Wire harness and method of manufacturing wire harness

Abstract

To provide a wire harness and a method of manufacturing a wire harness, capable of preventing a routing material from being loosened when an exterior member is attached to the routing material and preventing the routing material from protruding from the exterior member.SOLUTION: A wire harness includes: an electroconductive routing material W; a mold-molded member 1 that is an exterior member for a plurality of routing materials W and that is provided integrally with the routing materials W so as to cover the wiring materials W; and a winding tape 10 bundling the routing materials W disposed inside the molded-mold member 1. Thus, when the molded-mold member 1 covering the routing materials W is attached to the routing materials W by molding the molded-mold member 1 using a mold 20, the molded-mold member can be attached while a state where the routing materials W are bundled is maintained. Accordingly, it is possible to prevent the routing materials W from being loosened when the molded-mold member 1 is attached to the routing materials W, and prevent the routing materials W from protruding from the molded-mold member 1.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a wire harness and a method for manufacturing the wire harness. [Background technology]

[0002] For wire harnesses, exterior materials are essential to protect the electric wires from external structures such as steel plates of a vehicle. In conventional wire harnesses, various types of exterior materials are used to protect the electric wires. For example, the wire harness described in Patent Document 1 includes an electric wire bundle and a molded body integrally provided on a mounting portion that is a part of the axial direction of the electric wire bundle, and the molded body is made of a thermoplastic resin. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-160568 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional wire harnesses, there are many types of exterior members, and many of them are difficult to attach to electric wires without manual labor. In other words, although there are many types of exterior members, some of the exterior members may come apart when attaching the exterior member to a wiring material such as an electric wire, and in some cases, a part of the loosened wiring material may protrude from the exterior member. For this reason, in conventional wire harnesses, the arrangement of the wiring material relative to the exterior member may need to be adjusted manually when attaching the exterior member, and there is room for improvement in terms of attaching the exterior member to the wiring material.

[0005] The present invention has been made in consideration of the above, and aims to provide a wire harness and a manufacturing method for a wire harness that can suppress the unraveling of a wiring material when an outer member is attached to the wiring material and can suppress the wiring material from protruding from the outer member. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the wire harness of the present invention comprises a conductive wiring material, a molded member that covers a plurality of the wiring materials and is integral with the wiring materials, and a winding tape that bundles the plurality of wiring materials and is arranged inside the molded member.

[0007] In addition, in order to solve the above-mentioned problems and achieve the object, the manufacturing method of the wire harness of the present invention includes a step of bundling a plurality of conductive wiring materials and wrapping a winding tape around them, and a step of providing a molded member by injection molding around the plurality of wiring materials around which the winding tape is wrapped. Effect of the Invention

[0008] In the wire harness and the manufacturing method of the wire harness according to the present invention, the wiring materials arranged inside the molded member, which is an exterior member, are arranged inside the exterior member in a state where the wiring materials are wrapped with a winding tape and the wiring materials are bundled by the winding tape. Therefore, when the exterior member covering the wiring materials is attached to the wiring material by molding the exterior member using a mold, the wiring materials can be attached while maintaining the bundled state. As a result, it is possible to suppress the wiring materials from coming apart when the exterior member is attached to the wiring material, and it is possible to suppress the wiring materials from protruding from the exterior member. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of a wire harness according to the first embodiment. [Diagram 2]FIG. 2 is a schematic diagram showing a state in which a winding tape is wound around a plurality of wiring materials. [Diagram 3] FIG. 3 is a cross-sectional view of the mold in a state in which the wiring material shown in FIG. 2 is placed in the mold. [Figure 4] FIG. 4 is a schematic diagram showing a state in which the mold shown in FIG. 3 is filled with a resin material. [Diagram 5] FIG. 5 is a schematic diagram showing a state in which a plurality of wiring materials are passed through the inside of a molding part of a metal mold without being wrapped with a winding tape. [Figure 6] FIG. 6 is a schematic diagram of a wire harness in which a molded member is formed on a plurality of wiring materials W without wrapping the winding tape. [Figure 7] FIG. 7 is a schematic diagram of the wire harness according to the second embodiment. [Figure 8] FIG. 8 is a schematic diagram showing a state in which a winding tape is wound around a plurality of wiring materials in the second embodiment. [Figure 9] FIG. 9 is an explanatory diagram showing a state in which the wiring material shown in FIG. 8 is placed in a mold. [Figure 10] FIG. 10 is an explanatory diagram showing a state in which multiple wiring materials are placed in a mold without wrapping a winding tape around the wiring materials. [Figure 11] FIG. 11 is a schematic diagram of a wire harness in which a molded member is formed on a plurality of wiring members without wrapping the winding tape. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to this embodiment. In addition, the components in the following embodiments include those that are replaceable and easy for a person skilled in the art, or those that are substantially the same.

