Heater, and heating device

Abstract

To provide a heater that can prevent an increase in the heat capacity of the heater even if metal is used as a material of a substrate, and a heating device.SOLUTION: A heater according to an embodiment is provided with: a substrate that includes metal, exhibits a plate-like shape, and has a first surface, a second surface opposite to the first surface, and a first hole opening in at least one of the first surface and the second surface; an insulating layer that is provided on the first surface of the substrate and has a second hole penetrating in a thickness direction; heating elements that are provided on the insulating layer; and a protection part that is provided on the insulating layer, covers the heating elements, and has a third hole penetrating in the thickness direction. When seen from a direction perpendicular to the first surface of the substrate, the second hole and the third hole overlap the first hole.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE The present invention relates to a heater and a heating device. [Background technology]

[0002] For example, heaters are used to heat the interior of buildings and the interior of vehicles such as automobiles and trains. Such heaters are also used as elements of HVAC (Heating Ventilation Air Conditioning). Heaters are also provided in the fixing units of image forming devices such as copiers and printers, the print-erase units of rewritable card readers and riders, office automation equipment, home electrical appliances, precision machinery, and the like.

[0003] Generally, such a heater includes a plate-shaped substrate, a heating element provided on one surface of the substrate, and a protective portion provided on the other surface of the substrate to cover the heating element. The substrate is made of a material that is heat resistant and has high thermal conductivity. The protective portion is made of a material that has heat resistance, insulating properties, high thermal conductivity, and high chemical stability, for example, glass.

[0004] Here, if the material of the substrate is a metal, it is possible to improve the rigidity of the substrate and reduce manufacturing costs. However, metal has a larger heat capacity than inorganic materials such as ceramics and glass. Therefore, if the material of the substrate is a metal, the heat capacity of the heater will be large. If the heat capacity of the heater is large, it will take a long time for the heater to heat up and for the heater to cool down. Therefore, there has been a demand for the development of a technology that can prevent the heat capacity of the heater from increasing even when the substrate material is metal. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2007-240606 A Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a heater and a heating device that can prevent the heat capacity of the heater from increasing even when the material of the substrate is metal. [Means for solving the problem]

[0007] The heater according to the embodiment includes a substrate including a metal, in a plate shape, and having a first surface, a second surface opposite to the first surface, and a first hole opening in at least one of the first surface and the second surface; an insulating layer provided on the first surface of the substrate and having a second hole penetrating in a thickness direction; a heating element provided on the insulating layer; and a protective part provided on the insulating layer, covering the heating element, and having a third hole penetrating in a thickness direction. When viewed from a direction perpendicular to the first surface of the substrate, the second hole and the third hole overlap with the first hole. Effect of the Invention

[0008] According to the embodiments of the present invention, it is possible to provide a heater and a heating device that can prevent the heat capacity of the heater from increasing even when the substrate material is metal. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic perspective view illustrating a heater according to an embodiment of the present invention; [Diagram 2] 2 is a schematic cross-sectional view of the heater in the direction of line AA in FIG. 1. [Diagram 3] 3(a) to 3(c) are schematic cross-sectional views illustrating holes formed in a substrate. [Figure 4] 1 is a schematic cross-sectional view illustrating a heating device according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment will be illustrated with reference to the drawings. In each drawing, the same components are given the same reference numerals, and detailed description is omitted as appropriate. In each drawing, arrows X, Y, and Z represent three mutually orthogonal directions. For example, one direction parallel to the surface of the substrate (e.g., the longitudinal direction or length direction) is the X direction, the other direction parallel to the surface of the substrate (e.g., the transverse direction or width direction) is the Y direction, and the direction perpendicular to the surface of the substrate (e.g., the thickness direction) is the Z direction.

