Coil component

Abstract

To enable connection reliability to be maintained between a coil and an external electrode in a coil component despite vibrations or external impacts and to strengthen physical coupling force between a body and the external electrode by bending one region of an end of the external electrode toward a recess formed in the body.SOLUTION: According to an aspect of the present disclosure, a coil component includes: a body including a first surface and a second surface opposing each other in a first direction, and a third surface connecting the first surface to the second surface; a coil disposed in the body and including a lead-out portion led out to the first surface or the second surface; and an external electrode disposed on the body and connected to the lead-out portion and including a first metal layer and a second metal layer. The first metal layer includes an inner side surface facing the body and an outer side surface opposing the inner side surface. The second metal layer can be disposed on each of the inner side surface and the outer side surface of the first metal layer.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a coil component. [Background technology]

[0002] An inductor, which is a type of coil component, is a typical passive electronic component used in electronic devices along with resistors and capacitors.

[0003] As electronic devices become increasingly more powerful and smaller, the number of electronic components used in the electronic devices is also increasing and becoming smaller.

[0004] Meanwhile, thin film coil components in which a coil is plated on a support member are advantageous for miniaturization, but have the problem of reduced bonding strength between the external electrodes and the coil. Therefore, there is a demand for a structure with stronger bonding strength so that the connection reliability between the coil and external electrodes can be maintained even when subjected to vibration or impact. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2022-074828 Summary of the Invention [Problem to be solved by the invention]

[0006] It is an object of the present invention to provide a coil component capable of maintaining connection reliability between a coil and an external electrode within the coil component even when subjected to vibration or external shock.

[0007] Another object of the present invention is that a region of an end of the external electrode is bent toward a recess formed on the body to enhance the physical bonding force between the body and the external electrode. [Means for solving the problem]

[0008] According to one aspect of the present invention, a coil component may be provided that includes a main body including a first surface and a second surface facing each other in a first direction and a third surface connecting the first surface and the second surface, a coil disposed within the main body and including an extension portion extended to the first surface or the second surface, and an external electrode disposed on the main body and connected to the extension portion, the external electrode including a first metal layer and a second metal layer, the first metal layer including an inner surface facing the main body and an outer surface facing the inner surface, and the second metal layer disposed on each of the inner surface and the outer surface of the first metal layer.

[0009] According to another aspect of the present invention, there can be provided a coil component including a main body including a first surface and a second surface facing each other in a first direction, and a third surface connecting the first surface and the second surface, a coil disposed within the main body and including an extension portion extended to the first surface or the second surface, a conductive resin layer disposed on the main body and connected to the extension portion, and an external electrode disposed on the conductive resin layer and including a first metal layer and a second metal layer, the first metal layer including an inner surface facing the main body and an outer surface facing the inner surface, the second metal layer being disposed on each of the inner surface and the outer surface of the first metal layer, and the conductive resin layer being disposed between the extension portion and the second metal layer, and at least a portion of the coil component extending to the third surface. Effect of the Invention

[0010] According to an embodiment of the present invention, the reliability of the connection between the coil and the external electrode in the coil component can be maintained even when subjected to vibration or external impact.

[0011] According to an embodiment of the present invention, a region of an end of an external electrode is bent toward a recess formed on the body, thereby enhancing a physical bonding force between the body and the external electrode. [Brief description of the drawings]

[0012] [Figure 1] 1 is a perspective view showing a coil component according to a first embodiment of the present invention; [Diagram 2] FIG. 2 is an exploded perspective view of FIG. [Diagram 3] FIG. 11 is a LT cross-sectional view of the first external electrode. [Figure 4] 2 is a cross-sectional view taken along line II' of FIG. 1. [Diagram 5] 2 is a cross-sectional view taken along line II-II' in FIG. 1 and an enlarged view of region A. [Figure 6] FIG. 6 is an additional enlarged view of areas B and C in FIG. 5. [Figure 7] 11 is a cross-sectional view of a coil component according to a second embodiment of the present invention, taken along line LT, and an enlarged view of a region D, corresponding to FIG. 5. [Figure 8] 11 is a view showing a LT cross section of a coil component according to a third embodiment of the present invention, and corresponds to FIG. 7. [Figure 9] 13 is a view showing a LT cross section of a coil component according to a fourth embodiment of the present invention, and corresponds to FIG. 5. [Figure 10] 13 is a diagram showing a LT cross section of a coil component according to a modified example of the fourth embodiment of the present invention, and corresponds to FIG. 9. [Figure 11] 10 is a view showing a LT cross section of a coil component according to a fifth embodiment of the present invention, and corresponds to FIG. 9. [Figure 12] 12 is a diagram showing a LT cross section of a coil component according to a modified example of the fifth embodiment of the present invention, and corresponds to FIG. 11. [Figure 13] 2 is a diagram illustrating a schematic diagram of a part of a manufacturing process of the coil component according to the first embodiment of the present invention. [Figure 14] 2 is a diagram illustrating a schematic diagram of a part of a manufacturing process of the coil component according to the first embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The terms used in this application are merely used to describe certain embodiments and are not intended to limit the present invention. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, the terms "include" or "have" specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and should be understood not to preclude the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. And, in the entire specification, "on" means to be located above or below the target part, and does not necessarily mean to be located on the upper side based on the direction of gravity.

[0014] In addition, the term "bonding" does not only refer to a case where the components are in direct physical contact with each other in the contact relationship between the components, but is used as a concept that also encompasses a case where another structure is interposed between the components and the components are in contact with each other.

[0015] The size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not necessarily limited to those shown.

[0016] In the drawings, the L direction can be defined as the first direction or length direction, the W direction can be defined as the second direction or width direction, and the T direction can be defined as the third direction or thickness direction.

[0017] Hereinafter, coil parts according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components are given the same drawing numbers, and duplicate descriptions thereof will be omitted.

[0018] Various kinds of electronic components are used in electronic devices, and various kinds of coil components can be appropriately used between such electronic components for the purpose of removing noise, etc.

[0019] That is, in electronic devices, coil components can be used as power inductors, high frequency inductors, general beads, high frequency beads (GHz beads), common mode filters, and the like.

[0020] First Example FIG. 1 is a schematic perspective view of a coil device 1000 according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view of FIG. 1, FIG. 3 is an LT cross-sectional view of a first external electrode 410, FIG. 4 is a drawing showing a cross-section along line I-I' in FIG. 1, FIG. 5 is a cross-section along line II-II' in FIG. 1 and an enlarged view of area A, and FIG. 6 is an additional enlarged view of areas B and C in FIG. 5.

[0021] Meanwhile, in order to more clearly show the connections between the components, an insulating layer 500 on the body 100 that may be applied to this embodiment is omitted in FIGS.

[0022] 1 to 6, a coil device 1000 according to a first embodiment of the present invention may include a main body 100, a coil 300, and external electrodes 410, 420, and may further include a support member 200, an insulating layer 500, and adhesive layers 610, 620.