[0011] [Embodiment 1] FIG. 1 is a schematic diagram of a wire harness WH according to the first embodiment. The wire harness WH according to the first embodiment is arranged in a vehicle or the like. The wire harness WH is, for example, a bundle of wiring materials W used for power supply and signal communication for connection between devices mounted on a vehicle, and is configured to electrically connect the wiring materials W to each device using a connector or the like. The wire harness WH includes a plurality of wiring materials W having electrical conductivity, and a molded member 1 integrally provided around the plurality of wiring materials W so as to bundle the plurality of wiring materials W. The wire harness WH may further include various components such as exterior members such as a corrugated tube, a resin tape, and a protector, an electrical connection box, and a fixing device.

[0012] The wiring material W is composed of, for example, a metal rod, an electric wire, an electric wire bundle, etc. The metal rod is a rod-shaped member having electrical conductivity. The electric wire is a conductor portion (core wire) made of a plurality of conductive metal strands. The electric wire bundle is a bundle of such electric wires. Each wiring material W may be covered with an insulating coating portion.

[0013] The molded member 1 is provided as an exterior member for the wiring materials W. The molded member 1 is provided around the wiring materials W to cover the wiring materials W so as to bundle them along a predetermined direction in which the wiring materials W extend (hereinafter referred to as the extension direction X). The molded member 1 is formed of an insulating elastic resin material (e.g., ethylene-propylene-diene rubber (EPDM) or the like) having low rigidity and high flexibility, such as rubber or a thermoplastic elastomer. The molded member 1 is provided integrally around the wiring materials W so that the elastic resin material bundles the wiring materials W by molding. Therefore, the wire harness WH can have flexibility together with the molded member 1. The molded member 1 covers a portion of the wiring materials W collectively, and the portion of the wiring materials W is buried. In addition, the covering portion that constitutes the wiring material W is typically an insulating covering member provided over the entire length of the wiring material W, whereas the molded member 1 is a protective member that is provided further outside of such a covering member at a necessary location on the wiring material W for protecting the wiring material W, regulating the route, etc.

[0014] In the first embodiment, the molded member 1 is formed in a substantially cylindrical shape with the axial direction being along the extension direction X of the wiring material W. A plurality of wiring materials W are arranged inside the molded member 1 around the axis of the cylinder that is the shape of the molded member 1.

[0015] Furthermore, in the molded member 1 according to embodiment 1, a protrusion 3, which is a gate portion when the molded member 1 is formed by injection molding, protrudes from the outer surface 2 of the molded member 1 and is formed on a part of the outer surface 2. That is, the protrusion 3 formed on the outer surface 2 of the molded member 1 is a mark of an injected portion of a resin material into a die 20 (see FIG. 4) when the molded member 1 is injection molded using the die 20. The protrusion 3 is formed on the outer surface 2 near the center of the molded member 1 in the extension direction X of the wiring material W.

