Method for manufacturing joined body

Abstract

To provide a bonded body having excellent adhesiveness and airtightness.SOLUTION: A bonded body 1 is formed by bonding a first member 10 and a second member 20 via an adhesive layer 30 made of an electrodeposition coating film. A gap between the first member 10 and the second member 20 is hermetically sealed by the adhesive layer 30. Furthermore, in the bonded body 1, the adhesive layer 30 provides airtightness between the first member 10 and the second member 20 such that the amount of He leakage is 1×10-10 Pa m3 / sec or less.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a bonded body and a method for producing the same. [Background technology]

[0002] Metal materials are being replaced with resins in automobile parts, electrical and electronic products, and other industrial products, mainly from the perspective of weight reduction. In recent years, not only is replacement with resin being used, but joints that utilize the characteristics of metal materials and resin parts according to the purpose of use are also being used.

[0003] In such a bonded body, since dissimilar materials, namely metal and resin, are bonded to each other, there is a risk that sufficient adhesion between the two may not be obtained. Therefore, various methods for improving adhesion have been considered. For example, in the configuration disclosed in Patent Document 1, a laser beam is irradiated to the bonding surface of the metal member with the resin member to form fine irregular irregularities, and the material of the resin member that is molten on the bonding surface is allowed to penetrate into the irregularities, thereby directly bonding the metal member and the resin member to improve the adhesion between them. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-294024 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the configuration disclosed in Patent Document 1, the unevenness formed by irradiating the laser light is fine and irregular, so that the resin member does not reach the deepest part of the unevenness, and a space may be formed between the metal member and the resin member. Then, the space communicates with the outside, and the airtightness between the metal member and the resin member decreases. Therefore, even if the adhesion between the metal member and the resin member can be guaranteed, if a higher airtightness is required, the requirement cannot be met. Therefore, there is room for improvement in achieving both high adhesion and high airtightness.

[0006] In addition, when joining metals together, in order to electrically insulate the two, it is necessary to interpose an insulating layer between the two. Even in such a case, dissimilar materials are joined together, so there is still room for improvement in achieving both high adhesion and high airtightness, as in the above case.

[0007] The present invention has been made in view of the above background, and aims to provide a bonded body having excellent adhesiveness and airtightness. [Means for solving the problem]

[0008] One aspect of the present invention is a joined body in which a first member made of metal and a second member made of resin or metal are joined via an adhesive layer made of an electrodeposition coating film, a gap between the first member and the second member is hermetically sealed by the adhesive layer, The airtightness between the first member and the second member due to the adhesive layer is such that the He leak amount is 1×10 -10 Pa·m 3 / sec or less, in the zygote.

[0009] Another aspect of the present invention is a method for producing a joined body in which a first member made of a metal and a second member made of a resin are joined via an adhesive layer made of an electrodeposition coating film, the method comprising the steps of: an adhesive layer forming step of forming a deposit film on the surface of the first member by electrocoating, washing the deposit film with water, and then heating the deposit film to a temperature lower than the curing temperature of the adhesive layer to volatilize water and form the adhesive layer in an uncured state; and a bonding step of bonding the second member to the first member by causing the uncured adhesive layer to dissolve in a part of the material forming the second member.

[0010] Yet another aspect of the present invention is a method for producing a joined body in which a first member made of a metal and a second member made of a metal are joined via an adhesive layer made of an electrodeposition coating film, the method comprising the steps of: an adhesive layer forming step of forming a deposition film on the surface of the first member and the second member by electrocoating, washing the deposition film with water, and then heating the first adhesive layer and the second adhesive layer to a temperature lower than the curing temperature of the first adhesive layer and the second adhesive layer to volatilize moisture and form the first adhesive layer and the second adhesive layer in an uncured state; and a bonding step of bonding the first member and the second member by causing the first adhesive layer and the second adhesive layer in an uncured state to be compatible with each other. Effect of the Invention

[0011] According to the joined body of the first embodiment, the adhesive layer is made of an electrodeposition coating film, and therefore has excellent adhesiveness to both the first member and the second member. The first member and the second member are joined via the adhesive layer, and the adhesive layer provides an airtight seal between the first member and the second member, thereby reducing the amount of He leakage to 1×10 -10 Pa·m 3 / sec or less. This allows the bonded body to ensure extremely high airtightness.

[0012] According to the method for producing a bonded body of the other aspect, the second member can be bonded to the first member by causing the adhesive layer in a semi-cured state to dissolve in a part of the second member made of a resin. As described above, the adhesive layer provides an airtight seal between the first member and the second member, thereby reducing the amount of He leakage to 1×10 -10 Pa·m3 It can exhibit extremely high airtightness of less than 1 / sec.

[0013] According to the method for producing a bonded body of the above-mentioned further aspect, the first adhesive layer in a semi-cured state and the second adhesive layer in a semi-cured state are made compatible with each other, so that the second member can be bonded to the first member. As described above, the adhesive layer provides an airtight seal between the two members, so that the amount of He leakage is reduced to 1×10 -10 Pa·m 3 It can exhibit extremely high airtightness of less than 1 / sec.