[0011] (heater) FIG. 1 is a schematic perspective view illustrating a heater 1 according to the present embodiment. FIG. 2 is a schematic cross-sectional view of the heater 1 in FIG. 1 taken along the line AA. As shown in FIGS. 1 and 2, the heater 1 includes, for example, a substrate 10, an insulating layer 11, a heat generating portion 20, a wiring portion 30, a protective portion 40, and a warpage mitigating portion 50. As shown in FIG.

[0012] The substrate 10 has a plate shape and has a surface 10a (corresponding to an example of a first surface) and a surface 10b (corresponding to an example of a second surface) opposite to the surface 10a. The substrate 10 may have a shape extending in the X direction, a shape extending in the Y direction, or a shape extending in both the X and Y directions. The shape of the substrate 10 as viewed from the Z direction is, for example, a rectangle. By increasing the dimensions of the substrate 10 in the X direction and the Y direction, the heating area of ​​the heater 1 can be increased. By increasing the heating area of ​​the heater 1, the heating efficiency can be improved. The dimensions of the substrate 10 in the X direction and the Y direction can be appropriately changed depending on the size of the object to be heated, the heating efficiency required of the heater 1, and the like.

[0013] The substrate 10 is made of a material that is heat resistant and has high thermal conductivity. The substrate 10 can be made of ceramics such as aluminum oxide. However, since ceramics are brittle materials, the substrate 10 becomes more susceptible to breakage as the dimensions (planar dimensions) of the heater 1 in the X and Y directions become larger or the dimensions (thickness) of the heater 1 in the Z direction become smaller.

[0014] Therefore, it is preferable that the substrate 10 is made of a metal such as stainless steel or an aluminum alloy. If the substrate 10 is made of a metal, the rigidity of the substrate 10 can be improved compared to when the substrate 10 is made of ceramics. Furthermore, the thermal conductivity of metal is higher than that of ceramics. Therefore, if the substrate 10 is made of a metal, it is possible to suppress the occurrence of in-plane distribution in the temperature of the heater 1. If the substrate 10 is made of a metal, it is possible to reduce the manufacturing cost compared to when the substrate 10 is made of ceramics. When the substrate 10 is made of a metal, the thickness of the substrate 10 can be, for example, about 0.5 mm to 1.0 mm.

[0015] The substrate 10 made of metal is conductive. Therefore, the heat generating portion 20 and the wiring portion 30 cannot be provided directly on the substrate 10. Therefore, the heater 1 is provided with an insulating layer 11. The insulating layer 11 is provided on the surface 10a of the substrate 10 on which the heat generating portion 20 is provided. The insulating layer 11 covers at least the area of ​​the surface 10a of the substrate 10 on which the heat generating portion 20 is provided. In the case of the heater 1 illustrated in FIG. 1 and FIG. 2, the insulating layer 11 covers the entire surface 10a of the substrate 10. The insulating layer 11 is formed of a material having heat resistance and insulating properties. The insulating layer 11 can be formed of an inorganic material such as glass or ceramics.

[0016] The heat generating portion 20 converts the applied power into heat (Joule heat). The heat generating portion 20 is provided on an insulating layer 11. The heat generating portion 20 and the substrate 10 are insulated by the insulating layer 11. The heat generating section 20 has, for example, a heat generating element 21 and a heat generating element 22. In this case, the heat generating element 21 can be provided in the peripheral region of the substrate 10. The heat generating element 22 can be provided in the central region of the substrate 10. Note that, although the case where the heat generating element 21 and the heat generating element 22 are provided has been illustrated as an example, the number, size, arrangement, etc. of the heat generating elements can be appropriately changed depending on the size of the substrate 10, the size of the object to be heated, the temperature distribution required of the heater 1, etc. For example, it is sufficient that at least one heat generating element is provided.

[0017] Heat generating element 21 and heat generating element 22 can be arranged, for example, at a predetermined interval in the Y direction. Heat generating element 21 and heat generating element 22 extend, for example, in the X direction. The dimensions (length dimensions) of heat generating element 21 and heat generating element 22 in the X direction can be, for example, approximately the same.