[0016] The wiring material W arranged inside the molded member 1 is bundled with multiple wiring materials W by a winding tape 10. The winding tape 10 is arranged inside the molded member 1 together with the wiring materials W, and is wrapped around the multiple wiring materials W together to bundle the multiple wiring materials W. The width of the winding tape 10 in the extension direction X of the wiring materials W is narrower than the length of the molded member 1 in the extension direction X of the wiring materials W. For this reason, the winding tape 10 is wrapped around a portion of the portion of the wiring material W that is located inside the molded member 1.

[0017] In the first embodiment, the winding tape 10 that bundles the multiple wiring materials W inside the molded component 1 is arranged including the same position as the position where the protrusion 3 that is the gate part of the molded component 1 is formed in the extension direction X of the wiring materials W. In other words, the winding tape 10 is arranged at a position that overlaps with the protrusion 3 in the radial direction of the cylindrical shape of the molded component 1.

[0018] Next, a method for manufacturing the wire harness WH according to the first embodiment will be described. Fig. 2 is a schematic diagram showing a state in which a winding tape 10 is wound around a plurality of wiring materials W. Fig. 2 shows a process (ST1) of bundling a plurality of wiring materials W having conductivity and winding the winding tape 10 around the plurality of wiring materials W. When manufacturing the wire harness WH according to the first embodiment, first, as shown in Fig. 2, a plurality of wiring materials W are bundled and the winding tape 10 is wound around the plurality of wiring materials W. The winding tape 10 is a so-called adhesive tape, and by winding the winding tape 10 around the wiring materials W in a bundled state, the plurality of wiring materials W can be maintained in a bundled state.

[0019] FIG. 3 is a cross-sectional view of the mold 20 in a state where the wiring material W shown in FIG. 2 is placed in the mold 20. FIG. 3 shows a process (ST2) of placing a plurality of wiring materials W in the mold 20. After wrapping the winding tape 10 around the wiring material W in a bundled state, a molded member 1 is provided around the plurality of wiring materials W wrapped with the winding tape 10 by injection molding of a resin material. The injection molding of the molded member 1 is performed using a mold 20 capable of molding the molded member 1. Therefore, after wrapping the winding tape 10 around the plurality of wiring materials W, the wiring material W is placed in the mold 20 for molding the molded member 1. In the first embodiment, the mold 20 has an upper mold 20a and a lower mold 20b, and when molding the molded member 1, molding is performed with the upper mold 20a and the lower mold 20b stacked vertically. That is, the upper die 20a is placed over the lower die 20b from above.

[0020] The upper die 20a and the lower die 20b each have a molding section 21 for molding the molded member 1 on the surface facing the other. In detail, the first molding section 21a, which is the molding section 21, is formed on the surface of the upper die 20a facing the lower die 20b, and the second molding section 21b, which is the molding section 21, is formed on the surface of the lower die 20b facing the upper die 20a. The first molding section 21a and the second molding section 21b are formed in a shape that can mold the outer surface 2 of the molded member 1. The first molding section 21a and the second molding section 21b are each formed in a shape that can mold the outer surface 2 of the molded member 1 in a range of about 180° in the circumferential direction of the cylinder, which is the shape of the molded member 1.

[0021] The upper die 20a is also formed with an insertion hole 20aa for inserting a nozzle 31 (see FIG. 4) of an injection device 30 (see FIG. 4) when injecting a resin material into the die 20 during molding of the molded member 1. The insertion hole 20aa is formed as a hole communicating with the first molding portion 21a from the surface of the upper die 20a opposite to the surface facing the lower die 20b.

[0022] When molding the molded member 1 using the metal mold 20, the upper metal mold 20a and the lower metal mold 20b are overlapped with the wiring material W passing through the inside of the first molding portion 21a of the upper metal mold 20a and the second molding portion 21b of the lower metal mold 20b. At that time, the wiring material W is placed at a position where the winding tape 10 wound around the wiring material W overlaps with the insertion hole 20aa formed in the upper metal mold 20a. That is, the wiring material W is placed inside the molding portion 21 formed in the metal mold 20 so that the position of the winding tape 10 in the extension direction X of the wiring material W includes a portion that is the same position as the insertion hole 20aa formed in the upper metal mold 20a.