[0023] The coil device 1000 of this embodiment has a structure in which the external electrodes 410, 420 are plated on the main body 100, but may have a structure in which the external electrodes 410, 420 including the first metal layers 411, 421 and the second metal layers 412, 422 coating the first metal layers 411, 421 are formed separately through a process such as rolling, and then fused to the lead-out portions 331, 332 exposed to the main body 100 through ultrasonic welding, laser welding, resistance welding, or the like.

[0024] As a result, in the coil device 1000 of this embodiment, the external electrodes 410, 420 are formed through a process such as rolling, so that the long axis direction of the crystal grains contained in the first metal layers 411, 421 of the external electrodes 410, 420 can be formed parallel to the surface of the main body 100.

[0025] In addition, the lead-out portions 331, 332 and the external electrodes 410, 420 are contacted and connected by fusion such as ultrasonic welding, laser welding, or resistance welding, so that a complete solid solution can be formed in the area where the lead-out portions 331, 332 and the second metal layers 412, 422 contact each other.

[0026] With the above configuration, the coil device 1000 of the present embodiment can have improved bonding strength and connection reliability between the coil 300 and the external electrodes 410 and 420, and can therefore have high resistance to vibration or external shock.

[0027] The main components constituting the coil device 1000 according to this embodiment will be described in detail below.

[0028] The main body 100 has the external appearance of the coil device 1000 according to this embodiment, and can have the support member 200 and the coil 300 embedded therein.

[0029] The main body 100 may be formed in an overall hexahedral shape.

[0030] The main body 100 includes a first surface 101 and a second surface 102 facing each other in a length direction L (first direction), a third surface 103 and a fourth surface 104 facing each other in a thickness direction T (second direction), and a fifth surface 105 and a sixth surface 106 facing each other in a width direction W (third direction). The first surface 101, the second surface 102, the fifth surface 105, and the sixth surface 106 of the main body 100 correspond to wall surfaces of the main body 100 connecting the third surface 103 and the fourth surface 104 of the main body 100.

[0031] The main body 100 may be formed so that the coil device 1000 according to this embodiment including the external electrodes 410, 420 has, for example, a length of 2.5 mm, a width of 2.0 mm, and a thickness of 0.8 mm, a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.6 mm, a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.6 mm, a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.4 mm, a length of 1.4 mm, a width of 1.2 mm, and a thickness of 0.65 mm, a length of 1.0 mm, a width of 0.7 mm, and a thickness of 0.65 mm, a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.65 mm, or a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.5 mm, but is not limited thereto.

[0032] Meanwhile, the above-mentioned exemplary values ​​for the length, width, and thickness of the coil part 1000 are values ​​that do not reflect process errors, and therefore values ​​within the range that can be recognized as process errors should be considered to fall within the above-mentioned exemplary values.

[0033] The length of the coil part 1000 may refer to the maximum value of the dimensions of a plurality of line segments that are spaced apart from each other in the thickness direction T by connecting two outermost boundary lines facing each other in the length direction L of the coil part 1000 in parallel with the length direction L, based on an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-thickness direction T taken at the center of the width direction W of the coil part 1000. Alternatively, the length of the coil part 1000 may refer to the minimum value of the dimensions of the above-mentioned plurality of line segments. Alternatively, the length of the coil part 1000 may refer to the arithmetic average value of at least three or more of the dimensions of the above-mentioned plurality of line segments. Here, the plurality of line segments parallel to the length direction L may be equally spaced from each other in the thickness direction T, but the scope of the present invention is not limited thereto.

[0034] The thickness of the coil part 1000 may refer to the maximum value among the dimensions of a plurality of line segments spaced apart from each other in the length direction L by connecting two outermost boundary lines facing each other in the thickness direction T of the coil part 1000 shown in the image parallel to the thickness direction T, based on an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-thickness direction T taken at the center of the width direction W of the coil part 1000. Alternatively, the thickness of the coil part 1000 may refer to the minimum value among the dimensions of the above-mentioned plurality of line segments. Alternatively, the thickness of the coil part 1000 may refer to an arithmetic average value of at least three or more of the dimensions of the above-mentioned plurality of line segments. Here, the plurality of line segments parallel to the thickness direction T may be equally spaced from each other in the length direction L, but the scope of the present invention is not limited thereto.

[0035] The width of the coil part 1000 may refer to the maximum value among the dimensions of a plurality of line segments spaced apart from each other in the length direction L by connecting two outermost boundary lines facing each other in the width direction W of the coil part 1000 in parallel with the width direction W, based on an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-width direction W taken at the center of the thickness direction T of the coil part 1000. Alternatively, the width of the coil part 1000 may refer to the minimum value among the dimensions of the above-mentioned plurality of line segments. Alternatively, the width of the coil part 1000 may refer to an arithmetic average value of at least three or more of the dimensions of the above-mentioned plurality of line segments. Here, the plurality of line segments parallel to the width direction W may be equally spaced from each other in the length direction L, but the scope of the present invention is not limited thereto.

[0036] Alternatively, each of the length, width, and thickness of the coil device 1000 may be measured by a micrometer measurement method. The micrometer measurement method may be performed by setting a zero point with a micrometer that has been subjected to Gage R&R (Repeatability and Reproducibility), inserting the coil device 1000 according to the present embodiment between the tips of the micrometer, and rotating the measurement lever of the micrometer. Meanwhile, in measuring the length of the coil device 1000 by the micrometer measurement method, the length of the coil device 1000 may mean a value measured once, or may mean an arithmetic average of values ​​measured multiple times. This may be similarly applied to the width and thickness of the coil device 1000.

[0037] The main body 100 may include a magnetic material and a resin. Specifically, the main body 100 may be formed by laminating one or more magnetic composite sheets in which a magnetic material is dispersed in a resin. However, the main body 100 may have a structure other than the structure in which a magnetic material is dispersed in a resin. For example, the main body 100 may be made of a magnetic material such as ferrite, or may be made of a non-magnetic material.

[0038] The magnetic material may be ferrite or metallic magnetic powder.

[0039] The ferrite can be, for example, at least one of spinel-type ferrites such as Mg-Zn-based, Mn-Zn-based, Mn-Mg-based, Cu-Zn-based, Mg-Mn-Sr-based, and Ni-Zn-based ferrites; hexagonal-type ferrites such as Ba-Zn-based, Ba-Mg-based, Ba-Ni-based, Ba-Co-based, and Ba-Ni-Co-based ferrites; garnet-type ferrites such as Y-based ferrites; and Li-based ferrites.

[0040] The metal magnetic powder may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu) and nickel (Ni). For example, the metal magnetic powder may be at least one of pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder and Fe-Cr-Al alloy powder.

[0041] The metal magnetic powder can be amorphous or crystalline. For example, the metal magnetic powder can be Fe-Si-B-Cr amorphous alloy powder, but is not necessarily limited thereto.

[0042] The ferrite and metal magnetic powders may each have an average diameter of about 0.1 μm to 30 μm, but are not limited thereto.

[0043] The body 100 may include two or more types of magnetic materials dispersed in a resin. Here, different types of magnetic materials means that the magnetic materials dispersed in the resin are distinguished from each other in any one of average diameter, composition, crystallinity, and shape.

[0044] The resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, and the like, either alone or in combination.