[0018] The electric resistance values ​​of the heating element 21 and the heating element 22 can be approximately the same or different. For example, the peripheral region of the substrate 10 is more susceptible to heat radiation to the outside than the central region of the substrate 10. In this case, if the heat generation amount of the heating element 21 provided in the peripheral region of the substrate 10 is greater than the heat generation amount of the heating element 22 provided in the central region of the substrate 10, the temperature variation in the surface of the heater 1 can be reduced. For example, the resistance value of the heating element 21 may be greater than the resistance value of the heating element 22. For example, the dimensions of the heating element 21 may be smaller than the dimensions of the heating element 22 in at least one of the X-direction, Y-direction, and Z-direction. In addition, the resistance values ​​of the heating element 21 and the heating element 22 may be different by changing the material.

[0019] When the resistance value of heating element 21 and the resistance value of heating element 22 are to be made the same, for example, the dimensions of heating element 21 and the dimensions of heating element 22 in the X direction, Y direction, and Z direction may be made the same, and the material of heating element 21 and the material of heating element 22 may be made the same.

[0020] In addition, in the X direction, a terminal 31 is electrically connected to one end of the heating element 21 and the heating element 22. A wiring 32 is electrically connected to the other end of the heating element 21 and the heating element 22. Therefore, heat is more likely to be dissipated to the outside near the ends of the heating element 21 and the heating element 22 than near the center of the heating element 21 and the heating element 22. Therefore, the resistance value near the ends of the heating element 21 and the heating element 22 can be made larger than the resistance value near the center of the heating element 21 and the heating element 22. For example, at least one of the dimensions and the material may be changed near the ends and near the center, as in the above-mentioned case.

[0021] Heating element 21 and heating element 22 can be formed using, for example, ruthenium oxide (RuO2), a silver-palladium (Ag-Pd) alloy, etc. Heating element 21 and heating element 22 can be formed, for example, by applying a paste-like material onto insulating layer 11 using a screen printing method or the like, and curing it using a baking method or the like.

[0022] The wiring portion 30 is provided on the insulating layer 11 . The wiring section 30 includes, for example, a terminal 31 and a wiring 32 .

[0023] The terminals 31 can be provided in pairs, for example. The pair of terminals 31 can be provided in the vicinity of one end of the substrate 10 in the X direction, for example. The pair of terminals 31 can be provided side by side in the Y direction, for example. The pair of terminals 31 can be electrically connected to a control device provided outside the heater 1, for example, via a connector and wiring. In the case of the heater 1 illustrated in FIG. 1, the pair of terminals 31 is electrically connected to one end of the heating element 21. The pair of terminals 31 can also be electrically connected to one end of the heating element 21 via wiring. If wiring is provided between the pair of terminals 31 and the heating element 21, the arrangement of the pair of terminals 31 can be arbitrarily changed. Therefore, the pair of terminals 31 can be easily electrically connected to a connector, etc.

[0024] The wiring 32 can be provided, for example, near the other end of the substrate 10 in the X direction. The wiring 32 is electrically connected to an end of the heating element 21 and an end of the heating element 22. The wiring 32 is provided to connect the heating element 21 and the heating element 22 in series. The number of wirings 32 can be appropriately changed depending on the number of the heating elements 21 and the heating elements 22. Further, although the case where the heating elements 21 and 22 are connected in series has been exemplified, the heating elements 21 and 22 may also be connected in parallel.

[0025] The wiring portion 30 (terminals 31 and wiring 32) is formed using a material containing, for example, silver, copper, etc. For example, the terminals 31 and wiring 32 can be formed by applying a paste-like material onto the insulating layer 11 using a screen printing method or the like, and curing it using a baking method or the like.

[0026] The protective portion 40 is provided on the insulating layer 11, and covers the heat generating portion 20 (heat generating elements 21 and 22) and the wiring 32 of the wiring portion 30. In this case, the terminals 31 of the wiring portion 30 are exposed from the protective portion 40.

