component can be cooled efficiently, and the power conversion device can be made smaller in size. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view that illustrates a power conversion device according to a first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view that illustrates the power conversion device of the first embodiment. [Diagram 3] FIG. 3 is an exploded perspective view showing the power conversion device of the first embodiment. [Figure 4] FIG. 4 is a plan view that illustrates the power converter of the first embodiment. [Diagram 5] FIG. 5 is a plan view showing the second electronic component and the second housing of the first embodiment. [Figure 6] FIG. 6 is an exploded perspective view showing a power converter according to the second embodiment. [Figure 7] FIG. 7 is a plan view showing the power converter according to the second embodiment. [Figure 8] FIG. 8 is an exploded perspective view showing another example of the first housing of the first embodiment. [Figure 9] FIG. 9 is a plan view showing a power converter according to another embodiment. [Figure 10] FIG. 10 is a plan view showing a power converter according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] (First embodiment) A first embodiment of a power conversion device will be described below with reference to Figs. 1 to 5. <Power conversion device> 1 and 2, the power converter 10 includes a housing body 20 including a first housing 11 in which a first electronic component 31 is disposed, and a second housing 21 in which a second electronic component 41 is disposed. In addition, a cooling water flow path 51 is defined inside the power converter 10, through which cooling water flows as a cooling medium.

[0016] <Main unit> The housing body 20 is formed by integrally assembling a first housing 11 and a second housing 21 together. <First cabinet> The first housing 11 is made of a metal. An example of the metal that forms the first housing 11 is an aluminum alloy.

[0017] 3, the first housing 11 includes a flow path forming portion 12 and a pair of header forming portions 13. The first housing 11 is formed by integrating the flow path forming portion 12 and the pair of header forming portions 13 by brazing or welding. The first housing 11 functions as a box that defines a flow path for the cooling water therein.

[0018] As shown in Figs. 2 and 3, the first housing 11 is in the form of a flat, long plate. The flow path forming portion 12 is a multi-hole pipe and is also in the form of a flat, long plate. The flow path forming portion 12 is a flat tube in which a plurality of first flow paths 12a are defined therein. The plurality of first flow paths 12a of the flow path forming portion 12 are elongated holes through which cooling water can flow. The flow path forming portion 12 is an extrusion multi-hole formed by extrusion molding. Each of the first flow paths 12a extends linearly over the entire first direction X of the flow path forming portion 12. Therefore, the flow path forming portion 12 is made of a multi-hole pipe that defines a plurality of first flow paths 12a arranged in parallel.

[0019] The first direction X is the longitudinal direction of the flow path forming part 12. Each of the first flow paths 12a extends in the first direction X, and the first flow paths 12a are arranged parallel to each other in the lateral direction of the flow path forming part 12. The direction in which the first flow paths 12a are arranged, that is, the lateral direction of the flow path forming part 12, is defined as the second direction Y, and the direction perpendicular to the first direction X and the second direction Y is defined as the third direction Z. The third direction Z is the direction in which the first flow paths 12a are arranged in the flow path forming part 12 and the direction perpendicular to the extension direction of the first flow paths 12a, and is the plate thickness direction of the first housing 11. Since the longitudinal direction of the flow path forming part 12 is also the longitudinal direction of the first housing 11, the first direction X of the flow path forming part 12 is defined as the first direction X of the first housing 11. In addition, since the short side direction of the flow path forming section 12 is also the short side direction of the first housing 11, the second direction Y of the flow path forming section 12 is the second direction Y of the first housing 11.

[0020] The flow path forming portion 12 includes flat portions 12c located on both sides in the third direction Z, and wall portions 12d arranged between the flat portions 12c in the third direction Z. The first flow path 12a is defined between the pair of flat portions 12c and the wall portions 12d adjacent to each other in the second direction Y.

[0021] The flow path forming section 12 has demarcating surfaces Ha of header flow path forming recessed sections H at both ends in the first direction X. The header flow path forming recessed sections H are recessed from a first end face side toward a second end face side in the third direction Z of the flow path forming section 12, and are recessed from both end faces in the first direction X of the flow path forming section 12 toward the center. The header flow path forming recessed sections H are open toward one end in the third direction Z and the end in the first direction X of the flow path forming section 12.

[0022] The demarcation surface Ha of the header flow-path forming recess H defines the header flow-path forming recess H from the second end face side in the third direction Z, and also defines the header flow-path forming recess H from both end faces in the second direction Y. Furthermore, of the demarcation surfaces Ha of the header flow-path forming recess H, the first flow path 12a opens to the demarcation surface Ha at a position recessed from the end face in the first direction X.

[0023] The flow path forming section 12 includes a first flow path group 121 including three first flow paths 12a, and a second flow path group 122 including three first flow paths 12a. The first flow path group 121 and the second flow path group 122 are arranged separately on both sides in the second direction Y. In each of the first flow path group 121 and the second flow path group 122, a wall portion 12d that separates the first flow paths 12a adjacent to each other in the second direction Y is defined as a first partition wall H1.

[0024] The wall 12d separating the first flow path group 121 and the second flow path group 122 is defined as a second partition wall H2. The second partition wall H2 is provided at a location sandwiched between the first flow paths 12a of the first flow path group 121 and the first flow paths 12a of the second flow path group 122 that are close to the center in the second direction Y. The dimension of the second partition wall H2 in the second direction Y is larger than the dimension of the first partition wall H1 in the second direction Y.

[0025] The second partition H2 has a mounting hole 12b recessed from the flat surface portion 12c located on the first end surface side in the third direction Z. Also, a mounting hole 12b recessed from the flat surface portion 12c located on the first end surface side in the third direction Z is formed at one end of the flow path forming part 12 in the second direction Y. The mounting hole 12b is a female thread hole for mounting the second housing 21 to the first housing 11. The mounting hole 12b formed in the center of the flow path forming part 12 in the second direction Y is formed in the direction in which the multiple first flow paths 12a are arranged, that is, between the first flow paths 12a adjacent to each other in the second direction Y.