[0045] The main body 100 may include a core 110 that penetrates the support member 200 and the coil 300. The core 110 may be formed by filling the through-hole of the support member 200 with a magnetic composite sheet, but is not limited thereto.

[0046] The support member 200 may be disposed within the body 100. The support member 200 is configured to support the coil 300. Meanwhile, in some embodiments, the support member 200 may be omitted, for example, when the coil 300 corresponds to a wound coil or has a coreless structure.

[0047] The support member 200 may be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as a polyimide, or a photosensitive insulating resin, or may be formed of an insulating material obtained by impregnating such an insulating resin with a reinforcing material such as glass fiber or an inorganic filler. For example, the support member 200 may be formed of a material such as prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) resin, PID (Photo Imagable Dielectric), Copper Clad Laminate (CCL), etc., but is not limited thereto.

[0048] As the inorganic filler, at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0049] When the support member 200 is made of an insulating material including a reinforcing material, the support member 200 can provide better rigidity. When the support member 200 is made of an insulating material including no glass fiber, it is advantageous to reduce the thickness of the parts by thinning the overall thickness (meaning the sum of the dimensions of the coil 300 and the support member 200 along the second direction T in FIG. 1) of the support member 200 and the coil 300. When the support member 200 is made of an insulating material including a photosensitive insulating resin, the number of processes for forming the coil 300 is reduced, which is advantageous to reduce production costs, and fine vias 320 can be formed. The thickness of the support member 200 can be, for example, 10 μm to 50 μm, but is not limited thereto.

[0050] The coil 300 is disposed on the support member 200. The coil 300 is embedded in the body 100 to exhibit the characteristics of a coil component. For example, when the coil component 1000 of the present embodiment is used as a power inductor, the coil 300 can stabilize the power supply of an electronic device by storing an electric field in a magnetic field and maintaining an output voltage.

[0051] The coil 300 is formed on at least one of the opposing surfaces of the support member 200 and has at least one turn. In this embodiment, the coil 300 may include coil patterns 311 and 312, a via 320, and lead-out portions 331 and 332.

[0052] 1, 4 and 5, the first coil pattern 311 and the second coil pattern 312 may be disposed on both sides of the support member 200 facing each other and may have a planar spiral shape with at least one turn around the core 110 of the main body 100. For example, based on the direction of FIG. 1, the first coil pattern 311 is disposed on the upper surface of the support member 200 and forms at least one turn around the core 110. The second coil pattern 312 is disposed on the lower surface of the support member 200 and forms at least one turn around the core 110. Each of the first and second coil patterns 311 and 312 is formed in such a manner that the ends of the outermost turns connected to the lead-out portions 331 and 332 extend in the directions of the first surface 101 and the second surface 102 of the main body 100, respectively.

[0053] The lead-out portions 331 , 332 may extend from the coil patterns 311 , 312 to the first surface 101 or the second surface 102 of the main body 100 .

[0054] Specifically, the first extension part 331 may extend from an outer end of the first coil pattern 311 to the first surface 101 of the body 100 and be connected to the first external electrode 410. In addition, the first extension part 331 may be formed integrally with the first coil pattern 311.

[0055] Similarly, the second lead portion 332 may extend from an outer end of the second coil pattern 312 to the second surface 102 of the body 100 and be connected to the second external electrode 420. In addition, the second lead portion 332 may be formed integrally with the second coil pattern 312.

[0056] 4, the coil 300 may further include a via 320 connecting the first coil pattern 311 and the second coil pattern 312. Specifically, the via 320 may pass through the support member 200 to connect inner ends of the innermost turns of the first and second coil patterns 311 and 312 to each other. Thus, a signal input to the first external electrode 410 may be output to the second external electrode 420 via the first lead-out portion 331, the first coil pattern 311, the via 320, the second coil pattern 312, and the second lead-out portion 332. With this configuration, each component of the coil 300 may function as one coil connected between the first and second external electrodes 410 and 420 as a whole.

[0057] At least one of the coil patterns 311, 312, the via 320, and the lead-out portions 331, 332 may include at least one or more conductive layers.

[0058] For example, when the first coil pattern 311, the via 320, and the first lead-out portion 331 are formed by plating on the upper surface of the support member 200 (based on the direction of FIG. 1), each of the first coil pattern 311, the via 320, and the first lead-out portion 331 may include a seed layer and an electrolytic plating layer. The seed layer may be formed by an electroless plating method or a vapor phase deposition method such as sputtering. Each of the seed layer and the electrolytic plating layer may have a single layer structure or a multilayer structure. The multilayer electrolytic plating layer may be formed in a conformal film structure in which one electrolytic plating layer is covered by the other electrolytic plating layer, or may be formed in a shape in which the other electrolytic plating layer is laminated only on one surface of one electrolytic plating layer. The seed layer of the first coil pattern 311, the seed layer of the via 320, and the seed layer of the first lead-out portion 331 may be formed integrally so that no boundary is formed between them, but the present invention is not limited thereto. The electrolytic plating layer of the first coil pattern 311, the electrolytic plating layer of the via 320, and the electrolytic plating layer of the first extraction portion 331 may be integrally formed so that no boundaries are formed between them, but is not limited to this.

[0059] Each of the coil patterns 311, 312, the vias 320, and the lead-out portions 331, 332 may include a conductive material such as, but not limited to, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo), or an alloy thereof.

[0060] 1, 2 and 5, a coil device 1000 according to the present embodiment may include external electrodes 410 and 420 disposed on a body 100 and connected to a coil 300.

[0061] The external electrodes 410, 420 are configured to electrically connect the coil component 1000 to a circuit board when the coil component 1000 according to the present embodiment is mounted on a circuit board or the like. For example, the first and second external electrodes 410, 420 spaced apart from each other on the third surface 103 of the body 100 may be electrically connected to a connection portion of the circuit board.

[0062] Specifically, the first external electrode 410 may be disposed on the first surface 101 of the body 100 and may be in contact with a first extension portion 331 extending to the first surface 101 of the body 100, and the second external electrode 420 may be disposed on the second surface 102 of the body 100 and may be in contact with a second extension portion 332 extending to the second surface 102 of the body 100.

[0063] The first external electrode 410 may be disposed on the first surface 101 of the body 100 and extend from the third surface to at least a portion of the sixth surfaces 103, 104, 105, 106 of the body 100.

[0064] The second external electrode 420 may be disposed on the second surface 102 of the body 100 and extend from the third surface to at least a portion of the sixth surfaces 103, 104, 105, 106 of the body 100.

[0065] The region where the first external electrode 410 extends from the third surface of the main body 100 to at least a portion of the sixth surfaces 103, 104, 105, and 106 and the region where the second external electrode 420 extends from the third surface of the main body 100 to at least a portion of the sixth surfaces 103, 104, 105, and 106 can be separated from each other.

[0066] Meanwhile, referring to Figures 1, 2 and 5, the coil device 1000 of this embodiment may have a structure in which the first and second external electrodes 410, 420 arranged on the first surface 101 and the second surface 102, respectively, of the main body 100 each extend only to the third surface 103 of the main body 100.