[0014] As described above, according to the present invention, a bonded body having excellent adhesiveness and airtightness can be provided. [Brief description of the drawings]

[0015] [Figure 1] FIG. 2A is a top view of a bonded body in Example 1, FIG. 2B is a cross-sectional view taken along line Ib-Ib, and FIG. 2C is a perspective view of the bonded body. [Diagram 2] A partially enlarged view of FIG. 1(b). [Diagram 3] FIG. 3 is an enlarged view of the area indicated by the symbol A in FIG. 2 . [Figure 4] A schematic diagram explaining the conditions for the He leak test. [Diagram 5] FIG. 2 is a conceptual diagram for explaining a method for producing a bonded body in the first embodiment. [Figure 6] FIG. 11 is a conceptual diagram for explaining a method for producing a bonded body in the first modification. [Figure 7] FIG. 13A is a perspective view of a joined body according to a second modification, and FIG. 13B is a perspective view of a joined body according to a third modification. [Figure 8] 13A is a perspective view of a bonded body in Modification 4, and FIG. 13B is a longitudinal sectional view of the bonded body. [Figure 9] 13A is a perspective view of a bonded body in Modification 5, and FIG. 13B is a longitudinal sectional view of the bonded body. [Figure 10] 13A is a longitudinal sectional view of a bonded body according to Modification 6, FIG. 13B is a longitudinal sectional view of a bonded body according to Modification 7, and FIG. 13C is a longitudinal sectional view of a bonded body according to Modification 8. [Figure 11] FIG. 11 is a partially enlarged vertical cross-sectional view of a bonded body in Example 2. [Figure 12] FIG. 11A is a perspective view of a bonded body according to a third embodiment, and FIG. [Figure 13] 10A is a perspective view of a sealed container according to a fourth embodiment, FIG. 10B is a partially enlarged view of the sealed container, and FIG. [Figure 14] 13A is a perspective view of a sealed container in a ninth modified example, FIG. 13B is a partially enlarged view of the sealed container, and FIG. 13C is a partial vertical cross-sectional view of the sealed container. [Figure 15] 13A is a perspective view of a sealed container in a tenth modification, FIG. 13B is a partially enlarged view of the sealed container, and FIG. [Figure 16] 13A is a perspective view of a sealed container according to a fifth embodiment, FIG. 13B is a partially enlarged view of the sealed container, and FIG. 13C is a partially enlarged view of a longitudinal section of the sealed container according to a fifth embodiment. [Figure 17] 11A is a perspective view of a sealed container, FIG. 11B is a partially enlarged view of the sealed container, and FIG. 11C is a partially enlarged view of a vertical cross section of the sealed container in an eleventh modification. [Figure 18] FIG. 13 is a perspective view of a bonded body in Example 6. [Figure 19] FIG. 13( a ) is a conceptual diagram illustrating a method for producing a bonded body in Example 6. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The portion of the first member covered by the electrodeposition coating film forming the adhesive layer preferably includes an area having a surface roughness Ra of 5.0 μm or less. In this case, the portion of the first member covered by the electrodeposition coating film has a relatively smooth surface, so that the material of the electrodeposition coating film forming the adhesive layer of the first member is easily adhered to the surface. This prevents air from entering between the adhesive layer and the surface of the first member, and further improves the airtightness between the first member and the second member.

[0017] It is preferable that the second member is made of resin, and a compatible layer is formed between the second member and the adhesive layer, in which a first resin material constituting the second member and a second resin material constituting the adhesive layer are mutually compatible, thereby further improving the adhesion and airtightness between the second member and the adhesive layer.

[0018] The thickness of the compatible layer is preferably within the range of 1.0 to 25 μm, in which case the compatible layer will have a sufficient thickness to maintain the adhesiveness and airtightness between the resin member and the adhesive layer.

[0019] The first resin material forming the second member is preferably an engineering plastic or a super engineering plastic, and the second resin material forming the adhesive layer is preferably an epoxy resin, a polyamide-imide resin, or a polyimide resin. In this case, by using an engineering plastic or a super engineering plastic as the first resin material, the insulating property, heat resistance, chemical resistance, and mechanical properties of the second member can be improved. The epoxy resin, polyamide-imide resin, or polyimide resin adopted as the second resin material has good wettability with heat-melted engineering plastics or super engineering plastics, and is easily compatible with each other, and has surface characteristics with high affinity and compatibility with engineering plastics and super engineering plastics. In addition, since these materials have excellent heat resistance, thermal deterioration due to heat-melted engineering plastics or super engineering plastics during molding is unlikely to occur. Therefore, by adopting the first resin material and the second resin material as described above, sufficient adhesion can be obtained between the first member and the adhesive layer and between the second member and the adhesive layer. In addition, since the second member and the adhesive layer are both resins, sufficient adhesion can be obtained between them. As a result, the airtightness between the first member and the second member can be further improved.

[0020] In this specification, engineering plastics refers to resin materials with a heat-resistant temperature of 100°C or higher and superior tensile strength and elastic modulus to so-called general-purpose plastics, while super engineering plastics refers to resin materials among engineering plastics with a heat-resistant temperature of 150°C or higher.

[0021] The second resin material is preferably an electrolytically activated electrodeposition paint. In this case, the adhesive layer is cured by an electrolytically activated curing system, so that the adhesive layer is both curable and stable, and the adhesiveness and airtightness between the first and second members are further improved.

[0022] It is preferable that the first member has an uneven portion or a groove portion, and the second member is fitted into the uneven portion or the groove portion. In this case, the second member fitted into the uneven portion or the groove portion serves as an anchor for the first member and can increase the area of ​​the joint between the first member and the second member, thereby improving the joint strength between the first member and the second member.