[0026] The dimension of each header forming portion 13 in the first direction X is the same as the dimension of the header flow-path forming recess H in the first direction X. The dimension of each header forming portion 13 in the second direction Y is the same as the dimension of the header flow-path forming recess H in the second direction Y. In addition, the dimension of each header forming portion 13 in the third direction Z is the same as the dimension of the header flow-path forming recess H in the third direction Z.

[0027] The header forming portion 13 includes a first forming portion 13a having a long plate shape whose longitudinal direction extends in the second direction Y, and a second forming portion 13b having a long plate shape extending from one end edge in the short direction of the first forming portion 13a and whose longitudinal direction extends in the second direction Y. When the header forming portion 13 is viewed in the longitudinal direction, the header forming portion 13 is L-shaped.

[0028] Both longitudinal end faces of the first forming portion 13a and both longitudinal end faces of the second forming portion 13b are joined to a demarcating surface Ha that defines both end faces of the header flow path forming recess H in the second direction Y. The end face of the first forming portion 13a opposite to the second forming portion 13b is joined to a demarcating surface Ha where the first flow path 12a opens. The end face of the second forming portion 13b opposite to the first forming portion 13a is joined to a demarcating surface Ha on the second end face side in the third direction Z of the demarcating surfaces Ha of the header flow path forming recess H. Each header forming portion 13 closes the header flow path forming recess H from the first end face side in the third direction Z and also closes it from the end face side in the first direction X. Thus, the header flow path T is defined by the header flow path forming recess H and the header forming portion 13 at both ends in the first direction X of the first housing 11.

[0029] Of the pair of header flow paths T, one header flow path T communicating with the first pipe connection portion 16 is referred to as a first header flow path T1, and the other header flow path T is referred to as a second header flow path T2. Each of the first header flow path T1 and the second header flow path T2 is defined by a defining surface Ha of the header flow path forming recess H in the flow path forming portion 12 and an inner surface of the header forming portion 13. Each of the first header flow path T1 and the second header flow path T2 communicates with each of the first flow paths 12a. Therefore, the first housing 11 defines a header flow path T communicating with a plurality of first flow paths 12a. That is, the flow path forming portion 12 is provided with a header flow path forming recess H that opens to a first end surface of the flow path forming portion 12 in the third direction Z and defines the header flow path T. Each of the first header flow path T1 and the second header flow path T2 extends over almost the entirety of the second direction Y.

[0030] One of the header forming portions 13 is provided with a first pipe connecting portion 16. A supply pipe 17 for supplying cooling water is connected to the first pipe connecting portion 16. In addition, the other header forming portion 13 is formed with a female thread hole 13c that is the same as the mounting hole 12b of the flow path forming portion 12.

[0031] The header forming portion 13 that defines the second header flow path T2 has a water channel through hole 13d that communicates with the second header flow path T2. The water channel through hole 13d penetrates the first forming portion 13a of the header forming portion 13 in the third direction Z.

[0032] <Second cabinet> The second housing 21 is made of a metal. An example of the metal that forms the second housing 21 is an aluminum alloy.

[0033] The second housing 21 is formed by integrating a box-shaped main body 22, a flange 23, a plurality of fins 24, and a second pipe connection portion 26. The main body 22 includes a top plate 22a, a first peripheral wall 22b standing on the periphery of the top plate 22a, and a second peripheral wall 22c standing on the opposite side to the first peripheral wall 22b from the top plate 22a. The first peripheral wall 22b and the second peripheral wall 22c form a continuous rectangular tube in the third direction Z.

[0034] A second flow path 27 is defined inside the main body 22. The second flow path 27 is defined by the top plate 22a and the first peripheral wall 22b. The multiple fins 24 are cylindrical, so-called pin fins, protruding from the top plate 22a toward the second flow path 27. Therefore, the second housing 21 is provided with fins 24 exposed to the second flow path 27. Note that the fins 24 provided in the second housing 21 may be other than cylindrical pin fins, and may be polygonal pin fins, wave-shaped fins, or corrugated fins.

[0035] The second pipe connection portion 26 is connected to the first peripheral wall 22b. A discharge pipe 29 for discharging the cooling water is connected to the second pipe connection portion 26. The flange 23 extends outward from the first peripheral wall 22b on the opposite side to the top plate 22a. The flange 23 has a through hole 23a formed at a position corresponding to the mounting hole 12b and the female screw hole 13c.

[0036] The second peripheral wall 22c surrounds the top plate 22a in a rectangular cylindrical shape. The second peripheral wall 22c defines an accommodation space F surrounding the top plate 22a. The second electronic component 41 is accommodated in the accommodation space F. Therefore, the second housing 21 functions as a box that accommodates the second electronic component 41. The second housing 21 may be provided with a lid that closes the accommodation space F. In this case, the second housing 21 becomes a housing including the box and the lid.

[0037] Then, the screw 18 passing through the through hole 23a is screwed into the mounting hole 12b of the flow path forming part 12 or the female threaded hole 13c of the header forming part 13. As a result, the second housing 21 is fastened to the first housing 11, and the second housing 21 is disposed on the first end face side of both faces of the first housing 11 in the third direction Z.

[0038] The second housing 21 closes the water passage through hole 13d, and therefore closes the opening in the flow path of the cooling water defined inside the first housing 11. Therefore, the second housing 21 is a lid that closes the flow path of the cooling water, which is a space defined inside the first housing 11. Therefore, the housing body 20 including the first housing 11 and the second housing 21 includes the first housing 11 which is a box, and the second housing 21 which is a lid for the first housing 11. The first housing 11 is also a lid that closes the second flow path 27, which is a space defined inside the second housing 21. Therefore, it can be said that the housing body 20 includes the second housing 21 which is a box, and the first housing 11 which is a lid for the second housing 21. And the first housing 11 is a housing that allows the first electronic component 31 to be arranged, defines the first flow path 12a, and is a cooler that cools the first electronic component 31. The second housing 21 also allows the second electronic component 41 to be placed therein, and is a housing that defines the second flow path 27, and at the same time, is a cooler that cools the second electronic component 41.

