Mounting device

The assembly device addresses the complexity of assembling parts to resin members in transit by using a positioning unit with X and Z directional regulation and a detection unit for accurate part attachment, ensuring reliable assembly with a simplified design.

JP2025015074APending Publication Date: 2025-01-30INOAC CORP +1
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Patent Information

Application Number
JP2023118179
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-07-20
Publication Date
2025-01-30

AI Technical Summary

Technical Problem

Existing assembly devices for assembling parts to resin members being transported are complex in structure and require efficient positioning and fixation during the assembly process.

Method used

An assembly device that fixes the position of resin members using a positioning unit with first and second mechanisms to regulate movement in X and Z directions, and an assembly part to securely attach parts to the resin member, while utilizing a detection unit to ensure accurate placement.

Benefits of technology

Enables reliable assembly of parts to resin members being transported with a simple structure by maintaining precise positional control and preventing dislodgment during the assembly process.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a novel mounting device which mounts a component with a resin member being conveyed.SOLUTION: A mounting device for mounting a component on a resin member held displaceably on a conveyance device includes: a positioning part which contacts the resin member and fixes the position of the resin member; and a mounting part which mounts the component on the resin member with the positioning part fixing the position of the resin member.SELECTED DRAWING: Figure 5
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Description

[Technical field]

[0001] The present disclosure relates to an assembly device. [Background technology]

[0002] Conventionally, there is known an assembly device that assembles a separate part to a resin member. The assembly device may assemble a part to a resin member being transported to a post-process by a transport device (for example, Patent Document 1). Patent Document 1 discloses a take-out robot that grasps the resin member being transported and holds it in a predetermined position, and an assembly robot that holds a part, moves to the assembly location while measuring the assembly location, and assembles the part to the resin member.

[0003] [Patent Document 1] JP 2017-222150 A Summary of the Invention [Problem to be solved by the invention]

[0004] The resin member may move relative to the conveying device during conveyance. It is preferable that the assembling device has a relatively simple structure. The present disclosure provides a novel assembling device that assembles a part onto the resin member during conveyance. [Means for solving the problem]

[0005] The assembly device according to the present disclosure is an assembly device that assembles a part to a resin member that is held in a displaceable state relative to a conveying device, and includes a positioning part that contacts the resin member and fixes the position of the resin member, and an assembly part that assembles the part to the resin member while the positioning part fixes the position of the resin member. Effect of the Invention

[0006] According to the present disclosure, it is possible to provide a novel assembly device that assembles a part onto a resin member being transported. [Brief description of the drawings]

[0007] [Figure 1] FIG. 4 is a perspective view showing a resin member and a component attached to the resin member. [Diagram 2] FIG. 4 is a front view showing a resin member and components attached to the resin member. [Diagram 3] FIG. 4 is a side view showing the resin member and a component attached to the resin member. [Figure 4] FIG. [Diagram 5] FIG. [Figure 6] Schematic diagram showing a manufacturing process of a resin member. [Figure 7] Schematic diagram showing a manufacturing process of a resin member. [Figure 8] Schematic diagram showing a manufacturing process of a resin member. [Figure 9] Schematic diagram showing a manufacturing process of a resin member. [Figure 10] FIG. 4 is a schematic diagram showing the positional relationship between an assembly device and components. [Figure 11] FIG. 4 is a schematic diagram showing the positional relationship between an assembly device and components. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. First, a resin member M and a part E attached to the resin member M will be described.

[0009] 1, the resin member M of this embodiment is an interior member of a vehicle, and the part E is a clip for attaching and fixing the resin member M to a vehicle structure. However, the resin member M may be an exterior member of a vehicle, a resin member used in buildings such as houses, or other daily necessities. The part E is not limited to a clip, and may be a cap made of an elastic body, or the like.

[0010] The resin member M has a plate portion 21. The plate portion 21 includes a front surface 21a and a back surface 21b opposite to the front surface 21a. The front surface 21a may be formed as a design surface of the resin member M.