[0027] The protective section 40 has, for example, a function of insulating the heat generating section 20 and a part of the wiring section 30, a function of transmitting heat generated in the heat generating section 20 to the outside, and a function of protecting the heat generating section 20 and a part of the wiring section 30 from external forces, corrosive gases, and the like. The protective section 40 is formed from a material that has heat resistance and insulating properties, and has high chemical stability and thermal conductivity. The protective section 40 is formed from, for example, glass. In this case, the protective section 40 can be formed using glass to which a filler containing a material with high thermal conductivity, such as aluminum oxide, has been added. The thermal conductivity of the glass to which the filler has been added can be, for example, 2 [W / (m·K)] or more.

[0028] The heater 1 may further be provided with a detection unit that detects the temperature of the heat generating unit 20 and the temperature of the substrate 10. The detection unit may be, for example, a thermistor. The detection unit may be provided on at least one of the side of the substrate 10 on which the heat generating unit 20 is provided and the side of the substrate 10 opposite to the side on which the heat generating unit 20 is provided. For example, the detection unit and the wiring and terminals electrically connected to the detection unit may be provided on the insulating layer 11. In this case, the detection unit and the wiring may be covered by the protective unit 40. The terminals electrically connected to the detection unit may be exposed from the protective unit 40.

[0029] As described above, the substrate 10 is made of a metal such as stainless steel or an aluminum alloy, while the insulating layer 11 and the protective portion 40 are made of glass or the like. Therefore, the linear expansion coefficient of the material of the substrate 10 is different from the linear expansion coefficient of the material of the insulating layer 11 and the protective part 40. When the heating part 20 is heated during use of the heater 1, the substrate 10, the insulating layer 11, and the protective part 40 are heated. When the heating part 20, the wiring part 30, the insulating layer 11, and the protective part 40 are baked during manufacture of the heater 1, the substrate 10, the insulating layer 11, and the protective part 40 are heated. Therefore, when the heater 1 is used or manufactured, thermal stress occurs due to the difference in the linear expansion coefficient of the materials. When thermal stress occurs on one side of the substrate 10, the heater 1 may be warped.

[0030] In this case, since the linear expansion coefficient of metal is higher than that of glass etc., the heater 1 is likely to warp significantly. Also, for example, when the length of the substrate 10 in the Y direction is short, the length of the substrate 10 in the X direction is long, or the thickness of the substrate 10 is thin, the heater 1 is likely to warp significantly. If the heater 1 is warped significantly, the distance between the heater 1 and the object to be heated varies, which may result in uneven heating of the object to be heated.

[0031] 1 and 2, the heater 1 is provided with a warpage mitigating portion 50. The warpage mitigating portion 50 is provided on the surface 10b of the substrate 10. If the warpage mitigating portion 50 is provided on the surface 10b of the substrate 10, the thermal stress generated on the surface 10a side of the substrate 10 can be offset by the thermal stress generated on the surface 10b side of the substrate 10. Therefore, it is possible to suppress the occurrence of warpage in the heater 1 when the heater 1 is used or when the heater 1 is manufactured.

[0032] It is possible to provide at least one warp mitigating portion 50. When providing a plurality of warp mitigating portions 50, for example, the plurality of warp mitigating portions 50 can be arranged side by side in the X direction and the Y direction of the substrate 10. Note that one warp mitigating portion 50 illustrated in Figs. 1 and 2 is provided on the surface 10b of the substrate 10.

[0033] Furthermore, the dimension of the warp mitigating portion 50 in the Y direction of the substrate 10 may be the same as the dimension of the substrate 10 in the Y direction, or may be shorter than the dimension of the substrate 10 in the Y direction. Note that the dimension of the warp mitigating portion 50 illustrated in Figs. 1 and 2 in the Y direction of the substrate 10 is shorter than the dimension of the substrate 10 in the Y direction.