[0039] A seal member 28 surrounding the second flow passage 27 is interposed between the flange 23 and the first housing 11 in the third direction Z. The seal member 28 is in close contact with the flange 23 and the first housing 11 to seal between the flange 23 and the first housing 11. The water passage through hole 13d of the header forming part 13 communicates with the second flow passage 27. Therefore, the second flow passage 27 and the second header flow passage T2 communicate with each other via the water passage through hole 13d. In the power conversion device 10, a cooling water flow passage 51 is formed in which the first header flow passage T1, the multiple first flow passages 12a, the second header flow passage T2, the water passage through hole 13d, and the second flow passage 27 are all communicated with each other.

[0040] The opening area of ​​the water passage through hole 13d is appropriately set according to the amount and flow rate of the cooling water flowing from the second header flow path T2 to the second flow path 27. For example, if it is desired to increase the amount of cooling water flowing to the second flow path 27, the opening area of ​​the water passage through hole 13d is increased. On the other hand, if it is desired to increase the flow rate of the cooling water flowing to the second flow path 27, the opening area of ​​the water passage through hole 13d is decreased.

[0041] As shown in FIG. 4, the second housing 21 is fastened to the first housing 11 at a position where the second housing 21 overlaps with the first flow passage group 121 of the first flow passage group 121 and the second flow passage group 122 in the third direction Z. <First electronic component> The first electronic component 31, which is a heat generating component, may be, for example, a capacitor or a transformer, but the type of the first electronic component 31 is arbitrary. The first electronic component 31 is disposed on both end faces in the third direction Z of the flow path forming part 12. The first electronic component 31 is disposed on the outer surfaces of both flat parts 12c of the flow path forming part 12. Therefore, the first electronic component 31 is disposed on both sides of the first housing 11 in the third direction Z.

[0042] Further, the first electronic component 31 arranged on the outer surface of the flat portion 12c on the first end face side in the third direction Z is arranged at a position overlapping the second flow path group 122 in the third direction Z, and the first electronic component 31 arranged on the outer surface of the flat portion 12c on the second end face side in the third direction Z is arranged at a position overlapping the first flow path group 121 in the third direction Z. Then, the first electronic component 31 is arranged on both sides in the third direction Z of the first housing 11 so as to be able to exchange heat with the cooling water flowing through the first flow path 12a.

[0043] <Second electronic component> The second electronic component 41, which is a heat generating component, may be, for example, a semiconductor element such as a MOSFET, but the type of the second electronic component 41 is arbitrary. The second electronic component 41 is disposed on the top plate 22a of the second housing 21 and is housed in the housing space F defined by the second peripheral wall 22c. Therefore, the second housing 21 also functions as a housing that defines the housing space F that houses the second electronic component 41. The second electronic component 41 is mounted on a board (not shown). The second electronic component 41 is an electronic component that generates more heat than the first electronic component 31. The second electronic component 41 is disposed in the second housing 21 so as to be able to exchange heat with the cooling water flowing through the second flow path 27.

[0044] <Function of the power conversion device> Cooling water supplied from a supply source (not shown) is supplied from the supply pipe 17 to the first header flow path T1 of the first housing 11 via the first pipe connection part 16. The cooling water supplied to the first header flow path T1 branches into each first flow path 12a of the first flow path group 121 and each first flow path 12a of the second flow path group 122, and flows through each first flow path 12a. Heat generated from the first electronic component 31 arranged on the outer surface of the flat part 12c on the first end face side in the third direction Z is transferred through the flat part 12c on the first end face side and released to the cooling water flowing through the first flow path 12a of the second flow path group 122. This cools the first electronic component 31. Also, heat generated from the first electronic component 31 arranged on the outer surface of the flat part 12c on the second end face side in the third direction Z is transferred through the flat part 12c on the second end face side and released to the cooling water flowing through the first flow path 12a of the first flow path group 121. As a result, the first electronic component 31 is cooled.

[0045] The cooling water that has flowed through the first flow paths 12a of the first flow path group 121 and the first flow paths 12a of the second flow path group 122 flow into the second header flow path T2. The cooling water collected in the second header flow path T2 is supplied to the second flow path 27 of the second housing 21 through the water path through hole 13d. The cooling water supplied to the second flow path 27 flows through the second flow path 27 and is discharged to the discharge pipe 29 via the second pipe connection part 26. The heat generated by the second electronic component 41 is transferred through the top plate 22a and the fins 24 and released into the cooling water flowing through the second flow path 27. This cools the second electronic component 41.

[0046] According to the first embodiment, the following effects can be obtained. (1-1) The first electronic component 31 and the second electronic component 41 are individually cooled in the respective housings 11 and 21. The housing body 20 of the power conversion device 10 integrally includes the first housing 11 in which the first electronic component 31 is arranged and the second housing 21 in which the second electronic component 41 is arranged. The first housing 11 is a housing that allows the first electronic component 31 to be arranged, defines the first flow path 12a, and is a cooler that cools the first electronic component 31. The second housing 21 is also a housing that allows the second electronic component 41 to be arranged, defines the second flow path 27, and is a cooler that cools the second electronic component 41. Therefore, the power conversion device 10 can be made smaller than when a cooler is provided separately from the first housing 11 in which the first electronic component 31 is arranged or when a cooler is provided separately from the second housing 21 in which the second electronic component 41 is arranged. As a result, the first electronic component 31 and the second electronic component 41 can be cooled efficiently, and the power conversion device 10 can be made smaller in size.

