Electronic component

Abstract

To downsize while reducing characteristic deterioration.SOLUTION: In an electronic component 100, a first inductor L1 includes a spiral first conductor pattern part 11. A second inductor L2 includes a spiral second conductor pattern part 12. An insulation layer 2 includes an interlayer insulation film 23 covering the first inductor L1. The second conductor pattern part 12 of the second inductor L2 is provided on the interlayer insulation film 23. The second conductor pattern part 12 of the second inductor L2 has: a first portion 121 which overlaps the first conductor pattern part 11 of the first inductor L1 in plan view from a thickness direction D1 of a substrate 1; and a second portion 122 which does not overlap the first conductor pattern part 11 of the first inductor L1 in plan view from the thickness direction D1 of the substrate 1. The second inductor L2 includes a third conductor pattern part 13 which is formed inside the interlayer insulation film 23, and at least part of which overlaps the second portion 122 of the second conductor pattern part 12.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates generally to electronic components, and more particularly to electronic components including multiple inductors. [Background technology]

[0002] Patent Document 1 discloses a thin-film element (electronic component) including a Si substrate, a first insulating film formed on the front surface side of the Si substrate, two inductor electrodes formed on the first insulating film, each having a spiral pattern, and a second insulating film formed on the two inductor electrodes.

[0003] In the thin-film device disclosed in Patent Document 1, two inductor electrodes are disposed spaced apart from each other on a first insulating film. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2011 / 092910 Summary of the Invention [Problem to be solved by the invention]

[0005] In the thin-film element disclosed in Patent Document 1, the two inductor electrodes are disposed spaced apart from each other on the first insulating film, which may result in the thin-film element becoming large in size.

[0006] An object of the present invention is to provide an electronic component that can be miniaturized while reducing deterioration in characteristics. [Means for solving the problem]

[0007] An electronic component according to an embodiment of the present invention includes a substrate, an insulating layer, a first inductor, and a second inductor. The insulating layer is provided on the substrate. The first inductor includes a first spiral conductor pattern provided in the insulating layer. The second inductor includes a second spiral conductor pattern provided in the insulating layer. The insulating layer includes an interlayer insulating film covering the first inductor, and the second conductor pattern of the second inductor is provided on the interlayer insulating film. The second conductor pattern of the second inductor has a first portion that overlaps the first conductor pattern of the first inductor in a plan view from the thickness direction of the substrate, and a second portion that does not overlap the first conductor pattern of the first inductor in a plan view from the thickness direction of the substrate. The second inductor includes a third conductor pattern formed in the interlayer insulating film and at least a portion of which overlaps the second portion of the second conductor pattern. Effect of the Invention

[0008] The electronic component according to the above aspect of the present invention can be made smaller while reducing deterioration in characteristics. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view of the electronic component according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view of the electronic component. [Diagram 3] FIG. 3 is a plan view of the electronic component. [Figure 4] FIG. 4 is a bottom view of the electronic component. [Diagram 5]Fig. 5A is a plan view seen through a first metal pattern portion of the electronic component of the same. Fig. 5B is a plan view seen through a second metal pattern portion of the electronic component of the same. Fig. 5C is a plan view seen through a third metal pattern portion of the electronic component of the same. Fig. 5D is a plan view seen through a fourth metal pattern portion of the electronic component of the same. Fig. 5E is a plan view seen through a fifth metal pattern portion of the electronic component of the same. Fig. 5F is a plan view seen through a sixth metal pattern portion of the electronic component of the same. [Figure 6] FIG. 6 is a circuit diagram of the electronic component. [Figure 7] FIG. 7 is an equivalent circuit diagram of the electronic component. [Figure 8] FIG. 8 is a characteristic diagram of the electronic component. [Figure 9] FIG. 9 is a cross-sectional view of the electronic component according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments 1 and 2 will be described with reference to the drawings. The drawings referred to in the following embodiments are schematic drawings, and the sizes and thicknesses of components in the drawings do not necessarily reflect the actual dimensions, and the size ratios and thickness ratios between components do not necessarily reflect the actual dimensional ratios.

[0011] (Embodiment 1) An electronic component 100 according to a first embodiment will be described with reference to the drawings.

[0012] 1 and 2, the electronic component 100 according to the first embodiment includes a first inductor L1 and a second inductor L2. The electronic component 100 is, for example, an integrated passive device (IPD).