[0023] The unevenness or the groove is formed in a portion covered by the electrodeposition coating film forming the adhesive layer, and the opening width of the unevenness or the groove is preferably 100 μm or more. In this case, even if the material forming the adhesive layer is a resin material with low wettability, it can easily enter the unevenness or the groove, so that the airtightness between the first member and the second member can be further improved.

[0024] It is preferable that the metal member has a through hole, and the resin member is inserted into the through hole. In this case, the resin member inserted into the through hole serves as an anchor for the metal member, thereby improving the bonding strength between the metal member and the resin member.

[0025] The diameter of the through hole is preferably equal to or greater than the thickness of the metal member, which makes it easier for the material of the resin member to enter the through hole, thereby improving the bonding strength between the metal member and the resin member.

[0026] In the method for producing a bonded body, in the adhesive layer forming step, it is preferable to reheat the uncured adhesive layer after it is formed. In this case, the adhesion between the adhesive layer and the resin member can be further improved. EXAMPLES

[0027] Example 1 An embodiment of the bonded body will be described below with reference to FIGS. The joined body 1 of the present embodiment 1 is formed by joining a first member 10 and a second member 20 via an adhesive layer 30 made of an electrodeposition coating film. The first member 10 and the second member 20 are hermetically sealed by the adhesive layer 30. Furthermore, the airtightness between the first member 10 and the second member 20 provided by the adhesive layer 30 is such that the He leakage amount is 1×10 -10 Pa·m 3 / sec or less.

[0028] The bonded body 1 of Example 1 will be described in detail below. In the first embodiment, a first member 10 made of metal and a second member 20 made of resin are used. As shown in Figs. 1(a) to 1(c), the first member 10 made of metal penetrates the second member 20 made of resin. In the first embodiment, the second member 20 is a plate having a predetermined thickness, but as shown in Fig. 1(c), its outer shape is not specified. In the first embodiment, the horizontal direction, which is one of the surface directions of the second member 20, is defined as X, the vertical direction, which is one of the surface directions of the second member 20 and perpendicular to the horizontal direction X, is defined as Y, and the height direction, which is the thickness direction of the second member 20 and perpendicular to the horizontal direction X and the vertical direction Y, is defined as Z.

[0029] 1. First member 10 The first member 10 is made of a metal, and may be made of copper, an aluminum alloy, or the like, and is made of copper in this example. In this example, the first member 10 is cylindrical, but is not limited to this. As shown in FIG. 1(b), on the outer surface of the first member 10, a central region in the height direction Z including a portion located within the through-hole 21 of the second member 20 is a bonding surface 11 to which an adhesive layer 30 described below is bonded.

[0030] A part or the entirety of the bonding surface 11 includes an airtight region 12 that ensures airtightness between the adhesive layer 30 and the bonding surface 11. The airtight region 12 has a relatively smooth surface. The airtight region 12 preferably has a surface roughness Ra of a predetermined value or less, for example, 5.0 μm or less, more preferably 3.0 μm or less. In this example, the entirety of the bonding surface 11 is the airtight region 12.

[0031] 2. Adhesive layer 30 Next, the adhesive layer 30 will be described in detail. As shown in FIG. 1(a)-(c), the adhesive layer 30 is provided on the joining surface 11 including the airtight region 12 of the first member 10. The adhesive layer 30 is a resin coating formed by electrodeposition coating. The adhesive layer 30 is made of a material that has higher adhesion to the first member 10 than the resin material constituting the second member 20 described later. For example, a thermosetting epoxy resin, polyamide-imide resin, or polyimide resin, which is a cationic electrodeposition paint, can be used as the material for forming the adhesive layer 30, and in this example, an electrolytically activated electrodeposition paint is used as the thermosetting epoxy resin. As a result, in the airtight region 12, the adhesive layer 30 is configured to hermetically seal the gap between the second member 20 and the first member 10 to prevent the passage of gas. The details of the airtightness provided by the adhesive layer 30 will be described later.

[0032] As shown in Fig. 2, the average thickness, which is the average value of the thickness T0 of the adhesive layer 30, can be in the range of 10 to 80 µm, preferably in the range of 20 to 50 µm, and in this example, the average thickness is set to 30 µm. If the average thickness of the adhesive layer 30 is less than 10 µm, uneven coating or uncoated areas may occur, which is not preferable. Also, if the average thickness of the adhesive layer 30 exceeds 80 µm, it may take an excessive amount of time to form the layer, which is not practical.

[0033] 3. Second member 20 Next, the second member 20 will be described in detail. In this embodiment 1, the second member is made of resin. The shape of the second member 20 is not limited, but in this embodiment 1, as shown in FIG. 1(b), it is plate-shaped. The resin material constituting the second member 20 is preferably a thermoplastic resin material so that insert molding, which will be described later, is possible, and in consideration of exposure to high temperatures during insert molding, it is preferable that the heat-resistant temperature is 150°C or higher. In addition, from the viewpoint of ensuring compatibility and adhesion between the resin material of the second member 20 and the material forming the adhesive layer 30, it is preferable that the solubility parameters (SP values) of both are close to each other. For example, in consideration of the case where an epoxy resin with an SP value of about 11, a polyamide-imide resin or polyimide resin with an SP value of about 13.6, etc. are used as the material forming the adhesive layer 30, a material with a solubility parameter (SP value) in the range of 9.5 to 15 can be used as the resin material of the second member 20.