[0011] The resin member M further has a pedestal 22 protruding from the rear surface 21b of the plate portion 21. The pedestal 22 has an attachment surface 23 to which the component E is attached and a reference surface 24 used to position the resin member M.

[0012] 2 and 3 are enlarged views of a portion of the resin member M to which the component E is attached. Fig. 2 is a front view of the resin member M near the base 22, and Fig. 3 is a side view of the same.

[0013] 2, the base 22 of this embodiment viewed from the front has a shape of a truncated cone with a part removed. The inside of the base 22 is formed hollow except for a reference surface 24.

[0014] The base 22 includes an outer surface 22a and an opening 22b. In this embodiment, the outer surface 22a is a curved surface that is inclined with respect to the height direction (the direction of the arrow Z in FIG. 2) of the base 22. In this embodiment, the opening 22b opens in the direction of the arrow X.

[0015] The mounting surface 23 is a plate piece provided at the tip of the base 22. The mounting surface 23 includes a notch 23a for receiving the component E.

[0016] The reference surface 24 is a plate piece provided inside the base 22. The reference surface 24 in this embodiment is disposed between the rear surface 21b of the plate portion 21 and the mounting surface 23, and is parallel to the mounting surface 23.

[0017] The part E has a mounting portion 31, a protruding portion 32 protruding from one side of the mounting portion 31, and a base portion 33 protruding from the other side of the mounting portion 31. In this embodiment, the mounting portion 31 forms a constricted portion that fits the notch 23a of the mounting surface 23. The constricted portion is inserted into the notch 23a of the mounting surface 23, and the protruding portion 32 and the base portion 33 restrict movement in the thickness direction of the mounting surface 23 (the direction of the arrow Z in FIG. 2), thereby fixing the mounting portion 31 to the mounting surface 23. The protruding portion 32 is a grommet for fixing the resin member M to the vehicle structure. The protruding portion 32 is inserted into a hole provided on the vehicle side, thereby fixing the resin member M to the vehicle structure. The protruding portion 32 protrudes from the tip of the base 22 in the opposite direction to the plate portion 21 when the part E is assembled to the resin member M. When the component E is attached to the resin member M, the base 33 protrudes from the tip of the base 22 toward the plate portion 21.

[0018] Next, the assembling device 1 will be described. Fig. 4 and Fig. 5 show the assembling device 1 which assembles a part E to a resin member M being transported by a transport device C. The resin member M is held in a displaceable state relative to the transport device C. Here, the displaceable state means, for example, a state in which the resin member M is movable in the horizontal or vertical direction relative to the transport device C, or a state in which the resin member M is swingable relative to the transport device C. In this embodiment, the resin member M is held via an elastic member such as a spring with the front surface 21a facing upward (arrow Z direction) and the back surface 21b facing downward (opposite direction to arrow Z), and is suspended in a swingable state relative to the transport device C.

[0019] 4, the assembling device 1 of this embodiment is a work attachment that is attached to the tip of a robot arm R when in use. The assembling device 1 includes a positioning unit 11, an assembling unit 12, and a detection unit 13.

[0020] The positioning unit 11 comes into contact with the swingably suspended resin member M and fixes the position of the resin member M to an assembly position. The assembly position includes an X-direction component, a Y-direction component, and a Z-direction component. The positioning unit 11 fixes the resin member M to the assembly position in the X-direction, the Y-direction, and the Z-direction.

[0021] 5, the positioning unit 11 includes a first mechanism 11a, a first actuator 11b that drives the first mechanism 11a, a second mechanism 11c, and a second actuator 11d that drives the second mechanism 11c. In this embodiment, the first mechanism 11a and the second mechanism 11c are disposed opposite to each other in the X direction.

[0022] The first mechanism 11a regulates the movement of the resin member M in the X direction and the Y direction (an example of a first direction). The first mechanism 11a includes a first regulating portion 11e. In this embodiment, the first regulating portion 11e is a plate-like member having an arc-shaped notch corresponding to the shape of the outer surface 22a of the base 22.

