Conveyance teaching method and substrate processing system

Abstract

To provide a technology that can efficiently teach the conveyance position of conveyance equipment and improve the accuracy of conveyance of conveyed objects.SOLUTION: A conveyance teaching method teaches the conveyance position of a conveyance equipment in order to convey the conveyed object by the conveyance equipment. A conveyance teaching method includes the following processes: (A) moving the conveyance equipment to the conveyed object placed at a placement location and detecting the conveyed object with a sensor provided by the conveyance equipment, (B) calculating a position of the conveyed object based on the detected object, and (C) setting the conveyance position based on the calculated position of the conveyed object.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a transport teaching method and a substrate processing system. [Background technology]

[0002] Patent Document 1 discloses a substrate processing system (transfer system) in which a substrate, which is an object to be transferred, is transferred by a vacuum transfer robot (transfer device) in a vacuum transfer module, and the substrate is subjected to substrate processing in a process module.

[0003] In this substrate processing system, the central positions of all of the placement locations (e.g., placement tables of process modules) where substrates are received and transferred during setup and maintenance are taught to the transfer device, so that the substrate processing system can move the transfer device with high accuracy based on the taught positions when actually transferring substrates and performing substrate processing. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-132087 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique that can efficiently teach a transport position of a transport device and improve the transport accuracy of an object. Provide technology. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, there is provided a conveying teaching method for teaching a conveying position of a conveying device so that the conveying device can convey an object, the conveying teaching method including: (A) a step of moving the conveying device relative to the object placed on a placement location and detecting the object using a sensor provided on the conveying device; (B) a step of calculating a position of the object based on the detected object; and (C) a step of setting the conveying position based on the calculated position of the object. Effect of the Invention

[0007] According to one aspect, the transport position of the transport device can be efficiently taught, and the transport accuracy of the transported object can be improved. [Brief description of the drawings]

[0008] [Figure 1] 1 is a schematic plan view showing an example of the overall configuration of a substrate processing system according to an embodiment; [Diagram 2] Fig. 2(A) is a diagram showing a path mount according to an embodiment, Fig. 2(B) is a diagram showing a path mount according to a first modified example, and Fig. 2(C) is a diagram showing a path mount according to a second modified example. [Diagram 3] FIG. 2 is an enlarged plan view showing the fork and the substrate of the vacuum transport device. [Figure 4] FIG. 2 is a plan view showing a path for transporting substrates to processing modules in the rear area. [Diagram 5] Fig. 5(A) is a plan view showing a state in which a substrate is placed on a path placement section by a first transport device, Fig. 5(B) is a side view showing a substrate scanning operation by a second transport device, and Fig. 5(C) is a plan view showing a substrate scanning operation by the second transport device. [Figure 6] 10 is a flowchart showing a conveyance teaching method for the second conveyance device. [Figure 7] Fig. 7(A) is a plan view showing a retreating operation of the second conveying device in the conveying teaching method, Fig. 7(B) is a plan view showing a correction operation of the second conveying device in the conveying teaching method, and Fig. 7(C) is a plan view showing rescanning by the second conveying device in the conveying teaching method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated descriptions may be omitted.

[0010] Fig. 1 is a schematic plan view showing an example of the overall configuration of a substrate processing system 1 according to an embodiment. As shown in Fig. 1, the substrate processing system 1 is a multi-chamber type semiconductor manufacturing apparatus including a plurality of processing modules 10. Each processing module 10 performs substrate processing such as film formation processing, etching processing, cleaning processing, etc. on a substrate W, which is an example of a transfer object. In addition to each processing module 10, the substrate processing system 1 also includes a vacuum transfer module 20, a plurality of load lock modules 30, an atmospheric transfer module 40, a load port 50, and a control device 90.

[0011] Each processing module 10 carries the substrate W in and out of the vacuum transfer module 20, and performs substrate processing on the substrate W while the substrate W is housed therein. The processing modules 10 in the substrate processing system 1 may perform the same processing, or some or all of the processing modules 10 may perform different processing. The substrate processing system 1 may be configured to perform plasma processing in some or all of the processing modules 10.

[0012] Specifically, each processing module 10 has a processing vessel 11 that accommodates the substrate W, and a mounting table 12 on which the substrate W is placed inside the processing vessel 11. The mounting table 12 includes a lifter (e.g., a plurality of pins) (not shown) that raises and lowers the substrate W, and receives and delivers the substrate W in cooperation with a vacuum transfer device 22 described below.

[0013] Each processing module 10 also includes a connection part 13 that connects the processing vessel 11 and the vacuum transfer module 20, and a processing module sensor 14 that detects the substrate W. The connection part 13 has a gate valve (not shown) therein that opens and closes the opening 11a of the processing vessel 11. Each processing module 10 can transfer the substrate W to the processing vessel 11 through the connection part 13 by opening the gate valve, and can reduce the pressure inside the processing vessel 11 to an appropriate vacuum atmosphere by closing the gate valve.

[0014] The processing module side sensor 14 detects the outer edge of the substrate W when the substrate W is transported between each processing module 10 and the vacuum transfer module 20, and transmits the detection information to the control device 90. The control device 90 can calculate the center position of the substrate W based on the detection information of each processing module side sensor 14, and can recognize the deviation of the center position of the substrate W being transported by the vacuum transfer device 22. The processing module side sensor 14 is provided, for example, in a position adjacent to the opening 11a of each processing module 10 in the vacuum transfer module 20. The processing module side sensor 14 may be provided inside the connection portion 13, or may be provided in a position adjacent to the opening 11a in the processing module 10.