[0034] For example, the resin material forming the second member 20 may be engineering plastics such as nylon resin, polycarbonate resin, etc., or super engineering plastics such as polyphenylene sulfide (PPS) resin, polysulfone (PSF) resin, polyethersulfone (PES) resin, polyamide-imide (PAI) resin, etc. In this example, PPS resin is used as the resin material forming the second member 20.

[0035] As shown in Fig. 3, a compatible layer 40 is formed between the second member 20 and the adhesive layer 30, in which both resin members are compatible with each other. In reality, the boundaries between the compatible layer 40 and the second member 20 and the adhesive layer 30 are unclear, but in this embodiment, the boundary 41 between the compatible layer 40 and the second member 20 is defined as the portion closer to the adhesive layer 30 in the lateral direction X among the portions where deterioration is observed in the second member 20, and the boundary 42 between the compatible layer 40 and the adhesive layer 30 is defined as the portion closer to the second member 20 in the lateral direction X among the portions where deterioration of the adhesive layer 30 is observed in the adhesive layer 30. In Fig. 3, each boundary 41, 42 is shown by a dashed line based on the above definition.

[0036] As shown in Fig. 3, the thickness T1 of the compatible layer 40 is defined as the maximum width between the boundaries 41, 42 in the lateral direction X. The thickness T1 of the compatible layer 40 is preferably within a range of 1.0 to 25 µm. If the thickness T1 of the compatible layer 40 is thinner than the minimum value of the above range, the adhesion between the second member 20 and the adhesive layer 30 may decrease. If the thickness T1 of the compatible layer 40 is greater than the maximum value of the above range, it may take a long time to form the compatible layer 40, which may decrease productivity.

[0037] 4.Evaluation Test The airtightness provided by the adhesive layer 30 in the bonded body 1 of this example will be described in detail below. As described above, the airtightness provided by the adhesive layer 30 is evaluated by a He leak test. The He leak test was performed by an internal vacuum method (spraying method). That is, as shown in FIG. 4, the test specimen W of Example 1 or Comparative Example was set in a He leak test fixture 100, and then He gas stored in a He cylinder 102 was sprayed by a He spray gun 103, and a He leak detector 101 (manufactured by ULVAC, Inc., model number HELIOT 904) equipped with a monitor 101a was used to detect the amount of He leaking through the test specimen W by evacuating as shown by the arrow 104. The pass criterion for the amount of He leaking was 1.0×10 -10 Pa·m 3 / sec or less.

[0038] In the airtightness test of this example, the joined body 1 of this Example 1 was used as a sample, and as a comparative example, a joined body in which the second member 20 was melted and joined to the outer peripheral surface of the first member 10 without using an adhesive layer 30 was used.

[0039] The adhesiveness of the adhesive layer 30 was evaluated by the following tensile strength test. The tensile strength test was performed using an electronic tensile tester (manufactured by Yonekura Seisakusho, model number CATY-1005Z) to chuck the first member 10 and the second member 20 of the bonded body 1 and the bonded body of the comparative example, and pull the first member 10 in the axial direction Y at a tensile speed of 25.4 mm / min until it breaks, and measure the peak load. The results of the He leak test and the tensile strength test are shown in Table 1 below.

[0040] [Table 1]

[0041] As shown in Table 1, the amount of He leaked from the bonded body of the comparative example was 2.0 × 10 -7 Pa·m 3 / sec, the amount of He leaked from the bonded body 1 of this Example 1 was 1.0×10 -10 Pa·m 3 / sec or less. This confirmed that the bonded body 1 of this Example 1 exhibited extremely high airtightness. Furthermore, the tensile strength of the bonded body 1 of this Example 1 was sufficiently high compared to the tensile strength of the bonded body of the comparative example, and it was confirmed that the bonded body 1 of this Example 1 exhibited high adhesiveness.

[0042] 5. Manufacturing method A method for producing the bonded body 1 of this embodiment will be described below.

[0043] As shown in FIG. 5(a), a first member 10 is prepared, and an adhesive layer forming step S1 is performed. In the adhesive layer forming step S1, an adhesive layer 30 is formed on the joining surface 11 including the airtight region 12 of the first member 10. In the adhesive layer forming step S1 of this example, a water-soluble thermosetting epoxy resin is attached to the first member 10 by electrodeposition coating, and the epoxy resin is heated in a temperature environment below the curing temperature thereof to volatilize water and dry, forming a semi-cured adhesive layer 30. Note that the electrodeposition coating is performed after masking both end regions of the outer surface of the first member 10 other than the joining surface 11, so that the adhesive layer 30 is formed only on the joining surface 11.

[0044] In this embodiment, the electrodeposition coating in the adhesive layer forming step S1 is performed as follows. First, the surface of the first member 10 is cleaned and degreased. Then, a bathtub for electrodeposition coating is filled with cationic epoxy resin-based electrolytically activated electrodeposition paint (manufactured by Nippon Paint Co., Ltd., model number Insuleaid 3030) with a solid content concentration of 20% adjusted to 20%. Then, the first member 10 after the cleaning and degreasing is immersed in the bathtub, and a voltage of 200V is applied for 3 minutes. Then, the first member 10 is taken out of the bathtub, washed with water, and dried in a drying furnace at 130°C, which is the curing temperature of the electrolytically activated electrodeposition paint, for 20 minutes. This allows the moisture to volatilize, forming an adhesive layer 30 made of a semi-cured epoxy resin coating (deposition film) with an average thickness of 50 μm.