[0013] The electronic component 100 includes, for example, an LC filter used in a communication device. The communication device is, for example, a mobile phone (for example, a smartphone), but is not limited to this and may be, for example, a wearable terminal (for example, a smart watch) or the like.

[0014] (1) Circuit configuration of electronic components The circuit configuration of the electronic component 100 according to the first embodiment will be described below with reference to the drawings.

[0015] 6, the electronic component 100 includes an input terminal T1, an output terminal T2, a ground terminal T3, a first inductor L1, a second inductor L2, a capacitor C1 (hereinafter also referred to as the first capacitor C1), and a capacitor C2 (hereinafter also referred to as the second capacitor C2). The first capacitor C1 and the second capacitor C2 are included in an LC filter together with the first inductor L1 and the second inductor L2. The LC filter included in the electronic component 100 functions as a low-pass filter.

[0016] The input terminal T1 is a terminal to which a high-frequency signal is input. The output terminal T2 is a terminal from which a high-frequency signal that has passed through an LC filter is output. The ground terminal T3 is, for example, a terminal connected to a ground conductor of a circuit board on which the electronic component 100 is disposed.

[0017] Each of the first inductor L1 and the second inductor L2 has a first end and a second end. In the electronic component 100, the first end of the first inductor L1 and the first end of the second inductor L2 are connected to each other, the second end of the first inductor L1 is connected to the input terminal T1, and the second end of the second inductor L2 is connected to the output terminal T2. In the electronic component 100, the first inductor L1 and the second inductor L2 are sum-connected.

[0018] Each of the first capacitor C1 and the second capacitor C2 has a first end and a second end. In the electronic component 100, a first end of the first capacitor C1 is connected to the input terminal T1, and a second end of the capacitor C1 is connected to the output terminal T2. In the electronic component 100, a first end of the second capacitor C2 is connected to a first end of the first inductor L1 and a first end of the second inductor L2, and a second end of the second capacitor is connected to the ground terminal T3.

[0019] (2) Equivalent circuits of electronic components In the equivalent circuit shown in FIG. 7, the mutual inductance between the first inductor L1 and the second inductor L2 is illustrated as an inductor L3 connected between the connection point of the first inductor L1 and the second inductor L2 and the second capacitor C2.

[0020] In the electronic component 100, the first inductor L1 and the second inductor L2 are summarily connected, so that it is not necessary to form the inductor L3 separately from the first inductor L1 and the second inductor L2.

[0021] (3) Structure of electronic components As shown in Fig. 1, electronic component 100 includes a substrate 1, an insulating layer 2, a first inductor L1, a second inductor L2, a first capacitor C1, and a second capacitor C2 (see Fig. 2). As shown in Figs. 2 and 3, electronic component 100 also includes an input terminal T1, an output terminal T2, a ground terminal T3, and a terminal T4. In Figs. 2 to 4, illustration of substrate 1 and insulating layer 2 are omitted. Fig. 1 is a cross-sectional view corresponding to the cross section taken along line X1-X1 in Fig. 3.

[0022] The substrate 1 is, for example, a silicon substrate. The substrate 1 is not limited to a silicon substrate, and may be, for example, a glass substrate. In a plan view from a thickness direction D1 of the substrate 1, the outer edge of the substrate 1 is, for example, rectangular, but may be a shape other than rectangular. The thickness of the substrate 1 is, for example, 80 μm or more and 380 μm or less.

[0023] The insulating layer 2 is provided on the substrate 1. The insulating layer 2 is thinner than the substrate 1. The thickness of the insulating layer 2 is, for example, 20 μm or less. This allows the thickness of the electronic component 100 to be 400 μm or less. However, the thickness of the electronic component 100 is not limited to 400 μm or less and may be thicker than 400 μm.

[0024] The insulating layer 2 has electrical insulation properties. The insulating layer 2 has a multi-layer structure and includes an interlayer insulating film 23 and a protective film 25. The interlayer insulating film 23 is interposed between the first inductor L1 and the second inductor L2 in the thickness direction D1 of the substrate 1. The interlayer insulating film 23 covers the first inductor L1. The material of the interlayer insulating film 23 includes, for example, silicon oxide. The protective film 25 is a passivation film. The material of the protective film 25 includes, for example, silicon nitride. Note that the material of the portion of the insulating layer 2 other than the protective film 25 includes, for example, silicon oxide.