[0034] That is, the number, arrangement, and dimensions of the warp mitigation portions 50 can be appropriately changed depending on the warp generated in the heater 1. The number, arrangement, and dimensions of the warp mitigation portions 50 can be appropriately determined by, for example, conducting experiments or simulations.

[0035] As described above, the substrate 10 is made of metal and has high rigidity. For example, by increasing the thickness of the substrate 10, the rigidity of the substrate 10 can be increased, and the occurrence of warping can be suppressed. Therefore, when the amount of warping that occurs is small, the warping mitigating portion 50 can be omitted.

[0036] Here, the substrate 10 made of metal has a larger heat capacity than a substrate made of ceramics. Furthermore, when the dimensions of the substrate 10 are increased in at least one of the X-direction, Y-direction, and Z-direction, the heat capacity of the substrate 10 is increased. That is, when the substrate 10 is made of metal, the heat capacity of the substrate 10 is likely to be large. When the heat capacity of the substrate 10 is increased, the heat capacity of the heater 1 is increased.

[0037] The substrate 10 is also provided with an insulating layer 11, a protective portion 40, and a warpage mitigating portion 50. Therefore, when the dimensions of the substrate 10 increase in at least one of the X and Y directions, the dimensions of the insulating layer 11, the protective portion 40, and the warpage mitigating portion 50 also increase. When the dimensions of the insulating layer 11, the protective portion 40, and the warpage mitigating portion 50 increase, their heat capacities, and therefore the heat capacity of the heater 1, also increase.

[0038] If the heat capacity of the heater 1 is large, new problems arise in that it takes a long time for the heater 1 to increase in temperature and a long time for the heater 1 to cool down.

[0039] In this case, the thermal capacity of the heater 1 can be reduced by reducing the dimensions of the substrate 10, the insulating layer 11, the protective portion 40, and the warpage mitigating portion 50 in the X and Y directions. However, since these dimensions are determined by the application and function of the heater 1, it is difficult to reduce these dimensions.

[0040] Furthermore, by reducing the dimensions of the substrate 10, the insulating layer 11, the protective portion 40, and the warpage mitigating portion 50 in the Z direction, the heat capacity of the heater 1 can be reduced. In other words, by reducing the thicknesses of these portions, the heat capacity of the heater 1 can be reduced.

[0041] However, for example, since the protective part 40 covers the heat generating part 20 and the wiring part 30, if the thickness of the protective part 40 is made too thin, the shapes of the heat generating part 20 and the wiring part 30 may be transferred to the surface of the protective part 40, causing unevenness on the surface of the protective part 40. If unevenness occurs on the surface of the protective part 40, the distance between the surface of the protective part 40 and the heated object may vary, causing uneven heating of the heated object. Furthermore, when the heated object passes over the heater 1, the heated object may get caught on the unevenness on the surface of the protective part 40.

[0042] Furthermore, for example, if the thickness of insulating layer 11 is made too thin, there is a concern that the dielectric strength cannot be ensured. Furthermore, for example, if at least one of the thickness of the substrate 10 and the thickness of the warp mitigating portion 50 is reduced, the warp may become larger. Therefore, there is a limit to how much the heat capacity of the heater 1 can be reduced by reducing the thicknesses of the substrate 10, the insulating layer 11, the protective portion 40, and the warp mitigating portion 50.

[0043] Therefore, as shown in FIG. 1 and FIG. 2, a hole 1a is provided in the heater 1 according to the present embodiment. For example, the holes 1a may include a hole 10c (corresponding to an example of a first hole) provided in the substrate 10, a hole 11a (corresponding to an example of a second hole) provided in the insulating layer 11, a hole 40a (corresponding to an example of a third hole) provided in the protective portion 40, and a hole 50a (corresponding to an example of a fourth hole) provided in the warp mitigating portion 50. When viewed from the Z direction, the hole 10c overlaps with the hole 11a, the hole 40a, and the hole 50a.