[0023] The first actuator 11b moves the first mechanism 11a to change the position of the first mechanism 11a relative to the second mechanism 11c. In this embodiment, the first actuator 11b controls the relative movement of the first mechanism 11a and the second mechanism 11c in the X direction.

[0024] The second mechanism 11c restricts movement of the resin member M in the Z direction (an example of the second direction). The second mechanism 11c includes a second restricting portion 11f that is inserted into the opening 22b of the base 22 and contacts the reference surface 24 of the resin member M to position the resin member M in the Z direction. The second restricting portion 11f in this embodiment is a plate-like member extending toward the first mechanism 11a. The second restricting portion 11f is formed in accordance with the shape and size of the reference surface 24 of the resin member M. The size of the second restricting portion 11f in the width direction (the direction of the arrow Y in FIG. 4) in this embodiment is formed to be smaller than the opening 22b of the base 22.

[0025] The second actuator 11d moves the second mechanism 11c to change the position of the second mechanism 11c relative to the first mechanism 11a. The second actuator 11d of the present embodiment controls the relative movement of the first mechanism 11a and the second mechanism 11c in the Z direction.

[0026] With the positioning unit 11 fixing the resin member M at the assembly position, the assembly unit 12 assembles the part E to the resin member M. The assembly unit 12 of this embodiment presses the part E towards the resin member M to assemble it.

[0027] The assembly unit 12 has a holder 12a that holds the component E, and a third actuator 12b that drives the holder 12a.

[0028] The holding portion 12a holds a part E that has been prepared in advance, and moves and assembles the part E near the resin member M. The holding portion 12a in this embodiment is a cylindrical member that corresponds to the shape of the protruding portion 32 of the part E. The holding portion 12a holds the protruding portion 32 of the part E therein, and moves the part E in a state in which the attachment portion 31 and the base portion 33 are exposed.

[0029] The third actuator 12b moves the holding portion 12a in the X direction, the Y direction, and / or the Z direction. In this embodiment, the third actuator 12b moves at least the holding portion 12a along the X direction. The third actuator 12b moves the holding portion 12a along the X direction, and brings it closer to the component E from the opening 22b side. This allows the assembly unit 12 to assemble the mounting portion 31 of the component E to the mounting surface 23.

[0030] The detection unit 13 detects whether the part E is placed at a predetermined position on the attachment surface 23 and whether the part E is assembled to the resin member M. The detection unit 13 in this embodiment is an infrared sensor or a laser sensor provided near the holding portion 12a of the assembly unit 12.

[0031] Next, the process of assembling the part E by the assembling device 1 will be described.

[0032] 6 to 9 are schematic diagrams showing the manufacturing process of the resin member M. The resin member M of this embodiment is taken out of the injection molding machine, and while being transported by a transport device C to a post-process, a part E is attached to it.

[0033] As shown in Fig. 6(a), first, a resin member M is formed. The resin member M of this embodiment is formed by an injection molding machine. The injection molding machine injects a resin material into a cavity 41 formed between a pair of molds S. The resin material solidifies in the cavity 41 to become the resin member M.

[0034] 6(b), the resin member M is removed from the mold S and transported by the transport device C. The transport device C holds the plate portion 21 of the resin member M and moves the resin member M. The transport device C of this embodiment holds the resin member M by adsorbing to the surface 21a of the plate portion 21.

[0035] 6(c), during transport by the transport device C, the resin member M is suspended from the transport device C. The resin member M is held via an elastic member and is therefore held without being affected by air resistance during transport, but the resin member M during transport is held in a state in which it can swing relative to the transport device C.

[0036] The resin member M of this embodiment is transported with the front surface 21a of the plate portion 21 facing upward (the direction of the arrow Z in FIG. 6(c)) and the back surface 21b facing downward (the direction opposite to the arrow Z in FIG. 6(c)). That is, the resin member M is transported with the base 22 and the mounting surface 23 facing downward.