[0025] The first inductor L1 has a spiral shape when viewed from a thickness direction D1 of the substrate 1 (see FIG. 3). The first inductor L1 includes a spiral first conductor pattern portion 11 provided in the insulating layer 2. The first conductor pattern portion 11 has electrical conductivity. The material of the first conductor pattern portion 11 includes a metal. The thickness of the first conductor pattern portion 11 is, for example, 3 μm, but is not limited to 3 μm.

[0026] The second inductor L2 has a spiral shape when viewed from a thickness direction D1 of the substrate 1 (see FIG. 3). The second inductor L2 includes a spiral second conductor pattern portion 12 provided in the insulating layer 2. The second conductor pattern portion 12 has electrical conductivity. The material of the second conductor pattern portion 12 includes a metal. The thickness of the second conductor pattern portion 12 is, for example, 3 μm, but is not limited to 3 μm.

[0027] The second conductor pattern portion 12 of the second inductor L2 is provided on the interlayer insulating film 23. The second conductor pattern portion 12 of the second inductor L2 has a first portion 121 that overlaps with the first conductor pattern portion 11 of the first inductor L1 in a planar view from the thickness direction D1 of the substrate 1, and a second portion 122 that does not overlap with the first conductor pattern portion 11 of the first inductor L1 in a planar view from the thickness direction D1 of the substrate 1.

[0028] The second inductor L2 includes a third conductor pattern portion 13. The third conductor pattern portion 13 is formed in the interlayer insulating film 23, and at least a portion of the third conductor pattern portion 13 overlaps with the second portion 122 of the second conductor pattern portion 12. The third conductor pattern portion 13 is disposed in an opening penetrating the interlayer insulating film 23 in the thickness direction D1 of the substrate 1. The third conductor pattern portion 13 has electrical conductivity. The material of the third conductor pattern portion 13 includes a metal. The thickness of the third conductor pattern portion 13 is, for example, 3 μm, but is not limited to 3 μm. The third conductor pattern portion 13 may be configured to be disposed in a spiral recess formed in the interlayer insulating film 23.

[0029] In the electronic component 100, the first inductor L1 further includes a fourth conductor pattern portion 14. The fourth conductor pattern portion 14 is formed in the interlayer insulating film 23. The fourth conductor pattern portion 14 overlaps a portion of the first conductor pattern portion 11 that does not overlap the second conductor pattern portion 12 of the second inductor L2 in a plan view from the thickness direction D1 of the substrate 1. The fourth conductor pattern portion 14 is conductive. The material of the fourth conductor pattern portion 14 includes a metal. The thickness of the fourth conductor pattern portion 14 is, for example, 3 μm, but is not limited to 3 μm.

[0030] In addition, in the electronic component 100, when viewed in a plan view from the thickness direction D1 of the substrate 1, as shown in FIG. 3, multiple portions of the second conductor pattern portion 12 and multiple portions of the first conductor pattern portion 11 are arranged alternately in the width direction of the second conductor pattern portion 12 and the first conductor pattern portion 11.

[0031] In the electronic component 100, the conductor pattern portion 10 which is the first conductor pattern portion 11 has a narrow portion 10N having a first width W1 (see FIG. 1) and a wide portion 10W having a second width W2 (see FIG. 1) wider than the first width W1, as shown in FIG. 5D. The narrow portion 10N includes the first end 101 which is closer to the center than the first end 101 and the second end 102 of the conductor pattern portion 10. The wide portion 10W includes the second end 102. In the electronic component 100, the portion of the first inductor L1 which overlaps with the first portion 121 of the second conductor pattern portion 12 of the second inductor L2 includes a part of the narrow portion 10N.

[0032] 5F, the conductor pattern portion 10, which is the second conductor pattern portion 12, has a narrow portion 10N having a first width W1 and a wide portion 10W having a second width W2 wider than the first width W1. The narrow portion 10N includes the first end 101, which is closer to the center, of the first end 101 and the second end 102 of the conductor pattern portion 10. The wide portion 10W includes the second end 102. In the electronic component 100, the first portion 121 of the second conductor pattern portion 12 of the second inductor L2 includes a part of the narrow portion 10N.

[0033] The electronic component 100 further includes a via conductor V12 (see FIG. 5E) interposed between the first inductor L1 and the second inductor L2. The via conductor V12 is formed in the interlayer insulating film 23. In the electronic component 100, the first inductor L1 and the second inductor L2 are summarily connected by the via conductor V12.