[0023] FIG. 4 is a schematic diagram showing a state in which the mold 20 shown in FIG. 3 is filled with a resin material. FIG. 4 shows a step (ST3) of providing a molded member 1 by injection molding around a plurality of wiring materials W around which the winding tape 10 is wound. After the plurality of wiring materials W bundled by being wound with the winding tape 10 are passed through the inside of the molding section 21 formed in the mold 20, the molding section 21 is filled with molten resin material with the upper mold 20a and the lower mold 20b overlapped. The resin material is filled into the molding section 21 using an injection device 30. The injection device 30 is capable of melting the resin material and injecting the molten resin material from a nozzle 31.

[0024] When filling the molding portion 21 of the metal mold 20 with resin material, the nozzle 31 of the injection device 30 is inserted into the insertion hole 20aa formed in the upper metal mold 20a, and the molten resin material is injected from the nozzle 31 to inject the resin material into the molding portion 21. As a result, the resin material is filled into the space formed by the first molding portion 21a of the upper metal mold 20a and the second molding portion 21b of the lower metal mold 20b.

[0025] The resin material filled in the molding section 21 hardens by cooling over time. As a result, the resin material is formed into the molded member 1 that covers the wiring material W arranged inside. When the resin material in the molding section 21 hardens to form the molded member 1, the upper metal mold 20a and the lower metal mold 20b are separated from each other to remove the molded member 1 formed by the metal mold 20.

[0026] Here, in the first embodiment, before passing the wiring materials W inside the molding section 21 of the metal mold 20 to mold the molded member 1 with the metal mold 20, the wiring materials W are bundled with the winding tape 10. That is, when the molded member 1 is molded in the molding section 21 of the metal mold 20, the wiring materials W bundled with the winding tape 10 are passed inside the molding section 21. Therefore, the molding of the molded member 1 is performed without the wiring materials W passed inside the molding section 21 coming apart.

[0027] FIG. 5 is a schematic diagram showing a state where the wiring material W is passed inside the molding part 21 of the mold 20 without wrapping the winding tape 10 around the wiring material W. FIG. 6 is a schematic diagram of a wire harness WH in which the molded member 1 is molded without wrapping the winding tape 10 around the wiring material W. When the molded member 1 of the wire harness WH is molded using the mold 20, for example, as shown in FIG. 5, if the winding tape 10 is not wrapped around the wiring material W, the wiring material W may break apart. That is, the resin material injected into the molding part 21 of the mold 20 during molding of the molded member 1 is filled into the molding part 21 while flowing within the molding part 21. For this reason, the pressure of the resin material flowing within the molding part 21 acts on the wiring material W arranged inside the molding part 21 of the mold 20, and the wiring materials W may break apart due to the pressure from the resin material.

[0028] When the resin material in the molded portion 21 of the mold 20 hardens while the wiring materials W in the molded portion 21 are loose, some of the wiring materials W may harden in a state where they protrude from the molded member 1. In other words, when the resin material in the molded portion 21 hardens while the wiring materials W are loose, some of the wiring materials W may harden in a state where they protrude from the resin material, as shown in FIG. 6, the wiring harness WH may have a protruding portion Wa where some of the wiring materials W protrude from the molded member 1. In this case, the molded member 1 cannot protect the protruding portion Wa of the wiring materials W protruding from the molded member 1.

[0029] In contrast, in the wire harness WH according to the first embodiment, the molded member 1 is molded while multiple wiring materials W are bundled with the winding tape 10, so that the molded member 1 can be molded without the wiring materials W protruding from the molded member 1. As a result, the wiring harness WH can adequately protect the wiring materials W by the molded member 1.

[0030] The wire harness WH is routed at a desired position with a portion of the wiring materials W covered with the molded member 1 in this manner and the wiring materials W protected by the molded member 1. At that time, since the molded member 1 has a protrusion 3 formed thereon, when the molded member 1 is arranged at a desired position, it can be positioned by the protrusion 3. This allows the molded member 1 to be arranged at an appropriate position when the wire harness WH is arranged.