[0045] Then, in the joining step S2 shown in FIG. 5(b) and FIG. 5(c), insert molding is performed. In the insert molding in the joining step S2, first, a mold divided into two parts, an upper mold 51 and a lower mold 52, is prepared as shown in FIG. 5(b). The upper mold 51 has a recess 52a along the outer shape of the upper part of the first member 10, and the lower mold 52 has a recess 52a along the outer shape of the lower part of the first member 10 and the second member 20. Then, as shown in FIG. 5(c), the first member 10 provided with the adhesive layer 30 made of a semi-cured epoxy resin coating between the upper mold 51 and the lower mold 52 is set between the upper mold 51 and the lower mold 52. Then, the PPS resin that has been heated to have fluidity is poured between the upper mold 51 and the lower mold 52 to form the second member 20. In this example, the resin is heated to 330° C. to melt it and have fluidity. As a result, the first member 10 and the second member 20 are bonded to each other via the adhesive layer 30 between the first member 10 and the second member 20, thereby forming the bonded body 1 shown in FIG.

[0046] In this embodiment, after the bonded body 1 shown in Fig. 1 is formed, it is reheated. The target temperature of the reheating can be, for example, the temperature during drying or higher. The heating time can be, for example, within a range of 90 to 250 minutes.

[0047] 6. Effects Next, the effects of the bonded body 1 of this embodiment will be described in detail. According to the bonded body of this example, the adhesive layer 30 is made of an electrodeposition coating film, and therefore has excellent adhesiveness to both the first member 10 made of metal and the second member 20 made of resin. The first member 10 and the second member 20 are bonded together via the adhesive layer 30, and the adhesive layer 30 provides an airtight seal between the first member 10 and the second member 20, thereby reducing the He leakage amount to 1×10 -10 Pa·m 3 / sec or less. This allows the joined body 1 of this embodiment to ensure extremely high airtightness.

[0048] In addition, the joint surface 11, which is the portion of the first member 10 covered by the electrodeposition coating film that forms the adhesive layer 30, includes an airtight region 12 having a surface roughness Ra of 5.0 μm or less. This makes the joint surface 11 a relatively smooth surface, making it easier for the material forming the adhesive layer 30 to adhere to the joint surface 11. This prevents an air layer from entering between the adhesive layer 30 and the joint surface 11 of the first member 10, and further increases the airtightness between the first member 10 and the second member 20.

[0049] In this example, a compatible layer 40 is formed between the second member 20 and the adhesive layer 30, in which the first resin material constituting the second member 20 and the second resin material constituting the adhesive layer 30 are compatible with each other. This can further improve the adhesion and airtightness between the second member 20 and the adhesive layer 30.

[0050] In this embodiment, the thickness T1 of the compatible layer 40 is within a range of 1.0 to 25 μm, which provides the compatible layer 40 with a sufficient thickness to maintain the adhesiveness and airtightness between the second member 20 and the adhesive layer 30.

[0051] In this embodiment, the first resin material forming the second member 20 is an engineering plastic or a super engineering plastic, and the second resin material forming the adhesive layer 30 is an epoxy resin, a polyamide-imide resin, or a polyimide resin. By using an engineering plastic or a super engineering plastic as the first resin material, the insulating property, heat resistance, chemical resistance, and mechanical properties of the second member 20 can be improved. The epoxy resin, polyamide-imide resin, or polyimide resin adopted as the second resin material has good wettability with heat-melted engineering plastics or super engineering plastics, and is easily compatible with each other, and has surface characteristics with high affinity and compatibility with engineering plastics and super engineering plastics. In addition, since these materials have excellent heat resistance, thermal deterioration due to heat-melted engineering plastics or super engineering plastics during molding is unlikely to occur. Therefore, by adopting the first resin material and the second resin material as described above, sufficient adhesion can be obtained between the first member 10 and the adhesive layer 30 and between the second member 20 and the adhesive layer 30. In addition, since the second member 20 and the adhesive layer 30 are both resins, sufficient adhesion can be obtained between them. As a result, the airtightness between the first member 10 and the second member 20 can be further improved.

[0052] In this embodiment, the second resin material forming the adhesive layer 30 is an electrolytically activated electrodeposition paint. As a result, the adhesive layer 30 is cured by an electrolytically activated curing system, and therefore the adhesive layer 30 is both curable and stable, and the adhesiveness and airtightness between the first member 10 and the second member 20 are further improved.

[0053] Furthermore, according to the manufacturing method of the bonded body 1 of this embodiment, the second member 20 can be bonded to the first member 10 by causing the adhesive layer 30 in a semi-cured state and a part of the second member 20 to dissolve together. As described above, the adhesive layer 30 provides an airtight seal between the first member 10 and the second member 20, and the amount of He leakage is reduced to 1×10 -10 Pa·m 3 It can exhibit extremely high airtightness of less than 1 / sec.