[0034] In electronic component 100, the area of ​​first portion 121 of second conductor pattern portion 12 is smaller than the area of ​​second portion 122 of second conductor pattern portion 12 in plan view in thickness direction D1 of substrate 1 (see FIG. 3).

[0035] In the electronic component 100, the first conductor pattern portion 11 has a first end 11a on the central side and a second end 11b on the outer periphery side, as shown in Fig. 5D. The first end 11a and the second end 11b of the first conductor pattern portion 11 correspond to the first end 101 and the second end 102 of the conductor pattern portion 10 constituting the first conductor pattern portion 11. The second conductor pattern portion 12 has a first end 12a on the central side and a second end 12b on the outer periphery side, as shown in Fig. 5F. The first end 12a and the second end 12b of the second conductor pattern portion 12 correspond to the first end 101 and the second end 102 of the conductor pattern portion 10 constituting the second conductor pattern portion 12.

[0036] In the electronic component 100, the second portion 122 (see FIG. 1) of the second conductor pattern portion 12 of the second inductor L2 is closer to the second end 12b than the first end 12a and the second end 12b.

[0037] In the electronic component 100, when viewed in a plan view from the thickness direction D1 of the substrate 1, in the second portion 122 of the second conductor pattern portion 12 of the second inductor L2, the width W3 of the third conductor pattern portion 13 (see Figures 1 and 5E) is narrower than the width W4 of the first conductor pattern portion 11 (see Figures 1 and 5F).

[0038] The first capacitor C1 and the second capacitor C2 are provided in the insulating layer 2. As shown in FIG. 1, each of the first capacitor C1 and the second capacitor C2 has a pair of electrodes 17, 18 and a dielectric film 19 interposed between the pair of electrodes 17, 18. In the thickness direction D1 of the substrate 1, the first capacitor C1 and the capacitor C2 have the electrode 17, the dielectric film 19, and the electrode 18 arranged in this order from the substrate 1 side. That is, the dielectric film 19 is laminated on the electrode 17, and the electrode 18 is laminated on the dielectric film 19. In the thickness direction D1 of the substrate 1, the pair of electrodes 17, 18 of the capacitors C1 and C2 are located closer to the substrate 1 than the first inductor L1. The thickness of the electrode 17 is, for example, 0.6 μm, but is not limited to 0.6 μm. The thickness of the dielectric film 19 is, for example, 0.1 μm, but is not limited to 0.1 μm. The thickness of the electrode 18 is, for example, 0.2 μm, but is not limited to 0.2 μm.

[0039] In electronic component 100, in plan view in thickness direction D1 of substrate 1, a pair of electrodes 17, 18 of each of first capacitor C1 and second capacitor C2 does not overlap with first inductor L1 and second inductor L2.

[0040] In electronic component 100, a pair of electrodes 17, 18 of each of first capacitor C1 and second capacitor C2 are located outside second inductor L2 in plan view in thickness direction D1 of substrate 1.

[0041] 5A to 5F, the electronic component 100 has a first metal pattern portion M1, a second metal pattern portion M2, a third metal pattern portion M3, a fourth metal pattern portion M4, a fifth metal pattern portion M5, and a sixth metal pattern portion M6. The first metal pattern portion M1, the second metal pattern portion M2, the third metal pattern portion M3, the fourth metal pattern portion M4, the fifth metal pattern portion M5, and the sixth metal pattern portion M6 are disposed in the insulating layer 2. In the thickness direction D1 of the substrate 1, the first metal pattern portion M1, the second metal pattern portion M2, the third metal pattern portion M3, the fourth metal pattern portion M4, the fifth metal pattern portion M5, and the sixth metal pattern portion M6 are positioned in the following order from the substrate 1 side: the first metal pattern portion M1, the second metal pattern portion M2, the third metal pattern portion M3, the fourth metal pattern portion M4, the fifth metal pattern portion M5, and the sixth metal pattern portion M6.