[0044] When viewed from the Z direction, the hole 1a does not overlap the heat generating portion 20 and the wiring portion 30. In this case, it is preferable that the gap between the heat generating elements 21, 22 and the hole 10c of the substrate 10 is 0.5 mm or more in the direction (Y direction) perpendicular to the direction (X direction) in which the heat generating elements 21, 22 extend. In this way, the heat generating elements 21, 22 can be easily formed.

[0045] At least one hole 1a can be provided. When multiple holes 1a are provided, the multiple holes 1a can be arranged side by side in at least one of the X and Y directions. In the heater 1 illustrated in FIG. 1 and FIG. 2, multiple holes 1a are arranged side by side in the X and Y directions. In this case, it is preferable that the gap between the holes 10c of the substrate 10 is 5 mm or more in the direction in which the heating elements 21 and 22 extend (X direction). In this way, it is possible to prevent the rigidity of the substrate 10 from becoming excessively small. 1 and 2, the hole 1a extends in the X direction when viewed from the Z direction, but the shape of the hole 1a is not limited to this. The shape of the hole 1a may be, for example, a circle, an ellipse, a regular polygon, etc.

[0046] If the hole 1a is provided, the heat capacity of the heater 1 can be reduced even if the material of the substrate 10 is metal. In addition, since the dimensions of the substrate 10, the insulating layer 11, the protective portion 40, and the warpage mitigating portion 50 in the X, Y, and Z directions do not change, even if the hole 1a is provided, the effect on the functions of the substrate 10, the insulating layer 11, the protective portion 40, and the warpage mitigating portion 50 can be reduced.

[0047] However, if the hole 10c provided in the substrate 10 is made too large, the rigidity of the substrate 10 becomes too small, and the heater 1 becomes more likely to warp. As described below, the holes 11a, 40a, and 50a are formed so as to overlap the hole 10c. Therefore, if the hole 10c is made too small, the hole 1a becomes too small, and the effect obtained by reducing the heat capacity of the heater 1 (for example, shortening the temperature rise time) is reduced.

[0048] According to the knowledge of the present inventors, the volume of the substrate 10 is V1 (mm 3 ), the total volume of the hole 10c is V2 (mm 3), if "0.1≦V2 / V1≦0.7" is satisfied, the heat capacity of the heater 1 can be reduced and the occurrence of warping in the heater 1 can be suppressed. Note that the total volume of the holes 10c is the total volume of the multiple holes 10c when multiple holes 10c are provided, and is the volume of one hole 10c when one hole 10c is provided.

[0049] In the above, the holes 10c (holes 10c penetrating in the thickness direction) opening on the surface 10a and the surface 10b of the substrate 10 have been exemplified, but the holes 10c may be holes opening on the surface 10a or the surface 10b of the substrate 10. That is, the holes 10c may be through holes or may be bottomed holes (recesses). In this case, if the holes 10c are through holes, it is easy to reduce the heat capacity of the heater 1. If the holes 10c are bottomed holes, it is possible to prevent the rigidity of the heater 1 (substrate 10) from decreasing.

[0050] Next, the formation of the holes 1a will be described. In the following, as an example, a case where the hole 10c of the substrate 10 is a through hole will be described. First, the hole 10c penetrating the substrate 10 in the thickness direction is formed in the substrate 10. The hole 10c can be formed by, for example, etching, laser processing, press processing, or the like.

[0051] 3(a) to (c) are schematic cross-sectional views illustrating holes 10c formed in the substrate 10. FIG. 3(a) is a cross-section of a hole 10c formed by etching. When the hole 10c is formed by etching, the periphery of the hole 10c becomes a curved surface. 3(b) is a cross-section of the hole 10c formed by laser processing. When the hole 10c is formed by laser processing, the periphery of the hole 10c and the surfaces 10a and 10b of the substrate 10 are substantially perpendicular to each other. 3(c) is a cross-section of hole 10c formed by press working. When hole 10c is formed by press working, burrs are generated on the periphery of hole 10c on the side opposite to the processing direction. The burrs can be scraped off, but if warpage mitigation portion 50 is formed on surface 10b of substrate 10 where the burrs are generated, the removal of the burrs can be omitted.