[0037] When the resin member M reaches the vicinity of the robot arm R and the assembly device 1, the transport device C temporarily suspends transport of the resin member M, and the assembly device 1 holds the part E and moves to the vicinity of the resin member M. The part E is preferably prepared in an inverted state with respect to the orientation in which it is to be assembled into the resin member M. In this embodiment, the part E is attached to the resin member M with the base 33 facing upward and the protruding part 32 facing downward. Therefore, the part E before assembly is prepared with the protruding part 32 facing upward and the base 33 facing downward.

[0038] When the assembling device 1 holds the protruding portion 32 by the holding portion 12a of the assembling unit 12 with the holding portion 12a of the assembling unit 12 facing downward, the assembling device 1 reverses the position of the part E. As a result, the assembling device 1 faces upward with the holding portion 12a of the assembling unit 12 facing upward, and the part E faces downward with the protruding portion 32. The assembling device 1 assembles the part E to the resin member M in this upward position.

[0039] 7(a), the assembling device 1 moves the part E to the vicinity of the base 22 of the resin member M with the base 33 of the part E facing upward (the direction of the arrow Z in FIG. 7(a)). Accordingly, the assembling device 1 is disposed in an initial position for assembling the part E.

[0040] In the initial position, the first mechanism 11a is disposed to face the outer surface 22a of the base 22. The second mechanism 11c is disposed to face the opening 22b of the base 22. That is, the first mechanism 11a and the second mechanism 11c are disposed to sandwich the base 22 in the X direction.

[0041] Next, as shown in FIG. 7(b), the first mechanism 11a of the assembly apparatus 1 is driven by the first actuator 11b (see FIG. 5) and moves from the initial position indicated by the dashed line toward the second mechanism 11c along the X direction.

[0042] FIG. 10 is a schematic diagram showing the positional relationship between the first mechanism 11a and the base 22 accompanying the movement of the first mechanism 11a. The first mechanism 11a of this embodiment moves along the X direction from the initial position shown by the dashed line in FIG. 11 to the position shown by the solid line. At this time, the first mechanism 11a surrounds the outer surface 22a of the base 22. In addition, as the first mechanism 11a moves, a part or the whole of the first restricting portion 11e abuts against the outer surface 22a of the base 22. Since the resin member M is suspended so as to be swingable with respect to the conveying device C, it can be moved to a specified assembly position by being pushed by the first restricting portion 11e. The first restricting portion 11e of this embodiment abuts against the outer surface 22a from the opposite side of the opening 22b of the base 22 in the X direction and the Y direction. This allows the first mechanism 11a to move the base 22 to the assembly position.

[0043] Next, as shown in FIG. 7(c), the second mechanism 11c of the assembly apparatus 1 is driven by the second actuator 11d (see FIG. 5) and moves downward (in the direction opposite to the direction of the arrow Z) from the initial position indicated by the dashed line.

[0044] Fig. 11 is a schematic diagram showing the positional relationship between the second mechanism 11c and the pedestal 22 as the second mechanism 11c moves. The second mechanism 11c moves in the Z direction from an initial position shown by a dashed line to a position shown by a solid line in Fig. 11. As a result, the second restricting portion 11f of the second mechanism 11c abuts against the reference surface 24 of the pedestal 22, restricting the movement of the pedestal 22 in the Z direction.

[0045] As described above, the assembly device 1 can move the base 22 and the mounting surface 23 to the assembly position and hold them at the assembly position by the first mechanism 11a. The assembly device 1 restricts the movement of the base 22 and the mounting surface 23 in the Z direction by the second mechanism 11c.

[0046] 8(a), the assembly device 1 assembles the part E while holding the resin member M at the assembly position. The assembly unit 12 of the assembly device 1 of this embodiment moves the part E from the opening 22b of the base 22 along the X direction, and inserts the mounting part 31 of the part E into the notch 23a of the mounting surface 23. As the part E is assembled, the base 22 is pressed in the direction in which the part E is assembled (X direction). In response to this, the first restricting unit 11e presses the outer surface 22a of the base 22 from the direction opposite to the direction in which the part E is assembled, thereby restricting the movement of the base 22 from the assembly position.