[0067] In this case, the first external electrode 410 may include a first pad portion arranged on the third surface 103 of the body 100, and a first extension portion arranged on the first surface 101 of the body 100 and connecting the first extension portion 331 and the first pad portion.

[0068] In addition, the second external electrode 420 may include a second pad portion spaced apart from the first pad portion on the third surface 103 of the body 100, and a second extension portion arranged on the second surface 102 of the body 100 and connecting the second extension portion 332 and the second pad portion.

[0069] The pad portion and the extension portion can be formed together in the same process, and can be integrally formed without any boundary between them.

[0070] 3 and 5, the external electrodes 410 and 420 of the present embodiment may include first metal layers 411 and 421 and second metal layers 412 and 422.

[0071] The first metal layers 411, 421 of the external electrodes 410, 420 include an inner surface facing the body 100 and an outer surface facing the inner surface, and the second metal layers 412, 422 of the external electrodes 410, 420 may be disposed on the inner and outer surfaces, respectively, of the first metal layers 411, 421. That is, the external electrodes 410, 420 may be disposed in the order of the second metal layers 412, 422, the first metal layers 411, 421, and the second metal layers 412, 422 in the direction from the inside to the outside of the coil device 1000.

[0072] The first metal layers 411, 421 of the external electrodes 410, 420 may be coated with the second metal layers 412, 422. That is, based on the LT cross section of the coil device 1000 of the present embodiment, the second metal layers 412, 422 of the external electrodes 410, 420 may be disposed in a form surrounding the first metal layers 411, 421. However, without being limited thereto, the second metal layers 412, 422 may be disposed at both ends of the external electrodes 410, 420 in a form exposing a portion of the first metal layers 411, 421.

[0073] The first metal layers 411 and 421 of the external electrodes 410 and 420 may include copper (Cu), and the second metal layers 412 and 422 may include nickel (Ni). For example, the external electrodes 410 and 420 of the present embodiment may correspond to a form in which nickel (Ni) is coated on the surface of copper (Cu).

[0074] Referring to FIG. 5, the second metal layers 412, 422 of the external electrodes 410, 420 may be in direct contact with the lead-out portions 331, 332 on the first surface 101 or the second surface 102 of the body 100, and may be fused to each other through a process such as ultrasonic welding, laser welding, or resistance welding.

[0075] As a result, the metal contained in the lead-out portions 331 and 332 and the metal contained in the second metal layers 412 and 422 can form a complete solid solution in the contact area with each other. Here, a complete solid solution is a type of solid solution, and refers to a solid solution in which the crystal structure does not change due to the single composition regardless of the ratio in which two substances are mixed.

[0076] The enlarged view of area A in Figure 5 shows in detail the contact area between the second extension portion 332 and the second external electrode 420, and a complete solid solution area CS1 can be formed in the area where the metal contained in the second extension portion 332 and the metal contained in the second metal layer 422 of the second external electrode 420 are in contact with each other.

[0077] In the region CS1 where the complete solid solution is formed, there may be a point where the content ratio of the metal contained in the second lead portion 332 to the metal contained in the second metal layer 422 is 1:1. This may be a feature that appears in the complete solid solution region CS1 as the content of the two metals changes stepwise, unlike an intermetallic compound (IMC).

[0078] For example, if the second lead portion 332 contains copper (Cu) and the second metal layer 422 contains nickel (Ni), when the second lead portion 332 and the second external electrode 420 are fused through a process such as ultrasonic welding, laser welding, or resistance welding, the copper (Cu) of the second lead portion 332 and the nickel (Ni) of the second metal layer 422 may form a complete solid solution. In the complete solid solution region (CS1), the copper (Cu) content may gradually decrease and the nickel (Ni) content may gradually increase from the second lead portion 332 to the second metal layer 422, and a point where the copper (Cu) and nickel (Ni) content ratio is 1:1 may exist in the intermediate region.

[0079] FIG. 6 is an enlarged view of region B included in second lead portion 332 and region C included in first metal layer 421 in region A of FIG.

[0080] 6, metal crystal grains G1 and G2 can be observed in the enlarged views of areas B and C. For example, copper (Cu) crystal grains G1 included in the second lead portion 332 can be observed in area B, and copper (Cu) crystal grains G2 included in the first metal layer 421 can be observed in area C.

[0081] Comparing the enlarged view of area B with the enlarged view of area C, the copper (Cu) crystal grains G2 contained in the first metal layer 421 are larger in size and have directionality than the copper (Cu) crystal grains G1 contained in the second pull-out portion 332.

[0082] In the case of the lead-out portions 331, 332, which are one component of the coil 300, they are formed by electrolytic plating on the support member 200, whereas the first metal layer 421 of the external electrodes 410, 420 is formed by a rolling process including pressure and heating by rollers, so that the size of the crystal grains G2 increases due to recrystallization, and the crystal grains can have directionality.

[0083] Here, the sizes of the crystal grains G1 and G2 can be determined by, for example, a line intercept method, but are not limited thereto.

[0084] 5 and 6, the crystal grains G2 included in the first metal layer 421 may have their major axes La aligned parallel to the surface of the body 100. That is, in a region where the first metal layer 421 is disposed on the second surface 102 of the body 100, the crystal grains G2 may have their major axes La aligned parallel to the second direction T, and in a region where the first metal layer 421 is disposed on the third surface 103 of the body 100, the crystal grains G2 may have their major axes La aligned parallel to the first direction L.

[0085] Here, the meaning that the direction of the long axis La of the crystal grain G2 included in the first metal layer 421 is aligned parallel to the second direction T can be defined as the interior angle θ between the long axis La of the crystal grain G2 included in the first metal layer 421 and an imaginary extension line VL that penetrates the body 100 and is aligned in the first direction L, being greater than or equal to 80 degrees and less than or equal to 110 degrees.

[0086] Similarly, the meaning that the direction of the long axis La of the crystal grain G2 contained in the first metal layer 421 is aligned parallel to the first direction L can be defined as the interior angle θ between the long axis La of the crystal grain G2 contained in the first metal layer 421 and an imaginary extension line that penetrates the body 100 and is aligned in the second direction T as a reference, and is greater than or equal to 80 degrees and less than or equal to 110 degrees.

[0087] In this case, the long axis La of the crystal grain G2 contained in the first metal layer 421 may refer to a straight line having the maximum length within the crystal grain G2, and can be observed on an optical microscope image or a SEM (Scanning Electron Microscope) image of the LT cross section taken at the center of the coil device 1000 in the third direction W.

[0088] Meanwhile, the interior angle θ between a virtual extension line VL perpendicular to the surface of the body 100 and the long axis La of the crystal grain G2 may refer to the arithmetic average value obtained by measuring the angle between the long axis La and the extension line VL for each of the crystal grains G2 appearing within an area of ​​20 μm × 20 μm or more on the SEM image.

[0089] The external electrodes 410, 420 may be formed by coating the second metal layers 412, 422 on the surfaces of the first metal layers 411, 421 and then performing a rolling process using a roller or the like, but is not limited to this. The first metal layers 411, 421 may first be formed by a rolling process, and then the second metal layers 412, 422 may be formed on the surfaces by a vapor deposition method such as sputtering and / or a plating method.