[0047] (1-2) The first flow path 12a of the first housing 11 is defined by a flow path forming portion 12 of a multi-hole tube. For example, a comparative example is a case in which the first housing 11 is formed of a member in which a large number of grooves opening upward are defined and a lid that closes the openings, and the grooves are closed with the lid to define the first flow path 12a. Unlike this comparative example, the first housing 11 does not require a seal for the first flow path 12a. Also, the first housing 11 can have a shorter seal length than the comparative example.

[0048] (1-3) The first header flow path T1 and the second header flow path T2 are defined by closing the header flow path forming recess H of the flow path forming portion 12 with the header forming portion 13. For example, compared to the case where the first header flow path T1 and the second header flow path T2 are defined by post-processing the flow path forming portion 12, the first header flow path T1 and the second header flow path T2 can be formed more easily.

[0049] (1-4) The second housing 21 includes a plurality of fins 24 exposed to the second flow path 27. Compared to a case in which the fins 24 are not provided, the heat dissipation area of ​​the cooling water in the second flow path 27 can be increased, so that the second electronic component 41 disposed on the top plate 22a of the second housing 21 can be cooled more effectively.

[0050] (1-5) The flow passage forming section 12 made of a multi-hole pipe has a mounting hole 12b for mounting the second housing 21 to the first housing 11. A part of the mounting hole 12b is formed in the center of the flow passage forming section 12 in the second direction Y. A second partition wall H2 made of a wall portion 12d is formed in the center of the flow passage forming section 12 in the second direction Y. The dimension of the second partition wall H2 in the second direction Y is larger than the dimension of the first partition wall H1 in the second direction Y. Therefore, the second housing 21 can be mounted to the first housing 11 using the mounting hole 12b formed in the second partition wall H2. Therefore, by adjusting the dimension between the first flow passages 12a, the second housing 21 can be mounted at a desired position even in the first housing 11 having the flow passage forming section 12 made of a multi-hole pipe.

[0051] (1-6) The second housing 21 is fastened to the first housing 11. Since the second housing 21 includes a plurality of fins 24 exposed to the second flow path 27, the heat dissipation area of ​​the second housing 21 to the cooling water is enlarged. Therefore, the cooling performance of the power conversion device 10 can be adjusted so that the second electronic component 41 arranged in the second housing 21 can be cooled more than the first electronic component 31. Therefore, if the second housing 21 includes the fins 24, the second electronic component 41 can be cooled more than the first electronic component 31. Therefore, the power conversion device 10 can target and cool the second electronic component 41, which requires more cooling than the first electronic component 31, by using the second housing 21 including the fins 24.

[0052] (1-7) The power conversion device 10 includes a first housing 11 and a second housing 21. The second housing 21 includes fins 24, and thus has higher cooling performance than the first housing 11, and has a different cooling performance from the first housing 11. In this manner, the cooling performance of the first housing 11 and the second housing 21 can be designed independently, and therefore it is easy to design the cooling performance of the power conversion device 10 to a structure suitable for cooling the first electronic component 31 and the second electronic component 41.

[0053] Second Embodiment Next, a second embodiment of the power conversion device 10 will be described with reference to Fig. 6 to Fig. 7. In the second embodiment, detailed descriptions of the same parts as those in the first embodiment will be omitted.

[0054] 6 and 7, the power conversion device 100 includes a housing main body 90 including a first housing 81 and a second housing 91. The power conversion device 100 also includes a first electronic component 31 arranged on the first housing 81 side and a second electronic component 41 arranged on the second housing 91 side.

[0055] <First cabinet> The first housing 81 includes a flow path forming portion 82 and a plurality of blocking members 83. Therefore, the first housing 81 of the second embodiment does not include a pair of header forming portions 13.

[0056] As in the first embodiment, the flow path forming section 82 defines a plurality of first flow paths 82a and includes a first flow path group 121 and a second flow path group 122. Furthermore, on both sides of the flow path forming section 82 in the first direction X, header flow path forming recesses H are defined which are recessed from a first end face of the flow path forming section 82 in the third direction Z. Each header flow path forming recess H does not penetrate the flow path forming section 82 in the third direction Z. In other words, the header flow path forming recesses H are closed on the second end face side of the flow path forming section 82 and open on the first end face side.

[0057] In each of the first flow paths 82a, the end side in the first direction X of the header flow path forming recess H is blocked by a blocking member 83. Note that, in each of the first flow paths 82a, the openings on the end side in the first direction X of the header flow path forming recess H may be blocked collectively on both ends in the first direction X by a single blocking member extending over the entirety of the flow path forming part 82 in the second direction Y. The first housing 81 functions as a box that defines a flow path for the cooling water therein.

[0058] Of both surfaces in the third direction Z of the first housing 81, the first electronic component 31 is disposed on the side opposite the joining surface of the second housing 91 so as to overlap the second flow path group 122. Therefore, the first electronic component 31 is disposed on the second end face side, which is one of the two surfaces in the third direction Z of the first housing 81.

[0059] <Second cabinet> The second housing 91 includes a box-shaped first main body 92a and a box-shaped second main body 92b, and a flange 93 that is integral with the first main body 92a and the second main body 92b.

[0060] Each of the first main body 92a and the second main body 92b includes a top plate 921, a first peripheral wall 922 standing from the periphery of the top plate 921, and a second peripheral wall 923 standing from the top plate 921 on the opposite side to the first peripheral wall 922. The first peripheral wall 922 and the second peripheral wall 923 form a continuous rectangular tube in the third direction Z.