[0042] As shown in FIG. 5A, the first metal pattern portion M1 includes one electrode 17 of each of the first capacitor C1 and the second capacitor C2. As shown in FIG. 5B, the second metal pattern portion M2 includes the other electrode 18 of each of the first capacitor C1 and the second capacitor C2. As shown in FIG. 5C, the third metal pattern portion M3 includes the fourth conductor pattern portion 14 and a via conductor V45 connected to the electrode 17. As shown in FIG. 5D, the fourth metal pattern portion M4 includes the first conductor pattern portion 11 and a via conductor V35 connected to the via conductor V45. As shown in FIG. 5E, the fifth metal pattern portion M5 includes the third conductor pattern portion 13, a via conductor V25 connected to the via conductor V35, a via conductor V21 connected to the input terminal T1, a via conductor V22 connected to the output terminal T2, a via conductor V23 connected to the ground terminal T3, and a via conductor V24 connected to the terminal T4. As shown in FIG. 5F, the sixth metal pattern portion M6 includes the second conductor pattern portion 12, a via conductor V1 connected to the input terminal T1 and the via conductor V21, a via conductor V2 connected to the output terminal T2 and the via conductor V22, a via conductor V3 connected to the ground terminal T3 and the via conductor V23, and a via conductor V2 connected to the terminal T4 and the via conductor V24.

[0043] In the electronic component 100, the first inductor L1 and the second inductor L2 are arranged so that a magnetic field generated in the first inductor L1 and a magnetic field generated in the second inductor L2 are coupled together, as shown in Fig. 2. The first inductor L1 and the second inductor L2 are arranged so that the first inductor L1 and the second inductor L2 are coupled together.

[0044] In electronic component 100, the winding direction of first inductor L1 and the winding direction of second inductor L2 are opposite to each other, and in thickness direction D1 of mounting substrate 9, part of first inductor L1 and part of second inductor L2 overlap each other.

[0045] (4) Manufacturing method In a manufacturing method for the electronic component 100 of embodiment 1, a wafer that serves as the base for the substrate 1 is prepared, and then an insulating layer 2, a first metal pattern portion M1, a second metal pattern portion M2, a third metal pattern portion M3, a fourth metal pattern portion M4, a fifth metal pattern portion M5 and a sixth metal pattern portion M6 are formed using thin film formation technology, photolithography technology, etching technology, etc., and an input terminal T1, an output terminal T2, a ground terminal T3 and a terminal T4 are formed, and then a dicing process is performed to obtain multiple electronic components 100.

[0046] (5) Characteristics Fig. 8 shows the attenuation-frequency characteristics of the electronic component 100. The electronic component 100 can obtain the same attenuation-frequency characteristics as the LC filter in Fig. 7 in which the inductor L3 is formed separately from the first inductor L1 and the second inductor L2. In the electronic component 100, an attenuation pole is generated that is determined by the mutual inductance caused by the summation of the first inductor L1 and the second inductor L2 and the capacitance of the second capacitor C2. Furthermore, the electronic component 100 can reduce the insertion loss of the LC filter.

[0047] (6) Effects The electronic component 100 according to the first embodiment includes a substrate 1, an insulating layer 2, a first inductor L1, and a second inductor L2. The insulating layer 2 is provided on the substrate 1. The first inductor L1 includes a spiral first conductor pattern portion 11 provided in the insulating layer 2. The second inductor L2 includes a spiral second conductor pattern portion 12 provided in the insulating layer 2. The insulating layer 2 includes an interlayer insulating film 23 covering the first inductor L1, and the second conductor pattern portion 12 of the second inductor L2 is provided on the interlayer insulating film 23. The second conductor pattern portion 12 of the second inductor L2 has a first portion 121 that overlaps the first conductor pattern portion 11 of the first inductor L1 in a plan view from the thickness direction D1 of the substrate 1, and a second portion 122 that does not overlap the first conductor pattern portion 11 of the first inductor L1 in a plan view from the thickness direction D1 of the substrate 1. The second inductor L2 includes a third conductor pattern portion 13 formed in the interlayer insulating film 23 and having at least a portion overlapping the second portion 122 of the second conductor pattern portion 12.

[0048] According to the above configuration, it is possible to reduce the characteristic deterioration and achieve miniaturization. More specifically, in the electronic component 100 according to the first embodiment, the second inductor L2 includes the third conductor pattern portion 13, so that the resistance value of the second inductor L2 can be reduced and the Q value can be improved, making it possible to reduce the characteristic deterioration and achieve miniaturization.