[0015] The processing module side sensor 14 has two detectors 141, 142 for detecting the presence or absence of the substrate W. For example, each detector 141, 142 includes a light-emitting section that emits light for measurement and a light-receiving section that receives the light from the light-emitting section across the path through which the substrate W passes (both not shown), and detects the presence of the substrate W when the light for measurement is blocked based on the passage of the substrate W. The two detectors 141, 142 are aligned in a direction parallel to the opening 11a and are arranged such that the distance between them is shorter than the diameter of the substrate W. The principle of calculating the position of the substrate W by detection by the processing module side sensor 14 is the same as that of each fork side sensor 227 of the vacuum transport device 22 described later, and will be described in detail later.

[0016] The vacuum transfer module 20 of the substrate processing system 1 is depressurized to a vacuum atmosphere. The vacuum transfer module 20 includes a transfer container 21 connected to each of the processing modules 10 and the plurality of load lock modules 30, and a vacuum transfer device 22 that transfers the substrate W in the transfer container 21.

[0017] Moreover, the vacuum transfer module 20 according to the embodiment divides the internal space of the transfer container 21 into three transfer regions along the longitudinal direction. Specifically, the vacuum transfer module 20 includes a front region 21A, a pass region 25, and a rear region 21B in this order in the direction away from the adjacent position of the load lock module 30. However, the front region 21A, the pass region 25, and the rear region 21B are not separated by a partition or the like, and are spatially connected within the transfer container 21.

[0018] The front area 21A is a first area of ​​the vacuum transfer module 20 that transfers the substrate W between multiple (four in FIG. 1) processing modules 10, the pass area 25, and multiple load lock modules 30. A first transfer device 22A, which is a vacuum transfer device 22, is installed in the front area 21A. Note that the number of processing modules 10 connected to the front area 21A is not limited to four, and can be set to any number.

[0019] The rear area 21B is a second area of ​​the vacuum transfer module 20 that transfers the substrate W between a plurality of (four in FIG. 1) processing modules 10 and the pass area 25. A second transfer device 22B that is a vacuum transfer device 22 is installed in the rear area 21B. The number of processing modules 10 connected to the rear area 21B is not limited to four, and may be set to any number. The number of transfer areas of the vacuum transfer device 22 is not limited to three (the front area 21A, the pass area 25, and the rear area 21B), and may be four or more areas. For example, the vacuum transfer module 20 may be provided with a transfer area having the vacuum transfer device 22 via another pass area 25 on one side (such as the upper side in FIG. 1) of the rear area 21B.

[0020] The pass area 25 is a placement location prepared for receiving and transferring the substrate W between the first transport device 22A in the front area 21A and the second transport device 22B in the rear area 21B. Specifically, the pass area 25 has a plurality of pass placement sections 26 (two in FIG. 1) on which the substrate W is temporarily placed. The first transport device 22A places the substrate W held on the pass placement section 26, and the second transport device 22B holds the substrate W on the pass placement section 26, thereby completing the transfer of the substrate W from the first transport device 22A to the second transport device 22B. Conversely, the second transport device 22B places the substrate W held on the pass placement section 26, and the first transport device 22A holds the substrate W on the pass placement section 26, thereby completing the transfer of the substrate W from the second transport device 22B to the first transport device 22A.

[0021] Fig. 2(A) is a diagram showing a path mounting unit 26 according to an embodiment. Fig. 2(B) is a diagram showing a path mounting unit 26A according to a first modified example. Fig. 2(C) is a diagram showing a path mounting unit 26B according to a second modified example. Note that in Figs. 2(A) to 2(C), the upper figures are plan views, and the lower figures are cross-sectional views taken along line AA of the upper figures.

[0022] 2(A), the path platform 26 according to the embodiment has a platform 261 that is circular in plan view, and a support 262 that is connected to the bottom surface of the platform 261. The platform 261 has a flat upper surface and is a circular plate whose diameter is smaller than the diameter of the substrate W. By placing the central region of the substrate W on the top surface of the platform 261, the path platform 26 can stably support the substrate W.

[0023] However, the substrate processing system 1 is not particularly limited in the configuration of the path platform 26, and various modifications are possible. For example, the path platform 26A according to a first modification shown in Fig. 2(B) has a pair of shelf plates 263 supporting the outer edge of the substrate W, instead of the platform 261 supporting the central region of the substrate W in Fig. 2(A). The pair of shelf plates 263 extend parallel to each other and are spaced apart by a distance shorter than the diameter of the substrate W. Even in this case, the pair of shelf plates 263 can stably support the outer edge of the substrate W.

[0024] Also, for example, the path platform 26B according to the second modified example shown in FIG. 2(C) has a plurality of support pins 264 (three in FIG. 2(C)) that support the central region of the substrate W. The support pins 264 are provided, for example, at positions constituting the vertices of an equilateral triangle, so as to be at the same height as one another. This allows the support pins 264 to stably support the lower surface of the central region of the substrate W. Note that each support pin 264 is configured to be capable of rising and falling relative to a floor portion (not shown) from which the support pins 264 protrude, and may rise to receive the substrate W when the substrate W enters upward, and may conversely fall to hand over the substrate W. This type of lifting and lowering function may be provided in the path platform 26 in FIG. 2(A) or the path platform 26A in FIG. 2(B).

[0025] Returning to FIG. 1, the vacuum transfer module 20 forms a pass area 25 by arranging two pass placement units 26 side by side in the short direction at the middle position in the longitudinal direction of the transfer container 21, and divides the front area 21A and the rear area 21B. In the vacuum transfer module 20, the place having the pass placement unit 26 in the transfer container 21 may be simply the pass area 25, or the pass area 25 may be spatially separated from the front area 21A and the rear area 21B by a partition wall (not shown). In this case, it is preferable that the partition wall is provided with an opening and a gate valve for opening and closing the opening. In addition, the vacuum transfer module 20 may be configured to have multiple transfer areas by connecting multiple transfer containers 21 (a transfer container having the front area 21A, a transfer container having the pass area 25, and a transfer container having the rear area 21B).