[0090] The external electrodes 410, 420 formed by the above method may be disposed on the main body 100 and contact-connected to the lead-out portions 331, 332 by ultrasonic welding, laser welding, resistance welding, or the like, and a complete solid solution may be formed between the metal contained in the lead-out portions 331, 332 and the metal contained in the second metal layers 412, 422 of the external electrodes 410, 420 in at least a portion of the contact area between the external electrodes 410, 420 and the lead-out portions 331, 332.

[0091] As a result, the bonding strength and connection reliability between the external electrodes 410, 420 and the lead portions 331, 332 can be improved compared to when the external electrodes 410, 420 are formed by plating.

[0092] The coil device 1000 according to this embodiment may further include an insulating layer 500 disposed on the third to sixth surfaces 103, 104, 105, and 106 of the main body 100. The insulating layer 500 may be disposed in an area of ​​the surface of the main body 100 other than the area where the external electrodes 410 and 420 are disposed.

[0093] At least a portion of the insulating layer 500 disposed on each of the third to sixth surfaces 103, 104, 105, and 106 of the main body 100 may be formed in the same process as one another and in an integrated form with no boundary between them, but the scope of the present invention is not limited thereto.

[0094] Referring to FIG. 5, at least a portion of the insulating layer 500 can extend between the third surface 103 of the body 100 and the external electrodes 410 , 420 .

[0095] When the insulating layer 500 extends between the third surface 103 of the main body 100 and the external electrodes 410, 420, the insulation distance between the first and second external electrodes 410, 420 is increased, thereby effectively preventing current leakage that may occur between the first and second external electrodes 410, 420.

[0096] When the coil device 1000 according to this embodiment includes adhesive layers 610 and 620 described below, the insulating layer 500 can extend between the third surface 103 of the body 100 and the adhesive layers 610 and 620 .

[0097] When the insulating layer 500 extends between the third surface 103 of the main body 100 and the adhesive layers 610, 620, the effect of preventing current leakage that may occur between the first and second external electrodes 410, 420 can be improved, the bonding force between the insulating layer 500 and the adhesive layers 610, 620 can be stronger, and the bonding force between the external electrodes 410, 420 and the main body 100 can also be strengthened.

[0098] The insulating layer 500 may be formed by a method such as, but not limited to, a printing method, a vapor phase deposition method, a spray coating method, a film lamination method, and the like.

[0099] The insulating layer 500 may include thermoplastic resins such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, and acrylic, thermosetting resins such as phenol, epoxy, urethane, melamine, and alkyd, photosensitive resins, paralyne, SiOx, or SiNx. The insulating layer 500 may further include an insulating filler such as an inorganic filler, but is not limited thereto.

[0100] 1, 2, and 5, the coil device 1000 according to the present embodiment may further include adhesive layers 610, 620 disposed between the third surface 103 of the body 100 and the external electrodes 410, 420. The adhesive layers 610, 620 are configured to strengthen the bonding force between the body 100 and the external electrodes 410, 420.

[0101] Specifically, a first adhesive layer 610 may be disposed between the third surface 103 of the body 100 and the first external electrode 410, and a second adhesive layer 620 may be disposed between the third surface 103 of the body 100 and the second external electrode 420.

[0102] In this embodiment, the adhesive layers 610 and 620 may include a conductive resin or a non-conductive resin. For example, the adhesive layers 610 and 620 may include a conductive paste. The adhesive layers 610 and 620 may also include, but are not limited to, one or more of epoxy, polyurethane, silicone, polyimide, phenol, and polyester-based thermosetting resins.

[0103] 4 and 5, the insulating film IF is disposed between the coil 300 and the body 100 so as to cover the coil 300. The insulating film IF may be formed along the surfaces of the support member 200 and the coil 300. The insulating film IF is for insulating the coil 300 from the body 100, and may include, but is not limited to, a known insulating material such as paralyzed. The insulating film IF may be formed by, but is not limited to, a method such as vapor deposition, and may also be formed by laminating insulating films on both sides of the support member 200.

[0104] Second Example FIG. 7 is a cross-sectional view taken along line LT and an enlarged view of region D of a coil device 2000 according to a second embodiment of the present invention, and corresponds to FIG.

[0105] Comparing Figure 7 with Figure 5, the coil device 2000 of this embodiment differs in that third metal layers 430, 440 are further interposed between the main body 100 and the second metal layers 412, 422, and therefore the position at which the complete solid solution region CS2 is formed.

[0106] Therefore, in describing this embodiment, only the positions of the third metal layers 430, 440 and the full-solution region CS2, which are different from those in the first embodiment of the present invention, will be described, and the description of the first embodiment of the present invention can be applied as is to the remaining configurations.

[0107] 7, the coil device 2000 according to the present embodiment may further include third metal layers 430 and 440 disposed between the lead-out portions 331 and 332 and the second metal layers 412 and 422.

[0108] The third metal layers 430 and 440 may be disposed to cover at least one of the first surface 101 and the second surface 102 of the body 100 .

[0109] The third metal layers 430, 440 may be formed by electrolytic plating and may include, but are not limited to, conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo) or alloys thereof.

[0110] In this embodiment, the third metal layers 430 and 440 may include the same metal as the lead-out portions 331 and 332, thereby further enhancing the connection reliability and physical bonding strength between the lead-out portions 331 and 332 and the external electrodes 410 and 420.

[0111] Meanwhile, referring to FIG. 7, the metal contained in the third metal layers 430 and 440 and the metal contained in the second metal layers 412 and 422 may form a complete solid solution in the contact area with each other.

[0112] That is, unlike the first embodiment, a region CS2 of full-rate solid solution can be formed between the third metal layers 430, 440 and the second metal layers 412, 422.

[0113] For example, referring to the enlarged view of area D, a region CS2 of full solid solution may be formed in at least a portion of the region where the third metal layer 440 and the second metal layer 422 contact each other.

[0114] In the region CS2 where the complete solid solution is formed, there may be a point where the content ratio of the metal contained in the third metal layer 440 to the metal contained in the second metal layer 422 is 1:1. This may be a feature that appears in the complete solid solution region CS2 as the content of the two metals changes stepwise, unlike an intermetallic compound (IMC).

[0115] For example, if the third metal layer 440 contains copper (Cu) and the second metal layer 422 contains nickel (Ni), when the third metal layer 440 and the second external electrode 420 are fused through a process such as ultrasonic welding, laser welding, or resistance welding, the copper (Cu) of the third metal layer 440 and the nickel (Ni) of the second metal layer 422 may form a complete solid solution. In the complete solid solution region CS2, the copper (Cu) content may gradually decrease and the nickel (Ni) content may gradually increase from the third metal layer 440 to the second metal layer 422, and a point where the copper (Cu) and nickel (Ni) content ratio is 1:1 may exist in the intermediate region.