[0049] Moreover, in the electronic component 100 according to the first embodiment, the first inductor L1 further includes a fourth conductor pattern portion 14 formed in the interlayer insulating film 23. The fourth conductor pattern portion 14 overlaps a portion of the first conductor pattern portion 11 that does not overlap the second conductor pattern portion 12 of the second inductor L2 in a plan view from the thickness direction D1 of the substrate 1.

[0050] According to the above configuration, it is possible to achieve miniaturization while further reducing deterioration in characteristics. More specifically, in the electronic component 100 according to the first embodiment, the resistance value of the first inductor L1 can be reduced and the Q value of the first inductor L1 can be improved, so that it is possible to achieve miniaturization while further reducing deterioration in characteristics.

[0051] (Embodiment 2) An electronic component 100A according to the second embodiment will be described with reference to Fig. 9. Regarding the electronic component 100A according to the second embodiment, the same components as those of the electronic component 100 according to the first embodiment (see Figs. 1 to 7) are denoted by the same reference numerals and description thereof will be omitted.

[0052] As shown in FIG. 9 , the electronic component 100A differs from the electronic component 100 of embodiment 1 in that, in a planar view from the thickness direction D1 of the substrate 1, in the second portion 122 of the second conductor pattern portion 12 of the second inductor L2, the width of the third conductor pattern portion 13 is wider than the width of the second conductor pattern portion 12.

[0053] The electronic component 100A according to embodiment 2 can be made smaller while reducing deterioration in characteristics, similar to the electronic component 100 according to embodiment 1. Moreover, in the electronic component 100A according to embodiment 2, the resistance value of the second inductor L2 can be reduced, thereby improving the characteristics.

[0054] (Modification) The above-mentioned embodiments 1 and 2 are merely one of various embodiments of the present invention. The above-mentioned embodiments 1 and 2 can be modified in various ways depending on the design, etc., as long as the object of the present invention can be achieved.

[0055] (Aspect) The present specification discloses the following aspects.

[0056] The electronic component (100; 100A) according to the first aspect includes a substrate (1), an insulating layer (2), a first inductor (L1), and a second inductor (L2). The insulating layer (2) is provided on the substrate (1). The first inductor (L1) includes a spiral first conductor pattern portion (11) provided in the insulating layer (2). The second inductor (L2) includes a spiral second conductor pattern portion (12) provided in the insulating layer (2). The insulating layer (2) includes an interlayer insulating film (23) covering the first inductor (L1). The second conductor pattern portion (12) of the second inductor (L2) is provided on the interlayer insulating film (23). The second conductor pattern portion (12) of the second inductor (L2) has a first portion (121) that overlaps with the first conductor pattern portion (11) of the first inductor (L1) in a plan view from the thickness direction (D1) of the substrate (1), and a second portion (122) that does not overlap with the first conductor pattern portion (11) of the first inductor (L1) in a plan view from the thickness direction (D1) of the substrate (1). The second inductor (L2) includes a third conductor pattern portion (13) that is formed in the interlayer insulating film (23) and at least a portion of which overlaps with the second portion (122) of the second conductor pattern portion (12).

[0057] According to this embodiment, it is possible to reduce the deterioration of characteristics and to achieve miniaturization.

[0058] In the electronic component (100; 100A) according to the second aspect, in the first aspect, the first inductor (L1) further includes a fourth conductor pattern portion (14). The fourth conductor pattern portion (14) is formed in the interlayer insulating film (23). The fourth conductor pattern portion (14) overlaps a portion of the first conductor pattern portion (11) that does not overlap the second conductor pattern portion (12) of the second inductor (L2) in a plan view from the thickness direction (D1) of the substrate (1).

[0059] According to this embodiment, it is possible to achieve miniaturization while further reducing deterioration in characteristics.

[0060] In the electronic component (100; 100A) according to the third aspect, in the first or second aspect, when viewed in a planar view from the thickness direction (D1) of the substrate (1), multiple portions of the second conductor pattern portion (12) and multiple portions of the first conductor pattern portion (11) are arranged alternately in the width direction of the second conductor pattern portion (12) and the first conductor pattern portion (11).

[0061] According to this embodiment, it is possible to increase the Q value of each of the first inductor (L1) and the second inductor (L2), thereby improving the characteristics.