[0026] The vacuum transfer devices 22 (first transfer device 22A, second transfer device 22B) of the vacuum transfer module 20 are configured to operate independently. Each vacuum transfer device 22 has a base 221 that can move in the longitudinal direction of the transfer container 21, a plurality of arms 222 that can rotate, expand, contract, and move up and down relative to the base 221, and a fork (end effector) 223 provided on the arm 222 on the distal end side. Note that, although FIG. 1 illustrates a vacuum transfer device 22 equipped with two forks 223, the present invention is not limited thereto, and the vacuum transfer device 22 may be configured to have one or three or more forks 223.

[0027] Fig. 3 is an enlarged plan view showing the fork 223 and the substrate W of the vacuum transfer device 22. As shown in Fig. 3, the vacuum transfer device 22 supports the substrate W on the upper surface of the fork 223, and transfers the substrate W by appropriately operating the base 221 and each arm 222 (see Fig. 1).

[0028] The fork 223 includes a base plate 224 connected to the arm 222 on the distal end side, and a pair of support plates 225 extending from the base plate 224 in two directions. The base plate 224 and the pair of support plates 225 are integrally formed with each other and are continuous in the horizontal direction, forming a U-shape in plan view. The pair of support plates 225 are formed parallel to each other and have the same length. The distance between the pair of support plates 225 is greater than the diameter of the mounting table 261 of the path mounting unit 26 described above (see also FIG. 2(A)). The fork 223 has a recessed space 223s surrounded by the base plate 224 and the pair of support plates 225. This recessed space 223s is open at the tips (extending ends) of the pair of support plates 225.

[0029] The fork 223 thus configured can be raised and lowered relative to the mounting table 261 of the path mounting unit 26, for example, through the recessed space 223s. Therefore, the vacuum transfer device 22 can place the substrate W directly above the mounting table 261 using the fork 223, and place the substrate W on the upper surface of the mounting table 261 by lowering the fork 223. Conversely, the vacuum transfer device 22 can receive the substrate W on the fork 223 by moving the fork 223 below the mounting table 261 on which the substrate W is placed, and then raising the fork 223.

[0030] Furthermore, the fork 223 includes a plurality of pads 226 on the upper surfaces of the base plate portion 224 and the support plate portion 225. For example, the plurality of pads 226 are provided at a widthwise intermediate position of the base plate portion 224 and at the tip sides of the pair of support plate portions 225, thereby directly supporting three portions of the substrate W. The plurality of pads 226 may be formed of a material (such as an elastomer) having appropriate frictional force and elasticity. Furthermore, the fork 223 may include a holding means, such as suction, electrostatic adsorption, or a mechanical locking mechanism, for holding the substrate W using the plurality of pads 226 (or instead of the plurality of pads 226).

[0031] When the vacuum transfer device 22 supports the substrate W with the fork 223, the fork 223 is moved so that the center position Wc of the substrate W is aligned with a reference position 223c preset on the fork 223. The position to which the fork 223 of the vacuum transfer device 22 moves to support or place the substrate W corresponds to the "transfer position" in the embodiment. The vacuum transfer device 22 moves the fork 223 so that the reference position 223c is aligned with the transfer position, and contacts the substrate W, thereby enabling the substrate W to be stably supported.

[0032] The fork 223 according to the embodiment includes a plurality of fork-side sensors 227 (two in FIG. 2) for detecting the substrate W, which is a transported object, on a surface (lower surface) opposite to the surface supporting the substrate W. In detail, each fork-side sensor 227 is provided near the extending end (tips of the fork 223) of the pair of support plate portions 225, and has a detector for detecting an object present (facing) below the fork 223 in the vertical direction (see also FIG. 5B). Each fork-side sensor 227 is communicatively connected to the control device 90, performs detection under the control of the control device 90, and transmits the detection information to the control device 90.

[0033] For example, each fork side sensor 227 according to the embodiment is a displacement sensor that optically measures the distance from the fork 223 to an object. In this case, each fork side sensor 227 has a light emitting unit and a light receiving unit as a detector, and measures the distance to the object based on the light intensity or wavelength of the detection light projected by the light emitting unit and reflected by the object. Therefore, when the fork side sensor 227 continues detection while the fork 223 moves above the substrate W, the fork side sensor 227 can detect a change in distance at the outer edge of the substrate W, and the control device 90 can recognize the outer edge of the substrate W based on this detection information. Then, the control device 90 can calculate the center position of the substrate W based on the detection information of multiple points on the outer edge of the substrate W by a calculation method described later.

[0034] In addition, since the substrate processing system 1 is only required to acquire the center position of the substrate W to be transported, the type of each fork side sensor 227 is not particularly limited. Other examples of each fork side sensor 227 include an on-off sensor that detects the outer edge of the substrate W based on the transmission or blocking of detection light, and a capacitance sensor that detects a change in capacitance when the substrate W passes above. Alternatively, each fork side sensor 227 may be an infrared sensor, an ultrasonic sensor, a radar, a camera, or the like. In addition, the substrate processing system 1 is not particularly limited with respect to the position or number of the fork side sensors 227 installed on the fork 223. For example, if one camera is applied to the fork side sensor 227 to capture an image of a part of the outer edge of the substrate W, the center position of the substrate W can be calculated.

[0035] 1, the vacuum transfer device 22 (first transfer device 22A, second transfer device 22B) transfers the substrate W from an appropriate load lock module 30 to an appropriate processing module 10 under the control of the control device 90. Also, the vacuum transfer device 22 transfers the substrate W from an appropriate processing module 10 to an appropriate load lock module 30 under the control of the control device 90. Furthermore, the vacuum transfer device 22 may transfer the substrate W between two processing modules 10.