[0047] Further, the second restricting portion 11f presses against the reference surface 24 of the base 22 to restrict the movement of the base 22 in the Z direction associated with the installation of the component E.

[0048] Furthermore, the assembling device 1 detects whether or not the part E is in a predetermined assembling position in a state in which the part E is assembled to the resin member M. The detection unit 13 (see FIG. 5) of this embodiment detects the position of the part E assembled on the mounting surface 23 of the base 22 by the assembling unit 12. If it is detected that the part E has not reached the predetermined position, the assembling unit 12 further presses the part E along the X direction.

[0049] 8(b), the assembling device 1 moves away from the resin member M. The assembling device 1 of this embodiment separates the holding portion 12a of the assembling unit 12 from the protruding portion 32 of the component E. Furthermore, the assembling device 1 moves the first mechanism 11a and the second mechanism 11c to their initial positions and moves them away from the vicinity of the base 22.

[0050] 9(a), when the assembly device 1 moves away from the resin member M, the resin member M is held only by the conveying device C. The conveying device C resumes conveying the resin member M.

[0051] 9(b), the resin member M having the part E assembled thereto is transported to a predetermined position by a transport device C. In this embodiment, the transport device C places the resin member M on a belt conveyor B for moving the resin member M to the next process.

[0052] 9(c), when the conveying device C places the resin member M on the belt conveyor B, it releases the resin member M. As a result, the resin member M is moved to a subsequent process by the belt conveyor B with the surface 21a of the plate portion 21 facing upward (the direction of the arrow Z in FIG. 9(b)).

[0053] As described above, the resin member M is held displaceably (rockably in this embodiment) relative to the conveying device C. The positioning unit 11 of the assembly device 1 of the present disclosure contacts the resin member M to fix the position of the resin member M. Therefore, the part E can be reliably assembled to the resin member M held displaceably relative to the conveying device C by using the assembly unit 12.

[0054] In the assembling device 1 of the present disclosure, the resin member M is held at a specified assembling position, so that the assembling unit 12 can assemble the part E to the resin member M simply by moving the part E to the assembling position. Since the settings such as the moving distance of the assembling unit 12 (stroke of the third actuator 12b) only need to be fixed, it is possible to provide an assembling device 1 with a relatively simple structure.

[0055] Furthermore, the assembly apparatus 1 restricts movement of the resin member M in the X direction and / or Y direction by the first mechanism 11a. The first mechanism 11a presses the resin member M from the direction in which the part E is assembled to the resin member M, i.e., the opposite direction to the direction in which the resin member M is pressed when assembling the part E. This allows the assembly apparatus 1 to prevent the resin member M from coming off the part E when assembling the part E to the resin member M.

[0056] Further, the second mechanism 11c of the assembling apparatus 1 restricts movement of the resin member M in the Z direction. This enables the assembling apparatus 1 to fix the position of the resin member M at the assembling position with high accuracy.

[0057] Moreover, the resin member M has an attachment surface 23 on which the part E is attached to the back surface 21b of the plate portion 21. The conveying device C holds the front surface 21a of the plate portion 21 opposite to the back surface 21b, and conveys the resin member M with the attachment surface 23 facing downward. This allows the resin member M to be conveyed with a space around the attachment surface 23 for assembling the part E.

[0058] Furthermore, the assembling unit 12 of the assembling device 1 holds the protruding portion 32 of the part E and moves the part E to the vicinity of the base 22 of the resin member M. In this case, the assembling device 1 holds the part E in a state inverted from the mounting attitude to the resin member M, inverts the attitude of the part E, and moves the mounting portion 31 to the mounting surface 23 of the resin member M. In this way, the assembling device 1 can assemble the part E to the resin member M without having to reposition the part E when the resin member M is transported with the mounting surface 23 facing downward.