[0062] In the electronic component (100; 100A) according to the fourth aspect, in any one of the first to third aspects, the conductor pattern portion (10) which is at least one of the first conductor pattern portion (11) and the second conductor pattern portion (12) has a narrow portion (10N) having a first width (W1) and a wide portion (10W) having a second width (W2) wider than the first width (W1). The narrow portion (10N) includes the first end (101) which is closer to the center of the first end (101) and the second end (102) of the conductor pattern portion (10). The wide portion (10W) includes the second end (102). At least one of the first portion (121) of the second conductor pattern portion (12) of the second inductor (L2) and the portion of the first inductor (L1) which overlaps with the first portion (121) includes a part of the narrow portion (10N).

[0063] According to this embodiment, it is possible to reduce the parasitic capacitance occurring between the first inductor (L1) and the second inductor (L2), and it is possible to reduce the deterioration of characteristics.

[0064] An electronic component (100; 100A) according to a fifth aspect is any one of the first to fourth aspects, and further includes a via conductor (V12) formed in the interlayer insulating film (23) and interposed between the first inductor (L1) and the second inductor (L2). In the electronic component (100), the first inductor (L1) and the second inductor (L2) are sum-connected by the via conductor (V12).

[0065] According to this embodiment, since a mutual inductance is formed between the first inductor (L1) and the second inductor (L2), it is possible to reduce the number of inductors.

[0066] In an electronic component (100; 100A) according to a sixth aspect, in any one of the first to fifth aspects, the area of ​​a first portion (121) of the second conductor pattern portion (12) is smaller than the area of ​​a second portion (122) of the second conductor pattern portion (12) in a planar view in the thickness direction (D1) of the substrate (1).

[0067] According to this embodiment, it is possible to reduce the parasitic capacitance occurring between the first inductor (L1) and the second inductor (L2), and it is possible to reduce the deterioration of characteristics.

[0068] In an electronic component (100; 100A) according to a seventh aspect, in any one of the first to sixth aspects, each of the first conductor pattern portion (11) and the second conductor pattern portion (12) has a first end (11a, 12a) on the central side and a second end (11b, 12b) on the outer periphery side. A second portion (122) of the second conductor pattern portion (12) of the second inductor (L2) is closer to the second end (12b) of the first end (12a) and the second end (12b).

[0069] According to this embodiment, it is possible to improve the characteristics of the second inductor (L2).

[0070] An electronic component (100) according to an eighth aspect is based on any one of the first to seventh aspects. In a plan view in the thickness direction (D1) of the substrate (1), in a second portion (122) of the second conductor pattern portion (12) of the second inductor (L2), a width (W3) of the third conductor pattern portion (13) is narrower than a width (W4) of the first conductor pattern portion (11).

[0071] According to this embodiment, the parasitic capacitance occurring between the third conductor pattern portion (13) and the first inductor (L1) can be reduced, and the characteristics can be improved.

[0072] The electronic component (100A) according to the ninth aspect is based on any one of the first to seventh aspects. In a plan view in the thickness direction (D1) of the substrate (1), in the second portion (122) of the second conductor pattern portion (12) of the second inductor (L2), the width (W3) of the third conductor pattern portion (13) is wider than the width (W4) of the first conductor pattern portion (11).

[0073] According to this embodiment, the resistance value of the second inductor (L2) can be reduced, and the characteristics can be improved.

[0074] An electronic component (100; 100A) according to a tenth aspect is any one of the first to ninth aspects, further comprising a capacitor (C1, C2). The capacitor (C1, C2) has a pair of electrodes (17, 18) provided in the insulating layer (2). The capacitor (C1, C2) is included in an LC filter together with a first inductor (L1) and a second inductor (L2). In a thickness direction (D1) of the substrate (1), the pair of electrodes (17, 18) of the capacitor (C1, C2) is located closer to the substrate (1) than the first inductor (L1).

[0075] In an electronic component (100; 100A) according to an eleventh aspect, in the tenth aspect, a pair of electrodes (17, 18) does not overlap with the first inductor (L1) and the second inductor (L2) when viewed in a planar view in the thickness direction (D1) of the substrate (1).

[0076] In the electronic component (100; 100A) of the twelfth aspect, in the eleventh aspect, a pair of electrodes (17, 18) of the capacitor (C1, C2) are located outside the second inductor (L2) when viewed in a planar view from the thickness direction (D1) of the substrate (1).