[0036] The two load lock modules 30 of the substrate processing system 1 are provided between the vacuum transfer module 20 and the atmospheric transfer module 40, and switch the interior between an atmospheric atmosphere and a vacuum atmosphere. Specifically, each load lock module 30 includes a container 31 for accommodating a substrate W, and a mounting table 32 for mounting the substrate W inside the container 31. For example, the mounting table 32 includes a groove (not shown) into which the fork 223 of the first transfer device 22A and the fork 423 of the atmospheric transfer device 42 described later can enter, and the substrate W is received and transferred by the advancement and retreat and elevation of the forks 223, 423. The mounting table 32 may be configured to include a lifter, similar to the mounting table 12 of the processing module 10.

[0037] Each load lock module 30 has a connection part 33 on the vacuum transfer module 20 side and a connection part 35 on the atmospheric transfer module 40 side. The connection parts 33 and 35 have gate valves (not shown) therein for opening and closing the opening of the container 31. Each load lock module 30 communicates with the vacuum transfer module 20 by opening the gate valve of the connection part 33 in a vacuum atmosphere state. Each load lock module 30 also communicates with the atmospheric transfer module 40 by opening the gate valve of the connection part 35 in an atmospheric atmosphere state.

[0038] The atmospheric transfer module 40 of the substrate processing system 1 maintains an atmospheric atmosphere inside. The atmospheric transfer module 40 includes a transfer container 41 connected to each load lock module 30, and an atmospheric transfer device 42 that transfers the substrate W in the transfer container 41. The atmospheric transfer module 40 may form a downflow of clean air inside the transfer container 41. The atmospheric transfer module 40 also includes an aligner 43 on the side that aligns the substrate W.

[0039] Furthermore, a plurality of load ports 50 are provided on the wall surface of the atmospheric transfer module 40. A carrier C accommodating a substrate W or an empty carrier C is attached to each load port 50. For example, a FOUP (Front Opening Unified Pod) or the like can be used as the carrier C. Furthermore, a carrier C accommodating a ring R (focus ring, edge ring, etc.), which is an example of a transport object, may be attached to each load port 50. The ring R is disposed around the substrate W on the mounting table 12 of the processing module 10.

[0040] The atmospheric transfer device 42, like the vacuum transfer device 22, has a base 421 movable in the longitudinal direction of the transfer container 41, a plurality of arms 422 that can rotate, expand, and contract, and move up and down relative to the base 421, and a fork (end effector) 423 provided on the arm 422 at the distal end. The atmospheric transfer device 42 supports the substrate W on the upper surface of the fork 423, and transfers the substrate W by appropriately operating the base 421 and each arm 422. Note that, although FIG. 1 illustrates an atmospheric transfer device 42 equipped with two forks 423, the present invention is not limited thereto, and the atmospheric transfer device 42 may have a configuration equipped with one or three or more forks 423.

[0041] The atmospheric transfer device 42 transfers the substrate W between each load lock module 30 and the atmospheric transfer module 40 in response to opening and closing of the gate valves of each connection part 35. The atmospheric transfer device 42 also transfers the substrate W between the aligner 43 and the atmospheric transfer module 40. Furthermore, the atmospheric transfer device 42 transfers the substrate W between each carrier C attached to each load port 50 and the atmospheric transfer module 40.

[0042] The control device 90 is a computer having a processor 91, a memory 92, and an input / output interface and a communication interface (not shown). The processor 91 is a combination of one or more of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), a circuit made of a plurality of discrete semiconductors, and executes and processes a program stored in the memory 92. The memory 92 includes a main storage device made of a semiconductor memory or the like, and an auxiliary storage device made of a disk, a semiconductor memory (flash memory), or the like.

[0043] For example, the control device 90 transfers the substrate W of the unprocessed carrier C attached to the load port 50 to the aligner 43 by the atmospheric transfer device 42 to align it, and further transfers the substrate W of the aligner 43 to one of the load lock modules 30. Then, the control device 90 reduces the pressure of the load lock module 30 containing the substrate W, and then removes the substrate W by the vacuum transfer device 22 and transfers the substrate W to one of the processing modules 10 via the vacuum transfer module 20. Thereafter, the control device 90 performs substrate processing in each processing module 10 into which the substrate W has been transferred. Then, after the substrate processing, the control device 90 transfers the substrate W of the one processing module 10 to the carrier C for accommodating the processed substrate W by reversing the above procedure.

[0044] Fig. 4 is a plan view showing a path for transporting the substrate W to the processing module 10 in the rear area 21B. As shown in Fig. 4, the substrate processing system 1 can transport the substrate W from the load port 50 of the atmospheric transfer module 40 to a target processing module 10 in the rear area 21B, and perform substrate processing by the processing module 10. In this case, the control device 90 controls the atmospheric transfer device 42, the first transfer device 22A, and the second transfer device 22B, respectively, to transport the substrate W.

[0045] Specifically, the controller 90 causes the first transfer device 22A to take out the substrate W that has been transferred from the aligner 43 to one load lock module 30 by the atmospheric transfer device 42, and transfers it within the front area 21A. Then, the controller 90 causes the first transfer device 22A to place the substrate W on one pass platform 26 in the pass area 25. Furthermore, the controller 90 causes the second transfer device 22B to take out the substrate W from the pass platform 26, transfer it within the rear area 21B, and load and place the substrate W into the target processing module 10.