[0052] Next, the insulating layer 11 is formed on the surface 10a of the substrate 10. For example, the insulating layer 11 can be formed by applying a paste of glass or an inorganic material onto the surface 10a of the substrate 10 using a screen printing method or the like, and then curing it using a baking method or the like. At this time, the holes 11a of the insulating layer 11 are arranged to overlap the holes 10c of the substrate 10.

[0053] Next, the heat generating portion 20 and the wiring portion 30 are formed on the insulating layer 11 as described above. Next, the protective section 40 that covers the heat generating section 20 and a part of the wiring section 30 is formed on the insulating layer 11 . For example, the protective portion 40 can be formed by applying a paste-like glass onto the insulating layer 11 using a screen printing method or the like, and then curing it using a baking method or the like. At this time, the holes 40a of the protective portion 40 are arranged to overlap the holes 11a of the insulating layer 11.

[0054] It is preferable that at least one of the insulating layer 11 and the protective portion 40 is not provided inside the hole 10c of the substrate 10. In this way, it is possible to prevent the heat capacity of the insulating layer 11 and the heat capacity of the protective portion 40 from becoming unnecessarily large.

[0055] Next, the warpage mitigating portion 50 is formed on the other surface 10b of the substrate 10. For example, the warpage mitigating portion 50 can be formed by applying a paste-like glass onto the surface 10b of the substrate 10 using a screen printing method or the like, and then curing it using a baking method or the like. At this time, the hole 50a of the warpage mitigating portion 50 is made to overlap the hole 10c of the substrate 10. In this case, it is preferable that the warpage mitigating portion 50 is not provided inside the hole 10c of the substrate 10. In this way, it is possible to prevent the heat capacity of the warpage mitigating portion 50 from becoming unnecessarily large.

[0056] (heating device) In one embodiment of the present invention, a heating device 100 including a heater 1 can be provided. The above description of the heater 1 and modified versions of the heater 1 (for example, those having the features of the present invention that are achieved by adding, deleting, or modifying the design of components as appropriate by those skilled in the art) can all be applied to the heating device 100.

[0057] In the following, as an example, the heating device 100 will be described as a heating device. However, the heating device 100 is not limited to a heating device, and may be, for example, a fixing unit of an image forming device such as a copier or printer, a print-erase unit such as a rewritable card reader / writer, office automation equipment, household electrical appliances, precision machinery, etc.

[0058] FIG. 4 is a schematic cross-sectional view illustrating the heating device 100 according to this embodiment. As shown in FIG. 4, the heating device 100 includes, for example, a housing 101, a blower 102, and a heater 1. The housing 101 is, for example, box-shaped and has an air inlet 101a and an exhaust port 101b. For example, the air inlet 101a and the exhaust port 101b can be provided at positions facing each other. For example, the housing 101 may be cylindrical.

[0059] Furthermore, the air supply port 101a may be provided with a filter 101c. The filter 101c has air permeability and captures, for example, dust that can be seen with the naked eye.

[0060] The blower 102 is provided inside the housing 101. The blower 102 can be provided, for example, in a region between the air inlet 101a and the heater 1. The blower 102 draws gas (for example, air) in the atmosphere in which the heating device 100 is provided into the housing 101 through the filter 101c and the air inlet 101a. The gas drawn into the housing 101 is discharged to the outside of the heating device 100 through the exhaust port 101b of the housing 101. Therefore, a gas flow from the air inlet 101a to the exhaust port 101b is formed inside the housing 101. Note that, although FIG. 4 illustrates an example in which the blower 102 is an axial flow blower, the type of the blower 102 can be changed as appropriate. The blower 102 may be, for example, a centrifugal blower, a cross flow blower, or the like.