[0059] As described above, according to the present disclosure, it is possible to provide a novel assembly device that assembles a component onto a resin member being transported.

[0060] <Other embodiments> Although the embodiment of the present disclosure has been described above, the present disclosure is not limited to the above embodiment, and various modifications are possible without departing from the gist of the invention. In particular, the multiple modifications described in this specification can be arbitrarily combined as necessary.

[0061] The assembly device 1 of the present embodiment assembles the part E to the pedestal 22 provided on the resin member M, but the present disclosure is not limited thereto. That is, the pedestal 22 may have a variety of shapes for receiving the part E, and may be, for example, a vertical wall with an opening or slit provided in the resin member M. Also, the part E of the present embodiment is inserted into the opening 22b provided on the side of the pedestal 22, but the assembly direction of the part E can be changed according to the shape of the pedestal 22.

[0062] In addition, in the assembly device 1 of the present embodiment, the first mechanism 11a restricts the movement of the resin member M in the X direction and / or Y direction, and the second mechanism 11c restricts the movement of the resin member M in the Z direction, but the present disclosure is not limited to this. That is, the first mechanism 11a and the second mechanism 11c may restrict the movement of the resin member M from different directions. For example, a modification is possible in which one mechanism restricts the movement in the X direction and the other mechanism restricts the movement in the Y direction and / or Z direction.

[0063] Furthermore, the shapes of the first restricting portion 11e of the first mechanism 11a and the second restricting portion 11f of the second mechanism 11c of the present disclosure can also be changed in various ways. For example, the first restricting portion 11e may be an L-shaped plate-like member that restricts the movement of the resin member M in the X direction and / or Y direction. Moreover, the second restricting portion 11f may have a U-shaped cross-sectional shape that sandwiches the reference surface 24 from both the upper and lower sides in order to restrict the movement of the resin member M in the Z direction.

[0064] In addition, the first mechanism 11a in this embodiment is moved in the X direction by the first actuator 11b, but the present disclosure is not limited to this. The first mechanism 11a may be moved in the Y direction or Z direction by providing an additional actuator. The second mechanism 11c is also moved in the Z direction by the second actuator 11d, but may be moved in the X direction or Y direction by providing an additional actuator.

[0065] Furthermore, although the mounting surface 23 and the reference surface 24 of the base 22 in this embodiment are disposed to be spaced apart in the Z direction, the present disclosure is not limited to this. That is, the mounting surface 23 and the reference surface 24 may be provided as different points on the same plane. For example, the assembly device 1 may assemble the part E by using a different point on the same plane as the mounting surface 23 while restricting movement with the second mechanism 11c using one of the planes as the reference surface 24. [Explanation of symbols]

[0066] 1: Assembly device 11: Positioning section 11a: 1st mechanism 11c:Second mechanism 12: Assembly section 13: Detection unit M: Resin material 23: Mounting surface 24: Reference plane E: Parts C: Transport device

Claims

1. An assembly device that assembles a component to a resin member that is held in a displaceable state relative to a conveying device, a positioning portion that comes into contact with the resin member and fixes the position of the resin member; an assembly unit that assembles the component to the resin member while the positioning unit fixes the position of the resin member; An assembly device comprising:

2. the assembly unit presses the component in a first direction to assemble it to the resin member; the positioning portion has a first mechanism that restricts movement of the resin member in the first direction by contacting the resin member from the first direction when the assembly portion assembles the component to the resin member, The assembly device according to claim 1 .

3. the positioning portion has a second mechanism that restricts movement of the resin member in a second direction intersecting the first direction by contacting the resin member in the second direction. The assembly device according to claim 2 .

4. the resin member has a mounting surface to which the component is attached, the conveying device conveys the resin member with the mounting surface facing downward, the assembly unit holds the component in a downward position and assembles the component to the resin member in an upward position; The assembly device according to any one of claims 1 to 3.

5. The assembly device includes: a detection unit that detects whether the part is attached to the resin member; The assembly device according to claim 1 .