[0054] In the manufacturing method of the bonded body 1 of this example, in the adhesive layer forming step S1, the uncured adhesive layer 30 is formed and then reheated. This makes it possible to further improve the adhesion between the adhesive layer 30 and the second member 20.

[0055] In addition, before performing the adhesive layer forming step S1, the bonding surface 11 may be subjected to laser processing or etching processing to form a plurality of recesses having a depth and an opening width of 100 μm or more and 500 μm or less, thereby providing the airtight region 12. For example, as shown in Modification 1 in FIG. 6, the bonding surface 11 can be laser processed to form the recesses by irradiating the bonding surface 11 with laser light using a laser irradiation device 50. The recesses forming the airtight region 12 have an appropriate size that allows the material for forming the adhesive layer 30 to easily spread, so that an air layer is prevented from entering between the adhesive layer 30 and the bonding surface 11 of the first member 10, and the airtightness between the first member 10 and the second member 20 can be further improved. In addition, the recesses can provide an anchor effect for the second member 20, and the adhesion between the first member 10 and the second member 20 can be further improved.

[0056] In this embodiment 1, the shape of the first member 10 is cylindrical, but it is not limited to this and may be another shape. For example, it may be plate-shaped as in Modification 2 shown in Fig. 7(a) or square prism-shaped as in Modification 3 shown in Fig. 7(b). Modifications 2 and 3 also provide the same effects as those of embodiment 1.

[0057] Also, as in Modification 4 shown in Figs. 8(a) and 8(b), a disk-shaped flange portion 15 may be provided on the cylindrical first member 10 in this embodiment 1, and the flange portion 15 may also be bonded to the upper surface of the second member 20 via an adhesive layer 30. In this Modification 4, the lower surface of the flange portion 15, i.e., the surface of the flange portion 15 facing the second member 20, is also etched by laser light irradiation to form an airtight region 12. Modification 4 also provides the same effects as those of Example 1, and the flange portion 15 can enlarge the joint between the first member 10 and the second member 20, thereby improving the joint strength and airtightness between the two. Note that, as in Modification 5 shown in Figs. 9(a) and 9(b), the shape of the first member 10 may be a shape in which the upper part of the flange portion 15 of the first member 10 in Modification 4 shown in Figs. 8(a) and 8(b) is removed. Modification 5 also provides the same effects as those of Modification 4.

[0058] In addition, in this Example 1, the first member 10 is inserted into the through hole 21 of the second member 20, but this is not limited to the above. As shown in Modification Example 6 in FIG. 10(a), the plate-shaped first member 10 and the plate-shaped second member 20 may be arranged in parallel and joined together via an adhesive layer 30 in the area where they overlap in the thickness direction (height direction Z).

[0059] Furthermore, as in Modification 7 shown in Fig. 10(b), the first member 10 may have a concave-convex portion 13, and the second member 20 may be inserted into the concave-convex portion 13. In this case, the second member 20 inserted into the concave-convex portion 13 serves as an anchor for the first member 10 and increases the area of ​​the joint between the two, thereby improving the joint strength between the first member 10 and the second member 20. The concave-convex portion 13 may be formed by pressing or machining. The concave-convex portion 13 may also be formed in a groove shape to form a groove portion.

[0060] 10(b), the opening width W1 of the uneven portion (groove portion) 13 is set to 100 μm or more. This allows the material for forming the adhesive layer 30, even if it is a resin material with low wettability, to easily enter the uneven portion (groove portion) 13, thereby further improving the airtightness between the first member 10 and the second member 20.

[0061] 10(c), the first member 10 may have a through hole 14, and the second member 20 may fit into the through hole 14. In this case, the second member 20 fitting into the through hole 14 serves as an anchor for the first member 10 and can increase the area of ​​the joint between the first member 10 and the second member 20, thereby improving the joint strength between the first member 10 and the second member 20.

[0062] 10(c), the diameter D of the through hole 14 is set to be equal to or larger than the thickness T3 of the first member 10. This makes it easier for the material of the second member 20 to enter the through hole 14, and the bonding strength between the first member 10 and the second member 20 can be improved.

[0063] As described above, according to this embodiment 1 and modifications 2 to 7, it is possible to provide the bonded body 1 having excellent adhesiveness and airtightness.

[0064] Example 2 In the above-mentioned Example 1, the airtight region 12 was formed over the entire joint surface 11 of the first member 10, but in this Example 2, instead, as shown in Fig. 11, the joint surface 11 of the first member 10 includes the airtight region 12 with high smoothness and a rough surface region 16 that has been roughened and has a surface roughness greater than that of the airtight region 12. Since the other configurations are the same as those in Example 1, the same reference numerals as those in Example 1 are used and the description thereof will be omitted.

[0065] In the second embodiment, as described above, the joining surface 11 of the first member 10 includes the airtight region 12 and the rough surface region 16, so that the airtightness between the second member 20 and the first member 10 can be improved in the airtight region 12 having a high smoothness, and the adhesiveness between the second member 20 and the first member 10 can be improved in the rough surface region 16. This makes it possible to further improve both the adhesiveness and the airtightness. Note that the second embodiment also provides the same effects as the first embodiment.