[0046] Here, the substrate processing system 1 has errors that occur when it is installed in a factory or the like, dimensional errors of each structure, and machine differences between each device, which cause deviations from the preset transfer positions and reduce the transfer accuracy of the substrate W. For this reason, the substrate processing system 1 performs a teaching process for teaching the transfer positions of each of the vacuum transfer device 22 (first transfer device 22A, second transfer device 22B) and the atmospheric transfer device 42 when setting up the system or performing maintenance.

[0047] For example, when teaching the second transport device 22B the transport position of one pass platform 26, in the conventional teaching process, the fork 223 is raised and lowered vertically and slid horizontally near the one pass platform 26, the outer edge of the platform 261 is detected by the fork side sensor 227, and the center position of the platform 261 is calculated based on the detection information. When the second transport device 22B actually receives the substrate W from the pass platform 26, the fork 223 is operated so that the calculated center position of the platform 261 coincides with the reference position 223c of the fork 223, thereby enabling the substrate W to be supported with high accuracy. However, the control device 90 performs the same teaching process for each process module 10 and each pass platform 26, and the second transport device 22B is operated in various ways for each teaching process, which causes inconveniences such as a long time required for the teaching process.

[0048] Furthermore, in the substrate processing system 1, the center position Wc of the substrate W is likely to shift from the center position 26c of the path platform 26, and the amount of shift may become large. This is because the atmospheric transfer device 42 places the substrate W in the load lock module 30, and the first transfer device 22A transfers the substrate W from the load lock module 30 to the path platform 26, and the errors of the atmospheric transfer device 42 and the first transfer device 22A appear in the path platform 26. In other words, in a vacuum transfer module 20 employing a plurality of vacuum transfer devices 22, the substrate W is likely to shift significantly in the vacuum transfer device 22 (second transfer device 22B) installed away from the load lock module 30.

[0049] In the substrate processing system 1 according to the embodiment, for example, in a teaching process for the second transport device 22B when receiving a substrate W from the path platform 26, the substrate W actually placed on the path platform 26 by the first transport device 22A is used to teach the second transport device 22B a transport position. This makes it possible to set the transport position of the second transport device 22B in accordance with the actual deviation of the substrate W, thereby improving transport accuracy. Hereinafter, the principle of the transport teaching method for teaching a transport position using the substrate W will be described with reference to Figs. 5(A) to 5(C).

[0050] FIG. 5(A) is a plan view showing a state where the substrate W is placed on the path platform 26 by the first transfer device 22A. FIG. 5(B) is a side view showing the scanning operation of the substrate W by the second transfer device 22B. FIG. 5(C) is a plan view showing the scanning operation of the substrate W by the second transfer device 22B. As shown in FIG. 5(A), when the first transfer device 22A places the substrate W supported by the fork 223 on the path platform 26, the substrate W may be placed with the center position Wc of the substrate W shifted from the center position 26c of the path platform 26. This is because, as described above, an error due to the atmospheric transfer device 42 and an error due to the first transfer device 22A are recorded until the substrate W is transported to the path platform 26.

[0051] In order to teach the transport position when the second transport device 22B receives the substrate W from the path platform 26, the control device 90 detects (scans) the substrate W placed on the path platform 26 by the second transport device 22B in a transport teaching method as shown in Fig. 5(B). In detail, the control device 90 acquires detection information of the pair of fork side sensors 227 while sliding the second transport device 22B horizontally and linearly above the vertical direction of the substrate W. At this time, the linear movement of the second transport device 22B is controlled so that the reference position 223c (center) of the fork 223 passes through a design position preset on the path platform 26.

[0052] As shown in FIG. 5(C), each of the fork side sensors 227 provided near the tip of each support plate portion 225 of the second transfer device 22B detects the outer edge of the substrate W by passing above the substrate W. Specifically, when passing above the substrate W, the pair of fork side sensors 227 transmit to the control device 90 the timing at which the distance changes from a long distance to a short distance and the timing at which the distance changes from a short distance to a long distance. In addition, in scanning the second transfer device 22B, the control device 90 recognizes the position of the fork 223 based on the operation of each arm 222 of the second transfer device 22B, in other words, the position (three-dimensional coordinates) of each fork side sensor 227. The control device 90 detects two points Wd (see white stars in FIG. 5(C)) on the outer edge of the substrate W by linking the timing of the detection information of the fork side sensor 227 with the recognized position of the fork side sensor 227. In other words, the control device 90 can detect the positions of four points Wd in total on the outer edge of the substrate W by the pair of fork side sensors 227.

[0053] Then, the control device 90 can use the positions of the detected four points Wd to calculate the center position Wc (see the black stars in FIG. 5(C)) of the substrate W. For example, the control device 90 can calculate normal lines extending radially inward from each of the detected four points Wd, and calculate the point where the normal lines intersect with each other as the center position of the substrate W.

[0054] This enables the control device 90 to recognize the deviation (amount of deviation and direction of deviation) between the calculated center position of the substrate W and the center position of the mounting table 261 of the path mounting section 26, and can correct the transport position of the second transport device 22B to eliminate this deviation.

[0055] The substrate processing system 1 according to the embodiment is basically configured as described above, and its operation (transport teaching method) will be described below with reference to Figs. 6 and 7. Fig. 6 is a flow chart showing the transport teaching method of the second transport device 22B. Fig. 7(A) is a plan view showing the retreating operation of the second transport device 22B in the transport teaching method. Fig. 7(B) is a plan view showing the correction operation of the second transport device 22B in the transport teaching method. Fig. 7(C) is a plan view showing rescanning by the second transport device 22B in the transport teaching method.

[0056] When teaching a transfer position in the second transfer device 22B, the control device 90 of the substrate processing system 1 first transfers the substrate W by the atmospheric transfer device 42 and the first transfer device 22A, and places the substrate W on the path placement unit 26 to be taught (step S101). As a result, the substrate W is placed on the placement table 261 of the path placement unit 26 in a shifted state so as to include an error of the atmospheric transfer device 42 and an error of the first transfer device 22A (see also FIG. 5(A)).