[0061] The heater 1 is provided inside the housing 101. The heater 1 is provided, for example, between the blower 102 and the exhaust port 101b. As shown in FIG. 4, when the gas sucked into the housing 101 by the blower 102 reaches the heater 1, it flows along the surface of the heater 1. The gas flowing along the surface of the heater 1 flows from the periphery of the heater 1 to the exhaust port 101b side of the housing 101. In addition, a part of the gas flows through the hole 1a of the heater 1 to the exhaust port 101b side of the housing 101. When the gas flows along the surface of the heater 1 and when the gas flows inside the hole 1a of the heater 1, the temperature of the gas increases due to the heat from the heater 1. The gas with the increased temperature is released through the exhaust port 101b, for example, into the atmosphere in which the heating device 100 is provided. For example, the heating device 100 can be a heating device used to increase the temperature of the atmosphere in which the heating device 100 is provided.

[0062] Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be implemented in combination with each other.

[0063] Below, additional notes regarding the above-described embodiment are given.

[0064] (Appendix 1) a substrate including a metal, being plate-shaped, having a first surface, a second surface opposite to the first surface, and a first hole opening in at least one of the first surface and the second surface; an insulating layer provided on the first surface of the substrate, the insulating layer having a second hole penetrating in a thickness direction; A heating element provided on the insulating layer; a protective portion provided on the insulating layer, covering the heating element, and having a third hole penetrating in a thickness direction; Equipped with the second hole and the third hole overlap with the first hole when viewed from a direction perpendicular to the first surface of the substrate.

[0065] (Appendix 2) a warpage mitigating portion provided on the second surface of the substrate and having a fourth hole penetrating in a thickness direction, 2. The heater according to claim 1, wherein the fourth hole overlaps with the first hole when viewed from a direction perpendicular to the first surface of the substrate.

[0066] (Appendix 3) 3. The heater according to claim 1, wherein at least one of the insulating layer and the protective portion is not provided inside the first hole.

[0067] (Appendix 4) The volume of the substrate is V1 (mm 3 ), the total volume of the first hole is V2 (mm 3 4. The heater according to any one of claims 1 to 3, which satisfies the following formula when 0.1≦V2 / V1≦0.7

[0068] (Appendix 5) A heating device comprising the heater according to any one of claims 1 to 4. [Explanation of symbols]

[0069] 1 heater, 10 substrate, 1a hole, 10a surface, 10b surface, 10c hole, 11 insulating layer, 11a hole, 20 heat generating portion, 21 heat generating element, 22 heat generating element, 30 wiring portion, 40 protection portion, 40a hole, 50 warpage mitigation portion, 50a hole, 100 heating device

Claims

1. a substrate including a metal, being plate-shaped, and having a first surface, a second surface opposite to the first surface, and a first hole opening in at least one of the first surface and the second surface; an insulating layer provided on the first surface of the substrate and having a second hole penetrating in a thickness direction; A heating element provided on the insulating layer; a protective portion provided on the insulating layer, covering the heating element, and having a third hole penetrating in a thickness direction; Equipped with The heater, when viewed in a direction perpendicular to the first surface of the substrate, the second hole and the third hole overlap with the first hole.

2. a warpage mitigating portion provided on the second surface of the substrate and having a fourth hole penetrating in a thickness direction, 2. The heater according to claim 1, wherein the fourth hole overlaps with the first hole when viewed in a direction perpendicular to the first surface of the substrate.

3. 3. The heater according to claim 1, wherein at least one of the insulating layer and the protective portion is not provided inside the first hole.

4. The volume of the substrate is V1 (mm ３ , the total volume of the first hole is V2 (mm ３ 3. The heater according to claim 1, wherein the following formula is satisfied: 0.1≦V2 / V1≦0.7

5. A heating device comprising the heater according to claim 1.

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