[0077] According to this embodiment, the magnetic fields generated by the first inductor (L1) and the second inductor (L2) are less likely to be blocked by the pair of electrodes (17, 18) of the capacitors (C1, C2), making it possible to reduce deterioration of characteristics. [Explanation of symbols]

[0078] 1 Board 2. Insulation layer 23 Interlayer insulating film 25 Protective film 10 Conductor pattern section 10N narrow part 10W wide section 101 1st end 102 2nd end 11 First conductor pattern portion 11a 1st end 11b 2nd end 12 Second conductor pattern portion 12a 1st end 12b 2nd end 121 Part 1 122 Part 2 13 Third conductor pattern section 14 Fourth conductor pattern section 17 electrodes 18 electrodes 19 Dielectric Film 100, 100A Electronic Components L1 First inductor L2 Second inductor L3 inductor C1 Capacitor D1 Thickness direction T1 input terminal T2 output terminal T3 Ground Terminal T4 terminal V1, V2, V3, V4 via conductors V12 via conductor V21, V22, V23, V24, V25 Via conductors V35 via conductor V45 via conductor W1 1st width W2 Second width W3 width W4 Width

Claims

1. A substrate; an insulating layer provided on the substrate; a first inductor including a spiral first conductor pattern portion provided in the insulating layer; a second inductor including a spiral second conductor pattern portion provided in the insulating layer, the insulating layer includes an interlayer insulating film covering the first inductor; the second conductor pattern portion of the second inductor is provided on the interlayer insulating film, The second conductor pattern portion of the second inductor is a first portion overlapping the first conductor pattern portion of the first inductor in a plan view in a thickness direction of the substrate; a second portion that does not overlap the first conductor pattern portion of the first inductor in a plan view from the thickness direction of the substrate, the second inductor includes a third conductor pattern portion formed in the interlayer insulating film and at least a portion of which overlaps the second portion of the second conductor pattern portion; Electronic components.

2. The first inductor is a fourth conductor pattern portion formed in the interlayer insulating film and overlapping a portion of the first conductor pattern portion that does not overlap the second conductor pattern portion of the second inductor in a plan view from the thickness direction of the substrate, The electronic component according to claim 1 .

3. a plurality of portions of the second conductor pattern portion and a plurality of portions of the first conductor pattern portion are alternately arranged in a width direction of the second conductor pattern portion and the first conductor pattern portion in a plan view in the thickness direction of the substrate; The electronic component according to claim 1 or 2.

4. At least one of the first conductor pattern portion and the second conductor pattern portion is a narrow portion having a first width; a wide portion having a second width greater than the first width, the narrow width portion includes a first end that is closer to a center than a second end of the conductor pattern portion, the wide portion includes the second end, at least one of the first portion of the second conductor pattern portion of the second inductor and a portion of the first inductor that overlaps with the first portion includes a part of the narrow portion; The electronic component according to claim 1 or 2.

5. a via conductor formed in the interlayer insulating film and interposed between the first inductor and the second inductor; The first inductor and the second inductor are summarily connected by the via conductor. The electronic component according to claim 1 or 2.

6. an area of ​​the first portion of the second conductor pattern portion is smaller than an area of ​​the second portion of the second conductor pattern portion in a plan view in the thickness direction of the substrate; The electronic component according to claim 1 or 2.

7. Each of the first conductor pattern portion and the second conductor pattern portion is A first end on a central side and a second end on an outer periphery side, the second portion of the second conductor pattern portion of the second inductor is closer to the second end than the first end or the second end; The electronic component according to claim 1 or 2.

8. In a plan view in the thickness direction of the substrate, in the second portion of the second conductor pattern portion of the second inductor, a width of the third conductor pattern portion is narrower than a width of the first conductor pattern portion. The electronic component according to claim 1 or 2.

9. In a plan view in the thickness direction of the substrate, in the second portion of the second conductor pattern portion of the second inductor, a width of the third conductor pattern portion is wider than a width of the first conductor pattern portion. The electronic component according to claim 1 or 2.

10. a capacitor having a pair of electrodes provided in the insulating layer and included in an LC filter together with the first inductor and the second inductor; In the thickness direction of the substrate, the pair of electrodes of the capacitor are located closer to the substrate than the first inductor. The electronic component according to claim 1 or 2.

11. the pair of electrodes do not overlap the first inductor and the second inductor in a plan view in the thickness direction of the substrate; The electronic component according to claim 10.

12. the pair of electrodes of the capacitor are located outside the second inductor in a plan view in the thickness direction of the substrate. The electronic component according to claim 11.

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