[0057] When the substrate W is placed on the path placement unit 26, the control device 90 activates a mode for carrying out a teaching process by the second transfer device 22B (step S102). As a result, the control device 90 operates the second transfer device 22B and starts a teaching process for correcting the transfer position based on the detection information of the fork side sensor 227.

[0058] In the teaching process, the control device 90 operates each arm 222 of the second transfer device 22B to move the fork 223, and during this movement, each fork side sensor 227 detects (scans) the substrate on the path placement unit 26 (step S103). At this time, the second transfer device 22B moves the fork 223 straight toward a height position vertically above the placement table 261, that is, toward the center position 26c of the placement table 261 (see also FIG. 5(B)). This allows each fork side sensor 227 to detect four points Wd on the outer edge of the substrate W (see also FIG. 5(C)).

[0059] Then, the control device 90 acquires the detection information of each fork side sensor 227, calculates the center position of the substrate W based on the detected positions of the four points Wd of the substrate W, and further calculates the deviation of the center position from the reference position 223c of the fork 223 (step S104). As described above, the deviation of the substrate W is calculated by the deviation direction and deviation amount.

[0060] Thereafter, the control device 90 compares the calculated amount of deviation of the substrate W with a threshold stored in advance to determine whether the amount of deviation is less than the threshold (step S105). The threshold is preferably set to a value at which the center position Wc of the substrate W coincides with the reference position 223c of the fork 223 and the fork 223 can stably support the substrate W, and may be set to an appropriate value within the range of 0.1 mm to 1.0 mm, for example. If the amount of deviation is equal to or greater than the threshold (step S105: NO), the control device 90 proceeds to step S106, whereas if the amount of deviation is less than the threshold (step S105: YES), the control device 90 proceeds to step S108.

[0061] In step S106, the controller 90 performs a retreat operation to retreat the fork 223 of the second transport device 22B relative to the substrate W placed on the path platform 26 (see FIG. 7(A)).

[0062] After step S106, the control device 90 corrects the transfer position of the second transfer device 22B based on the calculated deviation direction and deviation amount (step S107). For example, the control device 90 calculates vector components in the X-axis direction and the Y-axis direction based on the deviation direction and deviation amount. Then, as shown in FIG. 7B, when the fork 223 of the second transfer device 22B is deviated in the X-axis direction, the control device 90 moves the reference position 223c of the fork 223 to a position that eliminates the deviation amount in the X-axis direction.

[0063] After performing step S107, the control device 90 returns to step S103 in Fig. 6 and repeats the same process flow thereafter. If the forks 223 of the second transfer device 22B are misaligned in the Y-axis direction, the advancement amount of the reference position 223c of the forks 223 may be changed so as to eliminate the amount of misalignment in the Y-axis direction in step S103. This allows the second transfer device 22B to detect the outer edge of the substrate W on the path placement unit 26 again by the fork side sensors 227.

[0064] By the second and subsequent operations of the second transport device 22B, the detection information detected by each fork side sensor 227 becomes the position of the outer edge of the substrate W obtained by correcting the previous detection information of the substrate W. The control device 90 calculates the center position Wc of the substrate W based on this corrected position of the outer edge of the substrate W, thereby obtaining a position where the deviation of the center position Wc of the substrate W relative to the reference position 223c of the fork 223 is almost eliminated. Therefore, in step S105, the control device 90 can determine a substrate W for which the amount of deviation is less than the threshold value.

[0065] If the deviation amount is equal to or greater than the threshold even after the second or subsequent processing flow is performed, steps S106 and S107 are performed again, and the process returns to step S103 and is repeated. If the deviation of the substrate W is equal to or greater than the threshold even after the flow of correcting the position of the substrate W and performing scanning again is repeated multiple times, there is a possibility that an abnormality has occurred in the second transport device 22B or the path platform 26. For this reason, the control device 90 may transition to a process of notifying the user of an abnormality when the flow of correcting the position of the substrate W and performing scanning again has been repeated a set number of times.

[0066] Through the above process, the center position Wc of the substrate W placed on the path platform 26 is aligned with the reference position 223c of the fork 223 of the second transport device 22B, allowing the second transport device 22B to transport the substrate W. That is, the control device 90 sets the center position Wc of the substrate W as the transport position of the path platform 26, and updates the transport position of the path platform 26 of the second transport device 22B that has been set up until now (step S108).

[0067] This causes the control device 90 to end the current teaching process mode for the second transfer device 22B (step S109). After the end of the transport teaching method for the second transfer device 22B, the substrate processing system 1 may operate the second transfer device 22B based on the reset transport position to receive the substrate W from the path platform 26 and transport the substrate W to an appropriate processing module 10. At this time, the substrate processing system 1 can detect the substrate W supported by the fork 223 using the processing module side sensor 14 and verify whether the substrate W is supported with precision. This allows the transport state of the substrate W by the second transfer device 22B to be reconfirmed, making it possible to improve the transport precision.

[0068] By performing the above-described transport teaching method, the substrate processing system 1 can transport the substrate W with high precision by the second transport device 22B when actually transporting the substrate W for substrate processing. Even during the process of transporting the substrate W from the path platform 26 and supported by the second transport device 22B into the processing module 10, the position of the substrate W is detected by the processing module side sensor 14, and any deviation of the substrate W is corrected. Therefore, the substrate processing system 1 can place the substrate W in the processing module 10 with even higher precision.