[0031] In the wire harness WH according to the above embodiment, the wiring material W arranged inside the molded member 1 is arranged inside the molded member 1 in a state where the winding tape 10 is wound around the wiring materials W and the wiring materials W are bundled by the winding tape 10. Therefore, when the molded member 1 covering the wiring materials W is attached to the wiring material W by molding the molded member 1 using the mold 20, the wiring materials W can be attached while maintaining the bundled state. As a result, it is possible to suppress the loosening of the wiring material W when the molded member 1, which is an exterior member, is attached to the wiring material W, and it is possible to suppress the wiring material W from protruding from the molded member 1. In addition, since it is possible to suppress the wiring material W from protruding from the molded member 1, it is possible to manufacture the wire harness WH with a certain quality.

[0032] In addition, the winding tape 10 is arranged in the extension direction X of the wiring material W including the same position as the position where the protrusion portion 3, which is the gate portion of the molded member 1, is formed, so that the loosening of the wiring material W can be further suppressed. That is, when the molded member 1 is molded using the mold 20, the molten resin material is injected into the molded portion 21 of the mold 20 from the position of the insertion hole 20aa formed in the mold 20. Therefore, the wiring material W arranged in the molded portion 21 of the mold 20 when the molded member 1 is molded is easily subjected to a large pressure from the resin material when the resin material is injected into the molded portion 21 at a portion located near the insertion hole 20aa in the wiring material W. As a result, the portion located near the insertion hole 20aa in the wiring material W is easily loosened by the large pressure acting from the resin material when the molded member 1 is molded.

[0033] In contrast, in the wire harness WH according to the first embodiment, the winding tape 10 bundling the wiring materials W is arranged in the wiring material W including the same position as the position where the protrusion 3, which is the gate portion of the molded member 1, is formed in the extension direction X of the wiring material W. In other words, the winding tape 10 is arranged in the extension direction X of the wiring material W including the portion where the insertion hole 20aa of the mold 20, which is the portion into which the resin material is injected when the molded member 1 is molded, is located. Therefore, the winding tape 10 can bundle the portions of the wiring materials W that are likely to come apart due to the large pressure that is likely to act from the resin material when the molded member 1 is molded.

[0034] As a result, by bundling the parts of the wiring materials W that are likely to come apart due to the large pressure applied by the resin material during molding of the molded member 1 with the winding tape 10, it is possible to maintain the bundled state of the wiring materials W even during molding of the molded member 1. As a result, it is possible to prevent the wiring materials W from coming apart when the molded member 1 is attached to the wiring materials W, and to prevent the wiring materials W from protruding from the molded member 1.

[0035] In addition, the manufacturing method of the wire harness WH according to the first embodiment includes bundling a plurality of electrically conductive wiring materials W, winding a winding tape 10 around the wiring materials W, and providing a molded member 1 by injection molding around the plurality of wiring materials W around which the winding tape 10 is wound. As a result, when providing the molded member 1 around the plurality of wiring materials W, the plurality of wiring materials W can be provided while maintaining the bundled state, and the molded member 1 can be attached to the wiring materials W while maintaining the bundled state. As a result, it is possible to suppress the unraveling of the wiring materials W when attaching the molded member 1, which is an exterior member, to the wiring materials W, and it is possible to suppress the wiring materials W from protruding from the molded member 1.

[0036] [Embodiment 2] The wire harness WH according to the second embodiment has a configuration substantially similar to that of the wire harness WH according to the first embodiment, but is characterized in that the winding tape 10 bundling the wiring material W is disposed so as to include the position of the end 5 of the molded member 1. Since the other configurations are the same as those of the first embodiment, the description thereof will be omitted and the same reference numerals will be used.