[0116] In the case of the coil device 2000 of this embodiment, the third metal layers 430, 440 corresponding to the pre-plating layer are first disposed on the surfaces of the body 100 where the lead-out portions 331, 332 are exposed, i.e., the first surface 101 and the second surface 102, and then the separately formed external electrodes 410, 420 are fused to the third metal layers 430, 440 by ultrasonic welding, laser welding, resistance welding, or the like. As the area of ​​the fusion surface increases, the connection reliability and bonding strength between the coil 300 and the external electrodes 410, 420 can be further strengthened.

[0117] Third Example FIG. 8 shows a LT cross section of a coil device 3000 according to a third embodiment of the present invention, and corresponds to FIG.

[0118] Comparing FIG. 8 with FIG. 7, the coil device 3000 of this embodiment differs from the second embodiment in that recesses R1, R2 are formed on the main body 100 and that the external electrodes 410, 420 include bent portions BP1, BP2 that extend into the recesses R1, R2.

[0119] Therefore, in describing this embodiment, only the recesses R1, R2 and the bent portions BP1, BP2 extending into the recesses R1, R2, which are different from the second embodiment of the present invention, will be described, and the description of the second embodiment of the present invention can be applied as is to the remaining configuration of this embodiment.

[0120] 8, the upper surface of the main body 100, i.e., the fourth surface 104, may include at least one recess R1, R2. The recesses R1, R2 in this embodiment are formed in the main body 100 and are configured to accommodate parts of the external electrodes 410, 420, thereby further generating a physical fixing force between the main body 100 and the external electrodes 410, 420.

[0121] At least a portion of the external electrodes 410, 420 may extend into the recesses R1, R2. The recesses R1, R2 may be formed to be spaced apart from the first surface 101 and the second surface 102 of the body 100, respectively. The recesses R1, R2 may extend to the fifth surface 105 and the sixth surface 106 of the body 100.

[0122] Specifically, in the present embodiment, first and second recesses R1 and R2 may be formed on the fourth surface 104 of the body 100, and the first recess R1 may be formed to be spaced apart from the first surface 101 of the body 100 at a constant interval to accommodate and fix at least a portion of an end of the first external electrode 410. Similarly, the second recess R2 may be formed to be spaced apart from the second surface 102 of the body 100 at a constant interval to accommodate and fix at least a portion of an end of the second external electrode 420.

[0123] Referring to FIG. 8, the external electrodes 410 and 420 of the present embodiment include bent portions BP1 and BP2 formed at one end, and the bent portions BP1 and BP2 may be bent toward the recesses R1 and R2.

[0124] Specifically, the first external electrode 410 is disposed on the first surface 101 of the body 100, extends to the fourth surface 104 of the body 100 along the area where the first surface 101 of the body 100 and the first recess R1 are separated, and the extended end may include a first bent portion BP1 bent to be accommodated in the first recess R1.

[0125] Similarly, the second external electrode 420 is arranged on the second surface 102 of the body 100 and extends to the fourth surface 104 of the body 100 along the area where the second surface 102 of the body 100 and the second recess R2 are separated, and the extended end may include a second bent portion BP2 bent to be accommodated in the second recess R2.

[0126] The angle at which the bent portions BP1 and BP2 are bent can be selected without limitation within a range of more than 0 degrees and less than 180 degrees, as long as a physical fixing force can be applied between the bent portions BP1 and BP2 and the recesses R1 and R2.

[0127] In the coil device 3000 of this embodiment, recesses R1, R2 are formed on the main body 100, and the bent portions BP1, BP2 formed at the ends of the external electrodes 410, 420 are accommodated in the recesses R1, R2, thereby further providing a physical fixing force between the main body 100 and the external electrodes 410, 420, thereby providing resistance to external impacts and vibrations.

[0128] Fourth embodiment and modified example FIG. 9 shows a LT cross section of a coil device 4000 according to a fourth embodiment of the present invention, and corresponds to FIG.

[0129] Comparing Figure 9 with Figure 5, the differences are that the adhesive layers 610, 620 arranged on the third surface 103 of the main body 100 are omitted, and L-shaped first conductive resin layers 711, 721 are interposed between the second metal layers 412, 422 and the main body 100.

[0130] Therefore, in describing this embodiment, only the L-shaped first conductive resin layers 711, 721, which are different from those in the first embodiment of the present invention, will be described, and the description of the first embodiment of the present invention can be applied as is to the remaining configuration.

[0131] 9, the coil device 4000 according to the present embodiment may further include first conductive resin layers 711, 721 disposed between the external electrodes 410, 420 and the main body 100. In the case of the present embodiment, the functions of the adhesive layers 610, 620 in the first embodiment may also be replaced by the first conductive resin layers 711, 721, and therefore the adhesive layers 610, 620 may be omitted.

[0132] The first conductive resin layers 711 and 721 of the present embodiment may be disposed on the main body 100 and connected to the lead-out portions 331 and 332. The first conductive resin layers 711 and 721 may also connect the lead-out portions 331 and 332 and the external electrodes 410 and 420.

[0133] The first conductive resin layers 711 , 721 are disposed between the lead portions 331 , 332 and the second metal layers 412 , 422 of the external electrodes 410 , 420 , and can extend to the third surface 103 of the body 100 at least partially.

[0134] The first conductive resin layers 711 and 721 of the present embodiment may be formed of a layer containing resin and a metal component dispersed in the resin. The resin may contain epoxy as a thermosetting resin. The metal component may contain silver (Ag) or copper (Cu) components. For example, the first conductive resin layers 711 and 721 of the present embodiment may be, but are not limited to, an Ag epoxy layer or a Cu epoxy layer.

[0135] The first conductive resin layers 711 and 721 may contain a metal component to allow current to flow, and may contain a resin component having flexibility and elasticity, and thus may be more resistant to vibrations and external impacts than a metal layer.

[0136] In addition, in the coil device 4000 of this embodiment, by disposing the first conductive resin layers 711, 721 directly on the main body 100, the bonding between the resin component of the main body 100 and the resin components of the first conductive resin layers 711, 721 can have the effect of strengthening the bonding strength and flexibility between the main body 100 and the external electrodes 410, 420 through bonding between the resin component of the main body 100 and the resin components of the first conductive resin layers 711, 721.

[0137] FIG. 10 shows a LT cross section of a coil device 4000' according to a modified example of the fourth embodiment of the present invention, and corresponds to FIG.

[0138] Comparing Figure 10 with Figure 9, it differs from the fourth embodiment in that second conductive resin layers 712, 722 are further arranged between the areas of the first conductive resin layers 711, 721 that are arranged on the third surface 103 of the main body 100 and the second metal layers 412, 422.

[0139] Therefore, in describing this modified example, only the second conductive resin layers 712, 722 which are different from the fourth embodiment of the present invention will be described, and the description of the fourth embodiment of the present invention can be applied as is to the remaining configuration.

[0140] 10, in a coil device 4000' according to this modification, the conductive resin layer extending onto the third surface 103 of the body 100 may be formed in a plurality of layers.

[0141] Specifically, first conductive resin layers 711, 721 are arranged on the first surface 101 of the main body 100, and a portion of the first conductive resin layers 711, 721 may extend to the third surface 103, and second conductive resin layers 712, 722 may be further arranged on the area where the first conductive resin layers 711, 721 extend to the third surface 103.