[0066] Example 3 In the bonded body 1 of Example 3, as shown in Figures 12(a) and 12(b), the second member 20 is plate-shaped and has a through hole 21, and the first member 10 is plate-shaped and overlaps the second member 20 so as to cover the through hole 21. The second member 20 and the first member 10 are bonded to each other at the overlapping portion of the first member 10 and the second member 20 via an adhesive layer 30, and the adhesive layer 30 prevents gas from passing between the second member 20 and the first member 10 at the through hole 21. The other configurations are the same as those in Example 1, so the same reference numerals as those in Example 1 are used and the description thereof is omitted.

[0067] According to the joined body 1 of Example 3, by using the second member 20 in which the through hole 21 is blocked by the first member 10 as a lid for a storage container (not shown), it is possible to provide a storage container with excellent airtightness since the first member 10 is prevented from decreasing the airtightness of the storage container. Note that this Example 3 also provides the same effects as those of Example 1.

[0068] Example 4 As shown in Figs. 13(a) to 13(c), in the joined body 1 of Example 4, the second member 20 is a part of a sealed container 60 and has a cylindrical resin tubular portion 25 that forms an opening 61 of the sealed container 60. The first member 10 is cylindrical and is disposed inside the resin tubular portion 25 coaxially with the resin tubular portion 25. The outer peripheral surface 10a of the first member 10 is provided with an airtight region 12 and is joined to the inner peripheral surface 25a of the resin tubular portion 25 via an adhesive layer 30, and the adhesive layer 30 prevents gas from passing between the inner peripheral surface 25a of the resin tubular portion 25 and the outer peripheral surface 10a of the first member 10. The other configurations are the same as those of Example 1 and Modification 4, so the same reference numerals as those in these cases are used and the description thereof is omitted.

[0069] According to the joined body 1 of Example 4, the strength of the opening 61 of the sealed container 60 can be improved, and the joint surface 11 between the first member 10 and the second member 20 can be prevented from reducing the airtightness of the sealed container 60, thereby providing a sealed container 60 with excellent airtightness. The sealed container 60 can be used as a cylinder capable of storing a gas with a small molecular weight, such as hydrogen gas or helium gas. This Example 4 also provides the same effects as those of Example 1 and Modification 4.

[0070] The first member 10 in this embodiment 4 may have a shape that does not have the flange portion 15 shown in Figs. 13(a) to 13(c), as in Modification 9 shown in Figs. 14(a) to 14(c). Also, as in Modification 10 shown in Figs. 15(a) to 15(c), a disk-shaped first member 10 having a through hole may be bonded to the upper end surface of a cylindrical second member 20 via an adhesive layer 30. In Modification 10, an airtight region 12 is formed on the lower surface 10c of the first member 10 that faces the upper end surface of the second member 20. These Modifications 6 and 6 also provide the same effects as those of this embodiment 4.

[0071] Example 5 As shown in Figs. 16(a) to 16(c), in the joined body 1 of Example 5, the second member 20 has a resin tubular portion 26 which constitutes a part of the sealed container 60 and is tubular to form an opening 61 of the sealed container 60, and the cylindrical first member 10 is disposed coaxially with the resin tubular portion 26 on the outside of the resin tubular portion 26. The outer peripheral surface 26a of the resin tubular portion 26 and the inner peripheral surface 10b of the first member 10 are joined via an adhesive layer 30. The adhesive layer 30 prevents gas from passing between the outer peripheral surface 26a of the resin tubular portion 26 and the inner peripheral surface 10b of the first member 10. In Example 5, an airtight region 12 is formed on the inner peripheral surface 10b of the first member 10. The other configurations are the same as those in Example 1, so the same reference numerals as those in Example 1 are used and the description thereof is omitted.

[0072] The bonded body 1 of Example 5 can also improve the strength of the opening 61 of the sealed container 60, and prevent the bonding surface 11 between the first member 10 and the second member 20 from reducing the airtightness of the sealed container, thereby providing a sealed container 60 with excellent airtightness.

[0073] 17(a) to 17(c), the first member 10 in this embodiment 5 may be configured so that the first member 10 covers the upper end of the resin tubular portion 26. This embodiment 5 also has the same advantageous effects as the embodiment 5.

[0074] Example 6 The present Example 6 shown in FIG. 18 is a joined body 1 in which a second member 20 made of metal is used and the second member 20 and a first member 10 made of metal are joined via an adhesive layer 30. In the present Example 6, as shown in FIG. 19(a), the first member 10 has a cylindrical shaft portion 17 and a disk-shaped flange portion 18 provided in the center of the shaft portion 17. A first adhesive layer 31 is provided on a joining surface 11, which is the back surface of the flange portion 18. The first adhesive layer 31 has a configuration equivalent to that of the adhesive layer 30 of the above-mentioned Example 1.

[0075] As shown in FIG. 19(a), the second member 20 is in the form of a plate having a through hole 21. As shown by the arrow P, the shaft portion 17 of the first member 10 is inserted into the through hole 21. A second adhesive layer 32 is provided on the inner wall of the through hole 21 in the second member 20 and in the area around the through hole 21 facing the flange portion 18. The second adhesive layer 32 has a configuration equivalent to that of the adhesive layer 30 in the above-mentioned Example 1. As shown in FIGS. 19(b) and (c), the joint surface 22, which is a portion of the second member 20 covered by the electrodeposition coating film forming the second adhesive layer 32, has a configuration equivalent to that of the joint surface 11 in the above-mentioned Example 1, and the joint surface 22 includes an airtight region 23 having a configuration equivalent to that of the airtight region 12 in the above-mentioned Example 1.