[0037] 7 is a schematic diagram of a wire harness WH according to embodiment 2. The wire harness WH according to embodiment 2 has a molded member 1 that covers a conductive wiring material W, similar to the wire harness WH according to embodiment 1, and the molded member 1 is provided integrally with the wiring material W while covering the wiring materials W. In addition, a winding tape 10 is wound around the wiring materials W, and the wiring materials W are bundled together by the winding tape 10.

[0038] Unlike in the first embodiment, the winding tape 10 bundling the multiple wiring materials W is arranged to include the position of the end 5 of the molded member 1 in the extension direction X of the wiring material W. In other words, the winding tape 10 is arranged at a position overlapping the end 5 on both sides of the molded member 1 in the extension direction X of the wiring material W in the radial direction of the cylinder that is the shape of the molded member 1. That is, in the first embodiment, the winding tape 10 is arranged at one location near the center of the molded member 1 in the extension direction X of the wiring material W, whereas in the second embodiment, the winding tape 10 is arranged at two locations near both ends of the molded member 1 in the extension direction X of the wiring material W.

[0039] Next, a method for manufacturing the wire harness WH according to the second embodiment will be described. FIG. 8 is a schematic diagram showing a state in which the winding tape 10 is wound around a plurality of wiring materials W in the second embodiment. When manufacturing the wire harness WH according to the second embodiment, first, as shown in FIG. 8, the winding tape 10 is wound around the plurality of wiring materials W at two positions separated in the extension direction X of the plurality of wiring materials W. The two winding tapes 10 are arranged so that the interval between the ends of the winding tapes 10 on the other winding tape 10 side of each winding tape 10 is narrower than the length of the molded member 1, and the interval between the ends of the winding tapes 10 on the opposite side to the side where the other winding tape 10 is located is wider than the length of the molded member 1. The winding tape 10 is wound around the two positions of the wiring materials W in this way while the wiring materials W are bundled, so that the wiring materials W can be maintained in a bundled state by the winding tape 10.

[0040] Fig. 9 is an explanatory diagram showing the state in which the wiring material W shown in Fig. 8 is placed in a mold 20. After wrapping the winding tape 10 around the wiring material W in a bundled state, the wiring material W is placed in a mold 20 for molding the molded component 1. The wiring material W is first placed in the lower mold 20b of the mold 20, for example, as shown in Fig. 9. That is, the wiring material W is placed inside the second molding portion 21b formed in the lower mold 20b.

[0041] At this time, the wiring material W is arranged so that each of the two winding tapes 10 wound around the wiring material W is positioned from the inside of the second molding portion 21b to the outside of the end portion 22 of the mold 20. That is, the wiring material W is arranged with respect to the lower mold 20b so that each of the two winding tapes 10 protrudes from the inside of the second molding portion 21b toward the outside of the end portion 22 of the mold 20.

[0042] After the wiring material W is placed in the lower mold 20b, the upper mold 20a is placed on the lower mold 20b, and the molten resin material is injected into the molding portion 21 while the wiring material W passes through the inside of the first molding portion 21a of the upper mold 20a and the second molding portion 21b of the lower mold 20b. In other words, while the upper mold 20a and the lower mold 20b are placed on top of each other, the nozzle 31 (see FIG. 4) of the injection device 30 (see FIG. 4) is inserted into the insertion hole 20aa formed in the upper mold 20a, and the resin material is injected from the injection device 30. As a result, the resin material is injected into the molding portion 21 formed in the mold 20, and the molding portion 21 is filled with the resin material.

[0043] The resin material filled in the molding section 21 hardens as it cools over time, and the hardened resin material is formed as the molded member 1 that covers the wiring material W. When the resin material in the molding section 21 hardens to form the molded member 1, the upper metal mold 20a and the lower metal mold 20b are separated from each other, and the molded member 1 formed by the metal mold 20 is taken out.