[0069] Furthermore, the technology disclosed herein is not limited to the above-mentioned substrate processing system 1 and transport teaching method, and various modifications are possible. For example, in the transport teaching method, an example has been described in which the transport position of the second transport device 22B is corrected for the substrate W transported from the load lock module 30 to the path platform 26 by the first transport device 22A. However, the above-mentioned transport teaching method may also be implemented when the substrate W is transported from the processing module 10 in the front area 21A to the path platform 26. This is because the substrate W may be misaligned even when only transported by the first transport device 22A.

[0070] Furthermore, the above-mentioned transport teaching method is not limited to the second transport device 22B receiving the substrate W on the path mounting part 26. For example, when the second transport device 22B mounts the substrate W on the mounting table 12 of the processing module 10, the transport position of the mounted substrate W may be detected by the fork side sensor 227, and the transport position of the substrate W in the processing module 10 may be corrected based on the detection information.

[0071] Alternatively, the above-mentioned transport teaching method may be applied when correcting the transport position in the first transport device 22A or the atmospheric transport device 42. As an example, when the first transport device 22A takes out the substrate W from the load lock module 30, the first transport device 22A may correct the transport position of the substrate W using the above-mentioned transport teaching method. Moreover, when the second transport device 22B takes out the substrate W from the processing module 10 and places the substrate W on the path placement part 26, the first transport device 22A may correct the transport position of the substrate W using the above-mentioned transport teaching method. Furthermore, when the first transport device 22A places the substrate W on the placement table 12 of the processing module 10, the fork side sensor 227 may detect the transport position of the placed substrate W, and may correct the transport position of the substrate W in the processing module 10 based on the detection information.

[0072] Therefore, the substrate processing system 1 may have a configuration in which the vacuum transfer module 20 includes one vacuum transfer device 22 (first transfer device 22A) and does not include the rear area 21B or the pass area 25.

[0073] Furthermore, in the substrate processing system 1, the transported object transported by the vacuum transport device 22 or the atmospheric transport device 42 is not limited to the substrate W, and may be something else. For example, another example of the transported object is a ring R (see FIG. 1) arranged around the substrate W.

[0074] The technical ideas and effects of the present disclosure explained in the above embodiments will be described below.

[0075] A first aspect of the present disclosure is a transport teaching method for teaching a transport position of a transport device (vacuum transport device 22) in order to transport a transport object (substrate W) by the transport device, and includes the steps of (A) moving the transport device relative to the transport object placed on a placement location (path placement section 26) and detecting the transport object using a sensor (fork side sensor 227) provided on the transport device, (B) calculating the position of the transport object based on the detected transport object, and (C) setting the transport position based on the calculated position of the transport object.

[0076] According to the above, the transport teaching method uses a sensor (fork side sensor 227) of the transport device (vacuum transport device 22) to calculate the position of the transport object (substrate W) placed at the placement location, thereby making it possible to recognize the position of the transport object at the placement location instead of the position of the placement location itself. Since the position of this transport object includes a deviation of the transport object, by setting the transport position to eliminate the deviation, the transport device can appropriately support and transport the transport object. As a result, the transport teaching method can efficiently teach the transport position and significantly improve the transport accuracy of the transport object.

[0077] In step (B), the deviation between the calculated position of the transport object (substrate W) and the set position is calculated, the position of the transport device (vacuum transport device 22) is corrected based on the calculated deviation, and steps (A) and (B) are performed again after the correction to recalculate the position of the transport object. This allows the transport teaching method to further improve the transport accuracy of the transport object.

[0078] Furthermore, after step (B), there is a step of comparing the amount of deviation of the transported object (substrate W) with a threshold value, and if the amount of deviation is equal to or greater than the threshold value, the position of the transport device (vacuum transport device 22) is corrected based on the calculated deviation, and steps (A) and (B) are performed again after the correction to recalculate the position of the transported object, while if the amount of deviation is less than the threshold value, step (C) is performed. This allows the transport teaching method to smoothly set the transport position when the deviation of the transported object is less than the threshold value, making it possible to more efficiently teach the transport position.

[0079] In step (A), the sensor (fork side sensor 227) detects the outer edge of the transported object (substrate W), and in step (B), the center position Wc of the transported object is calculated as the position of the transported object based on the detected outer edge of the transported object. By calculating the center position Wc of the transported object in this manner, the transport teaching method can easily monitor the deviation of the transported object.

[0080] In step (A), the transport device (vacuum transport device 22) is moved linearly above the transport object (substrate W) in the vertical direction, while detecting multiple points on the outer edge of the transport object placed on the placement location with a sensor (fork side sensor 227), and in step (B), the center position Wc of the transport object is calculated from the multiple points on the outer edge of the transport object that are detected. This allows the transport teaching method to transport the substrate W to the center position Wc with high accuracy.

[0081] Furthermore, steps (A) to (C) are performed in a vacuum transfer module 20 including a transfer container 21 capable of reducing the pressure to a vacuum atmosphere and a transfer device (vacuum transfer device 22) that is provided inside the transfer container 21 and transfers an object to be transferred (substrate W). Thereby, the transfer teaching method can set the transfer position in the vacuum transfer module 20 with high accuracy.

[0082] The transfer container 21 is provided with a plurality of transfer devices (vacuum transfer devices 22) and a pass area 25 for temporarily placing the object to be transferred (substrate W) between the plurality of transfer devices, and performs steps (A) to (C) for at least one of the plurality of transfer devices. This allows the transfer position to be set with high accuracy even in a system having a plurality of vacuum transfer devices 22.

[0083] The multiple transfer devices (vacuum transfer devices 22) include a first transfer device 22A that transfers an object (substrate W) from the load lock module 30 into the inside of the transfer container 21, and a second transfer device 22B that is provided at a position farther away from the load lock module 30 than the first transfer device 22A and the pass area 25. Steps (A) to (C) are performed when the first transfer device 22A sets the transfer position of the second transfer device 22B for the object placed in the pass area 25. This allows the second transfer device 22B to accurately support and transfer the object when it receives the object placed in the pass area 25.