[0061] A second flow path 94 is defined by a top plate 921 and a first peripheral wall 922 on the inside of the first body 92a and the second body 92b. A storage space F is defined by a top plate 921 and a second peripheral wall 923 on the inside of the first body 92a and the second body 92b. A second electronic component 41 is disposed on the top plate 921 of the first body 92a, and the second electronic component 41 is accommodated in the storage space F of the first body 92a. A second electronic component 41 is also disposed on the top plate 921 of the second body 92b, and the second electronic component 41 is accommodated in the storage space F of the second body 92b. Therefore, the second housing 91 functions as a box that accommodates the second electronic component 41. The second housing 91 may be provided with a lid that closes the storage space F. In this case, the second housing 91 becomes a housing including a box and a lid.

[0062] Although not shown, the fins 24 are exposed in the second flow passage 94 inside the first body 92a and in the second flow passage 94 inside the second body 92b. The second housing 91 covers the entire first end surface of the first housing 81 in the third direction Z, and covers each header flow path forming recess H from the first end surface side of the first housing 81. The first header flow path T1 and the second header flow path T2 are defined in a space surrounded by the header flow path forming recess H and the second housing 91. The second housing 91 closes the header flow path forming recess H. Therefore, the second housing 21 closes the opening of the first flow path 82a defined inside the first housing 81. Therefore, the second housing 91 is a lid that closes the first flow path 82a defined inside the first housing 81 with the header flow path forming recess H. Therefore, the housing main body 90 including the first housing 81 and the second housing 91 includes the first housing 81 which is a box body, and the second housing 91 which is a lid for the first housing 81. The first housing 81 also functions as a lid that closes a second flow path 94, which is a space defined inside the second housing 91.

[0063] In the second embodiment, a header flow path T communicating with the multiple first flow paths 82a is defined in the first housing 81, and the flow path forming part 82 is provided with a header flow path forming recess H that opens into a first end face of the flow path forming part 82 in the third direction Z and defines the header flow path T. The first flow paths 82a and the second flow paths 94 communicate with each other through the header flow path forming recess H.

[0064] Similarly to the first embodiment, a through hole 93a is formed in the flange 93. Then, the screw 18 inserted into the through hole 93a is screwed into the mounting hole 82b of the first housing 81, whereby the second housing 91 is fastened to the first housing 81. Therefore, the second housing 91 is disposed on the first end face side of both faces of the first housing 81 in the third direction Z.

[0065] In the power conversion device 100, the first housing 81 is not provided with the first pipe connection portion 86 and the second pipe connection portion 87. The second housing 91 is provided with the first pipe connection portion 86 and the second pipe connection portion 87. That is, the first pipe connection portion 86 is connected to the first peripheral wall 922 of the first main body 92a, and the supply pipe 17 is connected to the first pipe connection portion 86. The second pipe connection portion 87 is connected to the first peripheral wall 922 of the second main body 92b, and the discharge pipe 29 is connected to the second pipe connection portion 87.

[0066] In this case, the cooling water supplied from a supply source (not shown) is supplied from the supply pipe 17 through the first pipe connection part 86 to the second flow path 94 in the first main body 92a. The cooling water supplied to the second flow path 94 in the first main body 92a is supplied directly to the first header flow path T1. The cooling water supplied to the first header flow path T1 flows through the first flow paths 82a of the first flow path group 121 and the second flow path group 122. Then, the heat generated by the first electronic component 31 is released to the cooling water flowing through the first flow path 82a of the second flow path group 122. As a result, the first electronic component 31 is cooled.

[0067] The cooling water that has flowed through the first flow paths 82a of the first flow path group 121 and the first flow paths 82a of the second flow path group 122 flow into the second header flow path T2. The cooling water collected in the second header flow path T2 is supplied directly from the second header flow path T2 to the second flow path 94 in the second main body 92b. The cooling water supplied to the second flow path 94 in the second main body 92b flows through the second flow path 94 and is discharged to the discharge pipe 29 via the second pipe connection part 87. The heat generated by the second electronic component 41 is released to the cooling water flowing through each second flow path 94. As a result, the second electronic component 41 is cooled.

[0068] Therefore, according to the second embodiment, the following effect can be obtained in addition to the effects described in the first embodiment. (2-1) The second housing 91 includes a first body 92a and a second body 92b, and a second flow path 94 is defined inside the first body 92a and the second body 92b. Therefore, even if the second electronic components 41 that generate a large amount of heat are arranged apart from each other in the second housing 91, each second electronic component 41 can be cooled individually.

[0069] (2-2) The first header flow path T1 and the second header flow path T2 of the first housing 81 are formed by covering a header flow path forming recess H, which is formed by recessing a flow path forming section 82 made of a multi-hole pipe in the third direction Z, with the second housing 91. For this reason, the first header flow path T1 and the second header flow path T2 can be easily formed.

[0070] This embodiment can be modified as follows: This embodiment and the following modifications can be combined with each other to the extent that there is no technical contradiction. 8, the first housing 11 of the first embodiment may include a flow path forming portion 12, a pair of header defining members 131, a first plate 141, and a second plate 142. The first housing 11 is formed by integrating the flow path forming portion 12, the pair of header defining members 131, the first plate 141, and the second plate 142 by brazing or welding.

[0071] The header flow passage forming recess H is not defined in the flow passage forming portion 12. The first flow passages 12a are opened at both end faces in the first direction X of the flow passage forming portion 12. The dimension of each header defining member 131 in the second direction Y is the same as the dimension of the flow passage forming portion 12 in the second direction Y. The dimension of each header defining member 131 in the third direction Z is the same as the dimension of the flow passage forming portion 12 in the third direction Z. The header defining member 131 is U-shaped and includes a rectangular parallelepiped first forming portion 131a whose longitudinal direction extends in the second direction Y, and a second forming portion 131b extending from both longitudinal ends of the first forming portion 131a. The header defining member 131 has a female screw hole 13c formed therein, as in the first embodiment.