[0142] The second conductive resin layers 712 and 722 in this embodiment may be formed of a layer containing resin and a metal component dispersed in the resin. The resin may contain epoxy as a thermosetting resin. The metal component may contain silver (Ag) or copper (Cu) components. For example, the second conductive resin layers 712 and 722 in this embodiment may be, but are not limited to, an Ag epoxy layer or a Cu epoxy layer.

[0143] The coil component 4000' of this modified example can strengthen the bonding force between the main body 100 and the external electrodes 410, 420 by arranging a conductive resin layer having a two-layer structure of first conductive resin layers 711, 721 and second conductive resin layers 712, 722 on the pad portions of the external electrodes 410, 420, which are mounted on a circuit board and where stress is concentrated.

[0144] In addition, the flexibility and elasticity of the resin component of the conductive resin layer can provide greater resistance to vibration and external impacts. By disposing the second conductive resin layers 712 and 722 only in the pad area, the DC resistance (R dc ) characteristics may not deteriorate.

[0145] Fifth embodiment and modified examples FIG. 11 shows a LT cross section of a coil device 5000 according to a fifth embodiment of the present invention, and corresponds to FIG.

[0146] Comparing FIG. 11 with FIG. 9, the coil device 5000 of this embodiment differs from the fourth embodiment in that recesses R1, R2 are formed on the main body 100 and that the external electrodes 410, 420 include bent portions BP1, BP2 that extend into the recesses R1, R2.

[0147] Therefore, in describing this embodiment, only the recesses R1, R2 and the bent portions BP1, BP2 extending into the recesses R1, R2, which are different from the fourth embodiment of the present invention, will be described, and the description of the fourth embodiment of the present invention can be applied as is to the remaining configuration of this embodiment.

[0148] 11, the upper surface of the main body 100, i.e., the fourth surface 104, may include at least one recess R1, R2. The recesses R1, R2 in this embodiment are formed in the main body 100 and are configured to accommodate parts of the external electrodes 410, 420, thereby further generating a physical fixing force between the main body 100 and the external electrodes 410, 420.

[0149] At least a portion of the external electrodes 410, 420 may extend into the recesses R1, R2. The recesses R1, R2 may be formed to be spaced apart from the first surface 101 and the second surface 102 of the body 100, respectively. The recesses R1, R2 may extend to the fifth surface 105 and the sixth surface 106 of the body 100.

[0150] Specifically, in the present embodiment, first and second recesses R1 and R2 may be formed on the fourth surface 104 of the body 100, and the first recess R1 may be formed to be spaced apart from the first surface 101 of the body 100 at a constant interval to accommodate and fix at least a portion of an end of the first external electrode 410. Similarly, the second recess R2 may be formed to be spaced apart from the second surface 102 of the body 100 at a constant interval to accommodate and fix at least a portion of an end of the second external electrode 420.

[0151] Referring to FIG. 11, the external electrodes 410 and 420 of the present embodiment include bent portions BP1 and BP2 formed at one end, and the bent portions BP1 and BP2 may be bent toward the recesses R1 and R2.

[0152] Specifically, the first external electrode 410 is disposed on the first surface 101 of the body 100, extends to the fourth surface 104 of the body 100 along the area where the first surface 101 of the body 100 and the first recess R1 are separated, and the extended end may include a first bent portion BP1 bent to be accommodated in the first recess R1.

[0153] Similarly, the second external electrode 420 is arranged on the second surface 102 of the body 100 and extends to the fourth surface 104 of the body 100 along the area where the second surface 102 of the body 100 and the second recess R2 are separated, and the extended end may include a second bent portion BP2 bent to be accommodated in the second recess R2.

[0154] The angle at which the bent portions BP1 and BP2 are bent can be selected without limitation within a range of more than 0 degrees and less than 180 degrees, as long as a physical fixing force can be applied between the bent portions BP1 and BP2 and the recesses R1 and R2.

[0155] In the coil device 5000 of this embodiment, recesses R1, R2 are formed on the main body 100, and the bent portions BP1, BP2 formed at the ends of the external electrodes 410, 420 are accommodated in the recesses R1, R2, thereby further providing a physical fixing force between the main body 100 and the external electrodes 410, 420, thereby providing resistance to external impacts and vibrations.

[0156] Furthermore, since the coil component 5000 according to this embodiment includes the first conductive resin layers 711, 721 interposed between the external electrodes 410, 420 and the main body 100, the flexibility and elasticity of the resin components of the first conductive resin layers 711, 721 enable the coil component 5000 to have resistance to vibration and external impacts.

[0157] In other words, even if the coil device 5000 of this embodiment is mounted on a circuit board and exposed to an environment with a lot of vibration and external impact, the bonding strength between the main body 100 and the external electrodes 410, 420 and the connection reliability between the coil 300 and the external electrodes 410, 420 can be further strengthened due to the flexibility and elasticity provided by the first conductive resin layers 711, 721 and the physical fixing force provided by the recesses R1, R2 and the bending portions BP1, BP2.

[0158] FIG. 12 shows a LT cross section of a coil device 5000' according to a modified example of the fifth embodiment of the present invention, and is a drawing corresponding to FIG.

[0159] Comparing Figure 12 with Figure 11, the difference from the fifth embodiment is that second conductive resin layers 712, 722 are further arranged between the areas of the first conductive resin layers 711, 721 that are arranged on the third surface 103 of the main body 100 and the second metal layers 412, 422.

[0160] Therefore, in describing this modified example, only the second conductive resin layers 712, 722 which are different from the fifth embodiment of the present invention will be described, and the description of the fifth embodiment of the present invention can be applied as is to the remaining configuration.

[0161] 12, in a coil device 5000' according to this modification, the conductive resin layer extending onto the third surface 103 of the body 100 may be formed in a plurality of layers.

[0162] Specifically, first conductive resin layers 711, 721 are arranged on the first surface 101 of the main body 100, and a portion of the first conductive resin layers 711, 721 may extend to the third surface 103, and second conductive resin layers 712, 722 may be further arranged on the area where the first conductive resin layers 711, 721 extend to the third surface 103.

[0163] The second conductive resin layers 712 and 722 in this embodiment may be formed of a layer containing resin and a metal component dispersed in the resin. The resin may contain epoxy as a thermosetting resin. The metal component may contain silver (Ag) or copper (Cu) components. For example, the second conductive resin layers 712 and 722 in this embodiment may be, but are not limited to, an Ag epoxy layer or a Cu epoxy layer.

[0164] In the coil component 5000' of this modified example, a conductive resin layer having a two-layer structure of first conductive resin layers 711, 721 and second conductive resin layers 712, 722 is disposed on the pad portions of the external electrodes 410, 420, which are portions of the external electrodes 410, 420 that are mounted on a circuit board and where stress is concentrated, thereby strengthening the bonding force between the main body 100 and the external electrodes 410, 420.

[0165] In addition, the flexibility and elasticity of the resin component of the conductive resin layer can provide greater resistance to vibration and external impacts. By disposing the second conductive resin layers 712 and 722 only in the pad area, the DC resistance (R dc ) characteristics may not deteriorate.