[0044] At that time, the molding of the molded member 1 is performed in a state in which each of the two winding tapes 10 wound around the wiring material W is positioned from the inside of the second molding portion 21b to the outside of the end 22 of the mold 20. Therefore, in the molded member 1 after molding, the two winding tapes 10 are exposed from the inside of the molded member 1 toward the outside in the extension direction X of the wiring material W, and are positioned including the position of the end 5 of the molded member 1 in the extension direction X of the wiring material W.

[0045] In the second embodiment, when the molded member 1 is molded in the metal mold 20, the wiring materials W bound by the winding tape 10 are passed inside the molding section 21, so that, as in the first embodiment, the multiple wiring materials W passed inside the molding section 21 are molded without coming apart. Furthermore, in the second embodiment, the winding tape 10 is positioned to include the position of the end 5 of the molded member 1 in the extension direction X of the wiring materials W, so that the wiring materials W can be prevented from being pinched by the metal mold 20 when the molded member 1 is molded.

[0046] FIG. 10 is an explanatory diagram showing a state in which the wiring material W is placed in the mold 20 without wrapping the winding tape 10 around the wiring material W. FIG. 11 is a schematic diagram of a wire harness WH in which the molded member 1 is molded without wrapping the winding tape 10 around the wiring material W. When the molded member 1 is molded without wrapping the winding tape 10 around the wiring material W, when the wiring material W is placed in the mold 20, some of the wiring materials W may protrude from the molded portion 21 of the mold 20. In other words, when the wiring material W is placed inside the second molded portion 21b formed in the lower mold 20b without wrapping the winding tape 10 around the wiring material W, the wiring materials W on which the winding tape 10 is not wrapped are likely to come apart. Therefore, if the wiring material W is placed inside the second molding portion 21b without wrapping the winding tape 10 around the wiring material W, some of the scattered wiring material W may protrude from the second molding portion 21b, for example, as shown in the clamped portion Wb in Figure 10.

[0047] When molding the molded member 1, the upper die 20a and the lower die 20b are overlapped, so if the upper die 20a and the lower die 20b are overlapped in a state where a part of the wiring material W protrudes from the second molding portion 21b, the protruding part of the wiring material W is sandwiched between the upper die 20a and the lower die 20b. In other words, when the wiring material W is arranged inside the second molding portion 21b formed in the lower die 20b, the sandwiched part Wb of the wiring material W protruding from the second molding portion 21b is sandwiched between the upper die 20a and the lower die 20b other than the molding portion 21 when the upper die 20a and the lower die 20b are overlapped.

[0048] When the molten resin material is filled into the molding section 21 while the sandwiched portion Wb of the wiring material W is sandwiched between the upper mold 20a and the lower mold 20b in a portion other than the molding section 21, the sandwiched portion Wb of the wiring material W is located outside the resin material. Therefore, when the resin material filled into the molding section 21 hardens, the resin material hardens in a state in which the sandwiched portion Wb of the wiring material W protrudes from the resin material. Therefore, when the resin material hardens in a state in which the sandwiched portion Wb of the wiring material W protrudes from the resin material, when the molded member 1 is molded, the sandwiched portion Wb becomes a protruding portion Wa of the wiring material W protruding from the molded member 1, as shown in FIG. 11.

[0049] In other words, the sandwiched portion Wb of the wiring material W does not come out of the molded member 1 from the position of the end portion 5 of the molded member 1, but comes out of the molded member 1 from the position of the outer surface 2 of the molded member 1. In this case, the molded member 1 cannot protect the protruding portion Wa of the wiring material W that protrudes from the molded member 1.

[0050] In contrast, in the wire harness WH according to the second embodiment, the winding tape 10 wound around the multiple wiring materials W is arranged to include the position of the end 5 of the molded member 1 in the extension direction X of the wiring materials W. Therefore, when the multiple wiring materials W are arranged in the molding portion 21 of the mold 20, the wiring materials W can be prevented from coming apart, and therefore it is possible to prevent some of the loose wiring materials W from protruding from the molding portion 21 and being pinched between the upper mold 20a and the lower mold 20b in a portion other than the molding portion 21.