[0072] A pair of second forming portions 131b of the header defining member 131 are joined to end faces of the flow path forming portion 12 in the first direction X. Each header defining member 131 defines a through space on the outer side in the first direction X of the flow path forming portion 12. The through space opens to both ends in the third direction Z. In addition, each first flow path 12a opens toward the through space.

[0073] Each of the first plate 141 and the second plate 142 is a flat long plate. The dimension of the first plate 141 and the second plate 142 in the first direction X is the same as the sum of the dimensions of the flow path forming portion 12 and the pair of header defining members 131 in the first direction X. The dimension of the first plate 141 and the second plate 142 in the second direction Y is the same as the dimensions of the flow path forming portion 12 and the header defining member 131 in the second direction Y. Therefore, in the first housing 11, the first ends of the first plate 141 and the second plate 142 in the first direction X are located at a first end in the first direction X, and the first end of the header defining member 131 in the first direction X is located. Also, in the first housing 11, the second ends of the first plate 141 and the second plate 142 in the first direction X are located at a second end in the first direction X, and the second end of the header defining member 131 is located at a second end in the first direction X.

[0074] The inner surface of the first plate 141 is joined to a first end surface in the third direction Z of the flow path forming portion 12 and a first end surface in the third direction Z of the pair of header defining members 131, while the inner surface of the second plate 142 is joined to a second end surface in the third direction Z of the flow path forming portion 12 and a second end surface in the third direction Z of the pair of header defining members 131. The first plate 141 and the second plate 142 sandwich the flow path forming portion 12 and the pair of header defining members 131 from both sides in the third direction Z. Therefore, the first housing 11 has a layered structure made up of the first plate 141, the flow path forming portion 12 and the header defining members 131, and the second plate 142.

[0075] The first plate 141 closes a first end side of the through space in the third direction Z, and the second plate 142 closes a second end side of the through space in the third direction Z. The through space with both ends closed in the third direction Z is a header flow path T defined in the first housing 11.

[0076] The first plate 141 has an insertion hole 14a formed at a position corresponding to the mounting hole 12b of the flow path forming portion 12 and the female screw hole 13c of the header forming portion 13. The insertion hole 14a penetrates the first plate 141 in the third direction Z. In addition, a water channel through hole 141b communicating with the second header flow path T2 is formed on the second end side of the first plate 141 in the first direction X. The water channel through hole 141b penetrates the first plate 141 in the third direction Z.

[0077] The screw 18 inserted into the through hole 23a of the second housing 21 is inserted into the insertion hole 14a of the first plate 141 and is screwed into the mounting hole 12b of the flow path forming part 12 and the female threaded hole 13c of the header defining member 131. As a result, the second housing 21 is fastened to the first housing 11, and the second housing 21 is disposed on one of the two surfaces of the first housing 11 in the third direction Z.

[0078] According to this, in the case where the objective is to further improve the strength of first housing 11 which is a flat, long plate, by providing first plate 141 and second plate 142, the strength of first housing 11 can be improved.

[0079] As shown in FIG. 9, the housing body 20 of the power converter 10 of the first embodiment may include a first housing 11 and two second housings 21. The first electronic component 31 is arranged on the outer surface of the first housing 11 in the third direction Z at a position overlapping the first flow path group 121 and the second flow path group 122 in the third direction Z. Therefore, the first electronic component 31 is arranged so as to be able to exchange heat with the cooling water flowing through the first flow path 12a at the first end face side of the first housing 11 in the third direction Z. The first electronic component 31 may be arranged so as to be able to exchange heat with the cooling water flowing through the first flow path 12a at the second end face side of the first housing 11 in the third direction Z, or may be arranged so as to be able to exchange heat with the cooling water flowing through the first flow path 12a on both sides in the third direction Z.

[0080] One of the two second housings 21 is disposed on a first end side in the first direction X of the first housing 11, and the other second housing 21 is disposed on a second end side in the first direction X of the first housing 11. In this case, the first pipe connection portion 16 is connected to the first peripheral wall 22b of one second housing 21, and the second pipe connection portion 26 is connected to the first peripheral wall 22b of the other second housing 21.

[0081] In addition, a water channel through hole 13d communicating with the first header flow path T1 is formed in the header forming section 13 on the first end side in the first direction X of the first housing 11, and a water channel through hole 13d communicating with the second header flow path T2 is formed in the header forming section 13 on the second end side in the first direction X of the first housing 11.

[0082] The second flow path 27 of the second housing 21 on the first end side in the first direction X communicates with the first header flow path T1 through the water channel through hole 13d on the first end side, and the second flow path 27 of the second housing 21 on the second end side in the first direction X communicates with the second header flow path T2 through the water channel through hole 13d on the second end side.

[0083] Cooling water supplied from a supply source (not shown) is supplied from the supply pipe 17 through the first pipe connection part 16 to the second flow path 27 of the second housing 21. This causes the second electronic component 41 arranged in the second flow path 27 to be cooled.

[0084] The cooling water supplied to the second flow passage 27 on the first end side in the first direction X is supplied to the first header flow passage T1 of the first housing 11 through the water passage through hole 13d on the first end side. The cooling water supplied to the first header flow passage T1 branches into each first flow passage 12a of the first flow passage group 121 and each first flow passage 12a of the second flow passage group 122 and flows through each first flow passage 12a. Heat generated from the first electronic component 31 is released to the cooling water flowing through the first flow passages 12a of the first flow passage group 121 and the second flow passage group 122. As a result, the first electronic component 31 is cooled.

[0085] The cooling water that has flowed through the first flow paths 12a of the first flow path group 121 and the first flow paths 12a of the second flow path group 122 flow into the second header flow path T2. The cooling water collected in the second header flow path T2 is supplied to the second flow path 27 of the second housing 21 on the second end side through the water path through hole 13d on the second end side. The cooling water supplied to the second flow path 27 flows through the second flow path 27 and is discharged to the discharge pipe 29 via the second pipe connection part 26. This cools the second electronic component 41 arranged in the second flow path 27 on the second end side.