[0076] The bonded body 1 of this Example 6 is manufactured as follows. First, in the adhesive layer forming step S1 shown in FIG. 19(a), a deposit film is formed on the surfaces of the first member 10 and the second member 20 by electrochemical coating, and the deposit film is washed with water. Then, the first adhesive layer 31 and the second adhesive layer 32 are heated to a temperature lower than the curing temperature of the first adhesive layer 31 and the second adhesive layer 32 to volatilize the moisture and form the first adhesive layer 31 and the second adhesive layer 32 in an uncured state. The electrochemical coating in the adhesive layer forming step S1 is performed in the same manner as in the above-mentioned Example 1. Also, as in the case of Example 1, after the first adhesive layer 31 and the second adhesive layer 32 in a semi-cured state are formed, they are reheated. Then, as shown by the arrow P, the shaft portion 17 of the first member 10 is inserted into the through hole 21 of the second member 20.

[0077] 19(b), in a bonding step S2, the shaft portion 17 of the first member 10 is inserted into the through hole 21 of the second member 20 and heated to cause the uncured first adhesive layer 31 and second adhesive layer 32 to become compatible, thereby bonding the first member 10 and the second member 20. As a result, a compatible layer 33 is formed in the adhesive layer 30, and the bonded body 1 shown in FIG.

[0078] According to the joined body 1 of this Example 6, the first member 10 and the second member 20 are joined via an adhesive layer 30 consisting of a resin electrocoating film, so that they are electrically insulated from each other, and at the same time, as in the case of Example 1, both high adhesion and high airtightness are achieved between the first member 10 and the second member 20.

[0079] The present invention is not limited to the above-described embodiments and modifications, and can be applied to various embodiments without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0080] 1 zygote 10 First member 11 Joint surface 12 Airtight Zone 13 Uneven part (groove part) 16 Rough surface area 20 Second member 30 Adhesive layer 40 Compatible layer 60 Airtight Containers 61 Opening

Claims

1. A joined body in which a first member made of metal and a second member made of resin or metal are joined via an adhesive layer made of an electrodeposition coating film, a gap between the first member and the second member is hermetically sealed by the adhesive layer; The airtightness between the first member and the second member due to the adhesive layer is such that the He leak amount is 1×10 －１０ P.A.M. ３ / sec or less.

2. 2. The joined body according to claim 1, wherein a portion of the first member that is covered with the electrodeposition coating film that forms the adhesive layer includes an area having a surface roughness Ra of 5.0 μm or less.

3. 3. The joined body according to claim 1, wherein the second member is made of a resin, and a compatible layer is formed between the second member and the adhesive layer, the compatible layer being made of a first resin material constituting the second member and a second resin material constituting the adhesive layer.

4. The bonded body according to claim 3, wherein the thickness of the compatibility layer is within a range of 1.0 to 25 μm.

5. the first resin material forming the second member is an engineering plastic or a super engineering plastic; 3. The bonded structure according to claim 1, wherein the second resin material forming the adhesive layer is an epoxy resin, a polyamide-imide resin, or a polyimide resin.

6. The joined body according to claim 5 , wherein the second resin material is an electrolytically activated electrodeposition paint.

7. The bonded structure according to claim 1 or 2, wherein the first member has an uneven portion or a groove portion, and the second member is fitted into the uneven portion or the groove portion.

8. 8. The joined body according to claim 7, wherein the uneven portion or the groove portion is formed in a portion covered by the electrodeposition coating film that forms the adhesive layer, and the opening width of the uneven portion or the groove portion is 100 μm or more.

9. The bonded body according to claim 1 or 2, wherein the first member has a through hole, and the second member penetrates into the through hole.

10. The bonded body according to claim 9 , wherein the diameter of the through hole is equal to or greater than the thickness of the first member.

11. The joint body according to claim 1 or 2, wherein the second member is made of a metal, and the adhesive layer is formed by a first adhesive layer made of an electrocoating coating formed on the first member and a second adhesive layer made of an electrocoating coating formed on the second member being mutually dissolved.

12. A method for producing the bonded body according to claim 3, comprising the steps of: an adhesive layer forming step of forming a deposit film on the surface of the first member by electrocoating, washing the deposit film with water, and then heating the deposit film to a temperature lower than the curing temperature of the adhesive layer to volatilize moisture and form the adhesive layer in an uncured state; a joining step of joining the second member to the first member by causing the uncured adhesive layer to dissolve with a portion of the material forming the second member that has been heated to make it fluid.

13. The method for producing a bonded body according to claim 12 , wherein in the adhesive layer forming step, the adhesive layer in the uncured state is formed and then reheated.

14. A method for producing a bonded body according to claim 11, comprising the steps of: an adhesive layer forming step of forming a deposition film on the surfaces of the first member and the second member by electrocoating, washing the deposition film with water, and then heating the deposition film to a temperature lower than the curing temperature of the first adhesive layer and the second adhesive layer to volatilize moisture and form the first adhesive layer and the second adhesive layer in an uncured state; a joining step of joining the first member and the second member by causing the first adhesive layer and the second adhesive layer in an uncured state to be compatible with each other.

15. The method for producing a bonded body according to claim 14 , wherein in the adhesive layer forming step, the first adhesive layer and the second adhesive layer in the uncured state are formed and then reheated.

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