[0051] That is, by arranging the winding tape 10 at a position including the positions of the ends 5 on both sides of the molded member 1 in the extension direction X of the wiring material W, the entire part of the wiring material W arranged inside the molded member 1 can be kept in a bundled state by the two winding tapes 10. As a result, when the molded member 1 covering the multiple wiring materials W is molded by injection molding of a resin material and attached to the wiring material W, the multiple wiring materials W arranged inside the molded member 1 can be attached while maintaining the bundled state.

[0052] Therefore, when molding the molded member 1 using the metal mold 20, it is possible to prevent a part of the wiring material W from protruding from the molding portion 21 of the metal mold 20, and to prevent a part of the wiring material W from being pinched between the upper metal mold 20a and the lower metal mold 20b in a portion other than the molding portion 21. As a result, it is possible to prevent the wiring material W from coming apart when the molded member 1 is attached to the wiring material W, and to prevent a part of the loose wiring material W from protruding from the molded molded member 1.

[0053] [Variations] In the above-described first and second embodiments, the molded member 1 after molding has the protrusion 3, which is the gate portion during molding of the molded member 1, but the protrusion 3 may be removed after molding of the molded member 1. Since the protrusion 3 is not involved in the protection of the wiring material W by the molded member 1, the presence or absence of the protrusion 3 in the molded member 1 after molding does not matter.

[0054] In the above-described embodiment 2, the winding tape 10 wound around the wiring material W is arranged to include the positions of the end portions 5 on both sides of the molded member 1 in the extension direction X of the wiring material W, but the winding tape 10 does not have to be arranged at the positions of the end portions 5 on both sides of the molded member 1. The winding tape 10 wound around the wiring material W is arranged, for example, at the position of the end portion 5 on one side of the molded member 1, and does not have to be arranged at the position of the end portion 5 on the other side of the molded member 1. The winding tape 10 wound around the wiring material W is preferably arranged to include the position of the end portion 5 of the molded member 1 on the side where the wiring material W protrudes from the molded portion 21 of the mold 20 and is likely to be pinched in a portion other than the molded portion 21 of the mold 20, depending on the shape of the molded member 1 and the mold 20.

[0055] In the above-mentioned first and second embodiments, the molded member 1 is formed in a substantially cylindrical shape whose axial direction is along the extension direction X of the wiring material W, but the molded member 1 may be formed in other shapes. For example, the molded member 1 may be formed in a substantially rectangular column shape, or may be formed in a so-called substantially truncated cone shape in which the end 5 on one side of the molded member 1 and the other end 5 are different in size. The shape of the molded member 1 is not important as long as it can partially protect the necessary parts of the wiring material W.

[0056] The wire harness and the manufacturing method of the wire harness according to the embodiment and the modified example of the present invention described above are not limited to the embodiment and the modified example described above, and various modifications are possible within the scope of the claims. The wire harness according to the embodiment and the modified example may be configured by appropriately combining the components of the embodiment and the modified example described above. [Explanation of symbols]

[0057] 1 Molding material 2 External surface 3 Protrusion 5 End 10 rolls of tape 20 Mold 21 Molding section 22 End 30 Injection device WH Wire harness W Routing material

Claims

1. A conductive wiring material; A molded member that covers the plurality of wiring materials and is integral with the wiring materials; A winding tape that bundles the wiring materials arranged inside the molded member; The present invention is characterized in that it comprises Wire harness.

2. The wire harness according to claim 1 , wherein the winding tape is arranged in an extending direction of the wiring material, the winding tape including a position at which a gate portion of the molded member is formed.

3. The wire harness according to claim 1 , wherein the winding tape is disposed so as to include a position of an end of the molded member in an extending direction of the wiring material.

4. A step of bundling a plurality of conductive wiring materials and wrapping a winding tape around the bundling materials; A step of providing a molded member by injection molding around the plurality of wiring materials around which the winding tape is wound; A method for manufacturing a wire harness comprising the steps of:

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