[0086] As shown in Fig. 10, the housing body 20 of the power conversion device 10 of the first embodiment may include a first housing 11 and two second housings 21. The two second housings 21 are arranged on a first end side of the first housing 11 in the first direction X. One of the two second housings 21 is arranged on a first end side of the first housing 11 in the second direction Y, and the other is arranged on a second end side of the first housing 11 in the second direction Y. In this case, the first pipe connection portion 16 is connected to the first peripheral wall 22b of the second housing 21 on the first end side, and the second pipe connection portion 26 is connected to the first peripheral wall 22b of the second housing 21 on the second end side.

[0087] The first housing 11 is provided with two header flow passage forming recesses H at a first end side in the first direction X, and two first header flow passages T1. The two header flow passage forming recesses H and the first header flow passage T1 are separated in the second direction Y. At the first end side in the first direction X of the header forming part 13, a water passage through hole 13d communicating with the first header flow passage T1 at the first end side in the second direction Y is formed, and a water passage through hole 13d communicating with the first header flow passage T1 at the second end side in the second direction Y is formed. The water passage through hole 13d at the first end side in the second direction Y is communicated with the second flow passage 27 of the second housing 21 at the first end side, and the water passage through hole 13d at the second end side in the second direction Y is communicated with the second flow passage 27 of the second housing 21 at the second end side.

[0088] Further, a second header flow path T2 is defined at a second end side in the first direction X of the first housing 11. The first header flow path T1 at the first end side in the second direction Y of the two first header flow paths T1 communicates with the second header flow path T2 via a first flow path group 121, and the first header flow path T1 at the second end side in the second direction Y of the two first header flow paths T1 communicates with the second header flow path T2 via a second flow path group 122. The first electronic component 31 is disposed on the outer surface of the first housing 11 so as to overlap the first flow path group 121 and the second flow path group 122.

[0089] The direction of the cooling water flowing through the first flow paths 12a of the first flow path group 121 is from the first header flow path T1 to the second header flow path T2, and the direction of the cooling water flowing through the first flow paths 12a of the second flow path group 122 is from the second header flow path T2 to the first header flow path T1.

[0090] Cooling water supplied from a supply source (not shown) is supplied from the supply pipe 17 through the first pipe connection part 16 to the second flow path 27 of the second housing 21 on the first end side in the second direction Y. This cools the second electronic component 41 arranged in the second flow path 27 on the first end side.

[0091] The cooling water supplied to the second flow passage 27 on the first end side in the second direction Y is supplied to the first header flow passage T1 through the water passage through hole 13d on the first end side. The cooling water supplied to the first header flow passage T1 on the first end side flows through each of the first flow passages 12a of the first flow passage group 121. Heat generated from the first electronic component 31 is released to the cooling water flowing through the first flow passages 12a of the first flow passage group 121. As a result, the first electronic component 31 is cooled.

[0092] The cooling water that has flowed through the first flow paths 12a of the first flow path group 121 flows into the second header flow path T2. Furthermore, the cooling water that has flowed into the second header flow path T2 flows through the first flow paths 12a of the second flow path group 122 and flows into the first header flow path T1 on the second end side in the second direction Y. The cooling water supplied to the first header flow path T1 on the second end side is supplied to the second flow path 27 of the second housing 21 on the second end side in the second direction Y through the water path through hole 13d on the second end side. Then, the cooling water supplied to the second flow path 27 flows through the second flow path 27 and is discharged to the discharge pipe 29 via the second pipe connection part 26.

[0093] The heat generated from the second electronic component 41 is released to the cooling water flowing through the second flow path 27. As a result, the second electronic component 41 is cooled. In this configuration, the number of first flow paths 12a communicating with the first header flow path T1 can be reduced compared to the case where six first flow paths 12a communicate with one first header flow path T1. This makes it possible to increase the flow rate of the cooling water in each of the first flow paths 12a. This allows the first electronic component 31 to be cooled efficiently.

[0094] In the first embodiment, the second housing 21 may be disposed on a first end surface of both sides of the first housing 11 in the third direction Z, and a third housing may be disposed on a second end surface of the first housing 11 in the third direction Z. The power conversion device may include a housing main body including the first housing 11, the second housing 21, and the third housing. In this case, the first pipe connection portion 16 is connected to the second housing 21, and the supply pipe 17 is connected to the first pipe connection portion 16. The second pipe connection portion 26 is connected to the third housing, and the discharge pipe 29 is connected to the second pipe connection portion 26.

[0095] In the first embodiment, the first housing 11 may function as a lid for a box provided on one of the two sides of the first housing 11 in the third direction Z opposite to the side on which the second housing 21 is provided. That is, the first housing 11 is a box provided on the side on which the first electronic component 31 is provided, and functions as a lid for a box (not shown) that houses the first electronic component 31. In this case, an accommodation space that houses the electronic component is defined inside the box. In this case, the second housing 21 is disposed on the first end face side of the first housing 11, and a box is disposed on the second end face side of the first housing 11 in the third direction Z.

[0096] A first electronic component 31 is accommodated inside the housing arranged on the second end face side in the third direction Z of the first housing 11. The first electronic component 31 may be arranged on the outer surface of the flat portion 12c on the second end face side of the flow path forming portion 12 as in the first embodiment, or may be accommodated in a state where it is mounted on a board accommodated inside the housing. The first electronic component 31 mounted on the board is arranged so as to contact the outer surface of the flat portion 12c of the flow path forming portion 12. Alternatively, the first electronic component 31 accommodated inside the housing may be arranged so as to be capable of dissipating heat to the first housing 11 while being fixed to the housing and contacting the outer surface of the flat portion 12c of the flow path forming portion 12 via a heat transfer member. Thus, the first electronic component 31 is arranged on the second end face side in the third direction Z of the first housing 11 so as to be capable of exchanging heat with the cooling water flowing through the first flow path 12a, but the arrangement of the first electronic component 31 inside the housing arranged on the second end face side in the third direction Z of the first housing 11 can be changed as appropriate.