[0166] Coil component manufacturing process 13 and 14 are diagrams that roughly show a part of the manufacturing process of the coil device 1000 according to the first embodiment of the present invention.

[0167] 13, the external electrodes 410, 420 connected to the electrode frame EF may be formed through a rolling process using rollers, etc. Here, the external electrodes 410, 420 may be formed by coating a second metal layer on the surface of a first metal layer, and then rolling the same using rollers, etc., but are not limited thereto. The first metal layer may be first formed through a rolling process, and then the second metal layer may be formed on the surface by a vapor deposition method such as sputtering and / or a plating method.

[0168] Next, adhesive layers 610, 620 are disposed on pad areas of the external electrodes 410, 420 connected to the electrode frame EF, and the body 100 with the coil 300 embedded therein can be loaded.

[0169] Here, a conductive resin layer or the like can be arranged instead of the adhesive layers 610, 620. When the conductive resin layer is arranged, it can be arranged not only in the pad portion area but also extended to the area in contact with the pull-out portion of the coil 300.

[0170] Next, referring to FIG. 14, in order to form the individual coil component 1000, the external electrodes 410, 420 connected to the electrode frame EF can be cut using a trimming member TM.

[0171] Next, the bending member BM can be used to apply upward pressure to the portions of the external electrodes 410, 420 that are not disposed on the main body 100, i.e., the areas excluding the pad portions, to bend the external electrodes 410, 420 and adhere them to the sides of the main body 100.

[0172] Next, the lead-out portion of the coil 300 exposed on the side surface of the main body 100 and the external electrodes 410, 420 can be fused using ultrasonic welding, laser welding, resistance welding, or the like.

[0173] Although one embodiment of the present invention has been described above, a person having ordinary knowledge in the relevant technical field may modify and change the present invention in various ways by adding, changing or deleting components, without departing from the concept of the present invention described in the claims, and this also falls within the scope of the claims of the present invention. [Explanation of symbols]

[0174] 100 Body 110 cores 200 Support member 300 coils 311, 312 coil pattern 320 Beer 331, 332 Drawer section 410, 420 external electrode 411, 421 1st metal layer 412, 422 2nd metal layer 430, 440 3rd metal layer 500 Insulation Layer 610, 620 adhesive layer 711, 721 First conductive resin layer 712, 722 Second conductive resin layer IF insulating film BP1, BP2 bending section CS1, CS2 complete solid solution region G1, G2 grains La long axis R1, R2 recess EF Electrode Frame TM trimming material BM bending parts 1000, 2000, 3000, 4000, 4000', 5000, 5000' Coil parts

Claims

1. a main body including a first surface and a second surface facing each other in a first direction, and a third surface connecting the first surface and the second surface; a coil disposed within the body and including an extension portion that is extended to the first surface or the second surface; an external electrode disposed on the body and connected to the lead portion, the external electrode including a first metal layer and a second metal layer; the first metal layer includes an inner surface facing the body and an outer surface opposite the inner surface; The second metal layer is disposed on each of the inner surface and the outer surface of the first metal layer.

2. The coil component according to claim 1 , wherein the first metal layer is coated with the second metal layer.

3. On a cross section perpendicular to the first surface and the third surface, The coil component according to claim 1 , wherein the second metal layer surrounds the first metal layer.

4. The coil component according to claim 1 , wherein the first metal layer includes copper (Cu).

5. The coil component according to claim 1 , wherein the second metal layer includes nickel (Ni).

6. The coil component according to claim 1 , wherein the metal contained in the lead-out portion and the metal contained in the second metal layer form a complete solid solution in a region where they contact each other.

7. The coil component according to claim 6 , wherein in the region in which the complete solid solution is formed, there is a point where the content ratio of the metal contained in the lead portion to the metal contained in the second metal layer is 1:

1.

8. The coil component according to claim 1 , wherein the crystal grains included in the first metal layer have major axes aligned parallel to a surface of the body.

9. Based on a virtual extension line that passes through the main body and is aligned in the first direction, The coil component according to claim 8 , wherein an interior angle between a major axis of a crystal grain included in the first metal layer and the extension line is equal to or greater than 80 degrees and equal to or less than 110 degrees.

10. The coil component according to claim 1 , further comprising a support member disposed within the body to support the coil.

11. further comprising an insulating layer disposed on a third surface of the body; The coil component according to claim 1 , wherein at least a portion of the insulating layer extends between a third surface of the body and the external electrode.

12. The coil component according to claim 1 , further comprising a third metal layer disposed between the lead portion and the second metal layer.

13. The coil component according to claim 12 , wherein the third metal layer covers at least one of the first surface and the second surface.

14. The coil component according to claim 12 , wherein the third metal layer includes copper (Cu).

15. The coil component according to claim 12 , wherein the metal contained in the third metal layer and the metal contained in the second metal layer form a complete solid solution in a region where they contact each other.

16. The coil component of claim 15, wherein the region in which the complete solid solution is formed has a point where the content ratio of the metal contained in the third metal layer to the metal contained in the second metal layer is 1:

1.

17. The body further includes a fourth surface opposite the third surface, the fourth surface includes at least one recess; The coil component of claim 12 , wherein at least a portion of the external electrode extends into the recess.

18. The coil component according to claim 17 , wherein the recess is spaced apart from the first surface and the second surface.

19. The coil component according to claim 17 , wherein the external electrode includes a bent portion formed at one end thereof, the bent portion being bent toward the recess.

20. The coil component of claim 1 , further comprising an adhesive layer disposed between the third surface of the body and the external electrode.

21. The coil component according to claim 20 , wherein the adhesive layer includes a conductive paste.

22. a main body including a first surface and a second surface facing each other in a first direction, and a third surface connecting the first surface and the second surface; a coil disposed within the body and including an extension portion that is extended to the first surface or the second surface; a conductive resin layer disposed on the main body and connected to the lead portion; an external electrode disposed on the conductive resin layer and including a first metal layer and a second metal layer; the first metal layer includes an inner surface facing the body and an outer surface opposite the inner surface; the second metal layer is disposed on each of the inner surface and the outer surface of the first metal layer; the conductive resin layer is disposed between the lead portion and the second metal layer, and at least a portion of the conductive resin layer extends onto the third surface.

23. The coil component according to claim 22 , wherein the conductive resin layer extending onto the third surface is formed of a plurality of layers.

24. The coil component according to claim 22 , wherein the conductive resin layer contains at least one of silver (Ag) and copper (Cu).

25. The coil component according to claim 22 , wherein the first metal layer includes copper (Cu) and the second metal layer includes nickel (Ni).

26. The coil component according to claim 22 , wherein the crystal grains included in the first metal layer have major axes aligned parallel to a surface of the body.

27. Based on a virtual extension line that passes through the main body and is aligned in the first direction, The coil component according to claim 26 , wherein an interior angle between a major axis of a crystal grain included in the first metal layer and the extension line is greater than or equal to 80 degrees and less than or equal to 110 degrees.

28. the body includes at least one recess; The coil component according to claim 22 , wherein one end of the external electrode is bent along a surface of the body and inserted into the recess.

Images