[0084] Moreover, the transported object is the substrate W that is subjected to substrate processing after being transported by the transport device (vacuum transport device 22). This makes it possible for the transport teaching method to set the transport position of the substrate W with high accuracy.

[0085] The transport device (vacuum transport device 22) includes a fork 223 on which an object to be transported (substrate W) is placed, and a plurality of arms 222 for moving the fork 223, and the sensor (fork side sensor 227) is a displacement sensor provided on the fork 223 for measuring the distance to the opposing object to be transported. This allows the transport teaching method to stably detect (scan) the object to be transported as the transport device moves.

[0086] Further, the sensors (fork side sensors 227) are provided in a pair at the tips of the forks 223, and are arranged at an interval narrower than the outer shape of the transported object (substrate W). This allows the transport teaching method to easily detect the transported object by using the pair of sensors.

[0087] A second aspect of the present disclosure is a substrate processing system 1 including a transfer container 21, a transfer device (vacuum transfer device 22) provided inside the transfer container 21 for transferring an object (substrate W), and a control device 90 for controlling the operation of the transfer device, in which the control device 90 controls, as a transfer teaching method for teaching the transfer position of the transfer device, the steps of (A) moving the transfer device relative to the object placed at the placement location and detecting the object with a sensor (fork side sensor 227) included in the transfer device, (B) calculating the position of the object based on the detected object, and (C) setting the transfer position based on the calculated position of the object. Even in this case, the substrate processing system 1 can efficiently teach the transfer position of the transfer device and significantly improve the transfer accuracy of the object.

[0088] The substrate processing system 1 and the transport teaching method according to the presently disclosed embodiment are illustrative in all respects and are not restrictive. The embodiments can be modified and improved in various forms without departing from the scope and spirit of the appended claims. The matters described in the above embodiments can be configured in other ways as long as they are not inconsistent, and can be combined as long as they are not inconsistent. [Explanation of symbols]

[0089] 1. Substrate Processing System 22 Vacuum transport device 22A First conveying device 22B Second conveying device 227 Fork side sensor 26 Pass placement section 90 Control device W substrate

Claims

1. A conveyance teaching method for teaching a conveyance position of a conveyance device so that the conveyance device can convey an object, comprising: (A) moving the conveying device relative to the transported object placed on a placement location and detecting the transported object with a sensor provided in the conveying device; (B) calculating a position of the transported object based on the detected transported object; (C) setting the transport position based on the calculated position of the transported object, Transport teaching method.

2. In the step (B), a deviation between the calculated position of the transported object and a set position is calculated; correcting the position of the conveying device based on the calculated deviation, and after the correction, performing steps (A) and (B) again to recalculate the position of the conveyed object. The transport teaching method according to claim 1 .

3. After the step (B), a step of comparing the deviation amount of the conveyed object with a threshold value is included, When the deviation amount is equal to or greater than a threshold value, the position of the conveying device is corrected based on the calculated deviation, and after the correction, the steps (A) and (B) are performed again to recalculate the position of the conveyed object, while When the deviation amount is less than the threshold value, the step (C) is performed. The transport teaching method according to claim 2 .

4. In the step (A), an outer edge of the transported object is detected by the sensor; In the step (B), a center position of the transported object is calculated as a position of the transported object based on the detected outer edge of the transported object. The transport teaching method according to any one of claims 1 to 3.

5. In the step (A), the conveying device is moved linearly above the object in the vertical direction, while detecting a plurality of points of an outer edge of the object placed in the placement location by the sensor; In the step (B), a center position of the transported object is calculated from a plurality of detected points on the outer edge of the transported object. The conveyance teaching method according to claim 4 .

6. In a vacuum transfer module including a transfer container capable of reducing pressure to a vacuum atmosphere and the transfer device that is provided inside the transfer container and transfers the object to be transferred, the steps (A) to (C) are performed. The transport teaching method according to any one of claims 1 to 3.

7. the transport container includes a plurality of the transport devices and a path area for temporarily placing the transported object between the plurality of the transport devices; The steps (A) to (C) are performed for at least one of the plurality of conveying devices. The conveyance teaching method according to claim 6.

8. the plurality of transport devices include a first transport device that transports the transport object from a load lock module into the transport container, and a second transport device that is provided at a position farther away from the load lock module than the first transport device and the pass area; The steps (A) to (C) are performed when the first conveying device sets the conveying position of the second conveying device with respect to the conveyed object placed in the path area. The conveyance teaching method according to claim 7.

9. The transported object is a substrate to be subjected to substrate processing after being transported by the transport device. The transport teaching method according to any one of claims 1 to 3.

10. The conveying device includes a fork on which the object is placed and a plurality of arms for moving the fork, The sensor is a displacement sensor provided on the fork and configured to measure a distance to the opposing transported object. The transport teaching method according to any one of claims 1 to 3.

11. The sensors are provided in pairs at the tips of the forks and are arranged at intervals narrower than the outer shape of the object to be conveyed. The conveyance teaching method according to claim 10.

12. A transport container; A conveying device that is provided inside the conveying container and conveys an object to be conveyed; A substrate processing system comprising: a control device for controlling an operation of the transport device, The control device includes: a conveyance teaching method for teaching a conveyance position of the conveyance device, (A) moving the conveying device relative to the transported object placed on a placement location and detecting the transported object with a sensor provided in the conveying device; (B) calculating a position of the transported object based on the detected transported object; (C) setting the transport position based on the calculated position of the transported object. Substrate processing system.

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