[0097] In the first embodiment, the main body 22 of the second housing 21 does not have to include the second peripheral wall 22c. In this case, the second housing 21 functions as a housing in which the second electronic component 41 is mounted. In the second embodiment, the second housing 91 does not have to include the second peripheral wall 923. In this case, the second housing 91 functions as a housing in which the second electronic component 41 is mounted.

[0098] In the first embodiment, the second housing 21 may be disposed on the second end face side of the first housing 11 in the third direction Z. In the second embodiment, the second housing 91 may be disposed on the second end face side of the first housing 81 in the third direction Z.

[0099] In the flow path forming portion 12, 82, the first flow path group 121 and the second flow path group 122 may be separated by a wall portion 12d having the same dimensions as the first partition wall H1. That is, in the flow path forming portion 12, 82, all of the first flow paths 12a, 82a may be separated by a wall portion 12d having the same dimensions as the first partition wall H1. In this case, the mounting holes 12b, 82b are provided only at both ends of the flow path forming portion 12, 82 in the second direction Y or both ends in the first direction X.

[0100] The second housings 21, 91 may be integrated with the first housings 11, 81 by adhesion or welding. When the first electronic component 31 is an electronic component that generates more heat than the second electronic component 41, the second housing 21, 91 does not need to include the fins 24.

[0101] The number of the first flow paths 12a, 82a can be changed as appropriate. The cooling medium may be a liquid other than cooling water or a gas. The technical ideas that can be understood from the above-described embodiment and modified examples will be described.

[0102] [Aspect 1] a housing body including a first housing in which a first electronic component, which is a heat-generating component, is disposed, and a second housing in which a second electronic component, which is a heat-generating component, is disposed; the first housing includes a flow path forming section made of a multi-hole pipe that defines a plurality of first flow paths arranged in parallel, and when a direction in which the plurality of first flow paths are arranged in the flow path forming section and a direction perpendicular to a direction in which the first flow paths extend are defined as a plate thickness direction of the first housing, the first electronic component is disposed on at least one of both sides of the first housing in the plate thickness direction so as to be capable of exchanging heat with a cooling medium flowing through the first flow paths, The second housing is arranged on one of both sides of the first housing in the plate thickness direction, the second housing defines a second flow path therein that communicates with the first flow path, and the second electronic component is arranged in the second housing so as to be able to exchange heat with a cooling medium flowing through the second flow path.

[0103] [Aspect 2] The power conversion device according to [Aspect 1], wherein the second housing includes fins exposed to the second flow path.

[0104] [Aspect 3] A power conversion device as described in [Aspect 1] or [Aspect 2], wherein the flow path forming portion has mounting holes for mounting the second housing to the first housing, and the mounting holes are formed between adjacent first flow paths in the direction in which the multiple first flow paths are arranged.

[0105] [Aspect 4] A power conversion device according to any one of [Aspect 1] to [Aspect 3], wherein a header flow path communicating with the plurality of first flow paths is defined in the first housing, and the flow path forming portion is provided with a header flow path forming recess that opens to one side of the flow path forming portion in the plate thickness direction and defines the header flow path, and the first flow path and the second flow path are connected through the header flow path forming recess.

[0106] [Aspect 5] The first housing includes the flow path forming portion, and a first plate and a second plate sandwiching the flow path forming portion from both sides in the plate thickness direction, and the first electronic component is arranged on at least one outer surface of the first plate and the second plate as at least one of the two surfaces in the plate thickness direction, and the second housing is arranged on an outer surface of either the first plate or the second plate as one of the two surfaces in the plate thickness direction. A power conversion device described in any one of [Aspect 1] to [Aspect 4]. [Explanation of symbols]

[0107] H...header flow path forming recess, T...header flow path, Z...third direction as the plate thickness direction, 10...power conversion device, 11,81...first housing, 12a,82a...first flow path, 12,82...flow path forming portion, 12b,82b...mounting hole, 20,90...housing main body, 21,91...second housing, 24...fins, 27,94...second flow path, 31...first electronic component, 41...second electronic component.

Claims

1. a housing body including a first housing in which a first electronic component, which is a heat-generating component, is disposed, and a second housing in which a second electronic component, which is a heat-generating component, is disposed; the first housing includes a flow path forming portion made of a multi-hole pipe that defines a plurality of first flow paths arranged in parallel, and when a direction in which the plurality of first flow paths are arranged in the flow path forming portion and a direction perpendicular to a direction in which the first flow paths extend are defined as a plate thickness direction of the first housing, the first electronic component is disposed on at least one of both sides of the first housing in the plate thickness direction so as to be capable of exchanging heat with a cooling medium flowing through the first flow paths, The second housing is arranged on one of the two sides of the first housing in the plate thickness direction, the second housing defines a second flow path therein that communicates with the first flow path, and the second electronic component is arranged in the second housing so as to be able to exchange heat with a cooling medium flowing through the second flow path.

2. The power conversion device according to claim 1 , wherein the second housing includes a fin exposed to the second flow path.

3. 3. The power conversion device according to claim 1 or claim 2, wherein the flow path forming portion has an attachment hole for attaching the second housing to the first housing, and the attachment hole is formed between adjacent first flow paths in the direction in which the multiple first flow paths are arranged.

4. 3. The power conversion device according to claim 1, wherein a header flow path communicating with the plurality of first flow paths is defined in the first housing, and the flow path forming portion is provided with a header flow path forming recess that opens to one surface of the flow path forming portion in the plate thickness direction and defines the header flow path, and the first flow path and the second flow path communicate with each other through the header flow path forming recess.

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